{
  "schema_version": "touchdown.ai-chip-product-progress.v2",
  "title": "China and United States AI chip product-progress ledger",
  "updated_at": "2026-08-01",
  "scope": "Dated, source-bounded milestones for selected China accelerator paths, the five active NVIDIA reference paths, and exact AMD products only where a dated product receipt is available. This is a progress ledger, not a matched-performance score or a complete shipment census.",
  "method": "The event date is the date or period stated by the cited source. Date precision is explicit. A launch, roadmap, tapeout, bring-up, design-in, vendor production statement, cloud listing, or deployment is kept at that exact readiness gate and is not promoted to a later gate.",
  "summary": {
    "event_count": 38,
    "product_linked_event_count": 37,
    "products_covered": 28,
    "china_events": 26,
    "china_products_covered": 21,
    "united_states_events": 12,
    "united_states_products_covered": 7,
    "unique_source_urls": 30,
    "official_events": 36,
    "reported_events": 2,
    "day_precision_events": 23,
    "month_precision_events": 9,
    "year_precision_events": 6
  },
  "evidence_states": {
    "official": "The named company, cloud provider, issuer filing, or product owner published the receipt. Official does not mean independently verified.",
    "reported": "A named publication or reader-supplied discovery item reports the milestone, but the primary product-owner receipt is missing."
  },
  "date_precision_levels": {
    "day": "The source supports an exact calendar day.",
    "month": "The source supports only a calendar month; no day is inferred.",
    "year": "The source supports only a calendar year; no month or day is inferred."
  },
  "readiness_gate_definitions": {
    "roadmap": "The vendor disclosed a planned product or availability window.",
    "tapeout": "The vendor says a design was sent for fabrication.",
    "silicon_bringup": "The vendor says initial silicon was powered on or tested.",
    "system_bringup": "A named operator says a complete system was powered on and validated.",
    "software_enablement": "A dated software or kernel receipt names the product.",
    "development_validation": "Development validation is underway or reported near completion.",
    "product_validation": "The vendor reports product validation, without treating it as customer qualification.",
    "workload_validation": "A named workload or compatibility test was passed.",
    "product_announcement": "The product was publicly disclosed.",
    "product_launch": "The vendor launched or released the product; shipment volume remains separate.",
    "small_batch": "The vendor or issuer reports small-batch delivery or production.",
    "component_design_in": "A named component supplier reports a design-in or integration for the product.",
    "internal_deployment": "The product owner says the product was used inside its own operations.",
    "cloud_availability": "A named cloud provider says customers can access the product.",
    "customer_deployment": "A named system or vehicle deployment is reported.",
    "vendor_reported_volume": "The vendor reports mass production, shipment, or scaled sales; audited units remain separate."
  },
  "events": [
    {
      "id": "cxmt-lpddr6-development-validation-2026-08-01",
      "date": "2026-08-01",
      "date_precision": "day",
      "company": "CXMT",
      "country": "China",
      "product_id": null,
      "product": "LPDDR6",
      "event_type": "development_validation_report",
      "readiness_gate": "development_validation",
      "state": "reported",
      "evidence_state": "reported",
      "summary": "Yicai reporting cited an industry source saying CXMT's LPDDR6 was close to completing development validation, described as an important step before mass production.",
      "boundary": "This is not evidence of completed customer qualification, mass production, volume shipment, yield, or a complete qualified production chain.",
      "source_title": "Reader-supplied screenshot summarizing Yicai reporting",
      "discovery_source": "Screenshot of an X post supplied by the reader on 2026-08-01; the embedded Chinese text attributes the claim to Yicai and an unnamed industry source.",
      "source_url": null,
      "missing_receipts": [
        "original Yicai URL",
        "CXMT announcement",
        "customer qualification",
        "production start",
        "shipment volume",
        "yield"
      ]
    },
    {
      "id": "dfsx-df1000-launch-2026-07-13",
      "date": "2026-07-13",
      "date_precision": "day",
      "company": "Shanghai DFSX",
      "country": "China",
      "product_id": "dfsx-df1000",
      "product": "DF1000",
      "event_type": "reported_product_launch",
      "readiness_gate": "product_launch",
      "state": "reported",
      "evidence_state": "reported",
      "summary": "TrendForce China reported that DFSX launched DF1000 on July 13, 2026. DFSX showed cards and systems and claims functional validation and readiness for mass production.",
      "boundary": "A launch and vendor readiness claim do not establish customer qualification, accepted production workloads, audited shipment volume, yield, or a complete qualified supply chain.",
      "source_title": "TrendForce China report on the DF1000 launch",
      "source_url": "https://www.trendforce.cn/industry-news/semiconductors/20260714-6437.html",
      "missing_receipts": [
        "dated DFSX launch release",
        "independent silicon inspection",
        "named customer qualification",
        "volume shipments",
        "yield and supply-chain provenance"
      ]
    },
    {
      "id": "huawei-ascend-910c-atlas-900-a3-deployment-2025-09-18",
      "date": "2025-09-18",
      "date_precision": "day",
