{ "schema_version": "touchdown.ai-chip-industrial-registry.v1", "dataset_version": "0.2.0", "as_of": "2026-07-29", "updated_at": "2026-07-29", "title": "Canonical China semiconductor industrial registry", "scope": "A typed, source-bounded registry of the dated canonical China semiconductor dataset, organized as a 15-stage industrial navigation layer without creating new supplier or customer edges.", "status": "source_backed_incomplete", "reader_guide": { "investor": "Use the 15 stages to see which industrial layers have named records and where public proof is still missing. Counts show coverage, not market share, complete supply-chain coverage, production scale, or matched technical performance.", "executive": "Open a stage, then a record. Check the legal endpoint, exact product or portfolio scope, evidence tier, readiness, and remaining unknowns before treating it as an available supplier or operating capability.", "engineer": "Use the canonical fields and source refs. Stage placement is derived only from the displayed classification fields; relationships remain the 101 canonical edges and retain product, equipment, facility, qualification, commercial, and evidence ceilings." }, "boundaries": { "general": "No supplier, customer, facility, qualification, capacity, yield, or volume edge is inferred from product fit.", "completeness": "The endpoint completely accounts for the listed canonical datasets as dated, but the underlying research is explicitly incomplete. A missing record or edge remains unknown, not absent.", "classification": "The 15-stage view is a deterministic navigation transform over canonical classification fields. It does not add a relationship or prove that every record performs every activity in a stage.", "relationship": "Only records from canonical relationships.yaml are graph edges. No entity-to-product reference, technical fit, stage co-membership, capability, facility presence, or compatible interface is converted into a supplier or customer edge.", "model_scope": "Exact catalogue identifiers, series, families, portfolios, and undisclosed models remain distinct. A named model does not prove a customer, facility, qualification, shipment, installed base, uptime, yield, or volume.", "evidence_tier": "Primary means the source is first-party or official at the canonical source-record level; secondary means independent or third-party. Either can have a narrow claim ceiling. Evidence tier is not readiness.", "compatibility_vs_supplier": "Support, integration, validation, and testing are not supplier relationships. Supplier and supplier-selection records remain separately labeled, with reported selections kept distinct from confirmed states.", "ownership_vs_geography": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are separate fields.", "editorial_display": "Canonical machine keys and source-recorded fields remain unchanged. Derived editorial_display fields use explicit country wording for public presentation and do not change the underlying evidence.", "capacity": "Designed, licensed, installed, qualified, utilized, and actual output are separate capacity states. Null means no public receipt in the canonical record." }, "taxonomy": { "required_stage_count": 15, "stages": [ { "id": "design_company", "order": 1, "label": "Design company", "plain_language": "The organization responsible for defining the chip or system design.", "engineering_question": "Which legal or unresolved design endpoint owns the design, and what is its exact record level?" }, { "id": "architecture_ip", "order": 2, "label": "Architecture and IP", "plain_language": "The processor architecture, reusable circuit blocks, memory interfaces, and accelerator design.", "engineering_question": "Which compute, memory, interface, or reusable-IP block is actually named?" }, { "id": "eda", "order": 3, "label": "EDA and verification", "plain_language": "The software used to design, simulate, verify, and prepare a chip for manufacturing.", "engineering_question": "Which design or verification tool and workflow are source-backed?" }, { "id": "logic_foundry_process", "order": 4, "label": "Foundry and wafer process", "plain_language": "The factories and process families that turn a design into patterned wafers.", "engineering_question": "Which legal operator, facility, wafer size, process family, and production state are named?" }, { "id": "lithography", "order": 5, "label": "Lithography and patterning", "plain_language": "The scanners, tracks, masks, optics, light sources, and resists used to print each layer.", "engineering_question": "Is the receipt for an exact scanner or component, a portfolio, or only a development claim?" }, { "id": "wafer_equipment", "order": 6, "label": "Other wafer equipment", "plain_language": "The deposition, etch, clean, implant, CMP, thermal, inspection, metrology, and test tools around lithography.", "engineering_question": "Which exact model, process step, target device, facility, and qualification state are known?" }, { "id": "critical_materials", "order": 7, "label": "Critical materials", "plain_language": "Wafers, gases, resists, solvents, targets, slurries, pads, precursors, and other consumed inputs.", "engineering_question": "Which chemical or material grade, purity, process, named fab, and batch-supply state are proven?" }, { "id": "memory_manufacturer", "order": 8, "label": "Memory", "plain_language": "DRAM, HBM, NAND, memory interfaces, modules, controllers, and storage media.", "engineering_question": "Which memory device, interface, bandwidth, capacity, producer, and manufacturing path are named?" }, { "id": "package_provider", "order": 9, "label": "Packaging", "plain_language": "The interposer, substrate, thinning, bonding, stacking, molding, and wafer-level package work around the dies.", "engineering_question": "Which package flow, tool, facility, provider, and acceptance state are source-backed?" }, { "id": "assembly_test", "order": 10, "label": "Assembly and test", "plain_language": "The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.", "engineering_question": "Which assembly or test step is named, and does the receipt establish customer acceptance or only capability?" }, { "id": "board_system", "order": 11, "label": "Boards and systems", "plain_language": "Accelerator cards, servers, racks, vehicles, phones, PCs, and other finished systems.", "engineering_question": "Which board or system integrates the part, and is the relationship compatibility, supply, or deployment?" }, { "id": "networking", "order": 12, "label": "Networking and interconnect", "plain_language": "The links, modems, optics, switches, and telecom systems that move data between devices and machines.", "engineering_question": "Which physical or protocol link is named, at what scale, and with what measured performance?" }, { "id": "power_cooling", "order": 13, "label": "Power, cooling, and facilities", "plain_language": "The cleanrooms, utilities, gas delivery, exhaust, construction, power, and cooling needed to operate fabs and compute.", "engineering_question": "Which facility system, contractor, site, acceptance state, and operating boundary are explicit?" }, { "id": "software_workload", "order": 14, "label": "Software and workload", "plain_language": "The firmware, runtime, simulation, models, and workloads that turn hardware into useful work.", "engineering_question": "Which software path and workload are actually demonstrated on the named hardware?" }, { "id": "qualification_volume_deployment", "order": 15, "label": "Qualification, volume, and deployment", "plain_language": "The acceptance, repeatable production, shipment, installation, and real deployment receipts that separate a product from a plan.", "engineering_question": "What proves qualification, volume, delivery, installation, utilization, reliability, and useful workload output?" } ], "relationship_semantic_classes": { "supplies": "supplier", "selected_supplier_for": "supplier_selection", "reported_selected_supplier_for": "reported_supplier_selection", "buys": "buyer_or_procurement", "reported_customer_acceptance_by": "reported_customer_acceptance", "supports": "compatibility_or_support_not_supplier", "integrates": "integration_not_supplier", "validates": "validation_not_supplier", "tests": "test_not_supplier", "owns": "ownership", "joint_venture_with": "joint_venture", "operates": "facility_operation", "services": "service_not_supplier", "contracted_for": "contracted_scope", "develops": "development", "strategic_cooperation_with": "strategic_cooperation", "depends_on": "dependency" }, "classification_fields_by_collection": { "entities": [ "supply_chain_layers" ], "products": [ "product_class", "process_step", "architecture_classification" ], "equipment": [ "process_step", "target_device", "target_material" ], "equipment_components": [ "component_class", "insertion" ], "materials": [ "material_class", "qualified_process" ], "facilities": [ "process_families" ], "capabilities": [ "taxonomy", "process_id" ], "processes": [ "layer" ], "dependencies": [ "category", "dependency_type" ], "relationships": [ "process_step" ], "gaps": [ "layer", "gap_type" ] }, "classification_rule_ids": [ { "id": "canonical-design-role", "stage_id": "design_company", "collections": [ "entities", "processes", "gaps" ] }, { "id": "canonical-architecture-or-ip-role", "stage_id": "architecture_ip", "collections": [ "entities", "products", "capabilities", "processes", "gaps", "relationships" ] }, { "id": "canonical-eda-role", "stage_id": "eda", "collections": [ "entities", "products", "processes", "gaps", "relationships" ] }, { "id": "canonical-foundry-or-fabrication-role", "stage_id": "logic_foundry_process", "collections": [ "entities", "facilities", "capabilities", "processes", "gaps", "relationships" ] }, { "id": "canonical-lithography-role", "stage_id": "lithography", "collections": [ "entities", "products", "equipment", "equipment_components", "materials", "facilities", "capabilities", "processes", "gaps", "relationships", "dependencies" ] }, { "id": "canonical-wafer-equipment-role", "stage_id": "wafer_equipment", "collections": [ "entities", "products", "equipment", "equipment_components", "facilities", "capabilities", "processes", "gaps", "relationships", "dependencies" ] }, { "id": "canonical-material-role", "stage_id": "critical_materials", "collections": [ "entities", "products", "materials", "facilities", "capabilities", "processes", "gaps", "relationships", "dependencies" ] }, { "id": "canonical-memory-role", "stage_id": "memory_manufacturer", "collections": [ "entities", "products", "facilities", "capabilities", "processes", "gaps", "relationships", "dependencies" ] }, { "id": "canonical-packaging-role", "stage_id": "package_provider", "collections": [ "entities", "products", "equipment", "facilities", "capabilities", "processes", "gaps", "relationships", "dependencies" ] }, { "id": "canonical-assembly-test-role", "stage_id": "assembly_test", "collections": [ "entities", "products", "facilities", "capabilities", "processes", "gaps", "relationships", "dependencies" ] }, { "id": "canonical-board-or-system-role", "stage_id": "board_system", "collections": [ "entities", "products", "facilities", "capabilities", "processes", "gaps", "relationships", "dependencies" ] }, { "id": "canonical-network-or-interconnect-role", "stage_id": "networking", "collections": [ "entities", "products", "capabilities", "processes", "gaps", "relationships", "dependencies" ] }, { "id": "canonical-power-cooling-or-facility-role", "stage_id": "power_cooling", "collections": [ "entities", "products", "facilities", "capabilities", "processes", "gaps", "relationships", "dependencies" ] }, { "id": "canonical-software-or-workload-role", "stage_id": "software_workload", "collections": [ "entities", "products", "capabilities", "processes", "gaps", "relationships", "dependencies" ] }, { "id": "canonical-qualification-volume-or-deployment-role", "stage_id": "qualification_volume_deployment", "collections": [ "entities", "products", "facilities", "capabilities", "processes", "gaps", "relationships", "dependencies" ] } ] }, "summary": { "complete_accounting_of_canonical_records": true, "research_complete": false, "stage_count": 15, "counts_by_collection": { "entities": 217, "products": 92, "equipment": 63, "equipment_components": 3, "materials": 61, "facilities": 33, "capabilities": 57, "processes": 147, "dependencies": 66, "relationships": 101, "gaps": 199 }, "mapped_counts_by_collection": { "entities": 186, "products": 92, "equipment": 63, "equipment_components": 3, "materials": 52, "facilities": 32, "capabilities": 57, "processes": 128, "dependencies": 40, "relationships": 75, "gaps": 149 }, "unmapped_counts_by_collection": { "entities": 31, "products": 0, "equipment": 0, "equipment_components": 0, "materials": 9, "facilities": 1, "capabilities": 0, "processes": 19, "dependencies": 26, "relationships": 26, "gaps": 50 }, "total_public_record_count": 1039, "relationship_count": 101, "canonical_source_count": 291, "canonical_claim_count": 388, "entity_record_level_counts": { "analysis_subject": 1, "branch": 1, "brand": 4, "brand_or_unresolved_endpoint": 11, "company": 190, "research_institute": 1, "service_brand_or_unresolved_operator": 2, "unresolved_anonymized_counterparty": 1, "unresolved_endpoint": 5, "unresolved_government_procurement_buyer_alias": 1 }, "relationship_type_counts": { "buys": 1, "contracted_for": 2, "depends_on": 1, "develops": 2, "integrates": 24, "joint_venture_with": 1, "operates": 2, "owns": 16, "reported_customer_acceptance_by": 1, "reported_selected_supplier_for": 2, "selected_supplier_for": 3, "services": 1, "strategic_cooperation_with": 1, "supplies": 34, "supports": 6, "tests": 1, "validates": 3 }, "relationship_semantic_counts": { "buyer_or_procurement": 1, "compatibility_or_support_not_supplier": 6, "contracted_scope": 2, "dependency": 1, "development": 2, "facility_operation": 2, "integration_not_supplier": 24, "joint_venture": 1, "ownership": 16, "reported_customer_acceptance": 1, "reported_supplier_selection": 2, "service_not_supplier": 1, "strategic_cooperation": 1, "supplier": 34, "supplier_selection": 3, "test_not_supplier": 1, "validation_not_supplier": 3 }, "evidence_tier_counts_by_collection": { "entities": { "no_source_attached": 1, "primary_and_secondary": 4, "primary_only": 210, "secondary_only": 2 }, "products": { "primary_only": 91, "secondary_only": 1 }, "equipment": { "primary_only": 63 }, "equipment_components": { "primary_only": 3 }, "materials": { "primary_only": 44, "secondary_only": 17 }, "facilities": { "primary_and_secondary": 1, "primary_only": 32 }, "capabilities": { "no_source_attached": 20, "primary_and_secondary": 1, "primary_only": 30, "secondary_only": 6 }, "processes": { "no_source_attached": 96, "primary_and_secondary": 5, "primary_only": 46 }, "dependencies": { "no_source_attached": 50, "primary_only": 12, "secondary_only": 4 }, "relationships": { "primary_only": 101 }, "gaps": { "no_source_attached": 191, "primary_only": 8 } }, "equipment_model_scope_counts": { "canonical_model_named_scope_not_explicit": 8, "exact_catalogue_identifier": 48, "model_undisclosed": 2, "portfolio_exact_model_unresolved": 4, "series": 1 }, "product_model_scope_counts": { "canonical_exact_model_field_present": 1, "canonical_scope_not_recorded": 91 }, "material_scope_counts": { "named_material_scope_not_explicit": 54, "portfolio_or_family": 7 }, "gap_priority_counts": { "1": 12, "2": 3, "3": 9, "4": 5, "5": 3, "6": 7, "7": 5, "8": 4, "9": 2, "10": 2, "11": 2, "12": 2, "13": 2, "14": 2, "15": 2, "16": 2, "17": 2, "18": 2, "19": 2, "20": 2, "21": 1, "22": 1, "23": 1, "24": 1, "25": 1, "26": 1, "27": 1, "28": 1, "29": 1, "30": 118 }, "source_backed_edge_count": 101, "inferred_edge_count": 0 }, "provenance": { "source_repository": "Touchdown-Labs", "source_directory": "data/china-semiconductor", "source_dataset_commit": null, "source_dataset_base_commit": "360936e25eb5e1c2fbda25f6e3f43f8131a35184", "source_repository_head_at_capture": "5c2cb9a5949717dc0a3927173e0ed40ff5208639", "source_worktree_state": "dirty_in_source_directory", "source_snapshot_boundary": "The source directory contained uncommitted changes when these build inputs were captured. This is not an independent source of truth. The per-file SHA-256 values identify the exact bytes used; the base commit alone does not.", "aggregate_source_sha256": "269eb42f03da5d92895bcd87ccbcb0a44b9b30b161d80b25c996ffc43e254f2a", "file_hash_boundary": "Per-file SHA-256 values identify the exact source bytes used. When the source directory is dirty, the file hashes rather than the commit alone are authoritative for this build.", "source_files": [ { "dataset": "manifest", "path": "manifest.json", "schema_version": "touchdown.china-semiconductor.manifest.v1", "record_count": null, "sha256": "6a8368c066237abeb016cb187c8373d8dfd704c4a0581a22b3233b72224e3f92" }, { "dataset": "entities", "path": "entities.yaml", "schema_version": "touchdown.china-semiconductor.entity.v1", "record_count": 217, "sha256": "41ec1edcd4ee6e7a3632cc77caaabf227956506d8b28b82551c0ee3500315341" }, { "dataset": "products", "path": "products.yaml", "schema_version": "touchdown.china-semiconductor.product.v1", "record_count": 92, "sha256": "71344a574e7f5292ed11fd84d8cfa69801f97c26389e0ab7c9ad8b8a23a497df" }, { "dataset": "equipment", "path": "equipment.yaml", "schema_version": "touchdown.china-semiconductor.equipment.v1", "record_count": 63, "sha256": "1a0c4f2290a8546510dd433b9f03adeffe0dd61045ebd4f5595c5b1b1c9150d7" }, { "dataset": "equipment_components", "path": "equipment-components.yaml", "schema_version": "touchdown.china-semiconductor.equipment_component.v1", "record_count": 3, "sha256": "0c8f5a39d654226627e36fbea7b05e668f91f58b6e99fe3627b93e3e2612a642" }, { "dataset": "materials", "path": "materials.yaml", "schema_version": "touchdown.china-semiconductor.material.v1", "record_count": 61, "sha256": "0957521ee51e8cd35d2602a76f4146e17ad10db3bd78d1490a8f268c14c1c0cb" }, { "dataset": "facilities", "path": "facilities.yaml", "schema_version": "touchdown.china-semiconductor.facility.v1", "record_count": 33, "sha256": "5bbc90d9f85b5950d05c1750c09e5608bb5982f7eb299af546484b025903bab5" }, { "dataset": "capabilities", "path": "capabilities.yaml", "schema_version": "touchdown.china-semiconductor.capability.v1", "record_count": 57, "sha256": "6c6727be2af68de3076449c1851325faa95323bfbcf533971131a64aed3b19e9" }, { "dataset": "processes", "path": "processes.yaml", "schema_version": "touchdown.china-semiconductor.process.v1", "record_count": 147, "sha256": "f0615483d53a1b3529ade90c9f14a22c538454128afe0db5e5430258474c0088" }, { "dataset": "dependencies", "path": "dependencies.yaml", "schema_version": "touchdown.china-semiconductor.dependency.v1", "record_count": 66, "sha256": "97b478140d900eaa797e68149299bae97aadf4c9c9302fb48a1af17dcdf295fa" }, { "dataset": "relationships", "path": "relationships.yaml", "schema_version": "touchdown.china-semiconductor.relationship.v1", "record_count": 101, "sha256": "6f3691dbbbacd21102358376617c527ecad99c77458d9635d2a6bce70f08e210" }, { "dataset": "claims", "path": "claims.yaml", "schema_version": "touchdown.china-semiconductor.claim.v1", "record_count": 388, "sha256": "1bc6ea2de0da7dc2caeaa06df0a63e145e417e45fb54dbd37c4ad18feaa33b96" }, { "dataset": "sources", "path": "evidence.yaml", "schema_version": "touchdown.china-semiconductor.source.v1", "record_count": 291, "sha256": "7a5d17b85989542750809e70a15f4571c0ee48260e3dfa16e6cdd346e6137994" }, { "dataset": "gaps", "path": "gaps.yaml", "schema_version": "touchdown.china-semiconductor.gap.v1", "record_count": 199, "sha256": "2588f18689bf830432aa7ff35681a9ea6918eed37abfb0370cab7c5bf368b31c" } ] }, "availability": { "canonical_capability_dataset_available": true, "canonical_capability_record_count": 57, "standalone_service_dataset_available": false, "service_scope_locations": [ "products", "relationships", "capabilities", "entities" ], "service_boundary": "The canonical source has no standalone services dataset. Service-like records remain in their original product, relationship, capability, or entity record type and are not promoted into a new service claim." }, "stage_groups": [ { "id": "design_company", "order": 1, "label": "Design company", "plain_language": "The organization responsible for defining the chip or system design.", "engineering_question": "Which legal or unresolved design endpoint owns the design, and what is its exact record level?", "record_count": 22, "counts_by_collection": { "entities": 17, "products": 0, "equipment": 0, "equipment_components": 0, "materials": 0, "facilities": 0, "capabilities": 0, "processes": 2, "dependencies": 0, "relationships": 0, "gaps": 3 }, "record_ids_by_collection": { "entities": [ "ent-beijing-starblaze", "ent-dosilicon", "ent-genitech", "ent-giantec-juchen", "ent-gigadevice", "ent-goke-microelectronics", "ent-hangzhou-lion-electronics", "ent-innosilicon-brand", "ent-maxio-technology-hangzhou", "ent-nio-inc", "ent-puya-semiconductor", "ent-shanghai-fudan-microelectronics", "ent-verisilicon", "ent-willsemi", "ent-xpeedic", "ent-xtx-technology", "ent-zhuzhou-crrc-times-semiconductor" ], "products": [], "equipment": [], "equipment_components": [], "materials": [], "facilities": [], "capabilities": [], "processes": [ "proc-chip-architecture", "proc-isa-rtl" ], "dependencies": [], "relationships": [], "gaps": [ "gap-nio-nx9031-manufacturing-chain", "gap-process-chip-architecture", "gap-process-isa-rtl" ] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." }, { "id": "architecture_ip", "order": 2, "label": "Architecture and IP", "plain_language": "The processor architecture, reusable circuit blocks, memory interfaces, and accelerator design.", "engineering_question": "Which compute, memory, interface, or reusable-IP block is actually named?", "record_count": 102, "counts_by_collection": { "entities": 32, "products": 42, "equipment": 0, "equipment_components": 0, "materials": 0, "facilities": 0, "capabilities": 17, "processes": 1, "dependencies": 0, "relationships": 9, "gaps": 1 }, "record_ids_by_collection": { "entities": [ "ent-alibaba-yitian-endpoint-unresolved", "ent-beijing-starblaze", "ent-biren-brand-endpoint-unresolved", "ent-cambricon-brand-endpoint-unresolved", "ent-dd-byd-semiconductor-unresolved", "ent-dd-siengine-hubei", "ent-dd-unisoc-shanghai", "ent-dfsx", "ent-enflame", "ent-espressif", "ent-gigadevice", "ent-goke-microelectronics", "ent-hangzhou-lion-electronics", "ent-houmo", "ent-huawei-brand-endpoint-unresolved", "ent-hygon-brand-endpoint-unresolved", "ent-iluvatar", "ent-innosilicon-brand", "ent-kunlun-brand-endpoint-unresolved", "ent-maxio-technology-hangzhou", "ent-metax", "ent-montage", "ent-moore-threads", "ent-puya-semiconductor", "ent-silan", "ent-silan-jike", "ent-sophgo-beijing", "ent-sophgo-brand-endpoint-unresolved", "ent-verisilicon", "ent-willsemi", "ent-witmem", "ent-zhuzhou-crrc-times-semiconductor" ], "products": [ "prod-biren-104p", "prod-biren-br106-family", "prod-biren-br166-family", "prod-biren-lightsphere-x", "prod-cambricon-mlu370-s4", "prod-cambricon-mlu370-x4", "prod-cambricon-mlu370-x8", "prod-cambricon-siyuan220-family", "prod-ctyun-pak1", "prod-ctyun-pak2", "prod-ctyun-pak3", "prod-ctyun-pch1", "prod-dd-byd-1500v-sic-chip", "prod-dd-se1000", "prod-dd-unisoc-t7250", "prod-dfsx-df1000", "prod-enflame-t20-t21", "prod-h3c-uniserver-r4930-g3", "prod-horizon-journey-3", "prod-horizon-journey-5", "prod-houmo-h30", "prod-houmo-m50", "prod-huawei-ascend-910b2", "prod-huawei-atlas-300i-duo", "prod-huawei-atlas-300i-pro", "prod-hygon-7000-series", "prod-hygon-7285", "prod-iluvatar-bi-v100-alias-unresolved", "prod-iluvatar-tg100", "prod-iluvatar-zk100", "prod-innosilicon-hbm3e-phy", "prod-kunlun-k200", "prod-kunlun-p800", "prod-kunlun-r200", "prod-metax-c500", "prod-metax-n100", "prod-montage-m88mx6852", "prod-moore-threads-s5000", "prod-sophgo-bm1684x", "prod-witmem-wtm2101", "prod-witmem-wtm8", "prod-yitian-710" ], "equipment": [], "equipment_components": [], "materials": [], "facilities": [], "capabilities": [ "cap-ai-biren-products", "cap-ai-cambricon-mlu370-x8", "cap-ai-cambricon-products", "cap-ai-enflame-t20-t21", "cap-ai-houmo-m50", "cap-ai-houmo-products", "cap-ai-iluvatar-products", "cap-ai-iluvatar-zk100", "cap-ai-kunlun-k200", "cap-ai-kunlun-p800", "cap-ai-kunlun-products", "cap-ai-metax-products", "cap-ai-moore-threads-s5000", "cap-ai-sophgo-bm1684x", "cap-ai-witmem-products", "cap-ai-witmem-wtm8", "cap-df1000-h2" ], "processes": [ "proc-pdk-libraries-ip" ], "dependencies": [], "relationships": [ "rel-biren-integrates-lightsphere-x-with-inesa", "rel-biren-integrates-lightsphere-x-with-lightelligence", "rel-biren-integrates-lightsphere-x-with-zte", "rel-dd-ecarx-antora-integrates-siengine-se1000", "rel-dd-poco-c71-integrates-unisoc-t7250", "rel-h3c-supports-cambricon-options-bios574", "rel-houmo-develops-h30-with-youkong", "rel-huishan-center-integrates-mt-s5000", "rel-primarius-nanospice-skhynix" ], "gaps": [ "gap-process-pdk-libraries-ip" ] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." }, { "id": "eda", "order": 3, "label": "EDA and verification", "plain_language": "The software used to design, simulate, verify, and prepare a chip for manufacturing.", "engineering_question": "Which design or verification tool and workflow are source-backed?", "record_count": 20, "counts_by_collection": { "entities": 5, "products": 2, "equipment": 0, "equipment_components": 0, "materials": 0, "facilities": 0, "capabilities": 0, "processes": 6, "dependencies": 0, "relationships": 1, "gaps": 6 }, "record_ids_by_collection": { "entities": [ "ent-51world", "ent-empyrean", "ent-primarius", "ent-semitronix", "ent-xpeedic" ], "products": [ "prod-empyrean-polas", "prod-primarius-nanospice" ], "equipment": [], "equipment_components": [], "materials": [], "facilities": [], "capabilities": [], "processes": [ "proc-analog-design", "proc-design-verification", "proc-dft-yield-analysis", "proc-pdk-libraries-ip", "proc-physical-design-signoff", "proc-signal-power-integrity" ], "dependencies": [], "relationships": [ "rel-empyrean-polas-willsemi" ], "gaps": [ "gap-process-analog-design", "gap-process-design-verification", "gap-process-dft-yield-analysis", "gap-process-pdk-libraries-ip", "gap-process-physical-design-signoff", "gap-process-signal-power-integrity" ] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." }, { "id": "logic_foundry_process", "order": 4, "label": "Foundry and wafer process", "plain_language": "The factories and process families that turn a design into patterned wafers.", "engineering_question": "Which legal operator, facility, wafer size, process family, and production state are named?", "record_count": 62, "counts_by_collection": { "entities": 31, "products": 0, "equipment": 0, "equipment_components": 0, "materials": 0, "facilities": 8, "capabilities": 3, "processes": 7, "dependencies": 0, "relationships": 4, "gaps": 9 }, "record_ids_by_collection": { "entities": [ "ent-cxmt-corp", "ent-globalfoundries", "ent-guangdong-tianyu", "ent-hangzhou-lion-electronics", "ent-huahong-huali", "ent-huahong-semiconductor", "ent-jhicc", "ent-naura", "ent-samsung-china-semiconductor", "ent-sanan-ic-brand-unresolved", "ent-sicarrier", "ent-silan", "ent-silan-jike", "ent-skhynix-dalian", "ent-skhynix-wuxi-operator-unresolved", "ent-smic", "ent-smic-ningbo", "ent-ssmc", "ent-tsmc", "ent-tsmc-china", "ent-tsmc-nanjing", "ent-umc", "ent-united-semi-xiamen", "ent-util-changxin-xinqiao", "ent-util-huahong-wuxi", "ent-util-silan-jihong", "ent-xinye-shidai", "ent-xmc", "ent-yitang", "ent-ymtc", "ent-zhuzhou-crrc-times-semiconductor" ], "products": [], "equipment": [], "equipment_components": [], "materials": [], "facilities": [ "fac-silan-jike-12in", "fac-tsmc-nanjing-fab16", "fac-tsmc-shanghai-fab10", "fac-united-semi-xiamen", "fac-util-cxmt-phase2", "fac-util-huahong-wuxi-project", "fac-util-silan-sic-phase1", "fac-xinye-shidai-8in" ], "capabilities": [ "cap-duv-dram-patterning-trace", "cap-duv-nand-patterning-trace", "cap-hbm-step-qualified-dram-core-die" ], "processes": [ "proc-analog-rf-power-sensor", "proc-dram-fabrication", "proc-logic-foundry", "proc-nand-fabrication", "proc-sic-gan", "proc-silicon-photonics", "proc-specialty-memory" ], "dependencies": [], "relationships": [ "rel-gigadevice-buys-cxmt-dram", "rel-silan-jv-with-xiamen-semiconductor-investment", "rel-skhynix-controls-dalian-operation", "rel-skhynix-controls-wuxi-operation" ], "gaps": [ "gap-nio-nx9031-manufacturing-chain", "gap-process-analog-rf-power-sensor", "gap-process-dram-fabrication", "gap-process-logic-foundry", "gap-process-nand-fabrication", "gap-process-sic-gan", "gap-process-silicon-photonics", "gap-process-specialty-memory", "gap-xmc-separate-facility-identities" ] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." }, { "id": "lithography", "order": 5, "label": "Lithography and patterning", "plain_language": "The scanners, tracks, masks, optics, light sources, and resists used to print each layer.", "engineering_question": "Is the receipt for an exact scanner or component, a portfolio, or only a development claim?", "record_count": 88, "counts_by_collection": { "entities": 19, "products": 3, "equipment": 4, "equipment_components": 1, "materials": 21, "facilities": 4, "capabilities": 13, "processes": 7, "dependencies": 0, "relationships": 5, "gaps": 11 }, "record_ids_by_collection": { "entities": [ "ent-aishengna", "ent-beijing-kehua", "ent-buyer-zycgr22011903-unresolved", "ent-guowang-optics", "ent-hubei-dinglong", "ent-hubei-sinophorus-xingfu-electronic-materials", "ent-jiangyin-jianghua-micro", "ent-kingsemi", "ent-nata", "ent-red-avenue", "ent-rslaser", "ent-shanghai-sinyang-semiconductor-materials", "ent-shenzhen-newway-photomask", "ent-shenzhen-qingyi-photomask", "ent-smee", "ent-tianjin-jiuri-new-materials", "ent-tongcheng-chemical-china", "ent-tongcheng-electronic-materials-shanghai", "ent-yuliangsheng" ], "products": [ "prod-huate-excimer-gases", "prod-smee-ssa600", "prod-smee-ssc800-10" ], "equipment": [ "eq-kingsemi-ks-ft200-300", "eq-kingsemi-unidentified-12in-krf-silan-jike", "eq-smee-ssa600-series", "eq-smee-ssc800-10" ], "equipment_components": [ "comp-uprecision-dual-stage" ], "materials": [ "mat-huate-excimer-mixtures", "mat-kehua-bn301", "mat-kehua-bn303", "mat-kehua-bn308", "mat-kehua-bn310", "mat-kehua-bp212", "mat-kehua-bp218", "mat-kehua-c5300", "mat-kehua-c6111", "mat-kehua-c7300", "mat-kehua-c7500", "mat-kehua-c8300", "mat-kehua-cp4800", "mat-kehua-dk1080", "mat-kehua-e3100", "mat-kehua-e3200", "mat-kehua-ep3100", "mat-kehua-ep3200", "mat-tongcheng-arf-photoresist-family", "mat-tongcheng-g5-ebr", "mat-tongcheng-phs-photoresist-resin" ], "facilities": [ "fac-guowang-exposure-optics-base", "fac-kehua-shunyi-photoresist-base", "fac-rslaser-yizhuang-base", "fac-tongcheng-electronic-photoresist-solvent" ], "capabilities": [ "cap-aishengna-immersion-p0", "cap-duv-dram-patterning-trace", "cap-duv-fab-cxmt", "cap-duv-fab-huahong", "cap-duv-fab-jhicc", "cap-duv-fab-smic", "cap-duv-fab-swaysure", "cap-duv-fab-xmc", "cap-duv-fab-ymtc", "cap-duv-nand-patterning-trace", "cap-smee-ssa600-p0", "cap-smee-ssc800-10-award", "cap-yuliangsheng-smic-p3" ], "processes": [ "proc-computational-lithography", "proc-lithography-dry-arf", "proc-lithography-euv", "proc-lithography-iline-krf", "proc-lithography-immersion-arf", "proc-mask-reticle", "proc-track" ], "dependencies": [], "relationships": [ "rel-kingsemi-supplies-silan-jike-krf-2022", "rel-red-avenue-owns-tongcheng-chemical-china", "rel-smee-zycgr22011903-ssc800-award-2025", "rel-tongcheng-shanghai-owns-beijing-kehua", "rel-uprecision-supplies-smee-dual-stage-2020" ], "gaps": [ "gap-process-computational-lithography", "gap-process-lithography-dry-arf", "gap-process-lithography-euv", "gap-process-lithography-iline-krf", "gap-process-lithography-immersion-arf", "gap-process-mask-reticle", "gap-process-track", "gap-smee-ssc800-award-buyer-and-acceptance", "gap-tongcheng-material-output-yield", "gap-tongcheng-photoresist-named-fab-layer", "gap-tongcheng-shanghai-resin-lines-operator" ] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." }, { "id": "wafer_equipment", "order": 6, "label": "Other wafer equipment", "plain_language": "The deposition, etch, clean, implant, CMP, thermal, inspection, metrology, and test tools around lithography.", "engineering_question": "Which exact model, process step, target device, facility, and qualification state are known?", "record_count": 146, "counts_by_collection": { "entities": 22, "products": 5, "equipment": 50, "equipment_components": 3, "materials": 0, "facilities": 1, "capabilities": 0, "processes": 26, "dependencies": 0, "relationships": 13, "gaps": 26 }, "record_ids_by_collection": { "entities": [ "ent-acm-shanghai", "ent-amec", "ent-gentech", "ent-guowang-optics", "ent-hengyunchang", "ent-hwatsing", "ent-jiangsu-shenzhou", "ent-kfmi", "ent-kingsemi", "ent-leadmicro", "ent-piotech", "ent-rslaser", "ent-semitronix", "ent-shanghai-kingstone-semiconductor", "ent-shenyang-fortune-precision", "ent-skyverse", "ent-suzhou-kema-materials", "ent-thinkon-semiconductor-jinzhou", "ent-uprecision", "ent-uprecision-company-k-unresolved", "ent-util-kyky", "ent-wuhan-jingce-electronic" ], "products": [ "prod-hengyunchang-rf-power", "prod-hwatsing-cmp-portfolio", "prod-piotech-deposition-portfolio", "prod-shenzhou-rps", "prod-util-kyky-vacuum-test" ], "equipment": [ "eq-acm-clean-portfolio", "eq-acm-ultra-c-tahoe", "eq-amec-etch-portfolio", "eq-hwatsing-cmp-portfolio", "eq-naura-3080b", "eq-naura-3080d", "eq-naura-3120g", "eq-naura-a302l", "eq-naura-accura-be", "eq-naura-accura-nz", "eq-naura-ace-e300", "eq-naura-ace-e300ge", "eq-naura-booster-u630", "eq-naura-bpure", "eq-naura-con302x", "eq-naura-cygnus-capella-sio", "eq-naura-cygnus-optima-prime", "eq-naura-demax-tn302t", "eq-naura-eris-e220r", "eq-naura-flouris-201", "eq-naura-hesper-e230a", "eq-naura-hesper-e630r", "eq-naura-hesper-i-e430r", "eq-naura-hesper-pn430r-ii", "eq-naura-hesper-to230r-ii", "eq-naura-implant-portfolio", "eq-naura-nmc-612c", "eq-naura-nmc-612d", "eq-naura-nmc-612e", "eq-naura-nmc-612g", "eq-naura-nmc-612m", "eq-naura-orion-proxima", "eq-naura-polaris-h630-mhm", "eq-naura-py302d", "eq-naura-sc3080a", "eq-naura-scaler-hk430", "eq-naura-sicrius-py302u", "eq-naura-sirius-mc313", "eq-naura-sitara-ta230a-ii", "eq-naura-sn302d-adv", "eq-naura-sn302p", "eq-naura-surefill-w620", "eq-naura-surefill-w630", "eq-naura-theoris-x302h", "eq-naura-theoris-x302p", "eq-naura-we3102", "eq-piotech-pf300t", "eq-piotech-supra-d-achm-iv", "eq-piotech-ts300-altair", "eq-skyverse-ginkgoifm-p300" ], "equipment_components": [ "comp-hengyunchang-rf-power", "comp-shenzhou-rps", "comp-uprecision-dual-stage" ], "materials": [], "facilities": [ "fac-nantong-tongfu-hbs-chiplet-line" ], "capabilities": [], "processes": [ "proc-clean-strip", "proc-cmp", "proc-component-chillers-abatement", "proc-component-esc-ceramics", "proc-component-field-service", "proc-component-gas-panels-piping", "proc-component-lasers-light-sources", "proc-component-mfc", "proc-component-power-control-electronics", "proc-component-projection-optics", "proc-component-quartz-silicon-electrodes", "proc-component-rf-matching", "proc-component-robots-wafer-handling", "proc-component-seals", "proc-component-sensors-software", "proc-component-spares", "proc-component-stages-encoders-bearings", "proc-component-targets-filters", "proc-component-vacuum-pumps", "proc-component-vacuum-valves", "proc-deposition-cvd-ald", "proc-epitaxy", "proc-etch", "proc-implant", "proc-plating", "proc-thermal" ], "dependencies": [], "relationships": [ "rel-hanjing-supplies-huahong-group", "rel-hengyunchang-supplies-amec", "rel-hengyunchang-supplies-leadmicro", "rel-hengyunchang-supplies-naura", "rel-hengyunchang-supplies-piotech", "rel-kfmi-supplies-ssmc-targets-parts", "rel-piotech-supplies-cxmt", "rel-piotech-supplies-huahong", "rel-piotech-supplies-smic", "rel-piotech-supplies-ymtc", "rel-shenzhou-rps-to-amec", "rel-shenzhou-rps-to-piotech", "rel-util-006" ], "gaps": [ "gap-process-clean-strip", "gap-process-cmp", "gap-process-component-chillers-abatement", "gap-process-component-esc-ceramics", "gap-process-component-field-service", "gap-process-component-gas-panels-piping", "gap-process-component-lasers-light-sources", "gap-process-component-mfc", "gap-process-component-power-control-electronics", "gap-process-component-projection-optics", "gap-process-component-quartz-silicon-electrodes", "gap-process-component-rf-matching", "gap-process-component-robots-wafer-handling", "gap-process-component-seals", "gap-process-component-sensors-software", "gap-process-component-spares", "gap-process-component-stages-encoders-bearings", "gap-process-component-targets-filters", "gap-process-component-vacuum-pumps", "gap-process-component-vacuum-valves", "gap-process-deposition-cvd-ald", "gap-process-epitaxy", "gap-process-etch", "gap-process-implant", "gap-process-plating", "gap-process-thermal" ] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." }, { "id": "critical_materials", "order": 7, "label": "Critical materials", "plain_language": "Wafers, gases, resists, solvents, targets, slurries, pads, precursors, and other consumed inputs.", "engineering_question": "Which chemical or material grade, purity, process, named fab, and batch-supply state are proven?", "record_count": 190, "counts_by_collection": { "entities": 37, "products": 6, "equipment": 0, "equipment_components": 0, "materials": 52, "facilities": 5, "capabilities": 3, "processes": 19, "dependencies": 24, "relationships": 15, "gaps": 29 }, "record_ids_by_collection": { "entities": [ "ent-anji", "ent-beijing-kehua", "ent-cssc-handan-peric-special-gases", "ent-gentech", "ent-grikin", "ent-grinm-advanced-materials", "ent-guangzhou-g-gas-energy", "ent-hangzhou-lion-electronics", "ent-hanjing", "ent-huate-gas", "ent-huate-jiangxi", "ent-hubei-dinglong", "ent-hubei-sinophorus-xingfu-electronic-materials", "ent-hubei-xingfa-chemicals", "ent-jiangsu-hhck-advanced-materials", "ent-jiangsu-novoray-lianrui", "ent-jiangyin-jianghua-micro", "ent-jinhong-gas", "ent-kfmi", "ent-kunshan-kinglai-xinlai", "ent-nata", "ent-nsig", "ent-pnc-process-systems", "ent-red-avenue", "ent-shanghai-sinyang-semiconductor-materials", "ent-shenyang-fortune-precision", "ent-shenzhen-newway-photomask", "ent-shenzhen-qingyi-photomask", "ent-suzhou-kema-materials", "ent-thinkon-semiconductor-jinzhou", "ent-tianjin-jiuri-new-materials", "ent-tongcheng-chemical-china", "ent-tongcheng-electronic-materials-changzhou", "ent-tongcheng-electronic-materials-shanghai", "ent-util-shengjian", "ent-xian-eswin-material", "ent-xinsheng-jingke" ], "products": [ "prod-gentech-gas-chemical-box", "prod-hanjing-quartz-sic-components", "prod-huate-excimer-gases", "prod-huate-onsite-hydrogen-system", "prod-nsig-300mm-wafers", "svc-util-silan-exhaust" ], "equipment": [], "equipment_components": [], "materials": [ "mat-anji-cmp-slurry", "mat-anji-damascene-plating", "mat-anji-tsv-plating", "mat-anji-wet-chemicals", "mat-gentech-arsine", "mat-gentech-hcds", "mat-gentech-phosphine", "mat-gentech-tma", "mat-grikin-300mm-copper-target", "mat-grikin-electrolytic-copper", "mat-grikin-evaporation-portfolio", "mat-huate-argon-5n5", "mat-huate-disilane-project", "mat-huate-electronic-gases", "mat-huate-excimer-mixtures", "mat-huate-hbr-300t-project", "mat-huate-nitrogen-6n", "mat-jinhong-high-purity-n2o", "mat-jinhong-teos", "mat-jinhong-ultrapure-ammonia-7n", "mat-kehua-bn301", "mat-kehua-bn303", "mat-kehua-bn308", "mat-kehua-bn310", "mat-kehua-bp212", "mat-kehua-bp218", "mat-kehua-c5300", "mat-kehua-c6111", "mat-kehua-c7300", "mat-kehua-c7500", "mat-kehua-c8300", "mat-kehua-cp4800", "mat-kehua-dk1080", "mat-kehua-e3100", "mat-kehua-e3200", "mat-kehua-ep3100", "mat-kehua-ep3200", "mat-kfmi-aluminum-5n-capability", "mat-kfmi-copper-6n-capability", "mat-kfmi-tantalum-4n-capability", "mat-kfmi-titanium-5n-capability", "mat-nata-nf3-4n6", "mat-nata-sf6-5n", "mat-nata-tega", "mat-nata-tmal", "mat-nata-tmga", "mat-nata-tmin", "mat-nsig-300mm-wafers", "mat-tongcheng-arf-photoresist-family", "mat-tongcheng-changzhou-cmp-pads", "mat-tongcheng-g5-ebr", "mat-tongcheng-phs-photoresist-resin" ], "facilities": [ "fac-kehua-shunyi-photoresist-base", "fac-tongcheng-changzhou-cmp-pad", "fac-tongcheng-chemical-shanghai-resin", "fac-tongcheng-electronic-photoresist-solvent", "fac-xinsheng-jingke-300mm" ], "capabilities": [ "cap-anji-cmp-family-matrix", "cap-anji-functional-wet-chemicals", "cap-nsig-300mm-capacity" ], "processes": [ "proc-compound-substrates", "proc-material-200mm-silicon", "proc-material-300mm-silicon", "proc-material-abf-bt-ceramic", "proc-material-adhesive-molding-thermal", "proc-material-cmp-consumables", "proc-material-compound-substrate", "proc-material-epi-heavy-doped", "proc-material-leadframe-bondwire", "proc-material-mask-blank-quartz", "proc-material-metal-highk-precursors", "proc-material-process-gases", "proc-material-resist-stack", "proc-material-soi", "proc-material-sputter-targets", "proc-material-substrate-interposer-rdl", "proc-material-wet-plating-chemistry", "proc-packaging-substrates", "proc-silicon-wafers" ], "dependencies": [ "dep-anji-imported-raw-materials", "dep-gap-material-abf-film", "dep-gap-material-advanced-300mm-prime", "dep-gap-material-advanced-cmp-slurry", "dep-gap-material-advanced-etch-gases", "dep-gap-material-advanced-mask-blanks", "dep-gap-material-advanced-metal-precursors", "dep-gap-material-arf-photoresist", "dep-gap-material-cmp-pads", "dep-gap-material-developer-solvents", "dep-gap-material-emc-silica-fillers", "dep-gap-material-high-end-epi-wafer", "dep-gap-material-high-k-precursors", "dep-gap-material-high-performance-tim", "dep-gap-material-low-k-precursors", "dep-gap-material-ncf-underfill", "dep-gap-material-pag", "dep-gap-material-rare-laser-gases", "dep-gap-material-resist-resin", "dep-gap-material-soi", "dep-gap-material-topcoat-rinse", "dep-jinhong-n2o-feedstock", "dep-jinhong-nh3-feedstock", "dep-metax-overseas-hbm-category" ], "relationships": [ "rel-gentech-supplies-amec", "rel-gentech-supplies-leadmicro", "rel-gentech-supplies-naura", "rel-gentech-supplies-piotech", "rel-gentech-supplies-sicarrier", "rel-gentech-supplies-xinye-shidai-chemical-system-2025", "rel-gentech-supplies-yitang", "rel-hanjing-supplies-huahong-group", "rel-huate-supplies-smic-ningbo", "rel-kfmi-supplies-ssmc-targets-parts", "rel-kingsemi-supplies-silan-jike-krf-2022", "rel-red-avenue-owns-tongcheng-chemical-china", "rel-red-avenue-owns-tongcheng-electronic-shanghai", "rel-tongcheng-shanghai-owns-beijing-kehua", "rel-tongcheng-shanghai-owns-tongcheng-changzhou" ], "gaps": [ "gap-anji-named-customer-sku", "gap-grikin-named-customer", "gap-huate-project-capacity-qualification", "gap-kfmi-mainland-fab-target", "gap-nata-customer-qualification", "gap-nsig-shanghai-taiyuan-capacity-split", "gap-process-compound-substrates", "gap-process-material-200mm-silicon", "gap-process-material-300mm-silicon", "gap-process-material-abf-bt-ceramic", "gap-process-material-adhesive-molding-thermal", "gap-process-material-cmp-consumables", "gap-process-material-compound-substrate", "gap-process-material-epi-heavy-doped", "gap-process-material-leadframe-bondwire", "gap-process-material-mask-blank-quartz", "gap-process-material-metal-highk-precursors", "gap-process-material-process-gases", "gap-process-material-resist-stack", "gap-process-material-soi", "gap-process-material-sputter-targets", "gap-process-material-substrate-interposer-rdl", "gap-process-material-wet-plating-chemistry", "gap-process-packaging-substrates", "gap-process-silicon-wafers", "gap-tongcheng-cmp-named-fab-layer", "gap-tongcheng-material-output-yield", "gap-tongcheng-photoresist-named-fab-layer", "gap-tongcheng-shanghai-resin-lines-operator" ] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." }, { "id": "memory_manufacturer", "order": 8, "label": "Memory", "plain_language": "DRAM, HBM, NAND, memory interfaces, modules, controllers, and storage media.", "engineering_question": "Which memory device, interface, bandwidth, capacity, producer, and manufacturing path are named?", "record_count": 90, "counts_by_collection": { "entities": 31, "products": 13, "equipment": 0, "equipment_components": 0, "materials": 0, "facilities": 7, "capabilities": 28, "processes": 0, "dependencies": 0, "relationships": 8, "gaps": 3 }, "record_ids_by_collection": { "entities": [ "ent-beijing-starblaze", "ent-cxmt-corp", "ent-cxmt-product-hefei", "ent-dosilicon", "ent-giantec-juchen", "ent-gigadevice", "ent-gloway-brand", "ent-goke-microelectronics", "ent-houmo", "ent-jhicc", "ent-mainland-qualified-hbm-analysis", "ent-maxio-technology-hangzhou", "ent-memblaze", "ent-montage", "ent-netac-technology", "ent-payton-technology-shenzhen", "ent-powev-jiahe-jinwei-brand-unresolved", "ent-puya-semiconductor", "ent-samsung-china-semiconductor", "ent-samsung-electronics", "ent-shanghai-fudan-microelectronics", "ent-skhynix", "ent-skhynix-dalian", "ent-skhynix-wuxi-operator-unresolved", "ent-swaysure", "ent-util-changxin-xinqiao", "ent-witmem", "ent-xmc", "ent-xtx-technology", "ent-ymtc", "ent-ymtc-phase3" ], "products": [ "prod-cxmt-cxmq3a4ma4gr7-cj1-a-new", "prod-cxmt-ddr5", "prod-cxmt-lpddr5-12gb", "prod-cxmt-lpddr5x", "prod-gloway-yi-pro-2020", "prod-houmo-h30", "prod-houmo-m50", "prod-innosilicon-hbm3e-phy", "prod-memblaze-pblaze6-6541", "prod-montage-m88mx6852", "prod-witmem-wtm2101", "prod-witmem-wtm8", "prod-xmc-spi-nor" ], "equipment": [], "equipment_components": [], "materials": [], "facilities": [ "fac-cxmt-product-hefei-test", "fac-samsung-xian-nand", "fac-skhynix-dalian-nand", "fac-skhynix-wuxi-c2", "fac-skhynix-wuxi-c2f", "fac-util-cxmt-phase2", "fac-ymtc-phase3" ], "capabilities": [ "cap-ai-houmo-m50", "cap-ai-witmem-products", "cap-ai-witmem-wtm8", "cap-df1000-h2", "cap-duv-dram-patterning-trace", "cap-duv-nand-patterning-trace", "cap-hbm-step-accelerator-integration", "cap-hbm-step-base-die-phy", "cap-hbm-step-burn-in", "cap-hbm-step-customer-qualification", "cap-hbm-step-final-test", "cap-hbm-step-interposer-rdl-substrate", "cap-hbm-step-known-good-die-selection", "cap-hbm-step-microbump-or-hybrid-bond", "cap-hbm-step-qualified-dram-core-die", "cap-hbm-step-reliability", "cap-hbm-step-stack-assembly-repair", "cap-hbm-step-sustained-production-yield", "cap-hbm-step-sustained-shipment-volume", "cap-hbm-step-thermal-power-closure", "cap-hbm-step-thinning-cmp", "cap-hbm-step-tsv-dielectric-barrier-seed-plating", "cap-hbm-step-tsv-formation", "cap-hbm-step-wafer-probe", "cap-memblaze-nvme-h3", "cap-montage-mxc-h3", "cap-tongfu-hbm-project", "cap-tongfu-hbs-trial-line" ], "processes": [], "dependencies": [], "relationships": [ "rel-cxmt-product-hefei-tests-cxmt-dram", "rel-gigadevice-buys-cxmt-dram", "rel-gloway-integrates-cxmt-dram", "rel-h3c-supports-cxmt-memory-option-bios574", "rel-houmo-develops-h30-with-youkong", "rel-memblaze-integrates-ymtc-nand", "rel-skhynix-controls-dalian-operation", "rel-skhynix-controls-wuxi-operation" ], "gaps": [ "gap-cxmt-public-hbm-product-receipt", "gap-cxmt-unnamed-osat-packaging", "gap-tongfu-hbs-line-hbm-closure" ] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." }, { "id": "package_provider", "order": 9, "label": "Packaging", "plain_language": "The interposer, substrate, thinning, bonding, stacking, molding, and wafer-level package work around the dies.", "engineering_question": "Which package flow, tool, facility, provider, and acceptance state are source-backed?", "record_count": 100, "counts_by_collection": { "entities": 18, "products": 2, "equipment": 50, "equipment_components": 0, "materials": 0, "facilities": 3, "capabilities": 6, "processes": 9, "dependencies": 0, "relationships": 3, "gaps": 9 }, "record_ids_by_collection": { "entities": [ "ent-amkor", "ent-amkor-shanghai-operator-unresolved", "ent-huatian", "ent-hubei-dinglong", "ent-hubei-tongge-microelectronics", "ent-jcet", "ent-jiangsu-hhck-advanced-materials", "ent-nantong-tongfu", "ent-payton-technology-shenzhen", "ent-piotech", "ent-powev-jiahe-jinwei-brand-unresolved", "ent-shanghai-sinyang-semiconductor-materials", "ent-tongfu", "ent-uprecision", "ent-util-huakang", "ent-util-yuerun", "ent-wg-tech-jiangxi-group", "ent-xmc" ], "products": [ "prod-piotech-w2w-hybrid-bonder", "svc-util-yuerun-cleanroom" ], "equipment": [ "eq-naura-3080b", "eq-naura-3080d", "eq-naura-3120g", "eq-naura-a302l", "eq-naura-accura-be", "eq-naura-accura-nz", "eq-naura-ace-e300", "eq-naura-ace-e300ge", "eq-naura-ace-i300v", "eq-naura-ausip-t830", "eq-naura-bmd-p300", "eq-naura-booster-u630", "eq-naura-bpure", "eq-naura-con302x", "eq-naura-cygnus-capella-sio", "eq-naura-cygnus-optima-prime", "eq-naura-demax-tn302t", "eq-naura-eris-e220r", "eq-naura-flouris-201", "eq-naura-hesper-e230a", "eq-naura-hesper-e630r", "eq-naura-hesper-i-e430r", "eq-naura-hesper-pn430r-ii", "eq-naura-hesper-to230r-ii", "eq-naura-hse-d300", "eq-naura-hse-p300", "eq-naura-nmc-612c", "eq-naura-nmc-612d", "eq-naura-nmc-612e", "eq-naura-nmc-612g", "eq-naura-nmc-612m", "eq-naura-orion-proxima", "eq-naura-polaris-h630-mhm", "eq-naura-pse-v300", "eq-naura-py302d", "eq-naura-sc3080a", "eq-naura-scaler-hk430", "eq-naura-sicrius-py302u", "eq-naura-sirius-mc313", "eq-naura-sitara-ta230a-ii", "eq-naura-sn302d-adv", "eq-naura-sn302p", "eq-naura-sumeris-ap302c", "eq-naura-surefill-w620", "eq-naura-surefill-w630", "eq-naura-theoris-x302h", "eq-naura-theoris-x302p", "eq-naura-we3102", "eq-piotech-pleione-300", "eq-piotech-w2w-hybrid-bonding" ], "equipment_components": [], "materials": [], "facilities": [ "fac-amkor-shanghai", "fac-nantong-tongfu-hbs-chiplet-line", "fac-util-yuerun-a1" ], "capabilities": [ "cap-hbm-step-interposer-rdl-substrate", "cap-hbm-step-microbump-or-hybrid-bond", "cap-hbm-step-thinning-cmp", "cap-hbm-step-tsv-dielectric-barrier-seed-plating", "cap-hbm-step-tsv-formation", "cap-piotech-hybrid-bonding" ], "processes": [ "proc-final-test-burnin", "proc-hybrid-bonding", "proc-organic-substrate", "proc-osat-assembly", "proc-rdl-interposer", "proc-reliability-failure-analysis", "proc-stack-assembly-repair", "proc-tsv", "proc-wafer-thinning" ], "dependencies": [], "relationships": [ "rel-amkor-operates-shanghai-current", "rel-amkor-services-smic-historical", "rel-tongfu-owns-nantong-tongfu" ], "gaps": [ "gap-process-final-test-burnin", "gap-process-hybrid-bonding", "gap-process-organic-substrate", "gap-process-osat-assembly", "gap-process-rdl-interposer", "gap-process-reliability-failure-analysis", "gap-process-stack-assembly-repair", "gap-process-tsv", "gap-process-wafer-thinning" ] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." }, { "id": "assembly_test", "order": 10, "label": "Assembly and test", "plain_language": "The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.", "engineering_question": "Which assembly or test step is named, and does the receipt establish customer acceptance or only capability?", "record_count": 51, "counts_by_collection": { "entities": 15, "products": 3, "equipment": 0, "equipment_components": 0, "materials": 0, "facilities": 6, "capabilities": 8, "processes": 4, "dependencies": 0, "relationships": 5, "gaps": 10 }, "record_ids_by_collection": { "entities": [ "ent-amkor", "ent-amkor-shanghai-operator-unresolved", "ent-ase", "ent-ase-wuxi-operator-unresolved", "ent-beijing-starblaze", "ent-cxmt-product-hefei", "ent-huatian", "ent-jcet", "ent-payton-technology-shenzhen", "ent-powev-jiahe-jinwei-brand-unresolved", "ent-semitronix", "ent-tongfu", "ent-util-kyky", "ent-wuhan-jingce-electronic", "ent-zhuzhou-crrc-times-semiconductor" ], "products": [ "prod-empyrean-polas", "prod-gentech-gas-chemical-box", "prod-util-kyky-vacuum-test" ], "equipment": [], "equipment_components": [], "materials": [], "facilities": [ "fac-amkor-shanghai", "fac-ase-wuxi", "fac-cxmt-product-hefei-test", "fac-dd-dongjun-hubei", "fac-dd-lynk-yuyao", "fac-nantong-tongfu-hbs-chiplet-line" ], "capabilities": [ "cap-hbm-step-burn-in", "cap-hbm-step-final-test", "cap-hbm-step-known-good-die-selection", "cap-hbm-step-reliability", "cap-hbm-step-stack-assembly-repair", "cap-hbm-step-wafer-probe", "cap-tongfu-hbm-project", "cap-tongfu-hbs-trial-line" ], "processes": [ "proc-final-test-burnin", "proc-osat-assembly", "proc-reliability-failure-analysis", "proc-wafer-probe" ], "dependencies": [], "relationships": [ "rel-amkor-operates-shanghai-current", "rel-amkor-services-smic-historical", "rel-ase-operates-wuxi-current", "rel-cmb-validates-kunlun-p800-vendor-reported", "rel-empyrean-polas-willsemi" ], "gaps": [ "gap-anji-named-customer-sku", "gap-grikin-named-customer", "gap-huate-project-capacity-qualification", "gap-kfmi-mainland-fab-target", "gap-nata-customer-qualification", "gap-process-final-test-burnin", "gap-process-osat-assembly", "gap-process-reliability-failure-analysis", "gap-process-wafer-probe", "gap-util-006" ] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." }, { "id": "board_system", "order": 11, "label": "Boards and systems", "plain_language": "Accelerator cards, servers, racks, vehicles, phones, PCs, and other finished systems.", "engineering_question": "Which board or system integrates the part, and is the relationship compatibility, supply, or deployment?", "record_count": 115, "counts_by_collection": { "entities": 40, "products": 43, "equipment": 0, "equipment_components": 0, "materials": 0, "facilities": 4, "capabilities": 0, "processes": 5, "dependencies": 0, "relationships": 18, "gaps": 5 }, "record_ids_by_collection": { "entities": [ "ent-baidu-ai-cloud-brand-unresolved", "ent-beijing-digital-china-yunke", "ent-byd-contracting-endpoint-unresolved", "ent-china-great-wall", "ent-dd-dongjun-hubei", "ent-dd-dongjun-site-owner-unresolved", "ent-dd-ecarx-holdings", "ent-dd-faw-endpoint-unresolved", "ent-dd-lynk-sales", "ent-dd-lynk-yuyao-owner-unresolved", "ent-dd-poco-global-operator-unresolved", "ent-dd-siengine-hubei", "ent-dd-unisoc-shanghai", "ent-dd-zte", "ent-dfsx", "ent-digital-china-group", "ent-genitech", "ent-h3c-technologies", "ent-horizon-brand-endpoint-unresolved", "ent-huawei-brand-endpoint-unresolved", "ent-hubei-tongge-microelectronics", "ent-inesa-group", "ent-li-auto-inc", "ent-lightelligence-shanghai", "ent-netac-technology", "ent-nio-inc", "ent-pnc-process-systems", "ent-powev-jiahe-jinwei-brand-unresolved", "ent-saic-motor", "ent-samsung-electronics", "ent-shenyang-fortune-precision", "ent-shenzhou-kuntai-xiamen", "ent-tianyi-cloud-tech", "ent-transsion-brand", "ent-util-11th-tech", "ent-util-kyky", "ent-util-shengjian", "ent-wg-tech-jiangxi-group", "ent-xiaomi-brand", "ent-youkong-zhixing-endpoint-unresolved" ], "products": [ "prod-baidu-baige-deepseek-p800", "prod-biren-lightsphere-x", "prod-cambricon-mlu370-s4", "prod-cambricon-mlu370-x8", "prod-cxmt-cxmq3a4ma4gr7-cj1-a-new", "prod-dd-antora-1000-pro", "prod-dd-byd-1500v-sic-chip", "prod-dd-byd-1500v-sic-module", "prod-dd-byd-c11", "prod-dd-byd-ebus-3", "prod-dd-byd-super-e", "prod-dd-hongqi-tiangong-05", "prod-dd-lynk08-2023", "prod-dd-lynk08-2025-refresh", "prod-dd-poco-c71", "prod-dd-se1000", "prod-dd-unisoc-t7250", "prod-dfsx-hs512", "prod-dfsx-qy100", "prod-dfsx-ty64", "prod-enflame-t20-t21", "prod-h3c-h65-bios-574", "prod-h3c-uniserver-r4930-g3", "prod-horizon-journey-3", "prod-horizon-journey-5", "prod-houmo-h30", "prod-houmo-m50", "prod-huawei-atlas-300i-duo", "prod-huawei-atlas-300i-pro", "prod-hygon-7000-series", "prod-hygon-7285", "prod-iluvatar-bi-v100-alias-unresolved", "prod-kunlun-k200", "prod-kunlun-r200", "prod-li-auto-2021-li-one", "prod-moore-threads-s5000", "prod-nio-et9-2025", "prod-nio-shenji-nx9031", "prod-shenzhou-kuntai-ai-server-framework", "prod-sophgo-bm1684x", "prod-yitian-710", "prod-yunke-telecom-server-framework-combined", "svc-util-yuerun-cleanroom" ], "equipment": [], "equipment_components": [], "materials": [], "facilities": [ "fac-baidu-p800-10k-class-unknown-site", "fac-baidu-p800-30k-class-unknown-site", "fac-dd-dongjun-hubei", "fac-dd-lynk-yuyao" ], "capabilities": [], "processes": [ "proc-boards-optics-network", "proc-controller-module", "proc-power-cooling", "proc-storage-tier", "proc-system-architecture" ], "dependencies": [], "relationships": [ "rel-baidu-baige-appliance-integrates-p800", "rel-biren-integrates-lightsphere-x-with-inesa", "rel-biren-integrates-lightsphere-x-with-lightelligence", "rel-biren-integrates-lightsphere-x-with-zte", "rel-ctyun-integrates-ascend910b2-pak3-huabei2", "rel-ctyun-integrates-ascend910b2-pak3-shanghai36", "rel-ctyun-integrates-atlas300iduo-pak2", "rel-ctyun-integrates-atlas300ipro-pak1", "rel-ctyun-integrates-hygon7285-pch1", "rel-ctyun-integrates-mlu370s4-pch1", "rel-dd-byd-integrates-byd-semiconductor-sic", "rel-dd-faw-tiangong05-integrates-ecarx-antora", "rel-dd-poco-c71-integrates-unisoc-t7250", "rel-h3c-r4930g3-integrates-hygon7000", "rel-houmo-develops-h30-with-youkong", "rel-iluvatar-supports-h3c-bi-v100-configurations", "rel-saic-develops-journey5-solution", "rel-util-002" ], "gaps": [ "gap-process-boards-optics-network", "gap-process-controller-module", "gap-process-power-cooling", "gap-process-storage-tier", "gap-process-system-architecture" ] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." }, { "id": "networking", "order": 12, "label": "Networking and interconnect", "plain_language": "The links, modems, optics, switches, and telecom systems that move data between devices and machines.", "engineering_question": "Which physical or protocol link is named, at what scale, and with what measured performance?", "record_count": 15, "counts_by_collection": { "entities": 9, "products": 2, "equipment": 0, "equipment_components": 0, "materials": 0, "facilities": 0, "capabilities": 0, "processes": 0, "dependencies": 0, "relationships": 4, "gaps": 0 }, "record_ids_by_collection": { "entities": [ "ent-china-mobile-communications", "ent-china-telecom-corp", "ent-china-telecom-group", "ent-dd-cu-guangdong-branch", "ent-dd-cu-operating", "ent-dd-unisoc-shanghai", "ent-dd-zte", "ent-espressif", "ent-lightelligence-shanghai" ], "products": [ "prod-verisilicon-fdsoi-wireless-ip", "prod-yunke-telecom-server-framework-combined" ], "equipment": [], "equipment_components": [], "materials": [], "facilities": [], "capabilities": [], "processes": [], "dependencies": [], "relationships": [ "rel-beijing-yunke-framework-china-telecom-corp-2025", "rel-beijing-yunke-framework-china-telecom-group-2025", "rel-biren-integrates-lightsphere-x-with-lightelligence", "rel-shenzhou-kuntai-framework-china-mobile-ai-servers-2024" ], "gaps": [] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." }, { "id": "power_cooling", "order": 13, "label": "Power, cooling, and facilities", "plain_language": "The cleanrooms, utilities, gas delivery, exhaust, construction, power, and cooling needed to operate fabs and compute.", "engineering_question": "Which facility system, contractor, site, acceptance state, and operating boundary are explicit?", "record_count": 67, "counts_by_collection": { "entities": 10, "products": 6, "equipment": 0, "equipment_components": 0, "materials": 0, "facilities": 0, "capabilities": 1, "processes": 19, "dependencies": 0, "relationships": 7, "gaps": 24 }, "record_ids_by_collection": { "entities": [ "ent-gentech", "ent-kunshan-kinglai-xinlai", "ent-pnc-process-systems", "ent-shenyang-fortune-precision", "ent-util-11th-tech", "ent-util-huakang", "ent-util-ihep", "ent-util-lk-suzhou", "ent-util-shanghai-fourth", "ent-util-shengjian" ], "products": [ "prod-huate-onsite-hydrogen-system", "svc-util-cxmt-cleanroom", "svc-util-huahong-civil", "svc-util-huahong-epc", "svc-util-silan-exhaust", "svc-util-yuerun-cleanroom" ], "equipment": [], "equipment_components": [], "materials": [], "facilities": [], "capabilities": [ "cap-hbm-step-thermal-power-closure" ], "processes": [ "proc-cleanroom-epc", "proc-facility-abatement", "proc-facility-automation", "proc-facility-backup-power", "proc-facility-bulk-gases", "proc-facility-chemical-delivery", "proc-facility-chillers-heat-rejection", "proc-facility-contamination-control", "proc-facility-fire-life-safety", "proc-facility-power-quality", "proc-facility-solvent-recovery", "proc-facility-specialty-gas-delivery", "proc-facility-ultrapure-water", "proc-facility-vacuum", "proc-facility-vibration-control", "proc-facility-wastewater", "proc-gases-chemicals-delivery", "proc-power-water", "proc-vacuum-abatement-wastewater" ], "dependencies": [], "relationships": [ "rel-gentech-supplies-xinye-shidai-chemical-system-2025", "rel-huate-tianyu-onsite-hydrogen-2025", "rel-tongcheng-shanghai-owns-tongcheng-changzhou", "rel-util-001", "rel-util-002", "rel-util-004", "rel-util-005" ], "gaps": [ "gap-process-cleanroom-epc", "gap-process-facility-abatement", "gap-process-facility-automation", "gap-process-facility-backup-power", "gap-process-facility-bulk-gases", "gap-process-facility-chemical-delivery", "gap-process-facility-chillers-heat-rejection", "gap-process-facility-contamination-control", "gap-process-facility-fire-life-safety", "gap-process-facility-power-quality", "gap-process-facility-solvent-recovery", "gap-process-facility-specialty-gas-delivery", "gap-process-facility-ultrapure-water", "gap-process-facility-vacuum", "gap-process-facility-vibration-control", "gap-process-facility-wastewater", "gap-process-gases-chemicals-delivery", "gap-process-power-water", "gap-process-vacuum-abatement-wastewater", "gap-util-001", "gap-util-002", "gap-util-003", "gap-util-004", "gap-xmc-separate-facility-identities" ] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." }, { "id": "software_workload", "order": 14, "label": "Software and workload", "plain_language": "The firmware, runtime, simulation, models, and workloads that turn hardware into useful work.", "engineering_question": "Which software path and workload are actually demonstrated on the named hardware?", "record_count": 35, "counts_by_collection": { "entities": 4, "products": 1, "equipment": 0, "equipment_components": 0, "materials": 0, "facilities": 0, "capabilities": 5, "processes": 3, "dependencies": 15, "relationships": 4, "gaps": 3 }, "record_ids_by_collection": { "entities": [ "ent-51world", "ent-dd-ecarx-holdings", "ent-dfsx", "ent-h3c-technologies" ], "products": [ "prod-h3c-h65-bios-574" ], "equipment": [], "equipment_components": [], "materials": [], "facilities": [], "capabilities": [ "cap-hbm-step-base-die-phy", "cap-hbm-step-customer-qualification", "cap-hbm-step-sustained-production-yield", "cap-hbm-step-sustained-shipment-volume", "cap-verisilicon-gf-h3-not-hbm" ], "processes": [ "proc-accepted-result-economics", "proc-compiler-runtime-firmware", "proc-os-collectives-serving" ], "dependencies": [ "dep-dd-poco-c71-google-android-services", "dep-dd-unisoc-t7250-arm-ip", "dep-gap-eda-arm-isa-ip", "dep-gap-eda-digital-full-flow", "dep-gap-eda-foreign-service-updates", "dep-gap-eda-formal-emulation", "dep-gap-eda-hbm-phy-verification", "dep-gap-eda-mask-data-prep", "dep-gap-eda-opc-smo", "dep-gap-eda-pcie-cxl-serdes", "dep-gap-eda-pdk-library-qualification", "dep-gap-eda-timing-power-signoff", "dep-metax-overseas-eda-category", "dep-metax-overseas-interface-ip-category", "dep-verisilicon-globalfoundries-22fdx" ], "relationships": [ "rel-51world-supports-mt-s5000-simone4", "rel-h3c-supports-biren104p-bios574", "rel-h3c-supports-cambricon-options-bios574", "rel-verisilicon-depends-globalfoundries-22fdx" ], "gaps": [ "gap-process-accepted-result-economics", "gap-process-compiler-runtime-firmware", "gap-process-os-collectives-serving" ] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." }, { "id": "qualification_volume_deployment", "order": 15, "label": "Qualification, volume, and deployment", "plain_language": "The acceptance, repeatable production, shipment, installation, and real deployment receipts that separate a product from a plan.", "engineering_question": "What proves qualification, volume, delivery, installation, utilization, reliability, and useful workload output?", "record_count": 83, "counts_by_collection": { "entities": 9, "products": 7, "equipment": 0, "equipment_components": 0, "materials": 0, "facilities": 3, "capabilities": 0, "processes": 24, "dependencies": 1, "relationships": 9, "gaps": 30 }, "record_ids_by_collection": { "entities": [ "ent-alibaba-cloud-ecs-brand-unresolved", "ent-baidu-ai-cloud-brand-unresolved", "ent-beijing-starblaze", "ent-china-merchants-bank", "ent-ctyun-resource-pool-owner-unresolved", "ent-dd-cu-digital", "ent-digital-china-group", "ent-shanghai-kingstone-semiconductor", "ent-tianyi-cloud-tech" ], "products": [ "prod-alibaba-ecs-c8y", "prod-alibaba-ecs-g8y", "prod-alibaba-ecs-r8y", "prod-ctyun-pak1", "prod-ctyun-pak2", "prod-ctyun-pak3", "prod-ctyun-pch1" ], "equipment": [], "equipment_components": [], "materials": [], "facilities": [ "fac-ctyun-guangzhou6-resource-pool", "fac-ctyun-huabei2-resource-pool", "fac-ctyun-shanghai36-resource-pool" ], "capabilities": [], "processes": [ "proc-channel-authorized-distribution", "proc-channel-equipment-material-agents", "proc-channel-inventory-spot-resale", "proc-channel-module-distribution-assembly", "proc-end-user-workload", "proc-market-aerospace-defense", "proc-market-ai-inference", "proc-market-ai-training", "proc-market-automotive", "proc-market-cloud-services", "proc-market-consumer-electronics", "proc-market-energy", "proc-market-grid", "proc-market-imaging-power", "proc-market-industrial-automation", "proc-market-medical", "proc-market-networking", "proc-market-pcs", "proc-market-robotics", "proc-market-scientific-computing", "proc-market-smartphones", "proc-market-storage", "proc-market-telecom", "proc-national-commercial-demand" ], "dependencies": [ "dep-guowang-hermle-five-axis-machining" ], "relationships": [ "rel-ctyun-integrates-ascend910b2-pak3-huabei2", "rel-ctyun-integrates-ascend910b2-pak3-shanghai36", "rel-ctyun-integrates-atlas300iduo-pak2", "rel-ctyun-integrates-atlas300ipro-pak1", "rel-ctyun-integrates-hygon7285-pch1", "rel-ctyun-integrates-mlu370s4-pch1", "rel-hermle-guowang-five-axis-award-2022", "rel-huishan-center-integrates-mt-s5000", "rel-util-005" ], "gaps": [ "gap-anji-named-customer-sku", "gap-grikin-named-customer", "gap-huate-project-capacity-qualification", "gap-kfmi-mainland-fab-target", "gap-nata-customer-qualification", "gap-process-channel-authorized-distribution", "gap-process-channel-equipment-material-agents", "gap-process-channel-inventory-spot-resale", "gap-process-channel-module-distribution-assembly", "gap-process-end-user-workload", "gap-process-market-aerospace-defense", "gap-process-market-ai-inference", "gap-process-market-ai-training", "gap-process-market-automotive", "gap-process-market-cloud-services", "gap-process-market-consumer-electronics", "gap-process-market-energy", "gap-process-market-grid", "gap-process-market-imaging-power", "gap-process-market-industrial-automation", "gap-process-market-medical", "gap-process-market-networking", "gap-process-market-pcs", "gap-process-market-robotics", "gap-process-market-scientific-computing", "gap-process-market-smartphones", "gap-process-market-storage", "gap-process-market-telecom", "gap-process-national-commercial-demand", "gap-util-006" ] }, "boundary": "Stage membership is a classification view, not an industrial or commercial relationship. Follow the record and its sources before making a capability or supply-chain claim." } ], "explicit_unmapped": { "record_ids_by_collection": { "entities": [ "ent-allwinner", "ent-amlogic-shanghai", "ent-baidu-cluster-owner-unresolved", "ent-biwin-storage", "ent-cansemitech", "ent-changchuan", "ent-crmicro", "ent-dapustor", "ent-darbond", "ent-fastprint", "ent-goodix", "ent-hermle", "ent-huafeng-test-control", "ent-huahong-group", "ent-huawei", "ent-innoscience-suzhou", "ent-longsys", "ent-nexchip-hefei", "ent-omnivision-technologies-us", "ent-phichem", "ent-rockchip", "ent-shanghai-hanbell", "ent-shennan-circuits", "ent-sicc", "ent-sjsemi-issuer", "ent-sjsemi-jiangyin", "ent-tankeblue", "ent-util-taiji", "ent-wazam", "ent-wuxi-huishan-ai-center-owner-unresolved", "ent-xiamen-semiconductor-investment" ], "products": [], "equipment": [], "equipment_components": [], "materials": [ "mat-huate-bcl3-300t-project", "mat-huate-c4f6-300t-project", "mat-jinhong-ch3f", "mat-jinhong-fluorocarbon-portfolio", "mat-nata-ash3-6n-6n5", "mat-nata-ash3-ags-5n5", "mat-nata-bf3-ags-3n", "mat-nata-ph3-6n-6n5", "mat-nata-ph3-ags-5n7" ], "facilities": [ "fac-wuxi-huishan-ai-compute-center-phase1" ], "capabilities": [], "processes": [ "proc-chip-ai-accelerator", "proc-chip-automotive-soc", "proc-chip-cpu", "proc-chip-display-driver", "proc-chip-dsp", "proc-chip-fpga", "proc-chip-gpu", "proc-chip-industrial-security", "proc-chip-isp-vision", "proc-chip-mcu", "proc-chip-modem-connectivity", "proc-chip-network-switch-optical-dsp", "proc-chip-pmic-analog", "proc-chip-power-device", "proc-chip-rf", "proc-chip-sensors", "proc-chip-storage-controller-interface", "proc-inspection-defect-review", "proc-metrology" ], "dependencies": [ "dep-dd-lynk08-nvidia-thor", "dep-dd-lynk08-qualcomm-8295", "dep-gap-equipment-advanced-arf-track", "dep-gap-equipment-advanced-optical-inspection", "dep-gap-equipment-advanced-probe-ate", "dep-gap-equipment-arf-excimer-light-source", "dep-gap-equipment-cd-overlay-metrology", "dep-gap-equipment-dry-vacuum-pumps", "dep-gap-equipment-ebeam-inspection-review", "dep-gap-equipment-electrostatic-chucks", "dep-gap-equipment-euv-scanner", "dep-gap-equipment-field-service-spares-controls", "dep-gap-equipment-high-energy-implant", "dep-gap-equipment-high-purity-valves", "dep-gap-equipment-immersion-arf-scanner", "dep-gap-equipment-mask-inspection", "dep-gap-equipment-mask-repair", "dep-gap-equipment-mass-flow-controller", "dep-gap-equipment-projection-optics", "dep-gap-equipment-rf-power-match", "dep-gap-equipment-stage-encoder-interferometer", "dep-gap-equipment-wafer-robots", "dep-samsung-xian-controlled-tool-exports", "dep-skhynix-dalian-controlled-tool-exports", "dep-skhynix-wuxi-controlled-tool-exports", "dep-tsmc-nanjing-controlled-tool-exports" ], "relationships": [ "rel-alibaba-ecs-c8y-integrates-yitian710", "rel-alibaba-ecs-g8y-integrates-yitian710", "rel-alibaba-ecs-r8y-integrates-yitian710", "rel-cxmt-owns-product-hefei", "rel-dd-lynk08-integrates-ecarx-antora", "rel-gentech-owns-hanjing", "rel-great-wall-n90pro-integrates-houmo-m50", "rel-huate-owns-jiangxi", "rel-hwatsing-supplies-cxmt", "rel-hwatsing-supplies-huahong", "rel-hwatsing-supplies-smic", "rel-hwatsing-supplies-ymtc", "rel-jcet-sells-unspecified-goods-cxmt-fy2025", "rel-jinhong-supplies-xinye-shidai-bulk-gas-project-2025", "rel-li-auto-2021-li-one-integrates-journey3", "rel-nsig-owns-xinsheng-jingke", "rel-samsung-owns-xian-operation", "rel-skhynix-acquires-dalian-nand", "rel-transsion-brand-validates-cxmt-lpddr5", "rel-tsmc-owns-nanjing", "rel-tsmc-owns-shanghai", "rel-umc-owns-united-semi-xiamen", "rel-uprecision-company-k-2024-acceptance", "rel-util-003", "rel-xiaomi-brand-validates-cxmt-lpddr5", "rel-xmc-espressif-strategic-cooperation" ], "gaps": [ "gap-ai-accelerator-manufacturing-and-customer-receipts-20260729", "gap-baidu-p800-cluster-primary-test-asset", "gap-chinatelecom-framework-execution-bom", "gap-cmcc-framework-execution-bom", "gap-ctyun-hardware-procurement-acceptance", "gap-foreign-amkor-shanghai-current", "gap-foreign-ase-wuxi-operator", "gap-foreign-skhynix-wuxi-current", "gap-h3c-supported-options-commercial-receipt", "gap-jcet-cxmt-unspecified-goods", "gap-process-chip-ai-accelerator", "gap-process-chip-automotive-soc", "gap-process-chip-cpu", "gap-process-chip-display-driver", "gap-process-chip-dsp", "gap-process-chip-fpga", "gap-process-chip-gpu", "gap-process-chip-industrial-security", "gap-process-chip-isp-vision", "gap-process-chip-mcu", "gap-process-chip-modem-connectivity", "gap-process-chip-network-switch-optical-dsp", "gap-process-chip-pmic-analog", "gap-process-chip-power-device", "gap-process-chip-rf", "gap-process-chip-sensors", "gap-process-chip-storage-controller-interface", "gap-process-inspection-defect-review", "gap-process-metrology", "gap-receipt-cxmt-duv", "gap-receipt-cxmt-fab-bom", "gap-receipt-cxmt-phone-program", "gap-receipt-df1000-bond-tool", "gap-receipt-df1000-customer", "gap-receipt-df1000-foundry", "gap-receipt-df1000-memory", "gap-receipt-df1000-osat", "gap-receipt-df1000-server-oem", "gap-receipt-gentech-part-tool-fab", "gap-receipt-hbm-accelerator", "gap-receipt-hengyunchang-fab-validation", "gap-receipt-huahong-duv", "gap-receipt-huate-gas-fab", "gap-receipt-hwatsing-model-facility", "gap-receipt-nsig-customer-grade", "gap-receipt-piotech-model-facility", "gap-receipt-smic-duv", "gap-receipt-tongfu-hbm-customer", "gap-receipt-ymtc-scanner", "gap-util-005" ] }, "boundary": "Unmapped means no public 15-stage rule matched the record's own canonical classification fields. The record remains exposed and is not forced into a stage by its name, a linked entity, technical fit, or analyst inference." }, "registry": { "entities": [ { "aliases": [ "51WORLD" ], "brands": [], "canonical_legal_name_cn": "北京五一视界数字孪生科技股份有限公司", "canonical_legal_name_en": "Beijing 51WORLD Digital Twin Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-51world", "entity_type": "company", "exchange": "HKEX", "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-51world", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-51world-about", "src-ncsti-s5000-simone-20260226" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "simulation_software" ], "ticker": "06651", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "510b716cfba60884a701ba883c221a68ccbb8a70a5bbb6fb8e0832a309c39f32", "stage_ids": [ "eda", "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "simulation_software" } ] }, { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "simulation_software" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "simulation_software" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-51world-about", "title": "关于51WORLD", "publisher": "北京五一视界数字孪生科技股份有限公司", "url": "https://www.51world.com.cn/about", "source_type": "official_company_identity_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Identity receipt only." ] }, { "source_id": "src-ncsti-s5000-simone-20260226", "title": "国产GPU与自动驾驶仿真平台完成系统适配", "publisher": "中关村国家自主创新示范区展示中心", "url": "https://www.ncsti.gov.cn/kjdt/scyq/zgckxc/zgcdt/202602/t20260226_239035.html", "source_type": "government_innovation_record", "primary_status": "primary", "publication_date": "2026-02-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Compatibility/validation receipt only; purchase, quantity, installation site and production use are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-51world", "record_level": "company", "canonical_legal_name_en": "Beijing 51WORLD Digital Twin Technology Co., Ltd.", "canonical_legal_name_cn": "北京五一视界数字孪生科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Beijing 51WORLD Digital Twin Technology Co., Ltd.", "canonical_legal_name_cn": "北京五一视界数字孪生科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "ACM Research Shanghai", "盛美上海" ], "brands": [], "canonical_legal_name_cn": "盛美半导体设备（上海）股份有限公司", "canonical_legal_name_en": "ACM Research (Shanghai), Inc.", "completion_state": "source_backed", "countries_of_operation": [ "United States", "China" ], "country_of_ownership": "United States", "entity_id": "ent-acm-shanghai", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-acm-shanghai", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public_foreign_controlled", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-acm-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "clean_equipment", "plating_equipment", "thermal_equipment" ], "ticker": "688082", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "6a4e7b4eae2f15565e1d5c7b982341754196ba8f003bf9cd997b5a5236052f6a", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "clean_equipment" }, { "field": "supply_chain_layers", "value": "plating_equipment" }, { "field": "supply_chain_layers", "value": "thermal_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "clean_equipment" }, { "field": "supply_chain_layers", "value": "plating_equipment" }, { "field": "supply_chain_layers", "value": "thermal_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-acm-annual-2025", "title": "盛美半导体设备（上海）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-02-27/688082_20260227_7FPP.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-02-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio statement does not prove a named-fab installation or qualified layer." ] } ], "entity_reference": { "entity_id": "ent-acm-shanghai", "record_level": "company", "canonical_legal_name_en": "ACM Research (Shanghai), Inc.", "canonical_legal_name_cn": "盛美半导体设备（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "ACM Research (Shanghai), Inc.", "canonical_legal_name_cn": "盛美半导体设备（上海）股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "United States", "ownership_type": "mainland_public_foreign_controlled", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "United States", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Shanghai Aishengna" ], "brands": [], "canonical_legal_name_cn": "上海爱晟纳电子科技集团有限公司", "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-aishengna", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-aishengna", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [ "proc-lithography-immersion-arf" ], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-reuters-duv-aishengna-2026" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "lithography_equipment" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "09d752dfa9890b502e06125e17366b75cb34f761da2b4cbfe33b1f34063fc9bc", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "lithography_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "lithography_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-reuters-duv-aishengna-2026", "title": "China starts production of home-grown immersion DUV chipmaking tools, source says", "publisher": "Reuters", "url": "https://www.reuters.com/world/china/china-starts-production-home-grown-immersion-duv-chipmaking-tools-source-2026-07-28/", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2026-07-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Anonymous-source report; no model, serial, purchase order, shipment, installation, site acceptance, layer qualification, uptime, yield, or recurring volume." ] } ], "entity_reference": { "entity_id": "ent-aishengna", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海爱晟纳电子科技集团有限公司", "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海爱晟纳电子科技集团有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Alibaba Cloud ECS", "阿里云ECS" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "entity_type": "service_brand_or_unresolved_operator", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": null, "id": "ent-alibaba-cloud-ecs-brand-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-alibaba-ecs-c8y", "prod-alibaba-ecs-g8y", "prod-alibaba-ecs-r8y" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "cloud_services" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "93d0925dc66189441864536e43f29f887d1358b7c5be6858fe17b39906de86b0", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "cloud_services" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "cloud_services" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-alibaba-ecs-yitian-instance-families-20260625", "title": "Elastic Compute Service: Available instance families", "publisher": "Alibaba Cloud Documentation Center", "url": "https://www.alibabacloud.com/help/en/ecs/user-guide/overview-of-instance-families", "source_type": "official_cloud_product_documentation", "primary_status": "primary", "publication_date": "2026-06-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves a current commercial catalogue configuration, not region-specific operator, physical facility, installed count or utilization.", "Server manufacturer, board BOM, foundry, package/OSAT, capacity, tenant, uptime and workload receipts are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "record_level": "service_brand_or_unresolved_operator", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "service_brand_or_unresolved_operator", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Alibaba Cloud in-house Yitian", "倚天" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-alibaba-yitian-endpoint-unresolved", "entity_type": "brand_or_unresolved_endpoint", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": null, "id": "ent-alibaba-yitian-endpoint-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-yitian-710" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "cpus" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "bff9c5bf29eefde5b7a27a38f0608a213a296643a563ca8e88432e2edd0cb562", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "cpus" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "cpus" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-alibaba-ecs-yitian-instance-families-20260625", "title": "Elastic Compute Service: Available instance families", "publisher": "Alibaba Cloud Documentation Center", "url": "https://www.alibabacloud.com/help/en/ecs/user-guide/overview-of-instance-families", "source_type": "official_cloud_product_documentation", "primary_status": "primary", "publication_date": "2026-06-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves a current commercial catalogue configuration, not region-specific operator, physical facility, installed count or utilization.", "Server manufacturer, board BOM, foundry, package/OSAT, capacity, tenant, uptime and workload receipts are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-alibaba-yitian-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "全志科技", "Allwinner", "AllwinnerTechnology" ], "brands": [ "Allwinner" ], "canonical_legal_name_cn": "珠海全志科技股份有限公司", "canonical_legal_name_en": "Allwinner Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-allwinner", "entity_type": "company", "exchange": "Shenzhen Stock Exchange ChiNext", "facility_ids": [], "former_names": [], "headquarters": "Zhuhai, Guangdong, China", "id": "ent-allwinner", "identity_resolution_state": "chinese_identity_closed_english_name_source_normalized", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-allwinner-profile" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "300458", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "b0cf00550bf9f6254599b8b5fb78293512875eaeae04b838a7f5f650069f4287", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-allwinner-profile", "title": "关于全志", "publisher": "珠海全志科技股份有限公司", "url": "https://www.allwinnertech.com/index.php?a=index&c=about&id=21", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not print a formal English legal suffix; the English name remains source-normalized." ] } ], "entity_reference": { "entity_id": "ent-allwinner", "record_level": "company", "canonical_legal_name_en": "Allwinner Technology Co., Ltd.", "canonical_legal_name_cn": "珠海全志科技股份有限公司", "identity_resolution_state": "chinese_identity_closed_english_name_source_normalized", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Allwinner Technology Co., Ltd.", "canonical_legal_name_cn": "珠海全志科技股份有限公司", "identity_resolution_state": "chinese_identity_closed_english_name_source_normalized" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Zhuhai, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "AMEC", "中微公司" ], "brands": [], "canonical_legal_name_cn": "中微半导体设备（上海）股份有限公司", "canonical_legal_name_en": "Advanced Micro-Fabrication Equipment Inc. China", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-amec", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-amec", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-amec-halfyear-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "etch_equipment", "deposition_equipment" ], "ticker": "688012", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "55694ec7135286b50cbce4769f65e1fb07d710f0f50d35910dc18e1c89dd9633", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "etch_equipment" }, { "field": "supply_chain_layers", "value": "deposition_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "etch_equipment" }, { "field": "supply_chain_layers", "value": "deposition_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-amec-halfyear-2025", "title": "中微半导体设备（上海）股份有限公司2025年半年度报告", "publisher": "上海证券交易所", "url": "https://star.sse.com.cn/disclosure/listedinfo/announcement/c/new/2025-08-29/688012_20250829_BW75.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-08-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer portfolio and revenue recognition do not name the facility, qualified layer, throughput, uptime, or yield." ] } ], "entity_reference": { "entity_id": "ent-amec", "record_level": "company", "canonical_legal_name_en": "Advanced Micro-Fabrication Equipment Inc. China", "canonical_legal_name_cn": "中微半导体设备（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Advanced Micro-Fabrication Equipment Inc. China", "canonical_legal_name_cn": "中微半导体设备（上海）股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Amkor" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": "Amkor Technology, Inc.", "completion_state": "source_backed", "countries_of_operation": [ "United States", "China" ], "country_of_ownership": "United States", "entity_id": "ent-amkor", "entity_type": "company", "exchange": "NASDAQ", "facility_ids": [], "former_names": [], "headquarters": "Tempe, Arizona, United States", "id": "ent-amkor", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-amkor-current-factory-2026", "src-amkor-shanghai-expansion-2015", "src-amkor-shanghai-qualification-2001", "src-amkor-smic-award-2013", "src-shanghai-amkor-current-2025" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-amkor-shanghai-operator-unresolved" ], "supply_chain_layers": [ "assembly", "packaging", "test" ], "ticker": "AMKR", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "1d269fb4e582554631a1fefd048104516088659471fcde92ba825c5e115d63b0", "stage_ids": [ "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "packaging" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "assembly" }, { "field": "supply_chain_layers", "value": "test" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "assembly" }, { "field": "supply_chain_layers", "value": "packaging" }, { "field": "supply_chain_layers", "value": "test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-amkor-current-factory-2026", "title": "Contact Us — Factories", "publisher": "Amkor Technology, Inc.", "url": "https://amkor.com/contact-us/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The current factory list proves legal name, factory identifier and address, not package-specific qualification, customers, capacity, utilization, yield or immediate ownership chain." ] }, { "source_id": "src-amkor-shanghai-expansion-2015", "title": "Amkor Technology Announces Expansion of China Operations", "publisher": "Amkor Technology, Inc.", "url": "https://ir.amkor.com/news-releases/news-release-details/amkor-technology-announces-expansion-china-operations", "source_type": "company_facility_announcement", "primary_status": "primary", "publication_date": "2015-07-21", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical portfolio description is not package-specific customer qualification, capacity, utilization, yield or current production proof." ] }, { "source_id": "src-amkor-shanghai-qualification-2001", "title": "Amkor’s China Factory Ready for Customer Qualification", "publisher": "Amkor Technology, Inc.", "url": "https://ir.amkor.com/news-releases/news-release-details/amkors-china-factory-ready-customer-qualification", "source_type": "company_facility_announcement", "primary_status": "primary", "publication_date": "2001-06-11", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Readiness for qualification is not qualification, production or current operating-state proof." ] }, { "source_id": "src-amkor-smic-award-2013", "title": "Amkor Technology Receives Excellent Service Provider Award from SMIC", "publisher": "Amkor Technology, Inc.", "url": "https://ir.amkor.com/news-releases/news-release-details/amkor-technology-receives-excellent-service-provider-award-0", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2013-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-origin award statement does not identify the exact SMIC legal affiliate, facility, package, chip, quantity, price, qualification or current status." ] }, { "source_id": "src-shanghai-amkor-current-2025", "title": "浦东新区领导走访行业领军企业", "publisher": "浦东新区人民政府", "url": "https://www.shanghai.gov.cn/nw15343/20250310/86a8dfa142ed4672ae78265adb29ecf0.html", "source_type": "government_company_record", "primary_status": "primary", "publication_date": "2025-03-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Government visit confirms current legal name and production-line presence, not exact package platform, customer, capacity, utilization, yield or equipment/material BOM." ] } ], "entity_reference": { "entity_id": "ent-amkor", "record_level": "company", "canonical_legal_name_en": "Amkor Technology, Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Amkor Technology, Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "United States", "ownership_type": "foreign_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Tempe, Arizona, United States", "countries_of_operation": [ "United States", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Amkor Shanghai", "Amkor C3", "Amkor China Factory" ], "brands": [], "canonical_legal_name_cn": "安靠封装测试（上海）有限公司", "canonical_legal_name_en": "Amkor Assembly and Test (Shanghai) Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "United States", "China" ], "country_of_ownership": "United States", "entity_id": "ent-amkor-shanghai-operator-unresolved", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-amkor-shanghai" ], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-amkor-shanghai-operator-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-amkor", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-amkor-shanghai-qualification-2001", "src-amkor-shanghai-expansion-2015", "src-amkor-current-factory-2026", "src-shanghai-amkor-current-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "assembly", "packaging", "test" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "9eb88917d03d2f12e6cc60803fd46f7d916f099a46192bbc34df73adaec68010", "stage_ids": [ "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "packaging" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "assembly" }, { "field": "supply_chain_layers", "value": "test" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "assembly" }, { "field": "supply_chain_layers", "value": "packaging" }, { "field": "supply_chain_layers", "value": "test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-amkor-shanghai-qualification-2001", "title": "Amkor’s China Factory Ready for Customer Qualification", "publisher": "Amkor Technology, Inc.", "url": "https://ir.amkor.com/news-releases/news-release-details/amkors-china-factory-ready-customer-qualification", "source_type": "company_facility_announcement", "primary_status": "primary", "publication_date": "2001-06-11", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Readiness for qualification is not qualification, production or current operating-state proof." ] }, { "source_id": "src-amkor-shanghai-expansion-2015", "title": "Amkor Technology Announces Expansion of China Operations", "publisher": "Amkor Technology, Inc.", "url": "https://ir.amkor.com/news-releases/news-release-details/amkor-technology-announces-expansion-china-operations", "source_type": "company_facility_announcement", "primary_status": "primary", "publication_date": "2015-07-21", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical portfolio description is not package-specific customer qualification, capacity, utilization, yield or current production proof." ] }, { "source_id": "src-amkor-current-factory-2026", "title": "Contact Us — Factories", "publisher": "Amkor Technology, Inc.", "url": "https://amkor.com/contact-us/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The current factory list proves legal name, factory identifier and address, not package-specific qualification, customers, capacity, utilization, yield or immediate ownership chain." ] }, { "source_id": "src-shanghai-amkor-current-2025", "title": "浦东新区领导走访行业领军企业", "publisher": "浦东新区人民政府", "url": "https://www.shanghai.gov.cn/nw15343/20250310/86a8dfa142ed4672ae78265adb29ecf0.html", "source_type": "government_company_record", "primary_status": "primary", "publication_date": "2025-03-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Government visit confirms current legal name and production-line presence, not exact package platform, customer, capacity, utilization, yield or equipment/material BOM." ] } ], "entity_reference": { "entity_id": "ent-amkor-shanghai-operator-unresolved", "record_level": "company", "canonical_legal_name_en": "Amkor Assembly and Test (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "安靠封装测试（上海）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Amkor Assembly and Test (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "安靠封装测试（上海）有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "United States", "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-amkor", "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "United States", "China" ], "facility_ids": [ "fac-amkor-shanghai" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "晶晨股份", "Amlogic" ], "brands": [ "Amlogic" ], "canonical_legal_name_cn": "晶晨半导体（上海）股份有限公司", "canonical_legal_name_en": "Amlogic (Shanghai) Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-amlogic-shanghai", "entity_type": "company", "exchange": "Shanghai Stock Exchange STAR Market", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-amlogic-shanghai", "identity_resolution_state": "canonical_identity_closed_brand_separated", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-amlogic-sse-snapshot", "src-amlogic-sse-listing" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "688099", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "5c3281c17a5bb21e1e17af68b5fddcd07799fcc49da0d9a95930e9c7994c9d72", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-amlogic-sse-snapshot", "title": "688099 Company Overview", "publisher": "上海证券交易所", "url": "https://star.sse.com.cn/star/en/marketdata/snapshot/c/5546285.shtml", "source_type": "exchange_record", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Amlogic is also used globally as a brand and should not be treated as a separate legal parent without proof." ] }, { "source_id": "src-amlogic-sse-listing", "title": "关于晶晨半导体（上海）股份有限公司人民币普通股股票科创板上市交易的公告", "publisher": "上海证券交易所", "url": "https://www.sse.com.cn/disclosure/announcement/listing/ipo/c/c_20190807_75889932.shtml", "source_type": "exchange_notice", "primary_status": "primary", "publication_date": "2019-08-07", "date_checked": "2026-07-29", "access_state": "open", "limitations": [] } ], "entity_reference": { "entity_id": "ent-amlogic-shanghai", "record_level": "company", "canonical_legal_name_en": "Amlogic (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "晶晨半导体（上海）股份有限公司", "identity_resolution_state": "canonical_identity_closed_brand_separated", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Amlogic (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "晶晨半导体（上海）股份有限公司", "identity_resolution_state": "canonical_identity_closed_brand_separated" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Anji Micro", "安集科技" ], "brands": [], "canonical_legal_name_cn": "安集微电子科技（上海）股份有限公司", "canonical_legal_name_en": "Anji Microelectronics Technology (Shanghai) Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-anji", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-anji", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [ "proc-material-cmp-consumables", "proc-material-wet-plating-chemistry" ], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-anji-annual-2024" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "cmp_materials", "wet_chemicals" ], "ticker": "688019", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "f7398987d3e1460bdd990ce8636af89a5e47212adbbdc827a01580d134d7f559", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "cmp_materials" }, { "field": "supply_chain_layers", "value": "wet_chemicals" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "cmp_materials" }, { "field": "supply_chain_layers", "value": "wet_chemicals" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-anji-annual-2024", "title": "安集微电子科技（上海）股份有限公司2024年年度报告", "publisher": "上海证券交易所", "url": "https://star.sse.com.cn/disclosure/listedinfo/announcement/c/new/2025-04-16/688019_20250416_8014.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-04-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Public disclosure does not expose full formulation, precursor origin, lot purity, named qualified layer, or fab-specific utilization." ] } ], "entity_reference": { "entity_id": "ent-anji", "record_level": "company", "canonical_legal_name_en": "Anji Microelectronics Technology (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "安集微电子科技（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Anji Microelectronics Technology (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "安集微电子科技（上海）股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "ASE" ], "brands": [], "canonical_legal_name_cn": "日月光半導體製造股份有限公司", "canonical_legal_name_en": "Advanced Semiconductor Engineering, Inc.", "completion_state": "source_backed", "countries_of_operation": [ "Taiwan", "China" ], "country_of_ownership": "Taiwan", "entity_id": "ent-ase", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Kaohsiung, Taiwan", "id": "ent-ase", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-ase-wuxi-facility", "src-ase-wuxi-operator-2025" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-ase-wuxi-operator-unresolved" ], "supply_chain_layers": [ "assembly", "test" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "5b210f15b48f5c2de2811e65b1d8036c8c3b4bfbd76184cd19b1845ef575a194", "stage_ids": [ "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "assembly" }, { "field": "supply_chain_layers", "value": "test" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "assembly" }, { "field": "supply_chain_layers", "value": "test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ase-wuxi-facility", "title": "Global Manufacturing", "publisher": "Advanced Semiconductor Engineering, Inc.", "url": "https://ase.aseglobal.com/about-ase/manufacturing-facilities/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not identify the exact Chinese legal operator, package platforms, customers, capacity, qualification, utilization or ownership chain." ] }, { "source_id": "src-ase-wuxi-operator-2025", "title": "ASE WuXi — 关于我们", "publisher": "无锡通芝微电子有限公司", "url": "https://www.asewx.com/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page proves the operating legal name, address and generic assembly/test scope, not the immediate ownership chain, package platforms, named customers, capacity, utilization or yield." ] } ], "entity_reference": { "entity_id": "ent-ase", "record_level": "company", "canonical_legal_name_en": "Advanced Semiconductor Engineering, Inc.", "canonical_legal_name_cn": "日月光半導體製造股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Advanced Semiconductor Engineering, Inc.", "canonical_legal_name_cn": "日月光半導體製造股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "Taiwan", "ownership_type": "foreign_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Kaohsiung, Taiwan", "countries_of_operation": [ "Taiwan", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "ASE Wuxi", "ASEWX" ], "brands": [], "canonical_legal_name_cn": "无锡通芝微电子有限公司", "canonical_legal_name_en": "Wuxi Tongzhi Microelectronics Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "Taiwan", "China" ], "country_of_ownership": "Taiwan", "entity_id": "ent-ase-wuxi-operator-unresolved", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-ase-wuxi" ], "former_names": [], "headquarters": "Wuxi, Jiangsu, China", "id": "ent-ase-wuxi-operator-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-ase", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-ase-wuxi-facility", "src-ase-wuxi-operator-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "assembly", "test" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "b8a054d0b7a7fb5119ce1f45b37214ddb652b4d1bc9b18f5bbdd816eca0e9fcc", "stage_ids": [ "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "assembly" }, { "field": "supply_chain_layers", "value": "test" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "assembly" }, { "field": "supply_chain_layers", "value": "test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ase-wuxi-facility", "title": "Global Manufacturing", "publisher": "Advanced Semiconductor Engineering, Inc.", "url": "https://ase.aseglobal.com/about-ase/manufacturing-facilities/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not identify the exact Chinese legal operator, package platforms, customers, capacity, qualification, utilization or ownership chain." ] }, { "source_id": "src-ase-wuxi-operator-2025", "title": "ASE WuXi — 关于我们", "publisher": "无锡通芝微电子有限公司", "url": "https://www.asewx.com/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page proves the operating legal name, address and generic assembly/test scope, not the immediate ownership chain, package platforms, named customers, capacity, utilization or yield." ] } ], "entity_reference": { "entity_id": "ent-ase-wuxi-operator-unresolved", "record_level": "company", "canonical_legal_name_en": "Wuxi Tongzhi Microelectronics Co., Ltd.", "canonical_legal_name_cn": "无锡通芝微电子有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Wuxi Tongzhi Microelectronics Co., Ltd.", "canonical_legal_name_cn": "无锡通芝微电子有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "Taiwan", "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-ase", "state_parent": null }, "geography": { "headquarters": "Wuxi, Jiangsu, China", "countries_of_operation": [ "Taiwan", "China" ], "facility_ids": [ "fac-ase-wuxi" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Baidu AI Cloud", "百度智能云" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-baidu-ai-cloud-brand-unresolved", "entity_type": "service_brand_or_unresolved_operator", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": null, "id": "ent-baidu-ai-cloud-brand-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-baidu-baige-deepseek-p800" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-baidu-baige-deepseek-p800-20250217", "src-baidu-p800-large-cluster-caict-claim-20250723" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "cloud_services", "ai_systems" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "863a38dc11c4fe24d336a7bd8f46143d34c0bb444e9f98a9d3decd6061bc934d", "stage_ids": [ "board_system", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "ai_systems" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "cloud_services" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "cloud_services" }, { "field": "supply_chain_layers", "value": "ai_systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-baidu-baige-deepseek-p800-20250217", "title": "百度百舸 DeepSeek 一体机发布，支持昆仑芯 P800 单机 8 卡满血版开箱即用", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_e0a478ab-bfa4-425c-b9b5-a6d296f6c698", "source_type": "official_operator_product_release", "primary_status": "primary", "publication_date": "2025-02-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Launch/apply-for-trial and vendor deployment statements; no order, shipment, customer acceptance or independent workload receipt.", "Server OEM, CPU/memory/network BOM, cluster facility, exact card count, uptime and utilization are undisclosed." ] }, { "source_id": "src-baidu-p800-large-cluster-caict-claim-20250723", "title": "首家！AI算力最高评级！", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_377f7acf-07e4-4787-a0f5-d70671dd6f34", "source_type": "official_operator_news", "primary_status": "primary", "publication_date": "2025-07-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "CAICT report/certificate, test version, duration, sample, pass criteria and raw results were not retrieved.", "10,000- and 30,000-card terms are rounded vendor classes, not exact installed/qualified/utilized counts." ] } ], "entity_reference": { "entity_id": "ent-baidu-ai-cloud-brand-unresolved", "record_level": "service_brand_or_unresolved_operator", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "service_brand_or_unresolved_operator", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Baidu P800 cluster legal owner/operator (unresolved)" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-baidu-cluster-owner-unresolved", "entity_type": "unresolved_endpoint", "exchange": null, "facility_ids": [ "fac-baidu-p800-10k-class-unknown-site", "fac-baidu-p800-30k-class-unknown-site" ], "former_names": [], "headquarters": null, "id": "ent-baidu-cluster-owner-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-baidu-p800-large-cluster-caict-claim-20250723" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "ai_compute_infrastructure" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "de267b0dcd13d024a74510e98ad78bdce5242ab63cf1b12a2847c4ccb514d06c", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "ai_compute_infrastructure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-baidu-p800-large-cluster-caict-claim-20250723", "title": "首家！AI算力最高评级！", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_377f7acf-07e4-4787-a0f5-d70671dd6f34", "source_type": "official_operator_news", "primary_status": "primary", "publication_date": "2025-07-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "CAICT report/certificate, test version, duration, sample, pass criteria and raw results were not retrieved.", "10,000- and 30,000-card terms are rounded vendor classes, not exact installed/qualified/utilized counts." ] } ], "entity_reference": { "entity_id": "ent-baidu-cluster-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [ "fac-baidu-p800-10k-class-unknown-site", "fac-baidu-p800-30k-class-unknown-site" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "神州云科", "北京神州鲲泰信息技术有限公司" ], "brands": [], "canonical_legal_name_cn": "北京神州数码云科信息技术有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-beijing-digital-china-yunke", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [ "北京神州数码云科信息技术有限公司" ], "headquarters": "Beijing, China", "id": "ent-beijing-digital-china-yunke", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-digital-china-group", "process_ids": [], "product_ids": [ "prod-yunke-telecom-server-framework-combined" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-digital-china-chinatelecom-framework-20250423", "src-digital-china-2025-annual-summary-20260331" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "servers" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "8761007eb7ec315c2a7aa4ad6332776e41ab397c4f404216cfc8689945f0eed8", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "servers" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "servers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-digital-china-chinatelecom-framework-20250423", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2025-04/23/content_2053613.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Framework award value is not ordered, delivered or accepted value.", "Server models, CPU/accelerator vendor and part numbers, memory/NIC BOM, quantity, receiving affiliate/facility and test receipt are undisclosed." ] }, { "source_id": "src-digital-china-2025-annual-summary-20260331", "title": "神州数码集团股份有限公司2025年年度报告摘要", "publisher": "神州数码集团股份有限公司", "url": "https://paper.cnstock.com/html/2026-03/31/content_2194300.htm", "source_type": "exchange_filing_summary", "primary_status": "primary", "publication_date": "2026-03-31", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal-name/alias resolution only; no product, order, delivery or acceptance state." ] } ], "entity_reference": { "entity_id": "ent-beijing-digital-china-yunke", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京神州数码云科信息技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京神州数码云科信息技术有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-digital-china-group", "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Kehua", "北京科华", "Kempur", "Kempur Microelectronics Inc." ], "brands": [], "canonical_legal_name_cn": "北京科华微电子材料有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-beijing-kehua", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-kehua-shunyi-photoresist-base" ], "former_names": [], "headquarters": "No. 4 Zhuyuan Road, Tianzhu Comprehensive Bonded Zone, Shunyi District, Beijing, China", "id": "ent-beijing-kehua", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-tongcheng-electronic-materials-shanghai", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-red-avenue-annual-2025", "src-kehua-icmtia-product-catalogue-2026", "src-kehua-company-home-20260729", "src-redavenue-kehua-investment-2025", "src-icmtia-kehua-248nm-award-2021" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "photoresist", "lithography_materials" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "32df22ba1f189a2740795953a55356c670a4461e5fa8b7ba51f842423779c3ca", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "photoresist" }, { "field": "supply_chain_layers", "value": "lithography_materials" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "photoresist" }, { "field": "supply_chain_layers", "value": "lithography_materials" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "photoresist" }, { "field": "supply_chain_layers", "value": "lithography_materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_and_secondary", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] }, { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] }, { "source_id": "src-kehua-company-home-20260729", "title": "北京科华微电子材料有限公司 — 关于我们 / Kempur home page", "publisher": "北京科华微电子材料有限公司", "url": "https://www.kempur.com/", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "indexed_direct_open_error", "limitations": [ "Direct page fetch returned an internal error; only the public search-indexed company-page text was recorded and no access control was bypassed.", "Line descriptions and address do not establish permit capacity, installed tools, current utilization, output, model-to-line mapping, named customer or qualification." ] }, { "source_id": "src-redavenue-kehua-investment-2025", "title": "彤程新材料集团股份有限公司对外投资进展公告", "publisher": "彤程新材料集团股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2025-05/28/content_2074043.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-05-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The disclosure said business-registration changes remained at publication; the later annual report gives 96.3296%, a one-ten-thousandth-point rounding difference." ] }, { "source_id": "src-icmtia-kehua-248nm-award-2021", "title": "“第二届集成电路材料奖”获奖名单颁布", "publisher": "中关村集成电路材料产业技术创新联盟", "url": "https://www.icmtia.com/news/647.html", "source_type": "industry_association_award_record", "primary_status": "secondary", "publication_date": "2021-11-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The award names Beijing Kehua and a 248 nm family, not an exact SKU, customer, fab, layer, lot, quantity, qualification date or independent process data." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-tongcheng-electronic-materials-shanghai", "state_parent": null }, "geography": { "headquarters": "No. 4 Zhuyuan Road, Tianzhu Comprehensive Bonded Zone, Shunyi District, Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-kehua-shunyi-photoresist-base" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Starblaze", "忆芯科技" ], "brands": [], "canonical_legal_name_cn": "北京忆芯科技有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-beijing-starblaze", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-beijing-starblaze", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-starblaze-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "fabless chip design", "storage controllers", "ssd storage", "production qualification" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "99c75d36b0e316e8680b5209bb96466282032521ed43d0e0422647ff4a619ac5", "stage_ids": [ "design_company", "architecture_ip", "memory_manufacturer", "assembly_test", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "fabless chip design" } ] }, { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "storage controllers" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "storage controllers" }, { "field": "supply_chain_layers", "value": "ssd storage" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "production qualification" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "production qualification" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "fabless chip design" }, { "field": "supply_chain_layers", "value": "storage controllers" }, { "field": "supply_chain_layers", "value": "ssd storage" }, { "field": "supply_chain_layers", "value": "production qualification" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-starblaze-profile-20260801", "title": "About Starblaze", "publisher": "北京忆芯科技有限公司", "url": "https://www.starblaze.com/content/index/cid/5.html", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Tapeout and million-unit validation language is anonymous and company-reported; no foundry, OSAT or named customer edge is established." ] } ], "entity_reference": { "entity_id": "ent-beijing-starblaze", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京忆芯科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京忆芯科技有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Biren", "壁仞科技", "璧仞" ], "brands": [], "canonical_legal_name_cn": "上海壁仞科技股份有限公司", "canonical_legal_name_en": "Shanghai Biren Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-biren-brand-endpoint-unresolved", "entity_type": "company", "exchange": "HKEX", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-biren-brand-endpoint-unresolved", "identity_resolution_state": "resolved_to_legal_entity", "joint_venture_ids": [], "last_checked": "2026-07-29", "legacy_id_resolution_note": "Stable ID retains historical unresolved suffix; canonical legal identity is now primary-source resolved.", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [ "proc-chip-ai-accelerator" ], "product_ids": [ "prod-biren-104p", "prod-biren-br106-family", "prod-biren-br166-family", "prod-biren-lightsphere-x" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-biren-annual-2025", "src-h3c-h65-bios-574-20230804" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "accelerators" ], "ticker": "06082", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "3e76119d3516328427427154d1ffb370a144df335e8066f0f31e8807006c3884", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "accelerators" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "accelerators" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-biren-annual-2025", "title": "Shanghai Biren Technology Co., Ltd. 2025 Annual Report", "publisher": "香港交易所", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0422/2026042200045.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-22", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers, project sites, foundry, OSAT, memory suppliers and variant-specific unit counts are withheld." ] }, { "source_id": "src-h3c-h65-bios-574-20230804", "title": "H3C H65-BIOS-5.74版本说明书", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202308/1903077_30005_0.htm", "source_type": "official_firmware_release_notes", "primary_status": "primary", "publication_date": "2023-08-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Firmware adaptation/support is not a purchase, configured commercial SKU, order, shipment, installation or external qualification.", "The signed binary is named with MD5 eea6fa3e3dc6f629ee8fdaa78932627c; it was not locally archived." ] } ], "entity_reference": { "entity_id": "ent-biren-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Shanghai Biren Technology Co., Ltd.", "canonical_legal_name_cn": "上海壁仞科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shanghai Biren Technology Co., Ltd.", "canonical_legal_name_cn": "上海壁仞科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "佰维存储", "BIWIN STORAGE" ], "brands": [ "BIWIN", "Biwintech", "佰维", "佰微" ], "canonical_legal_name_cn": "深圳佰维存储科技股份有限公司", "canonical_legal_name_en": "BIWIN STORAGE TECHNOLOGY CO., LTD.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-biwin-storage", "entity_type": "company", "exchange": "Shanghai Stock Exchange STAR Market", "facility_ids": [], "former_names": [], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-biwin-storage", "identity_resolution_state": "canonical_identity_closed_brands_separated", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-biwin-company", "src-biwin-stock" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "688525", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "ea74b35763ef81ba2f3fce8a8d1b3aef5e3c613ce129e28083c15b0f0fb53be8", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-biwin-company", "title": "公司简介", "publisher": "深圳佰维存储科技股份有限公司", "url": "https://www.biwin.com.cn/about/company", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [] }, { "source_id": "src-biwin-stock", "title": "Investor relations company information", "publisher": "深圳佰维存储科技股份有限公司", "url": "https://www.biwin.com.cn/gushi.html", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The official English legal name omits Shenzhen." ] } ], "entity_reference": { "entity_id": "ent-biwin-storage", "record_level": "company", "canonical_legal_name_en": "BIWIN STORAGE TECHNOLOGY CO., LTD.", "canonical_legal_name_cn": "深圳佰维存储科技股份有限公司", "identity_resolution_state": "canonical_identity_closed_brands_separated", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "BIWIN STORAGE TECHNOLOGY CO., LTD.", "canonical_legal_name_cn": "深圳佰维存储科技股份有限公司", "identity_resolution_state": "canonical_identity_closed_brands_separated" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "zycgr22011903", "ZYCGR22011903", "LGGJ实验室" ], "best_supported_identity": "临港实验室 / 临港国家实验室", "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "unknown", "entity_id": "ent-buyer-zycgr22011903-unresolved", "entity_type": "unresolved_government_procurement_buyer_alias", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Candidate: 2380 Hechuan Road, Building 37, Minhang, Shanghai; legal identity unresolved", "id": "ent-buyer-zycgr22011903-unresolved", "identity_ceiling": "Exact address, contacts and research remit correlate; no same-document unmasking, legal registration ID or signed-contract legal name.", "identity_evidence_state": "CORROBORATED", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unknown", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-ccgp-smee-ssc800-award-2025", "src-ssc800-ccgp-single-source-notice-20251107", "src-ssc800-ccgp-expert-opinion-20251106", "src-lingang-laboratory-procurement-contact-20250109", "src-lingang-laboratory-contact-20260729" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "research_or_semiconductor_lithography_buyer_unknown" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "210b467b4ae43f4b84104b7b89fd1a22aa8163e29f8d607f823e2e799eeb5abf", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "research_or_semiconductor_lithography_buyer_unknown" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "research_or_semiconductor_lithography_buyer_unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ccgp-smee-ssc800-award-2025", "title": "zycgr22011903单一来源采购步进扫描式光刻机成交公告", "publisher": "中国政府采购网 / 财政部", "url": "https://www.ccgp.gov.cn/cggg/zygg/cjgg/202512/t20251225_25989183.htm", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2025-12-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Buyer legal identity remains unresolved; official address/contact correlation to 临港实验室 is strong but not a same-document legal-identity receipt.", "Award/vendor selection is not a signed contract, manufacturing completion, shipment, delivery, move-in, installation, site acceptance, asset registration or process qualification.", "Wavelength, NA, resolution, overlay, throughput, facility, layer, yield and production use are undisclosed." ] }, { "source_id": "src-ssc800-ccgp-single-source-notice-20251107", "title": "科学技术部zycgr22011903单一来源采购步进扫描式光刻机征求意见公示", "publisher": "中国政府采购网 / 中华人民共和国财政部国库司", "url": "https://www.ccgp.gov.cn/eadylynotice/202511/t20251107_25653325.htm", "source_type": "central_government_single_source_notice", "primary_status": "primary", "publication_date": "2025-11-07", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The buyer remains masked.", "The notice does not provide the eventual model, signed contract, delivery date, installation facility, acceptance, qualified layer, wavelength, NA, throughput, uptime or yield." ] }, { "source_id": "src-ssc800-ccgp-expert-opinion-20251106", "title": "附件3-专家论证意见", "publisher": "科学技术部 / 中国政府采购网", "url": "https://download.ccgp.gov.cn/oss/download?uuid=ECF994F0FBE86A6F1C7EB79270DA03", "source_type": "single_source_expert_opinion", "primary_status": "primary", "publication_date": "2025-11-07", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The performance statements are procurement-justification assertions, not FAT, SAT or independent metrology.", "The attachment names no model, wavelength, NA, serial, facility, delivery date, qualified layer, throughput, uptime, defectivity or yield." ] }, { "source_id": "src-lingang-laboratory-procurement-contact-20250109", "title": "临港实验室科研物资采购服务平台2025-2027年度供应商公开遴选项目公告", "publisher": "临港实验室", "url": "https://www.lglab.ac.cn/xwdt/tzgg/202501/t20250109_308408.html", "source_type": "official_laboratory_procurement_notice", "primary_status": "primary", "publication_date": "2025-01-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "This page is not about SSC800/10 and supports only identity correlation, not the equipment relationship." ] }, { "source_id": "src-lingang-laboratory-contact-20260729", "title": "联系方式", "publisher": "临港实验室", "url": "https://www.lglab.ac.cn/xxgk/xxgklxfs/", "source_type": "official_laboratory_contact_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not mention the masked buyer alias or SSC800/10." ] } ], "entity_reference": { "entity_id": "ent-buyer-zycgr22011903-unresolved", "record_level": "unresolved_government_procurement_buyer_alias", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "unresolved_government_procurement_buyer_alias", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "unknown", "ownership_type": "unknown", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Candidate: 2380 Hechuan Road, Building 37, Minhang, Shanghai; legal identity unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "BYD", "BYD contracting entity for 2022 Journey 5 design win (unresolved)", "比亚迪" ], "brands": [], "canonical_legal_name_cn": "比亚迪股份有限公司", "canonical_legal_name_en": "BYD COMPANY LIMITED", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-byd-contracting-endpoint-unresolved", "entity_type": "company", "exchange": "SZSE / HKEX", "facility_ids": [], "former_names": [], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-byd-contracting-endpoint-unresolved", "identity_resolution_state": "resolved_to_legal_entity", "joint_venture_ids": [], "last_checked": "2026-07-29", "legacy_id_resolution_note": "Stable ID retains historical unresolved suffix; canonical legal identity is now primary-source resolved.", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-dd-byd-c11", "prod-dd-byd-ebus-3", "prod-dd-byd-super-e" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-byd-horizon-journey5-designwin-20220421", "src-dd-byd-001", "src-dd-byd-002", "src-dd-byd-003" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "automotive" ], "ticker": "002594 / 01211", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "0046dc27e395ba75367aa6a3f108acaf227a6be52f480c62ea9f2d83e80adb0b", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "automotive" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-byd-horizon-journey5-designwin-20220421", "title": "比亚迪与地平线官宣合作 2023年部分上市车型将搭载征程5", "publisher": "比亚迪汽车工业有限公司", "url": "https://oip.byd.com/addons/cms/news/detail?category=1&news_id=72", "source_type": "customer_site_industry_news", "primary_status": "primary", "publication_date": "2022-04-21", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact contracting legal endpoints, vehicle models, SOP, delivery, installed units and volume are undisclosed.", "Rhetorical mass-production wording is not a model-specific shipment or production receipt." ] }, { "source_id": "src-dd-byd-001", "title": "全球首款批量装车1500V高耐压大功率SiC芯片 助力全球最强超级e平台", "publisher": "比亚迪股份有限公司", "url": "https://www.byd.com/cn/news/2025/detail569", "source_type": "official_corporate_technical_announcement", "primary_status": "primary", "publication_date": "2025-03-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No fab, substrate/epitaxy supplier, equipment/material supplier, capacity, output, yield, vehicle count or independent reliability." ] }, { "source_id": "src-dd-byd-002", "title": "比亚迪超级e平台，兆瓦闪充开启油电同速", "publisher": "比亚迪股份有限公司", "url": "https://www.bydglobal.com/cn/news/2025-03-18/1617162611594", "source_type": "official_customer_corporate_announcement", "primary_status": "primary", "publication_date": "2025-03-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No delivered-vehicle count, facility, yield or independent validation." ] }, { "source_id": "src-dd-byd-003", "title": "比亚迪发布e-Bus平台3.0，推动电动客车进入千伏时代", "publisher": "比亚迪股份有限公司", "url": "https://www.bydglobal.com/cn/news/2025-09-16/1617162700470", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2025-09-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No exact chip ID/legal manufacturer, deliveries, fleet operator, facility, capacity or yield." ] } ], "entity_reference": { "entity_id": "ent-byd-contracting-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "BYD COMPANY LIMITED", "canonical_legal_name_cn": "比亚迪股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "BYD COMPANY LIMITED", "canonical_legal_name_cn": "比亚迪股份有限公司", "identity_resolution_state": "resolved_to_legal_entity" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Cambricon", "寒武纪" ], "brands": [], "canonical_legal_name_cn": "中科寒武纪科技股份有限公司", "canonical_legal_name_en": "Cambricon Technologies Corporation Limited", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-cambricon-brand-endpoint-unresolved", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-cambricon-brand-endpoint-unresolved", "identity_resolution_state": "resolved_to_legal_entity", "joint_venture_ids": [], "last_checked": "2026-07-29", "legacy_id_resolution_note": "Stable ID retains historical unresolved suffix; canonical legal identity is now primary-source resolved.", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [ "proc-chip-ai-accelerator" ], "product_ids": [ "prod-cambricon-mlu370-s4", "prod-cambricon-mlu370-x4", "prod-cambricon-mlu370-x8", "prod-cambricon-siyuan220-family" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-cambricon-annual-2025", "src-cambricon-mlu370x8-product", "src-ctyun-cambricon-cloud-20260703" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "accelerators" ], "ticker": "688256", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "f4ee6fb898633c33f9353b1ab22edfc3cc3057c8b8fffa01db474be23f879c0f", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "accelerators" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "accelerators" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cambricon-annual-2025", "title": "中科寒武纪科技股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-13/688256_20260313_GWH3.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-13", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, wafer facility, OSAT, package flow, memory supplier and named customers are undisclosed.", "The one-million figure is family cumulative volume, not a model/facility split." ] }, { "source_id": "src-cambricon-mlu370x8-product", "title": "MLU370-X8 智能加速卡", "publisher": "中科寒武纪科技股份有限公司", "url": "https://www.cambricon.com/index.php?a=lists&c=index&catid=406&m=content", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, LPDDR5 supplier, OSAT, package, units, named customer and independent workload receipt are undisclosed." ] }, { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-07-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-cambricon-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Cambricon Technologies Corporation Limited", "canonical_legal_name_cn": "中科寒武纪科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Cambricon Technologies Corporation Limited", "canonical_legal_name_cn": "中科寒武纪科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "粤芯半导体", "CanSemi" ], "brands": [ "CanSemi" ], "canonical_legal_name_cn": "粤芯半导体技术股份有限公司", "canonical_legal_name_en": "CanSemi Technology Inc.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-cansemitech", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [ "广州粤芯半导体技术有限公司" ], "headquarters": "Guangzhou, Guangdong, China", "id": "ent-cansemitech", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "unlisted_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-cansemitech-about" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "e6813986ec1f38706dbf0d3a68dd25a0ae5c82578d1c305cd40cdf21719aad1a", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cansemitech-about", "title": "About Us", "publisher": "CanSemi", "url": "https://www.cansemitech.com/?lang=en&page_id=394", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not close the current controller." ] } ], "entity_reference": { "entity_id": "ent-cansemitech", "record_level": "company", "canonical_legal_name_en": "CanSemi Technology Inc.", "canonical_legal_name_cn": "粤芯半导体技术股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "CanSemi Technology Inc.", "canonical_legal_name_cn": "粤芯半导体技术股份有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unlisted_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Guangzhou, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "长川科技", "CCTECH", "CCTech" ], "brands": [ "CCTECH" ], "canonical_legal_name_cn": "杭州长川科技股份有限公司", "canonical_legal_name_en": "Hangzhou Changchuan Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-changchuan", "entity_type": "company", "exchange": "Shenzhen Stock Exchange ChiNext", "facility_ids": [], "former_names": [], "headquarters": "Hangzhou, Zhejiang, China", "id": "ent-changchuan", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-cctech-profile" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "300604", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "405688c0a2581a12417391d54128647b653b6db84eba48822168f62c2a8eb7b6", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cctech-profile", "title": "Company Profile", "publisher": "Hangzhou Changchuan Technology Co., Ltd.", "url": "https://www.hzcctech.com/eng/companyprofile/index.aspx", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [] } ], "entity_reference": { "entity_id": "ent-changchuan", "record_level": "company", "canonical_legal_name_en": "Hangzhou Changchuan Technology Co., Ltd.", "canonical_legal_name_cn": "杭州长川科技股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Hangzhou Changchuan Technology Co., Ltd.", "canonical_legal_name_cn": "杭州长川科技股份有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Hangzhou, Zhejiang, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "China Great Wall", "中国长城" ], "brands": [], "canonical_legal_name_cn": "中国长城科技集团股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-china-great-wall", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-china-great-wall", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_linked", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-houmo-m50-greatwall-20260531" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "pcs", "systems" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "3d9a923ba8cc80b97be570d1ba1b5c9bebdfcf6523f71ac3e74c279049842c7e", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "pcs" }, { "field": "supply_chain_layers", "value": "systems" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "pcs" }, { "field": "supply_chain_layers", "value": "systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-houmo-m50-greatwall-20260531", "title": "长城N90 Pro AI笔记本搭载后摩M50", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/1/47/NewsDetails.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2026-05-31", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Direct buying entity, contract, units, retail shipments, acceptance and field reliability are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-china-great-wall", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "中国长城科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "中国长城科技集团股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_linked", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "China Merchants Bank", "招商银行" ], "brands": [], "canonical_legal_name_cn": "招商银行股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-china-merchants-bank", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-china-merchants-bank", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-kunlun-p800-cmb-20250327" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "financial_services", "ai_demand" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "c6a2f3b4556ce74f3452e82274b19a587f7a2cc59c2ae13ebdd659d7f85e0733", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "ai_demand" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "financial_services" }, { "field": "supply_chain_layers", "value": "ai_demand" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kunlun-p800-cmb-20250327", "title": "昆仑芯中标招商银行AI芯片资源项目", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/news/4469.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2025-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-origin award; tender number, contract, quantity, delivery, installation and customer acceptance are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-china-merchants-bank", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "招商银行股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "招商银行股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "China Mobile contracting entity" ], "brands": [], "canonical_legal_name_cn": "中国移动通信有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-china-mobile-communications", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "29 Financial Street, Xicheng District, Beijing, China", "id": "ent-china-mobile-communications", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_owned", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-digital-china-cmcc-framework-20240824" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "telecom", "ai_infrastructure" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "8af4fa54f7db385cb6e0b52247d071e942e8054278aca691a52c7a814e521d25", "stage_ids": [ "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "telecom" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "telecom" }, { "field": "supply_chain_layers", "value": "ai_infrastructure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-digital-china-cmcc-framework-20240824", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2024-08/24/content_1957609.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2024-08-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "842 is a framework award ceiling, not an actual order, shipment, installation or acceptance count.", "Server model, accelerator/CPU/memory/NIC BOM, facility, value, serial and asset receipt are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-china-mobile-communications", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "中国移动通信有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "中国移动通信有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_owned", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "29 Financial Street, Xicheng District, Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "China Telecom Corporation" ], "brands": [], "canonical_legal_name_cn": "中国电信股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-china-telecom-corp", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "31 Financial Street, Xicheng District, Beijing, China", "id": "ent-china-telecom-corp", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public_state_controlled", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-digital-china-chinatelecom-framework-20250423" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "telecom", "compute_infrastructure" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "8e86fca6b9928198882b9c918018cdbe2be6780d30912d2e180b2dbb8284078a", "stage_ids": [ "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "telecom" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "telecom" }, { "field": "supply_chain_layers", "value": "compute_infrastructure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-digital-china-chinatelecom-framework-20250423", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2025-04/23/content_2053613.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Framework award value is not ordered, delivered or accepted value.", "Server models, CPU/accelerator vendor and part numbers, memory/NIC BOM, quantity, receiving affiliate/facility and test receipt are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-china-telecom-corp", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "中国电信股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "中国电信股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public_state_controlled", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "31 Financial Street, Xicheng District, Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "China Telecom Group" ], "brands": [], "canonical_legal_name_cn": "中国电信集团有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-china-telecom-group", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "31 Financial Street, Xicheng District, Beijing, China", "id": "ent-china-telecom-group", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_owned", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-digital-china-chinatelecom-framework-20250423" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "telecom", "compute_infrastructure" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "0026a5f8a6d466f28d1a23ff0640058015b683606b79284358d2a352415e0b50", "stage_ids": [ "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "telecom" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "telecom" }, { "field": "supply_chain_layers", "value": "compute_infrastructure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-digital-china-chinatelecom-framework-20250423", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2025-04/23/content_2053613.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Framework award value is not ordered, delivered or accepted value.", "Server models, CPU/accelerator vendor and part numbers, memory/NIC BOM, quantity, receiving affiliate/facility and test receipt are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-china-telecom-group", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "中国电信集团有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "中国电信集团有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_owned", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "31 Financial Street, Xicheng District, Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "华润微", "CR Micro", "CRM" ], "brands": [ "CR Micro" ], "canonical_legal_name_cn": "华润微电子有限公司", "canonical_legal_name_en": "China Resources Microelectronics Limited", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-crmicro", "entity_type": "company", "exchange": "Shanghai Stock Exchange STAR Market", "facility_ids": [], "former_names": [], "headquarters": "Operational headquarters in Wuxi, Jiangsu, China; Cayman registered issuer", "id": "ent-crmicro", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "Cayman exempted company / PRC red-chip issuer", "lei": null, "ownership_type": "central_state_group_affiliate_listed_red_chip", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-crmicro-profile" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "688396", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "4307be8830c04a2a99072f35424eadfc61896242fe6bc054971ce514657bef6d", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-crmicro-profile", "title": "Company Profile", "publisher": "China Resources Microelectronics Limited", "url": "https://www.crmicro.com/Home/companyProfile/index.html", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The profile names the group, not the exact current immediate legal shareholder." ] } ], "entity_reference": { "entity_id": "ent-crmicro", "record_level": "company", "canonical_legal_name_en": "China Resources Microelectronics Limited", "canonical_legal_name_cn": "华润微电子有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "China Resources Microelectronics Limited", "canonical_legal_name_cn": "华润微电子有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "central_state_group_affiliate_listed_red_chip", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Operational headquarters in Wuxi, Jiangsu, China; Cayman registered issuer", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "CSSC Special Gas", "PERIC", "派瑞特气" ], "brands": [], "canonical_legal_name_cn": "中船（邯郸）派瑞特种气体股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-cssc-handan-peric-special-gases", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-cssc-handan-peric-special-gases", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-peric-special-gases-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "electronic specialty gases", "semiconductor materials" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "ee17eca06f848daa69544ca59ce765c94e0fccf5dbeb39e5d6e0f1834b2c45ca", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "electronic specialty gases" }, { "field": "supply_chain_layers", "value": "semiconductor materials" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "electronic specialty gases" }, { "field": "supply_chain_layers", "value": "semiconductor materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-peric-special-gases-profile-20260801", "title": "PERIC Special Gases", "publisher": "中船（邯郸）派瑞特种气体股份有限公司", "url": "https://www.pericsg.com/", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Process fit does not prove a named fab, exact grade, qualified layer, capacity allocation or recurring supply edge." ] } ], "entity_reference": { "entity_id": "ent-cssc-handan-peric-special-gases", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "中船（邯郸）派瑞特种气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "中船（邯郸）派瑞特种气体股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Tianyi Cloud resource-pool legal owner (unresolved)" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-ctyun-resource-pool-owner-unresolved", "entity_type": "unresolved_endpoint", "exchange": null, "facility_ids": [ "fac-ctyun-guangzhou6-resource-pool", "fac-ctyun-huabei2-resource-pool", "fac-ctyun-shanghai36-resource-pool" ], "former_names": [], "headquarters": null, "id": "ent-ctyun-resource-pool-owner-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-ctyun-ascend-cloud-20260508", "src-ctyun-cambricon-cloud-20260703" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "cloud_infrastructure" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "34a6e0633b9bee596c376a3d72c62c6f87576b5e700447670d652e9501d19d10", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "cloud_infrastructure" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "cloud_infrastructure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] }, { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-07-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-ctyun-resource-pool-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [ "fac-ctyun-guangzhou6-resource-pool", "fac-ctyun-huabei2-resource-pool", "fac-ctyun-shanghai36-resource-pool" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "CXMT", "长鑫存储", "ChangXin Memory Technologies" ], "brands": [], "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "canonical_legal_name_en": "CXMT Corporation", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-cxmt-corp", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Hefei, Anhui, China", "id": "ent-cxmt-corp", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private_mixed", "parent_entity_id": null, "process_ids": [ "proc-lithography-immersion-arf" ], "product_ids": [ "prod-cxmt-cxmq3a4ma4gr7-cj1-a-new", "prod-cxmt-ddr5", "prod-cxmt-lpddr5-12gb", "prod-cxmt-lpddr5x" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-cxmt-sse-prospectus-2026", "src-cxmt-official-products-2026" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-cxmt-product-hefei" ], "supply_chain_layers": [ "memory", "wafer_fabrication" ], "ticker": "688825", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "195942142a264a268106bd05df299a2955d4ff3f4dc7988da10959b15d3627e9", "stage_ids": [ "logic_foundry_process", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer_fabrication" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "memory" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "memory" }, { "field": "supply_chain_layers", "value": "wafer_fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cxmt-sse-prospectus-2026", "title": "长鑫科技集团股份有限公司首次公开发行股票并在科创板上市招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202605/002170_20260527_23QQ.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-05-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The issuer names no packaging OSAT legal entity.", "The filing has no HBM literal hit and no HBM product, stack, facility, customer, qualification, yield or shipment receipt.", "Absence in this filing is not proof that no private R&D exists." ] }, { "source_id": "src-cxmt-official-products-2026", "title": "CXMT - Products", "publisher": "CXMT Corporation", "url": "https://www.cxmt.com/en/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio statement does not prove a particular customer, wafer capacity, yield, or shipment volume." ] } ], "entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private_mixed", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Hefei, Anhui, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "长鑫产品合肥", "CXMT Product Hefei" ], "brands": [], "canonical_legal_name_cn": "长鑫存储产品（合肥）有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-cxmt-product-hefei", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-cxmt-product-hefei-test" ], "former_names": [], "headquarters": "8 Zipengshan Road, Feixi Economic Development Zone, Hefei, Anhui, China", "id": "ent-cxmt-product-hefei", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-cxmt-corp", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": "91340123MA8PN0YKXR", "source_ids": [ "src-cxmt-sse-prospectus-2026" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "dram_test" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "5d6a5b45c359d0a45c26da9a2b7394c80b9afedb9aae7893ff95cfd33f563593", "stage_ids": [ "memory_manufacturer", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "dram_test" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "dram_test" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "dram_test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cxmt-sse-prospectus-2026", "title": "长鑫科技集团股份有限公司首次公开发行股票并在科创板上市招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202605/002170_20260527_23QQ.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-05-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The issuer names no packaging OSAT legal entity.", "The filing has no HBM literal hit and no HBM product, stack, facility, customer, qualification, yield or shipment receipt.", "Absence in this filing is not proof that no private R&D exists." ] } ], "entity_reference": { "entity_id": "ent-cxmt-product-hefei", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "长鑫存储产品（合肥）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "长鑫存储产品（合肥）有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-cxmt-corp", "state_parent": null }, "geography": { "headquarters": "8 Zipengshan Road, Feixi Economic Development Zone, Hefei, Anhui, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-cxmt-product-hefei-test" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "大普微", "DapuStor" ], "brands": [ "DapuStor" ], "canonical_legal_name_cn": "深圳大普微电子股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dapustor", "entity_type": "company", "exchange": "Shenzhen Stock Exchange ChiNext", "facility_ids": [], "former_names": [ "深圳大普微电子科技有限公司" ], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-dapustor", "identity_resolution_state": "chinese_identity_closed_official_english_name_open", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dapustor-investor", "src-dapustor-rename" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "301666", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "7a5380a3b0632886894b864afad27310735804b86cf59017ff0cd1f89b7b8cf8", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dapustor-investor", "title": "基本信息", "publisher": "深圳大普微电子股份有限公司", "url": "https://www.dapustor.com/investor.html", "source_type": "official_company_page", "primary_status": "primary", "publication_date": "2026-04-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No official English legal name is printed." ] }, { "source_id": "src-dapustor-rename", "title": "动态丨更名“深圳大普微电子股份有限公司”", "publisher": "深圳大普微电子股份有限公司", "url": "https://www.dapustor.com/news/96.html", "source_type": "official_company_release", "primary_status": "primary", "publication_date": "2023-09-15", "date_checked": "2026-07-29", "access_state": "open", "limitations": [] } ], "entity_reference": { "entity_id": "ent-dapustor", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "深圳大普微电子股份有限公司", "identity_resolution_state": "chinese_identity_closed_official_english_name_open", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "深圳大普微电子股份有限公司", "identity_resolution_state": "chinese_identity_closed_official_english_name_open" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "德邦科技", "Darbond Technology" ], "brands": [ "Darbond" ], "canonical_legal_name_cn": "烟台德邦科技股份有限公司", "canonical_legal_name_en": "Yantai Darbond Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-darbond", "entity_type": "company", "exchange": "Shanghai Stock Exchange STAR Market", "facility_ids": [], "former_names": [], "headquarters": "Yantai, Shandong, China", "id": "ent-darbond", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-darbond-profile" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "688035", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "a7d4299cb12dae65f0c4531283f2388f384f80bb6a8cb465a7f08db3b134dc4b", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-darbond-profile", "title": "Company Profile", "publisher": "Yantai Darbond Technology Co., Ltd.", "url": "https://www.darbond.com/en/index.php/List/index/cid/9.html", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [] } ], "entity_reference": { "entity_id": "ent-darbond", "record_level": "company", "canonical_legal_name_en": "Yantai Darbond Technology Co., Ltd.", "canonical_legal_name_cn": "烟台德邦科技股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Yantai Darbond Technology Co., Ltd.", "canonical_legal_name_cn": "烟台德邦科技股份有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Yantai, Shandong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "比亚迪半导体", "BYD Semiconductor" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dd-byd-semiconductor-unresolved", "entity_type": "brand_or_unresolved_endpoint", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": null, "id": "ent-dd-byd-semiconductor-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-dd-byd-1500v-sic-chip", "prod-dd-byd-1500v-sic-module" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dd-byd-001" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "sic_power_semiconductors" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "829360b82e1de74addca499ab226e9ce3bc3477b31e22c747a9ba3cfe67d0c2a", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "sic_power_semiconductors" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "sic_power_semiconductors" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-byd-001", "title": "全球首款批量装车1500V高耐压大功率SiC芯片 助力全球最强超级e平台", "publisher": "比亚迪股份有限公司", "url": "https://www.byd.com/cn/news/2025/detail569", "source_type": "official_corporate_technical_announcement", "primary_status": "primary", "publication_date": "2025-03-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No fab, substrate/epitaxy supplier, equipment/material supplier, capacity, output, yield, vehicle count or independent reliability." ] } ], "entity_reference": { "entity_id": "ent-dd-byd-semiconductor-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [], "brands": [], "canonical_legal_name_cn": "联通数字科技有限公司", "canonical_legal_name_en": "China Unicom Digital Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dd-cu-digital", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-dd-cu-digital", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_owned_subsidiary", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dd-cu-001" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "cloud_services", "ai_infrastructure" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "eaf9c70891fa4ff45a017ed196a3cfec83e8f05ad98e895f907c01404bbf17f3", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "cloud_services" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "cloud_services" }, { "field": "supply_chain_layers", "value": "ai_infrastructure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-cu-001", "title": "2025年中国联通通用服务器集中采购项目中标候选人公示", "publisher": "中国联通采购与招标网", "url": "https://www.chinaunicombidding.cn/bidInformation/detail?id=1971600438168158208", "source_type": "official_customer_tender_candidate_notice", "primary_status": "primary", "publication_date": "2025-09-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Candidate notice only; no final award, framework, order, model, share, delivery, installation or acceptance." ] } ], "entity_reference": { "entity_id": "ent-dd-cu-digital", "record_level": "company", "canonical_legal_name_en": "China Unicom Digital Technology Co., Ltd.", "canonical_legal_name_cn": "联通数字科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "China Unicom Digital Technology Co., Ltd.", "canonical_legal_name_cn": "联通数字科技有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_owned_subsidiary", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [], "brands": [], "canonical_legal_name_cn": "中国联合网络通信有限公司广东省分公司", "canonical_legal_name_en": "China United Network Communications Corporation Limited Guangdong Branch", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dd-cu-guangdong-branch", "entity_type": "branch", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Guangdong, China", "id": "ent-dd-cu-guangdong-branch", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_owned_branch", "parent_entity_id": "ent-dd-cu-operating", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dd-cu-002" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "telecom", "ai_infrastructure" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "c9b7154f1d59060650f00e0871de41a6b2677c77fa0043bcf60696130d4f01dc", "stage_ids": [ "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "telecom" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "telecom" }, { "field": "supply_chain_layers", "value": "ai_infrastructure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-cu-002", "title": "2025年中国联通广东智算中心资源池工程采购项目（二期）（人工智能服务器）直接采购评审结果公示", "publisher": "中国联通采购与招标网", "url": "https://www.chinaunicombidding.cn/bidInformation/detail?id=2082004955862970368", "source_type": "official_customer_direct_procurement_candidate_notice", "primary_status": "primary", "publication_date": "2026-07-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Candidate is not final award, contract, order, delivery, installation, acceptance or named-chip qualification." ] } ], "entity_reference": { "entity_id": "ent-dd-cu-guangdong-branch", "record_level": "branch", "canonical_legal_name_en": "China United Network Communications Corporation Limited Guangdong Branch", "canonical_legal_name_cn": "中国联合网络通信有限公司广东省分公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "branch", "canonical_legal_name_en": "China United Network Communications Corporation Limited Guangdong Branch", "canonical_legal_name_cn": "中国联合网络通信有限公司广东省分公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_owned_branch", "parent_entity_id": "ent-dd-cu-operating", "state_parent": null }, "geography": { "headquarters": "Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "China Unicom", "中国联通" ], "brands": [], "canonical_legal_name_cn": "中国联合网络通信有限公司", "canonical_legal_name_en": "China United Network Communications Corporation Limited", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dd-cu-operating", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-dd-cu-operating", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_owned", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dd-cu-001", "src-dd-cu-003" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-dd-cu-guangdong-branch" ], "supply_chain_layers": [ "telecom", "ai_infrastructure" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "8a6c16a4530bab2ab45acc328eb85ef9d5262d57bcb65198682abd7f45555a6d", "stage_ids": [ "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "telecom" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "telecom" }, { "field": "supply_chain_layers", "value": "ai_infrastructure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-cu-001", "title": "2025年中国联通通用服务器集中采购项目中标候选人公示", "publisher": "中国联通采购与招标网", "url": "https://www.chinaunicombidding.cn/bidInformation/detail?id=1971600438168158208", "source_type": "official_customer_tender_candidate_notice", "primary_status": "primary", "publication_date": "2025-09-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Candidate notice only; no final award, framework, order, model, share, delivery, installation or acceptance." ] }, { "source_id": "src-dd-cu-003", "title": "2026年中国联通云智业务智算资源池设备及集成安装服务招标公告", "publisher": "中国联通采购与招标网", "url": "https://www.chinaunicombidding.cn/bidInformation/detail?id=2080612123361193984", "source_type": "official_customer_tender_notice", "primary_status": "primary", "publication_date": "2026-07-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Tender only; no bidder, awardee, contract, model, exact facility, delivery, installation or acceptance." ] } ], "entity_reference": { "entity_id": "ent-dd-cu-operating", "record_level": "company", "canonical_legal_name_en": "China United Network Communications Corporation Limited", "canonical_legal_name_cn": "中国联合网络通信有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "China United Network Communications Corporation Limited", "canonical_legal_name_cn": "中国联合网络通信有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_owned", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Hubei Dongjun", "湖北东峻" ], "brands": [], "canonical_legal_name_cn": "湖北东峻汽车电子科技有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dd-dongjun-hubei", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-dd-dongjun-hubei" ], "former_names": [], "headquarters": "Hubei, China", "id": "ent-dd-dongjun-hubei", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unknown", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dd-auto-002", "src-dd-auto-003" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "automotive_system_manufacturing" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "0ef97822c868be8c81143a43de694dd1b9a2c9e7331df218129de6b2a1b69067", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive_system_manufacturing" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "automotive_system_manufacturing" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-002", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2023-09-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ] }, { "source_id": "src-dd-auto-003", "title": "安托拉1000 Pro量产交付相关政务记录", "publisher": "武汉经济技术开发区", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202309/t20230927_2272685.html", "source_type": "government_company_event_record", "primary_status": "primary", "publication_date": "2023-09-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Company-attributed government record, not an independent production audit." ] } ], "entity_reference": { "entity_id": "ent-dd-dongjun-hubei", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "湖北东峻汽车电子科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "湖北东峻汽车电子科技有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unknown", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Hubei, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-dd-dongjun-hubei" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Hubei Dongjun production-line legal owner (unresolved)" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dd-dongjun-site-owner-unresolved", "entity_type": "unresolved_endpoint", "exchange": null, "facility_ids": [ "fac-dd-dongjun-hubei" ], "former_names": [], "headquarters": null, "id": "ent-dd-dongjun-site-owner-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dd-auto-002", "src-dd-auto-003" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "automotive_system_manufacturing" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "8b2d75fd1c4e46f89344617cd56a76713e58dbed84641e2a8a49f0d738510d32", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive_system_manufacturing" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "automotive_system_manufacturing" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-002", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2023-09-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ] }, { "source_id": "src-dd-auto-003", "title": "安托拉1000 Pro量产交付相关政务记录", "publisher": "武汉经济技术开发区", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202309/t20230927_2272685.html", "source_type": "government_company_event_record", "primary_status": "primary", "publication_date": "2023-09-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Company-attributed government record, not an independent production audit." ] } ], "entity_reference": { "entity_id": "ent-dd-dongjun-site-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [ "fac-dd-dongjun-hubei" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "ECARX", "亿咖通" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": "ECARX Holdings Inc.", "completion_state": "source_backed", "countries_of_operation": [ "unknown", "China" ], "country_of_ownership": "unknown", "entity_id": "ent-dd-ecarx-holdings", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Mainland operating entity unresolved", "id": "ent-dd-ecarx-holdings", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_or_unresolved_control", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-dd-antora-1000-pro" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dd-auto-002", "src-dd-auto-007", "src-dd-auto-008" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "automotive_compute_platforms", "automotive_software" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "cdbc625c39511fb126f595eae3bce96a41157747b6ffe293250d6c6503baeda8", "stage_ids": [ "board_system", "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive_compute_platforms" }, { "field": "supply_chain_layers", "value": "automotive_software" } ] }, { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive_software" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "automotive_compute_platforms" }, { "field": "supply_chain_layers", "value": "automotive_software" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-002", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2023-09-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ] }, { "source_id": "src-dd-auto-007", "title": "ECARX to Power Launch of First Hongqi Model Under Strategic Partnership with FAW, Debuting AutoGPT with DeepSeek-R1 Integration", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-power-launch-first-hongqi-model-under-strategic", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2025-02-11", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-origin release; no vehicle deliveries, contract, chip shipment, foundry or OSAT." ] }, { "source_id": "src-dd-auto-008", "title": "ECARX Antora 1000 Pro", "publisher": "ECARX", "url": "https://www.ecarxgroup.com/ecarx-antora-1000-pro/", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue specifications do not prove vehicle shipments, yield, foundry or package." ] } ], "entity_reference": { "entity_id": "ent-dd-ecarx-holdings", "record_level": "company", "canonical_legal_name_en": "ECARX Holdings Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "ECARX Holdings Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "unknown", "ownership_type": "foreign_or_unresolved_control", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Mainland operating entity unresolved", "countries_of_operation": [ "unknown", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "FAW Group Co., Ltd.", "中国一汽", "红旗" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dd-faw-endpoint-unresolved", "entity_type": "brand_or_unresolved_endpoint", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": null, "id": "ent-dd-faw-endpoint-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-dd-hongqi-tiangong-05" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dd-auto-006", "src-dd-auto-007" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "automotive" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "361a915e03014c96cb31974997a2c376a6555fbbad0e931e706ff021de7d1fe3", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "automotive" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-006", "title": "红旗研发新视界：天工05", "publisher": "中国一汽", "url": "https://www.faw.com.cn/fawcn/5133331/5642305/5833080/index.html", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2025-02-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The customer does not name the chip/platform vendor or delivery count." ] }, { "source_id": "src-dd-auto-007", "title": "ECARX to Power Launch of First Hongqi Model Under Strategic Partnership with FAW, Debuting AutoGPT with DeepSeek-R1 Integration", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-power-launch-first-hongqi-model-under-strategic", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2025-02-11", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-origin release; no vehicle deliveries, contract, chip shipment, foundry or OSAT." ] } ], "entity_reference": { "entity_id": "ent-dd-faw-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Lynk & Co", "领克" ], "brands": [], "canonical_legal_name_cn": "领克汽车销售有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dd-lynk-sales", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-dd-lynk-sales", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-dd-lynk08-2023", "prod-dd-lynk08-2025-refresh" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dd-auto-001", "src-dd-auto-005" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "automotive" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "9fcc4f429ac892a9445748feee1b8523f863d99e0af84c4deff9e6aaf528ce53", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "automotive" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-001", "title": "领克携手魅族探索移动出行智能化，全方位共创「无界」超级生态", "publisher": "领克汽车销售有限公司", "url": "https://www.lynkco.com.cn/brand/news/newslist/2023/1117", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2023-03-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No vehicle shipment count, direct chip purchase, foundry, package, OSAT or yield." ] }, { "source_id": "src-dd-auto-005", "title": "全新有为 进阶无界，全新领克08 EM-P 15.98万元起正式上市", "publisher": "领克汽车销售有限公司", "url": "https://www.lynkco.com.cn/brand/news/newslist/2025news/0924", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2025-09-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Near-150,000 family users span generations and cannot be assigned to the earlier SE1000 configuration." ] } ], "entity_reference": { "entity_id": "ent-dd-lynk-sales", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "领克汽车销售有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "领克汽车销售有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Lynk Yuyao plant owner/operator (unresolved)" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dd-lynk-yuyao-owner-unresolved", "entity_type": "unresolved_endpoint", "exchange": null, "facility_ids": [ "fac-dd-lynk-yuyao" ], "former_names": [], "headquarters": null, "id": "ent-dd-lynk-yuyao-owner-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dd-auto-002", "src-dd-auto-003" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "automotive_manufacturing" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "13547746e1679c165fb4c45ab598d7b18a8652771631a52c5c3ea6c7ab079cc9", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive_manufacturing" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "automotive_manufacturing" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-002", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2023-09-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ] }, { "source_id": "src-dd-auto-003", "title": "安托拉1000 Pro量产交付相关政务记录", "publisher": "武汉经济技术开发区", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202309/t20230927_2272685.html", "source_type": "government_company_event_record", "primary_status": "primary", "publication_date": "2023-09-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Company-attributed government record, not an independent production audit." ] } ], "entity_reference": { "entity_id": "ent-dd-lynk-yuyao-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [ "fac-dd-lynk-yuyao" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "POCO", "Xiaomi Global" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dd-poco-global-operator-unresolved", "entity_type": "brand_or_unresolved_endpoint", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": null, "id": "ent-dd-poco-global-operator-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-dd-poco-c71" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dd-mobile-001", "src-dd-mobile-002", "src-dd-mobile-003", "src-dd-mobile-004" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "smartphones" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "55173464f96cd5cf6b16f514ee2033c9f6dfc744e3e72e31342d110c5841d333", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "smartphones" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "smartphones" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-mobile-001", "title": "POCO C71", "publisher": "Xiaomi Global", "url": "https://www.mi.com/global/product/poco-c71/", "source_type": "official_customer_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No direct purchase path, SoC quantity, foundry, package or OSAT." ] }, { "source_id": "src-dd-mobile-002", "title": "POCO C71 Specs", "publisher": "Xiaomi Global", "url": "https://www.mi.com/global/product/poco-c71/specs/", "source_type": "official_customer_specification_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Memory type is stated but memory and eMMC suppliers are not." ] }, { "source_id": "src-dd-mobile-003", "title": "POCO C71 FAQ", "publisher": "Xiaomi Global Support", "url": "https://www.mi.com/global/support/faq/details/KA-559836/", "source_type": "official_customer_support_bom_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier strings are brands/abbreviations; legal entities, lot shares and direct purchasing are unresolved." ] }, { "source_id": "src-dd-mobile-004", "title": "Xiaomi 12.12 Mega Sale 2025", "publisher": "Xiaomi Singapore", "url": "https://www.mi.com/sg/support/terms/xiaomi-12-12-mega-sale-2025/", "source_type": "official_retail_terms", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Commercial offer and shipping availability do not prove completed sales or volume." ] } ], "entity_reference": { "entity_id": "ent-dd-poco-global-operator-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "SiEngine", "芯擎科技", "DragonHawk" ], "brands": [], "canonical_legal_name_cn": "湖北芯擎科技有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dd-siengine-hubei", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Hubei, China", "id": "ent-dd-siengine-hubei", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-dd-se1000" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dd-auto-002", "src-dd-auto-004" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "automotive_socs" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "651a1915c322b3c00dc51959c7a2409c6b8acb3a989c6e70ff5661ac8c1fbc12", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive_socs" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive_socs" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "automotive_socs" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-002", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2023-09-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ] }, { "source_id": "src-dd-auto-004", "title": "芯擎科技与龙鹰一号相关政务记录", "publisher": "武汉经济技术开发区", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202304/t20230423_2190472.html", "source_type": "government_company_identity_and_product_record", "primary_status": "primary", "publication_date": "2023-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, OSAT, delivered-chip quantity or vehicle volume." ] } ], "entity_reference": { "entity_id": "ent-dd-siengine-hubei", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "湖北芯擎科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "湖北芯擎科技有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Hubei, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "UNISOC", "紫光展锐" ], "brands": [], "canonical_legal_name_cn": "紫光展锐（上海）科技有限公司", "canonical_legal_name_en": "UNISOC (Shanghai) Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dd-unisoc-shanghai", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-dd-unisoc-shanghai", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-dd-unisoc-t7250" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dd-mobile-005", "src-dd-mobile-006", "src-dd-mobile-007", "src-dd-mobile-008" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "smartphone_socs", "modems" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "03e38a765755ccdb2ab617154cec938e218ea40aab8f1ba9bc19dc9a3e343cda", "stage_ids": [ "architecture_ip", "board_system", "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "smartphone_socs" }, { "field": "supply_chain_layers", "value": "modems" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "smartphone_socs" } ] }, { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "modems" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "smartphone_socs" }, { "field": "supply_chain_layers", "value": "modems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-mobile-005", "title": "T7250", "publisher": "紫光展锐", "url": "https://www.unisoc.com/cn/product/SmartPhone/T7250", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, Xiaomi-specific certification or volume." ] }, { "source_id": "src-dd-mobile-006", "title": "T7250", "publisher": "UNISOC", "url": "https://www.unisoc.com/en/product/SmartPhone/T7250", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, Xiaomi-specific certification or volume." ] }, { "source_id": "src-dd-mobile-007", "title": "联系我们", "publisher": "紫光展锐", "url": "https://www.unisoc.com/cn/about/contact-us", "source_type": "official_company_identity_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Identity only; not a direct Xiaomi purchase receipt." ] }, { "source_id": "src-dd-mobile-008", "title": "Contact Us", "publisher": "UNISOC", "url": "https://www.unisoc.com/en/about/contact-us", "source_type": "official_company_identity_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Identity only; not a direct Xiaomi purchase receipt." ] } ], "entity_reference": { "entity_id": "ent-dd-unisoc-shanghai", "record_level": "company", "canonical_legal_name_en": "UNISOC (Shanghai) Technology Co., Ltd.", "canonical_legal_name_cn": "紫光展锐（上海）科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "UNISOC (Shanghai) Technology Co., Ltd.", "canonical_legal_name_cn": "紫光展锐（上海）科技有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "ZTE", "中兴通讯" ], "brands": [], "canonical_legal_name_cn": "中兴通讯股份有限公司", "canonical_legal_name_en": "ZTE Corporation", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dd-zte", "entity_type": "company", "exchange": "SZSE / HKEX", "facility_ids": [], "former_names": [], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-dd-zte", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public_mixed", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dd-cu-002" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "telecom_systems", "servers" ], "ticker": "000063 / 00763", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "6f226524680716b14e17b91c75e097b149e11bd4872249056df56fcb0d01d342", "stage_ids": [ "board_system", "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "telecom_systems" }, { "field": "supply_chain_layers", "value": "servers" } ] }, { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "telecom_systems" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "telecom_systems" }, { "field": "supply_chain_layers", "value": "servers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-cu-002", "title": "2025年中国联通广东智算中心资源池工程采购项目（二期）（人工智能服务器）直接采购评审结果公示", "publisher": "中国联通采购与招标网", "url": "https://www.chinaunicombidding.cn/bidInformation/detail?id=2082004955862970368", "source_type": "official_customer_direct_procurement_candidate_notice", "primary_status": "primary", "publication_date": "2026-07-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Candidate is not final award, contract, order, delivery, installation, acceptance or named-chip qualification." ] } ], "entity_reference": { "entity_id": "ent-dd-zte", "record_level": "company", "canonical_legal_name_en": "ZTE Corporation", "canonical_legal_name_cn": "中兴通讯股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "ZTE Corporation", "canonical_legal_name_cn": "中兴通讯股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public_mixed", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Shanghai Oriental Computing Technology", "Shanghai Orient Computing Core Technology", "Orient Silicon", "Dongfang Suanxin", "DFSX" ], "brands": [], "canonical_legal_name_cn": "上海东方算芯科技有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dfsx", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-dfsx", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [ "proc-chip-architecture" ], "product_ids": [ "prod-dfsx-df1000", "prod-dfsx-hs512", "prod-dfsx-qy100", "prod-dfsx-ty64" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dfsx-df1000-product-2026", "src-dfsx-3d-near-memory-2026" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "ai_accelerator", "systems", "software" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "99191a7cb7ad50a68772c6a2095a1efdd43004d611063c4fa6f6f425c785e5dd", "stage_ids": [ "architecture_ip", "board_system", "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "ai_accelerator" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "systems" } ] }, { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "software" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "ai_accelerator" }, { "field": "supply_chain_layers", "value": "systems" }, { "field": "supply_chain_layers", "value": "software" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dfsx-df1000-product-2026", "title": "DF1000 AI Accelerator", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/products/ai-accelerator/df1000", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor page exposes no independent workload receipt, memory supplier, foundry, package yield, power, customer, or shipment volume." ] }, { "source_id": "src-dfsx-3d-near-memory-2026", "title": "3D Near-Memory Computing", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/technology/3d-near-memory-computing", "source_type": "company_technology_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported architecture; no bond pitch, memory die source, layer count, yield, or independent test." ] } ], "entity_reference": { "entity_id": "ent-dfsx", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海东方算芯科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海东方算芯科技有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Digital China Group", "神州数码" ], "brands": [], "canonical_legal_name_cn": "神州数码集团股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-digital-china-group", "entity_type": "company", "exchange": "SZSE", "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-digital-china-group", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-digital-china-cmcc-framework-20240824", "src-digital-china-chinatelecom-framework-20250423", "src-digital-china-2025-annual-summary-20260331" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-beijing-digital-china-yunke", "ent-shenzhou-kuntai-xiamen" ], "supply_chain_layers": [ "systems", "distribution" ], "ticker": "000034", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "06950c2acebd248bfdddd98d14b0068957d1bbabff3c85e5d53639cb48e97f5f", "stage_ids": [ "board_system", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "systems" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "distribution" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "systems" }, { "field": "supply_chain_layers", "value": "distribution" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-digital-china-cmcc-framework-20240824", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2024-08/24/content_1957609.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2024-08-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "842 is a framework award ceiling, not an actual order, shipment, installation or acceptance count.", "Server model, accelerator/CPU/memory/NIC BOM, facility, value, serial and asset receipt are undisclosed." ] }, { "source_id": "src-digital-china-chinatelecom-framework-20250423", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2025-04/23/content_2053613.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Framework award value is not ordered, delivered or accepted value.", "Server models, CPU/accelerator vendor and part numbers, memory/NIC BOM, quantity, receiving affiliate/facility and test receipt are undisclosed." ] }, { "source_id": "src-digital-china-2025-annual-summary-20260331", "title": "神州数码集团股份有限公司2025年年度报告摘要", "publisher": "神州数码集团股份有限公司", "url": "https://paper.cnstock.com/html/2026-03/31/content_2194300.htm", "source_type": "exchange_filing_summary", "primary_status": "primary", "publication_date": "2026-03-31", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal-name/alias resolution only; no product, order, delivery or acceptance state." ] } ], "entity_reference": { "entity_id": "ent-digital-china-group", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "神州数码集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "神州数码集团股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Dosilicon", "东芯股份" ], "brands": [], "canonical_legal_name_cn": "东芯半导体股份有限公司", "canonical_legal_name_en": "Dosilicon Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-dosilicon", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-dosilicon", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dosilicon-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "fabless chip design", "nand memory", "nor memory", "dram memory" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "3ee661b6dd12fdad42c7a14eee1d6c6180e6cd8842ffadd24141db280d94a521", "stage_ids": [ "design_company", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "fabless chip design" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "nand memory" }, { "field": "supply_chain_layers", "value": "nor memory" }, { "field": "supply_chain_layers", "value": "dram memory" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "fabless chip design" }, { "field": "supply_chain_layers", "value": "nand memory" }, { "field": "supply_chain_layers", "value": "nor memory" }, { "field": "supply_chain_layers", "value": "dram memory" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dosilicon-profile-20260801", "title": "Dosilicon", "publisher": "Dosilicon Co., Ltd.", "url": "https://www.dosilicon.com/", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "The source supports a fabless memory-product company; it does not establish memory-wafer fabrication or a named foundry." ] } ], "entity_reference": { "entity_id": "ent-dosilicon", "record_level": "company", "canonical_legal_name_en": "Dosilicon Co., Ltd.", "canonical_legal_name_cn": "东芯半导体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Dosilicon Co., Ltd.", "canonical_legal_name_cn": "东芯半导体股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Empyrean", "华大九天" ], "brands": [], "canonical_legal_name_cn": "北京华大九天科技股份有限公司", "canonical_legal_name_en": "Empyrean Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-empyrean", "entity_type": "company", "exchange": "SZSE ChiNext", "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-empyrean", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-empyrean-polas" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-empyrean-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "eda" ], "ticker": "301269", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "6870b0be6f7a6c6b2d7fd065776e855341a13deb649516e4dd151cad423cf2b4", "stage_ids": [ "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "eda" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "eda" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-empyrean-annual-2025", "title": "北京华大九天科技股份有限公司2025年年度报告", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-28/1225215590.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio disclosure does not establish a successful advanced-node tapeout, named PDK, or independent parity." ] } ], "entity_reference": { "entity_id": "ent-empyrean", "record_level": "company", "canonical_legal_name_en": "Empyrean Technology Co., Ltd.", "canonical_legal_name_cn": "北京华大九天科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Empyrean Technology Co., Ltd.", "canonical_legal_name_cn": "北京华大九天科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Enflame", "燧原科技" ], "brands": [], "canonical_legal_name_cn": "上海燧原科技股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-enflame", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-enflame", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [ "proc-chip-ai-accelerator" ], "product_ids": [ "prod-enflame-t20-t21" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-enflame-csrc-approval-20260709", "src-enflame-t20-t21-20210709" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "accelerators" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "a7826663250715b17e1a57ae982bdc5a94c66952f8e43bc74eae846e7412dc05", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "accelerators" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "accelerators" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_and_secondary", "source_refs": [ { "source_id": "src-enflame-csrc-approval-20260709", "title": "关于同意上海燧原科技股份有限公司首次公开发行股票注册的批复", "publisher": "中国证券监督管理委员会", "url": "https://www.csrc.gov.cn/csrc/c105906/c7644477/content.shtml", "source_type": "government_regulatory_approval", "primary_status": "primary", "publication_date": "2026-07-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal entity and registration approval only; no product or manufacturing receipt." ] }, { "source_id": "src-enflame-t20-t21-20210709", "title": "燧原科技发布云燧T20、T21", "publisher": "人民网转载中国电子报", "url": "https://finance.people.com.cn/n1/2021/0709/c1004-32153321.html", "source_type": "reputable_reporting", "primary_status": "secondary", "publication_date": "2021-07-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Future production plan; no later primary closing receipt, foundry, OSAT, HBM supplier, customer or shipment." ] } ], "entity_reference": { "entity_id": "ent-enflame", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海燧原科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海燧原科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Espressif", "Espressif Systems", "乐鑫", "乐鑫科技" ], "brands": [ "Espressif" ], "canonical_legal_name_cn": "乐鑫信息科技（上海）股份有限公司", "canonical_legal_name_en": "Espressif Systems (Shanghai) Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-espressif", "entity_type": "company", "exchange": "Shanghai Stock Exchange STAR Market", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-espressif", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-espressif-footer", "src-espressif-sse-snapshot", "src-xmc-espressif-cooperation" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "connectivity_chips", "mcu" ], "ticker": "688018", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "7d061f83d1129eb2b9aaeca45d03abc4b70525003577b2a3658b83423612ecb6", "stage_ids": [ "architecture_ip", "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "connectivity_chips" }, { "field": "supply_chain_layers", "value": "mcu" } ] }, { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "connectivity_chips" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "connectivity_chips" }, { "field": "supply_chain_layers", "value": "mcu" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-espressif-footer", "title": "Espressif official website legal footer", "publisher": "乐鑫信息科技（上海）股份有限公司", "url": "https://www.espressif.com/zh-hans/company/investor-relations/investor-inquiries", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [] }, { "source_id": "src-espressif-sse-snapshot", "title": "688018 Company Overview", "publisher": "上海证券交易所", "url": "https://www.sse.com.cn/star/en/marketdata/snapshot/c/5550511.shtml", "source_type": "exchange_record", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [] }, { "source_id": "src-xmc-espressif-cooperation", "title": "武汉新芯与乐鑫科技达成战略合作", "publisher": "武汉新芯集成电路制造有限公司", "url": "https://www.xmcwh.com/site/details/123?details=1", "source_type": "company_press_release", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Strategic-cooperation statement does not disclose wafer quantity, current program status, yield, or end-product volume." ] } ], "entity_reference": { "entity_id": "ent-espressif", "record_level": "company", "canonical_legal_name_en": "Espressif Systems (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "乐鑫信息科技（上海）股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Espressif Systems (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "乐鑫信息科技（上海）股份有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "兴森科技", "兴森快捷", "Fastprint" ], "brands": [ "Fastprint" ], "canonical_legal_name_cn": "深圳市兴森快捷电路科技股份有限公司", "canonical_legal_name_en": "Shenzhen Fastprint Circuit Tech Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-fastprint", "entity_type": "company", "exchange": "Shenzhen Stock Exchange", "facility_ids": [], "former_names": [], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-fastprint", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-fastprint-listing" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "002436", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "c37460bd9548f70e9aa4528094802ba65ea6be31ea6b17a3958e92a887105d5a", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-fastprint-listing", "title": "兴森快捷成功上市", "publisher": "深圳市兴森快捷电路科技股份有限公司", "url": "https://www.chinafastprint.com/news/detail/4929", "source_type": "official_company_release", "primary_status": "primary", "publication_date": "2010-07-05", "date_checked": "2026-07-29", "access_state": "open", "limitations": [] } ], "entity_reference": { "entity_id": "ent-fastprint", "record_level": "company", "canonical_legal_name_en": "Shenzhen Fastprint Circuit Tech Co., Ltd.", "canonical_legal_name_cn": "深圳市兴森快捷电路科技股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shenzhen Fastprint Circuit Tech Co., Ltd.", "canonical_legal_name_cn": "深圳市兴森快捷电路科技股份有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Shenji", "神玑" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": "GeniTech Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-genitech", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact legal domicile unresolved", "id": "ent-genitech", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-nio-inc", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-nio-genitech-investment-20260226" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "automotive_chip_design" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "9acf65b67fa681c3541c78821a32811cb00c828e3ba436c18037dab561676287", "stage_ids": [ "design_company", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive_chip_design" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive_chip_design" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "automotive_chip_design" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nio-genitech-investment-20260226", "title": "NIO Inc.’s Subsidiary Enters into Definitive Agreements for RMB2.257 Billion Investment", "publisher": "NIO Inc.", "url": "https://ir.nio.com/zh-hans/news-releases/news-release-details/nio-incs-subsidiary-enters-definitive-agreements-rmb2257-billion", "source_type": "company_investor_release", "primary_status": "primary", "publication_date": "2026-02-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The disclosure post-dates ET9 launch and does not establish the historical assignee, designer or manufacturer of each NX9031 die.", "The immediate NIO legal shareholder is unnamed." ] } ], "entity_reference": { "entity_id": "ent-genitech", "record_level": "company", "canonical_legal_name_en": "GeniTech Co., Ltd.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "GeniTech Co., Ltd.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-nio-inc", "state_parent": null }, "geography": { "headquarters": "China; exact legal domicile unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Gentech", "正帆科技" ], "brands": [], "canonical_legal_name_cn": "上海正帆科技股份有限公司", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-gentech", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-gentech", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-gentech-gas-chemical-box" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-gentech-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-hanjing" ], "supply_chain_layers": [ "gas_chemical_delivery", "specialty_gases", "equipment_components" ], "ticker": "688596", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "4bc7888ce7b255012f30134157a2876c53d79ccc2481d6d12c1a6476bc2b24ec", "stage_ids": [ "wafer_equipment", "critical_materials", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "equipment_components" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "gas_chemical_delivery" }, { "field": "supply_chain_layers", "value": "specialty_gases" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "gas_chemical_delivery" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "gas_chemical_delivery" }, { "field": "supply_chain_layers", "value": "specialty_gases" }, { "field": "supply_chain_layers", "value": "equipment_components" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-gentech", "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Juchen", "Giantec", "聚辰股份" ], "brands": [], "canonical_legal_name_cn": "聚辰半导体股份有限公司", "canonical_legal_name_en": "Giantec Semiconductor Corporation", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-giantec-juchen", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-giantec-juchen", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-juchen-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "fabless chip design", "eeprom memory", "nor memory", "nfc chips", "mixed signal chips" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "263b3039f5ea2667ed1102cead31fe866b63000eca0321cb5dbb2d65a1a247b0", "stage_ids": [ "design_company", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "fabless chip design" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "eeprom memory" }, { "field": "supply_chain_layers", "value": "nor memory" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "fabless chip design" }, { "field": "supply_chain_layers", "value": "eeprom memory" }, { "field": "supply_chain_layers", "value": "nor memory" }, { "field": "supply_chain_layers", "value": "nfc chips" }, { "field": "supply_chain_layers", "value": "mixed signal chips" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-juchen-profile-20260801", "title": "Company Profile", "publisher": "聚辰半导体股份有限公司", "url": "https://www.giantec-semi.com/qyjs", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Historical application mentions require product and date limits; no current named supplier/customer edge is created." ] } ], "entity_reference": { "entity_id": "ent-giantec-juchen", "record_level": "company", "canonical_legal_name_en": "Giantec Semiconductor Corporation", "canonical_legal_name_cn": "聚辰半导体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Giantec Semiconductor Corporation", "canonical_legal_name_cn": "聚辰半导体股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "GigaDevice", "兆易创新" ], "brands": [], "canonical_legal_name_cn": "兆易创新科技集团股份有限公司", "canonical_legal_name_en": "GigaDevice Semiconductor Inc.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-gigadevice", "entity_type": "company", "exchange": "SSE", "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-gigadevice", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-gigadevice-cxmt-2026" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "fabless_memory_design", "mcu" ], "ticker": "603986", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "49e012464673f6666933781f5d68c15f343a0cbc052d0da29e2787e37e48e4c2", "stage_ids": [ "design_company", "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "fabless_memory_design" } ] }, { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "mcu" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "fabless_memory_design" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "fabless_memory_design" }, { "field": "supply_chain_layers", "value": "mcu" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gigadevice-cxmt-2026", "title": "兆易创新关于2026年上半年度日常关联交易预计额度的公告", "publisher": "兆易创新科技集团股份有限公司", "url": "https://money.finance.sina.com.cn/corp/view/vCB_AllBulletinDetail.php?id=11930272&stockid=603986", "source_type": "exchange_filing_mirror", "primary_status": "primary", "publication_date": "2026-01-23", "date_checked": "2026-07-29", "access_state": "open_mirror", "limitations": [ "Primary listed-company announcement accessed through a mirror; exact die, fab, process, volume, price and qualification are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-gigadevice", "record_level": "company", "canonical_legal_name_en": "GigaDevice Semiconductor Inc.", "canonical_legal_name_cn": "兆易创新科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "GigaDevice Semiconductor Inc.", "canonical_legal_name_cn": "兆易创新科技集团股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "GlobalFoundries", "GF" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": "GlobalFoundries Inc.", "completion_state": "source_backed", "countries_of_operation": [ "United States", "China" ], "country_of_ownership": "United States", "entity_id": "ent-globalfoundries", "entity_type": "company", "exchange": "NASDAQ", "facility_ids": [], "former_names": [], "headquarters": "Malta, New York, United States", "id": "ent-globalfoundries", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-verisilicon-gf-22fdx-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "foundry" ], "ticker": "GFS", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "4546f268bb5565a3fa6b0622f3e2d7b05a9c0ee84f1143290f3a5cfe2f93e3a5", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "foundry" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "foundry" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-verisilicon-gf-22fdx-2025", "title": "VeriSilicon Introduces FD-SOI Wireless IP Platform", "publisher": "VeriSilicon Microelectronics (Shanghai) Co., Ltd.", "url": "https://www.verisilicon.com/en/PressRelease/WirelessIP", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2025-09-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers and chips are anonymous; facility and shipment split are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-globalfoundries", "record_level": "company", "canonical_legal_name_en": "GlobalFoundries Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "GlobalFoundries Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "United States", "ownership_type": "foreign_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Malta, New York, United States", "countries_of_operation": [ "United States", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "GLOWAY", "光威" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-gloway-brand", "entity_type": "brand", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-gloway-brand", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "brand_identity_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-gloway-yi-pro-2020" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-gloway-cxmt-yipro" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "memory_modules" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "283f67403f133a069a2a2dc0de78be0a261561d2ba4c4243f7310d36a7fe9f4d", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "memory_modules" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "memory_modules" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gloway-cxmt-yipro", "title": "光威品牌发展历程", "publisher": "嘉合劲威", "url": "https://www.gloway.com.cn/pages_29/", "source_type": "company_brand_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Brand history does not quantify SKU-level volumes, current authorization, or all BOM components." ] } ], "entity_reference": { "entity_id": "ent-gloway-brand", "record_level": "brand", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "brand_identity_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Goke Micro", "国科微" ], "brands": [], "canonical_legal_name_cn": "湖南国科微电子股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-goke-microelectronics", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-goke-microelectronics", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-goke-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "fabless chip design", "storage controllers", "storage products" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "99a401cb6435e69c11144aabf7c9b2c6738796781c43a30d94864bb0b245b725", "stage_ids": [ "design_company", "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "fabless chip design" } ] }, { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "storage controllers" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "storage controllers" }, { "field": "supply_chain_layers", "value": "storage products" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "fabless chip design" }, { "field": "supply_chain_layers", "value": "storage controllers" }, { "field": "supply_chain_layers", "value": "storage products" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-goke-annual-2025", "title": "湖南国科微电子股份有限公司2025年年度报告", "publisher": "湖南国科微电子股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-29/1225245415.