{ "schema_version": "touchdown.ai-chip-coverage-universe.v3", "as_of": "2026-07-29", "updated_at": "2026-07-29", "title": "Dated China semiconductor and AI-compute research universe", "scope": "Every unique seed in the dated canonical China semiconductor research universe, including resolved entity records, stale crosswalk candidates, and true unresolved research queues across the full supply chain.", "status": "incomplete", "complete_accounting": true, "research_complete": false, "evidence_boundary": "Names are research seeds, not proof of legal identity, capability, or a commercial relationship. Generic categories are retained as discovery queues.", "resolution_boundary": "Only exact research-seed strings resolved in the canonical entity registry appear here; all others remain explicit unresolved seeds.", "display_name_boundary": "The name and seed_name fields preserve the dated source seed text. Display_name and seed_display_name provide country-explicit public labels without changing identity matching, stable IDs, or source accounting.", "geography_boundary": "Headquarters, ownership, legal domicile, control, design location, fab location, and operating geography are separate fields. This endpoint preserves source-recorded fields and does not infer a China or U.S. lane from one field.", "relationship_boundary": "Company capability and category membership do not create product-specific supplier, customer, facility, qualification, shipment, or deployment edges.", "summary": { "category_count": 16, "seed_group_entry_count": 304, "unique_seed_count": 239, "repeated_seed_count": 63, "extra_membership_count": 65, "canonical_resolved_count": 135, "canonical_resolved_unique_entity_count": 129, "crosswalk_candidate_count": 9, "resolution_conflict_count": 2, "unresolved_research_seed_count": 95, "unresolved_seed_group_entry_count": 107, "open_seed_group_entry_count": 122, "state_counts": { "canonical_resolved": 135, "exact_crosswalk_candidate": 8, "normalized_crosswalk_candidate": 0, "ambiguous_crosswalk_candidate": 1, "unresolved_research_seed": 95 }, "resolution_status_counts": { "canonical_exact_resolved": 115, "canonical_contextual_resolved": 18, "canonical_resolved_alias_collision": 1, "canonical_resolution_conflict": 1, "exact_legal_candidate": 0, "exact_nonlegal_candidate": 8, "normalized_candidate": 0, "ambiguous_candidate": 1, "unresolved": 95 }, "resolution_status_group_entry_counts": { "canonical_exact_resolved": 154, "canonical_contextual_resolved": 24, "canonical_resolved_alias_collision": 2, "canonical_resolution_conflict": 2, "exact_legal_candidate": 0, "exact_nonlegal_candidate": 13, "normalized_candidate": 0, "ambiguous_candidate": 2, "unresolved": 107 }, "canonical_entity_count": 217, "canonical_alias_resolution_count": 459, "coverage_percent": 56.5 }, "provenance": { "source_repository": "Touchdown-Labs", "source_directory": "data/china-semiconductor", "source_dataset_commit": null, "source_dataset_base_commit": "360936e25eb5e1c2fbda25f6e3f43f8131a35184", "source_repository_head_at_capture": "5c2cb9a5949717dc0a3927173e0ed40ff5208639", "source_worktree_state": "dirty_in_source_directory", "source_snapshot_boundary": "The source directory contained uncommitted changes when these build inputs were captured. This is not an independent source of truth. The per-file SHA-256 values identify the exact bytes used; the base commit alone does not.", "source_files": [ { "path": "seed-universe.yaml", "sha256": "645fce6ef049aaa5a76756230edc384b8d3f883a7a69567b666f89e99b6cd6b7" }, { "path": "entities.yaml", "sha256": "41ec1edcd4ee6e7a3632cc77caaabf227956506d8b28b82551c0ee3500315341" }, { "path": "evidence.yaml", "sha256": "7a5d17b85989542750809e70a15f4571c0ee48260e3dfa16e6cdd346e6137994" } ], "seed_schema_version": "touchdown.china-semiconductor.seed-universe.v1", "entity_schema_version": "touchdown.china-semiconductor.entity.v1", "evidence_schema_version": "touchdown.china-semiconductor.source.v1" }, "taxonomy": { "coverage_states": { "canonical_resolved": "The canonical seed resolver names one entity record.", "exact_crosswalk_candidate": "An unresolved seed exactly matches one canonical identity string, but the canonical seed resolver has not approved the crosswalk.", "normalized_crosswalk_candidate": "An unresolved seed matches one identity only after case, punctuation, and whitespace normalization; human review is required.", "ambiguous_crosswalk_candidate": "The identity string can map to more than one canonical entity; no entity is selected.", "unresolved_research_seed": "No unique canonical entity candidate is available from the current identity registry." }, "resolution_statuses": { "canonical_exact_resolved": "The canonical resolver selects an entity whose recorded identity exactly matches the seed.", "canonical_contextual_resolved": "The canonical resolver selects an entity through a reviewed contextual crosswalk; the literal seed is not an exact identity string.", "canonical_resolved_alias_collision": "The canonical resolver selects an entity, but another entity shares the same identity string.", "canonical_resolution_conflict": "The canonical resolver selects one legal entity while the identity ledger points to another record level or endpoint.", "exact_legal_candidate": "The unresolved seed exactly matches one clean legal-company record; human review is still required.", "exact_nonlegal_candidate": "The unresolved seed exactly matches one brand or unresolved endpoint rather than a clean legal-company record.", "normalized_candidate": "The unresolved seed matches one record only after conservative identity normalization.", "ambiguous_candidate": "The unresolved seed can match more than one entity record; no target is selected.", "unresolved": "No canonical identity candidate is available from the current registry." }, "category_mapping_boundary": "Macro-stage hints organize research queues. They are derived from the category definition and do not prove that a seed performs every hinted role." }, "normalization": { "version": "seed-identity-normalizer-v1", "method": "NFKC, lowercase, ampersand expansion, punctuation and whitespace collapsed", "selection_boundary": "candidate_generation_only", "boundary": "Normalization may reveal a review candidate or collision. 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Membership does not establish a company-to-product or supplier relationship." }, { "id": "compound_power_rf_photonics_sensors", "label": "Compound, power, RF, photonics, and sensors", "question": "Who supplies the non-logic devices that move power, radio, light, and sensor data?", "macro_stage_hints": [ "chip_architecture", "front_end_fabrication", "interconnect_networking" ], "placement_count": 18, "seed_count": 18, "state_counts": { "canonical_resolved": 6, "exact_crosswalk_candidate": 2, "normalized_crosswalk_candidate": 0, "ambiguous_crosswalk_candidate": 1, "unresolved_research_seed": 9 }, "resolution_status_counts": { "canonical_exact_resolved": 5, "canonical_contextual_resolved": 0, "canonical_resolved_alias_collision": 1, "canonical_resolution_conflict": 0, "exact_legal_candidate": 0, "exact_nonlegal_candidate": 2, "normalized_candidate": 0, "ambiguous_candidate": 1, "unresolved": 9 }, "resolved_count": 6, "crosswalk_candidate_count": 3, "unresolved_count": 9, "seed_ids": [ "seed-802e969c0bfe97f9", "seed-5bf5a698c6b99eeb", "seed-6d410d92e6a69489", "seed-9c2907d32976ae96", "seed-783ea1a39ad2657c", "seed-1b005dcf37c84899", "seed-74563a97f25b39b7", "seed-d763da1fcd93fe16", "seed-83bdad00e8ac5af9", "seed-e840094384450c14", "seed-8db134f61324f8a3", "seed-9175f557840cdd6d", "seed-a91f0beffeab1079", "seed-1b03a9cd113f75eb", "seed-9e46e38c7b4fe786", "seed-1d9b672d6fbed28d", "seed-55c422fda5213b6e", "seed-b2799bc632a738de" ], "membership_ids": [ "membership-ab9ce64c7560a015", "membership-9db2e69d0932980e", "membership-1140e6ac7b68eadb", "membership-15f119a23d5da015", "membership-706b2646a2ff836b", "membership-780673e7380ad699", "membership-7688a09b5006f69f", "membership-19e9411032c2f5db", "membership-4fced69477430166", "membership-aa3d2f56eff91caa", "membership-0b2b14d01105f9ec", "membership-c6b8fb711d205807", "membership-7911a7380ee7d985", "membership-f725897441446ade", "membership-8d5f4bc89609566f", "membership-8fca612923ad0d3a", "membership-d926c071498f60e4", "membership-9b23d7c480e2850a" ], "boundary": "This category is an investigation queue. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-9954db40ae98435a", "record_type": "research_seed_coverage", "name": "China Telecom", "display_name": "China Telecom", "category_ids": [ "downstream_demand" ], "occurrence_count": 1, "macro_stage_hints": [ "cloud_deployment_demand", "systems_integration" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-778f2eb74b796fce", "record_type": "research_seed_coverage", "name": "China Unicom", "display_name": "China Unicom", "category_ids": [ "downstream_demand" ], "occurrence_count": 1, "macro_stage_hints": [ "cloud_deployment_demand", "systems_integration" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-dd-cu-operating", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-dd-cu-operating" ], "normalized_candidate_entity_ids": [ "ent-dd-cu-operating" ], "candidate_record_types": { "ent-dd-cu-operating": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-dd-cu-operating", "name": "China United Network Communications Corporation Limited", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Beijing, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_state_owned", "supply_chain_layers": [ "telecom", "ai_infrastructure" ], "product_ids": [] }, "source_ids": [ "src-dd-cu-001", "src-dd-cu-003" ], "source_refs": [ { "source_id": "src-dd-cu-001", "title": "2025年中国联通通用服务器集中采购项目中标候选人公示", "publisher": "中国联通采购与招标网", "url": "https://www.chinaunicombidding.cn/bidInformation/detail?id=1971600438168158208", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-dd-cu-003", "title": "2026年中国联通云智业务智算资源池设备及集成安装服务招标公告", "publisher": "中国联通采购与招标网", "url": "https://www.chinaunicombidding.cn/bidInformation/detail?id=2080612123361193984", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. 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Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-f8e92d3eeb84d480", "record_type": "research_seed_coverage", "name": "DapuStor", "display_name": "DapuStor", "category_ids": [ "memory_controllers_modules_storage" ], "occurrence_count": 1, "macro_stage_hints": [ "memory_storage", "substrate_board" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-dapustor", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-dapustor" ], "normalized_candidate_entity_ids": [ "ent-dapustor" ], "candidate_record_types": { "ent-dapustor": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-dapustor", "name": "深圳大普微电子股份有限公司", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Shenzhen, Guangdong, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "publicly_listed_current_control_unresolved", "supply_chain_layers": [], "product_ids": [] }, "source_ids": [ "src-dapustor-investor", "src-dapustor-rename" ], "source_refs": [ { "source_id": "src-dapustor-investor", "title": "基本信息", "publisher": "深圳大普微电子股份有限公司", "url": "https://www.dapustor.com/investor.html", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-dapustor-rename", "title": "动态丨更名“深圳大普微电子股份有限公司”", "publisher": "深圳大普微电子股份有限公司", "url": "https://www.dapustor.com/news/96.html", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-88324cfa469ad31d", "record_type": "research_seed_coverage", "name": "Darbond", "display_name": "Darbond", "category_ids": [ "packaging_osat_test_substrates", "wafers_materials_gases_chemicals" ], "occurrence_count": 2, "macro_stage_hints": [ "advanced_packaging_osat", "inspection_metrology_test", "substrate_board", "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-darbond", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-darbond" ], "normalized_candidate_entity_ids": [ "ent-darbond" ], "candidate_record_types": { "ent-darbond": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "canonical_identity_closed", "entity_snapshot": { "entity_id": "ent-darbond", "name": "Yantai Darbond Technology Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Yantai, Shandong, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "publicly_listed_current_control_unresolved", "supply_chain_layers": [], "product_ids": [] }, "source_ids": [ "src-darbond-profile" ], "source_refs": [ { "source_id": "src-darbond-profile", "title": "Company Profile", "publisher": "Yantai Darbond Technology Co., Ltd.", "url": "https://www.darbond.com/en/index.php/List/index/cid/9.html", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-bcfcbb3b7d033096", "record_type": "research_seed_coverage", "name": "Guowang Optics", "display_name": "Guowang Optics", "category_ids": [ "equipment_components_subsystems" ], "occurrence_count": 1, "macro_stage_hints": [ "deposition_etch_clean_cmp", "inspection_metrology_test", "lithography" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-guowang-optics", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-guowang-optics" ], "normalized_candidate_entity_ids": [ "ent-guowang-optics" ], "candidate_record_types": { "ent-guowang-optics": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-guowang-optics", "name": "北京国望光学科技有限公司", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Beijing, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_state_linked", "supply_chain_layers": [ "projection_optics", "equipment_components" ], "product_ids": [] }, "source_ids": [ "src-guowang-base-production-2024", "src-guowang-hermle-award-2022", "src-guowang-optics-base-2021" ], "source_refs": [ { "source_id": "src-guowang-base-production-2024", "title": "国望光学曝光光学系统基地竣工投产", "publisher": "国家科技创新中心", "url": "https://www.ncsti.gov.cn/kjdt/scyq/bjjjjskfq/jkdt/202402/t20240219_149260.html", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-guowang-hermle-award-2022", "title": "北京国望光学科技有限公司五轴立式加工中心项目评标结果公告", "publisher": "商务部机电产品招标投标电子交易平台", "url": "https://chinabidding.mofcom.gov.cn/bidDetail/bidding/bulletin/202206/ff8080817d94c145018145fd60755ec2.html", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-guowang-optics-base-2021", "title": "投影光刻机曝光光学系统研发及批量生产基地项目", "publisher": "北京市公共资源交易服务平台", "url": "https://ggzyfw.beijing.gov.cn/jylcgcjs/20210114/1340589.html", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-f01866f89ad506de", "record_type": "research_seed_coverage", "name": "HHCK", "display_name": "HHCK", "category_ids": [ "packaging_osat_test_substrates", "wafers_materials_gases_chemicals" ], "occurrence_count": 2, "macro_stage_hints": [ "advanced_packaging_osat", "inspection_metrology_test", "substrate_board", "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-jiangsu-hhck-advanced-materials", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-jiangsu-hhck-advanced-materials" ], "normalized_candidate_entity_ids": [ "ent-jiangsu-hhck-advanced-materials" ], "candidate_record_types": { "ent-jiangsu-hhck-advanced-materials": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-jiangsu-hhck-advanced-materials", "name": "江苏华海诚科新材料股份有限公司", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "semiconductor packaging materials", "epoxy molding compounds", "electronic adhesives" ], "product_ids": [] }, "source_ids": [ "src-hhck-annual-2025" ], "source_refs": [ { "source_id": "src-hhck-annual-2025", "title": "江苏华海诚科新材料股份有限公司2025年年度报告", "publisher": "江苏华海诚科新材料股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-03-18/1225014871.PDF", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-394a401a20829d80", "record_type": "research_seed_coverage", "name": "Hanbell", "display_name": "Hanbell", "category_ids": [ "cleanrooms_utilities_environment", "equipment_components_subsystems" ], "occurrence_count": 2, "macro_stage_hints": [ "deposition_etch_clean_cmp", "inspection_metrology_test", "lithography", "power_cooling_facilities" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-shanghai-hanbell", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-shanghai-hanbell" ], "normalized_candidate_entity_ids": [ "ent-shanghai-hanbell" ], "candidate_record_types": { "ent-shanghai-hanbell": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-shanghai-hanbell", "name": "Shanghai Hanbell Precise Machinery Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "semiconductor vacuum equipment" ], "product_ids": [] }, "source_ids": [ "src-hanbell-profile-vacuum-20260801" ], "source_refs": [ { "source_id": "src-hanbell-profile-vacuum-20260801", "title": "Company Profile and Vacuum Pumps", "publisher": "Shanghai Hanbell Precise Machinery Co., Ltd.", "url": "https://hanbell.com.cn/En/company-profile?tp/1", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-a9fa77cf7c61cbe5", "record_type": "research_seed_coverage", "name": "Hengshuo / 恒烁股份", "display_name": "Hengshuo / 恒烁股份", "category_ids": [ "hbm_reduced_architectures" ], "occurrence_count": 1, "macro_stage_hints": [ "advanced_packaging_osat", "chip_architecture", "memory_storage" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-4af83db9453f32af", "record_type": "research_seed_coverage", "name": "Hengyunchang", "display_name": "Hengyunchang", "category_ids": [ "equipment_components_subsystems" ], "occurrence_count": 1, "macro_stage_hints": [ "deposition_etch_clean_cmp", "inspection_metrology_test", "lithography" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-hengyunchang", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-hengyunchang" ], "normalized_candidate_entity_ids": [ "ent-hengyunchang" ], "candidate_record_types": { "ent-hengyunchang": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-hengyunchang", "name": "Shenzhen Hengyunchang Vacuum Technology Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Shenzhen, Guangdong, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_public", "supply_chain_layers": [ "equipment_components" ], "product_ids": [ "prod-hengyunchang-rf-power" ] }, "source_ids": [ "src-hengyunchang-annual-2025" ], "source_refs": [ { "source_id": "src-hengyunchang-annual-2025", "title": "深圳市恒运昌真空技术股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688785_20260428_AVJI.pdf", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-debf635967218524", "record_type": "research_seed_coverage", "name": "Hygon", "display_name": "Hygon", "category_ids": [ "fabless_and_system_silicon", "hbm_reduced_architectures" ], "occurrence_count": 2, "macro_stage_hints": [ "advanced_packaging_osat", "chip_architecture", "design_ip_eda", "memory_storage" ], "coverage_state": "exact_crosswalk_candidate", "resolution_status": "exact_nonlegal_candidate", "disposition": "requires_crosswalk_review", "canonical_entity_id": null, "candidate_entity_ids": [ "ent-hygon-brand-endpoint-unresolved" ], "exact_candidate_entity_ids": [ "ent-hygon-brand-endpoint-unresolved" ], "normalized_candidate_entity_ids": [ "ent-hygon-brand-endpoint-unresolved" ], "candidate_record_types": { "ent-hygon-brand-endpoint-unresolved": "brand_or_unresolved_endpoint" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "exact_brand_or_unresolved_endpoint_identity_string", "legal_identity_state": "unresolved", "entity_snapshot": { "entity_id": "ent-hygon-brand-endpoint-unresolved", "name": "Hygon", "entity_type": "brand_or_unresolved_endpoint", "completion_state": "lead_only", "headquarters": null, "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "unresolved_legal_endpoint", "supply_chain_layers": [ "cpus" ], "product_ids": [ "prod-hygon-7000-series", "prod-hygon-7285" ] }, "source_ids": [ "src-ctyun-cambricon-cloud-20260703" ], "source_refs": [ { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "A human review must confirm that the matching identity string is the intended research seed, then update the canonical seed resolver. This candidate is not counted as resolved.", "boundary": "A research seed or category match shows what is being investigated. 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Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-6e33e6aabd977ff8", "record_type": "research_seed_coverage", "name": "Ingenic", "display_name": "Ingenic", "category_ids": [ "fabless_and_system_silicon" ], "occurrence_count": 1, "macro_stage_hints": [ "chip_architecture", "design_ip_eda" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-1d9b672d6fbed28d", "record_type": "research_seed_coverage", "name": "Innolight", "display_name": "Innolight", "category_ids": [ "compound_power_rf_photonics_sensors" ], "occurrence_count": 1, "macro_stage_hints": [ "chip_architecture", "front_end_fabrication", "interconnect_networking" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-9c2907d32976ae96", "record_type": "research_seed_coverage", "name": "Innoscience", "display_name": "Innoscience", "category_ids": [ "compound_power_rf_photonics_sensors", "fabless_and_system_silicon", "foundries_idms_wafer_fabs" ], "occurrence_count": 3, "macro_stage_hints": [ "chip_architecture", "design_ip_eda", "front_end_fabrication", "interconnect_networking", "production_qualification" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-innoscience-suzhou", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-innoscience-suzhou" ], "normalized_candidate_entity_ids": [ "ent-innoscience-suzhou" ], "candidate_record_types": { "ent-innoscience-suzhou": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-innoscience-suzhou", "name": "InnoScience (Suzhou) Technology Holding Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Suzhou, Jiangsu, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "publicly_listed_current_control_unresolved", "supply_chain_layers": [], "product_ids": [] }, "source_ids": [ "src-innoscience-hkex", "src-innoscience-official-listing" ], "source_refs": [ { "source_id": "src-innoscience-hkex", "title": "InnoScience (Suzhou) Technology Holding Co., Ltd. listing document", "publisher": "Hong Kong Exchanges and Clearing Limited", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2024/1230/2024121201395.htm", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-innoscience-official-listing", "title": "英诺赛科成功上市，氮化镓功率半导体引领者全“芯”启航", "publisher": "英诺赛科（苏州）科技股份有限公司", "url": "https://www.innoscience.com/cn/news/detail/85/1278", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-bbfa3353f4761846", "record_type": "research_seed_coverage", "name": "Innosilicon", "display_name": "Innosilicon", "category_ids": [ "eda_ip_design_services", "memory_controllers_modules_storage" ], "occurrence_count": 2, "macro_stage_hints": [ "design_ip_eda", "memory_storage", "substrate_board" ], "coverage_state": "exact_crosswalk_candidate", "resolution_status": "exact_nonlegal_candidate", "disposition": "requires_crosswalk_review", "canonical_entity_id": null, "candidate_entity_ids": [ "ent-innosilicon-brand" ], "exact_candidate_entity_ids": [ "ent-innosilicon-brand" ], "normalized_candidate_entity_ids": [ "ent-innosilicon-brand" ], "candidate_record_types": { "ent-innosilicon-brand": "brand" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "exact_brand_or_unresolved_endpoint_identity_string", "legal_identity_state": "unresolved", "entity_snapshot": { "entity_id": "ent-innosilicon-brand", "name": "Innosilicon", "entity_type": "brand", "completion_state": "source_backed", "headquarters": "Wuhan, Hubei, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "brand_identity_unresolved", "supply_chain_layers": [ "semiconductor_ip", "design_services" ], "product_ids": [ "prod-innosilicon-hbm3e-phy" ] }, "source_ids": [ "src-innosilicon-ip-catalogue" ], "source_refs": [ { "source_id": "src-innosilicon-ip-catalogue", "title": "IP Solutions", "publisher": "Innosilicon", "url": "https://www.innosilicon.com/ip-solution", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "A human review must confirm that the matching identity string is the intended research seed, then update the canonical seed resolver. This candidate is not counted as resolved.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-650bb185bb1aca93", "record_type": "research_seed_coverage", "name": "Inspur", "display_name": "Inspur", "category_ids": [ "downstream_demand" ], "occurrence_count": 1, "macro_stage_hints": [ "cloud_deployment_demand", "systems_integration" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-3a74bb222cdee020", "record_type": "research_seed_coverage", "name": "JCET", "display_name": "JCET", "category_ids": [ "packaging_osat_test_substrates" ], "occurrence_count": 1, "macro_stage_hints": [ "advanced_packaging_osat", "inspection_metrology_test", "substrate_board" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-jcet", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-jcet" ], "normalized_candidate_entity_ids": [ "ent-jcet" ], "candidate_record_types": { "ent-jcet": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-jcet", "name": "JCET Group Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Jiangyin, Jiangsu, China", "country_of_ownership": "China", "countries_of_operation": [ "China", "Singapore", "South Korea" ], "ownership_type": "publicly_listed_current_control_not_closed_in_lane", "supply_chain_layers": [ "packaging", "test" ], "product_ids": [] }, "source_ids": [ "src-jcet-annual-2025", "src-jcet-ar2025", "src-jcet-profile" ], "source_refs": [ { "source_id": "src-jcet-annual-2025", "title": "江苏长电科技股份有限公司2025年年度报告", "publisher": "江苏长电科技股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225091498.PDF", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-jcet-ar2025", "title": "江苏长电科技股份有限公司2025年年度报告", "publisher": "江苏长电科技股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225091498.PDF", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-jcet-profile", "title": "JCET Enters Into Strategic Business Agreement with Analog Devices", "publisher": "JCET Group Co., Ltd.", "url": "https://www.jcetglobal.com/en/site/detailscon/556", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-bd7edb0d2ca47721", "record_type": "research_seed_coverage", "name": "Jiahe Jinwei", "display_name": "Jiahe Jinwei", "category_ids": [ "memory_controllers_modules_storage" ], "occurrence_count": 1, "macro_stage_hints": [ "memory_storage", "substrate_board" ], "coverage_state": "exact_crosswalk_candidate", "resolution_status": "exact_nonlegal_candidate", "disposition": "requires_crosswalk_review", "canonical_entity_id": null, "candidate_entity_ids": [ "ent-powev-jiahe-jinwei-brand-unresolved" ], "exact_candidate_entity_ids": [ "ent-powev-jiahe-jinwei-brand-unresolved" ], "normalized_candidate_entity_ids": [ "ent-powev-jiahe-jinwei-brand-unresolved" ], "candidate_record_types": { "ent-powev-jiahe-jinwei-brand-unresolved": "brand_or_unresolved_endpoint" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "exact_brand_or_unresolved_endpoint_identity_string", "legal_identity_state": "unresolved", "entity_snapshot": { "entity_id": "ent-powev-jiahe-jinwei-brand-unresolved", "name": "Jiahe Jinwei", "entity_type": "brand_or_unresolved_endpoint", "completion_state": "lead_only", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "dram modules", "nand modules", "memory packaging", "assembly", "test", "storage boards" ], "product_ids": [] }, "source_ids": [ "src-powev-jiahe-profile-20260801" ], "source_refs": [ { "source_id": "src-powev-jiahe-profile-20260801", "title": "About Powev", "publisher": "Powev", "url": "https://www.powev.com/about-5/", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "A human review must confirm that the matching identity string is the intended research seed, then update the canonical seed resolver. This candidate is not counted as resolved.