      "company": "Huawei",
      "country": "China",
      "product_id": "huawei-ascend-910c",
      "product": "Ascend 910C / Atlas 900 A3",
      "event_type": "vendor_deployment_disclosure",
      "readiness_gate": "customer_deployment",
      "state": "official",
      "evidence_state": "official",
      "summary": "Huawei said it had deployed more than 300 Atlas 900 A3 SuperPoD systems, built around Ascend 910C, for more than 20 customers across several industries.",
      "boundary": "This company-reported installed-base statement does not disclose customer names, accepted workload results, shipment mix, manufacturing provenance, yield, or independently verified system counts.",
      "source_title": "Huawei SuperPoD architecture and deployment statement",
      "source_url": "https://www.huawei.com/cn/news/2025/9/hc-superpod-innovation",
      "missing_receipts": [
        "named customer installations",
        "accepted workload benchmarks",
        "independent installed-base audit",
        "chip and memory supplier allocation",
        "system-level yield and reliability"
      ]
    },
    {
      "id": "huawei-ascend-950pr-roadmap-2025-09-18",
      "date": "2025-09-18",
      "date_precision": "day",
      "company": "Huawei",
      "country": "China",
      "product_id": "huawei-ascend-950pr",
      "product": "Ascend 950PR",
      "event_type": "product_roadmap_disclosure",
      "readiness_gate": "roadmap",
      "state": "official",
      "evidence_state": "official",
      "summary": "Huawei disclosed Ascend 950PR and said it was intended for prefill and recommendation workloads with a first-quarter 2026 availability target.",
      "boundary": "A roadmap and target quarter are not evidence that silicon was delivered, independently measured, customer-qualified, produced in volume, or available on schedule.",
      "source_title": "Huawei Ascend chip roadmap keynote",
      "source_url": "https://www.huawei.com/en/news/2025/9/hc-xu-keynote-speech",
      "missing_receipts": [
        "shipping product receipt",
        "independent silicon measurement",
        "customer qualification",
        "volume production",
        "supplier and process provenance"
      ]
    },
    {
      "id": "huawei-ascend-950dt-roadmap-2025-09-18",
      "date": "2025-09-18",
      "date_precision": "day",
      "company": "Huawei",
      "country": "China",
      "product_id": "huawei-ascend-950dt",
      "product": "Ascend 950DT",
      "event_type": "product_roadmap_disclosure",
      "readiness_gate": "roadmap",
      "state": "official",
      "evidence_state": "official",
      "summary": "Huawei disclosed Ascend 950DT for decode and training workloads with a fourth-quarter 2026 availability target.",
      "boundary": "A roadmap and target quarter are not evidence that silicon was delivered, independently measured, customer-qualified, produced in volume, or available on schedule.",
      "source_title": "Huawei Ascend chip roadmap keynote",
      "source_url": "https://www.huawei.com/en/news/2025/9/hc-xu-keynote-speech",
      "missing_receipts": [
        "shipping product receipt",
        "independent silicon measurement",
        "customer qualification",
        "volume production",
        "supplier and process provenance"
      ]
    },
    {
      "id": "metax-c500-tapeout-2022-12",
      "date": "2022-12",
      "date_precision": "month",
      "company": "MetaX",
      "country": "China",
      "product_id": "metax-c500-c550",
      "product": "MetaX C500",
      "event_type": "vendor_reported_tapeout",
      "readiness_gate": "tapeout",
      "state": "official",
      "evidence_state": "official",
      "summary": "MetaX's company timeline records the C500 tapeout in December 2022.",
      "boundary": "Tapeout does not prove working silicon, acceptable yield, customer qualification, shipment, or volume production.",
      "source_title": "MetaX company milestones",
      "source_url": "https://www.metax-tech.com/en/about/about.html",
      "missing_receipts": [
        "foundry lot and process receipt",
        "working-silicon bring-up",
        "yield",
        "customer qualification",
        "volume shipment"
      ]
    },
    {
      "id": "metax-c500-bringup-2023-06",
      "date": "2023-06",
      "date_precision": "month",
      "company": "MetaX",
      "country": "China",
      "product_id": "metax-c500-c550",
      "product": "MetaX C500",
      "event_type": "vendor_reported_silicon_bringup",
      "readiness_gate": "silicon_bringup",
      "state": "official",
      "evidence_state": "official",
      "summary": "MetaX's company timeline says C500 completed testing within five hours after bring-up in June 2023.",
      "boundary": "A vendor bring-up milestone does not establish full functional coverage, production yield, customer qualification, shipment, or sustained workload performance.",
      "source_title": "MetaX company milestones",
      "source_url": "https://www.metax-tech.com/en/about/about.html",
      "missing_receipts": [
        "test coverage",
        "independent silicon measurement",
        "production yield",
        "customer qualification",
        "volume shipment"
      ]
    },
    {
      "id": "metax-c500-mass-production-shipment-2023-12",
      "date": "2023-12",
      "date_precision": "month",
      "company": "MetaX",
      "country": "China",
      "product_id": "metax-c500-c550",
      "product": "MetaX C500",
      "event_type": "vendor_reported_mass_production_and_shipment",
      "readiness_gate": "vendor_reported_volume",
      "state": "official",
      "evidence_state": "official",
      "summary": "MetaX's company timeline says C500 entered mass production and shipment in December 2023 and records 1,000-card cluster deployments that month.",
