{ "schema_version": "touchdown.ai-chip-supply-chain.v1", "updated_at": "2026-08-01", "title": "China semiconductor capability graph with China and U.S. accelerator product-path overlays", "scope": "A source-bounded map of the canonical mainland China semiconductor company and relationship census, plus China and U.S. accelerator product families, their named design-company associations, explicitly sourced product-to-supplier edges, and explicit unknown records for every remaining product-specific supply-chain stage.", "research_status": { "status": "working_research", "authoritative": false, "fully_verified": false, "complete": false, "may_be_wrong_or_stale": true, "warning": "Working research, not a final or authoritative source of truth. This dataset is incomplete, not fully verified, and may be wrong or stale. Check each cited source and review date before relying on a company, product, supplier, readiness, capacity, or performance record." }, "evidence_boundary": "No supplier, customer, facility, qualification, capacity, yield, or volume edge is inferred from product fit.", "provenance": { "source_repository": "Touchdown-Labs", "source_directory": "data/china-semiconductor", "source_dataset_commit": "360936e25eb5e1c2fbda25f6e3f43f8131a35184", "source_dataset_commit_date": "2026-07-30T15:36:57-07:00", "source_data_worktree_dirty": true, "dataset_version": "0.2.0", "canonical_dataset_as_of": "2026-07-29", "product_overlay_as_of": "2026-08-01", "output_as_of": "2026-08-01", "dataset_as_of": "2026-07-29", "manifest_schema": "touchdown.china-semiconductor.manifest.v1", "canonical_validator_version": "1.5.0", "source_files": [ { "path": "capabilities.yaml", "sha256": "6c6727be2af68de3076449c1851325faa95323bfbcf533971131a64aed3b19e9" }, { "path": "claims.yaml", "sha256": 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"2588f18689bf830432aa7ff35681a9ea6918eed37abfb0370cab7c5bf368b31c" }, { "path": "manifest.json", "sha256": "6a8368c066237abeb016cb187c8373d8dfd704c4a0581a22b3233b72224e3f92" }, { "path": "materials.yaml", "sha256": "0957521ee51e8cd35d2602a76f4146e17ad10db3bd78d1490a8f268c14c1c0cb" }, { "path": "processes.yaml", "sha256": "f0615483d53a1b3529ade90c9f14a22c538454128afe0db5e5430258474c0088" }, { "path": "products.yaml", "sha256": "71344a574e7f5292ed11fd84d8cfa69801f97c26389e0ab7c9ad8b8a23a497df" }, { "path": "relationships.yaml", "sha256": "6f3691dbbbacd21102358376617c527ecad99c77458d9635d2a6bce70f08e210" }, { "path": "seed-universe.yaml", "sha256": "645fce6ef049aaa5a76756230edc384b8d3f883a7a69567b666f89e99b6cd6b7" } ], "canonical_entity_records_sha256": "edf953945e9a545905f90db2f6ec6e5a30d20c871d3b297f5d5ee5bfc721620c", "canonical_relationship_records_sha256": "890169c9c3c822d3bcb047b03e1838c3a0a4311f6756683a185100570050c859", "atlas_product_files": [ { "path": "research/china-ai-chip-memory-atlas/data-v2.json", "sha256": "7eb0027098292b1c430af33a2f1a72e3630f5d462e6c4123f17f65cc32af728e" }, { "path": "research/china-ai-chip-memory-atlas/us-data-v2.json", "sha256": "6772813d65ca0aeab2b953379615a94897fa46f77bcfbfea8d65137d23c9f57f" } ] }, "taxonomy": { "macro_stages": [ { "id": "design_ip_eda", "label": "Design, IP & EDA", "plain_language": "The tools, reusable designs, and verification work used to define a chip.", "order": 1 }, { "id": "chip_architecture", "label": "Chip architecture", "plain_language": "The compute design: GPU, accelerator, CPU, controller, sensor, or system-on-chip.", "order": 2 }, { "id": "front_end_fabrication", "label": "Wafer fabrication & process", "plain_language": "The fab and process steps that turn a blank wafer into working devices.", "order": 3 }, { "id": "lithography", "label": "Lithography", "plain_language": "The scanners, tracks, optics, masks, and resist used to print circuit patterns.", "order": 4 }, { "id": "deposition_etch_clean_cmp", "label": "Deposition, etch, clean & CMP", "plain_language": "The equipment that adds, removes, cleans, plates, and flattens material on a wafer.", "order": 5 }, { "id": "inspection_metrology_test", "label": "Inspection, metrology & test", "plain_language": "The tools that find defects, measure process control, and test dies and packages.", "order": 6 }, { "id": "wafers_materials_chemicals", "label": "Wafers, materials & chemicals", "plain_language": "Silicon wafers, gases, resists, targets, slurries, solvents, and other consumables.", "order": 7 }, { "id": "memory_storage", "label": "Memory & storage", "plain_language": "DRAM, HBM, NAND, modules, controllers, and storage products.", "order": 8 }, { "id": "advanced_packaging_osat", "label": "Advanced packaging & OSAT", "plain_language": "Assembly, stacking, bonding, wafer-level packaging, and package test.", "order": 9 }, { "id": "substrate_board", "label": "Substrates, boards & cards", "plain_language": "The substrate, printed circuit board, and accelerator card that connect the package.", "order": 10 }, { "id": "systems_integration", "label": "Systems & integration", "plain_language": "Servers, vehicles, phones, PCs, racks, and the companies that assemble them.", "order": 11 }, { "id": "interconnect_networking", "label": "Interconnect & networking", "plain_language": "Links, modems, optical components, and network systems that move data between chips and machines.", "order": 12 }, { "id": "power_cooling_facilities", "label": "Power, cooling & facilities", "plain_language": "Cleanrooms, utilities, exhaust, gas delivery, construction, power, and cooling around production and compute.", "order": 13 }, { "id": "software_runtime", "label": "Software & runtime", "plain_language": "Firmware, simulation, system software, and the runtime layer used to operate hardware.", "order": 14 }, { "id": "cloud_deployment_demand", "label": "Cloud, deployment & demand", "plain_language": "Cloud services, compute centers, telecom operators, and downstream users that put hardware to work.", "order": 15 }, { "id": "production_qualification", "label": "Production & qualification", "plain_language": "Manufacturing, acceptance, validation, test, shipment, and repeatable production evidence.", "order": 16 }, { "id": "other_unknown", "label": "Other or unresolved", "plain_language": "A recorded role that does not yet fit one technical stage without making an inference.", "order": 17 } ], "raw_layer_to_macro_stage": { "12 inch silicon wafers": [ "wafers_materials_chemicals" ], "12-inch specialty-process wafer fabrication": [ "front_end_fabrication" ], "3d_integration": [ "advanced_packaging_osat" ], "3d_nand_fab_project": [ "memory_storage" ], "8-inch SiC power-device wafer fabrication": [ "front_end_fabrication" ], "MEP and process service systems": [ "systems_integration", "power_cooling_facilities" ], "accelerators": [ "chip_architecture" ], "advanced packaging": [ "advanced_packaging_osat" ], "advanced packaging materials": [ "wafers_materials_chemicals", "advanced_packaging_osat" ], "advanced-packaging cleanroom and utility EPC": [ "advanced_packaging_osat", "power_cooling_facilities" ], "advanced_materials": [ "wafers_materials_chemicals" ], "advanced_packaging": [ "advanced_packaging_osat" ], "ai_accelerator": [ "chip_architecture" ], "ai_compute_infrastructure": [ "cloud_deployment_demand" ], "ai_demand": [ "cloud_deployment_demand" ], "ai_infrastructure": [ "cloud_deployment_demand" ], "ai_servers": [ "systems_integration" ], "ai_systems": [ "systems_integration" ], "alumina materials": [ "wafers_materials_chemicals" ], "analog": [ "chip_architecture" ], "analog chips": [ "chip_architecture" ], "arf photoresist": [ "lithography", "wafers_materials_chemicals" ], "asic design": [ "other_unknown" ], "assembly": [ "advanced_packaging_osat", "production_qualification" ], "automotive": [ "systems_integration" ], "automotive_chip_design": [ "design_ip_eda", "chip_architecture", "systems_integration" ], "automotive_chips": [ "chip_architecture", "systems_integration" ], "automotive_compute_platforms": [ "systems_integration" ], "automotive_manufacturing": [ "systems_integration", "production_qualification" ], "automotive_socs": [ "chip_architecture", "systems_integration" ], "automotive_software": [ "systems_integration", "software_runtime" ], "automotive_system_integration": [ "systems_integration" ], "automotive_system_manufacturing": [ "systems_integration", "production_qualification" ], "bonding_equipment": [ "advanced_packaging_osat" ], "bulk_gases": [ "wafers_materials_chemicals" ], "chip_design": [ "design_ip_eda" ], "clean_equipment": [ "deposition_etch_clean_cmp" ], "cleaners": [ "other_unknown" ], "cleaning materials": [ "wafers_materials_chemicals" ], "cleanroom": [ "power_cooling_facilities" ], "cleanroom EPC and integration": [ "power_cooling_facilities" ], "cloud_infrastructure": [ "cloud_deployment_demand" ], "cloud_services": [ "cloud_deployment_demand" ], "cmp cleaners": [ "other_unknown" ], "cmp materials": [ "deposition_etch_clean_cmp", "wafers_materials_chemicals" ], "cmp pads": [ "deposition_etch_clean_cmp", "wafers_materials_chemicals" ], "cmp slurries": [ "other_unknown" ], "cmp_equipment": [ "deposition_etch_clean_cmp" ], "cmp_materials": [ "deposition_etch_clean_cmp", "wafers_materials_chemicals" ], "cmp_pads": [ "deposition_etch_clean_cmp", "wafers_materials_chemicals" ], "compound semiconductor foundry": [ "front_end_fabrication" ], "compound_semiconductor_manufacturing": [ "front_end_fabrication", "production_qualification" ], "compute_in_memory": [ "chip_architecture", "memory_storage" ], "compute_infrastructure": [ "cloud_deployment_demand" ], "computing_system_integration": [ "systems_integration" ], "connectivity_chips": [ "chip_architecture", "interconnect_networking" ], "control chips": [ "other_unknown" ], "controllers": [ "chip_architecture" ], "cpus": [ "chip_architecture" ], "data management soc": [ "chip_architecture" ], "deposition_equipment": [ "deposition_etch_clean_cmp" ], "design_services": [ "design_ip_eda" ], "display-driver packaging": [ "advanced_packaging_osat" ], "distribution": [ "cloud_deployment_demand" ], "dram memory": [ "memory_storage" ], "dram modules": [ "memory_storage" ], "dram packaging": [ "memory_storage", "advanced_packaging_osat" ], "dram_memory": [ "memory_storage" ], "dram_test": [ "inspection_metrology_test", "memory_storage", "production_qualification" ], "eda": [ "design_ip_eda" ], "eeprom memory": [ "memory_storage" ], "electronic adhesives": [ "other_unknown" ], "electronic bulk gases": [ "wafers_materials_chemicals" ], "electronic chemicals": [ "wafers_materials_chemicals" ], "electronic materials": [ "wafers_materials_chemicals" ], "electronic specialty gases": [ "wafers_materials_chemicals" ], "electronic_gases": [ "wafers_materials_chemicals" ], "electronic_grade_formaldehyde": [ "wafers_materials_chemicals" ], "electronic_specialty_gases": [ "wafers_materials_chemicals" ], "electronics": [ "systems_integration" ], "epoxy molding compounds": [ "other_unknown" ], "equipment consumables": [ "wafers_materials_chemicals" ], "equipment_components": [ "front_end_fabrication" ], "equipment_parts": [ "front_end_fabrication" ], "etch consumables": [ "deposition_etch_clean_cmp", "wafers_materials_chemicals" ], "etch_equipment": [ "deposition_etch_clean_cmp" ], "etchants": [ "deposition_etch_clean_cmp" ], "etching fluids": [ "deposition_etch_clean_cmp" ], "etching materials": [ "deposition_etch_clean_cmp", "wafers_materials_chemicals" ], "evaporation_materials": [ "deposition_etch_clean_cmp", "wafers_materials_chemicals" ], "external storage": [ "memory_storage" ], "fab exhaust and point-of-use/process-gas exhaust systems": [ "systems_integration", "power_cooling_facilities" ], "fabless": [ "design_ip_eda" ], "fabless chip design": [ "design_ip_eda" ], "fabless_memory_design": [ "design_ip_eda", "memory_storage" ], "financial_services": [ "cloud_deployment_demand" ], "firmware": [ "software_runtime" ], "foundry": [ "front_end_fabrication" ], "gas chemical delivery": [ "wafers_materials_chemicals", "power_cooling_facilities" ], "gas chemical delivery systems": [ "wafers_materials_chemicals", "systems_integration", "power_cooling_facilities" ], "gas_chemical_delivery": [ "wafers_materials_chemicals", "power_cooling_facilities" ], "gas_services": [ "wafers_materials_chemicals" ], "glass circuit boards": [ "other_unknown" ], "glass packaging substrates": [ "advanced_packaging_osat", "substrate_board" ], "gpus": [ "chip_architecture" ], "hbm": [ "memory_storage" ], "high purity ceramic materials": [ "wafers_materials_chemicals" ], "high purity gas chemical delivery": [ "wafers_materials_chemicals", "power_cooling_facilities" ], "high purity processing systems": [ "wafers_materials_chemicals", "systems_integration" ], "high purity wet chemicals": [ "wafers_materials_chemicals" ], "high_purity_metals": [ "wafers_materials_chemicals" ], "high_purity_solvents": [ "wafers_materials_chemicals" ], "idm": [ "front_end_fabrication" ], "industrial gases": [ "other_unknown" ], "inspection": [ "inspection_metrology_test" ], "inspection equipment": [ "inspection_metrology_test" ], "ion implant semiconductor equipment": [ "front_end_fabrication" ], "krf photoresist": [ "lithography", "wafers_materials_chemicals" ], "lithography materials": [ "lithography", "wafers_materials_chemicals" ], "lithography_equipment": [ "lithography" ], "lithography_light_source": [ "lithography" ], "lithography_materials": [ "lithography", "wafers_materials_chemicals" ], "mcu": [ "chip_architecture" ], "memory": [ "memory_storage" ], "memory modules": [ "memory_storage" ], "memory packaging": [ "memory_storage", "advanced_packaging_osat" ], "memory wafer fabrication": [ "front_end_fabrication", "memory_storage" ], "memory_interfaces": [ "memory_storage" ], "memory_modules": [ "memory_storage" ], "memory_research": [ "memory_storage" ], "mems": [ "chip_architecture" ], "metalorganic_precursors": [ "wafers_materials_chemicals" ], "metrology": [ "inspection_metrology_test" ], "mixed signal chips": [ "other_unknown" ], "modems": [ "chip_architecture", "interconnect_networking" ], "nand memory": [ "memory_storage" ], "nand modules": [ "memory_storage" ], "nand packaging": [ "memory_storage", "advanced_packaging_osat" ], "nand_memory": [ "memory_storage" ], "nfc chips": [ "other_unknown" ], "non volatile memory": [ "memory_storage" ], "nor memory": [ "memory_storage" ], "optical_interconnect": [ "interconnect_networking" ], "packaging": [ "advanced_packaging_osat" ], "parent of semiconductor-fab engineering contractor": [ "other_unknown" ], "pcs": [ "systems_integration" ], "photomasks": [ "other_unknown" ], "photoresist": [ "lithography", "wafers_materials_chemicals" ], "photoresist developers": [ "lithography", "wafers_materials_chemicals" ], "photoresist materials": [ "lithography", "wafers_materials_chemicals" ], "photoresist reagents": [ "lithography", "wafers_materials_chemicals" ], "photoresist_resins": [ "lithography", "wafers_materials_chemicals" ], "plating materials": [ "deposition_etch_clean_cmp", "wafers_materials_chemicals" ], "plating_equipment": [ "deposition_etch_clean_cmp" ], "power semiconductor design": [ "chip_architecture" ], "power semiconductor idm": [ "chip_architecture", "front_end_fabrication" ], "power_semiconductors": [ "chip_architecture" ], "precision_machine_tools": [ "power_cooling_facilities" ], "production deployment evidence": [ "production_qualification" ], "production qualification": [ "production_qualification" ], "projection_optics": [ "lithography" ], "pvd copper": [ "other_unknown" ], "quartz": [ "wafers_materials_chemicals" ], "rare gases": [ "other_unknown" ], "research_or_semiconductor_lithography_buyer_unknown": [ "lithography" ], "semiconductor equipment components": [ "front_end_fabrication" ], "semiconductor materials": [ "wafers_materials_chemicals" ], "semiconductor packaging materials": [ "wafers_materials_chemicals", "advanced_packaging_osat" ], "semiconductor process equipment": [ "other_unknown" ], "semiconductor test equipment": [ "inspection_metrology_test", "production_qualification" ], "semiconductor vacuum equipment": [ "other_unknown" ], "semiconductor-fab EPC": [ "power_cooling_facilities" ], "semiconductor-fab civil construction": [ "power_cooling_facilities" ], "semiconductor-related research infrastructure": [ "power_cooling_facilities" ], "semiconductor_consumables": [ "wafers_materials_chemicals" ], "semiconductor_equipment": [ "front_end_fabrication" ], "semiconductor_group": [ "other_unknown" ], "semiconductor_investment": [ "other_unknown" ], "semiconductor_ip": [ "design_ip_eda" ], "semiconductor_materials": [ "wafers_materials_chemicals" ], "sensors": [ "chip_architecture" ], "server_cards": [ "substrate_board", "systems_integration" ], "servers": [ "systems_integration" ], "sic_power_semiconductors": [ "chip_architecture" ], "silica materials": [ "wafers_materials_chemicals" ], "silicon carbide components": [ "wafers_materials_chemicals" ], "silicon wafer materials": [ "wafers_materials_chemicals" ], "silicon_carbide_components": [ "wafers_materials_chemicals" ], "silicon_wafers": [ "wafers_materials_chemicals" ], "simulation_software": [ "software_runtime" ], "slc nand memory": [ "memory_storage" ], "smartphone_socs": [ "chip_architecture", "systems_integration" ], "smartphones": [ "systems_integration" ], "software": [ "software_runtime" ], "specialty_gases": [ "wafers_materials_chemicals" ], "specialty_memory": [ "memory_storage" ], "specialty_process": [ "front_end_fabrication" ], "sputtering_targets": [ "wafers_materials_chemicals" ], "ssd": [ "memory_storage" ], "ssd storage": [ "memory_storage" ], "storage": [ "memory_storage" ], "storage boards": [ "memory_storage" ], "storage controllers": [ "chip_architecture", "memory_storage" ], "storage products": [ "memory_storage" ], "strippers": [ "other_unknown" ], "system_integration": [ "systems_integration" ], "systems": [ "systems_integration" ], "telecom": [ "cloud_deployment_demand" ], "telecom_systems": [ "systems_integration", "interconnect_networking", "cloud_deployment_demand" ], "test": [ "inspection_metrology_test", "production_qualification" ], "thermal_equipment": [ "deposition_etch_clean_cmp" ], "through glass vias": [ "other_unknown" ], "track_equipment": [ "lithography" ], "vacuum system components": [ "other_unknown" ], "vacuum test systems": [ "inspection_metrology_test", "systems_integration", "production_qualification" ], "wafer fabrication": [ "front_end_fabrication" ], "wafer-level advanced packaging": [ "advanced_packaging_osat" ], "wafer_fabrication": [ "front_end_fabrication" ], "wafer_fabrication_equipment": [ "front_end_fabrication" ], "wafer_test": [ "inspection_metrology_test", "production_qualification" ], "wet chemicals": [ "wafers_materials_chemicals" ], "wet_chemicals": [ "wafers_materials_chemicals" ], "wet_process_equipment": [ "deposition_etch_clean_cmp" ], "yield_analysis": [ "inspection_metrology_test" ] }, "evidence_states": { "canonical": [ "CONFIRMED_INDEPENDENT", "CONFIRMED_PRIMARY", "CONTRADICTED", "CORROBORATED", "PLAUSIBLE_UNVERIFIED", "RESEARCH_MEASURED", "VENDOR_REPORTED" ], "public_display": [ "official", "independent", "corroborated", "reported", "derived", "unknown" ] }, "product_path_state_semantics": { "required_stage_status": "Coverage of a bounded technical or operating fact about the selected product.", "supplier_relationship_status": "Whether the reviewed record establishes the product-specific company or supplier relationship for that stage." }, "boundary": "Macro stages classify the source's raw layer labels. Product-fact coverage is kept separate from supplier-relationship coverage. Neither classification creates a supplier, customer, facility, product, or qualification relationship." }, "summary": { "entity_count": 217, "relationship_count": 101, "total_entity_count": 369, "total_relationship_count": 215, "atlas_product_family_count": 55, "atlas_design_company_count": 40, "atlas_product_design_relationship_count": 55, "atlas_product_supplier_count": 2, "atlas_product_supplier_relationship_count": 4, "explicit_unknown_product_path_count": 55, "required_product_path_stage_count": 15, "product_path_stage_cell_count": 825, "product_path_stage_status_counts": { "known": 55, "partial": 350, "unknown": 420, "not_applicable": 0 }, "atlas_product_families_by_country": { "China": 38, "United States": 17 }, "atlas_design_companies_by_country": { "China": 31, "United States": 9 }, "product_count": 92, "facility_count": 33, "claim_count": 388, "source_count": 291, "atlas_product_source_count": 104, "total_source_count": 395, "gap_count": 199, "explicit_unknown_item_count": 5382, "entities_by_macro_stage": { "advanced_packaging_osat": 21, "chip_architecture": 127, "cloud_deployment_demand": 15, "deposition_etch_clean_cmp": 16, "design_ip_eda": 58, "front_end_fabrication": 43, "inspection_metrology_test": 15, "interconnect_networking": 4, "lithography": 19, "memory_storage": 32, "other_unknown": 72, "power_cooling_facilities": 11, "production_qualification": 75, "software_runtime": 4, "substrate_board": 2, "systems_integration": 36, "wafers_materials_chemicals": 36 }, "relationships_by_type": { "buys": 1, "contains_gpu_manufactured_on_process_by": 1, "contracted_for": 2, "depends_on": 1, "develops": 2, "integrates": 24, "joint_venture_with": 1, "manufactured_on_process_by": 1, "operates": 2, "owns": 16, "planned_hbm4_supplier_for": 1, "product_record_design_company": 55, "reported_customer_acceptance_by": 1, "reported_selected_supplier_for": 2, "selected_supplier_for": 3, "services": 1, "strategic_cooperation_with": 1, "supplies": 34, 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"design_ip_eda", "chip_architecture" ], "unknowns": [ "canonical legal-entity crosswalk", "design-site allocation by product", "foundry and facility", "memory, package, board, and system suppliers", "qualification and shipment volume" ], "atlas_design_company_record_sha256": "7778e6fb54e8ffbca10b6c351f93a6a121721e59bcceacad3174bc4fbb778008" }, { "id": "atlas-supplier-south-korea-sk-hynix", "entity_id": "atlas-supplier-south-korea-sk-hynix", "name": "SK hynix", "kind": "product_supplier", "entity_type": "product_supplier", "entity_origin": "atlas_product_supplier", "supplier_country_lane": "South Korea", "country_of_ownership": "Unknown", "headquarters": null, "completion_state": "source_bounded_product_supplier", "last_checked": "2026-08-01", "aliases": [], "product_ids": [ "nvidia-gb300-nvl72", "nvidia-vera-rubin-nvl72" ], "product_path_stage_ids": [ "memory_manufacturer" ], "source_ids": [ "src-atlas-818f53dfd97ac373" ], "source_refs": [ { "source_id": "src-atlas-818f53dfd97ac373", "url": "https://news.skhynix.com/en/gtc-2026-ai-partnership/", "title": "SK hynix GTC 2026 NVIDIA memory disclosure", "publisher": "SK hynix GTC 2026 NVIDIA memory disclosure", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "atlas_supplier_memory_manufacturer" ], "supply_chain_layers": [ "atlas_supplier_memory_manufacturer" ], "macro_stages": [ "memory_storage" ], "unknowns": [ "exact legal-entity crosswalk unless stated by the source", "facility, production line, lot allocation, volume, and exclusivity unless stated by the source", "every unlisted supplier relationship" ], "atlas_supplier_record_sha256": "f6da5d41ae18ee3580293aae42c9e902a9f25495ef2103ecacc73749c585a53f" }, { "id": "atlas-supplier-taiwan-tsmc", "entity_id": "atlas-supplier-taiwan-tsmc", "name": "TSMC", "kind": "product_supplier", "entity_type": "product_supplier", "entity_origin": "atlas_product_supplier", "supplier_country_lane": "Taiwan", "country_of_ownership": "Unknown", "headquarters": null, "completion_state": "source_bounded_product_supplier", "last_checked": "2026-08-01", "aliases": [], "product_ids": [ "nvidia-blackwell-b200", "nvidia-gb200-nvl72" ], "product_path_stage_ids": [ "logic_foundry_process" ], "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-6499ff99cb5c9ee3" ], "source_refs": [ { "source_id": "src-atlas-24203513100c1d6d", "url": "https://nvidianews.nvidia.com/news/nvidia-blackwell-platform-arrives-to-power-a-new-era-of-computing", "title": "NVIDIA