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-45202c00cc803c1f", "record_type": "research_seed_coverage", "name": "Jianghua Micro", "display_name": "Jianghua Micro", "category_ids": [ "wafers_materials_gases_chemicals" ], "occurrence_count": 1, "macro_stage_hints": [ "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-jiangyin-jianghua-micro", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-jiangyin-jianghua-micro" ], "normalized_candidate_entity_ids": [ "ent-jiangyin-jianghua-micro" ], "candidate_record_types": { "ent-jiangyin-jianghua-micro": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-jiangyin-jianghua-micro", "name": "江阴江化微电子材料股份有限公司", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "high purity wet chemicals", "photoresist reagents" ], "product_ids": [] }, "source_ids": [ "src-jianghua-micro-profile-20260801" ], "source_refs": [ { "source_id": "src-jianghua-micro-profile-20260801", "title": "About Jianghua Micro", "publisher": "江阴江化微电子材料股份有限公司", "url": "https://www.jianghuamem.com/cn/about.html", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-31c706218865cc98", "record_type": "research_seed_coverage", "name": "Jingce", "display_name": "Jingce", "category_ids": [ "wafer_fabrication_equipment" ], "occurrence_count": 1, "macro_stage_hints": [ "deposition_etch_clean_cmp", "inspection_metrology_test" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-wuhan-jingce-electronic", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-wuhan-jingce-electronic" ], "normalized_candidate_entity_ids": [ "ent-wuhan-jingce-electronic" ], "candidate_record_types": { "ent-wuhan-jingce-electronic": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-wuhan-jingce-electronic", "name": "Wuhan Jingce Electronic Group Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "semiconductor test equipment", "inspection equipment" ], "product_ids": [] }, "source_ids": [ "src-jingce-profile-20260801" ], "source_refs": [ { "source_id": "src-jingce-profile-20260801", "title": "Company Profile", "publisher": "Wuhan Jingce Electronic Group Co., Ltd.", "url": "https://www.wuhanjingce.com/en/jbxx/index.aspx", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-80dd3c25fcfb6c84", "record_type": "research_seed_coverage", "name": "Jingyi Equipment", "display_name": "Jingyi Equipment", "category_ids": [ "cleanrooms_utilities_environment" ], "occurrence_count": 1, "macro_stage_hints": [ "power_cooling_facilities" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-9e080337aaa834bc", "record_type": "research_seed_coverage", "name": "Jinhong Gas", "display_name": "Jinhong Gas", "category_ids": [ "wafers_materials_gases_chemicals" ], "occurrence_count": 1, "macro_stage_hints": [ "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-jinhong-gas", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-jinhong-gas" ], "normalized_candidate_entity_ids": [ "ent-jinhong-gas" ], "candidate_record_types": { "ent-jinhong-gas": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-jinhong-gas", "name": "Jinhong Gas Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Suzhou, Jiangsu, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_public", "supply_chain_layers": [ "bulk_gases", "electronic_specialty_gases", "gas_services" ], "product_ids": [] }, "source_ids": [ "src-jinhong-annual-2025" ], "source_refs": [ { "source_id": "src-jinhong-annual-2025", "title": "金宏气体股份有限公司2025年年度报告", "publisher": "金宏气体股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-03-28/1225047235.PDF", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. 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Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-a168971faa1bd10a", "record_type": "research_seed_coverage", "name": "KFMI", "display_name": "KFMI", "category_ids": [ "equipment_components_subsystems", "wafers_materials_gases_chemicals" ], "occurrence_count": 2, "macro_stage_hints": [ "deposition_etch_clean_cmp", "inspection_metrology_test", "lithography", "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-kfmi", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-kfmi" ], "normalized_candidate_entity_ids": [ "ent-kfmi" ], "candidate_record_types": { "ent-kfmi": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-kfmi", "name": "Konfoong Materials International Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Ningbo, Zhejiang, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_public", "supply_chain_layers": [ "sputtering_targets", "equipment_parts" ], "product_ids": [] }, "source_ids": [ "src-kfmi-home-purity", "src-kfmi-ssmc-award-2024" ], "source_refs": [ { "source_id": "src-kfmi-home-purity", "title": "宁波江丰电子材料股份有限公司", "publisher": "宁波江丰电子材料股份有限公司", "url": "https://www.kfmic.com/", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-kfmi-ssmc-award-2024", "title": "江丰电子荣获SSMC“最佳供应商奖”", "publisher": "宁波江丰电子材料股份有限公司", "url": "https://www.kfmic.com/?news_13%2F634.html=", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-ecf5205c264d5306", "record_type": "research_seed_coverage", "name": "KYKY", "display_name": "KYKY", "category_ids": [ "cleanrooms_utilities_environment", "equipment_components_subsystems" ], "occurrence_count": 2, "macro_stage_hints": [ "deposition_etch_clean_cmp", "inspection_metrology_test", "lithography", "power_cooling_facilities" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-util-kyky", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-util-kyky" ], "normalized_candidate_entity_ids": [ "ent-util-kyky" ], "candidate_record_types": { "ent-util-kyky": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "named_legal_endpoint_source_bounded", "entity_snapshot": { "entity_id": "ent-util-kyky", "name": "北京中科科仪股份有限公司", "entity_type": "company", "completion_state": "source_backed", "headquarters": "13 Zhongguancun North Second Street, Haidian District, Beijing, China", "country_of_ownership": "unknown", "countries_of_operation": [ "China" ], "ownership_type": "unknown", "supply_chain_layers": [ "vacuum test systems" ], "product_ids": [ "prod-util-kyky-vacuum-test" ] }, "source_ids": [ "src-util-005" ], "source_refs": [ { "source_id": "src-util-005", "title": "中国科学院高能物理研究所超净半导体真空测试系统采购项目中标公告", "publisher": "中国政府采购网 / 中华人民共和国财政部国库司", "url": "https://www.ccgp.gov.cn/cggg/zygg/zbgg/202605/t20260507_26518210.htm", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-5fe763de1156640c", "record_type": "research_seed_coverage", "name": "Kingstone", "display_name": "Kingstone", "category_ids": [ "wafer_fabrication_equipment" ], "occurrence_count": 1, "macro_stage_hints": [ "deposition_etch_clean_cmp", "inspection_metrology_test" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-shanghai-kingstone-semiconductor", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-shanghai-kingstone-semiconductor" ], "normalized_candidate_entity_ids": [ "ent-shanghai-kingstone-semiconductor" ], "candidate_record_types": { "ent-shanghai-kingstone-semiconductor": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-shanghai-kingstone-semiconductor", "name": "Shanghai Kingstone Semiconductor Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "ion implant semiconductor equipment", "production deployment evidence" ], "product_ids": [] }, "source_ids": [ "src-kingstone-profile-20260801" ], "source_refs": [ { "source_id": "src-kingstone-profile-20260801", "title": "About Kingstone Semiconductor", "publisher": "Shanghai Kingstone Semiconductor Co., Ltd.", "url": "https://www.kingstonesemi.com/en/about", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-2d64ad6590e2a53f", "record_type": "research_seed_coverage", "name": "Kunlunxin", "display_name": "Kunlunxin", "category_ids": [ "fabless_and_system_silicon", "hbm_reduced_architectures" ], "occurrence_count": 2, "macro_stage_hints": [ "advanced_packaging_osat", "chip_architecture", "design_ip_eda", "memory_storage" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-kunlun-brand-endpoint-unresolved", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-kunlun-brand-endpoint-unresolved" ], "normalized_candidate_entity_ids": [ "ent-kunlun-brand-endpoint-unresolved" ], "candidate_record_types": { "ent-kunlun-brand-endpoint-unresolved": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-kunlun-brand-endpoint-unresolved", "name": "昆仑芯（北京）科技股份有限公司", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Beijing, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_private", "supply_chain_layers": [ "accelerators" ], "product_ids": [ "prod-kunlun-k200", "prod-kunlun-p800", "prod-kunlun-r200" ] }, "source_ids": [ "src-baidu-baige-deepseek-p800-20250217", "src-baidu-p800-large-cluster-caict-claim-20250723", "src-kunlun-k200-product", "src-kunlun-p800-cmb-20250327", "src-kunlun-r200-product", "src-kunlunxin-home" ], "source_refs": [ { "source_id": "src-baidu-baige-deepseek-p800-20250217", "title": "百度百舸 DeepSeek 一体机发布，支持昆仑芯 P800 单机 8 卡满血版开箱即用", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_e0a478ab-bfa4-425c-b9b5-a6d296f6c698", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-baidu-p800-large-cluster-caict-claim-20250723", "title": "首家！AI算力最高评级！", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_377f7acf-07e4-4787-a0f5-d70671dd6f34", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-kunlun-k200-product", "title": "K200", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/product/686.html", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-kunlun-p800-cmb-20250327", "title": "昆仑芯中标招商银行AI芯片资源项目", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/news/4469.html", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-kunlun-r200-product", "title": "R200", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/product/274.html", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-kunlunxin-home", "title": "昆仑芯官网", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-2233362786da7964", "record_type": "research_seed_coverage", "name": "L&K Engineering", "display_name": "L&K Engineering", "category_ids": [ "cleanrooms_utilities_environment" ], "occurrence_count": 1, "macro_stage_hints": [ "power_cooling_facilities" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-util-lk-suzhou", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-util-lk-suzhou" ], "normalized_candidate_entity_ids": [ "ent-util-lk-suzhou" ], "candidate_record_types": { "ent-util-lk-suzhou": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-util-lk-suzhou", "name": "亚翔系统集成科技（苏州）股份有限公司", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Suzhou, Jiangsu, China; exact registered address not extracted in this lane", "country_of_ownership": "unknown", "countries_of_operation": [ "China" ], "ownership_type": "publicly_listed_company", "supply_chain_layers": [ "cleanroom EPC and integration" ], "product_ids": [ "svc-util-cxmt-cleanroom" ] }, "source_ids": [ "src-util-001" ], "source_refs": [ { "source_id": "src-util-001", "title": "亚翔系统集成科技（苏州）股份有限公司关于公司重大项目中标的公告", "publisher": "亚翔系统集成科技（苏州）股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2024-02/06/content_1875556.htm", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-a0f695b1f4f08411", "record_type": "research_seed_coverage", "name": "Leadmicro", "display_name": "Leadmicro", "category_ids": [ "wafer_fabrication_equipment" ], "occurrence_count": 1, "macro_stage_hints": [ "deposition_etch_clean_cmp", "inspection_metrology_test" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-leadmicro", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-leadmicro" ], "normalized_candidate_entity_ids": [ "ent-leadmicro" ], "candidate_record_types": { "ent-leadmicro": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-leadmicro", "name": "Jiangsu Leadmicro Nano Technology Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Wuxi, Jiangsu, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_public", "supply_chain_layers": [ "deposition_equipment" ], "product_ids": [] }, "source_ids": [ "src-hengyunchang-annual-2025" ], "source_refs": [ { "source_id": "src-hengyunchang-annual-2025", "title": "深圳市恒运昌真空技术股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688785_20260428_AVJI.pdf", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-acec4064d0fcc0d5", "record_type": "research_seed_coverage", "name": "Lenovo", "display_name": "Lenovo", "category_ids": [ "downstream_demand" ], "occurrence_count": 1, "macro_stage_hints": [ "cloud_deployment_demand", "systems_integration" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-5ace00faf5c30543", "record_type": "research_seed_coverage", "name": "Li Auto", "display_name": "Li Auto", "category_ids": [ "downstream_demand" ], "occurrence_count": 1, "macro_stage_hints": [ "cloud_deployment_demand", "systems_integration" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-li-auto-inc", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-li-auto-inc" ], "normalized_candidate_entity_ids": [ "ent-li-auto-inc" ], "candidate_record_types": { "ent-li-auto-inc": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-li-auto-inc", "name": "Li Auto Inc.