      "boundary": "The vendor timeline does not disclose audited units, recipients, installed configuration, accepted workload results, current production rate, or supplier provenance.",
      "source_title": "MetaX company milestones",
      "source_url": "https://www.metax-tech.com/en/about/about.html",
      "missing_receipts": [
        "audited shipment units",
        "named recipients",
        "customer acceptance",
        "current production rate",
        "supplier and manufacturing provenance"
      ]
    },
    {
      "id": "metax-c600-tapeout-2024-10",
      "date": "2024-10",
      "date_precision": "month",
      "company": "MetaX",
      "country": "China",
      "product_id": "metax-c600",
      "product": "MetaX C600",
      "event_type": "vendor_reported_tapeout",
      "readiness_gate": "tapeout",
      "state": "official",
      "evidence_state": "official",
      "summary": "MetaX's company timeline records the C600 tapeout in October 2024.",
      "boundary": "Tapeout does not prove working silicon, acceptable yield, customer qualification, shipment, or volume production.",
      "source_title": "MetaX company milestones",
      "source_url": "https://www.metax-tech.com/en/about/about.html",
      "missing_receipts": [
        "foundry lot and process receipt",
        "working-silicon bring-up",
        "yield",
        "customer qualification",
        "volume shipment"
      ]
    },
    {
      "id": "metax-c600-bringup-2025-07",
      "date": "2025-07",
      "date_precision": "month",
      "company": "MetaX",
      "country": "China",
      "product_id": "metax-c600",
      "product": "MetaX C600",
      "event_type": "vendor_reported_silicon_bringup",
      "readiness_gate": "silicon_bringup",
      "state": "official",
      "evidence_state": "official",
      "summary": "MetaX's company timeline records C600 bring-up in July 2025, nine months after its reported tapeout.",
      "boundary": "A vendor bring-up milestone does not establish production yield, customer qualification, shipment, current availability, or sustained workload performance.",
      "source_title": "MetaX company milestones",
      "source_url": "https://www.metax-tech.com/en/about/about.html",
      "missing_receipts": [
        "independent silicon measurement",
        "production yield",
        "customer qualification",
        "volume shipment",
        "current availability"
      ]
    },
    {
      "id": "moore-threads-s4000-gemm-engineering-2026-04-14",
      "date": "2026-04-14",
      "date_precision": "day",
      "company": "Moore Threads",
      "country": "China",
      "product_id": "moore-threads-s4000",
      "product": "MTT S4000",
      "event_type": "dated_software_engineering_receipt",
      "readiness_gate": "software_enablement",
      "state": "official",
      "evidence_state": "official",
      "summary": "Moore Threads published dated GEMM kernel engineering work for its GPU software stack, providing a product-era software enablement receipt for the S4000 path.",
      "boundary": "A vendor engineering article does not establish broad framework compatibility, customer workload acceptance, shipment volume, or comparative end-to-end performance.",
      "source_title": "Moore Threads GEMM engineering article",
      "source_url": "https://blog.mthreads.com/blog/GEMM/2026-04-14-GEMM01/",
      "missing_receipts": [
        "reproducible code and environment",
        "independent benchmark replay",
        "customer workload acceptance",
        "shipment volume"
      ]
    },
    {
      "id": "kunlunxin-p800-deepseek-adaptation-test-2025-04-17",
      "date": "2025-04-17",
      "date_precision": "day",
      "company": "Kunlunxin / Baidu",
      "country": "China",
      "product_id": "kunlunxin-p800",
      "product": "Kunlunxin P800",
      "event_type": "named_workload_adaptation_test",
      "readiness_gate": "workload_validation",
      "state": "official",
      "evidence_state": "official",
      "summary": "Kunlunxin said an eight-card P800 system passed a CAICT DeepSeek-V3/R1 671B adaptation-support test with reported accuracy aligned to the DeepSeek technical report and support for long-context inference.",
      "boundary": "One named adaptation-support test does not establish production throughput, latency, energy, cost, reliability, broad customer qualification, shipment volume, or matched performance against another platform.",
      "source_title": "Kunlunxin report of CAICT DeepSeek adaptation testing",
      "source_url": "https://www.kunlunxin.com/news/4471.html",
      "missing_receipts": [
        "full CAICT result packet",
        "reproducible workload configuration",
        "latency and throughput",
        "energy and cost",
        "named customer acceptance"
      ]
    },
    {
      "id": "horizon-journey-6-launch-2024",
      "date": "2024",
      "date_precision": "year",
      "company": "Horizon Robotics",
      "country": "China",
      "product_id": "horizon-journey-6",
      "product": "Journey 6 family",
      "event_type": "vendor_reported_family_launch",
      "readiness_gate": "product_launch",
      "state": "official",
      "evidence_state": "official",
      "summary": "Horizon Robotics identifies 2024 as the launch year for the Journey 6 family and says members of the family entered vehicle production programs.",
      "boundary": "A family-level launch statement does not identify qualification and shipment status for every Journey 6 member, vehicle program, foundry lot, or production volume.",
      "source_title": "Horizon Robotics Journey 6 product page",
      "source_url": "https://en.horizon.auto/solutions/horizon-journey",
      "missing_receipts": [
        "member-by-member launch dates",