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-29", "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "No memory-wafer fabrication, named foundry, exact customer or product-level supply relationship is disclosed." ] } ], "entity_reference": { "entity_id": "ent-goke-microelectronics", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "湖南国科微电子股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "湖南国科微电子股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "汇顶科技", "Goodix" ], "brands": [ "Goodix" ], "canonical_legal_name_cn": "深圳市汇顶科技股份有限公司", "canonical_legal_name_en": "Shenzhen Goodix Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-goodix", "entity_type": "company", "exchange": "Shanghai Stock Exchange", "facility_ids": [], "former_names": [], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-goodix", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-goodix-statement" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "603160", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "005cfc4b52c654a4e2ff1e7eefdb04a91f7a5451089d8fbbf1d7cf7a9e2a9efd", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-goodix-statement", "title": "澄清声明", "publisher": "深圳市汇顶科技股份有限公司", "url": "https://www.goodix.com/zh/about_goodix/newsroom/company_news/detail/14328", "source_type": "official_company_release", "primary_status": "primary", "publication_date": "2020-12-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [] } ], "entity_reference": { "entity_id": "ent-goodix", "record_level": "company", "canonical_legal_name_en": "Shenzhen Goodix Technology Co., Ltd.", "canonical_legal_name_cn": "深圳市汇顶科技股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shenzhen Goodix Technology Co., Ltd.", "canonical_legal_name_cn": "深圳市汇顶科技股份有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "GRIKIN", "有研亿金" ], "brands": [], "canonical_legal_name_cn": "有研亿金新材料有限公司", "canonical_legal_name_en": "GRIKIN Advanced Material Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-grikin", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-grikin", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_subsidiary", "parent_entity_id": "ent-grinm-advanced-materials", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-grikin-home", "src-grikin-6n-copper", "src-grikin-evaporation-materials", "src-grinm-grikin-300mm-cu-target-2021" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "high_purity_metals", "sputtering_targets", "evaporation_materials" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "32e1743c6744f0ec26d5f2867c9a7b632bd63913cf99762a0dca43181ece71b9", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "high_purity_metals" }, { "field": "supply_chain_layers", "value": "sputtering_targets" }, { "field": "supply_chain_layers", "value": "evaporation_materials" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "high_purity_metals" }, { "field": "supply_chain_layers", "value": "sputtering_targets" }, { "field": "supply_chain_layers", "value": "evaporation_materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-grikin-home", "title": "有研亿金新材料有限公司", "publisher": "有研亿金新材料有限公司", "url": "https://www.grikin.com/", "source_type": "company_home_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal identity and affiliation only." ] }, { "source_id": "src-grikin-6n-copper", "title": "6N High Purity Copper", "publisher": "GRIKIN Advanced Material Co., Ltd.", "url": "https://www.grikin.com/en/cms/product/9", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer metadata is internally inconsistent: 6N title versus 5N numeric purity; no CoA or named customer." ] }, { "source_id": "src-grikin-evaporation-materials", "title": "蒸发料", "publisher": "有研亿金新材料有限公司", "url": "https://www.grikin.com/article/27", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue only; no named process, customer, qualification, capacity or lot CoA." ] }, { "source_id": "src-grinm-grikin-300mm-cu-target-2021", "title": "有研亿金300mm超高纯铜靶喜获第二届集成电路材料五星产品奖", "publisher": "中国有研科技集团有限公司", "url": "https://www.grinm.com/s/2614-6794-121247.html", "source_type": "state_parent_product_announcement", "primary_status": "primary", "publication_date": "2021-11-15", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers are unnamed; exact purity basis, target drawing, capacity, process layer, shipment quantity and yield are absent." ] } ], "entity_reference": { "entity_id": "ent-grikin", "record_level": "company", "canonical_legal_name_en": "GRIKIN Advanced Material Co., Ltd.", "canonical_legal_name_cn": "有研亿金新材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "GRIKIN Advanced Material Co., Ltd.", "canonical_legal_name_cn": "有研亿金新材料有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_subsidiary", "parent_entity_id": "ent-grinm-advanced-materials", "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "GRINM", "有研新材" ], "brands": [], "canonical_legal_name_cn": "有研新材料股份有限公司", "canonical_legal_name_en": "GRINM Advanced Materials Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-grinm-advanced-materials", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-grinm-advanced-materials", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_linked", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-grikin-home", "src-grinm-grikin-300mm-cu-target-2021" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-grikin" ], "supply_chain_layers": [ "advanced_materials" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "099590f677272a082f272903e87ab7d55149ae0eae7a30724af8767bf40ea2e2", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "advanced_materials" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "advanced_materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-grikin-home", "title": "有研亿金新材料有限公司", "publisher": "有研亿金新材料有限公司", "url": "https://www.grikin.com/", "source_type": "company_home_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal identity and affiliation only." ] }, { "source_id": "src-grinm-grikin-300mm-cu-target-2021", "title": "有研亿金300mm超高纯铜靶喜获第二届集成电路材料五星产品奖", "publisher": "中国有研科技集团有限公司", "url": "https://www.grinm.com/s/2614-6794-121247.html", "source_type": "state_parent_product_announcement", "primary_status": "primary", "publication_date": "2021-11-15", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers are unnamed; exact purity basis, target drawing, capacity, process layer, shipment quantity and yield are absent." ] } ], "entity_reference": { "entity_id": "ent-grinm-advanced-materials", "record_level": "company", "canonical_legal_name_en": "GRINM Advanced Materials Co., Ltd.", "canonical_legal_name_cn": "有研新材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "GRINM Advanced Materials Co., Ltd.", "canonical_legal_name_cn": "有研新材料股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_linked", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Guangdong Tianyu Semiconductor" ], "brands": [], "canonical_legal_name_cn": "广东天域半导体股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-guangdong-tianyu", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Guangdong, China", "id": "ent-guangdong-tianyu", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-huate-gas-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "compound_semiconductor_manufacturing" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "753b81b216eb9e0c6de524e994114c23fcd2f4fa616689fb5fa466821d1ad8f7", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "compound_semiconductor_manufacturing" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "compound_semiconductor_manufacturing" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "entity_reference": { "entity_id": "ent-guangdong-tianyu", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "广东天域半导体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "广东天域半导体股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Guangzhou Gas", "G-Gas", "广钢气体" ], "brands": [], "canonical_legal_name_cn": "广州广钢气体能源股份有限公司", "canonical_legal_name_en": "Guangzhou G-Gas Energy Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-guangzhou-g-gas-energy", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-guangzhou-g-gas-energy", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-ggas-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "electronic bulk gases", "rare gases", "industrial gases" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "9f36ef4a84e386a2392c17ef99aee1d65825794a9c517c4f17a6067b3b7544f1", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "electronic bulk gases" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "electronic bulk gases" }, { "field": "supply_chain_layers", "value": "rare gases" }, { "field": "supply_chain_layers", "value": "industrial gases" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ggas-profile-20260801", "title": "G-Gas", "publisher": "Guangzhou G-Gas Energy Co., Ltd.", "url": "https://en.ggas.com/", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Portfolio capability does not prove installation or qualified supply at a specific fab." ] } ], "entity_reference": { "entity_id": "ent-guangzhou-g-gas-energy", "record_level": "company", "canonical_legal_name_en": "Guangzhou G-Gas Energy Co., Ltd.", "canonical_legal_name_cn": "广州广钢气体能源股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Guangzhou G-Gas Energy Co., Ltd.", "canonical_legal_name_cn": "广州广钢气体能源股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Guowang Optics", "国望光学" ], "brands": [], "canonical_legal_name_cn": "北京国望光学科技有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-guowang-optics", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-guowang-exposure-optics-base" ], "former_names": [], "headquarters": "Beijing, China", "id": "ent-guowang-optics", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_linked", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-guowang-optics-base-2021", "src-guowang-base-production-2024", "src-guowang-hermle-award-2022" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "projection_optics", "equipment_components" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "62c041f16348a8fe261b386edbe8970c85e1e80636d43949d9458d9fd1654d6f", "stage_ids": [ "lithography", "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "projection_optics" } ] }, { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "equipment_components" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "projection_optics" }, { "field": "supply_chain_layers", "value": "equipment_components" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-guowang-optics-base-2021", "title": "投影光刻机曝光光学系统研发及批量生产基地项目", "publisher": "北京市公共资源交易服务平台", "url": "https://ggzyfw.beijing.gov.cn/jylcgcjs/20210114/1340589.html", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2021-01-14", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "15–20 systems/year is a design target, not installed, qualified or actual output." ] }, { "source_id": "src-guowang-base-production-2024", "title": "国望光学曝光光学系统基地竣工投产", "publisher": "国家科技创新中心", "url": "https://www.ncsti.gov.cn/kjdt/scyq/bjjjjskfq/jkdt/202402/t20240219_149260.html", "source_type": "government_industrial_update", "primary_status": "primary", "publication_date": "2024-02-19", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility state only; actual output, model, customer, scanner integration, qualification and yield are not disclosed." ] }, { "source_id": "src-guowang-hermle-award-2022", "title": "北京国望光学科技有限公司五轴立式加工中心项目评标结果公告", "publisher": "商务部机电产品招标投标电子交易平台", "url": "https://chinabidding.mofcom.gov.cn/bidDetail/bidding/bulletin/202206/ff8080817d94c145018145fd60755ec2.html", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2022-06-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Award does not prove delivery, installation, acceptance, current use, the exact optical part processed, service route or spares." ] } ], "entity_reference": { "entity_id": "ent-guowang-optics", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京国望光学科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京国望光学科技有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_linked", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-guowang-exposure-optics-base" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "H3C", "新华三" ], "brands": [], "canonical_legal_name_cn": "新华三技术有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-h3c-technologies", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters not resolved in lane sources", "id": "ent-h3c-technologies", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-h3c-h65-bios-574", "prod-h3c-uniserver-r4930-g3" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-h3c-h65-bios-574-20230804", "src-h3c-r4930g3-product" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "servers", "firmware", "system_integration" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "0beb5a55622fbfbfb63322d9337af5ad3e24610ce85389de46d07fd6d52545e6", "stage_ids": [ "board_system", "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "servers" }, { "field": "supply_chain_layers", "value": "system_integration" } ] }, { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "firmware" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "servers" }, { "field": "supply_chain_layers", "value": "firmware" }, { "field": "supply_chain_layers", "value": "system_integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-h3c-h65-bios-574-20230804", "title": "H3C H65-BIOS-5.74版本说明书", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202308/1903077_30005_0.htm", "source_type": "official_firmware_release_notes", "primary_status": "primary", "publication_date": "2023-08-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Firmware adaptation/support is not a purchase, configured commercial SKU, order, shipment, installation or external qualification.", "The signed binary is named with MD5 eea6fa3e3dc6f629ee8fdaa78932627c; it was not locally archived." ] }, { "source_id": "src-h3c-r4930g3-product", "title": "搭载海光二号的双路服务器H3C UniServer R4930 G3", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/Products_And_Solution/Server/H3C/Products/RackServer/Products_Series/Dualway_Server/R4930_G3/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No exact factory/address, processor SKU by configuration, shipment, customer, installed base, capacity or reliability receipt.", "The all-domestic wording lacks a component-level BOM and origin record." ] } ], "entity_reference": { "entity_id": "ent-h3c-technologies", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "新华三技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "新华三技术有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters not resolved in lane sources", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Lion Micro", "立昂微" ], "brands": [], "canonical_legal_name_cn": "杭州立昂微电子股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-hangzhou-lion-electronics", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-hangzhou-lion-electronics", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-lion-micro-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "semiconductor materials", "power semiconductor design", "wafer fabrication" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "bd374db1a025f013cfe65ec1255421e1b24ef0d6354bf8667b31254da17fbfc8", "stage_ids": [ "design_company", "architecture_ip", "logic_foundry_process", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "power semiconductor design" } ] }, { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "power semiconductor design" } ] }, { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer fabrication" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "semiconductor materials" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "semiconductor materials" }, { "field": "supply_chain_layers", "value": "power semiconductor design" }, { "field": "supply_chain_layers", "value": "wafer fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-lion-micro-profile-20260801", "title": "About Lion Micro", "publisher": "杭州立昂微电子股份有限公司", "url": "https://www.li-on.com/about/", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "No named accelerator product, exact facility, process, customer, order or qualified supply relationship is disclosed." ] } ], "entity_reference": { "entity_id": "ent-hangzhou-lion-electronics", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "杭州立昂微电子股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "杭州立昂微电子股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Hanjing Semiconductor Materials", "辽宁汉京" ], "brands": [], "canonical_legal_name_cn": "辽宁汉京半导体材料有限公司", "canonical_legal_name_en": "Liaoning Hanjing Semiconductor Materials Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-hanjing", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Liaoning, China", "id": "ent-hanjing", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-gentech", "process_ids": [], "product_ids": [ "prod-hanjing-quartz-sic-components" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-gentech-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "quartz", "silicon_carbide_components" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "4e4e45ad708d67f9fe81e898f7bb6f9cb44f3827b93fcdb5b30ce62ed553c26c", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "quartz" }, { "field": "supply_chain_layers", "value": "silicon_carbide_components" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "quartz" }, { "field": "supply_chain_layers", "value": "silicon_carbide_components" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-hanjing", "record_level": "company", "canonical_legal_name_en": "Liaoning Hanjing Semiconductor Materials Co., Ltd.", "canonical_legal_name_cn": "辽宁汉京半导体材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Liaoning Hanjing Semiconductor Materials Co., Ltd.", "canonical_legal_name_cn": "辽宁汉京半导体材料有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-gentech", "state_parent": null }, "geography": { "headquarters": "Liaoning, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Hengyunchang", "恒运昌" ], "brands": [], "canonical_legal_name_cn": "深圳市恒运昌真空技术股份有限公司", "canonical_legal_name_en": "Shenzhen Hengyunchang Vacuum Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-hengyunchang", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-hengyunchang", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-hengyunchang-rf-power" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-hengyunchang-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "equipment_components" ], "ticker": "688785", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "3ed416696c825390f34c367d9c431d925e7a41b44adddcf7d5be31b169eb3b04", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "equipment_components" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "equipment_components" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hengyunchang-annual-2025", "title": "深圳市恒运昌真空技术股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688785_20260428_AVJI.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer-reported customer revenue does not identify the receiving fab, tool model, layer, or exact accepted component SKU." ] } ], "entity_reference": { "entity_id": "ent-hengyunchang", "record_level": "company", "canonical_legal_name_en": "Shenzhen Hengyunchang Vacuum Technology Co., Ltd.", "canonical_legal_name_cn": "深圳市恒运昌真空技术股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shenzhen Hengyunchang Vacuum Technology Co., Ltd.", "canonical_legal_name_cn": "深圳市恒运昌真空技术股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "德国贝托特•哈默机械制造股份公司", "Hermle" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": "Berthold Hermle AG", "completion_state": "source_backed", "countries_of_operation": [ "Germany", "China" ], "country_of_ownership": "Germany", "entity_id": "ent-hermle", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Gosheim, Germany", "id": "ent-hermle", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-guowang-hermle-award-2022" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "precision_machine_tools" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "95dc1415eb91294170c9fbe9e9419e3ab0af7018e6eb5071886a2e48128c1ad5", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "precision_machine_tools" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-guowang-hermle-award-2022", "title": "北京国望光学科技有限公司五轴立式加工中心项目评标结果公告", "publisher": "商务部机电产品招标投标电子交易平台", "url": "https://chinabidding.mofcom.gov.cn/bidDetail/bidding/bulletin/202206/ff8080817d94c145018145fd60755ec2.html", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2022-06-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Award does not prove delivery, installation, acceptance, current use, the exact optical part processed, service route or spares." ] } ], "entity_reference": { "entity_id": "ent-hermle", "record_level": "company", "canonical_legal_name_en": "Berthold Hermle AG", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Berthold Hermle AG", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "Germany", "ownership_type": "foreign_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Gosheim, Germany", "countries_of_operation": [ "Germany", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Horizon Robotics", "地平线" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-horizon-brand-endpoint-unresolved", "entity_type": "brand_or_unresolved_endpoint", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": null, "id": "ent-horizon-brand-endpoint-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-horizon-journey-3", "prod-horizon-journey-5" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-li-auto-2021q1-results-20210526", "src-byd-horizon-journey5-designwin-20220421" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "automotive_chips" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "c53f2866021494af77b77fa7b2790f1e496305bb9209c83beb97ca7d4fd5130a", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive_chips" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "automotive_chips" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-li-auto-2021q1-results-20210526", "title": "Li Auto Inc. Announces Unaudited First Quarter 2021 Financial Results", "publisher": "Li Auto Inc.", "url": "https://ir.lixiang.com/zh-hans/news-releases/news-release-details/li-auto-inc-announces-unaudited-first-quarter-2021-financial", "source_type": "company_financial_results", "primary_status": "primary", "publication_date": "2021-05-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Horizon's contracting legal entity, chip purchase quantity, supplier contract, manufacturing facility and accepted-system test are undisclosed." ] }, { "source_id": "src-byd-horizon-journey5-designwin-20220421", "title": "比亚迪与地平线官宣合作 2023年部分上市车型将搭载征程5", "publisher": "比亚迪汽车工业有限公司", "url": "https://oip.byd.com/addons/cms/news/detail?category=1&news_id=72", "source_type": "customer_site_industry_news", "primary_status": "primary", "publication_date": "2022-04-21", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact contracting legal endpoints, vehicle models, SOP, delivery, installed units and volume are undisclosed.", "Rhetorical mass-production wording is not a model-specific shipment or production receipt." ] } ], "entity_reference": { "entity_id": "ent-horizon-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Houmo AI", "PostMoore", "后摩智能" ], "brands": [], "canonical_legal_name_cn": "后摩智能科技股份有限公司", "canonical_legal_name_en": "PostMoore Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-houmo", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-houmo", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [ "proc-chip-ai-accelerator" ], "product_ids": [ "prod-houmo-h30", "prod-houmo-m50" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-houmo-home", "src-houmo-h30-youkong-20231229", "src-houmo-m50-product", "src-houmo-m50-greatwall-20260531" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "compute_in_memory", "accelerators" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "7e34bc680dea7308b56685bb169bb49532e7179933bcee27dbb3db6b3f6773e9", "stage_ids": [ "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "compute_in_memory" }, { "field": "supply_chain_layers", "value": "accelerators" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "compute_in_memory" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "compute_in_memory" }, { "field": "supply_chain_layers", "value": "accelerators" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-houmo-home", "title": "后摩智能官网", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/", "source_type": "company_home_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal identity only." ] }, { "source_id": "src-houmo-h30-youkong-20231229", "title": "后摩智能与优控智行战略合作", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/3/28/NewsDetails.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2023-12-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Counterparty legal entity, production vehicle, contract, units, foundry, memory and OSAT are undisclosed." ] }, { "source_id": "src-houmo-m50-product", "title": "M50", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/60/ProductType.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, OSAT, LPDDR supplier, units, customer acceptance and independent workload receipt are undisclosed." ] }, { "source_id": "src-houmo-m50-greatwall-20260531", "title": "长城N90 Pro AI笔记本搭载后摩M50", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/1/47/NewsDetails.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2026-05-31", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Direct buying entity, contract, units, retail shipments, acceptance and field reliability are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-houmo", "record_level": "company", "canonical_legal_name_en": "PostMoore Technology Co., Ltd.", "canonical_legal_name_cn": "后摩智能科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "PostMoore Technology Co., Ltd.", "canonical_legal_name_cn": "后摩智能科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "华峰测控" ], "brands": [ "AccoTEST" ], "canonical_legal_name_cn": "北京华峰测控技术股份有限公司", "canonical_legal_name_en": "Beijing Huafeng Test & Control Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-huafeng-test-control", "entity_type": "company", "exchange": "Shanghai Stock Exchange STAR Market", "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-huafeng-test-control", "identity_resolution_state": "canonical_identity_closed_brand_routed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-accotest-corporate" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "688200", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "92adb079e5ab29c469e062d9e487f16134858a535698bdc73134f04d60bf5871", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-accotest-corporate", "title": "Corporate", "publisher": "AccoTEST", "url": "https://www.accotest.com/corporate/", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "AccoTEST must not be represented as a separate legal company." ] } ], "entity_reference": { "entity_id": "ent-huafeng-test-control", "record_level": "company", "canonical_legal_name_en": "Beijing Huafeng Test & Control Technology Co., Ltd.", "canonical_legal_name_cn": "北京华峰测控技术股份有限公司", "identity_resolution_state": "canonical_identity_closed_brand_routed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Beijing Huafeng Test & Control Technology Co., Ltd.", "canonical_legal_name_cn": "北京华峰测控技术股份有限公司", "identity_resolution_state": "canonical_identity_closed_brand_routed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Hua Hong Group", "华虹集团" ], "brands": [], "canonical_legal_name_cn": "上海华虹（集团）有限公司", "canonical_legal_name_en": "Shanghai Huahong (Group) Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-huahong-group", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-huahong-group", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_owned", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-gentech-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "semiconductor_group" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "a30f48fbe0c4262ca16ae501008a2967673f7e140db107f74e7beaf082533e26", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "semiconductor_group" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-huahong-group", "record_level": "company", "canonical_legal_name_en": "Shanghai Huahong (Group) Co., Ltd.", "canonical_legal_name_cn": "上海华虹（集团）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shanghai Huahong (Group) Co., Ltd.", "canonical_legal_name_cn": "上海华虹（集团）有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_owned", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "HLMC", "Huali Microelectronics", "华虹宏力" ], "brands": [], "canonical_legal_name_cn": "华虹宏力半导体有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-huahong-huali", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-huahong-huali", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_owned", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-huahong-huali-acquisition-2026" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "wafer_fabrication", "foundry" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "ff5feb64362a1e30ca13fec68e375a6a71f07aeba0a6d0d46b231b0526574fe5", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer_fabrication" }, { "field": "supply_chain_layers", "value": "foundry" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "wafer_fabrication" }, { "field": "supply_chain_layers", "value": "foundry" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huahong-huali-acquisition-2026", "title": "华虹宏力半导体有限公司发行股份购买资产并募集配套资金暨关联交易报告书（注册稿）", "publisher": "上海证券交易所 / 华虹宏力", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-06-23/688347_20260623_FKJB.pdf", "source_type": "acquisition_filing", "primary_status": "primary", "publication_date": "2026-06-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Generic acceptance workflow does not prove acceptance of a particular scanner.", "A patent title is mechanism/IP evidence, not proof of Nikon tool ownership, supplier status, installation or current use.", "Equipment suppliers remain undisclosed." ] } ], "entity_reference": { "entity_id": "ent-huahong-huali", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "华虹宏力半导体有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "华虹宏力半导体有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_owned", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Hua Hong Semiconductor", "华虹半导体" ], "brands": [], "canonical_legal_name_cn": "华虹半导体有限公司", "canonical_legal_name_en": "Hua Hong Semiconductor Limited", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-huahong-semiconductor", "entity_type": "company", "exchange": "HKEX / SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-huahong-semiconductor", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_linked", "parent_entity_id": null, "process_ids": [ "proc-lithography-immersion-arf" ], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-huahong-annual-2025", "src-reuters-duv-aishengna-2026" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "foundry" ], "ticker": "01347 / 688347", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "771900a1f6d20916b3bd4f0e08bc55118751bf1bf6fb01a1f30eb85f44df4d3d", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "foundry" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "foundry" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_and_secondary", "source_refs": [ { "source_id": "src-huahong-annual-2025", "title": "Hua Hong Semiconductor Limited 2025 Annual Report", "publisher": "Hong Kong Exchanges and Clearing Limited", "url": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0326/2026032602731_c.pdf", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-03-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group disclosure does not identify a product's foundry, scanner fleet, customer, yield or complete supplier BOM." ] }, { "source_id": "src-reuters-duv-aishengna-2026", "title": "China starts production of home-grown immersion DUV chipmaking tools, source says", "publisher": "Reuters", "url": "https://www.reuters.com/world/china/china-starts-production-home-grown-immersion-duv-chipmaking-tools-source-2026-07-28/", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2026-07-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Anonymous-source report; no model, serial, purchase order, shipment, installation, site acceptance, layer qualification, uptime, yield, or recurring volume." ] } ], "entity_reference": { "entity_id": "ent-huahong-semiconductor", "record_level": "company", "canonical_legal_name_en": "Hua Hong Semiconductor Limited", "canonical_legal_name_cn": "华虹半导体有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Hua Hong Semiconductor Limited", "canonical_legal_name_cn": "华虹半导体有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_linked", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Huate Gas", "华特气体" ], "brands": [], "canonical_legal_name_cn": "广东华特气体股份有限公司", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-huate-gas", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Foshan, Guangdong, China", "id": "ent-huate-gas", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-huate-excimer-gases", "prod-huate-onsite-hydrogen-system" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-huate-gas-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-huate-jiangxi" ], "supply_chain_layers": [ "specialty_gases" ], "ticker": "688268", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "4ca710f5cc41f85d697acd9d55dc30958312b377a1243adb0de584a74eeea76c", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "specialty_gases" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "specialty_gases" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "entity_reference": { "entity_id": "ent-huate-gas", "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Foshan, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Jiangxi Huate Electronic Chemicals" ], "brands": [], "canonical_legal_name_cn": "江西华特电子化学品有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-huate-jiangxi", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Jiangxi, China", "id": "ent-huate-jiangxi", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-huate-gas", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-huate-gas-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "specialty_gases" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "2371612ec111df523e685b8591859d888f30029268eae74424c2f010bdd2b582", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "specialty_gases" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "specialty_gases" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "entity_reference": { "entity_id": "ent-huate-jiangxi", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "江西华特电子化学品有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "江西华特电子化学品有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-huate-gas", "state_parent": null }, "geography": { "headquarters": "Jiangxi, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Huatian", "华天科技" ], "brands": [], "canonical_legal_name_cn": "天水华天科技股份有限公司", "canonical_legal_name_en": "Tianshui Huatian Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-huatian", "entity_type": "company", "exchange": "SZSE", "facility_ids": [], "former_names": [], "headquarters": "Tianshui, Gansu, China", "id": "ent-huatian", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-huatian-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "packaging", "test", "advanced_packaging" ], "ticker": "002185", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "158f19a483cf2859c80e98b07e19e50156b193436aa2cfd5902da9e4f12cbfb9", "stage_ids": [ "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "packaging" }, { "field": "supply_chain_layers", "value": "advanced_packaging" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "test" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "packaging" }, { "field": "supply_chain_layers", "value": "test" }, { "field": "supply_chain_layers", "value": "advanced_packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huatian-annual-2025", "title": "天水华天科技股份有限公司2025年年度报告", "publisher": "天水华天科技股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-03-31/1225059982.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-31", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The single HBM reference is industry context; a roadmap is not current qualification or volume production." ] } ], "entity_reference": { "entity_id": "ent-huatian", "record_level": "company", "canonical_legal_name_en": "Tianshui Huatian Technology Co., Ltd.", "canonical_legal_name_cn": "天水华天科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Tianshui Huatian Technology Co., Ltd.", "canonical_legal_name_cn": "天水华天科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Tianshui, Gansu, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "华为", "Huawei" ], "brands": [ "Huawei", "Ascend", "Atlas" ], "canonical_legal_name_cn": "华为技术有限公司", "canonical_legal_name_en": "Huawei Technologies Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China", "multiple" ], "country_of_ownership": "China", "entity_id": "ent-huawei", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters not resolved in this identity source", "id": "ent-huawei", "identity_resolution_state": "legal_company_identity_closed_product_brand_endpoint_retained", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC limited liability company", "lei": null, "ownership_type": "private_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-huawei-legal-footer-20250918" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "dc818041de28c03a4e0d80951c6ba0b6b35d73572b3c2f10fa362e100307f4ae", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huawei-legal-footer-20250918", "title": "Huawei Launches SuperPoD Products", "publisher": "Huawei Technologies Co., Ltd.", "url": "https://www.huawei.com/en/news/2025/9/hc-superpod-innovation", "source_type": "official_company_legal_page", "primary_status": "primary", "publication_date": "2025-09-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not prove the exact legal owner, designer, foundry, supplier, customer, or contracting entity for every Huawei, Ascend, Atlas, HiBL, or HiZQ product." ] } ], "entity_reference": { "entity_id": "ent-huawei", "record_level": "company", "canonical_legal_name_en": "Huawei Technologies Co., Ltd.", "canonical_legal_name_cn": "华为技术有限公司", "identity_resolution_state": "legal_company_identity_closed_product_brand_endpoint_retained", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Huawei Technologies Co., Ltd.", "canonical_legal_name_cn": "华为技术有限公司", "identity_resolution_state": "legal_company_identity_closed_product_brand_endpoint_retained" }, "ownership": { "country_of_ownership": "China", "ownership_type": "private_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters not resolved in this identity source", "countries_of_operation": [ "China", "multiple" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Ascend", "Atlas", "昇腾" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-huawei-brand-endpoint-unresolved", "entity_type": "brand_or_unresolved_endpoint", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": null, "id": "ent-huawei-brand-endpoint-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-huawei-ascend-910b2", "prod-huawei-atlas-300i-duo", "prod-huawei-atlas-300i-pro" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "accelerators", "server_cards" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "037b2d59824d93535b9842494a6959e12cc0d7b2ac210ad0964bd06df9279d97", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "accelerators" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "server_cards" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "accelerators" }, { "field": "supply_chain_layers", "value": "server_cards" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] } ], "entity_reference": { "entity_id": "ent-huawei-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Dinglong", "鼎龙股份" ], "brands": [], "canonical_legal_name_cn": "湖北鼎龙控股股份有限公司", "canonical_legal_name_en": "Hubei Dinglong Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-hubei-dinglong", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-hubei-dinglong", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-dinglong-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "cmp pads", "cmp cleaners", "cmp slurries", "krf photoresist", "arf photoresist", "advanced packaging materials" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "0da7423dea2f0a7a4e4b089509c9d7f1d4fc13bafb1db8467b01906ed0d6cb84", "stage_ids": [ "lithography", "critical_materials", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "krf photoresist" }, { "field": "supply_chain_layers", "value": "arf photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "cmp pads" }, { "field": "supply_chain_layers", "value": "krf photoresist" }, { "field": "supply_chain_layers", "value": "arf photoresist" }, { "field": "supply_chain_layers", "value": "advanced packaging materials" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "advanced packaging materials" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "cmp pads" }, { "field": "supply_chain_layers", "value": "cmp cleaners" }, { "field": "supply_chain_layers", "value": "cmp slurries" }, { "field": "supply_chain_layers", "value": "krf photoresist" }, { "field": "supply_chain_layers", "value": "arf photoresist" }, { "field": "supply_chain_layers", "value": "advanced packaging materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dinglong-profile-20260801", "title": "Company Profile", "publisher": "Hubei Dinglong Co., Ltd.", "url": "https://en.dl-kg.com/company.html", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "References to leading domestic fabs are anonymous and do not establish a named supplier relationship." ] } ], "entity_reference": { "entity_id": "ent-hubei-dinglong", "record_level": "company", "canonical_legal_name_en": "Hubei Dinglong Co., Ltd.", "canonical_legal_name_cn": "湖北鼎龙控股股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Hubei Dinglong Co., Ltd.", "canonical_legal_name_cn": "湖北鼎龙控股股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Xingfu", "Sinophorus", "兴福电子" ], "brands": [], "canonical_legal_name_cn": "湖北兴福电子材料股份有限公司", "canonical_legal_name_en": "Hubei Sinophorus Electronic Materials Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-hubei-sinophorus-xingfu-electronic-materials", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-hubei-sinophorus-xingfu-electronic-materials", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-sinophorus-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "wet chemicals", "etchants", "photoresist developers", "cleaners", "strippers" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "f9bd057b6aef288cca4455583269a143d480943e83730fe2bf635969fdf3d7a4", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "photoresist developers" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wet chemicals" }, { "field": "supply_chain_layers", "value": "photoresist developers" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "wet chemicals" }, { "field": "supply_chain_layers", "value": "etchants" }, { "field": "supply_chain_layers", "value": "photoresist developers" }, { "field": "supply_chain_layers", "value": "cleaners" }, { "field": "supply_chain_layers", "value": "strippers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-sinophorus-profile-20260801", "title": "About Sinophorus", "publisher": "Hubei Sinophorus Electronic Materials Co., Ltd.", "url": "https://m.sinophorus.com/about-us", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "The Xingfa group link is supported, but exact current ownership percentage and named fab/product supply remain unresolved." ] } ], "entity_reference": { "entity_id": "ent-hubei-sinophorus-xingfu-electronic-materials", "record_level": "company", "canonical_legal_name_en": "Hubei Sinophorus Electronic Materials Co., Ltd.", "canonical_legal_name_cn": "湖北兴福电子材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Hubei Sinophorus Electronic Materials Co., Ltd.", "canonical_legal_name_cn": "湖北兴福电子材料股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "TGV Tech", "Tongge Microelectronics", "通格微" ], "brands": [], "canonical_legal_name_cn": "湖北通格微电路科技有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-hubei-tongge-microelectronics", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-hubei-tongge-microelectronics", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-wgtech-tongge-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "through glass vias", "pvd copper", "glass circuit boards", "advanced packaging" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "fcc3c09c110adc4c0b0d67679efa505e25da40d5144d99e0167da9263c0a5d26", "stage_ids": [ "package_provider", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "advanced packaging" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "glass circuit boards" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "through glass vias" }, { "field": "supply_chain_layers", "value": "pvd copper" }, { "field": "supply_chain_layers", "value": "glass circuit boards" }, { "field": "supply_chain_layers", "value": "advanced packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-wgtech-tongge-profile-20260801", "title": "WG Tech Group", "publisher": "WG Tech", "url": "https://www.wgtechjx.com/", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "The compound seed covers two entities. Affiliate status is supported, but exact equity and product-to-customer relationships are not." ] } ], "entity_reference": { "entity_id": "ent-hubei-tongge-microelectronics", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "湖北通格微电路科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "湖北通格微电路科技有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Xingfa", "兴发集团" ], "brands": [], "canonical_legal_name_cn": "湖北兴发化工集团股份有限公司", "canonical_legal_name_en": "Hubei Xingfa Chemicals Group Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-hubei-xingfa-chemicals", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-hubei-xingfa-chemicals", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-xingfa-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "electronic chemicals", "etching fluids", "semiconductor materials" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "45aa7c014c952c454496518895dd265d8ca471821eb59759d9513532c913e7d9", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "electronic chemicals" }, { "field": "supply_chain_layers", "value": "semiconductor materials" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "electronic chemicals" }, { "field": "supply_chain_layers", "value": "etching fluids" }, { "field": "supply_chain_layers", "value": "semiconductor materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-xingfa-profile-20260801", "title": "About Xingfa Group", "publisher": "Hubei Xingfa Chemicals Group Co., Ltd.", "url": "https://www.xingfagroup.com/en/index.php/About", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "No named fab, qualified grade, process layer, capacity allocation or recurring product relationship is disclosed." ] } ], "entity_reference": { "entity_id": "ent-hubei-xingfa-chemicals", "record_level": "company", "canonical_legal_name_en": "Hubei Xingfa Chemicals Group Co., Ltd.", "canonical_legal_name_cn": "湖北兴发化工集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Hubei Xingfa Chemicals Group Co., Ltd.", "canonical_legal_name_cn": "湖北兴发化工集团股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Hwatsing", "华海清科" ], "brands": [], "canonical_legal_name_cn": "华海清科股份有限公司", "canonical_legal_name_en": "Hwatsing Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-hwatsing", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Tianjin, China", "id": "ent-hwatsing", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-hwatsing-cmp-portfolio" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-hwatsing-annual-2025", "src-hwatsing-inquiry-2021" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "cmp_equipment" ], "ticker": "688120", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "20bdf7d2ad1d3a831fa27a0f4ea703a7005fb636c2f1f6e308d3335d133b4009", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "cmp_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "cmp_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hwatsing-annual-2025", "title": "华海清科股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-23/688120_20260423_K9XR.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No public facility/model/layer/yield attribution is inferred from portfolio disclosure." ] }, { "source_id": "src-hwatsing-inquiry-2021", "title": "华海清科股份有限公司第二轮审核问询函回复", "publisher": "华海清科股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202102/000752_20210208_7AX3.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-02-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Aggregates models, customers and process capabilities; exact model/facility/layer qualification is not disclosed." ] } ], "entity_reference": { "entity_id": "ent-hwatsing", "record_level": "company", "canonical_legal_name_en": "Hwatsing Technology Co., Ltd.", "canonical_legal_name_cn": "华海清科股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Hwatsing Technology Co., Ltd.", "canonical_legal_name_cn": "华海清科股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Tianjin, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Hygon", "海光" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-hygon-brand-endpoint-unresolved", "entity_type": "brand_or_unresolved_endpoint", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": null, "id": "ent-hygon-brand-endpoint-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-hygon-7000-series", "prod-hygon-7285" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-ctyun-cambricon-cloud-20260703" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "cpus" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "7f688536fbffc03af004c6d0c3206b1ff7d4f0195773025e93ddd8c7effcb31d", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "cpus" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "cpus" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-07-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-hygon-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Iluvatar CoreX", "天数智芯" ], "brands": [], "canonical_legal_name_cn": "上海天数智芯半导体股份有限公司", "canonical_legal_name_en": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-iluvatar", "entity_type": "company", "exchange": "HKEX", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-iluvatar", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [ "proc-chip-ai-accelerator" ], "product_ids": [ "prod-iluvatar-bi-v100-alias-unresolved", "prod-iluvatar-tg100", "prod-iluvatar-zk100" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-iluvatar-annual-2025", "src-iluvatar-about" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "gpus", "accelerators" ], "ticker": "09903", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "1e626ed4323af1f9c495ab610a44cdb414a0dbaf97dd1a1b1d024ac1cac9b527", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "gpus" }, { "field": "supply_chain_layers", "value": "accelerators" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "gpus" }, { "field": "supply_chain_layers", "value": "accelerators" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-iluvatar-annual-2025", "title": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd. 2025 Annual Report", "publisher": "香港交易所", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0427/2026042701284.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers/projects, foundry, OSAT, HBM/memory supplier and model-specific units are withheld." ] }, { "source_id": "src-iluvatar-about", "title": "发展历程", "publisher": "上海天数智芯半导体股份有限公司", "url": "https://www.iluvatar.com/about/", "source_type": "company_timeline", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor timeline; model-specific units, foundry, OSAT, memory supplier and named customers are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-iluvatar", "record_level": "company", "canonical_legal_name_en": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd.", "canonical_legal_name_cn": "上海天数智芯半导体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd.", "canonical_legal_name_cn": "上海天数智芯半导体股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "INESA", "上海仪电" ], "brands": [], "canonical_legal_name_cn": "上海仪电（集团）有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-inesa-group", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-inesa-group", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "ownership_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-biren-lightspherex-initial", "src-biren-lightspherex-commercial" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "computing_system_integration" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "67ddf90fc6ddf10acccba590f917df00caf6e9d0fe2d06174890c3495b406822", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "computing_system_integration" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "computing_system_integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-biren-lightspherex-initial", "title": "光跃LightSphere X超节点", "publisher": "上海壁仞科技股份有限公司", "url": "https://www.birentech.com/news/uk3x1bhhagcrtf5bqkurbnsa/", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Planned deployment at source date; no purchase, named customer, facility acceptance or installed-card count." ] }, { "source_id": "src-biren-lightspherex-commercial", "title": "光跃超节点商业版联合发布", "publisher": "上海壁仞科技股份有限公司", "url": "https://sgc-prod.birentech.com/news/h5vjj6lsw4n5za2yw6ayyv1e/", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2026-03-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported aggregate; no site, customer, exact card SKU, acceptance, uptime or utilization." ] } ], "entity_reference": { "entity_id": "ent-inesa-group", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海仪电（集团）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海仪电（集团）有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "ownership_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "英诺赛科", "Innoscience", "InnoScience" ], "brands": [ "InnoScience", "Innoscience" ], "canonical_legal_name_cn": "英诺赛科（苏州）科技股份有限公司", "canonical_legal_name_en": "InnoScience (Suzhou) Technology Holding Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-innoscience-suzhou", "entity_type": "company", "exchange": "Hong Kong Stock Exchange Main Board", "facility_ids": [], "former_names": [], "headquarters": "Suzhou, Jiangsu, China", "id": "ent-innoscience-suzhou", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-innoscience-hkex", "src-innoscience-official-listing" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "02577", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "464db0da9eba4bc232c837d971fdc09b29575d5a3085afd2c7fa8ff9eed65b52", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-innoscience-hkex", "title": "InnoScience (Suzhou) Technology Holding Co., Ltd. listing document", "publisher": "Hong Kong Exchanges and Clearing Limited", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2024/1230/2024121201395.htm", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2024-12-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Current controlling-shareholder analysis was not extracted for this identity-only lane." ] }, { "source_id": "src-innoscience-official-listing", "title": "英诺赛科成功上市，氮化镓功率半导体引领者全“芯”启航", "publisher": "英诺赛科（苏州）科技股份有限公司", "url": "https://www.innoscience.com/cn/news/detail/85/1278", "source_type": "official_company_release", "primary_status": "primary", "publication_date": "2024-12-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [] } ], "entity_reference": { "entity_id": "ent-innoscience-suzhou", "record_level": "company", "canonical_legal_name_en": "InnoScience (Suzhou) Technology Holding Co., Ltd.", "canonical_legal_name_cn": "英诺赛科（苏州）科技股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "InnoScience (Suzhou) Technology Holding Co., Ltd.", "canonical_legal_name_cn": "英诺赛科（苏州）科技股份有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Suzhou, Jiangsu, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Innosilicon", "芯动科技" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-innosilicon-brand", "entity_type": "brand", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Wuhan, Hubei, China", "id": "ent-innosilicon-brand", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "brand_identity_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-innosilicon-hbm3e-phy" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-innosilicon-ip-catalogue" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "semiconductor_ip", "design_services" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "fa304f90e04ef7d9a2273e7cec3ce6a0c8f5b77779f8f8732572b4d725f4d8da", "stage_ids": [ "design_company", "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "design_services" } ] }, { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "semiconductor_ip" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "semiconductor_ip" }, { "field": "supply_chain_layers", "value": "design_services" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-innosilicon-ip-catalogue", "title": "IP Solutions", "publisher": "Innosilicon", "url": "https://www.innosilicon.com/ip-solution", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue compatibility is not a named license, tapeout, qualified production chip, or mainland HBM stack." ] } ], "entity_reference": { "entity_id": "ent-innosilicon-brand", "record_level": "brand", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "brand_identity_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Wuhan, Hubei, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "JCET", "JCET Group", "长电科技" ], "brands": [ "JCET" ], "canonical_legal_name_cn": "江苏长电科技股份有限公司", "canonical_legal_name_en": "JCET Group Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China", "Singapore", "South Korea" ], "country_of_ownership": "China", "entity_id": "ent-jcet", "entity_type": "company", "exchange": "Shanghai Stock Exchange", "facility_ids": [], "former_names": [], "headquarters": "Jiangyin, Jiangsu, China", "id": "ent-jcet", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_not_closed_in_lane", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-jcet-annual-2025", "src-jcet-ar2025", "src-jcet-profile" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "packaging", "test" ], "ticker": "600584", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "7ebef16f87632bbbf97f0699014e6eda0ac8aaf37bf1f391687463afb05b5200", "stage_ids": [ "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "packaging" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "test" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "packaging" }, { "field": "supply_chain_layers", "value": "test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jcet-annual-2025", "title": "江苏长电科技股份有限公司2025年年度报告", "publisher": "江苏长电科技股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225091498.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The row says only sale of goods; product, facility, process, package/test scope and HBM status are unknown.", "Do not convert this receipt into a packages, tests or HBM relationship." ] }, { "source_id": "src-jcet-ar2025", "title": "江苏长电科技股份有限公司2025年年度报告", "publisher": "江苏长电科技股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225091498.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Current parent/control fields were not extracted into this identity lane." ] }, { "source_id": "src-jcet-profile", "title": "JCET Enters Into Strategic Business Agreement with Analog Devices", "publisher": "JCET Group Co., Ltd.", "url": "https://www.jcetglobal.com/en/site/detailscon/556", "source_type": "official_company_release", "primary_status": "primary", "publication_date": "2019-12-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The release predates the current control structure." ] } ], "entity_reference": { "entity_id": "ent-jcet", "record_level": "company", "canonical_legal_name_en": "JCET Group Co., Ltd.", "canonical_legal_name_cn": "江苏长电科技股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "JCET Group Co., Ltd.", "canonical_legal_name_cn": "江苏长电科技股份有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_not_closed_in_lane", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Jiangyin, Jiangsu, China", "countries_of_operation": [ "China", "Singapore", "South Korea" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "JHICC", "福建晋华" ], "brands": [], "canonical_legal_name_cn": "福建省晋华集成电路有限公司", "canonical_legal_name_en": "Fujian Jinhua Integrated Circuit Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-jhicc", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Quanzhou, Fujian, China", "id": "ent-jhicc", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_linked", "parent_entity_id": null, "process_ids": [ "proc-lithography-immersion-arf" ], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-jhicc-about" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "dram_memory", "wafer_fabrication" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "a728d9cfdaedc7a821cd10208693569610195908765009430a5b1e7f5092b055", "stage_ids": [ "logic_foundry_process", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer_fabrication" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "dram_memory" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "dram_memory" }, { "field": "supply_chain_layers", "value": "wafer_fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jhicc-about", "title": "关于晋华", "publisher": "福建省晋华集成电路有限公司", "url": "https://www.jhicc.cn/AboutUs.html?info=quality", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Does not disclose qualified product, production state, capacity, yield, output or scanner fleet." ] } ], "entity_reference": { "entity_id": "ent-jhicc", "record_level": "company", "canonical_legal_name_en": "Fujian Jinhua Integrated Circuit Co., Ltd.", "canonical_legal_name_cn": "福建省晋华集成电路有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Fujian Jinhua Integrated Circuit Co., Ltd.", "canonical_legal_name_cn": "福建省晋华集成电路有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_linked", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Quanzhou, Fujian, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "HHCK", "华海诚科" ], "brands": [], "canonical_legal_name_cn": "江苏华海诚科新材料股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-jiangsu-hhck-advanced-materials", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-jiangsu-hhck-advanced-materials", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-hhck-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "semiconductor packaging materials", "epoxy molding compounds", "electronic adhesives" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "883c3d889de14a8263f0d938a8590cd600719f884fb0c42d5a086b0780398419", "stage_ids": [ "critical_materials", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "semiconductor packaging materials" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "semiconductor packaging materials" }, { "field": "supply_chain_layers", "value": "epoxy molding compounds" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "semiconductor packaging materials" }, { "field": "supply_chain_layers", "value": "epoxy molding compounds" }, { "field": "supply_chain_layers", "value": "electronic adhesives" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hhck-annual-2025", "title": "江苏华海诚科新材料股份有限公司2025年年度报告", "publisher": "江苏华海诚科新材料股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-03-18/1225014871.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-03-18", "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "This is a packaging-material capability, not evidence that the company is a package assembler or a supplier to a named product." ] } ], "entity_reference": { "entity_id": "ent-jiangsu-hhck-advanced-materials", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "江苏华海诚科新材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "江苏华海诚科新材料股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Lianrui", "NOVORAY", "联瑞新材" ], "brands": [], "canonical_legal_name_cn": "江苏联瑞新材料股份有限公司", "canonical_legal_name_en": "Jiangsu NOVORAY New Material Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-jiangsu-novoray-lianrui", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-jiangsu-novoray-lianrui", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-novoray-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "electronic materials", "silica materials", "alumina materials" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "c2aa8a3daa1e97f96dedb4fe7448400aff637cd67a4a965106be3adba78d673d", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "electronic materials" }, { "field": "supply_chain_layers", "value": "silica materials" }, { "field": "supply_chain_layers", "value": "alumina materials" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "electronic materials" }, { "field": "supply_chain_layers", "value": "silica materials" }, { "field": "supply_chain_layers", "value": "alumina materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-novoray-profile-20260801", "title": "About NOVORAY", "publisher": "Jiangsu NOVORAY New Material Co., Ltd.", "url": "https://www.novoray.com/en/index.php/about/index/id/7.html", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "No named package, customer, exact material grade, qualification or production allocation is disclosed." ] } ], "entity_reference": { "entity_id": "ent-jiangsu-novoray-lianrui", "record_level": "company", "canonical_legal_name_en": "Jiangsu NOVORAY New Material Co., Ltd.", "canonical_legal_name_cn": "江苏联瑞新材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Jiangsu NOVORAY New Material Co., Ltd.", "canonical_legal_name_cn": "江苏联瑞新材料股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Shenzhou Semiconductor" ], "brands": [], "canonical_legal_name_cn": "江苏神州半导体科技股份有限公司", "canonical_legal_name_en": "Jiangsu Shenzhou Semiconductor Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-jiangsu-shenzhou", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Jiangsu, China", "id": "ent-jiangsu-shenzhou", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-shenzhou-rps" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-jiangsu-shenzhou-prospectus-2026" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "equipment_components" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "c336e5dfe23702962c03ee5296dcc010849e5d33a34bcd20c83f40abab897c48", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "equipment_components" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "equipment_components" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jiangsu-shenzhou-prospectus-2026", "title": "江苏神州半导体科技股份有限公司招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202606/002191_20260630_F1GO.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-06-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer filing reproduces customer endorsements; facility, serial number, fab acceptance and qualified layer are not public." ] } ], "entity_reference": { "entity_id": "ent-jiangsu-shenzhou", "record_level": "company", "canonical_legal_name_en": "Jiangsu Shenzhou Semiconductor Technology Co., Ltd.", "canonical_legal_name_cn": "江苏神州半导体科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Jiangsu Shenzhou Semiconductor Technology Co., Ltd.", "canonical_legal_name_cn": "江苏神州半导体科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Jiangsu, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Jianghua Micro", "江化微" ], "brands": [], "canonical_legal_name_cn": "江阴江化微电子材料股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-jiangyin-jianghua-micro", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-jiangyin-jianghua-micro", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-jianghua-micro-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "high purity wet chemicals", "photoresist reagents" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "ff43504dfb40b875eaa24db41d0cbdc32d2540d8c3220369c7a35f7e41e9aaef", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "photoresist reagents" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "high purity wet chemicals" }, { "field": "supply_chain_layers", "value": "photoresist reagents" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "high purity wet chemicals" }, { "field": "supply_chain_layers", "value": "photoresist reagents" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jianghua-micro-profile-20260801", "title": "About Jianghua Micro", "publisher": "江阴江化微电子材料股份有限公司", "url": "https://www.jianghuamem.com/cn/about.html", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Twelve-inch-process language is company-reported; no named fab, grade, qualified layer or supply volume is disclosed." ] } ], "entity_reference": { "entity_id": "ent-jiangyin-jianghua-micro", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "江阴江化微电子材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "江阴江化微电子材料股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Jinhong Gas", "金宏气体" ], "brands": [], "canonical_legal_name_cn": "金宏气体股份有限公司", "canonical_legal_name_en": "Jinhong Gas Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-jinhong-gas", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Suzhou, Jiangsu, China", "id": "ent-jinhong-gas", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-jinhong-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "bulk_gases", "electronic_specialty_gases", "gas_services" ], "ticker": "688106", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "db0b39248c179d045e72b012120c747931d4a434fbbadd92212d7592e023c701", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "bulk_gases" }, { "field": "supply_chain_layers", "value": "electronic_specialty_gases" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "bulk_gases" }, { "field": "supply_chain_layers", "value": "electronic_specialty_gases" }, { "field": "supply_chain_layers", "value": "gas_services" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jinhong-annual-2025", "title": "金宏气体股份有限公司2025年年度报告", "publisher": "金宏气体股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-03-28/1225047235.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Capacity is consolidated/group aggregate and cannot be assigned to a facility or subsidiary.", "Named customer portfolios are not molecule-specific edges.", "Except for 7N ammonia program wording, customer CoA purity/particle/moisture/metal limits are absent.", "Do not derive actual output by multiplying capacity and utilization without a separately labeled model." ] } ], "entity_reference": { "entity_id": "ent-jinhong-gas", "record_level": "company", "canonical_legal_name_en": "Jinhong Gas Co., Ltd.", "canonical_legal_name_cn": "金宏气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Jinhong Gas Co., Ltd.", "canonical_legal_name_cn": "金宏气体股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Suzhou, Jiangsu, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "KFMI", "江丰电子" ], "brands": [], "canonical_legal_name_cn": "宁波江丰电子材料股份有限公司", "canonical_legal_name_en": "Konfoong Materials International Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-kfmi", "entity_type": "company", "exchange": "SZSE", "facility_ids": [], "former_names": [], "headquarters": "Ningbo, Zhejiang, China", "id": "ent-kfmi", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-kfmi-home-purity", "src-kfmi-ssmc-award-2024" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "sputtering_targets", "equipment_parts" ], "ticker": "300666", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "9bda22d15bdaecc44cb046b3b51f6502e23a4e60c024882cf6a80744b85c4626", "stage_ids": [ "wafer_equipment", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "equipment_parts" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "sputtering_targets" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "sputtering_targets" }, { "field": "supply_chain_layers", "value": "equipment_parts" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kfmi-home-purity", "title": "宁波江丰电子材料股份有限公司", "publisher": "宁波江丰电子材料股份有限公司", "url": "https://www.kfmic.com/", "source_type": "company_technology_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Purity capability is not a lot CoA, target drawing, named customer qualification or process-layer receipt." ] }, { "source_id": "src-kfmi-ssmc-award-2024", "title": "江丰电子荣获SSMC“最佳供应商奖”", "publisher": "宁波江丰电子材料股份有限公司", "url": "https://www.kfmic.com/?news_13%2F634.html=", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2024-08-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-side statement; exact target metal/grade/model, equipment-part SKU, quantity and process layer are absent." ] } ], "entity_reference": { "entity_id": "ent-kfmi", "record_level": "company", "canonical_legal_name_en": "Konfoong Materials International Co., Ltd.", "canonical_legal_name_cn": "宁波江丰电子材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Konfoong Materials International Co., Ltd.", "canonical_legal_name_cn": "宁波江丰电子材料股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Ningbo, Zhejiang, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Kingsemi", "芯源微" ], "brands": [], "canonical_legal_name_cn": "沈阳芯源微电子设备股份有限公司", "canonical_legal_name_en": "Kingsemi Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-kingsemi", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shenyang, Liaoning, China", "id": "ent-kingsemi", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-kingsemi-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "track_equipment", "wet_process_equipment" ], "ticker": "688037", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "1440e9ed6585cd93857eb6cd3e21f75f89234ecf4875240487a5bc4040aa6182", "stage_ids": [ "lithography", "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "track_equipment" } ] }, { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wet_process_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "track_equipment" }, { "field": "supply_chain_layers", "value": "wet_process_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kingsemi-annual-2025", "title": "沈阳芯源微电子设备股份有限公司2025年年度报告摘要", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688037_20260418_OATI.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The summary does not establish scanner pairing, installed base, site acceptance, or qualified production layer." ] } ], "entity_reference": { "entity_id": "ent-kingsemi", "record_level": "company", "canonical_legal_name_en": "Kingsemi Co., Ltd.", "canonical_legal_name_cn": "沈阳芯源微电子设备股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Kingsemi Co., Ltd.", "canonical_legal_name_cn": "沈阳芯源微电子设备股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenyang, Liaoning, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Kunlunxin", "昆仑芯" ], "brands": [], "canonical_legal_name_cn": "昆仑芯（北京）科技股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-kunlun-brand-endpoint-unresolved", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-kunlun-brand-endpoint-unresolved", "identity_resolution_state": "resolved_to_legal_entity", "joint_venture_ids": [], "last_checked": "2026-07-29", "legacy_id_resolution_note": "Stable ID retains historical unresolved suffix; canonical legal identity is now primary-source resolved.", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [ "proc-chip-ai-accelerator" ], "product_ids": [ "prod-kunlun-k200", "prod-kunlun-p800", "prod-kunlun-r200" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-baidu-baige-deepseek-p800-20250217", "src-baidu-p800-large-cluster-caict-claim-20250723", "src-kunlun-k200-product", "src-kunlun-p800-cmb-20250327", "src-kunlun-r200-product", "src-kunlunxin-home" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "accelerators" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "f582affe02cde8ca31416a5d959e00f8bb10e3d8f12ace4bf94736c4e9a23fed", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "accelerators" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "accelerators" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-baidu-baige-deepseek-p800-20250217", "title": "百度百舸 DeepSeek 一体机发布，支持昆仑芯 P800 单机 8 卡满血版开箱即用", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_e0a478ab-bfa4-425c-b9b5-a6d296f6c698", "source_type": "official_operator_product_release", "primary_status": "primary", "publication_date": "2025-02-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Launch/apply-for-trial and vendor deployment statements; no order, shipment, customer acceptance or independent workload receipt.", "Server OEM, CPU/memory/network BOM, cluster facility, exact card count, uptime and utilization are undisclosed." ] }, { "source_id": "src-baidu-p800-large-cluster-caict-claim-20250723", "title": "首家！AI算力最高评级！", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_377f7acf-07e4-4787-a0f5-d70671dd6f34", "source_type": "official_operator_news", "primary_status": "primary", "publication_date": "2025-07-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "CAICT report/certificate, test version, duration, sample, pass criteria and raw results were not retrieved.", "10,000- and 30,000-card terms are rounded vendor classes, not exact installed/qualified/utilized counts." ] }, { "source_id": "src-kunlun-k200-product", "title": "K200", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/product/686.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, OSAT/interposer, HBM generation/supplier/stack, yield, units and named customer are undisclosed." ] }, { "source_id": "src-kunlun-p800-cmb-20250327", "title": "昆仑芯中标招商银行AI芯片资源项目", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/news/4469.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2025-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-origin award; tender number, contract, quantity, delivery, installation and customer acceptance are undisclosed." ] }, { "source_id": "src-kunlun-r200-product", "title": "R200", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/product/274.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, GDDR6 supplier, OSAT, units, named customer and workload receipt are undisclosed." ] }, { "source_id": "src-kunlunxin-home", "title": "昆仑芯官网", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/", "source_type": "company_home_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal identity only." ] } ], "entity_reference": { "entity_id": "ent-kunlun-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "昆仑芯（北京）科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "昆仑芯（北京）科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Xinlai", "Kinglai", "新莱应材" ], "brands": [], "canonical_legal_name_cn": "昆山新莱洁净应用材料股份有限公司", "canonical_legal_name_en": "Kunshan Kinglai Hygienic Materials Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-kunshan-kinglai-xinlai", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-kunshan-kinglai-xinlai", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-xinlai-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "high purity gas chemical delivery", "vacuum system components" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "6cf694401dff58286ad24a8a2edc1bcd13b1a38a3892fb305e54617a13810aaa", "stage_ids": [ "critical_materials", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "high purity gas chemical delivery" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "high purity gas chemical delivery" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "high purity gas chemical delivery" }, { "field": "supply_chain_layers", "value": "vacuum system components" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-xinlai-annual-2025", "title": "昆山新莱洁净应用材料股份有限公司2025年年度报告", "publisher": "昆山新莱洁净应用材料股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-28/1225215794.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Issuer portfolio evidence only; it does not identify an exact semiconductor part, fab, order, installation or qualification state." ] } ], "entity_reference": { "entity_id": "ent-kunshan-kinglai-xinlai", "record_level": "company", "canonical_legal_name_en": "Kunshan Kinglai Hygienic Materials Co., Ltd.", "canonical_legal_name_cn": "昆山新莱洁净应用材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Kunshan Kinglai Hygienic Materials Co., Ltd.", "canonical_legal_name_cn": "昆山新莱洁净应用材料股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Leadmicro", "微导纳米" ], "brands": [], "canonical_legal_name_cn": "江苏微导纳米科技股份有限公司", "canonical_legal_name_en": "Jiangsu Leadmicro Nano Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-leadmicro", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Wuxi, Jiangsu, China", "id": "ent-leadmicro", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-hengyunchang-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "deposition_equipment" ], "ticker": "688147", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "c2928a6202c6608164cea3fe35231ae2c5ca17f0159c017511d02c2dba5e0be3", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "deposition_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "deposition_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hengyunchang-annual-2025", "title": "深圳市恒运昌真空技术股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688785_20260428_AVJI.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer-reported customer revenue does not identify the receiving fab, tool model, layer, or exact accepted component SKU." ] } ], "entity_reference": { "entity_id": "ent-leadmicro", "record_level": "company", "canonical_legal_name_en": "Jiangsu Leadmicro Nano Technology Co., Ltd.", "canonical_legal_name_cn": "江苏微导纳米科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Jiangsu Leadmicro Nano Technology Co., Ltd.", "canonical_legal_name_cn": "江苏微导纳米科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Wuxi, Jiangsu, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Li Auto", "理想汽车" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": "Li Auto Inc.", "completion_state": "source_backed", "countries_of_operation": [ "ownership_country_unresolved_in_lane_sources", "China" ], "country_of_ownership": "ownership_country_unresolved_in_lane_sources", "entity_id": "ent-li-auto-inc", "entity_type": "company", "exchange": "NASDAQ / HKEX", "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-li-auto-inc", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_company_offshore_listed_parent", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-li-auto-2021-li-one" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-li-auto-2021q1-results-20210526", "src-li-auto-2021q3-results-20211129", "src-li-auto-dec-deliveries-20220101" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "automotive" ], "ticker": "LI / 2015", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "33467f61c7d5a8031d55bc9446f5653a7dfea5f722f084103b0320e15f99eceb", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "automotive" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-li-auto-2021q1-results-20210526", "title": "Li Auto Inc. Announces Unaudited First Quarter 2021 Financial Results", "publisher": "Li Auto Inc.", "url": "https://ir.lixiang.com/zh-hans/news-releases/news-release-details/li-auto-inc-announces-unaudited-first-quarter-2021-financial", "source_type": "company_financial_results", "primary_status": "primary", "publication_date": "2021-05-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Horizon's contracting legal entity, chip purchase quantity, supplier contract, manufacturing facility and accepted-system test are undisclosed." ] }, { "source_id": "src-li-auto-2021q3-results-20211129", "title": "Li Auto Inc. Announces Unaudited Third Quarter 2021 Financial Results", "publisher": "Li Auto Inc.", "url": "https://ir.lixiang.com/news-releases/news-release-details/li-auto-inc-announces-unaudited-third-quarter-2021-financial/", "source_type": "company_financial_results", "primary_status": "primary", "publication_date": "2021-11-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vehicle delivery volume does not independently prove a direct Horizon purchase contract or chip procurement quantity." ] }, { "source_id": "src-li-auto-dec-deliveries-20220101", "title": "Li Auto Inc. December 2021 Delivery Update", "publisher": "Li Auto Inc.", "url": "https://ir.lixiang.com/news-releases/news-release-details/li-auto-inc-december-2021-delivery-update", "source_type": "company_delivery_update", "primary_status": "primary", "publication_date": "2022-01-01", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not independently repeat the Journey 3 configuration; the integration join is limited to the explicitly named 2021 Li ONE generation." ] } ], "entity_reference": { "entity_id": "ent-li-auto-inc", "record_level": "company", "canonical_legal_name_en": "Li Auto Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Li Auto Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "ownership_country_unresolved_in_lane_sources", "ownership_type": "mainland_company_offshore_listed_parent", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "ownership_country_unresolved_in_lane_sources", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Lightelligence", "曦智科技" ], "brands": [], "canonical_legal_name_cn": "上海曦智科技股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-lightelligence-shanghai", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-lightelligence-shanghai", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-biren-lightspherex-initial", "src-biren-lightspherex-commercial" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "optical_interconnect", "computing_system_integration" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "7cb5f6db02e1f9216d6ca0812c35ccad800c59d1bf230ae9aceeab52d4abd29c", "stage_ids": [ "board_system", "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "computing_system_integration" } ] }, { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "optical_interconnect" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "optical_interconnect" }, { "field": "supply_chain_layers", "value": "computing_system_integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-biren-lightspherex-initial", "title": "光跃LightSphere X超节点", "publisher": "上海壁仞科技股份有限公司", "url": "https://www.birentech.com/news/uk3x1bhhagcrtf5bqkurbnsa/", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Planned deployment at source date; no purchase, named customer, facility acceptance or installed-card count." ] }, { "source_id": "src-biren-lightspherex-commercial", "title": "光跃超节点商业版联合发布", "publisher": "上海壁仞科技股份有限公司", "url": "https://sgc-prod.birentech.com/news/h5vjj6lsw4n5za2yw6ayyv1e/", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2026-03-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported aggregate; no site, customer, exact card SKU, acceptance, uptime or utilization." ] } ], "entity_reference": { "entity_id": "ent-lightelligence-shanghai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海曦智科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海曦智科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "江波龙", "Longsys" ], "brands": [ "FORESEE", "Lexar", "雷克沙", "Zilia", "智忆巴西" ], "canonical_legal_name_cn": "深圳市江波龙电子股份有限公司", "canonical_legal_name_en": "Shenzhen Longsys Electronics Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China", "Brazil" ], "country_of_ownership": "China", "entity_id": "ent-longsys", "entity_type": "company", "exchange": "Shenzhen Stock Exchange ChiNext", "facility_ids": [], "former_names": [ "深圳市江波龙电子有限公司" ], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-longsys", "identity_resolution_state": "canonical_identity_closed_brands_separated", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-longsys-listing", "src-longsys-brands" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "301308", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "9804c25306331cab3d2d44391a8047427238de8cb0b253594964126efe8955b4", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-longsys-listing", "title": "江波龙首次公开发行股票，正式登陆深交所A股创业板", "publisher": "深圳市江波龙电子股份有限公司", "url": "https://cn.longsys.com/about/news/1719.html", "source_type": "official_company_release", "primary_status": "primary", "publication_date": "2022-08-05", "date_checked": "2026-07-29", "access_state": "open", "limitations": [] }, { "source_id": "src-longsys-brands", "title": "品牌介绍", "publisher": "深圳市江波龙电子股份有限公司", "url": "https://cn.longsys.com/about/news/13956.html", "source_type": "official_company_page", "primary_status": "primary", "publication_date": "2026-06-01", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "A brand is not a separate legal entity unless independently registered and recorded." ] } ], "entity_reference": { "entity_id": "ent-longsys", "record_level": "company", "canonical_legal_name_en": "Shenzhen Longsys Electronics Co., Ltd.", "canonical_legal_name_cn": "深圳市江波龙电子股份有限公司", "identity_resolution_state": "canonical_identity_closed_brands_separated", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shenzhen Longsys Electronics Co., Ltd.", "canonical_legal_name_cn": "深圳市江波龙电子股份有限公司", "identity_resolution_state": "canonical_identity_closed_brands_separated" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China", "Brazil" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Qualified mainland commercial HBM stack" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-mainland-qualified-hbm-analysis", "entity_type": "analysis_subject", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": null, "id": "ent-mainland-qualified-hbm-analysis", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "not_applicable_analysis_subject", "parent_entity_id": null, "process_ids": [ "proc-accepted-result-economics", "proc-dram-fabrication", "proc-final-test-burnin", "proc-hybrid-bonding", "proc-nand-fabrication", "proc-pdk-libraries-ip", "proc-power-cooling", "proc-rdl-interposer", "proc-reliability-failure-analysis", "proc-stack-assembly-repair", "proc-system-architecture", "proc-tsv", "proc-wafer-probe", "proc-wafer-thinning" ], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "hbm" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "f2a64e4f5409a1232ee106316ea8ac089cc3eadc75720c14b25e4e9f9dd211b0", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "hbm" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "hbm" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "not_applicable_analysis_subject", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Maxio", "联芸科技" ], "brands": [], "canonical_legal_name_cn": "联芸科技（杭州）股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-maxio-technology-hangzhou", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-maxio-technology-hangzhou", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-maxio-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "fabless chip design", "storage controllers", "data management soc" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "cff5f0e56217fc9c0b0ecf14a382f29145a4c03ded707e56ac1ad7eb90059210", "stage_ids": [ "design_company", "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "fabless chip design" } ] }, { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "storage controllers" }, { "field": "supply_chain_layers", "value": "data management soc" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "storage controllers" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "fabless chip design" }, { "field": "supply_chain_layers", "value": "storage controllers" }, { "field": "supply_chain_layers", "value": "data management soc" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-maxio-profile-20260801", "title": "About Maxio", "publisher": "联芸科技（杭州）股份有限公司", "url": "https://www.maxio-tech.com/about/intro.html", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Controller design is not NAND or DRAM wafer fabrication; foundry, OSAT and named product/customer links remain undisclosed." ] } ], "entity_reference": { "entity_id": "ent-maxio-technology-hangzhou", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "联芸科技（杭州）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "联芸科技（杭州）股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Memblaze", "忆恒创源" ], "brands": [], "canonical_legal_name_cn": "北京忆恒创源科技股份有限公司", "canonical_legal_name_en": "Memblaze Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-memblaze", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-memblaze", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [ "proc-storage-tier" ], "product_ids": [ "prod-memblaze-pblaze6-6541" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-memblaze-ymtc-pblaze6" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "ssd", "storage" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "c80fa9707f8240800caf682a498bacd355c55fc8c6967435b294d5ed27b33358", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "ssd" }, { "field": "supply_chain_layers", "value": "storage" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "ssd" }, { "field": "supply_chain_layers", "value": "storage" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-memblaze-ymtc-pblaze6", "title": "PBlaze6 6541 Enterprise SSD", "publisher": "北京忆恒创源科技股份有限公司", "url": "https://www.memblaze.com/product/pblaze6/639.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Direct product BOM join for NAND only; controller, PMIC, firmware component origins and shipment volume are not fully disclosed." ] } ], "entity_reference": { "entity_id": "ent-memblaze", "record_level": "company", "canonical_legal_name_en": "Memblaze Technology Co., Ltd.", "canonical_legal_name_cn": "北京忆恒创源科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Memblaze Technology Co., Ltd.", "canonical_legal_name_cn": "北京忆恒创源科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "MetaX", "沐曦" ], "brands": [], "canonical_legal_name_cn": "沐曦集成电路（上海）股份有限公司", "canonical_legal_name_en": "MetaX Integrated Circuits (Shanghai) Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-metax", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-metax", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [ "proc-chip-ai-accelerator" ], "product_ids": [ "prod-metax-c500", "prod-metax-n100" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-metax-annual-2025", "src-metax-legal" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "gpus", "accelerators" ], "ticker": "688802", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "5a27ac5dc4f36caf88532ec12a0883d8653de6cd458b3c0e3d708dd9c14c2ef1", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "gpus" }, { "field": "supply_chain_layers", "value": "accelerators" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "gpus" }, { "field": "supply_chain_layers", "value": "accelerators" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-metax-annual-2025", "title": "沐曦集成电路（上海）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-27/688802_20260327_0HOB.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Fabless contractors are unnamed; 2025 board-sales totals are family-category totals, not model-specific.", "Overseas HBM, EDA and interface-IP suppliers are not named." ] }, { "source_id": "src-metax-legal", "title": "Legal Statement", "publisher": "MetaX Integrated Circuits (Shanghai) Co., Ltd.", "url": "https://www.metax-tech.com/en/index/statement.html", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "English legal-name receipt only." ] } ], "entity_reference": { "entity_id": "ent-metax", "record_level": "company", "canonical_legal_name_en": "MetaX Integrated Circuits (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "沐曦集成电路（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "MetaX Integrated Circuits (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "沐曦集成电路（上海）股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Montage", "澜起科技" ], "brands": [], "canonical_legal_name_cn": "澜起科技股份有限公司", "canonical_legal_name_en": "Montage Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-montage", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-montage", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [ "proc-storage-tier" ], "product_ids": [ "prod-montage-m88mx6852" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-montage-mxc-official" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "memory_interfaces", "controllers" ], "ticker": "688008", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "7523b30117239ab3ec6728f73d36a3036f31ac50c1b39e17f035e3768a17438f", "stage_ids": [ "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "memory_interfaces" }, { "field": "supply_chain_layers", "value": "controllers" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "memory_interfaces" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "memory_interfaces" }, { "field": "supply_chain_layers", "value": "controllers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-montage-mxc-official", "title": "MXC Memory Expansion Controller", "publisher": "澜起科技股份有限公司", "url": "https://www.montage-tech.com/index.php/MXC", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Product availability does not prove deployment in a named accelerator, p50/p99 latency, energy, contention, or recovery." ] } ], "entity_reference": { "entity_id": "ent-montage", "record_level": "company", "canonical_legal_name_en": "Montage Technology Co., Ltd.", "canonical_legal_name_cn": "澜起科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Montage Technology Co., Ltd.", "canonical_legal_name_cn": "澜起科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Moore Threads", "摩尔线程" ], "brands": [], "canonical_legal_name_cn": "摩尔线程智能科技（北京）股份有限公司", "canonical_legal_name_en": "Moore Threads Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-moore-threads", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-moore-threads", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [ "proc-chip-ai-accelerator" ], "product_ids": [ "prod-moore-threads-s5000" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-moore-threads-listing-2025", "src-moore-threads-legal", "src-moore-threads-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "gpus", "accelerators" ], "ticker": "688795", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "d71f2fb0ddc5f08561d0d2c5242c9e1eb6332c8c8af47fca657ee186e7714b2c", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "gpus" }, { "field": "supply_chain_layers", "value": "accelerators" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "gpus" }, { "field": "supply_chain_layers", "value": "accelerators" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-moore-threads-listing-2025", "title": "摩尔线程智能科技（北京）股份有限公司股票科创板上市公告书", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/announcement/listing/ipo/c/c_20251204_10800678.shtml", "source_type": "exchange_listing_notice", "primary_status": "primary", "publication_date": "2025-12-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal/listing identity only." ] }, { "source_id": "src-moore-threads-legal", "title": "Compliance / Legal", "publisher": "Moore Threads Technology Co., Ltd.", "url": "https://en.mthreads.com/legal/compliance", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "English legal-name receipt only." ] }, { "source_id": "src-moore-threads-annual-2025", "title": "摩尔线程智能科技（北京）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-27/688795_20260427_CUNP.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, OSAT, board maker, memory supplier and customer names are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-moore-threads", "record_level": "company", "canonical_legal_name_en": "Moore Threads Technology Co., Ltd.", "canonical_legal_name_cn": "摩尔线程智能科技（北京）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Moore Threads Technology Co., Ltd.", "canonical_legal_name_cn": "摩尔线程智能科技（北京）股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Nantong Tongfu" ], "brands": [], "canonical_legal_name_cn": "南通通富微电子有限公司", "canonical_legal_name_en": "Nantong TongFu Microelectronics Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-nantong-tongfu", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-nantong-tongfu-hbs-chiplet-line" ], "former_names": [], "headquarters": "Nantong, Jiangsu, China", "id": "ent-nantong-tongfu", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-tongfu", "process_ids": [ "proc-osat-assembly" ], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-tongfu-hbm-project-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "advanced_packaging" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "fb3a64c7ae573cec6c57b2c65470a718e2dca7cbc6a61285700e2d31b2e0a72e", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "advanced_packaging" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "advanced_packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-tongfu-hbm-project-2025", "title": "HBM芯粒先进封装研发及产线建设项目环境影响报告表公示", "publisher": "通富微电子股份有限公司", "url": "https://www.tfme.com/news/1380.html", "source_type": "company_project_eia", "primary_status": "primary", "publication_date": "2025-01-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Project/EIA receipt is not HBM customer qualification, qualified stack generation, yield, shipment, or volume production." ] } ], "entity_reference": { "entity_id": "ent-nantong-tongfu", "record_level": "company", "canonical_legal_name_en": "Nantong TongFu Microelectronics Co., Ltd.", "canonical_legal_name_cn": "南通通富微电子有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Nantong TongFu Microelectronics Co., Ltd.", "canonical_legal_name_cn": "南通通富微电子有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-tongfu", "state_parent": null }, "geography": { "headquarters": "Nantong, Jiangsu, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-nantong-tongfu-hbs-chiplet-line" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Nata", "南大光电" ], "brands": [], "canonical_legal_name_cn": "江苏南大光电材料股份有限公司", "canonical_legal_name_en": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-nata", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Suzhou, Jiangsu, China", "id": "ent-nata", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-nata-electronic-gases", "src-nata-mo-sources" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "electronic_gases", "metalorganic_precursors", "photoresist" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "31c8d1abadbdc3414d445c807e7367eac2547fd5bb44eaf150b578f59e1a4a8a", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "electronic_gases" }, { "field": "supply_chain_layers", "value": "metalorganic_precursors" }, { "field": "supply_chain_layers", "value": "photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "electronic_gases" }, { "field": "supply_chain_layers", "value": "metalorganic_precursors" }, { "field": "supply_chain_layers", "value": "photoresist" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nata-electronic-gases", "title": "电子特气", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/dianziteqi/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No impurity-by-element, moisture/oxygen/particle limits, CoA, named fab, qualified layer or shipment quantity." ] }, { "source_id": "src-nata-mo-sources", "title": "MO源", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/moyuan", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Adduct/Semi are not numeric purity specifications; no CoA, named customer, facility or qualification." ] } ], "entity_reference": { "entity_id": "ent-nata", "record_level": "company", "canonical_legal_name_en": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "canonical_legal_name_cn": "江苏南大光电材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "canonical_legal_name_cn": "江苏南大光电材料股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Suzhou, Jiangsu, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "NAURA", "北方华创", "七星电子" ], "brands": [], "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-naura", "entity_type": "company", "exchange": "SZSE", "facility_ids": [], "former_names": [ "北京七星华创电子股份有限公司" ], "headquarters": "Beijing, China", "id": "ent-naura", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-naura-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "wafer_fabrication_equipment" ], "ticker": "002371", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "d4715b4f8698e1c94efc231d3934bfdc7c9b5adb9ad397362c129dbb84da8798", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer_fabrication_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "wafer_fabrication_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-annual-2025", "title": "北方华创科技集团股份有限公司2025年年度报告", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225122918.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio coverage does not prove a model's installation, qualified layer, uptime, yield, or recurring volume at a named fab." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Netac", "朗科科技" ], "brands": [], "canonical_legal_name_cn": "深圳市朗科科技股份有限公司", "canonical_legal_name_en": "Netac Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-netac-technology", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-netac-technology", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-netac-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "memory modules", "ssd storage", "storage boards", "external storage" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "eef8679437cb8cca67944985f8024b2a7773a5f6df08facb63c77eb3c5c59c1d", "stage_ids": [ "memory_manufacturer", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "memory modules" }, { "field": "supply_chain_layers", "value": "ssd storage" }, { "field": "supply_chain_layers", "value": "storage boards" }, { "field": "supply_chain_layers", "value": "external storage" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "storage boards" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "memory modules" }, { "field": "supply_chain_layers", "value": "ssd storage" }, { "field": "supply_chain_layers", "value": "storage boards" }, { "field": "supply_chain_layers", "value": "external storage" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-netac-profile-20260801", "title": "Netac Technology", "publisher": "Netac Technology Co., Ltd.", "url": "https://www.netac.com/", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "The portfolio supports a module and storage-product vendor, not a memory-wafer fab or a named upstream relationship." ] } ], "entity_reference": { "entity_id": "ent-netac-technology", "record_level": "company", "canonical_legal_name_en": "Netac Technology Co., Ltd.", "canonical_legal_name_cn": "深圳市朗科科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Netac Technology Co., Ltd.", "canonical_legal_name_cn": "深圳市朗科科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "晶合集成", "Nexchip" ], "brands": [ "Nexchip" ], "canonical_legal_name_cn": "合肥晶合集成电路股份有限公司", "canonical_legal_name_en": "Nexchip Semiconductor Corporation", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-nexchip-hefei", "entity_type": "company", "exchange": "Shanghai Stock Exchange STAR Market", "facility_ids": [], "former_names": [], "headquarters": "Hefei, Anhui, China", "id": "ent-nexchip-hefei", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_mixed_ownership_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-nexchip-profile-en", "src-nexchip-sse-listing" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "688249", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "c09b9fcbe2af24ad4469e93b20365ac139007326adf73375cabdd47a839abbad", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nexchip-profile-en", "title": "Corporate Profile", "publisher": "Nexchip Semiconductor Corporation", "url": "https://www.nexchip.com.cn/en-us/About/Introduce", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The founding joint-venture statement is not proof of the current controlling shareholder." ] }, { "source_id": "src-nexchip-sse-listing", "title": "关于合肥晶合集成电路股份有限公司人民币普通股股票科创板上市交易的公告", "publisher": "上海证券交易所", "url": "https://www.sse.com.cn/disclosure/announcement/listing/ipo/c/c_20230504_89473619.shtml", "source_type": "exchange_notice", "primary_status": "primary", "publication_date": "2023-05-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The company's July 2026 Hong Kong listing is mentioned on its current profile, but its HKEX code was not closed in this lane." ] } ], "entity_reference": { "entity_id": "ent-nexchip-hefei", "record_level": "company", "canonical_legal_name_en": "Nexchip Semiconductor Corporation", "canonical_legal_name_cn": "合肥晶合集成电路股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Nexchip Semiconductor Corporation", "canonical_legal_name_cn": "合肥晶合集成电路股份有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_mixed_ownership_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Hefei, Anhui, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "NIO", "蔚来" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": "NIO Inc.", "completion_state": "source_backed", "countries_of_operation": [ "ownership_country_unresolved_in_lane_sources", "China" ], "country_of_ownership": "ownership_country_unresolved_in_lane_sources", "entity_id": "ent-nio-inc", "entity_type": "company", "exchange": "NYSE / HKEX / SGX", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-nio-inc", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_company_offshore_listed_parent", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-nio-et9-2025", "prod-nio-shenji-nx9031" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-nio-auto-shanghai-20250423", "src-nio-genitech-investment-20260226" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-genitech" ], "supply_chain_layers": [ "automotive", "chip_design" ], "ticker": "NIO / 9866", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "7c2ce4c4cbf7e15147a3a20e0d51af031c743ac7bd098d83a4f27915947903e3", "stage_ids": [ "design_company", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "chip_design" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "automotive" }, { "field": "supply_chain_layers", "value": "chip_design" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nio-auto-shanghai-20250423", "title": "NIO Showcases Its Three EV Brands at Auto Shanghai 2025", "publisher": "NIO Inc.", "url": "https://www.nio.com/news/20250423001", "source_type": "company_customer_press_release", "primary_status": "primary", "publication_date": "2025-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No delivered ET9 count, manufacturing legal entity/facility, foundry, OSAT, package, yield or field-reliability receipt.", "NIO's mass-production wording is vendor language; the source proves delivery start and two-chip integration only." ] }, { "source_id": "src-nio-genitech-investment-20260226", "title": "NIO Inc.’s Subsidiary Enters into Definitive Agreements for RMB2.257 Billion Investment", "publisher": "NIO Inc.", "url": "https://ir.nio.com/zh-hans/news-releases/news-release-details/nio-incs-subsidiary-enters-definitive-agreements-rmb2257-billion", "source_type": "company_investor_release", "primary_status": "primary", "publication_date": "2026-02-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The disclosure post-dates ET9 launch and does not establish the historical assignee, designer or manufacturer of each NX9031 die.", "The immediate NIO legal shareholder is unnamed." ] } ], "entity_reference": { "entity_id": "ent-nio-inc", "record_level": "company", "canonical_legal_name_en": "NIO Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "NIO Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "ownership_country_unresolved_in_lane_sources", "ownership_type": "mainland_company_offshore_listed_parent", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "ownership_country_unresolved_in_lane_sources", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "NSIG", "上海硅产业集团" ], "brands": [], "canonical_legal_name_cn": "上海硅产业集团股份有限公司", "canonical_legal_name_en": "National Silicon Industry Group Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-nsig", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-nsig", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [ "proc-silicon-wafers" ], "product_ids": [ "prod-nsig-300mm-wafers" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-nsig-capacity-2025", "src-nsig-inquiry-2025" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-xinsheng-jingke" ], "supply_chain_layers": [ "silicon_wafers" ], "ticker": "688126", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "c906b02194c1d7b29c70eb37ab70ebea6906af6ff94c6b5c3b5c4a877d515e7b", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "silicon_wafers" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "silicon_wafers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nsig-capacity-2025", "title": "上海硅产业集团股份有限公司2026年度“提质增效重回报”行动方案", "publisher": "上海硅产业集团股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-17/1225114299.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group capacity is not installed-tool count, qualified output, actual output, utilization, yield or fab-specific capacity." ] }, { "source_id": "src-nsig-inquiry-2025", "title": "关于上海硅产业集团股份有限公司发行股份及支付现金购买资产并募集配套资金申请审核问询函的回复", "publisher": "上海证券交易所 / 立信会计师事务所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202509/688126_20250901_U2SY.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-09-01", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Equipment vendors and a domestic polysilicon supplier are anonymized; forecasts are not actual production." ] } ], "entity_reference": { "entity_id": "ent-nsig", "record_level": "company", "canonical_legal_name_en": "National Silicon Industry Group Co., Ltd.", "canonical_legal_name_cn": "上海硅产业集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "National Silicon Industry Group Co., Ltd.", "canonical_legal_name_cn": "上海硅产业集团股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "OmniVision Technologies, Inc.", "OVTI" ], "brands": [ "OMNIVISION" ], "canonical_legal_name_cn": null, "canonical_legal_name_en": "OMNIVISION Technologies, Inc.", "completion_state": "source_backed", "countries_of_operation": [ "United States", "China" ], "country_of_ownership": "China (historical acquisition stated; current chain unresolved)", "entity_id": "ent-omnivision-technologies-us", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Santa Clara, California, United States", "id": "ent-omnivision-technologies-us", "identity_resolution_state": "distinct_legal_entity_closed_parent_link_open", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "United States corporation", "lei": null, "ownership_type": "acquired_2019_current_immediate_parent_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-ovt-history" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "09cbb2018a6ffdbf0e9e5e746151246faeb0bd49ddc847b331ba8c52ab3efedf", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ovt-history", "title": "About Us", "publisher": "OMNIVISION", "url": "https://www.ovt.com/company/about-us/", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not provide a current legal subsidiary register or prove the immediate ownership chain." ] } ], "entity_reference": { "entity_id": "ent-omnivision-technologies-us", "record_level": "company", "canonical_legal_name_en": "OMNIVISION Technologies, Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "distinct_legal_entity_closed_parent_link_open", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "OMNIVISION Technologies, Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "distinct_legal_entity_closed_parent_link_open" }, "ownership": { "country_of_ownership": "China (historical acquisition stated; current chain unresolved)", "ownership_type": "acquired_2019_current_immediate_parent_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Santa Clara, California, United States", "countries_of_operation": [ "United States", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Payton", "沛顿科技" ], "brands": [], "canonical_legal_name_cn": "沛顿科技（深圳）有限公司", "canonical_legal_name_en": "Payton Technology (Shenzhen) Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-payton-technology-shenzhen", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-payton-technology-shenzhen", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-payton-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "dram packaging", "nand packaging", "assembly", "test" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "993602e0c059349ebcc939903bd7c1a96b30113e4548bbd7cdd80efb990312cd", "stage_ids": [ "memory_manufacturer", "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "dram packaging" }, { "field": "supply_chain_layers", "value": "nand packaging" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "dram packaging" }, { "field": "supply_chain_layers", "value": "nand packaging" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "assembly" }, { "field": "supply_chain_layers", "value": "test" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "dram packaging" }, { "field": "supply_chain_layers", "value": "nand packaging" }, { "field": "supply_chain_layers", "value": "assembly" }, { "field": "supply_chain_layers", "value": "test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-payton-profile-20260801", "title": "Payton Technology Company Profile", "publisher": "Payton Technology (Shenzhen) Co., Ltd.", "url": "https://en.kaifa.cn/uploadfiles/2020/09/20200921165222583.pdf", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Production figures are company-reported; no named customer, exact device, package flow, facility allocation or accepted shipment edge is disclosed." ] } ], "entity_reference": { "entity_id": "ent-payton-technology-shenzhen", "record_level": "company", "canonical_legal_name_en": "Payton Technology (Shenzhen) Co., Ltd.", "canonical_legal_name_cn": "沛顿科技（深圳）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Payton Technology (Shenzhen) Co., Ltd.", "canonical_legal_name_cn": "沛顿科技（深圳）有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "飞凯材料", "Phichem", "PhiChem" ], "brands": [ "PhiChem" ], "canonical_legal_name_cn": "上海飞凯材料科技股份有限公司", "canonical_legal_name_en": "PhiChem Corporation", "completion_state": "source_backed", "countries_of_operation": [ "China", "United States" ], "country_of_ownership": "China", "entity_id": "ent-phichem", "entity_type": "company", "exchange": "Shenzhen Stock Exchange ChiNext", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-phichem", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-phichem-about" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "300398", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "45a39a01dea83fb2788b9a64c9af2e750344fdb8bc1791460a756fb59e4d1377", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-phichem-about", "title": "About Us", "publisher": "PhiChem Corporation", "url": "https://phichem.com/about-us/", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The English page does not print the Chinese legal name in the extracted text." ] } ], "entity_reference": { "entity_id": "ent-phichem", "record_level": "company", "canonical_legal_name_en": "PhiChem Corporation", "canonical_legal_name_cn": "上海飞凯材料科技股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "PhiChem Corporation", "canonical_legal_name_cn": "上海飞凯材料科技股份有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China", "United States" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Piotech", "拓荆科技" ], "brands": [], "canonical_legal_name_cn": "拓荆科技股份有限公司", "canonical_legal_name_en": "Piotech Inc.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-piotech", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shenyang, Liaoning, China", "id": "ent-piotech", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [ "proc-hybrid-bonding" ], "product_ids": [ "prod-piotech-deposition-portfolio", "prod-piotech-w2w-hybrid-bonder" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-piotech-annual-2025", "src-piotech-prospectus-2021" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "deposition_equipment", "bonding_equipment" ], "ticker": "688072", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "6f1a9f3477d1cc52f6dab7270f900bbc6f34b8236810276f3c544cd94a57f385", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "deposition_equipment" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "bonding_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "deposition_equipment" }, { "field": "supply_chain_layers", "value": "bonding_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-piotech-annual-2025", "title": "拓荆科技股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688072_20260428_IFOF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio and issuer-reported progress do not establish a named HBM customer or qualified HBM production." ] }, { "source_id": "src-piotech-prospectus-2021", "title": "拓荆科技股份有限公司招股说明书（注册稿）", "publisher": "拓荆科技股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202111/000996_20211105_MYB4.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-11-05", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group/product-family scope; exact model, facility, process layer, installation, acceptance, uptime and yield are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenyang, Liaoning, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "PNCS", "Zhichun", "至纯科技", "至纯" ], "brands": [], "canonical_legal_name_cn": "上海至纯洁净系统科技股份有限公司", "canonical_legal_name_en": "PNC Process Systems Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-pnc-process-systems", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-pnc-process-systems", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-pncs-group-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "semiconductor process equipment", "high purity processing systems", "gas chemical delivery", "electronic materials" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "9d8acdb166805b4eb8291f053435e7f2dc55b18e2061d683f1de091f0d075f52", "stage_ids": [ "critical_materials", "board_system", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "high purity processing systems" }, { "field": "supply_chain_layers", "value": "gas chemical delivery" }, { "field": "supply_chain_layers", "value": "electronic materials" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "high purity processing systems" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "gas chemical delivery" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "semiconductor process equipment" }, { "field": "supply_chain_layers", "value": "high purity processing systems" }, { "field": "supply_chain_layers", "value": "gas chemical delivery" }, { "field": "supply_chain_layers", "value": "electronic materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-pncs-group-profile-20260801", "title": "PNC Group Profile", "publisher": "PNC Process Systems Co., Ltd.", "url": "https://en.pncs.cn/brand/index.html", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Shipment counts are company-reported; exact customer, product, facility, order and acceptance records are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-pnc-process-systems", "record_level": "company", "canonical_legal_name_en": "PNC Process Systems Co., Ltd.", "canonical_legal_name_cn": "上海至纯洁净系统科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "PNC Process Systems Co., Ltd.", "canonical_legal_name_cn": "上海至纯洁净系统科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Jiahe Jinwei", "Powev", "嘉合劲威" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-powev-jiahe-jinwei-brand-unresolved", "entity_type": "brand_or_unresolved_endpoint", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-powev-jiahe-jinwei-brand-unresolved", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-powev-jiahe-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "dram modules", "nand modules", "memory packaging", "assembly", "test", "storage boards" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "a3a1baae255c4407712538b47b7c0c7b4c4e04b6539ab6c0e70cbd9383be7ace", "stage_ids": [ "memory_manufacturer", "package_provider", "assembly_test", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "dram modules" }, { "field": "supply_chain_layers", "value": "nand modules" }, { "field": "supply_chain_layers", "value": "memory packaging" }, { "field": "supply_chain_layers", "value": "storage boards" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "memory packaging" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "assembly" }, { "field": "supply_chain_layers", "value": "test" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "storage boards" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "dram modules" }, { "field": "supply_chain_layers", "value": "nand modules" }, { "field": "supply_chain_layers", "value": "memory packaging" }, { "field": "supply_chain_layers", "value": "assembly" }, { "field": "supply_chain_layers", "value": "test" }, { "field": "supply_chain_layers", "value": "storage boards" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-powev-jiahe-profile-20260801", "title": "About Powev", "publisher": "Powev", "url": "https://www.powev.com/about-5/", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "The page does not prove DRAM wafer fabrication or close the exact Jiahe Jinwei legal alias or rename; no named customer edge is created." ] } ], "entity_reference": { "entity_id": "ent-powev-jiahe-jinwei-brand-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Primarius", "概伦电子" ], "brands": [], "canonical_legal_name_cn": "上海概伦电子股份有限公司", "canonical_legal_name_en": "Primarius Technologies Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-primarius", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-primarius", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-primarius-nanospice" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-primarius-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "eda" ], "ticker": "688206", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "0a56b44ff3c9a27c38f9b6e0801a2b2f11db8c74a94204394a06e9c3ada9e0d3", "stage_ids": [ "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "eda" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "eda" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-primarius-annual-2025", "title": "上海概伦电子股份有限公司2025年年度报告摘要", "publisher": "上海证券交易所", "url": "https://static.cninfo.com.cn/finalpage/2026-04-16/1225108666.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Summary-level portfolio statement; customer, PDK, tapeout, process and production-chip evidence remain product-specific." ] } ], "entity_reference": { "entity_id": "ent-primarius", "record_level": "company", "canonical_legal_name_en": "Primarius Technologies Co., Ltd.", "canonical_legal_name_cn": "上海概伦电子股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Primarius Technologies Co., Ltd.", "canonical_legal_name_cn": "上海概伦电子股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Puya", "普冉股份" ], "brands": [], "canonical_legal_name_cn": "普冉半导体（上海）股份有限公司", "canonical_legal_name_en": "Puya Semiconductor (Shanghai) Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-puya-semiconductor", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-puya-semiconductor", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-puya-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "fabless chip design", "nor memory", "eeprom memory", "mcu", "analog chips" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "aa2157fc83e36ea4d71dab3d379cf2d58e77c46dfa54a0ea16ab3664bd474edf", "stage_ids": [ "design_company", "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "fabless chip design" } ] }, { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "mcu" }, { "field": "supply_chain_layers", "value": "analog chips" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "nor memory" }, { "field": "supply_chain_layers", "value": "eeprom memory" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "fabless chip design" }, { "field": "supply_chain_layers", "value": "nor memory" }, { "field": "supply_chain_layers", "value": "eeprom memory" }, { "field": "supply_chain_layers", "value": "mcu" }, { "field": "supply_chain_layers", "value": "analog chips" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-puya-profile-20260801", "title": "About Puya Semiconductor", "publisher": "Puya Semiconductor (Shanghai) Co., Ltd.", "url": "https://www.puyasemi.com/en/about.html", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Named downstream brands are general use statements without exact product, order, volume or current qualification evidence." ] } ], "entity_reference": { "entity_id": "ent-puya-semiconductor", "record_level": "company", "canonical_legal_name_en": "Puya Semiconductor (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "普冉半导体（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Puya Semiconductor (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "普冉半导体（上海）股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Red Avenue", "Red Avenue New Materials", "彤程新材" ], "brands": [], "canonical_legal_name_cn": "彤程新材料集团股份有限公司", "canonical_legal_name_en": "Red Avenue New Materials Group Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-red-avenue", "entity_type": "company", "exchange": "SSE", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-red-avenue", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-red-avenue-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-tongcheng-chemical-china", "ent-tongcheng-electronic-materials-shanghai" ], "supply_chain_layers": [ "semiconductor_materials", "photoresist", "cmp_pads", "high_purity_solvents" ], "ticker": "603650", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "8619f7959b79133690b1743921639162ae80bf98bb9230297d0ca8391d144492", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "semiconductor_materials" }, { "field": "supply_chain_layers", "value": "photoresist" }, { "field": "supply_chain_layers", "value": "cmp_pads" }, { "field": "supply_chain_layers", "value": "high_purity_solvents" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "semiconductor_materials" }, { "field": "supply_chain_layers", "value": "photoresist" }, { "field": "supply_chain_layers", "value": "cmp_pads" }, { "field": "supply_chain_layers", "value": "high_purity_solvents" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] } ], "entity_reference": { "entity_id": "ent-red-avenue", "record_level": "company", "canonical_legal_name_en": "Red Avenue New Materials Group Co., Ltd.", "canonical_legal_name_cn": "彤程新材料集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Red Avenue New Materials Group Co., Ltd.", "canonical_legal_name_cn": "彤程新材料集团股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "瑞芯微", "Rockchip" ], "brands": [ "Rockchip" ], "canonical_legal_name_cn": "瑞芯微电子股份有限公司", "canonical_legal_name_en": "Rockchip Electronics Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-rockchip", "entity_type": "company", "exchange": "Shanghai Stock Exchange", "facility_ids": [], "former_names": [], "headquarters": "Fuzhou, Fujian, China", "id": "ent-rockchip", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-rockchip-profile" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "603893", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "9f96d34dd03c8293d9cb43c1a2419225ba3ada1847b9774827c69c650fcfff12", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-rockchip-profile", "title": "About Rockchip", "publisher": "Rockchip Electronics Co., Ltd.", "url": "https://www.rock-chips.com/a/en/About_Rockchip/About_Rockchip/index.html", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [] } ], "entity_reference": { "entity_id": "ent-rockchip", "record_level": "company", "canonical_legal_name_en": "Rockchip Electronics Co., Ltd.", "canonical_legal_name_cn": "瑞芯微电子股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Rockchip Electronics Co., Ltd.", "canonical_legal_name_cn": "瑞芯微电子股份有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Fuzhou, Fujian, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "RSLaser", "北京科益虹源" ], "brands": [], "canonical_legal_name_cn": "北京科益虹源光电技术有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-rslaser", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-rslaser-yizhuang-base" ], "former_names": [], "headquarters": "Beijing, China", "id": "ent-rslaser", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-rslaser-yizhuang-project-2021" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "lithography_light_source", "equipment_components" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "60bd25f7dcec6c4d4d954f750f7b39e4eae91c7b1cc4b2a45c58154ffdefbfdc", "stage_ids": [ "lithography", "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "lithography_light_source" } ] }, { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "equipment_components" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "lithography_light_source" }, { "field": "supply_chain_layers", "value": "equipment_components" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-rslaser-yizhuang-project-2021", "title": "科益虹源集成电路光刻光源制造及翻新基地（北京亦庄研发基地）项目", "publisher": "北京市公共资源交易服务平台", "url": "https://ggzyfw.beijing.gov.cn/jylcgcjs/20210910/2058109.html", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2021-09-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Project registration is not construction completion, installed capacity, output, customer delivery or scanner integration." ] } ], "entity_reference": { "entity_id": "ent-rslaser", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科益虹源光电技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科益虹源光电技术有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-rslaser-yizhuang-base" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "SAIC", "上汽集团" ], "brands": [], "canonical_legal_name_cn": "上海汽车集团股份有限公司", "canonical_legal_name_en": "SAIC Motor Corporation Limited", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-saic-motor", "entity_type": "company", "exchange": "SSE", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-saic-motor", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public_state_controlled", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-saic-soa-conference-20221104" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "automotive" ], "ticker": "600104", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "c7625288d7c7ca5b288125c3534fa4c391affbcf180e291260453ede9b4b458f", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "automotive" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-saic-soa-conference-20221104", "title": "第二届上汽零束SOA平台开发者大会揭幕", "publisher": "上海汽车集团股份有限公司", "url": "https://www.saicmotor.com/m/xwzx/xwk/2022/58086.shtml", "source_type": "company_customer_press_release", "primary_status": "primary", "publication_date": "2022-11-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No exact vehicle program, Horizon legal entity, board/controller, order, SOP, shipment or field receipt.", "Other delivered SOA vehicles in the page are not tied to Journey 5; the future 2025 production target is not achieved production evidence." ] } ], "entity_reference": { "entity_id": "ent-saic-motor", "record_level": "company", "canonical_legal_name_en": "SAIC Motor Corporation Limited", "canonical_legal_name_cn": "上海汽车集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "SAIC Motor Corporation Limited", "canonical_legal_name_cn": "上海汽车集团股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public_state_controlled", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Samsung Xi'an" ], "brands": [], "canonical_legal_name_cn": "三星（中国）半导体有限公司", "canonical_legal_name_en": "Samsung (China) Semiconductor Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "South Korea", "China" ], "country_of_ownership": "South Korea", "entity_id": "ent-samsung-china-semiconductor", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-samsung-xian-nand" ], "former_names": [], "headquarters": "Xi'an, Shaanxi, China", "id": "ent-samsung-china-semiconductor", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-samsung-electronics", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-samsung-xian-operation-2014" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "nand_memory", "wafer_fabrication" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "b1b0f260a6091be5d3aa3eeac6fe0ad8ee7268deb1deb4cc69b92afca797e9bf", "stage_ids": [ "logic_foundry_process", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer_fabrication" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "nand_memory" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "nand_memory" }, { "field": "supply_chain_layers", "value": "wafer_fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-samsung-xian-operation-2014", "title": "Samsung Announces Operation of Its Memory Facility in Xi'an, China", "publisher": "Samsung Electronics", "url": "https://news.samsung.com/global/samsung-announces-operation-of-its-memory-facility-in-xian-china", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2014-05-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical start receipt; current capacity, generation, utilization, supplier mix, and export-control exposure require later sources." ] } ], "entity_reference": { "entity_id": "ent-samsung-china-semiconductor", "record_level": "company", "canonical_legal_name_en": "Samsung (China) Semiconductor Co., Ltd.", "canonical_legal_name_cn": "三星（中国）半导体有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Samsung (China) Semiconductor Co., Ltd.", "canonical_legal_name_cn": "三星（中国）半导体有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "South Korea", "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-samsung-electronics", "state_parent": null }, "geography": { "headquarters": "Xi'an, Shaanxi, China", "countries_of_operation": [ "South Korea", "China" ], "facility_ids": [ "fac-samsung-xian-nand" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Samsung Electronics" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": "Samsung Electronics Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "South Korea", "China" ], "country_of_ownership": "South Korea", "entity_id": "ent-samsung-electronics", "entity_type": "company", "exchange": "KRX", "facility_ids": [], "former_names": [], "headquarters": "Suwon, South Korea", "id": "ent-samsung-electronics", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-samsung-xian-operation-2014" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-samsung-china-semiconductor" ], "supply_chain_layers": [ "memory", "electronics" ], "ticker": "005930", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "bb609690c7b6dea0776424758e945977eb484446dd3ea785f1f05ee9e329e498", "stage_ids": [ "memory_manufacturer", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "memory" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "electronics" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "memory" }, { "field": "supply_chain_layers", "value": "electronics" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-samsung-xian-operation-2014", "title": "Samsung Announces Operation of Its Memory Facility in Xi'an, China", "publisher": "Samsung Electronics", "url": "https://news.samsung.com/global/samsung-announces-operation-of-its-memory-facility-in-xian-china", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2014-05-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical start receipt; current capacity, generation, utilization, supplier mix, and export-control exposure require later sources." ] } ], "entity_reference": { "entity_id": "ent-samsung-electronics", "record_level": "company", "canonical_legal_name_en": "Samsung Electronics Co., Ltd.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Samsung Electronics Co., Ltd.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "South Korea", "ownership_type": "foreign_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Suwon, South Korea", "countries_of_operation": [ "South Korea", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Sanan IC", "三安集成" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-sanan-ic-brand-unresolved", "entity_type": "brand_or_unresolved_endpoint", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-sanan-ic-brand-unresolved", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-sanan-ic-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "compound semiconductor foundry" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "fe0ba5a792b7df0ceed84c2acb69e7c3369513c527f34a708bd9b7ba95bfe058", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "compound semiconductor foundry" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "compound semiconductor foundry" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-sanan-ic-profile-20260801", "title": "About Sanan IC", "publisher": "Sanan IC", "url": "https://www.sanan-ic.com/en/about-us", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Business-unit branding does not resolve one contracting legal operator for every factory or product." ] } ], "entity_reference": { "entity_id": "ent-sanan-ic-brand-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Semitronix", "广立微" ], "brands": [], "canonical_legal_name_cn": "杭州广立微电子股份有限公司", "canonical_legal_name_en": "Semitronix Corporation", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-semitronix", "entity_type": "company", "exchange": "SZSE ChiNext", "facility_ids": [], "former_names": [], "headquarters": "Hangzhou, Zhejiang, China", "id": "ent-semitronix", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-semitronix-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "eda", "wafer_test", "yield_analysis" ], "ticker": "301095", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "2d9ec6679803c8a160f550d0267eef77487232c14cc097f6482cbd09c355f33d", "stage_ids": [ "eda", "wafer_equipment", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "eda" } ] }, { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "yield_analysis" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer_test" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "eda" }, { "field": "supply_chain_layers", "value": "wafer_test" }, { "field": "supply_chain_layers", "value": "yield_analysis" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-semitronix-annual-2025", "title": "杭州广立微电子股份有限公司2025年年度报告摘要", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-23/1225153966.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Does not identify a qualified process layer, fab installation, or attributable yield improvement." ] } ], "entity_reference": { "entity_id": "ent-semitronix", "record_level": "company", "canonical_legal_name_en": "Semitronix Corporation", "canonical_legal_name_cn": "杭州广立微电子股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Semitronix Corporation", "canonical_legal_name_cn": "杭州广立微电子股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Hangzhou, Zhejiang, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Fudan Micro", "复旦微电" ], "brands": [], "canonical_legal_name_cn": "上海复旦微电子集团股份有限公司", "canonical_legal_name_en": "Shanghai Fudan Microelectronics Group Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-shanghai-fudan-microelectronics", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-shanghai-fudan-microelectronics", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-fudan-micro-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "fabless chip design", "asic design", "non volatile memory" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "ed0063f6416b58a02d64e1c057750ce43394ecbf031085fee1471e13afb300c6", "stage_ids": [ "design_company", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "fabless chip design" }, { "field": "supply_chain_layers", "value": "asic design" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "non volatile memory" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "fabless chip design" }, { "field": "supply_chain_layers", "value": "asic design" }, { "field": "supply_chain_layers", "value": "non volatile memory" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-fudan-micro-profile-20260801", "title": "About Fudan Microelectronics", "publisher": "Shanghai Fudan Microelectronics Group Co., Ltd.", "url": "https://eng.fmsh.com/about.shtml", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "No named foundry, wafer-fabrication claim, exact customer or product-level supply relationship is disclosed." ] } ], "entity_reference": { "entity_id": "ent-shanghai-fudan-microelectronics", "record_level": "company", "canonical_legal_name_en": "Shanghai Fudan Microelectronics Group Co., Ltd.", "canonical_legal_name_cn": "上海复旦微电子集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shanghai Fudan Microelectronics Group Co., Ltd.", "canonical_legal_name_cn": "上海复旦微电子集团股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Hanbell", "汉钟精机" ], "brands": [], "canonical_legal_name_cn": "上海汉钟精机股份有限公司", "canonical_legal_name_en": "Shanghai Hanbell Precise Machinery Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-shanghai-hanbell", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-shanghai-hanbell", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-hanbell-profile-vacuum-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "semiconductor vacuum equipment" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "f3dc87d44967b2539e1c7c35a17740246667dfce91b9959ee17dd69142f0c488", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "semiconductor vacuum equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hanbell-profile-vacuum-20260801", "title": "Company Profile and Vacuum Pumps", "publisher": "Shanghai Hanbell Precise Machinery Co., Ltd.", "url": "https://hanbell.com.cn/En/company-profile?tp/1", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Application fit does not prove a named fab installation, customer order or accepted production tool." ] } ], "entity_reference": { "entity_id": "ent-shanghai-hanbell", "record_level": "company", "canonical_legal_name_en": "Shanghai Hanbell Precise Machinery Co., Ltd.", "canonical_legal_name_cn": "上海汉钟精机股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shanghai Hanbell Precise Machinery Co., Ltd.", "canonical_legal_name_cn": "上海汉钟精机股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Kingstone", "凯世通" ], "brands": [], "canonical_legal_name_cn": "上海凯世通半导体股份有限公司", "canonical_legal_name_en": "Shanghai Kingstone Semiconductor Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-shanghai-kingstone-semiconductor", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-shanghai-kingstone-semiconductor", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-kingstone-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "ion implant semiconductor equipment", "production deployment evidence" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "d861d52400cfd7641c522f3574a7193ca0bca026cc7ce130b5757f8335a0d214", "stage_ids": [ "wafer_equipment", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "ion implant semiconductor equipment" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "production deployment evidence" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "ion implant semiconductor equipment" }, { "field": "supply_chain_layers", "value": "production deployment evidence" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kingstone-profile-20260801", "title": "About Kingstone Semiconductor", "publisher": "Shanghai Kingstone Semiconductor Co., Ltd.", "url": "https://www.kingstonesemi.com/en/about", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "System counts, manufacturer counts and wafer volumes are anonymous and company-reported; no named customer or accepted tool edge is created." ] } ], "entity_reference": { "entity_id": "ent-shanghai-kingstone-semiconductor", "record_level": "company", "canonical_legal_name_en": "Shanghai Kingstone Semiconductor Co., Ltd.", "canonical_legal_name_cn": "上海凯世通半导体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shanghai Kingstone Semiconductor Co., Ltd.", "canonical_legal_name_cn": "上海凯世通半导体股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Shanghai Sinyang", "新阳半导体" ], "brands": [], "canonical_legal_name_cn": "上海新阳半导体材料股份有限公司", "canonical_legal_name_en": "Shanghai Sinyang Semiconductor Materials Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-shanghai-sinyang-semiconductor-materials", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-shanghai-sinyang-semiconductor-materials", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-sinyang-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "plating materials", "cleaning materials", "etching materials", "lithography materials", "cmp materials", "advanced packaging materials" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "e4cccbd26d03f78ab6a618a2a689e28544f39766ef8d27d582f119e074de13e4", "stage_ids": [ "lithography", "critical_materials", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "lithography materials" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "plating materials" }, { "field": "supply_chain_layers", "value": "cleaning materials" }, { "field": "supply_chain_layers", "value": "etching materials" }, { "field": "supply_chain_layers", "value": "lithography materials" }, { "field": "supply_chain_layers", "value": "cmp materials" }, { "field": "supply_chain_layers", "value": "advanced packaging materials" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "advanced packaging materials" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "plating materials" }, { "field": "supply_chain_layers", "value": "cleaning materials" }, { "field": "supply_chain_layers", "value": "etching materials" }, { "field": "supply_chain_layers", "value": "lithography materials" }, { "field": "supply_chain_layers", "value": "cmp materials" }, { "field": "supply_chain_layers", "value": "advanced packaging materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-sinyang-annual-2025", "title": "上海新阳半导体材料股份有限公司2025年年度报告", "publisher": "上海新阳半导体材料股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-03-13/1225006867.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-03-13", "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Issuer portfolio evidence only; no named fab, package flow, exact grade, qualification or recurring supply edge is disclosed." ] } ], "entity_reference": { "entity_id": "ent-shanghai-sinyang-semiconductor-materials", "record_level": "company", "canonical_legal_name_en": "Shanghai Sinyang Semiconductor Materials Co., Ltd.", "canonical_legal_name_cn": "上海新阳半导体材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shanghai Sinyang Semiconductor Materials Co., Ltd.", "canonical_legal_name_cn": "上海新阳半导体材料股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "深南电路", "SCC" ], "brands": [ "SCC" ], "canonical_legal_name_cn": "深南电路股份有限公司", "canonical_legal_name_en": "Shennan Circuits Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-shennan-circuits", "entity_type": "company", "exchange": "Shenzhen Stock Exchange", "facility_ids": [], "former_names": [ "Shennan Circuits Ltd." ], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-shennan-circuits", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_control_not_closed_in_lane", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-scc-profile", "src-scc-rename" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "002916", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "41e595529898213a5a4052bec30552858c7357ea67dec962063f557d02d923ed", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-scc-profile", "title": "Who is SCC?", "publisher": "Shennan Circuits Co., Ltd.", "url": "https://www.scc.com.cn/scc/en/gysn/index.html", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Current controlling shareholder was not closed in this lane." ] }, { "source_id": "src-scc-rename", "title": "Shennan Circuits Ltd. officially renamed as Shennan Circuits Co., Ltd.", "publisher": "Shennan Circuits Co., Ltd.", "url": "https://www.scc.com.cn/scc/en/xwdt/782287856969187328.html", "source_type": "official_company_release", "primary_status": "primary", "publication_date": "2015-01-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [] } ], "entity_reference": { "entity_id": "ent-shennan-circuits", "record_level": "company", "canonical_legal_name_en": "Shennan Circuits Co., Ltd.", "canonical_legal_name_cn": "深南电路股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shennan Circuits Co., Ltd.", "canonical_legal_name_cn": "深南电路股份有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_control_not_closed_in_lane", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Fuchuang Precision", "Fortune Precision" ], "brands": [], "canonical_legal_name_cn": "沈阳富创精密设备股份有限公司", "canonical_legal_name_en": "Shenyang Fortune Precision Equipment Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-shenyang-fortune-precision", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-shenyang-fortune-precision", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-fuchuang-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "semiconductor equipment components", "gas chemical delivery systems" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "079c92278fda06948cc4ed8cad6409623871442dae4978556f2aef2ca2e73c0d", "stage_ids": [ "wafer_equipment", "critical_materials", "board_system", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "semiconductor equipment components" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "gas chemical delivery systems" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "gas chemical delivery systems" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "gas chemical delivery systems" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "semiconductor equipment components" }, { "field": "supply_chain_layers", "value": "gas chemical delivery systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-fuchuang-profile-20260801", "title": "Company Profile", "publisher": "Shenyang Fortune Precision Equipment Co., Ltd.", "url": "https://en.fortune-semi.com/profile.html", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Company-reported portfolio and capability only; no named customer, exact tool, fab, order, acceptance, yield or independently verified output." ] } ], "entity_reference": { "entity_id": "ent-shenyang-fortune-precision", "record_level": "company", "canonical_legal_name_en": "Shenyang Fortune Precision Equipment Co., Ltd.", "canonical_legal_name_cn": "沈阳富创精密设备股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shenyang Fortune Precision Equipment Co., Ltd.", "canonical_legal_name_cn": "沈阳富创精密设备股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "路维光电 / Newway Photomask", "Newway", "Newway Photomask", "路维光电" ], "brands": [], "canonical_legal_name_cn": "深圳市路维光电股份有限公司", "canonical_legal_name_en": "Shenzhen Newway Photomask Making Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-shenzhen-newway-photomask", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-shenzhen-newway-photomask", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-newway-photomask-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "photomasks", "lithography materials" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "56a6a6c3e5834e4492ae8976aec0a73031b2c930330f2e1f6c6d88fb182ab4e6", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "lithography materials" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "lithography materials" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "photomasks" }, { "field": "supply_chain_layers", "value": "lithography materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-newway-photomask-profile-20260801", "title": "Newway Photomask", "publisher": "Shenzhen Newway Photomask Making Co., Ltd.", "url": "https://www.newwaymask.com/en/", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "The process range is company-reported and does not identify a named fab, mask set, qualified layer or production volume." ] } ], "entity_reference": { "entity_id": "ent-shenzhen-newway-photomask", "record_level": "company", "canonical_legal_name_en": "Shenzhen Newway Photomask Making Co., Ltd.", "canonical_legal_name_cn": "深圳市路维光电股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shenzhen Newway Photomask Making Co., Ltd.", "canonical_legal_name_cn": "深圳市路维光电股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "清溢光电 / Qingyi Photomask", "Qingyi", "Qingyi Photomask", "清溢光电" ], "brands": [], "canonical_legal_name_cn": "深圳清溢光电股份有限公司", "canonical_legal_name_en": "Shenzhen Qingyi Photomask Limited", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-shenzhen-qingyi-photomask", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-shenzhen-qingyi-photomask", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-qingyi-photomask-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "photomasks", "lithography materials" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "0cae58d5294186cb30c5f72e1fa64908f64d3fe6442192eb7b2cd49ec5aa6c29", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "lithography materials" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "lithography materials" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "photomasks" }, { "field": "supply_chain_layers", "value": "lithography materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-qingyi-photomask-profile-20260801", "title": "About Qingyi Photomask", "publisher": "Shenzhen Qingyi Photomask Limited", "url": "https://en.supermask.com/Aboutus/1.html", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "No named wafer fab, process layer, mask set, order or qualified-production relationship is disclosed." ] } ], "entity_reference": { "entity_id": "ent-shenzhen-qingyi-photomask", "record_level": "company", "canonical_legal_name_en": "Shenzhen Qingyi Photomask Limited", "canonical_legal_name_cn": "深圳清溢光电股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shenzhen Qingyi Photomask Limited", "canonical_legal_name_cn": "深圳清溢光电股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Shenzhou Kuntai Xiamen" ], "brands": [], "canonical_legal_name_cn": "神州鲲泰（厦门）信息技术有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-shenzhou-kuntai-xiamen", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Xiamen, Fujian, China", "id": "ent-shenzhou-kuntai-xiamen", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-digital-china-group", "process_ids": [], "product_ids": [ "prod-shenzhou-kuntai-ai-server-framework" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-digital-china-cmcc-framework-20240824" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "ai_servers" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "1af60da19e9d245fc8d1057170effc1c395b20b368a2346bb6b33679e8843f45", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "ai_servers" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "ai_servers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-digital-china-cmcc-framework-20240824", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2024-08/24/content_1957609.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2024-08-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "842 is a framework award ceiling, not an actual order, shipment, installation or acceptance count.", "Server model, accelerator/CPU/memory/NIC BOM, facility, value, serial and asset receipt are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-shenzhou-kuntai-xiamen", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "神州鲲泰（厦门）信息技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "神州鲲泰（厦门）信息技术有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-digital-china-group", "state_parent": null }, "geography": { "headquarters": "Xiamen, Fujian, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "SiCarrier", "新凯来" ], "brands": [], "canonical_legal_name_cn": "深圳市新凯来技术有限公司", "canonical_legal_name_en": "Shenzhen SiCarrier Technologies Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-sicarrier", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-sicarrier", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-gentech-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "wafer_fabrication_equipment" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "f982a279661b58744deccae0c7b8ee595b562bbf1d50f2aab623921e825f3cd6", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer_fabrication_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "wafer_fabrication_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-sicarrier", "record_level": "company", "canonical_legal_name_en": "Shenzhen SiCarrier Technologies Co., Ltd.", "canonical_legal_name_cn": "深圳市新凯来技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shenzhen SiCarrier Technologies Co., Ltd.", "canonical_legal_name_cn": "深圳市新凯来技术有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "天岳先进", "SICC" ], "brands": [ "SICC" ], "canonical_legal_name_cn": "山东天岳先进科技股份有限公司", "canonical_legal_name_en": "SICC Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China", "Japan", "Germany" ], "country_of_ownership": "China", "entity_id": "ent-sicc", "entity_type": "company", "exchange": "Shanghai Stock Exchange STAR Market / Hong Kong Stock Exchange Main Board", "facility_ids": [], "former_names": [], "headquarters": "Jinan, Shandong, China", "id": "ent-sicc", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-sicc-profile", "src-sicc-hkex-current" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "688234 / 02631", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "dce29f940c6d551c64452ab03247ca07d78969b95f789642342bb3c4fff3004e", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-sicc-profile", "title": "关于天岳：概况", "publisher": "山东天岳先进科技股份有限公司", "url": "https://www.sicc.cc/about1.html", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not display both exchange codes." ] }, { "source_id": "src-sicc-hkex-current", "title": "Stock Connect Southbound Shareholding Search By Date", "publisher": "Hong Kong Exchanges and Clearing Limited", "url": "https://www3.hkexnews.hk/sdw/search/mutualmarket.aspx?force_isolation=true&t=hk", "source_type": "exchange_record", "primary_status": "primary", "publication_date": "2026-07-22", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Shareholding values are outside this lane." ] } ], "entity_reference": { "entity_id": "ent-sicc", "record_level": "company", "canonical_legal_name_en": "SICC Co., Ltd.", "canonical_legal_name_cn": "山东天岳先进科技股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "SICC Co., Ltd.", "canonical_legal_name_cn": "山东天岳先进科技股份有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Jinan, Shandong, China", "countries_of_operation": [ "China", "Japan", "Germany" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Silan", "士兰微" ], "brands": [], "canonical_legal_name_cn": "杭州士兰微电子股份有限公司", "canonical_legal_name_en": "Hangzhou Silan Microelectronics Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-silan", "entity_type": "company", "exchange": "SSE", "facility_ids": [], "former_names": [], "headquarters": "Hangzhou, Zhejiang, China", "id": "ent-silan", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-silan-jike-company-profile", "src-silan-jike-h1-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "idm", "analog", "power_semiconductors", "mems" ], "ticker": "600460", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "559b1a1dd43973fa2ab7038c63ca9588054143ef95554dfd0fd0d997d0cf2406", "stage_ids": [ "architecture_ip", "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "analog" }, { "field": "supply_chain_layers", "value": "power_semiconductors" }, { "field": "supply_chain_layers", "value": "mems" } ] }, { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "idm" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "idm" }, { "field": "supply_chain_layers", "value": "analog" }, { "field": "supply_chain_layers", "value": "power_semiconductors" }, { "field": "supply_chain_layers", "value": "mems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-silan-jike-company-profile", "title": "子公司-厦门士兰集科微电子有限公司", "publisher": "杭州士兰微电子股份有限公司", "url": "https://www.silan.com.cn/index.php/about/info/246.html", "source_type": "company_subsidiary_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The 40,000/80,000 wafers-per-month figures are project plans, not installed, qualified or actual-output capacity." ] }, { "source_id": "src-silan-jike-h1-2025", "title": "士兰微电子2025年半年度报告精读", "publisher": "杭州士兰微电子股份有限公司", "url": "https://www.silan.com.cn/index.php/news/details/260.html", "source_type": "company_operating_update", "primary_status": "primary", "publication_date": "2025-08-01", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Full load is not a disclosed utilization percentage; output is total wafers, not good-die output or yield." ] } ], "entity_reference": { "entity_id": "ent-silan", "record_level": "company", "canonical_legal_name_en": "Hangzhou Silan Microelectronics Co., Ltd.", "canonical_legal_name_cn": "杭州士兰微电子股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Hangzhou Silan Microelectronics Co., Ltd.", "canonical_legal_name_cn": "杭州士兰微电子股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Hangzhou, Zhejiang, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "士兰集科", "Silan Jike" ], "brands": [], "canonical_legal_name_cn": "厦门士兰集科微电子有限公司", "canonical_legal_name_en": "Xiamen Silan Jike Microelectronics Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-silan-jike", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-silan-jike-12in" ], "former_names": [], "headquarters": "Xiamen, Fujian, China", "id": "ent-silan-jike", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_joint_venture", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-silan-jike-company-profile", "src-silan-jike-production-start-2020", "src-silan-jike-h1-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "wafer_fabrication", "specialty_process", "power_semiconductors" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "f81ee920ea387d54e7ad38c9c0b22dfe59416ca6a0d3a32ca2178e7744680c08", "stage_ids": [ "architecture_ip", "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "power_semiconductors" } ] }, { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer_fabrication" }, { "field": "supply_chain_layers", "value": "specialty_process" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "wafer_fabrication" }, { "field": "supply_chain_layers", "value": "specialty_process" }, { "field": "supply_chain_layers", "value": "power_semiconductors" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-silan-jike-company-profile", "title": "子公司-厦门士兰集科微电子有限公司", "publisher": "杭州士兰微电子股份有限公司", "url": "https://www.silan.com.cn/index.php/about/info/246.html", "source_type": "company_subsidiary_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The 40,000/80,000 wafers-per-month figures are project plans, not installed, qualified or actual-output capacity." ] }, { "source_id": "src-silan-jike-production-start-2020", "title": "士兰集科12英寸特色工艺芯片生产线正式投产", "publisher": "杭州士兰微电子股份有限公司", "url": "https://www.silan.com.cn/index.php/news/details/78.html", "source_type": "company_facility_announcement", "primary_status": "primary", "publication_date": "2020-12-21", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The stated 40,000 wafers/month is planned phase capacity; no yield or actual-output receipt is supplied." ] }, { "source_id": "src-silan-jike-h1-2025", "title": "士兰微电子2025年半年度报告精读", "publisher": "杭州士兰微电子股份有限公司", "url": "https://www.silan.com.cn/index.php/news/details/260.html", "source_type": "company_operating_update", "primary_status": "primary", "publication_date": "2025-08-01", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Full load is not a disclosed utilization percentage; output is total wafers, not good-die output or yield." ] } ], "entity_reference": { "entity_id": "ent-silan-jike", "record_level": "company", "canonical_legal_name_en": "Xiamen Silan Jike Microelectronics Co., Ltd.", "canonical_legal_name_cn": "厦门士兰集科微电子有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Xiamen Silan Jike Microelectronics Co., Ltd.", "canonical_legal_name_cn": "厦门士兰集科微电子有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_joint_venture", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Xiamen, Fujian, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-silan-jike-12in" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "盛合晶微", "SJ Semi", "SJ Semiconductor" ], "brands": [ "SJ Semi" ], "canonical_legal_name_cn": "盛合晶微半导体有限公司", "canonical_legal_name_en": "SJ Semiconductor Corporation", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-sjsemi-issuer", "entity_type": "company", "exchange": "Shanghai Stock Exchange STAR Market", "facility_ids": [], "former_names": [], "headquarters": "China; exact registered jurisdiction not extracted in this lane", "id": "ent-sjsemi-issuer", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "listed issuer company", "lei": null, "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-sjsemi-parent-profile", "src-sjsemi-sse-listing" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "688820", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "1bb2f21978cfa7f5712d7bbc0e90c116aeebb44270e7e2cc0b14fefa482b98a2", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-sjsemi-parent-profile", "title": "盛合晶微营收规模持续增长，进入全球OSAT前十榜单", "publisher": "盛合晶微半导体有限公司", "url": "https://www.sjsemi.com/about/22699/147095.html", "source_type": "official_company_release", "primary_status": "primary", "publication_date": "2025-08-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not establish the legal ownership relation to the Jiangyin operating entity." ] }, { "source_id": "src-sjsemi-sse-listing", "title": "关于盛合晶微半导体有限公司人民币普通股股票科创板上市交易的公告", "publisher": "上海证券交易所", "url": "https://www.sse.com.cn/disclosure/announcement/listing/ipo/c/c_20260420_10815741.shtml", "source_type": "exchange_notice", "primary_status": "primary", "publication_date": "2026-04-20", "date_checked": "2026-07-29", "access_state": "open", "limitations": [] } ], "entity_reference": { "entity_id": "ent-sjsemi-issuer", "record_level": "company", "canonical_legal_name_en": "SJ Semiconductor Corporation", "canonical_legal_name_cn": "盛合晶微半导体有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "SJ Semiconductor Corporation", "canonical_legal_name_cn": "盛合晶微半导体有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact registered jurisdiction not extracted in this lane", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "盛合晶微江阴" ], "brands": [], "canonical_legal_name_cn": "盛合晶微半导体（江阴）有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-sjsemi-jiangyin", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Jiangyin, Jiangsu, China", "id": "ent-sjsemi-jiangyin", "identity_resolution_state": "distinct_legal_entity_closed_parent_link_open", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC limited company / operating entity", "lei": null, "ownership_type": "current_parent_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-sjsemi-jiangyin" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "f14a26aea510cb813f06e3c37ba3757613c354daddfa03b261847e197aa26485", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-sjsemi-jiangyin", "title": "盛合晶微厂房建设告捷 先进封装发展再添新引擎", "publisher": "盛合晶微半导体（江阴）有限公司", "url": "https://www.sjsemi.com/about/22699/147191.html", "source_type": "official_company_release", "primary_status": "primary", "publication_date": "2025-08-19", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Do not collapse this entity into the listed issuer." ] } ], "entity_reference": { "entity_id": "ent-sjsemi-jiangyin", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "盛合晶微半导体（江阴）有限公司", "identity_resolution_state": "distinct_legal_entity_closed_parent_link_open", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "盛合晶微半导体（江阴）有限公司", "identity_resolution_state": "distinct_legal_entity_closed_parent_link_open" }, "ownership": { "country_of_ownership": "China", "ownership_type": "current_parent_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Jiangyin, Jiangsu, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "SK hynix" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": "SK hynix Inc.", "completion_state": "source_backed", "countries_of_operation": [ "South Korea", "China" ], "country_of_ownership": "South Korea", "entity_id": "ent-skhynix", "entity_type": "company", "exchange": "KRX", "facility_ids": [], "former_names": [], "headquarters": "Icheon, South Korea", "id": "ent-skhynix", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-skhynix-dalian-acquisition-2021", "src-skhynix-f1-facilities-2026", "src-skhynix-official-network-2026", "src-skhynix-sec-subsidiaries-2026", "src-skhynix-wuxi-c2f-2019" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-skhynix-dalian", "ent-skhynix-wuxi-operator-unresolved" ], "supply_chain_layers": [ "memory" ], "ticker": "000660", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "f7bc3e43ad650bf0939dea23d35f412e89591df02a92db8a2a4253d53269f2b7", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "memory" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "memory" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-skhynix-dalian-acquisition-2021", "title": "SK hynix Completes the First Phase of Intel NAND and SSD Business Acquisition", "publisher": "SK hynix", "url": "https://news.skhynix.com/sk-hynix-completes-the-first-phase-of-intel-nand-and-ssd-business-acquisition/", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2021-12-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Acquisition receipt does not provide current capacity, product generation, yield, utilization, or local supplier share." ] }, { "source_id": "src-skhynix-f1-facilities-2026", "title": "SK hynix Inc. Form F-1 Registration Statement", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785df1.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing identifies C2/C2F DRAM and Dalian NAND and states group-wide full utilization, but does not disclose facility wafer capacity, node, output, yield, tool fleet or supplier BOM.", "Parent-level owns/operates language does not by itself resolve immediate local legal-title chains." ] }, { "source_id": "src-skhynix-official-network-2026", "title": "Global Network", "publisher": "SK hynix Inc.", "url": "https://www.skhynix.com/company/UI-FR-CP06/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page identifies the Wuxi production-site legal entity and a Dalian legal entity/address; it does not disclose capacity, process generation, output, yield, tools or materials." ] }, { "source_id": "src-skhynix-sec-subsidiaries-2026", "title": "List of Subsidiaries of SK hynix Inc.", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785dex211.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Subsidiary list proves consolidated legal-entity inclusion, not immediate ownership percentage or the legal title holder for each fab parcel and tool set." ] }, { "source_id": "src-skhynix-wuxi-c2f-2019", "title": "SK hynix Completes Expanded Fab (C2F) in Wuxi, China", "publisher": "SK hynix Inc.", "url": "https://news.skhynix.com/en/sk-hynix-completes-expanded-fab-c2f-in-wuxi-china/", "source_type": "company_facility_announcement", "primary_status": "primary", "publication_date": "2019-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical announcement does not prove 2026 legal operator, capacity, technology, utilization, yield, product mix or ownership-chain changes." ] } ], "entity_reference": { "entity_id": "ent-skhynix", "record_level": "company", "canonical_legal_name_en": "SK hynix Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "SK hynix Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "South Korea", "ownership_type": "foreign_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Icheon, South Korea", "countries_of_operation": [ "South Korea", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "SK hynix Dalian NAND", "Dalian NAND fab", "Solidigm Dalian" ], "brands": [], "canonical_legal_name_cn": "爱思开海力士半导体存储技术（大连）有限公司", "canonical_legal_name_en": "SK hynix semiconductor storage technology (Dalian) Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "South Korea", "China" ], "country_of_ownership": "South Korea", "entity_id": "ent-skhynix-dalian", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-skhynix-dalian-nand" ], "former_names": [], "headquarters": "Dalian, Liaoning, China", "id": "ent-skhynix-dalian", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-skhynix", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-skhynix-dalian-acquisition-2021", "src-skhynix-official-network-2026", "src-skhynix-sec-subsidiaries-2026", "src-liaoning-skhynix-dalian-2026" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "nand_memory", "wafer_fabrication" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "9c8b29a2a3bcc4ba300020d8f0db09876e3fcac299b0f490217d3eb4a433c2dd", "stage_ids": [ "logic_foundry_process", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer_fabrication" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "nand_memory" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "nand_memory" }, { "field": "supply_chain_layers", "value": "wafer_fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-skhynix-dalian-acquisition-2021", "title": "SK hynix Completes the First Phase of Intel NAND and SSD Business Acquisition", "publisher": "SK hynix", "url": "https://news.skhynix.com/sk-hynix-completes-the-first-phase-of-intel-nand-and-ssd-business-acquisition/", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2021-12-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Acquisition receipt does not provide current capacity, product generation, yield, utilization, or local supplier share." ] }, { "source_id": "src-skhynix-official-network-2026", "title": "Global Network", "publisher": "SK hynix Inc.", "url": "https://www.skhynix.com/company/UI-FR-CP06/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page identifies the Wuxi production-site legal entity and a Dalian legal entity/address; it does not disclose capacity, process generation, output, yield, tools or materials." ] }, { "source_id": "src-skhynix-sec-subsidiaries-2026", "title": "List of Subsidiaries of SK hynix Inc.", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785dex211.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Subsidiary list proves consolidated legal-entity inclusion, not immediate ownership percentage or the legal title holder for each fab parcel and tool set." ] }, { "source_id": "src-liaoning-skhynix-dalian-2026", "title": "3000余岗位助力大学生留辽来辽", "publisher": "辽宁省人民政府", "url": "https://www.ln.gov.cn/web/qmzx/yhyshjzt/dt/2026061509212657810/index.shtml", "source_type": "government_employment_record", "primary_status": "primary", "publication_date": "2026-06-15", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The government record confirms the current Chinese legal name only; it does not identify fab title, capacity, product generation, utilization, output, yield or supplier BOM." ] } ], "entity_reference": { "entity_id": "ent-skhynix-dalian", "record_level": "company", "canonical_legal_name_en": "SK hynix semiconductor storage technology (Dalian) Co., Ltd.", "canonical_legal_name_cn": "爱思开海力士半导体存储技术（大连）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "SK hynix semiconductor storage technology (Dalian) Co., Ltd.", "canonical_legal_name_cn": "爱思开海力士半导体存储技术（大连）有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "South Korea", "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-skhynix", "state_parent": null }, "geography": { "headquarters": "Dalian, Liaoning, China", "countries_of_operation": [ "South Korea", "China" ], "facility_ids": [ "fac-skhynix-dalian-nand" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "SK hynix Wuxi", "SK海力士无锡" ], "brands": [], "canonical_legal_name_cn": "SK海力士半导体（中国）有限公司", "canonical_legal_name_en": "SK hynix Semiconductor (China) Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "South Korea", "China" ], "country_of_ownership": "South Korea", "entity_id": "ent-skhynix-wuxi-operator-unresolved", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-skhynix-wuxi-c2", "fac-skhynix-wuxi-c2f" ], "former_names": [], "headquarters": "Wuxi, Jiangsu, China", "id": "ent-skhynix-wuxi-operator-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-skhynix", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-skhynix-f1-facilities-2026", "src-skhynix-official-network-2026", "src-skhynix-sec-subsidiaries-2026", "src-skhynix-wuxi-c2f-2019", "src-wuxi-skhynix-environment-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "dram_memory", "wafer_fabrication" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "26b0783f76d4a378451aa612897189dbd280f522faafe66ddcca2fe0d6c29a95", "stage_ids": [ "logic_foundry_process", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer_fabrication" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "dram_memory" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "dram_memory" }, { "field": "supply_chain_layers", "value": "wafer_fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-skhynix-f1-facilities-2026", "title": "SK hynix Inc. Form F-1 Registration Statement", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785df1.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing identifies C2/C2F DRAM and Dalian NAND and states group-wide full utilization, but does not disclose facility wafer capacity, node, output, yield, tool fleet or supplier BOM.", "Parent-level owns/operates language does not by itself resolve immediate local legal-title chains." ] }, { "source_id": "src-skhynix-official-network-2026", "title": "Global Network", "publisher": "SK hynix Inc.", "url": "https://www.skhynix.com/company/UI-FR-CP06/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page identifies the Wuxi production-site legal entity and a Dalian legal entity/address; it does not disclose capacity, process generation, output, yield, tools or materials." ] }, { "source_id": "src-skhynix-sec-subsidiaries-2026", "title": "List of Subsidiaries of SK hynix Inc.", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785dex211.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Subsidiary list proves consolidated legal-entity inclusion, not immediate ownership percentage or the legal title holder for each fab parcel and tool set." ] }, { "source_id": "src-skhynix-wuxi-c2f-2019", "title": "SK hynix Completes Expanded Fab (C2F) in Wuxi, China", "publisher": "SK hynix Inc.", "url": "https://news.skhynix.com/en/sk-hynix-completes-expanded-fab-c2f-in-wuxi-china/", "source_type": "company_facility_announcement", "primary_status": "primary", "publication_date": "2019-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical announcement does not prove 2026 legal operator, capacity, technology, utilization, yield, product mix or ownership-chain changes." ] }, { "source_id": "src-wuxi-skhynix-environment-2025", "title": "SK海力士半导体（中国）有限公司固体（危险）废物跨省转移审核意见的公告", "publisher": "无锡市新吴生态环境局", "url": "https://www.wnd.gov.cn/doc/2025/12/25/4706975.shtml", "source_type": "government_environmental_record", "primary_status": "primary", "publication_date": "2025-12-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Waste-transfer approval proves current entity/site identity, not DRAM generation, fab capacity, utilization, output, yield or production-tool qualification." ] } ], "entity_reference": { "entity_id": "ent-skhynix-wuxi-operator-unresolved", "record_level": "company", "canonical_legal_name_en": "SK hynix Semiconductor (China) Ltd.", "canonical_legal_name_cn": "SK海力士半导体（中国）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "SK hynix Semiconductor (China) Ltd.", "canonical_legal_name_cn": "SK海力士半导体（中国）有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "South Korea", "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-skhynix", "state_parent": null }, "geography": { "headquarters": "Wuxi, Jiangsu, China", "countries_of_operation": [ "South Korea", "China" ], "facility_ids": [ "fac-skhynix-wuxi-c2", "fac-skhynix-wuxi-c2f" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Skyverse", "中科飞测" ], "brands": [], "canonical_legal_name_cn": "深圳中科飞测科技股份有限公司", "canonical_legal_name_en": "Skyverse Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-skyverse", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-skyverse", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-skyverse-sse-identity-2023", "src-skyverse-ginkgoifm-p300-2025", "src-skyverse-ginkgoifm-catalogue" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "inspection", "metrology" ], "ticker": "688361", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "5a56e93067e9ad0f3db06335c210e81836edc46ee78fad4e7bc96c91ced42ec1", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "inspection" }, { "field": "supply_chain_layers", "value": "metrology" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "inspection" }, { "field": "supply_chain_layers", "value": "metrology" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-skyverse-sse-identity-2023", "title": "深圳中科飞测科技股份有限公司首次公开发行股票科创板上市公告书", "publisher": "上海证券交易所", "url": "https://www.sse.com.cn/disclosure/announcement/listing/ipo/c/c_20230518_89633026.shtml", "source_type": "exchange_filing_index", "primary_status": "primary", "publication_date": "2023-05-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal-identity receipt only; the index is not a product-readiness receipt." ] }, { "source_id": "src-skyverse-ginkgoifm-p300-2025", "title": "Skyverse Releases GINKGOIFM-P300 and Ships First Tool to HBM Client", "publisher": "Skyverse Technology Co., Ltd.", "url": "https://www.skyverse.cn/en/article/38/30.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2025-11-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customer and facility are anonymous; shipment is not installation, acceptance, process qualification or HBM-stack qualification." ] }, { "source_id": "src-skyverse-ginkgoifm-catalogue", "title": "Wafer Flatness Metrology Equipment Series - GINKGOIFM", "publisher": "Skyverse Technology Co., Ltd.", "url": "https://www.skyverse.cn/en/article/28/27.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Family-level catalogue; it does not establish P300 throughput or qualification at a named facility." ] } ], "entity_reference": { "entity_id": "ent-skyverse", "record_level": "company", "canonical_legal_name_en": "Skyverse Technology Co., Ltd.", "canonical_legal_name_cn": "深圳中科飞测科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Skyverse Technology Co., Ltd.", "canonical_legal_name_cn": "深圳中科飞测科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "SMEE" ], "brands": [], "canonical_legal_name_cn": "上海微电子装备（集团）股份有限公司", "canonical_legal_name_en": "Shanghai Micro Electronics Equipment (Group) Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-smee", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-smee", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_linked", "parent_entity_id": null, "process_ids": [ "proc-lithography-iline-krf" ], "product_ids": [ "prod-smee-ssa600", "prod-smee-ssc800-10" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-smee-ssa600-official" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "lithography_equipment" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "d389f1f9b1b1312558c4426d0179f140fb497bcd4fb37a38c0a28401141bd7b8", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "lithography_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "lithography_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-smee-ssa600-official", "title": "600 Series Step-and-Scan Lithography System", "publisher": "上海微电子装备（集团）股份有限公司", "url": "https://www.smee.com.cn/eis.pub?method=indexinfo&onclicknodeno=1_4_1_1&service=homepageService", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue capability only; no named facility, serial number, installation, site acceptance, qualified layer, uptime, or yield." ] } ], "entity_reference": { "entity_id": "ent-smee", "record_level": "company", "canonical_legal_name_en": "Shanghai Micro Electronics Equipment (Group) Co., Ltd.", "canonical_legal_name_cn": "上海微电子装备（集团）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shanghai Micro Electronics Equipment (Group) Co., Ltd.", "canonical_legal_name_cn": "上海微电子装备（集团）股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_linked", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "SMIC", "中芯国际" ], "brands": [], "canonical_legal_name_cn": "中芯国际集成电路制造有限公司", "canonical_legal_name_en": "Semiconductor Manufacturing International Corporation", "completion_state": "source_backed", "countries_of_operation": [ "Cayman Islands", "China" ], "country_of_ownership": "Cayman Islands", "entity_id": "ent-smic", "entity_type": "company", "exchange": "HKEX / SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-smic", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_incorporated_mainland_operated", "parent_entity_id": null, "process_ids": [ "proc-lithography-immersion-arf" ], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-smic-annual-2025", "src-ft-yuliangsheng-smic-2026", "src-reuters-duv-aishengna-2026" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "foundry" ], "ticker": "00981 / 688981", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "68ebe900043de41d93109f483df148d388500919a621d6b947ec9d152603cac4", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "foundry" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "foundry" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_and_secondary", "source_refs": [ { "source_id": "src-smic-annual-2025", "title": "SMIC 2025 Annual Report", "publisher": "Hong Kong Exchanges and Clearing Limited", "url": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0408/2026040801181.pdf", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group-level foundry capability does not identify a product's foundry, scanner fleet, customer, yield or tool/material BOM." ] }, { "source_id": "src-ft-yuliangsheng-smic-2026", "title": "China trials its first advanced tools for AI chipmaking", "publisher": "Financial Times", "url": "https://www.ft.com/content/8fd79522-e34f-4633-bc87-ef0aae2d9159", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2025-09-17", "date_checked": "2026-07-29", "access_state": "paywalled", "limitations": [ "Paywalled secondary report; prototype evaluation is not delivery/acceptance or qualified production." ] }, { "source_id": "src-reuters-duv-aishengna-2026", "title": "China starts production of home-grown immersion DUV chipmaking tools, source says", "publisher": "Reuters", "url": "https://www.reuters.com/world/china/china-starts-production-home-grown-immersion-duv-chipmaking-tools-source-2026-07-28/", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2026-07-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Anonymous-source report; no model, serial, purchase order, shipment, installation, site acceptance, layer qualification, uptime, yield, or recurring volume." ] } ], "entity_reference": { "entity_id": "ent-smic", "record_level": "company", "canonical_legal_name_en": "Semiconductor Manufacturing International Corporation", "canonical_legal_name_cn": "中芯国际集成电路制造有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Semiconductor Manufacturing International Corporation", "canonical_legal_name_cn": "中芯国际集成电路制造有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "Cayman Islands", "ownership_type": "foreign_incorporated_mainland_operated", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "Cayman Islands", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "SMIC Ningbo", "中芯宁波" ], "brands": [], "canonical_legal_name_cn": "中芯集成电路（宁波）有限公司", "canonical_legal_name_en": "SMIC Integrated Circuit (Ningbo) Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-smic-ningbo", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Ningbo, Zhejiang, China", "id": "ent-smic-ningbo", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_joint_venture", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-huate-gas-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "foundry" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "d9fe200f41e76099451c7da9bc9e3c8fb01c5a06ea6ad333393f0bf6382fb73e", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "foundry" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "foundry" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "entity_reference": { "entity_id": "ent-smic-ningbo", "record_level": "company", "canonical_legal_name_en": "SMIC Integrated Circuit (Ningbo) Co., Ltd.", "canonical_legal_name_cn": "中芯集成电路（宁波）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "SMIC Integrated Circuit (Ningbo) Co., Ltd.", "canonical_legal_name_cn": "中芯集成电路（宁波）有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_joint_venture", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Ningbo, Zhejiang, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Beijing SOPHGO legal entity" ], "brands": [], "canonical_legal_name_cn": "北京算能科技有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-sophgo-beijing", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-sophgo-beijing", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-sophgo-privacy" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "accelerators" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "db12b024d00b4b3bd480fdfa17de1833fa582b9ae0affe41f84286ebad0a3e37", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "accelerators" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "accelerators" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-sophgo-privacy", "title": "隐私政策", "publisher": "北京算能科技有限公司", "url": "https://www.sophgo.com/site/provacy-policy.html", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Does not identify the exact legal owner/manufacturer of each group-branded product." ] } ], "entity_reference": { "entity_id": "ent-sophgo-beijing", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京算能科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京算能科技有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "SOPHGO", "算能" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-sophgo-brand-endpoint-unresolved", "entity_type": "brand_or_unresolved_endpoint", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": null, "id": "ent-sophgo-brand-endpoint-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [ "proc-chip-ai-accelerator" ], "product_ids": [ "prod-sophgo-bm1684x" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-sophgo-privacy", "src-sophgo-bm1684x-product" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "accelerators" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "bbf057b123b498721ea2bdd6c5377671b0a85bc381cbb69cc9c34c2e24012e50", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "accelerators" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "accelerators" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-sophgo-privacy", "title": "隐私政策", "publisher": "北京算能科技有限公司", "url": "https://www.sophgo.com/site/provacy-policy.html", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Does not identify the exact legal owner/manufacturer of each group-branded product." ] }, { "source_id": "src-sophgo-bm1684x-product", "title": "BM1684X Mainboard", "publisher": "SOPHGO", "url": "https://en.sophgo.com/ecology/detail.html?id=41", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact legal product owner, foundry, OSAT, LPDDR supplier, units and named customer are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-sophgo-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "SSMC" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": "Systems on Silicon Manufacturing Company Pte. Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "Singapore", "China" ], "country_of_ownership": "Singapore", "entity_id": "ent-ssmc", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Singapore", "id": "ent-ssmc", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_joint_venture", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-kfmi-ssmc-award-2024" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "wafer_fabrication" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "5487f550ee2fa73122925f999607aa2ada8c40a4fbbfcb6b93b0186b77933158", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer_fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "wafer_fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kfmi-ssmc-award-2024", "title": "江丰电子荣获SSMC“最佳供应商奖”", "publisher": "宁波江丰电子材料股份有限公司", "url": "https://www.kfmic.com/?news_13%2F634.html=", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2024-08-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-side statement; exact target metal/grade/model, equipment-part SKU, quantity and process layer are absent." ] } ], "entity_reference": { "entity_id": "ent-ssmc", "record_level": "company", "canonical_legal_name_en": "Systems on Silicon Manufacturing Company Pte. Ltd.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Systems on Silicon Manufacturing Company Pte. Ltd.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "Singapore", "ownership_type": "foreign_joint_venture", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Singapore", "countries_of_operation": [ "Singapore", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Coma / Kema", "Kema", "Coma", "珂玛科技" ], "brands": [], "canonical_legal_name_cn": "苏州珂玛材料科技股份有限公司", "canonical_legal_name_en": "Suzhou Kema Materials Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-suzhou-kema-materials", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-suzhou-kema-materials", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-kema-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "high purity ceramic materials", "semiconductor equipment components", "equipment consumables" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "1ca8b30b041542ab634019d44731606303cbd19ebc64b7041b55711667027998", "stage_ids": [ "wafer_equipment", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "semiconductor equipment components" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "high purity ceramic materials" }, { "field": "supply_chain_layers", "value": "equipment consumables" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "high purity ceramic materials" }, { "field": "supply_chain_layers", "value": "semiconductor equipment components" }, { "field": "supply_chain_layers", "value": "equipment consumables" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kema-profile-20260801", "title": "About Kema", "publisher": "Suzhou Kema Materials Technology Co., Ltd.", "url": "https://kematek-en.com/about/", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "No named product-to-customer or product-to-fab relationship is disclosed." ] } ], "entity_reference": { "entity_id": "ent-suzhou-kema-materials", "record_level": "company", "canonical_legal_name_en": "Suzhou Kema Materials Technology Co., Ltd.", "canonical_legal_name_cn": "苏州珂玛材料科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Suzhou Kema Materials Technology Co., Ltd.", "canonical_legal_name_cn": "苏州珂玛材料科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Swaysure", "昇维旭" ], "brands": [], "canonical_legal_name_cn": "深圳市昇维旭技术有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-swaysure", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-swaysure", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [ "proc-lithography-immersion-arf" ], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-swaysure-home" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "memory_research" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "3a78713c81328360c4ba34bfd429698efb6e1becb33e904b1fa12092a0164e1a", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "memory_research" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "memory_research" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-swaysure-home", "title": "深圳市昇维旭技术有限公司官网", "publisher": "深圳市昇维旭技术有限公司", "url": "https://www.swaysure.com/", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Does not prove an operating fab, product generation, volume production or scanner fleet." ] } ], "entity_reference": { "entity_id": "ent-swaysure", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "深圳市昇维旭技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "深圳市昇维旭技术有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "天科合达", "TanKeBlue", "TankeBlue" ], "brands": [ "TanKeBlue" ], "canonical_legal_name_cn": "北京天科合达半导体股份有限公司", "canonical_legal_name_en": "Beijing TanKeBlue Semiconductor Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-tankeblue", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-tankeblue", "identity_resolution_state": "canonical_identity_closed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "unlisted_current_control_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-tankeblue-about" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "b14c3daca8fe370d0da463dfede72f0d42b7fb5be2149c7668da2ed1c070ebb5", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-tankeblue-about", "title": "About TanKeBlue", "publisher": "Beijing TanKeBlue Semiconductor Co., Ltd.", "url": "https://en.tankeblue.com/introduce/index.html", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No current parent or listing was stated." ] } ], "entity_reference": { "entity_id": "ent-tankeblue", "record_level": "company", "canonical_legal_name_en": "Beijing TanKeBlue Semiconductor Co., Ltd.", "canonical_legal_name_cn": "北京天科合达半导体股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Beijing TanKeBlue Semiconductor Co., Ltd.", "canonical_legal_name_cn": "北京天科合达半导体股份有限公司", "identity_resolution_state": "canonical_identity_closed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unlisted_current_control_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Thinkon", "神工股份" ], "brands": [], "canonical_legal_name_cn": "锦州神工半导体股份有限公司", "canonical_legal_name_en": "Thinkon Semiconductor Jinzhou Corp.