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Beijing, China", "country_of_ownership": "ownership_country_unresolved_in_lane_sources", "countries_of_operation": [ "ownership_country_unresolved_in_lane_sources", "China" ], "ownership_type": "mainland_company_offshore_listed_parent", "supply_chain_layers": [ "automotive" ], "product_ids": [ "prod-li-auto-2021-li-one" ] }, "source_ids": [ "src-li-auto-2021q1-results-20210526", "src-li-auto-2021q3-results-20211129", "src-li-auto-dec-deliveries-20220101" ], "source_refs": [ { "source_id": "src-li-auto-2021q1-results-20210526", "title": "Li Auto Inc. Announces Unaudited First Quarter 2021 Financial Results", "publisher": "Li Auto Inc.", "url": "https://ir.lixiang.com/zh-hans/news-releases/news-release-details/li-auto-inc-announces-unaudited-first-quarter-2021-financial", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-li-auto-2021q3-results-20211129", "title": "Li Auto Inc. Announces Unaudited Third Quarter 2021 Financial Results", "publisher": "Li Auto Inc.", "url": "https://ir.lixiang.com/news-releases/news-release-details/li-auto-inc-announces-unaudited-third-quarter-2021-financial/", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-li-auto-dec-deliveries-20220101", "title": "Li Auto Inc. December 2021 Delivery Update", "publisher": "Li Auto Inc.", "url": "https://ir.lixiang.com/news-releases/news-release-details/li-auto-inc-december-2021-delivery-update", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-ab03befbafbf7693", "record_type": "research_seed_coverage", "name": "Lianrui", "display_name": "Lianrui", "category_ids": [ "wafers_materials_gases_chemicals" ], "occurrence_count": 1, "macro_stage_hints": [ "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-jiangsu-novoray-lianrui", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-jiangsu-novoray-lianrui" ], "normalized_candidate_entity_ids": [ "ent-jiangsu-novoray-lianrui" ], "candidate_record_types": { "ent-jiangsu-novoray-lianrui": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-jiangsu-novoray-lianrui", "name": "Jiangsu NOVORAY New Material Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "electronic materials", "silica materials", "alumina materials" ], "product_ids": [] }, "source_ids": [ "src-novoray-profile-20260801" ], "source_refs": [ { "source_id": "src-novoray-profile-20260801", "title": "About NOVORAY", "publisher": "Jiangsu NOVORAY New Material Co., Ltd.", "url": "https://www.novoray.com/en/index.php/about/index/id/7.html", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-6f94049c32927764", "record_type": "research_seed_coverage", "name": "Lion Micro", "display_name": "Lion Micro", "category_ids": [ "wafers_materials_gases_chemicals" ], "occurrence_count": 1, "macro_stage_hints": [ "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-hangzhou-lion-electronics", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-hangzhou-lion-electronics" ], "normalized_candidate_entity_ids": [ "ent-hangzhou-lion-electronics" ], "candidate_record_types": { "ent-hangzhou-lion-electronics": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-hangzhou-lion-electronics", "name": "杭州立昂微电子股份有限公司", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "semiconductor materials", "power semiconductor design", "wafer fabrication" ], "product_ids": [] }, "source_ids": [ "src-lion-micro-profile-20260801" ], "source_refs": [ { "source_id": "src-lion-micro-profile-20260801", "title": "About Lion Micro", "publisher": "杭州立昂微电子股份有限公司", "url": "https://www.li-on.com/about/", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-5334ba542c374796", "record_type": "research_seed_coverage", "name": "Longsys", "display_name": "Longsys", "category_ids": [ "memory_controllers_modules_storage" ], "occurrence_count": 1, "macro_stage_hints": [ "memory_storage", "substrate_board" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-longsys", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-longsys" ], "normalized_candidate_entity_ids": [ "ent-longsys" ], "candidate_record_types": { "ent-longsys": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-longsys", "name": "Shenzhen Longsys Electronics Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Shenzhen, Guangdong, China", "country_of_ownership": "China", "countries_of_operation": [ "China", "Brazil" ], "ownership_type": "publicly_listed_current_control_unresolved", "supply_chain_layers": [], "product_ids": [] }, "source_ids": [ "src-longsys-brands", "src-longsys-listing" ], "source_refs": [ { "source_id": "src-longsys-brands", "title": "品牌介绍", "publisher": "深圳市江波龙电子股份有限公司", "url": "https://cn.longsys.com/about/news/13956.html", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-longsys-listing", "title": "江波龙首次公开发行股票，正式登陆深交所A股创业板", "publisher": "深圳市江波龙电子股份有限公司", "url": "https://cn.longsys.com/about/news/1719.html", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-23bbbf609e846312", "record_type": "research_seed_coverage", "name": "Loongson", "display_name": "Loongson", "category_ids": [ "fabless_and_system_silicon" ], "occurrence_count": 1, "macro_stage_hints": [ "chip_architecture", "design_ip_eda" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-2cb9eb0d58092f21", "record_type": "research_seed_coverage", "name": "MaxOne", "display_name": "MaxOne", "category_ids": [ "packaging_osat_test_substrates", "wafer_fabrication_equipment" ], "occurrence_count": 2, "macro_stage_hints": [ "advanced_packaging_osat", "deposition_etch_clean_cmp", "inspection_metrology_test", "substrate_board" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-bf202b2cac92d6e1", "record_type": "research_seed_coverage", "name": "Maxio", "display_name": "Maxio", "category_ids": [ "fabless_and_system_silicon", "memory_controllers_modules_storage" ], "occurrence_count": 2, "macro_stage_hints": [ "chip_architecture", "design_ip_eda", "memory_storage", "substrate_board" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-maxio-technology-hangzhou", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-maxio-technology-hangzhou" ], "normalized_candidate_entity_ids": [ "ent-maxio-technology-hangzhou" ], "candidate_record_types": { "ent-maxio-technology-hangzhou": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-maxio-technology-hangzhou", "name": "联芸科技（杭州）股份有限公司", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "fabless chip design", "storage controllers", "data management soc" ], "product_ids": [] }, "source_ids": [ "src-maxio-profile-20260801" ], "source_refs": [ { "source_id": "src-maxio-profile-20260801", "title": "About Maxio", "publisher": "联芸科技（杭州）股份有限公司", "url": "https://www.maxio-tech.com/about/intro.html", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. 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Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-971e689d0a5be527", "record_type": "research_seed_coverage", "name": "MetaX", "display_name": "MetaX", "category_ids": [ "fabless_and_system_silicon", "hbm_reduced_architectures" ], "occurrence_count": 2, "macro_stage_hints": [ "advanced_packaging_osat", "chip_architecture", "design_ip_eda", "memory_storage" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-metax", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-metax" ], "normalized_candidate_entity_ids": [ "ent-metax" ], "candidate_record_types": { "ent-metax": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-metax", "name": "MetaX Integrated Circuits (Shanghai) Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Shanghai, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_public", "supply_chain_layers": [ "gpus", "accelerators" ], "product_ids": [ "prod-metax-c500", "prod-metax-n100" ] }, "source_ids": [ "src-metax-annual-2025", "src-metax-legal" ], "source_refs": [ { "source_id": "src-metax-annual-2025", "title": "沐曦集成电路（上海）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-27/688802_20260327_0HOB.pdf", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-metax-legal", "title": "Legal Statement", "publisher": "MetaX Integrated Circuits (Shanghai) Co., Ltd.", "url": "https://www.metax-tech.com/en/index/statement.html", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-21e18c2f1e06d83f", "record_type": "research_seed_coverage", "name": "Midea", "display_name": "Midea", "category_ids": [ "downstream_demand" ], "occurrence_count": 1, "macro_stage_hints": [ "cloud_deployment_demand", "systems_integration" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-121e2522a136359f", "record_type": "research_seed_coverage", "name": "Montage", "display_name": "Montage", "category_ids": [ "fabless_and_system_silicon", "memory_controllers_modules_storage" ], "occurrence_count": 2, "macro_stage_hints": [ "chip_architecture", "design_ip_eda", "memory_storage", "substrate_board" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-montage", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-montage" ], "normalized_candidate_entity_ids": [ "ent-montage" ], "candidate_record_types": { "ent-montage": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-montage", "name": "Montage Technology Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Shanghai, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_public", "supply_chain_layers": [ "memory_interfaces", "controllers" ], "product_ids": [ "prod-montage-m88mx6852" ] }, "source_ids": [ "src-montage-mxc-official" ], "source_refs": [ { "source_id": "src-montage-mxc-official", "title": "MXC Memory Expansion Controller", "publisher": "澜起科技股份有限公司", "url": "https://www.montage-tech.com/index.php/MXC", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-7c74356e3383b9d0", "record_type": "research_seed_coverage", "name": "Moore Threads", "display_name": "Moore Threads", "category_ids": [ "fabless_and_system_silicon", "hbm_reduced_architectures" ], "occurrence_count": 2, "macro_stage_hints": [ "advanced_packaging_osat", "chip_architecture", "design_ip_eda", "memory_storage" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-moore-threads", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-moore-threads" ], "normalized_candidate_entity_ids": [ "ent-moore-threads" ], "candidate_record_types": { "ent-moore-threads": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-moore-threads", "name": "Moore Threads Technology Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Beijing, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_public", "supply_chain_layers": [ "gpus", "accelerators" ], "product_ids": [ "prod-moore-threads-s5000" ] }, "source_ids": [ "src-moore-threads-annual-2025", "src-moore-threads-legal", "src-moore-threads-listing-2025" ], "source_refs": [ { "source_id": "src-moore-threads-annual-2025", "title": "摩尔线程智能科技（北京）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-27/688795_20260427_CUNP.pdf", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-moore-threads-legal", "title": "Compliance / Legal", "publisher": "Moore Threads Technology