        "named vehicle qualification by product",
        "shipment units",
        "foundry and packaging provenance"
      ]
    },
    {
      "id": "alibaba-hanguang-800-launch-internal-use-2019-09-25",
      "date": "2019-09-25",
      "date_precision": "day",
      "company": "Alibaba / T-Head",
      "country": "China",
      "product_id": "alibaba-t-head-hanguang-800",
      "product": "Hanguang 800",
      "event_type": "launch_and_internal_use_disclosure",
      "readiness_gate": "internal_deployment",
      "state": "official",
      "evidence_state": "official",
      "summary": "Alibaba unveiled Hanguang 800 and said the inference chip was already used internally for search, translation, recommendations, advertising, and customer service.",
      "boundary": "Internal use does not establish merchant availability, deployment scale, current production, customer qualification, supplier provenance, or independently replayed performance.",
      "source_title": "Alibaba unveils Hanguang 800",
      "source_url": "https://www.alibabagroup.com/en-US/document-1491206538574954496",
      "missing_receipts": [
        "installed chip count",
        "current production status",
        "external customer availability",
        "independent benchmark replay",
        "supplier provenance"
      ]
    },
    {
      "id": "tencent-zixiao-c100-ptx1-launch-2022-12",
      "date": "2022-12",
      "date_precision": "month",
      "company": "Tencent",
      "country": "China",
      "product_id": "tencent-zixiao-c100",
      "product": "Zixiao C100",
      "event_type": "cloud_instance_launch",
      "readiness_gate": "cloud_availability",
      "state": "official",
      "evidence_state": "official",
      "summary": "Tencent Cloud records the PTX1 instance powered by Zixiao C100 as launched in December 2022.",
      "boundary": "A named cloud-instance launch does not establish standalone card shipment, current regional capacity, customer allocation, accepted workload results, or upstream supplier provenance.",
      "source_title": "Tencent Cloud PTX1 Zixiao C100 specifications",
      "source_url": "https://cloud.tencent.com/document/product/560/63395",
      "missing_receipts": [
        "current regional capacity",
        "customer allocation",
        "accepted workload performance",
        "standalone shipment volume",
        "supplier provenance"
      ]
    },
    {
      "id": "hygon-dcu-validation-commercial-application-2021",
      "date": "2021",
      "date_precision": "year",
      "company": "Hygon",
      "country": "China",
      "product_id": "hygon-dcu-8000",
      "product": "DCU 8000 series",
      "event_type": "issuer_reported_validation_and_commercial_application",
      "readiness_gate": "product_validation",
      "state": "official",
      "evidence_state": "official",
      "summary": "Hygon filings say its first deep-computing product completed product validation and entered commercial application in 2021.",
      "boundary": "The filing does not map that historical milestone cleanly to every current 8000-series product, name customers, disclose accepted workloads, or establish volume at this gate.",
      "source_title": "Hygon 2024 annual report",
      "source_url": "https://star.sse.com.cn/disclosure/listedinfo/announcement/c/new/2025-03-01/688041_20250301_608W.pdf",
      "missing_receipts": [
        "exact current-generation mapping",
        "named customer qualification",
        "accepted workload results",
        "shipment units",
        "supplier provenance"
      ]
    },
    {
      "id": "hygon-dcu-scaled-sales-2022-06",
      "date": "2022-06",
      "date_precision": "month",
      "company": "Hygon",
      "country": "China",
      "product_id": "hygon-dcu-8000",
      "product": "DCU 8000 series",
      "event_type": "issuer_reported_scaled_sales",
      "readiness_gate": "vendor_reported_volume",
      "state": "official",
      "evidence_state": "official",
      "summary": "A June 2022 Hygon exchange response said its deep-computing product had begun scaled sales.",
      "boundary": "A company filing's scaled-sales statement does not provide audited product units, current 8000-series mapping, recipients, accepted workload results, or present production capacity.",
      "source_title": "Hygon June 2022 exchange response",
      "source_url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202206/001043_20220622_HU33.pdf",
      "missing_receipts": [
        "audited product units",
        "exact current-generation mapping",
        "named recipients",
        "accepted workload results",
        "current production capacity"
      ]
    },
    {
      "id": "sophgo-bm1690-release-2024",
      "date": "2024",
      "date_precision": "year",
      "company": "SOPHGO",
      "country": "China",
      "product_id": "sophgo-bm1690",
      "product": "BM1690",
      "event_type": "vendor_reported_product_release",
      "readiness_gate": "product_launch",
      "state": "official",
      "evidence_state": "official",
      "summary": "SOPHGO's company history records BM1690 as released in 2024.",
      "boundary": "A release-year entry does not establish volume production, shipment units, named customer qualification, current availability, or independent workload measurement.",
      "source_title": "SOPHGO company and product history",
      "source_url": "https://www.sophgo.com/about-us/index.html",
      "missing_receipts": [
        "exact release date",
        "volume production",
        "shipment units",
        "named customer qualification",
        "independent workload measurement"
      ]
    },
    {
      "id": "vastai-va10-family-mass-production-2024-09",
      "date": "2024-09",
      "date_precision": "month",