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-thinkon-semiconductor-jinzhou", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-thinkon-semiconductor-jinzhou", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-thinkon-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "etch consumables", "silicon wafer materials", "silicon carbide components" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "ddd82f876400b58432c16ec42fe23d5849a6c8e48a3753a0c64537be50ee50a0", "stage_ids": [ "wafer_equipment", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "etch consumables" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "etch consumables" }, { "field": "supply_chain_layers", "value": "silicon wafer materials" }, { "field": "supply_chain_layers", "value": "silicon carbide components" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "etch consumables" }, { "field": "supply_chain_layers", "value": "silicon wafer materials" }, { "field": "supply_chain_layers", "value": "silicon carbide components" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-thinkon-profile-20260801", "title": "Thinkon Semiconductor", "publisher": "锦州神工半导体股份有限公司", "url": "https://www.thinkon-cn.com/", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Classifies the portfolio as silicon materials and etch consumables; it is not evidence of a generic wafer-equipment product or named customer." ] } ], "entity_reference": { "entity_id": "ent-thinkon-semiconductor-jinzhou", "record_level": "company", "canonical_legal_name_en": "Thinkon Semiconductor Jinzhou Corp.", "canonical_legal_name_cn": "锦州神工半导体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Thinkon Semiconductor Jinzhou Corp.", "canonical_legal_name_cn": "锦州神工半导体股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "九日新材 / Jiuri New Materials", "Jiuri", "Jiuri New Materials", "久日新材" ], "brands": [], "canonical_legal_name_cn": "天津久日新材料股份有限公司", "canonical_legal_name_en": "Tianjin Jiuri New Materials Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-tianjin-jiuri-new-materials", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-tianjin-jiuri-new-materials", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-jiuri-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "photoresist materials", "electronic chemicals" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "370ba2946c21da1438a11bc9e7defa3a75170096249cc0ed44621212026c4462", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "photoresist materials" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "photoresist materials" }, { "field": "supply_chain_layers", "value": "electronic chemicals" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "photoresist materials" }, { "field": "supply_chain_layers", "value": "electronic chemicals" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jiuri-annual-2025", "title": "天津久日新材料股份有限公司2025年年度报告", "publisher": "天津久日新材料股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-25/1225188188.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-25", "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Issuer-reported project and portfolio state; no named semiconductor customer, exact grade, layer, batch qualification or recurring supply relationship is disclosed." ] } ], "entity_reference": { "entity_id": "ent-tianjin-jiuri-new-materials", "record_level": "company", "canonical_legal_name_en": "Tianjin Jiuri New Materials Co., Ltd.", "canonical_legal_name_cn": "天津久日新材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Tianjin Jiuri New Materials Co., Ltd.", "canonical_legal_name_cn": "天津久日新材料股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Tianyi Cloud", "天翼云" ], "brands": [], "canonical_legal_name_cn": "天翼云科技有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-tianyi-cloud-tech", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-ctyun-guangzhou6-resource-pool", "fac-ctyun-huabei2-resource-pool", "fac-ctyun-shanghai36-resource-pool" ], "former_names": [], "headquarters": "China; exact headquarters not resolved in lane sources", "id": "ent-tianyi-cloud-tech", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_linked", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-ctyun-pak1", "prod-ctyun-pak2", "prod-ctyun-pak3", "prod-ctyun-pch1" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-ctyun-ascend-cloud-20260508", "src-ctyun-cambricon-cloud-20260703" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "cloud_services", "system_integration" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "dbb2a2efe64f51c6bf89417d3e05958cb9e83457bc8a18ffd7a7791fdc6c8b1a", "stage_ids": [ "board_system", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "system_integration" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "cloud_services" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "cloud_services" }, { "field": "supply_chain_layers", "value": "system_integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] }, { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-07-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-tianyi-cloud-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_linked", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters not resolved in lane sources", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-ctyun-guangzhou6-resource-pool", "fac-ctyun-huabei2-resource-pool", "fac-ctyun-shanghai36-resource-pool" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "彤程化学", "Red Avenue Chemical (China) Co., Ltd." ], "brands": [], "canonical_legal_name_cn": "彤程化学（中国）有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-tongcheng-chemical-china", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-tongcheng-chemical-shanghai-resin" ], "former_names": [], "headquarters": "66 North Yinhe Road, Shanghai Chemical Industry Park, Shanghai, China", "id": "ent-tongcheng-chemical-china", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-red-avenue", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-red-avenue-annual-2025", "src-redavenue-subsidiaries-guarantee-2025", "src-scip-tongcheng-resin-energy-review-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "photoresist_resins", "electronic_grade_formaldehyde" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "eb87f17b8f80405bfe5f6e773e2393e8f03fe826a0d821578e7ac737c5e9df99", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "photoresist_resins" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "photoresist_resins" }, { "field": "supply_chain_layers", "value": "electronic_grade_formaldehyde" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "photoresist_resins" }, { "field": "supply_chain_layers", "value": "electronic_grade_formaldehyde" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] }, { "source_id": "src-redavenue-subsidiaries-guarantee-2025", "title": "彤程新材料集团股份有限公司关于年度预计融资担保进展的公告", "publisher": "彤程新材料集团股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2025-04/03/content_2044624.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Registered residences are legal-entity addresses and are not automatically the same as every manufacturing site." ] }, { "source_id": "src-scip-tongcheng-resin-energy-review-2025", "title": "上海化学工业区管理委员会关于彤程化学（中国）有限公司光刻胶上游树脂及电子甲醛项目节能报告的审查意见", "publisher": "上海化学工业区管理委员会", "url": "https://www.scip.gov.cn/govxxgk/jjfzc/2025-01-17/3ca523a9-c4da-4e50-a029-cdb960d5101c.html", "source_type": "government_energy_review", "primary_status": "primary", "publication_date": "2025-01-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Energy-review approval proves applicant, site, planned line count and design output, not construction completion, production, customer qualification or shipment." ] } ], "entity_reference": { "entity_id": "ent-tongcheng-chemical-china", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "彤程化学（中国）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "彤程化学（中国）有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-red-avenue", "state_parent": null }, "geography": { "headquarters": "66 North Yinhe Road, Shanghai Chemical Industry Park, Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-tongcheng-chemical-shanghai-resin" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "彤程常州", "Tongcheng Electronic Materials (Changzhou)" ], "brands": [], "canonical_legal_name_cn": "彤程电子材料（常州）有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-tongcheng-electronic-materials-changzhou", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-tongcheng-changzhou-cmp-pad" ], "former_names": [], "headquarters": "Changzhou, Jiangsu, China", "id": "ent-tongcheng-electronic-materials-changzhou", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-tongcheng-electronic-materials-shanghai", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-red-avenue-annual-2025", "src-jintan-tongcheng-cmp-project-2024" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "cmp_pads", "semiconductor_consumables" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "6f21885cbe2022332e3f5b8d8a10fb521ec2bf67b5d4d1573db442892dcac6b8", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "cmp_pads" }, { "field": "supply_chain_layers", "value": "semiconductor_consumables" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "cmp_pads" }, { "field": "supply_chain_layers", "value": "semiconductor_consumables" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] }, { "source_id": "src-jintan-tongcheng-cmp-project-2024", "title": "华罗庚高新区：从“0”到“1” 打造半导体产业“芯”高地", "publisher": "常州市金坛区人民政府 / 华罗庚高新区", "url": "https://www.jintan.gov.cn/html/czjt/2024/IJMJQALL_1118/267619.html", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2024-11-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The 250,000 pads/year figure was a designed full-rate target at that date, not installed, qualified, utilized or actual output." ] } ], "entity_reference": { "entity_id": "ent-tongcheng-electronic-materials-changzhou", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "彤程电子材料（常州）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "彤程电子材料（常州）有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-tongcheng-electronic-materials-shanghai", "state_parent": null }, "geography": { "headquarters": "Changzhou, Jiangsu, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-tongcheng-changzhou-cmp-pad" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "彤程电子", "Shanghai Tongcheng Electronic Materials", "Shanghai Red Avenue Electronic Materials Co., Ltd." ], "brands": [], "canonical_legal_name_cn": "上海彤程电子材料有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-tongcheng-electronic-materials-shanghai", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-tongcheng-electronic-photoresist-solvent" ], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-tongcheng-electronic-materials-shanghai", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-red-avenue", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-red-avenue-annual-2025", "src-redavenue-subsidiaries-guarantee-2025" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-beijing-kehua", "ent-tongcheng-electronic-materials-changzhou" ], "supply_chain_layers": [ "photoresist", "photoresist_resins", "high_purity_solvents", "cmp_pads" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "fac54d156915f293d45eaae8c5b42524613c5382c20e2b5518f80b563a6c1607", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "photoresist" }, { "field": "supply_chain_layers", "value": "photoresist_resins" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "photoresist" }, { "field": "supply_chain_layers", "value": "photoresist_resins" }, { "field": "supply_chain_layers", "value": "high_purity_solvents" }, { "field": "supply_chain_layers", "value": "cmp_pads" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "photoresist" }, { "field": "supply_chain_layers", "value": "photoresist_resins" }, { "field": "supply_chain_layers", "value": "high_purity_solvents" }, { "field": "supply_chain_layers", "value": "cmp_pads" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] }, { "source_id": "src-redavenue-subsidiaries-guarantee-2025", "title": "彤程新材料集团股份有限公司关于年度预计融资担保进展的公告", "publisher": "彤程新材料集团股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2025-04/03/content_2044624.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Registered residences are legal-entity addresses and are not automatically the same as every manufacturing site." ] } ], "entity_reference": { "entity_id": "ent-tongcheng-electronic-materials-shanghai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海彤程电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海彤程电子材料有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-red-avenue", "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-tongcheng-electronic-photoresist-solvent" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Tongfu", "TFME" ], "brands": [], "canonical_legal_name_cn": "通富微电子股份有限公司", "canonical_legal_name_en": "TongFu Microelectronics Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-tongfu", "entity_type": "company", "exchange": "SZSE", "facility_ids": [], "former_names": [], "headquarters": "Nantong, Jiangsu, China", "id": "ent-tongfu", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-tongfu-hbm-project-2025" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-nantong-tongfu" ], "supply_chain_layers": [ "packaging", "test" ], "ticker": "002156", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "5b943c8efd4416cd1112a8f699811d8a8c201515ad97141f044c266e60204f4d", "stage_ids": [ "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "packaging" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "test" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "packaging" }, { "field": "supply_chain_layers", "value": "test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-tongfu-hbm-project-2025", "title": "HBM芯粒先进封装研发及产线建设项目环境影响报告表公示", "publisher": "通富微电子股份有限公司", "url": "https://www.tfme.com/news/1380.html", "source_type": "company_project_eia", "primary_status": "primary", "publication_date": "2025-01-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Project/EIA receipt is not HBM customer qualification, qualified stack generation, yield, shipment, or volume production." ] } ], "entity_reference": { "entity_id": "ent-tongfu", "record_level": "company", "canonical_legal_name_en": "TongFu Microelectronics Co., Ltd.", "canonical_legal_name_cn": "通富微电子股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "TongFu Microelectronics Co., Ltd.", "canonical_legal_name_cn": "通富微电子股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Nantong, Jiangsu, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Transsion", "传音" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-transsion-brand", "entity_type": "brand", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shenzhen, Guangdong, China", "id": "ent-transsion-brand", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "brand_identity_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-cxmt-xiaomi-transsion-validation-2023" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "smartphones" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "2da6747b5e5a33858dee7f6c8a7793bb758bd952dc439229e719407dbdd64734", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "smartphones" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "smartphones" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cxmt-xiaomi-transsion-validation-2023", "title": "长鑫存储LPDDR5产品正式发布", "publisher": "CXMT", "url": "https://www.cxmt.com/news/info_90.html", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2023-11-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Names brands, not contracting legal entities; does not state sustained shipment volume." ] } ], "entity_reference": { "entity_id": "ent-transsion-brand", "record_level": "brand", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "brand_identity_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shenzhen, Guangdong, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "TSMC" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": "Taiwan Semiconductor Manufacturing Company Limited", "completion_state": "source_backed", "countries_of_operation": [ "Taiwan", "China" ], "country_of_ownership": "Taiwan", "entity_id": "ent-tsmc", "entity_type": "company", "exchange": "TWSE", "facility_ids": [], "former_names": [], "headquarters": "Hsinchu, Taiwan", "id": "ent-tsmc", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-tsmc-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-tsmc-china", "ent-tsmc-nanjing" ], "supply_chain_layers": [ "foundry" ], "ticker": "2330", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "52b3b638668d58066b8a674d0409bb536d407e5770da27a7d7158ef7a3bf7247", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "foundry" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "foundry" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-tsmc-annual-2025", "title": "TSMC 2025 Annual Report", "publisher": "Taiwan Semiconductor Manufacturing Company Limited", "url": "https://investor.tsmc.com/sites/ir/annual-report/2025/2025%20Annual%20Report_E.pdf", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility listing does not by itself establish current tool BOM, local-supplier share, customers, utilization, or output." ] } ], "entity_reference": { "entity_id": "ent-tsmc", "record_level": "company", "canonical_legal_name_en": "Taiwan Semiconductor Manufacturing Company Limited", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Taiwan Semiconductor Manufacturing Company Limited", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "Taiwan", "ownership_type": "foreign_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Hsinchu, Taiwan", "countries_of_operation": [ "Taiwan", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "TSMC Shanghai", "Fab 10" ], "brands": [], "canonical_legal_name_cn": "台积电（中国）有限公司", "canonical_legal_name_en": "TSMC (China) Company Limited", "completion_state": "source_backed", "countries_of_operation": [ "Taiwan", "China" ], "country_of_ownership": "Taiwan", "entity_id": "ent-tsmc-china", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-tsmc-shanghai-fab10" ], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-tsmc-china", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-tsmc", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-tsmc-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "foundry" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "3ab48c46c51570b38bf34c8b07c6ca4dd3eb40cddb5ac81504f04f65651daa9f", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "foundry" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "foundry" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-tsmc-annual-2025", "title": "TSMC 2025 Annual Report", "publisher": "Taiwan Semiconductor Manufacturing Company Limited", "url": "https://investor.tsmc.com/sites/ir/annual-report/2025/2025%20Annual%20Report_E.pdf", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility listing does not by itself establish current tool BOM, local-supplier share, customers, utilization, or output." ] } ], "entity_reference": { "entity_id": "ent-tsmc-china", "record_level": "company", "canonical_legal_name_en": "TSMC (China) Company Limited", "canonical_legal_name_cn": "台积电（中国）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "TSMC (China) Company Limited", "canonical_legal_name_cn": "台积电（中国）有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "Taiwan", "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-tsmc", "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "Taiwan", "China" ], "facility_ids": [ "fac-tsmc-shanghai-fab10" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "TSMC Nanjing", "Fab 16" ], "brands": [], "canonical_legal_name_cn": "台积电（南京）有限公司", "canonical_legal_name_en": "TSMC (Nanjing) Company Limited", "completion_state": "source_backed", "countries_of_operation": [ "Taiwan", "China" ], "country_of_ownership": "Taiwan", "entity_id": "ent-tsmc-nanjing", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-tsmc-nanjing-fab16" ], "former_names": [], "headquarters": "Nanjing, Jiangsu, China", "id": "ent-tsmc-nanjing", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-tsmc", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-tsmc-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "foundry" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "2d166daadb4881ffdd2a73932789b7d8e44238100d02e49b68afd8789325cff0", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "foundry" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "foundry" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-tsmc-annual-2025", "title": "TSMC 2025 Annual Report", "publisher": "Taiwan Semiconductor Manufacturing Company Limited", "url": "https://investor.tsmc.com/sites/ir/annual-report/2025/2025%20Annual%20Report_E.pdf", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility listing does not by itself establish current tool BOM, local-supplier share, customers, utilization, or output." ] } ], "entity_reference": { "entity_id": "ent-tsmc-nanjing", "record_level": "company", "canonical_legal_name_en": "TSMC (Nanjing) Company Limited", "canonical_legal_name_cn": "台积电（南京）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "TSMC (Nanjing) Company Limited", "canonical_legal_name_cn": "台积电（南京）有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "Taiwan", "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-tsmc", "state_parent": null }, "geography": { "headquarters": "Nanjing, Jiangsu, China", "countries_of_operation": [ "Taiwan", "China" ], "facility_ids": [ "fac-tsmc-nanjing-fab16" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "UMC" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": "United Microelectronics Corporation", "completion_state": "source_backed", "countries_of_operation": [ "Taiwan", "China" ], "country_of_ownership": "Taiwan", "entity_id": "ent-umc", "entity_type": "company", "exchange": "TWSE", "facility_ids": [], "former_names": [], "headquarters": "Hsinchu, Taiwan", "id": "ent-umc", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-umc-fab-information" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-united-semi-xiamen" ], "supply_chain_layers": [ "foundry" ], "ticker": "2303", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "c23ba46749fdb87376699bbfa954984560c6fce2596c566c47f202b0e4a3764e", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "foundry" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "foundry" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-umc-fab-information", "title": "Fab Information", "publisher": "United Microelectronics Corporation", "url": "https://www.umc.com/en/Html/fab_information", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Designed capacity is not current installed, utilized, actual output, yield, or customer mix." ] } ], "entity_reference": { "entity_id": "ent-umc", "record_level": "company", "canonical_legal_name_en": "United Microelectronics Corporation", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "United Microelectronics Corporation", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "Taiwan", "ownership_type": "foreign_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Hsinchu, Taiwan", "countries_of_operation": [ "Taiwan", "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "United Semi Xiamen", "USCXM" ], "brands": [], "canonical_legal_name_cn": "联芯集成电路制造（厦门）有限公司", "canonical_legal_name_en": "United Semiconductor (Xiamen) Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "Taiwan", "China" ], "country_of_ownership": "Taiwan", "entity_id": "ent-united-semi-xiamen", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-united-semi-xiamen" ], "former_names": [], "headquarters": "Xiamen, Fujian, China", "id": "ent-united-semi-xiamen", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-umc", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-umc-fab-information" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "foundry" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "2d32da980e90c39aaf944c5e3852251e23fd54e26522b6f64bba21873a6b03a9", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "foundry" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "foundry" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-umc-fab-information", "title": "Fab Information", "publisher": "United Microelectronics Corporation", "url": "https://www.umc.com/en/Html/fab_information", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Designed capacity is not current installed, utilized, actual output, yield, or customer mix." ] } ], "entity_reference": { "entity_id": "ent-united-semi-xiamen", "record_level": "company", "canonical_legal_name_en": "United Semiconductor (Xiamen) Co., Ltd.", "canonical_legal_name_cn": "联芯集成电路制造（厦门）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "United Semiconductor (Xiamen) Co., Ltd.", "canonical_legal_name_cn": "联芯集成电路制造（厦门）有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "Taiwan", "ownership_type": "foreign_owned_mainland_operation", "parent_entity_id": "ent-umc", "state_parent": null }, "geography": { "headquarters": "Xiamen, Fujian, China", "countries_of_operation": [ "Taiwan", "China" ], "facility_ids": [ "fac-united-semi-xiamen" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "U-Precision", "华卓精科" ], "brands": [], "canonical_legal_name_cn": "北京华卓精科科技股份有限公司", "canonical_legal_name_en": "Beijing U-Precision Tech Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-uprecision", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-uprecision", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-uprecision-prospectus-2026" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "equipment_components", "bonding_equipment" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "fb3a3a08033317621287702ec21362a45a4fec5a5a27ec70a9046590eb7f5e28", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "equipment_components" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "bonding_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "equipment_components" }, { "field": "supply_chain_layers", "value": "bonding_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-uprecision-prospectus-2026", "title": "北京华卓精科科技股份有限公司招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202606/002213_20260630_2DQN.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-06-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Company K remains anonymous and must not be resolved to SMEE.", "Subsystem commercialization and customer acceptance do not establish scanner delivery, fab insertion, qualified layer or high-volume use." ] } ], "entity_reference": { "entity_id": "ent-uprecision", "record_level": "company", "canonical_legal_name_en": "Beijing U-Precision Tech Co., Ltd.", "canonical_legal_name_cn": "北京华卓精科科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Beijing U-Precision Tech Co., Ltd.", "canonical_legal_name_cn": "北京华卓精科科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "K公司", "Company K" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [], "country_of_ownership": "unknown", "entity_id": "ent-uprecision-company-k-unresolved", "entity_type": "unresolved_anonymized_counterparty", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": null, "id": "ent-uprecision-company-k-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unknown", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-uprecision-prospectus-2026" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "semiconductor_equipment" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "5be12672fbecae5d3834b63e7405dd171bbeeb109cdcbafbd39dc21dda414f91", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "semiconductor_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "semiconductor_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-uprecision-prospectus-2026", "title": "北京华卓精科科技股份有限公司招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202606/002213_20260630_2DQN.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-06-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Company K remains anonymous and must not be resolved to SMEE.", "Subsystem commercialization and customer acceptance do not establish scanner delivery, fab insertion, qualified layer or high-volume use." ] } ], "entity_reference": { "entity_id": "ent-uprecision-company-k-unresolved", "record_level": "unresolved_anonymized_counterparty", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "unresolved_anonymized_counterparty", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "unknown", "ownership_type": "unknown", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "十一科技", "11th Technology", "The 11th Technology Co., Ltd." ], "brands": [], "canonical_legal_name_cn": "信息产业电子第十一设计研究院科技工程股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-util-11th-tech", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact registered address not extracted in this lane", "id": "ent-util-11th-tech", "identity_resolution_state": "named_legal_endpoint_source_bounded", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "engineering_company", "lei": null, "ownership_type": "subsidiary_of_listed_company", "parent_entity_id": "ent-util-taiji", "process_ids": [], "product_ids": [ "svc-util-huahong-epc" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-util-001", "src-util-002" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "semiconductor-fab EPC", "cleanroom", "MEP and process service systems" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "6fb2772fe1e226b9929eb7f0ba755026e7f64f401b221849268b347df89b6271", "stage_ids": [ "board_system", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "MEP and process service systems" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "semiconductor-fab EPC" }, { "field": "supply_chain_layers", "value": "cleanroom" }, { "field": "supply_chain_layers", "value": "MEP and process service systems" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "semiconductor-fab EPC" }, { "field": "supply_chain_layers", "value": "cleanroom" }, { "field": "supply_chain_layers", "value": "MEP and process service systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-001", "title": "亚翔系统集成科技（苏州）股份有限公司关于公司重大项目中标的公告", "publisher": "亚翔系统集成科技（苏州）股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2024-02/06/content_1875556.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2024-02-06", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The issuer expressly says a formal project contract still had to be signed and construction, settlement and payment details remained subject to that contract." ] }, { "source_id": "src-util-002", "title": "无锡市太极实业股份有限公司关于子公司十一科技中标重大项目工程的进展公告", "publisher": "无锡市太极实业股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2023-06/03/content_1776018.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2023-06-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Formal signature is proven, but effectiveness was conditional on specified internal, shareholder and government approvals. Completion, site acceptance, production qualification, uptime and output are not proven." ] } ], "entity_reference": { "entity_id": "ent-util-11th-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "信息产业电子第十一设计研究院科技工程股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "信息产业电子第十一设计研究院科技工程股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "subsidiary_of_listed_company", "parent_entity_id": "ent-util-taiji", "state_parent": null }, "geography": { "headquarters": "China; exact registered address not extracted in this lane", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "ChangXin Xinqiao Memory Technologies", "CXMT Xinqiao" ], "brands": [], "canonical_legal_name_cn": "长鑫新桥存储技术有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "unknown", "entity_id": "ent-util-changxin-xinqiao", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-util-cxmt-phase2" ], "former_names": [], "headquarters": "2788 Xinhuai Avenue, Hefei Economic and Technological Development Zone, Anhui, China", "id": "ent-util-changxin-xinqiao", "identity_resolution_state": "named_legal_endpoint_source_bounded", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "semiconductor_manufacturer", "lei": null, "ownership_type": "unknown", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-util-001" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "memory wafer fabrication" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "cd5e8baf1e32538ecbdad3cbe21e034f30f15ed81ed47d4aa472e0894bc74de6", "stage_ids": [ "logic_foundry_process", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "memory wafer fabrication" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "memory wafer fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "memory wafer fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-001", "title": "亚翔系统集成科技（苏州）股份有限公司关于公司重大项目中标的公告", "publisher": "亚翔系统集成科技（苏州）股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2024-02/06/content_1875556.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2024-02-06", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The issuer expressly says a formal project contract still had to be signed and construction, settlement and payment details remained subject to that contract." ] } ], "entity_reference": { "entity_id": "ent-util-changxin-xinqiao", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "长鑫新桥存储技术有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "长鑫新桥存储技术有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded" }, "ownership": { "country_of_ownership": "unknown", "ownership_type": "unknown", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "2788 Xinhuai Avenue, Hefei Economic and Technological Development Zone, Anhui, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-util-cxmt-phase2" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Hua Hong Semiconductor Manufacturing (Wuxi) Co., Ltd." ], "brands": [ "Hua Hong" ], "canonical_legal_name_cn": "华虹半导体制造（无锡）有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "unknown", "entity_id": "ent-util-huahong-wuxi", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-util-huahong-wuxi-project" ], "former_names": [], "headquarters": "30-1 Xinzhou Road, Xinwu District, Wuxi, Jiangsu, China", "id": "ent-util-huahong-wuxi", "identity_resolution_state": "named_legal_endpoint_source_bounded", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "semiconductor_foundry", "lei": null, "ownership_type": "unknown", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-util-002" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "12-inch specialty-process wafer fabrication" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "de17a33aa29b3f7a9598c25ad3509fb97a4ce25c0e32b9dedfd3309ce4811055", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "12-inch specialty-process wafer fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "12-inch specialty-process wafer fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-002", "title": "无锡市太极实业股份有限公司关于子公司十一科技中标重大项目工程的进展公告", "publisher": "无锡市太极实业股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2023-06/03/content_1776018.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2023-06-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Formal signature is proven, but effectiveness was conditional on specified internal, shareholder and government approvals. Completion, site acceptance, production qualification, uptime and output are not proven." ] } ], "entity_reference": { "entity_id": "ent-util-huahong-wuxi", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "华虹半导体制造（无锡）有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "华虹半导体制造（无锡）有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded" }, "ownership": { "country_of_ownership": "unknown", "ownership_type": "unknown", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "30-1 Xinzhou Road, Xinwu District, Wuxi, Jiangsu, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-util-huahong-wuxi-project" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "华康洁净", "Huakang Cleanroom", "Wuhan Huakang Century Cleanroom Technology" ], "brands": [ "华康洁净" ], "canonical_legal_name_cn": "武汉华康世纪洁净科技股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "unknown", "entity_id": "ent-util-huakang", "entity_type": "company", "exchange": "Shenzhen Stock Exchange", "facility_ids": [], "former_names": [], "headquarters": "Building 3, 718 Gaoxin Avenue, East Lake High-tech Development Zone, Wuhan, Hubei, China", "id": "ent-util-huakang", "identity_resolution_state": "named_legal_endpoint_source_bounded", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "listed_company", "lei": null, "ownership_type": "publicly_listed_company", "parent_entity_id": null, "process_ids": [], "product_ids": [ "svc-util-yuerun-cleanroom" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-util-004" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "advanced-packaging cleanroom and utility EPC" ], "ticker": "301235", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "e0bc1d95103cb16550b8c267cf2b9dc21ed3873521fc380539c812b22245208a", "stage_ids": [ "package_provider", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "advanced-packaging cleanroom and utility EPC" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "advanced-packaging cleanroom and utility EPC" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "advanced-packaging cleanroom and utility EPC" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-004", "title": "华康洁净中标越润高端封测基地项目 强链国产半导体", "publisher": "武汉华康世纪洁净科技股份有限公司", "url": "https://www.whhksj.com/details/217.html", "source_type": "official_supplier_project_notice", "primary_status": "primary", "publication_date": "2026-05-11", "date_checked": "2026-07-29", "access_state": "indexed_direct_open_error", "limitations": [ "Supplier-authored award notice. No counterparty confirmation, signed contract, installation, acceptance, production qualification or output receipt was located." ] } ], "entity_reference": { "entity_id": "ent-util-huakang", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "武汉华康世纪洁净科技股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "武汉华康世纪洁净科技股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded" }, "ownership": { "country_of_ownership": "unknown", "ownership_type": "publicly_listed_company", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Building 3, 718 Gaoxin Avenue, East Lake High-tech Development Zone, Wuhan, Hubei, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "中科院高能所", "IHEP CAS" ], "brands": [], "canonical_legal_name_cn": "中国科学院高能物理研究所", "canonical_legal_name_en": "Institute of High Energy Physics, Chinese Academy of Sciences", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-util-ihep", "entity_type": "research_institute", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "19B Yuquan Road, Shijingshan District, Beijing, China", "id": "ent-util-ihep", "identity_resolution_state": "named_legal_endpoint_source_bounded", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "research_institute", "lei": null, "ownership_type": "state_research_institute", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-util-005" ], "state_parent": "中国科学院", "subsidiary_entity_ids": [], "supply_chain_layers": [ "semiconductor-related research infrastructure" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "67d4ffd57493ce19168b5e0eb75ee0a59edf26830373b9e2ed00a9c650b42857", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "semiconductor-related research infrastructure" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "semiconductor-related research infrastructure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-005", "title": "中国科学院高能物理研究所超净半导体真空测试系统采购项目中标公告", "publisher": "中国政府采购网 / 中华人民共和国财政部国库司", "url": "https://www.ccgp.gov.cn/cggg/zygg/zbgg/202605/t20260507_26518210.htm", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2026-05-07", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The award proves vendor, purchaser, system, model class, quantity and price. It does not prove delivery, installation, acceptance, semiconductor-fab production use or component origin." ] } ], "entity_reference": { "entity_id": "ent-util-ihep", "record_level": "research_institute", "canonical_legal_name_en": "Institute of High Energy Physics, Chinese Academy of Sciences", "canonical_legal_name_cn": "中国科学院高能物理研究所", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "research_institute", "canonical_legal_name_en": "Institute of High Energy Physics, Chinese Academy of Sciences", "canonical_legal_name_cn": "中国科学院高能物理研究所", "identity_resolution_state": "named_legal_endpoint_source_bounded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "state_research_institute", "parent_entity_id": null, "state_parent": "中国科学院" }, "geography": { "headquarters": "19B Yuquan Road, Shijingshan District, Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "KYKY Technology", "中科科仪" ], "brands": [ "KYKY" ], "canonical_legal_name_cn": "北京中科科仪股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "unknown", "entity_id": "ent-util-kyky", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "13 Zhongguancun North Second Street, Haidian District, Beijing, China", "id": "ent-util-kyky", "identity_resolution_state": "named_legal_endpoint_source_bounded", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "vacuum_equipment_company", "lei": null, "ownership_type": "unknown", "parent_entity_id": null, "process_ids": [], "product_ids": [ "prod-util-kyky-vacuum-test" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-util-005" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "vacuum test systems" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "362bcec42d236e45c511deb204866f8e0892ca8c615d5245736d35bc8609524b", "stage_ids": [ "wafer_equipment", "assembly_test", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "vacuum test systems" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "vacuum test systems" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "vacuum test systems" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "vacuum test systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-005", "title": "中国科学院高能物理研究所超净半导体真空测试系统采购项目中标公告", "publisher": "中国政府采购网 / 中华人民共和国财政部国库司", "url": "https://www.ccgp.gov.cn/cggg/zygg/zbgg/202605/t20260507_26518210.htm", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2026-05-07", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The award proves vendor, purchaser, system, model class, quantity and price. It does not prove delivery, installation, acceptance, semiconductor-fab production use or component origin." ] } ], "entity_reference": { "entity_id": "ent-util-kyky", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京中科科仪股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京中科科仪股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded" }, "ownership": { "country_of_ownership": "unknown", "ownership_type": "unknown", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "13 Zhongguancun North Second Street, Haidian District, Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "亚翔集成", "L&K Engineering (Suzhou) Co., Ltd.", "L&K Engineering" ], "brands": [ "L&K" ], "canonical_legal_name_cn": "亚翔系统集成科技（苏州）股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "unknown", "entity_id": "ent-util-lk-suzhou", "entity_type": "company", "exchange": "Shanghai Stock Exchange", "facility_ids": [], "former_names": [], "headquarters": "Suzhou, Jiangsu, China; exact registered address not extracted in this lane", "id": "ent-util-lk-suzhou", "identity_resolution_state": "named_legal_endpoint_source_bounded", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "listed_company", "lei": null, "ownership_type": "publicly_listed_company", "parent_entity_id": null, "process_ids": [], "product_ids": [ "svc-util-cxmt-cleanroom" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-util-001" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "cleanroom EPC and integration" ], "ticker": "603929", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "bd5a9eb05cca863713053e66bd1adb7f8ed97a9c566e3520be7dccd647b192e1", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "cleanroom EPC and integration" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "cleanroom EPC and integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-001", "title": "亚翔系统集成科技（苏州）股份有限公司关于公司重大项目中标的公告", "publisher": "亚翔系统集成科技（苏州）股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2024-02/06/content_1875556.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2024-02-06", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The issuer expressly says a formal project contract still had to be signed and construction, settlement and payment details remained subject to that contract." ] } ], "entity_reference": { "entity_id": "ent-util-lk-suzhou", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "亚翔系统集成科技（苏州）股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "亚翔系统集成科技（苏州）股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded" }, "ownership": { "country_of_ownership": "unknown", "ownership_type": "publicly_listed_company", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Suzhou, Jiangsu, China; exact registered address not extracted in this lane", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "上海四建", "Shanghai Construction No. 4 (Group) Co., Ltd." ], "brands": [], "canonical_legal_name_cn": "上海建工四建集团有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "unknown", "entity_id": "ent-util-shanghai-fourth", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China; exact registered address not extracted in this lane", "id": "ent-util-shanghai-fourth", "identity_resolution_state": "named_legal_endpoint_source_bounded", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "construction_company", "lei": null, "ownership_type": "unknown", "parent_entity_id": null, "process_ids": [], "product_ids": [ "svc-util-huahong-civil" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-util-002" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "semiconductor-fab civil construction" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "5917d0336fcdd437f72e31dd48732f99a5dcbc34b50ff925ee24f575c11c363c", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "semiconductor-fab civil construction" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "semiconductor-fab civil construction" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-002", "title": "无锡市太极实业股份有限公司关于子公司十一科技中标重大项目工程的进展公告", "publisher": "无锡市太极实业股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2023-06/03/content_1776018.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2023-06-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Formal signature is proven, but effectiveness was conditional on specified internal, shareholder and government approvals. Completion, site acceptance, production qualification, uptime and output are not proven." ] } ], "entity_reference": { "entity_id": "ent-util-shanghai-fourth", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海建工四建集团有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海建工四建集团有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded" }, "ownership": { "country_of_ownership": "unknown", "ownership_type": "unknown", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China; exact registered address not extracted in this lane", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "盛剑科技", "Shengjian Technology", "Sancoda" ], "brands": [ "盛剑科技" ], "canonical_legal_name_cn": "上海盛剑科技股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "unknown", "entity_id": "ent-util-shengjian", "entity_type": "company", "exchange": "Shanghai Stock Exchange", "facility_ids": [], "former_names": [ "上海盛剑环境系统科技股份有限公司" ], "headquarters": "301 Huifa Road, Jiading District, Shanghai, China", "id": "ent-util-shengjian", "identity_resolution_state": "named_legal_endpoint_source_bounded", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "listed_company", "lei": null, "ownership_type": "publicly_listed_company", "parent_entity_id": null, "process_ids": [], "product_ids": [ "svc-util-silan-exhaust" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-util-003" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "fab exhaust and point-of-use/process-gas exhaust systems" ], "ticker": "603324", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "1551f436adeb6a9178e407437d075f945de490420253d19a0a1a608fd9b2e946", "stage_ids": [ "critical_materials", "board_system", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "fab exhaust and point-of-use/process-gas exhaust systems" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "fab exhaust and point-of-use/process-gas exhaust systems" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "fab exhaust and point-of-use/process-gas exhaust systems" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "fab exhaust and point-of-use/process-gas exhaust systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-003", "title": "喜讯 | 盛剑科技中标厦门士兰集宏半导体有限公司项目", "publisher": "上海盛剑科技股份有限公司", "url": "https://www.sheng-jian.com/news_details/386.html", "source_type": "official_supplier_project_notice", "primary_status": "primary", "publication_date": "2025-01-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No award amount, signed contract, installation, acceptance or commissioning receipt is published. The 720,000 wafers/year figure is a two-phase eventual design target and not Phase I installed capacity or output." ] } ], "entity_reference": { "entity_id": "ent-util-shengjian", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海盛剑科技股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海盛剑科技股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded" }, "ownership": { "country_of_ownership": "unknown", "ownership_type": "publicly_listed_company", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "301 Huifa Road, Jiading District, Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Xiamen Silan Jihong Semiconductor Co., Ltd.", "士兰集宏" ], "brands": [ "Silan" ], "canonical_legal_name_cn": "厦门士兰集宏半导体有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "unknown", "entity_id": "ent-util-silan-jihong", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-util-silan-sic-phase1" ], "former_names": [], "headquarters": "Xiamen, Fujian, China; exact registered address not extracted in this lane", "id": "ent-util-silan-jihong", "identity_resolution_state": "named_legal_endpoint_source_bounded", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "compound_semiconductor_manufacturer", "lei": null, "ownership_type": "unknown", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-util-003" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "8-inch SiC power-device wafer fabrication" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "e30fb2569d1caf20d70ea7683ee93608a11b082f0e57143cf43ecd90ac82501e", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "8-inch SiC power-device wafer fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "8-inch SiC power-device wafer fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-003", "title": "喜讯 | 盛剑科技中标厦门士兰集宏半导体有限公司项目", "publisher": "上海盛剑科技股份有限公司", "url": "https://www.sheng-jian.com/news_details/386.html", "source_type": "official_supplier_project_notice", "primary_status": "primary", "publication_date": "2025-01-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No award amount, signed contract, installation, acceptance or commissioning receipt is published. The 720,000 wafers/year figure is a two-phase eventual design target and not Phase I installed capacity or output." ] } ], "entity_reference": { "entity_id": "ent-util-silan-jihong", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "厦门士兰集宏半导体有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "厦门士兰集宏半导体有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded" }, "ownership": { "country_of_ownership": "unknown", "ownership_type": "unknown", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Xiamen, Fujian, China; exact registered address not extracted in this lane", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-util-silan-sic-phase1" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "太极实业", "Wuxi Taiji Industry Limited Corporation" ], "brands": [], "canonical_legal_name_cn": "无锡市太极实业股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "unknown", "entity_id": "ent-util-taiji", "entity_type": "company", "exchange": "Shanghai Stock Exchange", "facility_ids": [], "former_names": [], "headquarters": "Wuxi, Jiangsu, China; exact registered address not extracted in this lane", "id": "ent-util-taiji", "identity_resolution_state": "named_legal_endpoint_source_bounded", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "listed_company", "lei": null, "ownership_type": "publicly_listed_company", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-util-002" ], "state_parent": null, "subsidiary_entity_ids": [ "ent-util-11th-tech" ], "supply_chain_layers": [ "parent of semiconductor-fab engineering contractor" ], "ticker": "600667", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "636212306a158fbde36fac48c273d5f89a632fcf24482f8862f65f5535ec4322", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "parent of semiconductor-fab engineering contractor" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-002", "title": "无锡市太极实业股份有限公司关于子公司十一科技中标重大项目工程的进展公告", "publisher": "无锡市太极实业股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2023-06/03/content_1776018.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2023-06-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Formal signature is proven, but effectiveness was conditional on specified internal, shareholder and government approvals. Completion, site acceptance, production qualification, uptime and output are not proven." ] } ], "entity_reference": { "entity_id": "ent-util-taiji", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "无锡市太极实业股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "无锡市太极实业股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded" }, "ownership": { "country_of_ownership": "unknown", "ownership_type": "publicly_listed_company", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Wuxi, Jiangsu, China; exact registered address not extracted in this lane", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "YueRun Integrated Circuit (Shaoxing) Co., Ltd.", "越润集成" ], "brands": [], "canonical_legal_name_cn": "越润集成电路（绍兴）有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "unknown", "entity_id": "ent-util-yuerun", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-util-yuerun-a1" ], "former_names": [], "headquarters": "Shaoxing, Zhejiang, China; exact registered address not extracted in this lane", "id": "ent-util-yuerun", "identity_resolution_state": "named_legal_endpoint_source_bounded", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "advanced_packaging_company", "lei": null, "ownership_type": "unknown", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-util-004" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "wafer-level advanced packaging", "display-driver packaging" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "4c7fa80ef69d143013e72a5922649c300f21b2da5a6c81de1c486b625854c4aa", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer-level advanced packaging" }, { "field": "supply_chain_layers", "value": "display-driver packaging" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "wafer-level advanced packaging" }, { "field": "supply_chain_layers", "value": "display-driver packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-004", "title": "华康洁净中标越润高端封测基地项目 强链国产半导体", "publisher": "武汉华康世纪洁净科技股份有限公司", "url": "https://www.whhksj.com/details/217.html", "source_type": "official_supplier_project_notice", "primary_status": "primary", "publication_date": "2026-05-11", "date_checked": "2026-07-29", "access_state": "indexed_direct_open_error", "limitations": [ "Supplier-authored award notice. No counterparty confirmation, signed contract, installation, acceptance, production qualification or output receipt was located." ] } ], "entity_reference": { "entity_id": "ent-util-yuerun", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "越润集成电路（绍兴）有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "越润集成电路（绍兴）有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded" }, "ownership": { "country_of_ownership": "unknown", "ownership_type": "unknown", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shaoxing, Zhejiang, China; exact registered address not extracted in this lane", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-util-yuerun-a1" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "VeriSilicon", "芯原股份" ], "brands": [], "canonical_legal_name_cn": "芯原微电子（上海）股份有限公司", "canonical_legal_name_en": "VeriSilicon Microelectronics (Shanghai) Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-verisilicon", "entity_type": "company", "exchange": "SSE STAR", "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-verisilicon", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [ "proc-pdk-libraries-ip" ], "product_ids": [ "prod-verisilicon-fdsoi-wireless-ip" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-verisilicon-gf-22fdx-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "design_services", "semiconductor_ip" ], "ticker": "688521", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "2454a1e470e0b6e29b0437343c738e05a91622f88be8fdcc43787682e3f9b6e9", "stage_ids": [ "design_company", "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "design_services" } ] }, { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "semiconductor_ip" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "design_services" }, { "field": "supply_chain_layers", "value": "semiconductor_ip" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-verisilicon-gf-22fdx-2025", "title": "VeriSilicon Introduces FD-SOI Wireless IP Platform", "publisher": "VeriSilicon Microelectronics (Shanghai) Co., Ltd.", "url": "https://www.verisilicon.com/en/PressRelease/WirelessIP", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2025-09-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers and chips are anonymous; facility and shipment split are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-verisilicon", "record_level": "company", "canonical_legal_name_en": "VeriSilicon Microelectronics (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "芯原微电子（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "VeriSilicon Microelectronics (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "芯原微电子（上海）股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "华正新材", "Huazheng New Materials", "Zhejiang Huazheng New Material Co., Ltd.", "Zhengjiang Huazheng New Material Co.,LTD" ], "brands": [ "WAZAM" ], "canonical_legal_name_cn": "浙江华正新材料股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-wazam", "entity_type": "company", "exchange": "Shanghai Stock Exchange", "facility_ids": [], "former_names": [], "headquarters": "Hangzhou, Zhejiang, China", "id": "ent-wazam", "identity_resolution_state": "chinese_identity_closed_english_legal_name_conflicted", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_Huali_Group_controlled_member_exact_parent_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-wazam-company-info", "src-wazam-about" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [], "ticker": "603186", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "158e3c66c86368e63a873f86570e50caec6c444027a54d92ba9859ff2d5a0de0", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-wazam-company-info", "title": "公司信息", "publisher": "浙江华正新材料股份有限公司", "url": "https://en.wazam.com.cn/article/detail-56.html", "source_type": "official_company_page", "primary_status": "primary", "publication_date": "2017-09-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The official English field contains the spelling 'Zhengjiang'; the current site brand is WAZAM." ] }, { "source_id": "src-wazam-about", "title": "了解我们", "publisher": "浙江华正新材料股份有限公司", "url": "https://www.wazam.com.cn/article/list/28.html", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page states group affiliation but not the exact immediate legal shareholder." ] } ], "entity_reference": { "entity_id": "ent-wazam", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "浙江华正新材料股份有限公司", "identity_resolution_state": "chinese_identity_closed_english_legal_name_conflicted", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "浙江华正新材料股份有限公司", "identity_resolution_state": "chinese_identity_closed_english_legal_name_conflicted" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_Huali_Group_controlled_member_exact_parent_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Hangzhou, Zhejiang, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "WG Tech", "沃格光电" ], "brands": [], "canonical_legal_name_cn": "江西沃格光电集团股份有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-wg-tech-jiangxi-group", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-wg-tech-jiangxi-group", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-wgtech-tongge-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "glass packaging substrates", "glass circuit boards" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "74fcb38e85149c9a23eaeca025dccb65f5407fd1eac2787124160425daec96cf", "stage_ids": [ "package_provider", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "glass packaging substrates" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "glass circuit boards" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "glass packaging substrates" }, { "field": "supply_chain_layers", "value": "glass circuit boards" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-wgtech-tongge-profile-20260801", "title": "WG Tech Group", "publisher": "WG Tech", "url": "https://www.wgtechjx.com/", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "The compound seed covers two entities. Affiliate status is supported, but exact equity and product-to-customer relationships are not." ] } ], "entity_reference": { "entity_id": "ent-wg-tech-jiangxi-group", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "江西沃格光电集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "江西沃格光电集团股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "OmniVision Group", "Will Semiconductor", "Will Semiconductor Co., Ltd. Shanghai", "Willsemi", "豪威集团", "韦尔股份" ], "brands": [ "OMNIVISION", "OmniVision" ], "canonical_legal_name_cn": "豪威集成电路（集团）股份有限公司", "canonical_legal_name_en": "OmniVision Integrated Circuits Group, Inc.", "completion_state": "source_backed", "countries_of_operation": [ "China", "United States" ], "country_of_ownership": "China", "entity_id": "ent-willsemi", "entity_type": "company", "exchange": "Shanghai Stock Exchange / Hong Kong Stock Exchange Main Board", "facility_ids": [], "former_names": [ "Will Semiconductor Co., Ltd. Shanghai", "上海韦尔半导体股份有限公司" ], "headquarters": "Shanghai, China", "id": "ent-willsemi", "identity_resolution_state": "current_issuer_identity_closed_former_name_routed", "joint_venture_ids": [], "last_checked": "2026-07-29", "legal_form": "PRC joint-stock company", "lei": null, "ownership_type": "publicly_listed_private_current_controller_not_extracted", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-empyrean-polas-willsemi-2022", "src-omnivision-current", "src-omnivision-hkex-current", "src-ovt-history", "src-will-sse-listing" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "fabless", "sensors" ], "ticker": "603501 / 00501", "canonical_dataset": "entities.yaml", "canonical_record_sha256": "49700de19dbb7ec860cd9f750c6a6cd1ae63b613322f1accbc6fa4ae4aaa2aac", "stage_ids": [ "design_company", "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "fabless" } ] }, { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "sensors" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "fabless" }, { "field": "supply_chain_layers", "value": "sensors" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-empyrean-polas-willsemi-2022", "title": "Empyrean Polas® Assists Willsemi in IC Design Reliability", "publisher": "Empyrean Technology Co., Ltd.", "url": "https://www.empyrean-tech.com/article/item-182.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2022-06-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-side announcement; contract, seats, chip SKU, foundry, PDK and production volume are undisclosed." ] }, { "source_id": "src-omnivision-current", "title": "OmniVision Integrated Circuits Group, Inc. Appointment of a New General Manager and Legal Representative", "publisher": "OMNIVISION", "url": "https://www.ovt.com/press-releases/omnivision-integrated-circuits-group-inc-appointment-of-a-new-general-manager-and-legal-representative/", "source_type": "official_company_release", "primary_status": "primary", "publication_date": "2025-11-12", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not explain all legal subsidiaries operating under the OMNIVISION brand." ] }, { "source_id": "src-omnivision-hkex-current", "title": "Stock Connect Southbound Shareholding Search By Date", "publisher": "Hong Kong Exchanges and Clearing Limited", "url": "https://www3.hkexnews.hk/sdw/search/mutualmarket.aspx?force_isolation=true&t=hk", "source_type": "exchange_record", "primary_status": "primary", "publication_date": "2026-07-22", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Shareholding values are outside this lane." ] }, { "source_id": "src-ovt-history", "title": "About Us", "publisher": "OMNIVISION", "url": "https://www.ovt.com/company/about-us/", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not provide a current legal subsidiary register or prove the immediate ownership chain." ] }, { "source_id": "src-will-sse-listing", "title": "关于上海韦尔半导体股份有限公司人民币普通股股票上市交易的公告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/announcement/listing/c/c_20170502_4304662.shtml", "source_type": "exchange_notice", "primary_status": "primary", "publication_date": "2017-05-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "This historical notice must not be used as the current legal name." ] } ], "entity_reference": { "entity_id": "ent-willsemi", "record_level": "company", "canonical_legal_name_en": "OmniVision Integrated Circuits Group, Inc.", "canonical_legal_name_cn": "豪威集成电路（集团）股份有限公司", "identity_resolution_state": "current_issuer_identity_closed_former_name_routed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "OmniVision Integrated Circuits Group, Inc.", "canonical_legal_name_cn": "豪威集成电路（集团）股份有限公司", "identity_resolution_state": "current_issuer_identity_closed_former_name_routed" }, "ownership": { "country_of_ownership": "China", "ownership_type": "publicly_listed_private_current_controller_not_extracted", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China", "United States" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Witmem Technology", "知存科技" ], "brands": [], "canonical_legal_name_cn": "杭州知存算力科技有限公司", "canonical_legal_name_en": "Hangzhou Zhicun (Witmem) Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-witmem", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Hangzhou, Zhejiang, China", "id": "ent-witmem", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [ "proc-chip-ai-accelerator" ], "product_ids": [ "prod-witmem-wtm2101", "prod-witmem-wtm8" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-witmem-home", "src-witmem-government-equity-20241105", "src-witmem-wtm2101-product", "src-witmem-wtm8-about", "src-witmem-wtm8-product" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "compute_in_memory", "accelerators" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "525344d3dfd779e90d3714c560404a7a22ac5cd2b89b03e6394983bd67137af4", "stage_ids": [ "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "compute_in_memory" }, { "field": "supply_chain_layers", "value": "accelerators" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "compute_in_memory" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "compute_in_memory" }, { "field": "supply_chain_layers", "value": "accelerators" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-witmem-home", "title": "知存科技官网", "publisher": "杭州知存算力科技有限公司", "url": "https://www.witmem.com/", "source_type": "company_home_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal identity and portfolio statement only." ] }, { "source_id": "src-witmem-government-equity-20241105", "title": "杭州知存算力科技有限公司企业国有产权交易披露", "publisher": "北京市公共资源交易服务平台", "url": "https://ggzyfw.beijing.gov.cn/jyxxgqgpplxx/20241105/4719635.html", "source_type": "government_equity_record", "primary_status": "primary", "publication_date": "2024-11-05", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Identity/equity record only." ] }, { "source_id": "src-witmem-wtm2101-product", "title": "WTM2101", "publisher": "杭州知存算力科技有限公司", "url": "https://www.witmem.com/WTM2101.php", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Audited units, foundry, OSAT, legal customer, yield and field reliability are undisclosed." ] }, { "source_id": "src-witmem-wtm8-about", "title": "关于知存", "publisher": "杭州知存算力科技有限公司", "url": "https://www.witmem.com/about.php", "source_type": "company_timeline", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Trial production is not commercial release, customer qualification or volume shipment." ] }, { "source_id": "src-witmem-wtm8-product", "title": "WTM-8", "publisher": "杭州知存算力科技有限公司", "url": "https://www.witmem.com/WTM-8.php", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, bonding facility/tool/pitch/yield, OSAT, die suppliers, customer and shipment are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-witmem", "record_level": "company", "canonical_legal_name_en": "Hangzhou Zhicun (Witmem) Technology Co., Ltd.", "canonical_legal_name_cn": "杭州知存算力科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Hangzhou Zhicun (Witmem) Technology Co., Ltd.", "canonical_legal_name_cn": "杭州知存算力科技有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Hangzhou, Zhejiang, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Jingce", "精测电子" ], "brands": [], "canonical_legal_name_cn": "武汉精测电子集团股份有限公司", "canonical_legal_name_en": "Wuhan Jingce Electronic Group Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-wuhan-jingce-electronic", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-wuhan-jingce-electronic", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-jingce-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "semiconductor test equipment", "inspection equipment" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "264564dda8650031d26471db1c35d8eeb8e1c85d44eae97c35b78229359a566d", "stage_ids": [ "wafer_equipment", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "inspection equipment" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "semiconductor test equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "semiconductor test equipment" }, { "field": "supply_chain_layers", "value": "inspection equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jingce-profile-20260801", "title": "Company Profile", "publisher": "Wuhan Jingce Electronic Group Co., Ltd.", "url": "https://www.wuhanjingce.com/en/jbxx/index.aspx", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "The source does not close an exact back-end assembly/test process, named customer or production deployment." ] } ], "entity_reference": { "entity_id": "ent-wuhan-jingce-electronic", "record_level": "company", "canonical_legal_name_en": "Wuhan Jingce Electronic Group Co., Ltd.", "canonical_legal_name_cn": "武汉精测电子集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Wuhan Jingce Electronic Group Co., Ltd.", "canonical_legal_name_cn": "武汉精测电子集团股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Wuxi Huishan AI Compute Center Phase I owner/operator (unresolved)" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-wuxi-huishan-ai-center-owner-unresolved", "entity_type": "unresolved_endpoint", "exchange": null, "facility_ids": [ "fac-wuxi-huishan-ai-compute-center-phase1" ], "former_names": [], "headquarters": null, "id": "ent-wuxi-huishan-ai-center-owner-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-huishan-mt-s5000-center-20260724" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "ai_compute_infrastructure" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "11a5669cdb91ae3b8e9a1930aa958ca00e5bd8dda9ca46427ec8da0ad362f283", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "ai_compute_infrastructure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huishan-mt-s5000-center-20260724", "title": "无锡（惠山）人工智能算力中心一期点亮", "publisher": "惠山区人民政府办公室", "url": "https://www.huishan.gov.cn/doc/2026/07/24/4809561.shtml", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2026-07-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility legal owner/operator, direct buyer, contract, acceptance certificate, uptime and utilization are undisclosed.", "Powered-on/deployed does not by itself prove sustained production workload or service volume." ] } ], "entity_reference": { "entity_id": "ent-wuxi-huishan-ai-center-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [ "fac-wuxi-huishan-ai-compute-center-phase1" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "厦门半导体投资集团" ], "brands": [], "canonical_legal_name_cn": "厦门半导体投资集团有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-xiamen-semiconductor-investment", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Xiamen, Fujian, China", "id": "ent-xiamen-semiconductor-investment", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_investment", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-silan-jike-company-profile" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "semiconductor_investment" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "2a02f33cf1ee355e5d7b2830a022ea0b8702b6507ab9c5fe4614bd2a20b3bc8f", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "semiconductor_investment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-silan-jike-company-profile", "title": "子公司-厦门士兰集科微电子有限公司", "publisher": "杭州士兰微电子股份有限公司", "url": "https://www.silan.com.cn/index.php/about/info/246.html", "source_type": "company_subsidiary_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The 40,000/80,000 wafers-per-month figures are project plans, not installed, qualified or actual-output capacity." ] } ], "entity_reference": { "entity_id": "ent-xiamen-semiconductor-investment", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "厦门半导体投资集团有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "厦门半导体投资集团有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_investment", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Xiamen, Fujian, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Xi’an Eswin Material", "ESWIN Material", "奕斯伟材料" ], "brands": [], "canonical_legal_name_cn": "西安奕斯伟材料科技股份有限公司", "canonical_legal_name_en": "Xi'an ESWIN Material Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-xian-eswin-material", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-xian-eswin-material", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-eswin-material-sse-20250815" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "12 inch silicon wafers", "semiconductor materials" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "95e8e1aa21681454a3d4ab6ff0f0b18b6d491f92c7467620d1c7434848154d69", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "12 inch silicon wafers" }, { "field": "supply_chain_layers", "value": "semiconductor materials" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "12 inch silicon wafers" }, { "field": "supply_chain_layers", "value": "semiconductor materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-eswin-material-sse-20250815", "title": "Xi'an ESWIN Material Technology listing review notice", "publisher": "Shanghai Stock Exchange", "url": "https://english.sse.com.cn/news/newsrelease/voice/c/c_20250815_10788645.shtml", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Issuer scope only; no customer, facility-to-product allocation, wafer grade, qualification or output record." ] } ], "entity_reference": { "entity_id": "ent-xian-eswin-material", "record_level": "company", "canonical_legal_name_en": "Xi'an ESWIN Material Technology Co., Ltd.", "canonical_legal_name_cn": "西安奕斯伟材料科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Xi'an ESWIN Material Technology Co., Ltd.", "canonical_legal_name_cn": "西安奕斯伟材料科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Xiaomi", "小米" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-xiaomi-brand", "entity_type": "brand", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-xiaomi-brand", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "brand_identity_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-cxmt-xiaomi-transsion-validation-2023" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "smartphones" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "55c8d4e2aa39249c7e81c8896923436ff9d68143f15676cf617544d9b6b967af", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "smartphones" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "smartphones" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cxmt-xiaomi-transsion-validation-2023", "title": "长鑫存储LPDDR5产品正式发布", "publisher": "CXMT", "url": "https://www.cxmt.com/news/info_90.html", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2023-11-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Names brands, not contracting legal entities; does not state sustained shipment volume." ] } ], "entity_reference": { "entity_id": "ent-xiaomi-brand", "record_level": "brand", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "brand_identity_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Xinsheng Jingke", "新昇晶科" ], "brands": [], "canonical_legal_name_cn": "上海新昇晶科半导体科技有限公司", "canonical_legal_name_en": "Shanghai Xinsheng Jingke Semiconductor Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-xinsheng-jingke", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-xinsheng-jingke-300mm" ], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-xinsheng-jingke", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-nsig", "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-nsig-inquiry-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "silicon_wafers" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "32ed41101734f9bd8abf60fcfe3f3ee41f0c6efbc7361d5c71aaaf1298f2e81a", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "silicon_wafers" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "silicon_wafers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nsig-inquiry-2025", "title": "关于上海硅产业集团股份有限公司发行股份及支付现金购买资产并募集配套资金申请审核问询函的回复", "publisher": "上海证券交易所 / 立信会计师事务所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202509/688126_20250901_U2SY.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-09-01", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Equipment vendors and a domestic polysilicon supplier are anonymized; forecasts are not actual production." ] } ], "entity_reference": { "entity_id": "ent-xinsheng-jingke", "record_level": "company", "canonical_legal_name_en": "Shanghai Xinsheng Jingke Semiconductor Technology Co., Ltd.", "canonical_legal_name_cn": "上海新昇晶科半导体科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Shanghai Xinsheng Jingke Semiconductor Technology Co., Ltd.", "canonical_legal_name_cn": "上海新昇晶科半导体科技有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_subsidiary", "parent_entity_id": "ent-nsig", "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-xinsheng-jingke-300mm" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "芯业时代", "Xinye Shidai" ], "brands": [], "canonical_legal_name_cn": "陕西电子芯业时代科技有限公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-xinye-shidai", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-xinye-shidai-8in" ], "former_names": [], "headquarters": "Xi'an, Shaanxi, China", "id": "ent-xinye-shidai", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "ownership_unresolved", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-xinye-shidai-chemical-system-award-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "wafer_fabrication" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "880bc6279eb3646238e5b51c8206a50a6fef0eea05599213bda68439fb911f8a", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer_fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "wafer_fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-xinye-shidai-chemical-system-award-2025", "title": "陕西电子芯业时代科技有限公司8英寸高性能特色工艺半导体芯片生产线项目化学品系统建设项目-中标结果公示", "publisher": "陕西省采购招标有限责任公司采购招标网", "url": "https://www.sxcgzb.com/portal/notice/detail/id/3500.html", "source_type": "official_procurement_award", "primary_status": "primary", "publication_date": "2025-03-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Award proves endpoints, project scope and price only; delivery, installation, commissioning, site acceptance and operation are unknown." ] } ], "entity_reference": { "entity_id": "ent-xinye-shidai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "陕西电子芯业时代科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "陕西电子芯业时代科技有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "ownership_unresolved", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Xi'an, Shaanxi, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-xinye-shidai-8in" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "XMC", "武汉新芯" ], "brands": [], "canonical_legal_name_cn": "武汉新芯集成电路股份有限公司", "canonical_legal_name_en": "Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-xmc", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [ "武汉新芯集成电路制造有限公司" ], "headquarters": "Wuhan, Hubei, China", "id": "ent-xmc", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_linked", "parent_entity_id": null, "process_ids": [ "proc-lithography-immersion-arf" ], "product_ids": [ "prod-xmc-spi-nor" ], "record_type": "entity", "registration_id": null, "source_ids": [ "src-xmc-home-2026", "src-xmc-privacy-current-legal", "src-xmc-prospectus-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "foundry", "specialty_memory", "3d_integration" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "5266ccccecdbd77cb9550471bf545a318b73160208f343777cc7f042d72455e3", "stage_ids": [ "logic_foundry_process", "memory_manufacturer", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "foundry" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "specialty_memory" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "3d_integration" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "foundry" }, { "field": "supply_chain_layers", "value": "specialty_memory" }, { "field": "supply_chain_layers", "value": "3d_integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-xmc-home-2026", "title": "武汉新芯集成电路股份有限公司", "publisher": "武汉新芯集成电路股份有限公司", "url": "https://www.xmcwh.com/", "source_type": "company_home_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio statement does not prove a particular customer, process yield, capacity, or tool/material supplier." ] }, { "source_id": "src-xmc-privacy-current-legal", "title": "隐私协议", "publisher": "武汉新芯集成电路股份有限公司", "url": "https://www.xmcwh.com/site/privacy-agreement", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal-identity receipt only." ] }, { "source_id": "src-xmc-prospectus-2025", "title": "武汉新芯集成电路股份有限公司招股说明书", "publisher": "武汉新芯集成电路股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202509/002044_20250929_SM99.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-09-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Fab phases, scanner fleet, periodic output and yield are not disclosed in the reviewed sections." ] } ], "entity_reference": { "entity_id": "ent-xmc", "record_level": "company", "canonical_legal_name_en": "Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.", "canonical_legal_name_cn": "武汉新芯集成电路股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.", "canonical_legal_name_cn": "武汉新芯集成电路股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_linked", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Wuhan, Hubei, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Xpeedic", "芯和半导体" ], "brands": [], "canonical_legal_name_cn": "芯和半导体科技（上海）股份有限公司", "canonical_legal_name_en": "Xpeedic Technology, Inc.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-xpeedic", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-xpeedic", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-xpeedic-pdk-2022" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "eda", "design_services" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "317227438ef313bccf9af05d070fa84e48f7d26878967910b0febcbe00d0d790", "stage_ids": [ "design_company", "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "design_services" } ] }, { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "eda" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "eda" }, { "field": "supply_chain_layers", "value": "design_services" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-xpeedic-pdk-2022", "title": "Chip Design EDA Solution", "publisher": "芯和半导体科技（上海）股份有限公司", "url": "https://www.xpeedic.com/cn/ueditor/php/upload/file/20220412/1649752311805858.pdf", "source_type": "company_technical_document", "primary_status": "primary", "publication_date": "2022-04-12", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Tool/service availability is not a named foundry PDK, customer tapeout, or advanced-node production receipt." ] } ], "entity_reference": { "entity_id": "ent-xpeedic", "record_level": "company", "canonical_legal_name_en": "Xpeedic Technology, Inc.", "canonical_legal_name_cn": "芯和半导体科技（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Xpeedic Technology, Inc.", "canonical_legal_name_cn": "芯和半导体科技（上海）股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "XTX", "芯天下" ], "brands": [], "canonical_legal_name_cn": "芯天下技术股份有限公司", "canonical_legal_name_en": "XTX Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-xtx-technology", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-xtx-technology", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-xtx-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "fabless chip design", "nor memory", "slc nand memory", "control chips" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "321b6653f12e86478d004f330b53e0d707a19187d0e312c6899761f1b8780f07", "stage_ids": [ "design_company", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "fabless chip design" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "nor memory" }, { "field": "supply_chain_layers", "value": "slc nand memory" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "fabless chip design" }, { "field": "supply_chain_layers", "value": "nor memory" }, { "field": "supply_chain_layers", "value": "slc nand memory" }, { "field": "supply_chain_layers", "value": "control chips" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-xtx-profile-20260801", "title": "About XTX", "publisher": "XTX Technology Co., Ltd.", "url": "https://www.xtxtech.com/en/AboutCoreWorld/index.aspx", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "Fabless product scope only; foundry, OSAT, named customer and production allocation remain undisclosed." ] } ], "entity_reference": { "entity_id": "ent-xtx-technology", "record_level": "company", "canonical_legal_name_en": "XTX Technology Co., Ltd.", "canonical_legal_name_cn": "芯天下技术股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "XTX Technology Co., Ltd.", "canonical_legal_name_cn": "芯天下技术股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Yitang", "屹唐半导体" ], "brands": [], "canonical_legal_name_cn": "北京屹唐半导体科技股份有限公司", "canonical_legal_name_en": "Beijing E-Town Semiconductor Technology Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-yitang", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Beijing, China", "id": "ent-yitang", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_public", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-gentech-annual-2025" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "wafer_fabrication_equipment" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "9d126239b5c66b71be55256e78c87fb8be79a4e4dd9bf1e08fbc584f9e3cdbdb", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer_fabrication_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "wafer_fabrication_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-yitang", "record_level": "company", "canonical_legal_name_en": "Beijing E-Town Semiconductor Technology Co., Ltd.", "canonical_legal_name_cn": "北京屹唐半导体科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Beijing E-Town Semiconductor Technology Co., Ltd.", "canonical_legal_name_cn": "北京屹唐半导体科技股份有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_public", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Beijing, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "YMTC", "长江存储" ], "brands": [], "canonical_legal_name_cn": "长江存储科技有限责任公司", "canonical_legal_name_en": "Yangtze Memory Technologies Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-ymtc", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Wuhan, Hubei, China", "id": "ent-ymtc", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_state_linked", "parent_entity_id": null, "process_ids": [ "proc-lithography-immersion-arf" ], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-ymtc-about", "src-ymtc-64layer-2019", "src-memblaze-ymtc-pblaze6" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "nand_memory", "wafer_fabrication" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "b164236e2756be0ae150d77c06982c18a285bb7eb9e97bc99496ac4c5ed1e209", "stage_ids": [ "logic_foundry_process", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "wafer_fabrication" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "nand_memory" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "nand_memory" }, { "field": "supply_chain_layers", "value": "wafer_fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ymtc-about", "title": "企业简介", "publisher": "长江存储科技有限责任公司", "url": "https://www.ymtc.com/cn/aboutus.html", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Does not disclose scanner vendors/models, capacity, yield or supplier BOM." ] }, { "source_id": "src-ymtc-64layer-2019", "title": "采用Xtacking®架构，长江存储启动64层3D NAND闪存量产", "publisher": "长江存储科技有限责任公司", "url": "https://www.ymtc.com/cn/news/37.html", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2019-09-02", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical product evidence; scanner vendor/model and current generation/fleet are not disclosed." ] }, { "source_id": "src-memblaze-ymtc-pblaze6", "title": "PBlaze6 6541 Enterprise SSD", "publisher": "北京忆恒创源科技股份有限公司", "url": "https://www.memblaze.com/product/pblaze6/639.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Direct product BOM join for NAND only; controller, PMIC, firmware component origins and shipment volume are not fully disclosed." ] } ], "entity_reference": { "entity_id": "ent-ymtc", "record_level": "company", "canonical_legal_name_en": "Yangtze Memory Technologies Co., Ltd.", "canonical_legal_name_cn": "长江存储科技有限责任公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Yangtze Memory Technologies Co., Ltd.", "canonical_legal_name_cn": "长江存储科技有限责任公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_state_linked", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Wuhan, Hubei, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "长存三期", "YMTC Phase III" ], "brands": [], "canonical_legal_name_cn": "长存三期（武汉）集成电路有限责任公司", "canonical_legal_name_en": null, "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-ymtc-phase3", "entity_type": "company", "exchange": null, "facility_ids": [ "fac-ymtc-phase3" ], "former_names": [], "headquarters": "Wuhan, Hubei, China", "id": "ent-ymtc-phase3", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_project_company", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-hubei-ymtc-phase3", "src-wuhan-ymtc-phase3" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "3d_nand_fab_project" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "befe907866b711f0c2368673f2db706eaffdcbbebd8190ff4a0ed1b7121f1e75", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "3d_nand_fab_project" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "3d_nand_fab_project" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hubei-ymtc-phase3", "title": "长存三期项目加速推进", "publisher": "湖北省人民政府", "url": "https://www.hubei.gov.cn/hbfb/rdgz/202605/t20260520_5939700.shtml", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2026-05-20", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Investment is not deployed capital, equipment list, capacity, first wafer or qualified production." ] }, { "source_id": "src-wuhan-ymtc-phase3", "title": "长江存储三期项目建设进展", "publisher": "武汉市人民政府", "url": "https://www.wuhan.gov.cn/sy/whyw/202601/t20260108_2708121.shtml", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2026-01-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Construction start is not tool move-in, installed capacity, first wafer, qualification or production." ] } ], "entity_reference": { "entity_id": "ent-ymtc-phase3", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "长存三期（武汉）集成电路有限责任公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "长存三期（武汉）集成电路有限责任公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_project_company", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Wuhan, Hubei, China", "countries_of_operation": [ "China" ], "facility_ids": [ "fac-ymtc-phase3" ] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "优控智行", "Youkong Zhixing" ], "brands": [], "canonical_legal_name_cn": null, "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-youkong-zhixing-endpoint-unresolved", "entity_type": "brand_or_unresolved_endpoint", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": null, "id": "ent-youkong-zhixing-endpoint-unresolved", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-houmo-h30-youkong-20231229" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "automotive_system_integration" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "2ce107a87cb659ec053ce196a47fb9a6d1df9778d850ed28ba93526d465cf3b0", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "automotive_system_integration" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "automotive_system_integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-houmo-h30-youkong-20231229", "title": "后摩智能与优控智行战略合作", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/3/28/NewsDetails.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2023-12-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Counterparty legal entity, production vehicle, contract, units, foundry, memory and OSAT are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-youkong-zhixing-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "identity_ownership_geography": { "legal_identity": { "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "unresolved_legal_endpoint", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": null, "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "Yuliangsheng" ], "brands": [], "canonical_legal_name_cn": "上海宇量昇科技有限公司", "canonical_legal_name_en": null, "completion_state": "lead_only", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-yuliangsheng", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "Shanghai, China", "id": "ent-yuliangsheng", "joint_venture_ids": [], "last_checked": "2026-07-29", "lei": null, "ownership_type": "mainland_private", "parent_entity_id": null, "process_ids": [ "proc-lithography-immersion-arf" ], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-ft-yuliangsheng-smic-2026" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "lithography_equipment" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "93c684b2e2559dec16a498c03b17224d6633f8dec44782b8e1b96c770ed94bac", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "lithography_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "lithography_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-ft-yuliangsheng-smic-2026", "title": "China trials its first advanced tools for AI chipmaking", "publisher": "Financial Times", "url": "https://www.ft.com/content/8fd79522-e34f-4633-bc87-ef0aae2d9159", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2025-09-17", "date_checked": "2026-07-29", "access_state": "paywalled", "limitations": [ "Paywalled secondary report; prototype evaluation is not delivery/acceptance or qualified production." ] } ], "entity_reference": { "entity_id": "ent-yuliangsheng", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海宇量昇科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海宇量昇科技有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_private", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "Shanghai, China", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } }, { "aliases": [ "CRRC Times", "中车时代半导体" ], "brands": [], "canonical_legal_name_cn": "株洲中车时代半导体有限公司", "canonical_legal_name_en": "Zhuzhou CRRC Times Semiconductor Co., Ltd.", "completion_state": "source_backed", "countries_of_operation": [ "China" ], "country_of_ownership": "China", "entity_id": "ent-zhuzhou-crrc-times-semiconductor", "entity_type": "company", "exchange": null, "facility_ids": [], "former_names": [], "headquarters": "China; exact headquarters unresolved", "id": "ent-zhuzhou-crrc-times-semiconductor", "joint_venture_ids": [], "last_checked": "2026-08-01", "lei": null, "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "process_ids": [], "product_ids": [], "record_type": "entity", "registration_id": null, "source_ids": [ "src-crrc-times-semiconductor-profile-20260801" ], "state_parent": null, "subsidiary_entity_ids": [], "supply_chain_layers": [ "power semiconductor design", "power semiconductor idm", "wafer fabrication", "assembly", "test" ], "ticker": null, "canonical_dataset": "entities.yaml", "canonical_record_sha256": "643cebef9e0e35cab550ff7209590fc215f4ac3fcf89a1b73225987cca0c78ff", "stage_ids": [ "design_company", "architecture_ip", "logic_foundry_process", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "power semiconductor design" } ] }, { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "power semiconductor design" }, { "field": "supply_chain_layers", "value": "power semiconductor idm" } ] }, { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "power semiconductor idm" }, { "field": "supply_chain_layers", "value": "wafer fabrication" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "supply_chain_layers", "value": "assembly" }, { "field": "supply_chain_layers", "value": "test" } ] } ], "canonical_classification_inputs": [ { "field": "supply_chain_layers", "value": "power semiconductor design" }, { "field": "supply_chain_layers", "value": "power semiconductor idm" }, { "field": "supply_chain_layers", "value": "wafer fabrication" }, { "field": "supply_chain_layers", "value": "assembly" }, { "field": "supply_chain_layers", "value": "test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-crrc-times-semiconductor-profile-20260801", "title": "Company Profile", "publisher": "Zhuzhou CRRC Times Semiconductor Co., Ltd.", "url": "https://ctsc.csrzic.com/protalen/gywm/gsjj/gsjj_1.htm", "source_type": "company_profile", "primary_status": "primary", "publication_date": null, "date_checked": "2026-08-01", "access_state": "open", "limitations": [ "The holding-company relationship is described without an ownership percentage; no accelerator-product supplier edge is established." ] } ], "entity_reference": { "entity_id": "ent-zhuzhou-crrc-times-semiconductor", "record_level": "company", "canonical_legal_name_en": "Zhuzhou CRRC Times Semiconductor Co., Ltd.", "canonical_legal_name_cn": "株洲中车时代半导体有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "identity_ownership_geography": { "legal_identity": { "record_level": "company", "canonical_legal_name_en": "Zhuzhou CRRC Times Semiconductor Co., Ltd.", "canonical_legal_name_cn": "株洲中车时代半导体有限公司", "identity_resolution_state": "not_recorded" }, "ownership": { "country_of_ownership": "China", "ownership_type": "mainland_control_not_closed_in_source", "parent_entity_id": null, "state_parent": null }, "geography": { "headquarters": "China; exact headquarters unresolved", "countries_of_operation": [ "China" ], "facility_ids": [] }, "boundary": "Legal identity, ownership and control, headquarters, countries of operation, facility location, design location, manufacturing location, and product origin are not interchangeable." } } ], "products": [ { "commercial_state": "commercial_catalogue_region_dependent", "completion_state": "source_backed", "entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-alibaba-ecs-c8y", "last_checked": "2026-07-29", "name": "Alibaba Cloud ECS c8y instance family", "product_class": "cloud_compute_instance_family", "product_id": "prod-alibaba-ecs-c8y", "record_type": "product", "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ], "unknowns": [ "region-specific legal operator", "actual availability", "facility", "installed CPU count", "server BOM", "utilization", "uptime", "customer/workload" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "4bcee985d5dd2f5cc6a878dc2b7a6cce08bf67c247fe3196d6a3581474ea8d80", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "product_class", "value": "cloud_compute_instance_family" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "cloud_compute_instance_family" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-alibaba-ecs-yitian-instance-families-20260625", "title": "Elastic Compute Service: Available instance families", "publisher": "Alibaba Cloud Documentation Center", "url": "https://www.alibabacloud.com/help/en/ecs/user-guide/overview-of-instance-families", "source_type": "official_cloud_product_documentation", "primary_status": "primary", "publication_date": "2026-06-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves a current commercial catalogue configuration, not region-specific operator, physical facility, installed count or utilization.", "Server manufacturer, board BOM, foundry, package/OSAT, capacity, tenant, uptime and workload receipts are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "record_level": "service_brand_or_unresolved_operator", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "commercial_catalogue_region_dependent", "completion_state": "source_backed", "entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-alibaba-ecs-g8y", "last_checked": "2026-07-29", "name": "Alibaba Cloud ECS g8y instance family", "product_class": "cloud_compute_instance_family", "product_id": "prod-alibaba-ecs-g8y", "record_type": "product", "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ], "unknowns": [ "region-specific legal operator", "actual availability", "facility", "installed CPU count", "server BOM", "utilization", "uptime", "customer/workload" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "a249813647cfc0f6022dbfa0f00dba7d2980d0a826c855f1dd16278556604a68", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "product_class", "value": "cloud_compute_instance_family" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "cloud_compute_instance_family" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-alibaba-ecs-yitian-instance-families-20260625", "title": "Elastic Compute Service: Available instance families", "publisher": "Alibaba Cloud Documentation Center", "url": "https://www.alibabacloud.com/help/en/ecs/user-guide/overview-of-instance-families", "source_type": "official_cloud_product_documentation", "primary_status": "primary", "publication_date": "2026-06-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves a current commercial catalogue configuration, not region-specific operator, physical facility, installed count or utilization.", "Server manufacturer, board BOM, foundry, package/OSAT, capacity, tenant, uptime and workload receipts are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "record_level": "service_brand_or_unresolved_operator", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "commercial_catalogue_region_dependent", "completion_state": "source_backed", "entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-alibaba-ecs-r8y", "last_checked": "2026-07-29", "name": "Alibaba Cloud ECS r8y instance family", "product_class": "cloud_compute_instance_family", "product_id": "prod-alibaba-ecs-r8y", "record_type": "product", "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ], "unknowns": [ "region-specific legal operator", "actual availability", "facility", "installed CPU count", "server BOM", "utilization", "uptime", "customer/workload" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "9c84e61c19313988b09d31fa795f4a749b41eef51c7eec6b4cc80c60294f5802", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "product_class", "value": "cloud_compute_instance_family" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "cloud_compute_instance_family" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-alibaba-ecs-yitian-instance-families-20260625", "title": "Elastic Compute Service: Available instance families", "publisher": "Alibaba Cloud Documentation Center", "url": "https://www.alibabacloud.com/help/en/ecs/user-guide/overview-of-instance-families", "source_type": "official_cloud_product_documentation", "primary_status": "primary", "publication_date": "2026-06-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves a current commercial catalogue configuration, not region-specific operator, physical facility, installed count or utilization.", "Server manufacturer, board BOM, foundry, package/OSAT, capacity, tenant, uptime and workload receipts are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "record_level": "service_brand_or_unresolved_operator", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "launched_apply_for_trial", "completion_state": "source_backed", "entity_id": "ent-baidu-ai-cloud-brand-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-baidu-baige-deepseek-p800", "last_checked": "2026-07-29", "name": "Baidu Baige DeepSeek appliance — 8-card P800 configuration", "product_class": "enterprise_ai_appliance", "product_id": "prod-baidu-baige-deepseek-p800", "record_type": "product", "source_ids": [ "src-baidu-baige-deepseek-p800-20250217" ], "unknowns": [ "orders", "shipment", "customer acceptance", "server OEM/BOM", "sustained workload/latency/energy", "reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "531ff334bbd28e3ca631b837423839bd16c5da53a73d5bc9ad35eea85806bb77", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "enterprise_ai_appliance" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "enterprise_ai_appliance" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-baidu-baige-deepseek-p800-20250217", "title": "百度百舸 DeepSeek 一体机发布，支持昆仑芯 P800 单机 8 卡满血版开箱即用", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_e0a478ab-bfa4-425c-b9b5-a6d296f6c698", "source_type": "official_operator_product_release", "primary_status": "primary", "publication_date": "2025-02-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Launch/apply-for-trial and vendor deployment statements; no order, shipment, customer acceptance or independent workload receipt.", "Server OEM, CPU/memory/network BOM, cluster facility, exact card count, uptime and utilization are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-baidu-ai-cloud-brand-unresolved", "record_level": "service_brand_or_unresolved_operator", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "firmware_supported_option", "completion_state": "source_backed", "entity_id": "ent-biren-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-biren-104p", "last_checked": "2026-07-29", "name": "Biren 104P", "product_class": "accelerator_option", "product_id": "prod-biren-104p", "record_type": "product", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "unknowns": [ "legal supplier", "configured server SKU", "order", "shipment", "installation", "customer" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "6221103d3a6ed3f62b1b73bca7b9fb84cc3cb0c78b06553699a03d098c4a96d0", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "accelerator_option" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "accelerator_option" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-h3c-h65-bios-574-20230804", "title": "H3C H65-BIOS-5.74版本说明书", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202308/1903077_30005_0.htm", "source_type": "official_firmware_release_notes", "primary_status": "primary", "publication_date": "2023-08-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Firmware adaptation/support is not a purchase, configured commercial SKU, order, shipment, installation or external qualification.", "The signed binary is named with MD5 eea6fa3e3dc6f629ee8fdaa78932627c; it was not locally archived." ] } ], "entity_reference": { "entity_id": "ent-biren-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Shanghai Biren Technology Co., Ltd.", "canonical_legal_name_cn": "上海壁仞科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "volume_production_and_commercialization_issuer_reported", "completion_state": "volume_backed", "entity_id": "ent-biren-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-biren-br106-family", "last_checked": "2026-07-29", "name": "BR106 form-factor family", "product_class": "ai_accelerator_family", "product_id": "prod-biren-br106-family", "record_type": "product", "source_ids": [ "src-biren-annual-2025" ], "unknowns": [ "variant split", "units", "foundry", "HBM supplier", "package/OSAT", "customers", "facilities", "yield", "field reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "926b7bc76365c7f81ffbb9d087cebb4c879e619a7989146b8cf875514fbda991", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_family" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_accelerator_family" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-biren-annual-2025", "title": "Shanghai Biren Technology Co., Ltd. 2025 Annual Report", "publisher": "香港交易所", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0422/2026042200045.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-22", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers, project sites, foundry, OSAT, memory suppliers and variant-specific unit counts are withheld." ] } ], "entity_reference": { "entity_id": "ent-biren-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Shanghai Biren Technology Co., Ltd.", "canonical_legal_name_cn": "上海壁仞科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "volume_production_and_commercialization_issuer_reported", "completion_state": "volume_backed", "entity_id": "ent-biren-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-biren-br166-family", "last_checked": "2026-07-29", "name": "BR166 form-factor family", "product_class": "ai_accelerator_family", "product_id": "prod-biren-br166-family", "record_type": "product", "source_ids": [ "src-biren-annual-2025" ], "unknowns": [ "variant split", "units", "foundry", "HBM supplier", "package/OSAT", "customers", "facilities", "yield", "field reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "1b3951784b6deb0733adaa45d4c00ef757bfe42c1d3d8468243a747b8d882e20", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_family" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_accelerator_family" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-biren-annual-2025", "title": "Shanghai Biren Technology Co., Ltd. 2025 Annual Report", "publisher": "香港交易所", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0422/2026042200045.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-22", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers, project sites, foundry, OSAT, memory suppliers and variant-specific unit counts are withheld." ] } ], "entity_reference": { "entity_id": "ent-biren-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Shanghai Biren Technology Co., Ltd.", "canonical_legal_name_cn": "上海壁仞科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "commercial_version_released; several-thousand-card aggregate deployment vendor-reported", "completion_state": "source_backed", "entity_id": "ent-biren-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-biren-lightsphere-x", "last_checked": "2026-07-29", "name": "光跃 LightSphere X / 光跃超节点", "product_class": "GPU_supernode_system", "product_id": "prod-biren-lightsphere-x", "record_type": "product", "source_ids": [ "src-biren-lightspherex-initial", "src-biren-lightspherex-commercial" ], "unknowns": [ "exact accelerator-card model", "named customer", "named facility", "unit count by site", "acceptance", "price", "uptime", "utilization", "full BOM", "foreign dependencies" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "5ef46e778907fe47e7ce8dfac03900957f306144b8c8ddcd8a8b3ce1a988b7fa", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "GPU_supernode_system" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "GPU_supernode_system" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "GPU_supernode_system" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-biren-lightspherex-initial", "title": "光跃LightSphere X超节点", "publisher": "上海壁仞科技股份有限公司", "url": "https://www.birentech.com/news/uk3x1bhhagcrtf5bqkurbnsa/", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Planned deployment at source date; no purchase, named customer, facility acceptance or installed-card count." ] }, { "source_id": "src-biren-lightspherex-commercial", "title": "光跃超节点商业版联合发布", "publisher": "上海壁仞科技股份有限公司", "url": "https://sgc-prod.birentech.com/news/h5vjj6lsw4n5za2yw6ayyv1e/", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2026-03-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported aggregate; no site, customer, exact card SKU, acceptance, uptime or utilization." ] } ], "entity_reference": { "entity_id": "ent-biren-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Shanghai Biren Technology Co., Ltd.", "canonical_legal_name_cn": "上海壁仞科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "integrated_in_online_cloud_service", "completion_state": "facility_backed", "entity_id": "ent-cambricon-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-cambricon-mlu370-s4", "last_checked": "2026-07-29", "name": "MLU370-S4", "product_class": "ai_accelerator_card", "product_id": "prod-cambricon-mlu370-s4", "record_type": "product", "source_ids": [ "src-ctyun-cambricon-cloud-20260703" ], "unknowns": [ "legal supplier", "foundry", "memory", "package/OSAT", "quantity", "power", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "bb0676d495b7955aefa53de944df55d3bdc2cf37cabd4974fe50db27d13d08bf", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_card" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_card" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_accelerator_card" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-07-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-cambricon-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Cambricon Technologies Corporation Limited", "canonical_legal_name_cn": "中科寒武纪科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "firmware_supported_option", "completion_state": "source_backed", "entity_id": "ent-cambricon-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-cambricon-mlu370-x4", "last_checked": "2026-07-29", "name": "MLU370-X4", "product_class": "accelerator_option", "product_id": "prod-cambricon-mlu370-x4", "record_type": "product", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "unknowns": [ "legal supplier", "configured server SKU", "order", "shipment", "installation", "customer" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "260da5002d5d7e9b9a4b662250e5bde87497b399b49cc8fbcc58ddda46b432f8", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "accelerator_option" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "accelerator_option" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-h3c-h65-bios-574-20230804", "title": "H3C H65-BIOS-5.74版本说明书", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202308/1903077_30005_0.htm", "source_type": "official_firmware_release_notes", "primary_status": "primary", "publication_date": "2023-08-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Firmware adaptation/support is not a purchase, configured commercial SKU, order, shipment, installation or external qualification.", "The signed binary is named with MD5 eea6fa3e3dc6f629ee8fdaa78932627c; it was not locally archived." ] } ], "entity_reference": { "entity_id": "ent-cambricon-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Cambricon Technologies Corporation Limited", "canonical_legal_name_cn": "中科寒武纪科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "board_power": "250 W", "commercial_state": "official_product_page", "completion_state": "source_backed", "entity_id": "ent-cambricon-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "foundry": null, "generation": "MLU370", "id": "prod-cambricon-mlu370-x8", "last_checked": "2026-07-29", "memory_bandwidth": "614.4 GB/s", "memory_capacity": "48 GB", "memory_type": "LPDDR5", "name": "MLU370-X8", "process": "7 nm (vendor specification; foundry undisclosed)", "product_class": "ai_accelerator_card", "product_id": "prod-cambricon-mlu370-x8", "record_type": "product", "source_ids": [ "src-cambricon-mlu370x8-product" ], "unknowns": [ "foundry", "memory supplier", "die size", "package/OSAT", "units", "named customer", "independent workload result", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "718ff2a9d13c091c187b1122d929ac2948a028061c17d4cfed1f0e6acfb1e88c", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_card" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_card" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_accelerator_card" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cambricon-mlu370x8-product", "title": "MLU370-X8 智能加速卡", "publisher": "中科寒武纪科技股份有限公司", "url": "https://www.cambricon.com/index.php?a=lists&c=index&catid=406&m=content", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, LPDDR5 supplier, OSAT, package, units, named customer and independent workload receipt are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-cambricon-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Cambricon Technologies Corporation Limited", "canonical_legal_name_cn": "中科寒武纪科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "cumulative_family_sales_over_one_million_vendor_reported", "completion_state": "volume_backed", "entity_id": "ent-cambricon-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-cambricon-siyuan220-family", "last_checked": "2026-07-29", "name": "Siyuan 220 series", "product_class": "edge_ai_accelerator_family", "product_id": "prod-cambricon-siyuan220-family", "record_type": "product", "source_ids": [ "src-cambricon-annual-2025" ], "unknowns": [ "model split", "period split", "foundry", "package/OSAT", "memory", "facility", "customers", "yield", "field reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "238d94357c01fcb21e23630ddf676b5bac7b366c8cf46df3fdfa590ac2707c55", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "edge_ai_accelerator_family" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "edge_ai_accelerator_family" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cambricon-annual-2025", "title": "中科寒武纪科技股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-13/688256_20260313_GWH3.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-13", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, wafer facility, OSAT, package flow, memory supplier and named customers are undisclosed.", "The one-million figure is family cumulative volume, not a model/facility split." ] } ], "entity_reference": { "entity_id": "ent-cambricon-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Cambricon Technologies Corporation Limited", "canonical_legal_name_cn": "中科寒武纪科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "online_cloud_service_family_page", "completion_state": "relationship_backed", "entity_id": "ent-tianyi-cloud-tech", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-ctyun-pak1", "last_checked": "2026-07-29", "name": "PAK1 Ascend compute-accelerated cloud host", "product_class": "cloud_accelerator_instance", "product_id": "prod-ctyun-pak1", "record_type": "product", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "unknowns": [ "per-resource-pool availability", "multi-card LLM support", "hardware quantity", "utilization", "tenant" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "604b066b53cdc26d20a8b277eb7706f2a0a1d330e4d1b5b6ac1128e270fc8873", "stage_ids": [ "architecture_ip", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "cloud_accelerator_instance" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "product_class", "value": "cloud_accelerator_instance" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "cloud_accelerator_instance" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] } ], "entity_reference": { "entity_id": "ent-tianyi-cloud-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "online_cloud_service_family_page", "completion_state": "relationship_backed", "entity_id": "ent-tianyi-cloud-tech", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-ctyun-pak2", "last_checked": "2026-07-29", "name": "PAK2 Ascend compute-accelerated cloud host", "product_class": "cloud_accelerator_instance", "product_id": "prod-ctyun-pak2", "record_type": "product", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "unknowns": [ "per-resource-pool availability", "hardware quantity", "purchase/acceptance", "utilization", "tenant" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "9f8c326b51a79529efd85714df9b9ed51bbd47580f8340e69d54353db9ca4d3b", "stage_ids": [ "architecture_ip", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "cloud_accelerator_instance" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "product_class", "value": "cloud_accelerator_instance" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "cloud_accelerator_instance" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] } ], "entity_reference": { "entity_id": "ent-tianyi-cloud-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "online_cloud_service", "completion_state": "facility_backed", "entity_id": "ent-tianyi-cloud-tech", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-ctyun-pak3", "last_checked": "2026-07-29", "name": "PAK3 Ascend compute-accelerated cloud host", "product_class": "cloud_accelerator_instance", "product_id": "prod-ctyun-pak3", "record_type": "product", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "unknowns": [ "hardware quantity", "purchase/acceptance", "utilization", "tenant", "exact site", "field reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "e242a806692fc3d6a951a7b72235f1068351d0e3829f02c2a50ca74221415df2", "stage_ids": [ "architecture_ip", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "cloud_accelerator_instance" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "product_class", "value": "cloud_accelerator_instance" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "cloud_accelerator_instance" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] } ], "entity_reference": { "entity_id": "ent-tianyi-cloud-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "online_cloud_service", "completion_state": "facility_backed", "entity_id": "ent-tianyi-cloud-tech", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-ctyun-pch1", "last_checked": "2026-07-29", "name": "PCH1 Cambricon compute-accelerated cloud host", "product_class": "cloud_accelerator_instance", "product_id": "prod-ctyun-pch1", "record_type": "product", "source_ids": [ "src-ctyun-cambricon-cloud-20260703" ], "unknowns": [ "hardware quantity", "purchase/acceptance", "utilization", "tenant", "exact site", "field reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "d84ceeb0aba7371af8de01e0e89399bff4a0f668e7505d10be232d9b1693de12", "stage_ids": [ "architecture_ip", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "cloud_accelerator_instance" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "product_class", "value": "cloud_accelerator_instance" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "cloud_accelerator_instance" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-07-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-tianyi-cloud-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "firmware_supported_option", "completion_state": "source_backed", "entity_id": "ent-cxmt-corp", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-cxmt-cxmq3a4ma4gr7-cj1-a-new", "last_checked": "2026-07-29", "name": "CXMQ3A4MA4GR7-CJ1-A_NEW", "product_class": "server_memory_option", "product_id": "prod-cxmt-cxmq3a4ma4gr7-cj1-a-new", "record_type": "product", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "unknowns": [ "module legal manufacturer", "DRAM die/BOM", "configured server SKU", "order", "shipment", "customer" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "438d7ef04b54218e75ac538f05b62f03da7e82b5d1e3e0b050945898da0ab63d", "stage_ids": [ "memory_manufacturer", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "product_class", "value": "server_memory_option" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "server_memory_option" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "server_memory_option" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-h3c-h65-bios-574-20230804", "title": "H3C H65-BIOS-5.74版本说明书", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202308/1903077_30005_0.htm", "source_type": "official_firmware_release_notes", "primary_status": "primary", "publication_date": "2023-08-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Firmware adaptation/support is not a purchase, configured commercial SKU, order, shipment, installation or external qualification.", "The signed binary is named with MD5 eea6fa3e3dc6f629ee8fdaa78932627c; it was not locally archived." ] } ], "entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "vendor_reported_product", "completion_state": "source_backed", "entity_id": "ent-cxmt-corp", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "generation": "DDR5", "id": "prod-cxmt-ddr5", "last_checked": "2026-07-29", "name": "DDR5", "product_class": "dram", "product_id": "prod-cxmt-ddr5", "record_type": "product", "source_ids": [ "src-cxmt-official-products-2026" ], "unknowns": [ "die revision", "named module customers", "volume", "yield", "fab/tool/material BOM" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "acda1b8e94ebfbf6938025664e56bdc1a645be6d9dc3c9a186c6cefc1ca422df", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "product_class", "value": "dram" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "dram" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cxmt-official-products-2026", "title": "CXMT - Products", "publisher": "CXMT Corporation", "url": "https://www.cxmt.com/en/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio statement does not prove a particular customer, wafer capacity, yield, or shipment volume." ] } ], "entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "customer_validated", "completion_state": "relationship_backed", "entity_id": "ent-cxmt-corp", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "generation": "LPDDR5", "id": "prod-cxmt-lpddr5-12gb", "last_checked": "2026-07-29", "name": "12 GB LPDDR5", "product_class": "mobile_dram", "product_id": "prod-cxmt-lpddr5-12gb", "record_type": "product", "source_ids": [ "src-cxmt-xiaomi-transsion-validation-2023" ], "unknowns": [ "phone model", "contracting legal entity", "shipments", "yield", "current program" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "5868d797cae4b1693f3b5f8e7c8b3c9588d66ddae770f1b6bb8ee05c9129813f", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "product_class", "value": "mobile_dram" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "mobile_dram" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cxmt-xiaomi-transsion-validation-2023", "title": "长鑫存储LPDDR5产品正式发布", "publisher": "CXMT", "url": "https://www.cxmt.com/news/info_90.html", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2023-11-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Names brands, not contracting legal entities; does not state sustained shipment volume." ] } ], "entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "speed_bin_specific_vendor_reported", "completion_state": "source_backed", "entity_id": "ent-cxmt-corp", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-cxmt-lpddr5x", "last_checked": "2026-07-29", "name": "LPDDR5X", "product_class": "mobile_dram", "product_id": "prod-cxmt-lpddr5x", "record_type": "product", "source_ids": [ "src-cxmt-lpddr5x-2025" ], "unknowns": [ "customer qualification by rate", "shipment volume", "yield", "field reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "2dcc492b7a234fea63db56dc5b61c2efe34eea4d71bcfa23e03fa6b5b0c8c85b", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "product_class", "value": "mobile_dram" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "mobile_dram" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cxmt-lpddr5x-2025", "title": "长鑫存储LPDDR5X产品实现量产", "publisher": "长鑫科技集团股份有限公司", "url": "https://www.cxmt.com/news/info_94.html", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2025-10-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported state; no customer acceptance, shipment volume, yield or field reliability." ] } ], "entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "first_delivery_and_named_vehicle_integrations", "completion_state": "relationship_backed", "configuration": { "cpu": "200K DMIPS", "interconnect": "SE-LINK 7.28 GT/s", "socs": "two SE1000" }, "entity_id": "ent-dd-ecarx-holdings", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-dd-antora-1000-pro", "last_checked": "2026-07-29", "name": "ECARX Antora 1000 Pro", "product_class": "automotive_cockpit_compute_platform", "product_id": "prod-dd-antora-1000-pro", "record_type": "product", "source_ids": [ "src-dd-auto-001", "src-dd-auto-002", "src-dd-auto-003", "src-dd-auto-007", "src-dd-auto-008" ], "unknowns": [ "mainland legal product owner", "chip transaction path", "foundry", "package/OSAT", "units", "line capacity", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "64faee1a8e6566e3f1abe9abefb67b996e8189a6606e6e23fe7ec29387195ebb", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "automotive_cockpit_compute_platform" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "automotive_cockpit_compute_platform" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-001", "title": "领克携手魅族探索移动出行智能化，全方位共创「无界」超级生态", "publisher": "领克汽车销售有限公司", "url": "https://www.lynkco.com.cn/brand/news/newslist/2023/1117", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2023-03-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No vehicle shipment count, direct chip purchase, foundry, package, OSAT or yield." ] }, { "source_id": "src-dd-auto-002", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2023-09-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ] }, { "source_id": "src-dd-auto-003", "title": "安托拉1000 Pro量产交付相关政务记录", "publisher": "武汉经济技术开发区", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202309/t20230927_2272685.html", "source_type": "government_company_event_record", "primary_status": "primary", "publication_date": "2023-09-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Company-attributed government record, not an independent production audit." ] }, { "source_id": "src-dd-auto-007", "title": "ECARX to Power Launch of First Hongqi Model Under Strategic Partnership with FAW, Debuting AutoGPT with DeepSeek-R1 Integration", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-power-launch-first-hongqi-model-under-strategic", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2025-02-11", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-origin release; no vehicle deliveries, contract, chip shipment, foundry or OSAT." ] }, { "source_id": "src-dd-auto-008", "title": "ECARX Antora 1000 Pro", "publisher": "ECARX", "url": "https://www.ecarxgroup.com/ecarx-antora-1000-pro/", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue specifications do not prove vehicle shipments, yield, foundry or package." ] } ], "entity_reference": { "entity_id": "ent-dd-ecarx-holdings", "record_level": "company", "canonical_legal_name_en": "ECARX Holdings Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "large_scale_application_and_batch_vehicle_installation_vendor_reported", "completion_state": "volume_backed", "entity_id": "ent-dd-byd-semiconductor-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-dd-byd-1500v-sic-chip", "last_checked": "2026-07-29", "name": "BYD 1500 V high-voltage high-power SiC chip", "product_class": "automotive_sic_power_semiconductor", "product_id": "prod-dd-byd-1500v-sic-chip", "record_type": "product", "source_ids": [ "src-dd-byd-001", "src-dd-byd-002" ], "unknowns": [ "exact legal developer/manufacturer", "fab", "substrate/epitaxy suppliers", "equipment/material suppliers", "capacity", "output", "yield", "reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "cc8009620f6080bdc5fb2dad1b9be64fbc00a3654e1dedc381ad67875476fe49", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "automotive_sic_power_semiconductor" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "automotive_sic_power_semiconductor" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "automotive_sic_power_semiconductor" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-byd-001", "title": "全球首款批量装车1500V高耐压大功率SiC芯片 助力全球最强超级e平台", "publisher": "比亚迪股份有限公司", "url": "https://www.byd.com/cn/news/2025/detail569", "source_type": "official_corporate_technical_announcement", "primary_status": "primary", "publication_date": "2025-03-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No fab, substrate/epitaxy supplier, equipment/material supplier, capacity, output, yield, vehicle count or independent reliability." ] }, { "source_id": "src-dd-byd-002", "title": "比亚迪超级e平台，兆瓦闪充开启油电同速", "publisher": "比亚迪股份有限公司", "url": "https://www.bydglobal.com/cn/news/2025-03-18/1617162611594", "source_type": "official_customer_corporate_announcement", "primary_status": "primary", "publication_date": "2025-03-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No delivered-vehicle count, facility, yield or independent validation." ] } ], "entity_reference": { "entity_id": "ent-dd-byd-semiconductor-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "batch_vehicle_installation_vendor_reported", "completion_state": "volume_backed", "entity_id": "ent-dd-byd-semiconductor-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-dd-byd-1500v-sic-module", "last_checked": "2026-07-29", "name": "BYD high-voltage double-sided silver-sintered SiC module", "process_features": [ "double-sided silver sintering", "laser welding", "high-temperature plastic encapsulant", "nano-silver sintering" ], "product_class": "automotive_power_module", "product_id": "prod-dd-byd-1500v-sic-module", "record_type": "product", "source_ids": [ "src-dd-byd-001" ], "unknowns": [ "exact legal manufacturer", "facility", "chip/source BOM", "substrate", "materials/equipment", "capacity", "yield", "reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "79560e38493c457ef42ece2a67d22d59cf5cc9117dbad7c1d5907ad7d83d6698", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "automotive_power_module" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "automotive_power_module" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-byd-001", "title": "全球首款批量装车1500V高耐压大功率SiC芯片 助力全球最强超级e平台", "publisher": "比亚迪股份有限公司", "url": "https://www.byd.com/cn/news/2025/detail569", "source_type": "official_corporate_technical_announcement", "primary_status": "primary", "publication_date": "2025-03-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No fab, substrate/epitaxy supplier, equipment/material supplier, capacity, output, yield, vehicle count or independent reliability." ] } ], "entity_reference": { "entity_id": "ent-dd-byd-semiconductor-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "launched_no_delivery_count", "completion_state": "source_backed", "entity_id": "ent-byd-contracting-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-dd-byd-c11", "last_checked": "2026-07-29", "name": "BYD C11 bus", "product_class": "electric_bus", "product_id": "prod-dd-byd-c11", "record_type": "product", "source_ids": [ "src-dd-byd-003" ], "unknowns": [ "deliveries", "fleet operator", "exact SiC chip", "facility", "full BOM" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "fc75a38a53aef46c3f00591b5847a09d9429cd73e8a80b46116fa439298ec4df", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "electric_bus" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "electric_bus" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-byd-003", "title": "比亚迪发布e-Bus平台3.0，推动电动客车进入千伏时代", "publisher": "比亚迪股份有限公司", "url": "https://www.bydglobal.com/cn/news/2025-09-16/1617162700470", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2025-09-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No exact chip ID/legal manufacturer, deliveries, fleet operator, facility, capacity or yield." ] } ], "entity_reference": { "entity_id": "ent-byd-contracting-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "BYD COMPANY LIMITED", "canonical_legal_name_cn": "比亚迪股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "launched", "completion_state": "source_backed", "entity_id": "ent-byd-contracting-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-dd-byd-ebus-3", "last_checked": "2026-07-29", "name": "BYD e-Bus Platform 3.0", "product_class": "electric_bus_platform", "product_id": "prod-dd-byd-ebus-3", "record_type": "product", "source_ids": [ "src-dd-byd-003" ], "unknowns": [ "exact SiC chip", "deliveries", "fleet operator", "facility" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "91b19378092b2057618fc2982b38e425228e737e1e77103df375f040fb355096", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "electric_bus_platform" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "electric_bus_platform" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-byd-003", "title": "比亚迪发布e-Bus平台3.0，推动电动客车进入千伏时代", "publisher": "比亚迪股份有限公司", "url": "https://www.bydglobal.com/cn/news/2025-09-16/1617162700470", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2025-09-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No exact chip ID/legal manufacturer, deliveries, fleet operator, facility, capacity or yield." ] } ], "entity_reference": { "entity_id": "ent-byd-contracting-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "BYD COMPANY LIMITED", "canonical_legal_name_cn": "比亚迪股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "mass_production_platform_vendor_reported", "completion_state": "volume_backed", "entity_id": "ent-byd-contracting-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-dd-byd-super-e", "last_checked": "2026-07-29", "name": "BYD Super e-Platform", "product_class": "passenger_vehicle_platform", "product_id": "prod-dd-byd-super-e", "record_type": "product", "source_ids": [ "src-dd-byd-001", "src-dd-byd-002" ], "unknowns": [ "vehicle deliveries", "trim/inverter BOM", "facility", "independent qualification" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "930ed5ac946eb053f9bd28806ec9f92e37a04af8871659b88a278f34a7bd349f", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "passenger_vehicle_platform" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "passenger_vehicle_platform" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-byd-001", "title": "全球首款批量装车1500V高耐压大功率SiC芯片 助力全球最强超级e平台", "publisher": "比亚迪股份有限公司", "url": "https://www.byd.com/cn/news/2025/detail569", "source_type": "official_corporate_technical_announcement", "primary_status": "primary", "publication_date": "2025-03-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No fab, substrate/epitaxy supplier, equipment/material supplier, capacity, output, yield, vehicle count or independent reliability." ] }, { "source_id": "src-dd-byd-002", "title": "比亚迪超级e平台，兆瓦闪充开启油电同速", "publisher": "比亚迪股份有限公司", "url": "https://www.bydglobal.com/cn/news/2025-03-18/1617162611594", "source_type": "official_customer_corporate_announcement", "primary_status": "primary", "publication_date": "2025-03-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No delivered-vehicle count, facility, yield or independent validation." ] } ], "entity_reference": { "entity_id": "ent-byd-contracting-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "BYD COMPANY LIMITED", "canonical_legal_name_cn": "比亚迪股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "launched_no_delivery_count", "completion_state": "relationship_backed", "entity_id": "ent-dd-faw-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-dd-hongqi-tiangong-05", "last_checked": "2026-07-29", "name": "Hongqi Tiangong 05", "product_class": "passenger_vehicle", "product_id": "prod-dd-hongqi-tiangong-05", "record_type": "product", "source_ids": [ "src-dd-auto-006", "src-dd-auto-007" ], "unknowns": [ "customer legal entity", "delivery count", "purchase terms", "production facility", "chip shipment count" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "ec249a3f6d286a4fbb017bbae719cb7a89042987f21b96481712e10441ff0477", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "passenger_vehicle" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "passenger_vehicle" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-006", "title": "红旗研发新视界：天工05", "publisher": "中国一汽", "url": "https://www.faw.com.cn/fawcn/5133331/5642305/5833080/index.html", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2025-02-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The customer does not name the chip/platform vendor or delivery count." ] }, { "source_id": "src-dd-auto-007", "title": "ECARX to Power Launch of First Hongqi Model Under Strategic Partnership with FAW, Debuting AutoGPT with DeepSeek-R1 Integration", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-power-launch-first-hongqi-model-under-strategic", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2025-02-11", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-origin release; no vehicle deliveries, contract, chip shipment, foundry or OSAT." ] } ], "entity_reference": { "entity_id": "ent-dd-faw-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "platform_first_delivery_vehicle_volume_unknown", "completion_state": "relationship_backed", "entity_id": "ent-dd-lynk-sales", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-dd-lynk08-2023", "last_checked": "2026-07-29", "name": "Lynk & Co 08 — 2023 Antora configuration", "product_class": "passenger_vehicle", "product_id": "prod-dd-lynk08-2023", "record_type": "product", "source_ids": [ "src-dd-auto-001", "src-dd-auto-002", "src-dd-auto-003" ], "unknowns": [ "vehicle deliveries", "factory legal owner/operator", "direct chip purchase path", "full semiconductor BOM" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "74d1744f6b3a98243488ed6f84931d8c8b8fb6bc0d375f01ad49508ffe07c1fc", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "passenger_vehicle" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "passenger_vehicle" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-001", "title": "领克携手魅族探索移动出行智能化，全方位共创「无界」超级生态", "publisher": "领克汽车销售有限公司", "url": "https://www.lynkco.com.cn/brand/news/newslist/2023/1117", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2023-03-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No vehicle shipment count, direct chip purchase, foundry, package, OSAT or yield." ] }, { "source_id": "src-dd-auto-002", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2023-09-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ] }, { "source_id": "src-dd-auto-003", "title": "安托拉1000 Pro量产交付相关政务记录", "publisher": "武汉经济技术开发区", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202309/t20230927_2272685.html", "source_type": "government_company_event_record", "primary_status": "primary", "publication_date": "2023-09-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Company-attributed government record, not an independent production audit." ] } ], "entity_reference": { "entity_id": "ent-dd-lynk-sales", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "领克汽车销售有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "launched", "completion_state": "source_backed", "entity_id": "ent-dd-lynk-sales", "foreign_dependencies": [ "Qualcomm Snapdragon 8295", "NVIDIA Thor" ], "foreign_dependency_status": "identified_candidates", "id": "prod-dd-lynk08-2025-refresh", "last_checked": "2026-07-29", "name": "Lynk & Co 08 EM-P — 2025 refreshed configuration", "product_class": "passenger_vehicle", "product_id": "prod-dd-lynk08-2025-refresh", "record_type": "product", "source_ids": [ "src-dd-auto-005" ], "unknowns": [ "vehicle deliveries", "chip SKUs/packages", "full BOM", "field reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "a37676c6ec17ff7f21f1e306c964084c23ac999b23760339ecc26a0bc3167136", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "passenger_vehicle" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "passenger_vehicle" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-005", "title": "全新有为 进阶无界，全新领克08 EM-P 15.98万元起正式上市", "publisher": "领克汽车销售有限公司", "url": "https://www.lynkco.com.cn/brand/news/newslist/2025news/0924", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2025-09-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Near-150,000 family users span generations and cannot be assigned to the earlier SE1000 configuration." ] } ], "entity_reference": { "entity_id": "ent-dd-lynk-sales", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "领克汽车销售有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "official_retail_shipping_offer_no_unit_volume", "completion_state": "relationship_backed", "entity_id": "ent-dd-poco-global-operator-unresolved", "foreign_dependencies": [ "Arm CPU/GPU IP", "Android Go", "Google services", "Google Assistant" ], "foreign_dependency_status": "identified_candidates", "id": "prod-dd-poco-c71", "last_checked": "2026-07-29", "memory_type": "LPDDR4X", "name": "POCO C71", "product_class": "smartphone", "product_id": "prod-dd-poco-c71", "record_type": "product", "source_ids": [ "src-dd-mobile-001", "src-dd-mobile-002", "src-dd-mobile-003", "src-dd-mobile-004" ], "storage": "eMMC 5.1", "unknowns": [ "legal product owner", "direct procurement path", "units", "memory/eMMC suppliers", "foundry", "package/OSAT" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "09d41493f608c0ae129b5eedf71205de67d6fce083ffc0df5c2db86ec43a533e", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "smartphone" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "smartphone" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-mobile-001", "title": "POCO C71", "publisher": "Xiaomi Global", "url": "https://www.mi.com/global/product/poco-c71/", "source_type": "official_customer_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No direct purchase path, SoC quantity, foundry, package or OSAT." ] }, { "source_id": "src-dd-mobile-002", "title": "POCO C71 Specs", "publisher": "Xiaomi Global", "url": "https://www.mi.com/global/product/poco-c71/specs/", "source_type": "official_customer_specification_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Memory type is stated but memory and eMMC suppliers are not." ] }, { "source_id": "src-dd-mobile-003", "title": "POCO C71 FAQ", "publisher": "Xiaomi Global Support", "url": "https://www.mi.com/global/support/faq/details/KA-559836/", "source_type": "official_customer_support_bom_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier strings are brands/abbreviations; legal entities, lot shares and direct purchasing are unresolved." ] }, { "source_id": "src-dd-mobile-004", "title": "Xiaomi 12.12 Mega Sale 2025", "publisher": "Xiaomi Singapore", "url": "https://www.mi.com/sg/support/terms/xiaomi-12-12-mega-sale-2025/", "source_type": "official_retail_terms", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Commercial offer and shipping availability do not prove completed sales or volume." ] } ], "entity_reference": { "entity_id": "ent-dd-poco-global-operator-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "integrated_in_first_delivered_antora_platform", "completion_state": "relationship_backed", "entity_id": "ent-dd-siengine-hubei", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-dd-se1000", "last_checked": "2026-07-29", "name": "SE1000 / 龍鷹一号 / DragonHawk 1", "process": "7 nm (vendor/customer statement)", "product_class": "automotive_soc", "product_id": "prod-dd-se1000", "record_type": "product", "source_ids": [ "src-dd-auto-001", "src-dd-auto-002", "src-dd-auto-003", "src-dd-auto-004", "src-dd-auto-008" ], "unknowns": [ "foundry", "package/OSAT", "unit shipments", "yield", "field reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "83a34ee94c33c9951201b57221088ec95486b1c995c10cee4826c34243cdf25a", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "automotive_soc" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "automotive_soc" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "automotive_soc" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-001", "title": "领克携手魅族探索移动出行智能化，全方位共创「无界」超级生态", "publisher": "领克汽车销售有限公司", "url": "https://www.lynkco.com.cn/brand/news/newslist/2023/1117", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2023-03-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No vehicle shipment count, direct chip purchase, foundry, package, OSAT or yield." ] }, { "source_id": "src-dd-auto-002", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2023-09-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ] }, { "source_id": "src-dd-auto-003", "title": "安托拉1000 Pro量产交付相关政务记录", "publisher": "武汉经济技术开发区", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202309/t20230927_2272685.html", "source_type": "government_company_event_record", "primary_status": "primary", "publication_date": "2023-09-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Company-attributed government record, not an independent production audit." ] }, { "source_id": "src-dd-auto-004", "title": "芯擎科技与龙鹰一号相关政务记录", "publisher": "武汉经济技术开发区", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202304/t20230423_2190472.html", "source_type": "government_company_identity_and_product_record", "primary_status": "primary", "publication_date": "2023-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, OSAT, delivered-chip quantity or vehicle volume." ] }, { "source_id": "src-dd-auto-008", "title": "ECARX Antora 1000 Pro", "publisher": "ECARX", "url": "https://www.ecarxgroup.com/ecarx-antora-1000-pro/", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue specifications do not prove vehicle shipments, yield, foundry or package." ] } ], "entity_reference": { "entity_id": "ent-dd-siengine-hubei", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "湖北芯擎科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "integrated_in_official_retail_offer", "completion_state": "relationship_backed", "cpu": "2× Arm Cortex-A75 1.8 GHz + 6× Cortex-A55 1.6 GHz", "entity_id": "ent-dd-unisoc-shanghai", "foreign_dependencies": [ "Arm Cortex CPU IP", "Arm Mali GPU IP" ], "foreign_dependency_status": "identified_candidates", "gpu": "Arm Mali-G57", "id": "prod-dd-unisoc-t7250", "last_checked": "2026-07-29", "name": "UNISOC T7250", "process": "12 nm (vendor/customer statement)", "product_class": "smartphone_soc", "product_id": "prod-dd-unisoc-t7250", "record_type": "product", "source_ids": [ "src-dd-mobile-001", "src-dd-mobile-002", "src-dd-mobile-003", "src-dd-mobile-005", "src-dd-mobile-006" ], "unknowns": [ "foundry", "package/OSAT", "units", "direct buyer/seller contract", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "44e9df8ac68410eccc766b5d7cf2cff5aee2b8ccc9098454bc3894349d1851ac", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "smartphone_soc" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "smartphone_soc" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "smartphone_soc" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-mobile-001", "title": "POCO C71", "publisher": "Xiaomi Global", "url": "https://www.mi.com/global/product/poco-c71/", "source_type": "official_customer_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No direct purchase path, SoC quantity, foundry, package or OSAT." ] }, { "source_id": "src-dd-mobile-002", "title": "POCO C71 Specs", "publisher": "Xiaomi Global", "url": "https://www.mi.com/global/product/poco-c71/specs/", "source_type": "official_customer_specification_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Memory type is stated but memory and eMMC suppliers are not." ] }, { "source_id": "src-dd-mobile-003", "title": "POCO C71 FAQ", "publisher": "Xiaomi Global Support", "url": "https://www.mi.com/global/support/faq/details/KA-559836/", "source_type": "official_customer_support_bom_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier strings are brands/abbreviations; legal entities, lot shares and direct purchasing are unresolved." ] }, { "source_id": "src-dd-mobile-005", "title": "T7250", "publisher": "紫光展锐", "url": "https://www.unisoc.com/cn/product/SmartPhone/T7250", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, Xiaomi-specific certification or volume." ] }, { "source_id": "src-dd-mobile-006", "title": "T7250", "publisher": "UNISOC", "url": "https://www.unisoc.com/en/product/SmartPhone/T7250", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, Xiaomi-specific certification or volume." ] } ], "entity_reference": { "entity_id": "ent-dd-unisoc-shanghai", "record_level": "company", "canonical_legal_name_en": "UNISOC (Shanghai) Technology Co., Ltd.", "canonical_legal_name_cn": "紫光展锐（上海）科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "architecture_classification": [ "H2" ], "commercial_state": "vendor_reported_product", "completion_state": "source_backed", "entity_id": "ent-dfsx", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "foundry": null, "generation": "DF1000", "id": "prod-dfsx-df1000", "last_checked": "2026-07-29", "memory_supplier": null, "memory_type": "vendor-described 3D DRAM near-memory", "name": "DF1000", "process": "vendor claim of 14 nm remains unverified in this baseline", "product_class": "ai_accelerator", "product_id": "prod-dfsx-df1000", "record_type": "product", "source_ids": [ "src-dfsx-df1000-product-2026", "src-dfsx-3d-near-memory-2026" ], "unknowns": [ "foundry", "memory supplier", "memory capacity", "interface width", "layer count", "bond flow", "bond pitch", "yield", "package", "OSAT", "TDP", "customers", "installed units", "shipment volume", "independent workload" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "defdd15b79108c2fc7999cc24f36eb25419e859ce14af71ee792fb4de58bfbc2", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_accelerator" }, { "field": "architecture_classification", "value": "H2" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dfsx-df1000-product-2026", "title": "DF1000 AI Accelerator", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/products/ai-accelerator/df1000", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor page exposes no independent workload receipt, memory supplier, foundry, package yield, power, customer, or shipment volume." ] }, { "source_id": "src-dfsx-3d-near-memory-2026", "title": "3D Near-Memory Computing", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/technology/3d-near-memory-computing", "source_type": "company_technology_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported architecture; no bond pitch, memory die source, layer count, yield, or independent test." ] } ], "entity_reference": { "entity_id": "ent-dfsx", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海东方算芯科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "vendor_reported_product", "completion_state": "source_backed", "entity_id": "ent-dfsx", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-dfsx-hs512", "last_checked": "2026-07-29", "name": "HS512", "product_class": "ai_cluster", "product_id": "prod-dfsx-hs512", "record_type": "product", "source_ids": [ "src-dfsx-qy100-hs512-2026" ], "unknowns": [ "HS128 naming relationship", "topology", "power", "customer", "shipments" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "21eb1dd5b94a5632c31a2aa66cf6bb75eb71396ca0b1fd3214ccc8ee46a69556", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_cluster" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_cluster" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dfsx-qy100-hs512-2026", "title": "QY100 Server and HS512 Cluster", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/products/servers-and-clusters/qy100-and-sh512", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Product positioning is not a named customer, installed-unit, or volume-shipment receipt." ] } ], "entity_reference": { "entity_id": "ent-dfsx", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海东方算芯科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "vendor_reported_product", "completion_state": "source_backed", "entity_id": "ent-dfsx", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-dfsx-qy100", "last_checked": "2026-07-29", "name": "QY100", "product_class": "ai_server", "product_id": "prod-dfsx-qy100", "record_type": "product", "source_ids": [ "src-dfsx-qy100-hs512-2026" ], "unknowns": [ "host CPU", "card count", "memory capacity", "power", "cooling", "customer", "shipments" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "79d08ff6864d489774eb25940e49f35b5ade7fb718f8f744d6bb068cd6885991", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_server" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_server" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dfsx-qy100-hs512-2026", "title": "QY100 Server and HS512 Cluster", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/products/servers-and-clusters/qy100-and-sh512", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Product positioning is not a named customer, installed-unit, or volume-shipment receipt." ] } ], "entity_reference": { "entity_id": "ent-dfsx", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海东方算芯科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "vendor_reported_product", "completion_state": "source_backed", "entity_id": "ent-dfsx", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-dfsx-ty64", "last_checked": "2026-07-29", "name": "TY64", "product_class": "ai_supernode", "product_id": "prod-dfsx-ty64", "record_type": "product", "source_ids": [ "src-dfsx-ty64-2026" ], "unknowns": [ "scale-up details", "scale-out details", "power", "cooling", "customer", "shipments", "independent workload" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "b82b9c1254804775168cc37259e50369eaf32984e9229337738b45fccbe051dd", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_supernode" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_supernode" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dfsx-ty64-2026", "title": "TY64 Supernode", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/products/superpod/ty64", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No matched-workload benchmark, customer acceptance, power, or field-reliability receipt." ] } ], "entity_reference": { "entity_id": "ent-dfsx", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海东方算芯科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "customer_adopted_vendor_reported", "completion_state": "relationship_backed", "entity_id": "ent-empyrean", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-empyrean-polas", "last_checked": "2026-07-29", "name": "Empyrean Polas", "product_class": "eda_reliability_analysis", "product_id": "prod-empyrean-polas", "record_type": "product", "source_ids": [ "src-empyrean-polas-willsemi-2022" ], "unknowns": [ "license scope", "Willsemi chip SKU", "foundry", "PDK", "volume" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "e34116fc58719085ee9aa8a32045113cd5ae35d775fe5f7f41f5ba099852f105", "stage_ids": [ "eda", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "product_class", "value": "eda_reliability_analysis" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "product_class", "value": "eda_reliability_analysis" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "eda_reliability_analysis" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-empyrean-polas-willsemi-2022", "title": "Empyrean Polas® Assists Willsemi in IC Design Reliability", "publisher": "Empyrean Technology Co., Ltd.", "url": "https://www.empyrean-tech.com/article/item-182.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2022-06-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-side announcement; contract, seats, chip SKU, foundry, PDK and production volume are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-empyrean", "record_level": "company", "canonical_legal_name_en": "Empyrean Technology Co., Ltd.", "canonical_legal_name_cn": "北京华大九天科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "2021_future_volume_plan_without_primary_closure", "completion_state": "lead_only", "entity_id": "ent-enflame", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-enflame-t20-t21", "last_checked": "2026-07-29", "memory_bandwidth": "1.8 TB/s reported", "memory_capacity": "64 GB reported", "memory_type": "HBM2E reported", "name": "云燧 T20 / T21", "product_class": "ai_accelerator_cards", "product_id": "prod-enflame-t20-t21", "record_type": "product", "source_ids": [ "src-enflame-t20-t21-20210709" ], "unknowns": [ "later production closure", "shipments", "foundry", "HBM supplier", "package/OSAT", "customer", "facility", "yield", "field reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "1fa05b0a6561ffe9b9dede56e1175a286d861e87ab375fef140cf78fd2331286", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_cards" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_cards" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_accelerator_cards" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-enflame-t20-t21-20210709", "title": "燧原科技发布云燧T20、T21", "publisher": "人民网转载中国电子报", "url": "https://finance.people.com.cn/n1/2021/0709/c1004-32153321.html", "source_type": "reputable_reporting", "primary_status": "secondary", "publication_date": "2021-07-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Future production plan; no later primary closing receipt, foundry, OSAT, HBM supplier, customer or shipment." ] } ], "entity_reference": { "entity_id": "ent-enflame", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海燧原科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "batch_supply_vendor_reported", "completion_state": "relationship_backed", "entity_id": "ent-gentech", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-gentech-gas-chemical-box", "last_checked": "2026-07-29", "name": "Gas Box / Chemical Box / Bubbler", "product_class": "gas_and_chemical_delivery_subassembly", "product_id": "prod-gentech-gas-chemical-box", "record_type": "product", "source_ids": [ "src-gentech-annual-2025" ], "unknowns": [ "SKU-to-equipment-maker mapping", "qualified tool model", "facility", "quantity", "foreign valves/MFC/controllers" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "9725deb86b04efa95480d5820db2fb5fb6abf2ba9259b983d7b13a12eb3157ab", "stage_ids": [ "critical_materials", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "product_class", "value": "gas_and_chemical_delivery_subassembly" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "product_class", "value": "gas_and_chemical_delivery_subassembly" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "gas_and_chemical_delivery_subassembly" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-gentech", "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "historical_product", "completion_state": "relationship_backed", "entity_id": "ent-gloway-brand", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-gloway-yi-pro-2020", "last_checked": "2026-07-29", "name": "Yi Pro memory module (2020)", "product_class": "dram_module", "product_id": "prod-gloway-yi-pro-2020", "record_type": "product", "source_ids": [ "src-gloway-cxmt-yipro" ], "unknowns": [ "exact SKU", "current status", "controller/PMIC/PCB BOM", "volume" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "ea17a2f5ec840a58b7ddf59e76c6ff8c89267b8fa9a4717ffa9f00329eff438b", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "product_class", "value": "dram_module" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "dram_module" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gloway-cxmt-yipro", "title": "光威品牌发展历程", "publisher": "嘉合劲威", "url": "https://www.gloway.com.cn/pages_29/", "source_type": "company_brand_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Brand history does not quantify SKU-level volumes, current authorization, or all BOM components." ] } ], "entity_reference": { "entity_id": "ent-gloway-brand", "record_level": "brand", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "official_firmware_release", "completion_state": "source_backed", "entity_id": "ent-h3c-technologies", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-h3c-h65-bios-574", "last_checked": "2026-07-29", "name": "H65-BIOS-5.74", "product_class": "server_firmware", "product_id": "prod-h3c-h65-bios-574", "record_type": "product", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "unknowns": [ "configured SKU", "order", "shipment", "customer validation", "installed base", "volume" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "7eadef2875a66d014664dd956b2f4d7ec0d49defb3fdd1b869ae0950a8f98d2a", "stage_ids": [ "board_system", "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "server_firmware" } ] }, { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "product_class", "value": "server_firmware" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "server_firmware" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-h3c-h65-bios-574-20230804", "title": "H3C H65-BIOS-5.74版本说明书", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202308/1903077_30005_0.htm", "source_type": "official_firmware_release_notes", "primary_status": "primary", "publication_date": "2023-08-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Firmware adaptation/support is not a purchase, configured commercial SKU, order, shipment, installation or external qualification.", "The signed binary is named with MD5 eea6fa3e3dc6f629ee8fdaa78932627c; it was not locally archived." ] } ], "entity_reference": { "entity_id": "ent-h3c-technologies", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "新华三技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "official_product", "completion_state": "source_backed", "entity_id": "ent-h3c-technologies", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-h3c-uniserver-r4930-g3", "last_checked": "2026-07-29", "name": "H3C UniServer R4930 G3", "product_class": "dual_socket_rack_server", "product_id": "prod-h3c-uniserver-r4930-g3", "record_type": "product", "source_ids": [ "src-h3c-r4930g3-product" ], "unknowns": [ "factory", "CPU SKU", "shipments", "customer", "installed base", "capacity", "failure rate", "component origins" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "eab158d94ce92033758d31d6359bacda61b0528311517eaec56e7b28818c04ff", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "dual_socket_rack_server" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "dual_socket_rack_server" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "dual_socket_rack_server" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-h3c-r4930g3-product", "title": "搭载海光二号的双路服务器H3C UniServer R4930 G3", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/Products_And_Solution/Server/H3C/Products/RackServer/Products_Series/Dualway_Server/R4930_G3/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No exact factory/address, processor SKU by configuration, shipment, customer, installed base, capacity or reliability receipt.", "The all-domestic wording lacks a component-level BOM and origin record." ] } ], "entity_reference": { "entity_id": "ent-h3c-technologies", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "新华三技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "stable_supply_vendor_reported", "completion_state": "relationship_backed", "entity_id": "ent-hanjing", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-hanjing-quartz-sic-components", "last_checked": "2026-07-29", "name": "High-purity quartz and silicon-carbide equipment components", "product_class": "equipment_consumables_and_chamber_components", "product_id": "prod-hanjing-quartz-sic-components", "record_type": "product", "source_ids": [ "src-gentech-annual-2025" ], "unknowns": [ "component SKU", "grade", "purity", "tool model", "fab", "layer", "quantity" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "d919a8fec26ebb64d08a37100f0de74b10ecd785857b0a3a3214feb1933d2e2e", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "product_class", "value": "equipment_consumables_and_chamber_components" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "equipment_consumables_and_chamber_components" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-hanjing", "record_level": "company", "canonical_legal_name_en": "Liaoning Hanjing Semiconductor Materials Co., Ltd.", "canonical_legal_name_cn": "辽宁汉京半导体材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "shipped_to_named_equipment_customers", "completion_state": "relationship_backed", "entity_id": "ent-hengyunchang", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-hengyunchang-rf-power", "last_checked": "2026-07-29", "name": "RF power supply systems", "product_class": "rf_power", "product_id": "prod-hengyunchang-rf-power", "record_type": "product", "source_ids": [ "src-hengyunchang-annual-2025" ], "unknowns": [ "SKU by customer", "fab", "tool model", "accepted layer", "stop-line spares" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "2fba276d49ffabca03144be204255b890bb1116ae4083336da202ea66b1e607b", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "product_class", "value": "rf_power" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "rf_power" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hengyunchang-annual-2025", "title": "深圳市恒运昌真空技术股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688785_20260428_AVJI.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer-reported customer revenue does not identify the receiving fab, tool model, layer, or exact accepted component SKU." ] } ], "entity_reference": { "entity_id": "ent-hengyunchang", "record_level": "company", "canonical_legal_name_en": "Shenzhen Hengyunchang Vacuum Technology Co., Ltd.", "canonical_legal_name_cn": "深圳市恒运昌真空技术股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "installed_in_volume_shipped_2021_Li_ONE", "completion_state": "volume_backed", "entity_id": "ent-horizon-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-horizon-journey-3", "last_checked": "2026-07-29", "name": "Journey 3", "product_class": "automotive_ai_accelerator", "product_id": "prod-horizon-journey-3", "record_type": "product", "source_ids": [ "src-li-auto-2021q1-results-20210526" ], "unknowns": [ "contracting legal entity", "foundry", "package/OSAT", "procurement quantity", "yield", "field failure rate" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "daaf74bf698fe73f5bdd8ea3ebe487a33efd7f1366bd8e0e236510e278f4f5b7", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "automotive_ai_accelerator" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "automotive_ai_accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "automotive_ai_accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-li-auto-2021q1-results-20210526", "title": "Li Auto Inc. Announces Unaudited First Quarter 2021 Financial Results", "publisher": "Li Auto Inc.", "url": "https://ir.lixiang.com/zh-hans/news-releases/news-release-details/li-auto-inc-announces-unaudited-first-quarter-2021-financial", "source_type": "company_financial_results", "primary_status": "primary", "publication_date": "2021-05-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Horizon's contracting legal entity, chip purchase quantity, supplier contract, manufacturing facility and accepted-system test are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-horizon-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "design_win_announced_for_unidentified_BYD_models", "completion_state": "source_backed", "entity_id": "ent-horizon-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-horizon-journey-5", "last_checked": "2026-07-29", "name": "Journey 5", "product_class": "automotive_ai_accelerator", "product_id": "prod-horizon-journey-5", "record_type": "product", "source_ids": [ "src-byd-horizon-journey5-designwin-20220421" ], "unknowns": [ "contracting legal entities", "vehicle model", "SOP", "installed units", "foundry", "package/OSAT", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "48b57298a0218e26f274caa017d875aa608f3a979b8b211346691356a3f41588", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "automotive_ai_accelerator" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "automotive_ai_accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "automotive_ai_accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-byd-horizon-journey5-designwin-20220421", "title": "比亚迪与地平线官宣合作 2023年部分上市车型将搭载征程5", "publisher": "比亚迪汽车工业有限公司", "url": "https://oip.byd.com/addons/cms/news/detail?category=1&news_id=72", "source_type": "customer_site_industry_news", "primary_status": "primary", "publication_date": "2022-04-21", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact contracting legal endpoints, vehicle models, SOP, delivery, installed units and volume are undisclosed.", "Rhetorical mass-production wording is not a model-specific shipment or production receipt." ] } ], "entity_reference": { "entity_id": "ent-horizon-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "strategic_co_development_vendor_reported", "completion_state": "source_backed", "entity_id": "ent-houmo", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-houmo-h30", "last_checked": "2026-07-29", "name": "鸿途 H30", "peak_compute": { "INT8": "256 TOPS reported" }, "product_class": "automotive_compute_in_memory_accelerator", "product_id": "prod-houmo-h30", "record_type": "product", "source_ids": [ "src-houmo-h30-youkong-20231229" ], "unknowns": [ "counterparty legal entity", "production vehicle", "foundry", "memory", "package/OSAT", "units", "qualification", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "16cc1fefed5af4c83e3c45dfe069a869ab18f654393986e173d5ca3f85658e5b", "stage_ids": [ "architecture_ip", "memory_manufacturer", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "automotive_compute_in_memory_accelerator" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "product_class", "value": "automotive_compute_in_memory_accelerator" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "automotive_compute_in_memory_accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "automotive_compute_in_memory_accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-houmo-h30-youkong-20231229", "title": "后摩智能与优控智行战略合作", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/3/28/NewsDetails.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2023-12-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Counterparty legal entity, production vehicle, contract, units, foundry, memory and OSAT are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-houmo", "record_level": "company", "canonical_legal_name_en": "PostMoore Technology Co., Ltd.", "canonical_legal_name_cn": "后摩智能科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "architecture_classification": [ "H3" ], "board_power": "10 W reported", "commercial_state": "integrated_in_announced_great_wall_n90_pro_vendor_reported", "completion_state": "relationship_backed", "entity_id": "ent-houmo", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-houmo-m50", "last_checked": "2026-07-29", "memory_bandwidth": "153.6 GB/s", "memory_capacity": "up to 48 GB", "memory_type": "LPDDR5", "name": "M50", "peak_compute": { "INT8": "160 TOPS", "bFP16": "100 TFLOPS" }, "product_class": "pc_compute_in_memory_accelerator", "product_id": "prod-houmo-m50", "record_type": "product", "source_ids": [ "src-houmo-m50-product", "src-houmo-m50-greatwall-20260531" ], "unknowns": [ "LPDDR5 supplier", "foundry", "package/OSAT", "units", "retail shipments", "acceptance", "independent workload", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "8948a5cb2c26ec846e95d6e14209918d2c3b384c3cd7a116edbddac0e48357a9", "stage_ids": [ "architecture_ip", "memory_manufacturer", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "pc_compute_in_memory_accelerator" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "product_class", "value": "pc_compute_in_memory_accelerator" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "pc_compute_in_memory_accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "pc_compute_in_memory_accelerator" }, { "field": "architecture_classification", "value": "H3" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-houmo-m50-product", "title": "M50", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/60/ProductType.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, OSAT, LPDDR supplier, units, customer acceptance and independent workload receipt are undisclosed." ] }, { "source_id": "src-houmo-m50-greatwall-20260531", "title": "长城N90 Pro AI笔记本搭载后摩M50", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/1/47/NewsDetails.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2026-05-31", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Direct buying entity, contract, units, retail shipments, acceptance and field reliability are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-houmo", "record_level": "company", "canonical_legal_name_en": "PostMoore Technology Co., Ltd.", "canonical_legal_name_cn": "后摩智能科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "certified_vendor_reported", "completion_state": "source_backed", "entity_id": "ent-huate-gas", "foreign_dependencies": [ "foreign excimer-laser platform certification/use may remain necessary" ], "foreign_dependency_status": "identified_candidates", "id": "prod-huate-excimer-gases", "last_checked": "2026-07-29", "name": "Excimer-lithography gas mixtures", "product_class": "lithography_gases", "product_id": "prod-huate-excimer-gases", "record_type": "product", "source_ids": [ "src-huate-gas-annual-2025" ], "unknowns": [ "scanner/laser model", "fab", "batch purity", "consumption", "certification date/scope" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "013e026a8bfe7132876c398c6157cd3e32d76863cccf887ee07ec9784912a97e", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "product_class", "value": "lithography_gases" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "product_class", "value": "lithography_gases" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "lithography_gases" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "entity_reference": { "entity_id": "ent-huate-gas", "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "named_project_in_construction_ledger", "completion_state": "relationship_backed", "entity_id": "ent-huate-gas", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-huate-onsite-hydrogen-system", "last_checked": "2026-07-29", "name": "Onsite hydrogen generation and supply system", "product_class": "facility_bulk_gas_system", "product_id": "prod-huate-onsite-hydrogen-system", "record_type": "product", "source_ids": [ "src-huate-gas-annual-2025" ], "unknowns": [ "contracting Huate subsidiary", "site address", "contract value", "delivery", "commissioning", "acceptance", "actual flow", "uptime", "gas purity", "process insertion" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "462545ad3f99e856b830b87f2a78b809dd52bc238b2b1add58bce6d078205ab4", "stage_ids": [ "critical_materials", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "product_class", "value": "facility_bulk_gas_system" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "product_class", "value": "facility_bulk_gas_system" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "facility_bulk_gas_system" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "entity_reference": { "entity_id": "ent-huate-gas", "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "integrated_in_online_cloud_service", "completion_state": "facility_backed", "entity_id": "ent-huawei-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-huawei-ascend-910b2", "last_checked": "2026-07-29", "name": "Ascend 910B2", "product_class": "ai_accelerator", "product_id": "prod-huawei-ascend-910b2", "record_type": "product", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "unknowns": [ "legal designer/manufacturer", "foundry", "memory", "package/OSAT", "quantity", "power", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "47a2c311ad4dea6724a2f8b1fd14c305bdb02dd027ae75da8477450ef4672e42", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] } ], "entity_reference": { "entity_id": "ent-huawei-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "integrated_in_online_cloud_service_family", "completion_state": "relationship_backed", "entity_id": "ent-huawei-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-huawei-atlas-300i-duo", "last_checked": "2026-07-29", "name": "Atlas 300I Duo", "product_class": "ai_accelerator_card", "product_id": "prod-huawei-atlas-300i-duo", "record_type": "product", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "unknowns": [ "legal supplier", "generation scope", "foundry", "memory", "package/OSAT", "quantity", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "50d7230dd8b735d7b57cab8eb366d6c1575688e35e1e3f1562001096c3d3ab08", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_card" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_card" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_accelerator_card" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] } ], "entity_reference": { "entity_id": "ent-huawei-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "integrated_in_online_cloud_service_family", "completion_state": "relationship_backed", "entity_id": "ent-huawei-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-huawei-atlas-300i-pro", "last_checked": "2026-07-29", "name": "Atlas 300I Pro", "product_class": "ai_accelerator_card", "product_id": "prod-huawei-atlas-300i-pro", "record_type": "product", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "unknowns": [ "legal supplier", "foundry", "memory", "package/OSAT", "quantity", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "2ba77847d2d87e0015fc8321429ffe95c754c8e0f58325036eeca878b76e3963", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_card" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_card" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_accelerator_card" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] } ], "entity_reference": { "entity_id": "ent-huawei-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "production_line_use_reported", "completion_state": "relationship_backed", "entity_id": "ent-hwatsing", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-hwatsing-cmp-portfolio", "last_checked": "2026-07-29", "name": "Universal-series CMP equipment portfolio", "product_class": "cmp_equipment", "product_id": "prod-hwatsing-cmp-portfolio", "record_type": "product", "source_ids": [ "src-hwatsing-inquiry-2021" ], "unknowns": [ "exact model by customer", "facility", "qualified layer", "acceptance date", "throughput", "yield effect" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "1dea38119c2c9dc7c571c054ed85152867f2a8cdb870019a327676383d696244", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "product_class", "value": "cmp_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "cmp_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hwatsing-inquiry-2021", "title": "华海清科股份有限公司第二轮审核问询函回复", "publisher": "华海清科股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202102/000752_20210208_7AX3.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-02-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Aggregates models, customers and process capabilities; exact model/facility/layer qualification is not disclosed." ] } ], "entity_reference": { "entity_id": "ent-hwatsing", "record_level": "company", "canonical_legal_name_en": "Hwatsing Technology Co., Ltd.", "canonical_legal_name_cn": "华海清科股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "integrated_in_official_server_product", "completion_state": "source_backed", "entity_id": "ent-hygon-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-hygon-7000-series", "last_checked": "2026-07-29", "name": "Hygon 7000 series", "product_class": "server_cpu_family", "product_id": "prod-hygon-7000-series", "record_type": "product", "source_ids": [ "src-h3c-r4930g3-product" ], "unknowns": [ "legal supplier", "exact CPU SKU/configuration", "foundry", "package", "shipments", "customer" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "ad371f8ab9914142b3afdcc0c063cf500fffcda1e918e3e0e0c2fd31c3b55560", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "server_cpu_family" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "server_cpu_family" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "server_cpu_family" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-h3c-r4930g3-product", "title": "搭载海光二号的双路服务器H3C UniServer R4930 G3", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/Products_And_Solution/Server/H3C/Products/RackServer/Products_Series/Dualway_Server/R4930_G3/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No exact factory/address, processor SKU by configuration, shipment, customer, installed base, capacity or reliability receipt.", "The all-domestic wording lacks a component-level BOM and origin record." ] } ], "entity_reference": { "entity_id": "ent-hygon-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "integrated_in_online_cloud_service", "completion_state": "facility_backed", "entity_id": "ent-hygon-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-hygon-7285", "last_checked": "2026-07-29", "name": "Hygon 7285", "product_class": "server_cpu", "product_id": "prod-hygon-7285", "record_type": "product", "source_ids": [ "src-ctyun-cambricon-cloud-20260703" ], "unknowns": [ "legal supplier", "foundry", "package/OSAT", "quantity", "power", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "ab78c229581fe73598510989c5082cace460c223ea293cb99e0ce78f23c3bb34", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "server_cpu" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "server_cpu" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "server_cpu" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-07-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-hygon-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "H3C supported configuration and compatibility certification", "completion_state": "qualification_backed", "entity_id": "ent-iluvatar", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-iluvatar-bi-v100-alias-unresolved", "last_checked": "2026-07-29", "name": "BI-V100 / 天数V100 (exact alias relationship unresolved)", "product_class": "accelerator_card", "product_id": "prod-iluvatar-bi-v100-alias-unresolved", "record_type": "product", "source_ids": [ "src-iluvatar-compatibility", "src-h3c-iluvatar-r5300g6-202412", "src-h3c-iluvatar-server-202408" ], "unknowns": [ "authoritative alias equivalence", "architecture", "process/foundry", "memory supplier/type", "package/OSAT", "purchase", "quantity", "production customer", "shipment", "installation", "acceptance" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "c4e01c22cc7da8066a7ce1a2cefcb6d553bb0498c62d52612dd2fe270496f4e8", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "accelerator_card" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "accelerator_card" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "accelerator_card" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-iluvatar-compatibility", "title": "生态合作与适配认证", "publisher": "上海天数智芯半导体股份有限公司", "url": "https://www.iluvatar.com/cooperation/direct", "source_type": "official_compatibility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Compatibility does not prove purchase, quantity, shipment, installation or production use." ] }, { "source_id": "src-h3c-iluvatar-r5300g6-202412", "title": "H3C UniServer R5300 G6配置文档", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202412/2328144_30005_0.htm", "source_type": "customer_product_documentation", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page exposes month but no exact publication day.", "The document names 天数V100 rather than BI-V100 and does not prove purchase or deployment." ] }, { "source_id": "src-h3c-iluvatar-server-202408", "title": "H3C服务器配置文档", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202408/2255813_30005_0.htm", "source_type": "customer_product_documentation", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page exposes month but no exact publication day.", "Support documentation does not prove purchase, shipment or production use." ] } ], "entity_reference": { "entity_id": "ent-iluvatar", "record_level": "company", "canonical_legal_name_en": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd.", "canonical_legal_name_cn": "上海天数智芯半导体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "volume_production_stage_vendor_timeline_2021", "completion_state": "volume_backed", "entity_id": "ent-iluvatar", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-iluvatar-tg100", "last_checked": "2026-07-29", "name": "天垓100 / TG100", "product_class": "training_gpu", "product_id": "prod-iluvatar-tg100", "record_type": "product", "source_ids": [ "src-iluvatar-annual-2025", "src-iluvatar-about" ], "unknowns": [ "model units", "foundry", "memory supplier", "package/OSAT", "customer/project", "facility", "yield", "field reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "48798770562cac8b8e32a269fa80786d1f01518ad606c5a02e52c5a4d64aedf5", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "training_gpu" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "training_gpu" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-iluvatar-annual-2025", "title": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd. 2025 Annual Report", "publisher": "香港交易所", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0427/2026042701284.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers/projects, foundry, OSAT, HBM/memory supplier and model-specific units are withheld." ] }, { "source_id": "src-iluvatar-about", "title": "发展历程", "publisher": "上海天数智芯半导体股份有限公司", "url": "https://www.iluvatar.com/about/", "source_type": "company_timeline", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor timeline; model-specific units, foundry, OSAT, memory supplier and named customers are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-iluvatar", "record_level": "company", "canonical_legal_name_en": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd.", "canonical_legal_name_cn": "上海天数智芯半导体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "chip_brought_up_and_card_released_vendor_timeline_2022", "completion_state": "source_backed", "entity_id": "ent-iluvatar", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-iluvatar-zk100", "last_checked": "2026-07-29", "name": "智铠100 / ZK100", "product_class": "inference_gpu", "product_id": "prod-iluvatar-zk100", "record_type": "product", "source_ids": [ "src-iluvatar-annual-2025", "src-iluvatar-about" ], "unknowns": [ "shipment state and units", "foundry", "memory supplier", "package/OSAT", "customer/project", "facility", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "0559974fd7e26ddde1d8a66099615b12491380ead511b5054f1d34c5c89a18ec", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "inference_gpu" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "inference_gpu" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-iluvatar-annual-2025", "title": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd. 2025 Annual Report", "publisher": "香港交易所", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0427/2026042701284.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers/projects, foundry, OSAT, HBM/memory supplier and model-specific units are withheld." ] }, { "source_id": "src-iluvatar-about", "title": "发展历程", "publisher": "上海天数智芯半导体股份有限公司", "url": "https://www.iluvatar.com/about/", "source_type": "company_timeline", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor timeline; model-specific units, foundry, OSAT, memory supplier and named customers are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-iluvatar", "record_level": "company", "canonical_legal_name_en": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd.", "canonical_legal_name_cn": "上海天数智芯半导体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "catalogue", "completion_state": "source_backed", "entity_id": "ent-innosilicon-brand", "foreign_dependencies": [ "HBM JEDEC standard ecosystem" ], "foreign_dependency_status": "identified_candidates", "id": "prod-innosilicon-hbm3e-phy", "last_checked": "2026-07-29", "name": "HBM3E PHY/controller IP", "product_class": "memory_interface_ip", "product_id": "prod-innosilicon-hbm3e-phy", "record_type": "product", "source_ids": [ "src-innosilicon-ip-catalogue" ], "unknowns": [ "legal licensor entity", "licensee", "foundry/process", "tapeout", "qualified production chip" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "d8097f5b94af4df5352550d9311e3708cfc0e19168ef5aff7464b644098b4fec", "stage_ids": [ "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "memory_interface_ip" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "product_class", "value": "memory_interface_ip" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "memory_interface_ip" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-innosilicon-ip-catalogue", "title": "IP Solutions", "publisher": "Innosilicon", "url": "https://www.innosilicon.com/ip-solution", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue compatibility is not a named license, tapeout, qualified production chip, or mainland HBM stack." ] } ], "entity_reference": { "entity_id": "ent-innosilicon-brand", "record_level": "brand", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "board_power": "150 W", "commercial_state": "official_product_page", "completion_state": "source_backed", "entity_id": "ent-kunlun-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-kunlun-k200", "last_checked": "2026-07-29", "memory_bandwidth": "512 GB/s", "memory_capacity": "16 GB", "memory_type": "HBM", "name": "K200", "package": "2.5D", "process": "14 nm (vendor specification; foundry undisclosed)", "product_class": "ai_accelerator_card", "product_id": "prod-kunlun-k200", "record_type": "product", "source_ids": [ "src-kunlun-k200-product" ], "unknowns": [ "foundry", "HBM generation/supplier/stack", "base die/PHY", "interposer/substrate", "package/OSAT", "units", "customer", "yield", "reliability", "independent workload result" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "3161d6e4f7cc37a6c7e086b09392a6474c054fd49e75762b83c3f20c6364f46a", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_card" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_card" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_accelerator_card" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kunlun-k200-product", "title": "K200", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/product/686.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, OSAT/interposer, HBM generation/supplier/stack, yield, units and named customer are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-kunlun-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "昆仑芯（北京）科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "integrated_in_baidu_appliance_and_powered_on_cluster; CMB_award_and_application_test_vendor_reported", "completion_state": "source_backed", "entity_id": "ent-kunlun-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-kunlun-p800", "last_checked": "2026-07-29", "name": "Kunlun P800", "product_class": "ai_accelerator", "product_id": "prod-kunlun-p800", "record_type": "product", "source_ids": [ "src-baidu-baige-deepseek-p800-20250217", "src-baidu-p800-large-cluster-caict-claim-20250723", "src-kunlun-p800-cmb-20250327" ], "unknowns": [ "CMB customer acceptance", "CMB delivery", "CMB installation", "CMB quantity", "CMB tender/contract", "exact installed count", "facility", "field reliability", "foundry", "legal designer/supplier", "memory", "package/OSAT", "utilization", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "544d0a3c68d44761a6634ac3de878bed9df4a4c91ed1c0b1087753abffa84c37", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-baidu-baige-deepseek-p800-20250217", "title": "百度百舸 DeepSeek 一体机发布，支持昆仑芯 P800 单机 8 卡满血版开箱即用", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_e0a478ab-bfa4-425c-b9b5-a6d296f6c698", "source_type": "official_operator_product_release", "primary_status": "primary", "publication_date": "2025-02-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Launch/apply-for-trial and vendor deployment statements; no order, shipment, customer acceptance or independent workload receipt.", "Server OEM, CPU/memory/network BOM, cluster facility, exact card count, uptime and utilization are undisclosed." ] }, { "source_id": "src-baidu-p800-large-cluster-caict-claim-20250723", "title": "首家！AI算力最高评级！", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_377f7acf-07e4-4787-a0f5-d70671dd6f34", "source_type": "official_operator_news", "primary_status": "primary", "publication_date": "2025-07-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "CAICT report/certificate, test version, duration, sample, pass criteria and raw results were not retrieved.", "10,000- and 30,000-card terms are rounded vendor classes, not exact installed/qualified/utilized counts." ] }, { "source_id": "src-kunlun-p800-cmb-20250327", "title": "昆仑芯中标招商银行AI芯片资源项目", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/news/4469.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2025-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-origin award; tender number, contract, quantity, delivery, installation and customer acceptance are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-kunlun-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "昆仑芯（北京）科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "official_product_page", "completion_state": "source_backed", "entity_id": "ent-kunlun-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-kunlun-r200", "last_checked": "2026-07-29", "memory_bandwidth": "512 GB/s", "memory_capacity": "16 GB or 32 GB", "memory_type": "GDDR6", "name": "R200 / R200-8F", "peak_compute": { "FP16": "128 TFLOPS", "INT8": "256 TOPS" }, "process": "7 nm (vendor specification; foundry undisclosed)", "product_class": "ai_accelerator_card", "product_id": "prod-kunlun-r200", "record_type": "product", "source_ids": [ "src-kunlun-r200-product" ], "unknowns": [ "foundry", "GDDR6 supplier", "package/OSAT", "units", "customer", "independent workload result", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "60b3f59eee4af5f68a78b0bd0a71b9f194087146edc4561d229c1d2f5edf5e4f", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_card" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_card" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_accelerator_card" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kunlun-r200-product", "title": "R200", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/product/274.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, GDDR6 supplier, OSAT, units, named customer and workload receipt are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-kunlun-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "昆仑芯（北京）科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "volume_shipments_2021", "completion_state": "volume_backed", "entity_id": "ent-li-auto-inc", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-li-auto-2021-li-one", "last_checked": "2026-07-29", "name": "2021 Li ONE", "product_class": "electric_vehicle", "product_id": "prod-li-auto-2021-li-one", "record_type": "product", "source_ids": [ "src-li-auto-2021q1-results-20210526", "src-li-auto-2021q3-results-20211129", "src-li-auto-dec-deliveries-20220101" ], "unknowns": [ "legal manufacturer/factory", "full semiconductor BOM", "chip procurement quantity", "field failure rate" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "e3fc64af9ad47651131b5e8f400fe6c315b934af237f5d7a034678d61dc69a09", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "electric_vehicle" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "electric_vehicle" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-li-auto-2021q1-results-20210526", "title": "Li Auto Inc. Announces Unaudited First Quarter 2021 Financial Results", "publisher": "Li Auto Inc.", "url": "https://ir.lixiang.com/zh-hans/news-releases/news-release-details/li-auto-inc-announces-unaudited-first-quarter-2021-financial", "source_type": "company_financial_results", "primary_status": "primary", "publication_date": "2021-05-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Horizon's contracting legal entity, chip purchase quantity, supplier contract, manufacturing facility and accepted-system test are undisclosed." ] }, { "source_id": "src-li-auto-2021q3-results-20211129", "title": "Li Auto Inc. Announces Unaudited Third Quarter 2021 Financial Results", "publisher": "Li Auto Inc.", "url": "https://ir.lixiang.com/news-releases/news-release-details/li-auto-inc-announces-unaudited-third-quarter-2021-financial/", "source_type": "company_financial_results", "primary_status": "primary", "publication_date": "2021-11-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vehicle delivery volume does not independently prove a direct Horizon purchase contract or chip procurement quantity." ] }, { "source_id": "src-li-auto-dec-deliveries-20220101", "title": "Li Auto Inc. December 2021 Delivery Update", "publisher": "Li Auto Inc.", "url": "https://ir.lixiang.com/news-releases/news-release-details/li-auto-inc-december-2021-delivery-update", "source_type": "company_delivery_update", "primary_status": "primary", "publication_date": "2022-01-01", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not independently repeat the Journey 3 configuration; the integration join is limited to the explicitly named 2021 Li ONE generation." ] } ], "entity_reference": { "entity_id": "ent-li-auto-inc", "record_level": "company", "canonical_legal_name_en": "Li Auto Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "product_page", "completion_state": "relationship_backed", "entity_id": "ent-memblaze", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-memblaze-pblaze6-6541", "last_checked": "2026-07-29", "name": "PBlaze6 6541", "product_class": "enterprise_nvme_ssd", "product_id": "prod-memblaze-pblaze6-6541", "record_type": "product", "source_ids": [ "src-memblaze-ymtc-pblaze6" ], "unknowns": [ "controller origin", "PMIC origin", "current shipment volume", "customer qualifications" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "3e02530e87b447973892b8fdb326c99142d80d8c624e870212d5644250f6e665", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "product_class", "value": "enterprise_nvme_ssd" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "enterprise_nvme_ssd" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-memblaze-ymtc-pblaze6", "title": "PBlaze6 6541 Enterprise SSD", "publisher": "北京忆恒创源科技股份有限公司", "url": "https://www.memblaze.com/product/pblaze6/639.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Direct product BOM join for NAND only; controller, PMIC, firmware component origins and shipment volume are not fully disclosed." ] } ], "entity_reference": { "entity_id": "ent-memblaze", "record_level": "company", "canonical_legal_name_en": "Memblaze Technology Co., Ltd.", "canonical_legal_name_cn": "北京忆恒创源科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "formal_mass_production_reported_from_2024_02", "completion_state": "volume_backed", "entity_id": "ent-metax", "foreign_dependencies": [ "overseas HBM, EDA and interface-IP categories disclosed; exact allocation unknown" ], "foreign_dependency_status": "identified_candidates", "id": "prod-metax-c500", "last_checked": "2026-07-29", "name": "C500", "product_class": "general_purpose_gpu", "product_id": "prod-metax-c500", "record_type": "product", "source_ids": [ "src-metax-annual-2025" ], "unknowns": [ "foundry", "package/OSAT", "HBM supplier/generation", "units", "customer", "facility", "independent workload", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "347c2bd6ffde8ba363dd8bcbf3c1a733924f83bfdabab63c4108a94d3aacfd7b", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "general_purpose_gpu" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "general_purpose_gpu" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-metax-annual-2025", "title": "沐曦集成电路（上海）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-27/688802_20260327_0HOB.