Co., Ltd.", "url": "https://en.mthreads.com/legal/compliance", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-moore-threads-listing-2025", "title": "摩尔线程智能科技（北京）股份有限公司股票科创板上市公告书", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/announcement/listing/ipo/c/c_20251204_10800678.shtml", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-f1bfd82b89bf073b", "record_type": "research_seed_coverage", "name": "MooreElite", "display_name": "MooreElite", "category_ids": [ "eda_ip_design_services" ], "occurrence_count": 1, "macro_stage_hints": [ "design_ip_eda" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-655bc3578578987a", "record_type": "research_seed_coverage", "name": "NAURA", "display_name": "NAURA", "category_ids": [ "wafer_fabrication_equipment" ], "occurrence_count": 1, "macro_stage_hints": [ "deposition_etch_clean_cmp", "inspection_metrology_test" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-naura", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-naura" ], "normalized_candidate_entity_ids": [ "ent-naura" ], "candidate_record_types": { "ent-naura": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-naura", "name": "NAURA Technology Group Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Beijing, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_public", "supply_chain_layers": [ "wafer_fabrication_equipment" ], "product_ids": [] }, "source_ids": [ "src-naura-annual-2025" ], "source_refs": [ { "source_id": "src-naura-annual-2025", "title": "北方华创科技集团股份有限公司2025年年度报告", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225122918.PDF", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-3857d35dfb945541", "record_type": "research_seed_coverage", "name": "NIO", "display_name": "NIO", "category_ids": [ "downstream_demand" ], "occurrence_count": 1, "macro_stage_hints": [ "cloud_deployment_demand", "systems_integration" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-nio-inc", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-nio-inc" ], "normalized_candidate_entity_ids": [ "ent-nio-inc" ], "candidate_record_types": { "ent-nio-inc": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-nio-inc", "name": "NIO Inc.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Shanghai, China", "country_of_ownership": "ownership_country_unresolved_in_lane_sources", "countries_of_operation": [ "ownership_country_unresolved_in_lane_sources", "China" ], "ownership_type": "mainland_company_offshore_listed_parent", "supply_chain_layers": [ "automotive", "chip_design" ], "product_ids": [ "prod-nio-et9-2025", "prod-nio-shenji-nx9031" ] }, "source_ids": [ "src-nio-auto-shanghai-20250423", "src-nio-genitech-investment-20260226" ], "source_refs": [ { "source_id": "src-nio-auto-shanghai-20250423", "title": "NIO Showcases Its Three EV Brands at Auto Shanghai 2025", "publisher": "NIO Inc.", "url": "https://www.nio.com/news/20250423001", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-nio-genitech-investment-20260226", "title": "NIO Inc.’s Subsidiary Enters into Definitive Agreements for RMB2.257 Billion Investment", "publisher": "NIO Inc.", "url": "https://ir.nio.com/zh-hans/news-releases/news-release-details/nio-incs-subsidiary-enters-definitive-agreements-rmb2257-billion", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-d28a3dbca90db5a5", "record_type": "research_seed_coverage", "name": "NSIG", "display_name": "NSIG", "category_ids": [ "wafers_materials_gases_chemicals" ], "occurrence_count": 1, "macro_stage_hints": [ "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-nsig", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-nsig" ], "normalized_candidate_entity_ids": [ "ent-nsig" ], "candidate_record_types": { "ent-nsig": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-nsig", "name": "National Silicon Industry Group Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Shanghai, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_public", "supply_chain_layers": [ "silicon_wafers" ], "product_ids": [ "prod-nsig-300mm-wafers" ] }, "source_ids": [ "src-nsig-capacity-2025", "src-nsig-inquiry-2025" ], "source_refs": [ { "source_id": "src-nsig-capacity-2025", "title": "上海硅产业集团股份有限公司2026年度“提质增效重回报”行动方案", "publisher": "上海硅产业集团股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-17/1225114299.PDF", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-nsig-inquiry-2025", "title": "关于上海硅产业集团股份有限公司发行股份及支付现金购买资产并募集配套资金申请审核问询函的回复", "publisher": "上海证券交易所 / 立信会计师事务所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202509/688126_20250901_U2SY.pdf", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-6f447d6b980ccd8b", "record_type": "research_seed_coverage", "name": "Nata", "display_name": "Nata", "category_ids": [ "lithography_masks_patterning", "wafers_materials_gases_chemicals" ], "occurrence_count": 2, "macro_stage_hints": [ "lithography", "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-nata", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-nata" ], "normalized_candidate_entity_ids": [ "ent-nata" ], "candidate_record_types": { "ent-nata": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-nata", "name": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Suzhou, Jiangsu, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_public", "supply_chain_layers": [ "electronic_gases", "metalorganic_precursors", "photoresist" ], "product_ids": [] }, "source_ids": [ "src-nata-electronic-gases", "src-nata-mo-sources" ], "source_refs": [ { "source_id": "src-nata-electronic-gases", "title": "电子特气", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/dianziteqi/", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-nata-mo-sources", "title": "MO源", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/moyuan", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-d6275dc896261480", "record_type": "research_seed_coverage", "name": "Netac", "display_name": "Netac", "category_ids": [ "memory_controllers_modules_storage" ], "occurrence_count": 1, "macro_stage_hints": [ "memory_storage", "substrate_board" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-netac-technology", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-netac-technology" ], "normalized_candidate_entity_ids": [ "ent-netac-technology" ], "candidate_record_types": { "ent-netac-technology": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-netac-technology", "name": "Netac Technology Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "memory modules", "ssd storage", "storage boards", "external storage" ], "product_ids": [] }, "source_ids": [ "src-netac-profile-20260801" ], "source_refs": [ { "source_id": "src-netac-profile-20260801", "title": "Netac Technology", "publisher": "Netac Technology Co., Ltd.", "url": "https://www.netac.com/", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-d2e34884d70bd28f", "record_type": "research_seed_coverage", "name": "Nexchip", "display_name": "Nexchip", "category_ids": [ "foundries_idms_wafer_fabs" ], "occurrence_count": 1, "macro_stage_hints": [ "front_end_fabrication", "production_qualification" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-nexchip-hefei", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-nexchip-hefei" ], "normalized_candidate_entity_ids": [ "ent-nexchip-hefei" ], "candidate_record_types": { "ent-nexchip-hefei": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-nexchip-hefei", "name": "Nexchip Semiconductor Corporation", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Hefei, Anhui, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "publicly_listed_mixed_ownership_current_control_unresolved", "supply_chain_layers": [], "product_ids": [] }, "source_ids": [ "src-nexchip-profile-en", "src-nexchip-sse-listing" ], "source_refs": [ { "source_id": "src-nexchip-profile-en", "title": "Corporate Profile", "publisher": "Nexchip Semiconductor Corporation", "url": "https://www.nexchip.com.cn/en-us/About/Introduce", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-nexchip-sse-listing", "title": "关于合肥晶合集成电路股份有限公司人民币普通股股票科创板上市交易的公告", "publisher": "上海证券交易所", "url": "https://www.sse.com.cn/disclosure/announcement/listing/ipo/c/c_20230504_89473619.shtml", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-ca4992453a0a5562", "record_type": "research_seed_coverage", "name": "OPC suppliers", "display_name": "OPC suppliers", "category_ids": [ "lithography_masks_patterning" ], "occurrence_count": 1, "macro_stage_hints": [ "lithography" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-e2f4e2c4b8d7cf9c", "record_type": "research_seed_coverage", "name": "OPPO", "display_name": "OPPO", "category_ids": [ "downstream_demand" ], "occurrence_count": 1, "macro_stage_hints": [ "cloud_deployment_demand", "systems_integration" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-9175f557840cdd6d", "record_type": "research_seed_coverage", "name": "OmniVision", "display_name": "OmniVision", "category_ids": [ "compound_power_rf_photonics_sensors", "fabless_and_system_silicon" ], "occurrence_count": 2, "macro_stage_hints": [ "chip_architecture", "design_ip_eda", "front_end_fabrication", "interconnect_networking" ], "coverage_state": "ambiguous_crosswalk_candidate", "resolution_status": "ambiguous_candidate", "disposition": "requires_crosswalk_review", "canonical_entity_id": null, "candidate_entity_ids": [ "ent-omnivision-technologies-us", "ent-willsemi" ], "exact_candidate_entity_ids": [ "ent-willsemi" ], "normalized_candidate_entity_ids": [ "ent-omnivision-technologies-us", "ent-willsemi" ], "candidate_record_types": { "ent-omnivision-technologies-us": "company", "ent-willsemi": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "exact_identity_collides_after_case_punctuation_normalization", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "More than one canonical identity can match this seed. Human review must establish the intended legal entity or brand endpoint; no candidate is counted as resolved.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-b7400aafdae38f4b", "record_type": "research_seed_coverage", "name": "PNCS", "display_name": "PNCS", "category_ids": [ "cleanrooms_utilities_environment", "equipment_components_subsystems" ], "occurrence_count": 2, "macro_stage_hints": [ "deposition_etch_clean_cmp", "inspection_metrology_test", "lithography", "power_cooling_facilities" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-pnc-process-systems", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-pnc-process-systems" ], "normalized_candidate_entity_ids": [ "ent-pnc-process-systems" ], "candidate_record_types": { "ent-pnc-process-systems": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-pnc-process-systems", "name": "PNC Process Systems Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "semiconductor process equipment", "high purity processing systems", "gas chemical delivery", "electronic materials" ], "product_ids": [] }, "source_ids": [ "src-pncs-group-profile-20260801" ], "source_refs": [ { "source_id": "src-pncs-group-profile-20260801", "title": "PNC Group Profile", "publisher": "PNC Process Systems Co., Ltd.", "url": "https://en.pncs.cn/brand/index.html", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-4f20eed411803150", "record_type": "research_seed_coverage", "name": "Payton", "display_name": "Payton", "category_ids": [ "packaging_osat_test_substrates" ], "occurrence_count": 1, "macro_stage_hints": [ "advanced_packaging_osat", "inspection_metrology_test", "substrate_board" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-payton-technology-shenzhen", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-payton-technology-shenzhen" ], "normalized_candidate_entity_ids": [ "ent-payton-technology-shenzhen" ], "candidate_record_types": { "ent-payton-technology-shenzhen": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-payton-technology-shenzhen", "name": "Payton Technology (Shenzhen) Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "dram packaging", "nand packaging", "assembly", "test" ], "product_ids": [] }, "source_ids": [ "src-payton-profile-20260801" ], "source_refs": [ { "source_id": "src-payton-profile-20260801", "title": "Payton Technology Company Profile", "publisher": "Payton Technology (Shenzhen) Co., Ltd.", "url": "https://en.kaifa.cn/uploadfiles/2020/09/20200921165222583.pdf", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-6caa722ead6bf66b", "record_type": "research_seed_coverage", "name": "Phichem", "display_name": "Phichem", "category_ids": [ "packaging_osat_test_substrates", "wafers_materials_gases_chemicals" ], "occurrence_count": 2, "macro_stage_hints": [ "advanced_packaging_osat", "inspection_metrology_test", "substrate_board", "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-phichem", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-phichem" ], "normalized_candidate_entity_ids": [ "ent-phichem" ], "candidate_record_types": { "ent-phichem": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-phichem", "name": "PhiChem