      "company": "Vastai Technologies",
      "country": "China",
      "product_id": "vastai-va10-family",
      "product": "VA10 family",
      "event_type": "vendor_reported_mass_production",
      "readiness_gate": "vendor_reported_volume",
      "state": "official",
      "evidence_state": "official",
      "summary": "Vastai's company history calls VA1L and VA10L mass-produced in September 2024 and says two chip generations reached mass production and commercialization.",
      "boundary": "The vendor statement does not disclose audited units, named recipients, member-by-member qualification, current availability, production rate, or manufacturing provenance.",
      "source_title": "Vastai company history and readiness claims",
      "source_url": "https://www.vastaitech.com/company/about",
      "missing_receipts": [
        "audited production units",
        "named recipients",
        "member-by-member qualification",
        "current production rate",
        "manufacturing provenance"
      ]
    },
    {
      "id": "black-sesame-a1000-mass-production-deployment-2025",
      "date": "2025",
      "date_precision": "year",
      "company": "Black Sesame Technologies",
      "country": "China",
      "product_id": "black-sesame-huashan-a1000-family",
      "product": "Huashan A1000 family",
      "event_type": "issuer_reported_mass_production_and_deployment",
      "readiness_gate": "vendor_reported_volume",
      "state": "official",
      "evidence_state": "official",
      "summary": "Black Sesame's 2025 annual report says the A1000 family achieved mass production and deployment, remained in vehicle programs, and was the main contributor to company chip sales that year.",
      "boundary": "The annual-report statement does not give audited product units, member-by-member vehicle qualification, customer allocation, production rate, or supplier provenance.",
      "source_title": "Black Sesame International 2025 annual report",
      "source_url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0427/2026042701016.pdf",
      "missing_receipts": [
        "audited product units",
        "member-by-member vehicle qualification",
        "customer allocation",
        "production rate",
        "supplier provenance"
      ]
    },
    {
      "id": "jingjia-micro-jm11-release-small-batch-2025",
      "date": "2025",
      "date_precision": "year",
      "company": "Jingjia Micro",
      "country": "China",
      "product_id": "jingjia-micro-jm11-family",
      "product": "JM11 family",
      "event_type": "issuer_reported_release_and_small_batch",
      "readiness_gate": "small_batch",
      "state": "official",
      "evidence_state": "official",
      "summary": "Jingjia Micro's 2025 annual report lists JM11 as released in 2025 and at a small-batch delivery-and-use stage.",
      "boundary": "Small-batch delivery and use do not establish named recipients, accepted production workloads, audited units, current capacity, or volume production.",
      "source_title": "Jingjia Micro 2025 annual report",
      "source_url": "https://static.cninfo.com.cn/finalpage/2026-04-24/1225166816.PDF",
      "missing_receipts": [
        "named recipients",
        "accepted production workloads",
        "audited units",
        "current capacity",
        "volume-production start"
      ]
    },
    {
      "id": "jingjia-micro-ch37-small-batch-2025",
      "date": "2025",
      "date_precision": "year",
      "company": "Jingjia Micro / Chengheng Micro",
      "country": "China",
      "product_id": "jingjia-micro-ch37-family",
      "product": "CH37 family",
      "event_type": "issuer_reported_small_batch_production",
      "readiness_gate": "small_batch",
      "state": "official",
      "evidence_state": "official",
      "summary": "Jingjia Micro's 2025 annual report places CH37 in small-batch production and says customer introduction and software work were continuing.",
      "boundary": "Small-batch production does not establish named customers, completed qualification, audited units, current capacity, or volume production.",
      "source_title": "Jingjia Micro 2025 annual report",
      "source_url": "https://static.cninfo.com.cn/finalpage/2026-04-24/1225166816.PDF",
      "missing_receipts": [
        "named customers",
        "completed qualification",
        "audited units",
        "current capacity",
        "volume-production start"
      ]
    },
    {
      "id": "innosilicon-fenghua-3-launch-demo-2025-09-22",
      "date": "2025-09-22",
      "date_precision": "day",
      "company": "Innosilicon",
      "country": "China",
      "product_id": "innosilicon-fenghua-3",
      "product": "Fenghua 3",
      "event_type": "vendor_launch_and_demonstration",
      "readiness_gate": "product_launch",
      "state": "official",
      "evidence_state": "official",
      "summary": "Innosilicon says it launched Fenghua 3 on September 22, 2025 and demonstrated large-model, scientific-computing, and graphics workloads at the event.",
      "boundary": "A launch-stage demonstration and announced partner agreements do not establish working units outside the event, current shipments, installed clusters, accepted customer workloads, or production volume.",
      "source_title": "Innosilicon Fenghua 3 launch article",
      "source_url": "https://www.innosilicon.cn/news/37",
      "missing_receipts": [
        "independent test system",
        "named delivered customers",
        "accepted production workloads",
        "shipment units",
        "production capacity"
      ]
    },
    {
      "id": "nio-nx9031-et9-delivery-2025-03-29",
      "date": "2025-03-29",
      "date_precision": "day",
      "company": "NIO",
      "country": "China",
      "product_id": "nio-shenji-nx9031",