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Fabless contractors are unnamed; 2025 board-sales totals are family-category totals, not model-specific.", "Overseas HBM, EDA and interface-IP suppliers are not named." ] } ], "entity_reference": { "entity_id": "ent-metax", "record_level": "company", "canonical_legal_name_en": "MetaX Integrated Circuits (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "沐曦集成电路（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "formal_mass_production_reported_from_2023_04", "completion_state": "volume_backed", "entity_id": "ent-metax", "foreign_dependencies": [ "overseas supply categories disclosed at company level; model allocation unknown" ], "foreign_dependency_status": "identified_candidates", "id": "prod-metax-n100", "last_checked": "2026-07-29", "name": "N100", "product_class": "ai_inference_gpu", "product_id": "prod-metax-n100", "record_type": "product", "source_ids": [ "src-metax-annual-2025" ], "unknowns": [ "foundry", "package/OSAT", "memory supplier", "units", "customer", "facility", "independent workload", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "2780dd5edfa5f7043cf8798a322fb1ecee197fe3aad7503dc17381d21d1d9b40", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_inference_gpu" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_inference_gpu" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-metax-annual-2025", "title": "沐曦集成电路（上海）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-27/688802_20260327_0HOB.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Fabless contractors are unnamed; 2025 board-sales totals are family-category totals, not model-specific.", "Overseas HBM, EDA and interface-IP suppliers are not named." ] } ], "entity_reference": { "entity_id": "ent-metax", "record_level": "company", "canonical_legal_name_en": "MetaX Integrated Circuits (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "沐曦集成电路（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "architecture_classification": [ "H3" ], "commercial_state": "catalogue", "completion_state": "source_backed", "entity_id": "ent-montage", "foreign_dependencies": [ "CXL/PCIe standards and ecosystem dependencies not origin-audited" ], "foreign_dependency_status": "identified_candidates", "id": "prod-montage-m88mx6852", "last_checked": "2026-07-29", "name": "M88MX6852", "product_class": "cxl_memory_expansion_controller", "product_id": "prod-montage-m88mx6852", "record_type": "product", "source_ids": [ "src-montage-mxc-official" ], "unknowns": [ "named deployment", "memory supplier", "p50/p99 latency", "energy", "contention", "recovery" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "737082bcd4ce4d3aedd999c63aac3f37c373ecc84282a1b5de3e594c92af20c7", "stage_ids": [ "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "cxl_memory_expansion_controller" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "product_class", "value": "cxl_memory_expansion_controller" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "cxl_memory_expansion_controller" }, { "field": "architecture_classification", "value": "H3" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-montage-mxc-official", "title": "MXC Memory Expansion Controller", "publisher": "澜起科技股份有限公司", "url": "https://www.montage-tech.com/index.php/MXC", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Product availability does not prove deployment in a named accelerator, p50/p99 latency, energy, contention, or recovery." ] } ], "entity_reference": { "entity_id": "ent-montage", "record_level": "company", "canonical_legal_name_en": "Montage Technology Co., Ltd.", "canonical_legal_name_cn": "澜起科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "over_2000_cards_deployed_at_named_center_government_reported", "completion_state": "facility_backed", "entity_id": "ent-moore-threads", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "generation": "Pinghu architecture", "id": "prod-moore-threads-s5000", "last_checked": "2026-07-29", "memory_bandwidth": "1.6 TB/s (peak vendor specification)", "memory_capacity": "80 GB (government/vendor lane receipt)", "name": "MTT S5000", "product_class": "ai_accelerator_card", "product_id": "prod-moore-threads-s5000", "record_type": "product", "scale_up_bandwidth": "784 GB/s (vendor specification)", "source_ids": [ "src-moore-threads-annual-2025", "src-moore-threads-s5000-product", "src-huishan-mt-s5000-center-20260724" ], "unknowns": [ "foundry", "memory type and supplier", "package/OSAT", "board maker", "facility buyer/owner/operator", "acceptance", "uptime", "utilization", "workload", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "79f5bd7b69cbc1086c50dd6667eb61259e87c629bf0b90831001c094e9ae29bc", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_card" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_card" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_accelerator_card" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-moore-threads-annual-2025", "title": "摩尔线程智能科技（北京）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-27/688795_20260427_CUNP.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, OSAT, board maker, memory supplier and customer names are undisclosed." ] }, { "source_id": "src-moore-threads-s5000-product", "title": "MTT S5000", "publisher": "摩尔线程", "url": "https://www.mthreads.com/product/S5000", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, memory supplier, OSAT, facility, deployment or independent workload receipt." ] }, { "source_id": "src-huishan-mt-s5000-center-20260724", "title": "无锡（惠山）人工智能算力中心一期点亮", "publisher": "惠山区人民政府办公室", "url": "https://www.huishan.gov.cn/doc/2026/07/24/4809561.shtml", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2026-07-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility legal owner/operator, direct buyer, contract, acceptance certificate, uptime and utilization are undisclosed.", "Powered-on/deployed does not by itself prove sustained production workload or service volume." ] } ], "entity_reference": { "entity_id": "ent-moore-threads", "record_level": "company", "canonical_legal_name_en": "Moore Threads Technology Co., Ltd.", "canonical_legal_name_cn": "摩尔线程智能科技（北京）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "delivery_started_2025-03-29", "completion_state": "source_backed", "entity_id": "ent-nio-inc", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-nio-et9-2025", "last_checked": "2026-07-29", "name": "NIO ET9 (delivery-start configuration)", "product_class": "electric_vehicle", "product_id": "prod-nio-et9-2025", "record_type": "product", "source_ids": [ "src-nio-auto-shanghai-20250423" ], "unknowns": [ "delivered quantity", "legal manufacturer", "factory", "full semiconductor BOM", "field reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "88dbbb8ad78d92a97c943b88105a18a6814e835366fb5ff05b2be3ca2e18d36b", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "electric_vehicle" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "electric_vehicle" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nio-auto-shanghai-20250423", "title": "NIO Showcases Its Three EV Brands at Auto Shanghai 2025", "publisher": "NIO Inc.", "url": "https://www.nio.com/news/20250423001", "source_type": "company_customer_press_release", "primary_status": "primary", "publication_date": "2025-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No delivered ET9 count, manufacturing legal entity/facility, foundry, OSAT, package, yield or field-reliability receipt.", "NIO's mass-production wording is vendor language; the source proves delivery start and two-chip integration only." ] } ], "entity_reference": { "entity_id": "ent-nio-inc", "record_level": "company", "canonical_legal_name_en": "NIO Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "installed_in_delivered_ET9_model", "completion_state": "source_backed", "entity_id": "ent-nio-inc", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-nio-shenji-nx9031", "last_checked": "2026-07-29", "name": "Shenji NX9031", "product_class": "automotive_smart_driving_chip", "product_id": "prod-nio-shenji-nx9031", "record_type": "product", "source_ids": [ "src-nio-auto-shanghai-20250423" ], "unknowns": [ "historical legal designer/assignee", "foundry", "process", "package/OSAT", "yield", "shipment count", "field reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "78fce976b1ccdebcbae02023e573094932dc4d0a38d36538626630d656469fe3", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "automotive_smart_driving_chip" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "automotive_smart_driving_chip" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nio-auto-shanghai-20250423", "title": "NIO Showcases Its Three EV Brands at Auto Shanghai 2025", "publisher": "NIO Inc.", "url": "https://www.nio.com/news/20250423001", "source_type": "company_customer_press_release", "primary_status": "primary", "publication_date": "2025-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No delivered ET9 count, manufacturing legal entity/facility, foundry, OSAT, package, yield or field-reliability receipt.", "NIO's mass-production wording is vendor language; the source proves delivery start and two-chip integration only." ] } ], "entity_reference": { "entity_id": "ent-nio-inc", "record_level": "company", "canonical_legal_name_en": "NIO Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "volume_production", "completion_state": "facility_backed", "entity_id": "ent-nsig", "foreign_dependencies": [ "high-end heavily doped epitaxial and low-oxygen high-resistivity gaps disclosed" ], "foreign_dependency_status": "identified_candidates", "id": "prod-nsig-300mm-wafers", "last_checked": "2026-07-29", "name": "300 mm silicon wafer portfolio", "product_class": "silicon_wafers", "product_id": "prod-nsig-300mm-wafers", "record_type": "product", "source_ids": [ "src-nsig-capacity-2025", "src-nsig-inquiry-2025" ], "unknowns": [ "grade", "resistivity", "oxygen range", "defect limit", "named fab", "product-level capacity", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "cbce00aed60e8795e6727156e5595cebac98bad2824da6c8846fcc7456335a44", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "product_class", "value": "silicon_wafers" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "silicon_wafers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nsig-capacity-2025", "title": "上海硅产业集团股份有限公司2026年度“提质增效重回报”行动方案", "publisher": "上海硅产业集团股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-17/1225114299.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group capacity is not installed-tool count, qualified output, actual output, utilization, yield or fab-specific capacity." ] }, { "source_id": "src-nsig-inquiry-2025", "title": "关于上海硅产业集团股份有限公司发行股份及支付现金购买资产并募集配套资金申请审核问询函的回复", "publisher": "上海证券交易所 / 立信会计师事务所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202509/688126_20250901_U2SY.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-09-01", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Equipment vendors and a domestic polysilicon supplier are anonymized; forecasts are not actual production." ] } ], "entity_reference": { "entity_id": "ent-nsig", "record_level": "company", "canonical_legal_name_en": "National Silicon Industry Group Co., Ltd.", "canonical_legal_name_cn": "上海硅产业集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "production_line_use_reported", "completion_state": "relationship_backed", "entity_id": "ent-piotech", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-piotech-deposition-portfolio", "last_checked": "2026-07-29", "name": "PECVD/ALD/SACVD equipment portfolio", "product_class": "thin_film_deposition_equipment", "product_id": "prod-piotech-deposition-portfolio", "record_type": "product", "source_ids": [ "src-piotech-prospectus-2021" ], "unknowns": [ "exact model by customer", "facility", "qualified layer", "acceptance date", "uptime", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "b8c76d3426d5bdbf69cb18aa57d1b4e473d8caee6e9f39b9c6a3d2a670e3b6ab", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "product_class", "value": "thin_film_deposition_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "thin_film_deposition_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-piotech-prospectus-2021", "title": "拓荆科技股份有限公司招股说明书（注册稿）", "publisher": "拓荆科技股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202111/000996_20211105_MYB4.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-11-05", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group/product-family scope; exact model, facility, process layer, installation, acceptance, uptime and yield are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "vendor_reported_portfolio", "completion_state": "source_backed", "entity_id": "ent-piotech", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-piotech-w2w-hybrid-bonder", "last_checked": "2026-07-29", "name": "W2W hybrid bonding equipment", "product_class": "bonding_equipment", "product_id": "prod-piotech-w2w-hybrid-bonder", "record_type": "product", "source_ids": [ "src-piotech-annual-2025" ], "unknowns": [ "model", "customer", "facility", "bond pitch", "throughput", "yield", "HBM usage" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "60a82bfc7924dcd776a2097998a7a2247d0448aeb32f44290c373262b054d02c", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "product_class", "value": "bonding_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "bonding_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-piotech-annual-2025", "title": "拓荆科技股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688072_20260428_IFOF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio and issuer-reported progress do not establish a named HBM customer or qualified HBM production." ] } ], "entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "customer_adopted_vendor_reported", "completion_state": "relationship_backed", "entity_id": "ent-primarius", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-primarius-nanospice", "last_checked": "2026-07-29", "name": "NanoSpice", "product_class": "parallel_spice_simulator", "product_id": "prod-primarius-nanospice", "record_type": "product", "source_ids": [ "src-primarius-nanospice-skhynix-2022" ], "unknowns": [ "SK hynix fab/process", "chip SKU", "seat count", "volume" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "dd1b55e6ce4d8497ac5d6ae56f73bacd55ed8e8d39920fc3dfdb63822949ccfb", "stage_ids": [ "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "product_class", "value": "parallel_spice_simulator" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "parallel_spice_simulator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-primarius-nanospice-skhynix-2022", "title": "Primarius NanoSpice™ Simulator ... is Adopted by SK hynix", "publisher": "Primarius Technologies Co., Ltd.", "url": "https://www.primarius-tech.com/en/aboutus/news/Primarius-NanoSpice-Simulator-to-Accelerate-the-verification-of-CMOS-Image-Sensor-is-adopted-by-Skhy.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2022-01-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-side adoption claim; no SK hynix-origin receipt, fab, node, chip SKU, seats or volume." ] } ], "entity_reference": { "entity_id": "ent-primarius", "record_level": "company", "canonical_legal_name_en": "Primarius Technologies Co., Ltd.", "canonical_legal_name_cn": "上海概伦电子股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "signed_framework_award", "completion_state": "relationship_backed", "entity_id": "ent-shenzhou-kuntai-xiamen", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-shenzhou-kuntai-ai-server-framework", "last_checked": "2026-07-29", "name": "AI servers and related products (CMCC framework)", "product_class": "ai_server_framework_product_class", "product_id": "prod-shenzhou-kuntai-ai-server-framework", "record_type": "product", "source_ids": [ "src-digital-china-cmcc-framework-20240824" ], "unknowns": [ "server model", "accelerator/CPU/memory/NIC BOM", "actual order", "delivery", "acceptance", "facility" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "1ae324d13bf1932e6ea58c2dd41e4341115aa3cb21767b4d3fc151561edd320a", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_server_framework_product_class" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_server_framework_product_class" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-digital-china-cmcc-framework-20240824", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2024-08/24/content_1957609.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2024-08-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "842 is a framework award ceiling, not an actual order, shipment, installation or acceptance count.", "Server model, accelerator/CPU/memory/NIC BOM, facility, value, serial and asset receipt are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-shenzhou-kuntai-xiamen", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "神州鲲泰（厦门）信息技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "issuer_reported_batch_production", "completion_state": "relationship_backed", "entity_id": "ent-jiangsu-shenzhou", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-shenzhou-rps", "last_checked": "2026-07-29", "name": "Remote plasma source (RPS) products", "product_class": "remote_plasma_source", "product_id": "prod-shenzhou-rps", "record_type": "product", "source_ids": [ "src-jiangsu-shenzhou-prospectus-2026" ], "unknowns": [ "model-to-tool mapping", "fab", "acceptance date", "qualified layer", "uptime" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "9dc573d29c7684d988902adc13b8b7119c99e1f28d76a1a4eca61b2f3a944980", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "product_class", "value": "remote_plasma_source" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "remote_plasma_source" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jiangsu-shenzhou-prospectus-2026", "title": "江苏神州半导体科技股份有限公司招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202606/002191_20260630_F1GO.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-06-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer filing reproduces customer endorsements; facility, serial number, fab acceptance and qualified layer are not public." ] } ], "entity_reference": { "entity_id": "ent-jiangsu-shenzhou", "record_level": "company", "canonical_legal_name_en": "Jiangsu Shenzhou Semiconductor Technology Co., Ltd.", "canonical_legal_name_cn": "江苏神州半导体科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "catalogue", "completion_state": "source_backed", "entity_id": "ent-smee", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-smee-ssa600", "last_checked": "2026-07-29", "name": "SSA600/SSX600 series", "product_class": "step_and_scan_lithography", "product_id": "prod-smee-ssa600", "record_type": "product", "source_ids": [ "src-smee-ssa600-official" ], "unknowns": [ "wavelength by model", "NA by model", "throughput", "availability", "MTBF", "MTTR", "customer", "installation", "acceptance", "qualified layer" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "a50eb986db7298ca27e284845d1e8badab5cdde542864b64ac8c9be99dbee986", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "product_class", "value": "step_and_scan_lithography" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "step_and_scan_lithography" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-smee-ssa600-official", "title": "600 Series Step-and-Scan Lithography System", "publisher": "上海微电子装备（集团）股份有限公司", "url": "https://www.smee.com.cn/eis.pub?method=indexinfo&onclicknodeno=1_4_1_1&service=homepageService", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue capability only; no named facility, serial number, installation, site acceptance, qualified layer, uptime, or yield." ] } ], "entity_reference": { "entity_id": "ent-smee", "record_level": "company", "canonical_legal_name_en": "Shanghai Micro Electronics Equipment (Group) Co., Ltd.", "canonical_legal_name_cn": "上海微电子装备（集团）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "procurement_award_contract_pending; no public manufacture/delivery/install/SAT receipt found", "completion_state": "relationship_backed", "entity_id": "ent-smee", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-smee-ssc800-10", "intended_use": "high-density and ten-thousand-channel neural-electrode fabrication for brain-machine-interface research", "last_checked": "2026-07-29", "name": "SSC800/10", "procurement_asserted_overlay": { "acceptance_state": "not_measured_or_accepted", "unit": "nm", "value": "<=15" }, "procurement_asserted_resolution": { "acceptance_state": "not_measured_or_accepted", "unit": "nm", "value": "<=110" }, "product_class": "step_and_scan_lithography_machine", "product_id": "prod-smee-ssc800-10", "record_type": "product", "source_ids": [ "src-ccgp-smee-ssc800-award-2025", "src-ssc800-ccgp-expert-opinion-20251106", "src-ssc800-ccgp-award-letter-20251224", "src-smee-lithography-product-index-20260729" ], "unknowns": [ "wavelength", "numerical aperture", "resolution", "overlay", "throughput", "buyer legal identity", "signed contract", "manufacturing completion", "serial", "shipment", "delivery/receiving", "move-in", "installation", "site acceptance", "asset registration", "qualified layer", "component BOM", "uptime", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "1021c551136839a7d56484780325731b265c3e98ec8d902e41d7c9e06d564e77", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "product_class", "value": "step_and_scan_lithography_machine" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "step_and_scan_lithography_machine" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ccgp-smee-ssc800-award-2025", "title": "zycgr22011903单一来源采购步进扫描式光刻机成交公告", "publisher": "中国政府采购网 / 财政部", "url": "https://www.ccgp.gov.cn/cggg/zygg/cjgg/202512/t20251225_25989183.htm", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2025-12-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Buyer legal identity remains unresolved; official address/contact correlation to 临港实验室 is strong but not a same-document legal-identity receipt.", "Award/vendor selection is not a signed contract, manufacturing completion, shipment, delivery, move-in, installation, site acceptance, asset registration or process qualification.", "Wavelength, NA, resolution, overlay, throughput, facility, layer, yield and production use are undisclosed." ] }, { "source_id": "src-ssc800-ccgp-expert-opinion-20251106", "title": "附件3-专家论证意见", "publisher": "科学技术部 / 中国政府采购网", "url": "https://download.ccgp.gov.cn/oss/download?uuid=ECF994F0FBE86A6F1C7EB79270DA03", "source_type": "single_source_expert_opinion", "primary_status": "primary", "publication_date": "2025-11-07", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The performance statements are procurement-justification assertions, not FAT, SAT or independent metrology.", "The attachment names no model, wavelength, NA, serial, facility, delivery date, qualified layer, throughput, uptime, defectivity or yield." ] }, { "source_id": "src-ssc800-ccgp-award-letter-20251224", "title": "zycgr22011903单一来源采购步进扫描式光刻成交通知书", "publisher": "zycgr22011903 / 中国政府采购网", "url": "https://download.ccgp.gov.cn/oss/download?uuid=29ED2DAF253269EC63A6675AED0E4F", "source_type": "procurement_award_letter", "primary_status": "primary", "publication_date": "2025-12-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The award letter does not prove that the contract was later executed or performed." ] }, { "source_id": "src-smee-lithography-product-index-20260729", "title": "光刻设备", "publisher": "上海微电子装备（集团）股份有限公司", "url": "https://www.smee.com.cn/eis.pub?method=indexinfo&onclicknodeno=1_4_1&service=homepageService", "source_type": "official_product_index", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "SSC800/10 was absent from the reviewed index.", "Page absence does not prove that SSC800/10 does not exist, was not manufactured or is not offered under controlled disclosure." ] } ], "entity_reference": { "entity_id": "ent-smee", "record_level": "company", "canonical_legal_name_en": "Shanghai Micro Electronics Equipment (Group) Co., Ltd.", "canonical_legal_name_cn": "上海微电子装备（集团）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "official_product_page", "completion_state": "source_backed", "entity_id": "ent-sophgo-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-sophgo-bm1684x", "last_checked": "2026-07-29", "memory_capacity": "6/12/16 GB", "memory_type": "LPDDR4/LPDDR4X", "name": "BM1684X mainboard", "peak_compute": { "BF16_FP16": "16 TFLOPS", "FP32": "2 TFLOPS", "INT8": "32 TOPS" }, "product_class": "ai_accelerator_mainboard", "product_id": "prod-sophgo-bm1684x", "record_type": "product", "source_ids": [ "src-sophgo-bm1684x-product" ], "unknowns": [ "exact legal product owner", "foundry", "LPDDR supplier", "package/OSAT", "units", "customer", "independent workload", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "ab5b32de9475f8e056f419673cf3526828d6338fc6291382c9734c13d112eef5", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_mainboard" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "ai_accelerator_mainboard" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "ai_accelerator_mainboard" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-sophgo-bm1684x-product", "title": "BM1684X Mainboard", "publisher": "SOPHGO", "url": "https://en.sophgo.com/ecology/detail.html?id=41", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact legal product owner, foundry, OSAT, LPDDR supplier, units and named customer are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-sophgo-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "procurement_awarded", "completion_state": "relationship_backed", "entity_id": "ent-util-kyky", "exact_model": "custom; brand listed as KYKY et al.", "foreign_dependencies": [ "unknown" ], "foreign_dependency_status": "identified_candidates", "id": "prod-util-kyky-vacuum-test", "last_checked": "2026-07-29", "name": "Ultraclean semiconductor vacuum test system", "process_step": "semiconductor-related vacuum testing", "product_class": "vacuum_test_system", "product_id": "prod-util-kyky-vacuum-test", "readiness_state": "unknown", "record_type": "product", "source_ids": [ "src-util-005" ], "unknowns": [ "serial number", "delivery site", "delivery", "installation", "acceptance", "production-fab use", "component BOM and origins" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "0538411185bbdbf913be620eadce6418b5f4a69561ecdaa0a3bfb3aeaa14512d", "stage_ids": [ "wafer_equipment", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "product_class", "value": "vacuum_test_system" }, { "field": "process_step", "value": "semiconductor-related vacuum testing" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "product_class", "value": "vacuum_test_system" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "vacuum_test_system" }, { "field": "process_step", "value": "semiconductor-related vacuum testing" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-005", "title": "中国科学院高能物理研究所超净半导体真空测试系统采购项目中标公告", "publisher": "中国政府采购网 / 中华人民共和国财政部国库司", "url": "https://www.ccgp.gov.cn/cggg/zygg/zbgg/202605/t20260507_26518210.htm", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2026-05-07", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The award proves vendor, purchaser, system, model class, quantity and price. It does not prove delivery, installation, acceptance, semiconductor-fab production use or component origin." ] } ], "entity_reference": { "entity_id": "ent-util-kyky", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京中科科仪股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_exact_model_field_present", "basis": "canonical exact_model field", "value": "custom; brand listed as KYKY et al.", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "production_shipments_claimed_for_anonymous_customers", "completion_state": "relationship_backed", "entity_id": "ent-verisilicon", "foreign_dependencies": [ "GlobalFoundries 22FDX process and PDK" ], "foreign_dependency_status": "identified_candidates", "id": "prod-verisilicon-fdsoi-wireless-ip", "last_checked": "2026-07-29", "name": "FD-SOI wireless IP platform", "product_class": "wireless_connectivity_ip", "product_id": "prod-verisilicon-fdsoi-wireless-ip", "record_type": "product", "source_ids": [ "src-verisilicon-gf-22fdx-2025" ], "unknowns": [ "customer", "chip SKU", "fab facility", "shipment split" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "9c651171f8e7e961e9d38c64dcfd0de0584251bba56b03e952799dee8c874ef7", "stage_ids": [ "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "product_class", "value": "wireless_connectivity_ip" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "wireless_connectivity_ip" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-verisilicon-gf-22fdx-2025", "title": "VeriSilicon Introduces FD-SOI Wireless IP Platform", "publisher": "VeriSilicon Microelectronics (Shanghai) Co., Ltd.", "url": "https://www.verisilicon.com/en/PressRelease/WirelessIP", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2025-09-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers and chips are anonymous; facility and shipment split are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-verisilicon", "record_level": "company", "canonical_legal_name_en": "VeriSilicon Microelectronics (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "芯原微电子（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "architecture_classification": [ "H4" ], "commercial_state": "kk_level_shipments_vendor_reported", "completion_state": "volume_backed", "die_size": "2.6 mm × 3.2 mm", "entity_id": "ent-witmem", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-witmem-wtm2101", "last_checked": "2026-07-29", "name": "WTM2101", "parameter_capacity": "1.8M", "peak_compute": ">50 GOPS", "product_class": "edge_compute_in_memory_chip", "product_id": "prod-witmem-wtm2101", "record_type": "product", "source_ids": [ "src-witmem-wtm2101-product" ], "unknowns": [ "audited units and period", "foundry", "package/OSAT", "customers", "yield", "field reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "814389e4615d44aa0781e723ed3a8e447c9197da2348059a70c5e56a6dfd7ab5", "stage_ids": [ "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "edge_compute_in_memory_chip" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "product_class", "value": "edge_compute_in_memory_chip" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "edge_compute_in_memory_chip" }, { "field": "architecture_classification", "value": "H4" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-witmem-wtm2101-product", "title": "WTM2101", "publisher": "杭州知存算力科技有限公司", "url": "https://www.witmem.com/WTM2101.php", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Audited units, foundry, OSAT, legal customer, yield and field reliability are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-witmem", "record_level": "company", "canonical_legal_name_en": "Hangzhou Zhicun (Witmem) Technology Co., Ltd.", "canonical_legal_name_cn": "杭州知存算力科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "architecture_classification": [ "H4" ], "bonding": "3D heterogeneous bonding vendor reported", "commercial_state": "trial_production_reported_but_product_page_coming_soon", "completion_state": "source_backed", "entity_id": "ent-witmem", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-witmem-wtm8", "last_checked": "2026-07-29", "name": "WTM-8", "peak_compute": ">24 TOPS reported", "power": "<3 W reported", "product_class": "compute_in_memory_accelerator", "product_id": "prod-witmem-wtm8", "record_type": "product", "source_ids": [ "src-witmem-wtm8-about", "src-witmem-wtm8-product" ], "unknowns": [ "commercial release", "foundry", "bonding facility/tool/flow/pitch/yield", "die suppliers", "package/OSAT", "customers", "shipments", "reliability" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "895eea9976a14df1be9e5fe8bbdf45dde1cf69bdbb589f243f2174c4a1480034", "stage_ids": [ "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "compute_in_memory_accelerator" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "product_class", "value": "compute_in_memory_accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "compute_in_memory_accelerator" }, { "field": "architecture_classification", "value": "H4" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-witmem-wtm8-about", "title": "关于知存", "publisher": "杭州知存算力科技有限公司", "url": "https://www.witmem.com/about.php", "source_type": "company_timeline", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Trial production is not commercial release, customer qualification or volume shipment." ] }, { "source_id": "src-witmem-wtm8-product", "title": "WTM-8", "publisher": "杭州知存算力科技有限公司", "url": "https://www.witmem.com/WTM-8.php", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, bonding facility/tool/pitch/yield, OSAT, die suppliers, customer and shipment are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-witmem", "record_level": "company", "canonical_legal_name_en": "Hangzhou Zhicun (Witmem) Technology Co., Ltd.", "canonical_legal_name_cn": "杭州知存算力科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "vendor_reported_product", "completion_state": "source_backed", "entity_id": "ent-xmc", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-xmc-spi-nor", "last_checked": "2026-07-29", "name": "SPI NOR Flash portfolio", "product_class": "specialty_memory", "product_id": "prod-xmc-spi-nor", "record_type": "product", "source_ids": [ "src-xmc-spi-nor" ], "unknowns": [ "SKU-level current volume", "yield", "tool/material BOM", "customer mapping" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "5570c58587e4c143e385e0a7d8a6517006bfef7fe7c27004a9176cacd979fdcd", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "product_class", "value": "specialty_memory" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "specialty_memory" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-xmc-spi-nor", "title": "SPI NOR Flash", "publisher": "武汉新芯集成电路股份有限公司", "url": "https://www.xmcwh.com/site/SPI-NOR-Flash", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Product status labels are issuer statements; no customer shipment volume or independent qualification receipt." ] } ], "entity_reference": { "entity_id": "ent-xmc", "record_level": "company", "canonical_legal_name_en": "Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.", "canonical_legal_name_cn": "武汉新芯集成电路股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "configured_in_commercial_cloud_catalogue", "completion_state": "source_backed", "entity_id": "ent-alibaba-yitian-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-yitian-710", "last_checked": "2026-07-29", "name": "Yitian 710", "product_class": "arm_server_cpu", "product_id": "prod-yitian-710", "record_type": "product", "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ], "unknowns": [ "legal designer/operator", "foundry", "package/OSAT", "installed count", "facility", "utilization", "yield" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "5a05e69309b7bc94f3d38a0d37e61770ab79d16737e7150acd747764e4e3c6ab", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "product_class", "value": "arm_server_cpu" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "arm_server_cpu" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "arm_server_cpu" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-alibaba-ecs-yitian-instance-families-20260625", "title": "Elastic Compute Service: Available instance families", "publisher": "Alibaba Cloud Documentation Center", "url": "https://www.alibabacloud.com/help/en/ecs/user-guide/overview-of-instance-families", "source_type": "official_cloud_product_documentation", "primary_status": "primary", "publication_date": "2026-06-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves a current commercial catalogue configuration, not region-specific operator, physical facility, installed count or utilization.", "Server manufacturer, board BOM, foundry, package/OSAT, capacity, tenant, uptime and workload receipts are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-alibaba-yitian-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "signed_framework_award", "completion_state": "relationship_backed", "entity_id": "ent-beijing-digital-china-yunke", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-yunke-telecom-server-framework-combined", "last_checked": "2026-07-29", "name": "ARM-A G-series and GPU G-series server framework", "product_class": "telecom_server_framework_product_classes", "product_id": "prod-yunke-telecom-server-framework-combined", "record_type": "product", "source_ids": [ "src-digital-china-chinatelecom-framework-20250423" ], "unknowns": [ "server models", "CPU/accelerator vendors and parts", "quantity", "orders", "delivery", "test acceptance", "facilities" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "1083797fccd2903ed12ebde548137cc22e8b15ab2ea7b005e8c6a7a8824954d0", "stage_ids": [ "board_system", "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "product_class", "value": "telecom_server_framework_product_classes" } ] }, { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "product_class", "value": "telecom_server_framework_product_classes" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "telecom_server_framework_product_classes" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-digital-china-chinatelecom-framework-20250423", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2025-04/23/content_2053613.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Framework award value is not ordered, delivered or accepted value.", "Server models, CPU/accelerator vendor and part numbers, memory/NIC BOM, quantity, receiving affiliate/facility and test receipt are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-beijing-digital-china-yunke", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京神州数码云科信息技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "awarded_formal_contract_pending", "completion_state": "relationship_backed", "entity_id": "ent-util-lk-suzhou", "exact_model": null, "foreign_dependencies": [ "unknown" ], "foreign_dependency_status": "identified_candidates", "id": "svc-util-cxmt-cleanroom", "last_checked": "2026-07-29", "name": "12-inch memory-wafer manufacturing base Phase II cleanroom-system package", "process_step": "fab cleanroom construction and integration", "product_class": "cleanroom_system_package", "product_id": "svc-util-cxmt-cleanroom", "readiness_state": "unknown", "record_type": "product", "source_ids": [ "src-util-001" ], "unknowns": [ "formal contract signature", "final scope and settlement", "installation", "site acceptance", "production qualification", "component BOM and origins" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "ad0dc82d9e375b4b9d6d88b8a6aa9cb30b8c2c9b0dc106f632858ae1bea3213c", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "product_class", "value": "cleanroom_system_package" }, { "field": "process_step", "value": "fab cleanroom construction and integration" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "cleanroom_system_package" }, { "field": "process_step", "value": "fab cleanroom construction and integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-001", "title": "亚翔系统集成科技（苏州）股份有限公司关于公司重大项目中标的公告", "publisher": "亚翔系统集成科技（苏州）股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2024-02/06/content_1875556.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2024-02-06", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The issuer expressly says a formal project contract still had to be signed and construction, settlement and payment details remained subject to that contract." ] } ], "entity_reference": { "entity_id": "ent-util-lk-suzhou", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "亚翔系统集成科技（苏州）股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "contract_signed_subject_to_effectiveness_conditions", "completion_state": "relationship_backed", "entity_id": "ent-util-shanghai-fourth", "exact_model": null, "foreign_dependencies": [ "unknown" ], "foreign_dependency_status": "identified_candidates", "id": "svc-util-huahong-civil", "last_checked": "2026-07-29", "name": "Hua Hong Wuxi civil works including outdoor works", "process_step": "fab civil construction", "product_class": "semiconductor_fab_civil_construction", "product_id": "svc-util-huahong-civil", "readiness_state": "unknown", "record_type": "product", "source_ids": [ "src-util-002" ], "unknowns": [ "effectiveness-condition completion", "actual construction start and completion", "site acceptance", "final settlement" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "a0735a8a5f34bccd00956cbab131b8723319502526d337e150472f7c408cca61", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "product_class", "value": "semiconductor_fab_civil_construction" }, { "field": "process_step", "value": "fab civil construction" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "semiconductor_fab_civil_construction" }, { "field": "process_step", "value": "fab civil construction" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-002", "title": "无锡市太极实业股份有限公司关于子公司十一科技中标重大项目工程的进展公告", "publisher": "无锡市太极实业股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2023-06/03/content_1776018.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2023-06-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Formal signature is proven, but effectiveness was conditional on specified internal, shareholder and government approvals. Completion, site acceptance, production qualification, uptime and output are not proven." ] } ], "entity_reference": { "entity_id": "ent-util-shanghai-fourth", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海建工四建集团有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "contract_signed_subject_to_effectiveness_conditions", "completion_state": "relationship_backed", "entity_id": "ent-util-11th-tech", "exact_model": null, "foreign_dependencies": [ "unspecified appropriate introduction mentioned at project-platform level" ], "foreign_dependency_status": "identified_candidates", "id": "svc-util-huahong-epc", "last_checked": "2026-07-29", "name": "Hua Hong Wuxi EPC management, design, cleanroom, MEP and process-service systems", "process_step": "fab construction, utilities and cleanroom", "product_class": "semiconductor_fab_epc", "product_id": "svc-util-huahong-epc", "readiness_state": "unknown", "record_type": "product", "source_ids": [ "src-util-002" ], "unknowns": [ "effectiveness-condition completion", "actual construction start and completion", "installed system schedule", "site acceptance", "production qualification", "component BOM and origins" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "6b369b098689ba9bb357540cd56efc00674002c21d23d17d3c2e61d2f1bf2279", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "product_class", "value": "semiconductor_fab_epc" }, { "field": "process_step", "value": "fab construction, utilities and cleanroom" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "semiconductor_fab_epc" }, { "field": "process_step", "value": "fab construction, utilities and cleanroom" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-002", "title": "无锡市太极实业股份有限公司关于子公司十一科技中标重大项目工程的进展公告", "publisher": "无锡市太极实业股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2023-06/03/content_1776018.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2023-06-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Formal signature is proven, but effectiveness was conditional on specified internal, shareholder and government approvals. Completion, site acceptance, production qualification, uptime and output are not proven." ] } ], "entity_reference": { "entity_id": "ent-util-11th-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "信息产业电子第十一设计研究院科技工程股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "awarded_contract_status_unknown", "completion_state": "relationship_backed", "entity_id": "ent-util-shengjian", "exact_model": null, "foreign_dependencies": [ "unknown" ], "foreign_dependency_status": "identified_candidates", "id": "svc-util-silan-exhaust", "last_checked": "2026-07-29", "name": "Phase I acid/alkali exhaust and PGEX system", "process_step": "acid/alkali and process-gas exhaust", "product_class": "fab_exhaust_and_abatement", "product_id": "svc-util-silan-exhaust", "readiness_state": "unknown", "record_type": "product", "source_ids": [ "src-util-003" ], "unknowns": [ "customer-side award confirmation", "award amount", "formal contract", "installation", "acceptance", "commissioning", "component BOM and origins" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "948e8c1e94d15ea7416eb61e28027e95714b3d7f667e1f091233356166837614", "stage_ids": [ "critical_materials", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "acid/alkali and process-gas exhaust" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "product_class", "value": "fab_exhaust_and_abatement" }, { "field": "process_step", "value": "acid/alkali and process-gas exhaust" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "fab_exhaust_and_abatement" }, { "field": "process_step", "value": "acid/alkali and process-gas exhaust" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-003", "title": "喜讯 | 盛剑科技中标厦门士兰集宏半导体有限公司项目", "publisher": "上海盛剑科技股份有限公司", "url": "https://www.sheng-jian.com/news_details/386.html", "source_type": "official_supplier_project_notice", "primary_status": "primary", "publication_date": "2025-01-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No award amount, signed contract, installation, acceptance or commissioning receipt is published. The 720,000 wafers/year figure is a two-phase eventual design target and not Phase I installed capacity or output." ] } ], "entity_reference": { "entity_id": "ent-util-shengjian", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海盛剑科技股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "commercial_state": "awarded_contract_status_unknown", "completion_state": "relationship_backed", "entity_id": "ent-util-huakang", "exact_model": null, "foreign_dependencies": [ "unknown" ], "foreign_dependency_status": "identified_candidates", "id": "svc-util-yuerun-cleanroom", "last_checked": "2026-07-29", "name": "A1 cleanroom fit-out and utility installation EPC", "process_step": "advanced-packaging cleanroom and facility systems", "product_class": "advanced_packaging_cleanroom_and_utilities_epc", "product_id": "svc-util-yuerun-cleanroom", "readiness_state": "unknown", "record_type": "product", "source_ids": [ "src-util-004" ], "unknowns": [ "customer-side award confirmation", "unrounded award value", "formal contract", "as-built installation", "site acceptance", "production qualification", "component BOM and origins" ], "canonical_dataset": "products.yaml", "canonical_record_sha256": "1b01ea169ef182d15437fdc8b897b31892cd7ec5d591b1fe3263bd9a27d3edad", "stage_ids": [ "package_provider", "board_system", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "product_class", "value": "advanced_packaging_cleanroom_and_utilities_epc" }, { "field": "process_step", "value": "advanced-packaging cleanroom and facility systems" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "advanced-packaging cleanroom and facility systems" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "product_class", "value": "advanced_packaging_cleanroom_and_utilities_epc" }, { "field": "process_step", "value": "advanced-packaging cleanroom and facility systems" } ] } ], "canonical_classification_inputs": [ { "field": "product_class", "value": "advanced_packaging_cleanroom_and_utilities_epc" }, { "field": "process_step", "value": "advanced-packaging cleanroom and facility systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-004", "title": "华康洁净中标越润高端封测基地项目 强链国产半导体", "publisher": "武汉华康世纪洁净科技股份有限公司", "url": "https://www.whhksj.com/details/217.html", "source_type": "official_supplier_project_notice", "primary_status": "primary", "publication_date": "2026-05-11", "date_checked": "2026-07-29", "access_state": "indexed_direct_open_error", "limitations": [ "Supplier-authored award notice. No counterparty confirmation, signed contract, installation, acceptance, production qualification or output receipt was located." ] } ], "entity_reference": { "entity_id": "ent-util-huakang", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "武汉华康世纪洁净科技股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_scope_not_recorded", "basis": "canonical exact_model field is absent or null", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } } ], "equipment": [ { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-acm-shanghai", "equipment_id": "eq-acm-clean-portfolio", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-acm-clean-portfolio", "last_checked": "2026-07-29", "model": "cleaning portfolio; exact model unresolved", "process_step": "wafer cleaning", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-acm-annual-2025" ], "target_device": "integrated circuits", "target_material": "wafers", "throughput": null, "unknowns": [ "model", "customer", "facility", "layer", "defectivity", "component origin" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "ecacc85861580c81912e59f617e4606ec0aa5557a8a4003d8f14b4719f969ed8", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "wafer cleaning" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "wafer cleaning" }, { "field": "target_device", "value": "integrated circuits" }, { "field": "target_material", "value": "wafers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-acm-annual-2025", "title": "盛美半导体设备（上海）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-02-27/688082_20260227_7FPP.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-02-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio statement does not prove a named-fab installation or qualified layer." ] } ], "entity_reference": { "entity_id": "ent-acm-shanghai", "record_level": "company", "canonical_legal_name_en": "ACM Research (Shanghai), Inc.", "canonical_legal_name_cn": "盛美半导体设备（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "portfolio_exact_model_unresolved", "basis": "canonical model text explicitly says portfolio", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "volume_backed", "customer": "anonymous mainland logic and memory fabs", "defectivity": { "source_scope": "vendor-reported_average", "unit": "particles_at_26nm", "value": "<6" }, "entity_id": "ent-acm-shanghai", "equipment_id": "eq-acm-ultra-c-tahoe", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-acm-ultra-c-tahoe", "last_checked": "2026-07-29", "model": "Ultra C Tahoe", "process_step": "hybrid batch and single-wafer cleaning", "qualified_layer": "more than 30 production layers in aggregate; customer/layer mapping undisclosed", "readiness_state": "volume_production", "record_type": "equipment", "source_ids": [ "src-acm-ultra-c-tahoe-2024" ], "target_device": "300 mm logic and memory wafers", "target_material": "post-process wafer surfaces", "throughput": { "source_scope": "vendor-reported", "unit": "wafers_per_hour", "value": ">200" }, "unknowns": [ "named legal customer", "facility", "layer mapping", "installation/acceptance dates", "uptime", "yield effect", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "227c9a038d2fe4a8c857df3d4e8cecfadfdde49bb30ce8100c9920a9bfae6828", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "hybrid batch and single-wafer cleaning" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "hybrid batch and single-wafer cleaning" }, { "field": "target_device", "value": "300 mm logic and memory wafers" }, { "field": "target_material", "value": "post-process wafer surfaces" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-acm-ultra-c-tahoe-2024", "title": "盛美上海Ultra C Tahoe清洗设备性能重大突破", "publisher": "盛美半导体设备（上海）股份有限公司", "url": "https://www.acmrcsh.com.cn/forefront-det/786.html", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2024-11-11", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers and facilities are anonymous; performance and production state are vendor-reported, with no independent acceptance or yield receipt." ] } ], "entity_reference": { "entity_id": "ent-acm-shanghai", "record_level": "company", "canonical_legal_name_en": "ACM Research (Shanghai), Inc.", "canonical_legal_name_cn": "盛美半导体设备（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_model_named_scope_not_explicit", "basis": "model is named, but canonical model_scope is not recorded", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-amec", "equipment_id": "eq-amec-etch-portfolio", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-amec-etch-portfolio", "last_checked": "2026-07-29", "model": "etch portfolio; exact model unresolved", "process_step": "plasma etch", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-amec-halfyear-2025" ], "target_device": "logic, memory and specialty devices", "target_material": "multiple films", "throughput": null, "unknowns": [ "model-facility-layer joins", "throughput", "uptime", "yield effect", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "70fe1453e7b7fc867c9d847c17f5935101acd3de11be2f9328e84640a210f096", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "plasma etch" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "plasma etch" }, { "field": "target_device", "value": "logic, memory and specialty devices" }, { "field": "target_material", "value": "multiple films" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-amec-halfyear-2025", "title": "中微半导体设备（上海）股份有限公司2025年半年度报告", "publisher": "上海证券交易所", "url": "https://star.sse.com.cn/disclosure/listedinfo/announcement/c/new/2025-08-29/688012_20250829_BW75.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-08-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer portfolio and revenue recognition do not name the facility, qualified layer, throughput, uptime, or yield." ] } ], "entity_reference": { "entity_id": "ent-amec", "record_level": "company", "canonical_legal_name_en": "Advanced Micro-Fabrication Equipment Inc. China", "canonical_legal_name_cn": "中微半导体设备（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "portfolio_exact_model_unresolved", "basis": "canonical model text explicitly says portfolio", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-hwatsing", "equipment_id": "eq-hwatsing-cmp-portfolio", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-hwatsing-cmp-portfolio", "last_checked": "2026-07-29", "model": "CMP portfolio; exact model unresolved", "process_step": "chemical mechanical planarization", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-hwatsing-annual-2025" ], "target_device": "integrated circuits", "target_material": "wafer films", "throughput": null, "unknowns": [ "model", "layer", "facility", "slurry/pad pair", "throughput", "yield effect" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "aaf178721e3b09b5d5b9f4cea965e4606d62ead8592624a931d242c499941057", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "chemical mechanical planarization" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "chemical mechanical planarization" }, { "field": "target_device", "value": "integrated circuits" }, { "field": "target_material", "value": "wafer films" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hwatsing-annual-2025", "title": "华海清科股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-23/688120_20260423_K9XR.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No public facility/model/layer/yield attribution is inferred from portfolio disclosure." ] } ], "entity_reference": { "entity_id": "ent-hwatsing", "record_level": "company", "canonical_legal_name_en": "Hwatsing Technology Co., Ltd.", "canonical_legal_name_cn": "华海清科股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "portfolio_exact_model_unresolved", "basis": "canonical model text explicitly says portfolio", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-kingsemi", "equipment_id": "eq-kingsemi-ks-ft200-300", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-kingsemi-ks-ft200-300", "last_checked": "2026-07-29", "model": "KS-FT200/300", "process_step": "front-end photoresist coat and develop", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-kingsemi-ks-ft200-300" ], "target_device": "8-inch and 12-inch integrated-circuit wafers", "target_material": "ArF, KrF and i-line resist; PI, BARC, SOC, SOD and SOG", "throughput": null, "unknowns": [ "customer", "facility", "order", "shipment", "installation", "site acceptance", "qualified layer", "uptime", "yield" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "774372fa9f33df185a6f1e3681a6b27831f2f5c9ba51ff51648bb5acc77407e9", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "process_step", "value": "front-end photoresist coat and develop" }, { "field": "target_material", "value": "ArF, KrF and i-line resist; PI, BARC, SOC, SOD and SOG" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "front-end photoresist coat and develop" }, { "field": "target_device", "value": "8-inch and 12-inch integrated-circuit wafers" }, { "field": "target_material", "value": "ArF, KrF and i-line resist; PI, BARC, SOC, SOD and SOG" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kingsemi-ks-ft200-300", "title": "KS-FT200/300 前道8/12寸涂胶显影机", "publisher": "沈阳芯源微电子设备股份有限公司", "url": "https://www.kingsemi.com/index.php/Product/detail?id=221", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue capability only; it must not be joined to the unnamed model delivered to Silan Jike." ] } ], "entity_reference": { "entity_id": "ent-kingsemi", "record_level": "company", "canonical_legal_name_en": "Kingsemi Co., Ltd.", "canonical_legal_name_cn": "沈阳芯源微电子设备股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_model_named_scope_not_explicit", "basis": "model is named, but canonical model_scope is not recorded", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "relationship_backed", "customer": "ent-silan-jike", "defectivity": null, "entity_id": "ent-kingsemi", "equipment_id": "eq-kingsemi-unidentified-12in-krf-silan-jike", "facility_id": "fac-silan-jike-12in", "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-kingsemi-unidentified-12in-krf-silan-jike", "last_checked": "2026-07-29", "model": "12-inch high-throughput KrF coat/develop tool; model undisclosed", "process_step": "KrF photoresist coat and develop", "qualified_layer": null, "readiness_state": "shipped", "record_type": "equipment", "source_ids": [ "src-kingsemi-silan-jike-krf-2022" ], "target_device": "12-inch specialty-process wafers", "target_material": "KrF photoresist", "throughput": null, "unknowns": [ "exact model", "serial", "installation", "site acceptance", "named layer", "qualification", "recurring volume", "yield" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "5e48c04e4e430fc6b2486056e643fffcb60f1c76904284230716ddc3d6c33eb2", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "process_step", "value": "KrF photoresist coat and develop" }, { "field": "target_material", "value": "KrF photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "KrF photoresist coat and develop" }, { "field": "target_device", "value": "12-inch specialty-process wafers" }, { "field": "target_material", "value": "KrF photoresist" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kingsemi-silan-jike-krf-2022", "title": "同“芯”聚力，共创辉煌——沈阳芯源KrF涂胶显影机台入驻士兰集科暨双方达成战略合作关系", "publisher": "沈阳芯源微电子设备股份有限公司", "url": "https://www.kingsemi.com/index.php/News/detail?id=160", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2022-06-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No model, serial, purchase record, installation completion, site acceptance, named layer, throughput, uptime or yield is disclosed." ] } ], "entity_reference": { "entity_id": "ent-kingsemi", "record_level": "company", "canonical_legal_name_en": "Kingsemi Co., Ltd.", "canonical_legal_name_cn": "沈阳芯源微电子设备股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "model_undisclosed", "basis": "canonical model text explicitly says model undisclosed", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-3080b", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-3080b", "last_checked": "2026-07-29", "model": "3080B", "model_scope": "exact_catalogue_identifier", "process_step": "wet cleaning; also advanced-packaging catalogue", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue", "src-naura-advanced-packaging-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "719ba056c98b98d220a44ced7dc4b70f7d0373836839955a3856bb1c37c18b2a", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "wet cleaning; also advanced-packaging catalogue" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "wet cleaning; also advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "wet cleaning; also advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] }, { "source_id": "src-naura-advanced-packaging-catalogue", "title": "先进封装装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1600.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; generic batch or repeat-order language does not establish model-specific readiness or customer." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-3080d", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-3080d", "last_checked": "2026-07-29", "model": "3080D", "model_scope": "exact_catalogue_identifier", "process_step": "wet cleaning", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "c1803590cf0a78625e77496451b2648db09e0bfeaf26ce5243306f6c15d22d27", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "wet cleaning" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "wet cleaning" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-3120g", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-3120g", "last_checked": "2026-07-29", "model": "3120G", "model_scope": "exact_catalogue_identifier", "process_step": "wet cleaning", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "0a84a98e73c71b07a2ff8390e0d3b2634f942dcc519b368ebefe821b11b4ae06", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "wet cleaning" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "wet cleaning" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-a302l", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-a302l", "last_checked": "2026-07-29", "model": "A302L", "model_scope": "exact_catalogue_identifier", "process_step": "furnace/thermal processing; also advanced-packaging catalogue", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue", "src-naura-advanced-packaging-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "7d2dcb03cb7f58d0d5fb30405ff1be2f740791584c5e1c327750a24341360d46", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "furnace/thermal processing; also advanced-packaging catalogue" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "furnace/thermal processing; also advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "furnace/thermal processing; also advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] }, { "source_id": "src-naura-advanced-packaging-catalogue", "title": "先进封装装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1600.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; generic batch or repeat-order language does not establish model-specific readiness or customer." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-accura-be", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-accura-be", "last_checked": "2026-07-29", "model": "Accura BE", "model_scope": "exact_catalogue_identifier", "process_step": "plasma etch", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "37b84dc6348c6edd34396de577bf371c6fc0e9940d6d19a61de6b91c441672ad", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "plasma etch" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "plasma etch" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-accura-nz", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-accura-nz", "last_checked": "2026-07-29", "model": "Accura NZ", "model_scope": "exact_catalogue_identifier", "process_step": "plasma etch", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "f9d92d0489fc49dc33c6d173e3783204c3a3d376ec07abe140b0a6d06881cdcb", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "plasma etch" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "plasma etch" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-ace-e300", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-ace-e300", "last_checked": "2026-07-29", "model": "ACE E300", "model_scope": "exact_catalogue_identifier", "process_step": "plasma etch", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "ec99444d8986d4ef1e460c44821f99f434c6ac39e06a60ca4ee4ecab84e3ded4", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "plasma etch" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "plasma etch" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-ace-e300ge", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-ace-e300ge", "last_checked": "2026-07-29", "model": "ACE E300Ge", "model_scope": "exact_catalogue_identifier", "process_step": "plasma etch", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "02647a08a82cc28255a4b29f327bf7dc68b011ae82eac47d37455e643e33ed9e", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "plasma etch" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "plasma etch" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-ace-i300v", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-ace-i300v", "last_checked": "2026-07-29", "model": "ACE I300(V)", "model_scope": "exact_catalogue_identifier", "process_step": "plasma etch; front-end and advanced-packaging catalogue", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue", "src-naura-advanced-packaging-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "5f09b71c10cd08610622f765a3bce8d8aa13ae7f512acd310b86597da319a0e5", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "plasma etch; front-end and advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "plasma etch; front-end and advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] }, { "source_id": "src-naura-advanced-packaging-catalogue", "title": "先进封装装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1600.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; generic batch or repeat-order language does not establish model-specific readiness or customer." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-ausip-t830", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-ausip-t830", "last_checked": "2026-07-29", "model": "Ausip T830", "model_scope": "exact_catalogue_identifier", "process_step": "advanced-packaging process equipment", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-advanced-packaging-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "d36ffc21ed7ecfdffaee9adf13eeb6193f16f9b7f310adc8c995bb4bfcd886fc", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "advanced-packaging process equipment" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "advanced-packaging process equipment" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-advanced-packaging-catalogue", "title": "先进封装装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1600.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; generic batch or repeat-order language does not establish model-specific readiness or customer." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-bmd-p300", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-bmd-p300", "last_checked": "2026-07-29", "model": "BMD P300", "model_scope": "exact_catalogue_identifier", "process_step": "advanced-packaging process equipment", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-advanced-packaging-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "47424ac18918776c8941c574dc50c52e6505d29c4bf5ee304ef94aa277bce573", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "advanced-packaging process equipment" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "advanced-packaging process equipment" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-advanced-packaging-catalogue", "title": "先进封装装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1600.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; generic batch or repeat-order language does not establish model-specific readiness or customer." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-booster-u630", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-booster-u630", "last_checked": "2026-07-29", "model": "Booster U630", "model_scope": "exact_catalogue_identifier", "process_step": "CVD/ALD", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "5ee0424d1f9b18c95ee7bec2000a731878c19fde091bbe086fe3cf8cfb26fa45", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "CVD/ALD" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "CVD/ALD" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-bpure", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-bpure", "last_checked": "2026-07-29", "model": "Bpure", "model_scope": "exact_catalogue_identifier", "process_step": "wet cleaning", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "7199c14691426cca8dfe15a828386ae58c66cbf5aa1bc98cd3977204a0de9f43", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "wet cleaning" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "wet cleaning" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-con302x", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-con302x", "last_checked": "2026-07-29", "model": "CON302X", "model_scope": "exact_catalogue_identifier", "process_step": "furnace/thermal processing", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "022fca676467ab401b70d2f9837937dfdd1c2bad621d82d66e03ac4a49032d53", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "furnace/thermal processing" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "furnace/thermal processing" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-cygnus-capella-sio", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-cygnus-capella-sio", "last_checked": "2026-07-29", "model": "Cygnus Capella SiO", "model_scope": "exact_catalogue_identifier", "process_step": "CVD/ALD; also advanced-packaging catalogue", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue", "src-naura-advanced-packaging-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "07313bb6ddd10b302defcd016c28288647fdcf3b5b05bbdb5024964b472f07ba", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "CVD/ALD; also advanced-packaging catalogue" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "CVD/ALD; also advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "CVD/ALD; also advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] }, { "source_id": "src-naura-advanced-packaging-catalogue", "title": "先进封装装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1600.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; generic batch or repeat-order language does not establish model-specific readiness or customer." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-cygnus-optima-prime", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-cygnus-optima-prime", "last_checked": "2026-07-29", "model": "Cygnus Optima Prime", "model_scope": "exact_catalogue_identifier", "process_step": "CVD/ALD; also advanced-packaging catalogue", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue", "src-naura-advanced-packaging-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "197ca67c8fbec40f367c6d8586649ff50ead05350f030ec4a10c030976b3ce22", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "CVD/ALD; also advanced-packaging catalogue" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "CVD/ALD; also advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "CVD/ALD; also advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] }, { "source_id": "src-naura-advanced-packaging-catalogue", "title": "先进封装装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1600.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; generic batch or repeat-order language does not establish model-specific readiness or customer." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-demax-tn302t", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-demax-tn302t", "last_checked": "2026-07-29", "model": "DEMAX TN302T", "model_scope": "exact_catalogue_identifier", "process_step": "furnace/thermal processing", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "c714659e8f700845f2c94d990585e003ed1cc63e20aabf68d3f1d88b2d9e3d8f", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "furnace/thermal processing" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "furnace/thermal processing" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-eris-e220r", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-eris-e220r", "last_checked": "2026-07-29", "model": "Eris E220R", "model_scope": "exact_catalogue_identifier", "process_step": "epitaxy", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "8639daeaa84e64be5fa175b60016ea921392ace0eac95007a40cad919608fb4a", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "epitaxy" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "epitaxy" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-flouris-201", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-flouris-201", "last_checked": "2026-07-29", "model": "FLOURIS 201", "model_scope": "exact_catalogue_identifier", "process_step": "furnace/thermal processing", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "00b5fc0e0a56bbc22d8795d4690c61f2b4723333daa546ae9844fdcbb0901169", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "furnace/thermal processing" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "furnace/thermal processing" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-hesper-e230a", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-hesper-e230a", "last_checked": "2026-07-29", "model": "Hesper E230A", "model_scope": "exact_catalogue_identifier", "process_step": "epitaxy", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "a7cb461d9d6e71f81c94962ce7306137afeb23338326282e31a5a94852dedcbc", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "epitaxy" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "epitaxy" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-hesper-e630r", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-hesper-e630r", "last_checked": "2026-07-29", "model": "Hesper E630R", "model_scope": "exact_catalogue_identifier", "process_step": "epitaxy", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "c1c73a1e071650dbe02365ff29e852d5560f17f67f528aef4c8683eb0e88dc03", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "epitaxy" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "epitaxy" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-hesper-i-e430r", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-hesper-i-e430r", "last_checked": "2026-07-29", "model": "Hesper I E430R", "model_scope": "exact_catalogue_identifier", "process_step": "epitaxy", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "277231197e3b80b2f738052f7ddde3abc473e48456b4620dec8dd21928deb5d9", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "epitaxy" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "epitaxy" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-hesper-pn430r-ii", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-hesper-pn430r-ii", "last_checked": "2026-07-29", "model": "Hesper PN430R II", "model_scope": "exact_catalogue_identifier", "process_step": "rapid thermal processing", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "49a6c08023721ce1f1d6fab1ea3113d3c8f6418a340a49173772d79ca9d4ceaf", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "rapid thermal processing" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "rapid thermal processing" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-hesper-to230r-ii", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-hesper-to230r-ii", "last_checked": "2026-07-29", "model": "Hesper TO230R II", "model_scope": "exact_catalogue_identifier", "process_step": "rapid thermal processing", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "f4f93bd4abe16370592a1e717741b626223a2580806456b7a2b393fca03458c7", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "rapid thermal processing" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "rapid thermal processing" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-hse-d300", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-hse-d300", "last_checked": "2026-07-29", "model": "HSE D300", "model_scope": "exact_catalogue_identifier", "process_step": "advanced-packaging etch/process equipment", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-advanced-packaging-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "97c919a3b1cc124bb785d8ebdb259887946376da4386c7bdaa7adb525bee890e", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "advanced-packaging etch/process equipment" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "advanced-packaging etch/process equipment" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-advanced-packaging-catalogue", "title": "先进封装装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1600.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; generic batch or repeat-order language does not establish model-specific readiness or customer." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-hse-p300", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-hse-p300", "last_checked": "2026-07-29", "model": "HSE P300", "model_scope": "exact_catalogue_identifier", "process_step": "advanced-packaging etch/process equipment", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-advanced-packaging-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "4cb183a6daf53468b8c44b9bca66742620780bca4d5043e8dd0defa177bf260e", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "advanced-packaging etch/process equipment" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "advanced-packaging etch/process equipment" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-advanced-packaging-catalogue", "title": "先进封装装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1600.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; generic batch or repeat-order language does not establish model-specific readiness or customer." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-implant-portfolio", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-implant-portfolio", "last_checked": "2026-07-29", "model": "ion-implant portfolio; exact model unresolved", "process_step": "ion implantation", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-annual-2025" ], "target_device": "integrated circuits", "target_material": "silicon wafers", "throughput": null, "unknowns": [ "model", "energy/current range", "customer", "facility", "layer", "uptime", "yield" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "d5767956568e4847589956136ff0e39b7bfc2f2247ded48388b9e3de544b5fbe", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "ion implantation" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "ion implantation" }, { "field": "target_device", "value": "integrated circuits" }, { "field": "target_material", "value": "silicon wafers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-annual-2025", "title": "北方华创科技集团股份有限公司2025年年度报告", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225122918.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio coverage does not prove a model's installation, qualified layer, uptime, yield, or recurring volume at a named fab." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "portfolio_exact_model_unresolved", "basis": "canonical model text explicitly says portfolio", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-nmc-612c", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-nmc-612c", "last_checked": "2026-07-29", "model": "NMC 612C", "model_scope": "exact_catalogue_identifier", "process_step": "plasma etch", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "649e2ca6d29a63e8a7227262be2a1122b16f164028e590c1f19ce2a5c7adbd43", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "plasma etch" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "plasma etch" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-nmc-612d", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-nmc-612d", "last_checked": "2026-07-29", "model": "NMC 612D", "model_scope": "exact_catalogue_identifier", "process_step": "plasma etch", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "9891f3594c95d0820af136283e1378057e81e56bcf02312a5a73bfd101e58a47", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "plasma etch" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "plasma etch" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-nmc-612e", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-nmc-612e", "last_checked": "2026-07-29", "model": "NMC 612E", "model_scope": "exact_catalogue_identifier", "process_step": "plasma etch", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "88a14161cb509aa034c7418efd1c3a88bd71dd32b075fb0b0fdc4fdc086f1086", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "plasma etch" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "plasma etch" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-nmc-612g", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-nmc-612g", "last_checked": "2026-07-29", "model": "NMC 612G", "model_scope": "exact_catalogue_identifier", "process_step": "plasma etch", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "028ac3923faa21df250873d9c85a5c1d0c7bd7078121abb0fe8153d7d0dcdf4a", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "plasma etch" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "plasma etch" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-nmc-612m", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-nmc-612m", "last_checked": "2026-07-29", "model": "NMC 612M", "model_scope": "exact_catalogue_identifier", "process_step": "plasma etch", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "dc3e85b405e3b68b41f6402bd1999d2155ebd3f8bd4064c67f27f581c02a7580", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "plasma etch" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "plasma etch" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-orion-proxima", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-orion-proxima", "last_checked": "2026-07-29", "model": "Orion Proxima", "model_scope": "exact_catalogue_identifier", "process_step": "CVD/ALD", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "0968e76d20797d301558ad117446c32492fdff3c3b9649945133cfcb20e90020", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "CVD/ALD" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "CVD/ALD" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-polaris-h630-mhm", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-polaris-h630-mhm", "last_checked": "2026-07-29", "model": "Polaris H630 MHM", "model_scope": "exact_catalogue_identifier", "process_step": "physical vapor deposition", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "620b7ffdd313dd51782bb29c21409832451e3c92ba2c4f93c8cf0e4163dfd74c", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "physical vapor deposition" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "physical vapor deposition" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-pse-v300", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-pse-v300", "last_checked": "2026-07-29", "model": "PSE V300", "model_scope": "exact_catalogue_identifier", "process_step": "plasma etch; front-end and advanced-packaging catalogue", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue", "src-naura-advanced-packaging-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "20b390f978be336eb0ea3355f540b1dbc77a5c3e5023994b32cebf30ba6804d0", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "plasma etch; front-end and advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "plasma etch; front-end and advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] }, { "source_id": "src-naura-advanced-packaging-catalogue", "title": "先进封装装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1600.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; generic batch or repeat-order language does not establish model-specific readiness or customer." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-py302d", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-py302d", "last_checked": "2026-07-29", "model": "PY302D", "model_scope": "exact_catalogue_identifier", "process_step": "furnace/thermal processing", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "c04301837d5bf2dd2631fa68a4fe79243dcdd811f33c522c701f6ab4b24e0e66", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "furnace/thermal processing" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "furnace/thermal processing" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-sc3080a", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-sc3080a", "last_checked": "2026-07-29", "model": "SC3080A", "model_scope": "exact_catalogue_identifier", "process_step": "wet cleaning; also advanced-packaging catalogue", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue", "src-naura-advanced-packaging-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "b79fe3f44d695bc3643eab35cbcdac580ae7187d3a01a4050658fbb31a7bf85d", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "wet cleaning; also advanced-packaging catalogue" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "wet cleaning; also advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "wet cleaning; also advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] }, { "source_id": "src-naura-advanced-packaging-catalogue", "title": "先进封装装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1600.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; generic batch or repeat-order language does not establish model-specific readiness or customer." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-scaler-hk430", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-scaler-hk430", "last_checked": "2026-07-29", "model": "Scaler HK430", "model_scope": "exact_catalogue_identifier", "process_step": "CVD/ALD; also advanced-packaging catalogue", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue", "src-naura-advanced-packaging-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "d77468c99e7830547bf7763a561ab1cc123feeb67a3316614e4449b520dc7c8b", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "CVD/ALD; also advanced-packaging catalogue" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "CVD/ALD; also advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "CVD/ALD; also advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] }, { "source_id": "src-naura-advanced-packaging-catalogue", "title": "先进封装装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1600.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; generic batch or repeat-order language does not establish model-specific readiness or customer." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-sicrius-py302u", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-sicrius-py302u", "last_checked": "2026-07-29", "model": "SICRIUS PY302U", "model_scope": "exact_catalogue_identifier", "process_step": "furnace/thermal processing", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "0878de64b51126212c836c378d1a00d3ea55096b9018efeccdae6189f09ffb74", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "furnace/thermal processing" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "furnace/thermal processing" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-sirius-mc313", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-sirius-mc313", "last_checked": "2026-07-29", "model": "Sirius MC313", "model_scope": "exact_catalogue_identifier", "process_step": "ion implantation", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "6060e2c9515131572f4d8e50872c75fc6a6429fca892c75575ea2ac2eec5e5cb", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "ion implantation" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "ion implantation" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-sitara-ta230a-ii", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-sitara-ta230a-ii", "last_checked": "2026-07-29", "model": "Sitara TA230A II", "model_scope": "exact_catalogue_identifier", "process_step": "rapid thermal processing", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "b8bdb8460d7db23f96ea51fd7eedf7ea7c024c57d37d9ad3d35866011a481c55", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "rapid thermal processing" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "rapid thermal processing" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-sn302d-adv", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-sn302d-adv", "last_checked": "2026-07-29", "model": "SN302D Adv", "model_scope": "exact_catalogue_identifier", "process_step": "furnace/thermal processing", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "2a473e7cc25dcbaefbcc7514870c741fb926ff056fbd794866a0859ddb2a44bd", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "furnace/thermal processing" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "furnace/thermal processing" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-sn302p", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-sn302p", "last_checked": "2026-07-29", "model": "SN302P", "model_scope": "exact_catalogue_identifier", "process_step": "furnace/thermal processing", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "4e9c262f8f70fb4e0c3773107f065ea4ee6840779f558ecd26a1037ae8ac5809", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "furnace/thermal processing" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "furnace/thermal processing" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-sumeris-ap302c", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-sumeris-ap302c", "last_checked": "2026-07-29", "model": "SUMERIS AP302C", "model_scope": "exact_catalogue_identifier", "process_step": "advanced-packaging thermal/process equipment", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-advanced-packaging-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "8564a3b554b46a91ea36e56ca607bf07b3cfb15935371be00fa1210d3d6316d7", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "advanced-packaging thermal/process equipment" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "advanced-packaging thermal/process equipment" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-advanced-packaging-catalogue", "title": "先进封装装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1600.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; generic batch or repeat-order language does not establish model-specific readiness or customer." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-surefill-w620", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-surefill-w620", "last_checked": "2026-07-29", "model": "Surefill W620", "model_scope": "exact_catalogue_identifier", "process_step": "CVD/ALD", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "e4ca3263fe4832f946e5966d1acd1904a695b1c3be0174b3f5a7147940952453", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "CVD/ALD" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "CVD/ALD" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-surefill-w630", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-surefill-w630", "last_checked": "2026-07-29", "model": "Surefill W630", "model_scope": "exact_catalogue_identifier", "process_step": "CVD/ALD", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "43dce85973f3071d8065086626ae28f7e844d0d1bc10db8ecb6e74619ffcb0a1", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "CVD/ALD" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "CVD/ALD" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-theoris-x302h", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-theoris-x302h", "last_checked": "2026-07-29", "model": "THEORIS X302H", "model_scope": "exact_catalogue_identifier", "process_step": "furnace/thermal processing; also advanced-packaging catalogue", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue", "src-naura-advanced-packaging-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "3af6b8bd0addf9bb6215cfd24c8af881c268e4cda8e5742b3f4b260d39369739", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "furnace/thermal processing; also advanced-packaging catalogue" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "furnace/thermal processing; also advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "furnace/thermal processing; also advanced-packaging catalogue" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] }, { "source_id": "src-naura-advanced-packaging-catalogue", "title": "先进封装装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1600.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; generic batch or repeat-order language does not establish model-specific readiness or customer." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-theoris-x302p", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-theoris-x302p", "last_checked": "2026-07-29", "model": "THEORIS X302P", "model_scope": "exact_catalogue_identifier", "process_step": "furnace/thermal processing", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "b8447fedf4cde4002f2d603469a376a63e5ffea87392f3669121bb459a0a6356", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "furnace/thermal processing" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "furnace/thermal processing" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-naura", "equipment_id": "eq-naura-we3102", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-naura-we3102", "last_checked": "2026-07-29", "model": "WE3102", "model_scope": "exact_catalogue_identifier", "process_step": "wet cleaning", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-naura-ic-equipment-catalogue" ], "target_device": "integrated circuits or advanced packaging; model-specific target undisclosed", "target_material": "model-specific material undisclosed", "throughput": null, "unknowns": [ "model-specific order", "customer", "facility", "shipment", "installation", "site acceptance", "qualified layer", "throughput", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "ebee601913e52fd94ff2b57e480da1b6dc59852eaf1d483c7a284a56ed1a9f56", "stage_ids": [ "wafer_equipment", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "wet cleaning" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "wet cleaning" }, { "field": "target_device", "value": "integrated circuits or advanced packaging; model-specific target undisclosed" }, { "field": "target_material", "value": "model-specific material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-ic-equipment-catalogue", "title": "集成电路装备", "publisher": "北方华创科技集团股份有限公司", "url": "https://www.naura.com/product/details_83_1602.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue/model identity only; page-level production/baseline language cannot be inherited by an individual model." ] } ], "entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "exact_catalogue_identifier", "basis": "canonical model_scope field", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "volume_backed", "customer": "anonymous customer production line", "defectivity": null, "entity_id": "ent-piotech", "equipment_id": "eq-piotech-pf300t", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-piotech-pf300t", "last_checked": "2026-07-29", "model": "PF-300T", "process_step": "thin-film deposition; exact process from timeline undisclosed", "qualified_layer": null, "readiness_state": "volume_production", "record_type": "equipment", "source_ids": [ "src-piotech-timeline-2026" ], "target_device": "integrated circuits", "target_material": "thin films; exact material undisclosed", "throughput": { "period_end": "2017", "unit": "cumulative_wafers", "value": ">1000000" }, "unknowns": [ "customer", "facility", "qualified layer", "time window", "uptime", "yield", "current status" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "3988034d47247c81d01f82c73868838af5aac88833baf69212bacb23d6c4871a", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "thin-film deposition; exact process from timeline undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "thin-film deposition; exact process from timeline undisclosed" }, { "field": "target_device", "value": "integrated circuits" }, { "field": "target_material", "value": "thin films; exact material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-piotech-timeline-2026", "title": "发展历程", "publisher": "拓荆科技股份有限公司", "url": "https://www.piotech.cn/index.php/About/about3", "source_type": "company_timeline", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Anonymous events cannot be joined to a catalogue model unless the timeline names that model." ] } ], "entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_model_named_scope_not_explicit", "basis": "model is named, but canonical model_scope is not recorded", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-piotech", "equipment_id": "eq-piotech-pleione-300", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-piotech-pleione-300", "last_checked": "2026-07-29", "model": "Pleione 300", "process_step": "die-to-wafer hybrid bonding", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-piotech-pleione-300" ], "target_device": "3D integration and HBM applications as catalogued", "target_material": "200 mm and 300 mm wafers and dies", "throughput": null, "unknowns": [ "model-named order", "shipment", "customer", "facility", "acceptance", "bond pitch", "throughput", "yield", "HBM qualification" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "cceee4bcd86169784c6c74c693c4db1a00aef8f62aac12b2b10716be254633be", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "die-to-wafer hybrid bonding" }, { "field": "target_device", "value": "3D integration and HBM applications as catalogued" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "die-to-wafer hybrid bonding" }, { "field": "target_device", "value": "3D integration and HBM applications as catalogued" }, { "field": "target_material", "value": "200 mm and 300 mm wafers and dies" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-piotech-pleione-300", "title": "Pleione 300", "publisher": "拓荆科技股份有限公司", "url": "https://piotech.cn/index.php/Pro/detail?id=691", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No named order, shipment, customer, facility, acceptance, bond pitch, throughput, yield or HBM qualification." ] } ], "entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_model_named_scope_not_explicit", "basis": "model is named, but canonical model_scope is not recorded", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-piotech", "equipment_id": "eq-piotech-supra-d-achm-iv", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-piotech-supra-d-achm-iv", "last_checked": "2026-07-29", "model": "Supra-D ACHM IV", "process_step": "thin-film deposition; exact layer undisclosed", "qualified_layer": null, "readiness_state": "shipped", "record_type": "equipment", "source_ids": [ "src-piotech-timeline-2026" ], "target_device": "integrated circuits; exact device undisclosed", "target_material": "ACHM film; exact chemistry undisclosed", "throughput": null, "unknowns": [ "customer", "facility", "installation", "acceptance", "qualified layer", "throughput", "yield" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "e87f21aa32878bb2fe2de9668ca1ddea4ee7262d00f9edb072895f51e8a74f52", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "thin-film deposition; exact layer undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "thin-film deposition; exact layer undisclosed" }, { "field": "target_device", "value": "integrated circuits; exact device undisclosed" }, { "field": "target_material", "value": "ACHM film; exact chemistry undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-piotech-timeline-2026", "title": "发展历程", "publisher": "拓荆科技股份有限公司", "url": "https://www.piotech.cn/index.php/About/about3", "source_type": "company_timeline", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Anonymous events cannot be joined to a catalogue model unless the timeline names that model." ] } ], "entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_model_named_scope_not_explicit", "basis": "model is named, but canonical model_scope is not recorded", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "qualification_backed", "customer": "anonymous customer", "defectivity": null, "entity_id": "ent-piotech", "equipment_id": "eq-piotech-ts300-altair", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-piotech-ts300-altair", "last_checked": "2026-07-29", "model": "TS-300 Altair", "process_step": "thermal ALD", "qualified_layer": null, "readiness_state": "customer_validated", "record_type": "equipment", "source_ids": [ "src-piotech-timeline-2026" ], "target_device": "integrated circuits; exact device undisclosed", "target_material": "thin films; exact material undisclosed", "throughput": null, "unknowns": [ "customer", "facility", "named layer", "qualification vs validation scope", "throughput", "uptime", "yield" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "80f2e032902a2774e6401a4d29bdcec6e75e0ed01086f8dabc85e61c526fc6c3", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "thermal ALD" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "thermal ALD" }, { "field": "target_device", "value": "integrated circuits; exact device undisclosed" }, { "field": "target_material", "value": "thin films; exact material undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-piotech-timeline-2026", "title": "发展历程", "publisher": "拓荆科技股份有限公司", "url": "https://www.piotech.cn/index.php/About/about3", "source_type": "company_timeline", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Anonymous events cannot be joined to a catalogue model unless the timeline names that model." ] } ], "entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_model_named_scope_not_explicit", "basis": "model is named, but canonical model_scope is not recorded", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-piotech", "equipment_id": "eq-piotech-w2w-hybrid-bonding", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-piotech-w2w-hybrid-bonding", "last_checked": "2026-07-29", "model": "W2W hybrid bonding equipment; model undisclosed", "process_step": "wafer-to-wafer hybrid bonding", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-piotech-annual-2025" ], "target_device": "advanced packaging", "target_material": "bonded wafers", "throughput": null, "unknowns": [ "model", "customer", "facility", "acceptance", "bond pitch", "yield", "HBM use" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "79c4381cebb19d828779802ae3dacf7f8487b36ae5eb6e656a7cfc1d20332d1b", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "wafer-to-wafer hybrid bonding" }, { "field": "target_device", "value": "advanced packaging" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "wafer-to-wafer hybrid bonding" }, { "field": "target_device", "value": "advanced packaging" }, { "field": "target_material", "value": "bonded wafers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-piotech-annual-2025", "title": "拓荆科技股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688072_20260428_IFOF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio and issuer-reported progress do not establish a named HBM customer or qualified HBM production." ] } ], "entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "model_undisclosed", "basis": "canonical model text explicitly says model undisclosed", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": "anonymous HBM client", "defectivity": null, "entity_id": "ent-skyverse", "equipment_id": "eq-skyverse-ginkgoifm-p300", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-skyverse-ginkgoifm-p300", "last_checked": "2026-07-29", "model": "GINKGOIFM-P300", "process_step": "wafer geometry, flatness and nanotopography metrology", "qualified_layer": null, "readiness_state": "shipped", "record_type": "equipment", "source_ids": [ "src-skyverse-ginkgoifm-p300-2025", "src-skyverse-ginkgoifm-catalogue" ], "target_device": "HBM, DRAM, logic and NAND applications as catalogued", "target_material": "patterned, unpatterned, post-bond, SiC and GaAs wafers", "throughput": null, "unknowns": [ "customer", "facility", "installation", "site acceptance", "qualified process", "throughput", "repeat order", "yield effect" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "6b245e5a20b89d08310ed55fbffff503618226d9d02ed5707e040a118387b2fb", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "wafer geometry, flatness and nanotopography metrology" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "wafer geometry, flatness and nanotopography metrology" }, { "field": "target_device", "value": "HBM, DRAM, logic and NAND applications as catalogued" }, { "field": "target_material", "value": "patterned, unpatterned, post-bond, SiC and GaAs wafers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-skyverse-ginkgoifm-p300-2025", "title": "Skyverse Releases GINKGOIFM-P300 and Ships First Tool to HBM Client", "publisher": "Skyverse Technology Co., Ltd.", "url": "https://www.skyverse.cn/en/article/38/30.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2025-11-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customer and facility are anonymous; shipment is not installation, acceptance, process qualification or HBM-stack qualification." ] }, { "source_id": "src-skyverse-ginkgoifm-catalogue", "title": "Wafer Flatness Metrology Equipment Series - GINKGOIFM", "publisher": "Skyverse Technology Co., Ltd.", "url": "https://www.skyverse.cn/en/article/28/27.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Family-level catalogue; it does not establish P300 throughput or qualification at a named facility." ] } ], "entity_reference": { "entity_id": "ent-skyverse", "record_level": "company", "canonical_legal_name_en": "Skyverse Technology Co., Ltd.", "canonical_legal_name_cn": "深圳中科飞测科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_model_named_scope_not_explicit", "basis": "model is named, but canonical model_scope is not recorded", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "source_backed", "customer": null, "defectivity": null, "entity_id": "ent-smee", "equipment_id": "eq-smee-ssa600-series", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-smee-ssa600-series", "last_checked": "2026-07-29", "model": "SSA600/SSX600 series", "process_step": "step-and-scan lithography", "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-smee-ssa600-official" ], "target_device": "front-end integrated circuits", "target_material": "photoresist-coated 200/300 mm wafers", "throughput": null, "unknowns": [ "wavelength/NA by model", "serial", "installation", "site acceptance", "qualified layer", "availability", "MTBF", "MTTR" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "e7dd849bf8ba82e4f07d3f76e28174604341a9eab196f6acb12309658acd9829", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "process_step", "value": "step-and-scan lithography" }, { "field": "target_material", "value": "photoresist-coated 200/300 mm wafers" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "step-and-scan lithography" }, { "field": "target_device", "value": "front-end integrated circuits" }, { "field": "target_material", "value": "photoresist-coated 200/300 mm wafers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-smee-ssa600-official", "title": "600 Series Step-and-Scan Lithography System", "publisher": "上海微电子装备（集团）股份有限公司", "url": "https://www.smee.com.cn/eis.pub?method=indexinfo&onclicknodeno=1_4_1_1&service=homepageService", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue capability only; no named facility, serial number, installation, site acceptance, qualified layer, uptime, or yield." ] } ], "entity_reference": { "entity_id": "ent-smee", "record_level": "company", "canonical_legal_name_en": "Shanghai Micro Electronics Equipment (Group) Co., Ltd.", "canonical_legal_name_cn": "上海微电子装备（集团）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "series", "basis": "canonical model text explicitly says series", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "completion_state": "relationship_backed", "customer": "ent-buyer-zycgr22011903-unresolved", "defectivity": null, "entity_id": "ent-smee", "equipment_id": "eq-smee-ssc800-10", "facility_id": null, "foreign_subcomponent_status": "unknown_not_proven_none", "foreign_subcomponents": [], "id": "eq-smee-ssc800-10", "last_checked": "2026-07-29", "model": "SSC800/10", "performance_evidence_ceiling": "procurement justification; no FAT/SAT metrology", "process_step": "step-and-scan lithography; wavelength/process family undisclosed", "procurement_asserted_overlay": { "unit": "nm", "value": "<=15" }, "procurement_asserted_resolution": { "unit": "nm", "value": "<=110" }, "qualified_layer": null, "readiness_state": "unknown", "record_type": "equipment", "source_ids": [ "src-ccgp-smee-ssc800-award-2025", "src-ssc800-ccgp-expert-opinion-20251106", "src-ssc800-ccgp-award-letter-20251224" ], "target_device": "intended research use: high-density and ten-thousand-channel neural-electrode structures", "target_material": "photoresist-coated wafer; exact resist/process unknown", "throughput": null, "unknowns": [ "signed contract", "manufacturing completion", "serial", "shipment", "delivery/receiving", "move-in", "installation", "site acceptance", "asset registration", "wavelength", "NA", "overlay scope/distribution", "throughput", "qualified layer", "uptime", "yield", "component BOM" ], "uptime": null, "canonical_dataset": "equipment.yaml", "canonical_record_sha256": "9d89f66537f2853b292768d543c1c328d48120f5aa3ec0b8e76feed35cbbf27a", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "process_step", "value": "step-and-scan lithography; wavelength/process family undisclosed" }, { "field": "target_material", "value": "photoresist-coated wafer; exact resist/process unknown" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "step-and-scan lithography; wavelength/process family undisclosed" }, { "field": "target_device", "value": "intended research use: high-density and ten-thousand-channel neural-electrode structures" }, { "field": "target_material", "value": "photoresist-coated wafer; exact resist/process unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ccgp-smee-ssc800-award-2025", "title": "zycgr22011903单一来源采购步进扫描式光刻机成交公告", "publisher": "中国政府采购网 / 财政部", "url": "https://www.ccgp.gov.cn/cggg/zygg/cjgg/202512/t20251225_25989183.htm", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2025-12-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Buyer legal identity remains unresolved; official address/contact correlation to 临港实验室 is strong but not a same-document legal-identity receipt.", "Award/vendor selection is not a signed contract, manufacturing completion, shipment, delivery, move-in, installation, site acceptance, asset registration or process qualification.", "Wavelength, NA, resolution, overlay, throughput, facility, layer, yield and production use are undisclosed." ] }, { "source_id": "src-ssc800-ccgp-expert-opinion-20251106", "title": "附件3-专家论证意见", "publisher": "科学技术部 / 中国政府采购网", "url": "https://download.ccgp.gov.cn/oss/download?uuid=ECF994F0FBE86A6F1C7EB79270DA03", "source_type": "single_source_expert_opinion", "primary_status": "primary", "publication_date": "2025-11-07", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The performance statements are procurement-justification assertions, not FAT, SAT or independent metrology.", "The attachment names no model, wavelength, NA, serial, facility, delivery date, qualified layer, throughput, uptime, defectivity or yield." ] }, { "source_id": "src-ssc800-ccgp-award-letter-20251224", "title": "zycgr22011903单一来源采购步进扫描式光刻成交通知书", "publisher": "zycgr22011903 / 中国政府采购网", "url": "https://download.ccgp.gov.cn/oss/download?uuid=29ED2DAF253269EC63A6675AED0E4F", "source_type": "procurement_award_letter", "primary_status": "primary", "publication_date": "2025-12-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The award letter does not prove that the contract was later executed or performed." ] } ], "entity_reference": { "entity_id": "ent-smee", "record_level": "company", "canonical_legal_name_en": "Shanghai Micro Electronics Equipment (Group) Co., Ltd.", "canonical_legal_name_cn": "上海微电子装备（集团）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "canonical_model_named_scope_not_explicit", "basis": "model is named, but canonical model_scope is not recorded", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } } ], "equipment_components": [ { "commercial_state": "supplied_to_named_equipment_makers", "completion_state": "relationship_backed", "component_class": "rf_power_and_matching", "component_id": "comp-hengyunchang-rf-power", "entity_id": "ent-hengyunchang", "foreign_dependency": "Market still described as dominated by MKS, Advanced Energy, TRUMPF and DAIHEN.", "id": "comp-hengyunchang-rf-power", "insertion": "plasma process equipment", "last_checked": "2026-07-29", "name": "RF power supply systems", "record_type": "equipment_component", "source_ids": [ "src-hengyunchang-annual-2025" ], "stop_line_risk": "high_if_unqualified_or_no_spare", "unknowns": [ "exact SKU", "tool model", "fab validation", "spares and service route" ], "canonical_dataset": "equipment-components.yaml", "canonical_record_sha256": "0749cc97cd29ca5a1f62c6523997aea28001e21f2b1a3863df680af1e056e3cc", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "component_class", "value": "rf_power_and_matching" } ] } ], "canonical_classification_inputs": [ { "field": "component_class", "value": "rf_power_and_matching" }, { "field": "insertion", "value": "plasma process equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hengyunchang-annual-2025", "title": "深圳市恒运昌真空技术股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688785_20260428_AVJI.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer-reported customer revenue does not identify the receiving fab, tool model, layer, or exact accepted component SKU." ] } ], "entity_reference": { "entity_id": "ent-hengyunchang", "record_level": "company", "canonical_legal_name_en": "Shenzhen Hengyunchang Vacuum Technology Co., Ltd.", "canonical_legal_name_cn": "深圳市恒运昌真空技术股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "commercial_state": "issuer_reported_installed_and_batch", "completion_state": "relationship_backed", "component_class": "remote_plasma_source", "component_id": "comp-shenzhou-rps", "entity_id": "ent-jiangsu-shenzhou", "foreign_dependency": null, "id": "comp-shenzhou-rps", "insertion": "etch and deposition chamber cleaning/process plasma", "last_checked": "2026-07-29", "name": "Remote plasma source", "record_type": "equipment_component", "source_ids": [ "src-jiangsu-shenzhou-prospectus-2026" ], "stop_line_risk": "high_if_source_fails", "unknowns": [ "model", "facility", "qualified process", "MTBF", "repair and spare route" ], "canonical_dataset": "equipment-components.yaml", "canonical_record_sha256": "4bd0253d725df74991c399a776ac51ca875c240a445d56b0d6e837b0c209dd88", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "component_class", "value": "remote_plasma_source" }, { "field": "insertion", "value": "etch and deposition chamber cleaning/process plasma" } ] } ], "canonical_classification_inputs": [ { "field": "component_class", "value": "remote_plasma_source" }, { "field": "insertion", "value": "etch and deposition chamber cleaning/process plasma" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jiangsu-shenzhou-prospectus-2026", "title": "江苏神州半导体科技股份有限公司招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202606/002191_20260630_F1GO.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-06-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer filing reproduces customer endorsements; facility, serial number, fab acceptance and qualified layer are not public." ] } ], "entity_reference": { "entity_id": "ent-jiangsu-shenzhou", "record_level": "company", "canonical_legal_name_en": "Jiangsu Shenzhou Semiconductor Technology Co., Ltd.", "canonical_legal_name_cn": "江苏神州半导体科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "commercial_state": "issuer_reported_product", "completion_state": "source_backed", "component_class": "precision_stage", "component_id": "comp-uprecision-dual-stage", "entity_id": "ent-uprecision", "foreign_dependency": null, "id": "comp-uprecision-dual-stage", "insertion": "lithography or bonding motion control", "last_checked": "2026-07-29", "name": "Dual-stage ultra-precision motion platform", "record_type": "equipment_component", "source_ids": [ "src-uprecision-prospectus-2026" ], "stop_line_risk": "critical_for_scanner_or_bonder", "unknowns": [ "scanner/bonder model", "customer", "facility", "site acceptance", "accuracy and uptime distribution" ], "canonical_dataset": "equipment-components.yaml", "canonical_record_sha256": "b2d4fa22f041550f0797c3d6f2746935002acf8b0d328217279393222e8cfa93", "stage_ids": [ "lithography", "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "insertion", "value": "lithography or bonding motion control" } ] }, { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "component_class", "value": "precision_stage" } ] } ], "canonical_classification_inputs": [ { "field": "component_class", "value": "precision_stage" }, { "field": "insertion", "value": "lithography or bonding motion control" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-uprecision-prospectus-2026", "title": "北京华卓精科科技股份有限公司招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202606/002213_20260630_2DQN.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-06-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Company K remains anonymous and must not be resolved to SMEE.", "Subsystem commercialization and customer acceptance do not establish scanner delivery, fab insertion, qualified layer or high-volume use." ] } ], "entity_reference": { "entity_id": "ent-uprecision", "record_level": "company", "canonical_legal_name_en": "Beijing U-Precision Tech Co., Ltd.", "canonical_legal_name_cn": "北京华卓精科科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } } ], "materials": [ { "batch_supply_state": "multiple_families_volume_production_vendor_reported", "capacity": null, "chemical_identity": null, "completion_state": "source_backed", "entity_id": "ent-anji", "foreign_dependency": "unresolved", "foreign_dependency_status": "identified_candidate", "grade": null, "id": "mat-anji-cmp-slurry", "last_checked": "2026-07-29", "material_class": "cmp_slurry", "material_id": "mat-anji-cmp-slurry", "metal_limit": null, "name": "CMP slurry portfolio", "named_fab_or_osat": null, "packaging_delivery_form": null, "particle_limit": null, "purity": null, "qualified_process": "logic, memory, substrate, TSV and hybrid-bonding CMP families; product-specific qualification undisclosed", "record_type": "material", "source_ids": [ "src-anji-annual-2024", "src-anji-launch-2026", "src-anji-solutions-2026" ], "unknowns": [ "formulation/grade", "particle and metal limits", "named fab/layer", "batch supply", "precursor origin", "second source" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "05ffdf897fddb11fa3c2f5fb2d39d39e5c2e00c00f8d4c4233089eb4b171dcc2", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "cmp_slurry" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "cmp_slurry" }, { "field": "qualified_process", "value": "logic, memory, substrate, TSV and hybrid-bonding CMP families; product-specific qualification undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-anji-annual-2024", "title": "安集微电子科技（上海）股份有限公司2024年年度报告", "publisher": "上海证券交易所", "url": "https://star.sse.com.cn/disclosure/listedinfo/announcement/c/new/2025-04-16/688019_20250416_8014.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-04-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Public disclosure does not expose full formulation, precursor origin, lot purity, named qualified layer, or fab-specific utilization." ] }, { "source_id": "src-anji-launch-2026", "title": "『创领』安集科技新品发布会，聚“芯”SEMICON CHINA 2026", "publisher": "安集微电子科技（上海）股份有限公司", "url": "https://www.anjimicro.com/qiyexinwen/124.html", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2026-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers are anonymous; family and formulation counts do not disclose exact SKU, composition, grade, facility, layer or yield." ] }, { "source_id": "src-anji-solutions-2026", "title": "解决方案", "publisher": "安集微电子科技（上海）股份有限公司", "url": "https://www.anjimicro.com/jiejuefangan.html", "source_type": "company_product_and_process_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Family/process-level vendor statements; no exact SKU, formulation, grade, named customer/fab, lot volume, defectivity or yield." ] } ], "entity_reference": { "entity_id": "ent-anji", "record_level": "company", "canonical_legal_name_en": "Anji Microelectronics Technology (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "安集微电子科技（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "portfolio_or_family", "basis": "canonical material name", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "volume_production_and_sales", "chemical_identity": "formulation undisclosed", "completion_state": "source_backed", "entity_id": "ent-anji", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": null, "id": "mat-anji-damascene-plating", "last_checked": "2026-07-29", "material_class": "electroplating_chemistry", "material_id": "mat-anji-damascene-plating", "name": "Damascene-copper plating chemistry", "purity": null, "qualified_process": "damascene copper interconnect", "record_type": "material", "source_ids": [ "src-anji-annual-2025" ], "unknowns": [ "SKU", "fab/layer", "bath control", "yield effect", "precursor origin" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "2049beb6d9787c3dba1b0d48313064e6f59e41507844f2e653d0dc8e47353d27", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "electroplating_chemistry" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "electroplating_chemistry" }, { "field": "qualified_process", "value": "damascene copper interconnect" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-anji-annual-2025", "title": "安集微电子科技（上海）股份有限公司2025年年度报告", "publisher": "安集微电子科技（上海）股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-16/1225108553.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers, facilities and product models are anonymized.", "No formulation, grade, numerical yield delta, shipment quantity or exact imported-input BOM is disclosed.", "Generic TSV/hybrid-bonding materials capability does not establish HBM qualification." ] } ], "entity_reference": { "entity_id": "ent-anji", "record_level": "company", "canonical_legal_name_en": "Anji Microelectronics Technology (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "安集微电子科技（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "development_validation", "chemical_identity": "development formulation", "completion_state": "source_backed", "entity_id": "ent-anji", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": null, "id": "mat-anji-tsv-plating", "last_checked": "2026-07-29", "material_class": "electroplating_chemistry", "material_id": "mat-anji-tsv-plating", "name": "TSV plating chemistry", "purity": null, "qualified_process": "TSV plating under development and validation", "record_type": "material", "source_ids": [ "src-anji-annual-2025" ], "unknowns": [ "customer", "facility", "TSV geometry", "fill/yield", "qualification date", "precursor origin" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "36c02ad37e69dc401984bd00635ddc3928eed4623665c8108a1da8790a27f033", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "electroplating_chemistry" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "electroplating_chemistry" }, { "field": "qualified_process", "value": "TSV plating under development and validation" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-anji-annual-2025", "title": "安集微电子科技（上海）股份有限公司2025年年度报告", "publisher": "安集微电子科技（上海）股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-16/1225108553.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers, facilities and product models are anonymized.", "No formulation, grade, numerical yield delta, shipment quantity or exact imported-input BOM is disclosed.", "Generic TSV/hybrid-bonding materials capability does not establish HBM qualification." ] } ], "entity_reference": { "entity_id": "ent-anji", "record_level": "company", "canonical_legal_name_en": "Anji Microelectronics Technology (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "安集微电子科技（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "multiple_families_volume_production_vendor_reported", "capacity": null, "chemical_identity": null, "completion_state": "source_backed", "entity_id": "ent-anji", "foreign_dependency": "unresolved", "foreign_dependency_status": "identified_candidate", "grade": null, "id": "mat-anji-wet-chemicals", "last_checked": "2026-07-29", "material_class": "wet_electronic_chemicals", "material_id": "mat-anji-wet-chemicals", "metal_limit": null, "name": "Functional wet electronic chemicals", "named_fab_or_osat": null, "packaging_delivery_form": null, "particle_limit": null, "purity": null, "qualified_process": "8/12-inch logic, memory, advanced packaging and MEMS process families as vendor-reported", "record_type": "material", "source_ids": [ "src-anji-annual-2024", "src-anji-solutions-2026" ], "unknowns": [ "identity/grade", "purity", "named fab/process", "batch supply", "precursor origin", "second source" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "d9c855a168ca571abed956a6edc9a1d02a88f55a481a0b87af450bc686b1b96a", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "wet_electronic_chemicals" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "wet_electronic_chemicals" }, { "field": "qualified_process", "value": "8/12-inch logic, memory, advanced packaging and MEMS process families as vendor-reported" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-anji-annual-2024", "title": "安集微电子科技（上海）股份有限公司2024年年度报告", "publisher": "上海证券交易所", "url": "https://star.sse.com.cn/disclosure/listedinfo/announcement/c/new/2025-04-16/688019_20250416_8014.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-04-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Public disclosure does not expose full formulation, precursor origin, lot purity, named qualified layer, or fab-specific utilization." ] }, { "source_id": "src-anji-solutions-2026", "title": "解决方案", "publisher": "安集微电子科技（上海）股份有限公司", "url": "https://www.anjimicro.com/jiejuefangan.html", "source_type": "company_product_and_process_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Family/process-level vendor statements; no exact SKU, formulation, grade, named customer/fab, lot volume, defectivity or yield." ] } ], "entity_reference": { "entity_id": "ent-anji", "record_level": "company", "canonical_legal_name_en": "Anji Microelectronics Technology (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "安集微电子科技（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "stable_volume_production_vendor_reported", "chemical_identity": "AsH3", "completion_state": "source_backed", "entity_id": "ent-gentech", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "electronic specialty gas; exact grade undisclosed", "id": "mat-gentech-arsine", "last_checked": "2026-07-29", "material_class": "electronic_specialty_gas", "material_id": "mat-gentech-arsine", "name": "Arsine", "purity": null, "qualified_process": "doping or epitaxy; exact customer process undisclosed", "record_type": "material", "source_ids": [ "src-gentech-annual-2025" ], "unknowns": [ "purity", "delivery form", "named fab/process", "capacity", "precursor", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "9eca61392af8f6063ccedeaf32cebe01cd5439e7ad09f53146516682fa5dd0ea", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "electronic_specialty_gas" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "electronic_specialty_gas" }, { "field": "qualified_process", "value": "doping or epitaxy; exact customer process undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-gentech", "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "sampled_customer_testing", "chemical_identity": "HCDS", "completion_state": "source_backed", "entity_id": "ent-gentech", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "electronic precursor; exact grade undisclosed", "id": "mat-gentech-hcds", "last_checked": "2026-07-29", "material_class": "deposition_precursor", "material_id": "mat-gentech-hcds", "name": "Hexachlorodisilane", "purity": null, "qualified_process": "customer testing; target layer undisclosed", "record_type": "material", "source_ids": [ "src-gentech-annual-2025" ], "unknowns": [ "purity", "delivery form", "customer/facility/layer", "capacity", "precursor", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "7fc17b57fbfd5a08049b101303948fde9e712150102acc60c2a74582bbae9ac5", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "deposition_precursor" }, { "field": "qualified_process", "value": "customer testing; target layer undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "deposition_precursor" }, { "field": "qualified_process", "value": "customer testing; target layer undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-gentech", "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "stable_volume_production_vendor_reported", "chemical_identity": "PH3", "completion_state": "source_backed", "entity_id": "ent-gentech", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "electronic specialty gas; exact grade undisclosed", "id": "mat-gentech-phosphine", "last_checked": "2026-07-29", "material_class": "electronic_specialty_gas", "material_id": "mat-gentech-phosphine", "name": "Phosphine", "purity": null, "qualified_process": "doping or deposition; exact customer process undisclosed", "record_type": "material", "source_ids": [ "src-gentech-annual-2025" ], "unknowns": [ "purity", "delivery form", "named fab/process", "capacity", "precursor", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "d907a9e2e5abc97bfcb437a9ef1da9fc435bba8bead7189473e04d6140faa21b", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "electronic_specialty_gas" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "electronic_specialty_gas" }, { "field": "qualified_process", "value": "doping or deposition; exact customer process undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-gentech", "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "sampled_customer_testing", "chemical_identity": "TMA", "completion_state": "source_backed", "entity_id": "ent-gentech", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "electronic precursor; exact grade undisclosed", "id": "mat-gentech-tma", "last_checked": "2026-07-29", "material_class": "deposition_precursor", "material_id": "mat-gentech-tma", "name": "Trimethylaluminum", "purity": null, "qualified_process": "customer testing; target layer undisclosed", "record_type": "material", "source_ids": [ "src-gentech-annual-2025" ], "unknowns": [ "purity", "delivery form", "customer/facility/layer", "capacity", "precursor", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "a467efd37d5abd4a990de1aa81b6c5edfad4b0fb11d589fc3f43c421399f629e", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "deposition_precursor" }, { "field": "qualified_process", "value": "customer testing; target layer undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "deposition_precursor" }, { "field": "qualified_process", "value": "customer testing; target layer undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-gentech", "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "volume_production_vendor_reported", "capacity": null, "chemical_identity": "Cu target", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-grikin", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "ultra-high purity; numeric grade undisclosed", "id": "mat-grikin-300mm-copper-target", "last_checked": "2026-07-29", "material_class": "sputtering_target", "material_id": "mat-grikin-300mm-copper-target", "metal_limit": null, "name": "300 mm ultra-high-purity copper sputtering target", "named_fab_or_osat": null, "packaging_delivery_form": null, "particle_limit": null, "purity": null, "qualified_process": "300 mm sputter deposition; exact layer unknown", "record_type": "material", "source_ids": [ "src-grinm-grikin-300mm-cu-target-2021" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume", "named customer", "target drawing/model", "capacity", "layer", "shipments" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "ad981cb78fe7f3e54a48a39181290c5a0d92c2f33715f67f4659258d94a78089", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "sputtering_target" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "sputtering_target" }, { "field": "qualified_process", "value": "300 mm sputter deposition; exact layer unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-grinm-grikin-300mm-cu-target-2021", "title": "有研亿金300mm超高纯铜靶喜获第二届集成电路材料五星产品奖", "publisher": "中国有研科技集团有限公司", "url": "https://www.grinm.com/s/2614-6794-121247.html", "source_type": "state_parent_product_announcement", "primary_status": "primary", "publication_date": "2021-11-15", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers are unnamed; exact purity basis, target drawing, capacity, process layer, shipment quantity and yield are absent." ] } ], "entity_reference": { "entity_id": "ent-grikin", "record_level": "company", "canonical_legal_name_en": "GRIKIN Advanced Material Co., Ltd.", "canonical_legal_name_cn": "有研亿金新材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "volume_production_vendor_reported", "capacity": null, "chemical_identity": "Cu", "completion_state": "source_backed", "contradiction_ids": [ "con-grikin-copper-6n-vs-5n" ], "entity_id": "ent-grikin", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "title 6N; body 99.999% (5N), unresolved", "id": "mat-grikin-electrolytic-copper", "last_checked": "2026-07-29", "material_class": "high_purity_target_metal", "material_id": "mat-grikin-electrolytic-copper", "metal_limit": null, "name": "High-purity electrolytic copper", "named_fab_or_osat": null, "packaging_delivery_form": null, "particle_limit": null, "purity": null, "qualified_process": "targets, evaporation and anodes; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-grikin-6n-copper" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume", "purity basis for title versus body", "100 tonnes/year designed versus actual output" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "1d70f8456126c2b3afe97f48961a576a60b1694c0bc0af8a1a1ce665dbacc1dd", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "high_purity_target_metal" }, { "field": "qualified_process", "value": "targets, evaporation and anodes; exact qualified use unknown" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "high_purity_target_metal" }, { "field": "qualified_process", "value": "targets, evaporation and anodes; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-grikin-6n-copper", "title": "6N High Purity Copper", "publisher": "GRIKIN Advanced Material Co., Ltd.", "url": "https://www.grikin.com/en/cms/product/9", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer metadata is internally inconsistent: 6N title versus 5N numeric purity; no CoA or named customer." ] } ], "entity_reference": { "entity_id": "ent-grikin", "record_level": "company", "canonical_legal_name_en": "GRIKIN Advanced Material Co., Ltd.", "canonical_legal_name_cn": "有研亿金新材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "Au, Au alloys, Ag, Pt, Ti, Ni, V, Cr, Al and Cu", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-grikin", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "3N5 to 6N by material; see source product table", "id": "mat-grikin-evaporation-portfolio", "last_checked": "2026-07-29", "material_class": "evaporation_material", "material_id": "mat-grikin-evaporation-portfolio", "metal_limit": null, "name": "Evaporation-material portfolio", "named_fab_or_osat": null, "packaging_delivery_form": null, "particle_limit": null, "purity": null, "qualified_process": "evaporation deposition; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-grikin-evaporation-materials" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "e89a65c20368e79730aa4f0a613e9749b400336c08b5b33a130920a96b8dedaf", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "evaporation_material" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "evaporation_material" }, { "field": "qualified_process", "value": "evaporation deposition; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-grikin-evaporation-materials", "title": "蒸发料", "publisher": "有研亿金新材料有限公司", "url": "https://www.grikin.com/article/27", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue only; no named process, customer, qualification, capacity or lot CoA." ] } ], "entity_reference": { "entity_id": "ent-grikin", "record_level": "company", "canonical_legal_name_en": "GRIKIN Advanced Material Co., Ltd.", "canonical_legal_name_cn": "有研亿金新材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "portfolio_or_family", "basis": "canonical material name", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "volume_production_portfolio_vendor_reported", "chemical_identity": "Ar", "completion_state": "source_backed", "entity_id": "ent-huate-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "5.5N", "id": "mat-huate-argon-5n5", "last_checked": "2026-07-29", "material_class": "electronic_process_gas", "material_id": "mat-huate-argon-5n5", "name": "Argon 5.5N", "purity": "99.9995%", "qualified_process": "process/clean/etch portfolio; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-huate-gas-annual-2025" ], "unknowns": [ "CoA impurity limits", "delivery form", "customer/facility", "process layer", "capacity", "shipment volume" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "ef55030a3a3cb52e2e813c41afa49551e948f8c4573dfe8d5bc13299da3c74c9", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "electronic_process_gas" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "electronic_process_gas" }, { "field": "qualified_process", "value": "process/clean/etch portfolio; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "entity_reference": { "entity_id": "ent-huate-gas", "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "construction_ledger_entry; progress_and_output_unknown", "capacity": { "scope": "legal owner and facility not resolved", "state": "designed_project_capacity", "unit": "tonnes_per_year", "value": 300 }, "chemical_identity": "BCl3", "completion_state": "facility_backed", "entity_id": "ent-huate-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "numeric specification undisclosed", "id": "mat-huate-bcl3-300t-project", "last_checked": "2026-07-29", "material_class": "etch_or_doping_gas", "material_id": "mat-huate-bcl3-300t-project", "name": "Boron trichloride purification project", "purity": null, "qualified_process": "clean/etch or doping application claimed; exact qualified process undisclosed", "record_type": "material", "source_ids": [ "src-huate-gas-annual-2025" ], "unknowns": [ "legal project owner", "facility/address", "project progress", "commissioning", "installed/qualified capacity", "output/utilization", "grade/CoA", "customer", "layer", "yield" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "96481c98f8b2dae4427c9fed05a519ca524b190e171c272c3b4dbd1ea2de60f7", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "material_class", "value": "etch_or_doping_gas" }, { "field": "qualified_process", "value": "clean/etch or doping application claimed; exact qualified process undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "entity_reference": { "entity_id": "ent-huate-gas", "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "construction_95.03_percent_at_2025_year_end", "capacity": { "scope": "legal owner and facility not resolved", "state": "designed_project_capacity", "unit": "tonnes_per_year", "value": 300 }, "chemical_identity": "C4F6; issuer uses 高纯全氟丁二烯/六氟丁二烯 wording", "completion_state": "facility_backed", "entity_id": "ent-huate-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "numeric specification undisclosed", "id": "mat-huate-c4f6-300t-project", "last_checked": "2026-07-29", "material_class": "advanced_etch_gas", "material_id": "mat-huate-c4f6-300t-project", "name": "Hexafluorobutadiene synthesis project", "purity": null, "qualified_process": "high-aspect-ratio etch application claimed; qualified process undisclosed", "record_type": "material", "source_ids": [ "src-huate-gas-annual-2025" ], "unknowns": [ "legal project owner", "facility/address", "completion", "commissioning", "installed/qualified capacity", "output/utilization", "grade/CoA", "customer", "layer", "upstream fluorine/feedstock", "yield" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "be8e4bc49873476ba017220004ed8907ea720e76c5cbec266f455506756f1f3b", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "material_class", "value": "advanced_etch_gas" }, { "field": "qualified_process", "value": "high-aspect-ratio etch application claimed; qualified process undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "entity_reference": { "entity_id": "ent-huate-gas", "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "project_complete_fixed_asset_transfer_and_2025_sales_order; qualified output unknown", "capacity": null, "chemical_identity": "Si2H6", "completion_state": "facility_backed", "entity_id": "ent-huate-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "numeric specification undisclosed", "id": "mat-huate-disilane-project", "last_checked": "2026-07-29", "material_class": "deposition_or_epitaxy_precursor", "material_id": "mat-huate-disilane-project", "name": "Disilane expansion project", "purity": null, "qualified_process": "epitaxy or thin-film deposition; exact qualified process undisclosed", "record_type": "material", "source_ids": [ "src-huate-gas-annual-2025" ], "unknowns": [ "designed capacity", "legal project owner", "facility/address", "installed/qualified capacity", "utilization", "actual output", "CoA", "customer", "delivery/acceptance", "upstream precursor" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "f9a58848f4388f59d7d8e62e3b7e3de52b3e4eb522f4390ebdea4b495023b374", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "deposition_or_epitaxy_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "deposition_or_epitaxy_precursor" }, { "field": "qualified_process", "value": "epitaxy or thin-film deposition; exact qualified process undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "entity_reference": { "entity_id": "ent-huate-gas", "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "volume_production_vendor_reported", "chemical_identity": "Includes CF4, C2F6, CO2, CO, C4F8, CHF3 and C4F6", "completion_state": "source_backed", "entity_id": "ent-huate-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "electronic grade; SKU grades undisclosed", "id": "mat-huate-electronic-gases", "last_checked": "2026-07-29", "material_class": "etch_and_process_gases", "material_id": "mat-huate-electronic-gases", "name": "Electronic specialty-gas portfolio", "purity": null, "qualified_process": "issuer reports multiple node uses; exact layers undisclosed", "record_type": "material", "source_ids": [ "src-huate-gas-annual-2025" ], "unknowns": [ "gas SKU for SMIC Ningbo award", "fab/layer", "purity", "quantity", "qualification date" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "7e15fddc784be8f6cff4abfd7f24ae5a1134ee699e2886cde8a226198c274ef6", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "etch_and_process_gases" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "etch_and_process_gases" }, { "field": "qualified_process", "value": "issuer reports multiple node uses; exact layers undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "entity_reference": { "entity_id": "ent-huate-gas", "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "portfolio_or_family", "basis": "canonical material name", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "portfolio_certification_and_scaled_line_use_vendor_reported", "chemical_identity": "Ar/F/Ne, Kr/Ne, Ar/Ne, Kr/F/Ne, Ar/Ne/Xe", "completion_state": "source_backed", "entity_id": "ent-huate-gas", "foreign_dependency": "Foreign excimer-light-source platforms may remain necessary; tool/fab scope undisclosed.", "foreign_dependency_status": "identified_candidate", "grade": "Ar/F/Ne, Kr/Ne, Ar/Ne, Kr/F/Ne and Ar/Ne/Xe formulations; exact certified formulations and concentrations undisclosed", "id": "mat-huate-excimer-mixtures", "last_checked": "2026-07-29", "material_class": "lithography_gases", "material_id": "mat-huate-excimer-mixtures", "name": "Excimer-lithography gas mixtures", "purity": null, "qualified_process": "ASML and Gigaphoton certification claimed by issuer", "record_type": "material", "source_ids": [ "src-huate-gas-annual-2025" ], "unknowns": [ "Ne/Kr/Xe/F supply origins", "batch and volume", "blend tolerance and contaminant limits", "certificate IDs/dates/specifications", "certification scope", "compatible laser models", "composition tolerance", "consumption", "customer/fab", "fab", "scanner/laser model", "which exact two trace-fluorine mixtures passed both certifications" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "eebb04a660e003eeadddd9d6a1a5e5ac3ef282a67f14d4b1ab5b8040d2a71d58", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "lithography_gases" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "lithography_gases" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "lithography_gases" }, { "field": "qualified_process", "value": "ASML and Gigaphoton certification claimed by issuer" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "entity_reference": { "entity_id": "ent-huate-gas", "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "project_complete_fixed_asset_transfer_and_2025_sales_order; qualified output unknown", "capacity": { "scope": "legal owner and facility not resolved", "state": "designed_project_capacity", "unit": "tonnes_per_year", "value": 300 }, "chemical_identity": "HBr", "completion_state": "facility_backed", "entity_id": "ent-huate-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "high purity; numeric specification undisclosed", "id": "mat-huate-hbr-300t-project", "last_checked": "2026-07-29", "material_class": "electronic_specialty_gas", "material_id": "mat-huate-hbr-300t-project", "name": "High-purity hydrogen bromide project", "purity": null, "qualified_process": "clean/etch auxiliary gas; exact qualified process undisclosed", "record_type": "material", "source_ids": [ "src-huate-gas-annual-2025" ], "unknowns": [ "legal project owner", "facility/address", "installed/qualified capacity", "utilization", "actual output", "grade/CoA", "customer", "delivery/acceptance", "upstream feedstock", "yield" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "ed3a0f0fa8e2e4bb5c1dda2b3a6e277c679e34c061f4039a2ed3149082586777", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "electronic_specialty_gas" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "electronic_specialty_gas" }, { "field": "qualified_process", "value": "clean/etch auxiliary gas; exact qualified process undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "entity_reference": { "entity_id": "ent-huate-gas", "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "volume_production_portfolio_vendor_reported", "chemical_identity": "N2", "completion_state": "source_backed", "entity_id": "ent-huate-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "6N", "id": "mat-huate-nitrogen-6n", "last_checked": "2026-07-29", "material_class": "electronic_process_gas", "material_id": "mat-huate-nitrogen-6n", "name": "Nitrogen 6N", "purity": "99.9999%", "qualified_process": "process-gas portfolio; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-huate-gas-annual-2025" ], "unknowns": [ "CoA impurity limits", "delivery form", "customer/facility", "process layer", "capacity", "shipment volume" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "278f2bb7b874bff1171576efc2df41200c22981ae655a99961735d54ab43c168", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "electronic_process_gas" }, { "field": "qualified_process", "value": "process-gas portfolio; exact qualified use unknown" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "electronic_process_gas" }, { "field": "qualified_process", "value": "process-gas portfolio; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "entity_reference": { "entity_id": "ent-huate-gas", "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "trial_production_vendor_reported", "capacity": null, "chemical_identity": "CH3F", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-jinhong-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "annual filing does not give purity", "id": "mat-jinhong-ch3f", "last_checked": "2026-07-29", "material_class": "etch_gas", "material_id": "mat-jinhong-ch3f", "metal_limit": null, "name": "Fluoromethane", "named_fab_or_osat": null, "packaging_delivery_form": [ "cylinder; exact form undisclosed in filing" ], "particle_limit": null, "purity": null, "qualified_process": "electronic etch; exact qualified layer unknown", "record_type": "material", "source_ids": [ "src-jinhong-annual-2025" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "6fd13a3f23c188c0c627a41af02d8f740c18b05df89b655eff852fed86d85da2", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "material_class", "value": "etch_gas" }, { "field": "qualified_process", "value": "electronic etch; exact qualified layer unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jinhong-annual-2025", "title": "金宏气体股份有限公司2025年年度报告", "publisher": "金宏气体股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-03-28/1225047235.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Capacity is consolidated/group aggregate and cannot be assigned to a facility or subsidiary.", "Named customer portfolios are not molecule-specific edges.", "Except for 7N ammonia program wording, customer CoA purity/particle/moisture/metal limits are absent.", "Do not derive actual output by multiplying capacity and utilization without a separately labeled model." ] } ], "entity_reference": { "entity_id": "ent-jinhong-gas", "record_level": "company", "canonical_legal_name_en": "Jinhong Gas Co., Ltd.", "canonical_legal_name_cn": "金宏气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "volume_production_portfolio_vendor_reported", "capacity": null, "chemical_identity": "C2F6, C4F8 and CF4", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-jinhong-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "numeric grades undisclosed", "id": "mat-jinhong-fluorocarbon-portfolio", "last_checked": "2026-07-29", "material_class": "etch_gas", "material_id": "mat-jinhong-fluorocarbon-portfolio", "metal_limit": null, "name": "Fluorocarbon etch-gas portfolio", "named_fab_or_osat": null, "packaging_delivery_form": [ "cylinder" ], "particle_limit": null, "purity": null, "qualified_process": "etch; molecule-specific customer qualification unknown", "record_type": "material", "source_ids": [ "src-jinhong-annual-2025" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "6c3914212083eab1bae6b92f213f01ccc24987a1409875f96521b2eba6b32b98", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "material_class", "value": "etch_gas" }, { "field": "qualified_process", "value": "etch; molecule-specific customer qualification unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jinhong-annual-2025", "title": "金宏气体股份有限公司2025年年度报告", "publisher": "金宏气体股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-03-28/1225047235.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Capacity is consolidated/group aggregate and cannot be assigned to a facility or subsidiary.", "Named customer portfolios are not molecule-specific edges.", "Except for 7N ammonia program wording, customer CoA purity/particle/moisture/metal limits are absent.", "Do not derive actual output by multiplying capacity and utilization without a separately labeled model." ] } ], "entity_reference": { "entity_id": "ent-jinhong-gas", "record_level": "company", "canonical_legal_name_en": "Jinhong Gas Co., Ltd.", "canonical_legal_name_cn": "金宏气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "portfolio_or_family", "basis": "canonical material name", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "volume_production_vendor_reported", "capacity": null, "chemical_identity": "N2O", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-jinhong-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "high purity; numeric grade undisclosed", "id": "mat-jinhong-high-purity-n2o", "last_checked": "2026-07-29", "material_class": "electronic_specialty_gas", "material_id": "mat-jinhong-high-purity-n2o", "metal_limit": null, "name": "High-purity nitrous oxide", "named_fab_or_osat": null, "packaging_delivery_form": [ "cylinder", "tube trailer" ], "particle_limit": null, "purity": null, "qualified_process": "dielectric-film processing; exact qualified layer unknown", "record_type": "material", "source_ids": [ "src-jinhong-annual-2025" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "36cbf1c26217830210e5d345ffc803fe31cae908f602f1c91ac64ff25ed606e1", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "electronic_specialty_gas" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "electronic_specialty_gas" }, { "field": "qualified_process", "value": "dielectric-film processing; exact qualified layer unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jinhong-annual-2025", "title": "金宏气体股份有限公司2025年年度报告", "publisher": "金宏气体股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-03-28/1225047235.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Capacity is consolidated/group aggregate and cannot be assigned to a facility or subsidiary.", "Named customer portfolios are not molecule-specific edges.", "Except for 7N ammonia program wording, customer CoA purity/particle/moisture/metal limits are absent.", "Do not derive actual output by multiplying capacity and utilization without a separately labeled model." ] } ], "entity_reference": { "entity_id": "ent-jinhong-gas", "record_level": "company", "canonical_legal_name_en": "Jinhong Gas Co., Ltd.", "canonical_legal_name_cn": "金宏气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "volume_production_vendor_reported", "capacity": null, "chemical_identity": "TEOS", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-jinhong-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "electronic precursor; numeric grade undisclosed", "id": "mat-jinhong-teos", "last_checked": "2026-07-29", "material_class": "deposition_precursor", "material_id": "mat-jinhong-teos", "metal_limit": null, "name": "Tetraethyl orthosilicate", "named_fab_or_osat": null, "packaging_delivery_form": [ "cylinder" ], "particle_limit": null, "purity": null, "qualified_process": "LPCVD SiO2 insulating layer; exact qualified customer process unknown", "record_type": "material", "source_ids": [ "src-jinhong-annual-2025" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "0d643b40aee880a7050242e8b0d8f41d39de7a0dc507d4d8b054dd1ed8c13ac8", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "deposition_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "deposition_precursor" }, { "field": "qualified_process", "value": "LPCVD SiO2 insulating layer; exact qualified customer process unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jinhong-annual-2025", "title": "金宏气体股份有限公司2025年年度报告", "publisher": "金宏气体股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-03-28/1225047235.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Capacity is consolidated/group aggregate and cannot be assigned to a facility or subsidiary.", "Named customer portfolios are not molecule-specific edges.", "Except for 7N ammonia program wording, customer CoA purity/particle/moisture/metal limits are absent.", "Do not derive actual output by multiplying capacity and utilization without a separately labeled model." ] } ], "entity_reference": { "entity_id": "ent-jinhong-gas", "record_level": "company", "canonical_legal_name_en": "Jinhong Gas Co., Ltd.", "canonical_legal_name_cn": "金宏气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "volume_production_vendor_reported", "capacity": null, "chemical_identity": "NH3", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-jinhong-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "7N project/product claim; not a customer CoA", "id": "mat-jinhong-ultrapure-ammonia-7n", "last_checked": "2026-07-29", "material_class": "electronic_specialty_gas", "material_id": "mat-jinhong-ultrapure-ammonia-7n", "metal_limit": null, "name": "Ultra-pure ammonia", "named_fab_or_osat": null, "packaging_delivery_form": [ "storage tank", "cylinder" ], "particle_limit": null, "purity": null, "qualified_process": "MOCVD/GaN and semiconductor use; exact qualified customer process unknown", "record_type": "material", "source_ids": [ "src-jinhong-annual-2025" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume", "producing subsidiary/facility", "customer-specific CoA", "named customer-product join" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "c160b18fbd5a1bfdb23538e590107904745c66eb433f9f72b5f73d10f142e005", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "electronic_specialty_gas" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "electronic_specialty_gas" }, { "field": "qualified_process", "value": "MOCVD/GaN and semiconductor use; exact qualified customer process unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jinhong-annual-2025", "title": "金宏气体股份有限公司2025年年度报告", "publisher": "金宏气体股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-03-28/1225047235.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Capacity is consolidated/group aggregate and cannot be assigned to a facility or subsidiary.", "Named customer portfolios are not molecule-specific edges.", "Except for 7N ammonia program wording, customer CoA purity/particle/moisture/metal limits are absent.", "Do not derive actual output by multiplying capacity and utilization without a separately labeled model." ] } ], "entity_reference": { "entity_id": "ent-jinhong-gas", "record_level": "company", "canonical_legal_name_en": "Jinhong Gas Co., Ltd.", "canonical_legal_name_cn": "金宏气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "2.0–3.0 µm film; discrete devices and microdevices", "id": "mat-kehua-bn301", "last_checked": "2026-07-29", "material_class": "UV_broad_spectrum_negative_photoresist", "material_id": "mat-kehua-bn301", "name": "BN301 Series", "purity": null, "qualified_process": "2.0–3.0 µm film; discrete devices and microdevices", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "22615b3c99dd313e4d78907447d9cd9490c29ebd1115743127fe74d9d2cb94bb", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "UV_broad_spectrum_negative_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "UV_broad_spectrum_negative_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "UV_broad_spectrum_negative_photoresist" }, { "field": "qualified_process", "value": "2.0–3.0 µm film; discrete devices and microdevices" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "0.85–2.1 µm film; practical resolution 5 µm", "id": "mat-kehua-bn303", "last_checked": "2026-07-29", "material_class": "UV_broad_spectrum_negative_photoresist", "material_id": "mat-kehua-bn303", "name": "BN303 Series", "purity": null, "qualified_process": "0.85–2.1 µm film; practical resolution 5 µm", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "ba03e64e4580cf72213cc6476f5d860a966a07b9cded96a68d8c012a5c6e3a2d", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "UV_broad_spectrum_negative_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "UV_broad_spectrum_negative_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "UV_broad_spectrum_negative_photoresist" }, { "field": "qualified_process", "value": "0.85–2.1 µm film; practical resolution 5 µm" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "2.2–6 µm film; practical resolution 8 µm", "id": "mat-kehua-bn308", "last_checked": "2026-07-29", "material_class": "UV_broad_spectrum_negative_photoresist", "material_id": "mat-kehua-bn308", "name": "BN308 Series", "purity": null, "qualified_process": "2.2–6 µm film; practical resolution 8 µm", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "97593ba2eae03a0822c4ec322ced6f5931ad2ad9914b2a1fa981a84649fb95ca", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "UV_broad_spectrum_negative_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "UV_broad_spectrum_negative_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "UV_broad_spectrum_negative_photoresist" }, { "field": "qualified_process", "value": "2.2–6 µm film; practical resolution 8 µm" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "0.85–1 µm film; practical resolution 2 µm", "id": "mat-kehua-bn310", "last_checked": "2026-07-29", "material_class": "UV_broad_spectrum_negative_photoresist", "material_id": "mat-kehua-bn310", "name": "BN310 Series", "purity": null, "qualified_process": "0.85–1 µm film; practical resolution 2 µm", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "4ad5148c205540d39325558db993c9898423b07de903bd10b0222c33fd2a99ba", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "UV_broad_spectrum_negative_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "UV_broad_spectrum_negative_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "UV_broad_spectrum_negative_photoresist" }, { "field": "qualified_process", "value": "0.85–1 µm film; practical resolution 2 µm" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "0.75–2.5 µm film; discrete-device positioning", "id": "mat-kehua-bp212", "last_checked": "2026-07-29", "material_class": "broad_spectrum_G_I_line_positive_photoresist", "material_id": "mat-kehua-bp212", "name": "KMP BP212 Series", "purity": null, "qualified_process": "0.75–2.5 µm film; discrete-device positioning", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "b9a7bb8308357fb1c9bf7bd3f5b2c3ca57625259b310599761ce32b7fe67c17f", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "broad_spectrum_G_I_line_positive_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "broad_spectrum_G_I_line_positive_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "broad_spectrum_G_I_line_positive_photoresist" }, { "field": "qualified_process", "value": "0.75–2.5 µm film; discrete-device positioning" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "1.0–2.0 µm film; discrete-device positioning", "id": "mat-kehua-bp218", "last_checked": "2026-07-29", "material_class": "broad_spectrum_G_I_line_positive_photoresist", "material_id": "mat-kehua-bp218", "name": "KMP BP218 Series", "purity": null, "qualified_process": "1.0–2.0 µm film; discrete-device positioning", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "945bb8da2bca1ab6a6647322f586774ffbaf88ebb44bbacc7f6180617c32aabd", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "broad_spectrum_G_I_line_positive_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "broad_spectrum_G_I_line_positive_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "broad_spectrum_G_I_line_positive_photoresist" }, { "field": "qualified_process", "value": "1.0–2.0 µm film; discrete-device positioning" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "0.6 µm resolution at 1.2 µm film; catalogue value", "id": "mat-kehua-c5300", "last_checked": "2026-07-29", "material_class": "G_I_line_positive_photoresist", "material_id": "mat-kehua-c5300", "name": "KMP C5300 Series", "purity": null, "qualified_process": "0.6 µm resolution at 1.2 µm film; catalogue value", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "bbc0ccae6dc6204276885bbda83d9a227b9e8d905c311cc2e73454eae9bdc138", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "G_I_line_positive_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "G_I_line_positive_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "G_I_line_positive_photoresist" }, { "field": "qualified_process", "value": "0.6 µm resolution at 1.2 µm film; catalogue value" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "5 µm film; PAD passivation and DNW deep-ion-implant positioning", "id": "mat-kehua-c6111", "last_checked": "2026-07-29", "material_class": "I_line_positive_thick_film_photoresist", "material_id": "mat-kehua-c6111", "name": "KMP C6111 Series", "purity": null, "qualified_process": "5 µm film; PAD passivation and DNW deep-ion-implant positioning", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "6f78fec21b06159f5f4a2471c43254f42e26a2432528ed603b6feaa112f3e94e", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "I_line_positive_thick_film_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "I_line_positive_thick_film_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "I_line_positive_thick_film_photoresist" }, { "field": "qualified_process", "value": "5 µm film; PAD passivation and DNW deep-ion-implant positioning" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "0.5 µm resolution at 1.0 µm film; catalogue value", "id": "mat-kehua-c7300", "last_checked": "2026-07-29", "material_class": "high_resolution_I_line_photoresist", "material_id": "mat-kehua-c7300", "name": "KMP C7300 Series", "purity": null, "qualified_process": "0.5 µm resolution at 1.0 µm film; catalogue value", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "80eecf5a245e5b881f6d69d537c498f36b39aa57f8af60c9baddc465c332cafc", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "high_resolution_I_line_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "high_resolution_I_line_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "high_resolution_I_line_photoresist" }, { "field": "qualified_process", "value": "0.5 µm resolution at 1.0 µm film; catalogue value" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "0.35 µm resolution at 0.75 µm film; catalogue value", "id": "mat-kehua-c7500", "last_checked": "2026-07-29", "material_class": "high_resolution_I_line_photoresist", "material_id": "mat-kehua-c7500", "name": "KMP C7500 Series", "purity": null, "qualified_process": "0.35 µm resolution at 0.75 µm film; catalogue value", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "3a33e464ccc1a4b96bc36a0040cc38e48b783a72e011d0a39b06dcf1e9393fff", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "high_resolution_I_line_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "high_resolution_I_line_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "high_resolution_I_line_photoresist" }, { "field": "qualified_process", "value": "0.35 µm resolution at 0.75 µm film; catalogue value" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "0.6 µm resolution; implantation and metal-layer positioning", "id": "mat-kehua-c8300", "last_checked": "2026-07-29", "material_class": "heat_and_etch_resistant_I_line_photoresist", "material_id": "mat-kehua-c8300", "name": "KMP C8300 Series", "purity": null, "qualified_process": "0.6 µm resolution; implantation and metal-layer positioning", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "afc8091b8b036caf1f9101b8f0cb7310fea2b50fbad8ebcf99c083a714c92279", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "heat_and_etch_resistant_I_line_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "heat_and_etch_resistant_I_line_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "heat_and_etch_resistant_I_line_photoresist" }, { "field": "qualified_process", "value": "0.6 µm resolution; implantation and metal-layer positioning" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "commercial_mass_production_use_at_anonymous_mainland_and_taiwan_packaging_companies_vendor_reported", "chemical_identity": "proprietary photoresist formulation", "completion_state": "volume_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "10–40 µm film; KOH/TMAH compatibility", "id": "mat-kehua-cp4800", "last_checked": "2026-07-29", "material_class": "advanced_packaging_thick_film_photoresist", "material_id": "mat-kehua-cp4800", "name": "KMP CP4800 Series", "purity": null, "qualified_process": "10–40 µm film; KOH/TMAH compatibility", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "6de531b979fa6b3d01bc208a49f63031a79434779b111facf2bf470ba62b7b6a", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "advanced_packaging_thick_film_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "advanced_packaging_thick_film_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "advanced_packaging_thick_film_photoresist" }, { "field": "qualified_process", "value": "10–40 µm film; KOH/TMAH compatibility" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "volume_supply_to_anonymous_leading_domestic_ic_manufacturers_vendor_reported", "chemical_identity": "proprietary photoresist formulation", "completion_state": "volume_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "implant-layer positioning; 0.25 µm catalogue resolution", "id": "mat-kehua-dk1080", "last_checked": "2026-07-29", "material_class": "KrF_248nm_photoresist", "material_id": "mat-kehua-dk1080", "name": "KMP DK1080", "purity": null, "qualified_process": "implant-layer positioning; 0.25 µm catalogue resolution", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "b75bab74f6b416077e38dae8e335b32e1103628b1f64ab8a7b6df061d892b233", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "KrF_248nm_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "KrF_248nm_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "KrF_248nm_photoresist" }, { "field": "qualified_process", "value": "implant-layer positioning; 0.25 µm catalogue resolution" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "1.0–4.5 µm film; inverted-trapezoidal sidewall positioning", "id": "mat-kehua-e3100", "last_checked": "2026-07-29", "material_class": "G_line_liftoff_negative_photoresist", "material_id": "mat-kehua-e3100", "name": "KMP E3100 Series", "purity": null, "qualified_process": "1.0–4.5 µm film; inverted-trapezoidal sidewall positioning", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "38263280b9fa70de620dd19c2cc981496495454cd16fa915d1ff7b7fea073a68", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "G_line_liftoff_negative_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "G_line_liftoff_negative_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "G_line_liftoff_negative_photoresist" }, { "field": "qualified_process", "value": "1.0–4.5 µm film; inverted-trapezoidal sidewall positioning" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "6.0–12.0 µm film; LED lift-off positioning", "id": "mat-kehua-e3200", "last_checked": "2026-07-29", "material_class": "G_line_liftoff_negative_photoresist", "material_id": "mat-kehua-e3200", "name": "KMP E3200 Series", "purity": null, "qualified_process": "6.0–12.0 µm film; LED lift-off positioning", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "0b2095acfe28743bdbc1e6951096461490a55f34d15c0159cdff84a1afbd55ab", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "G_line_liftoff_negative_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "G_line_liftoff_negative_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "G_line_liftoff_negative_photoresist" }, { "field": "qualified_process", "value": "6.0–12.0 µm film; LED lift-off positioning" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "LED-chip manufacturing positioning", "id": "mat-kehua-ep3100", "last_checked": "2026-07-29", "material_class": "G_I_line_positive_photoresist", "material_id": "mat-kehua-ep3100", "name": "KMP EP3100 Series", "purity": null, "qualified_process": "LED-chip manufacturing positioning", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "a8591b56c08159b2eb90a82e8ca038617c6820551a558538022575c6a91e058f", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "G_I_line_positive_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "G_I_line_positive_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "G_I_line_positive_photoresist" }, { "field": "qualified_process", "value": "LED-chip manufacturing positioning" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "catalogue_only", "chemical_identity": "proprietary photoresist formulation", "completion_state": "source_backed", "entity_id": "ent-beijing-kehua", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "LED-chip manufacturing positioning", "id": "mat-kehua-ep3200", "last_checked": "2026-07-29", "material_class": "G_I_line_positive_photoresist", "material_id": "mat-kehua-ep3200", "name": "KMP EP3200 Series", "purity": null, "qualified_process": "LED-chip manufacturing positioning", "record_type": "material", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "unknowns": [ "complete formulation", "resin/PAG/solvent origin", "metal limit", "particle limit", "named customer/facility", "qualification date", "batch quantity", "actual output", "yield effect", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "2453c2e1e9b3b9980ef7d0f90f44a950cc01ad1758a30485426105c2c5205834", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "G_I_line_positive_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "G_I_line_positive_photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "G_I_line_positive_photoresist" }, { "field": "qualified_process", "value": "LED-chip manufacturing positioning" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] } ], "entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "Al", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-kfmi", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "at least 99.999% (5N) capability", "id": "mat-kfmi-aluminum-5n-capability", "last_checked": "2026-07-29", "material_class": "high_purity_target_metal", "material_id": "mat-kfmi-aluminum-5n-capability", "metal_limit": null, "name": "Aluminium metal for sputtering targets", "named_fab_or_osat": null, "packaging_delivery_form": null, "particle_limit": null, "purity": null, "qualified_process": "sputtering target feedstock; exact target/process unknown", "record_type": "material", "source_ids": [ "src-kfmi-home-purity" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "ed2046bee210a10e3c067e4a24d9014781b9892208bdba682a6fd66345a0f09a", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "high_purity_target_metal" }, { "field": "qualified_process", "value": "sputtering target feedstock; exact target/process unknown" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "high_purity_target_metal" }, { "field": "qualified_process", "value": "sputtering target feedstock; exact target/process unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kfmi-home-purity", "title": "宁波江丰电子材料股份有限公司", "publisher": "宁波江丰电子材料股份有限公司", "url": "https://www.kfmic.com/", "source_type": "company_technology_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Purity capability is not a lot CoA, target drawing, named customer qualification or process-layer receipt." ] } ], "entity_reference": { "entity_id": "ent-kfmi", "record_level": "company", "canonical_legal_name_en": "Konfoong Materials International Co., Ltd.", "canonical_legal_name_cn": "宁波江丰电子材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "Cu", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-kfmi", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "at least 99.9999% (6N) capability", "id": "mat-kfmi-copper-6n-capability", "last_checked": "2026-07-29", "material_class": "high_purity_target_metal", "material_id": "mat-kfmi-copper-6n-capability", "metal_limit": null, "name": "Copper metal for sputtering targets", "named_fab_or_osat": null, "packaging_delivery_form": null, "particle_limit": null, "purity": null, "qualified_process": "sputtering target feedstock; exact target/process unknown", "record_type": "material", "source_ids": [ "src-kfmi-home-purity" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "faf5ebf52d545f6e4cb8f98b6e67604350691e5f6a4e23337582da693aceb30a", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "high_purity_target_metal" }, { "field": "qualified_process", "value": "sputtering target feedstock; exact target/process unknown" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "high_purity_target_metal" }, { "field": "qualified_process", "value": "sputtering target feedstock; exact target/process unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kfmi-home-purity", "title": "宁波江丰电子材料股份有限公司", "publisher": "宁波江丰电子材料股份有限公司", "url": "https://www.kfmic.com/", "source_type": "company_technology_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Purity capability is not a lot CoA, target drawing, named customer qualification or process-layer receipt." ] } ], "entity_reference": { "entity_id": "ent-kfmi", "record_level": "company", "canonical_legal_name_en": "Konfoong Materials International Co., Ltd.", "canonical_legal_name_cn": "宁波江丰电子材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "Ta", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-kfmi", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "at least 99.99% (4N) capability", "id": "mat-kfmi-tantalum-4n-capability", "last_checked": "2026-07-29", "material_class": "high_purity_target_metal", "material_id": "mat-kfmi-tantalum-4n-capability", "metal_limit": null, "name": "Tantalum metal for sputtering targets", "named_fab_or_osat": null, "packaging_delivery_form": null, "particle_limit": null, "purity": null, "qualified_process": "sputtering target feedstock; exact target/process unknown", "record_type": "material", "source_ids": [ "src-kfmi-home-purity" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "3969d6b70fa0d1fa73b3891a61e9a9e6f856c05dc19c00eff371f45986d6d254", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "high_purity_target_metal" }, { "field": "qualified_process", "value": "sputtering target feedstock; exact target/process unknown" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "high_purity_target_metal" }, { "field": "qualified_process", "value": "sputtering target feedstock; exact target/process unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kfmi-home-purity", "title": "宁波江丰电子材料股份有限公司", "publisher": "宁波江丰电子材料股份有限公司", "url": "https://www.kfmic.com/", "source_type": "company_technology_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Purity capability is not a lot CoA, target drawing, named customer qualification or process-layer receipt." ] } ], "entity_reference": { "entity_id": "ent-kfmi", "record_level": "company", "canonical_legal_name_en": "Konfoong Materials International Co., Ltd.", "canonical_legal_name_cn": "宁波江丰电子材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "Ti", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-kfmi", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "at least 99.999% (5N) capability", "id": "mat-kfmi-titanium-5n-capability", "last_checked": "2026-07-29", "material_class": "high_purity_target_metal", "material_id": "mat-kfmi-titanium-5n-capability", "metal_limit": null, "name": "Titanium metal for sputtering targets", "named_fab_or_osat": null, "packaging_delivery_form": null, "particle_limit": null, "purity": null, "qualified_process": "sputtering target feedstock; exact target/process unknown", "record_type": "material", "source_ids": [ "src-kfmi-home-purity" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "f5b9284345ccb0dadb01e97c05028c5d5cc0e5b308ace7bfa663cde884622f88", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "high_purity_target_metal" }, { "field": "qualified_process", "value": "sputtering target feedstock; exact target/process unknown" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "high_purity_target_metal" }, { "field": "qualified_process", "value": "sputtering target feedstock; exact target/process unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kfmi-home-purity", "title": "宁波江丰电子材料股份有限公司", "publisher": "宁波江丰电子材料股份有限公司", "url": "https://www.kfmic.com/", "source_type": "company_technology_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Purity capability is not a lot CoA, target drawing, named customer qualification or process-layer receipt." ] } ], "entity_reference": { "entity_id": "ent-kfmi", "record_level": "company", "canonical_legal_name_en": "Konfoong Materials International Co., Ltd.", "canonical_legal_name_cn": "宁波江丰电子材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "AsH3; issuer displays CAS 07784-42-1", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-nata", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "6N or 6N5", "id": "mat-nata-ash3-6n-6n5", "last_checked": "2026-07-29", "material_class": "implant_or_doping_gas", "material_id": "mat-nata-ash3-6n-6n5", "metal_limit": null, "name": "Arsine 6N/6N5", "named_fab_or_osat": null, "packaging_delivery_form": [ "40 L" ], "particle_limit": null, "purity": null, "qualified_process": "doping or implant source; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-nata-electronic-gases" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "10bd3988479c94568c7380a1256d646e8e29d83059a13e305733e01f9ddfef46", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "material_class", "value": "implant_or_doping_gas" }, { "field": "qualified_process", "value": "doping or implant source; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nata-electronic-gases", "title": "电子特气", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/dianziteqi/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No impurity-by-element, moisture/oxygen/particle limits, CoA, named fab, qualified layer or shipment quantity." ] } ], "entity_reference": { "entity_id": "ent-nata", "record_level": "company", "canonical_legal_name_en": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "canonical_legal_name_cn": "江苏南大光电材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "AsH3 adsorbed gas source; issuer displays CAS 07784-42-1", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-nata", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "5N5", "id": "mat-nata-ash3-ags-5n5", "last_checked": "2026-07-29", "material_class": "implant_or_doping_gas", "material_id": "mat-nata-ash3-ags-5n5", "metal_limit": null, "name": "Arsine adsorbed gas source 5N5", "named_fab_or_osat": null, "packaging_delivery_form": [ "0.44 L", "2.2 L", "3.0 L", "6.6 L" ], "particle_limit": null, "purity": null, "qualified_process": "doping or implant source; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-nata-electronic-gases" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "915a3cb4f6b072ec6fbb3237996784352293354cfcc40c9d8feab04d6ca46445", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "material_class", "value": "implant_or_doping_gas" }, { "field": "qualified_process", "value": "doping or implant source; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nata-electronic-gases", "title": "电子特气", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/dianziteqi/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No impurity-by-element, moisture/oxygen/particle limits, CoA, named fab, qualified layer or shipment quantity." ] } ], "entity_reference": { "entity_id": "ent-nata", "record_level": "company", "canonical_legal_name_en": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "canonical_legal_name_cn": "江苏南大光电材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "BF3 adsorbed gas source; issuer displays CAS 07784-42-1", "completion_state": "source_backed", "contradiction_ids": [ "con-nata-bf3-cas-metadata" ], "entity_id": "ent-nata", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "3N", "id": "mat-nata-bf3-ags-3n", "last_checked": "2026-07-29", "material_class": "implant_gas", "material_id": "mat-nata-bf3-ags-3n", "metal_limit": null, "name": "Boron trifluoride adsorbed gas source 3N", "named_fab_or_osat": null, "packaging_delivery_form": [ "0.44 L", "2.2 L", "3.0 L", "6.6 L" ], "particle_limit": null, "purity": null, "qualified_process": "implant source; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-nata-electronic-gases" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume", "corrected official CAS/SDS" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "9cd9a538b493743aa31a7357359269bbcafbfc28b0c135666acb64ea66bed322", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "material_class", "value": "implant_gas" }, { "field": "qualified_process", "value": "implant source; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nata-electronic-gases", "title": "电子特气", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/dianziteqi/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No impurity-by-element, moisture/oxygen/particle limits, CoA, named fab, qualified layer or shipment quantity." ] } ], "entity_reference": { "entity_id": "ent-nata", "record_level": "company", "canonical_legal_name_en": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "canonical_legal_name_cn": "江苏南大光电材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "NF3; CAS 7783-54-2", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-nata", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "4.6N", "id": "mat-nata-nf3-4n6", "last_checked": "2026-07-29", "material_class": "electronic_specialty_gas", "material_id": "mat-nata-nf3-4n6", "metal_limit": null, "name": "Nitrogen trifluoride 4.6N", "named_fab_or_osat": null, "packaging_delivery_form": [ "47 L / 20 kg", "440 L / 200 kg", "bundle / 320 kg", "8,800 L / 4,000 kg", "13,200 L / 6,000 kg", "18,800 L / 8,000 kg" ], "particle_limit": null, "purity": null, "qualified_process": "chamber cleaning; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-nata-electronic-gases" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "14be162147f8992ff5653588288de2a732d672f601deb4cd1fb263220e3aa2ed", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "electronic_specialty_gas" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "electronic_specialty_gas" }, { "field": "qualified_process", "value": "chamber cleaning; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nata-electronic-gases", "title": "电子特气", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/dianziteqi/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No impurity-by-element, moisture/oxygen/particle limits, CoA, named fab, qualified layer or shipment quantity." ] } ], "entity_reference": { "entity_id": "ent-nata", "record_level": "company", "canonical_legal_name_en": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "canonical_legal_name_cn": "江苏南大光电材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "PH3; CAS 7803-51-2", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-nata", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "6N or 6N5", "id": "mat-nata-ph3-6n-6n5", "last_checked": "2026-07-29", "material_class": "implant_or_doping_gas", "material_id": "mat-nata-ph3-6n-6n5", "metal_limit": null, "name": "Phosphine 6N/6N5", "named_fab_or_osat": null, "packaging_delivery_form": [ "44 L" ], "particle_limit": null, "purity": null, "qualified_process": "doping or implant source; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-nata-electronic-gases" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "77a83e40921aabdb7d110a1c5401578c93d57a28b44030b33d9360cd6b997ac1", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "material_class", "value": "implant_or_doping_gas" }, { "field": "qualified_process", "value": "doping or implant source; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nata-electronic-gases", "title": "电子特气", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/dianziteqi/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No impurity-by-element, moisture/oxygen/particle limits, CoA, named fab, qualified layer or shipment quantity." ] } ], "entity_reference": { "entity_id": "ent-nata", "record_level": "company", "canonical_legal_name_en": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "canonical_legal_name_cn": "江苏南大光电材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "PH3 adsorbed gas source; CAS 7803-51-2", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-nata", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "5N7", "id": "mat-nata-ph3-ags-5n7", "last_checked": "2026-07-29", "material_class": "implant_or_doping_gas", "material_id": "mat-nata-ph3-ags-5n7", "metal_limit": null, "name": "Phosphine adsorbed gas source 5N7", "named_fab_or_osat": null, "packaging_delivery_form": [ "0.44 L", "2.2 L", "3.0 L", "6.6 L" ], "particle_limit": null, "purity": null, "qualified_process": "doping or implant source; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-nata-electronic-gases" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "4056fac924d034b651e14825bb26130ea70a4da8ddb7780923195c81db41c691", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "material_class", "value": "implant_or_doping_gas" }, { "field": "qualified_process", "value": "doping or implant source; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nata-electronic-gases", "title": "电子特气", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/dianziteqi/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No impurity-by-element, moisture/oxygen/particle limits, CoA, named fab, qualified layer or shipment quantity." ] } ], "entity_reference": { "entity_id": "ent-nata", "record_level": "company", "canonical_legal_name_en": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "canonical_legal_name_cn": "江苏南大光电材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "SF6; CAS 2551-62-4", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-nata", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "electronic 5N", "id": "mat-nata-sf6-5n", "last_checked": "2026-07-29", "material_class": "electronic_specialty_gas", "material_id": "mat-nata-sf6-5n", "metal_limit": null, "name": "Sulfur hexafluoride 5N", "named_fab_or_osat": null, "packaging_delivery_form": [ "47 L / 50 kg", "440 L / 500 kg", "880 L / 1,100 kg" ], "particle_limit": null, "purity": null, "qualified_process": "etch or chamber cleaning; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-nata-electronic-gases" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "f80fa8c6ff9f1c6cd0fc529cd01b6151569f46cbd1f0b1c8e88fb4e295d4470a", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "electronic_specialty_gas" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "electronic_specialty_gas" }, { "field": "qualified_process", "value": "etch or chamber cleaning; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nata-electronic-gases", "title": "电子特气", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/dianziteqi/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No impurity-by-element, moisture/oxygen/particle limits, CoA, named fab, qualified layer or shipment quantity." ] } ], "entity_reference": { "entity_id": "ent-nata", "record_level": "company", "canonical_legal_name_en": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "canonical_legal_name_cn": "江苏南大光电材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "TEGa", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-nata", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "Adduct or Semi (vendor labels; not numeric purity)", "id": "mat-nata-tega", "last_checked": "2026-07-29", "material_class": "metalorganic_precursor", "material_id": "mat-nata-tega", "metal_limit": null, "name": "Triethylgallium", "named_fab_or_osat": null, "packaging_delivery_form": [ "vendor packaging undisclosed" ], "particle_limit": null, "purity": null, "qualified_process": "MOCVD precursor; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-nata-mo-sources" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "ecf8b5462456c38109e05769e55fc6c38d64479eae01c0aef0707306c3cf4c24", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "metalorganic_precursor" }, { "field": "qualified_process", "value": "MOCVD precursor; exact qualified use unknown" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "metalorganic_precursor" }, { "field": "qualified_process", "value": "MOCVD precursor; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nata-mo-sources", "title": "MO源", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/moyuan", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Adduct/Semi are not numeric purity specifications; no CoA, named customer, facility or qualification." ] } ], "entity_reference": { "entity_id": "ent-nata", "record_level": "company", "canonical_legal_name_en": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "canonical_legal_name_cn": "江苏南大光电材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "TMAl", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-nata", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "Adduct or Semi (vendor labels; not numeric purity)", "id": "mat-nata-tmal", "last_checked": "2026-07-29", "material_class": "metalorganic_precursor", "material_id": "mat-nata-tmal", "metal_limit": null, "name": "Trimethylaluminium", "named_fab_or_osat": null, "packaging_delivery_form": [ "vendor packaging undisclosed" ], "particle_limit": null, "purity": null, "qualified_process": "MOCVD or ALD precursor; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-nata-mo-sources" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "f9cde44e6a0c3a1c266b959316696e79a8c9ed0392d3c275ca334226cd73d5c2", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "metalorganic_precursor" }, { "field": "qualified_process", "value": "MOCVD or ALD precursor; exact qualified use unknown" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "metalorganic_precursor" }, { "field": "qualified_process", "value": "MOCVD or ALD precursor; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nata-mo-sources", "title": "MO源", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/moyuan", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Adduct/Semi are not numeric purity specifications; no CoA, named customer, facility or qualification." ] } ], "entity_reference": { "entity_id": "ent-nata", "record_level": "company", "canonical_legal_name_en": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "canonical_legal_name_cn": "江苏南大光电材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "TMGa", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-nata", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "Adduct or Semi (vendor labels; not numeric purity)", "id": "mat-nata-tmga", "last_checked": "2026-07-29", "material_class": "metalorganic_precursor", "material_id": "mat-nata-tmga", "metal_limit": null, "name": "Trimethylgallium", "named_fab_or_osat": null, "packaging_delivery_form": [ "vendor packaging undisclosed" ], "particle_limit": null, "purity": null, "qualified_process": "MOCVD precursor; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-nata-mo-sources" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "42716338607c6ff2e8c985e54092399f42f6a39f6ffdce324d6eb20a3fb2f088", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "metalorganic_precursor" }, { "field": "qualified_process", "value": "MOCVD precursor; exact qualified use unknown" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "metalorganic_precursor" }, { "field": "qualified_process", "value": "MOCVD precursor; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nata-mo-sources", "title": "MO源", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/moyuan", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Adduct/Semi are not numeric purity specifications; no CoA, named customer, facility or qualification." ] } ], "entity_reference": { "entity_id": "ent-nata", "record_level": "company", "canonical_legal_name_en": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "canonical_legal_name_cn": "江苏南大光电材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "manufactured_catalogue", "capacity": null, "chemical_identity": "TMIn", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-nata", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "Adduct or Semi (vendor labels; not numeric purity)", "id": "mat-nata-tmin", "last_checked": "2026-07-29", "material_class": "metalorganic_precursor", "material_id": "mat-nata-tmin", "metal_limit": null, "name": "Trimethylindium", "named_fab_or_osat": null, "packaging_delivery_form": [ "vendor packaging undisclosed" ], "particle_limit": null, "purity": null, "qualified_process": "MOCVD precursor; exact qualified use unknown", "record_type": "material", "source_ids": [ "src-nata-mo-sources" ], "unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null, "canonical_dataset": "materials.yaml", "canonical_record_sha256": "ff7683e4e57260b8d471ac6490769de6faf02c956574a89269376e53a9b3d847", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "metalorganic_precursor" }, { "field": "qualified_process", "value": "MOCVD precursor; exact qualified use unknown" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "metalorganic_precursor" }, { "field": "qualified_process", "value": "MOCVD precursor; exact qualified use unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nata-mo-sources", "title": "MO源", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/moyuan", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Adduct/Semi are not numeric purity specifications; no CoA, named customer, facility or qualification." ] } ], "entity_reference": { "entity_id": "ent-nata", "record_level": "company", "canonical_legal_name_en": "Jiangsu Nata Opto-electronic Material Co., Ltd.", "canonical_legal_name_cn": "江苏南大光电材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "volume_production", "capacity": { "scope": "Shanghai and Taiyuan combined, 2025", "state": "group_reported_capacity", "unit": "wafers_per_month", "value": 850000 }, "chemical_identity": "monocrystalline silicon", "completion_state": "facility_backed", "entity_id": "ent-nsig", "foreign_dependency": "High-end heavily doped epitaxial and low-oxygen high-resistivity product gaps disclosed.", "foreign_dependency_status": "identified_candidate", "grade": "polished/epitaxial mix; exact grade by facility undisclosed", "id": "mat-nsig-300mm-wafers", "last_checked": "2026-07-29", "material_class": "silicon_wafers", "material_id": "mat-nsig-300mm-wafers", "name": "300 mm silicon wafers", "purity": null, "qualified_process": "logic, memory and other wafer fabrication; exact named process undisclosed", "record_type": "material", "source_ids": [ "src-nsig-capacity-2025", "src-nsig-inquiry-2025" ], "unknowns": [ "resistivity/oxygen/defect limits", "customer", "facility split", "qualified output", "actual output", "yield" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "6d39c65b9b551395e2f7aff99616ab80391232718cb07c911fa4cd7b0084c5ab", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "silicon_wafers" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "silicon_wafers" }, { "field": "qualified_process", "value": "logic, memory and other wafer fabrication; exact named process undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nsig-capacity-2025", "title": "上海硅产业集团股份有限公司2026年度“提质增效重回报”行动方案", "publisher": "上海硅产业集团股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-17/1225114299.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group capacity is not installed-tool count, qualified output, actual output, utilization, yield or fab-specific capacity." ] }, { "source_id": "src-nsig-inquiry-2025", "title": "关于上海硅产业集团股份有限公司发行股份及支付现金购买资产并募集配套资金申请审核问询函的回复", "publisher": "上海证券交易所 / 立信会计师事务所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202509/688126_20250901_U2SY.