Corporation", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Shanghai, China", "country_of_ownership": "China", "countries_of_operation": [ "China", "United States" ], "ownership_type": "publicly_listed_current_control_unresolved", "supply_chain_layers": [], "product_ids": [] }, "source_ids": [ "src-phichem-about" ], "source_refs": [ { "source_id": "src-phichem-about", "title": "About Us", "publisher": "PhiChem Corporation", "url": "https://phichem.com/about-us/", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-f632d3cdfbc39846", "record_type": "research_seed_coverage", "name": "Phison aiDAPTIV", "display_name": "Phison aiDAPTIV", "category_ids": [ "controlled_global_comparators" ], "occurrence_count": 1, "macro_stage_hints": [ "chip_architecture", "memory_storage", "systems_integration" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-e3c7eaf5784d9b2f", "record_type": "research_seed_coverage", "name": "Phytium", "display_name": "Phytium", "category_ids": [ "fabless_and_system_silicon" ], "occurrence_count": 1, "macro_stage_hints": [ "chip_architecture", "design_ip_eda" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-50f8c257433c33d0", "record_type": "research_seed_coverage", "name": "Pingxin Technology / 苹芯科技", "display_name": "Pingxin Technology / 苹芯科技", "category_ids": [ "hbm_reduced_architectures" ], "occurrence_count": 1, "macro_stage_hints": [ "advanced_packaging_osat", "chip_architecture", "memory_storage" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-b910bf609afbf50d", "record_type": "research_seed_coverage", "name": "Piotech", "display_name": "Piotech", "category_ids": [ "wafer_fabrication_equipment" ], "occurrence_count": 1, "macro_stage_hints": [ "deposition_etch_clean_cmp", "inspection_metrology_test" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-piotech", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-piotech" ], "normalized_candidate_entity_ids": [ "ent-piotech" ], "candidate_record_types": { "ent-piotech": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-piotech", "name": "Piotech Inc.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Shenyang, Liaoning, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_public", "supply_chain_layers": [ "deposition_equipment", "bonding_equipment" ], "product_ids": [ "prod-piotech-deposition-portfolio", "prod-piotech-w2w-hybrid-bonder" ] }, "source_ids": [ "src-piotech-annual-2025", "src-piotech-prospectus-2021" ], "source_refs": [ { "source_id": "src-piotech-annual-2025", "title": "拓荆科技股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688072_20260428_IFOF.pdf", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-piotech-prospectus-2021", "title": "拓荆科技股份有限公司招股说明书（注册稿）", "publisher": "拓荆科技股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202111/000996_20211105_MYB4.pdf", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-661b80e64e9c52d4", "record_type": "research_seed_coverage", "name": "SK hynix Dalian NAND", "display_name": "SK hynix Dalian NAND", "category_ids": [ "foreign_owned_mainland_operations" ], "occurrence_count": 1, "macro_stage_hints": [ "advanced_packaging_osat", "front_end_fabrication", "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-skhynix-dalian", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-skhynix-dalian" ], "normalized_candidate_entity_ids": [ "ent-skhynix-dalian" ], "candidate_record_types": { "ent-skhynix-dalian": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-skhynix-dalian", "name": "SK hynix semiconductor storage technology (Dalian) Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Dalian, Liaoning, China", "country_of_ownership": "South Korea", "countries_of_operation": [ "South Korea", "China" ], "ownership_type": "foreign_owned_mainland_operation", "supply_chain_layers": [ "nand_memory", "wafer_fabrication" ], "product_ids": [] }, "source_ids": [ "src-liaoning-skhynix-dalian-2026", "src-skhynix-dalian-acquisition-2021", "src-skhynix-official-network-2026", "src-skhynix-sec-subsidiaries-2026" ], "source_refs": [ { "source_id": "src-liaoning-skhynix-dalian-2026", "title": "3000余岗位助力大学生留辽来辽", "publisher": "辽宁省人民政府", "url": "https://www.ln.gov.cn/web/qmzx/yhyshjzt/dt/2026061509212657810/index.shtml", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-skhynix-dalian-acquisition-2021", "title": "SK hynix Completes the First Phase of Intel NAND and SSD Business Acquisition", "publisher": "SK hynix", "url": "https://news.skhynix.com/sk-hynix-completes-the-first-phase-of-intel-nand-and-ssd-business-acquisition/", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-skhynix-official-network-2026", "title": "Global Network", "publisher": "SK hynix Inc.", "url": "https://www.skhynix.com/company/UI-FR-CP06/", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-skhynix-sec-subsidiaries-2026", "title": "List of Subsidiaries of SK hynix Inc.", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785dex211.htm", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. 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Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-aa7df7436b8b4824", "record_type": "research_seed_coverage", "name": "SMEE", "display_name": "SMEE", "category_ids": [ "lithography_masks_patterning" ], "occurrence_count": 1, "macro_stage_hints": [ "lithography" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-smee", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-smee" ], "normalized_candidate_entity_ids": [ "ent-smee" ], "candidate_record_types": { "ent-smee": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-smee", "name": "Shanghai Micro Electronics Equipment (Group) Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Shanghai, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_state_linked", "supply_chain_layers": [ "lithography_equipment" ], "product_ids": [ "prod-smee-ssa600", "prod-smee-ssc800-10" ] }, "source_ids": [ "src-smee-ssa600-official" ], "source_refs": [ { "source_id": "src-smee-ssa600-official", "title": "600 Series Step-and-Scan Lithography System", "publisher": "上海微电子装备（集团）股份有限公司", "url": "https://www.smee.com.cn/eis.pub?method=indexinfo&onclicknodeno=1_4_1_1&service=homepageService", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-4f50473673715a16", "record_type": "research_seed_coverage", "name": "SMIC", "display_name": "SMIC", "category_ids": [ "foundries_idms_wafer_fabs" ], "occurrence_count": 1, "macro_stage_hints": [ "front_end_fabrication", "production_qualification" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-smic", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-smic" ], "normalized_candidate_entity_ids": [ "ent-smic" ], "candidate_record_types": { "ent-smic": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-smic", "name": "Semiconductor Manufacturing International Corporation", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Shanghai, China", "country_of_ownership": "Cayman Islands", "countries_of_operation": [ "Cayman Islands", "China" ], "ownership_type": "foreign_incorporated_mainland_operated", "supply_chain_layers": [ "foundry" ], "product_ids": [] }, "source_ids": [ "src-ft-yuliangsheng-smic-2026", "src-reuters-duv-aishengna-2026", "src-smic-annual-2025" ], "source_refs": [ { "source_id": "src-ft-yuliangsheng-smic-2026", "title": "China trials its first advanced tools for AI chipmaking", "publisher": "Financial Times", "url": "https://www.ft.com/content/8fd79522-e34f-4633-bc87-ef0aae2d9159", "primary_status": "secondary", "date_checked": "2026-07-29" }, { "source_id": "src-reuters-duv-aishengna-2026", "title": "China starts production of home-grown immersion DUV chipmaking tools, source says", "publisher": "Reuters", "url": "https://www.reuters.com/world/china/china-starts-production-home-grown-immersion-duv-chipmaking-tools-source-2026-07-28/", "primary_status": "secondary", "date_checked": "2026-07-29" }, { "source_id": "src-smic-annual-2025", "title": "SMIC 2025 Annual Report", "publisher": "Hong Kong Exchanges and Clearing Limited", "url": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0408/2026040801181.pdf", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-7e40782955701386", "record_type": "research_seed_coverage", "name": "SOPHGO", "display_name": "SOPHGO", "category_ids": [ "fabless_and_system_silicon", "hbm_reduced_architectures" ], "occurrence_count": 2, "macro_stage_hints": [ "advanced_packaging_osat", "chip_architecture", "design_ip_eda", "memory_storage" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_resolution_conflict", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-sophgo-beijing", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-sophgo-brand-endpoint-unresolved" ], "normalized_candidate_entity_ids": [ "ent-sophgo-brand-endpoint-unresolved" ], "candidate_record_types": { "ent-sophgo-brand-endpoint-unresolved": "brand_or_unresolved_endpoint" }, "resolution_conflict": true, "resolution_conflict_entity_ids": [ "ent-sophgo-brand-endpoint-unresolved" ], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "not_separately_recorded", "entity_snapshot": { "entity_id": "ent-sophgo-beijing", "name": "北京算能科技有限公司", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Beijing, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_private", "supply_chain_layers": [ "accelerators" ], "product_ids": [] }, "source_ids": [ "src-sophgo-privacy" ], "source_refs": [ { "source_id": "src-sophgo-privacy", "title": "隐私政策", "publisher": "北京算能科技有限公司", "url": "https://www.sophgo.com/site/provacy-policy.html", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The canonical seed resolver selects one entity, but another canonical identity record collides with the same seed string. Human review must reconcile the identity records; product-specific relationships still require separate sources.", "boundary": "A research seed or category match shows what is being investigated. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-c9a8c9f2b4f76447", "record_type": "research_seed_coverage", "name": "Samsung Xi’an NAND", "display_name": "Samsung Xi’an NAND", "category_ids": [ "foreign_owned_mainland_operations" ], "occurrence_count": 1, "macro_stage_hints": [ "advanced_packaging_osat", "front_end_fabrication", "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_contextual_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-samsung-china-semiconductor", "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "not_separately_recorded", "entity_snapshot": { "entity_id": "ent-samsung-china-semiconductor", "name": "Samsung (China) Semiconductor Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Xi'an, Shaanxi, China", "country_of_ownership": "South Korea", "countries_of_operation": [ "South Korea", "China" ], "ownership_type": "foreign_owned_mainland_operation", "supply_chain_layers": [ "nand_memory", "wafer_fabrication" ], "product_ids": [] }, "source_ids": [ "src-samsung-xian-operation-2014" ], "source_refs": [ { "source_id": "src-samsung-xian-operation-2014", "title": "Samsung Announces Operation of Its Memory Facility in Xi'an, China", "publisher": "Samsung Electronics", "url": "https://news.samsung.com/global/samsung-announces-operation-of-its-memory-facility-in-xian-china", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-6d410d92e6a69489", "record_type": "research_seed_coverage", "name": "Sanan IC", "display_name": "Sanan IC", "category_ids": [ "compound_power_rf_photonics_sensors", "foundries_idms_wafer_fabs" ], "occurrence_count": 2, "macro_stage_hints": [ "chip_architecture", "front_end_fabrication", "interconnect_networking", "production_qualification" ], "coverage_state": "exact_crosswalk_candidate", "resolution_status": "exact_nonlegal_candidate", "disposition": "requires_crosswalk_review", "canonical_entity_id": null, "candidate_entity_ids": [ "ent-sanan-ic-brand-unresolved" ], "exact_candidate_entity_ids": [ "ent-sanan-ic-brand-unresolved" ], "normalized_candidate_entity_ids": [ "ent-sanan-ic-brand-unresolved" ], "candidate_record_types": { "ent-sanan-ic-brand-unresolved": "brand_or_unresolved_endpoint" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "exact_brand_or_unresolved_endpoint_identity_string", "legal_identity_state": "unresolved", "entity_snapshot": { "entity_id": "ent-sanan-ic-brand-unresolved", "name": "Sanan IC", "entity_type": "brand_or_unresolved_endpoint", "completion_state": "lead_only", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "compound semiconductor foundry" ], "product_ids": [] }, "source_ids": [ "src-sanan-ic-profile-20260801" ], "source_refs": [ { "source_id": "src-sanan-ic-profile-20260801", "title": "About Sanan IC", "publisher": "Sanan IC", "url": "https://www.sanan-ic.com/en/about-us", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "A human review must confirm that the matching identity string is the intended research seed, then update the canonical seed resolver. This candidate is not counted as resolved.