      "product": "Shenji NX9031",
      "event_type": "vehicle_delivery_with_named_chip",
      "readiness_gate": "customer_deployment",
      "state": "official",
      "evidence_state": "official",
      "summary": "NIO said ET9 deliveries began on March 29, 2025 and that every ET9 integrated two Shenji NX9031 chips.",
      "boundary": "A vehicle delivery start and configuration statement do not establish delivered vehicle count, chip shipment volume, broader-model deployment, independent qualification, or supplier provenance.",
      "source_title": "NIO Auto Shanghai 2025 release",
      "source_url": "https://www.nio.com/news/20250423001",
      "missing_receipts": [
        "delivered ET9 count",
        "chip shipment volume",
        "broader-model deployment",
        "independent vehicle qualification",
        "supplier provenance"
      ]
    },
    {
      "id": "xpeng-turing-chip-unveiled-2024-08-27",
      "date": "2024-08-27",
      "date_precision": "day",
      "company": "XPeng",
      "country": "China",
      "product_id": "xpeng-turing-ai-chip",
      "product": "XPENG Turing chip",
      "event_type": "product_unveiling",
      "readiness_gate": "product_announcement",
      "state": "official",
      "evidence_state": "official",
      "summary": "XPeng unveiled its Turing AI chip on August 27, 2024.",
      "boundary": "An unveiling does not establish a product-specific vehicle integration, customer qualification, completed production ramp, shipment, current availability, or supplier provenance.",
      "source_title": "XPeng delivery release and Turing unveiling",
      "source_url": "https://www.sec.gov/Archives/edgar/data/1810997/000119312524211475/d839068dex991.htm",
      "missing_receipts": [
        "named vehicle integration",
        "customer qualification",
        "production start",
        "shipment units",
        "supplier provenance"
      ]
    },
    {
      "id": "li-auto-mahe-m100-vehicle-delivery-2026-05",
      "date": "2026-05",
      "date_precision": "month",
      "company": "Li Auto",
      "country": "China",
      "product_id": "li-auto-mahe-m100",
      "product": "MAHE M100",
      "event_type": "vehicle_launch_and_delivery_with_named_chip",
      "readiness_gate": "customer_deployment",
      "state": "official",
      "evidence_state": "official",
      "summary": "Li Auto said it launched and began deliveries of the all-new Li L9 in May 2026, with one MAHE M100 in the Ultra configuration and two in the Livis configuration.",
      "boundary": "A launch configuration and delivery start do not establish delivered-unit count, chip shipment volume, independent vehicle qualification, current production rate, or supplier provenance.",
      "source_title": "Li Auto first-quarter 2026 results",
      "source_url": "https://www.sec.gov/Archives/edgar/data/1791706/000110465926067465/tm2615887d1_ex99-1.htm",
      "missing_receipts": [
        "delivered vehicle count by configuration",
        "chip shipment volume",
        "independent vehicle qualification",
        "current production rate",
        "supplier provenance"
      ]
    },
    {
      "id": "nvidia-blackwell-b200-announcement-2024-03-18",
      "date": "2024-03-18",
      "date_precision": "day",
      "company": "NVIDIA",
      "country": "United States",
      "product_id": "nvidia-blackwell-b200",
      "product": "Blackwell B200",
      "event_type": "platform_announcement",
      "readiness_gate": "product_announcement",
      "state": "official",
      "evidence_state": "official",
      "summary": "NVIDIA announced the Blackwell platform and B200 GPU on March 18, 2024, with partner systems described as forthcoming.",
      "boundary": "A platform announcement does not establish customer availability, shipment volume, installed systems, accepted workloads, yield, or complete supplier allocation.",
      "source_title": "NVIDIA Blackwell platform announcement",
      "source_url": "https://nvidianews.nvidia.com/news/nvidia-blackwell-platform-arrives-to-power-a-new-era-of-computing",
      "missing_receipts": [
        "customer availability at announcement",
        "shipment volume",
        "installed systems",
        "accepted workload results",
        "complete supplier allocation"
      ]
    },
    {
      "id": "nvidia-gb200-nvl72-announcement-2024-03-18",
      "date": "2024-03-18",
      "date_precision": "day",
      "company": "NVIDIA",
      "country": "United States",
      "product_id": "nvidia-gb200-nvl72",
      "product": "GB200 NVL72",
      "event_type": "rack_platform_announcement",
      "readiness_gate": "product_announcement",
      "state": "official",
      "evidence_state": "official",
      "summary": "NVIDIA announced GB200 NVL72 on March 18, 2024 as a rack-scale Blackwell system combining Grace CPUs, Blackwell GPUs, and NVLink.",
      "boundary": "A rack-platform announcement does not establish a deployed rack, shipment volume, customer acceptance, manufacturing origin for every component, or complete supplier allocation.",
      "source_title": "NVIDIA Blackwell platform announcement",
      "source_url": "https://nvidianews.nvidia.com/news/nvidia-blackwell-platform-arrives-to-power-a-new-era-of-computing",
      "missing_receipts": [
        "deployed rack at announcement",
        "shipment volume",
        "customer acceptance",
        "component manufacturing provenance",
        "complete supplier allocation"
      ]
    },
    {
      "id": "nvidia-blackwell-b200-coreweave-ga-2026-05-20",
      "date": "2026-05-20",
      "date_precision": "day",
      "company": "NVIDIA / CoreWeave",
      "country": "United States",
      "product_id": "nvidia-blackwell-b200",
      "product": "Blackwell B200",
      "event_type": "cloud_general_availability",