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-09-01", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Equipment vendors and a domestic polysilicon supplier are anonymized; forecasts are not actual production." ] } ], "entity_reference": { "entity_id": "ent-nsig", "record_level": "company", "canonical_legal_name_en": "National Silicon Industry Group Co., Ltd.", "canonical_legal_name_cn": "上海硅产业集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "customer_validated_and_ramping_vendor_reported", "chemical_identity": "proprietary ArF formulations; exact chemistry undisclosed", "completion_state": "qualification_backed", "entity_id": "ent-tongcheng-electronic-materials-shanghai", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "ArF dry/immersion split undisclosed for the validated products", "id": "mat-tongcheng-arf-photoresist-family", "last_checked": "2026-07-29", "material_class": "photoresist", "material_id": "mat-tongcheng-arf-photoresist-family", "name": "ArF photoresist family", "purity": null, "qualified_process": "validated at multiple unnamed mainland customers and entering ramp; exact layer and ArF mode undisclosed", "record_type": "material", "source_ids": [ "src-red-avenue-annual-2025" ], "unknowns": [ "exact SKU", "dry versus immersion", "resin/PAG/solvent composition", "metal and particle limits", "named fab", "layer", "qualification date", "batch quantity", "yield", "upstream precursors", "foreign dependencies" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "b7d418c2ba0e347ef6f34d1c6b1393e1615652bd508487f3ad57c419986ae10c", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "photoresist" }, { "field": "qualified_process", "value": "validated at multiple unnamed mainland customers and entering ramp; exact layer and ArF mode undisclosed" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "photoresist" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "photoresist" }, { "field": "qualified_process", "value": "validated at multiple unnamed mainland customers and entering ramp; exact layer and ArF mode undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] } ], "entity_reference": { "entity_id": "ent-tongcheng-electronic-materials-shanghai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海彤程电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "portfolio_or_family", "basis": "canonical material name", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "batch_production_and_stable_delivery_vendor_reported", "chemical_identity": "polyurethane-based CMP pads; exact formulation undisclosed", "completion_state": "volume_backed", "entity_id": "ent-tongcheng-electronic-materials-changzhou", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "8-inch and 12-inch wafer-fab applications; exact pad grades undisclosed", "id": "mat-tongcheng-changzhou-cmp-pads", "last_checked": "2026-07-29", "material_class": "cmp_pad", "material_id": "mat-tongcheng-changzhou-cmp-pads", "name": "Advanced semiconductor CMP-pad portfolio", "purity": null, "qualified_process": "entered multiple unnamed mainstream 200 mm and 300 mm fab supply chains", "record_type": "material", "source_ids": [ "src-red-avenue-annual-2025" ], "unknowns": [ "pad SKU", "named fab/facility", "oxide/metal layer", "slurry pairing", "qualification date", "output", "utilization", "defectivity/yield effect", "polyurethane/precursor and equipment origins", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "40a58c07ba85c283d48a66e9b3a085207eaedc1cc3bd5a1f3de6a67a9a72c011", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "cmp_pad" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "cmp_pad" }, { "field": "qualified_process", "value": "entered multiple unnamed mainstream 200 mm and 300 mm fab supply chains" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] } ], "entity_reference": { "entity_id": "ent-tongcheng-electronic-materials-changzhou", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "彤程电子材料（常州）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "portfolio_or_family", "basis": "canonical material name", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "volume_production_and_sales_vendor_reported", "chemical_identity": "proprietary solvent formulation; exact identity undisclosed", "completion_state": "qualification_backed", "entity_id": "ent-tongcheng-electronic-materials-shanghai", "foreign_dependency": "Issuer frames the product as a substitute for overseas products; precursor and purification-equipment origins are undisclosed.", "foreign_dependency_status": "identified_candidate", "grade": "G5; issuer describes ppb-level metal control and particle management", "id": "mat-tongcheng-g5-ebr", "last_checked": "2026-07-29", "material_class": "high_purity_lithography_solvent", "material_id": "mat-tongcheng-g5-ebr", "name": "G5-grade edge-bead remover (EBR)", "purity": "exact assay and individual metal/particle limits undisclosed", "qualified_process": "unnamed customer certifications at 40 nm and 28 nm", "record_type": "material", "source_ids": [ "src-red-avenue-annual-2025" ], "unknowns": [ "SKU", "named fab/facility", "scanner/resist pairing", "certified layer", "qualification date", "batch volume", "actual output", "yield effect", "precursor", "purification equipment", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "fc1e18eee492946fb2b07797f284317d761cb09f1a80ee7a4556cd71c22fe0a8", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "high_purity_lithography_solvent" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "high_purity_lithography_solvent" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "high_purity_lithography_solvent" }, { "field": "qualified_process", "value": "unnamed customer certifications at 40 nm and 28 nm" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] } ], "entity_reference": { "entity_id": "ent-tongcheng-electronic-materials-shanghai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海彤程电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "named_material_scope_not_explicit", "basis": "canonical material name and class", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } }, { "batch_supply_state": "volume_production_and_sales_vendor_reported", "chemical_identity": "polyhydroxystyrene-family resin; exact structures undisclosed", "completion_state": "volume_backed", "entity_id": "ent-tongcheng-electronic-materials-shanghai", "foreign_dependency": "Presented as internal substitution for imported resin; monomer, catalyst, purification-tool and filter origins are undisclosed.", "foreign_dependency_status": "identified_candidate", "grade": "photoresist grade; exact molecular-weight and metal specifications undisclosed", "id": "mat-tongcheng-phs-photoresist-resin", "last_checked": "2026-07-29", "material_class": "photoresist_resin", "material_id": "mat-tongcheng-phs-photoresist-resin", "name": "PHS photoresist-resin family", "purity": "issuer reports metal-impurity performance comparable with imported resin; numeric limits undisclosed", "qualified_process": "multiple products in production and sales; exact downstream photoresist and fab layers undisclosed", "record_type": "material", "source_ids": [ "src-red-avenue-annual-2025" ], "unknowns": [ "SKU", "molecular-weight distribution", "metal/particle limits", "named photoresist formula", "fab/layer", "capacity by resin line", "actual output", "yield", "upstream precursor", "second source" ], "canonical_dataset": "materials.yaml", "canonical_record_sha256": "3865f758adbb31b7e97a5014da3f7ba435bca07382d6155243862bfff9eba4f5", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "material_class", "value": "photoresist_resin" }, { "field": "qualified_process", "value": "multiple products in production and sales; exact downstream photoresist and fab layers undisclosed" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "material_class", "value": "photoresist_resin" }, { "field": "qualified_process", "value": "multiple products in production and sales; exact downstream photoresist and fab layers undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "material_class", "value": "photoresist_resin" }, { "field": "qualified_process", "value": "multiple products in production and sales; exact downstream photoresist and fab layers undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] } ], "entity_reference": { "entity_id": "ent-tongcheng-electronic-materials-shanghai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海彤程电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "model_or_portfolio_scope": { "state": "portfolio_or_family", "basis": "canonical material name", "boundary": "An exact identifier or named family proves only the source-recorded catalogue or product scope. It does not prove a customer, facility, qualification, shipment, installed base, yield, or volume." } } ], "facilities": [ { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-amkor-shanghai", "foreign_dependencies": [ "Amkor parent package-platform, IP and service boundary; detailed BOM undisclosed" ], "id": "fac-amkor-shanghai", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-amkor-shanghai-operator-unresolved", "location": "Waigaoqiao Free Trade Zone, Shanghai, China", "name": "Amkor Shanghai packaging and test operation", "operator_entity_id": "ent-amkor-shanghai-operator-unresolved", "process_families": [ "assembly", "wafer_level_packaging", "die_stacking", "package_stacking", "test" ], "production_state": "current_factory_and_production_lines_confirmed_2025_to_2026", "record_type": "facility", "source_ids": [ "src-amkor-shanghai-qualification-2001", "src-amkor-shanghai-expansion-2015", "src-amkor-smic-award-2013", "src-amkor-current-factory-2026", "src-shanghai-amkor-current-2025" ], "unknowns": [ "immediate ownership chain", "exact current package platforms", "customers", "capacity", "utilization", "output", "yield", "equipment/material BOM" ], "wafer_diameter": "not_applicable_or_unknown", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "680382f411fd5e71c80b15a2b976b49edbd58b844e6dfcc31bac1b0a3ad590c8", "stage_ids": [ "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_families", "value": "wafer_level_packaging" }, { "field": "process_families", "value": "die_stacking" }, { "field": "process_families", "value": "package_stacking" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_families", "value": "assembly" }, { "field": "process_families", "value": "test" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "assembly" }, { "field": "process_families", "value": "wafer_level_packaging" }, { "field": "process_families", "value": "die_stacking" }, { "field": "process_families", "value": "package_stacking" }, { "field": "process_families", "value": "test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-amkor-shanghai-qualification-2001", "title": "Amkor’s China Factory Ready for Customer Qualification", "publisher": "Amkor Technology, Inc.", "url": "https://ir.amkor.com/news-releases/news-release-details/amkors-china-factory-ready-customer-qualification", "source_type": "company_facility_announcement", "primary_status": "primary", "publication_date": "2001-06-11", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Readiness for qualification is not qualification, production or current operating-state proof." ] }, { "source_id": "src-amkor-shanghai-expansion-2015", "title": "Amkor Technology Announces Expansion of China Operations", "publisher": "Amkor Technology, Inc.", "url": "https://ir.amkor.com/news-releases/news-release-details/amkor-technology-announces-expansion-china-operations", "source_type": "company_facility_announcement", "primary_status": "primary", "publication_date": "2015-07-21", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical portfolio description is not package-specific customer qualification, capacity, utilization, yield or current production proof." ] }, { "source_id": "src-amkor-smic-award-2013", "title": "Amkor Technology Receives Excellent Service Provider Award from SMIC", "publisher": "Amkor Technology, Inc.", "url": "https://ir.amkor.com/news-releases/news-release-details/amkor-technology-receives-excellent-service-provider-award-0", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2013-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-origin award statement does not identify the exact SMIC legal affiliate, facility, package, chip, quantity, price, qualification or current status." ] }, { "source_id": "src-amkor-current-factory-2026", "title": "Contact Us — Factories", "publisher": "Amkor Technology, Inc.", "url": "https://amkor.com/contact-us/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The current factory list proves legal name, factory identifier and address, not package-specific qualification, customers, capacity, utilization, yield or immediate ownership chain." ] }, { "source_id": "src-shanghai-amkor-current-2025", "title": "浦东新区领导走访行业领军企业", "publisher": "浦东新区人民政府", "url": "https://www.shanghai.gov.cn/nw15343/20250310/86a8dfa142ed4672ae78265adb29ecf0.html", "source_type": "government_company_record", "primary_status": "primary", "publication_date": "2025-03-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Government visit confirms current legal name and production-line presence, not exact package platform, customer, capacity, utilization, yield or equipment/material BOM." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-amkor-shanghai-operator-unresolved", "record_level": "company", "canonical_legal_name_en": "Amkor Assembly and Test (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "安靠封装测试（上海）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-amkor-shanghai-operator-unresolved", "record_level": "company", "canonical_legal_name_en": "Amkor Assembly and Test (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "安靠封装测试（上海）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Waigaoqiao Free Trade Zone, Shanghai, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-ase-wuxi", "foreign_dependencies": [ "ASE parent package-platform, IP and service boundary; detailed BOM undisclosed" ], "id": "fac-ase-wuxi", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-ase-wuxi-operator-unresolved", "location": "Wuxi, Jiangsu, China", "name": "ASE Wuxi", "operator_entity_id": "ent-ase-wuxi-operator-unresolved", "process_families": [ "assembly", "test" ], "production_state": "current_legal_operator_site_with_assembly_and_test_scope", "record_type": "facility", "source_ids": [ "src-ase-wuxi-facility", "src-ase-wuxi-operator-2025" ], "unknowns": [ "immediate ownership chain", "package platforms", "customers", "capacity", "utilization", "output", "yield", "equipment/material BOM" ], "wafer_diameter": "not_applicable_or_unknown", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "359a71db209bd58acf3b5b5875466f18e0a81afbff81831cd7216e8438a8a172", "stage_ids": [ "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_families", "value": "assembly" }, { "field": "process_families", "value": "test" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "assembly" }, { "field": "process_families", "value": "test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ase-wuxi-facility", "title": "Global Manufacturing", "publisher": "Advanced Semiconductor Engineering, Inc.", "url": "https://ase.aseglobal.com/about-ase/manufacturing-facilities/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not identify the exact Chinese legal operator, package platforms, customers, capacity, qualification, utilization or ownership chain." ] }, { "source_id": "src-ase-wuxi-operator-2025", "title": "ASE WuXi — 关于我们", "publisher": "无锡通芝微电子有限公司", "url": "https://www.asewx.com/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page proves the operating legal name, address and generic assembly/test scope, not the immediate ownership chain, package platforms, named customers, capacity, utilization or yield." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-ase-wuxi-operator-unresolved", "record_level": "company", "canonical_legal_name_en": "Wuxi Tongzhi Microelectronics Co., Ltd.", "canonical_legal_name_cn": "无锡通芝微电子有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-ase-wuxi-operator-unresolved", "record_level": "company", "canonical_legal_name_en": "Wuxi Tongzhi Microelectronics Co., Ltd.", "canonical_legal_name_cn": "无锡通芝微电子有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Wuxi, Jiangsu, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": { "scope": "site and exact count unknown", "state": "rounded_vendor_class_not_exact_count", "unit": "accelerator_cards", "value": "10,000-card class" }, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-baidu-p800-10k-class-unknown-site", "foreign_dependencies": [], "id": "fac-baidu-p800-10k-class-unknown-site", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-baidu-cluster-owner-unresolved", "location": "unknown", "name": "Baidu Baige + P800 10,000-card-class cluster", "operator_entity_id": "ent-baidu-cluster-owner-unresolved", "process_families": [ "ai_training_cluster" ], "production_state": "powered_on_vendor_reported", "record_type": "facility", "source_ids": [ "src-baidu-baige-deepseek-p800-20250217", "src-baidu-p800-large-cluster-caict-claim-20250723" ], "unknowns": [ "legal owner/operator", "site", "exact installed/active count", "SAT", "utilization", "uptime", "power/cooling", "network/BOM", "customers" ], "wafer_diameter": "not_applicable", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "99773bbd747ccaa65fd73883d5244fc4e337710be1f3022d49e2bcb681384959", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_families", "value": "ai_training_cluster" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "ai_training_cluster" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-baidu-baige-deepseek-p800-20250217", "title": "百度百舸 DeepSeek 一体机发布，支持昆仑芯 P800 单机 8 卡满血版开箱即用", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_e0a478ab-bfa4-425c-b9b5-a6d296f6c698", "source_type": "official_operator_product_release", "primary_status": "primary", "publication_date": "2025-02-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Launch/apply-for-trial and vendor deployment statements; no order, shipment, customer acceptance or independent workload receipt.", "Server OEM, CPU/memory/network BOM, cluster facility, exact card count, uptime and utilization are undisclosed." ] }, { "source_id": "src-baidu-p800-large-cluster-caict-claim-20250723", "title": "首家！AI算力最高评级！", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_377f7acf-07e4-4787-a0f5-d70671dd6f34", "source_type": "official_operator_news", "primary_status": "primary", "publication_date": "2025-07-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "CAICT report/certificate, test version, duration, sample, pass criteria and raw results were not retrieved.", "10,000- and 30,000-card terms are rounded vendor classes, not exact installed/qualified/utilized counts." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-baidu-cluster-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "operator": { "entity_id": "ent-baidu-cluster-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "location": "unknown", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": { "scope": "site, exact count and accelerator BOM unknown", "state": "rounded_vendor_class_not_exact_count", "unit": "accelerator_cards", "value": "30,000-card class" }, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-baidu-p800-30k-class-unknown-site", "foreign_dependencies": [], "id": "fac-baidu-p800-30k-class-unknown-site", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-baidu-cluster-owner-unresolved", "location": "unknown", "name": "Baidu self-developed 30,000-card-class cluster", "operator_entity_id": "ent-baidu-cluster-owner-unresolved", "process_families": [ "ai_training_cluster" ], "production_state": "powered_on_vendor_reported", "record_type": "facility", "source_ids": [ "src-baidu-p800-large-cluster-caict-claim-20250723" ], "unknowns": [ "legal owner/operator", "site", "accelerator BOM", "exact installed/active count", "SAT", "utilization", "uptime", "power/cooling", "network", "customers" ], "wafer_diameter": "not_applicable", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "e806cea41cb9ddeb9eacf2a796b95c843808497d6d07be8604a16be335f7ec6e", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_families", "value": "ai_training_cluster" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "ai_training_cluster" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-baidu-p800-large-cluster-caict-claim-20250723", "title": "首家！AI算力最高评级！", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_377f7acf-07e4-4787-a0f5-d70671dd6f34", "source_type": "official_operator_news", "primary_status": "primary", "publication_date": "2025-07-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "CAICT report/certificate, test version, duration, sample, pass criteria and raw results were not retrieved.", "10,000- and 30,000-card terms are rounded vendor classes, not exact installed/qualified/utilized counts." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-baidu-cluster-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "operator": { "entity_id": "ent-baidu-cluster-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "location": "unknown", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-ctyun-guangzhou6-resource-pool", "foreign_dependencies": [], "id": "fac-ctyun-guangzhou6-resource-pool", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-ctyun-resource-pool-owner-unresolved", "location": "Guangzhou 6; exact building and address undisclosed", "name": "Tianyi Cloud Guangzhou 6 resource pool", "operator_entity_id": "ent-tianyi-cloud-tech", "process_families": [ "cloud_compute", "ai_acceleration" ], "production_state": "online_cloud_service", "record_type": "facility", "source_ids": [ "src-ctyun-cambricon-cloud-20260703" ], "unknowns": [ "legal owner", "address", "hardware count", "power/cooling", "utilization", "tenants" ], "wafer_diameter": "not_applicable", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "86191a4deb8112395619ca6c655605f6fb9974b129ef5f574cc94518341b18fe", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "process_families", "value": "cloud_compute" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "cloud_compute" }, { "field": "process_families", "value": "ai_acceleration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-07-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-ctyun-resource-pool-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "operator": { "entity_id": "ent-tianyi-cloud-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Guangzhou 6; exact building and address undisclosed", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-ctyun-huabei2-resource-pool", "foreign_dependencies": [], "id": "fac-ctyun-huabei2-resource-pool", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-ctyun-resource-pool-owner-unresolved", "location": "North China 2; exact province, city, building and address undisclosed", "name": "Tianyi Cloud North China 2 resource pool", "operator_entity_id": "ent-tianyi-cloud-tech", "process_families": [ "cloud_compute", "ai_acceleration" ], "production_state": "online_cloud_service", "record_type": "facility", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "unknowns": [ "legal owner", "address", "hardware count", "power/cooling", "utilization", "tenants" ], "wafer_diameter": "not_applicable", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "707db7dd51f3dd15b7b346b9a4849bc2f2164ffdec74f491cfe542ec3e2bbfab", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "process_families", "value": "cloud_compute" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "cloud_compute" }, { "field": "process_families", "value": "ai_acceleration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-ctyun-resource-pool-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "operator": { "entity_id": "ent-tianyi-cloud-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "North China 2; exact province, city, building and address undisclosed", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-ctyun-shanghai36-resource-pool", "foreign_dependencies": [], "id": "fac-ctyun-shanghai36-resource-pool", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-ctyun-resource-pool-owner-unresolved", "location": "Shanghai 36; exact building and address undisclosed", "name": "Tianyi Cloud Shanghai 36 resource pool", "operator_entity_id": "ent-tianyi-cloud-tech", "process_families": [ "cloud_compute", "ai_acceleration" ], "production_state": "online_cloud_service", "record_type": "facility", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "unknowns": [ "legal owner", "address", "hardware count", "power/cooling", "utilization", "tenants" ], "wafer_diameter": "not_applicable", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "ca0736ee6304fdc8df2635b22b105d71b2b73fd5f38310273f61305f108bf590", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "process_families", "value": "cloud_compute" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "cloud_compute" }, { "field": "process_families", "value": "ai_acceleration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-ctyun-resource-pool-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "operator": { "entity_id": "ent-tianyi-cloud-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Shanghai 36; exact building and address undisclosed", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-cxmt-product-hefei-test", "foreign_dependencies": [], "id": "fac-cxmt-product-hefei-test", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-cxmt-product-hefei", "location": "8 Zipengshan Road, Feixi Economic Development Zone, Hefei, Anhui, China", "name": "ChangXin Storage Products (Hefei) DRAM test operation", "operator_entity_id": "ent-cxmt-product-hefei", "process_families": [ "dram_test" ], "production_state": "current_internal_test_function_disclosed_in_2026_filing", "record_type": "facility", "source_ids": [ "src-cxmt-sse-prospectus-2026" ], "unknowns": [ "test platforms", "ATE/probe vendors", "product allocation", "capacity", "utilization", "yield", "outsourced-test endpoints" ], "wafer_diameter": "not_applicable_or_unknown", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "6331b0f8cd1400bb1a0ccc71ef78c56c96076bf45620a858e462fde3c4194fd4", "stage_ids": [ "memory_manufacturer", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_families", "value": "dram_test" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_families", "value": "dram_test" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "dram_test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cxmt-sse-prospectus-2026", "title": "长鑫科技集团股份有限公司首次公开发行股票并在科创板上市招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202605/002170_20260527_23QQ.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-05-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The issuer names no packaging OSAT legal entity.", "The filing has no HBM literal hit and no HBM product, stack, facility, customer, qualification, yield or shipment receipt.", "Absence in this filing is not proof that no private R&D exists." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-cxmt-product-hefei", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "长鑫存储产品（合肥）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-cxmt-product-hefei", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "长鑫存储产品（合肥）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "8 Zipengshan Road, Feixi Economic Development Zone, Hefei, Anhui, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-dd-dongjun-hubei", "foreign_dependencies": [], "id": "fac-dd-dongjun-hubei", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-dd-dongjun-site-owner-unresolved", "location": "Hubei, China; city/address undisclosed", "name": "Hubei Dongjun Antora production-line site", "operator_entity_id": "ent-dd-dongjun-hubei", "process_families": [ "automotive_compute_platform_assembly" ], "production_state": "mass_production_line_vendor_reported", "record_type": "facility", "source_ids": [ "src-dd-auto-002", "src-dd-auto-003" ], "unknowns": [ "legal owner", "address", "line capacity", "accepted output", "yield", "chip/board BOM", "uptime" ], "wafer_diameter": "not_applicable", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "631dada9d4ac3f1058046b3127809ac646da1cab78a2e5f89bc1eee71b013add", "stage_ids": [ "assembly_test", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_families", "value": "automotive_compute_platform_assembly" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_families", "value": "automotive_compute_platform_assembly" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "automotive_compute_platform_assembly" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-002", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2023-09-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ] }, { "source_id": "src-dd-auto-003", "title": "安托拉1000 Pro量产交付相关政务记录", "publisher": "武汉经济技术开发区", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202309/t20230927_2272685.html", "source_type": "government_company_event_record", "primary_status": "primary", "publication_date": "2023-09-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Company-attributed government record, not an independent production audit." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-dd-dongjun-site-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "operator": { "entity_id": "ent-dd-dongjun-hubei", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "湖北东峻汽车电子科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Hubei, China; city/address undisclosed", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-dd-lynk-yuyao", "foreign_dependencies": [], "id": "fac-dd-lynk-yuyao", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-dd-lynk-yuyao-owner-unresolved", "location": "Yuyao, Zhejiang, China; address undisclosed", "name": "Lynk & Co Yuyao plant", "operator_entity_id": "ent-dd-lynk-yuyao-owner-unresolved", "process_families": [ "vehicle_assembly" ], "production_state": "first_delivery_event_endpoint", "record_type": "facility", "source_ids": [ "src-dd-auto-002", "src-dd-auto-003" ], "unknowns": [ "legal owner/operator", "line/trim", "accepted unit count", "vehicle shipments", "uptime" ], "wafer_diameter": "not_applicable", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "e68aae046a99f845e7b5ac2dbdf6913edbab794c4718cb69d3309c62eee47a93", "stage_ids": [ "assembly_test", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_families", "value": "vehicle_assembly" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_families", "value": "vehicle_assembly" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "vehicle_assembly" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-002", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2023-09-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ] }, { "source_id": "src-dd-auto-003", "title": "安托拉1000 Pro量产交付相关政务记录", "publisher": "武汉经济技术开发区", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202309/t20230927_2272685.html", "source_type": "government_company_event_record", "primary_status": "primary", "publication_date": "2023-09-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Company-attributed government record, not an independent production audit." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-dd-lynk-yuyao-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "operator": { "entity_id": "ent-dd-lynk-yuyao-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "location": "Yuyao, Zhejiang, China; address undisclosed", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": { "scope": "design target at full production", "unit": "exposure_optical_systems_per_year", "value": { "maximum": 20, "minimum": 15 } }, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-guowang-exposure-optics-base", "foreign_dependencies": [ "two awarded Hermle five-axis vertical machining centres; delivery/current-use state unknown" ], "id": "fac-guowang-exposure-optics-base", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-guowang-optics", "location": "Beijing Economic-Technological Development Area, Beijing, China", "name": "Guowang exposure-optics R&D and batch-production base", "operator_entity_id": "ent-guowang-optics", "process_families": [ "projection_lithography_exposure_optics" ], "production_state": "facility_reported_completed_and_put_into_production_2024", "record_type": "facility", "source_ids": [ "src-guowang-optics-base-2021", "src-guowang-base-production-2024", "src-guowang-hermle-award-2022" ], "unknowns": [ "actual output", "installed/qualified capacity", "customer", "scanner integration", "optical model", "yield", "service and spares" ], "wafer_diameter": "not_applicable", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "1590bab96170dab5c31ad8ae2bfa4640935577a5a053f23c3d508ffe2149b18d", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "process_families", "value": "projection_lithography_exposure_optics" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "projection_lithography_exposure_optics" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-guowang-optics-base-2021", "title": "投影光刻机曝光光学系统研发及批量生产基地项目", "publisher": "北京市公共资源交易服务平台", "url": "https://ggzyfw.beijing.gov.cn/jylcgcjs/20210114/1340589.html", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2021-01-14", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "15–20 systems/year is a design target, not installed, qualified or actual output." ] }, { "source_id": "src-guowang-base-production-2024", "title": "国望光学曝光光学系统基地竣工投产", "publisher": "国家科技创新中心", "url": "https://www.ncsti.gov.cn/kjdt/scyq/bjjjjskfq/jkdt/202402/t20240219_149260.html", "source_type": "government_industrial_update", "primary_status": "primary", "publication_date": "2024-02-19", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility state only; actual output, model, customer, scanner integration, qualification and yield are not disclosed." ] }, { "source_id": "src-guowang-hermle-award-2022", "title": "北京国望光学科技有限公司五轴立式加工中心项目评标结果公告", "publisher": "商务部机电产品招标投标电子交易平台", "url": "https://chinabidding.mofcom.gov.cn/bidDetail/bidding/bulletin/202206/ff8080817d94c145018145fd60755ec2.html", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2022-06-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Award does not prove delivery, installation, acceptance, current use, the exact optical part processed, service route or spares." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-guowang-optics", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京国望光学科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-guowang-optics", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京国望光学科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Beijing Economic-Technological Development Area, Beijing, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": [ { "scope": "cyclized-rubber broad-spectrum UV negative photoresist", "state": "vendor_description_not_exact_value", "unit": "tonnes_per_year", "value": "100-ton-class" }, { "scope": "negative-photoresist ancillary reagent", "state": "vendor_description_not_exact_value", "unit": "tonnes_per_year", "value": "1000-ton-class" }, { "scope": "G/I-line positive photoresist", "state": "vendor_reported_line_capacity", "unit": "tonnes_per_year", "value": 500 }, { "scope": "positive-photoresist ancillary reagent", "state": "vendor_reported_line_capacity", "unit": "tonnes_per_year", "value": 1000 }, { "scope": "248 nm photoresist", "state": "vendor_description_not_exact_value", "unit": "tonnes_per_year", "value": "100-ton-class" } ], "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "source_backed", "facility_id": "fac-kehua-shunyi-photoresist-base", "foreign_dependencies": [], "id": "fac-kehua-shunyi-photoresist-base", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-beijing-kehua", "location": "No. 4 Zhuyuan Road, Tianzhu Comprehensive Bonded Zone, Shunyi District, Beijing, China", "name": "Beijing Kehua / Kempur Shunyi photoresist base", "operator_entity_id": "ent-beijing-kehua", "process_families": [ "KrF_photoresist", "I_line_photoresist", "G_line_photoresist", "broad_spectrum_UV_photoresist", "photoresist_ancillary_reagent" ], "production_state": "company-described production base; current permit/installed/operating state unresolved", "record_type": "facility", "source_ids": [ "src-kehua-company-home-20260729", "src-kehua-icmtia-product-catalogue-2026", "src-icmtia-kehua-248nm-award-2021" ], "unknowns": [ "permit capacity", "installed/qualified capacity", "current operation", "actual output", "utilization", "model-to-line mapping", "named customer", "qualification", "yield", "resin/PAG/solvent/additive origins", "filters", "packaging", "metrology equipment" ], "wafer_diameter": "not_applicable", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "f970d4deb7c992c3ac32a3a1ac8f827bfd67c80a1e1e25dc86167d0a3827c7ee", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "process_families", "value": "KrF_photoresist" }, { "field": "process_families", "value": "I_line_photoresist" }, { "field": "process_families", "value": "G_line_photoresist" }, { "field": "process_families", "value": "broad_spectrum_UV_photoresist" }, { "field": "process_families", "value": "photoresist_ancillary_reagent" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_families", "value": "KrF_photoresist" }, { "field": "process_families", "value": "I_line_photoresist" }, { "field": "process_families", "value": "G_line_photoresist" }, { "field": "process_families", "value": "broad_spectrum_UV_photoresist" }, { "field": "process_families", "value": "photoresist_ancillary_reagent" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "KrF_photoresist" }, { "field": "process_families", "value": "I_line_photoresist" }, { "field": "process_families", "value": "G_line_photoresist" }, { "field": "process_families", "value": "broad_spectrum_UV_photoresist" }, { "field": "process_families", "value": "photoresist_ancillary_reagent" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_and_secondary", "source_refs": [ { "source_id": "src-kehua-company-home-20260729", "title": "北京科华微电子材料有限公司 — 关于我们 / Kempur home page", "publisher": "北京科华微电子材料有限公司", "url": "https://www.kempur.com/", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "indexed_direct_open_error", "limitations": [ "Direct page fetch returned an internal error; only the public search-indexed company-page text was recorded and no access control was bypassed.", "Line descriptions and address do not establish permit capacity, installed tools, current utilization, output, model-to-line mapping, named customer or qualification." ] }, { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] }, { "source_id": "src-icmtia-kehua-248nm-award-2021", "title": "“第二届集成电路材料奖”获奖名单颁布", "publisher": "中关村集成电路材料产业技术创新联盟", "url": "https://www.icmtia.com/news/647.html", "source_type": "industry_association_award_record", "primary_status": "secondary", "publication_date": "2021-11-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The award names Beijing Kehua and a 248 nm family, not an exact SKU, customer, fab, layer, lot, quantity, qualification date or independent process data." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "No. 4 Zhuyuan Road, Tianzhu Comprehensive Bonded Zone, Shunyi District, Beijing, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": { "scope": "high-bandwidth-storage-chiplet product design capacity", "source_literal": "3.6万片/年（200万块/年）", "values": [ { "unit": "片_per_year", "value": 36000 }, { "unit": "块_per_year", "value": 2000000 } ] }, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-nantong-tongfu-hbs-chiplet-line", "foreign_dependencies": [], "id": "fac-nantong-tongfu-hbs-chiplet-line", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-nantong-tongfu", "location": "3A factory, first floor, Nantong, Jiangsu, China", "name": "Nantong Tongfu high-bandwidth-storage-chiplet advanced-packaging line", "operator_entity_id": "ent-nantong-tongfu", "process_families": [ "seed_sputter", "plating", "temporary_bond", "thinning", "CMP", "dry_etch", "CVD", "backside_bump", "dicing", "interposer_attach", "nine_layer_stack", "molding", "laser_debond", "inspection_and_test" ], "production_state": "trial_production_not_environmentally_accepted_at_report_state", "record_type": "facility", "source_ids": [ "src-tongfu-hbs-change-analysis-2025", "src-tongfu-annual-2025" ], "unknowns": [ "片/块 unit reconciliation", "installed/qualified capacity", "actual output", "DRAM die owner", "base die/PHY", "TSV", "KGD", "customer", "accelerator", "repair", "qualification", "yield", "shipment", "tool models/vendors" ], "wafer_diameter": "unknown", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "5f6360259669e599732e39986806b89716919d0f2c501b3bb97292dbbe9fd8bf", "stage_ids": [ "wafer_equipment", "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_families", "value": "dry_etch" }, { "field": "process_families", "value": "CVD" }, { "field": "process_families", "value": "inspection_and_test" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_families", "value": "thinning" }, { "field": "process_families", "value": "interposer_attach" }, { "field": "process_families", "value": "molding" }, { "field": "process_families", "value": "laser_debond" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_families", "value": "inspection_and_test" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "seed_sputter" }, { "field": "process_families", "value": "plating" }, { "field": "process_families", "value": "temporary_bond" }, { "field": "process_families", "value": "thinning" }, { "field": "process_families", "value": "CMP" }, { "field": "process_families", "value": "dry_etch" }, { "field": "process_families", "value": "CVD" }, { "field": "process_families", "value": "backside_bump" }, { "field": "process_families", "value": "dicing" }, { "field": "process_families", "value": "interposer_attach" }, { "field": "process_families", "value": "nine_layer_stack" }, { "field": "process_families", "value": "molding" }, { "field": "process_families", "value": "laser_debond" }, { "field": "process_families", "value": "inspection_and_test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-tongfu-hbs-change-analysis-2025", "title": "南通通富微电子有限公司高带宽存储芯粒先进封装技术研发和产线建设项目一般变动环境影响分析", "publisher": "南通通富微电子有限公司", "url": "https://omo-oss-file110.thefastfile.com/portal-saas/pg2025022515115656448/cms/file/南通通富微电子一般变动环境影响分析报告.pdf", "source_type": "environmental_impact_analysis", "primary_status": "primary", "publication_date": "2025-06-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The source never uses HBM and names no DRAM die owner, base die/PHY, customer or accelerator.", "The 片/块 capacity-unit mapping requires reconciliation; both are design capacity, not qualified or actual output.", "Tool counts are disclosed but models and vendors are not." ] }, { "source_id": "src-tongfu-annual-2025", "title": "通富微电子股份有限公司2025年年度报告", "publisher": "通富微电子股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-17/1225112762.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Two high-bandwidth-memory references are industry context; no named HBM product, customer, qualification, yield or shipment." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-nantong-tongfu", "record_level": "company", "canonical_legal_name_en": "Nantong TongFu Microelectronics Co., Ltd.", "canonical_legal_name_cn": "南通通富微电子有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-nantong-tongfu", "record_level": "company", "canonical_legal_name_en": "Nantong TongFu Microelectronics Co., Ltd.", "canonical_legal_name_cn": "南通通富微电子有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "3A factory, first floor, Nantong, Jiangsu, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-rslaser-yizhuang-base", "foreign_dependencies": [], "id": "fac-rslaser-yizhuang-base", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-rslaser", "location": "Hexi X6-1M3, Beijing Economic-Technological Development Area, Beijing, China", "name": "RSLaser Yizhuang lithography-light-source manufacturing and refurbishment base", "operator_entity_id": "ent-rslaser", "process_families": [ "excimer_laser_light_source", "light_source_refurbishment" ], "production_state": "project_registered; completion and output unknown", "record_type": "facility", "source_ids": [ "src-rslaser-yizhuang-project-2021" ], "unknowns": [ "construction completion", "installed capacity", "actual output", "customer", "scanner integration", "qualified use" ], "wafer_diameter": "not_applicable", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "8a929454240dba54baf678fb4eed7f7fe440f1ace6093479a7cb44647a1f0ab0", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "process_families", "value": "excimer_laser_light_source" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "excimer_laser_light_source" }, { "field": "process_families", "value": "light_source_refurbishment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-rslaser-yizhuang-project-2021", "title": "科益虹源集成电路光刻光源制造及翻新基地（北京亦庄研发基地）项目", "publisher": "北京市公共资源交易服务平台", "url": "https://ggzyfw.beijing.gov.cn/jylcgcjs/20210910/2058109.html", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2021-09-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Project registration is not construction completion, installed capacity, output, customer delivery or scanner integration." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-rslaser", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科益虹源光电技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-rslaser", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科益虹源光电技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Hexi X6-1M3, Beijing Economic-Technological Development Area, Beijing, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "volume_backed", "facility_id": "fac-samsung-xian-nand", "foreign_dependencies": [], "id": "fac-samsung-xian-nand", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-samsung-china-semiconductor", "location": "Xi'an, Shaanxi, China", "name": "Samsung Xi'an memory facility", "operator_entity_id": "ent-samsung-china-semiconductor", "process_families": [ "3d_nand" ], "production_state": "full_scale_manufacturing_announced_2014", "record_type": "facility", "source_ids": [ "src-samsung-xian-operation-2014" ], "unknowns": [ "current generation", "capacity", "utilization", "output", "yield", "local supplier share" ], "wafer_diameter": "unknown", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "2c33c89fb7d93b12bebc7ee409ac5df8b0c954872b5fc6f3e065f63d318a499c", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_families", "value": "3d_nand" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "3d_nand" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-samsung-xian-operation-2014", "title": "Samsung Announces Operation of Its Memory Facility in Xi'an, China", "publisher": "Samsung Electronics", "url": "https://news.samsung.com/global/samsung-announces-operation-of-its-memory-facility-in-xian-china", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2014-05-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical start receipt; current capacity, generation, utilization, supplier mix, and export-control exposure require later sources." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-samsung-china-semiconductor", "record_level": "company", "canonical_legal_name_en": "Samsung (China) Semiconductor Co., Ltd.", "canonical_legal_name_cn": "三星（中国）半导体有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-samsung-china-semiconductor", "record_level": "company", "canonical_legal_name_en": "Samsung (China) Semiconductor Co., Ltd.", "canonical_legal_name_cn": "三星（中国）半导体有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Xi'an, Shaanxi, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": { "period": "2025-H1", "unit": "300mm_wafers", "value": 298400 }, "designed": { "scope": "two-line total project plan; phase I plan 40,000", "unit": "300mm_wafers_per_month", "value": 80000 }, "installed": null, "licensed": null, "qualified": null, "utilized": { "denominator": null, "period": "2025-H1", "value": "full_load_statement" } }, "completion_state": "volume_backed", "facility_id": "fac-silan-jike-12in", "foreign_dependencies": [], "id": "fac-silan-jike-12in", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-silan-jike", "location": "89 Lanying Road, Haicang District, Xiamen, Fujian, China", "name": "Xiamen Silan Jike 12-inch specialty-process fab", "operator_entity_id": "ent-silan-jike", "process_families": [ "90nm_stated_phase1", "specialty_process", "IGBT", "analog" ], "production_state": "volume_production; full-load statement for 2025-H1", "record_type": "facility", "source_ids": [ "src-silan-jike-company-profile", "src-silan-jike-production-start-2020", "src-silan-jike-h1-2025", "src-kingsemi-silan-jike-krf-2022" ], "unknowns": [ "installed capacity", "qualified capacity", "utilization percentage denominator", "good-wafer output", "electrical yield", "complete tool/material BOM" ], "wafer_diameter": "300 mm", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "4b53773caaa1a211f195304c97769cdfd9511186c4e451f219de608ef64c20e8", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_families", "value": "specialty_process" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "90nm_stated_phase1" }, { "field": "process_families", "value": "specialty_process" }, { "field": "process_families", "value": "IGBT" }, { "field": "process_families", "value": "analog" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-silan-jike-company-profile", "title": "子公司-厦门士兰集科微电子有限公司", "publisher": "杭州士兰微电子股份有限公司", "url": "https://www.silan.com.cn/index.php/about/info/246.html", "source_type": "company_subsidiary_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The 40,000/80,000 wafers-per-month figures are project plans, not installed, qualified or actual-output capacity." ] }, { "source_id": "src-silan-jike-production-start-2020", "title": "士兰集科12英寸特色工艺芯片生产线正式投产", "publisher": "杭州士兰微电子股份有限公司", "url": "https://www.silan.com.cn/index.php/news/details/78.html", "source_type": "company_facility_announcement", "primary_status": "primary", "publication_date": "2020-12-21", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The stated 40,000 wafers/month is planned phase capacity; no yield or actual-output receipt is supplied." ] }, { "source_id": "src-silan-jike-h1-2025", "title": "士兰微电子2025年半年度报告精读", "publisher": "杭州士兰微电子股份有限公司", "url": "https://www.silan.com.cn/index.php/news/details/260.html", "source_type": "company_operating_update", "primary_status": "primary", "publication_date": "2025-08-01", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Full load is not a disclosed utilization percentage; output is total wafers, not good-die output or yield." ] }, { "source_id": "src-kingsemi-silan-jike-krf-2022", "title": "同“芯”聚力，共创辉煌——沈阳芯源KrF涂胶显影机台入驻士兰集科暨双方达成战略合作关系", "publisher": "沈阳芯源微电子设备股份有限公司", "url": "https://www.kingsemi.com/index.php/News/detail?id=160", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2022-06-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No model, serial, purchase record, installation completion, site acceptance, named layer, throughput, uptime or yield is disclosed." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-silan-jike", "record_level": "company", "canonical_legal_name_en": "Xiamen Silan Jike Microelectronics Co., Ltd.", "canonical_legal_name_cn": "厦门士兰集科微电子有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-silan-jike", "record_level": "company", "canonical_legal_name_en": "Xiamen Silan Jike Microelectronics Co., Ltd.", "canonical_legal_name_cn": "厦门士兰集科微电子有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "89 Lanying Road, Haicang District, Xiamen, Fujian, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "volume_backed", "facility_id": "fac-skhynix-dalian-nand", "foreign_dependencies": [ "U.S.-controlled chipmaking-tool export approvals for 2026" ], "id": "fac-skhynix-dalian-nand", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-skhynix-dalian", "location": "Dalian, Liaoning, China", "name": "Dalian NAND fab", "operator_entity_id": "ent-skhynix-dalian", "process_families": [ "nand" ], "production_state": "current_group_owned_and_operated_nand_fab_as_of_2026_03_31", "record_type": "facility", "source_ids": [ "src-skhynix-dalian-acquisition-2021", "src-skhynix-f1-facilities-2026", "src-skhynix-official-network-2026", "src-skhynix-sec-subsidiaries-2026", "src-liaoning-skhynix-dalian-2026" ], "unknowns": [ "immediate legal-title chain", "generation", "wafer capacity", "facility-specific utilization denominator", "actual output", "yield", "supplier BOM", "covered export-license tool models and service scope" ], "wafer_diameter": "unknown", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "fba5d034904aa1b3a0481d4ce209ed183c52a4cc61ce15725252435a4f380df1", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_families", "value": "nand" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "nand" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-skhynix-dalian-acquisition-2021", "title": "SK hynix Completes the First Phase of Intel NAND and SSD Business Acquisition", "publisher": "SK hynix", "url": "https://news.skhynix.com/sk-hynix-completes-the-first-phase-of-intel-nand-and-ssd-business-acquisition/", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2021-12-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Acquisition receipt does not provide current capacity, product generation, yield, utilization, or local supplier share." ] }, { "source_id": "src-skhynix-f1-facilities-2026", "title": "SK hynix Inc. Form F-1 Registration Statement", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785df1.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing identifies C2/C2F DRAM and Dalian NAND and states group-wide full utilization, but does not disclose facility wafer capacity, node, output, yield, tool fleet or supplier BOM.", "Parent-level owns/operates language does not by itself resolve immediate local legal-title chains." ] }, { "source_id": "src-skhynix-official-network-2026", "title": "Global Network", "publisher": "SK hynix Inc.", "url": "https://www.skhynix.com/company/UI-FR-CP06/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page identifies the Wuxi production-site legal entity and a Dalian legal entity/address; it does not disclose capacity, process generation, output, yield, tools or materials." ] }, { "source_id": "src-skhynix-sec-subsidiaries-2026", "title": "List of Subsidiaries of SK hynix Inc.", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785dex211.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Subsidiary list proves consolidated legal-entity inclusion, not immediate ownership percentage or the legal title holder for each fab parcel and tool set." ] }, { "source_id": "src-liaoning-skhynix-dalian-2026", "title": "3000余岗位助力大学生留辽来辽", "publisher": "辽宁省人民政府", "url": "https://www.ln.gov.cn/web/qmzx/yhyshjzt/dt/2026061509212657810/index.shtml", "source_type": "government_employment_record", "primary_status": "primary", "publication_date": "2026-06-15", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The government record confirms the current Chinese legal name only; it does not identify fab title, capacity, product generation, utilization, output, yield or supplier BOM." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-skhynix-dalian", "record_level": "company", "canonical_legal_name_en": "SK hynix semiconductor storage technology (Dalian) Co., Ltd.", "canonical_legal_name_cn": "爱思开海力士半导体存储技术（大连）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-skhynix-dalian", "record_level": "company", "canonical_legal_name_en": "SK hynix semiconductor storage technology (Dalian) Co., Ltd.", "canonical_legal_name_cn": "爱思开海力士半导体存储技术（大连）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Dalian, Liaoning, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "volume_backed", "facility_id": "fac-skhynix-wuxi-c2", "foreign_dependencies": [ "SK hynix parent technology, process IP, equipment, materials and service boundary; detailed BOM undisclosed", "U.S.-controlled chipmaking-tool export approvals for 2026" ], "id": "fac-skhynix-wuxi-c2", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-skhynix-wuxi-operator-unresolved", "location": "Wuxi, Jiangsu, China", "name": "SK hynix Wuxi C2", "operator_entity_id": "ent-skhynix-wuxi-operator-unresolved", "process_families": [ "dram" ], "production_state": "current_group_owned_and_operated_dram_fab_as_of_2026_03_31", "record_type": "facility", "source_ids": [ "src-skhynix-wuxi-c2f-2019", "src-skhynix-f1-facilities-2026", "src-skhynix-official-network-2026", "src-wuxi-skhynix-environment-2025" ], "unknowns": [ "immediate legal-title chain", "node/generation", "installed capacity", "facility-specific utilization denominator", "actual output", "yield", "supplier BOM", "covered export-license tool models and service scope" ], "wafer_diameter": "300 mm", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "344b9f06a5ee7e1c7906852b1075b3d27776eeb0936fd9b4c67731002351746c", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_families", "value": "dram" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "dram" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-skhynix-wuxi-c2f-2019", "title": "SK hynix Completes Expanded Fab (C2F) in Wuxi, China", "publisher": "SK hynix Inc.", "url": "https://news.skhynix.com/en/sk-hynix-completes-expanded-fab-c2f-in-wuxi-china/", "source_type": "company_facility_announcement", "primary_status": "primary", "publication_date": "2019-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical announcement does not prove 2026 legal operator, capacity, technology, utilization, yield, product mix or ownership-chain changes." ] }, { "source_id": "src-skhynix-f1-facilities-2026", "title": "SK hynix Inc. Form F-1 Registration Statement", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785df1.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing identifies C2/C2F DRAM and Dalian NAND and states group-wide full utilization, but does not disclose facility wafer capacity, node, output, yield, tool fleet or supplier BOM.", "Parent-level owns/operates language does not by itself resolve immediate local legal-title chains." ] }, { "source_id": "src-skhynix-official-network-2026", "title": "Global Network", "publisher": "SK hynix Inc.", "url": "https://www.skhynix.com/company/UI-FR-CP06/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page identifies the Wuxi production-site legal entity and a Dalian legal entity/address; it does not disclose capacity, process generation, output, yield, tools or materials." ] }, { "source_id": "src-wuxi-skhynix-environment-2025", "title": "SK海力士半导体（中国）有限公司固体（危险）废物跨省转移审核意见的公告", "publisher": "无锡市新吴生态环境局", "url": "https://www.wnd.gov.cn/doc/2025/12/25/4706975.shtml", "source_type": "government_environmental_record", "primary_status": "primary", "publication_date": "2025-12-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Waste-transfer approval proves current entity/site identity, not DRAM generation, fab capacity, utilization, output, yield or production-tool qualification." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-skhynix-wuxi-operator-unresolved", "record_level": "company", "canonical_legal_name_en": "SK hynix Semiconductor (China) Ltd.", "canonical_legal_name_cn": "SK海力士半导体（中国）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-skhynix-wuxi-operator-unresolved", "record_level": "company", "canonical_legal_name_en": "SK hynix Semiconductor (China) Ltd.", "canonical_legal_name_cn": "SK海力士半导体（中国）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Wuxi, Jiangsu, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "volume_backed", "facility_id": "fac-skhynix-wuxi-c2f", "foreign_dependencies": [ "SK hynix parent technology, process IP, equipment, materials and service boundary; detailed BOM undisclosed", "U.S.-controlled chipmaking-tool export approvals for 2026" ], "id": "fac-skhynix-wuxi-c2f", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-skhynix-wuxi-operator-unresolved", "location": "Wuxi, Jiangsu, China", "name": "SK hynix Wuxi C2F expansion", "operator_entity_id": "ent-skhynix-wuxi-operator-unresolved", "process_families": [ "dram" ], "production_state": "current_group_owned_and_operated_dram_fab_as_of_2026_03_31", "record_type": "facility", "source_ids": [ "src-skhynix-wuxi-c2f-2019", "src-skhynix-f1-facilities-2026", "src-skhynix-official-network-2026", "src-wuxi-skhynix-environment-2025" ], "unknowns": [ "immediate legal-title chain", "node/generation", "installed capacity", "qualified capacity", "facility-specific utilization denominator", "actual output", "yield", "supplier BOM", "covered export-license tool models and service scope" ], "wafer_diameter": "300 mm", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "e1c1e5969e139d04b9bf9e1091530ee66775f424def1bc9d6d752e016cdfbcd4", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_families", "value": "dram" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "dram" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-skhynix-wuxi-c2f-2019", "title": "SK hynix Completes Expanded Fab (C2F) in Wuxi, China", "publisher": "SK hynix Inc.", "url": "https://news.skhynix.com/en/sk-hynix-completes-expanded-fab-c2f-in-wuxi-china/", "source_type": "company_facility_announcement", "primary_status": "primary", "publication_date": "2019-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical announcement does not prove 2026 legal operator, capacity, technology, utilization, yield, product mix or ownership-chain changes." ] }, { "source_id": "src-skhynix-f1-facilities-2026", "title": "SK hynix Inc. Form F-1 Registration Statement", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785df1.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing identifies C2/C2F DRAM and Dalian NAND and states group-wide full utilization, but does not disclose facility wafer capacity, node, output, yield, tool fleet or supplier BOM.", "Parent-level owns/operates language does not by itself resolve immediate local legal-title chains." ] }, { "source_id": "src-skhynix-official-network-2026", "title": "Global Network", "publisher": "SK hynix Inc.", "url": "https://www.skhynix.com/company/UI-FR-CP06/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page identifies the Wuxi production-site legal entity and a Dalian legal entity/address; it does not disclose capacity, process generation, output, yield, tools or materials." ] }, { "source_id": "src-wuxi-skhynix-environment-2025", "title": "SK海力士半导体（中国）有限公司固体（危险）废物跨省转移审核意见的公告", "publisher": "无锡市新吴生态环境局", "url": "https://www.wnd.gov.cn/doc/2025/12/25/4706975.shtml", "source_type": "government_environmental_record", "primary_status": "primary", "publication_date": "2025-12-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Waste-transfer approval proves current entity/site identity, not DRAM generation, fab capacity, utilization, output, yield or production-tool qualification." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-skhynix-wuxi-operator-unresolved", "record_level": "company", "canonical_legal_name_en": "SK hynix Semiconductor (China) Ltd.", "canonical_legal_name_cn": "SK海力士半导体（中国）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-skhynix-wuxi-operator-unresolved", "record_level": "company", "canonical_legal_name_en": "SK hynix Semiconductor (China) Ltd.", "canonical_legal_name_cn": "SK海力士半导体（中国）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Wuxi, Jiangsu, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": { "scope": "project nominal annual capacity", "unit": "cmp_pads_per_year", "value": 250000 }, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "volume_backed", "facility_id": "fac-tongcheng-changzhou-cmp-pad", "foreign_dependencies": [], "id": "fac-tongcheng-changzhou-cmp-pad", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-tongcheng-electronic-materials-changzhou", "location": "Huachuang Zhigu, Hualuogeng High-Tech Zone, Jintan District, Changzhou, Jiangsu, China; project area 4,421 m²", "name": "Tongcheng Electronic Materials (Changzhou) advanced CMP-pad project", "operator_entity_id": "ent-tongcheng-electronic-materials-changzhou", "process_families": [ "cmp_pads_for_200mm_and_300mm_wafer_fabs" ], "production_state": "construction_completed_and_put_into_production; batch production and stable delivery issuer-reported", "record_type": "facility", "source_ids": [ "src-red-avenue-annual-2025", "src-jintan-tongcheng-cmp-project-2024" ], "unknowns": [ "street address", "installed capacity", "qualified capacity", "actual output", "utilization", "pad SKUs", "slurry pairings", "named fabs", "qualification dates", "yield effect", "polyurethane/precursor and equipment origins" ], "wafer_diameter": "not_applicable", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "af84f8d0d364a20a0368640415f7f1a15348622f5ed4f90b3f9288a1ebcd2536", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_families", "value": "cmp_pads_for_200mm_and_300mm_wafer_fabs" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "cmp_pads_for_200mm_and_300mm_wafer_fabs" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] }, { "source_id": "src-jintan-tongcheng-cmp-project-2024", "title": "华罗庚高新区：从“0”到“1” 打造半导体产业“芯”高地", "publisher": "常州市金坛区人民政府 / 华罗庚高新区", "url": "https://www.jintan.gov.cn/html/czjt/2024/IJMJQALL_1118/267619.html", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2024-11-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The 250,000 pads/year figure was a designed full-rate target at that date, not installed, qualified, utilized or actual output." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-tongcheng-electronic-materials-changzhou", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "彤程电子材料（常州）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-tongcheng-electronic-materials-changzhou", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "彤程电子材料（常州）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Huachuang Zhigu, Hualuogeng High-Tech Zone, Jintan District, Changzhou, Jiangsu, China; project area 4,421 m²", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": [ { "scope": "photoresist upstream resins, aggregate", "state": "government_approved_project_design", "unit": "tonnes_per_year", "value": 1450 }, { "scope": "electronic-grade formaldehyde", "state": "government_approved_project_design", "unit": "tonnes_per_year", "value": 1500 } ], "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-tongcheng-chemical-shanghai-resin", "foreign_dependencies": [], "id": "fac-tongcheng-chemical-shanghai-resin", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-tongcheng-chemical-china", "location": "Existing site, 66 North Yinhe Road, Shanghai Chemical Industry Park, Shanghai, China", "name": "Tongcheng Chemical photoresist-upstream-resin and electronic-grade-formaldehyde project", "operator_entity_id": "ent-tongcheng-chemical-china", "process_families": [ "cresol_formaldehyde_resin", "PHS_resin", "acrylic_resin", "electronic_grade_formaldehyde" ], "production_state": "six resin lines issuer-reported accepted in 2025; acceptance type and electronic-formaldehyde-line state unresolved", "record_type": "facility", "source_ids": [ "src-red-avenue-annual-2025", "src-scip-tongcheng-resin-energy-review-2025", "src-redavenue-subsidiaries-guarantee-2025" ], "unknowns": [ "capacity by resin type", "installed/qualified capacity", "electronic-formaldehyde line acceptance", "actual output", "utilization", "customer qualification", "yield", "monomer/catalyst origins", "purification equipment", "filters" ], "wafer_diameter": "not_applicable", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "a41dd398512fe28ba2fc6199eec8928e60530f0312c73a393ce6eef63eb5989b", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_families", "value": "cresol_formaldehyde_resin" }, { "field": "process_families", "value": "electronic_grade_formaldehyde" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "cresol_formaldehyde_resin" }, { "field": "process_families", "value": "PHS_resin" }, { "field": "process_families", "value": "acrylic_resin" }, { "field": "process_families", "value": "electronic_grade_formaldehyde" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] }, { "source_id": "src-scip-tongcheng-resin-energy-review-2025", "title": "上海化学工业区管理委员会关于彤程化学（中国）有限公司光刻胶上游树脂及电子甲醛项目节能报告的审查意见", "publisher": "上海化学工业区管理委员会", "url": "https://www.scip.gov.cn/govxxgk/jjfzc/2025-01-17/3ca523a9-c4da-4e50-a029-cdb960d5101c.html", "source_type": "government_energy_review", "primary_status": "primary", "publication_date": "2025-01-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Energy-review approval proves applicant, site, planned line count and design output, not construction completion, production, customer qualification or shipment." ] }, { "source_id": "src-redavenue-subsidiaries-guarantee-2025", "title": "彤程新材料集团股份有限公司关于年度预计融资担保进展的公告", "publisher": "彤程新材料集团股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2025-04/03/content_2044624.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Registered residences are legal-entity addresses and are not automatically the same as every manufacturing site." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-tongcheng-chemical-china", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "彤程化学（中国）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-tongcheng-chemical-china", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "彤程化学（中国）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Existing site, 66 North Yinhe Road, Shanghai Chemical Industry Park, Shanghai, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": [ { "scope": "semiconductor photoresist", "state": "approved_capacity_explicitly_defined_as_design_capacity", "unit": "tonnes_per_year", "value": 1000 }, { "scope": "high-purity solvent", "state": "approved_capacity_explicitly_defined_as_design_capacity", "unit": "tonnes_per_year", "value": 18800 } ], "installed": null, "licensed": null, "qualified": null, "utilized": [ { "period": "2025", "scope": "semiconductor photoresist", "unit": "percent", "value": 21.5 }, { "period": "2025", "scope": "high-purity solvent", "unit": "percent", "value": 7.2 } ] }, "completion_state": "facility_backed", "facility_id": "fac-tongcheng-electronic-photoresist-solvent", "foreign_dependencies": [], "id": "fac-tongcheng-electronic-photoresist-solvent", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-tongcheng-electronic-materials-shanghai", "location": "Shanghai Chemical Industry Park, Shanghai, China; exact street/plot for this factory unresolved", "name": "Tongcheng Electronic semiconductor photoresist and high-purity-solvent factory", "operator_entity_id": "ent-tongcheng-electronic-materials-shanghai", "process_families": [ "semiconductor_photoresist", "high_purity_solvent_ebr" ], "production_state": "operating; approved capacity and utilization disclosed for 2025", "record_type": "facility", "source_ids": [ "src-red-avenue-annual-2025", "src-redavenue-subsidiaries-guarantee-2025" ], "unknowns": [ "street address", "installed capacity", "qualified capacity", "actual output by product/grade", "yield", "customer legal entities", "tool and precursor BOM", "foreign dependencies", "second sources" ], "wafer_diameter": "not_applicable", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "f182855e399cf71b413eab8b37fd00838b3cc2206064d9a3d394321a9006c44e", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "process_families", "value": "semiconductor_photoresist" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_families", "value": "semiconductor_photoresist" }, { "field": "process_families", "value": "high_purity_solvent_ebr" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "semiconductor_photoresist" }, { "field": "process_families", "value": "high_purity_solvent_ebr" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] }, { "source_id": "src-redavenue-subsidiaries-guarantee-2025", "title": "彤程新材料集团股份有限公司关于年度预计融资担保进展的公告", "publisher": "彤程新材料集团股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2025-04/03/content_2044624.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Registered residences are legal-entity addresses and are not automatically the same as every manufacturing site." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-tongcheng-electronic-materials-shanghai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海彤程电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-tongcheng-electronic-materials-shanghai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海彤程电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Shanghai Chemical Industry Park, Shanghai, China; exact street/plot for this factory unresolved", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-tsmc-nanjing-fab16", "foreign_dependencies": [ "U.S.-controlled equipment export approvals" ], "id": "fac-tsmc-nanjing-fab16", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-tsmc-nanjing", "location": "Nanjing, Jiangsu, China", "name": "TSMC Fab 16", "operator_entity_id": "ent-tsmc-nanjing", "process_families": [ "foundry" ], "production_state": "listed_operating_facility", "record_type": "facility", "source_ids": [ "src-tsmc-annual-2025" ], "unknowns": [ "installed", "qualified", "utilized and actual output", "supplier BOM" ], "wafer_diameter": "300 mm", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "5b0e6205255739c1f4efae7abf412e284a28f9527474f51a237844a0a46ccb9a", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_families", "value": "foundry" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "foundry" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-tsmc-annual-2025", "title": "TSMC 2025 Annual Report", "publisher": "Taiwan Semiconductor Manufacturing Company Limited", "url": "https://investor.tsmc.com/sites/ir/annual-report/2025/2025%20Annual%20Report_E.pdf", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility listing does not by itself establish current tool BOM, local-supplier share, customers, utilization, or output." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-tsmc-nanjing", "record_level": "company", "canonical_legal_name_en": "TSMC (Nanjing) Company Limited", "canonical_legal_name_cn": "台积电（南京）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-tsmc-nanjing", "record_level": "company", "canonical_legal_name_en": "TSMC (Nanjing) Company Limited", "canonical_legal_name_cn": "台积电（南京）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Nanjing, Jiangsu, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-tsmc-shanghai-fab10", "foreign_dependencies": [ "U.S.-controlled equipment export approvals" ], "id": "fac-tsmc-shanghai-fab10", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-tsmc-china", "location": "Shanghai, China", "name": "TSMC Fab 10", "operator_entity_id": "ent-tsmc-china", "process_families": [ "foundry" ], "production_state": "listed_operating_facility", "record_type": "facility", "source_ids": [ "src-tsmc-annual-2025" ], "unknowns": [ "installed", "qualified", "utilized and actual output", "supplier BOM" ], "wafer_diameter": "200 mm", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "88650d2486b08f33fb37a6a821b0c578b124ea08495a6ec54f77c72639c22eae", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_families", "value": "foundry" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "foundry" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-tsmc-annual-2025", "title": "TSMC 2025 Annual Report", "publisher": "Taiwan Semiconductor Manufacturing Company Limited", "url": "https://investor.tsmc.com/sites/ir/annual-report/2025/2025%20Annual%20Report_E.pdf", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility listing does not by itself establish current tool BOM, local-supplier share, customers, utilization, or output." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-tsmc-china", "record_level": "company", "canonical_legal_name_en": "TSMC (China) Company Limited", "canonical_legal_name_cn": "台积电（中国）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-tsmc-china", "record_level": "company", "canonical_legal_name_en": "TSMC (China) Company Limited", "canonical_legal_name_cn": "台积电（中国）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Shanghai, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": { "scope": "when fully equipped", "unit": "300mm_wafers_per_month", "value": 50000 }, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "volume_backed", "facility_id": "fac-united-semi-xiamen", "foreign_dependencies": [], "id": "fac-united-semi-xiamen", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-united-semi-xiamen", "location": "Xiamen, Fujian, China", "name": "United Semiconductor Xiamen", "operator_entity_id": "ent-united-semi-xiamen", "process_families": [ "foundry", "28nm" ], "production_state": "volume_production_since_2016", "record_type": "facility", "source_ids": [ "src-umc-fab-information" ], "unknowns": [ "current installed capacity", "utilization", "actual output", "yield", "customer mix", "supplier BOM" ], "wafer_diameter": "300 mm", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "6828f75aa6d0e0ed7c8d63b7fc5edaef4d3bc11d201c99324e9bc0a5414ebce1", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_families", "value": "foundry" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "foundry" }, { "field": "process_families", "value": "28nm" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-umc-fab-information", "title": "Fab Information", "publisher": "United Microelectronics Corporation", "url": "https://www.umc.com/en/Html/fab_information", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Designed capacity is not current installed, utilized, actual output, yield, or customer mix." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-united-semi-xiamen", "record_level": "company", "canonical_legal_name_en": "United Semiconductor (Xiamen) Co., Ltd.", "canonical_legal_name_cn": "联芯集成电路制造（厦门）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-united-semi-xiamen", "record_level": "company", "canonical_legal_name_en": "United Semiconductor (Xiamen) Co., Ltd.", "canonical_legal_name_cn": "联芯集成电路制造（厦门）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Xiamen, Fujian, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "claim_ceiling": "The construction entity, project, address, cleanroom award and award value are proven. Contract signature, installation, acceptance, fab capacity, product generation and production are not.", "completion_state": "facility_backed", "facility_id": "fac-util-cxmt-phase2", "foreign_dependencies": [ "unknown; no cleanroom-system component BOM or origin record disclosed" ], "id": "fac-util-cxmt-phase2", "last_checked": "2026-07-29", "latest_dated_source": "src-util-001", "legal_owner_entity_id": "ent-util-changxin-xinqiao", "location": "Hefei Airport Economic Demonstration Zone, Anhui, China", "name": "12-inch memory-wafer manufacturing base Phase II", "operator_entity_id": "ent-util-changxin-xinqiao", "ownership_class": "mainland_location_ownership_unresolved", "ownership_evidence_ceiling": "Named project/construction entity; real-property title and current operating state remain unresolved unless separately stated.", "process_families": [ "12-inch memory wafer fabrication" ], "production_state": "cleanroom-package award announced; formal contract pending at source date", "project_scale": null, "record_type": "facility", "source_ids": [ "src-util-001" ], "unknowns": [ "real-property title where not expressly disclosed", "current operator state", "installed capacity", "qualified capacity", "actual output", "utilization", "yield", "complete equipment/material/component BOM and origins" ], "wafer_diameter": "300 mm", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "578747498fe862227a2eade2a492f196b12ff3170a357db2b069013aade233c6", "stage_ids": [ "logic_foundry_process", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_families", "value": "12-inch memory wafer fabrication" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_families", "value": "12-inch memory wafer fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "12-inch memory wafer fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-001", "title": "亚翔系统集成科技（苏州）股份有限公司关于公司重大项目中标的公告", "publisher": "亚翔系统集成科技（苏州）股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2024-02/06/content_1875556.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2024-02-06", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The issuer expressly says a formal project contract still had to be signed and construction, settlement and payment details remained subject to that contract." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-util-changxin-xinqiao", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "长鑫新桥存储技术有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-util-changxin-xinqiao", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "长鑫新桥存储技术有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Hefei Airport Economic Demonstration Zone, Anhui, China", "ownership_class": "mainland_location_ownership_unresolved", "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "claim_ceiling": "Site, building area, 12-inch specialty-process line and signed EPC scopes are proven. No construction completion, acceptance, tool installation, production qualification, capacity, yield or output is proven.", "completion_state": "facility_backed", "facility_id": "fac-util-huahong-wuxi-project", "foreign_dependencies": [ "The contract disclosure says the technology platform would combine independent development with appropriate introduction, but does not identify imported equipment, materials, IP, software or service." ], "id": "fac-util-huahong-wuxi-project", "last_checked": "2026-07-29", "latest_dated_source": "src-util-002", "legal_owner_entity_id": "ent-util-huahong-wuxi", "location": "30-1 Xinzhou Road, Xinwu District, Wuxi, Jiangsu, China", "name": "Hua Hong Manufacturing (Wuxi) project", "operator_entity_id": "ent-util-huahong-wuxi", "ownership_class": "mainland_location_ownership_unresolved", "ownership_evidence_ceiling": "Named project/construction entity; real-property title and current operating state remain unresolved unless separately stated.", "process_families": [ "12-inch specialty-process wafer fabrication" ], "production_state": "EPC contract formally signed in 2023, subject to effectiveness conditions", "project_scale": null, "record_type": "facility", "source_ids": [ "src-util-002" ], "unknowns": [ "real-property title where not expressly disclosed", "current operator state", "installed capacity", "qualified capacity", "actual output", "utilization", "yield", "complete equipment/material/component BOM and origins" ], "wafer_diameter": "300 mm", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "bf6ec1eb798db871b30278c20d4bd74b6b9e2cd6ca05f99f1670a5e39c6ba655", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_families", "value": "12-inch specialty-process wafer fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "12-inch specialty-process wafer fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-002", "title": "无锡市太极实业股份有限公司关于子公司十一科技中标重大项目工程的进展公告", "publisher": "无锡市太极实业股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2023-06/03/content_1776018.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2023-06-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Formal signature is proven, but effectiveness was conditional on specified internal, shareholder and government approvals. Completion, site acceptance, production qualification, uptime and output are not proven." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-util-huahong-wuxi", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "华虹半导体制造（无锡）有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-util-huahong-wuxi", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "华虹半导体制造（无锡）有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "30-1 Xinzhou Road, Xinwu District, Wuxi, Jiangsu, China", "ownership_class": "mainland_location_ownership_unresolved", "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": { "capacity_state": "vendor-reported_design_target", "period": "after both phases", "scope": "eventual two-phase project", "unit": "8-inch SiC wafers/year", "value": 720000 }, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "claim_ceiling": "Named Phase I exhaust/PGEX award is proven only by the supplier. The 720,000-wafer/year number applies to the eventual two-phase project, not installed or operating Phase I capacity.", "completion_state": "facility_backed", "facility_id": "fac-util-silan-sic-phase1", "foreign_dependencies": [ "unknown; no exhaust/PGEX component BOM, control software, pump, sensor, valve or service origin disclosed" ], "id": "fac-util-silan-sic-phase1", "last_checked": "2026-07-29", "latest_dated_source": "src-util-003", "legal_owner_entity_id": "ent-util-silan-jihong", "location": "Haicang District, Xiamen, Fujian, China", "name": "Xiamen Silan Jihong 8-inch SiC power-device line Phase I", "operator_entity_id": "ent-util-silan-jihong", "ownership_class": "mainland_location_ownership_unresolved", "ownership_evidence_ceiling": "Named project/construction entity; real-property title and current operating state remain unresolved unless separately stated.", "process_families": [ "8-inch SiC power-device wafer fabrication" ], "production_state": "project start reported 2024-06-18; exhaust/PGEX package awarded by 2025-01-23", "project_scale": null, "record_type": "facility", "source_ids": [ "src-util-003" ], "unknowns": [ "real-property title where not expressly disclosed", "current operator state", "installed capacity", "qualified capacity", "actual output", "utilization", "yield", "complete equipment/material/component BOM and origins" ], "wafer_diameter": "200 mm", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "636f2b620df960e762142a8bddd6e54135a315eebe611bf6a3e4c922fe53cf25", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_families", "value": "8-inch SiC power-device wafer fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "8-inch SiC power-device wafer fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-003", "title": "喜讯 | 盛剑科技中标厦门士兰集宏半导体有限公司项目", "publisher": "上海盛剑科技股份有限公司", "url": "https://www.sheng-jian.com/news_details/386.html", "source_type": "official_supplier_project_notice", "primary_status": "primary", "publication_date": "2025-01-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No award amount, signed contract, installation, acceptance or commissioning receipt is published. The 720,000 wafers/year figure is a two-phase eventual design target and not Phase I installed capacity or output." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-util-silan-jihong", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "厦门士兰集宏半导体有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-util-silan-jihong", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "厦门士兰集宏半导体有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Haicang District, Xiamen, Fujian, China", "ownership_class": "mainland_location_ownership_unresolved", "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "claim_ceiling": "A supplier-reported EPC award, rounded contract value, project type and detailed construction scope are proven. Contract signature, installed systems, acceptance, process qualification and production are not.", "completion_state": "facility_backed", "facility_id": "fac-util-yuerun-a1", "foreign_dependencies": [ "unknown; no component-level origin record for cleanroom, gas, liquid, vacuum, FFU, controls or abatement systems" ], "id": "fac-util-yuerun-a1", "last_checked": "2026-07-29", "latest_dated_source": "src-util-004", "legal_owner_entity_id": "ent-util-yuerun", "location": "Shaoxing, Zhejiang, China; exact street address not proven by the first-party source in this lane", "name": "YueRun A1 next-generation heterogeneous-integration advanced-packaging and DDIC project", "operator_entity_id": "ent-util-yuerun", "ownership_class": "mainland_location_ownership_unresolved", "ownership_evidence_ceiling": "Named project/construction entity; real-property title and current operating state remain unresolved unless separately stated.", "process_families": [ "wafer-level advanced packaging", "heterogeneous integration", "display-driver packaging" ], "production_state": "EPC award reported; project described as starting in 2026", "project_scale": { "capacity_state": "vendor-reported_project_description", "period": "2026 project", "scope": "cleanroom area", "unit": "square_metres", "value": "nearly 10000" }, "record_type": "facility", "source_ids": [ "src-util-004" ], "unknowns": [ "real-property title where not expressly disclosed", "current operator state", "installed capacity", "qualified capacity", "actual output", "utilization", "yield", "complete equipment/material/component BOM and origins" ], "wafer_diameter": "not_applicable_packaging_site", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "1e0c6010c1ee4d094add42b79412c4f76dfab51240c7e5981965976deb8af2e4", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_families", "value": "wafer-level advanced packaging" }, { "field": "process_families", "value": "display-driver packaging" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "wafer-level advanced packaging" }, { "field": "process_families", "value": "heterogeneous integration" }, { "field": "process_families", "value": "display-driver packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-004", "title": "华康洁净中标越润高端封测基地项目 强链国产半导体", "publisher": "武汉华康世纪洁净科技股份有限公司", "url": "https://www.whhksj.com/details/217.html", "source_type": "official_supplier_project_notice", "primary_status": "primary", "publication_date": "2026-05-11", "date_checked": "2026-07-29", "access_state": "indexed_direct_open_error", "limitations": [ "Supplier-authored award notice. No counterparty confirmation, signed contract, installation, acceptance, production qualification or output receipt was located." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-util-yuerun", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "越润集成电路（绍兴）有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-util-yuerun", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "越润集成电路（绍兴）有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Shaoxing, Zhejiang, China; exact street address not proven by the first-party source in this lane", "ownership_class": "mainland_location_ownership_unresolved", "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": { "period": "2026-07", "state": "reported_compute_class", "unit": "P_vendor_defined_compute", "value": ">1000" }, "installed": { "period": "2026-07", "state": "deployed_government_reported", "unit": "S5000_accelerator_cards", "value": ">2000" }, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-wuxi-huishan-ai-compute-center-phase1", "foreign_dependencies": [], "id": "fac-wuxi-huishan-ai-compute-center-phase1", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-wuxi-huishan-ai-center-owner-unresolved", "location": "Huishan District, Wuxi, Jiangsu, China; exact address undisclosed", "name": "Wuxi (Huishan) AI Compute Center Phase I", "operator_entity_id": "ent-wuxi-huishan-ai-center-owner-unresolved", "process_families": [ "ai_compute_service" ], "production_state": "powered_on_and_deployed_government_reported", "record_type": "facility", "source_ids": [ "src-huishan-mt-s5000-center-20260724" ], "unknowns": [ "legal owner/operator", "buyer", "contract", "acceptance certificate", "exact card count", "uptime", "utilization", "power/cooling", "customer workloads" ], "wafer_diameter": "not_applicable", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "5627a156625d601ecc35cd7473e1b367f051a20c01500aa88f0a1a9398f5b29e", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_families", "value": "ai_compute_service" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huishan-mt-s5000-center-20260724", "title": "无锡（惠山）人工智能算力中心一期点亮", "publisher": "惠山区人民政府办公室", "url": "https://www.huishan.gov.cn/doc/2026/07/24/4809561.shtml", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2026-07-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility legal owner/operator, direct buyer, contract, acceptance certificate, uptime and utilization are undisclosed.", "Powered-on/deployed does not by itself prove sustained production workload or service volume." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-wuxi-huishan-ai-center-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "operator": { "entity_id": "ent-wuxi-huishan-ai-center-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "location": "Huishan District, Wuxi, Jiangsu, China; exact address undisclosed", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": { "period": "2024", "scope": "issuer inquiry reply", "unit": "percent", "value": 88.11 } }, "completion_state": "facility_backed", "facility_id": "fac-xinsheng-jingke-300mm", "foreign_dependencies": [ "major equipment suppliers anonymized" ], "id": "fac-xinsheng-jingke-300mm", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-xinsheng-jingke", "location": "Shanghai, China", "name": "Xinsheng Jingke 300 mm wafer operation", "operator_entity_id": "ent-xinsheng-jingke", "process_families": [ "silicon_wafers" ], "production_state": "operating_2024_receipt", "record_type": "facility", "source_ids": [ "src-nsig-inquiry-2025" ], "unknowns": [ "licensed/design/installed/qualified capacity", "actual output", "yield", "equipment vendors" ], "wafer_diameter": "300 mm", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "2f9793ffd4a7e40fa9fbff8ccb23ec68e84a660b81ddb0aa3c075b14e7dac10d", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_families", "value": "silicon_wafers" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "silicon_wafers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nsig-inquiry-2025", "title": "关于上海硅产业集团股份有限公司发行股份及支付现金购买资产并募集配套资金申请审核问询函的回复", "publisher": "上海证券交易所 / 立信会计师事务所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202509/688126_20250901_U2SY.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-09-01", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Equipment vendors and a domestic polysilicon supplier are anonymized; forecasts are not actual production." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-xinsheng-jingke", "record_level": "company", "canonical_legal_name_en": "Shanghai Xinsheng Jingke Semiconductor Technology Co., Ltd.", "canonical_legal_name_cn": "上海新昇晶科半导体科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-xinsheng-jingke", "record_level": "company", "canonical_legal_name_en": "Shanghai Xinsheng Jingke Semiconductor Technology Co., Ltd.", "canonical_legal_name_cn": "上海新昇晶科半导体科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Shanghai, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-xinye-shidai-8in", "foreign_dependencies": [], "id": "fac-xinye-shidai-8in", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-xinye-shidai", "location": "Xi'an, Shaanxi, China; exact street address not in award receipt", "name": "8-inch high-performance specialty-process semiconductor line", "operator_entity_id": "ent-xinye-shidai", "process_families": [ "high_performance_specialty_process; exact device families unknown" ], "production_state": "project_award_stage; operating state unknown", "record_type": "facility", "source_ids": [ "src-xinye-shidai-chemical-system-award-2025" ], "unknowns": [ "ownership", "address", "process families", "installed capacity", "tool move-in", "first wafer", "qualification", "output", "yield" ], "wafer_diameter": "200 mm", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "377fd8ca177d58843eb41d1dfed8bbc18a52e87682a00e67611651f4b32516e7", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_families", "value": "high_performance_specialty_process; exact device families unknown" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "high_performance_specialty_process; exact device families unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-xinye-shidai-chemical-system-award-2025", "title": "陕西电子芯业时代科技有限公司8英寸高性能特色工艺半导体芯片生产线项目化学品系统建设项目-中标结果公示", "publisher": "陕西省采购招标有限责任公司采购招标网", "url": "https://www.sxcgzb.com/portal/notice/detail/id/3500.html", "source_type": "official_procurement_award", "primary_status": "primary", "publication_date": "2025-03-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Award proves endpoints, project scope and price only; delivery, installation, commissioning, site acceptance and operation are unknown." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-xinye-shidai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "陕西电子芯业时代科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-xinye-shidai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "陕西电子芯业时代科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Xi'an, Shaanxi, China; exact street address not in award receipt", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-ymtc-phase3", "foreign_dependencies": [], "id": "fac-ymtc-phase3", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-ymtc-phase3", "location": "Wuhan, Hubei, China", "name": "长存三期（武汉）项目", "operator_entity_id": "ent-ymtc-phase3", "process_families": [ "3d_nand" ], "production_state": "construction", "project_investment": { "state": "announced_project_investment", "unit": "CNY_billion", "value": 20.72 }, "record_type": "facility", "source_ids": [ "src-wuhan-ymtc-phase3", "src-hubei-ymtc-phase3" ], "unknowns": [ "designed WSPM", "installed tools", "tool move-in", "first wafer", "qualified capacity", "actual output" ], "wafer_diameter": "300 mm expected but not explicitly restated in cited project records", "canonical_dataset": "facilities.yaml", "canonical_record_sha256": "23f3d898ecd00810bb6e45d56b7723dfd9ae90bd50881f11e28278ad37aea00c", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_families", "value": "3d_nand" } ] } ], "canonical_classification_inputs": [ { "field": "process_families", "value": "3d_nand" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-wuhan-ymtc-phase3", "title": "长江存储三期项目建设进展", "publisher": "武汉市人民政府", "url": "https://www.wuhan.gov.cn/sy/whyw/202601/t20260108_2708121.shtml", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2026-01-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Construction start is not tool move-in, installed capacity, first wafer, qualification or production." ] }, { "source_id": "src-hubei-ymtc-phase3", "title": "长存三期项目加速推进", "publisher": "湖北省人民政府", "url": "https://www.hubei.gov.cn/hbfb/rdgz/202605/t20260520_5939700.shtml", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2026-05-20", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Investment is not deployed capital, equipment list, capacity, first wafer or qualified production." ] } ], "ownership_operation_geography": { "legal_owner": { "entity_id": "ent-ymtc-phase3", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "长存三期（武汉）集成电路有限责任公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "operator": { "entity_id": "ent-ymtc-phase3", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "长存三期（武汉）集成电路有限责任公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "location": "Wuhan, Hubei, China", "ownership_class": null, "boundary": "Facility location is not company ownership or control. The legal owner and operator remain separate endpoints, and neither field proves the origin of every tool, material, process, or product at the site." } } ], "capabilities": [ { "capability_id": "cap-ai-biren-products", "claim_ids": [ "clm-biren-br106-br166-production-ceiling" ], "completion_state": "volume_backed", "entity_id": "ent-biren-brand-endpoint-unresolved", "evidence_state": "CONFIRMED_PRIMARY", "id": "cap-ai-biren-products", "last_checked": "2026-07-29", "name": "BR106 and BR166 issuer-reported commercialization", "process_id": "proc-chip-ai-accelerator", "readiness_state": "volume_production", "record_type": "capability", "source_ids": [ "src-biren-annual-2025" ], "taxonomy": "ai_accelerator", "unknowns": [ "variant units", "manufacturing endpoints", "customers", "yield" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "75de7aa7e6c01dff0bb05f9fb43c1653c1d7ef8ec8b8a2ee41fefe6dda74f191", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-biren-annual-2025", "title": "Shanghai Biren Technology Co., Ltd. 2025 Annual Report", "publisher": "香港交易所", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0422/2026042200045.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-22", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers, project sites, foundry, OSAT, memory suppliers and variant-specific unit counts are withheld." ] } ], "entity_reference": { "entity_id": "ent-biren-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Shanghai Biren Technology Co., Ltd.", "canonical_legal_name_cn": "上海壁仞科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-ai-cambricon-mlu370-x8", "claim_ids": [ "clm-cambricon-mlu370x8-specification" ], "completion_state": "source_backed", "entity_id": "ent-cambricon-brand-endpoint-unresolved", "evidence_state": "VENDOR_REPORTED", "id": "cap-ai-cambricon-mlu370-x8", "last_checked": "2026-07-29", "name": "MLU370-X8 catalogue specification", "process_id": "proc-chip-ai-accelerator", "readiness_state": "unknown", "record_type": "capability", "source_ids": [ "src-cambricon-mlu370x8-product" ], "taxonomy": "ai_accelerator", "unknowns": [ "manufacturing endpoints", "memory supplier", "shipments", "customers", "yield", "independent workload" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "5e1a59b317bacf7a8bc4d445634c0cb9e5bebcab3365bb1b2b79f8c0f2ecf903", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cambricon-mlu370x8-product", "title": "MLU370-X8 智能加速卡", "publisher": "中科寒武纪科技股份有限公司", "url": "https://www.cambricon.com/index.php?a=lists&c=index&catid=406&m=content", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, LPDDR5 supplier, OSAT, package, units, named customer and independent workload receipt are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-cambricon-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Cambricon Technologies Corporation Limited", "canonical_legal_name_cn": "中科寒武纪科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-ai-cambricon-products", "claim_ids": [ "clm-cambricon-identity-fabless-and-siyuan220-volume" ], "completion_state": "volume_backed", "entity_id": "ent-cambricon-brand-endpoint-unresolved", "evidence_state": "CONFIRMED_PRIMARY", "id": "cap-ai-cambricon-products", "last_checked": "2026-07-29", "name": "Siyuan 220-series family sales", "process_id": "proc-chip-ai-accelerator", "readiness_state": "volume_production", "record_type": "capability", "source_ids": [ "src-cambricon-annual-2025" ], "taxonomy": "ai_accelerator", "unknowns": [ "model and period split", "manufacturing endpoints", "customers", "yield", "field reliability" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "ac236bf6bd6c6b1200c76aebdd95bd1564631a98a27efbff7559a9046f2cf83e", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cambricon-annual-2025", "title": "中科寒武纪科技股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-13/688256_20260313_GWH3.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-13", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, wafer facility, OSAT, package flow, memory supplier and named customers are undisclosed.", "The one-million figure is family cumulative volume, not a model/facility split." ] } ], "entity_reference": { "entity_id": "ent-cambricon-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Cambricon Technologies Corporation Limited", "canonical_legal_name_cn": "中科寒武纪科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-ai-enflame-t20-t21", "claim_ids": [ "clm-enflame-t20-t21-historical-plan" ], "completion_state": "lead_only", "entity_id": "ent-enflame", "evidence_state": "PLAUSIBLE_UNVERIFIED", "id": "cap-ai-enflame-t20-t21", "last_checked": "2026-07-29", "name": "T20/T21 historical product plan", "process_id": "proc-chip-ai-accelerator", "readiness_state": "unknown", "record_type": "capability", "source_ids": [ "src-enflame-t20-t21-20210709" ], "taxonomy": "ai_accelerator", "unknowns": [ "production closure", "manufacturing endpoints", "customers", "shipments" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "0d296737453f017823127052e7d23809da748ab60fe83f35f0117d4e6a245d2d", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-enflame-t20-t21-20210709", "title": "燧原科技发布云燧T20、T21", "publisher": "人民网转载中国电子报", "url": "https://finance.people.com.cn/n1/2021/0709/c1004-32153321.html", "source_type": "reputable_reporting", "primary_status": "secondary", "publication_date": "2021-07-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Future production plan; no later primary closing receipt, foundry, OSAT, HBM supplier, customer or shipment." ] } ], "entity_reference": { "entity_id": "ent-enflame", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海燧原科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "architecture_classification": [ "H3" ], "bandwidth": { "label": "M50 vendor peak; direction and sustained payload undisclosed", "unit": "GB/s", "value": 153.6 }, "capability_id": "cap-ai-houmo-m50", "capacity": "up to 48 GB", "claim_ids": [ "clm-houmo-m50-specification-and-integration" ], "completion_state": "relationship_backed", "energy_per_bit": null, "entity_id": "ent-houmo", "evidence_state": "VENDOR_REPORTED", "foreign_dependencies": [], "id": "cap-ai-houmo-m50", "last_checked": "2026-07-29", "latency_distribution": null, "memory_medium": "LPDDR5; supplier undisclosed", "name": "M50 LPDDR5-based compute-in-memory accelerator", "package": "M50 package and memory placement undisclosed", "physical_byte_path": "M50 compute device to LPDDR5 over an undisclosed interface", "physical_location": "board-attached memory topology; package placement undisclosed", "process_id": "proc-chip-ai-accelerator", "readiness_state": "manufactured", "record_type": "capability", "software_requirements": [ "vendor toolchain; versions, kernels and framework receipts undisclosed" ], "source_ids": [ "src-houmo-m50-product", "src-houmo-m50-greatwall-20260531" ], "taxonomy": "hbm_reduced_architecture", "unknowns": [ "manufacturing endpoints", "memory supplier", "shipments", "workload", "p50/p99 latency", "sustained throughput", "energy", "endurance", "contention", "active-state reinstall", "recovery" ], "workload_fit": [ "AI notebook integration claimed; no independent accepted workload" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "af450a9e5a0bc6d78b20659be6bad9d35500dfdc41e573cca628192b49845404", "stage_ids": [ "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "hbm_reduced_architecture" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "hbm_reduced_architecture" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-houmo-m50-product", "title": "M50", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/60/ProductType.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, OSAT, LPDDR supplier, units, customer acceptance and independent workload receipt are undisclosed." ] }, { "source_id": "src-houmo-m50-greatwall-20260531", "title": "长城N90 Pro AI笔记本搭载后摩M50", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/1/47/NewsDetails.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2026-05-31", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Direct buying entity, contract, units, retail shipments, acceptance and field reliability are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-houmo", "record_level": "company", "canonical_legal_name_en": "PostMoore Technology Co., Ltd.", "canonical_legal_name_cn": "后摩智能科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-ai-houmo-products", "claim_ids": [ "clm-houmo-h30-co-development" ], "completion_state": "relationship_backed", "entity_id": "ent-houmo", "evidence_state": "VENDOR_REPORTED", "id": "cap-ai-houmo-products", "last_checked": "2026-07-29", "name": "H30 automotive compute-in-memory co-development", "process_id": "proc-chip-ai-accelerator", "readiness_state": "engineering_prototype", "record_type": "capability", "source_ids": [ "src-houmo-h30-youkong-20231229" ], "taxonomy": "ai_accelerator", "unknowns": [ "counterparty legal entity", "production vehicle", "manufacturing endpoints", "memory supplier", "units", "qualification", "yield" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "8c871e7bccb2fc8a8c90c2b2e82fff15d88ae32a9e426587f9fa325c38c11a41", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-houmo-h30-youkong-20231229", "title": "后摩智能与优控智行战略合作", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/3/28/NewsDetails.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2023-12-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Counterparty legal entity, production vehicle, contract, units, foundry, memory and OSAT are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-houmo", "record_level": "company", "canonical_legal_name_en": "PostMoore Technology Co., Ltd.", "canonical_legal_name_cn": "后摩智能科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-ai-iluvatar-products", "claim_ids": [ "clm-iluvatar-tg100-production-stage" ], "completion_state": "volume_backed", "entity_id": "ent-iluvatar", "evidence_state": "VENDOR_REPORTED", "id": "cap-ai-iluvatar-products", "last_checked": "2026-07-29", "name": "TG100 vendor-reported production-stage milestone", "process_id": "proc-chip-ai-accelerator", "readiness_state": "volume_production", "record_type": "capability", "source_ids": [ "src-iluvatar-about" ], "taxonomy": "ai_accelerator", "unknowns": [ "model units", "manufacturing endpoints", "customers", "yield" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "f4411bedd1d42e04c85314b871dcb2b8c132c714b420045f8de3ae90baecf248", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-iluvatar-about", "title": "发展历程", "publisher": "上海天数智芯半导体股份有限公司", "url": "https://www.iluvatar.com/about/", "source_type": "company_timeline", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor timeline; model-specific units, foundry, OSAT, memory supplier and named customers are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-iluvatar", "record_level": "company", "canonical_legal_name_en": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd.", "canonical_legal_name_cn": "上海天数智芯半导体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-ai-iluvatar-zk100", "claim_ids": [ "clm-iluvatar-zk100-bringup-and-card-release" ], "completion_state": "source_backed", "entity_id": "ent-iluvatar", "evidence_state": "VENDOR_REPORTED", "id": "cap-ai-iluvatar-zk100", "last_checked": "2026-07-29", "name": "ZK100 bring-up and card-release milestone", "process_id": "proc-chip-ai-accelerator", "readiness_state": "manufactured", "record_type": "capability", "source_ids": [ "src-iluvatar-about" ], "taxonomy": "ai_accelerator", "unknowns": [ "shipments", "model units", "manufacturing endpoints", "customers", "qualification", "yield" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "6724f69a8a8f1ff4dbed0177a35c367271ffdb6dcc52c5e7cd9152f97410ba39", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-iluvatar-about", "title": "发展历程", "publisher": "上海天数智芯半导体股份有限公司", "url": "https://www.iluvatar.com/about/", "source_type": "company_timeline", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor timeline; model-specific units, foundry, OSAT, memory supplier and named customers are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-iluvatar", "record_level": "company", "canonical_legal_name_en": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd.", "canonical_legal_name_cn": "上海天数智芯半导体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-ai-kunlun-k200", "claim_ids": [ "clm-kunlun-k200-specification" ], "completion_state": "source_backed", "entity_id": "ent-kunlun-brand-endpoint-unresolved", "evidence_state": "VENDOR_REPORTED", "id": "cap-ai-kunlun-k200", "last_checked": "2026-07-29", "name": "K200 catalogue specification", "process_id": "proc-chip-ai-accelerator", "readiness_state": "unknown", "record_type": "capability", "source_ids": [ "src-kunlun-k200-product" ], "taxonomy": "ai_accelerator", "unknowns": [ "foundry", "HBM supplier/stack", "interposer/OSAT", "shipments", "customers", "yield", "independent workload" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "c3b2cf6269f73067162e56f68bbc49269bd8e3bb427a8f61d246bd785ab555e0", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kunlun-k200-product", "title": "K200", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/product/686.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, OSAT/interposer, HBM generation/supplier/stack, yield, units and named customer are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-kunlun-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "昆仑芯（北京）科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-ai-kunlun-p800", "claim_ids": [ "clm-kunlun-p800-cmb-award-and-test" ], "completion_state": "relationship_backed", "entity_id": "ent-kunlun-brand-endpoint-unresolved", "evidence_state": "VENDOR_REPORTED", "id": "cap-ai-kunlun-p800", "last_checked": "2026-07-29", "name": "P800 CMB application-test claim", "process_id": "proc-chip-ai-accelerator", "readiness_state": "customer_validated", "record_type": "capability", "source_ids": [ "src-kunlun-p800-cmb-20250327" ], "taxonomy": "ai_accelerator", "unknowns": [ "customer-origin award", "quantity", "delivery", "installation", "acceptance", "manufacturing endpoints", "memory supplier" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "50f8fc8ab776788175f4a5fef0e04d281609e9f73a4efed0b0048a28cbc42c2f", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kunlun-p800-cmb-20250327", "title": "昆仑芯中标招商银行AI芯片资源项目", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/news/4469.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2025-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-origin award; tender number, contract, quantity, delivery, installation and customer acceptance are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-kunlun-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "昆仑芯（北京）科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-ai-kunlun-products", "claim_ids": [ "clm-kunlun-r200-specification" ], "completion_state": "source_backed", "entity_id": "ent-kunlun-brand-endpoint-unresolved", "evidence_state": "VENDOR_REPORTED", "id": "cap-ai-kunlun-products", "last_checked": "2026-07-29", "name": "R200 catalogue specification", "process_id": "proc-chip-ai-accelerator", "readiness_state": "unknown", "record_type": "capability", "source_ids": [ "src-kunlun-r200-product" ], "taxonomy": "ai_accelerator", "unknowns": [ "manufacturing endpoints", "GDDR6 supplier", "shipments", "customers", "yield", "independent workload" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "4f1e0f817b34db6d732044b8a55c69654b0b031faadccee87267de522e88d69e", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kunlun-r200-product", "title": "R200", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/product/274.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, GDDR6 supplier, OSAT, units, named customer and workload receipt are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-kunlun-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "昆仑芯（北京）科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-ai-metax-products", "claim_ids": [ "clm-metax-identity-products-and-production-dates" ], "completion_state": "volume_backed", "entity_id": "ent-metax", "evidence_state": "CONFIRMED_PRIMARY", "id": "cap-ai-metax-products", "last_checked": "2026-07-29", "name": "N100 and C500 issuer-reported formal mass production", "process_id": "proc-chip-ai-accelerator", "readiness_state": "volume_production", "record_type": "capability", "source_ids": [ "src-metax-annual-2025" ], "taxonomy": "ai_accelerator", "unknowns": [ "unit/customer/facility split", "foundry", "OSAT", "memory supplier", "yield" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "d6327031905f699227116e898defe5edc6ad88959f4744b7043cb5c9d1cc4936", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-metax-annual-2025", "title": "沐曦集成电路（上海）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-27/688802_20260327_0HOB.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Fabless contractors are unnamed; 2025 board-sales totals are family-category totals, not model-specific.", "Overseas HBM, EDA and interface-IP suppliers are not named." ] } ], "entity_reference": { "entity_id": "ent-metax", "record_level": "company", "canonical_legal_name_en": "MetaX Integrated Circuits (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "沐曦集成电路（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-ai-moore-threads-s5000", "claim_ids": [ "clm-moore-threads-s5000-pinghu-and-huishan-deployment" ], "completion_state": "facility_backed", "entity_id": "ent-moore-threads", "evidence_state": "CONFIRMED_INDEPENDENT", "id": "cap-ai-moore-threads-s5000", "last_checked": "2026-07-29", "name": "S5000 named-facility deployment", "process_id": "proc-chip-ai-accelerator", "readiness_state": "installed", "record_type": "capability", "source_ids": [ "src-moore-threads-annual-2025", "src-moore-threads-s5000-product", "src-huishan-mt-s5000-center-20260724" ], "taxonomy": "ai_accelerator", "unknowns": [ "site acceptance", "manufacturing endpoints", "uptime", "utilization", "workload" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "6fa00f6be3f865b070a7e81f6ab3e2c52b228e718fdf8e6e264ea11ea85d410e", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-moore-threads-annual-2025", "title": "摩尔线程智能科技（北京）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-27/688795_20260427_CUNP.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, OSAT, board maker, memory supplier and customer names are undisclosed." ] }, { "source_id": "src-moore-threads-s5000-product", "title": "MTT S5000", "publisher": "摩尔线程", "url": "https://www.mthreads.com/product/S5000", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, memory supplier, OSAT, facility, deployment or independent workload receipt." ] }, { "source_id": "src-huishan-mt-s5000-center-20260724", "title": "无锡（惠山）人工智能算力中心一期点亮", "publisher": "惠山区人民政府办公室", "url": "https://www.huishan.gov.cn/doc/2026/07/24/4809561.shtml", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2026-07-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility legal owner/operator, direct buyer, contract, acceptance certificate, uptime and utilization are undisclosed.", "Powered-on/deployed does not by itself prove sustained production workload or service volume." ] } ], "entity_reference": { "entity_id": "ent-moore-threads", "record_level": "company", "canonical_legal_name_en": "Moore Threads Technology Co., Ltd.", "canonical_legal_name_cn": "摩尔线程智能科技（北京）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-ai-sophgo-bm1684x", "claim_ids": [ "clm-sophgo-group-identity-and-bm1684x-specification" ], "completion_state": "lead_only", "entity_id": "ent-sophgo-brand-endpoint-unresolved", "evidence_state": "VENDOR_REPORTED", "id": "cap-ai-sophgo-bm1684x", "last_checked": "2026-07-29", "name": "BM1684X accelerator mainboard", "process_id": "proc-chip-ai-accelerator", "readiness_state": "unknown", "record_type": "capability", "source_ids": [ "src-sophgo-privacy", "src-sophgo-bm1684x-product" ], "taxonomy": "ai_accelerator", "unknowns": [ "legal product owner", "manufacturing endpoints", "shipments", "customers" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "d20968e5e071176fd6f36986cf79e7bdec52099f2be2c251572a9c3f7f820fd2", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "ai_accelerator" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-sophgo-privacy", "title": "隐私政策", "publisher": "北京算能科技有限公司", "url": "https://www.sophgo.com/site/provacy-policy.html", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Does not identify the exact legal owner/manufacturer of each group-branded product." ] }, { "source_id": "src-sophgo-bm1684x-product", "title": "BM1684X Mainboard", "publisher": "SOPHGO", "url": "https://en.sophgo.com/ecology/detail.html?id=41", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact legal product owner, foundry, OSAT, LPDDR supplier, units and named customer are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-sophgo-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "architecture_classification": [ "H4" ], "bandwidth": null, "capability_id": "cap-ai-witmem-products", "capacity": "1.8M model parameters", "claim_ids": [ "clm-witmem-wtm2101-specification-and-shipments" ], "completion_state": "volume_backed", "energy_per_bit": null, "entity_id": "ent-witmem", "evidence_state": "VENDOR_REPORTED", "foreign_dependencies": [], "id": "cap-ai-witmem-products", "last_checked": "2026-07-29", "latency_distribution": null, "memory_medium": "on-chip compute-in-memory arrays", "name": "WTM2101 on-chip compute-in-memory accelerator", "package": "package and assembly flow undisclosed", "physical_byte_path": "memory-array-local compute path; external activation/weight path undisclosed", "physical_location": "on-chip; array topology undisclosed", "process_id": "proc-chip-ai-accelerator", "readiness_state": "volume_production", "record_type": "capability", "software_requirements": [ "vendor deployment/toolchain; versions and compatibility receipts undisclosed" ], "source_ids": [ "src-witmem-wtm2101-product" ], "taxonomy": "hbm_reduced_architecture", "unknowns": [ "audited shipment units and period", "manufacturing endpoints", "customers", "yield", "physical bandwidth", "latency distribution", "energy per bit", "external memory path" ], "workload_fit": [ "edge inference claimed; no independent accepted workload" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "bf77091dd248bdde0a179d8c107a6e326e5fa069ffbd5d4418f5ca3ece1cc7d7", "stage_ids": [ "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "hbm_reduced_architecture" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "hbm_reduced_architecture" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-witmem-wtm2101-product", "title": "WTM2101", "publisher": "杭州知存算力科技有限公司", "url": "https://www.witmem.com/WTM2101.php", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Audited units, foundry, OSAT, legal customer, yield and field reliability are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-witmem", "record_level": "company", "canonical_legal_name_en": "Hangzhou Zhicun (Witmem) Technology Co., Ltd.", "canonical_legal_name_cn": "杭州知存算力科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "architecture_classification": [ "H4" ], "bandwidth": null, "capability_id": "cap-ai-witmem-wtm8", "capacity": null, "claim_ids": [ "clm-witmem-wtm8-trial-state" ], "completion_state": "source_backed", "energy_per_bit": null, "entity_id": "ent-witmem", "evidence_state": "VENDOR_REPORTED", "foreign_dependencies": [], "id": "cap-ai-witmem-wtm8", "last_checked": "2026-07-29", "latency_distribution": null, "memory_medium": "compute-in-memory arrays; memory medium and die stack undisclosed", "name": "WTM-8 3D heterogeneous compute-in-memory trial product", "package": "3D heterogeneous bonding claimed; flow, pitch and facility undisclosed", "physical_byte_path": "memory-array-local compute path; external activation/weight path undisclosed", "physical_location": "3D heterogeneous structure per vendor; topology undisclosed", "process_id": "proc-chip-ai-accelerator", "readiness_state": "manufactured", "record_type": "capability", "software_requirements": [ "vendor deployment/toolchain; versions and compatibility receipts undisclosed" ], "source_ids": [ "src-witmem-wtm8-about", "src-witmem-wtm8-product" ], "taxonomy": "hbm_reduced_architecture", "unknowns": [ "commercial release", "manufacturing endpoints", "shipments", "customers", "yield", "physical bandwidth", "latency distribution", "energy per bit", "external memory path" ], "workload_fit": [ "edge inference claimed; no independent accepted workload" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "fbaba338850ce56dc3e99a3e2690af71568d9f441046ac1ce2e4e27f12102bab", "stage_ids": [ "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-chip-ai-accelerator" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "hbm_reduced_architecture" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "hbm_reduced_architecture" }, { "field": "process_id", "value": "proc-chip-ai-accelerator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-witmem-wtm8-about", "title": "关于知存", "publisher": "杭州知存算力科技有限公司", "url": "https://www.witmem.com/about.php", "source_type": "company_timeline", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Trial production is not commercial release, customer qualification or volume shipment." ] }, { "source_id": "src-witmem-wtm8-product", "title": "WTM-8", "publisher": "杭州知存算力科技有限公司", "url": "https://www.witmem.com/WTM-8.php", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, bonding facility/tool/pitch/yield, OSAT, die suppliers, customer and shipment are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-witmem", "record_level": "company", "canonical_legal_name_en": "Hangzhou Zhicun (Witmem) Technology Co., Ltd.", "canonical_legal_name_cn": "杭州知存算力科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-aishengna-immersion-p0", "claim_ceiling": "anonymous-source manufacturing and future-recipient lead; no shipment or acceptance", "claim_ids": [ "clm-aishengna-reported-manufacturing", "clm-aishengna-future-recipients" ], "completion_state": "source_backed", "customer": null, "domestic_duv_state": "P0", "entity_id": "ent-aishengna", "evidence_state": "PLAUSIBLE_UNVERIFIED", "facility_id": null, "id": "cap-aishengna-immersion-p0", "last_checked": "2026-07-29", "model": null, "name": "Reported Aishengna immersion DUV manufacturing program", "numerical_aperture": null, "process_id": "proc-lithography-immersion-arf", "qualified_layer": null, "readiness_state": "manufactured", "record_type": "capability", "source_ids": [ "src-reuters-duv-aishengna-2026" ], "taxonomy": "domestic_duv_system", "wavelength": 193, "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "56384d3bf2bfd70f88590cc0e641111b11d3b05a56cd900b5b81742a3bc832ce", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "domestic_duv_system" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "domestic_duv_system" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-reuters-duv-aishengna-2026", "title": "China starts production of home-grown immersion DUV chipmaking tools, source says", "publisher": "Reuters", "url": "https://www.reuters.com/world/china/china-starts-production-home-grown-immersion-duv-chipmaking-tools-source-2026-07-28/", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2026-07-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Anonymous-source report; no model, serial, purchase order, shipment, installation, site acceptance, layer qualification, uptime, yield, or recurring volume." ] } ], "entity_reference": { "entity_id": "ent-aishengna", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海爱晟纳电子科技集团有限公司", "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-anji-cmp-family-matrix", "claim_ceiling": "family-level vendor readiness; no exact SKU, named fab, grade, qualification date or yield", "claim_ids": [ "clm-anji-process-family-readiness" ], "completion_state": "source_backed", "entity_id": "ent-anji", "evidence_state": "VENDOR_REPORTED", "families": [ "copper_and_barrier", "tungsten", "dielectric", "ceria", "silicon_substrate", "TSV", "hybrid_bonding", "polymer", "carbon" ], "id": "cap-anji-cmp-family-matrix", "last_checked": "2026-07-29", "name": "CMP slurry family readiness matrix", "process_id": "proc-material-cmp-consumables", "readiness_state": "volume_production", "record_type": "capability", "source_ids": [ "src-anji-solutions-2026", "src-anji-launch-2026" ], "taxonomy": "materials_product_family", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "50251b482907c3bff7381a347ae7c5adb42a877b23fbccd2915802b07eb940c2", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "materials_product_family" }, { "field": "process_id", "value": "proc-material-cmp-consumables" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "materials_product_family" }, { "field": "process_id", "value": "proc-material-cmp-consumables" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-anji-solutions-2026", "title": "解决方案", "publisher": "安集微电子科技（上海）股份有限公司", "url": "https://www.anjimicro.com/jiejuefangan.html", "source_type": "company_product_and_process_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Family/process-level vendor statements; no exact SKU, formulation, grade, named customer/fab, lot volume, defectivity or yield." ] }, { "source_id": "src-anji-launch-2026", "title": "『创领』安集科技新品发布会，聚“芯”SEMICON CHINA 2026", "publisher": "安集微电子科技（上海）股份有限公司", "url": "https://www.anjimicro.com/qiyexinwen/124.html", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2026-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers are anonymous; family and formulation counts do not disclose exact SKU, composition, grade, facility, layer or yield." ] } ], "entity_reference": { "entity_id": "ent-anji", "record_level": "company", "canonical_legal_name_en": "Anji Microelectronics Technology (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "安集微电子科技（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-anji-functional-wet-chemicals", "claim_ceiling": "family/process-level vendor readiness; no exact SKU, named fab, grade, lot or yield", "claim_ids": [ "clm-anji-process-family-readiness" ], "completion_state": "source_backed", "entity_id": "ent-anji", "evidence_state": "VENDOR_REPORTED", "families": [ "aluminum_post_etch_clean", "copper_post_etch_clean", "TiN_hardmask_clean", "copper_post_CMP_clean", "thick_resist_strip", "cured_PI_clean", "flux_remove", "copper_plating", "nickel_plating", "nickel_iron_plating", "tin_silver_plating" ], "id": "cap-anji-functional-wet-chemicals", "last_checked": "2026-07-29", "name": "Functional wet-chemical process matrix", "process_id": "proc-material-wet-plating-chemistry", "readiness_state": "volume_production", "record_type": "capability", "source_ids": [ "src-anji-solutions-2026" ], "taxonomy": "materials_product_family", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "3e4e1a89c10aa425d66ef0658e27d01720c31b387632982f2c23e8f3c333f796", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "materials_product_family" }, { "field": "process_id", "value": "proc-material-wet-plating-chemistry" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "materials_product_family" }, { "field": "process_id", "value": "proc-material-wet-plating-chemistry" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-anji-solutions-2026", "title": "解决方案", "publisher": "安集微电子科技（上海）股份有限公司", "url": "https://www.anjimicro.com/jiejuefangan.html", "source_type": "company_product_and_process_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Family/process-level vendor statements; no exact SKU, formulation, grade, named customer/fab, lot volume, defectivity or yield." ] } ], "entity_reference": { "entity_id": "ent-anji", "record_level": "company", "canonical_legal_name_en": "Anji Microelectronics Technology (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "安集微电子科技（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "architecture_classification": [ "H2" ], "bandwidth": { "evidence_state": "PLAUSIBLE_UNVERIFIED", "label": "secondary report relaying a vendor launch peak; direction, scope and sustained result undisclosed", "unit": "TB/s", "value": 6.4 }, "capability_id": "cap-df1000-h2", "capacity": null, "claim_ids": [ "clm-df1000-architecture", "clm-df1000-launch-numeric-claims" ], "completion_state": "source_backed", "energy_per_bit": null, "entity_id": "ent-dfsx", "evidence_state": "VENDOR_REPORTED", "foreign_dependencies": [], "id": "cap-df1000-h2", "last_checked": "2026-07-29", "latency_distribution": null, "memory_medium": "3D DRAM; generation and supplier unknown", "name": "DF1000 vendor-described 3D DRAM near-memory architecture", "package": "wafer-level hybrid-bonded structure claimed; flow unknown", "physical_byte_path": "DRAM-to-logic vertical path; interface width, layers and protocol unknown", "physical_location": "vertically integrated near logic per vendor", "process_id": "proc-chip-architecture", "readiness_state": "manufactured", "record_type": "capability", "software_requirements": [ "vendor software-defined architecture; versions and kernels unknown" ], "source_ids": [ "src-dfsx-df1000-product-2026", "src-dfsx-3d-near-memory-2026", "src-dfsx-launch-shanghai-securities-2026" ], "taxonomy": "hbm_reduced_architecture", "unknowns": [ "foundry", "memory supplier", "memory capacity", "interface width", "layer count", "bond flow", "bond pitch", "yield", "package", "OSAT", "TDP", "customers", "installed units", "shipment volume", "independent workload" ], "workload_fit": [ "training and inference claimed; no independent receipt" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "638333f48f1d9d58f1e0d33d230c3ba379b3d42f043399900eae57cfc7fa3b4a", "stage_ids": [ "architecture_ip", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-chip-architecture" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "hbm_reduced_architecture" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "hbm_reduced_architecture" }, { "field": "process_id", "value": "proc-chip-architecture" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_and_secondary", "source_refs": [ { "source_id": "src-dfsx-df1000-product-2026", "title": "DF1000 AI Accelerator", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/products/ai-accelerator/df1000", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor page exposes no independent workload receipt, memory supplier, foundry, package yield, power, customer, or shipment volume." ] }, { "source_id": "src-dfsx-3d-near-memory-2026", "title": "3D Near-Memory Computing", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/technology/3d-near-memory-computing", "source_type": "company_technology_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported architecture; no bond pitch, memory die source, layer count, yield, or independent test." ] }, { "source_id": "src-dfsx-launch-shanghai-securities-2026", "title": "东方算芯发布其首颗芯片DF1000", "publisher": "上海证券报·中国证券网", "url": "https://finance.eastmoney.com/a/202607133804178993.html", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2026-07-13", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Relays vendor event claims; not an independent benchmark, BOM audit, customer receipt, or volume-shipment evidence." ] } ], "entity_reference": { "entity_id": "ent-dfsx", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海东方算芯科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-duv-dram-patterning-trace", "claim_ids": [], "completion_state": "lead_only", "device_family": "DRAM", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "id": "cap-duv-dram-patterning-trace", "last_checked": "2026-07-29", "name": "DRAM domestic-DUV patterning proof trace", "process_id": "proc-dram-fabrication", "readiness_state": "unknown", "record_type": "capability", "required_layers": { "block_masks": null, "cell_patterning": null, "contacts": null, "cost_per_good_wafer": null, "cut_masks": null, "cycle_time": null, "edge_placement_error": null, "hard_masks": null, "inspection": null, "lele": null, "metal": null, "overlay": null, "peripheral_logic": null, "sadp": null, "saqp": null, "yield": null }, "source_ids": [], "taxonomy": "duv_patterning_trace", "unknowns": [ "fab", "scanner model", "named layer", "process window", "electrical yield" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "3168cfb63cf44f17a7566a0323f2ab53f5c96380951ef5e24c465c0068732d69", "stage_ids": [ "logic_foundry_process", "lithography", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-dram-fabrication" } ] }, { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "duv_patterning_trace" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-dram-fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "duv_patterning_trace" }, { "field": "process_id", "value": "proc-dram-fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "availability": null, "capability_id": "cap-duv-fab-cxmt", "cd_window": null, "claim_ids": [], "completion_state": "source_backed", "conclusion": "No purchase, delivery, move-in, installation or acceptance record.", "defectivity": null, "electrical_yield": null, "entity_id": "ent-cxmt-corp", "evidence_state": "PLAUSIBLE_UNVERIFIED", "focus_control": null, "good_die_output": null, "highest_source_bounded_context_state": "future-recipient lead below P4", "id": "cap-duv-fab-cxmt", "installation": null, "last_checked": "2026-07-29", "model": null, "move_in": null, "mtbf": null, "mttr": null, "name": "CXMT domestic-DUV insertion matrix", "named_layer": null, "next_evidence_needed": "Named legal fab and model plus purchase/receiving, move-in, installation, site acceptance, qualified layer, process window, electrical yield and two-quarter production receipt.", "numerical_aperture": null, "overlay": null, "overlay_distribution": null, "p0": "lead/catalogue context only or not linked", "p1": "not sufficient for domestic scanner attribution", "p2": "production context does not identify scanner vendor", "p3": "only SMIC has a reported prototype-evaluation lead", "p4": "not proven", "p5": "not proven", "p6": "not proven", "process_id": "proc-lithography-immersion-arf", "readiness_state": "unknown", "record_type": "capability", "recurring_two_quarter_volume": null, "resist": null, "serial_or_purchase_evidence": null, "site_acceptance": null, "source_ids": [ "src-reuters-duv-aishengna-2026" ], "taxonomy": "domestic_duv_fab_matrix", "track": null, "verified_domestic_duv_state": "UNRESOLVED", "wafers_per_hour": null, "wavelength": null, "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "488731798f0f87ca72aa3dc1a21040f53a91085f6d68bdf9075cbf641b937ecd", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "domestic_duv_fab_matrix" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "domestic_duv_fab_matrix" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-reuters-duv-aishengna-2026", "title": "China starts production of home-grown immersion DUV chipmaking tools, source says", "publisher": "Reuters", "url": "https://www.reuters.com/world/china/china-starts-production-home-grown-immersion-duv-chipmaking-tools-source-2026-07-28/", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2026-07-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Anonymous-source report; no model, serial, purchase order, shipment, installation, site acceptance, layer qualification, uptime, yield, or recurring volume." ] } ], "entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "availability": null, "capability_id": "cap-duv-fab-huahong", "cd_window": null, "claim_ids": [], "completion_state": "source_backed", "conclusion": "Future-recipient reporting is not delivery or installation; exact subsidiary/fab unresolved.", "defectivity": null, "electrical_yield": null, "entity_id": "ent-huahong-semiconductor", "evidence_state": "PLAUSIBLE_UNVERIFIED", "focus_control": null, "good_die_output": null, "highest_source_bounded_context_state": "future-recipient lead below P4", "id": "cap-duv-fab-huahong", "installation": null, "last_checked": "2026-07-29", "model": null, "move_in": null, "mtbf": null, "mttr": null, "name": "Hua Hong domestic-DUV insertion matrix", "named_layer": null, "next_evidence_needed": "Named legal fab and model plus purchase/receiving, move-in, installation, site acceptance, qualified layer, process window, electrical yield and two-quarter production receipt.", "numerical_aperture": null, "overlay": null, "overlay_distribution": null, "p0": "lead/catalogue context only or not linked", "p1": "not sufficient for domestic scanner attribution", "p2": "production context does not identify scanner vendor", "p3": "only SMIC has a reported prototype-evaluation lead", "p4": "not proven", "p5": "not proven", "p6": "not proven", "process_id": "proc-lithography-immersion-arf", "readiness_state": "unknown", "record_type": "capability", "recurring_two_quarter_volume": null, "resist": null, "serial_or_purchase_evidence": null, "site_acceptance": null, "source_ids": [ "src-reuters-duv-aishengna-2026" ], "taxonomy": "domestic_duv_fab_matrix", "track": null, "verified_domestic_duv_state": "UNRESOLVED", "wafers_per_hour": null, "wavelength": null, "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "96a0e9b8dc5b92fc49b608486681dca124072143ec7c41cc9a36bf937d525ce7", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "domestic_duv_fab_matrix" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "domestic_duv_fab_matrix" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-reuters-duv-aishengna-2026", "title": "China starts production of home-grown immersion DUV chipmaking tools, source says", "publisher": "Reuters", "url": "https://www.reuters.com/world/china/china-starts-production-home-grown-immersion-duv-chipmaking-tools-source-2026-07-28/", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2026-07-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Anonymous-source report; no model, serial, purchase order, shipment, installation, site acceptance, layer qualification, uptime, yield, or recurring volume." ] } ], "entity_reference": { "entity_id": "ent-huahong-semiconductor", "record_level": "company", "canonical_legal_name_en": "Hua Hong Semiconductor Limited", "canonical_legal_name_cn": "华虹半导体有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "availability": null, "capability_id": "cap-duv-fab-jhicc", "cd_window": null, "claim_ids": [], "completion_state": "source_backed", "conclusion": "Official page proves memory scope only; operating/production/scanner milestones remain open.", "defectivity": null, "electrical_yield": null, "entity_id": "ent-jhicc", "evidence_state": "UNRESOLVED", "focus_control": null, "good_die_output": null, "highest_source_bounded_context_state": "unresolved", "id": "cap-duv-fab-jhicc", "installation": null, "last_checked": "2026-07-29", "model": null, "move_in": null, "mtbf": null, "mttr": null, "name": "Fujian Jinhua / JHICC domestic-DUV insertion matrix", "named_layer": null, "next_evidence_needed": "Named legal fab and model plus purchase/receiving, move-in, installation, site acceptance, qualified layer, process window, electrical yield and two-quarter production receipt.", "numerical_aperture": null, "overlay": null, "overlay_distribution": null, "p0": "lead/catalogue context only or not linked", "p1": "not sufficient for domestic scanner attribution", "p2": "production context does not identify scanner vendor", "p3": "only SMIC has a reported prototype-evaluation lead", "p4": "not proven", "p5": "not proven", "p6": "not proven", "process_id": "proc-lithography-immersion-arf", "readiness_state": "unknown", "record_type": "capability", "recurring_two_quarter_volume": null, "resist": null, "serial_or_purchase_evidence": null, "site_acceptance": null, "source_ids": [ "src-jhicc-about" ], "taxonomy": "domestic_duv_fab_matrix", "track": null, "verified_domestic_duv_state": "UNRESOLVED", "wafers_per_hour": null, "wavelength": null, "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "9e07a2eb8cf3813a17c09191c6d51fc9ee01cef326af89e74506c180393e7f99", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "domestic_duv_fab_matrix" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "domestic_duv_fab_matrix" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jhicc-about", "title": "关于晋华", "publisher": "福建省晋华集成电路有限公司", "url": "https://www.jhicc.cn/AboutUs.html?info=quality", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Does not disclose qualified product, production state, capacity, yield, output or scanner fleet." ] } ], "entity_reference": { "entity_id": "ent-jhicc", "record_level": "company", "canonical_legal_name_en": "Fujian Jinhua Integrated Circuit Co., Ltd.", "canonical_legal_name_cn": "福建省晋华集成电路有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "availability": null, "capability_id": "cap-duv-fab-smic", "cd_window": null, "claim_ids": [], "completion_state": "source_backed", "conclusion": "Paywalled secondary report of prototype evaluation; no primary receipt.", "defectivity": null, "electrical_yield": null, "entity_id": "ent-smic", "evidence_state": "PLAUSIBLE_UNVERIFIED", "focus_control": null, "good_die_output": null, "highest_source_bounded_context_state": "P3 reported only", "id": "cap-duv-fab-smic", "installation": null, "last_checked": "2026-07-29", "model": null, "move_in": null, "mtbf": null, "mttr": null, "name": "SMIC domestic-DUV insertion matrix", "named_layer": null, "next_evidence_needed": "Named legal fab and model plus purchase/receiving, move-in, installation, site acceptance, qualified layer, process window, electrical yield and two-quarter production receipt.", "numerical_aperture": null, "overlay": null, "overlay_distribution": null, "p0": "lead/catalogue context only or not linked", "p1": "not sufficient for domestic scanner attribution", "p2": "production context does not identify scanner vendor", "p3": "only SMIC has a reported prototype-evaluation lead", "p4": "not proven", "p5": "not proven", "p6": "not proven", "process_id": "proc-lithography-immersion-arf", "readiness_state": "unknown", "record_type": "capability", "recurring_two_quarter_volume": null, "resist": null, "serial_or_purchase_evidence": null, "site_acceptance": null, "source_ids": [ "src-ft-yuliangsheng-smic-2026" ], "taxonomy": "domestic_duv_fab_matrix", "track": null, "verified_domestic_duv_state": "UNRESOLVED", "wafers_per_hour": null, "wavelength": null, "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "58f9288aed468c057ae7a098b422d4faac10e8d7ceaf25d49c299da6054b9a82", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "domestic_duv_fab_matrix" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "domestic_duv_fab_matrix" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-ft-yuliangsheng-smic-2026", "title": "China trials its first advanced tools for AI chipmaking", "publisher": "Financial Times", "url": "https://www.ft.com/content/8fd79522-e34f-4633-bc87-ef0aae2d9159", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2025-09-17", "date_checked": "2026-07-29", "access_state": "paywalled", "limitations": [ "Paywalled secondary report; prototype evaluation is not delivery/acceptance or qualified production." ] } ], "entity_reference": { "entity_id": "ent-smic", "record_level": "company", "canonical_legal_name_en": "Semiconductor Manufacturing International Corporation", "canonical_legal_name_cn": "中芯国际集成电路制造有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "availability": null, "capability_id": "cap-duv-fab-swaysure", "cd_window": null, "claim_ids": [], "completion_state": "source_backed", "conclusion": "Official page proves an R&D scope only; an operating fab is not proven.", "defectivity": null, "electrical_yield": null, "entity_id": "ent-swaysure", "evidence_state": "UNRESOLVED", "focus_control": null, "good_die_output": null, "highest_source_bounded_context_state": "unresolved", "id": "cap-duv-fab-swaysure", "installation": null, "last_checked": "2026-07-29", "model": null, "move_in": null, "mtbf": null, "mttr": null, "name": "Swaysure domestic-DUV insertion matrix", "named_layer": null, "next_evidence_needed": "Named legal fab and model plus purchase/receiving, move-in, installation, site acceptance, qualified layer, process window, electrical yield and two-quarter production receipt.", "numerical_aperture": null, "overlay": null, "overlay_distribution": null, "p0": "lead/catalogue context only or not linked", "p1": "not sufficient for domestic scanner attribution", "p2": "production context does not identify scanner vendor", "p3": "only SMIC has a reported prototype-evaluation lead", "p4": "not proven", "p5": "not proven", "p6": "not proven", "process_id": "proc-lithography-immersion-arf", "readiness_state": "unknown", "record_type": "capability", "recurring_two_quarter_volume": null, "resist": null, "serial_or_purchase_evidence": null, "site_acceptance": null, "source_ids": [ "src-swaysure-home" ], "taxonomy": "domestic_duv_fab_matrix", "track": null, "verified_domestic_duv_state": "UNRESOLVED", "wafers_per_hour": null, "wavelength": null, "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "501a48527f42548f25bd4da326cb95fd245525a981346de863f4a8330b61afbd", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "domestic_duv_fab_matrix" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "domestic_duv_fab_matrix" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-swaysure-home", "title": "深圳市昇维旭技术有限公司官网", "publisher": "深圳市昇维旭技术有限公司", "url": "https://www.swaysure.com/", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Does not prove an operating fab, product generation, volume production or scanner fleet." ] } ], "entity_reference": { "entity_id": "ent-swaysure", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "深圳市昇维旭技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "availability": null, "capability_id": "cap-duv-fab-xmc", "cd_window": null, "claim_ids": [], "completion_state": "source_backed", "conclusion": "Two fabs and output are proven; domestic scanner identity is not.", "defectivity": null, "electrical_yield": null, "entity_id": "ent-xmc", "evidence_state": "CONFIRMED_PRIMARY", "focus_control": null, "good_die_output": null, "highest_source_bounded_context_state": "P2 production context; scanner unidentified", "id": "cap-duv-fab-xmc", "installation": null, "last_checked": "2026-07-29", "model": null, "move_in": null, "mtbf": null, "mttr": null, "name": "Wuhan Xinxin / XMC domestic-DUV insertion matrix", "named_layer": null, "next_evidence_needed": "Named legal fab and model plus purchase/receiving, move-in, installation, site acceptance, qualified layer, process window, electrical yield and two-quarter production receipt.", "numerical_aperture": null, "overlay": null, "overlay_distribution": null, "p0": "lead/catalogue context only or not linked", "p1": "not sufficient for domestic scanner attribution", "p2": "production context does not identify scanner vendor", "p3": "only SMIC has a reported prototype-evaluation lead", "p4": "not proven", "p5": "not proven", "p6": "not proven", "process_id": "proc-lithography-immersion-arf", "readiness_state": "unknown", "record_type": "capability", "recurring_two_quarter_volume": null, "resist": null, "serial_or_purchase_evidence": null, "site_acceptance": null, "source_ids": [ "src-xmc-prospectus-2025" ], "taxonomy": "domestic_duv_fab_matrix", "track": null, "verified_domestic_duv_state": "UNRESOLVED", "wafers_per_hour": null, "wavelength": null, "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "8032e78de20b7676ad88aee9319136ce0ff188fe76d30b051edee445887d05a4", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "domestic_duv_fab_matrix" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "domestic_duv_fab_matrix" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-xmc-prospectus-2025", "title": "武汉新芯集成电路股份有限公司招股说明书", "publisher": "武汉新芯集成电路股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202509/002044_20250929_SM99.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-09-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Fab phases, scanner fleet, periodic output and yield are not disclosed in the reviewed sections." ] } ], "entity_reference": { "entity_id": "ent-xmc", "record_level": "company", "canonical_legal_name_en": "Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.", "canonical_legal_name_cn": "武汉新芯集成电路股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "availability": null, "capability_id": "cap-duv-fab-ymtc", "cd_window": null, "claim_ids": [], "completion_state": "source_backed", "conclusion": "Product production is proven; domestic scanner identity is not.", "defectivity": null, "electrical_yield": null, "entity_id": "ent-ymtc", "evidence_state": "CONFIRMED_PRIMARY", "focus_control": null, "good_die_output": null, "highest_source_bounded_context_state": "P2 production context; scanner unidentified", "id": "cap-duv-fab-ymtc", "installation": null, "last_checked": "2026-07-29", "model": null, "move_in": null, "mtbf": null, "mttr": null, "name": "YMTC domestic-DUV insertion matrix", "named_layer": null, "next_evidence_needed": "Named legal fab and model plus purchase/receiving, move-in, installation, site acceptance, qualified layer, process window, electrical yield and two-quarter production receipt.", "numerical_aperture": null, "overlay": null, "overlay_distribution": null, "p0": "lead/catalogue context only or not linked", "p1": "not sufficient for domestic scanner attribution", "p2": "production context does not identify scanner vendor", "p3": "only SMIC has a reported prototype-evaluation lead", "p4": "not proven", "p5": "not proven", "p6": "not proven", "process_id": "proc-lithography-immersion-arf", "readiness_state": "unknown", "record_type": "capability", "recurring_two_quarter_volume": null, "resist": null, "serial_or_purchase_evidence": null, "site_acceptance": null, "source_ids": [ "src-ymtc-about", "src-ymtc-64layer-2019" ], "taxonomy": "domestic_duv_fab_matrix", "track": null, "verified_domestic_duv_state": "UNRESOLVED", "wafers_per_hour": null, "wavelength": null, "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "5a799315e0cdf724434dab2171cd95e800b183284b1bd97a202f160ed0d8a94c", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "domestic_duv_fab_matrix" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "domestic_duv_fab_matrix" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ymtc-about", "title": "企业简介", "publisher": "长江存储科技有限责任公司", "url": "https://www.ymtc.com/cn/aboutus.html", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Does not disclose scanner vendors/models, capacity, yield or supplier BOM." ] }, { "source_id": "src-ymtc-64layer-2019", "title": "采用Xtacking®架构，长江存储启动64层3D NAND闪存量产", "publisher": "长江存储科技有限责任公司", "url": "https://www.ymtc.com/cn/news/37.html", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2019-09-02", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical product evidence; scanner vendor/model and current generation/fleet are not disclosed." ] } ], "entity_reference": { "entity_id": "ent-ymtc", "record_level": "company", "canonical_legal_name_en": "Yangtze Memory Technologies Co., Ltd.", "canonical_legal_name_cn": "长江存储科技有限责任公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-duv-nand-patterning-trace", "claim_ids": [], "completion_state": "lead_only", "device_family": "3D NAND", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "id": "cap-duv-nand-patterning-trace", "last_checked": "2026-07-29", "name": "3D-NAND domestic-DUV patterning proof trace", "process_id": "proc-nand-fabrication", "readiness_state": "unknown", "record_type": "capability", "required_layers": { "alignment": null, "channel_patterning": null, "cost_per_good_wafer": null, "cycle_time": null, "hard_masks": null, "high_aspect_ratio_etch_interaction": null, "inspection": null, "periphery": null, "slit_patterning": null, "staircase_patterning": null, "string_stacking": null, "yield": null }, "source_ids": [], "taxonomy": "duv_patterning_trace", "unknowns": [ "fab", "scanner model", "named layer", "process window", "electrical yield" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "fca0dd4798180145bc8f3d597374c5e3ea3de03733151fc874ba41fb486af49d", "stage_ids": [ "logic_foundry_process", "lithography", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-nand-fabrication" } ] }, { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "duv_patterning_trace" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-nand-fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "duv_patterning_trace" }, { "field": "process_id", "value": "proc-nand-fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "capability_id": "cap-hbm-step-accelerator-integration", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-system-architecture", "id": "cap-hbm-step-accelerator-integration", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Accelerator integration", "process_id": "proc-system-architecture", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "2f12de79daf1f30f229691a9251ad71812000023c3a8a8775d17e614b2577451", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-system-architecture" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "capability_id": "cap-hbm-step-base-die-phy", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-pdk-libraries-ip", "id": "cap-hbm-step-base-die-phy", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Base die and PHY", "process_id": "proc-pdk-libraries-ip", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "6817d411fb19ff1b3106d7935886828e62b84df554728bf30909d3832187fb0b", "stage_ids": [ "memory_manufacturer", "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-pdk-libraries-ip" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-pdk-libraries-ip" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "capability_id": "cap-hbm-step-burn-in", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-final-test-burnin", "id": "cap-hbm-step-burn-in", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Burn-in", "process_id": "proc-final-test-burnin", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "eae82eba89e22fb09d90c713c0184219ef4c6b1ba8c041573f996461043bdb3b", "stage_ids": [ "memory_manufacturer", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-final-test-burnin" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-final-test-burnin" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "capability_id": "cap-hbm-step-customer-qualification", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-accepted-result-economics", "id": "cap-hbm-step-customer-qualification", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Customer qualification", "process_id": "proc-accepted-result-economics", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "c1f9de9914a5f370fce99e158ac54a96ef7babc6ac34d67566829ad88299d840", "stage_ids": [ "memory_manufacturer", "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-accepted-result-economics" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-accepted-result-economics" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "candidate_ceiling": "inspection/test equipment category disclosed; coverage and HBM qualification absent", "candidate_source_ids": [ "src-tongfu-hbs-change-analysis-2025" ], "capability_id": "cap-hbm-step-final-test", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-final-test-burnin", "id": "cap-hbm-step-final-test", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Final test", "process_id": "proc-final-test-burnin", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "04cb2240692b5490bd0a9cac37503d49253abdea9d261cdad3273ce8025e200e", "stage_ids": [ "memory_manufacturer", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-final-test-burnin" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-final-test-burnin" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "candidate_ceiling": "interposer attach candidate only; no HBM product qualification", "candidate_source_ids": [ "src-tongfu-hbs-change-analysis-2025" ], "capability_id": "cap-hbm-step-interposer-rdl-substrate", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-rdl-interposer", "id": "cap-hbm-step-interposer-rdl-substrate", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Interposer, RDL or substrate", "process_id": "proc-rdl-interposer", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "6b7df40a75a3b7a8715c9a998afec8508e0ff60151df2b82c95a14d3a99b5a6a", "stage_ids": [ "memory_manufacturer", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-rdl-interposer" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-rdl-interposer" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "capability_id": "cap-hbm-step-known-good-die-selection", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-wafer-probe", "id": "cap-hbm-step-known-good-die-selection", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Known-good-die selection", "process_id": "proc-wafer-probe", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "82b5098e7cd7f5b84da73c0995ebc29ca042a5e2397a4256a5dd3c6fbf568910", "stage_ids": [ "memory_manufacturer", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-wafer-probe" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-wafer-probe" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "candidate_ceiling": "bump/flip-chip/reflow candidate only; hybrid bonding absent", "candidate_source_ids": [ "src-tongfu-hbs-change-analysis-2025" ], "capability_id": "cap-hbm-step-microbump-or-hybrid-bond", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-hybrid-bonding", "id": "cap-hbm-step-microbump-or-hybrid-bond", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Microbump or hybrid bond", "process_id": "proc-hybrid-bonding", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "937b5053f5628511577950e81df0cc02492fb53073af91ed9fbdf8563f52917a", "stage_ids": [ "memory_manufacturer", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-hybrid-bonding" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-hybrid-bonding" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "capability_id": "cap-hbm-step-qualified-dram-core-die", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-dram-fabrication", "id": "cap-hbm-step-qualified-dram-core-die", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Qualified DRAM core die", "process_id": "proc-dram-fabrication", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "16e334ba5c1b45588fdd3714a258c5898a1db7a01835b9b6bb3396794ded0052", "stage_ids": [ "logic_foundry_process", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-dram-fabrication" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-dram-fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-dram-fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "capability_id": "cap-hbm-step-reliability", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-reliability-failure-analysis", "id": "cap-hbm-step-reliability", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Reliability", "process_id": "proc-reliability-failure-analysis", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "4a7333f1c059343305bcc13d5a4be86fc173735e06410a454e4bedf0c702a2d2", "stage_ids": [ "memory_manufacturer", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-reliability-failure-analysis" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-reliability-failure-analysis" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "candidate_ceiling": "nine-layer assembly described; repair and HBM identity absent", "candidate_source_ids": [ "src-tongfu-hbs-change-analysis-2025" ], "capability_id": "cap-hbm-step-stack-assembly-repair", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-stack-assembly-repair", "id": "cap-hbm-step-stack-assembly-repair", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Stack assembly and repair", "process_id": "proc-stack-assembly-repair", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "0f7c27d0fb6eeb20ee1989ce6e5dc6b4845ee65eac7626bb2c43281ae2f190f8", "stage_ids": [ "memory_manufacturer", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-stack-assembly-repair" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-stack-assembly-repair" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "capability_id": "cap-hbm-step-sustained-production-yield", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-accepted-result-economics", "id": "cap-hbm-step-sustained-production-yield", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Sustained production yield", "process_id": "proc-accepted-result-economics", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "2e09122e1af4debeaf7866855a926080948bbb09814686c6092c6cebd32eaa88", "stage_ids": [ "memory_manufacturer", "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-accepted-result-economics" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-accepted-result-economics" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "capability_id": "cap-hbm-step-sustained-shipment-volume", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-accepted-result-economics", "id": "cap-hbm-step-sustained-shipment-volume", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Sustained shipment volume", "process_id": "proc-accepted-result-economics", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "052dfe4642bcd73e26b5a55daae1e401252e2a6b4220344d7e8d422e77648bbe", "stage_ids": [ "memory_manufacturer", "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-accepted-result-economics" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-accepted-result-economics" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "capability_id": "cap-hbm-step-thermal-power-closure", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-power-cooling", "id": "cap-hbm-step-thermal-power-closure", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Thermal and power closure", "process_id": "proc-power-cooling", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "623953feff8bd468d983d5f619f0ce421fec2b74412cf1446bf16afc2e387efd", "stage_ids": [ "memory_manufacturer", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-power-cooling" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-power-cooling" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "candidate_ceiling": "generic trial-line thinning/CMP; no HBM die or qualified stack", "candidate_source_ids": [ "src-tongfu-hbs-change-analysis-2025" ], "capability_id": "cap-hbm-step-thinning-cmp", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-wafer-thinning", "id": "cap-hbm-step-thinning-cmp", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Thinning and CMP", "process_id": "proc-wafer-thinning", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "dd3c5337a9b2e8f25c8ab69b1fc4a9bb79221d3e26584177513b0e54dc32c47b", "stage_ids": [ "memory_manufacturer", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-wafer-thinning" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-wafer-thinning" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "candidate_ceiling": "generic seed/plating flow; no HBM die, TSV literal or qualification", "candidate_source_ids": [ "src-tongfu-hbs-change-analysis-2025" ], "capability_id": "cap-hbm-step-tsv-dielectric-barrier-seed-plating", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-tsv", "id": "cap-hbm-step-tsv-dielectric-barrier-seed-plating", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "TSV dielectric, barrier, seed and plating", "process_id": "proc-tsv", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "dc4ffe1db0b9bc6c1f5c942e4380e106150283592197953dfb46d9aabc891f5b", "stage_ids": [ "memory_manufacturer", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-tsv" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-tsv" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "capability_id": "cap-hbm-step-tsv-formation", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-tsv", "id": "cap-hbm-step-tsv-formation", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "TSV formation", "process_id": "proc-tsv", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "33333e6de3af6aaa198247fd662bfb8958a976269d717d83de4605f168450fbf", "stage_ids": [ "memory_manufacturer", "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-tsv" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-tsv" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "capability_id": "cap-hbm-step-wafer-probe", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-wafer-probe", "id": "cap-hbm-step-wafer-probe", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Wafer probe", "process_id": "proc-wafer-probe", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "063057e0bad9b8bb40a889c7532c6e0d0368a1017345c857bbf44ed7d752adf3", "stage_ids": [ "memory_manufacturer", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "conventional_hbm_step" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-wafer-probe" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "conventional_hbm_step" }, { "field": "process_id", "value": "proc-wafer-probe" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "entity_reference": { "entity_id": "ent-mainland-qualified-hbm-analysis", "record_level": "analysis_subject", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." } }, { "architecture_classification": [ "H3" ], "bandwidth": { "label": "storage interface; not local accelerator-memory bandwidth" }, "capability_id": "cap-memblaze-nvme-h3", "capacity": "SKU-dependent", "claim_ids": [ "clm-memblaze-ymtc-bom" ], "completion_state": "source_backed", "energy_per_bit": null, "entity_id": "ent-memblaze", "evidence_state": "CONFIRMED_PRIMARY", "foreign_dependencies": [], "id": "cap-memblaze-nvme-h3", "last_checked": "2026-07-29", "latency_distribution": null, "memory_medium": "YMTC 3D NAND", "name": "PBlaze6 6541 YMTC-NAND NVMe storage tier", "package": "SSD", "physical_byte_path": "host PCIe/NVMe → SSD controller → NAND", "physical_location": "enterprise NVMe SSD", "process_id": "proc-storage-tier", "readiness_state": "unknown", "record_type": "capability", "software_requirements": [ "NVMe driver and storage tiering if used for AI" ], "source_ids": [ "src-memblaze-ymtc-pblaze6" ], "taxonomy": "hbm_reduced_architecture", "unknowns": [ "controller/PMIC origin", "p50/p99 transfer latency", "sustained throughput", "energy", "endurance", "contention", "active-state reinstall", "recovery", "accelerator integration" ], "workload_fit": [ "checkpoint/storage/direct-storage candidate; no DF1000 or accelerator join" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "0fd30b601eb059746c989c30d91c305ff51fbadff5d9868fe493e81f4ca30d62", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "hbm_reduced_architecture" }, { "field": "process_id", "value": "proc-storage-tier" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "hbm_reduced_architecture" }, { "field": "process_id", "value": "proc-storage-tier" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-memblaze-ymtc-pblaze6", "title": "PBlaze6 6541 Enterprise SSD", "publisher": "北京忆恒创源科技股份有限公司", "url": "https://www.memblaze.com/product/pblaze6/639.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Direct product BOM join for NAND only; controller, PMIC, firmware component origins and shipment volume are not fully disclosed." ] } ], "entity_reference": { "entity_id": "ent-memblaze", "record_level": "company", "canonical_legal_name_en": "Memblaze Technology Co., Ltd.", "canonical_legal_name_cn": "北京忆恒创源科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "architecture_classification": [ "H3" ], "bandwidth": { "label": "vendor interface signaling ceiling, not sustained payload", "unit": "GT/s", "value": 64 }, "capability_id": "cap-montage-mxc-h3", "capacity": null, "claim_ids": [ "clm-montage-mxc-specs" ], "completion_state": "source_backed", "energy_per_bit": null, "entity_id": "ent-montage", "evidence_state": "VENDOR_REPORTED", "foreign_dependencies": [ "CXL/PCIe ecosystem" ], "id": "cap-montage-mxc-h3", "last_checked": "2026-07-29", "latency_distribution": null, "memory_medium": "DDR5 behind a CXL controller", "name": "M88MX6852 CXL/DDR5 memory-expansion path", "package": "controller package and DIMM topology undisclosed", "physical_byte_path": "host/accelerator PCIe/CXL link → controller → DDR5", "physical_location": "CXL-attached expansion memory", "process_id": "proc-storage-tier", "readiness_state": "unknown", "record_type": "capability", "software_requirements": [ "CXL-capable platform and memory-tiering software" ], "source_ids": [ "src-montage-mxc-official" ], "taxonomy": "hbm_reduced_architecture", "unknowns": [ "deployment", "p50/p99 latency", "sustained throughput", "energy", "endurance", "contention", "active-state reinstall", "recovery" ], "workload_fit": [ "capacity expansion; accelerator use not proven" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "995e4c3b97b8049f45c1f4ed357f9dc5ab6a7cfc8a3e4efd27e9dd36cec8bd9c", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "hbm_reduced_architecture" }, { "field": "process_id", "value": "proc-storage-tier" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "hbm_reduced_architecture" }, { "field": "process_id", "value": "proc-storage-tier" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-montage-mxc-official", "title": "MXC Memory Expansion Controller", "publisher": "澜起科技股份有限公司", "url": "https://www.montage-tech.com/index.php/MXC", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Product availability does not prove deployment in a named accelerator, p50/p99 latency, energy, contention, or recovery." ] } ], "entity_reference": { "entity_id": "ent-montage", "record_level": "company", "canonical_legal_name_en": "Montage Technology Co., Ltd.", "canonical_legal_name_cn": "澜起科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-nsig-300mm-capacity", "claim_ids": [], "completion_state": "source_backed", "entity_id": "ent-nsig", "evidence_state": "CONFIRMED_PRIMARY", "id": "cap-nsig-300mm-capacity", "last_checked": "2026-07-29", "name": "Group-reported 300 mm wafer capacity", "process_id": "proc-silicon-wafers", "readiness_state": "volume_production", "record_type": "capability", "reported_capacity": { "capacity_state": "group_reported; installed/qualified/output split unresolved", "scope": "Shanghai and Taiyuan aggregate", "unit": "wafers_per_month", "value": 850000 }, "source_ids": [ "src-nsig-capacity-2025", "src-nsig-inquiry-2025" ], "taxonomy": "materials_capacity", "unknowns": [ "facility split", "installed/qualified/actual output", "yield", "customer allocation" ], "utilization_receipt": { "entity": "ent-xinsheng-jingke", "period": "2024", "unit": "percent", "value": 88.11 }, "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "b9c7a6739a19ed9607fbda3d38b61385360343f57f283861b6b0f2a624066a11", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "materials_capacity" }, { "field": "process_id", "value": "proc-silicon-wafers" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "materials_capacity" }, { "field": "process_id", "value": "proc-silicon-wafers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nsig-capacity-2025", "title": "上海硅产业集团股份有限公司2026年度“提质增效重回报”行动方案", "publisher": "上海硅产业集团股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-17/1225114299.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group capacity is not installed-tool count, qualified output, actual output, utilization, yield or fab-specific capacity." ] }, { "source_id": "src-nsig-inquiry-2025", "title": "关于上海硅产业集团股份有限公司发行股份及支付现金购买资产并募集配套资金申请审核问询函的回复", "publisher": "上海证券交易所 / 立信会计师事务所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202509/688126_20250901_U2SY.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-09-01", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Equipment vendors and a domestic polysilicon supplier are anonymized; forecasts are not actual production." ] } ], "entity_reference": { "entity_id": "ent-nsig", "record_level": "company", "canonical_legal_name_en": "National Silicon Industry Group Co., Ltd.", "canonical_legal_name_cn": "上海硅产业集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-piotech-hybrid-bonding", "claim_ids": [ "clm-piotech-bonding-portfolio" ], "completion_state": "source_backed", "entity_id": "ent-piotech", "evidence_state": "VENDOR_REPORTED", "id": "cap-piotech-hybrid-bonding", "last_checked": "2026-07-29", "name": "W2W/D2W hybrid and fusion bonding portfolio", "process_id": "proc-hybrid-bonding", "readiness_state": "manufactured", "record_type": "capability", "source_ids": [ "src-piotech-annual-2025" ], "taxonomy": "advanced_packaging", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "10d480fd7c2b1130232da4e440128793cb8723a3e425f787d6ce46f11d23376d", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "advanced_packaging" }, { "field": "process_id", "value": "proc-hybrid-bonding" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "advanced_packaging" }, { "field": "process_id", "value": "proc-hybrid-bonding" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-piotech-annual-2025", "title": "拓荆科技股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688072_20260428_IFOF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio and issuer-reported progress do not establish a named HBM customer or qualified HBM production." ] } ], "entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-smee-ssa600-p0", "claim_ceiling": "official catalogue entry only", "claim_ids": [ "clm-smee-ssa600-catalogue" ], "completion_state": "source_backed", "customer": null, "domestic_duv_state": "P0", "entity_id": "ent-smee", "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "cap-smee-ssa600-p0", "last_checked": "2026-07-29", "model": "SSA600/SSX600 series", "name": "SSA600/SSX600 catalogue system", "numerical_aperture": null, "process_id": "proc-lithography-iline-krf", "qualified_layer": null, "readiness_state": "unknown", "record_type": "capability", "source_ids": [ "src-smee-ssa600-official" ], "taxonomy": "domestic_duv_system", "wavelength": null, "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "1a02a1f8f6e8ac8b094ea76d27149a82077f071e04ef0210fbf2e12caed5c3da", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "domestic_duv_system" }, { "field": "process_id", "value": "proc-lithography-iline-krf" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "domestic_duv_system" }, { "field": "process_id", "value": "proc-lithography-iline-krf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-smee-ssa600-official", "title": "600 Series Step-and-Scan Lithography System", "publisher": "上海微电子装备（集团）股份有限公司", "url": "https://www.smee.com.cn/eis.pub?method=indexinfo&onclicknodeno=1_4_1_1&service=homepageService", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue capability only; no named facility, serial number, installation, site acceptance, qualified layer, uptime, or yield." ] } ], "entity_reference": { "entity_id": "ent-smee", "record_level": "company", "canonical_legal_name_en": "Shanghai Micro Electronics Equipment (Group) Co., Ltd.", "canonical_legal_name_cn": "上海微电子装备（集团）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-smee-ssc800-10-award", "claim_ceiling": "award/vendor selection only; no signed contract, manufacture, shipment, delivery, installation or P4 site acceptance", "claim_ids": [ "clm-smee-ssc800-award-2025" ], "commercial_milestone": "procurement_award_contract_pending", "completion_state": "source_backed", "customer": "unresolved buyer alias zycgr22011903 / using-unit code LGGJ实验室", "domestic_duv_state": "P0", "entity_id": "ent-smee", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "cap-smee-ssc800-10-award", "last_checked": "2026-07-29", "model": "SSC800/10", "name": "SSC800/10 procurement-award record", "process_id": "proc-lithography-iline-krf", "qualified_layer": null, "readiness_state": "unknown", "record_type": "capability", "source_ids": [ "src-ccgp-smee-ssc800-award-2025" ], "taxonomy": "domestic_duv_system", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "2ea5acae72ef88a1e3a5b6b1bd8b333667ccbe3b00f603800cb1cfaa28bb471e", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "domestic_duv_system" }, { "field": "process_id", "value": "proc-lithography-iline-krf" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "domestic_duv_system" }, { "field": "process_id", "value": "proc-lithography-iline-krf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ccgp-smee-ssc800-award-2025", "title": "zycgr22011903单一来源采购步进扫描式光刻机成交公告", "publisher": "中国政府采购网 / 财政部", "url": "https://www.ccgp.gov.cn/cggg/zygg/cjgg/202512/t20251225_25989183.htm", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2025-12-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Buyer legal identity remains unresolved; official address/contact correlation to 临港实验室 is strong but not a same-document legal-identity receipt.", "Award/vendor selection is not a signed contract, manufacturing completion, shipment, delivery, move-in, installation, site acceptance, asset registration or process qualification.", "Wavelength, NA, resolution, overlay, throughput, facility, layer, yield and production use are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-smee", "record_level": "company", "canonical_legal_name_en": "Shanghai Micro Electronics Equipment (Group) Co., Ltd.", "canonical_legal_name_cn": "上海微电子装备（集团）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-tongfu-hbm-project", "claim_ceiling": "project/EIA only; not customer-qualified HBM", "claim_ids": [ "clm-tongfu-hbm-project" ], "completion_state": "source_backed", "entity_id": "ent-nantong-tongfu", "evidence_state": "CONFIRMED_PRIMARY", "id": "cap-tongfu-hbm-project", "last_checked": "2026-07-29", "name": "HBM chiplet packaging R&D/line project", "process_id": "proc-osat-assembly", "readiness_state": "research_concept", "record_type": "capability", "source_ids": [ "src-tongfu-hbm-project-2025" ], "taxonomy": "hbm_project", "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "0725a05c237cd48de48c769a30de22f43deae6017afa4de41df05e2f238914ea", "stage_ids": [ "memory_manufacturer", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "hbm_project" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-osat-assembly" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "hbm_project" }, { "field": "process_id", "value": "proc-osat-assembly" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-tongfu-hbm-project-2025", "title": "HBM芯粒先进封装研发及产线建设项目环境影响报告表公示", "publisher": "通富微电子股份有限公司", "url": "https://www.tfme.com/news/1380.html", "source_type": "company_project_eia", "primary_status": "primary", "publication_date": "2025-01-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Project/EIA receipt is not HBM customer qualification, qualified stack generation, yield, shipment, or volume production." ] } ], "entity_reference": { "entity_id": "ent-nantong-tongfu", "record_level": "company", "canonical_legal_name_en": "Nantong TongFu Microelectronics Co., Ltd.", "canonical_legal_name_cn": "南通通富微电子有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-tongfu-hbs-trial-line", "claim_ceiling": "trial process line; source never says HBM and proves no qualified conventional-HBM stack", "claim_ids": [ "clm-tongfu-hbs-trial-production-ceiling", "clm-tongfu-hbs-designed-capacity-units" ], "completion_state": "source_backed", "entity_id": "ent-nantong-tongfu", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-nantong-tongfu-hbs-chiplet-line", "id": "cap-tongfu-hbs-trial-line", "last_checked": "2026-07-29", "name": "High-bandwidth-storage-chiplet trial packaging line", "process_flow": [ "Ti/Cu seed sputter", "Cu/Ni/SnAg/Au plating", "bump formation", "temporary glass bond", "thinning", "CMP", "dry etch/CVD", "backside bump", "dicing", "flip-chip interposer attach", "nine-layer stack", "molding", "further thinning", "laser debond" ], "process_id": "proc-osat-assembly", "readiness_state": "process_development", "record_type": "capability", "source_ids": [ "src-tongfu-hbs-change-analysis-2025", "src-tongfu-annual-2025" ], "taxonomy": "hbm_candidate_process_line", "tool_count_receipt": { "CMP_tool": 1, "chip_sorter": 1, "high_precision_thermocompression_bonders": 5, "laser_debonder": 1, "models_and_vendors": null, "temporary_bonder": 1 }, "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "1f30087ce132a4aa03d19faedccb408e3ef3fdcdaa106ddf8626f3bddaa1aa66", "stage_ids": [ "memory_manufacturer", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "hbm_candidate_process_line" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-osat-assembly" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "hbm_candidate_process_line" }, { "field": "process_id", "value": "proc-osat-assembly" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-tongfu-hbs-change-analysis-2025", "title": "南通通富微电子有限公司高带宽存储芯粒先进封装技术研发和产线建设项目一般变动环境影响分析", "publisher": "南通通富微电子有限公司", "url": "https://omo-oss-file110.thefastfile.com/portal-saas/pg2025022515115656448/cms/file/南通通富微电子一般变动环境影响分析报告.pdf", "source_type": "environmental_impact_analysis", "primary_status": "primary", "publication_date": "2025-06-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The source never uses HBM and names no DRAM die owner, base die/PHY, customer or accelerator.", "The 片/块 capacity-unit mapping requires reconciliation; both are design capacity, not qualified or actual output.", "Tool counts are disclosed but models and vendors are not." ] }, { "source_id": "src-tongfu-annual-2025", "title": "通富微电子股份有限公司2025年年度报告", "publisher": "通富微电子股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-17/1225112762.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Two high-bandwidth-memory references are industry context; no named HBM product, customer, qualification, yield or shipment." ] } ], "entity_reference": { "entity_id": "ent-nantong-tongfu", "record_level": "company", "canonical_legal_name_en": "Nantong TongFu Microelectronics Co., Ltd.", "canonical_legal_name_cn": "南通通富微电子有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-verisilicon-gf-h3-not-hbm", "claim_ids": [], "completion_state": "source_backed", "entity_id": "ent-verisilicon", "evidence_state": "CONFIRMED_PRIMARY", "foundry_entity_id": "ent-globalfoundries", "id": "cap-verisilicon-gf-h3-not-hbm", "last_checked": "2026-07-29", "name": "Foreign-foundry dependency in a mainland design-service/IP platform", "pdk": "revision undisclosed", "process": "22FDX 22 nm FD-SOI", "process_id": "proc-pdk-libraries-ip", "readiness_state": "shipped", "record_type": "capability", "source_ids": [ "src-verisilicon-gf-22fdx-2025" ], "taxonomy": "design_dependency", "unknowns": [ "facility", "named customer/chip", "IP mix", "shipment split" ], "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "cbc7980084bfeca72d2ec7196d0498449577697f68b229afa290220d4758ef4d", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "process_id", "value": "proc-pdk-libraries-ip" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "design_dependency" }, { "field": "process_id", "value": "proc-pdk-libraries-ip" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-verisilicon-gf-22fdx-2025", "title": "VeriSilicon Introduces FD-SOI Wireless IP Platform", "publisher": "VeriSilicon Microelectronics (Shanghai) Co., Ltd.", "url": "https://www.verisilicon.com/en/PressRelease/WirelessIP", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2025-09-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers and chips are anonymous; facility and shipment split are undisclosed." ] } ], "entity_reference": { "entity_id": "ent-verisilicon", "record_level": "company", "canonical_legal_name_en": "VeriSilicon Microelectronics (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "芯原微电子（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } }, { "capability_id": "cap-yuliangsheng-smic-p3", "claim_ceiling": "paywalled secondary report of group-level prototype evaluation; facility unidentified", "claim_ids": [ "clm-yuliangsheng-smic-p3" ], "completion_state": "source_backed", "customer": "SMIC group", "domestic_duv_state": "P3", "entity_id": "ent-yuliangsheng", "evidence_state": "PLAUSIBLE_UNVERIFIED", "facility_id": null, "id": "cap-yuliangsheng-smic-p3", "last_checked": "2026-07-29", "model": null, "name": "Reported immersion prototype evaluation at SMIC", "numerical_aperture": null, "process_id": "proc-lithography-immersion-arf", "qualified_layer": null, "readiness_state": "engineering_prototype", "record_type": "capability", "source_ids": [ "src-ft-yuliangsheng-smic-2026" ], "taxonomy": "domestic_duv_system", "wavelength": 193, "canonical_dataset": "capabilities.yaml", "canonical_record_sha256": "46e94ab54a20d191b29a0e4f10085ac2f0882989d42b6cc4e3cc1639bdaf32a4", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "taxonomy", "value": "domestic_duv_system" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ] } ], "canonical_classification_inputs": [ { "field": "taxonomy", "value": "domestic_duv_system" }, { "field": "process_id", "value": "proc-lithography-immersion-arf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-ft-yuliangsheng-smic-2026", "title": "China trials its first advanced tools for AI chipmaking", "publisher": "Financial Times", "url": "https://www.ft.com/content/8fd79522-e34f-4633-bc87-ef0aae2d9159", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2025-09-17", "date_checked": "2026-07-29", "access_state": "paywalled", "limitations": [ "Paywalled secondary report; prototype evaluation is not delivery/acceptance or qualified production." ] } ], "entity_reference": { "entity_id": "ent-yuliangsheng", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海宇量昇科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." } } ], "processes": [ { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-accepted-result-economics" ], "id": "proc-accepted-result-economics", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "workload", "name": "Accepted output, cost, energy, reliability and margin", "process_id": "proc-accepted-result-economics", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "72a48040999ee022bf640f1fc8dfa434acd1d86ef9b8713d9862d6e7ebcd3210", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "layer", "value": "workload" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "workload" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-analog-design" ], "id": "proc-analog-design", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "eda", "name": "Analog and custom design", "process_id": "proc-analog-design", "record_type": "process", "source_ids": [ "src-empyrean-annual-2025", "src-primarius-annual-2025" ], "verified_entity_ids": [ "ent-empyrean", "ent-primarius" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "1697207bd27a1a82afb9263e4a27c3fd9b9c34b4e93c1849de08d354de1f586d", "stage_ids": [ "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "layer", "value": "eda" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "eda" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-empyrean-annual-2025", "title": "北京华大九天科技股份有限公司2025年年度报告", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-28/1225215590.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio disclosure does not establish a successful advanced-node tapeout, named PDK, or independent parity." ] }, { "source_id": "src-primarius-annual-2025", "title": "上海概伦电子股份有限公司2025年年度报告摘要", "publisher": "上海证券交易所", "url": "https://static.cninfo.com.cn/finalpage/2026-04-16/1225108666.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Summary-level portfolio statement; customer, PDK, tapeout, process and production-chip evidence remain product-specific." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-analog-rf-power-sensor" ], "id": "proc-analog-rf-power-sensor", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "fabrication", "name": "Analog, RF, power, MEMS and sensor fabrication", "process_id": "proc-analog-rf-power-sensor", "record_type": "process", "source_ids": [ "src-huahong-annual-2025", "src-reuters-duv-aishengna-2026" ], "verified_entity_ids": [ "ent-huahong-semiconductor" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "8d8052e11a8911f86f7529304f31bb136f4019c9000fb77ac96d22906026a436", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_and_secondary", "source_refs": [ { "source_id": "src-huahong-annual-2025", "title": "Hua Hong Semiconductor Limited 2025 Annual Report", "publisher": "Hong Kong Exchanges and Clearing Limited", "url": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0326/2026032602731_c.pdf", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-03-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group disclosure does not identify a product's foundry, scanner fleet, customer, yield or complete supplier BOM." ] }, { "source_id": "src-reuters-duv-aishengna-2026", "title": "China starts production of home-grown immersion DUV chipmaking tools, source says", "publisher": "Reuters", "url": "https://www.reuters.com/world/china/china-starts-production-home-grown-immersion-duv-chipmaking-tools-source-2026-07-28/", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2026-07-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Anonymous-source report; no model, serial, purchase order, shipment, installation, site acceptance, layer qualification, uptime, yield, or recurring volume." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-boards-optics-network" ], "id": "proc-boards-optics-network", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "systems", "name": "Boards, optics and networking", "process_id": "proc-boards-optics-network", "record_type": "process", "source_ids": [ "src-dfsx-3d-near-memory-2026", "src-dfsx-df1000-product-2026" ], "verified_entity_ids": [ "ent-dfsx" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "af7e2ff26441ae1e27a740a6cf6cf23f5a760877666d4902e1e568aea879cf80", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "layer", "value": "systems" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dfsx-3d-near-memory-2026", "title": "3D Near-Memory Computing", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/technology/3d-near-memory-computing", "source_type": "company_technology_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported architecture; no bond pitch, memory die source, layer count, yield, or independent test." ] }, { "source_id": "src-dfsx-df1000-product-2026", "title": "DF1000 AI Accelerator", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/products/ai-accelerator/df1000", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor page exposes no independent workload receipt, memory supplier, foundry, package yield, power, customer, or shipment volume." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-channel-authorized-distribution" ], "id": "proc-channel-authorized-distribution", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "distribution", "name": "Authorized semiconductor distribution", "process_id": "proc-channel-authorized-distribution", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "f19cfefd5e4a9949c10fd4d95e19fd83a34a4fd49d51e92f0e6ec6bbdc98d8db", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "distribution" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "distribution" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-channel-equipment-material-agents" ], "id": "proc-channel-equipment-material-agents", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "distribution", "name": "Equipment and material agents and service organizations", "process_id": "proc-channel-equipment-material-agents", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "97b98a1770d61d94d17b20d6dcf148c7161d172d3b3bfd2c5bd5dd70de328883", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "distribution" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "distribution" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-channel-inventory-spot-resale" ], "id": "proc-channel-inventory-spot-resale", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "distribution", "name": "Inventory ownership and spot-market resale", "process_id": "proc-channel-inventory-spot-resale", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "c48a8d3321c6e2291512f0a5bff223ca3e69e5e95213c2466fc8f9175a12c9a0", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "distribution" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "distribution" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-channel-module-distribution-assembly" ], "id": "proc-channel-module-distribution-assembly", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "distribution", "name": "Module distribution and assembly boundaries", "process_id": "proc-channel-module-distribution-assembly", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "ba866774960cca492d28864ceae22ac344b893c38f767047467e5a2bdd5bdf0c", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "distribution" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "distribution" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Ten legal/company or preserved group endpoints have exact product receipts; no model has a complete foundry-memory-OSAT-customer-yield chain.", "explicit_gap_ids": [ "gap-process-chip-ai-accelerator" ], "id": "proc-chip-ai-accelerator", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "AI accelerator products", "process_id": "proc-chip-ai-accelerator", "record_type": "process", "source_ids": [ "src-baidu-baige-deepseek-p800-20250217", "src-baidu-p800-large-cluster-caict-claim-20250723", "src-biren-annual-2025", "src-cambricon-annual-2025", "src-cambricon-mlu370x8-product", "src-ctyun-cambricon-cloud-20260703", "src-enflame-csrc-approval-20260709", "src-enflame-t20-t21-20210709", "src-h3c-h65-bios-574-20230804", "src-houmo-h30-youkong-20231229", "src-houmo-home", "src-houmo-m50-greatwall-20260531", "src-houmo-m50-product", "src-iluvatar-about", "src-iluvatar-annual-2025", "src-kunlun-k200-product", "src-kunlun-p800-cmb-20250327", "src-kunlun-r200-product", "src-kunlunxin-home", "src-metax-annual-2025", "src-metax-legal", "src-moore-threads-annual-2025", "src-moore-threads-legal", "src-moore-threads-listing-2025", "src-sophgo-bm1684x-product", "src-sophgo-privacy", "src-witmem-government-equity-20241105", "src-witmem-home", "src-witmem-wtm2101-product", "src-witmem-wtm8-about", "src-witmem-wtm8-product" ], "verified_entity_ids": [ "ent-biren-brand-endpoint-unresolved", "ent-cambricon-brand-endpoint-unresolved", "ent-enflame", "ent-houmo", "ent-iluvatar", "ent-kunlun-brand-endpoint-unresolved", "ent-metax", "ent-moore-threads", "ent-sophgo-brand-endpoint-unresolved", "ent-witmem" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "62b2122f149f742c563431d80766c2626a407f391e619a2a2c2d6968172f8d45", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_and_secondary", "source_refs": [ { "source_id": "src-baidu-baige-deepseek-p800-20250217", "title": "百度百舸 DeepSeek 一体机发布，支持昆仑芯 P800 单机 8 卡满血版开箱即用", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_e0a478ab-bfa4-425c-b9b5-a6d296f6c698", "source_type": "official_operator_product_release", "primary_status": "primary", "publication_date": "2025-02-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Launch/apply-for-trial and vendor deployment statements; no order, shipment, customer acceptance or independent workload receipt.", "Server OEM, CPU/memory/network BOM, cluster facility, exact card count, uptime and utilization are undisclosed." ] }, { "source_id": "src-baidu-p800-large-cluster-caict-claim-20250723", "title": "首家！AI算力最高评级！", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_377f7acf-07e4-4787-a0f5-d70671dd6f34", "source_type": "official_operator_news", "primary_status": "primary", "publication_date": "2025-07-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "CAICT report/certificate, test version, duration, sample, pass criteria and raw results were not retrieved.", "10,000- and 30,000-card terms are rounded vendor classes, not exact installed/qualified/utilized counts." ] }, { "source_id": "src-biren-annual-2025", "title": "Shanghai Biren Technology Co., Ltd. 2025 Annual Report", "publisher": "香港交易所", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0422/2026042200045.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-22", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers, project sites, foundry, OSAT, memory suppliers and variant-specific unit counts are withheld." ] }, { "source_id": "src-cambricon-annual-2025", "title": "中科寒武纪科技股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-13/688256_20260313_GWH3.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-13", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, wafer facility, OSAT, package flow, memory supplier and named customers are undisclosed.", "The one-million figure is family cumulative volume, not a model/facility split." ] }, { "source_id": "src-cambricon-mlu370x8-product", "title": "MLU370-X8 智能加速卡", "publisher": "中科寒武纪科技股份有限公司", "url": "https://www.cambricon.com/index.php?a=lists&c=index&catid=406&m=content", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, LPDDR5 supplier, OSAT, package, units, named customer and independent workload receipt are undisclosed." ] }, { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-07-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ] }, { "source_id": "src-enflame-csrc-approval-20260709", "title": "关于同意上海燧原科技股份有限公司首次公开发行股票注册的批复", "publisher": "中国证券监督管理委员会", "url": "https://www.csrc.gov.cn/csrc/c105906/c7644477/content.shtml", "source_type": "government_regulatory_approval", "primary_status": "primary", "publication_date": "2026-07-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal entity and registration approval only; no product or manufacturing receipt." ] }, { "source_id": "src-enflame-t20-t21-20210709", "title": "燧原科技发布云燧T20、T21", "publisher": "人民网转载中国电子报", "url": "https://finance.people.com.cn/n1/2021/0709/c1004-32153321.html", "source_type": "reputable_reporting", "primary_status": "secondary", "publication_date": "2021-07-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Future production plan; no later primary closing receipt, foundry, OSAT, HBM supplier, customer or shipment." ] }, { "source_id": "src-h3c-h65-bios-574-20230804", "title": "H3C H65-BIOS-5.74版本说明书", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202308/1903077_30005_0.htm", "source_type": "official_firmware_release_notes", "primary_status": "primary", "publication_date": "2023-08-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Firmware adaptation/support is not a purchase, configured commercial SKU, order, shipment, installation or external qualification.", "The signed binary is named with MD5 eea6fa3e3dc6f629ee8fdaa78932627c; it was not locally archived." ] }, { "source_id": "src-houmo-h30-youkong-20231229", "title": "后摩智能与优控智行战略合作", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/3/28/NewsDetails.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2023-12-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Counterparty legal entity, production vehicle, contract, units, foundry, memory and OSAT are undisclosed." ] }, { "source_id": "src-houmo-home", "title": "后摩智能官网", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/", "source_type": "company_home_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal identity only." ] }, { "source_id": "src-houmo-m50-greatwall-20260531", "title": "长城N90 Pro AI笔记本搭载后摩M50", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/1/47/NewsDetails.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2026-05-31", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Direct buying entity, contract, units, retail shipments, acceptance and field reliability are undisclosed." ] }, { "source_id": "src-houmo-m50-product", "title": "M50", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/60/ProductType.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, OSAT, LPDDR supplier, units, customer acceptance and independent workload receipt are undisclosed." ] }, { "source_id": "src-iluvatar-about", "title": "发展历程", "publisher": "上海天数智芯半导体股份有限公司", "url": "https://www.iluvatar.com/about/", "source_type": "company_timeline", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor timeline; model-specific units, foundry, OSAT, memory supplier and named customers are undisclosed." ] }, { "source_id": "src-iluvatar-annual-2025", "title": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd. 2025 Annual Report", "publisher": "香港交易所", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0427/2026042701284.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers/projects, foundry, OSAT, HBM/memory supplier and model-specific units are withheld." ] }, { "source_id": "src-kunlun-k200-product", "title": "K200", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/product/686.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, OSAT/interposer, HBM generation/supplier/stack, yield, units and named customer are undisclosed." ] }, { "source_id": "src-kunlun-p800-cmb-20250327", "title": "昆仑芯中标招商银行AI芯片资源项目", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/news/4469.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2025-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-origin award; tender number, contract, quantity, delivery, installation and customer acceptance are undisclosed." ] }, { "source_id": "src-kunlun-r200-product", "title": "R200", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/product/274.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, GDDR6 supplier, OSAT, units, named customer and workload receipt are undisclosed." ] }, { "source_id": "src-kunlunxin-home", "title": "昆仑芯官网", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/", "source_type": "company_home_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal identity only." ] }, { "source_id": "src-metax-annual-2025", "title": "沐曦集成电路（上海）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-27/688802_20260327_0HOB.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Fabless contractors are unnamed; 2025 board-sales totals are family-category totals, not model-specific.", "Overseas HBM, EDA and interface-IP suppliers are not named." ] }, { "source_id": "src-metax-legal", "title": "Legal Statement", "publisher": "MetaX Integrated Circuits (Shanghai) Co., Ltd.", "url": "https://www.metax-tech.com/en/index/statement.html", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "English legal-name receipt only." ] }, { "source_id": "src-moore-threads-annual-2025", "title": "摩尔线程智能科技（北京）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-27/688795_20260427_CUNP.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, OSAT, board maker, memory supplier and customer names are undisclosed." ] }, { "source_id": "src-moore-threads-legal", "title": "Compliance / Legal", "publisher": "Moore Threads Technology Co., Ltd.", "url": "https://en.mthreads.com/legal/compliance", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "English legal-name receipt only." ] }, { "source_id": "src-moore-threads-listing-2025", "title": "摩尔线程智能科技（北京）股份有限公司股票科创板上市公告书", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/announcement/listing/ipo/c/c_20251204_10800678.shtml", "source_type": "exchange_listing_notice", "primary_status": "primary", "publication_date": "2025-12-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal/listing identity only." ] }, { "source_id": "src-sophgo-bm1684x-product", "title": "BM1684X Mainboard", "publisher": "SOPHGO", "url": "https://en.sophgo.com/ecology/detail.html?id=41", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact legal product owner, foundry, OSAT, LPDDR supplier, units and named customer are undisclosed." ] }, { "source_id": "src-sophgo-privacy", "title": "隐私政策", "publisher": "北京算能科技有限公司", "url": "https://www.sophgo.com/site/provacy-policy.html", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Does not identify the exact legal owner/manufacturer of each group-branded product." ] }, { "source_id": "src-witmem-government-equity-20241105", "title": "杭州知存算力科技有限公司企业国有产权交易披露", "publisher": "北京市公共资源交易服务平台", "url": "https://ggzyfw.beijing.gov.cn/jyxxgqgpplxx/20241105/4719635.html", "source_type": "government_equity_record", "primary_status": "primary", "publication_date": "2024-11-05", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Identity/equity record only." ] }, { "source_id": "src-witmem-home", "title": "知存科技官网", "publisher": "杭州知存算力科技有限公司", "url": "https://www.witmem.com/", "source_type": "company_home_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal identity and portfolio statement only." ] }, { "source_id": "src-witmem-wtm2101-product", "title": "WTM2101", "publisher": "杭州知存算力科技有限公司", "url": "https://www.witmem.com/WTM2101.php", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Audited units, foundry, OSAT, legal customer, yield and field reliability are undisclosed." ] }, { "source_id": "src-witmem-wtm8-about", "title": "关于知存", "publisher": "杭州知存算力科技有限公司", "url": "https://www.witmem.com/about.php", "source_type": "company_timeline", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Trial production is not commercial release, customer qualification or volume shipment." ] }, { "source_id": "src-witmem-wtm8-product", "title": "WTM-8", "publisher": "杭州知存算力科技有限公司", "url": "https://www.witmem.com/WTM-8.php", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Foundry, bonding facility/tool/pitch/yield, OSAT, die suppliers, customer and shipment are undisclosed." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-architecture" ], "id": "proc-chip-architecture", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "design", "name": "Chip architecture", "process_id": "proc-chip-architecture", "record_type": "process", "source_ids": [ "src-dfsx-3d-near-memory-2026", "src-dfsx-df1000-product-2026" ], "verified_entity_ids": [ "ent-dfsx" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "e964026bbf5cffefa5d376f7279d67cd0089a03672261ef7b19c36ca879fb720", "stage_ids": [ "design_company" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "layer", "value": "design" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "design" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dfsx-3d-near-memory-2026", "title": "3D Near-Memory Computing", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/technology/3d-near-memory-computing", "source_type": "company_technology_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported architecture; no bond pitch, memory die source, layer count, yield, or independent test." ] }, { "source_id": "src-dfsx-df1000-product-2026", "title": "DF1000 AI Accelerator", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/products/ai-accelerator/df1000", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor page exposes no independent workload receipt, memory supplier, foundry, package yield, power, customer, or shipment volume." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-automotive-soc" ], "id": "proc-chip-automotive-soc", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "Automotive SoC products", "process_id": "proc-chip-automotive-soc", "record_type": "process", "source_ids": [ "src-dd-auto-002", "src-dd-auto-004", "src-dd-auto-007", "src-dd-auto-008" ], "verified_entity_ids": [ "ent-dd-ecarx-holdings", "ent-dd-siengine-hubei" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "76e6449786fcada7d953572a60ae6b8b669695841cfb04182991aaabc34a37c4", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-002", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2023-09-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ] }, { "source_id": "src-dd-auto-004", "title": "芯擎科技与龙鹰一号相关政务记录", "publisher": "武汉经济技术开发区", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202304/t20230423_2190472.html", "source_type": "government_company_identity_and_product_record", "primary_status": "primary", "publication_date": "2023-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, OSAT, delivered-chip quantity or vehicle volume." ] }, { "source_id": "src-dd-auto-007", "title": "ECARX to Power Launch of First Hongqi Model Under Strategic Partnership with FAW, Debuting AutoGPT with DeepSeek-R1 Integration", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-power-launch-first-hongqi-model-under-strategic", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2025-02-11", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-origin release; no vehicle deliveries, contract, chip shipment, foundry or OSAT." ] }, { "source_id": "src-dd-auto-008", "title": "ECARX Antora 1000 Pro", "publisher": "ECARX", "url": "https://www.ecarxgroup.com/ecarx-antora-1000-pro/", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue specifications do not prove vehicle shipments, yield, foundry or package." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-cpu" ], "id": "proc-chip-cpu", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "CPU products", "process_id": "proc-chip-cpu", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "2519e33e76abfd522d3333a9d76ca4294357446045cd2595769aca4990a1a2ba", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-display-driver" ], "id": "proc-chip-display-driver", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "Display-driver products", "process_id": "proc-chip-display-driver", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "0a2db861675007183073bb7941b12fc7b920cd5222a283ad5b08e666d1a5f7ce", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-dsp" ], "id": "proc-chip-dsp", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "DSP products", "process_id": "proc-chip-dsp", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "b5311d27078674d80d276609e773cfadbb7cc8c03c64fb5f301f7ba806827326", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-fpga" ], "id": "proc-chip-fpga", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "FPGA products", "process_id": "proc-chip-fpga", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "7e69bfb1071cb84cb4990e1f1549f02d340d421730878875c8f6f692d5dc175d", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-gpu" ], "id": "proc-chip-gpu", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "GPU products", "process_id": "proc-chip-gpu", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "1de5f6f118eac186fa4609bfa5f8d93c4e86a5e6310bf1061970b219a2ecd3d9", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-industrial-security" ], "id": "proc-chip-industrial-security", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "Industrial-control and security-chip products", "process_id": "proc-chip-industrial-security", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "46d0b0285bf1a952966379c965e0575d57e697d94f8b8fe8d2b98698edc22a80", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-isp-vision" ], "id": "proc-chip-isp-vision", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "ISP and vision-processing products", "process_id": "proc-chip-isp-vision", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "30005551eb998dfcee95bf460dbcba4cedc9aea90184e6b5c7a6d997f9ed7b5a", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-mcu" ], "id": "proc-chip-mcu", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "MCU products", "process_id": "proc-chip-mcu", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "4472c0a6fd286876510c45ea90ced59220102ccf6865a3450509d3b9801b23ff", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-modem-connectivity" ], "id": "proc-chip-modem-connectivity", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "Modem and connectivity products", "process_id": "proc-chip-modem-connectivity", "record_type": "process", "source_ids": [ "src-dd-mobile-005", "src-dd-mobile-006", "src-dd-mobile-007", "src-dd-mobile-008" ], "verified_entity_ids": [ "ent-dd-unisoc-shanghai" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "7b50c0a47fb0892f0fd00485118af1e98985b71a69d24289ecd7c5646812f43f", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-mobile-005", "title": "T7250", "publisher": "紫光展锐", "url": "https://www.unisoc.com/cn/product/SmartPhone/T7250", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, Xiaomi-specific certification or volume." ] }, { "source_id": "src-dd-mobile-006", "title": "T7250", "publisher": "UNISOC", "url": "https://www.unisoc.com/en/product/SmartPhone/T7250", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, Xiaomi-specific certification or volume." ] }, { "source_id": "src-dd-mobile-007", "title": "联系我们", "publisher": "紫光展锐", "url": "https://www.unisoc.com/cn/about/contact-us", "source_type": "official_company_identity_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Identity only; not a direct Xiaomi purchase receipt." ] }, { "source_id": "src-dd-mobile-008", "title": "Contact Us", "publisher": "UNISOC", "url": "https://www.unisoc.com/en/about/contact-us", "source_type": "official_company_identity_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Identity only; not a direct Xiaomi purchase receipt." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-network-switch-optical-dsp" ], "id": "proc-chip-network-switch-optical-dsp", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "Network-switch and optical-DSP products", "process_id": "proc-chip-network-switch-optical-dsp", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "28f962f746e53e20186774702468692afa04d90fec220586f89bc6ffb80088c8", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-pmic-analog" ], "id": "proc-chip-pmic-analog", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "PMIC and analog products", "process_id": "proc-chip-pmic-analog", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "90da1ce615469e824a074d9484b7523a2b1992d4ef916e864312f3df91b3e0bb", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-power-device" ], "id": "proc-chip-power-device", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "Power-semiconductor products", "process_id": "proc-chip-power-device", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "5ac217666051af4ec0df2ef81dd612e5809da7b9849e3b704013fa15b28c0710", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-rf" ], "id": "proc-chip-rf", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "RF semiconductor products", "process_id": "proc-chip-rf", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "04ac54e77a626bd83e2524cc07c68c14462e561ee0f83e5cb3e9e06c0f944104", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-sensors" ], "id": "proc-chip-sensors", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "Sensor products", "process_id": "proc-chip-sensors", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "444478da713fcda471124149c50c06f74b48ebb6123177e31a12c677155359ee", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-chip-storage-controller-interface" ], "id": "proc-chip-storage-controller-interface", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "Storage controllers and memory-interface products", "process_id": "proc-chip-storage-controller-interface", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "8ec6897666f973c86f5f1875f5e686a8f2170fea3a4bdc6dd00b703bbbfcba3a", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-clean-strip" ], "id": "proc-clean-strip", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "wafer_equipment", "name": "Wet clean, dry clean and strip", "process_id": "proc-clean-strip", "record_type": "process", "source_ids": [ "src-acm-annual-2025", "src-naura-annual-2025" ], "verified_entity_ids": [ "ent-acm-shanghai", "ent-naura" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "9696bd8a69d95d7128db2ebf86cafaf7ccc102236ab9475d40e87009d939ca00", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-acm-annual-2025", "title": "盛美半导体设备（上海）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-02-27/688082_20260227_7FPP.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-02-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio statement does not prove a named-fab installation or qualified layer." ] }, { "source_id": "src-naura-annual-2025", "title": "北方华创科技集团股份有限公司2025年年度报告", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225122918.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio coverage does not prove a model's installation, qualified layer, uptime, yield, or recurring volume at a named fab." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-cleanroom-epc" ], "id": "proc-cleanroom-epc", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "facilities", "name": "Cleanroom EPC, vibration and contamination control", "process_id": "proc-cleanroom-epc", "record_type": "process", "source_ids": [ "src-util-001", "src-util-002", "src-util-004" ], "verified_entity_ids": [ "ent-util-11th-tech", "ent-util-huakang", "ent-util-lk-suzhou", "ent-util-shanghai-fourth" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "0399569aa6ea1c99e3f868fd62e41869401c8df7a9a8fa206aa0d48f2650db69", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-001", "title": "亚翔系统集成科技（苏州）股份有限公司关于公司重大项目中标的公告", "publisher": "亚翔系统集成科技（苏州）股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2024-02/06/content_1875556.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2024-02-06", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The issuer expressly says a formal project contract still had to be signed and construction, settlement and payment details remained subject to that contract." ] }, { "source_id": "src-util-002", "title": "无锡市太极实业股份有限公司关于子公司十一科技中标重大项目工程的进展公告", "publisher": "无锡市太极实业股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2023-06/03/content_1776018.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2023-06-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Formal signature is proven, but effectiveness was conditional on specified internal, shareholder and government approvals. Completion, site acceptance, production qualification, uptime and output are not proven." ] }, { "source_id": "src-util-004", "title": "华康洁净中标越润高端封测基地项目 强链国产半导体", "publisher": "武汉华康世纪洁净科技股份有限公司", "url": "https://www.whhksj.com/details/217.html", "source_type": "official_supplier_project_notice", "primary_status": "primary", "publication_date": "2026-05-11", "date_checked": "2026-07-29", "access_state": "indexed_direct_open_error", "limitations": [ "Supplier-authored award notice. No counterparty confirmation, signed contract, installation, acceptance, production qualification or output receipt was located." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-cmp" ], "id": "proc-cmp", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "wafer_equipment", "name": "Chemical mechanical planarization", "process_id": "proc-cmp", "record_type": "process", "source_ids": [ "src-hwatsing-annual-2025", "src-hwatsing-inquiry-2021", "src-jintan-tongcheng-cmp-project-2024", "src-red-avenue-annual-2025" ], "verified_entity_ids": [ "ent-hwatsing", "ent-tongcheng-electronic-materials-changzhou" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "8c978516c9be94abcecd148560d743dd3637e96ab3c2fb03f86227557b38e8bc", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hwatsing-annual-2025", "title": "华海清科股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-23/688120_20260423_K9XR.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No public facility/model/layer/yield attribution is inferred from portfolio disclosure." ] }, { "source_id": "src-hwatsing-inquiry-2021", "title": "华海清科股份有限公司第二轮审核问询函回复", "publisher": "华海清科股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202102/000752_20210208_7AX3.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-02-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Aggregates models, customers and process capabilities; exact model/facility/layer qualification is not disclosed." ] }, { "source_id": "src-jintan-tongcheng-cmp-project-2024", "title": "华罗庚高新区：从“0”到“1” 打造半导体产业“芯”高地", "publisher": "常州市金坛区人民政府 / 华罗庚高新区", "url": "https://www.jintan.gov.cn/html/czjt/2024/IJMJQALL_1118/267619.html", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2024-11-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The 250,000 pads/year figure was a designed full-rate target at that date, not installed, qualified, utilized or actual output." ] }, { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-compiler-runtime-firmware" ], "id": "proc-compiler-runtime-firmware", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "software", "name": "Compiler, runtime, firmware and kernels", "process_id": "proc-compiler-runtime-firmware", "record_type": "process", "source_ids": [ "src-dfsx-3d-near-memory-2026", "src-dfsx-df1000-product-2026" ], "verified_entity_ids": [ "ent-dfsx" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "cfe5132279f056d380a9fa6ce22cf5034c5a1ff8f51b7fc7ee2c586ac138f303", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "layer", "value": "software" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "software" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dfsx-3d-near-memory-2026", "title": "3D Near-Memory Computing", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/technology/3d-near-memory-computing", "source_type": "company_technology_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported architecture; no bond pitch, memory die source, layer count, yield, or independent test." ] }, { "source_id": "src-dfsx-df1000-product-2026", "title": "DF1000 AI Accelerator", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/products/ai-accelerator/df1000", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor page exposes no independent workload receipt, memory supplier, foundry, package yield, power, customer, or shipment volume." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-chillers-abatement" ], "id": "proc-component-chillers-abatement", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Tool chillers and point-of-use abatement", "process_id": "proc-component-chillers-abatement", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "cde1e4970ebbb34e18b216bd4e14546debbf21740ba1ed59a2f9580be8ea4328", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-esc-ceramics" ], "id": "proc-component-esc-ceramics", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Electrostatic chucks and technical ceramics", "process_id": "proc-component-esc-ceramics", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "4c1e743abb60885af03a72b9b52175cd6128d5746c619d19d8f78f3cff2cacc1", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-field-service" ], "id": "proc-component-field-service", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Equipment field service", "process_id": "proc-component-field-service", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "c926033835d6346900da5d1d010a01b48dfd3c2591d786c5049d92b25b09798f", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-gas-panels-piping" ], "id": "proc-component-gas-panels-piping", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Gas panels and high-purity piping", "process_id": "proc-component-gas-panels-piping", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "0519743741343e2a570d627b8e37760ce3229ae46bc2818cab175cf8203d894d", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-lasers-light-sources" ], "id": "proc-component-lasers-light-sources", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Lasers and lithography light sources", "process_id": "proc-component-lasers-light-sources", "record_type": "process", "source_ids": [ "src-rslaser-yizhuang-project-2021" ], "verified_entity_ids": [ "ent-rslaser" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "7b4e135932e344269017a9f3311dbfb6be12c14016dc0d67b532b8b7c591ea4a", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-rslaser-yizhuang-project-2021", "title": "科益虹源集成电路光刻光源制造及翻新基地（北京亦庄研发基地）项目", "publisher": "北京市公共资源交易服务平台", "url": "https://ggzyfw.beijing.gov.cn/jylcgcjs/20210910/2058109.html", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2021-09-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Project registration is not construction completion, installed capacity, output, customer delivery or scanner integration." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-mfc" ], "id": "proc-component-mfc", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Mass-flow controllers", "process_id": "proc-component-mfc", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "05630f16ccbb897e8a1e1e2f9f0934a0030482f9fac71df8d73f06dcb5b29f55", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-power-control-electronics" ], "id": "proc-component-power-control-electronics", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Power supplies and control electronics", "process_id": "proc-component-power-control-electronics", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "622cb1cf0faabd57c17700dc1683a9fa59f752f0ca805400b19cd5c2fc1b20b0", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-projection-optics" ], "id": "proc-component-projection-optics", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Projection and inspection optics", "process_id": "proc-component-projection-optics", "record_type": "process", "source_ids": [ "src-guowang-base-production-2024", "src-guowang-optics-base-2021" ], "verified_entity_ids": [ "ent-guowang-optics" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "975004d5ef101ba1605d960c2bd69ec72455cba221aba722a37bc2aef321fe0e", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-guowang-base-production-2024", "title": "国望光学曝光光学系统基地竣工投产", "publisher": "国家科技创新中心", "url": "https://www.ncsti.gov.cn/kjdt/scyq/bjjjjskfq/jkdt/202402/t20240219_149260.html", "source_type": "government_industrial_update", "primary_status": "primary", "publication_date": "2024-02-19", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility state only; actual output, model, customer, scanner integration, qualification and yield are not disclosed." ] }, { "source_id": "src-guowang-optics-base-2021", "title": "投影光刻机曝光光学系统研发及批量生产基地项目", "publisher": "北京市公共资源交易服务平台", "url": "https://ggzyfw.beijing.gov.cn/jylcgcjs/20210114/1340589.html", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2021-01-14", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "15–20 systems/year is a design target, not installed, qualified or actual output." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-quartz-silicon-electrodes" ], "id": "proc-component-quartz-silicon-electrodes", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Quartz parts and silicon electrodes", "process_id": "proc-component-quartz-silicon-electrodes", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "e9a2061fbb70ff975004678922837c8782d43d152cd154d80d0eb53261354d93", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-rf-matching" ], "id": "proc-component-rf-matching", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "RF power and matching networks", "process_id": "proc-component-rf-matching", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "315ea4c4e706045330e1310ef1666dff8c961d4470a8ae4e4199adac95e9f1f9", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-robots-wafer-handling" ], "id": "proc-component-robots-wafer-handling", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Robots and wafer-handling systems", "process_id": "proc-component-robots-wafer-handling", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "bd04986289041a54b269e56918cc2f8eb0571f0010b55b5999fcd2b157c5419c", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-seals" ], "id": "proc-component-seals", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "High-purity and vacuum seals", "process_id": "proc-component-seals", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "069cd9d9fcdd985bf0d48c9b8409c9169316af17f098f95514ef8ac11cf170ea", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-sensors-software" ], "id": "proc-component-sensors-software", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Equipment sensors and control software", "process_id": "proc-component-sensors-software", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "8ed9a8def6c31298d783c02830f8d959fd5090ddc77587fbf8e8921c597cacb9", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-spares" ], "id": "proc-component-spares", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Equipment spare-parts supply", "process_id": "proc-component-spares", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "13da66f6b9415ebcf512f6173d4094873dc7fc209e1a060f2c3c97e3e9759f96", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-stages-encoders-bearings" ], "id": "proc-component-stages-encoders-bearings", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Stages, encoders and bearings", "process_id": "proc-component-stages-encoders-bearings", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "969e91bf7e05e220eec2731ea2a2d08cee8a6fa68213707adfa6563b405d719d", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-targets-filters" ], "id": "proc-component-targets-filters", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Targets and filters for equipment systems", "process_id": "proc-component-targets-filters", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "3292dd9585dd7aee1d68d669d6cf3fb787b44fd1abdf631215ff01aebd51a2cf", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-vacuum-pumps" ], "id": "proc-component-vacuum-pumps", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Vacuum pumps", "process_id": "proc-component-vacuum-pumps", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "7767144b49d104fc7dae73adb0b322067b49135410bce39601f4bd2aeb3ca7bd", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-component-vacuum-valves" ], "id": "proc-component-vacuum-valves", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "equipment_component", "name": "Vacuum valves", "process_id": "proc-component-vacuum-valves", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "5c7209278b08a6ccc00dbe66336280c993ba731cc783c6b3d3171a18d829bd89", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-compound-substrates" ], "id": "proc-compound-substrates", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "materials", "name": "SiC, GaN, sapphire and epitaxial substrates", "process_id": "proc-compound-substrates", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "2890678bbb657450e07996f410fedcfc998c10177b9aecb850cdf5f75a0093bd", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-computational-lithography" ], "id": "proc-computational-lithography", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "patterning", "name": "OPC, source-mask optimization and DTCO", "process_id": "proc-computational-lithography", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "dc95b02ccd16fe9b63a8711d8eba8ba18f9fd866c3ec2f2d0ae28ca3fa2ed2b9", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "patterning" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "patterning" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-controller-module" ], "id": "proc-controller-module", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "systems", "name": "Controllers and memory/storage modules", "process_id": "proc-controller-module", "record_type": "process", "source_ids": [ "src-gloway-cxmt-yipro", "src-memblaze-ymtc-pblaze6", "src-montage-mxc-official" ], "verified_entity_ids": [ "ent-montage", "ent-memblaze", "ent-gloway-brand" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "d7fbc293432230c01371e0460b9e04bdd3352b1d42932b7df8509f4a19742079", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "layer", "value": "systems" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gloway-cxmt-yipro", "title": "光威品牌发展历程", "publisher": "嘉合劲威", "url": "https://www.gloway.com.cn/pages_29/", "source_type": "company_brand_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Brand history does not quantify SKU-level volumes, current authorization, or all BOM components." ] }, { "source_id": "src-memblaze-ymtc-pblaze6", "title": "PBlaze6 6541 Enterprise SSD", "publisher": "北京忆恒创源科技股份有限公司", "url": "https://www.memblaze.com/product/pblaze6/639.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Direct product BOM join for NAND only; controller, PMIC, firmware component origins and shipment volume are not fully disclosed." ] }, { "source_id": "src-montage-mxc-official", "title": "MXC Memory Expansion Controller", "publisher": "澜起科技股份有限公司", "url": "https://www.montage-tech.com/index.php/MXC", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Product availability does not prove deployment in a named accelerator, p50/p99 latency, energy, contention, or recovery." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-deposition-cvd-ald" ], "id": "proc-deposition-cvd-ald", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "wafer_equipment", "name": "CVD, PECVD and ALD deposition", "process_id": "proc-deposition-cvd-ald", "record_type": "process", "source_ids": [ "src-naura-annual-2025", "src-piotech-annual-2025", "src-piotech-prospectus-2021" ], "verified_entity_ids": [ "ent-piotech", "ent-naura" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "84333cf13a53d099667288027db6b04480f4ee96bc3055b99affe914bd68a6cc", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-annual-2025", "title": "北方华创科技集团股份有限公司2025年年度报告", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225122918.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio coverage does not prove a model's installation, qualified layer, uptime, yield, or recurring volume at a named fab." ] }, { "source_id": "src-piotech-annual-2025", "title": "拓荆科技股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688072_20260428_IFOF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio and issuer-reported progress do not establish a named HBM customer or qualified HBM production." ] }, { "source_id": "src-piotech-prospectus-2021", "title": "拓荆科技股份有限公司招股说明书（注册稿）", "publisher": "拓荆科技股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202111/000996_20211105_MYB4.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-11-05", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group/product-family scope; exact model, facility, process layer, installation, acceptance, uptime and yield are not disclosed." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-design-verification" ], "id": "proc-design-verification", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "eda", "name": "Functional verification, simulation, emulation and formal", "process_id": "proc-design-verification", "record_type": "process", "source_ids": [ "src-empyrean-annual-2025", "src-primarius-annual-2025" ], "verified_entity_ids": [ "ent-empyrean", "ent-primarius" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "a0c3a62482f0271909f533fbdab7f04e07969bd876810ae969b42dc430d255d3", "stage_ids": [ "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "layer", "value": "eda" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "eda" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-empyrean-annual-2025", "title": "北京华大九天科技股份有限公司2025年年度报告", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-28/1225215590.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio disclosure does not establish a successful advanced-node tapeout, named PDK, or independent parity." ] }, { "source_id": "src-primarius-annual-2025", "title": "上海概伦电子股份有限公司2025年年度报告摘要", "publisher": "上海证券交易所", "url": "https://static.cninfo.com.cn/finalpage/2026-04-16/1225108666.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Summary-level portfolio statement; customer, PDK, tapeout, process and production-chip evidence remain product-specific." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-dft-yield-analysis" ], "id": "proc-dft-yield-analysis", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "eda", "name": "DFT and yield analysis", "process_id": "proc-dft-yield-analysis", "record_type": "process", "source_ids": [ "src-semitronix-annual-2025" ], "verified_entity_ids": [ "ent-semitronix" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "ebdf0fdb97b8775d40ff3d8f32d2fb8300944ad1540d812b844a8f5702a76f7c", "stage_ids": [ "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "layer", "value": "eda" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "eda" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-semitronix-annual-2025", "title": "杭州广立微电子股份有限公司2025年年度报告摘要", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-23/1225153966.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Does not identify a qualified process layer, fab installation, or attributable yield improvement." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-dram-fabrication" ], "id": "proc-dram-fabrication", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "fabrication", "name": "DRAM wafer fabrication", "process_id": "proc-dram-fabrication", "record_type": "process", "source_ids": [ "src-cxmt-official-products-2026", "src-cxmt-sse-prospectus-2026", "src-skhynix-f1-facilities-2026", "src-skhynix-official-network-2026", "src-skhynix-wuxi-c2f-2019", "src-util-001" ], "verified_entity_ids": [ "ent-cxmt-corp", "ent-skhynix", "ent-util-changxin-xinqiao" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "c0fe02029cbab684c3387dad6b6b13a94b59ba4fdfc417c2ab632e67b7883237", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cxmt-official-products-2026", "title": "CXMT - Products", "publisher": "CXMT Corporation", "url": "https://www.cxmt.com/en/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio statement does not prove a particular customer, wafer capacity, yield, or shipment volume." ] }, { "source_id": "src-cxmt-sse-prospectus-2026", "title": "长鑫科技集团股份有限公司首次公开发行股票并在科创板上市招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202605/002170_20260527_23QQ.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-05-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The issuer names no packaging OSAT legal entity.", "The filing has no HBM literal hit and no HBM product, stack, facility, customer, qualification, yield or shipment receipt.", "Absence in this filing is not proof that no private R&D exists." ] }, { "source_id": "src-skhynix-f1-facilities-2026", "title": "SK hynix Inc. Form F-1 Registration Statement", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785df1.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing identifies C2/C2F DRAM and Dalian NAND and states group-wide full utilization, but does not disclose facility wafer capacity, node, output, yield, tool fleet or supplier BOM.", "Parent-level owns/operates language does not by itself resolve immediate local legal-title chains." ] }, { "source_id": "src-skhynix-official-network-2026", "title": "Global Network", "publisher": "SK hynix Inc.", "url": "https://www.skhynix.com/company/UI-FR-CP06/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page identifies the Wuxi production-site legal entity and a Dalian legal entity/address; it does not disclose capacity, process generation, output, yield, tools or materials." ] }, { "source_id": "src-skhynix-wuxi-c2f-2019", "title": "SK hynix Completes Expanded Fab (C2F) in Wuxi, China", "publisher": "SK hynix Inc.", "url": "https://news.skhynix.com/en/sk-hynix-completes-expanded-fab-c2f-in-wuxi-china/", "source_type": "company_facility_announcement", "primary_status": "primary", "publication_date": "2019-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical announcement does not prove 2026 legal operator, capacity, technology, utilization, yield, product mix or ownership-chain changes." ] }, { "source_id": "src-util-001", "title": "亚翔系统集成科技（苏州）股份有限公司关于公司重大项目中标的公告", "publisher": "亚翔系统集成科技（苏州）股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2024-02/06/content_1875556.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2024-02-06", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The issuer expressly says a formal project contract still had to be signed and construction, settlement and payment details remained subject to that contract." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-end-user-workload" ], "id": "proc-end-user-workload", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "demand", "name": "Real end-user workload and accepted result", "process_id": "proc-end-user-workload", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "c48d85fff256660182ad1aa28ad4c00b41e7627c9c6b6eddfe8c9ef75e3b22f4", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "demand" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "demand" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-epitaxy" ], "id": "proc-epitaxy", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "wafer_equipment", "name": "Epitaxy", "process_id": "proc-epitaxy", "record_type": "process", "source_ids": [ "src-amec-halfyear-2025" ], "verified_entity_ids": [ "ent-amec" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "a3355bf4f61f3165d8b3c1c0735016ca0c1de755e84132de8e1c57749fe44a57", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-amec-halfyear-2025", "title": "中微半导体设备（上海）股份有限公司2025年半年度报告", "publisher": "上海证券交易所", "url": "https://star.sse.com.cn/disclosure/listedinfo/announcement/c/new/2025-08-29/688012_20250829_BW75.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-08-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer portfolio and revenue recognition do not name the facility, qualified layer, throughput, uptime, or yield." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-etch" ], "id": "proc-etch", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "wafer_equipment", "name": "Plasma and high-aspect-ratio etch", "process_id": "proc-etch", "record_type": "process", "source_ids": [ "src-amec-halfyear-2025", "src-naura-annual-2025" ], "verified_entity_ids": [ "ent-amec", "ent-naura" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "d7630d8a6ec2ebf547ec2a8869c4a3d18468fbe91631876295f84df5851a1914", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-amec-halfyear-2025", "title": "中微半导体设备（上海）股份有限公司2025年半年度报告", "publisher": "上海证券交易所", "url": "https://star.sse.com.cn/disclosure/listedinfo/announcement/c/new/2025-08-29/688012_20250829_BW75.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-08-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer portfolio and revenue recognition do not name the facility, qualified layer, throughput, uptime, or yield." ] }, { "source_id": "src-naura-annual-2025", "title": "北方华创科技集团股份有限公司2025年年度报告", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225122918.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio coverage does not prove a model's installation, qualified layer, uptime, yield, or recurring volume at a named fab." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-abatement" ], "id": "proc-facility-abatement", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "Point-of-use and central abatement", "process_id": "proc-facility-abatement", "record_type": "process", "source_ids": [ "src-util-003" ], "verified_entity_ids": [ "ent-util-shengjian" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "8214c29252077a13305bdfd07bcd184a644e7b7febd0d269136bdeaf1700d3b1", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-003", "title": "喜讯 | 盛剑科技中标厦门士兰集宏半导体有限公司项目", "publisher": "上海盛剑科技股份有限公司", "url": "https://www.sheng-jian.com/news_details/386.html", "source_type": "official_supplier_project_notice", "primary_status": "primary", "publication_date": "2025-01-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No award amount, signed contract, installation, acceptance or commissioning receipt is published. The 720,000 wafers/year figure is a two-phase eventual design target and not Phase I installed capacity or output." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-automation" ], "id": "proc-facility-automation", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "Facility automation and monitoring", "process_id": "proc-facility-automation", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "c9b514af8542f0835678464a12bb1279ab74627a427e83e3c771edd5f611e292", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-backup-power" ], "id": "proc-facility-backup-power", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "Backup-power systems", "process_id": "proc-facility-backup-power", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "e4837e0c02eea4a5646f4f03228a1fe10328d610b09e1d05d9d7d95fb5ffe0d1", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-bulk-gases" ], "id": "proc-facility-bulk-gases", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "Bulk-gas generation and supply", "process_id": "proc-facility-bulk-gases", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "bc415b7d4510739984158fe447e20242b5ba42b70e313833584867f44149db0a", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-chemical-delivery" ], "id": "proc-facility-chemical-delivery", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "High-purity chemical delivery systems", "process_id": "proc-facility-chemical-delivery", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "4a220c23eae5be1afc93c398ee710e6c135336c6f08525bedfd429c03712d2f9", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-chillers-heat-rejection" ], "id": "proc-facility-chillers-heat-rejection", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "Chillers and heat-rejection systems", "process_id": "proc-facility-chillers-heat-rejection", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "e1b74db20757994dae3dcc9f27a461d4ea4d97e0f37a8b1c215136f391752f34", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-contamination-control" ], "id": "proc-facility-contamination-control", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "Contamination-control systems", "process_id": "proc-facility-contamination-control", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "4f500702ca74fa34d901c4372fa0e92672d1b59049ab6d58391aab8a46566ab7", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-fire-life-safety" ], "id": "proc-facility-fire-life-safety", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "Fire and life-safety systems", "process_id": "proc-facility-fire-life-safety", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "b94537517d45006829b203223522972f18793c20a9dc63a7b64c27b04cb49d9d", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-power-quality" ], "id": "proc-facility-power-quality", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "Power-quality systems", "process_id": "proc-facility-power-quality", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "d3ffb4dc65b06b25c88001539204d97a05fdb853f7f4e289e2b8a8b3772408b7", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-solvent-recovery" ], "id": "proc-facility-solvent-recovery", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "Solvent-recovery systems", "process_id": "proc-facility-solvent-recovery", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "0dce3ce1fc116141dee3891aa794b4e89a9f6b5d9d3d2bb4257237f8a962a422", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-specialty-gas-delivery" ], "id": "proc-facility-specialty-gas-delivery", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "Specialty-gas delivery systems", "process_id": "proc-facility-specialty-gas-delivery", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "f13f66576c324acedde54326fa68f1099c112fa1efa67afa2c4826b5a1b02713", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-ultrapure-water" ], "id": "proc-facility-ultrapure-water", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "Ultrapure-water generation and distribution", "process_id": "proc-facility-ultrapure-water", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "c1b520f5113ca7311a58348e911f3b05feab7b5da07db0196cfc3685514e5217", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-vacuum" ], "id": "proc-facility-vacuum", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "Fab vacuum systems", "process_id": "proc-facility-vacuum", "record_type": "process", "source_ids": [ "src-util-005" ], "verified_entity_ids": [ "ent-util-ihep", "ent-util-kyky" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "fa592730f23e0038714af8f499bd904dc5007be2c5dea7d0accfb743a0572e1d", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-005", "title": "中国科学院高能物理研究所超净半导体真空测试系统采购项目中标公告", "publisher": "中国政府采购网 / 中华人民共和国财政部国库司", "url": "https://www.ccgp.gov.cn/cggg/zygg/zbgg/202605/t20260507_26518210.htm", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2026-05-07", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The award proves vendor, purchaser, system, model class, quantity and price. It does not prove delivery, installation, acceptance, semiconductor-fab production use or component origin." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-vibration-control" ], "id": "proc-facility-vibration-control", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "Vibration-control systems", "process_id": "proc-facility-vibration-control", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "4ffc4b477a183069715803c1a8fed82c5cbd226a3d03f4d21c4adc09a7b92ffd", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-facility-wastewater" ], "id": "proc-facility-wastewater", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "facilities_leaf", "name": "Fab wastewater treatment", "process_id": "proc-facility-wastewater", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "eabd062fac73ad6adb3f3828e2aa67a1befe675014217cafea49ada6455430b8", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-final-test-burnin" ], "id": "proc-final-test-burnin", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "packaging_test", "name": "Final test, burn-in and repair", "process_id": "proc-final-test-burnin", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "431cf1be76d9f2045ee3997d9cfb17ee142a98f07d85190a944ba77bb1cd695d", "stage_ids": [ "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "packaging_test" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "layer", "value": "packaging_test" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "packaging_test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-gases-chemicals-delivery" ], "id": "proc-gases-chemicals-delivery", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "facilities", "name": "Bulk/specialty gases and chemical delivery", "process_id": "proc-gases-chemicals-delivery", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "0fa21520fdac23ee1a4c197c37bdb1973e999d29222a73c6ad2b001f092331d5", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-hybrid-bonding" ], "id": "proc-hybrid-bonding", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "advanced_packaging", "name": "Hybrid and fusion bonding", "process_id": "proc-hybrid-bonding", "record_type": "process", "source_ids": [ "src-piotech-annual-2025", "src-piotech-prospectus-2021" ], "verified_entity_ids": [ "ent-piotech" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "c1fe93127682de8e9183a7ce30f5fb95247cddfab324ccccc0c0af592fc63899", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "advanced_packaging" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "advanced_packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-piotech-annual-2025", "title": "拓荆科技股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688072_20260428_IFOF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio and issuer-reported progress do not establish a named HBM customer or qualified HBM production." ] }, { "source_id": "src-piotech-prospectus-2021", "title": "拓荆科技股份有限公司招股说明书（注册稿）", "publisher": "拓荆科技股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202111/000996_20211105_MYB4.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-11-05", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group/product-family scope; exact model, facility, process layer, installation, acceptance, uptime and yield are not disclosed." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-implant" ], "id": "proc-implant", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "wafer_equipment", "name": "Ion implantation", "process_id": "proc-implant", "record_type": "process", "source_ids": [ "src-naura-annual-2025" ], "verified_entity_ids": [ "ent-naura" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "901a6efbef7effe1792745d402325b79f328472e63d41fc8b40c33318adb1074", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-naura-annual-2025", "title": "北方华创科技集团股份有限公司2025年年度报告", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225122918.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio coverage does not prove a model's installation, qualified layer, uptime, yield, or recurring volume at a named fab." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-inspection-defect-review" ], "id": "proc-inspection-defect-review", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "process_control", "name": "Inspection and defect review", "process_id": "proc-inspection-defect-review", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "c41c0b5d565a6fd5ef3e76f643a43575fce19cc53a61733534f3ddb5e4ed764c", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "process_control" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-isa-rtl" ], "id": "proc-isa-rtl", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "design", "name": "ISA and RTL", "process_id": "proc-isa-rtl", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "4b2e14bbadda043baf321f339d61c9d45cefaa0ac78812d8be5f43ac5afda1c6", "stage_ids": [ "design_company" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "layer", "value": "design" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "design" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-lithography-dry-arf" ], "id": "proc-lithography-dry-arf", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "lithography", "name": "Dry ArF lithography", "process_id": "proc-lithography-dry-arf", "record_type": "process", "source_ids": [ "src-smee-ssa600-official" ], "verified_entity_ids": [ "ent-smee" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "0cb0532bb58457075e7991e9f4fd2f5914132e35c5020eb9f8ae8082815e23b0", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "lithography" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "lithography" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-smee-ssa600-official", "title": "600 Series Step-and-Scan Lithography System", "publisher": "上海微电子装备（集团）股份有限公司", "url": "https://www.smee.com.cn/eis.pub?method=indexinfo&onclicknodeno=1_4_1_1&service=homepageService", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue capability only; no named facility, serial number, installation, site acceptance, qualified layer, uptime, or yield." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-lithography-euv" ], "id": "proc-lithography-euv", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "lithography", "name": "EUV lithography", "process_id": "proc-lithography-euv", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "1e69aa4e7f1095d14758b7487645f501484938be214ed146f1f6e9acf398f27b", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "lithography" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "lithography" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-lithography-iline-krf" ], "id": "proc-lithography-iline-krf", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "lithography", "name": "i-line and KrF lithography", "process_id": "proc-lithography-iline-krf", "record_type": "process", "source_ids": [ "src-icmtia-kehua-248nm-award-2021", "src-kehua-company-home-20260729", "src-kehua-icmtia-product-catalogue-2026", "src-red-avenue-annual-2025", "src-redavenue-kehua-investment-2025", "src-smee-ssa600-official" ], "verified_entity_ids": [ "ent-beijing-kehua", "ent-smee" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "da9aa3de74599e1c8545511404bf0d4fdd3edef01f3fa279cd96e770e384d078", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "lithography" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "lithography" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_and_secondary", "source_refs": [ { "source_id": "src-icmtia-kehua-248nm-award-2021", "title": "“第二届集成电路材料奖”获奖名单颁布", "publisher": "中关村集成电路材料产业技术创新联盟", "url": "https://www.icmtia.com/news/647.html", "source_type": "industry_association_award_record", "primary_status": "secondary", "publication_date": "2021-11-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The award names Beijing Kehua and a 248 nm family, not an exact SKU, customer, fab, layer, lot, quantity, qualification date or independent process data." ] }, { "source_id": "src-kehua-company-home-20260729", "title": "北京科华微电子材料有限公司 — 关于我们 / Kempur home page", "publisher": "北京科华微电子材料有限公司", "url": "https://www.kempur.com/", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "indexed_direct_open_error", "limitations": [ "Direct page fetch returned an internal error; only the public search-indexed company-page text was recorded and no access control was bypassed.", "Line descriptions and address do not establish permit capacity, installed tools, current utilization, output, model-to-line mapping, named customer or qualification." ] }, { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] }, { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] }, { "source_id": "src-redavenue-kehua-investment-2025", "title": "彤程新材料集团股份有限公司对外投资进展公告", "publisher": "彤程新材料集团股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2025-05/28/content_2074043.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-05-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The disclosure said business-registration changes remained at publication; the later annual report gives 96.3296%, a one-ten-thousandth-point rounding difference." ] }, { "source_id": "src-smee-ssa600-official", "title": "600 Series Step-and-Scan Lithography System", "publisher": "上海微电子装备（集团）股份有限公司", "url": "https://www.smee.com.cn/eis.pub?method=indexinfo&onclicknodeno=1_4_1_1&service=homepageService", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue capability only; no named facility, serial number, installation, site acceptance, qualified layer, uptime, or yield." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-lithography-immersion-arf" ], "id": "proc-lithography-immersion-arf", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "lithography", "name": "Immersion ArF lithography", "process_id": "proc-lithography-immersion-arf", "record_type": "process", "source_ids": [ "src-red-avenue-annual-2025", "src-redavenue-subsidiaries-guarantee-2025" ], "verified_entity_ids": [ "ent-tongcheng-electronic-materials-shanghai" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "66cbae8fbfb7ce60420723045d194766245b2fb5decd902f8d41bc930e698e37", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "lithography" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "lithography" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] }, { "source_id": "src-redavenue-subsidiaries-guarantee-2025", "title": "彤程新材料集团股份有限公司关于年度预计融资担保进展的公告", "publisher": "彤程新材料集团股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2025-04/03/content_2044624.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Registered residences are legal-entity addresses and are not automatically the same as every manufacturing site." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-logic-foundry" ], "id": "proc-logic-foundry", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "fabrication", "name": "Logic wafer fabrication", "process_id": "proc-logic-foundry", "record_type": "process", "source_ids": [ "src-ft-yuliangsheng-smic-2026", "src-huahong-annual-2025", "src-reuters-duv-aishengna-2026", "src-smic-annual-2025", "src-umc-fab-information", "src-util-002" ], "verified_entity_ids": [ "ent-huahong-semiconductor", "ent-smic", "ent-united-semi-xiamen", "ent-util-huahong-wuxi" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "4fbae87466afba9c9fc1f3ef5323f4bbf1618980b45e684df930b029ef2a4a05", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_and_secondary", "source_refs": [ { "source_id": "src-ft-yuliangsheng-smic-2026", "title": "China trials its first advanced tools for AI chipmaking", "publisher": "Financial Times", "url": "https://www.ft.com/content/8fd79522-e34f-4633-bc87-ef0aae2d9159", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2025-09-17", "date_checked": "2026-07-29", "access_state": "paywalled", "limitations": [ "Paywalled secondary report; prototype evaluation is not delivery/acceptance or qualified production." ] }, { "source_id": "src-huahong-annual-2025", "title": "Hua Hong Semiconductor Limited 2025 Annual Report", "publisher": "Hong Kong Exchanges and Clearing Limited", "url": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0326/2026032602731_c.pdf", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-03-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group disclosure does not identify a product's foundry, scanner fleet, customer, yield or complete supplier BOM." ] }, { "source_id": "src-reuters-duv-aishengna-2026", "title": "China starts production of home-grown immersion DUV chipmaking tools, source says", "publisher": "Reuters", "url": "https://www.reuters.com/world/china/china-starts-production-home-grown-immersion-duv-chipmaking-tools-source-2026-07-28/", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2026-07-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Anonymous-source report; no model, serial, purchase order, shipment, installation, site acceptance, layer qualification, uptime, yield, or recurring volume." ] }, { "source_id": "src-smic-annual-2025", "title": "SMIC 2025 Annual Report", "publisher": "Hong Kong Exchanges and Clearing Limited", "url": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0408/2026040801181.pdf", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group-level foundry capability does not identify a product's foundry, scanner fleet, customer, yield or tool/material BOM." ] }, { "source_id": "src-umc-fab-information", "title": "Fab Information", "publisher": "United Microelectronics Corporation", "url": "https://www.umc.com/en/Html/fab_information", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Designed capacity is not current installed, utilized, actual output, yield, or customer mix." ] }, { "source_id": "src-util-002", "title": "无锡市太极实业股份有限公司关于子公司十一科技中标重大项目工程的进展公告", "publisher": "无锡市太极实业股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2023-06/03/content_1776018.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2023-06-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Formal signature is proven, but effectiveness was conditional on specified internal, shareholder and government approvals. Completion, site acceptance, production qualification, uptime and output are not proven." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-aerospace-defense" ], "id": "proc-market-aerospace-defense", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Publicly documented aerospace and defense demand", "process_id": "proc-market-aerospace-defense", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "3129c12ab6537b49d8a03b13e2f15e13fe41e189780ae8480af6e86ef310354e", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-ai-inference" ], "id": "proc-market-ai-inference", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "AI inference demand and accepted workloads", "process_id": "proc-market-ai-inference", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "5dfaff91eba33b48cdeaf869954edf11656abe6ed9aea96dcb21d63944c8ec3c", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-ai-training" ], "id": "proc-market-ai-training", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "AI training demand and accepted workloads", "process_id": "proc-market-ai-training", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "976a76d81f0a2b07cd25d43add016fdb5dbef65887445493cd7ec5668e95eb53", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-automotive" ], "id": "proc-market-automotive", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Automotive semiconductor demand", "process_id": "proc-market-automotive", "record_type": "process", "source_ids": [ "src-byd-horizon-journey5-designwin-20220421", "src-dd-auto-001", "src-dd-auto-002", "src-dd-auto-005", "src-dd-auto-007", "src-dd-auto-008", "src-dd-byd-001", "src-dd-byd-002", "src-dd-byd-003" ], "verified_entity_ids": [ "ent-byd-contracting-endpoint-unresolved", "ent-dd-ecarx-holdings", "ent-dd-lynk-sales" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "1b2d2c59b0d0bc88559293199ebcdb7ce362ac352d678a613d093a9be3a1d0f9", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-byd-horizon-journey5-designwin-20220421", "title": "比亚迪与地平线官宣合作 2023年部分上市车型将搭载征程5", "publisher": "比亚迪汽车工业有限公司", "url": "https://oip.byd.com/addons/cms/news/detail?category=1&news_id=72", "source_type": "customer_site_industry_news", "primary_status": "primary", "publication_date": "2022-04-21", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact contracting legal endpoints, vehicle models, SOP, delivery, installed units and volume are undisclosed.", "Rhetorical mass-production wording is not a model-specific shipment or production receipt." ] }, { "source_id": "src-dd-auto-001", "title": "领克携手魅族探索移动出行智能化，全方位共创「无界」超级生态", "publisher": "领克汽车销售有限公司", "url": "https://www.lynkco.com.cn/brand/news/newslist/2023/1117", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2023-03-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No vehicle shipment count, direct chip purchase, foundry, package, OSAT or yield." ] }, { "source_id": "src-dd-auto-002", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2023-09-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ] }, { "source_id": "src-dd-auto-005", "title": "全新有为 进阶无界，全新领克08 EM-P 15.98万元起正式上市", "publisher": "领克汽车销售有限公司", "url": "https://www.lynkco.com.cn/brand/news/newslist/2025news/0924", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2025-09-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Near-150,000 family users span generations and cannot be assigned to the earlier SE1000 configuration." ] }, { "source_id": "src-dd-auto-007", "title": "ECARX to Power Launch of First Hongqi Model Under Strategic Partnership with FAW, Debuting AutoGPT with DeepSeek-R1 Integration", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-power-launch-first-hongqi-model-under-strategic", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2025-02-11", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-origin release; no vehicle deliveries, contract, chip shipment, foundry or OSAT." ] }, { "source_id": "src-dd-auto-008", "title": "ECARX Antora 1000 Pro", "publisher": "ECARX", "url": "https://www.ecarxgroup.com/ecarx-antora-1000-pro/", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue specifications do not prove vehicle shipments, yield, foundry or package." ] }, { "source_id": "src-dd-byd-001", "title": "全球首款批量装车1500V高耐压大功率SiC芯片 助力全球最强超级e平台", "publisher": "比亚迪股份有限公司", "url": "https://www.byd.com/cn/news/2025/detail569", "source_type": "official_corporate_technical_announcement", "primary_status": "primary", "publication_date": "2025-03-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No fab, substrate/epitaxy supplier, equipment/material supplier, capacity, output, yield, vehicle count or independent reliability." ] }, { "source_id": "src-dd-byd-002", "title": "比亚迪超级e平台，兆瓦闪充开启油电同速", "publisher": "比亚迪股份有限公司", "url": "https://www.bydglobal.com/cn/news/2025-03-18/1617162611594", "source_type": "official_customer_corporate_announcement", "primary_status": "primary", "publication_date": "2025-03-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No delivered-vehicle count, facility, yield or independent validation." ] }, { "source_id": "src-dd-byd-003", "title": "比亚迪发布e-Bus平台3.0，推动电动客车进入千伏时代", "publisher": "比亚迪股份有限公司", "url": "https://www.bydglobal.com/cn/news/2025-09-16/1617162700470", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2025-09-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No exact chip ID/legal manufacturer, deliveries, fleet operator, facility, capacity or yield." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-cloud-services" ], "id": "proc-market-cloud-services", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Cloud-service semiconductor demand", "process_id": "proc-market-cloud-services", "record_type": "process", "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625", "src-baidu-baige-deepseek-p800-20250217", "src-ctyun-ascend-cloud-20260508", "src-ctyun-cambricon-cloud-20260703" ], "verified_entity_ids": [ "ent-alibaba-cloud-ecs-brand-unresolved", "ent-baidu-ai-cloud-brand-unresolved", "ent-tianyi-cloud-tech" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "515a89682db8b90d6dfbb69a3d641e1c7f707451e8a86a2ae899766076c5fe18", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-alibaba-ecs-yitian-instance-families-20260625", "title": "Elastic Compute Service: Available instance families", "publisher": "Alibaba Cloud Documentation Center", "url": "https://www.alibabacloud.com/help/en/ecs/user-guide/overview-of-instance-families", "source_type": "official_cloud_product_documentation", "primary_status": "primary", "publication_date": "2026-06-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves a current commercial catalogue configuration, not region-specific operator, physical facility, installed count or utilization.", "Server manufacturer, board BOM, foundry, package/OSAT, capacity, tenant, uptime and workload receipts are undisclosed." ] }, { "source_id": "src-baidu-baige-deepseek-p800-20250217", "title": "百度百舸 DeepSeek 一体机发布，支持昆仑芯 P800 单机 8 卡满血版开箱即用", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_e0a478ab-bfa4-425c-b9b5-a6d296f6c698", "source_type": "official_operator_product_release", "primary_status": "primary", "publication_date": "2025-02-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Launch/apply-for-trial and vendor deployment statements; no order, shipment, customer acceptance or independent workload receipt.", "Server OEM, CPU/memory/network BOM, cluster facility, exact card count, uptime and utilization are undisclosed." ] }, { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] }, { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-07-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-consumer-electronics" ], "id": "proc-market-consumer-electronics", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Consumer-electronics semiconductor demand", "process_id": "proc-market-consumer-electronics", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "f73dbe5edd1567a4b9dd69c75240082bd89029fe9d0ab2d142999e05330a9526", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-energy" ], "id": "proc-market-energy", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Energy-system semiconductor demand", "process_id": "proc-market-energy", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "09c67b5ab4a605e4f2076b4febae7b9ac0eeff08e666855903230d2335bd49a6", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-grid" ], "id": "proc-market-grid", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Grid-equipment semiconductor demand", "process_id": "proc-market-grid", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "9232af2ab72f3c0a94e460bdc9e46f32020e949222d44b3615c4cffbd0fe4386", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-imaging-power" ], "id": "proc-market-imaging-power", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Image-sensor and power-electronics demand", "process_id": "proc-market-imaging-power", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "d5f165e347d5af677ed025c1b63150235e05036e8274ce4e253933a82bc92024", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-industrial-automation" ], "id": "proc-market-industrial-automation", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Industrial-automation semiconductor demand", "process_id": "proc-market-industrial-automation", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "aa62ba6fdc0b70e07468631a6f244fe0b64bc05517163441221a091143bf692f", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-medical" ], "id": "proc-market-medical", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Medical-device semiconductor demand", "process_id": "proc-market-medical", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "351ed1fa51118bb140a8f59b25ceaae218efcb70125f411cd0daa1f15c64329b", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-networking" ], "id": "proc-market-networking", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Networking-system semiconductor demand", "process_id": "proc-market-networking", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "1f71308126078708a548eb985b5f3a871b8d498d9d392a6211c26f027154c7a8", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-pcs" ], "id": "proc-market-pcs", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "PC semiconductor demand", "process_id": "proc-market-pcs", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "8c9f2577785318ce9096f2cc68412568037256945134d551ed41f7da4e2a609f", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-robotics" ], "id": "proc-market-robotics", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Robotics semiconductor demand", "process_id": "proc-market-robotics", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "fdedd561cc40954dc32c3b33abddb40f53e0da00e3401354dda64940586d91c0", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-scientific-computing" ], "id": "proc-market-scientific-computing", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Scientific-computing semiconductor demand", "process_id": "proc-market-scientific-computing", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "f2938440525aa8ba00147d1299362b1281fc33a4de7483e63f2cc8b91e19b9ed", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-smartphones" ], "id": "proc-market-smartphones", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Smartphone semiconductor demand", "process_id": "proc-market-smartphones", "record_type": "process", "source_ids": [ "src-dd-mobile-005", "src-dd-mobile-006", "src-dd-mobile-007", "src-dd-mobile-008" ], "verified_entity_ids": [ "ent-dd-unisoc-shanghai" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "7b0c1aee75302ca06c2d5577bf5d5970ef51332a1f81050bb3a25f70c58f3d57", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-mobile-005", "title": "T7250", "publisher": "紫光展锐", "url": "https://www.unisoc.com/cn/product/SmartPhone/T7250", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, Xiaomi-specific certification or volume." ] }, { "source_id": "src-dd-mobile-006", "title": "T7250", "publisher": "UNISOC", "url": "https://www.unisoc.com/en/product/SmartPhone/T7250", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, Xiaomi-specific certification or volume." ] }, { "source_id": "src-dd-mobile-007", "title": "联系我们", "publisher": "紫光展锐", "url": "https://www.unisoc.com/cn/about/contact-us", "source_type": "official_company_identity_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Identity only; not a direct Xiaomi purchase receipt." ] }, { "source_id": "src-dd-mobile-008", "title": "Contact Us", "publisher": "UNISOC", "url": "https://www.unisoc.com/en/about/contact-us", "source_type": "official_company_identity_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Identity only; not a direct Xiaomi purchase receipt." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-storage" ], "id": "proc-market-storage", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Storage-system semiconductor demand", "process_id": "proc-market-storage", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "0c84d8a61c72ad17eafb03f649c0db83e2ce38edb05d4f5b81bc0626699c8717", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-market-telecom" ], "id": "proc-market-telecom", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "end_market", "name": "Telecom-system semiconductor demand", "process_id": "proc-market-telecom", "record_type": "process", "source_ids": [ "src-dd-cu-001", "src-dd-cu-003", "src-digital-china-chinatelecom-framework-20250423", "src-digital-china-cmcc-framework-20240824", "src-h3c-r4930g3-product" ], "verified_entity_ids": [ "ent-beijing-digital-china-yunke", "ent-dd-cu-digital", "ent-dd-cu-operating", "ent-h3c-technologies", "ent-shenzhou-kuntai-xiamen" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "c5e0875a46b4253bbb22b5b63ff95f6f530ba0f832dd8c82e31e654ce6582cb4", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-cu-001", "title": "2025年中国联通通用服务器集中采购项目中标候选人公示", "publisher": "中国联通采购与招标网", "url": "https://www.chinaunicombidding.cn/bidInformation/detail?id=1971600438168158208", "source_type": "official_customer_tender_candidate_notice", "primary_status": "primary", "publication_date": "2025-09-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Candidate notice only; no final award, framework, order, model, share, delivery, installation or acceptance." ] }, { "source_id": "src-dd-cu-003", "title": "2026年中国联通云智业务智算资源池设备及集成安装服务招标公告", "publisher": "中国联通采购与招标网", "url": "https://www.chinaunicombidding.cn/bidInformation/detail?id=2080612123361193984", "source_type": "official_customer_tender_notice", "primary_status": "primary", "publication_date": "2026-07-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Tender only; no bidder, awardee, contract, model, exact facility, delivery, installation or acceptance." ] }, { "source_id": "src-digital-china-chinatelecom-framework-20250423", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2025-04/23/content_2053613.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Framework award value is not ordered, delivered or accepted value.", "Server models, CPU/accelerator vendor and part numbers, memory/NIC BOM, quantity, receiving affiliate/facility and test receipt are undisclosed." ] }, { "source_id": "src-digital-china-cmcc-framework-20240824", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2024-08/24/content_1957609.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2024-08-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "842 is a framework award ceiling, not an actual order, shipment, installation or acceptance count.", "Server model, accelerator/CPU/memory/NIC BOM, facility, value, serial and asset receipt are undisclosed." ] }, { "source_id": "src-h3c-r4930g3-product", "title": "搭载海光二号的双路服务器H3C UniServer R4930 G3", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/Products_And_Solution/Server/H3C/Products/RackServer/Products_Series/Dualway_Server/R4930_G3/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No exact factory/address, processor SKU by configuration, shipment, customer, installed base, capacity or reliability receipt.", "The all-domestic wording lacks a component-level BOM and origin record." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-mask-reticle" ], "id": "proc-mask-reticle", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "patterning", "name": "Mask, reticle, pellicle, inspection and repair", "process_id": "proc-mask-reticle", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "d271f1eb6b2eb8f212a211113060019834df9b89331e84860344868b821c7879", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "patterning" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "patterning" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-200mm-silicon" ], "id": "proc-material-200mm-silicon", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "200 mm silicon wafers", "process_id": "proc-material-200mm-silicon", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "3372466435c238ba58742248b3d52efba6adadd7e5cb9ff7170274c30a708c10", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-300mm-silicon" ], "id": "proc-material-300mm-silicon", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "300 mm silicon wafers", "process_id": "proc-material-300mm-silicon", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "db19a82469049bab8e1e393074956469f9e84f1305ba1719507dbf04e61b13cb", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-abf-bt-ceramic" ], "id": "proc-material-abf-bt-ceramic", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "ABF, BT resin and packaging ceramics", "process_id": "proc-material-abf-bt-ceramic", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "2cbf1a01860ed7989737843d104948bf64da12d605bd2a6bb43250c5ec243bd1", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-adhesive-molding-thermal" ], "id": "proc-material-adhesive-molding-thermal", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "Adhesives, underfill, NCF, EMC, TIM and fillers", "process_id": "proc-material-adhesive-molding-thermal", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "15845539fc1218f1b870d393886c692aaa3c772ccf6955ac0ab5e5f713005810", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-cmp-consumables" ], "id": "proc-material-cmp-consumables", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "CMP slurry and pads", "process_id": "proc-material-cmp-consumables", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "195adc5309964f099eb5952227163975396c38ada1eb5b4615a734d1864a93da", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-compound-substrate" ], "id": "proc-material-compound-substrate", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "SiC, GaN and sapphire substrates and epitaxy", "process_id": "proc-material-compound-substrate", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "1aff4f8d32cbd6d00fad1ab0a0e40d06d85055302b256570678cc718d01f7c6e", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-epi-heavy-doped" ], "id": "proc-material-epi-heavy-doped", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "Epitaxial and heavily doped silicon wafers", "process_id": "proc-material-epi-heavy-doped", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "951e72981507dd02ef1b204363380040a5d4e0a88a8f1abc3b8608179004da80", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-leadframe-bondwire" ], "id": "proc-material-leadframe-bondwire", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "Leadframes and bonding wire", "process_id": "proc-material-leadframe-bondwire", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "6270f97caaefa2f33003c8a80bb0be0290f16f7abf9d54486c0f35ff57110501", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-mask-blank-quartz" ], "id": "proc-material-mask-blank-quartz", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "Mask blanks and high-purity quartz", "process_id": "proc-material-mask-blank-quartz", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "7ae8f843ba71f8f20ceefae683ac0328d169f27ba048a2eb344334a299f04492", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-metal-highk-precursors" ], "id": "proc-material-metal-highk-precursors", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "Barrier, seed, high-k and metal precursors", "process_id": "proc-material-metal-highk-precursors", "record_type": "process", "source_ids": [ "src-nata-mo-sources" ], "verified_entity_ids": [ "ent-nata" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "4990b1a6e80aed6ae0e2e31758649da90084651269c64bbc96ff202142171271", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nata-mo-sources", "title": "MO源", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/moyuan", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Adduct/Semi are not numeric purity specifications; no CoA, named customer, facility or qualification." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-process-gases" ], "id": "proc-material-process-gases", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "Etch, deposition, implant and bulk process gases", "process_id": "proc-material-process-gases", "record_type": "process", "source_ids": [ "src-huate-gas-annual-2025", "src-nata-electronic-gases" ], "verified_entity_ids": [ "ent-huate-gas", "ent-nata" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "c5c66cca2df07d5f045c901d5b3a158975d404f35bc5bd834318361ea1192f0f", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] }, { "source_id": "src-nata-electronic-gases", "title": "电子特气", "publisher": "江苏南大光电材料股份有限公司", "url": "https://www.natachem.com/dianziteqi/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No impurity-by-element, moisture/oxygen/particle limits, CoA, named fab, qualified layer or shipment quantity." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-resist-stack" ], "id": "proc-material-resist-stack", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "Photoresist, PAG, resin, developer, rinse and topcoat", "process_id": "proc-material-resist-stack", "record_type": "process", "source_ids": [ "src-icmtia-kehua-248nm-award-2021", "src-kehua-company-home-20260729", "src-kehua-icmtia-product-catalogue-2026", "src-red-avenue-annual-2025", "src-redavenue-kehua-investment-2025", "src-redavenue-subsidiaries-guarantee-2025", "src-scip-tongcheng-resin-energy-review-2025" ], "verified_entity_ids": [ "ent-beijing-kehua", "ent-tongcheng-chemical-china", "ent-tongcheng-electronic-materials-shanghai" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "900d314c4ad62dc807475ec192d51b9c6f70760b59748613e95703aa62976849", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_and_secondary", "source_refs": [ { "source_id": "src-icmtia-kehua-248nm-award-2021", "title": "“第二届集成电路材料奖”获奖名单颁布", "publisher": "中关村集成电路材料产业技术创新联盟", "url": "https://www.icmtia.com/news/647.html", "source_type": "industry_association_award_record", "primary_status": "secondary", "publication_date": "2021-11-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The award names Beijing Kehua and a 248 nm family, not an exact SKU, customer, fab, layer, lot, quantity, qualification date or independent process data." ] }, { "source_id": "src-kehua-company-home-20260729", "title": "北京科华微电子材料有限公司 — 关于我们 / Kempur home page", "publisher": "北京科华微电子材料有限公司", "url": "https://www.kempur.com/", "source_type": "official_company_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "indexed_direct_open_error", "limitations": [ "Direct page fetch returned an internal error; only the public search-indexed company-page text was recorded and no access control was bypassed.", "Line descriptions and address do not establish permit capacity, installed tools, current utilization, output, model-to-line mapping, named customer or qualification." ] }, { "source_id": "src-kehua-icmtia-product-catalogue-2026", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "url": "https://en.icmtia.com/product/348.html", "source_type": "industry_alliance_product_catalogue", "primary_status": "secondary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ] }, { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] }, { "source_id": "src-redavenue-kehua-investment-2025", "title": "彤程新材料集团股份有限公司对外投资进展公告", "publisher": "彤程新材料集团股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2025-05/28/content_2074043.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-05-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The disclosure said business-registration changes remained at publication; the later annual report gives 96.3296%, a one-ten-thousandth-point rounding difference." ] }, { "source_id": "src-redavenue-subsidiaries-guarantee-2025", "title": "彤程新材料集团股份有限公司关于年度预计融资担保进展的公告", "publisher": "彤程新材料集团股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2025-04/03/content_2044624.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Registered residences are legal-entity addresses and are not automatically the same as every manufacturing site." ] }, { "source_id": "src-scip-tongcheng-resin-energy-review-2025", "title": "上海化学工业区管理委员会关于彤程化学（中国）有限公司光刻胶上游树脂及电子甲醛项目节能报告的审查意见", "publisher": "上海化学工业区管理委员会", "url": "https://www.scip.gov.cn/govxxgk/jjfzc/2025-01-17/3ca523a9-c4da-4e50-a029-cdb960d5101c.html", "source_type": "government_energy_review", "primary_status": "primary", "publication_date": "2025-01-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Energy-review approval proves applicant, site, planned line count and design output, not construction completion, production, customer qualification or shipment." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-soi" ], "id": "proc-material-soi", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "Silicon-on-insulator wafers", "process_id": "proc-material-soi", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "b10ab2b9804ee55dcb32b6c33f685e698dfaf0a9948428466acf98b9024bae3b", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-sputter-targets" ], "id": "proc-material-sputter-targets", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "Sputtering targets", "process_id": "proc-material-sputter-targets", "record_type": "process", "source_ids": [ "src-grinm-grikin-300mm-cu-target-2021", "src-kfmi-home-purity" ], "verified_entity_ids": [ "ent-grikin", "ent-kfmi" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "e61a9a13a3f8369ebcf45e0a9f58877c87a6bfa92f3da015ec68d643f9c1bdc0", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-grinm-grikin-300mm-cu-target-2021", "title": "有研亿金300mm超高纯铜靶喜获第二届集成电路材料五星产品奖", "publisher": "中国有研科技集团有限公司", "url": "https://www.grinm.com/s/2614-6794-121247.html", "source_type": "state_parent_product_announcement", "primary_status": "primary", "publication_date": "2021-11-15", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers are unnamed; exact purity basis, target drawing, capacity, process layer, shipment quantity and yield are absent." ] }, { "source_id": "src-kfmi-home-purity", "title": "宁波江丰电子材料股份有限公司", "publisher": "宁波江丰电子材料股份有限公司", "url": "https://www.kfmic.com/", "source_type": "company_technology_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Purity capability is not a lot CoA, target drawing, named customer qualification or process-layer receipt." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-substrate-interposer-rdl" ], "id": "proc-material-substrate-interposer-rdl", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "Package substrates, interposers and RDL materials", "process_id": "proc-material-substrate-interposer-rdl", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "8fddbf3aeff8e949db72e1770c8642694d14ec8c800bbfb5580a7cf7813ce7be", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-material-wet-plating-chemistry" ], "id": "proc-material-wet-plating-chemistry", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "materials_leaf", "name": "Wet chemicals and electroplating chemistry", "process_id": "proc-material-wet-plating-chemistry", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "8d46443e3d09d8ba233ad6b320c7f6fb1f2131e6c42af31b120cd04a10cdefff", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-metrology" ], "id": "proc-metrology", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "process_control", "name": "CD, overlay, film and materials metrology", "process_id": "proc-metrology", "record_type": "process", "source_ids": [ "src-skyverse-ginkgoifm-p300-2025" ], "verified_entity_ids": [ "ent-skyverse" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "3a83c8d0f3af7f662f365f6bf9746e0210e324e04d1e19be44d212c466ddda9f", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "process_control" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-skyverse-ginkgoifm-p300-2025", "title": "Skyverse Releases GINKGOIFM-P300 and Ships First Tool to HBM Client", "publisher": "Skyverse Technology Co., Ltd.", "url": "https://www.skyverse.cn/en/article/38/30.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2025-11-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customer and facility are anonymous; shipment is not installation, acceptance, process qualification or HBM-stack qualification." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-nand-fabrication" ], "id": "proc-nand-fabrication", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "fabrication", "name": "3D NAND wafer fabrication", "process_id": "proc-nand-fabrication", "record_type": "process", "source_ids": [ "src-memblaze-ymtc-pblaze6", "src-samsung-xian-operation-2014", "src-skhynix-dalian-acquisition-2021", "src-skhynix-f1-facilities-2026", "src-skhynix-sec-subsidiaries-2026", "src-ymtc-64layer-2019", "src-ymtc-about" ], "verified_entity_ids": [ "ent-ymtc", "ent-samsung-china-semiconductor", "ent-skhynix" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "70d6ca638052ef0a8b67ab6a7c267b0d36a5500c448acec78dc6755298111ae7", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-memblaze-ymtc-pblaze6", "title": "PBlaze6 6541 Enterprise SSD", "publisher": "北京忆恒创源科技股份有限公司", "url": "https://www.memblaze.com/product/pblaze6/639.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Direct product BOM join for NAND only; controller, PMIC, firmware component origins and shipment volume are not fully disclosed." ] }, { "source_id": "src-samsung-xian-operation-2014", "title": "Samsung Announces Operation of Its Memory Facility in Xi'an, China", "publisher": "Samsung Electronics", "url": "https://news.samsung.com/global/samsung-announces-operation-of-its-memory-facility-in-xian-china", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2014-05-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical start receipt; current capacity, generation, utilization, supplier mix, and export-control exposure require later sources." ] }, { "source_id": "src-skhynix-dalian-acquisition-2021", "title": "SK hynix Completes the First Phase of Intel NAND and SSD Business Acquisition", "publisher": "SK hynix", "url": "https://news.skhynix.com/sk-hynix-completes-the-first-phase-of-intel-nand-and-ssd-business-acquisition/", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2021-12-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Acquisition receipt does not provide current capacity, product generation, yield, utilization, or local supplier share." ] }, { "source_id": "src-skhynix-f1-facilities-2026", "title": "SK hynix Inc. Form F-1 Registration Statement", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785df1.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing identifies C2/C2F DRAM and Dalian NAND and states group-wide full utilization, but does not disclose facility wafer capacity, node, output, yield, tool fleet or supplier BOM.", "Parent-level owns/operates language does not by itself resolve immediate local legal-title chains." ] }, { "source_id": "src-skhynix-sec-subsidiaries-2026", "title": "List of Subsidiaries of SK hynix Inc.", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785dex211.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Subsidiary list proves consolidated legal-entity inclusion, not immediate ownership percentage or the legal title holder for each fab parcel and tool set." ] }, { "source_id": "src-ymtc-64layer-2019", "title": "采用Xtacking®架构，长江存储启动64层3D NAND闪存量产", "publisher": "长江存储科技有限责任公司", "url": "https://www.ymtc.com/cn/news/37.html", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2019-09-02", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical product evidence; scanner vendor/model and current generation/fleet are not disclosed." ] }, { "source_id": "src-ymtc-about", "title": "企业简介", "publisher": "长江存储科技有限责任公司", "url": "https://www.ymtc.com/cn/aboutus.html", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Does not disclose scanner vendors/models, capacity, yield or supplier BOM." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-national-commercial-demand" ], "id": "proc-national-commercial-demand", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "demand", "name": "National and commercial semiconductor demand", "process_id": "proc-national-commercial-demand", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "5fbd7c4bd4115efcf75fc608aeb7c0be52785abcb5299f9b501f412029342ffe", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "demand" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "demand" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-organic-substrate" ], "id": "proc-organic-substrate", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "advanced_packaging", "name": "Organic substrate manufacturing", "process_id": "proc-organic-substrate", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "52ddf17651049cc548938828fb8a0ee3edfcc1045a963318ac1745a1011ca63a", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "advanced_packaging" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "advanced_packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-os-collectives-serving" ], "id": "proc-os-collectives-serving", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "software", "name": "OS, collectives, serving engine and scheduling", "process_id": "proc-os-collectives-serving", "record_type": "process", "source_ids": [ "src-dfsx-3d-near-memory-2026", "src-dfsx-df1000-product-2026" ], "verified_entity_ids": [ "ent-dfsx" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "579a5525d32732c86c50e63f8d7613b02867b7c6eb4bb9ba5cfc108b64ab0876", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "layer", "value": "software" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "software" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dfsx-3d-near-memory-2026", "title": "3D Near-Memory Computing", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/technology/3d-near-memory-computing", "source_type": "company_technology_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported architecture; no bond pitch, memory die source, layer count, yield, or independent test." ] }, { "source_id": "src-dfsx-df1000-product-2026", "title": "DF1000 AI Accelerator", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/products/ai-accelerator/df1000", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor page exposes no independent workload receipt, memory supplier, foundry, package yield, power, customer, or shipment volume." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-osat-assembly" ], "id": "proc-osat-assembly", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "packaging_test", "name": "Assembly and advanced packaging", "process_id": "proc-osat-assembly", "record_type": "process", "source_ids": [ "src-amkor-current-factory-2026", "src-amkor-shanghai-expansion-2015", "src-ase-wuxi-facility", "src-ase-wuxi-operator-2025", "src-tongfu-hbm-project-2025", "src-util-004" ], "verified_entity_ids": [ "ent-amkor", "ent-ase", "ent-nantong-tongfu", "ent-tongfu", "ent-util-yuerun" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "9fcbff472df540c3f3c5602dc96f6103bb075406166e846f4c663966c5700344", "stage_ids": [ "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "packaging_test" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "layer", "value": "packaging_test" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "packaging_test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-amkor-current-factory-2026", "title": "Contact Us — Factories", "publisher": "Amkor Technology, Inc.", "url": "https://amkor.com/contact-us/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The current factory list proves legal name, factory identifier and address, not package-specific qualification, customers, capacity, utilization, yield or immediate ownership chain." ] }, { "source_id": "src-amkor-shanghai-expansion-2015", "title": "Amkor Technology Announces Expansion of China Operations", "publisher": "Amkor Technology, Inc.", "url": "https://ir.amkor.com/news-releases/news-release-details/amkor-technology-announces-expansion-china-operations", "source_type": "company_facility_announcement", "primary_status": "primary", "publication_date": "2015-07-21", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical portfolio description is not package-specific customer qualification, capacity, utilization, yield or current production proof." ] }, { "source_id": "src-ase-wuxi-facility", "title": "Global Manufacturing", "publisher": "Advanced Semiconductor Engineering, Inc.", "url": "https://ase.aseglobal.com/about-ase/manufacturing-facilities/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not identify the exact Chinese legal operator, package platforms, customers, capacity, qualification, utilization or ownership chain." ] }, { "source_id": "src-ase-wuxi-operator-2025", "title": "ASE WuXi — 关于我们", "publisher": "无锡通芝微电子有限公司", "url": "https://www.asewx.com/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page proves the operating legal name, address and generic assembly/test scope, not the immediate ownership chain, package platforms, named customers, capacity, utilization or yield." ] }, { "source_id": "src-tongfu-hbm-project-2025", "title": "HBM芯粒先进封装研发及产线建设项目环境影响报告表公示", "publisher": "通富微电子股份有限公司", "url": "https://www.tfme.com/news/1380.html", "source_type": "company_project_eia", "primary_status": "primary", "publication_date": "2025-01-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Project/EIA receipt is not HBM customer qualification, qualified stack generation, yield, shipment, or volume production." ] }, { "source_id": "src-util-004", "title": "华康洁净中标越润高端封测基地项目 强链国产半导体", "publisher": "武汉华康世纪洁净科技股份有限公司", "url": "https://www.whhksj.com/details/217.html", "source_type": "official_supplier_project_notice", "primary_status": "primary", "publication_date": "2026-05-11", "date_checked": "2026-07-29", "access_state": "indexed_direct_open_error", "limitations": [ "Supplier-authored award notice. No counterparty confirmation, signed contract, installation, acceptance, production qualification or output receipt was located." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-packaging-substrates" ], "id": "proc-packaging-substrates", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "materials", "name": "Organic, ceramic, glass and silicon substrates/interposers", "process_id": "proc-packaging-substrates", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "6bbef504bb233ae7e30e096cbdf1b46d160bed82dfe77e8e6373bd5654c4c9c2", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-pdk-libraries-ip" ], "id": "proc-pdk-libraries-ip", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "eda_ip", "name": "PDK, standard cells, memory compilers and interface IP", "process_id": "proc-pdk-libraries-ip", "record_type": "process", "source_ids": [ "src-innosilicon-ip-catalogue", "src-xpeedic-pdk-2022" ], "verified_entity_ids": [ "ent-xpeedic", "ent-innosilicon-brand" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "8acebd21f546e3efd62ef5bdc61afa90d3e64b33bd9026080fd3750215154392", "stage_ids": [ "architecture_ip", "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "layer", "value": "eda_ip" } ] }, { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "layer", "value": "eda_ip" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "eda_ip" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-innosilicon-ip-catalogue", "title": "IP Solutions", "publisher": "Innosilicon", "url": "https://www.innosilicon.com/ip-solution", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue compatibility is not a named license, tapeout, qualified production chip, or mainland HBM stack." ] }, { "source_id": "src-xpeedic-pdk-2022", "title": "Chip Design EDA Solution", "publisher": "芯和半导体科技（上海）股份有限公司", "url": "https://www.xpeedic.com/cn/ueditor/php/upload/file/20220412/1649752311805858.pdf", "source_type": "company_technical_document", "primary_status": "primary", "publication_date": "2022-04-12", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Tool/service availability is not a named foundry PDK, customer tapeout, or advanced-node production receipt." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-physical-design-signoff" ], "id": "proc-physical-design-signoff", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "eda", "name": "Place and route, timing, power and signoff", "process_id": "proc-physical-design-signoff", "record_type": "process", "source_ids": [ "src-empyrean-annual-2025" ], "verified_entity_ids": [ "ent-empyrean" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "7e699b3bebe5b9c00e1149fdef061fd1103ff2a7ac126699b6d9259da60e484b", "stage_ids": [ "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "layer", "value": "eda" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "eda" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-empyrean-annual-2025", "title": "北京华大九天科技股份有限公司2025年年度报告", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-28/1225215590.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio disclosure does not establish a successful advanced-node tapeout, named PDK, or independent parity." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-plating" ], "id": "proc-plating", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "wafer_equipment", "name": "Electroplating", "process_id": "proc-plating", "record_type": "process", "source_ids": [ "src-acm-annual-2025" ], "verified_entity_ids": [ "ent-acm-shanghai" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "1f5aaa15783618dbb06f130f357322383439c118053c8e100afb4df02784925e", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-acm-annual-2025", "title": "盛美半导体设备（上海）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-02-27/688082_20260227_7FPP.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-02-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio statement does not prove a named-fab installation or qualified layer." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-power-cooling" ], "id": "proc-power-cooling", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "systems", "name": "Power delivery and cooling", "process_id": "proc-power-cooling", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "5214dafb0224ba8005b85a66fd9b3c5f4c2e35cf18d70317c89ca528119028ab", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "layer", "value": "systems" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-power-water" ], "id": "proc-power-water", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "facilities", "name": "Power, ultrapure water and backup power", "process_id": "proc-power-water", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "8c160d3ffe5ff9c6d99ede6b90a13859aaa27a7c3ff08ba5bc053d0defcec54c", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-rdl-interposer" ], "id": "proc-rdl-interposer", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "advanced_packaging", "name": "RDL and interposer integration", "process_id": "proc-rdl-interposer", "record_type": "process", "source_ids": [ "src-xmc-home-2026", "src-xmc-privacy-current-legal", "src-xmc-prospectus-2025" ], "verified_entity_ids": [ "ent-xmc" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "adb9620b6df3f0dddb2a0614587e8e3c5e840f4605f62c106bdb850593a6c415", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "advanced_packaging" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "advanced_packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-xmc-home-2026", "title": "武汉新芯集成电路股份有限公司", "publisher": "武汉新芯集成电路股份有限公司", "url": "https://www.xmcwh.com/", "source_type": "company_home_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio statement does not prove a particular customer, process yield, capacity, or tool/material supplier." ] }, { "source_id": "src-xmc-privacy-current-legal", "title": "隐私协议", "publisher": "武汉新芯集成电路股份有限公司", "url": "https://www.xmcwh.com/site/privacy-agreement", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal-identity receipt only." ] }, { "source_id": "src-xmc-prospectus-2025", "title": "武汉新芯集成电路股份有限公司招股说明书", "publisher": "武汉新芯集成电路股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202509/002044_20250929_SM99.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-09-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Fab phases, scanner fleet, periodic output and yield are not disclosed in the reviewed sections." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-reliability-failure-analysis" ], "id": "proc-reliability-failure-analysis", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "packaging_test", "name": "Reliability and failure analysis", "process_id": "proc-reliability-failure-analysis", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "e47d308f5e972469c013d74f82a533c39ad5f940e287bac726d67d11b9bad094", "stage_ids": [ "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "packaging_test" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "layer", "value": "packaging_test" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "packaging_test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-sic-gan" ], "id": "proc-sic-gan", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "fabrication", "name": "SiC and GaN device fabrication", "process_id": "proc-sic-gan", "record_type": "process", "source_ids": [ "src-dd-byd-001", "src-util-003" ], "verified_entity_ids": [ "ent-dd-byd-semiconductor-unresolved", "ent-util-silan-jihong" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "a35772870d277005d3f5fbf1aa2def790f770158e74f0b8d6f8eb922775c4ed5", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-byd-001", "title": "全球首款批量装车1500V高耐压大功率SiC芯片 助力全球最强超级e平台", "publisher": "比亚迪股份有限公司", "url": "https://www.byd.com/cn/news/2025/detail569", "source_type": "official_corporate_technical_announcement", "primary_status": "primary", "publication_date": "2025-03-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No fab, substrate/epitaxy supplier, equipment/material supplier, capacity, output, yield, vehicle count or independent reliability." ] }, { "source_id": "src-util-003", "title": "喜讯 | 盛剑科技中标厦门士兰集宏半导体有限公司项目", "publisher": "上海盛剑科技股份有限公司", "url": "https://www.sheng-jian.com/news_details/386.html", "source_type": "official_supplier_project_notice", "primary_status": "primary", "publication_date": "2025-01-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No award amount, signed contract, installation, acceptance or commissioning receipt is published. The 720,000 wafers/year figure is a two-phase eventual design target and not Phase I installed capacity or output." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-signal-power-integrity" ], "id": "proc-signal-power-integrity", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "eda", "name": "Signal and power integrity", "process_id": "proc-signal-power-integrity", "record_type": "process", "source_ids": [ "src-xpeedic-pdk-2022" ], "verified_entity_ids": [ "ent-xpeedic" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "84f196d759c94b175bd0e942859d65c0326c424eac003c986c889c0c4d01b390", "stage_ids": [ "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "layer", "value": "eda" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "eda" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-xpeedic-pdk-2022", "title": "Chip Design EDA Solution", "publisher": "芯和半导体科技（上海）股份有限公司", "url": "https://www.xpeedic.com/cn/ueditor/php/upload/file/20220412/1649752311805858.pdf", "source_type": "company_technical_document", "primary_status": "primary", "publication_date": "2022-04-12", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Tool/service availability is not a named foundry PDK, customer tapeout, or advanced-node production receipt." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-silicon-photonics" ], "id": "proc-silicon-photonics", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "fabrication", "name": "Silicon photonics and optical integration", "process_id": "proc-silicon-photonics", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "881ef31542bb20067ce22cefb4e9a44cfd84e7863ccb879bd241b267c2ac9bb8", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-silicon-wafers" ], "id": "proc-silicon-wafers", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "materials", "name": "Silicon and SOI wafers", "process_id": "proc-silicon-wafers", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "07c2491f254b422e3cb6369a9d9232d0c22700d603703fc20e04a7973cbc548d", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-specialty-memory" ], "id": "proc-specialty-memory", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "fabrication", "name": "NOR and specialty memory fabrication", "process_id": "proc-specialty-memory", "record_type": "process", "source_ids": [ "src-xmc-home-2026", "src-xmc-privacy-current-legal", "src-xmc-prospectus-2025" ], "verified_entity_ids": [ "ent-xmc" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "823e50f8c6e97c4adcd53194b29439a19bbc2db1de69d9ef7e3472eb8225a696", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-xmc-home-2026", "title": "武汉新芯集成电路股份有限公司", "publisher": "武汉新芯集成电路股份有限公司", "url": "https://www.xmcwh.com/", "source_type": "company_home_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio statement does not prove a particular customer, process yield, capacity, or tool/material supplier." ] }, { "source_id": "src-xmc-privacy-current-legal", "title": "隐私协议", "publisher": "武汉新芯集成电路股份有限公司", "url": "https://www.xmcwh.com/site/privacy-agreement", "source_type": "company_legal_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Legal-identity receipt only." ] }, { "source_id": "src-xmc-prospectus-2025", "title": "武汉新芯集成电路股份有限公司招股说明书", "publisher": "武汉新芯集成电路股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202509/002044_20250929_SM99.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-09-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Fab phases, scanner fleet, periodic output and yield are not disclosed in the reviewed sections." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-stack-assembly-repair" ], "id": "proc-stack-assembly-repair", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "advanced_packaging", "name": "Stack assembly, repair and redundancy", "process_id": "proc-stack-assembly-repair", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "723c7ed4540a04626f467efafee3d5fe86f5f05f2294e6b7ed4377306921e4f8", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "advanced_packaging" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "advanced_packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-storage-tier" ], "id": "proc-storage-tier", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "systems", "name": "Local, CXL, PCIe, NVMe and remote storage tiers", "process_id": "proc-storage-tier", "record_type": "process", "source_ids": [ "src-memblaze-ymtc-pblaze6", "src-montage-mxc-official" ], "verified_entity_ids": [ "ent-montage", "ent-memblaze" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "eaafc6a004e119dd228afdd2173d1691e576c6b83424187535b9ad0421f08e98", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "layer", "value": "systems" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-memblaze-ymtc-pblaze6", "title": "PBlaze6 6541 Enterprise SSD", "publisher": "北京忆恒创源科技股份有限公司", "url": "https://www.memblaze.com/product/pblaze6/639.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Direct product BOM join for NAND only; controller, PMIC, firmware component origins and shipment volume are not fully disclosed." ] }, { "source_id": "src-montage-mxc-official", "title": "MXC Memory Expansion Controller", "publisher": "澜起科技股份有限公司", "url": "https://www.montage-tech.com/index.php/MXC", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Product availability does not prove deployment in a named accelerator, p50/p99 latency, energy, contention, or recovery." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-system-architecture" ], "id": "proc-system-architecture", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "systems", "name": "System architecture and integration", "process_id": "proc-system-architecture", "record_type": "process", "source_ids": [ "src-ctyun-ascend-cloud-20260508", "src-ctyun-cambricon-cloud-20260703", "src-dfsx-3d-near-memory-2026", "src-dfsx-df1000-product-2026", "src-digital-china-chinatelecom-framework-20250423", "src-digital-china-cmcc-framework-20240824", "src-h3c-r4930g3-product" ], "verified_entity_ids": [ "ent-beijing-digital-china-yunke", "ent-dfsx", "ent-h3c-technologies", "ent-shenzhou-kuntai-xiamen", "ent-tianyi-cloud-tech" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "7dddca0905887685f32ce17f443bb63d59d248e0712e6424750f6f8dd6da2a94", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "layer", "value": "systems" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] }, { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-07-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ] }, { "source_id": "src-dfsx-3d-near-memory-2026", "title": "3D Near-Memory Computing", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/technology/3d-near-memory-computing", "source_type": "company_technology_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported architecture; no bond pitch, memory die source, layer count, yield, or independent test." ] }, { "source_id": "src-dfsx-df1000-product-2026", "title": "DF1000 AI Accelerator", "publisher": "上海东方算芯科技有限公司", "url": "https://www.dfsx.com/products/ai-accelerator/df1000", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor page exposes no independent workload receipt, memory supplier, foundry, package yield, power, customer, or shipment volume." ] }, { "source_id": "src-digital-china-chinatelecom-framework-20250423", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2025-04/23/content_2053613.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Framework award value is not ordered, delivered or accepted value.", "Server models, CPU/accelerator vendor and part numbers, memory/NIC BOM, quantity, receiving affiliate/facility and test receipt are undisclosed." ] }, { "source_id": "src-digital-china-cmcc-framework-20240824", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2024-08/24/content_1957609.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2024-08-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "842 is a framework award ceiling, not an actual order, shipment, installation or acceptance count.", "Server model, accelerator/CPU/memory/NIC BOM, facility, value, serial and asset receipt are undisclosed." ] }, { "source_id": "src-h3c-r4930g3-product", "title": "搭载海光二号的双路服务器H3C UniServer R4930 G3", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/Products_And_Solution/Server/H3C/Products/RackServer/Products_Series/Dualway_Server/R4930_G3/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No exact factory/address, processor SKU by configuration, shipment, customer, installed base, capacity or reliability receipt.", "The all-domestic wording lacks a component-level BOM and origin record." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-thermal" ], "id": "proc-thermal", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "wafer_equipment", "name": "Furnace, oxidation, diffusion and RTP", "process_id": "proc-thermal", "record_type": "process", "source_ids": [ "src-acm-annual-2025", "src-naura-annual-2025" ], "verified_entity_ids": [ "ent-naura", "ent-acm-shanghai" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "c3ee50451ecff23dc21c0c31e359026f24601e4311ace68468314982a608df40", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-acm-annual-2025", "title": "盛美半导体设备（上海）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-02-27/688082_20260227_7FPP.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-02-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio statement does not prove a named-fab installation or qualified layer." ] }, { "source_id": "src-naura-annual-2025", "title": "北方华创科技集团股份有限公司2025年年度报告", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225122918.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio coverage does not prove a model's installation, qualified layer, uptime, yield, or recurring volume at a named fab." ] } ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-track" ], "id": "proc-track", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "lithography", "name": "Coat/develop track", "process_id": "proc-track", "record_type": "process", "source_ids": [ "src-kingsemi-annual-2025", "src-kingsemi-ks-ft200-300", "src-kingsemi-silan-jike-krf-2022", "src-naura-annual-2025", "src-red-avenue-annual-2025", "src-redavenue-subsidiaries-guarantee-2025" ], "verified_entity_ids": [ "ent-kingsemi", "ent-naura", "ent-tongcheng-electronic-materials-shanghai" ], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "171367027953bf3a26ddc4e1c268396cca3ec70e1e6a3df5dddce361464c5742", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "lithography" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "lithography" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kingsemi-annual-2025", "title": "沈阳芯源微电子设备股份有限公司2025年年度报告摘要", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688037_20260418_OATI.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The summary does not establish scanner pairing, installed base, site acceptance, or qualified production layer." ] }, { "source_id": "src-kingsemi-ks-ft200-300", "title": "KS-FT200/300 前道8/12寸涂胶显影机", "publisher": "沈阳芯源微电子设备股份有限公司", "url": "https://www.kingsemi.com/index.php/Product/detail?id=221", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue capability only; it must not be joined to the unnamed model delivered to Silan Jike." ] }, { "source_id": "src-kingsemi-silan-jike-krf-2022", "title": "同“芯”聚力，共创辉煌——沈阳芯源KrF涂胶显影机台入驻士兰集科暨双方达成战略合作关系", "publisher": "沈阳芯源微电子设备股份有限公司", "url": "https://www.kingsemi.com/index.php/News/detail?id=160", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2022-06-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No model, serial, purchase record, installation completion, site acceptance, named layer, throughput, uptime or yield is disclosed." ] }, { "source_id": "src-naura-annual-2025", "title": "北方华创科技集团股份有限公司2025年年度报告", "publisher": "巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225122918.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Portfolio coverage does not prove a model's installation, qualified layer, uptime, yield, or recurring volume at a named fab." ] }, { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] }, { "source_id": "src-redavenue-subsidiaries-guarantee-2025", "title": "彤程新材料集团股份有限公司关于年度预计融资担保进展的公告", "publisher": "彤程新材料集团股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2025-04/03/content_2044624.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Registered residences are legal-entity addresses and are not automatically the same as every manufacturing site." ] } ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-tsv" ], "id": "proc-tsv", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "advanced_packaging", "name": "TSV formation, dielectric, barrier, seed and fill", "process_id": "proc-tsv", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "a1a28b6af85e383bb6f035838f912dfc7c08aa6ef6a7d3c01054e93a9aa9f9aa", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "advanced_packaging" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "advanced_packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-vacuum-abatement-wastewater" ], "id": "proc-vacuum-abatement-wastewater", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "facilities", "name": "Vacuum, abatement, solvent recovery and wastewater", "process_id": "proc-vacuum-abatement-wastewater", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "c94b298bddf816d100e4f06fae90de3d5c740d191827a0f8328229bd96a05d0f", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-wafer-probe" ], "id": "proc-wafer-probe", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "test", "name": "Wafer probe and known-good-die selection", "process_id": "proc-wafer-probe", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "6b805506058704169a84d7cbb691464cd3062977ddd2147408946f6e032adb54", "stage_ids": [ "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "layer", "value": "test" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-wafer-thinning" ], "id": "proc-wafer-thinning", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "advanced_packaging", "name": "Wafer thinning and backgrind", "process_id": "proc-wafer-thinning", "record_type": "process", "source_ids": [], "verified_entity_ids": [], "canonical_dataset": "processes.yaml", "canonical_record_sha256": "c37de203accc73f2da4fc47d097a11264bd149275d3dc15c9fe0e99ea546aeb1", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "advanced_packaging" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "advanced_packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [] } ], "dependencies": [ { "category": "materials", "claim_ids": [ "clm-anji-imported-raw-material-exposure" ], "completion_state": "source_backed", "country_or_region": "multiple_or_unknown", "dependency_id": "dep-anji-imported-raw-materials", "dependency_name": "Unnamed imported raw materials with substantial U.S.-dollar settlement", "dependency_type": "confirmed_imported_raw_material_exposure", "dependent_id": "ent-anji", "evidence_state": "CONFIRMED_PRIMARY", "id": "dep-anji-imported-raw-materials", "last_checked": "2026-07-29", "proof_needed": [ "exact material and supplier", "country of origin", "spend/volume share", "inventory and criticality", "domestic substitute", "delivery, acceptance and qualification" ], "rank": 8, "record_type": "dependency", "source_ids": [ "src-anji-annual-2025" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "1257d80087d4cbeb8c238da0534d872bcbee9bb544e0162ecc7a9db9c59f9e86", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "materials" }, { "field": "dependency_type", "value": "confirmed_imported_raw_material_exposure" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "materials" }, { "field": "dependency_type", "value": "confirmed_imported_raw_material_exposure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-anji-annual-2025", "title": "安集微电子科技（上海）股份有限公司2025年年度报告", "publisher": "安集微电子科技（上海）股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-16/1225108553.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers, facilities and product models are anonymized.", "No formulation, grade, numerical yield delta, shipment quantity or exact imported-input BOM is disclosed.", "Generic TSV/hybrid-bonding materials capability does not establish HBM qualification." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "system_chip", "claim_ids": [ "clm-dd-lynk08-refresh-foreign-chip-bom" ], "completion_state": "source_backed", "country_or_region": "United States", "dependency_id": "dep-dd-lynk08-nvidia-thor", "dependency_name": "NVIDIA Thor", "dependency_type": "confirmed_foreign_chip", "dependent_id": "prod-dd-lynk08-2025-refresh", "evidence_state": "CONFIRMED_PRIMARY", "id": "dep-dd-lynk08-nvidia-thor", "last_checked": "2026-07-29", "proof_needed": [ "exact Thor SKU/package", "procurement route", "vehicle units", "domestic substitute and qualification" ], "rank": 5, "record_type": "dependency", "source_ids": [ "src-dd-auto-005" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "28ff6ae88770327b0859012fe563eab0940b71289f3e4a72510c43ab9ac010cd", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "system_chip" }, { "field": "dependency_type", "value": "confirmed_foreign_chip" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-005", "title": "全新有为 进阶无界，全新领克08 EM-P 15.98万元起正式上市", "publisher": "领克汽车销售有限公司", "url": "https://www.lynkco.com.cn/brand/news/newslist/2025news/0924", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2025-09-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Near-150,000 family users span generations and cannot be assigned to the earlier SE1000 configuration." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "system_chip", "claim_ids": [ "clm-dd-lynk08-refresh-foreign-chip-bom" ], "completion_state": "source_backed", "country_or_region": "United States", "dependency_id": "dep-dd-lynk08-qualcomm-8295", "dependency_name": "Qualcomm Snapdragon 8295", "dependency_type": "confirmed_foreign_chip", "dependent_id": "prod-dd-lynk08-2025-refresh", "evidence_state": "CONFIRMED_PRIMARY", "id": "dep-dd-lynk08-qualcomm-8295", "last_checked": "2026-07-29", "proof_needed": [ "exact package/SKU", "procurement route", "vehicle units", "domestic substitute and qualification" ], "rank": 5, "record_type": "dependency", "source_ids": [ "src-dd-auto-005" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "8d74231173d1434ee9489e56e73012bbabe0ca0bbbf9ea5d69ca011a4f2ef0b0", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "system_chip" }, { "field": "dependency_type", "value": "confirmed_foreign_chip" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-005", "title": "全新有为 进阶无界，全新领克08 EM-P 15.98万元起正式上市", "publisher": "领克汽车销售有限公司", "url": "https://www.lynkco.com.cn/brand/news/newslist/2025news/0924", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2025-09-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Near-150,000 family users span generations and cannot be assigned to the earlier SE1000 configuration." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [ "clm-dd-poco-c71-retail-and-software-dependencies" ], "completion_state": "source_backed", "country_or_region": "United States", "dependency_id": "dep-dd-poco-c71-google-android-services", "dependency_name": "Android Go, Google services and Google Assistant", "dependency_type": "confirmed_foreign_software_service", "dependent_id": "prod-dd-poco-c71", "evidence_state": "CONFIRMED_PRIMARY", "id": "dep-dd-poco-c71-google-android-services", "last_checked": "2026-07-29", "proof_needed": [ "software versions/license", "update/service route", "offline behavior", "domestic substitute and acceptance" ], "rank": 6, "record_type": "dependency", "source_ids": [ "src-dd-mobile-003", "src-dd-mobile-004" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "d2b3a60bb7f02b4fe4d3b538d885ae77957463b4cbc3ef2fa97c5edebf4b6d18", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "confirmed_foreign_software_service" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "confirmed_foreign_software_service" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-mobile-003", "title": "POCO C71 FAQ", "publisher": "Xiaomi Global Support", "url": "https://www.mi.com/global/support/faq/details/KA-559836/", "source_type": "official_customer_support_bom_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier strings are brands/abbreviations; legal entities, lot shares and direct purchasing are unresolved." ] }, { "source_id": "src-dd-mobile-004", "title": "Xiaomi 12.12 Mega Sale 2025", "publisher": "Xiaomi Singapore", "url": "https://www.mi.com/sg/support/terms/xiaomi-12-12-mega-sale-2025/", "source_type": "official_retail_terms", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Commercial offer and shipping availability do not prove completed sales or volume." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [ "clm-dd-poco-c71-unisoc-t7250-bom" ], "completion_state": "source_backed", "country_or_region": "United Kingdom", "dependency_id": "dep-dd-unisoc-t7250-arm-ip", "dependency_name": "Arm Cortex-A75/A55 CPU and Mali-G57 GPU IP", "dependency_type": "confirmed_foreign_ip", "dependent_id": "prod-dd-unisoc-t7250", "evidence_state": "CONFIRMED_PRIMARY", "id": "dep-dd-unisoc-t7250-arm-ip", "last_checked": "2026-07-29", "proof_needed": [ "license scope/version", "royalty/service route", "domestic substitute and production qualification" ], "rank": 5, "record_type": "dependency", "source_ids": [ "src-dd-mobile-002", "src-dd-mobile-005", "src-dd-mobile-006" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "9e4a31c6e726dd866c989d8c2bc90d3f0c6c4cf0c86df88817b726da21b095b7", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "confirmed_foreign_ip" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-mobile-002", "title": "POCO C71 Specs", "publisher": "Xiaomi Global", "url": "https://www.mi.com/global/product/poco-c71/specs/", "source_type": "official_customer_specification_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Memory type is stated but memory and eMMC suppliers are not." ] }, { "source_id": "src-dd-mobile-005", "title": "T7250", "publisher": "紫光展锐", "url": "https://www.unisoc.com/cn/product/SmartPhone/T7250", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, Xiaomi-specific certification or volume." ] }, { "source_id": "src-dd-mobile-006", "title": "T7250", "publisher": "UNISOC", "url": "https://www.unisoc.com/en/product/SmartPhone/T7250", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, Xiaomi-specific certification or volume." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-eda-arm-isa-ip", "dependency_name": "Arm ISA/core licenses and related IP", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-isa-rtl", "evidence_state": "UNRESOLVED", "id": "dep-gap-eda-arm-isa-ip", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 6, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "6a21cb3ba6fd4954141f42ef90cdf3271750f596d082e624092813fcdfb0b9f4", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-eda-digital-full-flow", "dependency_name": "Full digital synthesis/place-route/signoff flow", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-physical-design-signoff", "evidence_state": "UNRESOLVED", "id": "dep-gap-eda-digital-full-flow", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 1, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "a43af02cb17e9a331cb076e8344cb2fde0007bfd52d1919340fa7aca686cf8b5", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-eda-foreign-service-updates", "dependency_name": "Foreign EDA field service, license servers and tool updates", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-compiler-runtime-firmware", "evidence_state": "UNRESOLVED", "id": "dep-gap-eda-foreign-service-updates", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 10, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "d6dc905c6e82d74248cf7693254e569049cd2e99bafcc8e9162383fcc1903028", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-eda-formal-emulation", "dependency_name": "Formal verification and hardware emulation", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-design-verification", "evidence_state": "UNRESOLVED", "id": "dep-gap-eda-formal-emulation", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 2, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "4a5483f2a44aa4837e5ea1d92c8b2185497818f5bb0025f38be8f3c1ccb59c41", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-eda-hbm-phy-verification", "dependency_name": "HBM PHY/controller and verification IP", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-pdk-libraries-ip", "evidence_state": "UNRESOLVED", "id": "dep-gap-eda-hbm-phy-verification", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 7, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "62cbd89245a6e94ee94bdd88cfeddb278b5100bada67010c8b30a72ea9f96a6e", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-eda-mask-data-prep", "dependency_name": "Mask data preparation and verification", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-mask-reticle", "evidence_state": "UNRESOLVED", "id": "dep-gap-eda-mask-data-prep", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 5, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "35e531b4cebc648a98a289814b79ab1a271793f17e8f346f37f2b800e08e8c04", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-eda-opc-smo", "dependency_name": "Production OPC, SMO and computational lithography", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-computational-lithography", "evidence_state": "UNRESOLVED", "id": "dep-gap-eda-opc-smo", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 4, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "532021ea7902f509c17c3ff017ebdf7685fcc812ad9c37f10c69b0448e573143", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-eda-pcie-cxl-serdes", "dependency_name": "PCIe/CXL/Ethernet SerDes IP and compliance", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-pdk-libraries-ip", "evidence_state": "UNRESOLVED", "id": "dep-gap-eda-pcie-cxl-serdes", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 8, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "078757f658b0d64a103c51552978944533165e2a43be16b140ccc9c7a480c36a", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-eda-pdk-library-qualification", "dependency_name": "Foundry PDK, standard-cell and memory-compiler qualification", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-pdk-libraries-ip", "evidence_state": "UNRESOLVED", "id": "dep-gap-eda-pdk-library-qualification", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 9, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "7b4fb4f322c37fca445f5b67b2d831fb7b441550595ce9cf5a144af0d0a459ef", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-eda-timing-power-signoff", "dependency_name": "Timing, power-integrity and reliability signoff", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-physical-design-signoff", "evidence_state": "UNRESOLVED", "id": "dep-gap-eda-timing-power-signoff", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 3, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "b77fd5da6c2c3e01a3b024c6ffde14eb8745043aaadd8884b5f6d692077c294a", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-advanced-arf-track", "dependency_name": "Immersion-ArF coat/develop track qualified with scanner", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-track", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-advanced-arf-track", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 9, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "f131334615ff56e001182489e7cb52a82c6b6003a5839cf9e9093cc48c8a9399", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-advanced-optical-inspection", "dependency_name": "Advanced optical patterned-wafer inspection", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-inspection-defect-review", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-advanced-optical-inspection", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 3, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "ea8b0e9cfd442b97e956d2d3266e5845d549df7ef42fda1f203f06e7274e09c9", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-advanced-probe-ate", "dependency_name": "Advanced probe, ATE and high-speed memory test", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-wafer-probe", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-advanced-probe-ate", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 19, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "0b36e8a98d9899541125ac04fcb14c9c796076ea98039c34ade9e7f37e85fffd", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-arf-excimer-light-source", "dependency_name": "High-output ArF excimer light source", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-lithography-immersion-arf", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-arf-excimer-light-source", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 10, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "fb143887252e7e53145edad48a197362fb4bf701a889a8054373e72cdcd68753", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-cd-overlay-metrology", "dependency_name": "Advanced CD/overlay/focus metrology", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-metrology", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-cd-overlay-metrology", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 5, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "c31484e0cbb08a140c4dd56e2ae61db7aa5e00e5f3e3e3ff119a272b91410d5a", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-dry-vacuum-pumps", "dependency_name": "Dry vacuum pumps and spares", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-vacuum-abatement-wastewater", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-dry-vacuum-pumps", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 14, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "f16dc8be52f772cbab0d6620dbd149328d094a5e078126ad66ae0834cb3c404d", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-ebeam-inspection-review", "dependency_name": "High-throughput e-beam inspection and defect review", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-inspection-defect-review", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-ebeam-inspection-review", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 4, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "b54424bc5dc88d3f8ff2051afe09fdb577380c2364479bdea8b1bd46a50d2e33", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-electrostatic-chucks", "dependency_name": "Electrostatic chucks and advanced ceramics", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-etch", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-electrostatic-chucks", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 17, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "2846cd4b9e274f19411fa06539fac30c9356d1546ca83dbe0466af1fa7be3603", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-euv-scanner", "dependency_name": "Commercial EUV scanner and ecosystem", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-lithography-euv", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-euv-scanner", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 2, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "5c716c503de9d62820c930696642b738f5b6b662ac1501006c609fca3941723c", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-field-service-spares-controls", "dependency_name": "Foreign field service, spares and proprietary control software", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-logic-foundry", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-field-service-spares-controls", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 20, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "0a7439a3c8ac905f697e0691ed9cd68aa29c1c4ea23553a9807d4fefaa71d820", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-high-energy-implant", "dependency_name": "High-energy/high-current ion implantation", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-implant", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-high-energy-implant", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 8, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "317c5b1c3528374c77d8902cd4363f54762f8855b77a2188fdc705350587641c", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-high-purity-valves", "dependency_name": "High-purity valves and seals", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-gases-chemicals-delivery", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-high-purity-valves", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 15, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "2a50738907998d80787075ddd4f8191a58970c0945194b91166a5e004da79b72", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-immersion-arf-scanner", "dependency_name": "Immersion ArF scanner with P4-P6 receipts", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-lithography-immersion-arf", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-immersion-arf-scanner", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 1, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "60e27efa365217f8682cd3126be5bfecab801566a137eb320e210203b82b25e4", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-mask-inspection", "dependency_name": "Advanced mask inspection", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-mask-reticle", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-mask-inspection", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 6, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "38484fb6495b375abeeccd45f51a21b7f27dbcad2f36eb8bca76186c2fc6b13d", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-mask-repair", "dependency_name": "Advanced mask repair", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-mask-reticle", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-mask-repair", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 7, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "da4f309720a33ccd4ba45d98a583765f6acc61fb1e858ee08e8e38121adb78e6", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-mass-flow-controller", "dependency_name": "Semiconductor-grade mass-flow controllers", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-gases-chemicals-delivery", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-mass-flow-controller", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 13, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "ecd57616864fcd45ceeecc6fbc0018ca94ff94669565dee861b5a876db6e1594", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-projection-optics", "dependency_name": "Immersion projection optics", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-lithography-immersion-arf", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-projection-optics", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 11, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "872abe536a82fe1a8809c376e2f1dd2993e5b7d5c5fe2ab8839d496e059382a3", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-rf-power-match", "dependency_name": "RF generators and matching networks with fab validation", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-etch", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-rf-power-match", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 16, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "34c8e57519b5c2fcd75ca5835b2be124da1b901be9717fa7394945fa5a4c30e6", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-stage-encoder-interferometer", "dependency_name": "Precision stage, encoder and interferometer chain", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-lithography-immersion-arf", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-stage-encoder-interferometer", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 12, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "6804a974b50ba903babf2b64a70dba1d0bc059aeeedb43251e1d0423502a2171", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-equipment-wafer-robots", "dependency_name": "Vacuum/atmospheric wafer robots and controls", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-wafer-probe", "evidence_state": "UNRESOLVED", "id": "dep-gap-equipment-wafer-robots", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 18, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "8b5753410c7833960c223c8e5483345744eadd1e78567c5319de27df60cf2aab", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-abf-film", "dependency_name": "ABF build-up film qualified for high-density substrates", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-organic-substrate", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-abf-film", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 1, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "a0388679982f00f8753a4bc1f2e161a0c0713ef1ba56505d487a8ac3efc7fc07", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-advanced-300mm-prime", "dependency_name": "Advanced-node 300 mm prime silicon wafers", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-silicon-wafers", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-advanced-300mm-prime", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 7, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "5fe00d044d5b1fbdf1968113f19e3571498c3d34428a30ac0b22908e4a037399", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-advanced-cmp-slurry", "dependency_name": "Advanced-node low-defectivity CMP slurry", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-cmp", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-advanced-cmp-slurry", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 11, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "f4f51aff902b85a9d1db49f188a144ed56adc71401d193f0a4b260080f125d77", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-advanced-etch-gases", "dependency_name": "Advanced fluorinated etch gases", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-etch", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-advanced-etch-gases", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 15, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "2034d398e6243f9209c7607d62a7825b82f2b7e8954743267564fa540c511c5a", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-advanced-mask-blanks", "dependency_name": "Advanced low-defect mask blanks", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-mask-reticle", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-advanced-mask-blanks", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 2, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "bd1bab18155ce5685a377f3c1028a67b4cccbd55b0bc1bd4c25b630b042a826f", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-advanced-metal-precursors", "dependency_name": "Co/Ru/Mo advanced metal precursors", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-deposition-cvd-ald", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-advanced-metal-precursors", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 13, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "9e179ff0a1cf90d893ffe76a63ab5724163caac628cd5182c721444dfd43d468", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-arf-photoresist", "dependency_name": "Immersion-ArF photoresist", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-lithography-immersion-arf", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-arf-photoresist", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 3, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "199107f8974132772ddd9e7c8d82ffc683c3f22f577769ce955e2e80b6b9f0aa", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-cmp-pads", "dependency_name": "Advanced CMP pads and conditioners", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-cmp", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-cmp-pads", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 10, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "3bb23afa54b3d2693efe0f45ce47e00c5166b9c451fe7d10ea0d112d514c25e8", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-developer-solvents", "dependency_name": "Advanced developer, solvent and rinse grades", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-track", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-developer-solvents", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 17, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "77fd323c54c6b2f88888d2be93316ca1bde6afb59ecbdc480c517b6bdebe42aa", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-emc-silica-fillers", "dependency_name": "Low-warpage EMC and high-purity spherical silica fillers", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-osat-assembly", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-emc-silica-fillers", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 19, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "2c92887f453f9edec02f70b21c0f061d54a4a1889957e1318cde2d344c5e8d50", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-high-end-epi-wafer", "dependency_name": "Heavily doped epitaxial and low-oxygen high-resistivity wafers", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-silicon-wafers", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-high-end-epi-wafer", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 9, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "4c582b6ee5288f3d595e5d0e388d8b2811f49dcb4ed3588cf4ebe0e5f6a2b413", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-high-k-precursors", "dependency_name": "High-k Hf/Zr precursors", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-deposition-cvd-ald", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-high-k-precursors", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 12, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "e83ec8861870d439b5b2ab1e6e3fea713a4eee8e9d4f5c2eb72ab69a12edf236", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-high-performance-tim", "dependency_name": "High-performance thermal interface materials", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-power-cooling", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-high-performance-tim", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 20, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "15ee3369a7b35803903a884c3614ff7f5a96a7162e4dc50c912cb3fcce85001f", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-low-k-precursors", "dependency_name": "Low-k and ultra-low-k precursors", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-deposition-cvd-ald", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-low-k-precursors", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 14, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "5df3bf510650121c6495154f306850ed2f51830bc487afff73a22c01a6544fe9", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-ncf-underfill", "dependency_name": "NCF and capillary underfill", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-stack-assembly-repair", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-ncf-underfill", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 18, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "942ad50c5792eed3ebdf6b453015d954a3675bdf67cc81f22cbd1bc5c040a189", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-pag", "dependency_name": "Photoacid generators", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-lithography-immersion-arf", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-pag", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 4, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "dd3f3e7ed074d1aef6da06ea95598760c6df91f42d0fc34ca715b8d97c75088d", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-rare-laser-gases", "dependency_name": "Neon, krypton and xenon upstream supply", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-lithography-immersion-arf", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-rare-laser-gases", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 16, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "46c1698f4ea279988bfa6f78978ca09bb9176be87db1b871518b064dae1baba7", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-resist-resin", "dependency_name": "Advanced resist resins", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-lithography-immersion-arf", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-resist-resin", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 5, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "2d08f80020a75d4d2e80456e74f76ae53ea713846558bfe85221d5e54de00318", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-soi", "dependency_name": "SOI wafers", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-silicon-wafers", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-soi", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 8, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "9c48dc21c26072818310da6f2c9318b650f589b8a7a46214ea507562925e9f85", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-topcoat-rinse", "dependency_name": "Immersion topcoat and rinse chemistry", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-lithography-immersion-arf", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-topcoat-rinse", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 6, "record_type": "dependency", "source_ids": [], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "872d87a031c515af66c10a3b561f447488bd56843f86c896cb922d3177c7b180", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material_precursor" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material_precursor" }, { "field": "dependency_type", "value": "unresolved_dependency_candidate" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [], "completion_state": "relationship_backed", "country_or_region": "Germany", "dependency_id": "dep-guowang-hermle-five-axis-machining", "dependency_name": "Two Hermle five-axis vertical machining centres; exact production task undisclosed", "dependency_type": "confirmed_foreign_equipment_procurement", "dependent_id": "fac-guowang-exposure-optics-base", "evidence_state": "CONFIRMED_PRIMARY", "id": "dep-guowang-hermle-five-axis-machining", "last_checked": "2026-07-29", "proof_needed": [ "delivery and acceptance", "exact optical part/process insertion", "service/spares route", "qualified domestic substitute" ], "rank": 1, "record_type": "dependency", "source_ids": [ "src-guowang-hermle-award-2022" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "ba77e3871c6d826be36bff400464b177c73f7e37b30c22f7846571b9dcf01d12", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "dependency_type", "value": "confirmed_foreign_equipment_procurement" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "confirmed_foreign_equipment_procurement" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-guowang-hermle-award-2022", "title": "北京国望光学科技有限公司五轴立式加工中心项目评标结果公告", "publisher": "商务部机电产品招标投标电子交易平台", "url": "https://chinabidding.mofcom.gov.cn/bidDetail/bidding/bulletin/202206/ff8080817d94c145018145fd60755ec2.html", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2022-06-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Award does not prove delivery, installation, acceptance, current use, the exact optical part processed, service route or spares." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "materials", "claim_ids": [], "completion_state": "source_backed", "country_or_region": "origin_unknown", "dependency_id": "dep-jinhong-n2o-feedstock", "dependency_name": "industrial-grade nitrous oxide feedstock", "dependency_type": "confirmed_upstream_feedstock", "dependent_id": "mat-jinhong-high-purity-n2o", "evidence_state": "CONFIRMED_PRIMARY", "id": "dep-jinhong-n2o-feedstock", "last_checked": "2026-07-29", "proof_needed": [ "feedstock supplier", "country", "purity", "volume share", "inventory", "second source" ], "rank": 13, "record_type": "dependency", "source_ids": [ "src-jinhong-annual-2025" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "52aaa31c192ec6801d4a17ad8a31e137ae1634684ea71c0657bb1f94cd80b631", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "materials" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "materials" }, { "field": "dependency_type", "value": "confirmed_upstream_feedstock" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jinhong-annual-2025", "title": "金宏气体股份有限公司2025年年度报告", "publisher": "金宏气体股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-03-28/1225047235.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Capacity is consolidated/group aggregate and cannot be assigned to a facility or subsidiary.", "Named customer portfolios are not molecule-specific edges.", "Except for 7N ammonia program wording, customer CoA purity/particle/moisture/metal limits are absent.", "Do not derive actual output by multiplying capacity and utilization without a separately labeled model." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "materials", "claim_ids": [], "completion_state": "source_backed", "country_or_region": "origin_unknown", "dependency_id": "dep-jinhong-nh3-feedstock", "dependency_name": "industrial-grade ammonia feedstock", "dependency_type": "confirmed_upstream_feedstock", "dependent_id": "mat-jinhong-ultrapure-ammonia-7n", "evidence_state": "CONFIRMED_PRIMARY", "id": "dep-jinhong-nh3-feedstock", "last_checked": "2026-07-29", "proof_needed": [ "feedstock supplier", "country", "purity", "volume share", "inventory", "second source" ], "rank": 12, "record_type": "dependency", "source_ids": [ "src-jinhong-annual-2025" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "486f4df4ea850f519d87b15620014192297442887a2393a6f9bb9f39cc634f99", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "materials" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "materials" }, { "field": "dependency_type", "value": "confirmed_upstream_feedstock" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jinhong-annual-2025", "title": "金宏气体股份有限公司2025年年度报告", "publisher": "金宏气体股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-03-28/1225047235.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Capacity is consolidated/group aggregate and cannot be assigned to a facility or subsidiary.", "Named customer portfolios are not molecule-specific edges.", "Except for 7N ammonia program wording, customer CoA purity/particle/moisture/metal limits are absent.", "Do not derive actual output by multiplying capacity and utilization without a separately labeled model." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [ "clm-metax-identity-products-and-production-dates" ], "completion_state": "source_backed", "country_or_region": "overseas supplier undisclosed", "dependency_id": "dep-metax-overseas-eda-category", "dependency_name": "Overseas EDA tool category", "dependency_type": "confirmed_foreign_software_category", "dependent_id": "ent-metax", "evidence_state": "CONFIRMED_PRIMARY", "id": "dep-metax-overseas-eda-category", "last_checked": "2026-07-29", "proof_needed": [ "vendor/tool/version", "design stage", "license/service route", "product allocation", "domestic replacement qualification" ], "rank": 3, "record_type": "dependency", "source_ids": [ "src-metax-annual-2025" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "a2f1e31bbd6aec6de11ad45c65954d3b5ce032f18786aa2104912e7810a62ba9", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "confirmed_foreign_software_category" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "confirmed_foreign_software_category" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-metax-annual-2025", "title": "沐曦集成电路（上海）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-27/688802_20260327_0HOB.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Fabless contractors are unnamed; 2025 board-sales totals are family-category totals, not model-specific.", "Overseas HBM, EDA and interface-IP suppliers are not named." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "material", "claim_ids": [ "clm-metax-identity-products-and-production-dates" ], "completion_state": "source_backed", "country_or_region": "overseas supplier undisclosed", "dependency_id": "dep-metax-overseas-hbm-category", "dependency_name": "Overseas HBM supply category", "dependency_type": "confirmed_foreign_supply_category", "dependent_id": "ent-metax", "evidence_state": "CONFIRMED_PRIMARY", "id": "dep-metax-overseas-hbm-category", "last_checked": "2026-07-29", "proof_needed": [ "exact HBM generation/SKU", "supplier", "product allocation", "package flow", "qualification", "second source" ], "rank": 3, "record_type": "dependency", "source_ids": [ "src-metax-annual-2025" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "7fd1bfa1c69807e4ea47dcc44c8851b2b41d56fd03d372b3c78d25efc77af9a6", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "category", "value": "material" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "material" }, { "field": "dependency_type", "value": "confirmed_foreign_supply_category" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-metax-annual-2025", "title": "沐曦集成电路（上海）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-27/688802_20260327_0HOB.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Fabless contractors are unnamed; 2025 board-sales totals are family-category totals, not model-specific.", "Overseas HBM, EDA and interface-IP suppliers are not named." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [ "clm-metax-identity-products-and-production-dates" ], "completion_state": "source_backed", "country_or_region": "overseas supplier undisclosed", "dependency_id": "dep-metax-overseas-interface-ip-category", "dependency_name": "Overseas high-speed interface IP category", "dependency_type": "confirmed_foreign_ip_category", "dependent_id": "ent-metax", "evidence_state": "CONFIRMED_PRIMARY", "id": "dep-metax-overseas-interface-ip-category", "last_checked": "2026-07-29", "proof_needed": [ "IP block/vendor/version", "product allocation", "foundry/node", "license/service route", "domestic replacement qualification" ], "rank": 4, "record_type": "dependency", "source_ids": [ "src-metax-annual-2025" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "ee607d0cf8a5ac8aca2352be6dfbb6ebb76086567c5833402ab3b0709e4ac481", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "confirmed_foreign_ip_category" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-metax-annual-2025", "title": "沐曦集成电路（上海）股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-27/688802_20260327_0HOB.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Fabless contractors are unnamed; 2025 board-sales totals are family-category totals, not model-specific.", "Overseas HBM, EDA and interface-IP suppliers are not named." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [ "clm-samsung-xian-tool-license-2026" ], "completion_state": "source_backed", "country_or_region": "United States", "dependency_id": "dep-samsung-xian-controlled-tool-exports", "dependency_name": "U.S.-controlled chipmaking tools and service route", "dependency_type": "confirmed_export_license_exposure", "dependent_id": "fac-samsung-xian-nand", "evidence_state": "CONFIRMED_INDEPENDENT", "id": "dep-samsung-xian-controlled-tool-exports", "last_checked": "2026-07-29", "proof_needed": [ "official license", "covered tool/component list", "license term", "qualified substitutes" ], "rank": 1, "record_type": "dependency", "source_ids": [ "src-reuters-samsung-skhynix-tool-license-2025" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "3abbe1f5b87de50956bd6010bb74bb11fbfc2f562af1d522f0a702491523c6e4", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "confirmed_export_license_exposure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-reuters-samsung-skhynix-tool-license-2025", "title": "US approves Samsung, SK Hynix chipmaking tool shipments to China for 2026, sources say", "publisher": "Reuters", "url": "https://www.reuters.com/world/china/samsung-wins-us-annual-approval-chipmaking-tool-shipments-china-source-says-2025-12-30/", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2025-12-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Anonymous-source reporting; no official license text, covered model/component list, quantities, service scope, expiry conditions or facility-by-facility schedule is public in the source." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [ "clm-skhynix-dalian-tool-license-2026" ], "completion_state": "source_backed", "country_or_region": "United States", "dependency_id": "dep-skhynix-dalian-controlled-tool-exports", "dependency_name": "U.S.-controlled chipmaking tools and service route", "dependency_type": "confirmed_export_license_exposure", "dependent_id": "fac-skhynix-dalian-nand", "evidence_state": "CONFIRMED_INDEPENDENT", "id": "dep-skhynix-dalian-controlled-tool-exports", "last_checked": "2026-07-29", "proof_needed": [ "official license", "covered tool/component list", "license term", "qualified substitutes" ], "rank": 1, "record_type": "dependency", "source_ids": [ "src-reuters-samsung-skhynix-tool-license-2025" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "efb369ac602cd314074916a1a78050babc399e89834e3303bebd44ceb50148bb", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "confirmed_export_license_exposure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-reuters-samsung-skhynix-tool-license-2025", "title": "US approves Samsung, SK Hynix chipmaking tool shipments to China for 2026, sources say", "publisher": "Reuters", "url": "https://www.reuters.com/world/china/samsung-wins-us-annual-approval-chipmaking-tool-shipments-china-source-says-2025-12-30/", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2025-12-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Anonymous-source reporting; no official license text, covered model/component list, quantities, service scope, expiry conditions or facility-by-facility schedule is public in the source." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [ "clm-skhynix-wuxi-tool-license-2026" ], "completion_state": "source_backed", "country_or_region": "United States", "dependency_id": "dep-skhynix-wuxi-controlled-tool-exports", "dependency_name": "U.S.-controlled chipmaking tools and service route", "dependency_type": "confirmed_export_license_exposure", "dependent_id": "ent-skhynix-wuxi-operator-unresolved", "evidence_state": "CONFIRMED_INDEPENDENT", "id": "dep-skhynix-wuxi-controlled-tool-exports", "last_checked": "2026-07-29", "proof_needed": [ "official license", "covered tool/component list", "license term", "qualified substitutes" ], "rank": 1, "record_type": "dependency", "source_ids": [ "src-reuters-samsung-skhynix-tool-license-2025" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "afb680a574f92ea174811a821353bd9aa39b27335936d1b608202549a68053db", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "confirmed_export_license_exposure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-reuters-samsung-skhynix-tool-license-2025", "title": "US approves Samsung, SK Hynix chipmaking tool shipments to China for 2026, sources say", "publisher": "Reuters", "url": "https://www.reuters.com/world/china/samsung-wins-us-annual-approval-chipmaking-tool-shipments-china-source-says-2025-12-30/", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2025-12-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Anonymous-source reporting; no official license text, covered model/component list, quantities, service scope, expiry conditions or facility-by-facility schedule is public in the source." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "equipment", "claim_ids": [ "clm-tsmc-china-tool-license-exposure" ], "completion_state": "source_backed", "country_or_region": "United States", "dependency_id": "dep-tsmc-nanjing-controlled-tool-exports", "dependency_name": "U.S.-controlled chipmaking tools and service route", "dependency_type": "confirmed_export_license_exposure", "dependent_id": "fac-tsmc-nanjing-fab16", "evidence_state": "CONFIRMED_INDEPENDENT", "id": "dep-tsmc-nanjing-controlled-tool-exports", "last_checked": "2026-07-29", "proof_needed": [ "official license", "covered tool/component list", "license term", "domestic substitute and qualification" ], "rank": 1, "record_type": "dependency", "source_ids": [ "src-reuters-tsmc-tool-license-2025" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "658acdc11145e7ff371803f5df279d6069685ceb387d598db98546a27960d51f", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "category", "value": "equipment" }, { "field": "dependency_type", "value": "confirmed_export_license_exposure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "secondary_only", "source_refs": [ { "source_id": "src-reuters-tsmc-tool-license-2025", "title": "US grants annual approval for TSMC chipmaking tool exports to China", "publisher": "Reuters", "url": "https://www.reuters.com/world/asia-pacific/us-grants-annual-approval-tsmc-chipmaking-tool-exports-china-2025-12-31/", "source_type": "news_report", "primary_status": "secondary", "publication_date": "2025-12-31", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "License reporting does not enumerate the complete tool/component/service BOM." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." }, { "category": "eda_software_ip_service", "claim_ids": [], "completion_state": "relationship_backed", "country_or_region": "United States", "dependency_id": "dep-verisilicon-globalfoundries-22fdx", "dependency_name": "GlobalFoundries 22FDX 22 nm FD-SOI process/PDK", "dependency_type": "confirmed_foreign_foundry_and_pdk", "dependent_id": "prod-verisilicon-fdsoi-wireless-ip", "evidence_state": "CONFIRMED_PRIMARY", "id": "dep-verisilicon-globalfoundries-22fdx", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 1, "record_type": "dependency", "source_ids": [ "src-verisilicon-gf-22fdx-2025" ], "substitute_id": null, "canonical_dataset": "dependencies.yaml", "canonical_record_sha256": "93419bd641043519bcd11d5ecd808b1b4cdce5535935c3a210f59eb244190fda", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "confirmed_foreign_foundry_and_pdk" } ] } ], "canonical_classification_inputs": [ { "field": "category", "value": "eda_software_ip_service" }, { "field": "dependency_type", "value": "confirmed_foreign_foundry_and_pdk" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-verisilicon-gf-22fdx-2025", "title": "VeriSilicon Introduces FD-SOI Wireless IP Platform", "publisher": "VeriSilicon Microelectronics (Shanghai) Co., Ltd.", "url": "https://www.verisilicon.com/en/PressRelease/WirelessIP", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2025-09-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers and chips are anonymous; facility and shipment split are undisclosed." ] } ], "dependency_boundary": "A recorded dependency does not name an undisclosed supplier, prove the absence of alternatives, or prove a substitute has been qualified." } ], "relationships": [ { "claim_ids": [ "clm-relationship-51world-supports-mt-s5000-simone4" ], "commercial_state": "system_adaptation_and_optimization", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_INDEPENDENT", "facility_id": null, "from_entity_id": "ent-51world", "id": "rel-51world-supports-mt-s5000-simone4", "last_checked": "2026-07-29", "process_step": "SimOne 4.0 autonomous-driving simulation", "product_id": "prod-moore-threads-s5000", "qualification_state": "customer_validated", "quantity": null, "record_type": "relationship", "relationship_id": "rel-51world-supports-mt-s5000-simone4", "relationship_type": "supports", "source_ids": [ "src-ncsti-s5000-simone-20260226" ], "start_date": "2026-02-26", "to_entity_id": "ent-moore-threads", "unit": null, "unknowns": [ "contract", "quantity", "installation site", "production use", "workload metrics", "uptime", "commercial volume" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "d2240bdc286316eaf911dcc48510959b447ec3c2b379b7013bf768627d4f877b", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "process_step", "value": "SimOne 4.0 autonomous-driving simulation" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "SimOne 4.0 autonomous-driving simulation" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ncsti-s5000-simone-20260226", "title": "国产GPU与自动驾驶仿真平台完成系统适配", "publisher": "中关村国家自主创新示范区展示中心", "url": "https://www.ncsti.gov.cn/kjdt/scyq/zgckxc/zgcdt/202602/t20260226_239035.html", "source_type": "government_innovation_record", "primary_status": "primary", "publication_date": "2026-02-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Compatibility/validation receipt only; purchase, quantity, installation site and production use are undisclosed." ] } ], "relationship_semantics": { "class": "compatibility_or_support_not_supplier", "boundary": "Support or compatibility is not a supplier, procurement, manufacturing, ownership, or deployment relationship." }, "from_entity_reference": { "entity_id": "ent-51world", "record_level": "company", "canonical_legal_name_en": "Beijing 51WORLD Digital Twin Technology Co., Ltd.", "canonical_legal_name_cn": "北京五一视界数字孪生科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-moore-threads", "record_level": "company", "canonical_legal_name_en": "Moore Threads Technology Co., Ltd.", "canonical_legal_name_cn": "摩尔线程智能科技（北京）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-51world-supports-mt-s5000-simone4", "predicate": "supports", "scope": "edge from ent-51world to ent-moore-threads; commercial state system_adaptation_and_optimization; qualification state customer_validated", "evidence_state": "CONFIRMED_INDEPENDENT", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "contract", "quantity", "installation site", "production use", "workload metrics", "uptime", "commercial volume" ], "source_ids": [ "src-ncsti-s5000-simone-20260226" ] } ] }, { "claim_ids": [ "clm-relationship-alibaba-ecs-c8y-integrates-yitian710" ], "commercial_state": "commercial_cloud_catalogue_region_dependent", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "id": "rel-alibaba-ecs-c8y-integrates-yitian710", "last_checked": "2026-07-29", "process_step": "ECS c8y instance family", "product_id": "prod-yitian-710", "qualification_state": "service_catalogue", "quantity": null, "record_type": "relationship", "relationship_id": "rel-alibaba-ecs-c8y-integrates-yitian710", "relationship_type": "integrates", "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ], "start_date": null, "to_entity_id": "ent-alibaba-yitian-endpoint-unresolved", "unit": null, "unknowns": [ "region-specific legal operator", "actual availability", "facility", "installed CPU count", "server BOM", "utilization", "uptime", "tenant" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "3e7e5ff8ac0733ae4fc2d9b88231cf6feb12467809a0816f0b1ed611b19319ad", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "ECS c8y instance family" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-alibaba-ecs-yitian-instance-families-20260625", "title": "Elastic Compute Service: Available instance families", "publisher": "Alibaba Cloud Documentation Center", "url": "https://www.alibabacloud.com/help/en/ecs/user-guide/overview-of-instance-families", "source_type": "official_cloud_product_documentation", "primary_status": "primary", "publication_date": "2026-06-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves a current commercial catalogue configuration, not region-specific operator, physical facility, installed count or utilization.", "Server manufacturer, board BOM, foundry, package/OSAT, capacity, tenant, uptime and workload receipts are undisclosed." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "record_level": "service_brand_or_unresolved_operator", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "to_entity_reference": { "entity_id": "ent-alibaba-yitian-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-alibaba-ecs-c8y-integrates-yitian710", "predicate": "integrates", "scope": "edge from ent-alibaba-cloud-ecs-brand-unresolved to ent-alibaba-yitian-endpoint-unresolved; commercial state commercial_cloud_catalogue_region_dependent; qualification state service_catalogue", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "region-specific legal operator", "actual availability", "facility", "installed CPU count", "server BOM", "utilization", "uptime", "tenant" ], "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ] } ] }, { "claim_ids": [ "clm-relationship-alibaba-ecs-g8y-integrates-yitian710" ], "commercial_state": "commercial_cloud_catalogue_region_dependent", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "id": "rel-alibaba-ecs-g8y-integrates-yitian710", "last_checked": "2026-07-29", "process_step": "ECS g8y instance family", "product_id": "prod-yitian-710", "qualification_state": "service_catalogue", "quantity": null, "record_type": "relationship", "relationship_id": "rel-alibaba-ecs-g8y-integrates-yitian710", "relationship_type": "integrates", "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ], "start_date": null, "to_entity_id": "ent-alibaba-yitian-endpoint-unresolved", "unit": null, "unknowns": [ "region-specific legal operator", "actual availability", "facility", "installed CPU count", "server BOM", "utilization", "uptime", "tenant" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "baea76b10ef6842fc254d9d0f2f66fe8da2940882c630d06ad61374511f3fc9d", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "ECS g8y instance family" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-alibaba-ecs-yitian-instance-families-20260625", "title": "Elastic Compute Service: Available instance families", "publisher": "Alibaba Cloud Documentation Center", "url": "https://www.alibabacloud.com/help/en/ecs/user-guide/overview-of-instance-families", "source_type": "official_cloud_product_documentation", "primary_status": "primary", "publication_date": "2026-06-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves a current commercial catalogue configuration, not region-specific operator, physical facility, installed count or utilization.", "Server manufacturer, board BOM, foundry, package/OSAT, capacity, tenant, uptime and workload receipts are undisclosed." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "record_level": "service_brand_or_unresolved_operator", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "to_entity_reference": { "entity_id": "ent-alibaba-yitian-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-alibaba-ecs-g8y-integrates-yitian710", "predicate": "integrates", "scope": "edge from ent-alibaba-cloud-ecs-brand-unresolved to ent-alibaba-yitian-endpoint-unresolved; commercial state commercial_cloud_catalogue_region_dependent; qualification state service_catalogue", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "region-specific legal operator", "actual availability", "facility", "installed CPU count", "server BOM", "utilization", "uptime", "tenant" ], "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ] } ] }, { "claim_ids": [ "clm-relationship-alibaba-ecs-r8y-integrates-yitian710" ], "commercial_state": "commercial_cloud_catalogue_region_dependent", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "id": "rel-alibaba-ecs-r8y-integrates-yitian710", "last_checked": "2026-07-29", "process_step": "ECS r8y instance family", "product_id": "prod-yitian-710", "qualification_state": "service_catalogue", "quantity": null, "record_type": "relationship", "relationship_id": "rel-alibaba-ecs-r8y-integrates-yitian710", "relationship_type": "integrates", "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ], "start_date": null, "to_entity_id": "ent-alibaba-yitian-endpoint-unresolved", "unit": null, "unknowns": [ "region-specific legal operator", "actual availability", "facility", "installed CPU count", "server BOM", "utilization", "uptime", "tenant" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "e29d6a41a594681f1cd9fc22995887d5b940e38cdb1bbb34e05507e7efa9ff6a", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "ECS r8y instance family" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-alibaba-ecs-yitian-instance-families-20260625", "title": "Elastic Compute Service: Available instance families", "publisher": "Alibaba Cloud Documentation Center", "url": "https://www.alibabacloud.com/help/en/ecs/user-guide/overview-of-instance-families", "source_type": "official_cloud_product_documentation", "primary_status": "primary", "publication_date": "2026-06-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves a current commercial catalogue configuration, not region-specific operator, physical facility, installed count or utilization.", "Server manufacturer, board BOM, foundry, package/OSAT, capacity, tenant, uptime and workload receipts are undisclosed." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "record_level": "service_brand_or_unresolved_operator", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "to_entity_reference": { "entity_id": "ent-alibaba-yitian-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-alibaba-ecs-r8y-integrates-yitian710", "predicate": "integrates", "scope": "edge from ent-alibaba-cloud-ecs-brand-unresolved to ent-alibaba-yitian-endpoint-unresolved; commercial state commercial_cloud_catalogue_region_dependent; qualification state service_catalogue", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "region-specific legal operator", "actual availability", "facility", "installed CPU count", "server BOM", "utilization", "uptime", "tenant" ], "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ] } ] }, { "claim_ids": [ "clm-relationship-amkor-operates-shanghai-current" ], "commercial_state": "current_factory_C3", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-amkor-shanghai", "from_entity_id": "ent-amkor", "id": "rel-amkor-operates-shanghai-current", "last_checked": "2026-07-29", "process_step": "semiconductor assembly, packaging and test", "product_id": null, "qualification_state": "generic_packaging_test_scope_only", "quantity": null, "record_type": "relationship", "relationship_id": "rel-amkor-operates-shanghai-current", "relationship_type": "operates", "source_ids": [ "src-amkor-current-factory-2026", "src-shanghai-amkor-current-2025" ], "start_date": "2025-03-07", "to_entity_id": "ent-amkor-shanghai-operator-unresolved", "unit": null, "unknowns": [ "immediate ownership chain", "current package platforms", "customers", "capacity", "yield" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "6834f4006615ab41e6fadcfaedab917fc89ad3c94d67cd08c93d4811518dd046", "stage_ids": [ "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "semiconductor assembly, packaging and test" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_step", "value": "semiconductor assembly, packaging and test" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "semiconductor assembly, packaging and test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-amkor-current-factory-2026", "title": "Contact Us — Factories", "publisher": "Amkor Technology, Inc.", "url": "https://amkor.com/contact-us/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The current factory list proves legal name, factory identifier and address, not package-specific qualification, customers, capacity, utilization, yield or immediate ownership chain." ] }, { "source_id": "src-shanghai-amkor-current-2025", "title": "浦东新区领导走访行业领军企业", "publisher": "浦东新区人民政府", "url": "https://www.shanghai.gov.cn/nw15343/20250310/86a8dfa142ed4672ae78265adb29ecf0.html", "source_type": "government_company_record", "primary_status": "primary", "publication_date": "2025-03-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Government visit confirms current legal name and production-line presence, not exact package platform, customer, capacity, utilization, yield or equipment/material BOM." ] } ], "relationship_semantics": { "class": "facility_operation", "boundary": "Operation is kept separate from legal ownership, headquarters, product origin, capacity, utilization, and supplier status." }, "from_entity_reference": { "entity_id": "ent-amkor", "record_level": "company", "canonical_legal_name_en": "Amkor Technology, Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-amkor-shanghai-operator-unresolved", "record_level": "company", "canonical_legal_name_en": "Amkor Assembly and Test (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "安靠封装测试（上海）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-amkor-operates-shanghai-current", "predicate": "operates", "scope": "edge from ent-amkor to ent-amkor-shanghai-operator-unresolved; commercial state current_factory_C3; qualification state generic_packaging_test_scope_only", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "immediate ownership chain", "current package platforms", "customers", "capacity", "yield" ], "source_ids": [ "src-amkor-current-factory-2026", "src-shanghai-amkor-current-2025" ] } ] }, { "claim_ids": [ "clm-relationship-amkor-services-smic-historical" ], "commercial_state": "2012_service_provider_award_reported_by_supplier", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-amkor", "id": "rel-amkor-services-smic-historical", "last_checked": "2026-07-29", "process_step": "assembly, packaging or test service scope unresolved", "product_id": null, "qualification_state": "supplier_award_vendor_reported_not_technical_qualification", "quantity": null, "record_type": "relationship", "relationship_id": "rel-amkor-services-smic-historical", "relationship_type": "services", "source_ids": [ "src-amkor-smic-award-2013" ], "start_date": "2012-12-31", "to_entity_id": "ent-smic", "unit": null, "unknowns": [ "SMIC legal affiliate", "facility", "package", "chip", "quantity", "price", "current status" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "5e27e36647ef6688b0bbb03023c97f4834b0dc0e9e222c3ab3f178448f205e74", "stage_ids": [ "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "assembly, packaging or test service scope unresolved" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_step", "value": "assembly, packaging or test service scope unresolved" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "assembly, packaging or test service scope unresolved" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-amkor-smic-award-2013", "title": "Amkor Technology Receives Excellent Service Provider Award from SMIC", "publisher": "Amkor Technology, Inc.", "url": "https://ir.amkor.com/news-releases/news-release-details/amkor-technology-receives-excellent-service-provider-award-0", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2013-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-origin award statement does not identify the exact SMIC legal affiliate, facility, package, chip, quantity, price, qualification or current status." ] } ], "relationship_semantics": { "class": "service_not_supplier", "boundary": "A service relationship is not promoted to a product-supply, ownership, or manufacturing relationship." }, "from_entity_reference": { "entity_id": "ent-amkor", "record_level": "company", "canonical_legal_name_en": "Amkor Technology, Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-smic", "record_level": "company", "canonical_legal_name_en": "Semiconductor Manufacturing International Corporation", "canonical_legal_name_cn": "中芯国际集成电路制造有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-amkor-services-smic-historical", "predicate": "services", "scope": "edge from ent-amkor to ent-smic; commercial state 2012_service_provider_award_reported_by_supplier; qualification state supplier_award_vendor_reported_not_technical_qualification", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "SMIC legal affiliate", "facility", "package", "chip", "quantity", "price", "current status" ], "source_ids": [ "src-amkor-smic-award-2013" ] } ] }, { "claim_ids": [ "clm-relationship-ase-operates-wuxi-current" ], "commercial_state": "current_group_operation", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-ase-wuxi", "from_entity_id": "ent-ase", "id": "rel-ase-operates-wuxi-current", "last_checked": "2026-07-29", "process_step": "semiconductor assembly and test", "product_id": null, "qualification_state": "generic_assembly_test_scope_only", "quantity": null, "record_type": "relationship", "relationship_id": "rel-ase-operates-wuxi-current", "relationship_type": "operates", "source_ids": [ "src-ase-wuxi-operator-2025" ], "start_date": null, "to_entity_id": "ent-ase-wuxi-operator-unresolved", "unit": null, "unknowns": [ "immediate ownership chain", "package platforms", "customers", "capacity", "yield" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "18c3496470cd1ee97678d26f636cd65f792545ce385ff5b688a1abc4278e5ee0", "stage_ids": [ "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_step", "value": "semiconductor assembly and test" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "semiconductor assembly and test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ase-wuxi-operator-2025", "title": "ASE WuXi — 关于我们", "publisher": "无锡通芝微电子有限公司", "url": "https://www.asewx.com/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page proves the operating legal name, address and generic assembly/test scope, not the immediate ownership chain, package platforms, named customers, capacity, utilization or yield." ] } ], "relationship_semantics": { "class": "facility_operation", "boundary": "Operation is kept separate from legal ownership, headquarters, product origin, capacity, utilization, and supplier status." }, "from_entity_reference": { "entity_id": "ent-ase", "record_level": "company", "canonical_legal_name_en": "Advanced Semiconductor Engineering, Inc.", "canonical_legal_name_cn": "日月光半導體製造股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-ase-wuxi-operator-unresolved", "record_level": "company", "canonical_legal_name_en": "Wuxi Tongzhi Microelectronics Co., Ltd.", "canonical_legal_name_cn": "无锡通芝微电子有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-ase-operates-wuxi-current", "predicate": "operates", "scope": "edge from ent-ase to ent-ase-wuxi-operator-unresolved; commercial state current_group_operation; qualification state generic_assembly_test_scope_only", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "immediate ownership chain", "package platforms", "customers", "capacity", "yield" ], "source_ids": [ "src-ase-wuxi-operator-2025" ] } ] }, { "claim_ids": [ "clm-relationship-baidu-baige-appliance-integrates-p800" ], "commercial_state": "launched_apply_for_trial", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-baidu-ai-cloud-brand-unresolved", "id": "rel-baidu-baige-appliance-integrates-p800", "last_checked": "2026-07-29", "process_step": "Baidu Baige DeepSeek appliance", "product_id": "prod-kunlun-p800", "qualification_state": "vendor_claimed_end_to_end_optimized", "quantity": 8, "record_type": "relationship", "relationship_id": "rel-baidu-baige-appliance-integrates-p800", "relationship_type": "integrates", "source_ids": [ "src-baidu-baige-deepseek-p800-20250217" ], "start_date": null, "to_entity_id": "ent-kunlun-brand-endpoint-unresolved", "unit": "cards_per_appliance", "unknowns": [ "legal endpoints", "orders", "shipments", "customer acceptance", "server OEM/BOM", "sustained workload/latency/energy", "reliability" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "71344f5153e2d8d5214eb0368d4beae764e60f2dc5399eb5d444e8240611e0fa", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "Baidu Baige DeepSeek appliance" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "Baidu Baige DeepSeek appliance" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-baidu-baige-deepseek-p800-20250217", "title": "百度百舸 DeepSeek 一体机发布，支持昆仑芯 P800 单机 8 卡满血版开箱即用", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_e0a478ab-bfa4-425c-b9b5-a6d296f6c698", "source_type": "official_operator_product_release", "primary_status": "primary", "publication_date": "2025-02-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Launch/apply-for-trial and vendor deployment statements; no order, shipment, customer acceptance or independent workload receipt.", "Server OEM, CPU/memory/network BOM, cluster facility, exact card count, uptime and utilization are undisclosed." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-baidu-ai-cloud-brand-unresolved", "record_level": "service_brand_or_unresolved_operator", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "to_entity_reference": { "entity_id": "ent-kunlun-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "昆仑芯（北京）科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-baidu-baige-appliance-integrates-p800", "predicate": "integrates", "scope": "edge from ent-baidu-ai-cloud-brand-unresolved to ent-kunlun-brand-endpoint-unresolved; commercial state launched_apply_for_trial; qualification state vendor_claimed_end_to_end_optimized", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "legal endpoints", "orders", "shipments", "customer acceptance", "server OEM/BOM", "sustained workload/latency/energy", "reliability" ], "source_ids": [ "src-baidu-baige-deepseek-p800-20250217" ] } ] }, { "claim_ids": [ "clm-relationship-beijing-yunke-framework-china-telecom-corp-2025" ], "commercial_state": "signed_framework_after_award", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-beijing-digital-china-yunke", "id": "rel-beijing-yunke-framework-china-telecom-corp-2025", "last_checked": "2026-07-29", "process_step": "telecom compute infrastructure; buyer-level value allocation unknown", "product_id": "prod-yunke-telecom-server-framework-combined", "qualification_state": "awarded_framework_supplier", "quantity": null, "record_type": "relationship", "relationship_id": "rel-beijing-yunke-framework-china-telecom-corp-2025", "relationship_type": "supplies", "source_ids": [ "src-digital-china-chinatelecom-framework-20250423" ], "start_date": null, "to_entity_id": "ent-china-telecom-corp", "unit": null, "unknowns": [ "purchase orders", "actual spend/quantity", "delivery", "arrival acceptance", "test acceptance", "server models", "chip BOM", "receiving facility" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "9b4a4507a04ce4a6fa28d16be7a274983a7d0a98f6f3315b1523971c8aa82267", "stage_ids": [ "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "process_step", "value": "telecom compute infrastructure; buyer-level value allocation unknown" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "telecom compute infrastructure; buyer-level value allocation unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-digital-china-chinatelecom-framework-20250423", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2025-04/23/content_2053613.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Framework award value is not ordered, delivered or accepted value.", "Server models, CPU/accelerator vendor and part numbers, memory/NIC BOM, quantity, receiving affiliate/facility and test receipt are undisclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-beijing-digital-china-yunke", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京神州数码云科信息技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-china-telecom-corp", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "中国电信股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-beijing-yunke-framework-china-telecom-corp-2025", "predicate": "supplies", "scope": "edge from ent-beijing-digital-china-yunke to ent-china-telecom-corp; commercial state signed_framework_after_award; qualification state awarded_framework_supplier", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "purchase orders", "actual spend/quantity", "delivery", "arrival acceptance", "test acceptance", "server models", "chip BOM", "receiving facility" ], "source_ids": [ "src-digital-china-chinatelecom-framework-20250423" ] } ] }, { "claim_ids": [ "clm-relationship-beijing-yunke-framework-china-telecom-group-2025" ], "commercial_state": "signed_framework_after_award", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-beijing-digital-china-yunke", "id": "rel-beijing-yunke-framework-china-telecom-group-2025", "last_checked": "2026-07-29", "process_step": "telecom compute infrastructure; buyer-level value allocation unknown", "product_id": "prod-yunke-telecom-server-framework-combined", "qualification_state": "awarded_framework_supplier", "quantity": null, "record_type": "relationship", "relationship_id": "rel-beijing-yunke-framework-china-telecom-group-2025", "relationship_type": "supplies", "source_ids": [ "src-digital-china-chinatelecom-framework-20250423" ], "start_date": null, "to_entity_id": "ent-china-telecom-group", "unit": null, "unknowns": [ "purchase orders", "actual spend/quantity", "delivery", "arrival acceptance", "test acceptance", "server models", "chip BOM", "receiving facility" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "414f6fbf593af3cb6cc44f7ada7ea72b3326bafe39b579c38ef6a9f6dd050446", "stage_ids": [ "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "process_step", "value": "telecom compute infrastructure; buyer-level value allocation unknown" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "telecom compute infrastructure; buyer-level value allocation unknown" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-digital-china-chinatelecom-framework-20250423", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2025-04/23/content_2053613.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Framework award value is not ordered, delivered or accepted value.", "Server models, CPU/accelerator vendor and part numbers, memory/NIC BOM, quantity, receiving affiliate/facility and test receipt are undisclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-beijing-digital-china-yunke", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京神州数码云科信息技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-china-telecom-group", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "中国电信集团有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-beijing-yunke-framework-china-telecom-group-2025", "predicate": "supplies", "scope": "edge from ent-beijing-digital-china-yunke to ent-china-telecom-group; commercial state signed_framework_after_award; qualification state awarded_framework_supplier", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "purchase orders", "actual spend/quantity", "delivery", "arrival acceptance", "test acceptance", "server models", "chip BOM", "receiving facility" ], "source_ids": [ "src-digital-china-chinatelecom-framework-20250423" ] } ] }, { "claim_ids": [ "clm-relationship-biren-integrates-lightsphere-x-with-inesa" ], "commercial_state": "co_integration_and_commercial_version_released", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-biren-brand-endpoint-unresolved", "id": "rel-biren-integrates-lightsphere-x-with-inesa", "last_checked": "2026-07-29", "process_step": "GPU supernode system integration", "product_id": "prod-biren-lightsphere-x", "qualification_state": "unknown", "quantity": null, "record_type": "relationship", "relationship_id": "rel-biren-integrates-lightsphere-x-with-inesa", "relationship_type": "integrates", "source_ids": [ "src-biren-lightspherex-initial", "src-biren-lightspherex-commercial" ], "start_date": "2026-03-16", "to_entity_id": "ent-inesa-group", "unit": null, "unknowns": [ "customer/purchase", "named facility", "exact card model", "unit count by site", "acceptance", "uptime" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "e68b76de011fbbdc96b187c08c6b269f49709885a7009b09b6ecb78e3394e685", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "process_step", "value": "GPU supernode system integration" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "GPU supernode system integration" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "GPU supernode system integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-biren-lightspherex-initial", "title": "光跃LightSphere X超节点", "publisher": "上海壁仞科技股份有限公司", "url": "https://www.birentech.com/news/uk3x1bhhagcrtf5bqkurbnsa/", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Planned deployment at source date; no purchase, named customer, facility acceptance or installed-card count." ] }, { "source_id": "src-biren-lightspherex-commercial", "title": "光跃超节点商业版联合发布", "publisher": "上海壁仞科技股份有限公司", "url": "https://sgc-prod.birentech.com/news/h5vjj6lsw4n5za2yw6ayyv1e/", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2026-03-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported aggregate; no site, customer, exact card SKU, acceptance, uptime or utilization." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-biren-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Shanghai Biren Technology Co., Ltd.", "canonical_legal_name_cn": "上海壁仞科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-inesa-group", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海仪电（集团）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-biren-integrates-lightsphere-x-with-inesa", "predicate": "integrates", "scope": "edge from ent-biren-brand-endpoint-unresolved to ent-inesa-group; commercial state co_integration_and_commercial_version_released; qualification state unknown", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "customer/purchase", "named facility", "exact card model", "unit count by site", "acceptance", "uptime" ], "source_ids": [ "src-biren-lightspherex-initial", "src-biren-lightspherex-commercial" ] } ] }, { "claim_ids": [ "clm-relationship-biren-integrates-lightsphere-x-with-lightelligence" ], "commercial_state": "co_integration_and_commercial_version_released", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-biren-brand-endpoint-unresolved", "id": "rel-biren-integrates-lightsphere-x-with-lightelligence", "last_checked": "2026-07-29", "process_step": "GPU supernode optical/system integration", "product_id": "prod-biren-lightsphere-x", "qualification_state": "unknown", "quantity": null, "record_type": "relationship", "relationship_id": "rel-biren-integrates-lightsphere-x-with-lightelligence", "relationship_type": "integrates", "source_ids": [ "src-biren-lightspherex-initial", "src-biren-lightspherex-commercial" ], "start_date": "2026-03-16", "to_entity_id": "ent-lightelligence-shanghai", "unit": null, "unknowns": [ "customer/purchase", "named facility", "exact card/optical model", "unit count by site", "acceptance", "uptime" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "c5140bff52aeee50020bcfe9c72187665558b80e7eadfccb2124089ba9a656c3", "stage_ids": [ "architecture_ip", "board_system", "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "process_step", "value": "GPU supernode optical/system integration" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "GPU supernode optical/system integration" } ] }, { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "process_step", "value": "GPU supernode optical/system integration" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "GPU supernode optical/system integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-biren-lightspherex-initial", "title": "光跃LightSphere X超节点", "publisher": "上海壁仞科技股份有限公司", "url": "https://www.birentech.com/news/uk3x1bhhagcrtf5bqkurbnsa/", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Planned deployment at source date; no purchase, named customer, facility acceptance or installed-card count." ] }, { "source_id": "src-biren-lightspherex-commercial", "title": "光跃超节点商业版联合发布", "publisher": "上海壁仞科技股份有限公司", "url": "https://sgc-prod.birentech.com/news/h5vjj6lsw4n5za2yw6ayyv1e/", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2026-03-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported aggregate; no site, customer, exact card SKU, acceptance, uptime or utilization." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-biren-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Shanghai Biren Technology Co., Ltd.", "canonical_legal_name_cn": "上海壁仞科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-lightelligence-shanghai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海曦智科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-biren-integrates-lightsphere-x-with-lightelligence", "predicate": "integrates", "scope": "edge from ent-biren-brand-endpoint-unresolved to ent-lightelligence-shanghai; commercial state co_integration_and_commercial_version_released; qualification state unknown", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "customer/purchase", "named facility", "exact card/optical model", "unit count by site", "acceptance", "uptime" ], "source_ids": [ "src-biren-lightspherex-initial", "src-biren-lightspherex-commercial" ] } ] }, { "claim_ids": [ "clm-relationship-biren-integrates-lightsphere-x-with-zte" ], "commercial_state": "co_integration_and_commercial_version_released", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-biren-brand-endpoint-unresolved", "id": "rel-biren-integrates-lightsphere-x-with-zte", "last_checked": "2026-07-29", "process_step": "GPU supernode system integration", "product_id": "prod-biren-lightsphere-x", "qualification_state": "unknown", "quantity": null, "record_type": "relationship", "relationship_id": "rel-biren-integrates-lightsphere-x-with-zte", "relationship_type": "integrates", "source_ids": [ "src-biren-lightspherex-initial", "src-biren-lightspherex-commercial" ], "start_date": "2026-03-16", "to_entity_id": "ent-dd-zte", "unit": null, "unknowns": [ "customer/purchase", "named facility", "exact card model", "unit count by site", "acceptance", "uptime" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "64699a2745c9ca593438b8fdabc1702833a5b8ded12cf2995da2350696238bbe", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "process_step", "value": "GPU supernode system integration" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "GPU supernode system integration" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "GPU supernode system integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-biren-lightspherex-initial", "title": "光跃LightSphere X超节点", "publisher": "上海壁仞科技股份有限公司", "url": "https://www.birentech.com/news/uk3x1bhhagcrtf5bqkurbnsa/", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Planned deployment at source date; no purchase, named customer, facility acceptance or installed-card count." ] }, { "source_id": "src-biren-lightspherex-commercial", "title": "光跃超节点商业版联合发布", "publisher": "上海壁仞科技股份有限公司", "url": "https://sgc-prod.birentech.com/news/h5vjj6lsw4n5za2yw6ayyv1e/", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2026-03-16", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-reported aggregate; no site, customer, exact card SKU, acceptance, uptime or utilization." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-biren-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Shanghai Biren Technology Co., Ltd.", "canonical_legal_name_cn": "上海壁仞科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-dd-zte", "record_level": "company", "canonical_legal_name_en": "ZTE Corporation", "canonical_legal_name_cn": "中兴通讯股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-biren-integrates-lightsphere-x-with-zte", "predicate": "integrates", "scope": "edge from ent-biren-brand-endpoint-unresolved to ent-dd-zte; commercial state co_integration_and_commercial_version_released; qualification state unknown", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "customer/purchase", "named facility", "exact card model", "unit count by site", "acceptance", "uptime" ], "source_ids": [ "src-biren-lightspherex-initial", "src-biren-lightspherex-commercial" ] } ] }, { "claim_ids": [ "clm-relationship-cmb-validates-kunlun-p800-vendor-reported" ], "commercial_state": "vendor_reports_project_award_and_application_test", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-china-merchants-bank", "id": "rel-cmb-validates-kunlun-p800-vendor-reported", "last_checked": "2026-07-29", "process_step": "bank AI-chip resource application test", "product_id": "prod-kunlun-p800", "qualification_state": "customer_application_test_vendor_reported", "quantity": null, "record_type": "relationship", "relationship_id": "rel-cmb-validates-kunlun-p800-vendor-reported", "relationship_type": "validates", "source_ids": [ "src-kunlun-p800-cmb-20250327" ], "start_date": "2025-03-27", "to_entity_id": "ent-kunlun-brand-endpoint-unresolved", "unit": null, "unknowns": [ "customer-origin tender/contract", "quantity", "server BOM", "delivery", "installation", "acceptance", "workload result" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "5fa336fd9208d058f55db695e001731e616a25f1616ca458c46acdcb2e01872a", "stage_ids": [ "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_step", "value": "bank AI-chip resource application test" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "bank AI-chip resource application test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kunlun-p800-cmb-20250327", "title": "昆仑芯中标招商银行AI芯片资源项目", "publisher": "昆仑芯（北京）科技股份有限公司", "url": "https://www.kunlunxin.com/news/4469.