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-6b586442754bf795", "record_type": "research_seed_coverage", "name": "Semitronix", "display_name": "Semitronix", "category_ids": [ "eda_ip_design_services" ], "occurrence_count": 1, "macro_stage_hints": [ "design_ip_eda" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-semitronix", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-semitronix" ], "normalized_candidate_entity_ids": [ "ent-semitronix" ], "candidate_record_types": { "ent-semitronix": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-semitronix", "name": "Semitronix Corporation", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Hangzhou, Zhejiang, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_public", "supply_chain_layers": [ "eda", "wafer_test", "yield_analysis" ], "product_ids": [] }, "source_ids": [ "src-semitronix-annual-2025" ], "source_refs": [ { "source_id": "src-semitronix-annual-2025", "title": "杭州广立微电子股份有限公司2025年年度报告摘要", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-23/1225153966.PDF", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-5816d39c5e32e907", "record_type": "research_seed_coverage", "name": "Wuhan Xinxin / XMC", "display_name": "Wuhan Xinxin / XMC", "category_ids": [ "foundries_idms_wafer_fabs", "memory_controllers_modules_storage" ], "occurrence_count": 2, "macro_stage_hints": [ "front_end_fabrication", "memory_storage", "production_qualification", "substrate_board" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_contextual_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-xmc", "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "not_separately_recorded", "entity_snapshot": { "entity_id": "ent-xmc", "name": "Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Wuhan, Hubei, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_state_linked", "supply_chain_layers": [ "foundry", "specialty_memory", "3d_integration" ], "product_ids": [ "prod-xmc-spi-nor" ] }, "source_ids": [ "src-xmc-home-2026", "src-xmc-privacy-current-legal", "src-xmc-prospectus-2025" ], "source_refs": [ { "source_id": "src-xmc-home-2026", "title": "武汉新芯集成电路股份有限公司", "publisher": "武汉新芯集成电路股份有限公司", "url": "https://www.xmcwh.com/", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-xmc-privacy-current-legal", "title": "隐私协议", "publisher": "武汉新芯集成电路股份有限公司", "url": "https://www.xmcwh.com/site/privacy-agreement", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-xmc-prospectus-2025", "title": "武汉新芯集成电路股份有限公司招股说明书", "publisher": "武汉新芯集成电路股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202509/002044_20250929_SM99.pdf", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-a41ba66cf5f5ec90", "record_type": "research_seed_coverage", "name": "XTX", "display_name": "XTX", "category_ids": [ "memory_controllers_modules_storage" ], "occurrence_count": 1, "macro_stage_hints": [ "memory_storage", "substrate_board" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-xtx-technology", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-xtx-technology" ], "normalized_candidate_entity_ids": [ "ent-xtx-technology" ], "candidate_record_types": { "ent-xtx-technology": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-xtx-technology", "name": "XTX Technology Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "fabless chip design", "nor memory", "slc nand memory", "control chips" ], "product_ids": [] }, "source_ids": [ "src-xtx-profile-20260801" ], "source_refs": [ { "source_id": "src-xtx-profile-20260801", "title": "About XTX", "publisher": "XTX Technology Co., Ltd.", "url": "https://www.xtxtech.com/en/AboutCoreWorld/index.aspx", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-9fc7c2306f5afb4b", "record_type": "research_seed_coverage", "name": "Xiaomi", "display_name": "Xiaomi", "category_ids": [ "downstream_demand" ], "occurrence_count": 1, "macro_stage_hints": [ "cloud_deployment_demand", "systems_integration" ], "coverage_state": "exact_crosswalk_candidate", "resolution_status": "exact_nonlegal_candidate", "disposition": "requires_crosswalk_review", "canonical_entity_id": null, "candidate_entity_ids": [ "ent-xiaomi-brand" ], "exact_candidate_entity_ids": [ "ent-xiaomi-brand" ], "normalized_candidate_entity_ids": [ "ent-xiaomi-brand" ], "candidate_record_types": { "ent-xiaomi-brand": "brand" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "exact_brand_or_unresolved_endpoint_identity_string", "legal_identity_state": "unresolved", "entity_snapshot": { "entity_id": "ent-xiaomi-brand", "name": "Xiaomi", "entity_type": "brand", "completion_state": "source_backed", "headquarters": "Beijing, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "brand_identity_unresolved", "supply_chain_layers": [ "smartphones" ], "product_ids": [] }, "source_ids": [ "src-cxmt-xiaomi-transsion-validation-2023" ], "source_refs": [ { "source_id": "src-cxmt-xiaomi-transsion-validation-2023", "title": "长鑫存储LPDDR5产品正式发布", "publisher": "CXMT", "url": "https://www.cxmt.com/news/info_90.html", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "A human review must confirm that the matching identity string is the intended research seed, then update the canonical seed resolver. This candidate is not counted as resolved.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-ee04ffe0bba3cfd0", "record_type": "research_seed_coverage", "name": "Xingfa", "display_name": "Xingfa", "category_ids": [ "wafers_materials_gases_chemicals" ], "occurrence_count": 1, "macro_stage_hints": [ "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-hubei-xingfa-chemicals", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-hubei-xingfa-chemicals" ], "normalized_candidate_entity_ids": [ "ent-hubei-xingfa-chemicals" ], "candidate_record_types": { "ent-hubei-xingfa-chemicals": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-hubei-xingfa-chemicals", "name": "Hubei Xingfa Chemicals Group Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "electronic chemicals", "etching fluids", "semiconductor materials" ], "product_ids": [] }, "source_ids": [ "src-xingfa-profile-20260801" ], "source_refs": [ { "source_id": "src-xingfa-profile-20260801", "title": "About Xingfa Group", "publisher": "Hubei Xingfa Chemicals Group Co., Ltd.", "url": "https://www.xingfagroup.com/en/index.php/About", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-603462cdc8b22d44", "record_type": "research_seed_coverage", "name": "Xingfu", "display_name": "Xingfu", "category_ids": [ "wafers_materials_gases_chemicals" ], "occurrence_count": 1, "macro_stage_hints": [ "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-hubei-sinophorus-xingfu-electronic-materials", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-hubei-sinophorus-xingfu-electronic-materials" ], "normalized_candidate_entity_ids": [ "ent-hubei-sinophorus-xingfu-electronic-materials" ], "candidate_record_types": { "ent-hubei-sinophorus-xingfu-electronic-materials": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-hubei-sinophorus-xingfu-electronic-materials", "name": "Hubei Sinophorus Electronic Materials Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "wet chemicals", "etchants", "photoresist developers", "cleaners", "strippers" ], "product_ids": [] }, "source_ids": [ "src-sinophorus-profile-20260801" ], "source_refs": [ { "source_id": "src-sinophorus-profile-20260801", "title": "About Sinophorus", "publisher": "Hubei Sinophorus Electronic Materials Co., Ltd.", "url": "https://m.sinophorus.com/about-us", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-cc380acf25951404", "record_type": "research_seed_coverage", "name": "Xinlai", "display_name": "Xinlai", "category_ids": [ "equipment_components_subsystems" ], "occurrence_count": 1, "macro_stage_hints": [ "deposition_etch_clean_cmp", "inspection_metrology_test", "lithography" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-kunshan-kinglai-xinlai", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-kunshan-kinglai-xinlai" ], "normalized_candidate_entity_ids": [ "ent-kunshan-kinglai-xinlai" ], "candidate_record_types": { "ent-kunshan-kinglai-xinlai": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-kunshan-kinglai-xinlai", "name": "Kunshan Kinglai Hygienic Materials Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "high purity gas chemical delivery", "vacuum system components" ], "product_ids": [] }, "source_ids": [ "src-xinlai-annual-2025" ], "source_refs": [ { "source_id": "src-xinlai-annual-2025", "title": "昆山新莱洁净应用材料股份有限公司2025年年度报告", "publisher": "昆山新莱洁净应用材料股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-28/1225215794.PDF", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-bdf00a9bfdd2ed12", "record_type": "research_seed_coverage", "name": "Xi’an Eswin Material", "display_name": "Xi’an Eswin Material", "category_ids": [ "wafers_materials_gases_chemicals" ], "occurrence_count": 1, "macro_stage_hints": [ "wafers_materials_chemicals" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-xian-eswin-material", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-xian-eswin-material" ], "normalized_candidate_entity_ids": [ "ent-xian-eswin-material" ], "candidate_record_types": { "ent-xian-eswin-material": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-xian-eswin-material", "name": "Xi'an ESWIN Material Technology Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "12 inch silicon wafers", "semiconductor materials" ], "product_ids": [] }, "source_ids": [ "src-eswin-material-sse-20250815" ], "source_refs": [ { "source_id": "src-eswin-material-sse-20250815", "title": "Xi'an ESWIN Material Technology listing review notice", "publisher": "Shanghai Stock Exchange", "url": "https://english.sse.com.cn/news/newsrelease/voice/c/c_20250815_10788645.shtml", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-adeb5b1cc11eef55", "record_type": "research_seed_coverage", "name": "Xpeedic", "display_name": "Xpeedic", "category_ids": [ "eda_ip_design_services" ], "occurrence_count": 1, "macro_stage_hints": [ "design_ip_eda" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-xpeedic", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-xpeedic" ], "normalized_candidate_entity_ids": [ "ent-xpeedic" ], "candidate_record_types": { "ent-xpeedic": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-xpeedic", "name": "Xpeedic Technology, Inc.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Shanghai, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_private", "supply_chain_layers": [ "eda", "design_services" ], "product_ids": [] }, "source_ids": [ "src-xpeedic-pdk-2022" ], "source_refs": [ { "source_id": "src-xpeedic-pdk-2022", "title": "Chip Design EDA Solution", "publisher": "芯和半导体科技（上海）股份有限公司", "url": "https://www.xpeedic.com/cn/ueditor/php/upload/file/20220412/1649752311805858.pdf", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-1df5c47a0ef63bba", "record_type": "research_seed_coverage", "name": "YEESTOR", "display_name": "YEESTOR", "category_ids": [ "fabless_and_system_silicon", "memory_controllers_modules_storage" ], "occurrence_count": 2, "macro_stage_hints": [ "chip_architecture", "design_ip_eda", "memory_storage", "substrate_board" ], "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "disposition": "requires_primary_research", "canonical_entity_id": null, "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "none", "legal_identity_state": "unresolved", "entity_snapshot": null, "source_ids": [], "source_refs": [], "last_checked": "2026-07-29", "remaining_receipt": "A primary legal-identity or role source and a canonical entity record or explicit generic-queue disposition are still required.", "boundary": "A research seed or category match shows what is being investigated. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-410fabaf2c783586", "record_type": "research_seed_coverage", "name": "上海东方算芯科技有限公司", "display_name": "上海东方算芯科技有限公司", "category_ids": [ "fabless_and_system_silicon" ], "occurrence_count": 1, "macro_stage_hints": [ "chip_architecture", "design_ip_eda" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-dfsx", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-dfsx" ], "normalized_candidate_entity_ids": [ "ent-dfsx" ], "candidate_record_types": { "ent-dfsx": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "not_separately_recorded", "entity_snapshot": { "entity_id": "ent-dfsx", "name": "上海东方算芯科技有限公司", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Shanghai, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_private", "supply_chain_layers": [ "ai_accelerator", "systems", "software" ], "product_ids": [ "prod-dfsx-df1000", "prod-dfsx-hs512", "prod-dfsx-qy100", "prod-dfsx-ty64" ] }, "source_ids": [ "src-dfsx-3d-near-memory-2026", "src-dfsx-df1000-product-2026" ], "source_refs": [ { "source_id": "src-dfsx-3d-near-memory-2026", "title": "3D Near-Memory Computing", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/technology/3d-near-memory-computing", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-dfsx-df1000-product-2026", "title": "DF1000 AI Accelerator", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/products/ai-accelerator/df1000", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. 