      "readiness_gate": "cloud_availability",
      "state": "official",
      "evidence_state": "official",
      "summary": "CoreWeave said NVIDIA HGX B200 instances were generally available on its cloud on May 20, 2026.",
      "boundary": "Provider-reported general availability does not establish fleet size, capacity by region, customer allocation, manufacturing provenance, or accepted workload economics.",
      "source_title": "CoreWeave HGX B200 general availability",
      "source_url": "https://www.coreweave.com/blog/coreweave-expands-its-nvidia-blackwell-fleet-with-generally-available-nvidia-hgx-b200-instances",
      "missing_receipts": [
        "fleet size",
        "capacity by region",
        "customer allocation",
        "accepted workload economics",
        "manufacturing provenance"
      ]
    },
    {
      "id": "nvidia-blackwell-b300-technical-disclosure-2025-08-22",
      "date": "2025-08-22",
      "date_precision": "day",
      "company": "NVIDIA",
      "country": "United States",
      "product_id": "nvidia-blackwell-b300",
      "product": "Blackwell Ultra B300",
      "event_type": "dated_technical_platform_disclosure",
      "readiness_gate": "product_announcement",
      "state": "official",
      "evidence_state": "official",
      "summary": "NVIDIA published a dated technical description of Blackwell Ultra and the B300 GPU on August 22, 2025.",
      "boundary": "A technical disclosure does not establish broad customer availability, shipment volume, installed systems, accepted workloads, or complete supplier allocation.",
      "source_title": "Inside NVIDIA Blackwell Ultra",
      "source_url": "https://developer.nvidia.com/blog/inside-nvidia-blackwell-ultra-the-chip-powering-the-ai-factory-era/",
      "missing_receipts": [
        "broad customer availability",
        "shipment volume",
        "installed systems",
        "accepted workload results",
        "complete supplier allocation"
      ]
    },
    {
      "id": "nvidia-blackwell-b300-coreweave-ga-2026-07-30",
      "date": "2026-07-30",
      "date_precision": "day",
      "company": "NVIDIA / CoreWeave",
      "country": "United States",
      "product_id": "nvidia-blackwell-b300",
      "product": "Blackwell Ultra B300",
      "event_type": "cloud_general_availability",
      "readiness_gate": "cloud_availability",
      "state": "official",
      "evidence_state": "official",
      "summary": "CoreWeave said NVIDIA HGX B300 instances were generally available on its cloud on July 30, 2026.",
      "boundary": "Provider-reported general availability does not establish fleet size, capacity by region, customer allocation, manufacturing provenance, or accepted workload economics.",
      "source_title": "CoreWeave HGX B300 general availability",
      "source_url": "https://www.coreweave.com/blog/engineered-for-agentic-ai-nvidia-hgx-b300-on-coreweave-cloud",
      "missing_receipts": [
        "fleet size",
        "capacity by region",
        "customer allocation",
        "accepted workload economics",
        "manufacturing provenance"
      ]
    },
    {
      "id": "nvidia-gb300-nvl72-memory-design-in-2025-03-18",
      "date": "2025-03-18",
      "date_precision": "day",
      "company": "NVIDIA / Micron",
      "country": "United States",
      "product_id": "nvidia-gb300-nvl72",
      "product": "GB300 NVL72",
      "event_type": "named_memory_design_in",
      "readiness_gate": "component_design_in",
      "state": "official",
      "evidence_state": "official",
      "summary": "Micron said its 12-high HBM3E was designed into GB300 NVL72 and its SOCAMM memory was developed with NVIDIA for the GB300 Grace Blackwell Ultra Superchip.",
      "boundary": "A supplier design-in does not establish exclusive supply, installation in every rack, lot allocation, volume, customer acceptance, or the origin of every other component.",
      "source_title": "Micron memory designed for NVIDIA platforms",
      "source_url": "https://investors.micron.com/news-releases/news-release-details/micron-innovates-data-center-edge-nvidia",
      "missing_receipts": [
        "supplier mix and exclusivity",
        "rack-level lot allocation",
        "installed production volume",
        "customer acceptance",
        "other component provenance"
      ]
    },
    {
      "id": "nvidia-gb300-nvl72-coreweave-rack-deployment-2025-07-03",
      "date": "2025-07-03",
      "date_precision": "day",
      "company": "NVIDIA / Dell / CoreWeave",
      "country": "United States",
      "product_id": "nvidia-gb300-nvl72",
      "product": "GB300 NVL72",
      "event_type": "assembled_tested_and_deployed_rack",
      "readiness_gate": "customer_deployment",
      "state": "official",
      "evidence_state": "official",
      "summary": "Dell reported that it assembled and tested a GB300 NVL72 rack and deployed it for CoreWeave in the United States.",
      "boundary": "One vendor-reported rack deployment does not establish fleet-wide allocation, shipment volume, customer acceptance, accepted production workloads, assembly origin, or the origin of every component.",
      "source_title": "Dell delivers a GB300 NVL72 rack to CoreWeave",
      "source_url": "https://www.dell.com/en-us/blog/dell-delivers-market-s-first-nvidia-gb300-nvl72-to-coreweave/",
      "missing_receipts": [
        "fleet-wide allocation",
        "shipment volume",
        "customer acceptance",
        "accepted production workload",
        "assembly and component provenance"
      ]
    },
    {
      "id": "nvidia-vera-rubin-hbm4-production-shipment-2026-03-16",
      "date": "2026-03-16",
      "date_precision": "day",
      "company": "NVIDIA / Micron",
      "country": "United States",
      "product_id": "nvidia-vera-rubin-nvl72",