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2025-03-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vendor-origin award; tender number, contract, quantity, delivery, installation and customer acceptance are undisclosed." ] } ], "relationship_semantics": { "class": "validation_not_supplier", "boundary": "Validation is kept separate from supply, shipment, volume production, and customer deployment." }, "from_entity_reference": { "entity_id": "ent-china-merchants-bank", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "招商银行股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-kunlun-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "昆仑芯（北京）科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-cmb-validates-kunlun-p800-vendor-reported", "predicate": "validates", "scope": "edge from ent-china-merchants-bank to ent-kunlun-brand-endpoint-unresolved; commercial state vendor_reports_project_award_and_application_test; qualification state customer_application_test_vendor_reported", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "customer-origin tender/contract", "quantity", "server BOM", "delivery", "installation", "acceptance", "workload result" ], "source_ids": [ "src-kunlun-p800-cmb-20250327" ] } ] }, { "claim_ids": [ "clm-relationship-ctyun-integrates-ascend910b2-pak3-huabei2" ], "commercial_state": "online_cloud_service", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-ctyun-huabei2-resource-pool", "from_entity_id": "ent-tianyi-cloud-tech", "id": "rel-ctyun-integrates-ascend910b2-pak3-huabei2", "last_checked": "2026-07-29", "process_step": "PAK3 cloud-host system integration", "product_id": "prod-huawei-ascend-910b2", "qualification_state": "service_online", "quantity": 1, "record_type": "relationship", "relationship_id": "rel-ctyun-integrates-ascend910b2-pak3-huabei2", "relationship_type": "integrates", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "start_date": null, "to_entity_id": "ent-huawei-brand-endpoint-unresolved", "unit": "64GB_NPU_per_instance", "unknowns": [ "legal supplier", "purchase/acceptance", "hardware count", "utilization", "tenant", "site address" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "b5280c4d7ae3b641c1c49ad5bacfc435a4e8c2f9e0892ba5e1fed8449103ea3c", "stage_ids": [ "board_system", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "PAK3 cloud-host system integration" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "process_step", "value": "PAK3 cloud-host system integration" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "PAK3 cloud-host system integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-tianyi-cloud-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-huawei-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-ctyun-integrates-ascend910b2-pak3-huabei2", "predicate": "integrates", "scope": "edge from ent-tianyi-cloud-tech to ent-huawei-brand-endpoint-unresolved; commercial state online_cloud_service; qualification state service_online", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "legal supplier", "purchase/acceptance", "hardware count", "utilization", "tenant", "site address" ], "source_ids": [ "src-ctyun-ascend-cloud-20260508" ] } ] }, { "claim_ids": [ "clm-relationship-ctyun-integrates-ascend910b2-pak3-shanghai36" ], "commercial_state": "online_cloud_service", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-ctyun-shanghai36-resource-pool", "from_entity_id": "ent-tianyi-cloud-tech", "id": "rel-ctyun-integrates-ascend910b2-pak3-shanghai36", "last_checked": "2026-07-29", "process_step": "PAK3 cloud-host system integration", "product_id": "prod-huawei-ascend-910b2", "qualification_state": "service_online", "quantity": 1, "record_type": "relationship", "relationship_id": "rel-ctyun-integrates-ascend910b2-pak3-shanghai36", "relationship_type": "integrates", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "start_date": null, "to_entity_id": "ent-huawei-brand-endpoint-unresolved", "unit": "64GB_NPU_per_instance", "unknowns": [ "legal supplier", "purchase/acceptance", "hardware count", "utilization", "tenant", "site address" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "efb161661351425c2036110f015abd261965a693676636b6e3fb79c07e0cf3f8", "stage_ids": [ "board_system", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "PAK3 cloud-host system integration" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "process_step", "value": "PAK3 cloud-host system integration" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "PAK3 cloud-host system integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-tianyi-cloud-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-huawei-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-ctyun-integrates-ascend910b2-pak3-shanghai36", "predicate": "integrates", "scope": "edge from ent-tianyi-cloud-tech to ent-huawei-brand-endpoint-unresolved; commercial state online_cloud_service; qualification state service_online", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "legal supplier", "purchase/acceptance", "hardware count", "utilization", "tenant", "site address" ], "source_ids": [ "src-ctyun-ascend-cloud-20260508" ] } ] }, { "claim_ids": [ "clm-relationship-ctyun-integrates-atlas300iduo-pak2" ], "commercial_state": "online_cloud_service_family_page", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-tianyi-cloud-tech", "id": "rel-ctyun-integrates-atlas300iduo-pak2", "last_checked": "2026-07-29", "process_step": "PAK2 cloud-host system integration", "product_id": "prod-huawei-atlas-300i-duo", "qualification_state": "service_online", "quantity": 1, "record_type": "relationship", "relationship_id": "rel-ctyun-integrates-atlas300iduo-pak2", "relationship_type": "integrates", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "start_date": null, "to_entity_id": "ent-huawei-brand-endpoint-unresolved", "unit": "96GB_card_per_instance", "unknowns": [ "per-resource-pool availability", "legal supplier", "purchase/acceptance", "hardware count", "utilization" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "cae661afc17330a5164777d064fd7ff0715a7a27d67a20b578cd9aa151f3c2ae", "stage_ids": [ "board_system", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "PAK2 cloud-host system integration" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "process_step", "value": "PAK2 cloud-host system integration" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "PAK2 cloud-host system integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-tianyi-cloud-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-huawei-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-ctyun-integrates-atlas300iduo-pak2", "predicate": "integrates", "scope": "edge from ent-tianyi-cloud-tech to ent-huawei-brand-endpoint-unresolved; commercial state online_cloud_service_family_page; qualification state service_online", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "per-resource-pool availability", "legal supplier", "purchase/acceptance", "hardware count", "utilization" ], "source_ids": [ "src-ctyun-ascend-cloud-20260508" ] } ] }, { "claim_ids": [ "clm-relationship-ctyun-integrates-atlas300ipro-pak1" ], "commercial_state": "online_cloud_service_family_page", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-tianyi-cloud-tech", "id": "rel-ctyun-integrates-atlas300ipro-pak1", "last_checked": "2026-07-29", "process_step": "PAK1 cloud-host system integration", "product_id": "prod-huawei-atlas-300i-pro", "qualification_state": "service_online", "quantity": "1/2/4", "record_type": "relationship", "relationship_id": "rel-ctyun-integrates-atlas300ipro-pak1", "relationship_type": "integrates", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "start_date": null, "to_entity_id": "ent-huawei-brand-endpoint-unresolved", "unit": "24GB_cards_per_instance", "unknowns": [ "per-resource-pool availability", "legal supplier", "purchase/acceptance", "hardware count", "utilization" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "51d76fc23cdbea19bf779c9e5632c6f7a341b948280cc13805479f3d27f58517", "stage_ids": [ "board_system", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "PAK1 cloud-host system integration" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "process_step", "value": "PAK1 cloud-host system integration" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "PAK1 cloud-host system integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-tianyi-cloud-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-huawei-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-ctyun-integrates-atlas300ipro-pak1", "predicate": "integrates", "scope": "edge from ent-tianyi-cloud-tech to ent-huawei-brand-endpoint-unresolved; commercial state online_cloud_service_family_page; qualification state service_online", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "per-resource-pool availability", "legal supplier", "purchase/acceptance", "hardware count", "utilization" ], "source_ids": [ "src-ctyun-ascend-cloud-20260508" ] } ] }, { "claim_ids": [ "clm-relationship-ctyun-integrates-hygon7285-pch1" ], "commercial_state": "online_cloud_service", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-ctyun-guangzhou6-resource-pool", "from_entity_id": "ent-tianyi-cloud-tech", "id": "rel-ctyun-integrates-hygon7285-pch1", "last_checked": "2026-07-29", "process_step": "PCH1 cloud-host system integration", "product_id": "prod-hygon-7285", "qualification_state": "service_online", "quantity": null, "record_type": "relationship", "relationship_id": "rel-ctyun-integrates-hygon7285-pch1", "relationship_type": "integrates", "source_ids": [ "src-ctyun-cambricon-cloud-20260703" ], "start_date": null, "to_entity_id": "ent-hygon-brand-endpoint-unresolved", "unit": null, "unknowns": [ "legal supplier", "purchase/acceptance", "CPU count", "utilization", "tenant", "site address" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "7df795d7319cbf3ef5ffa4dd521ced522b9ce21473a3c4d237f879031131c45a", "stage_ids": [ "board_system", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "PCH1 cloud-host system integration" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "process_step", "value": "PCH1 cloud-host system integration" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "PCH1 cloud-host system integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-07-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-tianyi-cloud-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-hygon-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-ctyun-integrates-hygon7285-pch1", "predicate": "integrates", "scope": "edge from ent-tianyi-cloud-tech to ent-hygon-brand-endpoint-unresolved; commercial state online_cloud_service; qualification state service_online", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "legal supplier", "purchase/acceptance", "CPU count", "utilization", "tenant", "site address" ], "source_ids": [ "src-ctyun-cambricon-cloud-20260703" ] } ] }, { "claim_ids": [ "clm-relationship-ctyun-integrates-mlu370s4-pch1" ], "commercial_state": "online_cloud_service", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-ctyun-guangzhou6-resource-pool", "from_entity_id": "ent-tianyi-cloud-tech", "id": "rel-ctyun-integrates-mlu370s4-pch1", "last_checked": "2026-07-29", "process_step": "PCH1 cloud-host system integration", "product_id": "prod-cambricon-mlu370-s4", "qualification_state": "service_online", "quantity": "1/2/3/4", "record_type": "relationship", "relationship_id": "rel-ctyun-integrates-mlu370s4-pch1", "relationship_type": "integrates", "source_ids": [ "src-ctyun-cambricon-cloud-20260703" ], "start_date": null, "to_entity_id": "ent-cambricon-brand-endpoint-unresolved", "unit": "24GB_cards_per_instance", "unknowns": [ "legal supplier", "purchase/acceptance", "hardware count", "utilization", "tenant", "site address" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "4a453dd4c23df746aa5d2d84cdff94778dc44e94959b9904ed1a87eab67362cb", "stage_ids": [ "board_system", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "PCH1 cloud-host system integration" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "process_step", "value": "PCH1 cloud-host system integration" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "PCH1 cloud-host system integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-07-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-tianyi-cloud-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "天翼云科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-cambricon-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Cambricon Technologies Corporation Limited", "canonical_legal_name_cn": "中科寒武纪科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-ctyun-integrates-mlu370s4-pch1", "predicate": "integrates", "scope": "edge from ent-tianyi-cloud-tech to ent-cambricon-brand-endpoint-unresolved; commercial state online_cloud_service; qualification state service_online", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "legal supplier", "purchase/acceptance", "hardware count", "utilization", "tenant", "site address" ], "source_ids": [ "src-ctyun-cambricon-cloud-20260703" ] } ] }, { "claim_ids": [ "clm-relationship-cxmt-owns-product-hefei" ], "commercial_state": "wholly_owned_subsidiary", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-cxmt-product-hefei-test", "from_entity_id": "ent-cxmt-corp", "id": "rel-cxmt-owns-product-hefei", "last_checked": "2026-07-29", "process_step": null, "product_id": null, "qualification_state": "not_applicable", "quantity": 100, "record_type": "relationship", "relationship_id": "rel-cxmt-owns-product-hefei", "relationship_type": "owns", "source_ids": [ "src-cxmt-sse-prospectus-2026" ], "start_date": null, "to_entity_id": "ent-cxmt-product-hefei", "unit": "percent", "unknowns": [ "intermediate ownership chain if any", "later ownership changes" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "f63b5ec0926390682dab8f56beff676a9edeec996537569fc11257b89a2ba635", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cxmt-sse-prospectus-2026", "title": "长鑫科技集团股份有限公司首次公开发行股票并在科创板上市招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202605/002170_20260527_23QQ.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-05-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The issuer names no packaging OSAT legal entity.", "The filing has no HBM literal hit and no HBM product, stack, facility, customer, qualification, yield or shipment receipt.", "Absence in this filing is not proof that no private R&D exists." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-cxmt-product-hefei", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "长鑫存储产品（合肥）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-cxmt-owns-product-hefei", "predicate": "owns", "scope": "edge from ent-cxmt-corp to ent-cxmt-product-hefei; commercial state wholly_owned_subsidiary; qualification state not_applicable", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "intermediate ownership chain if any", "later ownership changes" ], "source_ids": [ "src-cxmt-sse-prospectus-2026" ] } ] }, { "claim_ids": [ "clm-relationship-cxmt-product-hefei-tests-cxmt-dram" ], "commercial_state": "internal_production_test_function", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-cxmt-product-hefei-test", "from_entity_id": "ent-cxmt-product-hefei", "id": "rel-cxmt-product-hefei-tests-cxmt-dram", "last_checked": "2026-07-29", "process_step": "part of CXMT DRAM product testing", "product_id": null, "qualification_state": "unknown", "quantity": null, "record_type": "relationship", "relationship_id": "rel-cxmt-product-hefei-tests-cxmt-dram", "relationship_type": "tests", "source_ids": [ "src-cxmt-sse-prospectus-2026" ], "start_date": null, "to_entity_id": "ent-cxmt-corp", "unit": null, "unknowns": [ "product SKUs", "test platforms", "capacity", "yield", "outsourced-test split" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "a350e0cd19812c832d1cb91d6c89e32aed15a387955fc011f2067fd66d8d4711", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_step", "value": "part of CXMT DRAM product testing" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "part of CXMT DRAM product testing" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cxmt-sse-prospectus-2026", "title": "长鑫科技集团股份有限公司首次公开发行股票并在科创板上市招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202605/002170_20260527_23QQ.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-05-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The issuer names no packaging OSAT legal entity.", "The filing has no HBM literal hit and no HBM product, stack, facility, customer, qualification, yield or shipment receipt.", "Absence in this filing is not proof that no private R&D exists." ] } ], "relationship_semantics": { "class": "test_not_supplier", "boundary": "Testing is kept separate from supply, ownership, qualification, volume, and deployment unless those fields are explicitly present." }, "from_entity_reference": { "entity_id": "ent-cxmt-product-hefei", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "长鑫存储产品（合肥）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-cxmt-product-hefei-tests-cxmt-dram", "predicate": "tests", "scope": "edge from ent-cxmt-product-hefei to ent-cxmt-corp; commercial state internal_production_test_function; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "product SKUs", "test platforms", "capacity", "yield", "outsourced-test split" ], "source_ids": [ "src-cxmt-sse-prospectus-2026" ] } ] }, { "claim_ids": [ "clm-relationship-dd-byd-integrates-byd-semiconductor-sic" ], "commercial_state": "mass_production_platform_and_batch_vehicle_installation_reported", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-byd-contracting-endpoint-unresolved", "id": "rel-dd-byd-integrates-byd-semiconductor-sic", "last_checked": "2026-07-29", "process_step": "vehicle inverter and high-voltage power conversion", "product_id": "prod-dd-byd-super-e", "qualification_state": "automotive_application_vendor_reported", "quantity": null, "record_type": "relationship", "relationship_id": "rel-dd-byd-integrates-byd-semiconductor-sic", "relationship_type": "integrates", "source_ids": [ "src-dd-byd-001", "src-dd-byd-002" ], "start_date": "2025-03-17", "to_entity_id": "ent-dd-byd-semiconductor-unresolved", "unit": null, "unknowns": [ "BYD Semiconductor legal entity", "vehicle unit count", "trim/inverter BOM", "facility", "independent qualification" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "60c62e876b3f501e632cc2bc2073a11eaf777799bad5e22510667b8580f8f69d", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "vehicle inverter and high-voltage power conversion" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "vehicle inverter and high-voltage power conversion" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-byd-001", "title": "全球首款批量装车1500V高耐压大功率SiC芯片 助力全球最强超级e平台", "publisher": "比亚迪股份有限公司", "url": "https://www.byd.com/cn/news/2025/detail569", "source_type": "official_corporate_technical_announcement", "primary_status": "primary", "publication_date": "2025-03-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No fab, substrate/epitaxy supplier, equipment/material supplier, capacity, output, yield, vehicle count or independent reliability." ] }, { "source_id": "src-dd-byd-002", "title": "比亚迪超级e平台，兆瓦闪充开启油电同速", "publisher": "比亚迪股份有限公司", "url": "https://www.bydglobal.com/cn/news/2025-03-18/1617162611594", "source_type": "official_customer_corporate_announcement", "primary_status": "primary", "publication_date": "2025-03-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No delivered-vehicle count, facility, yield or independent validation." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-byd-contracting-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "BYD COMPANY LIMITED", "canonical_legal_name_cn": "比亚迪股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-dd-byd-semiconductor-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-dd-byd-integrates-byd-semiconductor-sic", "predicate": "integrates", "scope": "edge from ent-byd-contracting-endpoint-unresolved to ent-dd-byd-semiconductor-unresolved; commercial state mass_production_platform_and_batch_vehicle_installation_reported; qualification state automotive_application_vendor_reported", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "BYD Semiconductor legal entity", "vehicle unit count", "trim/inverter BOM", "facility", "independent qualification" ], "source_ids": [ "src-dd-byd-001", "src-dd-byd-002" ] } ] }, { "claim_ids": [ "clm-relationship-dd-ecarx-antora-integrates-siengine-se1000" ], "commercial_state": "first_delivery", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-dd-dongjun-hubei", "from_entity_id": "ent-dd-ecarx-holdings", "id": "rel-dd-ecarx-antora-integrates-siengine-se1000", "last_checked": "2026-07-29", "process_step": "two SE1000 SoCs in Antora 1000 Pro", "product_id": "prod-dd-antora-1000-pro", "qualification_state": "integrated_product", "quantity": 2, "record_type": "relationship", "relationship_id": "rel-dd-ecarx-antora-integrates-siengine-se1000", "relationship_type": "integrates", "source_ids": [ "src-dd-auto-001", "src-dd-auto-002", "src-dd-auto-003", "src-dd-auto-004", "src-dd-auto-008" ], "start_date": "2023-09-26", "to_entity_id": "ent-dd-siengine-hubei", "unit": "SoCs_per_platform", "unknowns": [ "chip transaction path", "foundry", "package/OSAT", "shipment volume", "yield" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "7795d628e436bf5471db5f8b21a21b7053cd2682efe0470c6b6315a2604f9ac5", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "process_step", "value": "two SE1000 SoCs in Antora 1000 Pro" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "two SE1000 SoCs in Antora 1000 Pro" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-001", "title": "领克携手魅族探索移动出行智能化，全方位共创「无界」超级生态", "publisher": "领克汽车销售有限公司", "url": "https://www.lynkco.com.cn/brand/news/newslist/2023/1117", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2023-03-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No vehicle shipment count, direct chip purchase, foundry, package, OSAT or yield." ] }, { "source_id": "src-dd-auto-002", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2023-09-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ] }, { "source_id": "src-dd-auto-003", "title": "安托拉1000 Pro量产交付相关政务记录", "publisher": "武汉经济技术开发区", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202309/t20230927_2272685.html", "source_type": "government_company_event_record", "primary_status": "primary", "publication_date": "2023-09-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Company-attributed government record, not an independent production audit." ] }, { "source_id": "src-dd-auto-004", "title": "芯擎科技与龙鹰一号相关政务记录", "publisher": "武汉经济技术开发区", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202304/t20230423_2190472.html", "source_type": "government_company_identity_and_product_record", "primary_status": "primary", "publication_date": "2023-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, OSAT, delivered-chip quantity or vehicle volume." ] }, { "source_id": "src-dd-auto-008", "title": "ECARX Antora 1000 Pro", "publisher": "ECARX", "url": "https://www.ecarxgroup.com/ecarx-antora-1000-pro/", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue specifications do not prove vehicle shipments, yield, foundry or package." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-dd-ecarx-holdings", "record_level": "company", "canonical_legal_name_en": "ECARX Holdings Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-dd-siengine-hubei", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "湖北芯擎科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-dd-ecarx-antora-integrates-siengine-se1000", "predicate": "integrates", "scope": "edge from ent-dd-ecarx-holdings to ent-dd-siengine-hubei; commercial state first_delivery; qualification state integrated_product", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "chip transaction path", "foundry", "package/OSAT", "shipment volume", "yield" ], "source_ids": [ "src-dd-auto-001", "src-dd-auto-002", "src-dd-auto-003", "src-dd-auto-004", "src-dd-auto-008" ] } ] }, { "claim_ids": [ "clm-relationship-dd-faw-tiangong05-integrates-ecarx-antora" ], "commercial_state": "launched", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-dd-faw-endpoint-unresolved", "id": "rel-dd-faw-tiangong05-integrates-ecarx-antora", "last_checked": "2026-07-29", "process_step": "vehicle cockpit computing", "product_id": "prod-dd-hongqi-tiangong-05", "qualification_state": "production_vehicle_integration_vendor_reported", "quantity": null, "record_type": "relationship", "relationship_id": "rel-dd-faw-tiangong05-integrates-ecarx-antora", "relationship_type": "integrates", "source_ids": [ "src-dd-auto-006", "src-dd-auto-007", "src-dd-auto-008" ], "start_date": "2025-01", "to_entity_id": "ent-dd-ecarx-holdings", "unit": null, "unknowns": [ "FAW legal endpoint", "delivery count", "purchase terms", "production facility", "chip shipment count" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "c3b84662ec32204fa1d60f2adb848c65fce807064003beea969c66c01e03e2fa", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "vehicle cockpit computing" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "vehicle cockpit computing" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-006", "title": "红旗研发新视界：天工05", "publisher": "中国一汽", "url": "https://www.faw.com.cn/fawcn/5133331/5642305/5833080/index.html", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2025-02-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The customer does not name the chip/platform vendor or delivery count." ] }, { "source_id": "src-dd-auto-007", "title": "ECARX to Power Launch of First Hongqi Model Under Strategic Partnership with FAW, Debuting AutoGPT with DeepSeek-R1 Integration", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-power-launch-first-hongqi-model-under-strategic", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2025-02-11", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-origin release; no vehicle deliveries, contract, chip shipment, foundry or OSAT." ] }, { "source_id": "src-dd-auto-008", "title": "ECARX Antora 1000 Pro", "publisher": "ECARX", "url": "https://www.ecarxgroup.com/ecarx-antora-1000-pro/", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Catalogue specifications do not prove vehicle shipments, yield, foundry or package." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-dd-faw-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "to_entity_reference": { "entity_id": "ent-dd-ecarx-holdings", "record_level": "company", "canonical_legal_name_en": "ECARX Holdings Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-dd-faw-tiangong05-integrates-ecarx-antora", "predicate": "integrates", "scope": "edge from ent-dd-faw-endpoint-unresolved to ent-dd-ecarx-holdings; commercial state launched; qualification state production_vehicle_integration_vendor_reported", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "FAW legal endpoint", "delivery count", "purchase terms", "production facility", "chip shipment count" ], "source_ids": [ "src-dd-auto-006", "src-dd-auto-007", "src-dd-auto-008" ] } ] }, { "claim_ids": [ "clm-relationship-dd-lynk08-integrates-ecarx-antora" ], "commercial_state": "first_delivery", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-dd-lynk-yuyao", "from_entity_id": "ent-dd-lynk-sales", "id": "rel-dd-lynk08-integrates-ecarx-antora", "last_checked": "2026-07-29", "process_step": "Antora 1000 Pro cockpit computing", "product_id": "prod-dd-lynk08-2023", "qualification_state": "vehicle_platform_integration", "quantity": null, "record_type": "relationship", "relationship_id": "rel-dd-lynk08-integrates-ecarx-antora", "relationship_type": "integrates", "source_ids": [ "src-dd-auto-001", "src-dd-auto-002", "src-dd-auto-003" ], "start_date": "2023-09-26", "to_entity_id": "ent-dd-ecarx-holdings", "unit": null, "unknowns": [ "direct purchase path", "unit count", "vehicle shipment volume" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "e03240c4fed369cc39b78568578f29f28099cb65e1b90068c8b7501ff766090e", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "Antora 1000 Pro cockpit computing" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-auto-001", "title": "领克携手魅族探索移动出行智能化，全方位共创「无界」超级生态", "publisher": "领克汽车销售有限公司", "url": "https://www.lynkco.com.cn/brand/news/newslist/2023/1117", "source_type": "official_customer_product_announcement", "primary_status": "primary", "publication_date": "2023-03-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No vehicle shipment count, direct chip purchase, foundry, package, OSAT or yield." ] }, { "source_id": "src-dd-auto-002", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "publisher": "ECARX Holdings Inc.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "source_type": "official_supplier_ir_announcement", "primary_status": "primary", "publication_date": "2023-09-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ] }, { "source_id": "src-dd-auto-003", "title": "安托拉1000 Pro量产交付相关政务记录", "publisher": "武汉经济技术开发区", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202309/t20230927_2272685.html", "source_type": "government_company_event_record", "primary_status": "primary", "publication_date": "2023-09-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Company-attributed government record, not an independent production audit." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-dd-lynk-sales", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "领克汽车销售有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-dd-ecarx-holdings", "record_level": "company", "canonical_legal_name_en": "ECARX Holdings Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-dd-lynk08-integrates-ecarx-antora", "predicate": "integrates", "scope": "edge from ent-dd-lynk-sales to ent-dd-ecarx-holdings; commercial state first_delivery; qualification state vehicle_platform_integration", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "direct purchase path", "unit count", "vehicle shipment volume" ], "source_ids": [ "src-dd-auto-001", "src-dd-auto-002", "src-dd-auto-003" ] } ] }, { "claim_ids": [ "clm-relationship-dd-poco-c71-integrates-unisoc-t7250" ], "commercial_state": "retail_shipping_offer", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-dd-poco-global-operator-unresolved", "id": "rel-dd-poco-c71-integrates-unisoc-t7250", "last_checked": "2026-07-29", "process_step": "smartphone application processor", "product_id": "prod-dd-poco-c71", "qualification_state": "shipping_product", "quantity": 1, "record_type": "relationship", "relationship_id": "rel-dd-poco-c71-integrates-unisoc-t7250", "relationship_type": "integrates", "source_ids": [ "src-dd-mobile-001", "src-dd-mobile-002", "src-dd-mobile-003", "src-dd-mobile-005", "src-dd-mobile-006" ], "start_date": null, "to_entity_id": "ent-dd-unisoc-shanghai", "unit": "SoC_per_phone", "unknowns": [ "legal product owner", "direct buyer/seller contract", "distribution path", "units", "foundry", "package/OSAT" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "05efe2edc3aa04ae1c64db403e3c26afa2ace36a57390878971c89d0b3f346ab", "stage_ids": [ "architecture_ip", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "process_step", "value": "smartphone application processor" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "smartphone application processor" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "smartphone application processor" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-dd-mobile-001", "title": "POCO C71", "publisher": "Xiaomi Global", "url": "https://www.mi.com/global/product/poco-c71/", "source_type": "official_customer_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No direct purchase path, SoC quantity, foundry, package or OSAT." ] }, { "source_id": "src-dd-mobile-002", "title": "POCO C71 Specs", "publisher": "Xiaomi Global", "url": "https://www.mi.com/global/product/poco-c71/specs/", "source_type": "official_customer_specification_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Memory type is stated but memory and eMMC suppliers are not." ] }, { "source_id": "src-dd-mobile-003", "title": "POCO C71 FAQ", "publisher": "Xiaomi Global Support", "url": "https://www.mi.com/global/support/faq/details/KA-559836/", "source_type": "official_customer_support_bom_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier strings are brands/abbreviations; legal entities, lot shares and direct purchasing are unresolved." ] }, { "source_id": "src-dd-mobile-005", "title": "T7250", "publisher": "紫光展锐", "url": "https://www.unisoc.com/cn/product/SmartPhone/T7250", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, Xiaomi-specific certification or volume." ] }, { "source_id": "src-dd-mobile-006", "title": "T7250", "publisher": "UNISOC", "url": "https://www.unisoc.com/en/product/SmartPhone/T7250", "source_type": "official_supplier_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No foundry, package, Xiaomi-specific certification or volume." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-dd-poco-global-operator-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "to_entity_reference": { "entity_id": "ent-dd-unisoc-shanghai", "record_level": "company", "canonical_legal_name_en": "UNISOC (Shanghai) Technology Co., Ltd.", "canonical_legal_name_cn": "紫光展锐（上海）科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-dd-poco-c71-integrates-unisoc-t7250", "predicate": "integrates", "scope": "edge from ent-dd-poco-global-operator-unresolved to ent-dd-unisoc-shanghai; commercial state retail_shipping_offer; qualification state shipping_product", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "legal product owner", "direct buyer/seller contract", "distribution path", "units", "foundry", "package/OSAT" ], "source_ids": [ "src-dd-mobile-001", "src-dd-mobile-002", "src-dd-mobile-003", "src-dd-mobile-005", "src-dd-mobile-006" ] } ] }, { "claim_ids": [ "clm-relationship-empyrean-polas-willsemi" ], "commercial_state": "adopted", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-empyrean", "id": "rel-empyrean-polas-willsemi", "last_checked": "2026-07-29", "process_step": "power-IC reliability analysis", "product_id": "prod-empyrean-polas", "qualification_state": "integrated_into_design_process_vendor_reported", "quantity": null, "record_type": "relationship", "relationship_id": "rel-empyrean-polas-willsemi", "relationship_type": "supports", "source_ids": [ "src-empyrean-polas-willsemi-2022" ], "start_date": "2022-06-29", "to_entity_id": "ent-willsemi", "unit": null, "unknowns": [ "contract", "seat count", "chip SKU", "foundry", "PDK", "volume" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "7a54732466b8723c09ea0574b57bee8d42b7ba63aca1a0f5eaa06219fd1e911e", "stage_ids": [ "eda", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "process_step", "value": "power-IC reliability analysis" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "process_step", "value": "power-IC reliability analysis" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "power-IC reliability analysis" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-empyrean-polas-willsemi-2022", "title": "Empyrean Polas® Assists Willsemi in IC Design Reliability", "publisher": "Empyrean Technology Co., Ltd.", "url": "https://www.empyrean-tech.com/article/item-182.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2022-06-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-side announcement; contract, seats, chip SKU, foundry, PDK and production volume are undisclosed." ] } ], "relationship_semantics": { "class": "compatibility_or_support_not_supplier", "boundary": "Support or compatibility is not a supplier, procurement, manufacturing, ownership, or deployment relationship." }, "from_entity_reference": { "entity_id": "ent-empyrean", "record_level": "company", "canonical_legal_name_en": "Empyrean Technology Co., Ltd.", "canonical_legal_name_cn": "北京华大九天科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-willsemi", "record_level": "company", "canonical_legal_name_en": "OmniVision Integrated Circuits Group, Inc.", "canonical_legal_name_cn": "豪威集成电路（集团）股份有限公司", "identity_resolution_state": "current_issuer_identity_closed_former_name_routed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-empyrean-polas-willsemi", "predicate": "supports", "scope": "edge from ent-empyrean to ent-willsemi; commercial state adopted; qualification state integrated_into_design_process_vendor_reported", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "contract", "seat count", "chip SKU", "foundry", "PDK", "volume" ], "source_ids": [ "src-empyrean-polas-willsemi-2022" ] } ] }, { "claim_ids": [ "clm-relationship-gentech-owns-hanjing" ], "commercial_state": "subsidiary", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-gentech", "id": "rel-gentech-owns-hanjing", "last_checked": "2026-07-29", "process_step": null, "product_id": "prod-hanjing-quartz-sic-components", "qualification_state": "not_applicable", "quantity": null, "record_type": "relationship", "relationship_id": "rel-gentech-owns-hanjing", "relationship_type": "owns", "source_ids": [ "src-gentech-annual-2025" ], "start_date": null, "to_entity_id": "ent-hanjing", "unit": null, "unknowns": [], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "94e2c9b7187b3b26d81265d17b79da3ae45d9d70ed977554441338265bcfd650", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-gentech", "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-hanjing", "record_level": "company", "canonical_legal_name_en": "Liaoning Hanjing Semiconductor Materials Co., Ltd.", "canonical_legal_name_cn": "辽宁汉京半导体材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-gentech-owns-hanjing", "predicate": "owns", "scope": "edge from ent-gentech to ent-hanjing; commercial state subsidiary; qualification state not_applicable", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [], "source_ids": [ "src-gentech-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-gentech-supplies-amec" ], "commercial_state": "batch_supply", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-gentech", "id": "rel-gentech-supplies-amec", "last_checked": "2026-07-29", "process_step": "equipment gas and chemical delivery subsystem", "product_id": "prod-gentech-gas-chemical-box", "qualification_state": "validated_vendor_reported", "quantity": null, "record_type": "relationship", "relationship_id": "rel-gentech-supplies-amec", "relationship_type": "supplies", "source_ids": [ "src-gentech-annual-2025" ], "start_date": null, "to_entity_id": "ent-amec", "unit": null, "unknowns": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "d2e12db492e76bc4edf29e52e9f423d97d2078dc9d4ee221bb3a583d0e2f5769", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "equipment gas and chemical delivery subsystem" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "equipment gas and chemical delivery subsystem" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-gentech", "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-amec", "record_level": "company", "canonical_legal_name_en": "Advanced Micro-Fabrication Equipment Inc. China", "canonical_legal_name_cn": "中微半导体设备（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-gentech-supplies-amec", "predicate": "supplies", "scope": "edge from ent-gentech to ent-amec; commercial state batch_supply; qualification state validated_vendor_reported", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "source_ids": [ "src-gentech-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-gentech-supplies-leadmicro" ], "commercial_state": "batch_supply", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-gentech", "id": "rel-gentech-supplies-leadmicro", "last_checked": "2026-07-29", "process_step": "equipment gas and chemical delivery subsystem", "product_id": "prod-gentech-gas-chemical-box", "qualification_state": "validated_vendor_reported", "quantity": null, "record_type": "relationship", "relationship_id": "rel-gentech-supplies-leadmicro", "relationship_type": "supplies", "source_ids": [ "src-gentech-annual-2025" ], "start_date": null, "to_entity_id": "ent-leadmicro", "unit": null, "unknowns": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "5756ebcf09a05ee2ae4ed93bc1982b4c6d27b8918eadb81937eb6515cc78c850", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "equipment gas and chemical delivery subsystem" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "equipment gas and chemical delivery subsystem" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-gentech", "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-leadmicro", "record_level": "company", "canonical_legal_name_en": "Jiangsu Leadmicro Nano Technology Co., Ltd.", "canonical_legal_name_cn": "江苏微导纳米科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-gentech-supplies-leadmicro", "predicate": "supplies", "scope": "edge from ent-gentech to ent-leadmicro; commercial state batch_supply; qualification state validated_vendor_reported", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "source_ids": [ "src-gentech-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-gentech-supplies-naura" ], "commercial_state": "batch_supply", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-gentech", "id": "rel-gentech-supplies-naura", "last_checked": "2026-07-29", "process_step": "equipment gas and chemical delivery subsystem", "product_id": "prod-gentech-gas-chemical-box", "qualification_state": "validated_vendor_reported", "quantity": null, "record_type": "relationship", "relationship_id": "rel-gentech-supplies-naura", "relationship_type": "supplies", "source_ids": [ "src-gentech-annual-2025" ], "start_date": null, "to_entity_id": "ent-naura", "unit": null, "unknowns": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "9a44b6de0eb843ff24593ea73a6f169c80ffd4771dd5bf5c69f331e65711d1dc", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "equipment gas and chemical delivery subsystem" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "equipment gas and chemical delivery subsystem" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-gentech", "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-gentech-supplies-naura", "predicate": "supplies", "scope": "edge from ent-gentech to ent-naura; commercial state batch_supply; qualification state validated_vendor_reported", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "source_ids": [ "src-gentech-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-gentech-supplies-piotech" ], "commercial_state": "batch_supply", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-gentech", "id": "rel-gentech-supplies-piotech", "last_checked": "2026-07-29", "process_step": "equipment gas and chemical delivery subsystem", "product_id": "prod-gentech-gas-chemical-box", "qualification_state": "validated_vendor_reported", "quantity": null, "record_type": "relationship", "relationship_id": "rel-gentech-supplies-piotech", "relationship_type": "supplies", "source_ids": [ "src-gentech-annual-2025" ], "start_date": null, "to_entity_id": "ent-piotech", "unit": null, "unknowns": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "34b1c3fab9779ecb047397cc4fd79ad0cf94e8e5377e97235b58b931bd66c472", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "equipment gas and chemical delivery subsystem" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "equipment gas and chemical delivery subsystem" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-gentech", "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-gentech-supplies-piotech", "predicate": "supplies", "scope": "edge from ent-gentech to ent-piotech; commercial state batch_supply; qualification state validated_vendor_reported", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "source_ids": [ "src-gentech-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-gentech-supplies-sicarrier" ], "commercial_state": "batch_supply", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-gentech", "id": "rel-gentech-supplies-sicarrier", "last_checked": "2026-07-29", "process_step": "equipment gas and chemical delivery subsystem", "product_id": "prod-gentech-gas-chemical-box", "qualification_state": "validated_vendor_reported", "quantity": null, "record_type": "relationship", "relationship_id": "rel-gentech-supplies-sicarrier", "relationship_type": "supplies", "source_ids": [ "src-gentech-annual-2025" ], "start_date": null, "to_entity_id": "ent-sicarrier", "unit": null, "unknowns": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "7b1a38be2b7f5d2391d807a9b5776d45d2d0542e5804ce3c386755741f00a632", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "equipment gas and chemical delivery subsystem" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "equipment gas and chemical delivery subsystem" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-gentech", "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-sicarrier", "record_level": "company", "canonical_legal_name_en": "Shenzhen SiCarrier Technologies Co., Ltd.", "canonical_legal_name_cn": "深圳市新凯来技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-gentech-supplies-sicarrier", "predicate": "supplies", "scope": "edge from ent-gentech to ent-sicarrier; commercial state batch_supply; qualification state validated_vendor_reported", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "source_ids": [ "src-gentech-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-gentech-supplies-xinye-shidai-chemical-system-2025" ], "commercial_state": "procurement_award", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-xinye-shidai-8in", "from_entity_id": "ent-gentech", "id": "rel-gentech-supplies-xinye-shidai-chemical-system-2025", "last_checked": "2026-07-29", "process_step": "fab chemical-delivery system construction", "product_id": null, "qualification_state": "unknown", "quantity": 28980000, "record_type": "relationship", "relationship_id": "rel-gentech-supplies-xinye-shidai-chemical-system-2025", "relationship_type": "supplies", "source_ids": [ "src-xinye-shidai-chemical-system-award-2025" ], "start_date": "2025-03-25", "to_entity_id": "ent-xinye-shidai", "unit": "CNY_award_value", "unknowns": [ "exact system BOM", "chemical species", "delivery", "installation", "site acceptance", "operating state", "recurring service" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "8c437fb9721a8455db4dec74058d14214a44e41283bf36b8da6a1661800082f2", "stage_ids": [ "critical_materials", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "fab chemical-delivery system construction" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "process_step", "value": "fab chemical-delivery system construction" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "fab chemical-delivery system construction" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-xinye-shidai-chemical-system-award-2025", "title": "陕西电子芯业时代科技有限公司8英寸高性能特色工艺半导体芯片生产线项目化学品系统建设项目-中标结果公示", "publisher": "陕西省采购招标有限责任公司采购招标网", "url": "https://www.sxcgzb.com/portal/notice/detail/id/3500.html", "source_type": "official_procurement_award", "primary_status": "primary", "publication_date": "2025-03-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Award proves endpoints, project scope and price only; delivery, installation, commissioning, site acceptance and operation are unknown." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-gentech", "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-xinye-shidai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "陕西电子芯业时代科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-gentech-supplies-xinye-shidai-chemical-system-2025", "predicate": "supplies", "scope": "edge from ent-gentech to ent-xinye-shidai; commercial state procurement_award; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact system BOM", "chemical species", "delivery", "installation", "site acceptance", "operating state", "recurring service" ], "source_ids": [ "src-xinye-shidai-chemical-system-award-2025" ] } ] }, { "claim_ids": [ "clm-relationship-gentech-supplies-yitang" ], "commercial_state": "batch_supply", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-gentech", "id": "rel-gentech-supplies-yitang", "last_checked": "2026-07-29", "process_step": "equipment gas and chemical delivery subsystem", "product_id": "prod-gentech-gas-chemical-box", "qualification_state": "validated_vendor_reported", "quantity": null, "record_type": "relationship", "relationship_id": "rel-gentech-supplies-yitang", "relationship_type": "supplies", "source_ids": [ "src-gentech-annual-2025" ], "start_date": null, "to_entity_id": "ent-yitang", "unit": null, "unknowns": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "53ef0bb7a1f00c49af80d76c5835f1d1132183ef5baf6b0420d32a2fb4709c43", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "equipment gas and chemical delivery subsystem" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "equipment gas and chemical delivery subsystem" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-gentech", "record_level": "company", "canonical_legal_name_en": "Shanghai Gentech Co., Ltd.", "canonical_legal_name_cn": "上海正帆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-yitang", "record_level": "company", "canonical_legal_name_en": "Beijing E-Town Semiconductor Technology Co., Ltd.", "canonical_legal_name_cn": "北京屹唐半导体科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-gentech-supplies-yitang", "predicate": "supplies", "scope": "edge from ent-gentech to ent-yitang; commercial state batch_supply; qualification state validated_vendor_reported", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "source_ids": [ "src-gentech-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-gigadevice-buys-cxmt-dram" ], "commercial_state": "recurring_related_party_transaction", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-gigadevice", "id": "rel-gigadevice-buys-cxmt-dram", "last_checked": "2026-07-29", "process_step": "foundry-produced DRAM-related products", "product_id": null, "qualification_state": "volume_production", "quantity": null, "record_type": "relationship", "relationship_id": "rel-gigadevice-buys-cxmt-dram", "relationship_type": "buys", "source_ids": [ "src-gigadevice-cxmt-2026" ], "start_date": "2021-01-01", "to_entity_id": "ent-cxmt-corp", "unit": null, "unknowns": [ "exact die", "process generation", "fab", "actual volume", "yield" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "1df9eed0ecc588c646987313d9da444728cb5e11048088036e0aa2a73feae338", "stage_ids": [ "logic_foundry_process", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_step", "value": "foundry-produced DRAM-related products" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_step", "value": "foundry-produced DRAM-related products" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "foundry-produced DRAM-related products" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gigadevice-cxmt-2026", "title": "兆易创新关于2026年上半年度日常关联交易预计额度的公告", "publisher": "兆易创新科技集团股份有限公司", "url": "https://money.finance.sina.com.cn/corp/view/vCB_AllBulletinDetail.php?id=11930272&stockid=603986", "source_type": "exchange_filing_mirror", "primary_status": "primary", "publication_date": "2026-01-23", "date_checked": "2026-07-29", "access_state": "open_mirror", "limitations": [ "Primary listed-company announcement accessed through a mirror; exact die, fab, process, volume, price and qualification are undisclosed." ] } ], "relationship_semantics": { "class": "buyer_or_procurement", "boundary": "The canonical relationship explicitly records buying at the named scope. It does not expand to unnamed products, facilities, quantities, or production use." }, "from_entity_reference": { "entity_id": "ent-gigadevice", "record_level": "company", "canonical_legal_name_en": "GigaDevice Semiconductor Inc.", "canonical_legal_name_cn": "兆易创新科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-gigadevice-buys-cxmt-dram", "predicate": "buys", "scope": "edge from ent-gigadevice to ent-cxmt-corp; commercial state recurring_related_party_transaction; qualification state volume_production", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact die", "process generation", "fab", "actual volume", "yield" ], "source_ids": [ "src-gigadevice-cxmt-2026" ] } ] }, { "claim_ids": [ "clm-relationship-gloway-integrates-cxmt-dram" ], "commercial_state": "historical_named_product_bom", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-gloway-brand", "id": "rel-gloway-integrates-cxmt-dram", "last_checked": "2026-07-29", "process_step": "DRAM module", "product_id": "prod-gloway-yi-pro-2020", "qualification_state": "product_page", "quantity": null, "record_type": "relationship", "relationship_id": "rel-gloway-integrates-cxmt-dram", "relationship_type": "integrates", "source_ids": [ "src-gloway-cxmt-yipro" ], "start_date": "2020", "to_entity_id": "ent-cxmt-corp", "unit": null, "unknowns": [ "exact SKU", "volume", "current status", "legal brand owner" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "2588402cc382bca730e641d840003221b721d085659c7223cd8a2020d380fff2", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_step", "value": "DRAM module" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "DRAM module" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gloway-cxmt-yipro", "title": "光威品牌发展历程", "publisher": "嘉合劲威", "url": "https://www.gloway.com.cn/pages_29/", "source_type": "company_brand_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Brand history does not quantify SKU-level volumes, current authorization, or all BOM components." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-gloway-brand", "record_level": "brand", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "to_entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-gloway-integrates-cxmt-dram", "predicate": "integrates", "scope": "edge from ent-gloway-brand to ent-cxmt-corp; commercial state historical_named_product_bom; qualification state product_page", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact SKU", "volume", "current status", "legal brand owner" ], "source_ids": [ "src-gloway-cxmt-yipro" ] } ] }, { "claim_ids": [ "clm-relationship-great-wall-n90pro-integrates-houmo-m50" ], "commercial_state": "vendor_reports_named_notebook_integration", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-china-great-wall", "id": "rel-great-wall-n90pro-integrates-houmo-m50", "last_checked": "2026-07-29", "process_step": "AI notebook acceleration", "product_id": "prod-houmo-m50", "qualification_state": "unknown", "quantity": null, "record_type": "relationship", "relationship_id": "rel-great-wall-n90pro-integrates-houmo-m50", "relationship_type": "integrates", "source_ids": [ "src-houmo-m50-greatwall-20260531" ], "start_date": "2026-05-31", "to_entity_id": "ent-houmo", "unit": null, "unknowns": [ "customer-origin product page", "contract", "units", "retail shipments", "acceptance", "field reliability" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "d6908b22184f9e9911e2db9c9fca7fd20a3df43b196d465d4bcf9e3f30e0c994", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "AI notebook acceleration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-houmo-m50-greatwall-20260531", "title": "长城N90 Pro AI笔记本搭载后摩M50", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/1/47/NewsDetails.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2026-05-31", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Direct buying entity, contract, units, retail shipments, acceptance and field reliability are undisclosed." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-china-great-wall", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "中国长城科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-houmo", "record_level": "company", "canonical_legal_name_en": "PostMoore Technology Co., Ltd.", "canonical_legal_name_cn": "后摩智能科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-great-wall-n90pro-integrates-houmo-m50", "predicate": "integrates", "scope": "edge from ent-china-great-wall to ent-houmo; commercial state vendor_reports_named_notebook_integration; qualification state unknown", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "customer-origin product page", "contract", "units", "retail shipments", "acceptance", "field reliability" ], "source_ids": [ "src-houmo-m50-greatwall-20260531" ] } ] }, { "claim_ids": [ "clm-relationship-h3c-r4930g3-integrates-hygon7000" ], "commercial_state": "official_product", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-h3c-technologies", "id": "rel-h3c-r4930g3-integrates-hygon7000", "last_checked": "2026-07-29", "process_step": "R4930 G3 server system integration", "product_id": "prod-hygon-7000-series", "qualification_state": "vendor_manufactured_product", "quantity": 2, "record_type": "relationship", "relationship_id": "rel-h3c-r4930g3-integrates-hygon7000", "relationship_type": "integrates", "source_ids": [ "src-h3c-r4930g3-product" ], "start_date": null, "to_entity_id": "ent-hygon-brand-endpoint-unresolved", "unit": "processors_per_server", "unknowns": [ "supply contract", "CPU SKU", "shipments", "customer", "factory", "installed base" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "fc947f537c7ab36f3cff122a2025f42a82a621cebb4948d83f9728dcab5a4fad", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "R4930 G3 server system integration" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "R4930 G3 server system integration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-h3c-r4930g3-product", "title": "搭载海光二号的双路服务器H3C UniServer R4930 G3", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/Products_And_Solution/Server/H3C/Products/RackServer/Products_Series/Dualway_Server/R4930_G3/", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No exact factory/address, processor SKU by configuration, shipment, customer, installed base, capacity or reliability receipt.", "The all-domestic wording lacks a component-level BOM and origin record." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-h3c-technologies", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "新华三技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-hygon-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-h3c-r4930g3-integrates-hygon7000", "predicate": "integrates", "scope": "edge from ent-h3c-technologies to ent-hygon-brand-endpoint-unresolved; commercial state official_product; qualification state vendor_manufactured_product", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "supply contract", "CPU SKU", "shipments", "customer", "factory", "installed base" ], "source_ids": [ "src-h3c-r4930g3-product" ] } ] }, { "claim_ids": [ "clm-relationship-h3c-supports-biren104p-bios574" ], "commercial_state": "firmware_option_adaptation", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-h3c-technologies", "id": "rel-h3c-supports-biren104p-bios574", "last_checked": "2026-07-29", "process_step": "Biren 104P firmware option support", "product_id": "prod-h3c-h65-bios-574", "qualification_state": "unknown", "quantity": null, "record_type": "relationship", "relationship_id": "rel-h3c-supports-biren104p-bios574", "relationship_type": "supports", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "start_date": "2023-08-04", "to_entity_id": "ent-biren-brand-endpoint-unresolved", "unit": null, "unknowns": [ "configured server SKU", "order", "shipment", "validation", "installation", "customer", "volume" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "054f1e2bd4533f5fe042341e5277695109798aeaaaf7d8653dd088fb3717c099", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "process_step", "value": "Biren 104P firmware option support" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "Biren 104P firmware option support" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-h3c-h65-bios-574-20230804", "title": "H3C H65-BIOS-5.74版本说明书", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202308/1903077_30005_0.htm", "source_type": "official_firmware_release_notes", "primary_status": "primary", "publication_date": "2023-08-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Firmware adaptation/support is not a purchase, configured commercial SKU, order, shipment, installation or external qualification.", "The signed binary is named with MD5 eea6fa3e3dc6f629ee8fdaa78932627c; it was not locally archived." ] } ], "relationship_semantics": { "class": "compatibility_or_support_not_supplier", "boundary": "Support or compatibility is not a supplier, procurement, manufacturing, ownership, or deployment relationship." }, "from_entity_reference": { "entity_id": "ent-h3c-technologies", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "新华三技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-biren-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Shanghai Biren Technology Co., Ltd.", "canonical_legal_name_cn": "上海壁仞科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-h3c-supports-biren104p-bios574", "predicate": "supports", "scope": "edge from ent-h3c-technologies to ent-biren-brand-endpoint-unresolved; commercial state firmware_option_adaptation; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "configured server SKU", "order", "shipment", "validation", "installation", "customer", "volume" ], "source_ids": [ "src-h3c-h65-bios-574-20230804" ] } ] }, { "claim_ids": [ "clm-relationship-h3c-supports-cambricon-options-bios574" ], "commercial_state": "firmware_option_adaptation", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-h3c-technologies", "id": "rel-h3c-supports-cambricon-options-bios574", "last_checked": "2026-07-29", "process_step": "MLU370-X4 and MLU370-S4 firmware option support with Hygon CPUs", "product_id": "prod-h3c-h65-bios-574", "qualification_state": "unknown", "quantity": null, "record_type": "relationship", "relationship_id": "rel-h3c-supports-cambricon-options-bios574", "relationship_type": "supports", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "start_date": "2023-08-04", "to_entity_id": "ent-cambricon-brand-endpoint-unresolved", "unit": null, "unknowns": [ "configured server SKU", "order", "shipment", "validation", "installation", "customer", "volume" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "cae1bd27f9a0697d9b089f85dfe60f70da732d3e8416c0e62e659531b0392382", "stage_ids": [ "architecture_ip", "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "process_step", "value": "MLU370-X4 and MLU370-S4 firmware option support with Hygon CPUs" } ] }, { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "process_step", "value": "MLU370-X4 and MLU370-S4 firmware option support with Hygon CPUs" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "MLU370-X4 and MLU370-S4 firmware option support with Hygon CPUs" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-h3c-h65-bios-574-20230804", "title": "H3C H65-BIOS-5.74版本说明书", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202308/1903077_30005_0.htm", "source_type": "official_firmware_release_notes", "primary_status": "primary", "publication_date": "2023-08-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Firmware adaptation/support is not a purchase, configured commercial SKU, order, shipment, installation or external qualification.", "The signed binary is named with MD5 eea6fa3e3dc6f629ee8fdaa78932627c; it was not locally archived." ] } ], "relationship_semantics": { "class": "compatibility_or_support_not_supplier", "boundary": "Support or compatibility is not a supplier, procurement, manufacturing, ownership, or deployment relationship." }, "from_entity_reference": { "entity_id": "ent-h3c-technologies", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "新华三技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-cambricon-brand-endpoint-unresolved", "record_level": "company", "canonical_legal_name_en": "Cambricon Technologies Corporation Limited", "canonical_legal_name_cn": "中科寒武纪科技股份有限公司", "identity_resolution_state": "resolved_to_legal_entity", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-h3c-supports-cambricon-options-bios574", "predicate": "supports", "scope": "edge from ent-h3c-technologies to ent-cambricon-brand-endpoint-unresolved; commercial state firmware_option_adaptation; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "configured server SKU", "order", "shipment", "validation", "installation", "customer", "volume" ], "source_ids": [ "src-h3c-h65-bios-574-20230804" ] } ] }, { "claim_ids": [ "clm-relationship-h3c-supports-cxmt-memory-option-bios574" ], "commercial_state": "firmware_option_adaptation", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-h3c-technologies", "id": "rel-h3c-supports-cxmt-memory-option-bios574", "last_checked": "2026-07-29", "process_step": "CXMQ3A4MA4GR7-CJ1-A_NEW memory option support", "product_id": "prod-h3c-h65-bios-574", "qualification_state": "unknown", "quantity": null, "record_type": "relationship", "relationship_id": "rel-h3c-supports-cxmt-memory-option-bios574", "relationship_type": "supports", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "start_date": "2023-08-04", "to_entity_id": "ent-cxmt-corp", "unit": null, "unknowns": [ "module legal manufacturer", "DRAM die/BOM", "configured SKU", "order", "shipment", "installation", "customer", "volume" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "c2f3ec7effb57b5fd04cc0acb11a5ec8013df3fe985da0e3653027295e6dc427", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_step", "value": "CXMQ3A4MA4GR7-CJ1-A_NEW memory option support" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "CXMQ3A4MA4GR7-CJ1-A_NEW memory option support" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-h3c-h65-bios-574-20230804", "title": "H3C H65-BIOS-5.74版本说明书", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202308/1903077_30005_0.htm", "source_type": "official_firmware_release_notes", "primary_status": "primary", "publication_date": "2023-08-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Firmware adaptation/support is not a purchase, configured commercial SKU, order, shipment, installation or external qualification.", "The signed binary is named with MD5 eea6fa3e3dc6f629ee8fdaa78932627c; it was not locally archived." ] } ], "relationship_semantics": { "class": "compatibility_or_support_not_supplier", "boundary": "Support or compatibility is not a supplier, procurement, manufacturing, ownership, or deployment relationship." }, "from_entity_reference": { "entity_id": "ent-h3c-technologies", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "新华三技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-h3c-supports-cxmt-memory-option-bios574", "predicate": "supports", "scope": "edge from ent-h3c-technologies to ent-cxmt-corp; commercial state firmware_option_adaptation; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "module legal manufacturer", "DRAM die/BOM", "configured SKU", "order", "shipment", "installation", "customer", "volume" ], "source_ids": [ "src-h3c-h65-bios-574-20230804" ] } ] }, { "claim_ids": [ "clm-relationship-hanjing-supplies-huahong-group" ], "commercial_state": "stable_supply", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-hanjing", "id": "rel-hanjing-supplies-huahong-group", "last_checked": "2026-07-29", "process_step": "high-purity quartz or silicon-carbide equipment components", "product_id": "prod-hanjing-quartz-sic-components", "qualification_state": "validated_vendor_reported", "quantity": null, "record_type": "relationship", "relationship_id": "rel-hanjing-supplies-huahong-group", "relationship_type": "supplies", "source_ids": [ "src-gentech-annual-2025" ], "start_date": null, "to_entity_id": "ent-huahong-group", "unit": null, "unknowns": [ "component SKU", "receiving facility", "tool", "grade", "quantity" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "503ef1d7b68aedbf887c204f7ba83f81b5603badb938391db08acad8a9529015", "stage_ids": [ "wafer_equipment", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "high-purity quartz or silicon-carbide equipment components" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "high-purity quartz or silicon-carbide equipment components" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "high-purity quartz or silicon-carbide equipment components" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-gentech-annual-2025", "title": "上海正帆科技股份有限公司2025年年度报告", "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-hanjing", "record_level": "company", "canonical_legal_name_en": "Liaoning Hanjing Semiconductor Materials Co., Ltd.", "canonical_legal_name_cn": "辽宁汉京半导体材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-huahong-group", "record_level": "company", "canonical_legal_name_en": "Shanghai Huahong (Group) Co., Ltd.", "canonical_legal_name_cn": "上海华虹（集团）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-hanjing-supplies-huahong-group", "predicate": "supplies", "scope": "edge from ent-hanjing to ent-huahong-group; commercial state stable_supply; qualification state validated_vendor_reported", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "component SKU", "receiving facility", "tool", "grade", "quantity" ], "source_ids": [ "src-gentech-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-hengyunchang-supplies-amec" ], "commercial_state": "customer_revenue_reported", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-hengyunchang", "id": "rel-hengyunchang-supplies-amec", "last_checked": "2026-07-29", "process_step": "RF power in semiconductor equipment", "product_id": "prod-hengyunchang-rf-power", "qualification_state": "equipment_maker_validation_required", "quantity": null, "record_type": "relationship", "relationship_id": "rel-hengyunchang-supplies-amec", "relationship_type": "supplies", "source_ids": [ "src-hengyunchang-annual-2025" ], "start_date": null, "to_entity_id": "ent-amec", "unit": null, "unknowns": [ "SKU", "tool model", "fab", "qualified layer" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "2c2438575bbe4ee03df21bdd1c9bfea835192ca9fd0de4b11829a4aab49e1902", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "RF power in semiconductor equipment" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "RF power in semiconductor equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hengyunchang-annual-2025", "title": "深圳市恒运昌真空技术股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688785_20260428_AVJI.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer-reported customer revenue does not identify the receiving fab, tool model, layer, or exact accepted component SKU." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-hengyunchang", "record_level": "company", "canonical_legal_name_en": "Shenzhen Hengyunchang Vacuum Technology Co., Ltd.", "canonical_legal_name_cn": "深圳市恒运昌真空技术股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-amec", "record_level": "company", "canonical_legal_name_en": "Advanced Micro-Fabrication Equipment Inc. China", "canonical_legal_name_cn": "中微半导体设备（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-hengyunchang-supplies-amec", "predicate": "supplies", "scope": "edge from ent-hengyunchang to ent-amec; commercial state customer_revenue_reported; qualification state equipment_maker_validation_required", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "SKU", "tool model", "fab", "qualified layer" ], "source_ids": [ "src-hengyunchang-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-hengyunchang-supplies-leadmicro" ], "commercial_state": "named_customer", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-hengyunchang", "id": "rel-hengyunchang-supplies-leadmicro", "last_checked": "2026-07-29", "process_step": "RF power in semiconductor equipment", "product_id": "prod-hengyunchang-rf-power", "qualification_state": "equipment_maker_validation_required", "quantity": null, "record_type": "relationship", "relationship_id": "rel-hengyunchang-supplies-leadmicro", "relationship_type": "supplies", "source_ids": [ "src-hengyunchang-annual-2025" ], "start_date": null, "to_entity_id": "ent-leadmicro", "unit": null, "unknowns": [ "SKU", "tool model", "fab", "qualified layer", "revenue scope" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "f00aeb76c704c56fa9f8336620a7c778245ba81cf4c7daa870463eaece2e4c3d", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "RF power in semiconductor equipment" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "RF power in semiconductor equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hengyunchang-annual-2025", "title": "深圳市恒运昌真空技术股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688785_20260428_AVJI.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer-reported customer revenue does not identify the receiving fab, tool model, layer, or exact accepted component SKU." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-hengyunchang", "record_level": "company", "canonical_legal_name_en": "Shenzhen Hengyunchang Vacuum Technology Co., Ltd.", "canonical_legal_name_cn": "深圳市恒运昌真空技术股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-leadmicro", "record_level": "company", "canonical_legal_name_en": "Jiangsu Leadmicro Nano Technology Co., Ltd.", "canonical_legal_name_cn": "江苏微导纳米科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-hengyunchang-supplies-leadmicro", "predicate": "supplies", "scope": "edge from ent-hengyunchang to ent-leadmicro; commercial state named_customer; qualification state equipment_maker_validation_required", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "SKU", "tool model", "fab", "qualified layer", "revenue scope" ], "source_ids": [ "src-hengyunchang-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-hengyunchang-supplies-naura" ], "commercial_state": "customer_revenue_reported", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-hengyunchang", "id": "rel-hengyunchang-supplies-naura", "last_checked": "2026-07-29", "process_step": "RF power in semiconductor equipment", "product_id": "prod-hengyunchang-rf-power", "qualification_state": "equipment_maker_validation_required", "quantity": null, "record_type": "relationship", "relationship_id": "rel-hengyunchang-supplies-naura", "relationship_type": "supplies", "source_ids": [ "src-hengyunchang-annual-2025" ], "start_date": null, "to_entity_id": "ent-naura", "unit": null, "unknowns": [ "SKU", "tool model", "fab", "qualified layer" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "1ea86d84f3bc301d0ab372ccabc90ff3a2afc1f9eb3178816aac39a2d4ddba20", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "RF power in semiconductor equipment" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "RF power in semiconductor equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hengyunchang-annual-2025", "title": "深圳市恒运昌真空技术股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688785_20260428_AVJI.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer-reported customer revenue does not identify the receiving fab, tool model, layer, or exact accepted component SKU." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-hengyunchang", "record_level": "company", "canonical_legal_name_en": "Shenzhen Hengyunchang Vacuum Technology Co., Ltd.", "canonical_legal_name_cn": "深圳市恒运昌真空技术股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-naura", "record_level": "company", "canonical_legal_name_en": "NAURA Technology Group Co., Ltd.", "canonical_legal_name_cn": "北方华创科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-hengyunchang-supplies-naura", "predicate": "supplies", "scope": "edge from ent-hengyunchang to ent-naura; commercial state customer_revenue_reported; qualification state equipment_maker_validation_required", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "SKU", "tool model", "fab", "qualified layer" ], "source_ids": [ "src-hengyunchang-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-hengyunchang-supplies-piotech" ], "commercial_state": "customer_revenue_reported", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-hengyunchang", "id": "rel-hengyunchang-supplies-piotech", "last_checked": "2026-07-29", "process_step": "RF power in semiconductor equipment", "product_id": "prod-hengyunchang-rf-power", "qualification_state": "equipment_maker_validation_required", "quantity": null, "record_type": "relationship", "relationship_id": "rel-hengyunchang-supplies-piotech", "relationship_type": "supplies", "source_ids": [ "src-hengyunchang-annual-2025" ], "start_date": null, "to_entity_id": "ent-piotech", "unit": null, "unknowns": [ "SKU", "tool model", "fab", "qualified layer" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "0cb802bbc9e12755aeb8c0d6d4c87e21b747e0cbb99adb3d21001659d2ebbab2", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "RF power in semiconductor equipment" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "RF power in semiconductor equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hengyunchang-annual-2025", "title": "深圳市恒运昌真空技术股份有限公司2025年年度报告", "publisher": "上海证券交易所", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688785_20260428_AVJI.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer-reported customer revenue does not identify the receiving fab, tool model, layer, or exact accepted component SKU." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-hengyunchang", "record_level": "company", "canonical_legal_name_en": "Shenzhen Hengyunchang Vacuum Technology Co., Ltd.", "canonical_legal_name_cn": "深圳市恒运昌真空技术股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-hengyunchang-supplies-piotech", "predicate": "supplies", "scope": "edge from ent-hengyunchang to ent-piotech; commercial state customer_revenue_reported; qualification state equipment_maker_validation_required", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "SKU", "tool model", "fab", "qualified layer" ], "source_ids": [ "src-hengyunchang-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-hermle-guowang-five-axis-award-2022" ], "commercial_state": "procurement_award", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-guowang-exposure-optics-base", "from_entity_id": "ent-hermle", "id": "rel-hermle-guowang-five-axis-award-2022", "last_checked": "2026-07-29", "process_step": "precision machining support for exposure-optics production; exact part/task undisclosed", "product_id": null, "qualification_state": "unknown", "quantity": 2, "record_type": "relationship", "relationship_id": "rel-hermle-guowang-five-axis-award-2022", "relationship_type": "supplies", "source_ids": [ "src-guowang-hermle-award-2022" ], "start_date": "2022-06-09", "to_entity_id": "ent-guowang-optics", "unit": "five_axis_vertical_machining_centres", "unknowns": [ "delivery", "installation", "acceptance", "current use", "exact optical part", "service", "spares", "domestic substitute" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "a88f81a4342803cb60cfddee9c6fde247bbaade15897eed2e50f74567e653dce", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "process_step", "value": "precision machining support for exposure-optics production; exact part/task undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "precision machining support for exposure-optics production; exact part/task undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-guowang-hermle-award-2022", "title": "北京国望光学科技有限公司五轴立式加工中心项目评标结果公告", "publisher": "商务部机电产品招标投标电子交易平台", "url": "https://chinabidding.mofcom.gov.cn/bidDetail/bidding/bulletin/202206/ff8080817d94c145018145fd60755ec2.html", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2022-06-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Award does not prove delivery, installation, acceptance, current use, the exact optical part processed, service route or spares." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-hermle", "record_level": "company", "canonical_legal_name_en": "Berthold Hermle AG", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-guowang-optics", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京国望光学科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-hermle-guowang-five-axis-award-2022", "predicate": "supplies", "scope": "edge from ent-hermle to ent-guowang-optics; commercial state procurement_award; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "delivery", "installation", "acceptance", "current use", "exact optical part", "service", "spares", "domestic substitute" ], "source_ids": [ "src-guowang-hermle-award-2022" ] } ] }, { "claim_ids": [ "clm-relationship-houmo-develops-h30-with-youkong" ], "commercial_state": "strategic_co_development_announcement", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-houmo", "id": "rel-houmo-develops-h30-with-youkong", "last_checked": "2026-07-29", "process_step": "automotive compute-in-memory solution development", "product_id": "prod-houmo-h30", "qualification_state": "engineering_prototype", "quantity": null, "record_type": "relationship", "relationship_id": "rel-houmo-develops-h30-with-youkong", "relationship_type": "develops", "source_ids": [ "src-houmo-h30-youkong-20231229" ], "start_date": "2023-12-29", "to_entity_id": "ent-youkong-zhixing-endpoint-unresolved", "unit": null, "unknowns": [ "counterparty legal entity", "contract", "vehicle program", "qualification", "SOP", "units", "field reliability" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "3b7511b30acdec212c49644045b9e1a37431409baeb8678859250d390ea136f5", "stage_ids": [ "architecture_ip", "memory_manufacturer", "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "process_step", "value": "automotive compute-in-memory solution development" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_step", "value": "automotive compute-in-memory solution development" } ] }, { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "automotive compute-in-memory solution development" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "automotive compute-in-memory solution development" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-houmo-h30-youkong-20231229", "title": "后摩智能与优控智行战略合作", "publisher": "后摩智能科技股份有限公司", "url": "https://www.houmoai.com/3/28/NewsDetails.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2023-12-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Counterparty legal entity, production vehicle, contract, units, foundry, memory and OSAT are undisclosed." ] } ], "relationship_semantics": { "class": "development", "boundary": "Development work does not prove a commercial product, supplier relationship, qualification, shipment, or volume production." }, "from_entity_reference": { "entity_id": "ent-houmo", "record_level": "company", "canonical_legal_name_en": "PostMoore Technology Co., Ltd.", "canonical_legal_name_cn": "后摩智能科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-youkong-zhixing-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-houmo-develops-h30-with-youkong", "predicate": "develops", "scope": "edge from ent-houmo to ent-youkong-zhixing-endpoint-unresolved; commercial state strategic_co_development_announcement; qualification state engineering_prototype", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "counterparty legal entity", "contract", "vehicle program", "qualification", "SOP", "units", "field reliability" ], "source_ids": [ "src-houmo-h30-youkong-20231229" ] } ] }, { "claim_ids": [ "clm-relationship-huate-owns-jiangxi" ], "commercial_state": "wholly_owned_subsidiary_at_2025_year_end", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-huate-gas", "id": "rel-huate-owns-jiangxi", "last_checked": "2026-07-29", "process_step": null, "product_id": null, "qualification_state": "not_applicable", "quantity": 100, "record_type": "relationship", "relationship_id": "rel-huate-owns-jiangxi", "relationship_type": "owns", "source_ids": [ "src-huate-gas-annual-2025" ], "start_date": null, "to_entity_id": "ent-huate-jiangxi", "unit": "percent_equity", "unknowns": [ "current registry status", "which material projects are operated by the subsidiary" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "fd2de3f73eb7f232c89d7d5577ccc53862b23b283b99a3b30880275bbda074c0", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-huate-gas", "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-huate-jiangxi", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "江西华特电子化学品有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-huate-owns-jiangxi", "predicate": "owns", "scope": "edge from ent-huate-gas to ent-huate-jiangxi; commercial state wholly_owned_subsidiary_at_2025_year_end; qualification state not_applicable", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "current registry status", "which material projects are operated by the subsidiary" ], "source_ids": [ "src-huate-gas-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-huate-supplies-smic-ningbo" ], "commercial_state": "supplier_award", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-huate-gas", "id": "rel-huate-supplies-smic-ningbo", "last_checked": "2026-07-29", "process_step": "electronic specialty gases", "product_id": null, "qualification_state": "supplier_award_vendor_reported_not_technical_qualification", "quantity": null, "record_type": "relationship", "relationship_id": "rel-huate-supplies-smic-ningbo", "relationship_type": "supplies", "source_ids": [ "src-huate-gas-annual-2025" ], "start_date": null, "to_entity_id": "ent-smic-ningbo", "unit": null, "unknowns": [ "customer-origin notice", "gas SKU", "fab/layer", "quantity", "current share" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "c858e9a536c244492b304dea92d838fe31e9e205c6877b27f1b48044b3ac39e4", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "electronic specialty gases" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "electronic specialty gases" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-huate-gas", "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-smic-ningbo", "record_level": "company", "canonical_legal_name_en": "SMIC Integrated Circuit (Ningbo) Co., Ltd.", "canonical_legal_name_cn": "中芯集成电路（宁波）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-huate-supplies-smic-ningbo", "predicate": "supplies", "scope": "edge from ent-huate-gas to ent-smic-ningbo; commercial state supplier_award; qualification state supplier_award_vendor_reported_not_technical_qualification", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "customer-origin notice", "gas SKU", "fab/layer", "quantity", "current share" ], "source_ids": [ "src-huate-gas-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-huate-tianyu-onsite-hydrogen-2025" ], "commercial_state": "named_project_in_construction_ledger", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-huate-gas", "id": "rel-huate-tianyu-onsite-hydrogen-2025", "last_checked": "2026-07-29", "process_step": "onsite hydrogen generation and semiconductor-facility gas supply", "product_id": "prod-huate-onsite-hydrogen-system", "qualification_state": "unknown", "quantity": 1500, "record_type": "relationship", "relationship_id": "rel-huate-tianyu-onsite-hydrogen-2025", "relationship_type": "supplies", "source_ids": [ "src-huate-gas-annual-2025" ], "start_date": null, "to_entity_id": "ent-guangdong-tianyu", "unit": "Nm3_per_hour_nameplate", "unknowns": [ "contracting Huate subsidiary", "site address", "contract date/value", "delivery", "installation", "commissioning", "acceptance", "actual flow", "uptime", "purity", "specific process" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "aa889a10d5ddb6c4ef58969e7f227412cd32da667f986134296a419ec8b8c3a0", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "process_step", "value": "onsite hydrogen generation and semiconductor-facility gas supply" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "onsite hydrogen generation and semiconductor-facility gas supply" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-huate-gas", "record_level": "company", "canonical_legal_name_en": "Guangdong Huate Gas Co., Ltd.", "canonical_legal_name_cn": "广东华特气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-guangdong-tianyu", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "广东天域半导体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-huate-tianyu-onsite-hydrogen-2025", "predicate": "supplies", "scope": "edge from ent-huate-gas to ent-guangdong-tianyu; commercial state named_project_in_construction_ledger; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "contracting Huate subsidiary", "site address", "contract date/value", "delivery", "installation", "commissioning", "acceptance", "actual flow", "uptime", "purity", "specific process" ], "source_ids": [ "src-huate-gas-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-huishan-center-integrates-mt-s5000" ], "commercial_state": "deployed_and_powered_on_government_reported", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_INDEPENDENT", "facility_id": "fac-wuxi-huishan-ai-compute-center-phase1", "from_entity_id": "ent-wuxi-huishan-ai-center-owner-unresolved", "id": "rel-huishan-center-integrates-mt-s5000", "last_checked": "2026-07-29", "process_step": "AI compute-center accelerator deployment", "product_id": "prod-moore-threads-s5000", "qualification_state": "installed", "quantity": ">2000", "record_type": "relationship", "relationship_id": "rel-huishan-center-integrates-mt-s5000", "relationship_type": "integrates", "source_ids": [ "src-huishan-mt-s5000-center-20260724" ], "start_date": "2026-06-30", "to_entity_id": "ent-moore-threads", "unit": "accelerator_cards", "unknowns": [ "legal owner/operator", "buyer", "contract", "serials", "site acceptance", "uptime", "utilization", "customer workloads" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "7759e58c753f38f720748b05200057cfd6fc60519c8773057b50bc6df016c4b1", "stage_ids": [ "architecture_ip", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "process_step", "value": "AI compute-center accelerator deployment" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "process_step", "value": "AI compute-center accelerator deployment" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "AI compute-center accelerator deployment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huishan-mt-s5000-center-20260724", "title": "无锡（惠山）人工智能算力中心一期点亮", "publisher": "惠山区人民政府办公室", "url": "https://www.huishan.gov.cn/doc/2026/07/24/4809561.shtml", "source_type": "government_project_record", "primary_status": "primary", "publication_date": "2026-07-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility legal owner/operator, direct buyer, contract, acceptance certificate, uptime and utilization are undisclosed.", "Powered-on/deployed does not by itself prove sustained production workload or service volume." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-wuxi-huishan-ai-center-owner-unresolved", "record_level": "unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "to_entity_reference": { "entity_id": "ent-moore-threads", "record_level": "company", "canonical_legal_name_en": "Moore Threads Technology Co., Ltd.", "canonical_legal_name_cn": "摩尔线程智能科技（北京）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-huishan-center-integrates-mt-s5000", "predicate": "integrates", "scope": "edge from ent-wuxi-huishan-ai-center-owner-unresolved to ent-moore-threads; commercial state deployed_and_powered_on_government_reported; qualification state installed", "evidence_state": "CONFIRMED_INDEPENDENT", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "legal owner/operator", "buyer", "contract", "serials", "site acceptance", "uptime", "utilization", "customer workloads" ], "source_ids": [ "src-huishan-mt-s5000-center-20260724" ] } ] }, { "claim_ids": [ "clm-relationship-hwatsing-supplies-cxmt" ], "commercial_state": "production_line_use_reported_at_group_portfolio_scope", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-hwatsing", "id": "rel-hwatsing-supplies-cxmt", "last_checked": "2026-07-29", "process_step": "CMP", "product_id": "prod-hwatsing-cmp-portfolio", "qualification_state": "exact_model_facility_layer_unresolved", "quantity": null, "record_type": "relationship", "relationship_id": "rel-hwatsing-supplies-cxmt", "relationship_type": "supplies", "source_ids": [ "src-hwatsing-inquiry-2021" ], "start_date": null, "to_entity_id": "ent-cxmt-corp", "unit": null, "unknowns": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "474f1abea9d05ea78e34732d3c172e3748e7fdc7f30f59e76e6b3a5e8755d421", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "CMP" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hwatsing-inquiry-2021", "title": "华海清科股份有限公司第二轮审核问询函回复", "publisher": "华海清科股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202102/000752_20210208_7AX3.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-02-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Aggregates models, customers and process capabilities; exact model/facility/layer qualification is not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-hwatsing", "record_level": "company", "canonical_legal_name_en": "Hwatsing Technology Co., Ltd.", "canonical_legal_name_cn": "华海清科股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-hwatsing-supplies-cxmt", "predicate": "supplies", "scope": "edge from ent-hwatsing to ent-cxmt-corp; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "source_ids": [ "src-hwatsing-inquiry-2021" ] } ] }, { "claim_ids": [ "clm-relationship-hwatsing-supplies-huahong" ], "commercial_state": "production_line_use_reported_at_group_portfolio_scope", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-hwatsing", "id": "rel-hwatsing-supplies-huahong", "last_checked": "2026-07-29", "process_step": "CMP", "product_id": "prod-hwatsing-cmp-portfolio", "qualification_state": "exact_model_facility_layer_unresolved", "quantity": null, "record_type": "relationship", "relationship_id": "rel-hwatsing-supplies-huahong", "relationship_type": "supplies", "source_ids": [ "src-hwatsing-inquiry-2021" ], "start_date": null, "to_entity_id": "ent-huahong-group", "unit": null, "unknowns": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "8f3f028be83191bc0940605b753789e5ad6ab71c3648480b9383f6581679c7b3", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "CMP" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hwatsing-inquiry-2021", "title": "华海清科股份有限公司第二轮审核问询函回复", "publisher": "华海清科股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202102/000752_20210208_7AX3.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-02-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Aggregates models, customers and process capabilities; exact model/facility/layer qualification is not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-hwatsing", "record_level": "company", "canonical_legal_name_en": "Hwatsing Technology Co., Ltd.", "canonical_legal_name_cn": "华海清科股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-huahong-group", "record_level": "company", "canonical_legal_name_en": "Shanghai Huahong (Group) Co., Ltd.", "canonical_legal_name_cn": "上海华虹（集团）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-hwatsing-supplies-huahong", "predicate": "supplies", "scope": "edge from ent-hwatsing to ent-huahong-group; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "source_ids": [ "src-hwatsing-inquiry-2021" ] } ] }, { "claim_ids": [ "clm-relationship-hwatsing-supplies-smic" ], "commercial_state": "production_line_use_reported_at_group_portfolio_scope", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-hwatsing", "id": "rel-hwatsing-supplies-smic", "last_checked": "2026-07-29", "process_step": "CMP", "product_id": "prod-hwatsing-cmp-portfolio", "qualification_state": "exact_model_facility_layer_unresolved", "quantity": null, "record_type": "relationship", "relationship_id": "rel-hwatsing-supplies-smic", "relationship_type": "supplies", "source_ids": [ "src-hwatsing-inquiry-2021" ], "start_date": null, "to_entity_id": "ent-smic", "unit": null, "unknowns": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "79dae8ca0431e681d855f648fcc9f729b07fd7a9eb2f88a2385930b06a09d9ad", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "CMP" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hwatsing-inquiry-2021", "title": "华海清科股份有限公司第二轮审核问询函回复", "publisher": "华海清科股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202102/000752_20210208_7AX3.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-02-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Aggregates models, customers and process capabilities; exact model/facility/layer qualification is not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-hwatsing", "record_level": "company", "canonical_legal_name_en": "Hwatsing Technology Co., Ltd.", "canonical_legal_name_cn": "华海清科股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-smic", "record_level": "company", "canonical_legal_name_en": "Semiconductor Manufacturing International Corporation", "canonical_legal_name_cn": "中芯国际集成电路制造有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-hwatsing-supplies-smic", "predicate": "supplies", "scope": "edge from ent-hwatsing to ent-smic; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "source_ids": [ "src-hwatsing-inquiry-2021" ] } ] }, { "claim_ids": [ "clm-relationship-hwatsing-supplies-ymtc" ], "commercial_state": "production_line_use_reported_at_group_portfolio_scope", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-hwatsing", "id": "rel-hwatsing-supplies-ymtc", "last_checked": "2026-07-29", "process_step": "CMP", "product_id": "prod-hwatsing-cmp-portfolio", "qualification_state": "exact_model_facility_layer_unresolved", "quantity": null, "record_type": "relationship", "relationship_id": "rel-hwatsing-supplies-ymtc", "relationship_type": "supplies", "source_ids": [ "src-hwatsing-inquiry-2021" ], "start_date": null, "to_entity_id": "ent-ymtc", "unit": null, "unknowns": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "6bc1b719e547d6ea2b2dbc69ee20500e92d71dd0cf3cb1ff38030fc28559e183", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "CMP" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-hwatsing-inquiry-2021", "title": "华海清科股份有限公司第二轮审核问询函回复", "publisher": "华海清科股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202102/000752_20210208_7AX3.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-02-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Aggregates models, customers and process capabilities; exact model/facility/layer qualification is not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-hwatsing", "record_level": "company", "canonical_legal_name_en": "Hwatsing Technology Co., Ltd.", "canonical_legal_name_cn": "华海清科股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-ymtc", "record_level": "company", "canonical_legal_name_en": "Yangtze Memory Technologies Co., Ltd.", "canonical_legal_name_cn": "长江存储科技有限责任公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-hwatsing-supplies-ymtc", "predicate": "supplies", "scope": "edge from ent-hwatsing to ent-ymtc; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "source_ids": [ "src-hwatsing-inquiry-2021" ] } ] }, { "claim_ids": [ "clm-relationship-iluvatar-supports-h3c-bi-v100-configurations" ], "commercial_state": "supported_configuration", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CORROBORATED", "facility_id": null, "from_entity_id": "ent-iluvatar", "id": "rel-iluvatar-supports-h3c-bi-v100-configurations", "last_checked": "2026-07-29", "process_step": "server hardware compatibility", "product_id": "prod-iluvatar-bi-v100-alias-unresolved", "qualification_state": "hardware_compatibility_certified", "quantity": null, "record_type": "relationship", "relationship_id": "rel-iluvatar-supports-h3c-bi-v100-configurations", "relationship_type": "supports", "source_ids": [ "src-iluvatar-compatibility", "src-h3c-iluvatar-r5300g6-202412", "src-h3c-iluvatar-server-202408" ], "start_date": null, "to_entity_id": "ent-h3c-technologies", "unit": null, "unknowns": [ "exact BI-V100/天数V100 alias equivalence", "purchase", "quantity", "production customer", "shipment", "installation", "acceptance", "exact start date" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "0daa263b6f07d1c0909b6f1b39a5e6c2800369e425b38c1847552670a4564d8c", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "server hardware compatibility" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "server hardware compatibility" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-iluvatar-compatibility", "title": "生态合作与适配认证", "publisher": "上海天数智芯半导体股份有限公司", "url": "https://www.iluvatar.com/cooperation/direct", "source_type": "official_compatibility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Compatibility does not prove purchase, quantity, shipment, installation or production use." ] }, { "source_id": "src-h3c-iluvatar-r5300g6-202412", "title": "H3C UniServer R5300 G6配置文档", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202412/2328144_30005_0.htm", "source_type": "customer_product_documentation", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page exposes month but no exact publication day.", "The document names 天数V100 rather than BI-V100 and does not prove purchase or deployment." ] }, { "source_id": "src-h3c-iluvatar-server-202408", "title": "H3C服务器配置文档", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202408/2255813_30005_0.htm", "source_type": "customer_product_documentation", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page exposes month but no exact publication day.", "Support documentation does not prove purchase, shipment or production use." ] } ], "relationship_semantics": { "class": "compatibility_or_support_not_supplier", "boundary": "Support or compatibility is not a supplier, procurement, manufacturing, ownership, or deployment relationship." }, "from_entity_reference": { "entity_id": "ent-iluvatar", "record_level": "company", "canonical_legal_name_en": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd.", "canonical_legal_name_cn": "上海天数智芯半导体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-h3c-technologies", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "新华三技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-iluvatar-supports-h3c-bi-v100-configurations", "predicate": "supports", "scope": "edge from ent-iluvatar to ent-h3c-technologies; commercial state supported_configuration; qualification state hardware_compatibility_certified", "evidence_state": "CORROBORATED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact BI-V100/天数V100 alias equivalence", "purchase", "quantity", "production customer", "shipment", "installation", "acceptance", "exact start date" ], "source_ids": [ "src-iluvatar-compatibility", "src-h3c-iluvatar-r5300g6-202412", "src-h3c-iluvatar-server-202408" ] } ] }, { "claim_ids": [ "clm-relationship-jcet-sells-unspecified-goods-cxmt-fy2025" ], "commercial_state": "related_party_sale_of_unspecified_goods_fy2025", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-jcet", "id": "rel-jcet-sells-unspecified-goods-cxmt-fy2025", "last_checked": "2026-07-29", "process_step": "unspecified goods; package/test/HBM scope not established", "product_id": null, "qualification_state": "unknown", "quantity": 1609744, "record_type": "relationship", "relationship_id": "rel-jcet-sells-unspecified-goods-cxmt-fy2025", "relationship_type": "supplies", "source_ids": [ "src-jcet-annual-2025" ], "start_date": null, "to_entity_id": "ent-cxmt-corp", "unit": "CNY_fy2025", "unknowns": [ "product", "facility", "process", "package/test scope", "qualification", "quantity in physical units", "HBM status" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "188010418dc480ff1a1510935ba7891d7dba70188f8bb3b105ee5cbf5f54b8f0", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "unspecified goods; package/test/HBM scope not established" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jcet-annual-2025", "title": "江苏长电科技股份有限公司2025年年度报告", "publisher": "江苏长电科技股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225091498.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The row says only sale of goods; product, facility, process, package/test scope and HBM status are unknown.", "Do not convert this receipt into a packages, tests or HBM relationship." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-jcet", "record_level": "company", "canonical_legal_name_en": "JCET Group Co., Ltd.", "canonical_legal_name_cn": "江苏长电科技股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-jcet-sells-unspecified-goods-cxmt-fy2025", "predicate": "supplies", "scope": "edge from ent-jcet to ent-cxmt-corp; commercial state related_party_sale_of_unspecified_goods_fy2025; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "product", "facility", "process", "package/test scope", "qualification", "quantity in physical units", "HBM status" ], "source_ids": [ "src-jcet-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-jinhong-supplies-xinye-shidai-bulk-gas-project-2025" ], "commercial_state": "electronic_bulk_carrier_gas_project_landed", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-xinye-shidai-8in", "from_entity_id": "ent-jinhong-gas", "id": "rel-jinhong-supplies-xinye-shidai-bulk-gas-project-2025", "last_checked": "2026-07-29", "process_step": "electronic bulk/carrier gas integrated service; exact gases undisclosed", "product_id": null, "qualification_state": "unknown", "quantity": null, "record_type": "relationship", "relationship_id": "rel-jinhong-supplies-xinye-shidai-bulk-gas-project-2025", "relationship_type": "supplies", "source_ids": [ "src-jinhong-annual-2025" ], "start_date": "2025-12-31", "to_entity_id": "ent-xinye-shidai", "unit": null, "unknowns": [ "contracting Jinhong subsidiary", "exact gases/grades", "contract value", "delivery", "installation", "acceptance", "operating capacity" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "fe08f69839ccc6e0287a6d3568ae81598fa574c46fb856040f6dfbbff9f6d919", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "electronic bulk/carrier gas integrated service; exact gases undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jinhong-annual-2025", "title": "金宏气体股份有限公司2025年年度报告", "publisher": "金宏气体股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-03-28/1225047235.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-03-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Capacity is consolidated/group aggregate and cannot be assigned to a facility or subsidiary.", "Named customer portfolios are not molecule-specific edges.", "Except for 7N ammonia program wording, customer CoA purity/particle/moisture/metal limits are absent.", "Do not derive actual output by multiplying capacity and utilization without a separately labeled model." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-jinhong-gas", "record_level": "company", "canonical_legal_name_en": "Jinhong Gas Co., Ltd.", "canonical_legal_name_cn": "金宏气体股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-xinye-shidai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "陕西电子芯业时代科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-jinhong-supplies-xinye-shidai-bulk-gas-project-2025", "predicate": "supplies", "scope": "edge from ent-jinhong-gas to ent-xinye-shidai; commercial state electronic_bulk_carrier_gas_project_landed; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "contracting Jinhong subsidiary", "exact gases/grades", "contract value", "delivery", "installation", "acceptance", "operating capacity" ], "source_ids": [ "src-jinhong-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-kfmi-supplies-ssmc-targets-parts" ], "commercial_state": "sustained_supply_vendor_reported_for_16_years", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-kfmi", "id": "rel-kfmi-supplies-ssmc-targets-parts", "last_checked": "2026-07-29", "process_step": "sputtering targets and equipment parts; exact material/SKU/layer undisclosed", "product_id": null, "qualification_state": "supplier_award", "quantity": null, "record_type": "relationship", "relationship_id": "rel-kfmi-supplies-ssmc-targets-parts", "relationship_type": "supplies", "source_ids": [ "src-kfmi-ssmc-award-2024" ], "start_date": "2008-01-01", "to_entity_id": "ent-ssmc", "unit": null, "unknowns": [ "exact target metal", "grade", "target model/drawing", "equipment-part SKU", "quantity", "facility line", "process layer" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "24a667a1633848562efef173fba734c65bd7073f0646e33e1ebe0e4208941d92", "stage_ids": [ "wafer_equipment", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "sputtering targets and equipment parts; exact material/SKU/layer undisclosed" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "sputtering targets and equipment parts; exact material/SKU/layer undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "sputtering targets and equipment parts; exact material/SKU/layer undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kfmi-ssmc-award-2024", "title": "江丰电子荣获SSMC“最佳供应商奖”", "publisher": "宁波江丰电子材料股份有限公司", "url": "https://www.kfmic.com/?news_13%2F634.html=", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2024-08-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-side statement; exact target metal/grade/model, equipment-part SKU, quantity and process layer are absent." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-kfmi", "record_level": "company", "canonical_legal_name_en": "Konfoong Materials International Co., Ltd.", "canonical_legal_name_cn": "宁波江丰电子材料股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-ssmc", "record_level": "company", "canonical_legal_name_en": "Systems on Silicon Manufacturing Company Pte. Ltd.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-kfmi-supplies-ssmc-targets-parts", "predicate": "supplies", "scope": "edge from ent-kfmi to ent-ssmc; commercial state sustained_supply_vendor_reported_for_16_years; qualification state supplier_award", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact target metal", "grade", "target model/drawing", "equipment-part SKU", "quantity", "facility line", "process layer" ], "source_ids": [ "src-kfmi-ssmc-award-2024" ] } ] }, { "claim_ids": [ "clm-relationship-kingsemi-supplies-silan-jike-krf-2022" ], "commercial_state": "shipped_and_moved_in", "completion_state": "relationship_backed", "end_date": null, "equipment_id": "eq-kingsemi-unidentified-12in-krf-silan-jike", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-silan-jike-12in", "from_entity_id": "ent-kingsemi", "id": "rel-kingsemi-supplies-silan-jike-krf-2022", "last_checked": "2026-07-29", "process_step": "12-inch KrF photoresist coat and develop", "product_id": null, "qualification_state": "unknown", "quantity": null, "record_type": "relationship", "relationship_id": "rel-kingsemi-supplies-silan-jike-krf-2022", "relationship_type": "supplies", "source_ids": [ "src-kingsemi-silan-jike-krf-2022" ], "start_date": "2022-06-10", "to_entity_id": "ent-silan-jike", "unit": null, "unknowns": [ "model", "serial", "installation completion", "site acceptance", "named layer", "qualification", "recurring volume", "yield" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "ad827c60e9cbec575413dc438b38b3a5a76df3b422bdbfd86c6c843ec107bf9b", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "process_step", "value": "12-inch KrF photoresist coat and develop" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "12-inch KrF photoresist coat and develop" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "12-inch KrF photoresist coat and develop" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-kingsemi-silan-jike-krf-2022", "title": "同“芯”聚力，共创辉煌——沈阳芯源KrF涂胶显影机台入驻士兰集科暨双方达成战略合作关系", "publisher": "沈阳芯源微电子设备股份有限公司", "url": "https://www.kingsemi.com/index.php/News/detail?id=160", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2022-06-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No model, serial, purchase record, installation completion, site acceptance, named layer, throughput, uptime or yield is disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-kingsemi", "record_level": "company", "canonical_legal_name_en": "Kingsemi Co., Ltd.", "canonical_legal_name_cn": "沈阳芯源微电子设备股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-silan-jike", "record_level": "company", "canonical_legal_name_en": "Xiamen Silan Jike Microelectronics Co., Ltd.", "canonical_legal_name_cn": "厦门士兰集科微电子有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-kingsemi-supplies-silan-jike-krf-2022", "predicate": "supplies", "scope": "edge from ent-kingsemi to ent-silan-jike; commercial state shipped_and_moved_in; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "model", "serial", "installation completion", "site acceptance", "named layer", "qualification", "recurring volume", "yield" ], "source_ids": [ "src-kingsemi-silan-jike-krf-2022" ] } ] }, { "claim_ids": [ "clm-relationship-li-auto-2021-li-one-integrates-journey3" ], "commercial_state": "shipping_2021_vehicle_model", "completion_state": "volume_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-li-auto-inc", "id": "rel-li-auto-2021-li-one-integrates-journey3", "last_checked": "2026-07-29", "process_step": "2021 Li ONE ADAS acceleration", "product_id": "prod-horizon-journey-3", "qualification_state": "installed_in_delivered_vehicle_model", "quantity": 2, "record_type": "relationship", "relationship_id": "rel-li-auto-2021-li-one-integrates-journey3", "relationship_type": "integrates", "source_ids": [ "src-li-auto-2021q1-results-20210526", "src-li-auto-2021q3-results-20211129", "src-li-auto-dec-deliveries-20220101" ], "start_date": "2021-05-25", "to_entity_id": "ent-horizon-brand-endpoint-unresolved", "unit": "chips_per_vehicle", "unknowns": [ "Horizon contracting legal entity", "direct purchase/quantity", "vehicle factory/operator", "foundry/package/OSAT", "chip yield", "field failure rate" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "4cf67f1c06bf12ce5c707d076e20828f08b24e959c3dc92c8a57b5548a4c6ea9", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "2021 Li ONE ADAS acceleration" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-li-auto-2021q1-results-20210526", "title": "Li Auto Inc. Announces Unaudited First Quarter 2021 Financial Results", "publisher": "Li Auto Inc.", "url": "https://ir.lixiang.com/zh-hans/news-releases/news-release-details/li-auto-inc-announces-unaudited-first-quarter-2021-financial", "source_type": "company_financial_results", "primary_status": "primary", "publication_date": "2021-05-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Horizon's contracting legal entity, chip purchase quantity, supplier contract, manufacturing facility and accepted-system test are undisclosed." ] }, { "source_id": "src-li-auto-2021q3-results-20211129", "title": "Li Auto Inc. Announces Unaudited Third Quarter 2021 Financial Results", "publisher": "Li Auto Inc.", "url": "https://ir.lixiang.com/news-releases/news-release-details/li-auto-inc-announces-unaudited-third-quarter-2021-financial/", "source_type": "company_financial_results", "primary_status": "primary", "publication_date": "2021-11-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Vehicle delivery volume does not independently prove a direct Horizon purchase contract or chip procurement quantity." ] }, { "source_id": "src-li-auto-dec-deliveries-20220101", "title": "Li Auto Inc. December 2021 Delivery Update", "publisher": "Li Auto Inc.", "url": "https://ir.lixiang.com/news-releases/news-release-details/li-auto-inc-december-2021-delivery-update", "source_type": "company_delivery_update", "primary_status": "primary", "publication_date": "2022-01-01", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page does not independently repeat the Journey 3 configuration; the integration join is limited to the explicitly named 2021 Li ONE generation." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-li-auto-inc", "record_level": "company", "canonical_legal_name_en": "Li Auto Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-horizon-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-li-auto-2021-li-one-integrates-journey3", "predicate": "integrates", "scope": "edge from ent-li-auto-inc to ent-horizon-brand-endpoint-unresolved; commercial state shipping_2021_vehicle_model; qualification state installed_in_delivered_vehicle_model", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "Horizon contracting legal entity", "direct purchase/quantity", "vehicle factory/operator", "foundry/package/OSAT", "chip yield", "field failure rate" ], "source_ids": [ "src-li-auto-2021q1-results-20210526", "src-li-auto-2021q3-results-20211129", "src-li-auto-dec-deliveries-20220101" ] } ] }, { "claim_ids": [ "clm-relationship-memblaze-integrates-ymtc-nand" ], "commercial_state": "named_product_bom", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-memblaze", "id": "rel-memblaze-integrates-ymtc-nand", "last_checked": "2026-07-29", "process_step": "enterprise SSD media", "product_id": "prod-memblaze-pblaze6-6541", "qualification_state": "product_page", "quantity": null, "record_type": "relationship", "relationship_id": "rel-memblaze-integrates-ymtc-nand", "relationship_type": "integrates", "source_ids": [ "src-memblaze-ymtc-pblaze6" ], "start_date": null, "to_entity_id": "ent-ymtc", "unit": null, "unknowns": [ "NAND generation", "current shipment volume", "controller/PMIC origin" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "3e91941c2afd9f987b1736f78c979a4394580de88ff3623d252d3582552357bc", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_step", "value": "enterprise SSD media" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "enterprise SSD media" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-memblaze-ymtc-pblaze6", "title": "PBlaze6 6541 Enterprise SSD", "publisher": "北京忆恒创源科技股份有限公司", "url": "https://www.memblaze.com/product/pblaze6/639.html", "source_type": "company_product_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Direct product BOM join for NAND only; controller, PMIC, firmware component origins and shipment volume are not fully disclosed." ] } ], "relationship_semantics": { "class": "integration_not_supplier", "boundary": "Integration establishes the named technical combination only. It does not establish component supply, ownership, procurement, volume, or deployment beyond the source scope." }, "from_entity_reference": { "entity_id": "ent-memblaze", "record_level": "company", "canonical_legal_name_en": "Memblaze Technology Co., Ltd.", "canonical_legal_name_cn": "北京忆恒创源科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-ymtc", "record_level": "company", "canonical_legal_name_en": "Yangtze Memory Technologies Co., Ltd.", "canonical_legal_name_cn": "长江存储科技有限责任公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-memblaze-integrates-ymtc-nand", "predicate": "integrates", "scope": "edge from ent-memblaze to ent-ymtc; commercial state named_product_bom; qualification state product_page", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "NAND generation", "current shipment volume", "controller/PMIC origin" ], "source_ids": [ "src-memblaze-ymtc-pblaze6" ] } ] }, { "claim_ids": [ "clm-relationship-nsig-owns-xinsheng-jingke" ], "commercial_state": "subsidiary", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-xinsheng-jingke-300mm", "from_entity_id": "ent-nsig", "id": "rel-nsig-owns-xinsheng-jingke", "last_checked": "2026-07-29", "process_step": null, "product_id": null, "qualification_state": "operating", "quantity": null, "record_type": "relationship", "relationship_id": "rel-nsig-owns-xinsheng-jingke", "relationship_type": "owns", "source_ids": [ "src-nsig-inquiry-2025" ], "start_date": null, "to_entity_id": "ent-xinsheng-jingke", "unit": null, "unknowns": [ "current ownership percentage if less than wholly owned" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "85c8e296abb7e1b3075019c2cd3de369a26a5278cd3e60a4be3acf92728c71ba", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nsig-inquiry-2025", "title": "关于上海硅产业集团股份有限公司发行股份及支付现金购买资产并募集配套资金申请审核问询函的回复", "publisher": "上海证券交易所 / 立信会计师事务所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202509/688126_20250901_U2SY.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2025-09-01", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Equipment vendors and a domestic polysilicon supplier are anonymized; forecasts are not actual production." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-nsig", "record_level": "company", "canonical_legal_name_en": "National Silicon Industry Group Co., Ltd.", "canonical_legal_name_cn": "上海硅产业集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-xinsheng-jingke", "record_level": "company", "canonical_legal_name_en": "Shanghai Xinsheng Jingke Semiconductor Technology Co., Ltd.", "canonical_legal_name_cn": "上海新昇晶科半导体科技有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-nsig-owns-xinsheng-jingke", "predicate": "owns", "scope": "edge from ent-nsig to ent-xinsheng-jingke; commercial state subsidiary; qualification state operating", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "current ownership percentage if less than wholly owned" ], "source_ids": [ "src-nsig-inquiry-2025" ] } ] }, { "claim_ids": [ "clm-relationship-piotech-supplies-cxmt" ], "commercial_state": "production_line_use_reported_at_group_portfolio_scope", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-piotech", "id": "rel-piotech-supplies-cxmt", "last_checked": "2026-07-29", "process_step": "PECVD/ALD/SACVD deposition", "product_id": "prod-piotech-deposition-portfolio", "qualification_state": "exact_model_facility_layer_unresolved", "quantity": null, "record_type": "relationship", "relationship_id": "rel-piotech-supplies-cxmt", "relationship_type": "supplies", "source_ids": [ "src-piotech-prospectus-2021" ], "start_date": null, "to_entity_id": "ent-cxmt-corp", "unit": null, "unknowns": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "04d6c9852a06bdde66d1e1d920a2aa536283222853cb80825d2a7408d119aa1c", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "PECVD/ALD/SACVD deposition" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "PECVD/ALD/SACVD deposition" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-piotech-prospectus-2021", "title": "拓荆科技股份有限公司招股说明书（注册稿）", "publisher": "拓荆科技股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202111/000996_20211105_MYB4.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-11-05", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group/product-family scope; exact model, facility, process layer, installation, acceptance, uptime and yield are not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-piotech-supplies-cxmt", "predicate": "supplies", "scope": "edge from ent-piotech to ent-cxmt-corp; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "source_ids": [ "src-piotech-prospectus-2021" ] } ] }, { "claim_ids": [ "clm-relationship-piotech-supplies-huahong" ], "commercial_state": "production_line_use_reported_at_group_portfolio_scope", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-piotech", "id": "rel-piotech-supplies-huahong", "last_checked": "2026-07-29", "process_step": "PECVD/ALD/SACVD deposition", "product_id": "prod-piotech-deposition-portfolio", "qualification_state": "exact_model_facility_layer_unresolved", "quantity": null, "record_type": "relationship", "relationship_id": "rel-piotech-supplies-huahong", "relationship_type": "supplies", "source_ids": [ "src-piotech-prospectus-2021" ], "start_date": null, "to_entity_id": "ent-huahong-group", "unit": null, "unknowns": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "32807ff73d5b5ee0f075c5262acc82745d0386a881fe77a6855effbf1a85365a", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "PECVD/ALD/SACVD deposition" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "PECVD/ALD/SACVD deposition" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-piotech-prospectus-2021", "title": "拓荆科技股份有限公司招股说明书（注册稿）", "publisher": "拓荆科技股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202111/000996_20211105_MYB4.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-11-05", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group/product-family scope; exact model, facility, process layer, installation, acceptance, uptime and yield are not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-huahong-group", "record_level": "company", "canonical_legal_name_en": "Shanghai Huahong (Group) Co., Ltd.", "canonical_legal_name_cn": "上海华虹（集团）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-piotech-supplies-huahong", "predicate": "supplies", "scope": "edge from ent-piotech to ent-huahong-group; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "source_ids": [ "src-piotech-prospectus-2021" ] } ] }, { "claim_ids": [ "clm-relationship-piotech-supplies-smic" ], "commercial_state": "production_line_use_reported_at_group_portfolio_scope", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-piotech", "id": "rel-piotech-supplies-smic", "last_checked": "2026-07-29", "process_step": "PECVD/ALD/SACVD deposition", "product_id": "prod-piotech-deposition-portfolio", "qualification_state": "exact_model_facility_layer_unresolved", "quantity": null, "record_type": "relationship", "relationship_id": "rel-piotech-supplies-smic", "relationship_type": "supplies", "source_ids": [ "src-piotech-prospectus-2021" ], "start_date": null, "to_entity_id": "ent-smic", "unit": null, "unknowns": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "a959e718ad3d3df46661aab116e1a90f2dbfe55182550857a2514a643d9f5b7d", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "PECVD/ALD/SACVD deposition" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "PECVD/ALD/SACVD deposition" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-piotech-prospectus-2021", "title": "拓荆科技股份有限公司招股说明书（注册稿）", "publisher": "拓荆科技股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202111/000996_20211105_MYB4.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-11-05", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group/product-family scope; exact model, facility, process layer, installation, acceptance, uptime and yield are not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-smic", "record_level": "company", "canonical_legal_name_en": "Semiconductor Manufacturing International Corporation", "canonical_legal_name_cn": "中芯国际集成电路制造有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-piotech-supplies-smic", "predicate": "supplies", "scope": "edge from ent-piotech to ent-smic; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "source_ids": [ "src-piotech-prospectus-2021" ] } ] }, { "claim_ids": [ "clm-relationship-piotech-supplies-ymtc" ], "commercial_state": "production_line_use_reported_at_group_portfolio_scope", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-piotech", "id": "rel-piotech-supplies-ymtc", "last_checked": "2026-07-29", "process_step": "PECVD/ALD/SACVD deposition", "product_id": "prod-piotech-deposition-portfolio", "qualification_state": "exact_model_facility_layer_unresolved", "quantity": null, "record_type": "relationship", "relationship_id": "rel-piotech-supplies-ymtc", "relationship_type": "supplies", "source_ids": [ "src-piotech-prospectus-2021" ], "start_date": null, "to_entity_id": "ent-ymtc", "unit": null, "unknowns": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "0cdad818ab3295bc875331392d33616d54fc42fd350dfe00dfc193e0cd929e11", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "PECVD/ALD/SACVD deposition" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "PECVD/ALD/SACVD deposition" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-piotech-prospectus-2021", "title": "拓荆科技股份有限公司招股说明书（注册稿）", "publisher": "拓荆科技股份有限公司 via 上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202111/000996_20211105_MYB4.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2021-11-05", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Group/product-family scope; exact model, facility, process layer, installation, acceptance, uptime and yield are not disclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-ymtc", "record_level": "company", "canonical_legal_name_en": "Yangtze Memory Technologies Co., Ltd.", "canonical_legal_name_cn": "长江存储科技有限责任公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-piotech-supplies-ymtc", "predicate": "supplies", "scope": "edge from ent-piotech to ent-ymtc; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "source_ids": [ "src-piotech-prospectus-2021" ] } ] }, { "claim_ids": [ "clm-relationship-primarius-nanospice-skhynix" ], "commercial_state": "adopted", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-primarius", "id": "rel-primarius-nanospice-skhynix", "last_checked": "2026-07-29", "process_step": "CMOS image-sensor verification", "product_id": "prod-primarius-nanospice", "qualification_state": "customer_adoption_vendor_reported", "quantity": null, "record_type": "relationship", "relationship_id": "rel-primarius-nanospice-skhynix", "relationship_type": "supplies", "source_ids": [ "src-primarius-nanospice-skhynix-2022" ], "start_date": "2022-01-27", "to_entity_id": "ent-skhynix", "unit": null, "unknowns": [ "customer-origin receipt", "fab", "node", "chip SKU", "seat count", "volume" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "70092b7b6a64a3e30914eb7571c45dc78c81cf7bbc7fec7fdb072e20e19bd16a", "stage_ids": [ "architecture_ip" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "process_step", "value": "CMOS image-sensor verification" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "CMOS image-sensor verification" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-primarius-nanospice-skhynix-2022", "title": "Primarius NanoSpice™ Simulator ... is Adopted by SK hynix", "publisher": "Primarius Technologies Co., Ltd.", "url": "https://www.primarius-tech.com/en/aboutus/news/Primarius-NanoSpice-Simulator-to-Accelerate-the-verification-of-CMOS-Image-Sensor-is-adopted-by-Skhy.html", "source_type": "company_customer_announcement", "primary_status": "primary", "publication_date": "2022-01-27", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Supplier-side adoption claim; no SK hynix-origin receipt, fab, node, chip SKU, seats or volume." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-primarius", "record_level": "company", "canonical_legal_name_en": "Primarius Technologies Co., Ltd.", "canonical_legal_name_cn": "上海概伦电子股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-skhynix", "record_level": "company", "canonical_legal_name_en": "SK hynix Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-primarius-nanospice-skhynix", "predicate": "supplies", "scope": "edge from ent-primarius to ent-skhynix; commercial state adopted; qualification state customer_adoption_vendor_reported", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "customer-origin receipt", "fab", "node", "chip SKU", "seat count", "volume" ], "source_ids": [ "src-primarius-nanospice-skhynix-2022" ] } ] }, { "claim_ids": [ "clm-relationship-red-avenue-owns-tongcheng-chemical-china" ], "commercial_state": "wholly_owned_subsidiary_at_2025_year_end", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-tongcheng-chemical-shanghai-resin", "from_entity_id": "ent-red-avenue", "id": "rel-red-avenue-owns-tongcheng-chemical-china", "last_checked": "2026-07-29", "process_step": "corporate ownership of photoresist-resin and electronic-formaldehyde project operator", "product_id": null, "qualification_state": "not_applicable", "quantity": 100, "record_type": "relationship", "relationship_id": "rel-red-avenue-owns-tongcheng-chemical-china", "relationship_type": "owns", "source_ids": [ "src-red-avenue-annual-2025", "src-redavenue-subsidiaries-guarantee-2025" ], "start_date": null, "to_entity_id": "ent-tongcheng-chemical-china", "unit": "percent_equity", "unknowns": [ "incorporation/acquisition date", "registration ID" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "b67138c49ffba448506ac9af74511a0ddf06fe42c731a78daab3d7161e9f219d", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "process_step", "value": "corporate ownership of photoresist-resin and electronic-formaldehyde project operator" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "corporate ownership of photoresist-resin and electronic-formaldehyde project operator" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "corporate ownership of photoresist-resin and electronic-formaldehyde project operator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] }, { "source_id": "src-redavenue-subsidiaries-guarantee-2025", "title": "彤程新材料集团股份有限公司关于年度预计融资担保进展的公告", "publisher": "彤程新材料集团股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2025-04/03/content_2044624.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Registered residences are legal-entity addresses and are not automatically the same as every manufacturing site." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-red-avenue", "record_level": "company", "canonical_legal_name_en": "Red Avenue New Materials Group Co., Ltd.", "canonical_legal_name_cn": "彤程新材料集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-tongcheng-chemical-china", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "彤程化学（中国）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-red-avenue-owns-tongcheng-chemical-china", "predicate": "owns", "scope": "edge from ent-red-avenue to ent-tongcheng-chemical-china; commercial state wholly_owned_subsidiary_at_2025_year_end; qualification state not_applicable", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "incorporation/acquisition date", "registration ID" ], "source_ids": [ "src-red-avenue-annual-2025", "src-redavenue-subsidiaries-guarantee-2025" ] } ] }, { "claim_ids": [ "clm-relationship-red-avenue-owns-tongcheng-electronic-shanghai" ], "commercial_state": "current_subsidiary", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-red-avenue", "id": "rel-red-avenue-owns-tongcheng-electronic-shanghai", "last_checked": "2026-07-29", "process_step": "corporate ownership of semiconductor-materials producer", "product_id": null, "qualification_state": "not_applicable", "quantity": null, "record_type": "relationship", "relationship_id": "rel-red-avenue-owns-tongcheng-electronic-shanghai", "relationship_type": "owns", "source_ids": [ "src-red-avenue-annual-2025" ], "start_date": null, "to_entity_id": "ent-tongcheng-electronic-materials-shanghai", "unit": null, "unknowns": [ "acquisition/origination date", "registration ID" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "3c2334f12e9cfe71d2f985a2256cdfe396ec0f157a674b9f7ad51079e3ca4170", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "corporate ownership of semiconductor-materials producer" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "corporate ownership of semiconductor-materials producer" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-red-avenue", "record_level": "company", "canonical_legal_name_en": "Red Avenue New Materials Group Co., Ltd.", "canonical_legal_name_cn": "彤程新材料集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-tongcheng-electronic-materials-shanghai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海彤程电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-red-avenue-owns-tongcheng-electronic-shanghai", "predicate": "owns", "scope": "edge from ent-red-avenue to ent-tongcheng-electronic-materials-shanghai; commercial state current_subsidiary; qualification state not_applicable", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "acquisition/origination date", "registration ID" ], "source_ids": [ "src-red-avenue-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-saic-develops-journey5-solution" ], "commercial_state": "jointly_released_solution", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-saic-motor", "id": "rel-saic-develops-journey5-solution", "last_checked": "2026-07-29", "process_step": "vehicle intelligent-driving compute solution development", "product_id": "prod-horizon-journey-5", "qualification_state": "unknown", "quantity": null, "record_type": "relationship", "relationship_id": "rel-saic-develops-journey5-solution", "relationship_type": "develops", "source_ids": [ "src-saic-soa-conference-20221104" ], "start_date": "2022-11-04", "to_entity_id": "ent-horizon-brand-endpoint-unresolved", "unit": null, "unknowns": [ "Horizon legal entity", "SAIC subsidiary/vehicle model", "controller/BOM", "order", "SOP", "qualification", "delivery", "volume" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "4686d6b24224db62a58c273ea87e462959f841235c789e4d2a58827c38e80406", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "vehicle intelligent-driving compute solution development" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "vehicle intelligent-driving compute solution development" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-saic-soa-conference-20221104", "title": "第二届上汽零束SOA平台开发者大会揭幕", "publisher": "上海汽车集团股份有限公司", "url": "https://www.saicmotor.com/m/xwzx/xwk/2022/58086.shtml", "source_type": "company_customer_press_release", "primary_status": "primary", "publication_date": "2022-11-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No exact vehicle program, Horizon legal entity, board/controller, order, SOP, shipment or field receipt.", "Other delivered SOA vehicles in the page are not tied to Journey 5; the future 2025 production target is not achieved production evidence." ] } ], "relationship_semantics": { "class": "development", "boundary": "Development work does not prove a commercial product, supplier relationship, qualification, shipment, or volume production." }, "from_entity_reference": { "entity_id": "ent-saic-motor", "record_level": "company", "canonical_legal_name_en": "SAIC Motor Corporation Limited", "canonical_legal_name_cn": "上海汽车集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-horizon-brand-endpoint-unresolved", "record_level": "brand_or_unresolved_endpoint", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-saic-develops-journey5-solution", "predicate": "develops", "scope": "edge from ent-saic-motor to ent-horizon-brand-endpoint-unresolved; commercial state jointly_released_solution; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "Horizon legal entity", "SAIC subsidiary/vehicle model", "controller/BOM", "order", "SOP", "qualification", "delivery", "volume" ], "source_ids": [ "src-saic-soa-conference-20221104" ] } ] }, { "claim_ids": [ "clm-relationship-samsung-owns-xian-operation" ], "commercial_state": "foreign_owned_mainland_operation", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-samsung-xian-nand", "from_entity_id": "ent-samsung-electronics", "id": "rel-samsung-owns-xian-operation", "last_checked": "2026-07-29", "process_step": null, "product_id": null, "qualification_state": "volume_production", "quantity": null, "record_type": "relationship", "relationship_id": "rel-samsung-owns-xian-operation", "relationship_type": "owns", "source_ids": [ "src-samsung-xian-operation-2014" ], "start_date": null, "to_entity_id": "ent-samsung-china-semiconductor", "unit": null, "unknowns": [], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "4d312d80bf535e1c193b061bd6b004e2556bfee13f4edc20b8b87cbb651e5c4d", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-samsung-xian-operation-2014", "title": "Samsung Announces Operation of Its Memory Facility in Xi'an, China", "publisher": "Samsung Electronics", "url": "https://news.samsung.com/global/samsung-announces-operation-of-its-memory-facility-in-xian-china", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2014-05-09", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Historical start receipt; current capacity, generation, utilization, supplier mix, and export-control exposure require later sources." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-samsung-electronics", "record_level": "company", "canonical_legal_name_en": "Samsung Electronics Co., Ltd.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-samsung-china-semiconductor", "record_level": "company", "canonical_legal_name_en": "Samsung (China) Semiconductor Co., Ltd.", "canonical_legal_name_cn": "三星（中国）半导体有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-samsung-owns-xian-operation", "predicate": "owns", "scope": "edge from ent-samsung-electronics to ent-samsung-china-semiconductor; commercial state foreign_owned_mainland_operation; qualification state volume_production", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [], "source_ids": [ "src-samsung-xian-operation-2014" ] } ] }, { "claim_ids": [ "clm-relationship-shenzhou-kuntai-framework-china-mobile-ai-servers-2024" ], "commercial_state": "signed_framework_after_award", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-shenzhou-kuntai-xiamen", "id": "rel-shenzhou-kuntai-framework-china-mobile-ai-servers-2024", "last_checked": "2026-07-29", "process_step": "telecom AI-compute infrastructure", "product_id": "prod-shenzhou-kuntai-ai-server-framework", "qualification_state": "awarded_framework_supplier", "quantity": 842, "record_type": "relationship", "relationship_id": "rel-shenzhou-kuntai-framework-china-mobile-ai-servers-2024", "relationship_type": "supplies", "source_ids": [ "src-digital-china-cmcc-framework-20240824" ], "start_date": "2024-08-22", "to_entity_id": "ent-china-mobile-communications", "unit": "server_units_awarded_ceiling_actual_orders_unknown", "unknowns": [ "purchase orders", "executed quantity", "server model", "semiconductor BOM", "delivery", "installation", "commissioning", "acceptance", "receiving affiliate/facility", "utilization" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "73e2ab1f6b6b35bd5a9bdc60cf1dfebd2839cb99dad592e0405258be35eb2495", "stage_ids": [ "networking" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "networking", "rule_id": "canonical-network-or-interconnect-role", "canonical_field_matches": [ { "field": "process_step", "value": "telecom AI-compute infrastructure" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "telecom AI-compute infrastructure" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-digital-china-cmcc-framework-20240824", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2024-08/24/content_1957609.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2024-08-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "842 is a framework award ceiling, not an actual order, shipment, installation or acceptance count.", "Server model, accelerator/CPU/memory/NIC BOM, facility, value, serial and asset receipt are undisclosed." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-shenzhou-kuntai-xiamen", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "神州鲲泰（厦门）信息技术有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-china-mobile-communications", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "中国移动通信有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-shenzhou-kuntai-framework-china-mobile-ai-servers-2024", "predicate": "supplies", "scope": "edge from ent-shenzhou-kuntai-xiamen to ent-china-mobile-communications; commercial state signed_framework_after_award; qualification state awarded_framework_supplier", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "purchase orders", "executed quantity", "server model", "semiconductor BOM", "delivery", "installation", "commissioning", "acceptance", "receiving affiliate/facility", "utilization" ], "source_ids": [ "src-digital-china-cmcc-framework-20240824" ] } ] }, { "claim_ids": [ "clm-relationship-shenzhou-rps-to-amec" ], "commercial_state": "issuer_reports_installed_in_customer_equipment", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-jiangsu-shenzhou", "id": "rel-shenzhou-rps-to-amec", "last_checked": "2026-07-29", "process_step": "remote plasma source in etch", "product_id": "prod-shenzhou-rps", "qualification_state": "customer_endorsement_in_filing", "quantity": null, "record_type": "relationship", "relationship_id": "rel-shenzhou-rps-to-amec", "relationship_type": "supplies", "source_ids": [ "src-jiangsu-shenzhou-prospectus-2026" ], "start_date": null, "to_entity_id": "ent-amec", "unit": null, "unknowns": [ "model", "facility", "acceptance", "qualified layer", "uptime" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "f879e903f33da0850217664f69bbeda51f0aab0977fe1dc32017d0ce8897227d", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "remote plasma source in etch" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "remote plasma source in etch" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jiangsu-shenzhou-prospectus-2026", "title": "江苏神州半导体科技股份有限公司招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202606/002191_20260630_F1GO.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-06-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer filing reproduces customer endorsements; facility, serial number, fab acceptance and qualified layer are not public." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-jiangsu-shenzhou", "record_level": "company", "canonical_legal_name_en": "Jiangsu Shenzhou Semiconductor Technology Co., Ltd.", "canonical_legal_name_cn": "江苏神州半导体科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-amec", "record_level": "company", "canonical_legal_name_en": "Advanced Micro-Fabrication Equipment Inc. China", "canonical_legal_name_cn": "中微半导体设备（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-shenzhou-rps-to-amec", "predicate": "supplies", "scope": "edge from ent-jiangsu-shenzhou to ent-amec; commercial state issuer_reports_installed_in_customer_equipment; qualification state customer_endorsement_in_filing", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "model", "facility", "acceptance", "qualified layer", "uptime" ], "source_ids": [ "src-jiangsu-shenzhou-prospectus-2026" ] } ] }, { "claim_ids": [ "clm-relationship-shenzhou-rps-to-piotech" ], "commercial_state": "issuer_reports_installed_in_customer_equipment", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "from_entity_id": "ent-jiangsu-shenzhou", "id": "rel-shenzhou-rps-to-piotech", "last_checked": "2026-07-29", "process_step": "remote plasma source in PECVD/ALD", "product_id": "prod-shenzhou-rps", "qualification_state": "customer_endorsement_in_filing", "quantity": null, "record_type": "relationship", "relationship_id": "rel-shenzhou-rps-to-piotech", "relationship_type": "supplies", "source_ids": [ "src-jiangsu-shenzhou-prospectus-2026" ], "start_date": null, "to_entity_id": "ent-piotech", "unit": null, "unknowns": [ "model", "facility", "acceptance", "qualified layer", "uptime" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "fae8f4292161f2dffa211055cbd7c92841f2276b41d339658cc582b581a41dab", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "remote plasma source in PECVD/ALD" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "remote plasma source in PECVD/ALD" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jiangsu-shenzhou-prospectus-2026", "title": "江苏神州半导体科技股份有限公司招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202606/002191_20260630_F1GO.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-06-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Issuer filing reproduces customer endorsements; facility, serial number, fab acceptance and qualified layer are not public." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-jiangsu-shenzhou", "record_level": "company", "canonical_legal_name_en": "Jiangsu Shenzhou Semiconductor Technology Co., Ltd.", "canonical_legal_name_cn": "江苏神州半导体科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-piotech", "record_level": "company", "canonical_legal_name_en": "Piotech Inc.", "canonical_legal_name_cn": "拓荆科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-shenzhou-rps-to-piotech", "predicate": "supplies", "scope": "edge from ent-jiangsu-shenzhou to ent-piotech; commercial state issuer_reports_installed_in_customer_equipment; qualification state customer_endorsement_in_filing", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "model", "facility", "acceptance", "qualified layer", "uptime" ], "source_ids": [ "src-jiangsu-shenzhou-prospectus-2026" ] } ] }, { "claim_ids": [ "clm-relationship-silan-jv-with-xiamen-semiconductor-investment" ], "commercial_state": "joint_investment_in_silan_jike", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-silan-jike-12in", "from_entity_id": "ent-silan", "id": "rel-silan-jv-with-xiamen-semiconductor-investment", "last_checked": "2026-07-29", "process_step": "12-inch specialty-process wafer fabrication", "product_id": null, "qualification_state": "not_applicable", "quantity": null, "record_type": "relationship", "relationship_id": "rel-silan-jv-with-xiamen-semiconductor-investment", "relationship_type": "joint_venture_with", "source_ids": [ "src-silan-jike-company-profile" ], "start_date": null, "to_entity_id": "ent-xiamen-semiconductor-investment", "unit": null, "unknowns": [ "shareholding percentages", "current ownership changes" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "f695d702ddf2f39abfddcf638c9dfa1052bda689bb7d2306493274fda8691ddf", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_step", "value": "12-inch specialty-process wafer fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "12-inch specialty-process wafer fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-silan-jike-company-profile", "title": "子公司-厦门士兰集科微电子有限公司", "publisher": "杭州士兰微电子股份有限公司", "url": "https://www.silan.com.cn/index.php/about/info/246.html", "source_type": "company_subsidiary_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The 40,000/80,000 wafers-per-month figures are project plans, not installed, qualified or actual-output capacity." ] } ], "relationship_semantics": { "class": "joint_venture", "boundary": "A joint venture is not treated as full ownership, shared nationality, product supply, or common operating geography." }, "from_entity_reference": { "entity_id": "ent-silan", "record_level": "company", "canonical_legal_name_en": "Hangzhou Silan Microelectronics Co., Ltd.", "canonical_legal_name_cn": "杭州士兰微电子股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-xiamen-semiconductor-investment", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "厦门半导体投资集团有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-silan-jv-with-xiamen-semiconductor-investment", "predicate": "joint_venture_with", "scope": "edge from ent-silan to ent-xiamen-semiconductor-investment; commercial state joint_investment_in_silan_jike; qualification state not_applicable", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "shareholding percentages", "current ownership changes" ], "source_ids": [ "src-silan-jike-company-profile" ] } ] }, { "claim_ids": [ "clm-relationship-skhynix-acquires-dalian-nand" ], "commercial_state": "acquisition", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-skhynix-dalian-nand", "from_entity_id": "ent-skhynix", "id": "rel-skhynix-acquires-dalian-nand", "last_checked": "2026-07-29", "process_step": null, "product_id": null, "qualification_state": "operating_state_unknown", "quantity": null, "record_type": "relationship", "relationship_id": "rel-skhynix-acquires-dalian-nand", "relationship_type": "owns", "source_ids": [ "src-skhynix-dalian-acquisition-2021" ], "start_date": "2021-12-30", "to_entity_id": "ent-skhynix-dalian", "unit": null, "unknowns": [], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "56232bcd128564da8f7bf1a68202c369b7f5c4222f9b34f99a51817525659399", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-skhynix-dalian-acquisition-2021", "title": "SK hynix Completes the First Phase of Intel NAND and SSD Business Acquisition", "publisher": "SK hynix", "url": "https://news.skhynix.com/sk-hynix-completes-the-first-phase-of-intel-nand-and-ssd-business-acquisition/", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2021-12-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Acquisition receipt does not provide current capacity, product generation, yield, utilization, or local supplier share." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-skhynix", "record_level": "company", "canonical_legal_name_en": "SK hynix Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-skhynix-dalian", "record_level": "company", "canonical_legal_name_en": "SK hynix semiconductor storage technology (Dalian) Co., Ltd.", "canonical_legal_name_cn": "爱思开海力士半导体存储技术（大连）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-skhynix-acquires-dalian-nand", "predicate": "owns", "scope": "edge from ent-skhynix to ent-skhynix-dalian; commercial state acquisition; qualification state operating_state_unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [], "source_ids": [ "src-skhynix-dalian-acquisition-2021" ] } ] }, { "claim_ids": [ "clm-relationship-skhynix-controls-dalian-operation" ], "commercial_state": "consolidated_subsidiary_and_current_nand_fab", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-skhynix-dalian-nand", "from_entity_id": "ent-skhynix", "id": "rel-skhynix-controls-dalian-operation", "last_checked": "2026-07-29", "process_step": "NAND wafer fabrication", "product_id": null, "qualification_state": "not_applicable", "quantity": null, "record_type": "relationship", "relationship_id": "rel-skhynix-controls-dalian-operation", "relationship_type": "owns", "source_ids": [ "src-skhynix-f1-facilities-2026", "src-skhynix-sec-subsidiaries-2026", "src-skhynix-official-network-2026" ], "start_date": "2026-03-31", "to_entity_id": "ent-skhynix-dalian", "unit": null, "unknowns": [ "immediate ownership chain", "share percentage", "fab land/tool title allocation" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "f605076aeca58d5f43e88aa546cc6ed292d6a75939d9b14434b0c6f27327b6bd", "stage_ids": [ "logic_foundry_process", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_step", "value": "NAND wafer fabrication" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_step", "value": "NAND wafer fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "NAND wafer fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-skhynix-f1-facilities-2026", "title": "SK hynix Inc. Form F-1 Registration Statement", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785df1.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing identifies C2/C2F DRAM and Dalian NAND and states group-wide full utilization, but does not disclose facility wafer capacity, node, output, yield, tool fleet or supplier BOM.", "Parent-level owns/operates language does not by itself resolve immediate local legal-title chains." ] }, { "source_id": "src-skhynix-sec-subsidiaries-2026", "title": "List of Subsidiaries of SK hynix Inc.", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785dex211.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Subsidiary list proves consolidated legal-entity inclusion, not immediate ownership percentage or the legal title holder for each fab parcel and tool set." ] }, { "source_id": "src-skhynix-official-network-2026", "title": "Global Network", "publisher": "SK hynix Inc.", "url": "https://www.skhynix.com/company/UI-FR-CP06/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page identifies the Wuxi production-site legal entity and a Dalian legal entity/address; it does not disclose capacity, process generation, output, yield, tools or materials." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-skhynix", "record_level": "company", "canonical_legal_name_en": "SK hynix Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-skhynix-dalian", "record_level": "company", "canonical_legal_name_en": "SK hynix semiconductor storage technology (Dalian) Co., Ltd.", "canonical_legal_name_cn": "爱思开海力士半导体存储技术（大连）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-skhynix-controls-dalian-operation", "predicate": "owns", "scope": "edge from ent-skhynix to ent-skhynix-dalian; commercial state consolidated_subsidiary_and_current_nand_fab; qualification state not_applicable", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "immediate ownership chain", "share percentage", "fab land/tool title allocation" ], "source_ids": [ "src-skhynix-f1-facilities-2026", "src-skhynix-sec-subsidiaries-2026", "src-skhynix-official-network-2026" ] } ] }, { "claim_ids": [ "clm-relationship-skhynix-controls-wuxi-operation" ], "commercial_state": "consolidated_subsidiary_and_current_production_site", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-skhynix", "id": "rel-skhynix-controls-wuxi-operation", "last_checked": "2026-07-29", "process_step": "DRAM wafer fabrication", "product_id": null, "qualification_state": "not_applicable", "quantity": null, "record_type": "relationship", "relationship_id": "rel-skhynix-controls-wuxi-operation", "relationship_type": "owns", "source_ids": [ "src-skhynix-f1-facilities-2026", "src-skhynix-sec-subsidiaries-2026", "src-skhynix-official-network-2026" ], "start_date": "2026-03-31", "to_entity_id": "ent-skhynix-wuxi-operator-unresolved", "unit": null, "unknowns": [ "immediate ownership chain", "share percentage", "fab land/tool title allocation" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "d9713d436b11a90f988a4e5301dc31b1f1d4ab6e856f2e010c62e97ae56096d1", "stage_ids": [ "logic_foundry_process", "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "process_step", "value": "DRAM wafer fabrication" } ] }, { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "process_step", "value": "DRAM wafer fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "DRAM wafer fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-skhynix-f1-facilities-2026", "title": "SK hynix Inc. Form F-1 Registration Statement", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785df1.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing identifies C2/C2F DRAM and Dalian NAND and states group-wide full utilization, but does not disclose facility wafer capacity, node, output, yield, tool fleet or supplier BOM.", "Parent-level owns/operates language does not by itself resolve immediate local legal-title chains." ] }, { "source_id": "src-skhynix-sec-subsidiaries-2026", "title": "List of Subsidiaries of SK hynix Inc.", "publisher": "U.S. Securities and Exchange Commission", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785dex211.htm", "source_type": "regulatory_filing", "primary_status": "primary", "publication_date": "2026-06-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Subsidiary list proves consolidated legal-entity inclusion, not immediate ownership percentage or the legal title holder for each fab parcel and tool set." ] }, { "source_id": "src-skhynix-official-network-2026", "title": "Global Network", "publisher": "SK hynix Inc.", "url": "https://www.skhynix.com/company/UI-FR-CP06/", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The page identifies the Wuxi production-site legal entity and a Dalian legal entity/address; it does not disclose capacity, process generation, output, yield, tools or materials." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-skhynix", "record_level": "company", "canonical_legal_name_en": "SK hynix Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-skhynix-wuxi-operator-unresolved", "record_level": "company", "canonical_legal_name_en": "SK hynix Semiconductor (China) Ltd.", "canonical_legal_name_cn": "SK海力士半导体（中国）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-skhynix-controls-wuxi-operation", "predicate": "owns", "scope": "edge from ent-skhynix to ent-skhynix-wuxi-operator-unresolved; commercial state consolidated_subsidiary_and_current_production_site; qualification state not_applicable", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "immediate ownership chain", "share percentage", "fab land/tool title allocation" ], "source_ids": [ "src-skhynix-f1-facilities-2026", "src-skhynix-sec-subsidiaries-2026", "src-skhynix-official-network-2026" ] } ] }, { "claim_ids": [ "clm-relationship-smee-zycgr22011903-ssc800-award-2025" ], "commercial_state": "procurement_award_contract_pending", "completion_state": "relationship_backed", "end_date": null, "equipment_id": "eq-smee-ssc800-10", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-smee", "id": "rel-smee-zycgr22011903-ssc800-award-2025", "last_checked": "2026-07-29", "process_step": "step-and-scan lithography; exact process family undisclosed", "product_id": "prod-smee-ssc800-10", "qualification_state": "unknown", "quantity": 1, "record_type": "relationship", "relationship_id": "rel-smee-zycgr22011903-ssc800-award-2025", "relationship_type": "selected_supplier_for", "source_ids": [ "src-ccgp-smee-ssc800-award-2025", "src-ssc800-ccgp-award-letter-20251224" ], "start_date": "2025-12-24", "to_entity_id": "ent-buyer-zycgr22011903-unresolved", "unit": "tool", "unknowns": [ "buyer legal identity", "signed contract", "manufacturing completion", "serial", "shipment", "delivery/receiving", "move-in", "installation", "site acceptance", "asset registration", "facility", "technical specification", "qualified layer", "production use" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "ed9eb7adf6308eb77e74d7b4b43d49da1ee0efb8d1d0ca4b3aaa657931445f49", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "process_step", "value": "step-and-scan lithography; exact process family undisclosed" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "step-and-scan lithography; exact process family undisclosed" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ccgp-smee-ssc800-award-2025", "title": "zycgr22011903单一来源采购步进扫描式光刻机成交公告", "publisher": "中国政府采购网 / 财政部", "url": "https://www.ccgp.gov.cn/cggg/zygg/cjgg/202512/t20251225_25989183.htm", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2025-12-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Buyer legal identity remains unresolved; official address/contact correlation to 临港实验室 is strong but not a same-document legal-identity receipt.", "Award/vendor selection is not a signed contract, manufacturing completion, shipment, delivery, move-in, installation, site acceptance, asset registration or process qualification.", "Wavelength, NA, resolution, overlay, throughput, facility, layer, yield and production use are undisclosed." ] }, { "source_id": "src-ssc800-ccgp-award-letter-20251224", "title": "zycgr22011903单一来源采购步进扫描式光刻成交通知书", "publisher": "zycgr22011903 / 中国政府采购网", "url": "https://download.ccgp.gov.cn/oss/download?uuid=29ED2DAF253269EC63A6675AED0E4F", "source_type": "procurement_award_letter", "primary_status": "primary", "publication_date": "2025-12-25", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The award letter does not prove that the contract was later executed or performed." ] } ], "relationship_semantics": { "class": "supplier_selection", "boundary": "The canonical relationship explicitly records a selected supplier. Selection does not by itself prove delivery, acceptance, qualification, recurring volume, or current production use." }, "from_entity_reference": { "entity_id": "ent-smee", "record_level": "company", "canonical_legal_name_en": "Shanghai Micro Electronics Equipment (Group) Co., Ltd.", "canonical_legal_name_cn": "上海微电子装备（集团）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-buyer-zycgr22011903-unresolved", "record_level": "unresolved_government_procurement_buyer_alias", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-smee-zycgr22011903-ssc800-award-2025", "predicate": "selected_supplier_for", "scope": "edge from ent-smee to ent-buyer-zycgr22011903-unresolved; commercial state procurement_award_contract_pending; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "buyer legal identity", "signed contract", "manufacturing completion", "serial", "shipment", "delivery/receiving", "move-in", "installation", "site acceptance", "asset registration", "facility", "technical specification", "qualified layer", "production use" ], "source_ids": [ "src-ccgp-smee-ssc800-award-2025", "src-ssc800-ccgp-award-letter-20251224" ] } ] }, { "claim_ids": [ "clm-relationship-tongcheng-shanghai-owns-beijing-kehua" ], "commercial_state": "96.3295_percent_direct_holding_disclosed_2025_05; 96.3296_percent_annual_report_rounding", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-tongcheng-electronic-materials-shanghai", "id": "rel-tongcheng-shanghai-owns-beijing-kehua", "last_checked": "2026-07-29", "process_step": "corporate ownership of photoresist producer", "product_id": null, "qualification_state": "not_applicable", "quantity": 96.3295, "record_type": "relationship", "relationship_id": "rel-tongcheng-shanghai-owns-beijing-kehua", "relationship_type": "owns", "source_ids": [ "src-red-avenue-annual-2025", "src-redavenue-kehua-investment-2025" ], "start_date": "2025-05-28", "to_entity_id": "ent-beijing-kehua", "unit": "percent_direct_equity", "unknowns": [ "identity and country of remaining 3.6705 percent minority", "current registration extract", "registration ID" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "01ad38648c2ada0cecb77b5270214a663f7710166448a894b5ac990d02f029b5", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "process_step", "value": "corporate ownership of photoresist producer" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "corporate ownership of photoresist producer" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "corporate ownership of photoresist producer" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] }, { "source_id": "src-redavenue-kehua-investment-2025", "title": "彤程新材料集团股份有限公司对外投资进展公告", "publisher": "彤程新材料集团股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2025-05/28/content_2074043.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-05-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The disclosure said business-registration changes remained at publication; the later annual report gives 96.3296%, a one-ten-thousandth-point rounding difference." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-tongcheng-electronic-materials-shanghai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海彤程电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-beijing-kehua", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京科华微电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-tongcheng-shanghai-owns-beijing-kehua", "predicate": "owns", "scope": "edge from ent-tongcheng-electronic-materials-shanghai to ent-beijing-kehua; commercial state 96.3295_percent_direct_holding_disclosed_2025_05; 96.3296_percent_annual_report_rounding; qualification state not_applicable", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "identity and country of remaining 3.6705 percent minority", "current registration extract", "registration ID" ], "source_ids": [ "src-red-avenue-annual-2025", "src-redavenue-kehua-investment-2025" ] } ] }, { "claim_ids": [ "clm-relationship-tongcheng-shanghai-owns-tongcheng-changzhou" ], "commercial_state": "wholly_owned_project_subsidiary_at_2025_year_end", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-tongcheng-changzhou-cmp-pad", "from_entity_id": "ent-tongcheng-electronic-materials-shanghai", "id": "rel-tongcheng-shanghai-owns-tongcheng-changzhou", "last_checked": "2026-07-29", "process_step": "corporate ownership of CMP-pad facility operator", "product_id": null, "qualification_state": "not_applicable", "quantity": 100, "record_type": "relationship", "relationship_id": "rel-tongcheng-shanghai-owns-tongcheng-changzhou", "relationship_type": "owns", "source_ids": [ "src-red-avenue-annual-2025" ], "start_date": null, "to_entity_id": "ent-tongcheng-electronic-materials-changzhou", "unit": "percent_equity", "unknowns": [ "incorporation date", "registration ID" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "6105061c53d273da92edd03558b69f073ca02ec767bee0ad6edae24ee3905a40", "stage_ids": [ "critical_materials", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "process_step", "value": "corporate ownership of CMP-pad facility operator" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "process_step", "value": "corporate ownership of CMP-pad facility operator" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "corporate ownership of CMP-pad facility operator" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-red-avenue-annual-2025", "title": "彤程新材料集团股份有限公司2025年年度报告", "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-18", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-tongcheng-electronic-materials-shanghai", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海彤程电子材料有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-tongcheng-electronic-materials-changzhou", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "彤程电子材料（常州）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-tongcheng-shanghai-owns-tongcheng-changzhou", "predicate": "owns", "scope": "edge from ent-tongcheng-electronic-materials-shanghai to ent-tongcheng-electronic-materials-changzhou; commercial state wholly_owned_project_subsidiary_at_2025_year_end; qualification state not_applicable", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "incorporation date", "registration ID" ], "source_ids": [ "src-red-avenue-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-tongfu-owns-nantong-tongfu" ], "commercial_state": "subsidiary_project_owner", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-tongfu", "id": "rel-tongfu-owns-nantong-tongfu", "last_checked": "2026-07-29", "process_step": "advanced packaging", "product_id": null, "qualification_state": "not_applicable", "quantity": 100, "record_type": "relationship", "relationship_id": "rel-tongfu-owns-nantong-tongfu", "relationship_type": "owns", "source_ids": [ "src-tongfu-annual-2025", "src-tongfu-hbm-project-2025" ], "start_date": null, "to_entity_id": "ent-nantong-tongfu", "unit": "percent", "unknowns": [], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "81093b93c6bcb2787dca94c127a4fd28daa9f8163dee4d508295c36751525042", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "process_step", "value": "advanced packaging" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "advanced packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-tongfu-annual-2025", "title": "通富微电子股份有限公司2025年年度报告", "publisher": "通富微电子股份有限公司", "url": "https://static.cninfo.com.cn/finalpage/2026-04-17/1225112762.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Two high-bandwidth-memory references are industry context; no named HBM product, customer, qualification, yield or shipment." ] }, { "source_id": "src-tongfu-hbm-project-2025", "title": "HBM芯粒先进封装研发及产线建设项目环境影响报告表公示", "publisher": "通富微电子股份有限公司", "url": "https://www.tfme.com/news/1380.html", "source_type": "company_project_eia", "primary_status": "primary", "publication_date": "2025-01-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Project/EIA receipt is not HBM customer qualification, qualified stack generation, yield, shipment, or volume production." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-tongfu", "record_level": "company", "canonical_legal_name_en": "TongFu Microelectronics Co., Ltd.", "canonical_legal_name_cn": "通富微电子股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-nantong-tongfu", "record_level": "company", "canonical_legal_name_en": "Nantong TongFu Microelectronics Co., Ltd.", "canonical_legal_name_cn": "南通通富微电子有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-tongfu-owns-nantong-tongfu", "predicate": "owns", "scope": "edge from ent-tongfu to ent-nantong-tongfu; commercial state subsidiary_project_owner; qualification state not_applicable", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [], "source_ids": [ "src-tongfu-annual-2025", "src-tongfu-hbm-project-2025" ] } ] }, { "claim_ids": [ "clm-relationship-transsion-brand-validates-cxmt-lpddr5" ], "commercial_state": "brand_phone_product_validation", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-transsion-brand", "id": "rel-transsion-brand-validates-cxmt-lpddr5", "last_checked": "2026-07-29", "process_step": null, "product_id": "prod-cxmt-lpddr5-12gb", "qualification_state": "customer_validated", "quantity": null, "record_type": "relationship", "relationship_id": "rel-transsion-brand-validates-cxmt-lpddr5", "relationship_type": "validates", "source_ids": [ "src-cxmt-xiaomi-transsion-validation-2023" ], "start_date": "2023-11-28", "to_entity_id": "ent-cxmt-corp", "unit": null, "unknowns": [ "contracting legal entity", "phone model", "shipment volume", "current status" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "221f5c396543a17de45d518ce2581c953d9f1b6fe8812d0a9c98187723bcc6b9", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cxmt-xiaomi-transsion-validation-2023", "title": "长鑫存储LPDDR5产品正式发布", "publisher": "CXMT", "url": "https://www.cxmt.com/news/info_90.html", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2023-11-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Names brands, not contracting legal entities; does not state sustained shipment volume." ] } ], "relationship_semantics": { "class": "validation_not_supplier", "boundary": "Validation is kept separate from supply, shipment, volume production, and customer deployment." }, "from_entity_reference": { "entity_id": "ent-transsion-brand", "record_level": "brand", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "to_entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-transsion-brand-validates-cxmt-lpddr5", "predicate": "validates", "scope": "edge from ent-transsion-brand to ent-cxmt-corp; commercial state brand_phone_product_validation; qualification state customer_validated", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "contracting legal entity", "phone model", "shipment volume", "current status" ], "source_ids": [ "src-cxmt-xiaomi-transsion-validation-2023" ] } ] }, { "claim_ids": [ "clm-relationship-tsmc-owns-nanjing" ], "commercial_state": "foreign_owned_mainland_operation", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-tsmc-nanjing-fab16", "from_entity_id": "ent-tsmc", "id": "rel-tsmc-owns-nanjing", "last_checked": "2026-07-29", "process_step": null, "product_id": null, "qualification_state": "operating", "quantity": null, "record_type": "relationship", "relationship_id": "rel-tsmc-owns-nanjing", "relationship_type": "owns", "source_ids": [ "src-tsmc-annual-2025" ], "start_date": null, "to_entity_id": "ent-tsmc-nanjing", "unit": null, "unknowns": [], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "53f69243a31202a7a5155b7d554c82a33d72dc5e1544be3c91abdd93d1886d70", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-tsmc-annual-2025", "title": "TSMC 2025 Annual Report", "publisher": "Taiwan Semiconductor Manufacturing Company Limited", "url": "https://investor.tsmc.com/sites/ir/annual-report/2025/2025%20Annual%20Report_E.pdf", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility listing does not by itself establish current tool BOM, local-supplier share, customers, utilization, or output." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-tsmc", "record_level": "company", "canonical_legal_name_en": "Taiwan Semiconductor Manufacturing Company Limited", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-tsmc-nanjing", "record_level": "company", "canonical_legal_name_en": "TSMC (Nanjing) Company Limited", "canonical_legal_name_cn": "台积电（南京）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-tsmc-owns-nanjing", "predicate": "owns", "scope": "edge from ent-tsmc to ent-tsmc-nanjing; commercial state foreign_owned_mainland_operation; qualification state operating", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [], "source_ids": [ "src-tsmc-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-tsmc-owns-shanghai" ], "commercial_state": "foreign_owned_mainland_operation", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-tsmc-shanghai-fab10", "from_entity_id": "ent-tsmc", "id": "rel-tsmc-owns-shanghai", "last_checked": "2026-07-29", "process_step": null, "product_id": null, "qualification_state": "operating", "quantity": null, "record_type": "relationship", "relationship_id": "rel-tsmc-owns-shanghai", "relationship_type": "owns", "source_ids": [ "src-tsmc-annual-2025" ], "start_date": null, "to_entity_id": "ent-tsmc-china", "unit": null, "unknowns": [], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "95311c4a80af434850e178475542a6798a4c357e8b2c40c01e684a51cf00327e", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-tsmc-annual-2025", "title": "TSMC 2025 Annual Report", "publisher": "Taiwan Semiconductor Manufacturing Company Limited", "url": "https://investor.tsmc.com/sites/ir/annual-report/2025/2025%20Annual%20Report_E.pdf", "source_type": "annual_report", "primary_status": "primary", "publication_date": "2026-04-17", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Facility listing does not by itself establish current tool BOM, local-supplier share, customers, utilization, or output." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-tsmc", "record_level": "company", "canonical_legal_name_en": "Taiwan Semiconductor Manufacturing Company Limited", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-tsmc-china", "record_level": "company", "canonical_legal_name_en": "TSMC (China) Company Limited", "canonical_legal_name_cn": "台积电（中国）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-tsmc-owns-shanghai", "predicate": "owns", "scope": "edge from ent-tsmc to ent-tsmc-china; commercial state foreign_owned_mainland_operation; qualification state operating", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [], "source_ids": [ "src-tsmc-annual-2025" ] } ] }, { "claim_ids": [ "clm-relationship-umc-owns-united-semi-xiamen" ], "commercial_state": "foreign_owned_mainland_operation", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-united-semi-xiamen", "from_entity_id": "ent-umc", "id": "rel-umc-owns-united-semi-xiamen", "last_checked": "2026-07-29", "process_step": null, "product_id": null, "qualification_state": "volume_production", "quantity": null, "record_type": "relationship", "relationship_id": "rel-umc-owns-united-semi-xiamen", "relationship_type": "owns", "source_ids": [ "src-umc-fab-information" ], "start_date": null, "to_entity_id": "ent-united-semi-xiamen", "unit": null, "unknowns": [], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "2a934298b9c931ca4497427831066d0a8a2c4d951917f48482160358aa00a808", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-umc-fab-information", "title": "Fab Information", "publisher": "United Microelectronics Corporation", "url": "https://www.umc.com/en/Html/fab_information", "source_type": "company_facility_page", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Designed capacity is not current installed, utilized, actual output, yield, or customer mix." ] } ], "relationship_semantics": { "class": "ownership", "boundary": "Ownership is a corporate relationship. It does not establish facility location, operating control, product origin, or a supplier relationship." }, "from_entity_reference": { "entity_id": "ent-umc", "record_level": "company", "canonical_legal_name_en": "United Microelectronics Corporation", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-united-semi-xiamen", "record_level": "company", "canonical_legal_name_en": "United Semiconductor (Xiamen) Co., Ltd.", "canonical_legal_name_cn": "联芯集成电路制造（厦门）有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-umc-owns-united-semi-xiamen", "predicate": "owns", "scope": "edge from ent-umc to ent-united-semi-xiamen; commercial state foreign_owned_mainland_operation; qualification state volume_production", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [], "source_ids": [ "src-umc-fab-information" ] } ] }, { "claim_ids": [ "clm-relationship-uprecision-company-k-2024-acceptance" ], "commercial_state": "batch_customer_acceptance", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-uprecision", "id": "rel-uprecision-company-k-2024-acceptance", "last_checked": "2026-07-29", "process_step": "nanometre motion/control products and technical-development services", "product_id": null, "qualification_state": "customer_accepted_subsystem_scope", "quantity": null, "record_type": "relationship", "relationship_id": "rel-uprecision-company-k-2024-acceptance", "relationship_type": "reported_customer_acceptance_by", "source_ids": [ "src-uprecision-prospectus-2026" ], "start_date": "2024-01-01", "to_entity_id": "ent-uprecision-company-k-unresolved", "unit": null, "unknowns": [ "Company K legal identity", "model", "quantity", "scanner/bonder integration", "fab", "layer", "volume use" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "e4d044825ea3b23812c857a29faa25fc37c608ecfb07c816734ca7f3f2474a95", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "nanometre motion/control products and technical-development services" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-uprecision-prospectus-2026", "title": "北京华卓精科科技股份有限公司招股说明书", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202606/002213_20260630_2DQN.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-06-30", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Company K remains anonymous and must not be resolved to SMEE.", "Subsystem commercialization and customer acceptance do not establish scanner delivery, fab insertion, qualified layer or high-volume use." ] } ], "relationship_semantics": { "class": "reported_customer_acceptance", "boundary": "The canonical relationship preserves a reported customer-acceptance claim at its stated evidence level; no broader customer, volume, or deployment claim is added." }, "from_entity_reference": { "entity_id": "ent-uprecision", "record_level": "company", "canonical_legal_name_en": "Beijing U-Precision Tech Co., Ltd.", "canonical_legal_name_cn": "北京华卓精科科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-uprecision-company-k-unresolved", "record_level": "unresolved_anonymized_counterparty", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "lead_only", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-uprecision-company-k-2024-acceptance", "predicate": "reported_customer_acceptance_by", "scope": "edge from ent-uprecision to ent-uprecision-company-k-unresolved; commercial state batch_customer_acceptance; qualification state customer_accepted_subsystem_scope", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "Company K legal identity", "model", "quantity", "scanner/bonder integration", "fab", "layer", "volume use" ], "source_ids": [ "src-uprecision-prospectus-2026" ] } ] }, { "claim_ids": [ "clm-relationship-uprecision-supplies-smee-dual-stage-2020" ], "commercial_state": "shipped", "completion_state": "relationship_backed", "end_date": null, "equipment_component_id": "comp-uprecision-dual-stage", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-uprecision", "id": "rel-uprecision-supplies-smee-dual-stage-2020", "last_checked": "2026-07-29", "process_step": "lithography dual-wafer-stage subsystem", "product_id": null, "qualification_state": "not_accepted_at_source_cutoff", "quantity": 1, "record_type": "relationship", "relationship_id": "rel-uprecision-supplies-smee-dual-stage-2020", "relationship_type": "supplies", "source_ids": [ "src-uprecision-round2-2023" ], "start_date": "2020-04-01", "to_entity_id": "ent-smee", "unit": "dual_wafer_stage", "unknowns": [ "scanner model", "destination fab", "later acceptance", "qualified layer", "volume use" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "b00374c31fc75cf05bc045db0774485474b9e4abbae2ef9c50ceadefcfff67e4", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "process_step", "value": "lithography dual-wafer-stage subsystem" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "lithography dual-wafer-stage subsystem" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-uprecision-round2-2023", "title": "关于北京华卓精科科技股份有限公司首次公开发行股票并在科创板上市申请文件第二轮审核问询函的回复", "publisher": "上海证券交易所", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202312/000571_20231229_25V2.pdf", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2023-12-29", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Subsystem shipment only; no scanner model, fab, later acceptance, qualified layer or volume use." ] } ], "relationship_semantics": { "class": "supplier", "boundary": "The canonical relationship explicitly uses supplies; its product, equipment, component, facility, process, qualification, commercial, and evidence fields still define the exact ceiling." }, "from_entity_reference": { "entity_id": "ent-uprecision", "record_level": "company", "canonical_legal_name_en": "Beijing U-Precision Tech Co., Ltd.", "canonical_legal_name_cn": "北京华卓精科科技股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-smee", "record_level": "company", "canonical_legal_name_en": "Shanghai Micro Electronics Equipment (Group) Co., Ltd.", "canonical_legal_name_cn": "上海微电子装备（集团）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-uprecision-supplies-smee-dual-stage-2020", "predicate": "supplies", "scope": "edge from ent-uprecision to ent-smee; commercial state shipped; qualification state not_accepted_at_source_cutoff", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "scanner model", "destination fab", "later acceptance", "qualified layer", "volume use" ], "source_ids": [ "src-uprecision-round2-2023" ] } ] }, { "claim_ids": [ "clm-relationship-util-001" ], "commercial_state": "award_notice_received_formal_contract_pending", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-util-cxmt-phase2", "from_entity_id": "ent-util-lk-suzhou", "id": "rel-util-001", "last_checked": "2026-07-29", "process_step": "cleanroom-system package", "product_id": "svc-util-cxmt-cleanroom", "qualification_state": "unknown", "quantity": 728200000, "record_type": "relationship", "relationship_id": "rel-util-001", "relationship_type": "selected_supplier_for", "source_ids": [ "src-util-001" ], "start_date": "2024-02-05", "to_entity_id": "ent-util-11th-tech", "unit": "CNY_excluding_tax_award_value", "unknowns": [ "formal contract signature", "final scope and settlement terms", "installation", "site acceptance", "production qualification" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "00abfc5a8f7496a3d0ea61531da8a51356b860d1cd388aa936f6502f92a98dfc", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "process_step", "value": "cleanroom-system package" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "cleanroom-system package" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-001", "title": "亚翔系统集成科技（苏州）股份有限公司关于公司重大项目中标的公告", "publisher": "亚翔系统集成科技（苏州）股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2024-02/06/content_1875556.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2024-02-06", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The issuer expressly says a formal project contract still had to be signed and construction, settlement and payment details remained subject to that contract." ] } ], "relationship_semantics": { "class": "supplier_selection", "boundary": "The canonical relationship explicitly records a selected supplier. Selection does not by itself prove delivery, acceptance, qualification, recurring volume, or current production use." }, "from_entity_reference": { "entity_id": "ent-util-lk-suzhou", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "亚翔系统集成科技（苏州）股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-util-11th-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "信息产业电子第十一设计研究院科技工程股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-util-001", "predicate": "selected_supplier_for", "scope": "edge from ent-util-lk-suzhou to ent-util-11th-tech; commercial state award_notice_received_formal_contract_pending; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "formal contract signature", "final scope and settlement terms", "installation", "site acceptance", "production qualification" ], "source_ids": [ "src-util-001" ] } ] }, { "claim_ids": [ "clm-relationship-util-002" ], "commercial_state": "formal_contract_signed_subject_to_effectiveness_conditions", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-util-huahong-wuxi-project", "from_entity_id": "ent-util-11th-tech", "id": "rel-util-002", "last_checked": "2026-07-29", "process_step": "EPC management, design, cleanroom, MEP and process-service systems", "product_id": "svc-util-huahong-epc", "qualification_state": "unknown", "quantity": 4679514129.71, "record_type": "relationship", "relationship_id": "rel-util-002", "relationship_type": "contracted_for", "source_ids": [ "src-util-002" ], "start_date": "2023-06-03", "to_entity_id": "ent-util-huahong-wuxi", "unit": "CNY_including_tax_contract_scope", "unknowns": [ "effectiveness-condition satisfaction date", "actual start and completion", "acceptance", "installed systems", "production qualification" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "57a84219649c48647caabf790cac05daca80e59528507c4523c03734a71423c3", "stage_ids": [ "board_system", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "process_step", "value": "EPC management, design, cleanroom, MEP and process-service systems" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "process_step", "value": "EPC management, design, cleanroom, MEP and process-service systems" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "EPC management, design, cleanroom, MEP and process-service systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-002", "title": "无锡市太极实业股份有限公司关于子公司十一科技中标重大项目工程的进展公告", "publisher": "无锡市太极实业股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2023-06/03/content_1776018.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2023-06-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Formal signature is proven, but effectiveness was conditional on specified internal, shareholder and government approvals. Completion, site acceptance, production qualification, uptime and output are not proven." ] } ], "relationship_semantics": { "class": "contracted_scope", "boundary": "A contract proves only the named contracted scope and state; it does not prove completion, acceptance, operation, or production use." }, "from_entity_reference": { "entity_id": "ent-util-11th-tech", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "信息产业电子第十一设计研究院科技工程股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-util-huahong-wuxi", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "华虹半导体制造（无锡）有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-util-002", "predicate": "contracted_for", "scope": "edge from ent-util-11th-tech to ent-util-huahong-wuxi; commercial state formal_contract_signed_subject_to_effectiveness_conditions; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "effectiveness-condition satisfaction date", "actual start and completion", "acceptance", "installed systems", "production qualification" ], "source_ids": [ "src-util-002" ] } ] }, { "claim_ids": [ "clm-relationship-util-003" ], "commercial_state": "formal_contract_signed_subject_to_effectiveness_conditions", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-util-huahong-wuxi-project", "from_entity_id": "ent-util-shanghai-fourth", "id": "rel-util-003", "last_checked": "2026-07-29", "process_step": "civil works including outdoor works", "product_id": "svc-util-huahong-civil", "qualification_state": "unknown", "quantity": 3270404668.94, "record_type": "relationship", "relationship_id": "rel-util-003", "relationship_type": "contracted_for", "source_ids": [ "src-util-002" ], "start_date": "2023-06-03", "to_entity_id": "ent-util-huahong-wuxi", "unit": "CNY_including_tax_contract_scope", "unknowns": [ "effectiveness-condition satisfaction date", "actual start and completion", "acceptance" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "81b083d9136f7faaecfe57a0ac12621b75bdd2e2dc860eb7a3700265996fe025", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "civil works including outdoor works" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-002", "title": "无锡市太极实业股份有限公司关于子公司十一科技中标重大项目工程的进展公告", "publisher": "无锡市太极实业股份有限公司 / 上海证券报", "url": "https://paper.cnstock.com/html/2023-06/03/content_1776018.htm", "source_type": "issuer_statutory_disclosure", "primary_status": "primary", "publication_date": "2023-06-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Formal signature is proven, but effectiveness was conditional on specified internal, shareholder and government approvals. Completion, site acceptance, production qualification, uptime and output are not proven." ] } ], "relationship_semantics": { "class": "contracted_scope", "boundary": "A contract proves only the named contracted scope and state; it does not prove completion, acceptance, operation, or production use." }, "from_entity_reference": { "entity_id": "ent-util-shanghai-fourth", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海建工四建集团有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-util-huahong-wuxi", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "华虹半导体制造（无锡）有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-util-003", "predicate": "contracted_for", "scope": "edge from ent-util-shanghai-fourth to ent-util-huahong-wuxi; commercial state formal_contract_signed_subject_to_effectiveness_conditions; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "effectiveness-condition satisfaction date", "actual start and completion", "acceptance" ], "source_ids": [ "src-util-002" ] } ] }, { "claim_ids": [ "clm-relationship-util-004" ], "commercial_state": "supplier_reported_award", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": "fac-util-silan-sic-phase1", "from_entity_id": "ent-util-shengjian", "id": "rel-util-004", "last_checked": "2026-07-29", "process_step": "acid/alkali exhaust and PGEX", "product_id": "svc-util-silan-exhaust", "qualification_state": "unknown", "quantity": null, "record_type": "relationship", "relationship_id": "rel-util-004", "relationship_type": "reported_selected_supplier_for", "source_ids": [ "src-util-003" ], "start_date": "2025-01-23", "to_entity_id": "ent-util-silan-jihong", "unit": null, "unknowns": [ "award amount", "contract signature", "installation", "acceptance", "commissioning", "component origin" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "116b03f94b34a7e94650fee8ba4216fbe603c8840a2ea5d3d117a8aba65a7715", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "process_step", "value": "acid/alkali exhaust and PGEX" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "acid/alkali exhaust and PGEX" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-003", "title": "喜讯 | 盛剑科技中标厦门士兰集宏半导体有限公司项目", "publisher": "上海盛剑科技股份有限公司", "url": "https://www.sheng-jian.com/news_details/386.html", "source_type": "official_supplier_project_notice", "primary_status": "primary", "publication_date": "2025-01-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No award amount, signed contract, installation, acceptance or commissioning receipt is published. The 720,000 wafers/year figure is a two-phase eventual design target and not Phase I installed capacity or output." ] } ], "relationship_semantics": { "class": "reported_supplier_selection", "boundary": "The canonical record preserves a reported supplier selection at its stated evidence level. It is not promoted to confirmed delivery or qualification." }, "from_entity_reference": { "entity_id": "ent-util-shengjian", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "上海盛剑科技股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-util-silan-jihong", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "厦门士兰集宏半导体有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-util-004", "predicate": "reported_selected_supplier_for", "scope": "edge from ent-util-shengjian to ent-util-silan-jihong; commercial state supplier_reported_award; qualification state unknown", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "award amount", "contract signature", "installation", "acceptance", "commissioning", "component origin" ], "source_ids": [ "src-util-003" ] } ] }, { "claim_ids": [ "clm-relationship-util-005" ], "commercial_state": "supplier_reported_award", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "VENDOR_REPORTED", "facility_id": "fac-util-yuerun-a1", "from_entity_id": "ent-util-huakang", "id": "rel-util-005", "last_checked": "2026-07-29", "process_step": "cleanroom fit-out and supporting utility installation through acceptance and handover", "product_id": "svc-util-yuerun-cleanroom", "qualification_state": "unknown", "quantity": 105900000, "record_type": "relationship", "relationship_id": "rel-util-005", "relationship_type": "reported_selected_supplier_for", "source_ids": [ "src-util-004" ], "start_date": "2026-05-11", "to_entity_id": "ent-util-yuerun", "unit": "CNY_rounded_award_value", "unknowns": [ "counterparty confirmation", "exact unrounded award value", "contract signature", "installation", "acceptance", "production qualification" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "ea78813b4cf985b55d31d2d52b1d578ea07385d306c8dd769afe5c40c304c646", "stage_ids": [ "power_cooling", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "process_step", "value": "cleanroom fit-out and supporting utility installation through acceptance and handover" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "process_step", "value": "cleanroom fit-out and supporting utility installation through acceptance and handover" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "cleanroom fit-out and supporting utility installation through acceptance and handover" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-004", "title": "华康洁净中标越润高端封测基地项目 强链国产半导体", "publisher": "武汉华康世纪洁净科技股份有限公司", "url": "https://www.whhksj.com/details/217.html", "source_type": "official_supplier_project_notice", "primary_status": "primary", "publication_date": "2026-05-11", "date_checked": "2026-07-29", "access_state": "indexed_direct_open_error", "limitations": [ "Supplier-authored award notice. No counterparty confirmation, signed contract, installation, acceptance, production qualification or output receipt was located." ] } ], "relationship_semantics": { "class": "reported_supplier_selection", "boundary": "The canonical record preserves a reported supplier selection at its stated evidence level. It is not promoted to confirmed delivery or qualification." }, "from_entity_reference": { "entity_id": "ent-util-huakang", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "武汉华康世纪洁净科技股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-util-yuerun", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "越润集成电路（绍兴）有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-util-005", "predicate": "reported_selected_supplier_for", "scope": "edge from ent-util-huakang to ent-util-yuerun; commercial state supplier_reported_award; qualification state unknown", "evidence_state": "VENDOR_REPORTED", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "counterparty confirmation", "exact unrounded award value", "contract signature", "installation", "acceptance", "production qualification" ], "source_ids": [ "src-util-004" ] } ] }, { "claim_ids": [ "clm-relationship-util-006" ], "commercial_state": "government_procurement_awarded", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-util-kyky", "id": "rel-util-006", "last_checked": "2026-07-29", "process_step": "semiconductor-related ultraclean vacuum testing", "product_id": "prod-util-kyky-vacuum-test", "qualification_state": "unknown", "quantity": 1, "record_type": "relationship", "relationship_id": "rel-util-006", "relationship_type": "selected_supplier_for", "source_ids": [ "src-util-005" ], "start_date": "2026-05-07", "to_entity_id": "ent-util-ihep", "unit": "custom_system_set", "unknowns": [ "delivery site", "delivery", "installation", "acceptance", "production-fab use", "component origin" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "b0b18aeb3871d75a75cae488c67581714fee945ea156eca645eb3cd844bda08a", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "process_step", "value": "semiconductor-related ultraclean vacuum testing" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "semiconductor-related ultraclean vacuum testing" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-util-005", "title": "中国科学院高能物理研究所超净半导体真空测试系统采购项目中标公告", "publisher": "中国政府采购网 / 中华人民共和国财政部国库司", "url": "https://www.ccgp.gov.cn/cggg/zygg/zbgg/202605/t20260507_26518210.htm", "source_type": "government_procurement_award", "primary_status": "primary", "publication_date": "2026-05-07", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The award proves vendor, purchaser, system, model class, quantity and price. It does not prove delivery, installation, acceptance, semiconductor-fab production use or component origin." ] } ], "relationship_semantics": { "class": "supplier_selection", "boundary": "The canonical relationship explicitly records a selected supplier. Selection does not by itself prove delivery, acceptance, qualification, recurring volume, or current production use." }, "from_entity_reference": { "entity_id": "ent-util-kyky", "record_level": "company", "canonical_legal_name_en": null, "canonical_legal_name_cn": "北京中科科仪股份有限公司", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-util-ihep", "record_level": "research_institute", "canonical_legal_name_en": "Institute of High Energy Physics, Chinese Academy of Sciences", "canonical_legal_name_cn": "中国科学院高能物理研究所", "identity_resolution_state": "named_legal_endpoint_source_bounded", "completion_state": "source_backed", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "claim_refs": [ { "claim_id": "clm-relationship-util-006", "predicate": "selected_supplier_for", "scope": "edge from ent-util-kyky to ent-util-ihep; commercial state government_procurement_awarded; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "delivery site", "delivery", "installation", "acceptance", "production-fab use", "component origin" ], "source_ids": [ "src-util-005" ] } ] }, { "claim_ids": [ "clm-relationship-verisilicon-depends-globalfoundries-22fdx" ], "commercial_state": "platform_built_on_process", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-verisilicon", "id": "rel-verisilicon-depends-globalfoundries-22fdx", "last_checked": "2026-07-29", "process_step": "22FDX process and PDK", "product_id": "prod-verisilicon-fdsoi-wireless-ip", "qualification_state": "production_shipments_claimed_for_anonymous_customers", "quantity": null, "record_type": "relationship", "relationship_id": "rel-verisilicon-depends-globalfoundries-22fdx", "relationship_type": "depends_on", "source_ids": [ "src-verisilicon-gf-22fdx-2025" ], "start_date": null, "to_entity_id": "ent-globalfoundries", "unit": null, "unknowns": [ "foundry facility", "PDK revision", "named chips/customers" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "b8a461969cadbc878f4ac517883a2b834e0e144e60ec35b0437ea67aee31a681", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "process_step", "value": "22FDX process and PDK" } ] } ], "canonical_classification_inputs": [ { "field": "process_step", "value": "22FDX process and PDK" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-verisilicon-gf-22fdx-2025", "title": "VeriSilicon Introduces FD-SOI Wireless IP Platform", "publisher": "VeriSilicon Microelectronics (Shanghai) Co., Ltd.", "url": "https://www.verisilicon.com/en/PressRelease/WirelessIP", "source_type": "company_product_announcement", "primary_status": "primary", "publication_date": "2025-09-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Customers and chips are anonymous; facility and shipment split are undisclosed." ] } ], "relationship_semantics": { "class": "dependency", "boundary": "The dependency is preserved at the canonical scope. It does not identify an unnamed supplier or prove that a substitute is qualified." }, "from_entity_reference": { "entity_id": "ent-verisilicon", "record_level": "company", "canonical_legal_name_en": "VeriSilicon Microelectronics (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "芯原微电子（上海）股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-globalfoundries", "record_level": "company", "canonical_legal_name_en": "GlobalFoundries Inc.", "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-verisilicon-depends-globalfoundries-22fdx", "predicate": "depends_on", "scope": "edge from ent-verisilicon to ent-globalfoundries; commercial state platform_built_on_process; qualification state production_shipments_claimed_for_anonymous_customers", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "foundry facility", "PDK revision", "named chips/customers" ], "source_ids": [ "src-verisilicon-gf-22fdx-2025" ] } ] }, { "claim_ids": [ "clm-relationship-xiaomi-brand-validates-cxmt-lpddr5" ], "commercial_state": "brand_phone_product_validation", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-xiaomi-brand", "id": "rel-xiaomi-brand-validates-cxmt-lpddr5", "last_checked": "2026-07-29", "process_step": null, "product_id": "prod-cxmt-lpddr5-12gb", "qualification_state": "customer_validated", "quantity": null, "record_type": "relationship", "relationship_id": "rel-xiaomi-brand-validates-cxmt-lpddr5", "relationship_type": "validates", "source_ids": [ "src-cxmt-xiaomi-transsion-validation-2023" ], "start_date": "2023-11-28", "to_entity_id": "ent-cxmt-corp", "unit": null, "unknowns": [ "contracting legal entity", "phone model", "shipment volume", "current status" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "1f15bf93a92bdf08c5731e4ebffc0fdd05f5c474af04f4d6a0d483d894e6d83a", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-cxmt-xiaomi-transsion-validation-2023", "title": "长鑫存储LPDDR5产品正式发布", "publisher": "CXMT", "url": "https://www.cxmt.com/news/info_90.html", "source_type": "company_press_release", "primary_status": "primary", "publication_date": "2023-11-28", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Names brands, not contracting legal entities; does not state sustained shipment volume." ] } ], "relationship_semantics": { "class": "validation_not_supplier", "boundary": "Validation is kept separate from supply, shipment, volume production, and customer deployment." }, "from_entity_reference": { "entity_id": "ent-xiaomi-brand", "record_level": "brand", "canonical_legal_name_en": null, "canonical_legal_name_cn": null, "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a brand, service, branch, research, analysis, or unresolved endpoint record rather than silently promoting it to a resolved legal company." }, "to_entity_reference": { "entity_id": "ent-cxmt-corp", "record_level": "company", "canonical_legal_name_en": "CXMT Corporation", "canonical_legal_name_cn": "长鑫科技集团股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-xiaomi-brand-validates-cxmt-lpddr5", "predicate": "validates", "scope": "edge from ent-xiaomi-brand to ent-cxmt-corp; commercial state brand_phone_product_validation; qualification state customer_validated", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "contracting legal entity", "phone model", "shipment volume", "current status" ], "source_ids": [ "src-cxmt-xiaomi-transsion-validation-2023" ] } ] }, { "claim_ids": [ "clm-relationship-xmc-espressif-strategic-cooperation" ], "commercial_state": "announced_strategic_cooperation", "completion_state": "relationship_backed", "end_date": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "from_entity_id": "ent-xmc", "id": "rel-xmc-espressif-strategic-cooperation", "last_checked": "2026-07-29", "process_step": "50nm SPI NOR", "product_id": "prod-xmc-spi-nor", "qualification_state": "unknown", "quantity": null, "record_type": "relationship", "relationship_id": "rel-xmc-espressif-strategic-cooperation", "relationship_type": "strategic_cooperation_with", "source_ids": [ "src-xmc-espressif-cooperation" ], "start_date": null, "to_entity_id": "ent-espressif", "unit": null, "unknowns": [ "wafer quantity", "yield", "current program", "end-product volume" ], "canonical_dataset": "relationships.yaml", "canonical_record_sha256": "cb340a9d11f2fbc1a7be52103bf352d27ed0bdca1535b9afd76d8ceb23fb5af4", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "process_step", "value": "50nm SPI NOR" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-xmc-espressif-cooperation", "title": "武汉新芯与乐鑫科技达成战略合作", "publisher": "武汉新芯集成电路制造有限公司", "url": "https://www.xmcwh.com/site/details/123?details=1", "source_type": "company_press_release", "primary_status": "primary", "publication_date": null, "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Strategic-cooperation statement does not disclose wafer quantity, current program status, yield, or end-product volume." ] } ], "relationship_semantics": { "class": "strategic_cooperation", "boundary": "Cooperation is not converted into a supplier, customer, ownership, qualification, or production relationship." }, "from_entity_reference": { "entity_id": "ent-xmc", "record_level": "company", "canonical_legal_name_en": "Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.", "canonical_legal_name_cn": "武汉新芯集成电路股份有限公司", "identity_resolution_state": "not_recorded", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "to_entity_reference": { "entity_id": "ent-espressif", "record_level": "company", "canonical_legal_name_en": "Espressif Systems (Shanghai) Co., Ltd.", "canonical_legal_name_cn": "乐鑫信息科技（上海）股份有限公司", "identity_resolution_state": "canonical_identity_closed", "completion_state": "source_backed", "boundary": "This points to a canonical company record. Ownership, control, headquarters, operating geography, facility location, and product origin remain separate fields." }, "claim_refs": [ { "claim_id": "clm-relationship-xmc-espressif-strategic-cooperation", "predicate": "strategic_cooperation_with", "scope": "edge from ent-xmc to ent-espressif; commercial state announced_strategic_cooperation; qualification state unknown", "evidence_state": "CONFIRMED_PRIMARY", "confidence": "high_for_disclosed_edge_scope", "claim_ceiling": null, "readiness_state": "unknown", "missing_proof": [ "wafer quantity", "yield", "current program", "end-product volume" ], "source_ids": [ "src-xmc-espressif-cooperation" ] } ] } ], "gaps": [ { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-ai-accelerator-manufacturing-and-customer-receipts-20260729", "id": "gap-ai-accelerator-manufacturing-and-customer-receipts-20260729", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "model-specific foundry and facility", "memory supplier and exact device", "OSAT/package/substrate/interposer", "customer procurement and acceptance", "model shipment volume", "yield and independent workload receipt" ], "next_action": "Retrieve customer-origin procurement/acceptance records and supplier filings that name the same accelerator model and legal endpoints.", "priority": 1, "question": "Which named foundry, wafer facility, OSAT, memory supplier and customer closes each mainland accelerator model's manufacturing and shipment chain?", "record_type": "gap", "source_ids": [], "why_it_matters": "None of the ten accelerator lanes exposes a complete model-level foundry-memory-package-customer-yield chain.