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It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-72601ea105049cb1", "record_type": "research_seed_coverage", "name": "上海宇量昇科技有限公司", "display_name": "上海宇量昇科技有限公司", "category_ids": [ "lithography_masks_patterning" ], "occurrence_count": 1, "macro_stage_hints": [ "lithography" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-yuliangsheng", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-yuliangsheng" ], "normalized_candidate_entity_ids": [ "ent-yuliangsheng" ], "candidate_record_types": { "ent-yuliangsheng": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "not_separately_recorded", "entity_snapshot": { "entity_id": "ent-yuliangsheng", "name": "上海宇量昇科技有限公司", "entity_type": "company", "completion_state": "lead_only", "headquarters": "Shanghai, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_private", "supply_chain_layers": [ "lithography_equipment" ], "product_ids": [] }, "source_ids": [ "src-ft-yuliangsheng-smic-2026" ], "source_refs": [ { "source_id": "src-ft-yuliangsheng-smic-2026", "title": "China trials its first advanced tools for AI chipmaking", "publisher": "Financial Times", "url": "https://www.ft.com/content/8fd79522-e34f-4633-bc87-ef0aae2d9159", "primary_status": "secondary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-9758269115b44d81", "record_type": "research_seed_coverage", "name": "上海爱晟纳电子科技集团有限公司", "display_name": "上海爱晟纳电子科技集团有限公司", "category_ids": [ "lithography_masks_patterning" ], "occurrence_count": 1, "macro_stage_hints": [ "lithography" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-aishengna", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-aishengna" ], "normalized_candidate_entity_ids": [ "ent-aishengna" ], "candidate_record_types": { "ent-aishengna": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "not_separately_recorded", "entity_snapshot": { "entity_id": "ent-aishengna", "name": "上海爱晟纳电子科技集团有限公司", "entity_type": "company", "completion_state": "lead_only", "headquarters": "Shanghai, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_private", "supply_chain_layers": [ "lithography_equipment" ], "product_ids": [] }, "source_ids": [ "src-reuters-duv-aishengna-2026" ], "source_refs": [ { "source_id": "src-reuters-duv-aishengna-2026", "title": "China starts production of home-grown immersion DUV chipmaking tools, source says", "publisher": "Reuters", "url": "https://www.reuters.com/world/china/china-starts-production-home-grown-immersion-duv-chipmaking-tools-source-2026-07-28/", "primary_status": "secondary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-d51fcb546977b50a", "record_type": "research_seed_coverage", "name": "九日新材 / Jiuri New Materials", "display_name": "九日新材 / Jiuri New Materials", "category_ids": [ "lithography_masks_patterning" ], "occurrence_count": 1, "macro_stage_hints": [ "lithography" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-tianjin-jiuri-new-materials", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-tianjin-jiuri-new-materials" ], "normalized_candidate_entity_ids": [ "ent-tianjin-jiuri-new-materials" ], "candidate_record_types": { "ent-tianjin-jiuri-new-materials": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-tianjin-jiuri-new-materials", "name": "Tianjin Jiuri New Materials Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "photoresist materials", "electronic chemicals" ], "product_ids": [] }, "source_ids": [ "src-jiuri-annual-2025" ], "source_refs": [ { "source_id": "src-jiuri-annual-2025", "title": "天津久日新材料股份有限公司2025年年度报告", "publisher": "天津久日新材料股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-25/1225188188.PDF", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-e14db27ec961db30", "record_type": "research_seed_coverage", "name": "北京科益虹源 / Beijing RSLaser", "display_name": "北京科益虹源 / Beijing RSLaser", "category_ids": [ "lithography_masks_patterning" ], "occurrence_count": 1, "macro_stage_hints": [ "lithography" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_contextual_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-rslaser", "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "not_separately_recorded", "entity_snapshot": { "entity_id": "ent-rslaser", "name": "北京科益虹源光电技术有限公司", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Beijing, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_private", "supply_chain_layers": [ "lithography_light_source", "equipment_components" ], "product_ids": [] }, "source_ids": [ "src-rslaser-yizhuang-project-2021" ], "source_refs": [ { "source_id": "src-rslaser-yizhuang-project-2021", "title": "科益虹源集成电路光刻光源制造及翻新基地（北京亦庄研发基地）项目", "publisher": "北京市公共资源交易服务平台", "url": "https://ggzyfw.beijing.gov.cn/jylcgcjs/20210910/2058109.html", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-32d8620e7d24d0d0", "record_type": "research_seed_coverage", "name": "华卓精科 / U-Precision", "display_name": "华卓精科 / U-Precision", "category_ids": [ "lithography_masks_patterning" ], "occurrence_count": 1, "macro_stage_hints": [ "lithography" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_contextual_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-uprecision", "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "not_separately_recorded", "entity_snapshot": { "entity_id": "ent-uprecision", "name": "Beijing U-Precision Tech Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Beijing, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_private", "supply_chain_layers": [ "equipment_components", "bonding_equipment" ], "product_ids": [] }, "source_ids": [ "src-uprecision-prospectus-2026" ], "source_refs": [ { "source_id": "src-uprecision-prospectus-2026", "title": "北京华卓精科科技股份有限公司招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202606/002213_20260630_2DQN.pdf", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-0677d87498d1d0e8", "record_type": "research_seed_coverage", "name": "国望光学 / Guowang Optics", "display_name": "国望光学 / Guowang Optics", "category_ids": [ "lithography_masks_patterning" ], "occurrence_count": 1, "macro_stage_hints": [ "lithography" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_contextual_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-guowang-optics", "candidate_entity_ids": [], "exact_candidate_entity_ids": [], "normalized_candidate_entity_ids": [], "candidate_record_types": {}, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "not_separately_recorded", "entity_snapshot": { "entity_id": "ent-guowang-optics", "name": "北京国望光学科技有限公司", "entity_type": "company", "completion_state": "source_backed", "headquarters": "Beijing, China", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_state_linked", "supply_chain_layers": [ "projection_optics", "equipment_components" ], "product_ids": [] }, "source_ids": [ "src-guowang-base-production-2024", "src-guowang-hermle-award-2022", "src-guowang-optics-base-2021" ], "source_refs": [ { "source_id": "src-guowang-base-production-2024", "title": "国望光学曝光光学系统基地竣工投产", "publisher": "国家科技创新中心", "url": "https://www.ncsti.gov.cn/kjdt/scyq/bjjjjskfq/jkdt/202402/t20240219_149260.html", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-guowang-hermle-award-2022", "title": "北京国望光学科技有限公司五轴立式加工中心项目评标结果公告", "publisher": "商务部机电产品招标投标电子交易平台", "url": "https://chinabidding.mofcom.gov.cn/bidDetail/bidding/bulletin/202206/ff8080817d94c145018145fd60755ec2.html", "primary_status": "primary", "date_checked": "2026-07-29" }, { "source_id": "src-guowang-optics-base-2021", "title": "投影光刻机曝光光学系统研发及批量生产基地项目", "publisher": "北京市公共资源交易服务平台", "url": "https://ggzyfw.beijing.gov.cn/jylcgcjs/20210114/1340589.html", "primary_status": "primary", "date_checked": "2026-07-29" } ], "last_checked": "2026-07-29", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-2379317de3b1df20", "record_type": "research_seed_coverage", "name": "清溢光电 / Qingyi Photomask", "display_name": "清溢光电 / Qingyi Photomask", "category_ids": [ "lithography_masks_patterning" ], "occurrence_count": 1, "macro_stage_hints": [ "lithography" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-shenzhen-qingyi-photomask", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-shenzhen-qingyi-photomask" ], "normalized_candidate_entity_ids": [ "ent-shenzhen-qingyi-photomask" ], "candidate_record_types": { "ent-shenzhen-qingyi-photomask": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-shenzhen-qingyi-photomask", "name": "Shenzhen Qingyi Photomask Limited", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "photomasks", "lithography materials" ], "product_ids": [] }, "source_ids": [ "src-qingyi-photomask-profile-20260801" ], "source_refs": [ { "source_id": "src-qingyi-photomask-profile-20260801", "title": "About Qingyi Photomask", "publisher": "Shenzhen Qingyi Photomask Limited", "url": "https://en.supermask.com/Aboutus/1.html", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." }, { "id": "seed-5045c2b3cc65a015", "record_type": "research_seed_coverage", "name": "路维光电 / Newway Photomask", "display_name": "路维光电 / Newway Photomask", "category_ids": [ "lithography_masks_patterning" ], "occurrence_count": 1, "macro_stage_hints": [ "lithography" ], "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "disposition": "resolved_to_canonical_entity", "canonical_entity_id": "ent-shenzhen-newway-photomask", "candidate_entity_ids": [], "exact_candidate_entity_ids": [ "ent-shenzhen-newway-photomask" ], "normalized_candidate_entity_ids": [ "ent-shenzhen-newway-photomask" ], "candidate_record_types": { "ent-shenzhen-newway-photomask": "company" }, "resolution_conflict": false, "resolution_conflict_entity_ids": [], "identity_match_basis": "canonical_seed_resolution", "legal_identity_state": "verified", "entity_snapshot": { "entity_id": "ent-shenzhen-newway-photomask", "name": "Shenzhen Newway Photomask Making Co., Ltd.", "entity_type": "company", "completion_state": "source_backed", "headquarters": "China; exact headquarters unresolved", "country_of_ownership": "China", "countries_of_operation": [ "China" ], "ownership_type": "mainland_control_not_closed_in_source", "supply_chain_layers": [ "photomasks", "lithography materials" ], "product_ids": [] }, "source_ids": [ "src-newway-photomask-profile-20260801" ], "source_refs": [ { "source_id": "src-newway-photomask-profile-20260801", "title": "Newway Photomask", "publisher": "Shenzhen Newway Photomask Making Co., Ltd.", "url": "https://www.newwaymask.com/en/", "primary_status": "primary", "date_checked": "2026-08-01" } ], "last_checked": "2026-08-01", "remaining_receipt": "The seed-to-entity crosswalk is recorded. Product-specific supplier, facility, qualification, volume, and deployment relationships still require their own sources.", "boundary": "A research seed or category match shows what is being investigated. It does not prove capability, ownership, manufacturing origin, a product-specific supplier relationship, qualification, shipment volume, or deployment." } ], "memberships": [ { "id": "membership-0f1114ed7f261309", "record_type": "research_seed_category_membership", "category_id": "cleanrooms_utilities_environment", "position": 1, "seed_id": "seed-d795ae41bb9cb0d1", "seed_name": "Bocheng", "seed_display_name": "Bocheng", "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "boundary": "Category membership is a research-routing record, not a capability or supplier relationship." }, { "id": "membership-96c17dceeef0f6ec", "record_type": "research_seed_category_membership", "category_id": "cleanrooms_utilities_environment", "position": 2, "seed_id": "seed-2233362786da7964", "seed_name": "L&K Engineering", "seed_display_name": "L&K Engineering", "coverage_state": "canonical_resolved", "resolution_status": "canonical_exact_resolved", "boundary": "Category 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relationship." }, { "id": "membership-6315d33dc118b438", "record_type": "research_seed_category_membership", "category_id": "cleanrooms_utilities_environment", "position": 5, "seed_id": "seed-9c362b5aff967733", "seed_name": "Huakang", "seed_display_name": "Huakang", "coverage_state": "canonical_resolved", "resolution_status": "canonical_contextual_resolved", "boundary": "Category membership is a research-routing record, not a capability or supplier relationship." }, { "id": "membership-cfec82424882756f", "record_type": "research_seed_category_membership", "category_id": "cleanrooms_utilities_environment", "position": 6, "seed_id": "seed-c79fb1fbae9e4e08", "seed_name": "MayAir", "seed_display_name": "MayAir", "coverage_state": "unresolved_research_seed", "resolution_status": "unresolved", "boundary": "Category membership is a research-routing record, not a capability or supplier relationship." }, { "id": "membership-a79a9283c8e4e640", "record_type": "research_seed_category_membership", 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