      "product": "Vera Rubin NVL72",
      "event_type": "named_memory_high_volume_production_and_shipment",
      "readiness_gate": "component_design_in",
      "state": "official",
      "evidence_state": "official",
      "summary": "Micron reported high-volume production and shipment of HBM4 designed for NVIDIA Vera Rubin on March 16, 2026.",
      "boundary": "A memory supplier's production and shipment statement does not establish final rack allocation, exclusive supply, installed customer systems, customer acceptance, or broad Vera Rubin availability.",
      "source_title": "Micron HBM4 designed for NVIDIA Vera Rubin",
      "source_url": "https://investors.micron.com/news-releases/news-release-details/micron-high-volume-production-hbm4-designed-nvidia-vera-rubin",
      "missing_receipts": [
        "final rack allocation",
        "supplier mix and exclusivity",
        "installed customer system",
        "customer acceptance",
        "broad platform availability"
      ]
    },
    {
      "id": "nvidia-vera-rubin-full-production-2026-05-31",
      "date": "2026-05-31",
      "date_precision": "day",
      "company": "NVIDIA",
      "country": "United States",
      "product_id": "nvidia-vera-rubin-nvl72",
      "product": "Vera Rubin NVL72",
      "event_type": "vendor_full_production_statement",
      "readiness_gate": "vendor_reported_volume",
      "state": "official",
      "evidence_state": "official",
      "summary": "NVIDIA said Vera Rubin was ramping into full production, with server and supply-chain partners manufacturing systems at scale.",
      "boundary": "A vendor full-production statement does not establish broad customer availability, audited shipment volume, installed-base scale, customer acceptance, or complete supplier allocation.",
      "source_title": "NVIDIA Vera Rubin production release",
      "source_url": "https://nvidianews.nvidia.com/news/vera-rubin-full-production-agentic-ai-factory",
      "missing_receipts": [
        "broad customer availability",
        "audited shipment volume",
        "installed-base scale",
        "customer acceptance",
        "complete supplier allocation"
      ]
    },
    {
      "id": "nvidia-vera-rubin-coreweave-bringup-2026-06-01",
      "date": "2026-06-01",
      "date_precision": "day",
      "company": "NVIDIA / CoreWeave",
      "country": "United States",
      "product_id": "nvidia-vera-rubin-nvl72",
      "product": "Vera Rubin NVL72",
      "event_type": "cloud_provider_system_bringup",
      "readiness_gate": "system_bringup",
      "state": "official",
      "evidence_state": "official",
      "summary": "CoreWeave reported operational bring-up and validation of a Vera Rubin NVL72 system on June 1, 2026.",
      "boundary": "Provider-reported bring-up is not general availability, fleet scale, customer acceptance, production workload economics, or a complete supplier receipt.",
      "source_title": "CoreWeave Vera Rubin NVL72 bring-up",
      "source_url": "https://www.coreweave.com/news/coreweave-completes-industry-first-bring-up-of-nvidia-vera-rubin-nvl72",
      "missing_receipts": [
        "general-availability date",
        "fleet and regional capacity",
        "customer acceptance",
        "production workload economics",
        "complete supplier allocation"
      ]
    },
    {
      "id": "amd-instinct-mi300x-azure-ga-2024-05-21",
      "date": "2024-05-21",
      "date_precision": "day",
      "company": "AMD / Microsoft Azure",
      "country": "United States",
      "product_id": "amd-instinct-mi300x",
      "product": "Instinct MI300X",
      "event_type": "cloud_general_availability",
      "readiness_gate": "cloud_availability",
      "state": "official",
      "evidence_state": "official",
      "summary": "Microsoft announced general availability of Azure ND MI300X v5 virtual machines using eight AMD Instinct MI300X accelerators on May 21, 2024.",
      "boundary": "Provider-reported general availability does not establish capacity in every region, customer allocation, upstream supplier allocation, shipment volume, or accepted workload economics.",
      "source_title": "Azure ND MI300X v5 general availability",
      "source_url": "https://azure.microsoft.com/en-us/blog/unleashing-innovation-the-new-era-of-compute-powering-azure-ai-solutions/",
      "missing_receipts": [
        "capacity by region",
        "customer allocation",
        "shipment volume",
        "accepted workload economics",
        "complete upstream supplier allocation"
      ]
    },
    {
      "id": "amd-instinct-mi355x-oci-ga-2025-10-14",
      "date": "2025-10-14",
      "date_precision": "day",
      "company": "AMD / Oracle Cloud Infrastructure",
      "country": "United States",
      "product_id": "amd-instinct-mi355x",
      "product": "Instinct MI355X",
      "event_type": "cloud_general_availability",
      "readiness_gate": "cloud_availability",
      "state": "official",
      "evidence_state": "official",
      "summary": "Oracle announced general availability of OCI Compute with AMD Instinct MI355X GPUs on October 14, 2025.",
      "boundary": "Provider-reported general availability does not establish capacity in every region, customer allocation, upstream supplier allocation, shipment volume, or accepted workload economics.",
      "source_title": "Oracle and AMD AI infrastructure announcement",
      "source_url": "https://www.oracle.com/news/announcement/ai-world-oracle-and-amd-expand-partnership-to-help-customers-achieve-next-generation-ai-scale-2025-10-14/",
      "missing_receipts": [
        "capacity by region",
        "customer allocation",
        "shipment volume",
        "accepted workload economics",
        "complete upstream supplier allocation"
      ]
    }
  ]
}