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "e1ea5e8a4ff5c66c5196ee0bf7cbd37181e70aa7e8caafdbd88a0be6867d9e74", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "Which named foundry, wafer facility, OSAT, memory supplier and customer closes each mainland accelerator model's manufacturing and shipment chain?", "why_it_matters": "None of the ten accelerator lanes exposes a complete model-level foundry-memory-package-customer-yield chain.", "next_action": "Retrieve customer-origin procurement/acceptance records and supplier filings that name the same accelerator model and legal endpoints." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-anji-named-customer-sku", "id": "gap-anji-named-customer-sku", "last_checked": "2026-07-29", "layer": "materials_grades_and_qualification", "missing_proof": [ "SKU/formulation", "composition/grade", "named facility", "qualification date", "lot volume", "defectivity/yield" ], "next_action": "Retrieve customer-side qualification or procurement evidence naming Anji SKU and layer.", "priority": 6, "question": "Which exact Anji SKU/formulation is qualified at which fab and layer?", "record_type": "gap", "source_ids": [], "why_it_matters": "Catalogue grade or family-level volume language does not establish fab qualification, lot quality or process yield.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "02ce266a611c353f47d2d80dd959233ec90ae08982fe86ec3716030c27f372f3", "stage_ids": [ "critical_materials", "assembly_test", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_grades_and_qualification" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_grades_and_qualification", "question": "Which exact Anji SKU/formulation is qualified at which fab and layer?", "why_it_matters": "Catalogue grade or family-level volume language does not establish fab qualification, lot quality or process yield.", "next_action": "Retrieve customer-side qualification or procurement evidence naming Anji SKU and layer." } }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-baidu-p800-cluster-primary-test-asset", "id": "gap-baidu-p800-cluster-primary-test-asset", "last_checked": "2026-07-29", "layer": "downstream_validation", "missing_proof": [ "legal owner/operator", "site", "asset/BOM count", "SAT", "CAICT report/certificate", "test window/method", "uptime/failures", "utilization" ], "next_action": "Retrieve the CAICT report and Baidu facility/asset record identifying site and exact P800 count.", "priority": 3, "question": "Where are Baidu's P800 clusters, how many exact active cards do they contain, and what did CAICT test?", "record_type": "gap", "source_ids": [ "src-baidu-p800-large-cluster-caict-claim-20250723" ], "why_it_matters": "Framework, firmware, catalogue and powered-on states are below delivery, acceptance, qualification and sustained operation.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "40262e32aeb49b4102556e0cc0a1d2a9eb55a32a3472c81f43f4c4e601f8c36f", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "downstream_validation" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-baidu-p800-large-cluster-caict-claim-20250723", "title": "首家！AI算力最高评级！", "publisher": "百度智能云", "url": "https://cloud.baidu.com/news/news_377f7acf-07e4-4787-a0f5-d70671dd6f34", "source_type": "official_operator_news", "primary_status": "primary", "publication_date": "2025-07-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "CAICT report/certificate, test version, duration, sample, pass criteria and raw results were not retrieved.", "10,000- and 30,000-card terms are rounded vendor classes, not exact installed/qualified/utilized counts." ] } ], "editorial_display": { "layer": "downstream_validation", "question": "Where are Baidu's P800 clusters, how many exact active cards do they contain, and what did CAICT test?", "why_it_matters": "Framework, firmware, catalogue and powered-on states are below delivery, acceptance, qualification and sustained operation.", "next_action": "Retrieve the CAICT report and Baidu facility/asset record identifying site and exact P800 count." } }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-chinatelecom-framework-execution-bom", "id": "gap-chinatelecom-framework-execution-bom", "last_checked": "2026-07-29", "layer": "missing_supplier_or_customer_receipt", "missing_proof": [ "ZJZB-2024-18920 technical annex", "PO", "server model", "CPU/accelerator part", "quantity", "arrival/test acceptance", "facility" ], "next_action": "Retrieve a ZJZB-2024-18920 PO plus arrival/test acceptance and technical annex.", "priority": 3, "question": "Which China Telecom ARM-A/GPU server models and chip parts were ordered and accepted?", "record_type": "gap", "source_ids": [ "src-digital-china-chinatelecom-framework-20250423" ], "why_it_matters": "Framework, firmware, catalogue and powered-on states are below delivery, acceptance, qualification and sustained operation.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "bb96c72f34b96d92c09c967af77631cc79c68e95b03669b26e0addfa2c539e09", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-digital-china-chinatelecom-framework-20250423", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2025-04/23/content_2053613.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2025-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Framework award value is not ordered, delivered or accepted value.", "Server models, CPU/accelerator vendor and part numbers, memory/NIC BOM, quantity, receiving affiliate/facility and test receipt are undisclosed." ] } ], "editorial_display": { "layer": "missing_supplier_or_customer_receipt", "question": "Which China Telecom ARM-A/GPU server models and chip parts were ordered and accepted?", "why_it_matters": "Framework, firmware, catalogue and powered-on states are below delivery, acceptance, qualification and sustained operation.", "next_action": "Retrieve a ZJZB-2024-18920 PO plus arrival/test acceptance and technical annex." } }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-cmcc-framework-execution-bom", "id": "gap-cmcc-framework-execution-bom", "last_checked": "2026-07-29", "layer": "missing_supplier_or_customer_receipt", "missing_proof": [ "technical annex", "executed PO", "server model", "chip BOM", "quantity", "delivery", "SAT/asset receipt", "resource pool" ], "next_action": "Retrieve CMCC20240500088 technical specifications or an executed PO/SAT record.", "priority": 3, "question": "How many of the 842 China Mobile framework servers were ordered and accepted, with what chip BOM?", "record_type": "gap", "source_ids": [ "src-digital-china-cmcc-framework-20240824" ], "why_it_matters": "Framework, firmware, catalogue and powered-on states are below delivery, acceptance, qualification and sustained operation.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "6c3b2957cee50347642a04b8e5627b6ab518b1f5b8e3f3be788b872b95a5f599", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-digital-china-cmcc-framework-20240824", "title": "神州数码集团股份有限公司关于中标项目签订框架协议的公告", "publisher": "神州数码集团股份有限公司董事会", "url": "https://paper.cnstock.com/html/2024-08/24/content_1957609.htm", "source_type": "listed_company_mandatory_disclosure", "primary_status": "primary", "publication_date": "2024-08-24", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "842 is a framework award ceiling, not an actual order, shipment, installation or acceptance count.", "Server model, accelerator/CPU/memory/NIC BOM, facility, value, serial and asset receipt are undisclosed." ] } ], "editorial_display": { "layer": "missing_supplier_or_customer_receipt", "question": "How many of the 842 China Mobile framework servers were ordered and accepted, with what chip BOM?", "why_it_matters": "Framework, firmware, catalogue and powered-on states are below delivery, acceptance, qualification and sustained operation.", "next_action": "Retrieve CMCC20240500088 technical specifications or an executed PO/SAT record." } }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-ctyun-hardware-procurement-acceptance", "id": "gap-ctyun-hardware-procurement-acceptance", "last_checked": "2026-07-29", "layer": "downstream_validation", "missing_proof": [ "procurement/PO", "supplier legal entity", "model/configuration", "quantity", "delivery/acceptance", "resource-pool owner/address", "utilization", "field reliability" ], "next_action": "Retrieve Tianyi Cloud/China Telecom procurement award or asset/SAT record naming PAK/PCH hardware and resource pool.", "priority": 3, "question": "Who legally supplied the Tianyi Cloud PAK/PCH hardware, in what quantity, and where was it accepted?", "record_type": "gap", "source_ids": [ "src-ctyun-ascend-cloud-20260508", "src-ctyun-cambricon-cloud-20260703" ], "why_it_matters": "The current receipt establishes a bounded state but does not close qualification, capacity, supplier identity or manufacturing scope.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "88acf2f3b765a0dfd875d8de9801b73cc02f1f75af80e7c23a11765a9b898ab8", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "downstream_validation" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-ctyun-ascend-cloud-20260508", "title": "昇腾计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349596", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-05-08", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ] }, { "source_id": "src-ctyun-cambricon-cloud-20260703", "title": "寒武纪计算加速型云主机", "publisher": "天翼云科技有限公司", "url": "https://www.ctyun.cn/document/10029787/10349603", "source_type": "official_product_documentation", "primary_status": "primary", "publication_date": "2026-07-03", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ] } ], "editorial_display": { "layer": "downstream_validation", "question": "Who legally supplied the Tianyi Cloud PAK/PCH hardware, in what quantity, and where was it accepted?", "why_it_matters": "The current receipt establishes a bounded state but does not close qualification, capacity, supplier identity or manufacturing scope.", "next_action": "Retrieve Tianyi Cloud/China Telecom procurement award or asset/SAT record naming PAK/PCH hardware and resource pool." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-cxmt-public-hbm-product-receipt", "id": "gap-cxmt-public-hbm-product-receipt", "last_checked": "2026-07-29", "layer": "conventional_hbm", "missing_proof": [ "generation", "DRAM die", "TSV/KGD", "base die/PHY", "OSAT/facility", "customer", "yield", "shipment" ], "next_action": "Monitor CXMT and named counterparty filings for an exact HBM product/facility/qualification receipt.", "priority": 1, "question": "Does CXMT have a publicly receipted conventional-HBM product or qualified stack?", "record_type": "gap", "source_ids": [], "why_it_matters": "Process adjacency, trial production and industry context cannot close a qualified commercial HBM proof chain.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "aa26bc61d9d8cd8291892f20d592a42fc8aafe9906b9f9f3e4135693782fb392", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "layer", "value": "conventional_hbm" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "conventional_hbm" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "conventional_hbm", "question": "Does CXMT have a publicly receipted conventional-HBM product or qualified stack?", "why_it_matters": "Process adjacency, trial production and industry context cannot close a qualified commercial HBM proof chain.", "next_action": "Monitor CXMT and named counterparty filings for an exact HBM product/facility/qualification receipt." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-cxmt-unnamed-osat-packaging", "id": "gap-cxmt-unnamed-osat-packaging", "last_checked": "2026-07-29", "layer": "conventional_hbm", "missing_proof": [ "OSAT legal entity", "facility", "package platform", "CXMT product", "qualification", "volume" ], "next_action": "Retrieve CXMT supplier filings or OSAT/customer disclosures naming both endpoints and package/product.", "priority": 1, "question": "Which legal OSATs package which CXMT DRAM products at which facilities?", "record_type": "gap", "source_ids": [], "why_it_matters": "Process adjacency, trial production and industry context cannot close a qualified commercial HBM proof chain.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "617aa7db2c52796e6f326160f95c4c328de9023ab00ef0eb83760a0259cbbcb7", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "layer", "value": "conventional_hbm" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "conventional_hbm" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "conventional_hbm", "question": "Which legal OSATs package which CXMT DRAM products at which facilities?", "why_it_matters": "Process adjacency, trial production and industry context cannot close a qualified commercial HBM proof chain.", "next_action": "Retrieve CXMT supplier filings or OSAT/customer disclosures naming both endpoints and package/product." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-foreign-amkor-shanghai-current", "id": "gap-foreign-amkor-shanghai-current", "last_checked": "2026-07-29", "layer": "foreign_owned_mainland_operations", "missing_proof": [ "immediate ownership chain", "customer qualification/AVL", "capacity, utilization and yield" ], "next_action": "Retrieve a current customer qualification or AVL naming Amkor Shanghai C3 and the exact package platform.", "priority": 7, "question": "Which current package/test platforms and customers are qualified at Amkor Shanghai C3?", "record_type": "gap", "source_ids": [], "why_it_matters": "Foreign-owned mainland capacity must be separated from mainland ownership and still requires facility-specific process, capacity, qualification, output and dependency proof.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "327b9bf5b92cdcccfdb6dd172616ee649bbaaadebbefa419f938780eb761c2ab", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "foreign_owned_mainland_operations" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "Operations in China owned outside China", "question": "Which current package/test platforms and customers are qualified at Amkor Shanghai C3?", "why_it_matters": "Capacity in China operated by companies headquartered or controlled outside China must be separated from ownership based in China and still requires facility-specific process, capacity, qualification, output and dependency proof.", "next_action": "Retrieve a current customer qualification or AVL naming Amkor Shanghai C3 and the exact package platform." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-foreign-ase-wuxi-operator", "id": "gap-foreign-ase-wuxi-operator", "last_checked": "2026-07-29", "layer": "foreign_owned_mainland_operations", "missing_proof": [ "immediate ownership chain", "package-platform qualification", "customer and capacity receipt" ], "next_action": "Retrieve a customer qualification/AVL naming Wuxi Tongzhi and the exact package platform.", "priority": 7, "question": "Which exact package/test flows are qualified at the resolved Wuxi Tongzhi operation?", "record_type": "gap", "source_ids": [], "why_it_matters": "Foreign-owned mainland capacity must be separated from mainland ownership and still requires facility-specific process, capacity, qualification, output and dependency proof.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "03d345859e54f88e425ed8cebffbb8758809f7fa459e276520654fb1a65e0e16", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "foreign_owned_mainland_operations" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "Operations in China owned outside China", "question": "Which exact package/test flows are qualified at the resolved Wuxi Tongzhi operation?", "why_it_matters": "Capacity in China operated by companies headquartered or controlled outside China must be separated from ownership based in China and still requires facility-specific process, capacity, qualification, output and dependency proof.", "next_action": "Retrieve a customer qualification/AVL naming Wuxi Tongzhi and the exact package platform." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-foreign-skhynix-wuxi-current", "id": "gap-foreign-skhynix-wuxi-current", "last_checked": "2026-07-29", "layer": "foreign_owned_mainland_operations", "missing_proof": [ "facility permit/EIA", "node and WSPM allocation by C2/C2F", "actual output and yield receipt" ], "next_action": "Retrieve C2/C2F permits or filings with node, WSPM, actual output and yield.", "priority": 7, "question": "What are the current node, wafer-capacity denominator, output, yield and supplier BOM for the resolved SK hynix Wuxi operation?", "record_type": "gap", "source_ids": [], "why_it_matters": "Foreign-owned mainland capacity must be separated from mainland ownership and still requires facility-specific process, capacity, qualification, output and dependency proof.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b53be593b25ccfd38aa647d85fb0fdcb22e22931f685578b2f0ab8db12e56389", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "foreign_owned_mainland_operations" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "Operations in China owned outside China", "question": "What are the current node, wafer-capacity denominator, output, yield and supplier BOM for the resolved SK hynix Wuxi operation?", "why_it_matters": "Capacity in China operated by companies headquartered or controlled outside China must be separated from ownership based in China and still requires facility-specific process, capacity, qualification, output and dependency proof.", "next_action": "Retrieve C2/C2F permits or filings with node, WSPM, actual output and yield." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-grikin-named-customer", "id": "gap-grikin-named-customer", "last_checked": "2026-07-29", "layer": "materials_grades_and_qualification", "missing_proof": [ "named fab", "purity basis", "target drawing/model", "qualified layer", "shipment/consumption volume" ], "next_action": "Retrieve customer qualification, tender or acceptance naming GRIKIN target and layer.", "priority": 6, "question": "Which named fab qualifies GRIKIN's 300 mm copper target and on what layer?", "record_type": "gap", "source_ids": [], "why_it_matters": "Catalogue grade or family-level volume language does not establish fab qualification, lot quality or process yield.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "1a87bd890aa9d53a598e10fb3d9c224de95447e9ae19fb6ee30eb07d4e2c8f16", "stage_ids": [ "critical_materials", "assembly_test", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_grades_and_qualification" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_grades_and_qualification", "question": "Which named fab qualifies GRIKIN's 300 mm copper target and on what layer?", "why_it_matters": "Catalogue grade or family-level volume language does not establish fab qualification, lot quality or process yield.", "next_action": "Retrieve customer qualification, tender or acceptance naming GRIKIN target and layer." } }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-h3c-supported-options-commercial-receipt", "id": "gap-h3c-supported-options-commercial-receipt", "last_checked": "2026-07-29", "layer": "downstream_validation", "missing_proof": [ "configured SKU/option code", "supplier legal entity", "order", "delivery", "acceptance", "customer/facility", "volume" ], "next_action": "Find an H3C order, tender, delivery/SAT or warranty asset record naming the option code.", "priority": 3, "question": "Which H3C supported Biren/Cambricon/CXMT/Hygon options were ordered, shipped and accepted?", "record_type": "gap", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "why_it_matters": "Framework, firmware, catalogue and powered-on states are below delivery, acceptance, qualification and sustained operation.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "c1c6d29c825bbf29806069c71e253cb8044c205ee4c75bda5fe07a57d9475068", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "downstream_validation" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-h3c-h65-bios-574-20230804", "title": "H3C H65-BIOS-5.74版本说明书", "publisher": "新华三技术有限公司", "url": "https://www.h3c.com/cn/d_202308/1903077_30005_0.htm", "source_type": "official_firmware_release_notes", "primary_status": "primary", "publication_date": "2023-08-04", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "Firmware adaptation/support is not a purchase, configured commercial SKU, order, shipment, installation or external qualification.", "The signed binary is named with MD5 eea6fa3e3dc6f629ee8fdaa78932627c; it was not locally archived." ] } ], "editorial_display": { "layer": "downstream_validation", "question": "Which H3C supported Biren/Cambricon/CXMT/Hygon options were ordered, shipped and accepted?", "why_it_matters": "Framework, firmware, catalogue and powered-on states are below delivery, acceptance, qualification and sustained operation.", "next_action": "Find an H3C order, tender, delivery/SAT or warranty asset record naming the option code." } }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-huate-project-capacity-qualification", "id": "gap-huate-project-capacity-qualification", "last_checked": "2026-07-29", "layer": "materials_grades_and_qualification", "missing_proof": [ "legal owner/operator", "facility/address", "commissioning/SAT", "installed and qualified capacity", "utilization/output", "grade/CoA", "customer qualification", "upstream BOM" ], "next_action": "Retrieve project EIA/acceptance and customer AVL for HBr, Si2H6, C4F6 and BCl3.", "priority": 4, "question": "Which Huate gas project has installed, qualified and utilized capacity at which legal facility?", "record_type": "gap", "source_ids": [ "src-huate-gas-annual-2025" ], "why_it_matters": "The current receipt establishes a bounded state but does not close qualification, capacity, supplier identity or manufacturing scope.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "402eb309d2da08eb911b51c03ec9a0b34fd05144afb64423e664d9dc43db8526", "stage_ids": [ "critical_materials", "assembly_test", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_grades_and_qualification" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-huate-gas-annual-2025", "title": "广东华特气体股份有限公司2025年年度报告", "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ] } ], "editorial_display": { "layer": "materials_grades_and_qualification", "question": "Which Huate gas project has installed, qualified and utilized capacity at which legal facility?", "why_it_matters": "The current receipt establishes a bounded state but does not close qualification, capacity, supplier identity or manufacturing scope.", "next_action": "Retrieve project EIA/acceptance and customer AVL for HBr, Si2H6, C4F6 and BCl3." } }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-jcet-cxmt-unspecified-goods", "id": "gap-jcet-cxmt-unspecified-goods", "last_checked": "2026-07-29", "layer": "missing_supplier_or_customer_receipt", "missing_proof": [ "product/SKU", "facility", "process", "physical quantity", "qualification", "package/test scope", "HBM status" ], "next_action": "Retrieve the transaction contract or counterparty disclosure identifying the goods and process.", "priority": 3, "question": "What goods did JCET sell to CXMT in FY2025, and did they involve package/test services?", "record_type": "gap", "source_ids": [ "src-jcet-annual-2025" ], "why_it_matters": "The current receipt establishes a bounded state but does not close qualification, capacity, supplier identity or manufacturing scope.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "79354ca3ca8555ca6187fc38b55a64f62c0e00bfa1dc316a8652ca5f3a6131f0", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-jcet-annual-2025", "title": "江苏长电科技股份有限公司2025年年度报告", "publisher": "江苏长电科技股份有限公司 via 巨潮资讯网", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225091498.PDF", "source_type": "exchange_filing", "primary_status": "primary", "publication_date": "2026-04-10", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The row says only sale of goods; product, facility, process, package/test scope and HBM status are unknown.", "Do not convert this receipt into a packages, tests or HBM relationship." ] } ], "editorial_display": { "layer": "missing_supplier_or_customer_receipt", "question": "What goods did JCET sell to CXMT in FY2025, and did they involve package/test services?", "why_it_matters": "The current receipt establishes a bounded state but does not close qualification, capacity, supplier identity or manufacturing scope.", "next_action": "Retrieve the transaction contract or counterparty disclosure identifying the goods and process." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-kfmi-mainland-fab-target", "id": "gap-kfmi-mainland-fab-target", "last_checked": "2026-07-29", "layer": "materials_grades_and_qualification", "missing_proof": [ "mainland legal fab", "target metal/grade/drawing", "tool and layer", "quantity", "qualification" ], "next_action": "Retrieve mainland customer AVL, tender, award or acceptance naming KFMI and the exact target.", "priority": 6, "question": "Which exact KFMI target metal/grade/model is qualified at a mainland fab?", "record_type": "gap", "source_ids": [], "why_it_matters": "Catalogue grade or family-level volume language does not establish fab qualification, lot quality or process yield.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b97aeda5102cab5952f1b89cc522bb2ec857a38425d5b20b2af360bc87388547", "stage_ids": [ "critical_materials", "assembly_test", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_grades_and_qualification" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_grades_and_qualification", "question": "Which exact KFMI target metal/grade/model is qualified at a mainland fab?", "why_it_matters": "Catalogue grade or family-level volume language does not establish fab qualification, lot quality or process yield.", "next_action": "Retrieve mainland customer AVL, tender, award or acceptance naming KFMI and the exact target." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-nata-customer-qualification", "id": "gap-nata-customer-qualification", "last_checked": "2026-07-29", "layer": "materials_grades_and_qualification", "missing_proof": [ "named customer/facility", "molecule and grade", "CoA impurity limits", "delivery acceptance", "qualified layer" ], "next_action": "Retrieve customer AVL, tender, acceptance or issuer filing naming Nata molecule, grade and endpoint.", "priority": 6, "question": "Which Nata gas/precursor grade is qualified at which legal fab and process?", "record_type": "gap", "source_ids": [], "why_it_matters": "Catalogue grade or family-level volume language does not establish fab qualification, lot quality or process yield.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "d0affb9ef0d22d82999d8a2df32cad1e4c1f5eac9a12e89214bbde53b58965c1", "stage_ids": [ "critical_materials", "assembly_test", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_grades_and_qualification" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_grades_and_qualification" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_grades_and_qualification", "question": "Which Nata gas/precursor grade is qualified at which legal fab and process?", "why_it_matters": "Catalogue grade or family-level volume language does not establish fab qualification, lot quality or process yield.", "next_action": "Retrieve customer AVL, tender, acceptance or issuer filing naming Nata molecule, grade and endpoint." } }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-nio-nx9031-manufacturing-chain", "id": "gap-nio-nx9031-manufacturing-chain", "last_checked": "2026-07-29", "layer": "fabless_product_and_foundry_dependency", "missing_proof": [ "historical legal designer/assignee", "foundry/facility", "process", "package/OSAT", "yield", "delivered vehicle count", "field reliability" ], "next_action": "Retrieve NIO/GeniTech manufacturing evidence or physical analysis plus ET9 delivery records.", "priority": 4, "question": "Who fabricated, packaged and tested NX9031, and how many ET9 vehicles carry it?", "record_type": "gap", "source_ids": [ "src-nio-auto-shanghai-20250423", "src-nio-genitech-investment-20260226" ], "why_it_matters": "The current receipt establishes a bounded state but does not close qualification, capacity, supplier identity or manufacturing scope.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "ca188605348abfaa4516be7b4ec444516a2bb55a3d69b5a3222eb92c88f4dfaf", "stage_ids": [ "design_company", "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "layer", "value": "fabless_product_and_foundry_dependency" } ] }, { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabless_product_and_foundry_dependency" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabless_product_and_foundry_dependency" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "primary_only", "source_refs": [ { "source_id": "src-nio-auto-shanghai-20250423", "title": "NIO Showcases Its Three EV Brands at Auto Shanghai 2025", "publisher": "NIO Inc.", "url": "https://www.nio.com/news/20250423001", "source_type": "company_customer_press_release", "primary_status": "primary", "publication_date": "2025-04-23", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "No delivered ET9 count, manufacturing legal entity/facility, foundry, OSAT, package, yield or field-reliability receipt.", "NIO's mass-production wording is vendor language; the source proves delivery start and two-chip integration only." ] }, { "source_id": "src-nio-genitech-investment-20260226", "title": "NIO Inc.’s Subsidiary Enters into Definitive Agreements for RMB2.257 Billion Investment", "publisher": "NIO Inc.", "url": "https://ir.nio.com/zh-hans/news-releases/news-release-details/nio-incs-subsidiary-enters-definitive-agreements-rmb2257-billion", "source_type": "company_investor_release", "primary_status": "primary", "publication_date": "2026-02-26", "date_checked": "2026-07-29", "access_state": "open", "limitations": [ "The disclosure post-dates ET9 launch and does not establish the historical assignee, designer or manufacturer of each NX9031 die.", "The immediate NIO legal shareholder is unnamed." ] } ], "editorial_display": { "layer": "fabless_product_and_foundry_dependency", "question": "Who fabricated, packaged and tested NX9031, and how many ET9 vehicles carry it?", "why_it_matters": "The current receipt establishes a bounded state but does not close qualification, capacity, supplier identity or manufacturing scope.", "next_action": "Retrieve NIO/GeniTech manufacturing evidence or physical analysis plus ET9 delivery records." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-nsig-shanghai-taiyuan-capacity-split", "id": "gap-nsig-shanghai-taiyuan-capacity-split", "last_checked": "2026-07-29", "layer": "silicon_wafers", "missing_proof": [ "named facility and operator", "installed/qualified/output state", "grade mix", "yield" ], "next_action": "Retrieve facility-level NSIG subsidiary filings, permits or inquiry replies with the capacity denominator.", "priority": 8, "question": "How is NSIG's 850,000-wafer monthly group capacity split among named Shanghai and Taiyuan facilities?", "record_type": "gap", "source_ids": [], "why_it_matters": "An aggregate company statement cannot be promoted into a synthetic facility record.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b4fe2f68db09dd87f83bf22bd462dc7e04a215d2933ed6c975d62025b6431243", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "silicon_wafers" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "silicon_wafers" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "silicon_wafers", "question": "How is NSIG's 850,000-wafer monthly group capacity split among named Shanghai and Taiyuan facilities?", "why_it_matters": "An aggregate company statement cannot be promoted into a synthetic facility record.", "next_action": "Retrieve facility-level NSIG subsidiary filings, permits or inquiry replies with the capacity denominator." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-accepted-result-economics", "id": "gap-process-accepted-result-economics", "last_checked": "2026-07-29", "layer": "workload", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Accepted output, cost, energy, reliability and margin.", "priority": 30, "question": "No matched cost-per-accepted-task or joules-per-task receipt", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, accepted output, cost, energy, reliability and margin cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b841e59144114309a93231028ab1823e9fc2e4ab4c4f61d9d21db17b8584a3ab", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "layer", "value": "workload" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "workload" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "workload", "question": "No matched cost-per-accepted-task or joules-per-task receipt", "why_it_matters": "Without this receipt, accepted output, cost, energy, reliability and margin cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Accepted output, cost, energy, reliability and margin." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-analog-design", "id": "gap-process-analog-design", "last_checked": "2026-07-29", "layer": "eda", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Analog and custom design.", "priority": 7, "question": "Named PDK and production-chip receipts are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, analog and custom design cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b84c8deb2ea835c4b5cb74ea99d50d62c0667a415e5914f78039eaee6dc505f1", "stage_ids": [ "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "layer", "value": "eda" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "eda" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "eda", "question": "Named PDK and production-chip receipts are absent", "why_it_matters": "Without this receipt, analog and custom design cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Analog and custom design." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-analog-rf-power-sensor", "id": "gap-process-analog-rf-power-sensor", "last_checked": "2026-07-29", "layer": "fabrication", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Analog, RF, power, MEMS and sensor fabrication.", "priority": 30, "question": "Facility/product/customer and qualification joins are incomplete", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, analog, rf, power, mems and sensor fabrication cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "493280efb0b755cc5b7a9af9190dea6b8b7f0988d4f5b2c026ac5dd853a4ff1a", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "fabrication", "question": "Facility/product/customer and qualification joins are incomplete", "why_it_matters": "Without this receipt, analog, rf, power, mems and sensor fabrication cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Analog, RF, power, MEMS and sensor fabrication." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-boards-optics-network", "id": "gap-process-boards-optics-network", "last_checked": "2026-07-29", "layer": "systems", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Boards, optics and networking.", "priority": 30, "question": "Component-level origin, topology and acceptance are unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, boards, optics and networking cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b17cd98d33210e660238fb65d8a75a86960fb4292e1e3e864ac09ba4525ee3fa", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "layer", "value": "systems" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "systems", "question": "Component-level origin, topology and acceptance are unclosed", "why_it_matters": "Without this receipt, boards, optics and networking cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Boards, optics and networking." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-channel-authorized-distribution", "id": "gap-process-channel-authorized-distribution", "last_checked": "2026-07-29", "layer": "distribution", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Authorized semiconductor distribution.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for authorized semiconductor distribution", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, authorized semiconductor distribution cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "84806f0129217c6614e3db44c8ba737a8181820a80ba158187e43030ac4e33b0", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "distribution" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "distribution" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "distribution", "question": "No source-closed legal-entity, product/facility and readiness chain yet for authorized semiconductor distribution", "why_it_matters": "Without this receipt, authorized semiconductor distribution cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Authorized semiconductor distribution." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-channel-equipment-material-agents", "id": "gap-process-channel-equipment-material-agents", "last_checked": "2026-07-29", "layer": "distribution", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Equipment and material agents and service organizations.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for equipment and material agents and service organizations", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, equipment and material agents and service organizations cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "17cc7a9b3e361722107b7f0051e762c8ab0fba3ac0e35db186240ab29091ca52", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "distribution" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "distribution" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "distribution", "question": "No source-closed legal-entity, product/facility and readiness chain yet for equipment and material agents and service organizations", "why_it_matters": "Without this receipt, equipment and material agents and service organizations cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Equipment and material agents and service organizations." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-channel-inventory-spot-resale", "id": "gap-process-channel-inventory-spot-resale", "last_checked": "2026-07-29", "layer": "distribution", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Inventory ownership and spot-market resale.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for inventory ownership and spot-market resale", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, inventory ownership and spot-market resale cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "c27963832563d5ae991ceae3fc56d36026233d9a4b7a408358f917c4596960da", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "distribution" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "distribution" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "distribution", "question": "No source-closed legal-entity, product/facility and readiness chain yet for inventory ownership and spot-market resale", "why_it_matters": "Without this receipt, inventory ownership and spot-market resale cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Inventory ownership and spot-market resale." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-channel-module-distribution-assembly", "id": "gap-process-channel-module-distribution-assembly", "last_checked": "2026-07-29", "layer": "distribution", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Module distribution and assembly boundaries.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for module distribution and assembly boundaries", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, module distribution and assembly boundaries cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "9f5df0fc472499b56844bd520381f60a95e9b9e387492cd4a127508bb09608cc", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "distribution" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "distribution" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "distribution", "question": "No source-closed legal-entity, product/facility and readiness chain yet for module distribution and assembly boundaries", "why_it_matters": "Without this receipt, module distribution and assembly boundaries cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Module distribution and assembly boundaries." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-ai-accelerator", "id": "gap-process-chip-ai-accelerator", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: AI accelerator products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for ai accelerator products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, ai accelerator products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "d4971a4dec448df83bbff2f403f1a0fbced9c806688f8c60f94e3de2f5eaf874", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for ai accelerator products", "why_it_matters": "Without this receipt, ai accelerator products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: AI accelerator products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-architecture", "id": "gap-process-chip-architecture", "last_checked": "2026-07-29", "layer": "design", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Chip architecture.", "priority": 4, "question": "DF1000 architecture remains vendor-reported and physically under-specified", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, chip architecture cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "abdea0c154e9f33e8c4cd5ed6558235a1464c702ab01e632bde932bd24a1d482", "stage_ids": [ "design_company" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "layer", "value": "design" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "design" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "design", "question": "DF1000 architecture remains vendor-reported and physically under-specified", "why_it_matters": "Without this receipt, chip architecture cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Chip architecture." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-automotive-soc", "id": "gap-process-chip-automotive-soc", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Automotive SoC products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for automotive soc products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, automotive soc products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "6f549ddb067e8fa8efc01e821da0af85512bb83446a8096124ab1a9e810a6879", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for automotive soc products", "why_it_matters": "Without this receipt, automotive soc products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Automotive SoC products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-cpu", "id": "gap-process-chip-cpu", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: CPU products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for cpu products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, cpu products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "eb83a0faa7d89cbd2f19db16e7f243c707cc61743d8c13143781d99d71b68963", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for cpu products", "why_it_matters": "Without this receipt, cpu products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: CPU products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-display-driver", "id": "gap-process-chip-display-driver", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Display-driver products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for display-driver products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, display-driver products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "a3f9bdc5f06e62849f35dc08d6f4aea6b0ca3c54d9ef45c7f976eb590cc48bb6", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for display-driver products", "why_it_matters": "Without this receipt, display-driver products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Display-driver products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-dsp", "id": "gap-process-chip-dsp", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: DSP products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for dsp products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, dsp products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "1800e6db4d719c46dc83373288a537e2c660022497d379cf10e199aaeee9b729", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for dsp products", "why_it_matters": "Without this receipt, dsp products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: DSP products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-fpga", "id": "gap-process-chip-fpga", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: FPGA products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for fpga products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, fpga products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "3542e9f207e66cf8f539e2bfe2b2d18fb1eaba9d49d9e84cafb784fe8b25cbfe", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for fpga products", "why_it_matters": "Without this receipt, fpga products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: FPGA products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-gpu", "id": "gap-process-chip-gpu", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: GPU products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for gpu products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, gpu products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "eb730d6b262df97a14826f9d914b880b47257193e3174e00b59c7733cb9eb2ed", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for gpu products", "why_it_matters": "Without this receipt, gpu products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: GPU products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-industrial-security", "id": "gap-process-chip-industrial-security", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Industrial-control and security-chip products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for industrial-control and security-chip products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, industrial-control and security-chip products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "e9fabb8b31144f4c983f0eace7476140675c94a402deee9dc18fdfa9361fe52a", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for industrial-control and security-chip products", "why_it_matters": "Without this receipt, industrial-control and security-chip products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Industrial-control and security-chip products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-isp-vision", "id": "gap-process-chip-isp-vision", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: ISP and vision-processing products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for isp and vision-processing products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, isp and vision-processing products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b3c64c2de88fe5396115a64d3e748ac5faa4c499d80d49e1c950a50a452f2610", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for isp and vision-processing products", "why_it_matters": "Without this receipt, isp and vision-processing products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: ISP and vision-processing products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-mcu", "id": "gap-process-chip-mcu", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: MCU products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for mcu products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, mcu products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "5a2aa6cdf1e52e417f9a0b0870c5e6f5affb0569d2ee33ae3d338a5248d25fba", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for mcu products", "why_it_matters": "Without this receipt, mcu products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: MCU products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-modem-connectivity", "id": "gap-process-chip-modem-connectivity", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Modem and connectivity products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for modem and connectivity products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, modem and connectivity products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "9a99b4fa5ade7bc26b36baabeacbbf4eea4a82ea09ab5edb323aadd26625cb46", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for modem and connectivity products", "why_it_matters": "Without this receipt, modem and connectivity products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Modem and connectivity products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-network-switch-optical-dsp", "id": "gap-process-chip-network-switch-optical-dsp", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Network-switch and optical-DSP products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for network-switch and optical-dsp products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, network-switch and optical-dsp products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "6d07218b4276489eef61004fb407c35a5731867e01e87c2d1080cb3dae907d3a", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for network-switch and optical-dsp products", "why_it_matters": "Without this receipt, network-switch and optical-dsp products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Network-switch and optical-DSP products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-pmic-analog", "id": "gap-process-chip-pmic-analog", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: PMIC and analog products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for pmic and analog products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, pmic and analog products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "4680c42f5a2c56f6f6567c6f3d22c03da57478354a54fba3db94b1d873b39c95", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for pmic and analog products", "why_it_matters": "Without this receipt, pmic and analog products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: PMIC and analog products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-power-device", "id": "gap-process-chip-power-device", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power-semiconductor products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for power-semiconductor products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, power-semiconductor products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "0804cef1cf29c4e134774bcaa45f4b741c797f93ec97e3be580f98c56f23c2ec", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for power-semiconductor products", "why_it_matters": "Without this receipt, power-semiconductor products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power-semiconductor products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-rf", "id": "gap-process-chip-rf", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: RF semiconductor products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for rf semiconductor products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, rf semiconductor products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "4e73f0f6ee819be16ad68f7045a420a1c4cab747a11eadb4df4c5465d6ec7c0e", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for rf semiconductor products", "why_it_matters": "Without this receipt, rf semiconductor products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: RF semiconductor products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-sensors", "id": "gap-process-chip-sensors", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Sensor products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for sensor products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, sensor products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "81cf5fe973771a41717a2a93d56e355f3e31b0b80c500d4295fefe43a21a8c77", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for sensor products", "why_it_matters": "Without this receipt, sensor products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Sensor products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-storage-controller-interface", "id": "gap-process-chip-storage-controller-interface", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Storage controllers and memory-interface products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for storage controllers and memory-interface products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, storage controllers and memory-interface products cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "7719b7be671747933b3e3ca2e5f17a87805ce352d6a9e0bb24440410ed12da50", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "chip_product" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "chip_product", "question": "No source-closed legal-entity, product/facility and readiness chain yet for storage controllers and memory-interface products", "why_it_matters": "Without this receipt, storage controllers and memory-interface products cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Storage controllers and memory-interface products." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-clean-strip", "id": "gap-process-clean-strip", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Wet clean, dry clean and strip.", "priority": 30, "question": "Model/facility/layer/defectivity receipts remain sparse", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, wet clean, dry clean and strip cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "4e50187f2299126286d446bb13c5945f90928b7044bee1ef0b7a16fa4e391b77", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "wafer_equipment", "question": "Model/facility/layer/defectivity receipts remain sparse", "why_it_matters": "Without this receipt, wet clean, dry clean and strip cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Wet clean, dry clean and strip." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-cleanroom-epc", "id": "gap-process-cleanroom-epc", "last_checked": "2026-07-29", "layer": "facilities", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Cleanroom EPC, vibration and contamination control.", "priority": 17, "question": "Facility-specific EPC contract ledger is unbuilt", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, cleanroom epc, vibration and contamination control cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b1c7ebfaf8d98e0e88c22bf048d287de8d604cfd42e9289b1b7bbac3ba7836f9", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities", "question": "Facility-specific EPC contract ledger is unbuilt", "why_it_matters": "Without this receipt, cleanroom epc, vibration and contamination control cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Cleanroom EPC, vibration and contamination control." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-cmp", "id": "gap-process-cmp", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Chemical mechanical planarization.", "priority": 30, "question": "Named layer, consumable pair, throughput and yield effect are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, chemical mechanical planarization cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "07f4c1d3576826d8c12973dc548b5d1bd6fc49a345ef0b4124421016887e4926", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "wafer_equipment", "question": "Named layer, consumable pair, throughput and yield effect are absent", "why_it_matters": "Without this receipt, chemical mechanical planarization cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Chemical mechanical planarization." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-compiler-runtime-firmware", "id": "gap-process-compiler-runtime-firmware", "last_checked": "2026-07-29", "layer": "software", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Compiler, runtime, firmware and kernels.", "priority": 30, "question": "Independent framework/kernel/workload compatibility receipt is absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, compiler, runtime, firmware and kernels cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "ba63ad76d0e6b8e168a2f5d027cebba95f86fdeca37ea0d5e7c82d86ddd7c4ab", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "layer", "value": "software" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "software" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "software", "question": "Independent framework/kernel/workload compatibility receipt is absent", "why_it_matters": "Without this receipt, compiler, runtime, firmware and kernels cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Compiler, runtime, firmware and kernels." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-chillers-abatement", "id": "gap-process-component-chillers-abatement", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Tool chillers and point-of-use abatement.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for tool chillers and point-of-use abatement", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, tool chillers and point-of-use abatement cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "95df1018902e5b9aa7c6fb35afd572f0465a91451160fcff189a1854dd29bc11", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for tool chillers and point-of-use abatement", "why_it_matters": "Without this receipt, tool chillers and point-of-use abatement cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Tool chillers and point-of-use abatement." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-esc-ceramics", "id": "gap-process-component-esc-ceramics", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Electrostatic chucks and technical ceramics.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for electrostatic chucks and technical ceramics", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, electrostatic chucks and technical ceramics cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "e0dcac5433c22575a3e3062883344f3bbe708474ad1447296db7afabd9bc93e4", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for electrostatic chucks and technical ceramics", "why_it_matters": "Without this receipt, electrostatic chucks and technical ceramics cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Electrostatic chucks and technical ceramics." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-field-service", "id": "gap-process-component-field-service", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Equipment field service.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for equipment field service", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, equipment field service cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b5e8d77ff4f73be6076f76d34f381009a9a397d252f5429c9f99e8fd9606be71", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for equipment field service", "why_it_matters": "Without this receipt, equipment field service cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Equipment field service." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-gas-panels-piping", "id": "gap-process-component-gas-panels-piping", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Gas panels and high-purity piping.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for gas panels and high-purity piping", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, gas panels and high-purity piping cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "9f44a80885bdaa6398cf083197ee70a7a71e4fd0e5d0b33baa474b1592971492", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for gas panels and high-purity piping", "why_it_matters": "Without this receipt, gas panels and high-purity piping cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Gas panels and high-purity piping." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-lasers-light-sources", "id": "gap-process-component-lasers-light-sources", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Lasers and lithography light sources.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for lasers and lithography light sources", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, lasers and lithography light sources cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "210330c4f7b7d3ceda93dcd5e8ae0a9308df66c96feeadadf9ea7d868273ec53", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for lasers and lithography light sources", "why_it_matters": "Without this receipt, lasers and lithography light sources cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Lasers and lithography light sources." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-mfc", "id": "gap-process-component-mfc", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Mass-flow controllers.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for mass-flow controllers", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, mass-flow controllers cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "562adc117f2a12bcf0ee3f504bccbe43ea4835a8b1c6c9e0c0c2a10ff981c829", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for mass-flow controllers", "why_it_matters": "Without this receipt, mass-flow controllers cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Mass-flow controllers." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-power-control-electronics", "id": "gap-process-component-power-control-electronics", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power supplies and control electronics.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for power supplies and control electronics", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, power supplies and control electronics cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "db1429aa99e1583302f0e4dd74432e0138a8b6c17146774b5cbed5e4db0968b5", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for power supplies and control electronics", "why_it_matters": "Without this receipt, power supplies and control electronics cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power supplies and control electronics." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-projection-optics", "id": "gap-process-component-projection-optics", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Projection and inspection optics.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for projection and inspection optics", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, projection and inspection optics cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "1321c617a37ef5e1be9496dac59279efacccaaac9ce660169a648b017cd206eb", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for projection and inspection optics", "why_it_matters": "Without this receipt, projection and inspection optics cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Projection and inspection optics." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-quartz-silicon-electrodes", "id": "gap-process-component-quartz-silicon-electrodes", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Quartz parts and silicon electrodes.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for quartz parts and silicon electrodes", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, quartz parts and silicon electrodes cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "623c621e139237887d6fa5a13ce41c0e303ea28482ba1ef6dec8bd02a9e46099", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for quartz parts and silicon electrodes", "why_it_matters": "Without this receipt, quartz parts and silicon electrodes cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Quartz parts and silicon electrodes." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-rf-matching", "id": "gap-process-component-rf-matching", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: RF power and matching networks.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for rf power and matching networks", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, rf power and matching networks cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "21e0368446375e561ce0dc8ec533fb994ec1df5caf2c793e794bac8572001bf0", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for rf power and matching networks", "why_it_matters": "Without this receipt, rf power and matching networks cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: RF power and matching networks." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-robots-wafer-handling", "id": "gap-process-component-robots-wafer-handling", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Robots and wafer-handling systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for robots and wafer-handling systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, robots and wafer-handling systems cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "6b3c7f739db6b772003360625fe8b7f25199966efc9e7f3ac913696c59c87d12", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for robots and wafer-handling systems", "why_it_matters": "Without this receipt, robots and wafer-handling systems cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Robots and wafer-handling systems." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-seals", "id": "gap-process-component-seals", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: High-purity and vacuum seals.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for high-purity and vacuum seals", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, high-purity and vacuum seals cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "420d031a639601441699ed5b13c5622fb7079fe86933e0619ecbad864a0c3f04", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for high-purity and vacuum seals", "why_it_matters": "Without this receipt, high-purity and vacuum seals cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: High-purity and vacuum seals." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-sensors-software", "id": "gap-process-component-sensors-software", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Equipment sensors and control software.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for equipment sensors and control software", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, equipment sensors and control software cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "76ab8959e8dadb48bc1a9da783e05a7506398625fd6e581d09d5047d66e76e9a", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for equipment sensors and control software", "why_it_matters": "Without this receipt, equipment sensors and control software cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Equipment sensors and control software." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-spares", "id": "gap-process-component-spares", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Equipment spare-parts supply.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for equipment spare-parts supply", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, equipment spare-parts supply cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "4038804abc50e855fcdba85cc552567174b985f536f30890c3296620c72d3d39", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for equipment spare-parts supply", "why_it_matters": "Without this receipt, equipment spare-parts supply cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Equipment spare-parts supply." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-stages-encoders-bearings", "id": "gap-process-component-stages-encoders-bearings", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Stages, encoders and bearings.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for stages, encoders and bearings", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, stages, encoders and bearings cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "06a68372f6a3e18116b04e0b4aa4f2d2e9494c0992affa1fca49645877c9ba02", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for stages, encoders and bearings", "why_it_matters": "Without this receipt, stages, encoders and bearings cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Stages, encoders and bearings." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-targets-filters", "id": "gap-process-component-targets-filters", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Targets and filters for equipment systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for targets and filters for equipment systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, targets and filters for equipment systems cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "5fa26990608bae447615cee93cce34cddac1829e9965fdcba38d8678817ac20c", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for targets and filters for equipment systems", "why_it_matters": "Without this receipt, targets and filters for equipment systems cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Targets and filters for equipment systems." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-vacuum-pumps", "id": "gap-process-component-vacuum-pumps", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Vacuum pumps.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for vacuum pumps", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, vacuum pumps cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "3e2f5d16116559fdd04aa1540a50289d95e5aa9ac1178005f9d9bf3696435418", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for vacuum pumps", "why_it_matters": "Without this receipt, vacuum pumps cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Vacuum pumps." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-vacuum-valves", "id": "gap-process-component-vacuum-valves", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Vacuum valves.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for vacuum valves", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, vacuum valves cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "653aba8a7a45152291c328589c611df81b1c6fdb26c71b4a878f59f550055b48", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "equipment_component" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "equipment_component" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "equipment_component", "question": "No source-closed legal-entity, product/facility and readiness chain yet for vacuum valves", "why_it_matters": "Without this receipt, vacuum valves cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Vacuum valves." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-compound-substrates", "id": "gap-process-compound-substrates", "last_checked": "2026-07-29", "layer": "materials", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: SiC, GaN, sapphire and epitaxial substrates.", "priority": 15, "question": "Grade, defect limit and device-line qualification are unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, sic, gan, sapphire and epitaxial substrates cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "006c13cb942ca9cd31db00f110ea1972c8a3a1602a8e7f8dbe2391542c0cc6d7", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials", "question": "Grade, defect limit and device-line qualification are unclosed", "why_it_matters": "Without this receipt, sic, gan, sapphire and epitaxial substrates cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: SiC, GaN, sapphire and epitaxial substrates." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-computational-lithography", "id": "gap-process-computational-lithography", "last_checked": "2026-07-29", "layer": "patterning", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: OPC, source-mask optimization and DTCO.", "priority": 12, "question": "No source-closed mainland OPC production deployment found", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, opc, source-mask optimization and dtco cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "86191f0374ce129cc07b3cad7546d5a1369f7e5329778feb5d4a3caf5afbbf17", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "patterning" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "patterning" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "patterning", "question": "No source-closed mainland OPC production deployment found", "why_it_matters": "Without this receipt, opc, source-mask optimization and dtco cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: OPC, source-mask optimization and DTCO." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-controller-module", "id": "gap-process-controller-module", "last_checked": "2026-07-29", "layer": "systems", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Controllers and memory/storage modules.", "priority": 30, "question": "SKU BOM closure and customer qualifications remain incomplete", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, controllers and memory/storage modules cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "258b5d5f16ba698536952553b30cb47367f4d0e232cb9ee412d4c9526f20f3e3", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "layer", "value": "systems" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "systems", "question": "SKU BOM closure and customer qualifications remain incomplete", "why_it_matters": "Without this receipt, controllers and memory/storage modules cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Controllers and memory/storage modules." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-deposition-cvd-ald", "id": "gap-process-deposition-cvd-ald", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: CVD, PECVD and ALD deposition.", "priority": 26, "question": "Model/facility/layer/uptime/yield receipts remain sparse", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, cvd, pecvd and ald deposition cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b81ba7e3e69b28789095edd62048500d9fa244ec74d2dd220a449313041993e4", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "wafer_equipment", "question": "Model/facility/layer/uptime/yield receipts remain sparse", "why_it_matters": "Without this receipt, cvd, pecvd and ald deposition cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: CVD, PECVD and ALD deposition." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-design-verification", "id": "gap-process-design-verification", "last_checked": "2026-07-29", "layer": "eda", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Functional verification, simulation, emulation and formal.", "priority": 6, "question": "Named production-chip tapeout receipts are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, functional verification, simulation, emulation and formal cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "d6713a01fc838bc0c3436576e8d31ebd00e9ffb75e048be32e78ff104a7fdc6b", "stage_ids": [ "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "layer", "value": "eda" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "eda" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "eda", "question": "Named production-chip tapeout receipts are absent", "why_it_matters": "Without this receipt, functional verification, simulation, emulation and formal cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Functional verification, simulation, emulation and formal." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-dft-yield-analysis", "id": "gap-process-dft-yield-analysis", "last_checked": "2026-07-29", "layer": "eda", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: DFT and yield analysis.", "priority": 10, "question": "Attributable production-yield effect is absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, dft and yield analysis cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "d5b4348ca0636e655cc7efb863d8400310dff46bb8ef57e6bf2fe211c85d086a", "stage_ids": [ "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "layer", "value": "eda" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "eda" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "eda", "question": "Attributable production-yield effect is absent", "why_it_matters": "Without this receipt, dft and yield analysis cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: DFT and yield analysis." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-dram-fabrication", "id": "gap-process-dram-fabrication", "last_checked": "2026-07-29", "layer": "fabrication", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: DRAM wafer fabrication.", "priority": 30, "question": "Capacity, yield, tool/material BOM and customer volume remain unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, dram wafer fabrication cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "accd02d13cc825457eeb163bde77dff11c7cc6eb540658bc9232ab5b11ec7848", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "fabrication", "question": "Capacity, yield, tool/material BOM and customer volume remain unclosed", "why_it_matters": "Without this receipt, dram wafer fabrication cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: DRAM wafer fabrication." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-end-user-workload", "id": "gap-process-end-user-workload", "last_checked": "2026-07-29", "layer": "demand", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Real end-user workload and accepted result.", "priority": 2, "question": "No matched workload-to-accepted-result receipt for the mapped accelerators", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, real end-user workload and accepted result cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "ed4a602e184a7f40d2d03ea4a5ce74bf2ea35b1052bb9c7a4e8cae4b2a4d31d8", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "demand" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "demand" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "demand", "question": "No matched workload-to-accepted-result receipt for the mapped accelerators", "why_it_matters": "Without this receipt, real end-user workload and accepted result cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Real end-user workload and accepted result." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-epitaxy", "id": "gap-process-epitaxy", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Epitaxy.", "priority": 27, "question": "Model/facility/device qualification is unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, epitaxy cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "9fb68bfeecfa64834aa20a40e7df783fc51b733a5ab7523129ff1bca3a65e6c8", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "wafer_equipment", "question": "Model/facility/device qualification is unclosed", "why_it_matters": "Without this receipt, epitaxy cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Epitaxy." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-etch", "id": "gap-process-etch", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Plasma and high-aspect-ratio etch.", "priority": 28, "question": "Model/facility/qualified-layer/throughput/yield receipts remain sparse", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, plasma and high-aspect-ratio etch cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "d832d4613494c7098bfbe94d106275a87f467c8d3f942cbb10aef8adc10ff594", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "wafer_equipment", "question": "Model/facility/qualified-layer/throughput/yield receipts remain sparse", "why_it_matters": "Without this receipt, plasma and high-aspect-ratio etch cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Plasma and high-aspect-ratio etch." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-abatement", "id": "gap-process-facility-abatement", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Point-of-use and central abatement.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for point-of-use and central abatement", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, point-of-use and central abatement cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "79166fd505922b32dc26716e9ecbeba7fdd0801f4fbc0042e8aae8826ec224ba", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for point-of-use and central abatement", "why_it_matters": "Without this receipt, point-of-use and central abatement cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Point-of-use and central abatement." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-automation", "id": "gap-process-facility-automation", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Facility automation and monitoring.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for facility automation and monitoring", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, facility automation and monitoring cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "cd3a9bd499ce332fb8c5badcf14ccd47e84787bed4dc1ea394f06bb485040388", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for facility automation and monitoring", "why_it_matters": "Without this receipt, facility automation and monitoring cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Facility automation and monitoring." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-backup-power", "id": "gap-process-facility-backup-power", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Backup-power systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for backup-power systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, backup-power systems cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "09548e8b7f7f061f38767a2bcde11bc282a3425c9027fdee90738c85988886d7", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for backup-power systems", "why_it_matters": "Without this receipt, backup-power systems cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Backup-power systems." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-bulk-gases", "id": "gap-process-facility-bulk-gases", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Bulk-gas generation and supply.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for bulk-gas generation and supply", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, bulk-gas generation and supply cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "e900c694a19ba81185f8ebcd59455a93b91992c8d69ceea596924725b8a2c42c", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for bulk-gas generation and supply", "why_it_matters": "Without this receipt, bulk-gas generation and supply cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Bulk-gas generation and supply." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-chemical-delivery", "id": "gap-process-facility-chemical-delivery", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: High-purity chemical delivery systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for high-purity chemical delivery systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, high-purity chemical delivery systems cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "977ef69c8cb4940abebeee4b7de8757013a8021c8bf1c97ec77dc0a6ea3e9bdb", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for high-purity chemical delivery systems", "why_it_matters": "Without this receipt, high-purity chemical delivery systems cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: High-purity chemical delivery systems." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-chillers-heat-rejection", "id": "gap-process-facility-chillers-heat-rejection", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Chillers and heat-rejection systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for chillers and heat-rejection systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, chillers and heat-rejection systems cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "740286787c4c60eaab91516da7973014d9a6d885311c3bd3ae62de05e98ee3a2", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for chillers and heat-rejection systems", "why_it_matters": "Without this receipt, chillers and heat-rejection systems cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Chillers and heat-rejection systems." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-contamination-control", "id": "gap-process-facility-contamination-control", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Contamination-control systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for contamination-control systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, contamination-control systems cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "a4119381270c06563a53ea231706297e7da76a9620609f981786818e8cffda7f", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for contamination-control systems", "why_it_matters": "Without this receipt, contamination-control systems cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Contamination-control systems." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-fire-life-safety", "id": "gap-process-facility-fire-life-safety", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Fire and life-safety systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for fire and life-safety systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, fire and life-safety systems cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "2ca8795a5accba95be6a5b790c7668bca349ccf88f8f1e6de89826df3e5e3346", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for fire and life-safety systems", "why_it_matters": "Without this receipt, fire and life-safety systems cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Fire and life-safety systems." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-power-quality", "id": "gap-process-facility-power-quality", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power-quality systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for power-quality systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, power-quality systems cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "cd0f2b501871a24cf771a86216289c969493877dbe708cdea10a54501db73d78", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for power-quality systems", "why_it_matters": "Without this receipt, power-quality systems cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power-quality systems." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-solvent-recovery", "id": "gap-process-facility-solvent-recovery", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Solvent-recovery systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for solvent-recovery systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, solvent-recovery systems cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "1af83594368019295269fe85e68706bcb04587f9b626c76d97b3dbdb0d3c3184", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for solvent-recovery systems", "why_it_matters": "Without this receipt, solvent-recovery systems cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Solvent-recovery systems." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-specialty-gas-delivery", "id": "gap-process-facility-specialty-gas-delivery", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Specialty-gas delivery systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for specialty-gas delivery systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, specialty-gas delivery systems cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "bb0f0c18da8be55432c19c85d3cc0ed851c23c7b6cd8fe79c01f9b940d41f824", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for specialty-gas delivery systems", "why_it_matters": "Without this receipt, specialty-gas delivery systems cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Specialty-gas delivery systems." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-ultrapure-water", "id": "gap-process-facility-ultrapure-water", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Ultrapure-water generation and distribution.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for ultrapure-water generation and distribution", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, ultrapure-water generation and distribution cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "c624419769118fc40cc97355abcb602f0138fc702b53cad61e4140644f133951", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for ultrapure-water generation and distribution", "why_it_matters": "Without this receipt, ultrapure-water generation and distribution cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Ultrapure-water generation and distribution." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-vacuum", "id": "gap-process-facility-vacuum", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Fab vacuum systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for fab vacuum systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, fab vacuum systems cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "9e6c10fc5204eeaf76ca3c51ee3473815901e73f1cf8ae9267f9f91f9ecd39a9", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for fab vacuum systems", "why_it_matters": "Without this receipt, fab vacuum systems cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Fab vacuum systems." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-vibration-control", "id": "gap-process-facility-vibration-control", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Vibration-control systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for vibration-control systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, vibration-control systems cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "62b743a8af446c61543e70587fa8ebc29f517c5ca891585c6d0b0aa2bef0f282", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for vibration-control systems", "why_it_matters": "Without this receipt, vibration-control systems cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Vibration-control systems." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-wastewater", "id": "gap-process-facility-wastewater", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Fab wastewater treatment.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for fab wastewater treatment", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, fab wastewater treatment cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "1faed833ada00d86bb019d8672b32d2a1d485fb1d4905da71fcc7b561f454227", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for fab wastewater treatment", "why_it_matters": "Without this receipt, fab wastewater treatment cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Fab wastewater treatment." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-final-test-burnin", "id": "gap-process-final-test-burnin", "last_checked": "2026-07-29", "layer": "packaging_test", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Final test, burn-in and repair.", "priority": 30, "question": "HBM/accelerator test coverage and qualified flow are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, final test, burn-in and repair cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "a161e05dc556fcc838da906896bfdd56cbfc05a0244ca811098f0f362a471a2d", "stage_ids": [ "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "packaging_test" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "layer", "value": "packaging_test" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "packaging_test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "packaging_test", "question": "HBM/accelerator test coverage and qualified flow are absent", "why_it_matters": "Without this receipt, final test, burn-in and repair cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Final test, burn-in and repair." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-gases-chemicals-delivery", "id": "gap-process-gases-chemicals-delivery", "last_checked": "2026-07-29", "layer": "facilities", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Bulk/specialty gases and chemical delivery.", "priority": 19, "question": "Facility-specific supply and qualification receipts are unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, bulk/specialty gases and chemical delivery cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "5294bf306dc18c46866a45b9e50068ffb448f7e3c9b67b2103a0d700347b84c3", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities", "question": "Facility-specific supply and qualification receipts are unclosed", "why_it_matters": "Without this receipt, bulk/specialty gases and chemical delivery cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Bulk/specialty gases and chemical delivery." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-hybrid-bonding", "id": "gap-process-hybrid-bonding", "last_checked": "2026-07-29", "layer": "advanced_packaging", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Hybrid and fusion bonding.", "priority": 30, "question": "Generic equipment capability is not HBM qualification", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, hybrid and fusion bonding cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "3a92b949d91992f5e4674d359880de310e4de2dc1e43376a78565034256cfa43", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "advanced_packaging" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "advanced_packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "advanced_packaging", "question": "Generic equipment capability is not HBM qualification", "why_it_matters": "Without this receipt, hybrid and fusion bonding cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Hybrid and fusion bonding." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-implant", "id": "gap-process-implant", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Ion implantation.", "priority": 29, "question": "Named fab, model and qualified layer are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, ion implantation cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b4db13d59e032dc8c8598cde3e21f5e10ec14642d59c2bad3026ebd7f1ebd1e7", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "wafer_equipment", "question": "Named fab, model and qualified layer are absent", "why_it_matters": "Without this receipt, ion implantation cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Ion implantation." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-inspection-defect-review", "id": "gap-process-inspection-defect-review", "last_checked": "2026-07-29", "layer": "process_control", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Inspection and defect review.", "priority": 30, "question": "Advanced optical/e-beam production capability remains a critical gap", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, inspection and defect review cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "85f06b5d73ece5d78a12b666ce98acc1361f1aa7fd4c84da870660e4c2e501ec", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "process_control" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "process_control", "question": "Advanced optical/e-beam production capability remains a critical gap", "why_it_matters": "Without this receipt, inspection and defect review cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Inspection and defect review." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-isa-rtl", "id": "gap-process-isa-rtl", "last_checked": "2026-07-29", "layer": "design", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: ISA and RTL.", "priority": 5, "question": "ISA/RTL provenance and licensed dependencies are not closed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, isa and rtl cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "a4933382ba250bd88f2509b2cb05d9966a28221ba32762cba9ecd2747e6630ac", "stage_ids": [ "design_company" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "design_company", "rule_id": "canonical-design-role", "canonical_field_matches": [ { "field": "layer", "value": "design" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "design" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "design", "question": "ISA/RTL provenance and licensed dependencies are not closed", "why_it_matters": "Without this receipt, isa and rtl cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: ISA and RTL." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-lithography-dry-arf", "id": "gap-process-lithography-dry-arf", "last_checked": "2026-07-29", "layer": "lithography", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Dry ArF lithography.", "priority": 22, "question": "Wavelength/model-to-layer and customer qualification are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, dry arf lithography cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "6d5f5d0ad805fa8dae943dad4b8787f4e53d5106cd10b27b1ba55ced35f1c9f8", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "lithography" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "lithography" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "lithography", "question": "Wavelength/model-to-layer and customer qualification are absent", "why_it_matters": "Without this receipt, dry arf lithography cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Dry ArF lithography." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-lithography-euv", "id": "gap-process-lithography-euv", "last_checked": "2026-07-29", "layer": "lithography", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: EUV lithography.", "priority": 24, "question": "No verified mainland-owned commercial EUV scanner", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, euv lithography cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "98ef936dc562176aee8f13df2e4be939584885cad84b07cfb82a8d30dfcc80c6", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "lithography" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "lithography" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "lithography", "question": "No verified mainland-owned commercial EUV scanner", "why_it_matters": "Without this receipt, euv lithography cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: EUV lithography." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-lithography-iline-krf", "id": "gap-process-lithography-iline-krf", "last_checked": "2026-07-29", "layer": "lithography", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: i-line and KrF lithography.", "priority": 21, "question": "Named installation, site acceptance and qualified layer are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, i-line and krf lithography cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "93cd5204762e1cb4e7776db7a5f73b608952c3996f40061de53307c0ffe46052", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "lithography" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "lithography" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "lithography", "question": "Named installation, site acceptance and qualified layer are absent", "why_it_matters": "Without this receipt, i-line and krf lithography cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: i-line and KrF lithography." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-lithography-immersion-arf", "id": "gap-process-lithography-immersion-arf", "last_checked": "2026-07-29", "layer": "lithography", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Immersion ArF lithography.", "priority": 23, "question": "No public P4-P6 domestic system exists in the seven-fab matrix", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, immersion arf lithography cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "8d1c2c26aa98926198f2de7a0c5861ad72e1afa50e2146603d7636ee46cb331f", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "lithography" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "lithography" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "lithography", "question": "No public P4-P6 China-developed system exists in the seven-fab matrix", "why_it_matters": "Without this receipt, immersion arf lithography cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Immersion ArF lithography." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-logic-foundry", "id": "gap-process-logic-foundry", "last_checked": "2026-07-29", "layer": "fabrication", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Logic wafer fabrication.", "priority": 30, "question": "Node/facility/product/tool joins remain source-bounded and incomplete", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, logic wafer fabrication cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "04a0ee46dce2995904b03dd4c1c4f16c807bafed19c4b20f00a97e418539094d", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "fabrication", "question": "Node/facility/product/tool joins remain source-bounded and incomplete", "why_it_matters": "Without this receipt, logic wafer fabrication cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Logic wafer fabrication." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-aerospace-defense", "id": "gap-process-market-aerospace-defense", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Publicly documented aerospace and defense demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for publicly documented aerospace and defense demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, publicly documented aerospace and defense demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "88b5e1c24921cc63e340e2c117e9a43a7908bc552cb93999b1fc54589ab04b30", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for publicly documented aerospace and defense demand", "why_it_matters": "Without this receipt, publicly documented aerospace and defense demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Publicly documented aerospace and defense demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-ai-inference", "id": "gap-process-market-ai-inference", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: AI inference demand and accepted workloads.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for ai inference demand and accepted workloads", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, ai inference demand and accepted workloads cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "7ddb435d95c142640f99adc5201858183bfa0e77a38d904c32d1f97358b40131", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for ai inference demand and accepted workloads", "why_it_matters": "Without this receipt, ai inference demand and accepted workloads cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: AI inference demand and accepted workloads." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-ai-training", "id": "gap-process-market-ai-training", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: AI training demand and accepted workloads.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for ai training demand and accepted workloads", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, ai training demand and accepted workloads cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "0307015e996bfa1ee8bae502a3e9720592759772a29b7e743039513a4385bd78", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for ai training demand and accepted workloads", "why_it_matters": "Without this receipt, ai training demand and accepted workloads cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: AI training demand and accepted workloads." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-automotive", "id": "gap-process-market-automotive", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Automotive semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for automotive semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, automotive semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "9d238264f53a48bfeaf3962702ffaefdf9acdec0d3e742702792746cbe134ec7", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for automotive semiconductor demand", "why_it_matters": "Without this receipt, automotive semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Automotive semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-cloud-services", "id": "gap-process-market-cloud-services", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Cloud-service semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for cloud-service semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, cloud-service semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "610ccedb895d9995a7e8594d752904ba52838b3200f3f67e04a4483a2381a05c", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for cloud-service semiconductor demand", "why_it_matters": "Without this receipt, cloud-service semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Cloud-service semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-consumer-electronics", "id": "gap-process-market-consumer-electronics", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Consumer-electronics semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for consumer-electronics semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, consumer-electronics semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "517fe71e5dfe66c63b16872bf90c80c821ec8a0f97e505b7dc10eb54f8eef213", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for consumer-electronics semiconductor demand", "why_it_matters": "Without this receipt, consumer-electronics semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Consumer-electronics semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-energy", "id": "gap-process-market-energy", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Energy-system semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for energy-system semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, energy-system semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "67700b119376c68a0694f74d75e93ba11add4b1ec3411a05fd01dd6715a645bd", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for energy-system semiconductor demand", "why_it_matters": "Without this receipt, energy-system semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Energy-system semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-grid", "id": "gap-process-market-grid", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Grid-equipment semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for grid-equipment semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, grid-equipment semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "6266d7f8c921ef38e22e621855b7353d833cc05a6b915f12ff095f86aed605bd", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for grid-equipment semiconductor demand", "why_it_matters": "Without this receipt, grid-equipment semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Grid-equipment semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-imaging-power", "id": "gap-process-market-imaging-power", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Image-sensor and power-electronics demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for image-sensor and power-electronics demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, image-sensor and power-electronics demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "c547fa47d36f7db0cd52d73772566585278880611714f88e19c5c917301cfd4a", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for image-sensor and power-electronics demand", "why_it_matters": "Without this receipt, image-sensor and power-electronics demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Image-sensor and power-electronics demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-industrial-automation", "id": "gap-process-market-industrial-automation", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Industrial-automation semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for industrial-automation semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, industrial-automation semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "48d15b31cbf6faa2cf87ae57909cafc1ab6c053f8d2a11c1533264d65f480a15", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for industrial-automation semiconductor demand", "why_it_matters": "Without this receipt, industrial-automation semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Industrial-automation semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-medical", "id": "gap-process-market-medical", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Medical-device semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for medical-device semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, medical-device semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "fee7009ee66cf9850f504892587ec567c4dbd6a2fbf2bc366a6644df4f42040c", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for medical-device semiconductor demand", "why_it_matters": "Without this receipt, medical-device semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Medical-device semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-networking", "id": "gap-process-market-networking", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Networking-system semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for networking-system semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, networking-system semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "20dc4301174e8ac1310f377e486dc965ddd573423c6d4692ec7a0f072a797608", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for networking-system semiconductor demand", "why_it_matters": "Without this receipt, networking-system semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Networking-system semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-pcs", "id": "gap-process-market-pcs", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: PC semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for pc semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, pc semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "8c8ef69edbc232325087e4e4e11b1b2192fb53b6d5c6ca0f6cf30b493a52c6ef", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for pc semiconductor demand", "why_it_matters": "Without this receipt, pc semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: PC semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-robotics", "id": "gap-process-market-robotics", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Robotics semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for robotics semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, robotics semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "3a7dc6f0dce94be914c86515a3a46f29b7631f4850b7c0cc05ec8dc47e26c847", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for robotics semiconductor demand", "why_it_matters": "Without this receipt, robotics semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Robotics semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-scientific-computing", "id": "gap-process-market-scientific-computing", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Scientific-computing semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for scientific-computing semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, scientific-computing semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "8e69a207e377ca1ffdfb7bd2ece5d9700c2a7e154e63bd83b7136e928a00145b", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for scientific-computing semiconductor demand", "why_it_matters": "Without this receipt, scientific-computing semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Scientific-computing semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-smartphones", "id": "gap-process-market-smartphones", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Smartphone semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for smartphone semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, smartphone semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "04b534920ab1358f704c3714bbd8ac7ae6fe02f0e6edcfe45df7a1f56267bf8e", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for smartphone semiconductor demand", "why_it_matters": "Without this receipt, smartphone semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Smartphone semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-storage", "id": "gap-process-market-storage", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Storage-system semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for storage-system semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, storage-system semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "53e63ab883b95a56f3b3d16553ad9522170f295dc79d9f1de0ee438bb50fab29", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for storage-system semiconductor demand", "why_it_matters": "Without this receipt, storage-system semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Storage-system semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-telecom", "id": "gap-process-market-telecom", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Telecom-system semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for telecom-system semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, telecom-system semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "0b85db3df3811b89fc43252a68adbb866106073d1e017547f3798912e966a27b", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "end_market" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "end_market" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "end_market", "question": "No source-closed legal-entity, product/facility and readiness chain yet for telecom-system semiconductor demand", "why_it_matters": "Without this receipt, telecom-system semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Telecom-system semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-mask-reticle", "id": "gap-process-mask-reticle", "last_checked": "2026-07-29", "layer": "patterning", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Mask, reticle, pellicle, inspection and repair.", "priority": 13, "question": "Advanced mask blank, inspection and repair qualification is unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, mask, reticle, pellicle, inspection and repair cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "6278034d7ba455e32be4a09f504baa833897723da7b2ad48ffe92399a75f3e13", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "patterning" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "patterning" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "patterning", "question": "Advanced mask blank, inspection and repair qualification is unclosed", "why_it_matters": "Without this receipt, mask, reticle, pellicle, inspection and repair cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Mask, reticle, pellicle, inspection and repair." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-200mm-silicon", "id": "gap-process-material-200mm-silicon", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: 200 mm silicon wafers.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for 200 mm silicon wafers", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, 200 mm silicon wafers cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "7515acded78207c5fd1959111e32a5b76a803ebc842db7363c55967ab02cff6e", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for 200 mm silicon wafers", "why_it_matters": "Without this receipt, 200 mm silicon wafers cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: 200 mm silicon wafers." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-300mm-silicon", "id": "gap-process-material-300mm-silicon", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: 300 mm silicon wafers.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for 300 mm silicon wafers", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, 300 mm silicon wafers cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "0551d028033544dd8e9e8344b5ab5578de89c5d711ba03489fc76e02c6716ef5", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for 300 mm silicon wafers", "why_it_matters": "Without this receipt, 300 mm silicon wafers cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: 300 mm silicon wafers." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-abf-bt-ceramic", "id": "gap-process-material-abf-bt-ceramic", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: ABF, BT resin and packaging ceramics.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for abf, bt resin and packaging ceramics", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, abf, bt resin and packaging ceramics cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "f2e9d3c674bc0a59ce2ddd9d20797190b2022a77f1c41924c7c686eca98aad68", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for abf, bt resin and packaging ceramics", "why_it_matters": "Without this receipt, abf, bt resin and packaging ceramics cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: ABF, BT resin and packaging ceramics." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-adhesive-molding-thermal", "id": "gap-process-material-adhesive-molding-thermal", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Adhesives, underfill, NCF, EMC, TIM and fillers.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for adhesives, underfill, ncf, emc, tim and fillers", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, adhesives, underfill, ncf, emc, tim and fillers cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "ff8162b8a2172869ce189e6fb7872911e6eb4d7d97fa4cca736c767ae2229139", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for adhesives, underfill, ncf, emc, tim and fillers", "why_it_matters": "Without this receipt, adhesives, underfill, ncf, emc, tim and fillers cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Adhesives, underfill, NCF, EMC, TIM and fillers." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-cmp-consumables", "id": "gap-process-material-cmp-consumables", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: CMP slurry and pads.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for cmp slurry and pads", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, cmp slurry and pads cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "e15ad4d379c950574a77012afd9e402fb3b9fc63a982925c55c0597c42fc1683", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for cmp slurry and pads", "why_it_matters": "Without this receipt, cmp slurry and pads cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: CMP slurry and pads." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-compound-substrate", "id": "gap-process-material-compound-substrate", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: SiC, GaN and sapphire substrates and epitaxy.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for sic, gan and sapphire substrates and epitaxy", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, sic, gan and sapphire substrates and epitaxy cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "941e6db8595325444138762f6f92006053436e58f90db0021c3373e0fa3c2aac", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for sic, gan and sapphire substrates and epitaxy", "why_it_matters": "Without this receipt, sic, gan and sapphire substrates and epitaxy cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: SiC, GaN and sapphire substrates and epitaxy." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-epi-heavy-doped", "id": "gap-process-material-epi-heavy-doped", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Epitaxial and heavily doped silicon wafers.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for epitaxial and heavily doped silicon wafers", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, epitaxial and heavily doped silicon wafers cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "d4ab80439ff2191494ae5415589f8d1cf8eaf52b1bf951d7dfafd1b7d575e285", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for epitaxial and heavily doped silicon wafers", "why_it_matters": "Without this receipt, epitaxial and heavily doped silicon wafers cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Epitaxial and heavily doped silicon wafers." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-leadframe-bondwire", "id": "gap-process-material-leadframe-bondwire", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Leadframes and bonding wire.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for leadframes and bonding wire", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, leadframes and bonding wire cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "9f1d4a7f4751e945ea0e8278c58b6eb1e311f8b5b33d20957e0e6e71abb4f2bd", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for leadframes and bonding wire", "why_it_matters": "Without this receipt, leadframes and bonding wire cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Leadframes and bonding wire." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-mask-blank-quartz", "id": "gap-process-material-mask-blank-quartz", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Mask blanks and high-purity quartz.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for mask blanks and high-purity quartz", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, mask blanks and high-purity quartz cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "0e23ad672286ec5181ba46472453dc1844b456805fd8da93bd3223eb3433f909", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for mask blanks and high-purity quartz", "why_it_matters": "Without this receipt, mask blanks and high-purity quartz cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Mask blanks and high-purity quartz." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-metal-highk-precursors", "id": "gap-process-material-metal-highk-precursors", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Barrier, seed, high-k and metal precursors.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for barrier, seed, high-k and metal precursors", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, barrier, seed, high-k and metal precursors cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "aa831b8381c7e935bf7686af1e89eb790fc220352b424b278cb7c0ae414323ab", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for barrier, seed, high-k and metal precursors", "why_it_matters": "Without this receipt, barrier, seed, high-k and metal precursors cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Barrier, seed, high-k and metal precursors." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-process-gases", "id": "gap-process-material-process-gases", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Etch, deposition, implant and bulk process gases.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for etch, deposition, implant and bulk process gases", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, etch, deposition, implant and bulk process gases cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "f0548d8d955a156ce0ba81ae45fccec3ffdb1edea911ceb8ad45d29d5cec524f", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for etch, deposition, implant and bulk process gases", "why_it_matters": "Without this receipt, etch, deposition, implant and bulk process gases cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Etch, deposition, implant and bulk process gases." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-resist-stack", "id": "gap-process-material-resist-stack", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Photoresist, PAG, resin, developer, rinse and topcoat.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for photoresist, pag, resin, developer, rinse and topcoat", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, photoresist, pag, resin, developer, rinse and topcoat cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b284c89b1cf4e14ad561f3ec6a8d7b2ce21e59e692a19194f0de9bca11ea1ee4", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for photoresist, pag, resin, developer, rinse and topcoat", "why_it_matters": "Without this receipt, photoresist, pag, resin, developer, rinse and topcoat cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Photoresist, PAG, resin, developer, rinse and topcoat." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-soi", "id": "gap-process-material-soi", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Silicon-on-insulator wafers.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for silicon-on-insulator wafers", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, silicon-on-insulator wafers cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "a53bdc2a2309c798cb55877b7656e195886ba901b42a94c0504e6d6532a87f7b", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for silicon-on-insulator wafers", "why_it_matters": "Without this receipt, silicon-on-insulator wafers cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Silicon-on-insulator wafers." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-sputter-targets", "id": "gap-process-material-sputter-targets", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Sputtering targets.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for sputtering targets", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, sputtering targets cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "2eba972c83506db931feea5afd559293b863339446049a53ffe384f8d539c5e6", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for sputtering targets", "why_it_matters": "Without this receipt, sputtering targets cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Sputtering targets." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-substrate-interposer-rdl", "id": "gap-process-material-substrate-interposer-rdl", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Package substrates, interposers and RDL materials.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for package substrates, interposers and rdl materials", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, package substrates, interposers and rdl materials cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b6cd61a905ae2d2da4811f0d65c2d45fb0d561748b9f40efb0bc7d523b29d698", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for package substrates, interposers and rdl materials", "why_it_matters": "Without this receipt, package substrates, interposers and rdl materials cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Package substrates, interposers and RDL materials." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-wet-plating-chemistry", "id": "gap-process-material-wet-plating-chemistry", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Wet chemicals and electroplating chemistry.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for wet chemicals and electroplating chemistry", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, wet chemicals and electroplating chemistry cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "c8e5f6ff94b60eed83290cc7fc3a376d7eda1c77038671baec96980d729ba6c5", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials_leaf" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials_leaf" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials_leaf", "question": "No source-closed legal-entity, product/facility and readiness chain yet for wet chemicals and electroplating chemistry", "why_it_matters": "Without this receipt, wet chemicals and electroplating chemistry cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Wet chemicals and electroplating chemistry." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-metrology", "id": "gap-process-metrology", "last_checked": "2026-07-29", "layer": "process_control", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: CD, overlay, film and materials metrology.", "priority": 30, "question": "Advanced production metrology qualification remains unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, cd, overlay, film and materials metrology cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "86b669c1d55ae457ab4feabfe4fe463d893de6259d70a107921376d500cb66e6", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "process_control" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "process_control", "question": "Advanced production metrology qualification remains unclosed", "why_it_matters": "Without this receipt, cd, overlay, film and materials metrology cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: CD, overlay, film and materials metrology." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-nand-fabrication", "id": "gap-process-nand-fabrication", "last_checked": "2026-07-29", "layer": "fabrication", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: 3D NAND wafer fabrication.", "priority": 30, "question": "Generation/facility/capacity/yield and supplier BOM remain incomplete", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, 3d nand wafer fabrication cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "5126ee32844e04af7c3dcff2ad385beaad388100b7a737b61b043bb57e5a905e", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "fabrication", "question": "Generation/facility/capacity/yield and supplier BOM remain incomplete", "why_it_matters": "Without this receipt, 3d nand wafer fabrication cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: 3D NAND wafer fabrication." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-national-commercial-demand", "id": "gap-process-national-commercial-demand", "last_checked": "2026-07-29", "layer": "demand", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: National and commercial semiconductor demand.", "priority": 1, "question": "No source-closed demand-to-chip procurement ledger yet", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, national and commercial semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "f05f2b35eab8b1fd2e733e848b332dfb24c86629e21a2949cacbeff0b35ed10f", "stage_ids": [ "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "demand" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "demand" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "demand", "question": "No source-closed demand-to-chip procurement ledger yet", "why_it_matters": "Without this receipt, national and commercial semiconductor demand cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: National and commercial semiconductor demand." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-organic-substrate", "id": "gap-process-organic-substrate", "last_checked": "2026-07-29", "layer": "advanced_packaging", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Organic substrate manufacturing.", "priority": 30, "question": "HBM-class ABF substrate qualification remains unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, organic substrate manufacturing cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "25e11fc41ff57d38d8b325c6db1442d4465b0ea2f6530774d3d1b6355ccb01d4", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "advanced_packaging" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "advanced_packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "advanced_packaging", "question": "HBM-class ABF substrate qualification remains unclosed", "why_it_matters": "Without this receipt, organic substrate manufacturing cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Organic substrate manufacturing." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-os-collectives-serving", "id": "gap-process-os-collectives-serving", "last_checked": "2026-07-29", "layer": "software", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: OS, collectives, serving engine and scheduling.", "priority": 30, "question": "Versioned scale-out software and independent distributed-workload receipt are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, os, collectives, serving engine and scheduling cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "1b1b18bdcb5eddf40bebefb2204bddf6b3cee723a2f8bf84dcb99c172267333c", "stage_ids": [ "software_workload" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "software_workload", "rule_id": "canonical-software-or-workload-role", "canonical_field_matches": [ { "field": "layer", "value": "software" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "software" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "software", "question": "Versioned scale-out software and independent distributed-workload receipt are absent", "why_it_matters": "Without this receipt, os, collectives, serving engine and scheduling cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: OS, collectives, serving engine and scheduling." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-osat-assembly", "id": "gap-process-osat-assembly", "last_checked": "2026-07-29", "layer": "packaging_test", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Assembly and advanced packaging.", "priority": 30, "question": "Named HBM die owner, stack, customer, yield and volume are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, assembly and advanced packaging cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "dfd8695fc4c4ca2b5c0bfd1e8dfc0d12c5739436fd93be387a70dadbe9674483", "stage_ids": [ "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "packaging_test" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "layer", "value": "packaging_test" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "packaging_test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "packaging_test", "question": "Named HBM die owner, stack, customer, yield and volume are absent", "why_it_matters": "Without this receipt, assembly and advanced packaging cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Assembly and advanced packaging." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-packaging-substrates", "id": "gap-process-packaging-substrates", "last_checked": "2026-07-29", "layer": "materials", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Organic, ceramic, glass and silicon substrates/interposers.", "priority": 16, "question": "HBM-class substrate/interposer qualification is unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, organic, ceramic, glass and silicon substrates/interposers cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "a1ac02ef730d7adc44024fee2d2cbfe8e3568595215aaabef309eea6aa2214b4", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials", "question": "HBM-class substrate/interposer qualification is unclosed", "why_it_matters": "Without this receipt, organic, ceramic, glass and silicon substrates/interposers cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Organic, ceramic, glass and silicon substrates/interposers." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-pdk-libraries-ip", "id": "gap-process-pdk-libraries-ip", "last_checked": "2026-07-29", "layer": "eda_ip", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: PDK, standard cells, memory compilers and interface IP.", "priority": 11, "question": "Named foundry PDK, licensee, tapeout and production-chip receipts are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, pdk, standard cells, memory compilers and interface ip cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "dc2a584c17b8b660c161dfb805c71072a896729c5b1f6d967e28b675455407c3", "stage_ids": [ "architecture_ip", "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "architecture_ip", "rule_id": "canonical-architecture-or-ip-role", "canonical_field_matches": [ { "field": "layer", "value": "eda_ip" } ] }, { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "layer", "value": "eda_ip" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "eda_ip" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "eda_ip", "question": "Named foundry PDK, licensee, tapeout and production-chip receipts are absent", "why_it_matters": "Without this receipt, pdk, standard cells, memory compilers and interface ip cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: PDK, standard cells, memory compilers and interface IP." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-physical-design-signoff", "id": "gap-process-physical-design-signoff", "last_checked": "2026-07-29", "layer": "eda", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Place and route, timing, power and signoff.", "priority": 8, "question": "Advanced-node full-flow signoff evidence is absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, place and route, timing, power and signoff cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "e467455d8b6a5a1c3c05ce5821d8866353bd6713d8b1285b1f7d0323c51bf8e9", "stage_ids": [ "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "layer", "value": "eda" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "eda" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "eda", "question": "Advanced-node full-flow signoff evidence is absent", "why_it_matters": "Without this receipt, place and route, timing, power and signoff cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Place and route, timing, power and signoff." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-plating", "id": "gap-process-plating", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Electroplating.", "priority": 30, "question": "Named fab and qualified TSV/interconnect layer are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, electroplating cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "2ba6705b7a76c5ed346a67dcb462e6f3d61e1baf91aa375b4e2f2790d6036717", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "wafer_equipment", "question": "Named fab and qualified TSV/interconnect layer are absent", "why_it_matters": "Without this receipt, electroplating cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Electroplating." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-power-cooling", "id": "gap-process-power-cooling", "last_checked": "2026-07-29", "layer": "systems", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power delivery and cooling.", "priority": 30, "question": "DF1000 card/rack power and thermal BOM are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, power delivery and cooling cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "fa13af4491d694aab4061c1fd90d647c74730ee05973f69d52d00d52ed8ee589", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "layer", "value": "systems" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "systems", "question": "DF1000 card/rack power and thermal BOM are absent", "why_it_matters": "Without this receipt, power delivery and cooling cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power delivery and cooling." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-power-water", "id": "gap-process-power-water", "last_checked": "2026-07-29", "layer": "facilities", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power, ultrapure water and backup power.", "priority": 18, "question": "Fab-specific demand, redundancy and utility supplier evidence is unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, power, ultrapure water and backup power cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "e058c43fe5dd559cb22499d749c96006d27573d2ded14bd0bb2a1de853233dbf", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities", "question": "Fab-specific demand, redundancy and utility supplier evidence is unclosed", "why_it_matters": "Without this receipt, power, ultrapure water and backup power cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power, ultrapure water and backup power." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-rdl-interposer", "id": "gap-process-rdl-interposer", "last_checked": "2026-07-29", "layer": "advanced_packaging", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: RDL and interposer integration.", "priority": 30, "question": "HBM-specific interposer and yield receipts are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, rdl and interposer integration cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "8e824d00ff84afc5f019b5a13775263ba61c8fbc9050a6661126a58c72f159d3", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "advanced_packaging" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "advanced_packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "advanced_packaging", "question": "HBM-specific interposer and yield receipts are absent", "why_it_matters": "Without this receipt, rdl and interposer integration cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: RDL and interposer integration." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-reliability-failure-analysis", "id": "gap-process-reliability-failure-analysis", "last_checked": "2026-07-29", "layer": "packaging_test", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Reliability and failure analysis.", "priority": 30, "question": "Field-reliability and qualification receipts are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, reliability and failure analysis cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "2bb58e0dd5f72dddaaa2daf19856f088656d08ca24004c2ae0e0e4e616ab3390", "stage_ids": [ "package_provider", "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "packaging_test" } ] }, { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "layer", "value": "packaging_test" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "packaging_test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "packaging_test", "question": "Field-reliability and qualification receipts are absent", "why_it_matters": "Without this receipt, reliability and failure analysis cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Reliability and failure analysis." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-sic-gan", "id": "gap-process-sic-gan", "last_checked": "2026-07-29", "layer": "fabrication", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: SiC and GaN device fabrication.", "priority": 30, "question": "Substrate-to-device-to-module source chain is not yet closed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, sic and gan device fabrication cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "770803e298ec895b50aa31984b1c6d2c8e9d8420f1f53fe991b8109b1a466255", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "fabrication", "question": "Substrate-to-device-to-module source chain is not yet closed", "why_it_matters": "Without this receipt, sic and gan device fabrication cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: SiC and GaN device fabrication." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-signal-power-integrity", "id": "gap-process-signal-power-integrity", "last_checked": "2026-07-29", "layer": "eda", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Signal and power integrity.", "priority": 9, "question": "Named chip and production qualification receipts are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, signal and power integrity cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b7a1ccd0944a2af788b9254778fdffba9cc3eb2c54af5c830aca49ff71dd7073", "stage_ids": [ "eda" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "eda", "rule_id": "canonical-eda-role", "canonical_field_matches": [ { "field": "layer", "value": "eda" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "eda" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "eda", "question": "Named chip and production qualification receipts are absent", "why_it_matters": "Without this receipt, signal and power integrity cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Signal and power integrity." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-silicon-photonics", "id": "gap-process-silicon-photonics", "last_checked": "2026-07-29", "layer": "fabrication", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Silicon photonics and optical integration.", "priority": 30, "question": "Foundry/package/customer qualification chain is not closed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, silicon photonics and optical integration cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "9f1787c3a75b00b1222d7b5be8e200f3d5ea5327221e8a3b27bff9cfe4527248", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "fabrication", "question": "Foundry/package/customer qualification chain is not closed", "why_it_matters": "Without this receipt, silicon photonics and optical integration cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Silicon photonics and optical integration." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-silicon-wafers", "id": "gap-process-silicon-wafers", "last_checked": "2026-07-29", "layer": "materials", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Silicon and SOI wafers.", "priority": 14, "question": "Grade, defect limit and named-fab qualification are unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, silicon and soi wafers cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "dee59aa95f502586c49688b5888664f8e098e3437cfd7acdbb2fbc9faf7e4be8", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "materials" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "materials", "question": "Grade, defect limit and named-fab qualification are unclosed", "why_it_matters": "Without this receipt, silicon and soi wafers cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Silicon and SOI wafers." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-specialty-memory", "id": "gap-process-specialty-memory", "last_checked": "2026-07-29", "layer": "fabrication", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: NOR and specialty memory fabrication.", "priority": 30, "question": "SKU-level customer, yield and volume are incomplete", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, nor and specialty memory fabrication cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "0343d94a4980da7ba2562c6c112519cc6e7fc98d242685ddf3475a0a5f8cf106", "stage_ids": [ "logic_foundry_process" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "fabrication" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "fabrication" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "fabrication", "question": "SKU-level customer, yield and volume are incomplete", "why_it_matters": "Without this receipt, nor and specialty memory fabrication cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: NOR and specialty memory fabrication." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-stack-assembly-repair", "id": "gap-process-stack-assembly-repair", "last_checked": "2026-07-29", "layer": "advanced_packaging", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Stack assembly, repair and redundancy.", "priority": 30, "question": "Qualified mainland commercial HBM stack assembly is absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, stack assembly, repair and redundancy cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "d3b2979b2a0240a586efb26758b2199781363026b99c63b72042489119be6334", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "advanced_packaging" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "advanced_packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "advanced_packaging", "question": "Qualified mainland commercial HBM stack assembly is absent", "why_it_matters": "Without this receipt, stack assembly, repair and redundancy cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Stack assembly, repair and redundancy." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-storage-tier", "id": "gap-process-storage-tier", "last_checked": "2026-07-29", "layer": "systems", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Local, CXL, PCIe, NVMe and remote storage tiers.", "priority": 30, "question": "Matched latency, energy, contention and recovery receipts are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, local, cxl, pcie, nvme and remote storage tiers cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b321cf67b78f1d2fa54707adb26fa62148f2b41f6e7c7e2cb66dcf62e62a8488", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "layer", "value": "systems" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "systems", "question": "Matched latency, energy, contention and recovery receipts are absent", "why_it_matters": "Without this receipt, local, cxl, pcie, nvme and remote storage tiers cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Local, CXL, PCIe, NVMe and remote storage tiers." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-system-architecture", "id": "gap-process-system-architecture", "last_checked": "2026-07-29", "layer": "systems", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: System architecture and integration.", "priority": 3, "question": "Vendor system pages lack installed-customer and BOM receipts", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, system architecture and integration cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "6dc39a9460af1696697d33758f80de7cdbe9c45505a2983ade965a4f73a374b7", "stage_ids": [ "board_system" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "board_system", "rule_id": "canonical-board-or-system-role", "canonical_field_matches": [ { "field": "layer", "value": "systems" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "systems" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "systems", "question": "Vendor system pages lack installed-customer and BOM receipts", "why_it_matters": "Without this receipt, system architecture and integration cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: System architecture and integration." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-thermal", "id": "gap-process-thermal", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Furnace, oxidation, diffusion and RTP.", "priority": 30, "question": "Model/facility/layer receipts are incomplete", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, furnace, oxidation, diffusion and rtp cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "8cde66fedaef668cbea2dd0596117c438055f5c87dcc024e9668d46c0c121bdd", "stage_ids": [ "wafer_equipment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "wafer_equipment", "rule_id": "canonical-wafer-equipment-role", "canonical_field_matches": [ { "field": "layer", "value": "wafer_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "wafer_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "wafer_equipment", "question": "Model/facility/layer receipts are incomplete", "why_it_matters": "Without this receipt, furnace, oxidation, diffusion and rtp cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Furnace, oxidation, diffusion and RTP." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-track", "id": "gap-process-track", "last_checked": "2026-07-29", "layer": "lithography", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Coat/develop track.", "priority": 25, "question": "Named scanner pairing and qualified production layer are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, coat/develop track cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "e89941072c95ea079c0dd36433e6428ba1e1f0d16b6bf585a6f2f55e56694d92", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "lithography" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "lithography" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "lithography", "question": "Named scanner pairing and qualified production layer are absent", "why_it_matters": "Without this receipt, coat/develop track cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Coat/develop track." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-tsv", "id": "gap-process-tsv", "last_checked": "2026-07-29", "layer": "advanced_packaging", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: TSV formation, dielectric, barrier, seed and fill.", "priority": 30, "question": "Qualified mainland commercial HBM TSV chain is absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, tsv formation, dielectric, barrier, seed and fill cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "ec3aeece1a63c78eecba882687f3cbf74eef7fe77f6de39efa42f915558410d9", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "advanced_packaging" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "advanced_packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "advanced_packaging", "question": "Qualified mainland commercial HBM TSV chain is absent", "why_it_matters": "Without this receipt, tsv formation, dielectric, barrier, seed and fill cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: TSV formation, dielectric, barrier, seed and fill." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-vacuum-abatement-wastewater", "id": "gap-process-vacuum-abatement-wastewater", "last_checked": "2026-07-29", "layer": "facilities", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Vacuum, abatement, solvent recovery and wastewater.", "priority": 20, "question": "Facility-specific equipment and service receipts are unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, vacuum, abatement, solvent recovery and wastewater cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "18c4867d6c997cd4208f542489747611b9dd8efda6652013e6058b2b8d5b126e", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facilities" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facilities" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facilities", "question": "Facility-specific equipment and service receipts are unclosed", "why_it_matters": "Without this receipt, vacuum, abatement, solvent recovery and wastewater cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Vacuum, abatement, solvent recovery and wastewater." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-wafer-probe", "id": "gap-process-wafer-probe", "last_checked": "2026-07-29", "layer": "test", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Wafer probe and known-good-die selection.", "priority": 30, "question": "HBM-grade KGD selection and probe coverage are unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, wafer probe and known-good-die selection cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "041bd09089b48295cd2a242d59243448dece713aa1a58ab5a8acd3c9ce7a6385", "stage_ids": [ "assembly_test" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "layer", "value": "test" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "test" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "test", "question": "HBM-grade KGD selection and probe coverage are unclosed", "why_it_matters": "Without this receipt, wafer probe and known-good-die selection cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Wafer probe and known-good-die selection." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-wafer-thinning", "id": "gap-process-wafer-thinning", "last_checked": "2026-07-29", "layer": "advanced_packaging", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Wafer thinning and backgrind.", "priority": 30, "question": "HBM-specific qualified process and yield are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, wafer thinning and backgrind cannot be promoted to qualified or volume-backed coverage.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "2e5b570f78bb82eda6710bca95ef35052f1c1ff6a0ab1a2aea13ba508fc00b0b", "stage_ids": [ "package_provider" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "package_provider", "rule_id": "canonical-packaging-role", "canonical_field_matches": [ { "field": "layer", "value": "advanced_packaging" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "advanced_packaging" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "advanced_packaging", "question": "HBM-specific qualified process and yield are absent", "why_it_matters": "Without this receipt, wafer thinning and backgrind cannot be promoted to qualified or volume-backed coverage.", "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Wafer thinning and backgrind." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-cxmt-duv", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-cxmt-duv", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "purchase", "model/serial", "move-in", "installation", "site acceptance" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for CXMT domestic DUV receipt.", "priority": 10, "question": "CXMT domestic DUV receipt", "record_type": "gap", "source_ids": [], "why_it_matters": "Future-recipient language is below P4.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "e01512ce7eaa02214f30643154bd5b36ab1b528814984541b71270bfd7870759", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "CXMT China-developed DUV receipt", "why_it_matters": "Future-recipient language is below P4.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for CXMT China-developed DUV receipt." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-cxmt-fab-bom", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-cxmt-fab-bom", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "facility", "supplier legal entity", "model/material grade", "acceptance" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for CXMT fab equipment and material suppliers.", "priority": 8, "question": "CXMT fab equipment and material suppliers", "record_type": "gap", "source_ids": [], "why_it_matters": "DRAM products do not reveal facility BOM.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "7114377a3b0823cf0cb321ff2924cf720de5c7be23d5ecb4c9b5e965299b09a0", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "CXMT fab equipment and material suppliers", "why_it_matters": "DRAM products do not reveal facility BOM.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for CXMT fab equipment and material suppliers." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-cxmt-phone-program", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-cxmt-phone-program", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "legal buyer", "phone model", "AVL/qualification", "shipments" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for CXMT LPDDR5 legal customer/program.", "priority": 7, "question": "CXMT LPDDR5 legal customer/program", "record_type": "gap", "source_ids": [], "why_it_matters": "Brand validation does not resolve contracting legal entity or shipping program.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "c2206c927955a63da824d60e7e462dc89c12c38d50d6a4a497605ee94c6fb461", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "CXMT LPDDR5 legal customer/program", "why_it_matters": "Brand validation does not resolve contracting legal entity or shipping program.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for CXMT LPDDR5 legal customer/program." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-df1000-bond-tool", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-df1000-bond-tool", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "tool vendor/model", "facility", "bond flow/pitch/yield" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 bonding equipment and process owner.", "priority": 4, "question": "DF1000 bonding equipment and process owner", "record_type": "gap", "source_ids": [], "why_it_matters": "A generic domestic bonding portfolio is not a DF1000 edge.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "ba7a9f919144dcc3cb6807a60632d69c3e0ac184f7c955c1edc316727fd67e29", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "DF1000 bonding equipment and process owner", "why_it_matters": "A generic China-developed bonding portfolio is not a DF1000 edge.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 bonding equipment and process owner." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-df1000-customer", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-df1000-customer", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "customer legal entity", "purchase/acceptance", "units and dates" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 named customer and shipment.", "priority": 5, "question": "DF1000 named customer and shipment", "record_type": "gap", "source_ids": [], "why_it_matters": "Product launch is not commercial delivery or volume.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b1b4f9763ee7246b8e2de01f9589ffe8d1b80f2988f5ced97eb2f894e68dd49b", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "DF1000 named customer and shipment", "why_it_matters": "Product launch is not commercial delivery or volume.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 named customer and shipment." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-df1000-foundry", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-df1000-foundry", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "foundry legal entity", "facility", "wafer lot/tapeout receipt" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 foundry and fabrication facility.", "priority": 1, "question": "DF1000 foundry and fabrication facility", "record_type": "gap", "source_ids": [], "why_it_matters": "A foundry is not inferred from the reported 14 nm process.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b06e6554bcbd8e47f3747e80f1b296f9840553280e167cc1e61305d865a0bfb5", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "DF1000 foundry and fabrication facility", "why_it_matters": "A foundry is not inferred from the reported 14 nm process.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 foundry and fabrication facility." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-df1000-memory", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-df1000-memory", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "memory legal entity", "die generation", "wafer/die supply receipt" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 memory die supplier.", "priority": 2, "question": "DF1000 memory die supplier", "record_type": "gap", "source_ids": [], "why_it_matters": "3D DRAM does not identify the DRAM maker.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "273e26cb010e40fb427b7fa7822246c3e7c34d86b59fcd859f1e4bed9a78a2b3", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "DF1000 memory die supplier", "why_it_matters": "3D DRAM does not identify the DRAM maker.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 memory die supplier." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-df1000-osat", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-df1000-osat", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "OSAT legal entity", "facility", "package/flow acceptance" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 OSAT and packaging facility.", "priority": 3, "question": "DF1000 OSAT and packaging facility", "record_type": "gap", "source_ids": [], "why_it_matters": "Hybrid bonding/3D packaging does not identify the assembler.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "72938ea1a512a9b4d0e9ed4a5e7660eed8de4f3cc90391b05f87395a5fe5b7fe", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "DF1000 OSAT and packaging facility", "why_it_matters": "Hybrid bonding/3D packaging does not identify the assembler.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 OSAT and packaging facility." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-df1000-server-oem", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-df1000-server-oem", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "OEM/legal operator", "facility", "component BOM", "shipment" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for QY100/TY64/HS512 manufacturing and server OEM path.", "priority": 6, "question": "QY100/TY64/HS512 manufacturing and server OEM path", "record_type": "gap", "source_ids": [], "why_it_matters": "A vendor product page does not close system BOM/assembly.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "920f9924c9a6a6b231c620ba062e54d485f12143cd94f709f3965b2f060bf3f1", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "QY100/TY64/HS512 manufacturing and server OEM path", "why_it_matters": "A vendor product page does not close system BOM/assembly.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for QY100/TY64/HS512 manufacturing and server OEM path." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-gentech-part-tool-fab", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-gentech-part-tool-fab", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "part number", "equipment model", "fab", "quantity/acceptance" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Gentech delivery subsystem part-to-tool-to-fab join.", "priority": 17, "question": "Gentech delivery subsystem part-to-tool-to-fab join", "record_type": "gap", "source_ids": [], "why_it_matters": "Batch supply to equipment makers lacks exact insertion.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "cc780506066d9dceff3b9fd86fe79010f2866fffcb7f6b7252066eea826995be", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "Gentech delivery subsystem part-to-tool-to-fab join", "why_it_matters": "Batch supply to equipment makers lacks exact insertion.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Gentech delivery subsystem part-to-tool-to-fab join." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-hbm-accelerator", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-hbm-accelerator", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "stack product/generation", "accelerator", "customer qualification", "sustained yield/shipments" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Qualified mainland HBM stack-to-accelerator relationship.", "priority": 20, "question": "Qualified mainland HBM stack-to-accelerator relationship", "record_type": "gap", "source_ids": [], "why_it_matters": "Generic TSV/bonding/package capability is not HBM completion.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "383131428f437052929b64e91daf99005f0478d3d24d33dcea83fee231c8865f", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "Qualified mainland HBM stack-to-accelerator relationship", "why_it_matters": "Generic TSV/bonding/package capability is not HBM completion.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Qualified mainland HBM stack-to-accelerator relationship." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-hengyunchang-fab-validation", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-hengyunchang-fab-validation", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "component SKU", "tool model", "fab", "dual validation and spares" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Hengyunchang RF power fab validation.", "priority": 16, "question": "Hengyunchang RF power fab validation", "record_type": "gap", "source_ids": [], "why_it_matters": "Equipment-maker sales do not identify fab-level validation.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "f192337b7f6b0af171a24b918538e11ace0daf2101362f14eafa10f2b20fefda", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "Hengyunchang RF power fab validation", "why_it_matters": "Equipment-maker sales do not identify fab-level validation.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Hengyunchang RF power fab validation." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-huahong-duv", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-huahong-duv", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "subsidiary/fab", "purchase", "installation", "acceptance" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Hua Hong domestic DUV receipt.", "priority": 12, "question": "Hua Hong domestic DUV receipt", "record_type": "gap", "source_ids": [], "why_it_matters": "Future-recipient language is below P4 and the fab is unresolved.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "c89ec6119955a2f372d7d99e2876bd1da80fbee1ca714262992905d5b0912dd4", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "Hua Hong China-developed DUV receipt", "why_it_matters": "Future-recipient language is below P4 and the fab is unresolved.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Hua Hong China-developed DUV receipt." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-huate-gas-fab", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-huate-gas-fab", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "gas SKU/grade", "fab/process layer", "qualification date", "quantity" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Huate exact gas-to-SMIC Ningbo process join.", "priority": 18, "question": "Huate exact gas-to-SMIC Ningbo process join", "record_type": "gap", "source_ids": [], "why_it_matters": "Supplier award does not identify the gas, layer or quantity.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "bb28e2f1665e2efb259191bae30bcc2207301c999d6c3a2f4e36f107095674ab", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "Huate exact gas-to-SMIC Ningbo process join", "why_it_matters": "Supplier award does not identify the gas, layer or quantity.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Huate exact gas-to-SMIC Ningbo process join." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-hwatsing-model-facility", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-hwatsing-model-facility", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "exact model", "receiving facility", "slurry/pad", "yield effect" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Hwatsing CMP model-to-fab acceptance.", "priority": 15, "question": "Hwatsing CMP model-to-fab acceptance", "record_type": "gap", "source_ids": [], "why_it_matters": "Aggregate customer evidence does not identify model/fab/layer.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "f9c51da33adeb3142297370988666f3f232d659fc4666336e235152437efb8b7", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "Hwatsing CMP model-to-fab acceptance", "why_it_matters": "Aggregate customer evidence does not identify model/fab/layer.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Hwatsing CMP model-to-fab acceptance." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-nsig-customer-grade", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-nsig-customer-grade", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "wafer grade/spec", "facility", "customer/fab/process", "qualified output" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for NSIG wafer grade-to-customer qualification.", "priority": 19, "question": "NSIG wafer grade-to-customer qualification", "record_type": "gap", "source_ids": [], "why_it_matters": "Group capacity does not prove grade, customer or qualified output.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "678aa88f625f116d5f7e9ee1c566201251fce12e5993c3004bcd988daef24748", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "NSIG wafer grade-to-customer qualification", "why_it_matters": "Group capacity does not prove grade, customer or qualified output.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for NSIG wafer grade-to-customer qualification." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-piotech-model-facility", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-piotech-model-facility", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "exact model", "receiving facility", "acceptance", "qualified layer" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Piotech deposition model-to-fab acceptance.", "priority": 14, "question": "Piotech deposition model-to-fab acceptance", "record_type": "gap", "source_ids": [], "why_it_matters": "Group-level production-line use does not identify model/fab/layer.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "6104787b232ea680e98161737efca47f226752743c80fd59c099396165ddd35b", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "Piotech deposition model-to-fab acceptance", "why_it_matters": "Group-level production-line use does not identify model/fab/layer.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Piotech deposition model-to-fab acceptance." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-smic-duv", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-smic-duv", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "subsidiary/fab", "model/serial", "acceptance", "qualified layer" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for SMIC domestic DUV receipt.", "priority": 11, "question": "SMIC domestic DUV receipt", "record_type": "gap", "source_ids": [], "why_it_matters": "Anonymous prototype evaluation is only a P3 lead.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "10e735bc5b64a7018bc3d477edc1cba941d606f4937c500566fd31ea0b4fd14c", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "SMIC China-developed DUV receipt", "why_it_matters": "Anonymous prototype evaluation is only a P3 lead.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for SMIC China-developed DUV receipt." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-tongfu-hbm-customer", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-tongfu-hbm-customer", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "stack generation", "DRAM owner", "accelerator/customer", "yield/shipments" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Tongfu HBM project customer and qualified stack.", "priority": 13, "question": "Tongfu HBM project customer and qualified stack", "record_type": "gap", "source_ids": [], "why_it_matters": "Project construction is not HBM customer qualification.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "9a94bcc48dfb4e05e1cbd87398ef4cf29941539b144c076093ec5fbf7753e029", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "Tongfu HBM project customer and qualified stack", "why_it_matters": "Project construction is not HBM customer qualification.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Tongfu HBM project customer and qualified stack." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-ymtc-scanner", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-ymtc-scanner", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "scanner model", "fab phase", "layer", "acceptance and yield" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for YMTC scanner vendor/model by 3D NAND layer.", "priority": 9, "question": "YMTC scanner vendor/model by 3D NAND layer", "record_type": "gap", "source_ids": [], "why_it_matters": "Production with an unidentified fleet cannot prove domestic DUV.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b1082fb247af4e9ffedbce5da359c577eff0a023f781aa523e59ca4a45840aac", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "supplier_customer_receipt" }, { "field": "gap_type", "value": "missing_supplier_or_customer_receipt" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "supplier_customer_receipt", "question": "YMTC scanner vendor/model by 3D NAND layer", "why_it_matters": "Production with an unidentified fleet cannot prove China-developed DUV.", "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for YMTC scanner vendor/model by 3D NAND layer." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-smee-ssc800-award-buyer-and-acceptance", "id": "gap-smee-ssc800-award-buyer-and-acceptance", "last_checked": "2026-07-29", "layer": "domestic_duv", "missing_proof": [ "buyer legal identity/registration ID", "signed contract/equipment schedule", "manufacturing completion/serial", "shipment", "delivery/receiving", "move-in", "installation", "site acceptance", "asset registration", "wavelength/NA", "facility owner/operator", "qualified layer", "yield" ], "next_action": "Retrieve CCGP contract and 履约验收 records for project MB20016721763953804060, especially the signed equipment schedule and delivery/SAT attachment naming serial, purchaser and installation facility; if absent, inspect 2026 public fixed-asset/audit records for the same project ID and amount.", "priority": 1, "question": "What exact legal entity is zycgr22011903/LGGJ实验室, and did SSC800/10 progress beyond award?", "record_type": "gap", "source_ids": [], "why_it_matters": "An award is not a signed contract, shipment, installation, site acceptance or production qualification.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "a6bef6cd5226740190f6d201937e6532e0e42c015669d43824a5482910284eee", "stage_ids": [ "lithography" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "domestic_duv" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "domestic_duv" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "China-developed DUV", "question": "What exact legal entity is zycgr22011903/LGGJ实验室, and did SSC800/10 progress beyond award?", "why_it_matters": "An award is not a signed contract, shipment, installation, site acceptance or production qualification.", "next_action": "Retrieve CCGP contract and 履约验收 records for project MB20016721763953804060, especially the signed equipment schedule and delivery/SAT attachment naming serial, purchaser and installation facility; if absent, inspect 2026 public fixed-asset/audit records for the same project ID and amount." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-tongcheng-cmp-named-fab-layer", "id": "gap-tongcheng-cmp-named-fab-layer", "last_checked": "2026-07-29", "layer": "cmp_consumables", "missing_proof": [ "customer legal entity", "facility", "pad SKU", "slurry", "layer", "qualification date", "quantity", "yield effect" ], "next_action": "Retrieve customer AVL/qualification, tender, purchase or recurring-delivery records at exact pad-SKU scope.", "priority": 1, "question": "Which named 200 mm and 300 mm fabs qualify which Changzhou CMP-pad SKUs for which layers and slurries?", "record_type": "gap", "source_ids": [], "why_it_matters": "Anonymous issuer or catalogue language cannot close a legal supplier/customer, facility, capacity, qualification or yield edge.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "3f1d07f9f74c72f0c0f0ddbac835297dff7adc91869ca09309c1a7387f9354c8", "stage_ids": [ "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "cmp_consumables" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "cmp_consumables" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "cmp_consumables", "question": "Which named 200 mm and 300 mm fabs qualify which Changzhou CMP-pad SKUs for which layers and slurries?", "why_it_matters": "Anonymous issuer or catalogue language cannot close a legal supplier/customer, facility, capacity, qualification or yield edge.", "next_action": "Retrieve customer AVL/qualification, tender, purchase or recurring-delivery records at exact pad-SKU scope." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-tongcheng-material-output-yield", "id": "gap-tongcheng-material-output-yield", "last_checked": "2026-07-29", "layer": "lithography_materials", "missing_proof": [ "installed capacity", "qualified capacity", "actual output by SKU/grade", "utilization denominator", "yield" ], "next_action": "Retrieve facility permits, asset schedules and operating disclosures separating all capacity states.", "priority": 1, "question": "What installed, qualified and actual output supports Tongcheng's approved photoresist and high-purity-solvent capacity?", "record_type": "gap", "source_ids": [], "why_it_matters": "Anonymous issuer or catalogue language cannot close a legal supplier/customer, facility, capacity, qualification or yield edge.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "cece8bce7e23095f4f8ce09a1477091761d510d23752612e521fa62c44f9f1ea", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "lithography_materials" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "lithography_materials" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "lithography_materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "lithography_materials", "question": "What installed, qualified and actual output supports Tongcheng's approved photoresist and high-purity-solvent capacity?", "why_it_matters": "Anonymous issuer or catalogue language cannot close a legal supplier/customer, facility, capacity, qualification or yield edge.", "next_action": "Retrieve facility permits, asset schedules and operating disclosures separating all capacity states." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-tongcheng-photoresist-named-fab-layer", "id": "gap-tongcheng-photoresist-named-fab-layer", "last_checked": "2026-07-29", "layer": "lithography_materials", "missing_proof": [ "customer legal entity", "facility", "material SKU", "wavelength/mode", "layer", "qualification date", "batch quantity", "yield" ], "next_action": "Retrieve customer-side AVL, tender, purchase, qualification or recurring-delivery records naming both endpoints and the exact SKU/layer.", "priority": 1, "question": "Which named fabs qualify which Tongcheng/Kehua ArF, KrF and i-line photoresist SKUs at which layers?", "record_type": "gap", "source_ids": [], "why_it_matters": "Anonymous issuer or catalogue language cannot close a legal supplier/customer, facility, capacity, qualification or yield edge.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "16bbc4436c298facf1f5f96834a63e61d646c5117468a98e5e90fa50b57394ca", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "lithography_materials" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "lithography_materials" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "lithography_materials" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "lithography_materials", "question": "Which named fabs qualify which Tongcheng/Kehua ArF, KrF and i-line photoresist SKUs at which layers?", "why_it_matters": "Anonymous issuer or catalogue language cannot close a legal supplier/customer, facility, capacity, qualification or yield edge.", "next_action": "Retrieve customer-side AVL, tender, purchase, qualification or recurring-delivery records naming both endpoints and the exact SKU/layer." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-tongcheng-shanghai-resin-lines-operator", "id": "gap-tongcheng-shanghai-resin-lines-operator", "last_checked": "2026-07-29", "layer": "photoresist_precursors", "missing_proof": [ "acceptance certificate/type", "capacity by resin type", "electronic-formaldehyde line state", "installed/qualified capacity", "actual output/utilization", "equipment/precursor BOM", "customer qualification" ], "next_action": "Retrieve the Shanghai Chemical Industry Park EIA/竣工环保验收 attachments and operating records for the resin/formaldehyde project.", "priority": 1, "question": "What acceptance, installed capacity and output support the six Tongcheng Chemical photoresist-resin lines at 66 North Yinhe Road?", "record_type": "gap", "source_ids": [], "why_it_matters": "Anonymous issuer or catalogue language cannot close a legal supplier/customer, facility, capacity, qualification or yield edge.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "97560644d5f68128235e00507363c8f803eca1d702626d61c0cee9151b85a4f3", "stage_ids": [ "lithography", "critical_materials" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "lithography", "rule_id": "canonical-lithography-role", "canonical_field_matches": [ { "field": "layer", "value": "photoresist_precursors" } ] }, { "stage_id": "critical_materials", "rule_id": "canonical-material-role", "canonical_field_matches": [ { "field": "layer", "value": "photoresist_precursors" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "photoresist_precursors" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "photoresist_precursors", "question": "What acceptance, installed capacity and output support the six Tongcheng Chemical photoresist-resin lines at 66 North Yinhe Road?", "why_it_matters": "Anonymous issuer or catalogue language cannot close a legal supplier/customer, facility, capacity, qualification or yield edge.", "next_action": "Retrieve the Shanghai Chemical Industry Park EIA/竣工环保验收 attachments and operating records for the resin/formaldehyde project." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-tongfu-hbs-line-hbm-closure", "id": "gap-tongfu-hbs-line-hbm-closure", "last_checked": "2026-07-29", "layer": "conventional_hbm", "missing_proof": [ "HBM generation", "DRAM owner", "base die/PHY", "TSV/KGD", "customer/accelerator", "SAT", "yield", "shipments" ], "next_action": "Obtain dated customer or government acceptance naming the stack, line, yield and shipment state.", "priority": 1, "question": "Can the Nantong Tongfu trial line be joined to one qualified HBM stack?", "record_type": "gap", "source_ids": [], "why_it_matters": "Process adjacency, trial production and industry context cannot close a qualified commercial HBM proof chain.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "59ffc19503019ad96e9d1f599e65ab16805353aa58d6738308fa8456dd7b58bc", "stage_ids": [ "memory_manufacturer" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "memory_manufacturer", "rule_id": "canonical-memory-role", "canonical_field_matches": [ { "field": "layer", "value": "conventional_hbm" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "conventional_hbm" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "conventional_hbm", "question": "Can the Nantong Tongfu trial line be joined to one qualified HBM stack?", "why_it_matters": "Process adjacency, trial production and industry context cannot close a qualified commercial HBM proof chain.", "next_action": "Obtain dated customer or government acceptance naming the stack, line, yield and shipment state." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-util-001", "id": "gap-util-001", "last_checked": "2026-07-29", "layer": "cleanroom_and_epc", "missing_proof": [ "Issuer statutory disclosure or owner/tender-platform signed contract naming both endpoints, exact package, facility, date and state." ], "next_action": "Issuer statutory disclosure or owner/tender-platform signed contract naming both endpoints, exact package, facility, date and state.", "priority": 1, "question": "Bocheng exact named semiconductor facility receipt", "record_type": "gap", "severity": "high", "source_ids": [], "why_it_matters": "Media leads report Changxin Xinqiao process-piping work, but no directly inspectable primary contract or tender record was closed within this lane deadline.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "1882321e2e61ac34efcb16a30bc22a68812800c6f21ca43642722bc1b6d7d27d", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "cleanroom_and_epc" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "cleanroom_and_epc" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "cleanroom_and_epc", "question": "Bocheng exact named semiconductor facility receipt", "why_it_matters": "Media leads report Changxin Xinqiao process-piping work, but no directly inspectable primary contract or tender record was closed within this lane deadline.", "next_action": "Issuer statutory disclosure or owner/tender-platform signed contract naming both endpoints, exact package, facility, date and state." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-util-002", "id": "gap-util-002", "last_checked": "2026-07-29", "layer": "cleanroom_and_epc", "missing_proof": [ "Original contract, award or acceptance record naming CESE legal entity, facility owner/operator and exact semiconductor scope." ], "next_action": "Original contract, award or acceptance record naming CESE legal entity, facility owner/operator and exact semiconductor scope.", "priority": 2, "question": "CESE exact named semiconductor facility receipt", "record_type": "gap", "severity": "high", "source_ids": [], "why_it_matters": "A government bid-evaluation page listed CESE prior semiconductor project performance, but it did not close the original customer legal endpoint and contract scope for a new relationship edge.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b2b9d916e7630177f025e3d6dcbd3791a6184d7ce4aadc952f71a05e844d75a1", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "cleanroom_and_epc" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "cleanroom_and_epc" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "cleanroom_and_epc", "question": "CESE exact named semiconductor facility receipt", "why_it_matters": "A government bid-evaluation page listed CESE prior semiconductor project performance, but it did not close the original customer legal endpoint and contract scope for a new relationship edge.", "next_action": "Original contract, award or acceptance record naming CESE legal entity, facility owner/operator and exact semiconductor scope." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-util-003", "id": "gap-util-003", "last_checked": "2026-07-29", "layer": "facility_equipment", "missing_proof": [ "Customer tender, purchase, delivery, installation or acceptance record with exact model and facility." ], "next_action": "Customer tender, purchase, delivery, installation or acceptance record with exact model and facility.", "priority": 3, "question": "MayAir, PNCS, Jingyi Equipment and Hanbell named-facility receipts", "record_type": "gap", "severity": "high", "source_ids": [], "why_it_matters": "Company/filing leads name customer classes or company-level customers, but no model-plus-facility-plus-date delivery, installation or acceptance receipt was promoted.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "3f11da0df48827a1be68a5749c740ef4054109d1bd103c7c1b407207e9d46766", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "facility_equipment" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "facility_equipment" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "facility_equipment", "question": "MayAir, PNCS, Jingyi Equipment and Hanbell named-facility receipts", "why_it_matters": "Company/filing leads name customer classes or company-level customers, but no model-plus-facility-plus-date delivery, installation or acceptance receipt was promoted.", "next_action": "Customer tender, purchase, delivery, installation or acceptance record with exact model and facility." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-util-004", "id": "gap-util-004", "last_checked": "2026-07-29", "layer": "cleanroom_and_epc", "missing_proof": [ "Owner-side completion/acceptance and FMCS/utility performance test records." ], "next_action": "Owner-side completion/acceptance and FMCS/utility performance test records.", "priority": 4, "question": "Shenghui and Huakang completion receipts", "record_type": "gap", "severity": "medium", "source_ids": [], "why_it_matters": "Huakang has a named supplier-reported award; Shenghui had media leads. Neither has an as-built semiconductor-facility acceptance receipt in this lane.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "8b600917cab9d11e83647afe26ff8fdbc54d08e731a0a8126d255edef9c75479", "stage_ids": [ "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "cleanroom_and_epc" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "cleanroom_and_epc" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "cleanroom_and_epc", "question": "Shenghui and Huakang completion receipts", "why_it_matters": "Huakang has a named supplier-reported award; Shenghui had media leads. Neither has an as-built semiconductor-facility acceptance receipt in this lane.", "next_action": "Owner-side completion/acceptance and FMCS/utility performance test records." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-util-005", "id": "gap-util-005", "last_checked": "2026-07-29", "layer": "foreign_dependencies", "missing_proof": [ "Approved equipment/material schedules, component BOMs, origin certificates, service contracts and critical-spares lists." ], "next_action": "Approved equipment/material schedules, component BOMs, origin certificates, service contracts and critical-spares lists.", "priority": 5, "question": "Component-level origin and stop-risk", "record_type": "gap", "severity": "critical", "source_ids": [], "why_it_matters": "None of the six edges discloses a component-level origin record for filters, valves, pumps, MFCs, sensors, controls, software, chillers, scrubbers, piping, seals, spares or field service.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "28ed9b4598c840a77f3dcd9e48668b2c239e76c975c4a6887e3ec23dc3a2e11b", "stage_ids": [], "stage_assignment_state": "unmapped_no_rule_matched", "stage_assignment_basis": [], "canonical_classification_inputs": [ { "field": "layer", "value": "foreign_dependencies" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "Cross-border dependencies", "question": "Component-level origin and stop-risk", "why_it_matters": "None of the six edges discloses a component-level origin record for filters, valves, pumps, MFCs, sensors, controls, software, chillers, scrubbers, piping, seals, spares or field service.", "next_action": "Approved equipment/material schedules, component BOMs, origin certificates, service contracts and critical-spares lists." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-util-006", "id": "gap-util-006", "last_checked": "2026-07-29", "layer": "qualification", "missing_proof": [ "Site-acceptance protocols, utility qualification reports and recurring production/yield records." ], "next_action": "Site-acceptance protocols, utility qualification reports and recurring production/yield records.", "priority": 6, "question": "System performance and production qualification", "record_type": "gap", "severity": "critical", "source_ids": [], "why_it_matters": "No edge includes verified uptime, flow, pressure stability, particulate performance, abatement efficiency, tool availability, MTBF/MTTR, site acceptance, wafer yield effect or sustained production receipt.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "af761ba2aa37edcf93bfd23df8084f7f23f7019ee7cdcb1eedf10b9d319e3227", "stage_ids": [ "assembly_test", "qualification_volume_deployment" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "assembly_test", "rule_id": "canonical-assembly-test-role", "canonical_field_matches": [ { "field": "layer", "value": "qualification" } ] }, { "stage_id": "qualification_volume_deployment", "rule_id": "canonical-qualification-volume-or-deployment-role", "canonical_field_matches": [ { "field": "layer", "value": "qualification" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "qualification" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "qualification", "question": "System performance and production qualification", "why_it_matters": "No edge includes verified uptime, flow, pressure stability, particulate performance, abatement efficiency, tool availability, MTBF/MTTR, site acceptance, wafer yield effect or sustained production receipt.", "next_action": "Site-acceptance protocols, utility qualification reports and recurring production/yield records." } }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-xmc-separate-facility-identities", "id": "gap-xmc-separate-facility-identities", "last_checked": "2026-07-29", "layer": "foundry_facilities", "missing_proof": [ "facility names and addresses", "legal owner/operator per fab", "phase/process/capacity allocation" ], "next_action": "Retrieve XMC fab-phase EIAs, permits or land records and create separate facility rows only after identity closure.", "priority": 8, "question": "Which two separate XMC 12-inch facilities are covered by the prospectus aggregate?", "record_type": "gap", "source_ids": [], "why_it_matters": "An aggregate company statement cannot be promoted into a synthetic facility record.", "canonical_dataset": "gaps.yaml", "canonical_record_sha256": "b4e9a1a81e6c90cfa4fab2b8db1ef607a526442c48b0fb7e9272b257d9b0b939", "stage_ids": [ "logic_foundry_process", "power_cooling" ], "stage_assignment_state": "mapped_from_canonical_classification_fields", "stage_assignment_basis": [ { "stage_id": "logic_foundry_process", "rule_id": "canonical-foundry-or-fabrication-role", "canonical_field_matches": [ { "field": "layer", "value": "foundry_facilities" } ] }, { "stage_id": "power_cooling", "rule_id": "canonical-power-cooling-or-facility-role", "canonical_field_matches": [ { "field": "layer", "value": "foundry_facilities" } ] } ], "canonical_classification_inputs": [ { "field": "layer", "value": "foundry_facilities" } ], "stage_boundary": "Stage placement is a public navigation view over the displayed canonical classification fields. It is not a supplier, customer, compatibility, ownership, qualification, or geography relationship.", "evidence_source_tier": "no_source_attached", "source_refs": [], "editorial_display": { "layer": "foundry_facilities", "question": "Which two separate XMC 12-inch facilities are covered by the prospectus aggregate?", "why_it_matters": "An aggregate company statement cannot be promoted into a synthetic facility record.", "next_action": "Retrieve XMC fab-phase EIAs, permits or land records and create separate facility rows only after identity closure." } } ] }, "validation": { "status": "pass", "error_count": 0, "checks": [ "all declared canonical datasets share the manifest version and as-of date", "all canonical record IDs remain unique within and across public collections", "all public records preserve every canonical field and include a canonical-record SHA-256", "all entity, facility, product, process, equipment, component, claim, gap, and source IDs used by public records resolve", "all public source URLs use HTTPS", "every public record is either assigned through its displayed canonical classification fields or retained in the explicit-unmapped ledger", "the taxonomy contains exactly 15 ordered stages", "stage-group IDs and summary counts reconcile to the typed registry", "relationship count and IDs exactly match canonical relationships.yaml", "compatibility, integration, validation, ownership, geography, and supplier semantics remain separate", "no inferred relationship is emitted" ] } }