Blackwell platform announcement", "publisher": "NVIDIA Blackwell platform announcement", "primary_status": "primary" }, { "source_id": "src-atlas-6499ff99cb5c9ee3", "url": "https://www.nvidia.com/en-us/data-center/gb200-nvl72/", "title": "NVIDIA GB200 NVL72", "publisher": "NVIDIA GB200 NVL72", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "atlas_supplier_logic_foundry_process" ], "supply_chain_layers": [ "atlas_supplier_logic_foundry_process" ], "macro_stages": [ "front_end_fabrication" ], "unknowns": [ "exact legal-entity crosswalk unless stated by the source", "facility, production line, lot allocation, volume, and exclusivity unless stated by the source", "every unlisted supplier relationship" ], "atlas_supplier_record_sha256": "1d36849c6b3c3f0ad3de992ebc51cde1a57304b65e85c8f4ae4ac8cec6c1fe3b" }, { "id": "dfsx-df1000", "entity_id": "dfsx-df1000", "name": "Shanghai DFSX · DF1000", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Shanghai DFSX", "product": "DF1000", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "source_refs": [ { "source_id": "src-atlas-38ee4d2b017ca9ca", "url": "https://xenospectrum.com/en/dfsx-df1000-3d-dram-14nm/", "title": "Independent architectural assessment", "publisher": "Independent architectural assessment", "primary_status": "secondary" }, { "source_id": "src-atlas-3da7974ecc2cc7bd", "url": "https://www.dfsx.com/technology/3d-near-memory-computing", "title": "DFSX near-memory architecture", "publisher": "DFSX near-memory architecture", "primary_status": "primary" }, { "source_id": "src-atlas-b5e05a371644d162", "url": "https://www.dfsx.com/products/ai-accelerator/df1000", "title": "DFSX product page", "publisher": "DFSX product page", "primary_status": "primary" }, { "source_id": "src-atlas-f499ad50e806df9c", "url": "https://www.trendforce.cn/industry-news/semiconductors/20260714-6437.html", "title": "TrendForce China launch report", "publisher": "TrendForce China launch report", "primary_status": "secondary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "usable memory capacity", "DRAM vendor and generation", "sustained bandwidth", "card power", "die area", "stack yield", "latency", "RAS", "link topology", "software maturity", "customer qualification", "volume shipments" ], "technical_profile": { "entity_level": "datacenter_accelerator_family", "accelerator_type": "Dataflow or spatial ASIC", "role": "Datacenter training and inference accelerator", "architecture": "Software-defined spatial/dataflow accelerator with DRAM vertically integrated over logic", "process": { "node_nm": 14, "node_class": "mature-node-class", "state": "reported" }, "compute": [ { "value": 520, "unit": "TFLOPS", "precision": "BF16", "scope": "peak, dense-versus-sparse undisclosed", "state": "reported" } ], "memory": { "strategy": "3d-near-memory", "hbm_free": true, "type": "DRAM, exact generation unknown", "capacity_gb": null, "peak_bandwidth_tb_s": 6.4, "bandwidth_scope": "company peak; raw/effective/internal/sustained scope unknown", "state": "reported" }, "interconnect": { "peak_gb_s": 900, "scope": "company-stated scale-up bandwidth; direction, ports, topology and payload rate unknown", "state": "reported" }, "package": { "description": "Company describes wafer-level DRAM-logic 3D hybrid bonding and an OAM 2.0 card", "state": "reported" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "CAAP", "driver", "runtime", "operator libraries", "distributed tools" ], "software_evidence_state": "derived", "availability": { "state": "reported", "status": "Launched July 13, 2026; cards and systems shown; company claims functional validation and mass-production readiness; no public volume-shipment receipt" }, "independent_validation": "A peer-reviewed predecessor demonstrates the architectural direction, not DF1000 product specifications. No public DF1000 teardown or independent workload benchmark was found." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "summary": "Shanghai DFSX is the named company for DF1000 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Software-defined spatial/dataflow accelerator with DRAM vertically integrated over logic. Normalized compute record: 520 TFLOPS · BF16 · peak, dense-versus-sparse undisclosed", "evidence_state": "official", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 14 nm · mature-node-class · reported.", "evidence_state": "reported", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: 3d-near-memory · DRAM, exact generation unknown · 6.4 TB/s peak · company peak; raw/effective/internal/sustained scope unknown.", "evidence_state": "reported", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Company describes wafer-level DRAM-logic 3D hybrid bonding and an OAM 2.0 card.", "evidence_state": "reported", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Launched July 13, 2026; cards and systems shown; company claims functional validation and mass-production readiness; no public volume-shipment receipt.", "evidence_state": "reported", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 900 GB/s peak · company-stated scale-up bandwidth; direction, ports, topology and payload rate unknown.", "evidence_state": "reported", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CAAP · driver · runtime · operator libraries · distributed tools. A peer-reviewed predecessor demonstrates the architectural direction, not DF1000 product specifications. No public DF1000 teardown or independent workload benchmark was found.", "evidence_state": "derived", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Launched July 13, 2026; cards and systems shown; company claims functional validation and mass-production readiness; no public volume-shipment receipt.", "evidence_state": "reported", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "db0856c02abdd4836d1bb1fbe52c8025fda4fb873df2a4bd6d8668cc0646d4b9" }, { "id": "huawei-ascend-910c", "entity_id": "huawei-ascend-910c", "name": "Huawei · Ascend 910C / Atlas 900 A3", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Huawei", "product": "Ascend 910C / Atlas 900 A3", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "source_refs": [ { "source_id": "src-atlas-1fdfb869912d4d2c", "url": "https://e.huawei.com/cn/products/computing/ascend/atlas-900-a3-superpod", "title": "Huawei Atlas 900 A3", "publisher": "Huawei Atlas 900 A3", "primary_status": "primary" }, { "source_id": "src-atlas-7f6ae98d8e676324", "url": "https://www.huawei.com/cn/news/2025/9/hc-superpod-innovation", "title": "Huawei deployment statement", "publisher": "Huawei deployment statement", "primary_status": "primary" }, { "source_id": "src-atlas-ccf15b66682ce2ee", "url": "https://www.digitimes.com/news/a20251005PD200/huawei-ascend-tsmc-techinsights-samsung.html", "title": "TechInsights findings reported by DigiTimes", "publisher": "TechInsights findings reported by DigiTimes", "primary_status": "secondary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "production mix by foundry and revision", "direct per-chip compute table", "exact link topology", "measured workload efficiency", "system power per accepted task" ], "technical_profile": { "entity_level": "datacenter_accelerator_and_system_family", "accelerator_type": "NPU / tensor ASIC", "role": "Datacenter training and inference NPU", "architecture": "Tensor-centric Ascend architecture in a multi-die package", "process": { "node_nm": 7, "node_class": "advanced-constrained", "state": "independent", "note": "Sample-dependent. Teardowns found TSMC-fabricated 7 nm logic in examined units; reporting also describes SMIC N+2 revisions." }, "compute": [ { "value": 780, "unit": "TFLOPS", "precision": "BF16", "scope": "derived per chip from Huawei's 0.30 BF16 EFLOPS for 384 chips", "state": "derived" } ], "memory": { "strategy": "hbm", "hbm_free": false, "type": "HBM2E", "capacity_gb": 128, "peak_bandwidth_tb_s": 3.125, "bandwidth_scope": "derived from Huawei aggregate system figure; not a direct chip datasheet", "state": "derived" }, "interconnect": { "peak_gb_s": 270, "scope": "reported one-way internal dual-die link; Atlas 900 A3 scales through UnifiedBus/SuperPoD", "state": "reported" }, "package": { "description": "Multi-die accelerator with HBM2E; sampled component provenance varies", "state": "independent" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "CANN", "AscendCL", "MindSpore", "PyTorch adapters", "HCCL", "MindIE" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "In production and deployed in Atlas 900 A3 systems; Huawei reported more than 300 systems at over 20 customers by September 2025" }, "independent_validation": "TechInsights teardowns establish physical silicon and HBM in sampled packages. Public neutral workload-efficiency data remain limited." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "summary": "Huawei is the named company for Ascend 910C / Atlas 900 A3 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Tensor-centric Ascend architecture in a multi-die package. Normalized compute record: 780 TFLOPS · BF16 · derived per chip from Huawei's 0.30 BF16 EFLOPS for 384 chips", "evidence_state": "official", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 7 nm · advanced-constrained · independent.", "evidence_state": "independent", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM2E · 128 GB · 3.125 TB/s peak · derived from Huawei aggregate system figure; not a direct chip datasheet.", "evidence_state": "derived", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Multi-die accelerator with HBM2E; sampled component provenance varies.", "evidence_state": "independent", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_and_system_family. Availability record: In production and deployed in Atlas 900 A3 systems; Huawei reported more than 300 systems at over 20 customers by September 2025.", "evidence_state": "official", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 270 GB/s peak · reported one-way internal dual-die link; Atlas 900 A3 scales through UnifiedBus/SuperPoD.", "evidence_state": "reported", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CANN · AscendCL · MindSpore · PyTorch adapters · HCCL · MindIE. TechInsights teardowns establish physical silicon and HBM in sampled packages. Public neutral workload-efficiency data remain limited.", "evidence_state": "derived", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: In production and deployed in Atlas 900 A3 systems; Huawei reported more than 300 systems at over 20 customers by September 2025.", "evidence_state": "official", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "29e0d519e789dfb91c655848a073d3615ccf43f1bca1a6b0184b561a6e5cdff7" }, { "id": "huawei-ascend-950pr", "entity_id": "huawei-ascend-950pr", "name": "Huawei · Ascend 950PR", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Huawei", "product": "Ascend 950PR", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "source_refs": [ { "source_id": "src-atlas-451d351a4ef3e1b4", "url": "https://www.huawei.com/en/news/2025/9/hc-xu-keynote-speech", "title": "Huawei roadmap", "publisher": "Huawei roadmap", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process node", "power", "die count", "package", "memory provenance", "final capacity and bandwidth by SKU", "effective bandwidth", "customer benchmark" ], "technical_profile": { "entity_level": "datacenter_accelerator_family", "accelerator_type": "NPU / tensor ASIC", "role": "Prefill and recommendation NPU", "architecture": "Prefill-optimized Ascend accelerator with Huawei-defined HiBL memory", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": 1, "unit": "PFLOPS", "precision": "FP8", "scope": "roadmap target", "state": "official" }, { "value": 2, "unit": "PFLOPS", "precision": "FP4", "scope": "roadmap target", "state": "official" } ], "memory": { "strategy": "hbm-class", "hbm_free": false, "type": "HiBL 1.0", "capacity_gb": 128, "peak_bandwidth_tb_s": 1.6, "bandwidth_scope": "official roadmap; reported launched configurations differ", "state": "official" }, "interconnect": { "peak_gb_s": 2000, "scope": "company-claimed LingQu scale-up bandwidth", "state": "official" }, "package": { "description": "Exact die count and memory/package cross-section unknown", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "CANN", "MindIE", "HCCL", "LingQu", "CUDA migration tools" ], "software_evidence_state": "derived", "availability": { "state": "reported", "status": "Officially announced; reported in Atlas 350 configurations in 2026; independent teardown and customer benchmark not found" }, "independent_validation": "None found for final silicon specifications or end-to-end workload performance." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "summary": "Huawei is the named company for Ascend 950PR in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Prefill-optimized Ascend accelerator with Huawei-defined HiBL memory. Normalized compute record: 1 PFLOPS · FP8 · roadmap target | 2 PFLOPS · FP4 · roadmap target", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm-class · HiBL 1.0 · 128 GB · 1.6 TB/s peak · official roadmap; reported launched configurations differ.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Officially announced; reported in Atlas 350 configurations in 2026; independent teardown and customer benchmark not found.", "evidence_state": "reported", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 2000 GB/s peak · company-claimed LingQu scale-up bandwidth.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CANN · MindIE · HCCL · LingQu · CUDA migration tools. None found for final silicon specifications or end-to-end workload performance.", "evidence_state": "derived", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Officially announced; reported in Atlas 350 configurations in 2026; independent teardown and customer benchmark not found.", "evidence_state": "reported", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "8e707a9b24bd5f6051fd32c2dcda9799937985c4e22cf67df290f15153f56cdf" }, { "id": "huawei-ascend-950dt", "entity_id": "huawei-ascend-950dt", "name": "Huawei · Ascend 950DT", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Huawei", "product": "Ascend 950DT", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "source_refs": [ { "source_id": "src-atlas-451d351a4ef3e1b4", "url": "https://www.huawei.com/en/news/2025/9/hc-xu-keynote-speech", "title": "Huawei roadmap", "publisher": "Huawei roadmap", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process node", "package", "power", "silicon state", "shipment volume", "benchmark data", "final schedule" ], "technical_profile": { "entity_level": "datacenter_accelerator_family", "accelerator_type": "NPU / tensor ASIC", "role": "Decode and training NPU", "architecture": "Decode/training-optimized Ascend accelerator with higher-bandwidth HiZQ memory", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": 1, "unit": "PFLOPS", "precision": "FP8", "scope": "roadmap/system-derived", "state": "derived" }, { "value": 2, "unit": "PFLOPS", "precision": "FP4", "scope": "roadmap/system-derived", "state": "derived" } ], "memory": { "strategy": "hbm-class", "hbm_free": false, "type": "HiZQ 2.0", "capacity_gb": 144, "peak_bandwidth_tb_s": 4, "bandwidth_scope": "official roadmap target", "state": "official" }, "interconnect": { "peak_gb_s": 2000, "scope": "company-claimed LingQu scale-up bandwidth", "state": "official" }, "package": { "description": "Unknown", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "CANN", "MindIE", "HCCL", "LingQu" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "Roadmap product planned for later 2026; schedule reports vary; no independent silicon measurement found" }, "independent_validation": "None found for final silicon." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "summary": "Huawei is the named company for Ascend 950DT in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Decode/training-optimized Ascend accelerator with higher-bandwidth HiZQ memory. Normalized compute record: 1 PFLOPS · FP8 · roadmap/system-derived | 2 PFLOPS · FP4 · roadmap/system-derived", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm-class · HiZQ 2.0 · 144 GB · 4 TB/s peak · official roadmap target.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Roadmap product planned for later 2026; schedule reports vary; no independent silicon measurement found.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 2000 GB/s peak · company-claimed LingQu scale-up bandwidth.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CANN · MindIE · HCCL · LingQu. None found for final silicon.", "evidence_state": "derived", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Roadmap product planned for later 2026; schedule reports vary; no independent silicon measurement found.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "414a1815c70c17ef077ddaa78a279664e1590138db5e1e351d5293b2c9bbfc24" }, { "id": "cambricon-mlu370", "entity_id": "cambricon-mlu370", "name": "Cambricon · MLU370 family", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Cambricon", "product": "MLU370 family", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "source_refs": [ { "source_id": "src-atlas-701b99b2bea643a1", "url": "https://arxiv.org/abs/2512.09427", "title": "ODMA paper", "publisher": "ODMA paper", "primary_status": "secondary" }, { "source_id": "src-atlas-a41fccc5d11de3eb", "url": "https://developer.cambricon.com/index/document/index/classid/3.html", "title": "Cambricon documentation", "publisher": "Cambricon documentation", "primary_status": "primary" }, { "source_id": "src-atlas-d39f0fa317efd419", "url": "https://fcc.report/FCC-ID/2ARVF-MLU370-M8/5528126.pdf", "title": "FCC-hosted MLU370-M8 manual", "publisher": "FCC-hosted MLU370-M8 manual", "primary_status": "secondary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "verified process node and foundry", "package details", "complete compute table", "sustained bandwidth", "multi-card topology beyond local bridges" ], "technical_profile": { "entity_level": "datacenter_accelerator_family", "accelerator_type": "NPU / tensor ASIC", "role": "Datacenter inference and training accelerator", "architecture": "MLUv03 clusters with compute cores, memory core, and shared SRAM", "process": { "node_nm": 7, "node_class": "advanced-constrained", "state": "reported", "note": "Commonly reported; not established in the public manual used here." }, "compute": [ { "value": null, "unit": null, "precision": "FP32/TF32/FP16/BF16/INT8 supported", "scope": "authoritative rates vary by board and remain incomplete", "state": "unknown" } ], "memory": { "strategy": "lpddr", "hbm_free": true, "type": "LPDDR5", "capacity_gb": 48, "peak_bandwidth_tb_s": 0.3072, "bandwidth_scope": "MLU370-M8 manual", "state": "independent" }, "interconnect": { "peak_gb_s": 200, "scope": "aggregate bidirectional across four MLU-Link ports on M8", "state": "independent" }, "package": { "description": "PCIe board; no HBM/interposer", "state": "independent" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "Neuware", "CNRT", "CNDrv", "CNCL", "MagicMind", "BANG C/C++" ], "software_evidence_state": "derived", "availability": { "state": "independent", "status": "Long-standing production hardware with public manuals and academic workload use" }, "independent_validation": "An academic MLU370-X4 implementation measured a 27% TPS improvement from LPDDR-aware allocation. That is a memory-management result, not a cross-vendor benchmark." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "summary": "Cambricon is the named company for MLU370 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "MLUv03 clusters with compute cores, memory core, and shared SRAM. Normalized compute record: FP32/TF32/FP16/BF16/INT8 supported · authoritative rates vary by board and remain incomplete", "evidence_state": "official", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 7 nm · advanced-constrained · reported.", "evidence_state": "reported", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · LPDDR5 · 48 GB · 0.3072 TB/s peak · MLU370-M8 manual.", "evidence_state": "independent", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: PCIe board; no HBM/interposer.", "evidence_state": "independent", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Long-standing production hardware with public manuals and academic workload use.", "evidence_state": "independent", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 200 GB/s peak · aggregate bidirectional across four MLU-Link ports on M8.", "evidence_state": "independent", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Neuware · CNRT · CNDrv · CNCL · MagicMind · BANG C/C++. An academic MLU370-X4 implementation measured a 27% TPS improvement from LPDDR-aware allocation. That is a memory-management result, not a cross-vendor benchmark.", "evidence_state": "derived", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Long-standing production hardware with public manuals and academic workload use.", "evidence_state": "independent", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "0359d30955c3b00ae1718e135750ef492130038353d7f816942103df56f0d72a" }, { "id": "cambricon-mlu590-690", "entity_id": "cambricon-mlu590-690", "name": "Cambricon · MLU590 / MLU690", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Cambricon", "product": "MLU590 / MLU690", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-ffa76aceb153b772" ], "source_refs": [ { "source_id": "src-atlas-ffa76aceb153b772", "url": "https://developer.cambricon.com/", "title": "Cambricon developer documentation", "publisher": "Cambricon developer documentation", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process", "compute", "memory", "package", "interconnect bandwidth", "power", "availability", "MLU690 product state" ], "technical_profile": { "entity_level": "datacenter_accelerator_family", "accelerator_type": "NPU / tensor ASIC", "role": "Newer cloud training and inference accelerators", "architecture": "Public microarchitecture detail incomplete", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": null, "scope": "unknown", "state": "unknown" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "unknown", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "MLU590 appears in current CNCL/MLUDirect locality documentation; bandwidth unknown", "state": "official" }, "package": { "description": "Unknown", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "Neuware", "CNCL", "MLUDirect" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "MLU590 is recognized by current SDK documentation; this alone does not prove volume shipment. Reliable public MLU690 specifications were not found." }, "independent_validation": "None found." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-ffa76aceb153b772" ], "summary": "Cambricon is the named company for MLU590 / MLU690 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-ffa76aceb153b772" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Public microarchitecture detail incomplete. Normalized compute record: unknown", "evidence_state": "official", "source_ids": [ "src-atlas-ffa76aceb153b772" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: MLU590 is recognized by current SDK documentation; this alone does not prove volume shipment. Reliable public MLU690 specifications were not found..", "evidence_state": "official", "source_ids": [ "src-atlas-ffa76aceb153b772" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: MLU590 appears in current CNCL/MLUDirect locality documentation; bandwidth unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-ffa76aceb153b772" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Neuware · CNCL · MLUDirect. None found.", "evidence_state": "derived", "source_ids": [ "src-atlas-ffa76aceb153b772" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: MLU590 is recognized by current SDK documentation; this alone does not prove volume shipment. Reliable public MLU690 specifications were not found..", "evidence_state": "official", "source_ids": [ "src-atlas-ffa76aceb153b772" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "d27b283737f2773b823cacbda9d06377b56fcf2e5a72a9945b0bbc1ffb514999" }, { "id": "biren-br100", "entity_id": "biren-br100", "name": "Biren Technology · BR100 / BR104", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Biren Technology", "product": "BR100 / BR104", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "source_refs": [ { "source_id": "src-atlas-12fa162fea903cae", "url": "https://hc34.hotchips.org/assets/program/conference/day1/GPU%20HPC/HC2022.BirenTech.MikeHong.LingjieXu.v01.pdf", "title": "Biren Hot Chips presentation", "publisher": "Biren Hot Chips presentation", "primary_status": "primary" }, { "source_id": "src-atlas-c3b8ca53d537c686", "url": "https://old.chipsandcheese.com/2022/10/04/hot-chips-34-birens-br100-a-machine-learning-gpu-from-china/", "title": "Independent microarchitecture analysis", "publisher": "Independent microarchitecture analysis", "primary_status": "secondary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "current production volume", "BR104 memory and package", "post-control link rate", "independent silicon benchmarks" ], "technical_profile": { "entity_level": "datacenter_accelerator_family", "accelerator_type": "GPU / GPGPU", "role": "Datacenter GPGPU for training and inference", "architecture": "General vector processor plus 2.5D GEMM engine, C-Warp mode, large SRAM, multicast, and near-memory features", "process": { "node_nm": 7, "node_class": "advanced-constrained", "state": "official" }, "compute": [ { "value": 1, "unit": "PFLOPS", "precision": "BF16", "scope": "BR100 peak company claim", "state": "official" }, { "value": 256, "unit": "TFLOPS", "precision": "FP32", "scope": "BR100 peak company claim", "state": "official" }, { "value": 2, "unit": "POPS", "precision": "INT8", "scope": "BR100 peak company claim", "state": "official" } ], "memory": { "strategy": "hbm", "hbm_free": false, "type": "HBM2E", "capacity_gb": 64, "peak_bandwidth_tb_s": 2.3, "bandwidth_scope": "reported BR100 peak", "state": "reported" }, "interconnect": { "peak_gb_s": 448, "scope": "per BR100 OAM chip in an eight-card all-to-all topology", "state": "official" }, "package": { "description": "Two 537 mm² compute chiplets and four HBM2E stacks on TSMC CoWoS 2.5D", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "BIRENSUPA", "compiler", "runtime", "drivers", "libraries", "framework support" ], "software_evidence_state": "derived", "availability": { "state": "reported", "status": "Silicon and systems demonstrated; Q4 2022 sampling announced. Continuing volume status is unclear following the reported TSMC suspension and related trade restrictions." }, "independent_validation": "Independent architectural analysis exists; neutral current silicon benchmarks and shipment volumes remain missing." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "summary": "Biren Technology is the named company for BR100 / BR104 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "General vector processor plus 2.5D GEMM engine, C-Warp mode, large SRAM, multicast, and near-memory features. Normalized compute record: 1 PFLOPS · BF16 · BR100 peak company claim | 256 TFLOPS · FP32 · BR100 peak company claim | 2 POPS · INT8 · BR100 peak company claim", "evidence_state": "official", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 7 nm · advanced-constrained · official.", "evidence_state": "official", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM2E · 64 GB · 2.3 TB/s peak · reported BR100 peak.", "evidence_state": "reported", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Two 537 mm² compute chiplets and four HBM2E stacks on TSMC CoWoS 2.5D.", "evidence_state": "official", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Silicon and systems demonstrated; Q4 2022 sampling announced. Continuing volume status is unclear following the reported TSMC suspension and related trade restrictions..", "evidence_state": "reported", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 448 GB/s peak · per BR100 OAM chip in an eight-card all-to-all topology.", "evidence_state": "official", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: BIRENSUPA · compiler · runtime · drivers · libraries · framework support. Independent architectural analysis exists; neutral current silicon benchmarks and shipment volumes remain missing.", "evidence_state": "derived", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Silicon and systems demonstrated; Q4 2022 sampling announced. Continuing volume status is unclear following the reported TSMC suspension and related trade restrictions..", "evidence_state": "reported", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "b39b5cf9109917e2d08ec7f959d3044592ee79501bfdb5a1e4df91213560e5ab" }, { "id": "metax-c500-c550", "entity_id": "metax-c500-c550", "name": "MetaX · C500 / C550", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "MetaX", "product": "C500 / C550", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "source_refs": [ { "source_id": "src-atlas-5b18c8669d9bc4cb", "url": "https://developer.metax-tech.com/forum/t/ru-he-shi-yong-yi-bu-kao-bei-yi-da-dao-you-hua-de-xiao-guo-ni/215/", "title": "Observed C500 developer system", "publisher": "Observed C500 developer system", "primary_status": "secondary" }, { "source_id": "src-atlas-9194a22be0a5b57a", "url": "https://www.metax-tech.com/en/about/about.html", "title": "MetaX milestones", "publisher": "MetaX milestones", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "primary memory type and bandwidth", "verified node", "package", "tensor rates", "link bandwidth", "independent application benchmarks" ], "technical_profile": { "entity_level": "datacenter_accelerator_family", "accelerator_type": "GPU / GPGPU", "role": "General-purpose GPGPU for training, inference, HPC, and graphics", "architecture": "XCORE GPGPU; C500 PCIe and C550 OAM", "process": { "node_nm": 7, "node_class": "advanced-constrained", "state": "reported", "note": "Broadly reported; current official page does not name the foundry or node." }, "compute": [ { "value": 30, "unit": "TFLOPS", "precision": "FP32", "scope": "reported/observed class; authoritative table unavailable", "state": "reported" } ], "memory": { "strategy": "hbm-reported", "hbm_free": false, "type": "HBM2E reported by server vendors", "capacity_gb": 64, "peak_bandwidth_tb_s": null, "bandwidth_scope": "capacity observed with mx-smi; bandwidth unknown", "state": "independent" }, "interconnect": { "peak_gb_s": null, "scope": "C500 PCIe 4.0; C550 OAM/PCIe 5.0 reported; optical and 3D-mesh systems exist but numeric link bandwidth is unknown", "state": "reported" }, "package": { "description": "Unknown", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "MXMACA", "MACA", "mxcc", "cucc", "operator libraries", "PyTorch" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "C500 mass production and shipment since December 2023 according to MetaX; C550 is reported in deployed service" }, "independent_validation": "A public developer report shows an eight-C500 system, 64 GB per card, and a 350 W cap; a tested async-copy path underperformed its synchronous path, showing that source compatibility is not equal execution behavior." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "summary": "MetaX is the named company for C500 / C550 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "XCORE GPGPU; C500 PCIe and C550 OAM. Normalized compute record: 30 TFLOPS · FP32 · reported/observed class; authoritative table unavailable", "evidence_state": "official", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 7 nm · advanced-constrained · reported.", "evidence_state": "reported", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm-reported · HBM2E reported by server vendors · 64 GB · capacity observed with mx-smi; bandwidth unknown.", "evidence_state": "independent", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: C500 mass production and shipment since December 2023 according to MetaX; C550 is reported in deployed service.", "evidence_state": "official", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: C500 PCIe 4.0; C550 OAM/PCIe 5.0 reported; optical and 3D-mesh systems exist but numeric link bandwidth is unknown.", "evidence_state": "reported", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: MXMACA · MACA · mxcc · cucc · operator libraries · PyTorch. A public developer report shows an eight-C500 system, 64 GB per card, and a 350 W cap; a tested async-copy path underperformed its synchronous path, showing that source compatibility is not equal execution behavior.", "evidence_state": "derived", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: C500 mass production and shipment since December 2023 according to MetaX; C550 is reported in deployed service.", "evidence_state": "official", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "0213e0aa417a165667051c777032b3fc55e6666e0c087c3c5baa0000a9c2775a" }, { "id": "metax-c600", "entity_id": "metax-c600", "name": "MetaX · C600", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "MetaX", "product": "C600", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "source_refs": [ { "source_id": "src-atlas-23bb623e8fb89470", "url": "https://www.metax-tech.com/en", "title": "MetaX", "publisher": "MetaX", "primary_status": "primary" }, { "source_id": "src-atlas-9194a22be0a5b57a", "url": "https://www.metax-tech.com/en/about/about.html", "title": "MetaX milestones", "publisher": "MetaX milestones", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "final silicon specifications", "qualification", "production date", "memory", "interconnect", "package", "measured performance" ], "technical_profile": { "entity_level": "datacenter_accelerator_family", "accelerator_type": "GPU / GPGPU", "role": "Next-generation China-designed GPGPU for training, inference, and HPC", "architecture": "XCORE-class GPGPU; public final architecture incomplete", "process": { "node_nm": null, "node_class": "unknown", "state": "official", "note": "Company attributes the advanced process to China; the exact node, foundry, and facility remain unverified." }, "compute": [ { "value": null, "unit": null, "precision": null, "scope": "unknown", "state": "unknown" } ], "memory": { "strategy": "hbm-unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "144 GB appears in reseller material but is not treated as established", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "OAM and PCIe 5.0 reported; topology and bandwidth unknown", "state": "reported" }, "package": { "description": "Unknown", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "MXMACA" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "Taped out October 2024 and brought up July 2025 according to MetaX; product listed, but public volume-shipment evidence not found" }, "independent_validation": "None found." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "summary": "MetaX is the named company for C600 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "XCORE-class GPGPU; public final architecture incomplete. Normalized compute record: unknown", "evidence_state": "official", "source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Taped out October 2024 and brought up July 2025 according to MetaX; product listed, but public volume-shipment evidence not found.", "evidence_state": "official", "source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: OAM and PCIe 5.0 reported; topology and bandwidth unknown.", "evidence_state": "reported", "source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: MXMACA. None found.", "evidence_state": "derived", "source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Taped out October 2024 and brought up July 2025 according to MetaX; product listed, but public volume-shipment evidence not found.", "evidence_state": "official", "source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "9eebc9c8f7d0e58aedb273abea8272aa27d844b895fc2a544b2b5a44005aac78" }, { "id": "enflame-t20-t21", "entity_id": "enflame-t20-t21", "name": "Enflame · T20 / T21", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Enflame", "product": "T20 / T21", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "source_refs": [ { "source_id": "src-atlas-2aa6cb3e29858d4e", "url": "https://www.servethehome.com/enflame-dtu-1-0-ai-compute-chip-at-hot-chips-33/", "title": "ServeTheHome analysis", "publisher": "ServeTheHome analysis", "primary_status": "secondary" }, { "source_id": "src-atlas-dbf1c379241d20f7", "url": "https://hc33.hotchips.org/assets/program/conference/day2/Enflame_Final%20Deck.pdf", "title": "Enflame Hot Chips presentation", "publisher": "Enflame Hot Chips presentation", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "authoritative memory bandwidth", "package", "T20 versus T21 mapping", "production volume", "third-party workload performance" ], "technical_profile": { "entity_level": "datacenter_accelerator_family", "accelerator_type": "NPU / tensor ASIC", "role": "Datacenter training and inference accelerators", "architecture": "VLIW-style GCU cores with tensor/vector units, sparsity execution, and GCU-LARE interconnect", "process": { "node_nm": 12, "node_class": "mature-node-class", "state": "independent" }, "compute": [ { "value": 134.4, "unit": "TFLOPS", "precision": "FP16/BF16/TF32", "scope": "T20 company-era peak; sparsity convention requires confirmation", "state": "reported" }, { "value": 268.8, "unit": "TOPS", "precision": "INT8", "scope": "T20 company-era peak", "state": "reported" } ], "memory": { "strategy": "hbm", "hbm_free": false, "type": "HBM2E", "capacity_gb": 32, "peak_bandwidth_tb_s": null, "bandwidth_scope": "public figures conflict between about 0.819 and 1.6 TB/s", "state": "unknown" }, "interconnect": { "peak_gb_s": 300, "scope": "company-claimed GCU-LARE; direction and payload scope require confirmation", "state": "official" }, "package": { "description": "PCIe/OAM products; HBM package details unknown", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "TopsRider", "TopsPlatform", "PyTorch", "TensorFlow", "ONNX" ], "software_evidence_state": "derived", "availability": { "state": "reported", "status": "Commercial hardware used in clusters; no current teardown found" }, "independent_validation": "Hot Chips architecture material and independent architectural reviews exist; current neutral workload data remain limited." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "summary": "Enflame is the named company for T20 / T21 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "VLIW-style GCU cores with tensor/vector units, sparsity execution, and GCU-LARE interconnect. Normalized compute record: 134.4 TFLOPS · FP16/BF16/TF32 · T20 company-era peak; sparsity convention requires confirmation | 268.8 TOPS · INT8 · T20 company-era peak", "evidence_state": "official", "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 12 nm · mature-node-class · independent.", "evidence_state": "independent", "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Commercial hardware used in clusters; no current teardown found.", "evidence_state": "reported", "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 300 GB/s peak · company-claimed GCU-LARE; direction and payload scope require confirmation.", "evidence_state": "official", "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: TopsRider · TopsPlatform · PyTorch · TensorFlow · ONNX. Hot Chips architecture material and independent architectural reviews exist; current neutral workload data remain limited.", "evidence_state": "derived", "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Commercial hardware used in clusters; no current teardown found.", "evidence_state": "reported", "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "c55f2ce72586bc991fc7353c3d82d3ce8fb4bdfa20911e2c591fc0a2988a7c68" }, { "id": "enflame-s60", "entity_id": "enflame-s60", "name": "Enflame · S60", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Enflame", "product": "S60", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-295ba1b0e91682e2" ], "source_refs": [ { "source_id": "src-atlas-295ba1b0e91682e2", "url": "https://github.com/EnflameTechnology/candle-gcu", "title": "Enflame Candle-GCU", "publisher": "Enflame Candle-GCU", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process", "compute", "memory type and bandwidth", "interconnect", "package", "power", "independent reproduction" ], "technical_profile": { "entity_level": "datacenter_accelerator_family", "accelerator_type": "NPU / tensor ASIC", "role": "Later-generation inference and training card", "architecture": "GCU accelerator with a public Candle backend", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": null, "scope": "unknown", "state": "unknown" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": 48, "peak_bandwidth_tb_s": null, "bandwidth_scope": "capacity shown by company examples; type and bandwidth unknown", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "unknown", "state": "unknown" }, "package": { "description": "Unknown", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "TopsPlatform", "Ubridge", "UHHI", "Candle-GCU" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "Company repository demonstrates working S60 hardware; public production volume and qualification remain unknown" }, "independent_validation": "Company-generated LLM examples exist; independent reproduction was not found." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-295ba1b0e91682e2" ], "summary": "Enflame is the named company for S60 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-295ba1b0e91682e2" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "GCU accelerator with a public Candle backend. Normalized compute record: unknown", "evidence_state": "official", "source_ids": [ "src-atlas-295ba1b0e91682e2" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: unknown · 48 GB · capacity shown by company examples; type and bandwidth unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-295ba1b0e91682e2" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Company repository demonstrates working S60 hardware; public production volume and qualification remain unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-295ba1b0e91682e2" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: TopsPlatform · Ubridge · UHHI · Candle-GCU. Company-generated LLM examples exist; independent reproduction was not found.", "evidence_state": "derived", "source_ids": [ "src-atlas-295ba1b0e91682e2" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Company repository demonstrates working S60 hardware; public production volume and qualification remain unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-295ba1b0e91682e2" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "736acb51949d8827bea7b2f7030f5507b285f43e0b2563bd9a4268e72cc9406d" }, { "id": "moore-threads-s4000", "entity_id": "moore-threads-s4000", "name": "Moore Threads · MTT S4000", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Moore Threads", "product": "MTT S4000", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "source_refs": [ { "source_id": "src-atlas-413cf3d124dfa4c6", "url": "https://docs.mthreads.com/s4000/s4000-doc-online/product_specifications/", "title": "Official specification", "publisher": "Official specification", "primary_status": "primary" }, { "source_id": "src-atlas-45b711a51482ed71", "url": "https://en.mthreads.com/product/S4000", "title": "Moore Threads product page", "publisher": "Moore Threads product page", "primary_status": "primary" }, { "source_id": "src-atlas-636b447eec00fe6e", "url": "https://blog.mthreads.com/blog/GEMM/2026-04-14-GEMM01/", "title": "Official GEMM engineering work", "publisher": "Official GEMM engineering work", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process node", "memory type", "package detail", "exact MTLink topology", "sustained application efficiency", "neutral benchmarks" ], "technical_profile": { "entity_level": "datacenter_accelerator_card", "accelerator_type": "GPU / GPGPU", "role": "Datacenter GPU for AI, HPC, graphics, and media", "architecture": "Third-generation MUSA GPU with 8,192 vector cores and 128 tensor cores", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": 25, "unit": "TFLOPS", "precision": "FP32", "scope": "official dense peak", "state": "official" }, { "value": 100, "unit": "TFLOPS", "precision": "FP16 tensor", "scope": "official peak", "state": "official" }, { "value": 200, "unit": "TOPS", "precision": "INT8", "scope": "official peak", "state": "official" } ], "memory": { "strategy": "hbm-not-evidenced", "hbm_free": null, "type": "undisclosed conventional graphics memory", "capacity_gb": 48, "peak_bandwidth_tb_s": 0.768, "bandwidth_scope": "official peak", "state": "official" }, "interconnect": { "peak_gb_s": 240, "scope": "MTLink I/O/interface bandwidth; aggregate/directional scope and topology unclear", "state": "official" }, "package": { "description": "PCIe dual-slot board; no public HBM packaging evidence", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "MUSA", "MUSIFY", "driver", "runtime", "math libraries", "operator libraries", "communication libraries" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "Shipping product with public manuals and kernel-development work" }, "independent_validation": "No neutral full-system benchmark or teardown found." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "summary": "Moore Threads is the named company for MTT S4000 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Third-generation MUSA GPU with 8,192 vector cores and 128 tensor cores. Normalized compute record: 25 TFLOPS · FP32 · official dense peak | 100 TFLOPS · FP16 tensor · official peak | 200 TOPS · INT8 · official peak", "evidence_state": "official", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm-not-evidenced · undisclosed conventional graphics memory · 48 GB · 0.768 TB/s peak · official peak.", "evidence_state": "official", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: PCIe dual-slot board; no public HBM packaging evidence.", "evidence_state": "official", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_card. Availability record: Shipping product with public manuals and kernel-development work.", "evidence_state": "official", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 240 GB/s peak · MTLink I/O/interface bandwidth; aggregate/directional scope and topology unclear.", "evidence_state": "official", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: MUSA · MUSIFY · driver · runtime · math libraries · operator libraries · communication libraries. No neutral full-system benchmark or teardown found.", "evidence_state": "derived", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Shipping product with public manuals and kernel-development work.", "evidence_state": "official", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "4d2f8ef578e6a99fab2284ccb42771cd3ab3342e1ec13d80fd481bd4e5989bcd" }, { "id": "iluvatar-bi-v150", "entity_id": "iluvatar-bi-v150", "name": "Iluvatar CoreX · Tiangai 150 / BI-V150", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Iluvatar CoreX", "product": "Tiangai 150 / BI-V150", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-49480cf28f17187d" ], "source_refs": [ { "source_id": "src-atlas-49480cf28f17187d", "url": "https://project-hami.io/docs/next/userguide/iluvatar-device/enable-iluvatar-gpu-sharing", "title": "HAMi device support", "publisher": "HAMi device support", "primary_status": "secondary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "reliable memory bandwidth", "foundry and node verification", "package teardown", "production volume", "neutral benchmark" ], "technical_profile": { "entity_level": "datacenter_accelerator_card", "accelerator_type": "GPU / GPGPU", "role": "Datacenter GPGPU for training, inference, and HPC", "architecture": "Second-generation general-purpose GPU", "process": { "node_nm": 7, "node_class": "advanced-constrained", "state": "reported" }, "compute": [ { "value": 48, "unit": "TFLOPS", "precision": "FP32", "scope": "reported peak", "state": "reported" }, { "value": 192, "unit": "TFLOPS", "precision": "FP16/BF16", "scope": "reported peak", "state": "reported" } ], "memory": { "strategy": "hbm", "hbm_free": false, "type": "HBM2E", "capacity_gb": 64, "peak_bandwidth_tb_s": null, "bandwidth_scope": "public figures conflict materially; left unknown", "state": "unknown" }, "interconnect": { "peak_gb_s": 64, "scope": "manual-copy shared bidirectional value; other reported values conflict", "state": "reported" }, "package": { "description": "2.5D CoWoS stated in a public manual copy", "state": "reported" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "IXUCA", "CoreX SDK", "framework compatibility", "virtualization", "vGPU" ], "software_evidence_state": "derived", "availability": { "state": "independent", "status": "Commercial card supported by current HAMi device sharing and heterogeneous-cluster work" }, "independent_validation": "No teardown or credible neutral accelerator benchmark found." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-49480cf28f17187d" ], "summary": "Iluvatar CoreX is the named company for Tiangai 150 / BI-V150 in the normalized product record.", "evidence_state": "independent", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Second-generation general-purpose GPU. Normalized compute record: 48 TFLOPS · FP32 · reported peak | 192 TFLOPS · FP16/BF16 · reported peak", "evidence_state": "independent", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 7 nm · advanced-constrained · reported.", "evidence_state": "reported", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: 2.5D CoWoS stated in a public manual copy.", "evidence_state": "reported", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_card. Availability record: Commercial card supported by current HAMi device sharing and heterogeneous-cluster work.", "evidence_state": "independent", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 64 GB/s peak · manual-copy shared bidirectional value; other reported values conflict.", "evidence_state": "reported", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: IXUCA · CoreX SDK · framework compatibility · virtualization · vGPU. No teardown or credible neutral accelerator benchmark found.", "evidence_state": "derived", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Commercial card supported by current HAMi device sharing and heterogeneous-cluster work.", "evidence_state": "independent", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "58d63968b2ba9d81c7328fb8de45697891cd449b1aee493f3d8abfb3c4062b65" }, { "id": "kunlunxin-p800", "entity_id": "kunlunxin-p800", "name": "Kunlunxin / Baidu · P800", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Kunlunxin / Baidu", "product": "P800", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-09497d62f3e4abd2", "src-atlas-8d89c26d9a18ec84", "src-atlas-9ae9e04eb1ae03f7" ], "source_refs": [ { "source_id": "src-atlas-09497d62f3e4abd2", "url": "https://www.kunlunxin.com/news/4720.html", "title": "Kunlunxin architecture statement", "publisher": "Kunlunxin architecture statement", "primary_status": "primary" }, { "source_id": "src-atlas-8d89c26d9a18ec84", "url": "https://www.kunlunxin.com/news/4471.html", "title": "Kunlunxin qualification and deployment", "publisher": "Kunlunxin qualification and deployment", "primary_status": "primary" }, { "source_id": "src-atlas-9ae9e04eb1ae03f7", "url": "https://www.techinsights.com/blog/baidu-kunlunxin-p800-ai-accelerator-processor-floorplan-analysis", "title": "TechInsights floorplan analysis", "publisher": "TechInsights floorplan analysis", "primary_status": "secondary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "authoritative compute table", "process", "memory", "interconnect", "package", "power", "accessible teardown details" ], "technical_profile": { "entity_level": "datacenter_accelerator_family", "accelerator_type": "NPU / tensor ASIC", "role": "Datacenter training and inference XPU", "architecture": "Third-generation XPU-P optimized for MoE, MLA, and 8-bit inference", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown", "note": "Public reports conflict between 5 nm and 7 nm." }, "compute": [ { "value": null, "unit": null, "precision": null, "scope": "public figures conflict; no authoritative datasheet found", "state": "unknown" } ], "memory": { "strategy": "hbm-reported", "hbm_free": false, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "HBM2E/64 GB is widely reported but not established by the primary pages used", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "Eight-card systems and large clusters operate; numeric chip-link data remain unverified", "state": "unknown" }, "package": { "description": "Unknown", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "XPU stack", "PaddlePaddle", "PyTorch build", "KLX3 Triton", "vllm-kunlun", "xtorch_ops" ], "software_evidence_state": "derived", "availability": { "state": "independent", "status": "Eight-card system passed a named CAICT DeepSeek adaptation test; large deployments are company-reported" }, "independent_validation": "CAICT adaptation artifact and a TechInsights floorplan analysis exist; accessible detailed silicon measurements remain incomplete." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-09497d62f3e4abd2", "src-atlas-8d89c26d9a18ec84", "src-atlas-9ae9e04eb1ae03f7" ], "summary": "Kunlunxin / Baidu is the named company for P800 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-09497d62f3e4abd2", "src-atlas-8d89c26d9a18ec84", "src-atlas-9ae9e04eb1ae03f7" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Third-generation XPU-P optimized for MoE, MLA, and 8-bit inference. Normalized compute record: public figures conflict; no authoritative datasheet found", "evidence_state": "official", "source_ids": [ "src-atlas-09497d62f3e4abd2", "src-atlas-8d89c26d9a18ec84", "src-atlas-9ae9e04eb1ae03f7" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Eight-card system passed a named CAICT DeepSeek adaptation test; large deployments are company-reported.", "evidence_state": "independent", "source_ids": [ "src-atlas-09497d62f3e4abd2", "src-atlas-8d89c26d9a18ec84", "src-atlas-9ae9e04eb1ae03f7" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: XPU stack · PaddlePaddle · PyTorch build · KLX3 Triton · vllm-kunlun · xtorch_ops. CAICT adaptation artifact and a TechInsights floorplan analysis exist; accessible detailed silicon measurements remain incomplete.", "evidence_state": "derived", "source_ids": [ "src-atlas-09497d62f3e4abd2", "src-atlas-8d89c26d9a18ec84", "src-atlas-9ae9e04eb1ae03f7" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Eight-card system passed a named CAICT DeepSeek adaptation test; large deployments are company-reported.", "evidence_state": "independent", "source_ids": [ "src-atlas-09497d62f3e4abd2", "src-atlas-8d89c26d9a18ec84", "src-atlas-9ae9e04eb1ae03f7" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "92434f6589cdff2626a7b3ab19753ac99d8ee70bb55e27e74af3d24ccf076e18" }, { "id": "horizon-journey-6", "entity_id": "horizon-journey-6", "name": "Horizon Robotics · Journey 6 family", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Horizon Robotics", "product": "Journey 6 family", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "source_refs": [ { "source_id": "src-atlas-5f169f8d23f5bc8b", "url": "https://developer.horizon.auto/blog/13119", "title": "Horizon toolchain guide", "publisher": "Horizon toolchain guide", "primary_status": "primary" }, { "source_id": "src-atlas-6286a572960cb96f", "url": "https://www.reverse-costing.com/teardowns/horizon-robotics-journey-6-j6e-soc-module/", "title": "J6E module teardown listing", "publisher": "J6E module teardown listing", "primary_status": "secondary" }, { "source_id": "src-atlas-f41e75a6d3a6a02c", "url": "https://en.horizon.auto/solutions/horizon-journey", "title": "Horizon Journey 6", "publisher": "Horizon Journey 6", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "variant memory capacity", "package and power by variant", "dense versus sparse rates", "public teardown measurements" ], "technical_profile": { "entity_level": "automotive_ai_soc_family", "accelerator_type": "Integrated automotive AI accelerator", "role": "Automotive ADAS and NOA SoC", "architecture": "BPU Nash with integrated CPU, GPU, MCU, ISP, and safety islands", "process": { "node_nm": 7, "node_class": "advanced-constrained", "state": "reported" }, "compute": [ { "value": 560, "unit": "effective TOPS", "precision": "family maximum", "scope": "official with one-half sparsity and TPP under 4,800; not dense datacenter BF16", "state": "official" } ], "memory": { "strategy": "lpddr", "hbm_free": true, "type": "LPDDR5X", "capacity_gb": null, "peak_bandwidth_tb_s": 0.204, "bandwidth_scope": "reported J6P 192-bit LPDDR5X-8533; capacity chosen by module/OEM", "state": "reported" }, "interconnect": { "peak_gb_s": null, "scope": "No datacenter-style accelerator scale-up link disclosed", "state": "unknown" }, "package": { "description": "Integrated automotive SoC/module; no HBM", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "OpenExplorer", "horizon_tc_ui", "HMCT", "HBDK4", "runtime", "model zoo" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "Family launched in 2024; Journey 6 products are in vehicle production programs" }, "independent_validation": "A commercial J6E module teardown exists, but detailed results are paywalled. Production vehicle evidence exists." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "summary": "Horizon Robotics is the named company for Journey 6 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "BPU Nash with integrated CPU, GPU, MCU, ISP, and safety islands. Normalized compute record: 560 effective TOPS · family maximum · official with one-half sparsity and TPP under 4,800; not dense datacenter BF16", "evidence_state": "official", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 7 nm · advanced-constrained · reported.", "evidence_state": "reported", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · LPDDR5X · 0.204 TB/s peak · reported J6P 192-bit LPDDR5X-8533; capacity chosen by module/OEM.", "evidence_state": "reported", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Integrated automotive SoC/module; no HBM.", "evidence_state": "official", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: automotive_ai_soc_family. Availability record: Family launched in 2024; Journey 6 products are in vehicle production programs.", "evidence_state": "official", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: OpenExplorer · horizon_tc_ui · HMCT · HBDK4 · runtime · model zoo. A commercial J6E module teardown exists, but detailed results are paywalled. Production vehicle evidence exists.", "evidence_state": "derived", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Family launched in 2024; Journey 6 products are in vehicle production programs.", "evidence_state": "official", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "31c9a1e3c0c57908a11f61a1d0b0ca2d887da1f681619cea18328423c2bce71a" }, { "id": "alibaba-t-head-hanguang-800", "entity_id": "alibaba-t-head-hanguang-800", "name": "Alibaba / T-Head · Hanguang 800", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Alibaba / T-Head", "product": "Hanguang 800", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-2362ce7652927c41", "src-atlas-7ba385a60b7a4962", "src-atlas-d3da566ac27187d4" ], "source_refs": [ { "source_id": "src-atlas-2362ce7652927c41", "url": "https://www.alibabagroup.com/en-US/document-1491124270925873152", "title": "Alibaba account of Hanguang deployment", "publisher": "Alibaba account of Hanguang deployment", "primary_status": "primary" }, { "source_id": "src-atlas-7ba385a60b7a4962", "url": "https://www.t-head.cn/product/npu", "title": "T-Head Hanguang NPU product page", "publisher": "T-Head Hanguang NPU product page", "primary_status": "primary" }, { "source_id": "src-atlas-d3da566ac27187d4", "url": "https://www.alibabagroup.com/en-US/document-1491206538574954496", "title": "Alibaba announcement of Hanguang 800", "publisher": "Alibaba announcement of Hanguang 800", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process node and foundry", "memory type, capacity, and bandwidth", "package and system topology", "power", "external shipments", "current deployment scale", "customer qualification", "country-of-origin share" ], "technical_profile": { "entity_level": "internal_cloud_accelerator", "accelerator_type": "NPU / tensor ASIC", "role": "Machine-learning inference accelerator used inside Alibaba services", "architecture": "T-Head neural processing unit for search, translation, recommendation, advertising, and customer-service inference", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": null, "scope": "No normalized like-for-like compute rate in the reviewed primary record", "state": "unknown" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "Memory technology, capacity, topology, and bandwidth are not stated in the reviewed primary sources", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "Unknown", "state": "unknown" }, "package": { "description": "Package and deployable hardware boundary not stated", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "HGAI model conversion and compilation path", "integration path for mainstream deep-learning inference frameworks" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Alibaba said on September 25, 2019 that Hanguang 800 was used internally, and later said it was deployed in Alibaba Cloud data centers; current merchant availability and deployment scale are not established" }, "independent_validation": "No independent product teardown, workload reproduction, current shipment receipt, or production-volume record is normalized here." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-2362ce7652927c41", "src-atlas-7ba385a60b7a4962", "src-atlas-d3da566ac27187d4" ], "summary": "Alibaba / T-Head is the named company for Hanguang 800 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-2362ce7652927c41", "src-atlas-7ba385a60b7a4962", "src-atlas-d3da566ac27187d4" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "T-Head neural processing unit for search, translation, recommendation, advertising, and customer-service inference. Normalized compute record: No normalized like-for-like compute rate in the reviewed primary record", "evidence_state": "official", "source_ids": [ "src-atlas-2362ce7652927c41", "src-atlas-7ba385a60b7a4962", "src-atlas-d3da566ac27187d4" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: internal_cloud_accelerator. Availability record: Alibaba said on September 25, 2019 that Hanguang 800 was used internally, and later said it was deployed in Alibaba Cloud data centers; current merchant availability and deployment scale are not established.", "evidence_state": "official", "source_ids": [ "src-atlas-2362ce7652927c41", "src-atlas-7ba385a60b7a4962", "src-atlas-d3da566ac27187d4" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: HGAI model conversion and compilation path · integration path for mainstream deep-learning inference frameworks. No independent product teardown, workload reproduction, current shipment receipt, or production-volume record is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-2362ce7652927c41", "src-atlas-7ba385a60b7a4962", "src-atlas-d3da566ac27187d4" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Alibaba said on September 25, 2019 that Hanguang 800 was used internally, and later said it was deployed in Alibaba Cloud data centers; current merchant availability and deployment scale are not established.", "evidence_state": "official", "source_ids": [ "src-atlas-2362ce7652927c41", "src-atlas-7ba385a60b7a4962", "src-atlas-d3da566ac27187d4" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "d1cea4b157c7deed38634a997f73080ac71b552867036c882395a57cac522005" }, { "id": "tencent-zixiao-c100", "entity_id": "tencent-zixiao-c100", "name": "Tencent · Zixiao C100", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Tencent", "product": "Zixiao C100", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "source_refs": [ { "source_id": "src-atlas-001c9b5d13605335", "url": "https://cloud.tencent.com/document/product/560/63395", "title": "Tencent Cloud PTX1 Zixiao C100 specifications", "publisher": "Tencent Cloud PTX1 Zixiao C100 specifications", "primary_status": "primary" }, { "source_id": "src-atlas-bbcaab1123ddced2", "url": "https://static.www.tencent.com/attachments/ssv/2021/TencentSSVReport2021.pdf", "title": "Tencent sustainability report describing Zixiao", "publisher": "Tencent sustainability report describing Zixiao", "primary_status": "primary" }, { "source_id": "src-atlas-cf230d086080b8e8", "url": "https://cloud.tencent.com/document/product/560/19700", "title": "Tencent Cloud PTX1 instance overview", "publisher": "Tencent Cloud PTX1 instance overview", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process node and foundry", "memory technology and bandwidth", "die and package", "card power", "interconnect topology", "standalone card sales", "current cloud capacity", "customer qualification", "country-of-origin share" ], "technical_profile": { "entity_level": "cloud_accelerator_card", "accelerator_type": "NPU / tensor ASIC", "role": "Tencent Cloud AI inference accelerator used in PTX1 instances", "architecture": "Tencent Zixiao accelerator for computer vision, optical character recognition, natural-language processing, image, text, and speech inference", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": 120, "unit": "TFLOPS", "precision": "FP16", "scope": "Tencent Cloud PTX1 instance specification for one Zixiao C100 device; sustained application performance is not stated", "state": "official" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": 16, "peak_bandwidth_tb_s": null, "bandwidth_scope": "Tencent lists 16 GB of device memory; memory technology, placement, supplier, and bandwidth are not stated", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Unknown", "state": "unknown" }, "package": { "description": "C100 accelerator card inside Tencent Cloud PTX1 instances; die and package construction unknown", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "Tencent Cloud AI inference environment" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Tencent Cloud records PTX1 as launched in December 2022; this proves a named cloud-instance offering, not standalone card shipments or current volume" }, "independent_validation": "No independent chip benchmark, teardown, customer qualification record, or shipment-volume receipt is normalized here." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "summary": "Tencent is the named company for Zixiao C100 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Tencent Zixiao accelerator for computer vision, optical character recognition, natural-language processing, image, text, and speech inference. Normalized compute record: 120 TFLOPS · FP16 · Tencent Cloud PTX1 instance specification for one Zixiao C100 device; sustained application performance is not stated", "evidence_state": "official", "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: unknown · 16 GB · Tencent lists 16 GB of device memory; memory technology, placement, supplier, and bandwidth are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: C100 accelerator card inside Tencent Cloud PTX1 instances; die and package construction unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: cloud_accelerator_card. Availability record: Tencent Cloud records PTX1 as launched in December 2022; this proves a named cloud-instance offering, not standalone card shipments or current volume.", "evidence_state": "official", "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Tencent Cloud AI inference environment. No independent chip benchmark, teardown, customer qualification record, or shipment-volume receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Tencent Cloud records PTX1 as launched in December 2022; this proves a named cloud-instance offering, not standalone card shipments or current volume.", "evidence_state": "official", "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "ab49d89c9a1ec2d01141facdca606e4e4388f973711d21873f0d0d378af7bd0a" }, { "id": "hygon-dcu-8000", "entity_id": "hygon-dcu-8000", "name": "Hygon · DCU 8000 series", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Hygon", "product": "DCU 8000 series", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-2c78c73fc084cb04", "src-atlas-2cf813ccb61b0cde", "src-atlas-7d34f38ba91064db", "src-atlas-9b3cee9443d11a56" ], "source_refs": [ { "source_id": "src-atlas-2c78c73fc084cb04", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202203/001043_20220304_7DDI.pdf", "title": "Hygon March 2022 exchange response", "publisher": "Hygon March 2022 exchange response", "primary_status": "primary" }, { "source_id": "src-atlas-2cf813ccb61b0cde", "url": "https://star.sse.com.cn/disclosure/listedinfo/announcement/c/new/2025-03-01/688041_20250301_608W.pdf", "title": "Hygon 2024 annual report", "publisher": "Hygon 2024 annual report", "primary_status": "primary" }, { "source_id": "src-atlas-7d34f38ba91064db", "url": "https://star.sse.com.cn/disclosure/listedinfo/announcement/c/new/2025-08-06/688041_20250806_XTRO.pdf", "title": "Hygon 2025 half-year report", "publisher": "Hygon 2025 half-year report", "primary_status": "primary" }, { "source_id": "src-atlas-9b3cee9443d11a56", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202206/001043_20220622_HU33.pdf", "title": "Hygon June 2022 exchange response", "publisher": "Hygon June 2022 exchange response", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "current generation mapping", "process node and foundry", "memory type, capacity, and bandwidth", "package and interconnect", "power", "named customers", "current shipment volume", "qualification and yield", "country-of-origin share" ], "technical_profile": { "entity_level": "accelerator_family", "accelerator_type": "GPU / GPGPU", "role": "Data-center accelerator for scientific computing, AI training, inference, and large-model workloads", "architecture": "Hygon describes DCU as a GPGPU using a general parallel-computing architecture", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": "double, single, half precision, and integer formats supported", "scope": "The reviewed filing states supported format classes but does not provide a normalized generation-specific peak rate", "state": "official" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "Generation-specific memory technology, capacity, and bandwidth are not stated in the reviewed filings", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "Unknown", "state": "unknown" }, "package": { "description": "Server-cluster or data-center accelerator boundary stated; card and package construction unknown", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "DTK software stack", "self-developed operators", "third-party components" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Hygon filings say Deep Computing No. 1 completed product validation and entered commercial application in 2021, and had begun scaled sales by June 2022; the current 8000-series generation, volumes, and customer scope remain unnormalized" }, "independent_validation": "Exchange filings establish company statements and historical commercialization wording. They do not establish independent workload results, named customers, current shipment counts, or production yield." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-2c78c73fc084cb04", "src-atlas-2cf813ccb61b0cde", "src-atlas-7d34f38ba91064db", "src-atlas-9b3cee9443d11a56" ], "summary": "Hygon is the named company for DCU 8000 series in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-2c78c73fc084cb04", "src-atlas-2cf813ccb61b0cde", "src-atlas-7d34f38ba91064db", "src-atlas-9b3cee9443d11a56" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Hygon describes DCU as a GPGPU using a general parallel-computing architecture. Normalized compute record: double, single, half precision, and integer formats supported · The reviewed filing states supported format classes but does not provide a normalized generation-specific peak rate", "evidence_state": "official", "source_ids": [ "src-atlas-2c78c73fc084cb04", "src-atlas-2cf813ccb61b0cde", "src-atlas-7d34f38ba91064db", "src-atlas-9b3cee9443d11a56" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: accelerator_family. Availability record: Hygon filings say Deep Computing No. 1 completed product validation and entered commercial application in 2021, and had begun scaled sales by June 2022; the current 8000-series generation, volumes, and customer scope remain unnormalized.", "evidence_state": "official", "source_ids": [ "src-atlas-2c78c73fc084cb04", "src-atlas-2cf813ccb61b0cde", "src-atlas-7d34f38ba91064db", "src-atlas-9b3cee9443d11a56" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: DTK software stack · self-developed operators · third-party components. Exchange filings establish company statements and historical commercialization wording. They do not establish independent workload results, named customers, current shipment counts, or production yield.", "evidence_state": "official", "source_ids": [ "src-atlas-2c78c73fc084cb04", "src-atlas-2cf813ccb61b0cde", "src-atlas-7d34f38ba91064db", "src-atlas-9b3cee9443d11a56" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Hygon filings say Deep Computing No. 1 completed product validation and entered commercial application in 2021, and had begun scaled sales by June 2022; the current 8000-series generation, volumes, and customer scope remain unnormalized.", "evidence_state": "official", "source_ids": [ "src-atlas-2c78c73fc084cb04", "src-atlas-2cf813ccb61b0cde", "src-atlas-7d34f38ba91064db", "src-atlas-9b3cee9443d11a56" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "1f7a034a4619d038ffefb8982882a91022ade5044ce806e27b3c2b9d4651b197" }, { "id": "sophgo-bm1690", "entity_id": "sophgo-bm1690", "name": "SOPHGO · BM1690", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "SOPHGO", "product": "BM1690", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-1a5664d9f6c17765", "src-atlas-761fa9eecb96d9ea", "src-atlas-8cd82c3305ac4156", "src-atlas-f3a5d7c78fc4caf5" ], "source_refs": [ { "source_id": "src-atlas-1a5664d9f6c17765", "url": "https://www.sophgo.com/about-us/index.html", "title": "SOPHGO company and product history", "publisher": "SOPHGO company and product history", "primary_status": "primary" }, { "source_id": "src-atlas-761fa9eecb96d9ea", "url": "https://doc.sophgo.com/bm1688_sdk-docs/v1.7/docs_latest_release/docs/BM1688_CV186AH_SophonSDK_doc/0_introduction.html", "title": "SOPHGO BM1688 and CV186 SDK documentation", "publisher": "SOPHGO BM1688 and CV186 SDK documentation", "primary_status": "primary" }, { "source_id": "src-atlas-8cd82c3305ac4156", "url": "https://doc.sophgo.com/bm1688_sdk-docs/v2.1/docs_latest_release/docs/tpu-mlir/quick_start_en/index.html", "title": "SOPHGO TPU-MLIR documentation", "publisher": "SOPHGO TPU-MLIR documentation", "primary_status": "primary" }, { "source_id": "src-atlas-f3a5d7c78fc4caf5", "url": "https://en.sophgo.com/about-us/index.html", "title": "SOPHGO English company and product history", "publisher": "SOPHGO English company and product history", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process node and foundry", "memory technology and bandwidth", "package and interconnect", "power", "working-system scope", "volume production", "customer qualification", "shipments", "country-of-origin share" ], "technical_profile": { "entity_level": "processor_family", "accelerator_type": "NPU / tensor ASIC", "role": "Integrated large-model training and inference processor", "architecture": "SOPHGO tensor processor supported through SOPHONSDK and TPU-MLIR tooling", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": null, "scope": "No normalized BM1690 peak rate in the reviewed primary pages", "state": "unknown" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "Unknown", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "Unknown", "state": "unknown" }, "package": { "description": "Processor and system form factors not normalized for BM1690", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "SOPHONSDK", "TPU-MLIR", "multi-core MatMul support", "model regression tests", "operator-development path" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "SOPHGO records BM1690 as released in 2024 and documents continuing software enablement; the public record normalized here does not establish volume production or customer qualification" }, "independent_validation": "Software changelogs establish tool activity and regression testing, not production scale, customer acceptance, or independent workload performance." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-1a5664d9f6c17765", "src-atlas-761fa9eecb96d9ea", "src-atlas-8cd82c3305ac4156", "src-atlas-f3a5d7c78fc4caf5" ], "summary": "SOPHGO is the named company for BM1690 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-1a5664d9f6c17765", "src-atlas-761fa9eecb96d9ea", "src-atlas-8cd82c3305ac4156", "src-atlas-f3a5d7c78fc4caf5" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "SOPHGO tensor processor supported through SOPHONSDK and TPU-MLIR tooling. Normalized compute record: No normalized BM1690 peak rate in the reviewed primary pages", "evidence_state": "official", "source_ids": [ "src-atlas-1a5664d9f6c17765", "src-atlas-761fa9eecb96d9ea", "src-atlas-8cd82c3305ac4156", "src-atlas-f3a5d7c78fc4caf5" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: processor_family. Availability record: SOPHGO records BM1690 as released in 2024 and documents continuing software enablement; the public record normalized here does not establish volume production or customer qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-1a5664d9f6c17765", "src-atlas-761fa9eecb96d9ea", "src-atlas-8cd82c3305ac4156", "src-atlas-f3a5d7c78fc4caf5" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: SOPHONSDK · TPU-MLIR · multi-core MatMul support · model regression tests · operator-development path. Software changelogs establish tool activity and regression testing, not production scale, customer acceptance, or independent workload performance.", "evidence_state": "official", "source_ids": [ "src-atlas-1a5664d9f6c17765", "src-atlas-761fa9eecb96d9ea", "src-atlas-8cd82c3305ac4156", "src-atlas-f3a5d7c78fc4caf5" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: SOPHGO records BM1690 as released in 2024 and documents continuing software enablement; the public record normalized here does not establish volume production or customer qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-1a5664d9f6c17765", "src-atlas-761fa9eecb96d9ea", "src-atlas-8cd82c3305ac4156", "src-atlas-f3a5d7c78fc4caf5" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "a262164f9d0b82d313cc0cc76a9e5ef520b37fd46fc7a6bd39d0f79bb155f293" }, { "id": "denglin-goldwasser-l", "entity_id": "denglin-goldwasser-l", "name": "DenglinAI · Goldwasser I L series", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "DenglinAI", "product": "Goldwasser I L series", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "source_refs": [ { "source_id": "src-atlas-7d07ed76a4a49929", "url": "https://denglinai.com/h-col-301.html", "title": "DenglinAI product hierarchy", "publisher": "DenglinAI product hierarchy", "primary_status": "primary" }, { "source_id": "src-atlas-c3e2306259635fb0", "url": "https://www.sheitc.sh.gov.cn/gydt/20210618/a1c454e86b944440a5c4bca06f2bb0b4.html", "title": "Shanghai government record on historical Denglin BI chip", "publisher": "Shanghai government record on historical Denglin BI chip", "primary_status": "primary" }, { "source_id": "src-atlas-d3cd8f187d385fed", "url": "https://denglinai.com/h-col-251.html", "title": "DenglinAI Goldwasser L-series page", "publisher": "DenglinAI Goldwasser L-series page", "primary_status": "primary" }, { "source_id": "src-atlas-dd89e93294f43dd9", "url": "https://denglinai.com/", "title": "DenglinAI corporate and product site", "publisher": "DenglinAI corporate and product site", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "Goldwasser process node and foundry", "memory technology", "sustained bandwidth", "package construction", "interconnect", "later-generation specifications", "shipment volume", "customer qualification", "country-of-origin share" ], "technical_profile": { "entity_level": "accelerator_card_family", "accelerator_type": "GPU / GPGPU", "role": "Low-power enterprise and edge inference accelerator family", "architecture": "Denglin GPU+ accelerator supported by the Hamming software stack", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": null, "scope": "No normalized like-for-like peak rate in the reviewed primary product pages", "state": "unknown" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": 64, "capacity_scope": "L128/L256 family lists 16 GB, 32 GB, and 64 GB configurations; 64 GB is the family maximum, not every card", "peak_bandwidth_tb_s": 0.239, "bandwidth_scope": "Company peak for L128/L256; memory technology and sustained bandwidth are not stated", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Unknown", "state": "unknown" }, "package": { "description": "Enterprise accelerator-card family; die and package construction unknown", "state": "official" }, "power": { "value": 25, "unit": "W", "scope": "Company typical-power specification for the L128/L256 product table", "state": "official" }, "system_hierarchy": [], "specification_maturity": null, "software": [ "Hamming software stack", "mainstream AI-model inference path" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Denglin currently lists Goldwasser I L, Goldwasser II GS, and third-generation KS lines; current shipment quantity, customer qualification, and readiness of later generations are not established" }, "independent_validation": "No independent product benchmark, teardown, production-volume record, or named customer acceptance receipt is normalized here." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "summary": "DenglinAI is the named company for Goldwasser I L series in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Denglin GPU+ accelerator supported by the Hamming software stack. Normalized compute record: No normalized like-for-like peak rate in the reviewed primary product pages", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: unknown · 64 GB · 0.239 TB/s peak · Company peak for L128/L256; memory technology and sustained bandwidth are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Enterprise accelerator-card family; die and package construction unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: accelerator_card_family. Availability record: Denglin currently lists Goldwasser I L, Goldwasser II GS, and third-generation KS lines; current shipment quantity, customer qualification, and readiness of later generations are not established.", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Power record: 25 W · Company typical-power specification for the L128/L256 product table.", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Hamming software stack · mainstream AI-model inference path. No independent product benchmark, teardown, production-volume record, or named customer acceptance receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Denglin currently lists Goldwasser I L, Goldwasser II GS, and third-generation KS lines; current shipment quantity, customer qualification, and readiness of later generations are not established.", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "71ad197b6e1b3c7cf8f01a8f7ee35fe925b77bc12714af1520d2bf64093f196f" }, { "id": "vastai-va10-family", "entity_id": "vastai-va10-family", "name": "Vastai Technologies · VA10 family", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Vastai Technologies", "product": "VA10 family", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "source_refs": [ { "source_id": "src-atlas-5a2ab9962ec8a505", "url": "https://www.vastaitech.com/newsroom/company-news/55", "title": "Vastai VA10L appliance announcement", "publisher": "Vastai VA10L appliance announcement", "primary_status": "primary" }, { "source_id": "src-atlas-79bb2b46cec3ad70", "url": "https://www.vastaitech.com/company/about", "title": "Vastai company history and readiness claims", "publisher": "Vastai company history and readiness claims", "primary_status": "primary" }, { "source_id": "src-atlas-dc14099b302e74a8", "url": "https://www.vastaitech.com/newsroom/company-news/56", "title": "Vastai VGX VA16 announcement", "publisher": "Vastai VGX VA16 announcement", "primary_status": "primary" }, { "source_id": "src-atlas-e23d1506d07d833b", "url": "https://www.vastaitech.com/", "title": "Vastai product overview", "publisher": "Vastai product overview", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process node and foundry", "card memory type, capacity, and bandwidth", "package and interconnect", "card power", "named customers", "audited shipment volume", "qualification and yield", "country-of-origin share" ], "technical_profile": { "entity_level": "accelerator_and_system_family", "accelerator_type": "GPU / GPGPU", "role": "Data-center inference GPU family for large-language-model and media workloads", "architecture": "Vastai Unified Compute Architecture full-function GPU family spanning accelerator cards and appliances", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": null, "scope": "No normalized like-for-like card compute rate in the reviewed primary pages", "state": "unknown" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "Vastai states up to 2 TB of whole-appliance memory for VA10L/VGX VA16 systems; card memory type, card capacity, and bandwidth are not established", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "System interconnect topology and rate are not normalized", "state": "unknown" }, "package": { "description": "VA10-family accelerator cards and VGX VA16 appliance boundary; die and package construction unknown", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "VUCA", "Kylin", "UnionTech OS", "Anolis OS", "openEuler", "company-stated model adaptation for Llama, Qwen, Baichuan, ChatGLM, and Stable Diffusion" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Vastai says two chip generations reached mass production and commercialization, and called VA1L and VA10L mass-produced in September 2024; audited units, named recipients, current availability, and qualification remain unknown" }, "independent_validation": "Company mass-production and model-adaptation wording is not independent testing and does not establish shipment volume or workload parity." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "summary": "Vastai Technologies is the named company for VA10 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Vastai Unified Compute Architecture full-function GPU family spanning accelerator cards and appliances. Normalized compute record: No normalized like-for-like card compute rate in the reviewed primary pages", "evidence_state": "official", "source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: VA10-family accelerator cards and VGX VA16 appliance boundary; die and package construction unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: accelerator_and_system_family. Availability record: Vastai says two chip generations reached mass production and commercialization, and called VA1L and VA10L mass-produced in September 2024; audited units, named recipients, current availability, and qualification remain unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: VUCA · Kylin · UnionTech OS · Anolis OS · openEuler · company-stated model adaptation for Llama, Qwen, Baichuan, ChatGLM, and Stable Diffusion. Company mass-production and model-adaptation wording is not independent testing and does not establish shipment volume or workload parity.", "evidence_state": "official", "source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Vastai says two chip generations reached mass production and commercialization, and called VA1L and VA10L mass-produced in September 2024; audited units, named recipients, current availability, and qualification remain unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "092477c542a379318925b56c0b7fd0e4d8b486406463ef45f89bd9210e51c77b" }, { "id": "axera-ax650-family", "entity_id": "axera-ax650-family", "name": "Axera · AX650 family", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Axera", "product": "AX650 family", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "source_refs": [ { "source_id": "src-atlas-3900c910fe419b0f", "url": "https://www.axera-tech.com/en/node/2992", "title": "Axera 1050-series system-on-module page", "publisher": "Axera 1050-series system-on-module page", "primary_status": "primary" }, { "source_id": "src-atlas-625f0841670e9e08", "url": "https://github.com/AXERA-TECH/ax-llm", "title": "Axera AX-LLM repository", "publisher": "Axera AX-LLM repository", "primary_status": "primary" }, { "source_id": "src-atlas-6b6d0a2ed63bf092", "url": "https://axera-tech.com/en/news/2779.html", "title": "Axera PSA Certified Level 1 announcement", "publisher": "Axera PSA Certified Level 1 announcement", "primary_status": "primary" }, { "source_id": "src-atlas-ae9fe08bf7480a9b", "url": "https://www.axera-tech.com/sites/default/files/2026-01/2026013000010_c.pdf", "title": "Axera 2026 prospectus", "publisher": "Axera 2026 prospectus", "primary_status": "primary" }, { "source_id": "src-atlas-d187a0cd4aa5e239", "url": "https://axera-tech.com/en/news/2819.html", "title": "Axera AX650N product announcement", "publisher": "Axera AX650N product announcement", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process node and foundry", "device memory capacity and supplier", "sustained bandwidth", "package and test provider", "power for the normalized device boundary", "named customers", "current volume and yield", "country-of-origin share" ], "technical_profile": { "entity_level": "edge_ai_soc_family", "accelerator_type": "Integrated client or edge AI accelerator", "role": "Edge AI inference and vision system-on-chip family", "architecture": "Axera Neutron NPU integrated with Arm CPU, AI image-signal processing, and video engines", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": 10.8, "unit": "TOPS", "precision": "INT8", "scope": "AX650N vendor peak; the same source states 43.2 TOPS at INT4", "state": "official" }, { "value": 43.2, "unit": "TOPS", "precision": "INT4", "scope": "AX650N vendor peak; not comparable with INT8, FP16, or application throughput without a matched workload", "state": "official" } ], "memory": { "strategy": "lpddr", "hbm_free": true, "type": "64-bit LPDDR4X interface", "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "AX650N interface support; device capacity, memory supplier, and sustained bandwidth are not stated", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Peripheral interfaces are documented, but no data-center scale-up fabric applies to this SoC record", "state": "unknown" }, "package": { "description": "Integrated edge AI SoC; separate 1050-series DIMM system-on-module products use AX650-family silicon", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "Axera SDK", "AX-LLM evaluation repository", "mainstream deep-learning framework conversion path" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Axera's 2026 prospectus defines AX650 as a commercialized endpoint-computing series; this means external-sale revenue was recognized, not that current volume, customers, or profitability are established" }, "independent_validation": "PSA Certified Level 1 is a bounded security-certification receipt for named products. It does not establish automotive functional safety, workload performance, volume, or complete-system qualification." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "summary": "Axera is the named company for AX650 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Axera Neutron NPU integrated with Arm CPU, AI image-signal processing, and video engines. Normalized compute record: 10.8 TOPS · INT8 · AX650N vendor peak; the same source states 43.2 TOPS at INT4 | 43.2 TOPS · INT4 · AX650N vendor peak; not comparable with INT8, FP16, or application throughput without a matched workload", "evidence_state": "official", "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · 64-bit LPDDR4X interface · AX650N interface support; device capacity, memory supplier, and sustained bandwidth are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Integrated edge AI SoC; separate 1050-series DIMM system-on-module products use AX650-family silicon.", "evidence_state": "official", "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: edge_ai_soc_family. Availability record: Axera's 2026 prospectus defines AX650 as a commercialized endpoint-computing series; this means external-sale revenue was recognized, not that current volume, customers, or profitability are established.", "evidence_state": "official", "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Axera SDK · AX-LLM evaluation repository · mainstream deep-learning framework conversion path. PSA Certified Level 1 is a bounded security-certification receipt for named products. It does not establish automotive functional safety, workload performance, volume, or complete-system qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Axera's 2026 prospectus defines AX650 as a commercialized endpoint-computing series; this means external-sale revenue was recognized, not that current volume, customers, or profitability are established.", "evidence_state": "official", "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "9f84a08cb75dc0e69e332bc1ee91a421a6b6b7142887ef6c6b445a08fca6eef7" }, { "id": "intellifusion-deepedge10-family", "entity_id": "intellifusion-deepedge10-family", "name": "Intellifusion · DeepEdge10 family", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Intellifusion", "product": "DeepEdge10 family", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-159f320b1c93bd19" ], "source_refs": [ { "source_id": "src-atlas-159f320b1c93bd19", "url": "https://www.intellif.com/int/chips.html", "title": "Intellifusion AI chip and module catalog", "publisher": "Intellifusion AI chip and module catalog", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process node and foundry", "chip memory interface, capacity, supplier, and bandwidth", "D2D topology and bandwidth", "die and package construction", "chip and module power for the normalized family", "named customer qualification", "current shipment and production volume", "yield", "country-of-origin share" ], "technical_profile": { "entity_level": "edge_ai_soc_family", "accelerator_type": "Integrated client or edge AI accelerator", "role": "Edge video, machine-vision, robotics, industrial-control, and private edge-model inference SoC family", "architecture": "DeepEdge10C, DeepEdge10, and DeepEdge10Max use Intellifusion's NNP400T neural processor; DeepEdge10Max adds a vendor-described D2D chiplet interconnect for scalable edge inference", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": 8, "unit": "TOPS", "precision": "INT8", "scope": "DeepEdge10C vendor peak; the same page lists 4 TOPS INT16 and 1.5 TFLOPS FP16", "state": "official" }, { "value": 16, "unit": "TOPS", "precision": "INT8", "scope": "DeepEdge10 vendor peak; the same page lists 8 TOPS INT16 and 2 TFLOPS FP16", "state": "official" }, { "value": 64, "unit": "TOPS", "precision": "INT8", "scope": "DeepEdge10Max vendor peak; the same page lists 32 TOPS INT16 and 8 TFLOPS FP16", "state": "official" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "The official page lists 4 GB LPDDR4X on an IPU X200 module using DeepEdge10C and 8 GB LPDDR4X on an IPU A300 module using DeepEdge10; it does not establish a family-wide chip memory interface, topology, supplier, or bandwidth", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "DeepEdge10Max uses a vendor-described D2D chiplet interconnect; topology, die count, protocol, and rate are not stated", "state": "official" }, "package": { "description": "Integrated edge SoC family; DeepEdge10Max is described as a chiplet design, but die and package construction are not disclosed", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "model quantization, compilation, and deployment SDK", "PyTorch", "ONNX", "TensorFlow", "support for CNN, RNN, Transformer, and GNN networks" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Intellifusion currently lists DeepEdge10C, DeepEdge10, and DeepEdge10Max as chip products and lists modules and cards built around its processors; this does not establish shipment volume, named recipients, or current production capacity" }, "independent_validation": "No independent teardown, matched-workload benchmark, customer qualification, shipment count, or production-yield receipt is normalized here." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-159f320b1c93bd19" ], "summary": "Intellifusion is the named company for DeepEdge10 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-159f320b1c93bd19" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "DeepEdge10C, DeepEdge10, and DeepEdge10Max use Intellifusion's NNP400T neural processor; DeepEdge10Max adds a vendor-described D2D chiplet interconnect for scalable edge inference. Normalized compute record: 8 TOPS · INT8 · DeepEdge10C vendor peak; the same page lists 4 TOPS INT16 and 1.5 TFLOPS FP16 | 16 TOPS · INT8 · DeepEdge10 vendor peak; the same page lists 8 TOPS INT16 and 2 TFLOPS FP16 | 64 TOPS · INT8 · DeepEdge10Max vendor peak; the same page lists 32 TOPS INT16 and 8 TFLOPS FP16", "evidence_state": "official", "source_ids": [ "src-atlas-159f320b1c93bd19" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Integrated edge SoC family; DeepEdge10Max is described as a chiplet design, but die and package construction are not disclosed.", "evidence_state": "official", "source_ids": [ "src-atlas-159f320b1c93bd19" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: edge_ai_soc_family. Availability record: Intellifusion currently lists DeepEdge10C, DeepEdge10, and DeepEdge10Max as chip products and lists modules and cards built around its processors; this does not establish shipment volume, named recipients, or current production capacity.", "evidence_state": "official", "source_ids": [ "src-atlas-159f320b1c93bd19" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: DeepEdge10Max uses a vendor-described D2D chiplet interconnect; topology, die count, protocol, and rate are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-159f320b1c93bd19" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: model quantization, compilation, and deployment SDK · PyTorch · ONNX · TensorFlow · support for CNN, RNN, Transformer, and GNN networks. No independent teardown, matched-workload benchmark, customer qualification, shipment count, or production-yield receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-159f320b1c93bd19" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Intellifusion currently lists DeepEdge10C, DeepEdge10, and DeepEdge10Max as chip products and lists modules and cards built around its processors; this does not establish shipment volume, named recipients, or current production capacity.", "evidence_state": "official", "source_ids": [ "src-atlas-159f320b1c93bd19" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "78a6928760618aaf75314afca4186dafe26321bb01c73168961c7c467dab983c" }, { "id": "corerain-caisa-430", "entity_id": "corerain-caisa-430", "name": "Corerain · CAISA 430", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Corerain", "product": "CAISA 430", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "source_refs": [ { "source_id": "src-atlas-229e5b592b1e9d49", "url": "https://www.corerain.com/products/caisa430.html", "title": "Corerain CAISA 430 product specifications", "publisher": "Corerain CAISA 430 product specifications", "primary_status": "primary" }, { "source_id": "src-atlas-f61a067a7a89d767", "url": "https://www.corerain.com/caisa.html", "title": "Corerain CAISA 4.0 architecture and RainBuilder page", "publisher": "Corerain CAISA 4.0 architecture and RainBuilder page", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process node and foundry", "memory supplier and sustained bandwidth", "die and package construction", "external interconnect", "power", "named customer qualification", "current shipment and production volume", "yield", "country-of-origin share" ], "technical_profile": { "entity_level": "edge_ai_accelerator_soc", "accelerator_type": "Dataflow or spatial ASIC", "role": "Reconfigurable dataflow chip for edge and higher-performance AI inference", "architecture": "Fourth-generation CAISA 4.0 reconfigurable dataflow architecture with a 24-core Arm Cortex-A55 CPU complex and support for CNN, RNN, and Transformer networks", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": 16, "unit": "TOPS", "precision": "INT8", "scope": "Vendor peak for CAISA 430; the same page says INT16 and FP32 are supported without normalized peak rates", "state": "official" } ], "memory": { "strategy": "lpddr", "hbm_free": true, "type": "LPDDR4X", "capacity_gb": 48, "capacity_scope": "Vendor maximum across three LPDDR4X channels, not a statement that every implementation carries 48 GB", "peak_bandwidth_tb_s": 0.0896, "bandwidth_scope": "Vendor peak of 89.6 GB/s for the stated three-channel LPDDR4X memory path; sustained application bandwidth is not stated", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "External scale-up, scale-out, and chip-to-chip interconnect are not stated", "state": "unknown" }, "package": { "description": "Integrated accelerator SoC; die size, package type, assembly, and test path are not stated", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "RainBuilder compiler toolchain", "TensorFlow", "PyTorch", "Caffe", "ONNX", "MXNet" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Corerain currently lists CAISA 430 as an orderable-inquiry product and shows systems based on the architecture; the page does not establish shipment volume, current production capacity, or customer qualification" }, "independent_validation": "Vendor utilization and peak-throughput statements are not independent workload measurements and do not establish sustained model performance, power efficiency, or volume production." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "summary": "Corerain is the named company for CAISA 430 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Fourth-generation CAISA 4.0 reconfigurable dataflow architecture with a 24-core Arm Cortex-A55 CPU complex and support for CNN, RNN, and Transformer networks. Normalized compute record: 16 TOPS · INT8 · Vendor peak for CAISA 430; the same page says INT16 and FP32 are supported without normalized peak rates", "evidence_state": "official", "source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · LPDDR4X · 48 GB · 0.0896 TB/s peak · Vendor peak of 89.6 GB/s for the stated three-channel LPDDR4X memory path; sustained application bandwidth is not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: edge_ai_accelerator_soc. Availability record: Corerain currently lists CAISA 430 as an orderable-inquiry product and shows systems based on the architecture; the page does not establish shipment volume, current production capacity, or customer qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: RainBuilder compiler toolchain · TensorFlow · PyTorch · Caffe · ONNX · MXNet. Vendor utilization and peak-throughput statements are not independent workload measurements and do not establish sustained model performance, power efficiency, or volume production.", "evidence_state": "official", "source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Corerain currently lists CAISA 430 as an orderable-inquiry product and shows systems based on the architecture; the page does not establish shipment volume, current production capacity, or customer qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "2e2dbcfa309acfd188c3b522db6606808c71e377fba1ac75980726f3f2e38b0d" }, { "id": "corerain-n460h", "entity_id": "corerain-n460h", "name": "Corerain · Stellar N460H", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Corerain", "product": "Stellar N460H", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "source_refs": [ { "source_id": "src-atlas-1c48a778197fdca2", "url": "https://www.corerain.com/products/N460H.html", "title": "Corerain Stellar N460H product specifications", "publisher": "Corerain Stellar N460H product specifications", "primary_status": "primary" }, { "source_id": "src-atlas-f61a067a7a89d767", "url": "https://www.corerain.com/caisa.html", "title": "Corerain CAISA 4.0 architecture and RainBuilder page", "publisher": "Corerain CAISA 4.0 architecture and RainBuilder page", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "accelerator die count and process node", "foundry, assembly, and test provider", "memory supplier and bandwidth", "package construction", "measured PCIe throughput and multi-card fabric", "named customer qualification", "current shipment and production volume", "yield", "country-of-origin share" ], "technical_profile": { "entity_level": "accelerator_card", "accelerator_type": "Dataflow or spatial ASIC", "role": "Half-height, half-length inference card for x86 and Arm servers, small hosts, and industrial computers", "architecture": "Corerain high-performance AI inference card with a vendor-listed three-by-24-core Arm Cortex-A55 controller configuration; accelerator die count and package topology are not stated", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": 48, "unit": "TOPS", "precision": "INT8", "scope": "N460H vendor peak; not sustained application throughput", "state": "official" }, { "value": 12, "unit": "TOPS", "precision": "INT16", "scope": "N460H vendor peak; not directly comparable with INT8 or FP32 rates", "state": "official" }, { "value": 384, "unit": "GFLOPS", "precision": "FP32", "scope": "N460H vendor peak; sustained workload performance is not stated", "state": "official" } ], "memory": { "strategy": "lpddr", "hbm_free": true, "type": "LPDDR4X", "capacity_gb": 144, "capacity_scope": "Vendor maximum; the standard N460H configuration is listed as 72 GB", "peak_bandwidth_tb_s": null, "bandwidth_scope": "Memory bandwidth, topology, and supplier are not stated on the N460H card page", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Vendor lists a PCIe Gen3 x8 physical interface and a PCIe Gen3 x2 data-link interface; measured host-transfer throughput and multi-card fabric are not stated", "state": "official" }, "package": { "description": "Passive, single-slot, half-height half-length card measuring 169.5 by 69.2 by 18.5 mm; accelerator die and package construction are unknown", "state": "official" }, "power": { "value": 75, "unit": "W", "scope": "Vendor maximum card power, stated as no more than 75 W", "state": "official" }, "system_hierarchy": [], "specification_maturity": null, "software": [ "OpenEuler operating system by default", "RainBuilder compiler toolchain" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Corerain currently lists N460H as a product with ordering inquiry; this establishes a vendor-offered card specification, not stock, shipment volume, named customer qualification, or installed capacity" }, "independent_validation": "No independent card teardown, measured host-transfer result, sustained model benchmark, qualification record, or shipment count is normalized here." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "summary": "Corerain is the named company for Stellar N460H in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Corerain high-performance AI inference card with a vendor-listed three-by-24-core Arm Cortex-A55 controller configuration; accelerator die count and package topology are not stated. Normalized compute record: 48 TOPS · INT8 · N460H vendor peak; not sustained application throughput | 12 TOPS · INT16 · N460H vendor peak; not directly comparable with INT8 or FP32 rates | 384 GFLOPS · FP32 · N460H vendor peak; sustained workload performance is not stated", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · LPDDR4X · 144 GB · Memory bandwidth, topology, and supplier are not stated on the N460H card page.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Passive, single-slot, half-height half-length card measuring 169.5 by 69.2 by 18.5 mm; accelerator die and package construction are unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: accelerator_card. Availability record: Corerain currently lists N460H as a product with ordering inquiry; this establishes a vendor-offered card specification, not stock, shipment volume, named customer qualification, or installed capacity.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Vendor lists a PCIe Gen3 x8 physical interface and a PCIe Gen3 x2 data-link interface; measured host-transfer throughput and multi-card fabric are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Power record: 75 W · Vendor maximum card power, stated as no more than 75 W.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: OpenEuler operating system by default · RainBuilder compiler toolchain. No independent card teardown, measured host-transfer result, sustained model benchmark, qualification record, or shipment count is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Corerain currently lists N460H as a product with ordering inquiry; this establishes a vendor-offered card specification, not stock, shipment volume, named customer qualification, or installed capacity.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "24abc2c162b918af3d6f76c97d240e72950d1e9616445ed9ba8cb0b2bd018f16" }, { "id": "tsingmicro-tx5-family", "entity_id": "tsingmicro-tx5-family", "name": "TsingMicro · TX5 family", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "TsingMicro", "product": "TX5 family", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "source_refs": [ { "source_id": "src-atlas-a9e4a3eb66486d99", "url": "https://www.tsingmicro.com/products/tx5/security-grade", "title": "TsingMicro TX5 professional edge-chip family", "publisher": "TsingMicro TX5 professional edge-chip family", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "generation-specific peak compute", "process node and foundry", "memory type, capacity, supplier, and bandwidth", "external interconnect", "die and package construction", "generation-specific power", "named customer qualification", "audited shipment and production volume", "yield", "country-of-origin share" ], "technical_profile": { "entity_level": "edge_ai_soc_family", "accelerator_type": "Integrated client or edge AI accelerator", "role": "Professional edge-vision, industrial-inspection, robotics, and edge-model inference SoC family", "architecture": "TX5 family uses TsingMicro's reconfigurable neural-network engine; individual members add CGRA image processing, general-compute acceleration, GPU or 3D engines, video codecs, and vision-processing blocks", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": "W4A8 mixed-precision quantization supported on TX5326", "scope": "The reviewed family page does not provide a normalized numeric peak for TX5326, TX5336, TX5368, or TX5215", "state": "official" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "The vendor says its architecture reduces DDR consumption but does not state memory type, capacity, topology, supplier, or bandwidth for the family", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "External interfaces and inter-chip links are not normalized on the reviewed family page", "state": "unknown" }, "package": { "description": "Integrated edge SoC family including TX5326, TX5336, TX5368, and TX5215; package construction is not stated", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "vendor-described mature deployment toolchain", "mainstream-framework compatibility", "intelligent quantization", "Transformer, LLM, and VLM edge-model support" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "TsingMicro says the TX5 family is in scaled mass production; this is a vendor readiness claim and does not establish audited units, named recipients, current capacity, or qualification" }, "independent_validation": "No independent teardown, framework reproduction, matched-workload result, qualification receipt, or audited shipment count is normalized here." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "summary": "TsingMicro is the named company for TX5 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "TX5 family uses TsingMicro's reconfigurable neural-network engine; individual members add CGRA image processing, general-compute acceleration, GPU or 3D engines, video codecs, and vision-processing blocks. Normalized compute record: W4A8 mixed-precision quantization supported on TX5326 · The reviewed family page does not provide a normalized numeric peak for TX5326, TX5336, TX5368, or TX5215", "evidence_state": "official", "source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Integrated edge SoC family including TX5326, TX5336, TX5368, and TX5215; package construction is not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: edge_ai_soc_family. Availability record: TsingMicro says the TX5 family is in scaled mass production; this is a vendor readiness claim and does not establish audited units, named recipients, current capacity, or qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: vendor-described mature deployment toolchain · mainstream-framework compatibility · intelligent quantization · Transformer, LLM, and VLM edge-model support. No independent teardown, framework reproduction, matched-workload result, qualification receipt, or audited shipment count is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: TsingMicro says the TX5 family is in scaled mass production; this is a vendor readiness claim and does not establish audited units, named recipients, current capacity, or qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "6e3f4b193c2605a177a0872712faf8c7a187330d0855c901e6ae472e1689846d" }, { "id": "black-sesame-huashan-a1000-family", "entity_id": "black-sesame-huashan-a1000-family", "name": "Black Sesame Technologies · Huashan A1000 family", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Black Sesame Technologies", "product": "Huashan A1000 family", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-665cb201ca3cd619" ], "source_refs": [ { "source_id": "src-atlas-665cb201ca3cd619", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0427/2026042701016.pdf", "title": "Black Sesame International 2025 annual report", "publisher": "Black Sesame International 2025 annual report", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "generation-normalized compute", "process node and foundry", "memory type, capacity, supplier, and bandwidth", "package, assembly, and test path", "power", "product-level customer qualification", "audited shipment and production volume", "yield", "country-of-origin share" ], "technical_profile": { "entity_level": "automotive_ai_soc_family", "accelerator_type": "Automotive AI system-on-chip", "role": "Automotive driving-assistance SoC family for L2+ and L3 functions and related commercial-vehicle applications", "architecture": "Huashan automotive SoC family consisting of A1000, A1000L, and A1000 Pro; the reviewed filing describes proprietary IP cores and an integrated driving-compute platform without disclosing a normalized microarchitecture", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": null, "scope": "The reviewed 2025 annual report does not provide generation-normalized peak compute rates for A1000, A1000L, and A1000 Pro", "state": "unknown" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "Memory technology, capacity, topology, supplier, and bandwidth are not stated in the reviewed filing", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "Vehicle, sensor, die-to-die, and external accelerator interconnect rates are not normalized in the reviewed filing", "state": "unknown" }, "package": { "description": "Automotive SoC family; die, package, assembly, and test construction are not stated", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "Hanhai ADAS middleware platform", "peripheral open interfaces and commonly used basic software components" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Black Sesame's 2025 annual report says the A1000 family achieved mass production and deployment, remained in vehicle programs, and was the main contributor to company chip sales in 2025; audited unit volume and product-level customer qualification are not stated" }, "independent_validation": "The exchange filing is a primary company record. Its product, certification, integration, and readiness wording is not an independent workload, safety, shipment-volume, or supply-chain validation." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-665cb201ca3cd619" ], "summary": "Black Sesame Technologies is the named company for Huashan A1000 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-665cb201ca3cd619" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Huashan automotive SoC family consisting of A1000, A1000L, and A1000 Pro; the reviewed filing describes proprietary IP cores and an integrated driving-compute platform without disclosing a normalized microarchitecture. Normalized compute record: The reviewed 2025 annual report does not provide generation-normalized peak compute rates for A1000, A1000L, and A1000 Pro", "evidence_state": "official", "source_ids": [ "src-atlas-665cb201ca3cd619" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: automotive_ai_soc_family. Availability record: Black Sesame's 2025 annual report says the A1000 family achieved mass production and deployment, remained in vehicle programs, and was the main contributor to company chip sales in 2025; audited unit volume and product-level customer qualification are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-665cb201ca3cd619" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Hanhai ADAS middleware platform · peripheral open interfaces and commonly used basic software components. The exchange filing is a primary company record. Its product, certification, integration, and readiness wording is not an independent workload, safety, shipment-volume, or supply-chain validation.", "evidence_state": "official", "source_ids": [ "src-atlas-665cb201ca3cd619" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Black Sesame's 2025 annual report says the A1000 family achieved mass production and deployment, remained in vehicle programs, and was the main contributor to company chip sales in 2025; audited unit volume and product-level customer qualification are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-665cb201ca3cd619" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "62e8c8a2455237da0f60769a952990f964e7c1395d52d70bc2eaab72bd1f819d" }, { "id": "jingjia-micro-jm11-family", "entity_id": "jingjia-micro-jm11-family", "name": "Jingjia Micro · JM11 family", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Jingjia Micro", "product": "JM11 family", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-61588c19f7b763d5" ], "source_refs": [ { "source_id": "src-atlas-61588c19f7b763d5", "url": "https://static.cninfo.com.cn/finalpage/2026-04-24/1225166816.PDF", "title": "Jingjia Micro 2025 annual report", "publisher": "Jingjia Micro 2025 annual report", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "microarchitecture and generation-specific compute", "process node and foundry", "memory type, capacity, supplier, and bandwidth", "card, module, die, and package construction", "host and multi-GPU interconnect", "power", "named customer qualification", "audited shipment and production volume", "yield", "country-of-origin share" ], "technical_profile": { "entity_level": "gpu_chip_family", "accelerator_type": "GPU / GPGPU", "role": "General desktop and cloud-rendering GPU family for cloud desktops, cloud gaming, rendering, workstation, GIS, multimedia, and industrial-design workloads", "architecture": "Jingjia Micro GPU family with hardware virtualization and passthrough virtualization support; the reviewed filing does not disclose a normalized microarchitecture", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": null, "scope": "No normalized peak compute rate is stated for the JM11 family in the reviewed filing", "state": "unknown" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "Memory technology, capacity, topology, supplier, and bandwidth are not stated in the reviewed filing", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "Host and multi-GPU interconnect are not stated in the reviewed filing", "state": "unknown" }, "package": { "description": "GPU chip family used across servers, graphics workstations, desktops, and notebooks; card, module, die, and package boundaries are not normalized", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "Windows", "Linux", "mainstream operating systems used in China", "hardware virtualization", "passthrough virtualization" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Jingjia Micro's 2025 annual report lists JM11 as released in 2025 and at the small-batch delivery-and-use stage; it also describes a 32-session cloud-desktop deployment, but does not disclose recipient identity, product units, or current production capacity" }, "independent_validation": "Company-reported application and concurrency wording is not an independent benchmark, product teardown, customer acceptance record, or audited shipment count." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-61588c19f7b763d5" ], "summary": "Jingjia Micro is the named company for JM11 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Jingjia Micro GPU family with hardware virtualization and passthrough virtualization support; the reviewed filing does not disclose a normalized microarchitecture. Normalized compute record: No normalized peak compute rate is stated for the JM11 family in the reviewed filing", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: gpu_chip_family. Availability record: Jingjia Micro's 2025 annual report lists JM11 as released in 2025 and at the small-batch delivery-and-use stage; it also describes a 32-session cloud-desktop deployment, but does not disclose recipient identity, product units, or current production capacity.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Windows · Linux · mainstream operating systems used in China · hardware virtualization · passthrough virtualization. Company-reported application and concurrency wording is not an independent benchmark, product teardown, customer acceptance record, or audited shipment count.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Jingjia Micro's 2025 annual report lists JM11 as released in 2025 and at the small-batch delivery-and-use stage; it also describes a 32-session cloud-desktop deployment, but does not disclose recipient identity, product units, or current production capacity.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "862050776429fa39e5d3e7dfe99da52f701822327040e2316df97114ee083485" }, { "id": "jingjia-micro-ch37-family", "entity_id": "jingjia-micro-ch37-family", "name": "Jingjia Micro / Chengheng Micro · CH37 family", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Jingjia Micro / Chengheng Micro", "product": "CH37 family", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-61588c19f7b763d5" ], "source_refs": [ { "source_id": "src-atlas-61588c19f7b763d5", "url": "https://static.cninfo.com.cn/finalpage/2026-04-24/1225166816.PDF", "title": "Jingjia Micro 2025 annual report", "publisher": "Jingjia Micro 2025 annual report", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "generation variants and sustained workload performance", "process node and foundry", "memory type, capacity, supplier, and bandwidth", "external interfaces", "die and package construction", "numeric power", "named customer qualification", "audited shipment and production volume", "yield", "country-of-origin share" ], "technical_profile": { "entity_level": "edge_ai_soc_family", "accelerator_type": "Integrated client or edge AI accelerator", "role": "Integrated edge AI SoC family for robotics, AI boxes, intelligent terminals, recognition systems, and unmanned-aircraft payloads", "architecture": "Chengheng Micro high-integration single-chip SoC with CPU, GPU, NPU, GPGPU, ISP, DSP, and VPU processing blocks", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": 64, "unit": "TOPS", "precision": "INT8", "scope": "CH37 family vendor peak in Jingjia Micro's filing; sustained workload performance is not stated", "state": "official" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "Memory technology, capacity, topology, supplier, and bandwidth are not stated in the reviewed filing", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "Sensor, host, chip-to-chip, and network interfaces are not stated in the reviewed filing", "state": "unknown" }, "package": { "description": "High-integration single-chip edge AI SoC; die and package construction are not disclosed", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "supporting software under continued development according to the filing", "flexible compute-precision support" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Jingjia Micro's 2025 annual report places CH37 in the small-batch production stage and says customer introduction and software work are continuing; this does not establish audited units, named recipients, or qualification" }, "independent_validation": "The filing establishes the company's stated product and readiness stage, not an independent workload result, customer acceptance receipt, or audited production count." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-61588c19f7b763d5" ], "summary": "Jingjia Micro / Chengheng Micro is the named company for CH37 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Chengheng Micro high-integration single-chip SoC with CPU, GPU, NPU, GPGPU, ISP, DSP, and VPU processing blocks. Normalized compute record: 64 TOPS · INT8 · CH37 family vendor peak in Jingjia Micro's filing; sustained workload performance is not stated", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: High-integration single-chip edge AI SoC; die and package construction are not disclosed.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: edge_ai_soc_family. Availability record: Jingjia Micro's 2025 annual report places CH37 in the small-batch production stage and says customer introduction and software work are continuing; this does not establish audited units, named recipients, or qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: supporting software under continued development according to the filing · flexible compute-precision support. The filing establishes the company's stated product and readiness stage, not an independent workload result, customer acceptance receipt, or audited production count.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Jingjia Micro's 2025 annual report places CH37 in the small-batch production stage and says customer introduction and software work are continuing; this does not establish audited units, named recipients, or qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "41936d3488529cb9c190c15ce55a712ba18ace7c5fe8b395af8a0af404b7bb71" }, { "id": "lisuan-lx-7g100", "entity_id": "lisuan-lx-7g100", "name": "Lisuan Technology · LX 7G100", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Lisuan Technology", "product": "LX 7G100", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-13dac09c006da88b" ], "source_refs": [ { "source_id": "src-atlas-13dac09c006da88b", "url": "https://www.lisuantech.com/product/gaming-graphics/lx-7g100", "title": "Lisuan LX 7G100 official product page", "publisher": "Lisuan LX 7G100 official product page", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "GPU microarchitecture details and peak compute", "process node and foundry", "memory bus width, data rate, supplier, and bandwidth", "host interface", "GPU die and package construction", "board power", "named customer qualification", "audited shipment and production volume", "yield", "country-of-origin share" ], "technical_profile": { "entity_level": "discrete_graphics_card", "accelerator_type": "GPU / GPGPU", "role": "Consumer graphics card for gaming, local AI-PC applications, content creation, recording, streaming, and video processing", "architecture": "Lisuan TrueGPU graphics architecture with NRSS super-resolution support", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": null, "scope": "The reviewed official product page does not provide a peak compute rate or a normalized AI-acceleration rate", "state": "unknown" } ], "memory": { "strategy": "gddr", "hbm_free": true, "type": "GDDR6", "capacity_gb": 12, "peak_bandwidth_tb_s": null, "bandwidth_scope": "The product page states 12 GB GDDR6; bus width, data rate, supplier, and bandwidth are not stated", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Host interface generation and measured transfer rate are not stated on the reviewed product page", "state": "unknown" }, "package": { "description": "294 by 120 by 49 mm discrete graphics card with active axial-fan cooling; GPU die and package construction are unknown", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "DirectX 12", "Vulkan 1.3", "OpenGL 4.6", "OpenCL 3.0", "Lisuan driver download center", "NRSS super resolution" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Lisuan currently lists LX 7G100 as a consumer product and links to online purchasing; this does not establish stock, shipments, sell-through, named customers, or production volume" }, "independent_validation": "No independent board teardown, driver-compatibility audit, matched gaming or AI benchmark, qualification receipt, or audited shipment count is normalized here." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-13dac09c006da88b" ], "summary": "Lisuan Technology is the named company for LX 7G100 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-13dac09c006da88b" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Lisuan TrueGPU graphics architecture with NRSS super-resolution support. Normalized compute record: The reviewed official product page does not provide a peak compute rate or a normalized AI-acceleration rate", "evidence_state": "official", "source_ids": [ "src-atlas-13dac09c006da88b" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: gddr · GDDR6 · 12 GB · The product page states 12 GB GDDR6; bus width, data rate, supplier, and bandwidth are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-13dac09c006da88b" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: 294 by 120 by 49 mm discrete graphics card with active axial-fan cooling; GPU die and package construction are unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-13dac09c006da88b" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: discrete_graphics_card. Availability record: Lisuan currently lists LX 7G100 as a consumer product and links to online purchasing; this does not establish stock, shipments, sell-through, named customers, or production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-13dac09c006da88b" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: DirectX 12 · Vulkan 1.3 · OpenGL 4.6 · OpenCL 3.0 · Lisuan driver download center · NRSS super resolution. No independent board teardown, driver-compatibility audit, matched gaming or AI benchmark, qualification receipt, or audited shipment count is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-13dac09c006da88b" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Lisuan currently lists LX 7G100 as a consumer product and links to online purchasing; this does not establish stock, shipments, sell-through, named customers, or production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-13dac09c006da88b" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "2a20d0fad6f36ae9d7a8bdc746d991adc73406898095cd5bb99dad553d5f9c12" }, { "id": "innosilicon-fenghua-3", "entity_id": "innosilicon-fenghua-3", "name": "Innosilicon · Fenghua 3", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Innosilicon", "product": "Fenghua 3", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-f0377f591ec0d868" ], "source_refs": [ { "source_id": "src-atlas-f0377f591ec0d868", "url": "https://www.innosilicon.cn/news/37", "title": "Innosilicon Fenghua 3 launch article", "publisher": "Innosilicon Fenghua 3 launch article", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "peak compute by precision", "process node and foundry", "memory technology, supplier, and numeric bandwidth", "host and scale-out interconnect", "physical card, die, and package construction", "power", "named customer qualification", "current shipment and production volume", "yield", "country-of-origin share" ], "technical_profile": { "entity_level": "accelerator_card_family", "accelerator_type": "GPU / GPGPU", "role": "Full-function GPU for large-model training and inference, scientific computing, graphics rendering, virtualization, and multi-display workloads", "architecture": "Full-function GPU with a vendor-described CUDA-compatible programming path and an integrated Nanhu V3 open-source RISC-V CPU", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": "single, double, and mixed precision supported", "scope": "The launch article describes supported precision classes and workloads but does not provide a normalized peak compute rate", "state": "official" } ], "memory": { "strategy": "high_bandwidth_discrete", "hbm_free": null, "type": "high-bandwidth video memory; technology not stated", "capacity_gb": 112, "capacity_scope": "Vendor says a single card carries 112 GB or more; 112 GB is a lower bound rather than a normalized exact SKU", "peak_bandwidth_tb_s": null, "bandwidth_scope": "The vendor calls the memory high bandwidth but does not state memory technology, supplier, interface width, data rate, or numeric bandwidth", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Host, card-to-card, and cluster interconnect are not stated in the reviewed launch article", "state": "unknown" }, "package": { "description": "Single-card product boundary is stated; physical form factor, die count, package construction, assembly, and test path are not disclosed", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "PyTorch", "Triton", "HIP and CUDA-compatible frameworks", "OpenCL", "DirectX 12", "Vulkan 1.2", "OpenGL 4.6", "UOS", "Kylin", "Windows", "Android", "vGPU virtualization" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Innosilicon says Fenghua 3 was launched on September 22, 2025, demonstrated at the event, and covered by ecosystem agreements for future systems and clusters; this does not establish working units outside the demonstration, current shipments, installed clusters, or production volume" }, "independent_validation": "Launch demonstrations and ecosystem agreements are vendor evidence, not an independent benchmark, teardown, customer acceptance record, shipment receipt, or production audit." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-f0377f591ec0d868" ], "summary": "Innosilicon is the named company for Fenghua 3 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-f0377f591ec0d868" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Full-function GPU with a vendor-described CUDA-compatible programming path and an integrated Nanhu V3 open-source RISC-V CPU. Normalized compute record: single, double, and mixed precision supported · The launch article describes supported precision classes and workloads but does not provide a normalized peak compute rate", "evidence_state": "official", "source_ids": [ "src-atlas-f0377f591ec0d868" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: high_bandwidth_discrete · high-bandwidth video memory; technology not stated · 112 GB · The vendor calls the memory high bandwidth but does not state memory technology, supplier, interface width, data rate, or numeric bandwidth.", "evidence_state": "official", "source_ids": [ "src-atlas-f0377f591ec0d868" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Single-card product boundary is stated; physical form factor, die count, package construction, assembly, and test path are not disclosed.", "evidence_state": "official", "source_ids": [ "src-atlas-f0377f591ec0d868" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: accelerator_card_family. Availability record: Innosilicon says Fenghua 3 was launched on September 22, 2025, demonstrated at the event, and covered by ecosystem agreements for future systems and clusters; this does not establish working units outside the demonstration, current shipments, installed clusters, or production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-f0377f591ec0d868" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: PyTorch · Triton · HIP and CUDA-compatible frameworks · OpenCL · DirectX 12 · Vulkan 1.2 · OpenGL 4.6 · UOS · Kylin · Windows · Android · vGPU virtualization. Launch demonstrations and ecosystem agreements are vendor evidence, not an independent benchmark, teardown, customer acceptance record, shipment receipt, or production audit.", "evidence_state": "official", "source_ids": [ "src-atlas-f0377f591ec0d868" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Innosilicon says Fenghua 3 was launched on September 22, 2025, demonstrated at the event, and covered by ecosystem agreements for future systems and clusters; this does not establish working units outside the demonstration, current shipments, installed clusters, or production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-f0377f591ec0d868" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "8cd7306d17874d6abcdf8dac96fdddd1e41e79f81a4b931078df8f8c69eed05b" }, { "id": "unisoc-t9100", "entity_id": "unisoc-t9100", "name": "UNISOC · T9100", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "UNISOC", "product": "T9100", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "source_refs": [ { "source_id": "src-atlas-7b79dc972ba8d16f", "url": "https://www.unisoc.com/en/product/SmartPhoneUS/T9100", "title": "UNISOC T9100 product page", "publisher": "UNISOC T9100 product page", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process foundry and lithography route", "die size and transistor count", "package, assembly, and test path", "sustained NPU performance and power", "named device and customer qualification", "shipment and production volume", "yield", "country-of-origin share" ], "technical_profile": { "entity_level": "mobile_ai_soc", "accelerator_type": "Integrated client or edge AI accelerator", "role": "5G smartphone SoC with an integrated NPU for on-device AI, imaging, and security workloads", "architecture": "Octa-core Arm CPU with one Cortex-A76 at 2.7 GHz, three Cortex-A76 cores at 2.3 GHz, four Cortex-A55 cores at 2.1 GHz, an Arm Mali-G57 MC4 GPU, and an integrated NPU", "process": { "node_nm": 6, "node_class": "advanced", "state": "official" }, "compute": [ { "value": 8, "unit": "TOPS", "precision": null, "scope": "UNISOC peak NPU claim; precision, power envelope, utilization, and sustained application rate are not stated", "state": "official" } ], "memory": { "strategy": "lpddr", "hbm_free": true, "type": "LPDDR4X", "capacity_gb": 32, "capacity_scope": "UNISOC states support for up to 32 GB LPDDR4X at 2133 MHz; this is an interface maximum, not a device configuration or shipment claim", "peak_bandwidth_tb_s": null, "bandwidth_scope": "UNISOC states LPDDR4X at 2133 MHz and eMMC 5.1 or UFS 3.1 storage support; bus width and memory bandwidth are not stated", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "No chip-to-chip or accelerator-fabric rate is stated on the reviewed product page", "state": "unknown" }, "package": { "description": "Mobile SoC; die, package, assembly, and test construction are not stated", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "access to mainstream AI training frameworks", "advanced model-compression tooling", "compatibility with more than 200 neural-network operators", "on-device AI development and debugging environment" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "UNISOC currently maintains a T9100 product page; the page does not establish a named device design win, customer qualification, shipment count, or current production volume" }, "independent_validation": "No independent teardown, device-level workload benchmark, named-customer qualification, shipment count, or production-yield receipt is normalized here." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "summary": "UNISOC is the named company for T9100 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Octa-core Arm CPU with one Cortex-A76 at 2.7 GHz, three Cortex-A76 cores at 2.3 GHz, four Cortex-A55 cores at 2.1 GHz, an Arm Mali-G57 MC4 GPU, and an integrated NPU. Normalized compute record: 8 TOPS · UNISOC peak NPU claim; precision, power envelope, utilization, and sustained application rate are not stated", "evidence_state": "official", "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 6 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · LPDDR4X · 32 GB · UNISOC states LPDDR4X at 2133 MHz and eMMC 5.1 or UFS 3.1 storage support; bus width and memory bandwidth are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: mobile_ai_soc. Availability record: UNISOC currently maintains a T9100 product page; the page does not establish a named device design win, customer qualification, shipment count, or current production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: access to mainstream AI training frameworks · advanced model-compression tooling · compatibility with more than 200 neural-network operators · on-device AI development and debugging environment. No independent teardown, device-level workload benchmark, named-customer qualification, shipment count, or production-yield receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: UNISOC currently maintains a T9100 product page; the page does not establish a named device design win, customer qualification, shipment count, or current production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "48949aa69ba84dbdead6411fbb4ddfcb02cb8bf7b6230665c52c2ab5c95448ad" }, { "id": "unisoc-a7870", "entity_id": "unisoc-a7870", "name": "UNISOC · A7870 series", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "UNISOC", "product": "A7870 series", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "source_refs": [ { "source_id": "src-atlas-841b4e6a06b99c11", "url": "https://www.unisoc.com/cn/product/SmartCar/A7870", "title": "UNISOC A7870 series product page", "publisher": "UNISOC A7870 series product page", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "independent foundry confirmation of the vendor-stated TSMC 6nm EUV label", "lithography tools, wafer facility, and production route", "die size and transistor count", "package, assembly, and test path", "sustained NPU and GPU performance and power", "named vehicle and customer qualification", "shipment and production volume", "yield", "country-of-origin share" ], "technical_profile": { "entity_level": "automotive_cockpit_soc_family", "accelerator_type": "Integrated automotive AI accelerator", "role": "Automotive smart-cockpit, cockpit-and-parking, cockpit-and-driving, and integrated T-Box processing", "architecture": "Octa-core Arm CPU with one Cortex-A76 at 2.7 GHz, three Cortex-A76 cores at 2.3 GHz, four Cortex-A55 cores at 2.1 GHz, a four-core NATT GPU at 850 MHz, and an IMG AX3596 NPU", "process": { "node_nm": 6, "node_class": "advanced", "state": "official" }, "compute": [ { "value": 8, "unit": "TOPS", "precision": null, "scope": "UNISOC peak IMG AX3596 NPU claim; precision, power envelope, utilization, and sustained application rate are not stated", "state": "official" }, { "value": 486.4, "unit": "GFLOPS", "precision": null, "scope": "UNISOC peak NATT GPU claim in the product overview; the parameter table rounds the same GPU claim to 486 GFLOPS", "state": "official" } ], "memory": { "strategy": "lpddr", "hbm_free": true, "type": "LPDDR4X", "capacity_gb": 32, "capacity_scope": "UNISOC states support for up to 32 GB LPDDR4X at 2133 MHz; this is an interface maximum, not a vehicle configuration", "peak_bandwidth_tb_s": null, "bandwidth_scope": "UNISOC states LPDDR4X at 2133 MHz and eMMC 5.1 or UFS 3.1 storage support; bus width and memory bandwidth are not stated", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "UNISOC lists PCIe 3.0, MIPI DSI, DisplayPort 1.4, CSI, UFS 3.1, I2S, and other system interfaces; lane topology, chip-to-chip fabric, and sustained rate are not stated", "state": "official" }, "package": { "description": "Automotive cockpit SoC family; die, package, assembly, and test construction are not stated", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "QNX", "Linux", "Android Automotive", "virtual-machine multi-baseline cockpit software", "integrated cockpit, parking, and T-Box solution path" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "UNISOC lists the A7870 series as an automotive-grade smart-cockpit processor and uses AEC-Q100 process-system and support wording; the reviewed page does not establish a named vehicle, customer qualification, mass-production start, or shipment volume" }, "independent_validation": "The UNISOC product page labels the process as 'TSMC 6nm EUV.' This packet records that exact label only as an official UNISOC claim, not as independent foundry, lithography-tool, wafer-production, facility, volume, or yield proof. No independent teardown, vehicle benchmark, or qualification receipt is normalized here." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-841b4e6a06b99c11" ], "summary": "UNISOC is the named company for A7870 series in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Octa-core Arm CPU with one Cortex-A76 at 2.7 GHz, three Cortex-A76 cores at 2.3 GHz, four Cortex-A55 cores at 2.1 GHz, a four-core NATT GPU at 850 MHz, and an IMG AX3596 NPU. Normalized compute record: 8 TOPS · UNISOC peak IMG AX3596 NPU claim; precision, power envelope, utilization, and sustained application rate are not stated | 486.4 GFLOPS · UNISOC peak NATT GPU claim in the product overview; the parameter table rounds the same GPU claim to 486 GFLOPS", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 6 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Lithography claim: UNISOC product page labels the process TSMC 6nm EUV. not independent foundry, scanner, facility, volume, yield, or China-developed DUV/EUV capability proof", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · LPDDR4X · 32 GB · UNISOC states LPDDR4X at 2133 MHz and eMMC 5.1 or UFS 3.1 storage support; bus width and memory bandwidth are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: automotive_cockpit_soc_family. Availability record: UNISOC lists the A7870 series as an automotive-grade smart-cockpit processor and uses AEC-Q100 process-system and support wording; the reviewed page does not establish a named vehicle, customer qualification, mass-production start, or shipment volume.", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: UNISOC lists PCIe 3.0, MIPI DSI, DisplayPort 1.4, CSI, UFS 3.1, I2S, and other system interfaces; lane topology, chip-to-chip fabric, and sustained rate are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: QNX · Linux · Android Automotive · virtual-machine multi-baseline cockpit software · integrated cockpit, parking, and T-Box solution path. The UNISOC product page labels the process as 'TSMC 6nm EUV.' This packet records that exact label only as an official UNISOC claim, not as independent foundry, lithography-tool, wafer-production, facility, volume, or yield proof. No independent teardown, vehicle benchmark, or qualification receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: UNISOC lists the A7870 series as an automotive-grade smart-cockpit processor and uses AEC-Q100 process-system and support wording; the reviewed page does not establish a named vehicle, customer qualification, mass-production start, or shipment volume.", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "cf585dc2c500ec1a6b65d7e481a2b94e452011d0e05c6f5dd3dde31755120525" }, { "id": "rockchip-rk3588", "entity_id": "rockchip-rk3588", "name": "Rockchip · RK3588", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Rockchip", "product": "RK3588", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "source_refs": [ { "source_id": "src-atlas-84d8ab12b1d2bf18", "url": "https://www.rock-chips.com/a/en/products/RK35_Series/2022/0926/1660.html", "title": "Rockchip RK3588 product page", "publisher": "Rockchip RK3588 product page", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process foundry and lithography route", "memory type, capacity, supplier, and bandwidth", "package, assembly, and test path", "precision-specific peak and sustained NPU performance", "power", "named board, device, and customer qualification", "shipment and production volume", "yield", "country-of-origin share" ], "technical_profile": { "entity_level": "edge_compute_soc", "accelerator_type": "Integrated client or edge AI accelerator", "role": "Edge-compute, multimedia, and machine-vision SoC with an integrated NPU", "architecture": "Quad-core Arm Cortex-A76 plus quad-core Cortex-A55 CPU, Arm Mali-G610 MC4 GPU, and triple-core NPU", "process": { "node_nm": 8, "node_class": "advanced", "state": "official" }, "compute": [ { "value": 6, "unit": "TOPS", "precision": "INT4 / INT8 / INT16 / FP16 / BF16 / TF32 support", "scope": "Rockchip aggregate NPU peak claim; the page lists supported arithmetic formats but does not map 6 TOPS to a specific precision or sustained workload", "state": "official" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "Memory interface, type, capacity, supplier, topology, and bandwidth are not stated on the reviewed official product page", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "Rockchip lists PCIe 3.0, PCIe 2.0, SATA 3.0, RGMII, USB Type-C, USB 3.1, and USB 2.0; lane topology and sustained rates are not stated and these are not a normalized accelerator fabric", "state": "official" }, "package": { "description": "Edge-compute SoC; die, package, assembly, and test construction are not stated", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "Android", "Linux", "OpenCL 1.1, 1.2, and 2.0 GPU support" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Rockchip currently maintains an RK3588 product page; that page does not establish named board or device availability, customer qualification, shipment count, or current production volume" }, "independent_validation": "No independent teardown, matched-workload benchmark, board-level acceptance record, shipment count, or production-yield receipt is normalized here." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "summary": "Rockchip is the named company for RK3588 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Quad-core Arm Cortex-A76 plus quad-core Cortex-A55 CPU, Arm Mali-G610 MC4 GPU, and triple-core NPU. Normalized compute record: 6 TOPS · INT4 / INT8 / INT16 / FP16 / BF16 / TF32 support · Rockchip aggregate NPU peak claim; the page lists supported arithmetic formats but does not map 6 TOPS to a specific precision or sustained workload", "evidence_state": "official", "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 8 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: edge_compute_soc. Availability record: Rockchip currently maintains an RK3588 product page; that page does not establish named board or device availability, customer qualification, shipment count, or current production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Rockchip lists PCIe 3.0, PCIe 2.0, SATA 3.0, RGMII, USB Type-C, USB 3.1, and USB 2.0; lane topology and sustained rates are not stated and these are not a normalized accelerator fabric.", "evidence_state": "official", "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Android · Linux · OpenCL 1.1, 1.2, and 2.0 GPU support. No independent teardown, matched-workload benchmark, board-level acceptance record, shipment count, or production-yield receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Rockchip currently maintains an RK3588 product page; that page does not establish named board or device availability, customer qualification, shipment count, or current production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "593b6315817f3c0223c9a4852d481114d75f6786c7a70c77183589de05420825" }, { "id": "allwinner-v853", "entity_id": "allwinner-v853", "name": "Allwinner · V853", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Allwinner", "product": "V853", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "source_refs": [ { "source_id": "src-atlas-93a0cdb1c7b5310c", "url": "https://www.allwinnertech.com/index.php?c=product&id=117", "title": "Allwinner V853 product page", "publisher": "Allwinner V853 product page", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "process node, foundry, and lithography route", "memory capacity, supplier, and bandwidth", "package, assembly, and test path", "sustained NPU performance and power", "named device and customer qualification", "shipment and production volume", "yield", "country-of-origin share" ], "technical_profile": { "entity_level": "edge_ai_vision_soc", "accelerator_type": "Integrated vision NPU", "role": "Low-power AI-vision SoC for smart cameras, access systems, dash cameras, and other embedded image-processing products", "architecture": "Arm Cortex-A7 CPU up to 1.2 GHz, RISC-V XuanTie E907 MCU up to 600 MHz, integrated NPU, Allwinner codec engine, and image-signal processor", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": 1, "unit": "TOPS", "precision": "INT8", "scope": "Allwinner peak NPU claim; power envelope, utilization, and sustained application rate are not stated", "state": "official" } ], "memory": { "strategy": "ddr", "hbm_free": true, "type": "DDR3 / DDR3L", "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "Allwinner lists DDR3 and DDR3L support plus SD 3.0, eMMC 5.0, SPI NOR, and SPI NAND storage; capacity, bus width, supplier, and bandwidth are not stated", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Allwinner lists USB, SMHC, GPIO, SPI, TWI, UART, GMAC, GPADC, PWM, and other peripheral interfaces; no accelerator-fabric rate is stated", "state": "official" }, "package": { "description": "Embedded vision SoC; die, package, assembly, and test construction are not stated", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "Tina Linux", "FreeRTOS" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Allwinner currently maintains a V853 product page and lists target applications; the examples are product positioning, not named design wins, customer qualification, shipment counts, or production-volume receipts" }, "independent_validation": "No independent teardown, device-level workload benchmark, named-customer qualification, shipment count, or production-yield receipt is normalized here." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "summary": "Allwinner is the named company for V853 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Arm Cortex-A7 CPU up to 1.2 GHz, RISC-V XuanTie E907 MCU up to 600 MHz, integrated NPU, Allwinner codec engine, and image-signal processor. Normalized compute record: 1 TOPS · INT8 · Allwinner peak NPU claim; power envelope, utilization, and sustained application rate are not stated", "evidence_state": "official", "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: ddr · DDR3 / DDR3L · Allwinner lists DDR3 and DDR3L support plus SD 3.0, eMMC 5.0, SPI NOR, and SPI NAND storage; capacity, bus width, supplier, and bandwidth are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: edge_ai_vision_soc. Availability record: Allwinner currently maintains a V853 product page and lists target applications; the examples are product positioning, not named design wins, customer qualification, shipment counts, or production-volume receipts.", "evidence_state": "official", "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Allwinner lists USB, SMHC, GPIO, SPI, TWI, UART, GMAC, GPADC, PWM, and other peripheral interfaces; no accelerator-fabric rate is stated.", "evidence_state": "official", "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Tina Linux · FreeRTOS. No independent teardown, device-level workload benchmark, named-customer qualification, shipment count, or production-yield receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Allwinner currently maintains a V853 product page and lists target applications; the examples are product positioning, not named design wins, customer qualification, shipment counts, or production-volume receipts.", "evidence_state": "official", "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "1c00d5f684763f01f743f274878c6822af4343e0f42303691c6c0e4d495ca50b" }, { "id": "nio-shenji-nx9031", "entity_id": "nio-shenji-nx9031", "name": "NIO · Shenji NX9031", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "NIO", "product": "Shenji NX9031", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-b5f9ed8a0678a62b" ], "source_refs": [ { "source_id": "src-atlas-b5f9ed8a0678a62b", "url": "https://www.nio.com/news/20250423001", "title": "NIO Auto Shanghai 2025 release", "publisher": "NIO Auto Shanghai 2025 release", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "compute architecture, precision-specific performance, and power", "process node, foundry, and lithography route", "memory type, capacity, supplier, and bandwidth", "package, assembly, and test path", "independent customer qualification and safety validation", "delivered ET9 count using the chip", "chip shipment and production volume", "yield and field reliability", "country-of-origin share" ], "technical_profile": { "entity_level": "automotive_smart_driving_chip", "accelerator_type": "Automotive smart-driving accelerator", "role": "In-vehicle compute for assisted and intelligent-driving features", "architecture": "NIO describes Shenji NX9031 as its proprietary automotive-grade smart-driving chip; the reviewed primary source does not disclose a normalized CPU, GPU, NPU, or tensor architecture", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": null, "scope": "No precision-specific peak or sustained compute rate is stated in the reviewed NIO release", "state": "unknown" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "Memory technology, capacity, topology, supplier, and bandwidth are not stated in the reviewed NIO release", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "Vehicle, sensor, die-to-die, and chip-to-chip interconnect topology and rates are not stated in the reviewed NIO release", "state": "unknown" }, "package": { "description": "Automotive smart-driving chip; die, package, assembly, and test construction are not stated", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "NIO assisted and intelligent-driving feature stack" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "NIO said ET9 deliveries began on March 29, 2025 and that two Shenji NX9031 chips were integrated into every ET9. This establishes vehicle integration at the stated launch, not delivered ET9 quantity, broader-model deployment, customer qualification, or chip production volume" }, "independent_validation": "The NIO release is a primary company receipt for the stated ET9 delivery start and two-chip configuration. It is not an independent teardown, workload, safety, field-reliability, unit-volume, supply-chain, or yield validation." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-b5f9ed8a0678a62b" ], "summary": "NIO is the named company for Shenji NX9031 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-b5f9ed8a0678a62b" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "NIO describes Shenji NX9031 as its proprietary automotive-grade smart-driving chip; the reviewed primary source does not disclose a normalized CPU, GPU, NPU, or tensor architecture. Normalized compute record: No precision-specific peak or sustained compute rate is stated in the reviewed NIO release", "evidence_state": "official", "source_ids": [ "src-atlas-b5f9ed8a0678a62b" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: automotive_smart_driving_chip. Availability record: NIO said ET9 deliveries began on March 29, 2025 and that two Shenji NX9031 chips were integrated into every ET9. This establishes vehicle integration at the stated launch, not delivered ET9 quantity, broader-model deployment, customer qualification, or chip production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-b5f9ed8a0678a62b" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: NIO assisted and intelligent-driving feature stack. The NIO release is a primary company receipt for the stated ET9 delivery start and two-chip configuration. It is not an independent teardown, workload, safety, field-reliability, unit-volume, supply-chain, or yield validation.", "evidence_state": "official", "source_ids": [ "src-atlas-b5f9ed8a0678a62b" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: NIO said ET9 deliveries began on March 29, 2025 and that two Shenji NX9031 chips were integrated into every ET9. This establishes vehicle integration at the stated launch, not delivered ET9 quantity, broader-model deployment, customer qualification, or chip production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-b5f9ed8a0678a62b" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "118cbf05ee64a1e06d0b3027b84f547c30ba5904daa9d9a19a8edaedddae03b0" }, { "id": "xpeng-turing-ai-chip", "entity_id": "xpeng-turing-ai-chip", "name": "XPeng · XPENG Turing chip", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "XPeng", "product": "XPENG Turing chip", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-7412383edddfacd7", "src-atlas-ca81e3660c91770b" ], "source_refs": [ { "source_id": "src-atlas-7412383edddfacd7", "url": "https://www.sec.gov/Archives/edgar/data/1810997/000119312524211475/d839068dex991.htm", "title": "XPeng August 2024 delivery release and Turing unveiling", "publisher": "XPeng August 2024 delivery release and Turing unveiling", "primary_status": "primary" }, { "source_id": "src-atlas-ca81e3660c91770b", "url": "https://www.sec.gov/Archives/edgar/data/1810997/000119312525082001/d898600d20f.htm", "title": "XPeng 2024 annual report processing-hardware risk disclosure", "publisher": "XPeng 2024 annual report processing-hardware risk disclosure", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "product-specific tape-out linkage and silicon validation", "compute architecture, precision-specific performance, and power", "process node and identity of the unnamed foundry supplier", "memory type, capacity, supplier, and bandwidth", "package, assembly, and test suppliers", "vehicle, robot, or eVOTL integration and customer qualification", "shipment and production volume", "yield", "country-of-origin share" ], "technical_profile": { "entity_level": "automotive_and_robotics_ai_chip_program", "accelerator_type": "Automotive, robotics, and eVOTL AI accelerator", "role": "Planned processing hardware for AI-defined vehicles, robots, and electric vertical-takeoff-and-landing aircraft", "architecture": "XPeng unveiled the Turing chip as part of its AI architecture and said it is applicable to robots, AI-defined cars, and eVOTLs; the reviewed product-specific release does not disclose a normalized accelerator architecture", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": null, "scope": "No product-specific peak or sustained compute rate is stated in the reviewed XPeng release and filing", "state": "unknown" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "Memory technology, capacity, topology, supplier, and bandwidth are not stated in the reviewed product-specific source", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "Vehicle, sensor, die-to-die, and chip-to-chip interconnect topology and rates are not stated in the reviewed product-specific source", "state": "unknown" }, "package": { "description": "AI-chip program for vehicles, robots, and eVOTLs; die, package, assembly, and test construction are not disclosed", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "XPENG AI architecture" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "XPeng unveiled the Turing chip on August 27, 2024. The reviewed sources do not establish a product-specific vehicle integration, customer qualification, completed production ramp, shipment, or current merchant-availability receipt" }, "independent_validation": "XPeng's separate 2024 annual filing says unnamed processing hardware taped out in August 2024 and warns that development, design wins, and production ramp may not succeed. This packet does not convert that generic filing language into Turing-specific production proof. No independent teardown or workload receipt is normalized here." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-7412383edddfacd7", "src-atlas-ca81e3660c91770b" ], "summary": "XPeng is the named company for XPENG Turing chip in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-7412383edddfacd7", "src-atlas-ca81e3660c91770b" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "XPeng unveiled the Turing chip as part of its AI architecture and said it is applicable to robots, AI-defined cars, and eVOTLs; the reviewed product-specific release does not disclose a normalized accelerator architecture. Normalized compute record: No product-specific peak or sustained compute rate is stated in the reviewed XPeng release and filing", "evidence_state": "official", "source_ids": [ "src-atlas-7412383edddfacd7", "src-atlas-ca81e3660c91770b" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: automotive_and_robotics_ai_chip_program. Availability record: XPeng unveiled the Turing chip on August 27, 2024. The reviewed sources do not establish a product-specific vehicle integration, customer qualification, completed production ramp, shipment, or current merchant-availability receipt.", "evidence_state": "official", "source_ids": [ "src-atlas-7412383edddfacd7", "src-atlas-ca81e3660c91770b" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: XPENG AI architecture. XPeng's separate 2024 annual filing says unnamed processing hardware taped out in August 2024 and warns that development, design wins, and production ramp may not succeed. This packet does not convert that generic filing language into Turing-specific production proof. No independent teardown or workload receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-7412383edddfacd7", "src-atlas-ca81e3660c91770b" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: XPeng unveiled the Turing chip on August 27, 2024. The reviewed sources do not establish a product-specific vehicle integration, customer qualification, completed production ramp, shipment, or current merchant-availability receipt.", "evidence_state": "official", "source_ids": [ "src-atlas-7412383edddfacd7", "src-atlas-ca81e3660c91770b" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "a9fe8896a99a9d62f13843dc6fdaf4a5cffeceb3a798df3245e1f80214336c67" }, { "id": "li-auto-mahe-m100", "entity_id": "li-auto-mahe-m100", "name": "Li Auto · MAHE M100", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Li Auto", "product": "MAHE M100", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": "China design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-0c85e440636bcc7e", "src-atlas-64ee46503634d134" ], "source_refs": [ { "source_id": "src-atlas-0c85e440636bcc7e", "url": "https://www.sec.gov/Archives/edgar/data/1791706/000110465926041705/li-20251231x20f.htm", "title": "Li Auto 2025 annual report", "publisher": "Li Auto 2025 annual report", "primary_status": "primary" }, { "source_id": "src-atlas-64ee46503634d134", "url": "https://www.sec.gov/Archives/edgar/data/1791706/000110465926067465/tm2615887d1_ex99-1.htm", "title": "Li Auto first-quarter 2026 results exhibit", "publisher": "Li Auto first-quarter 2026 results exhibit", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "compute architecture, precision-specific performance, and power", "process node, foundry, and lithography route", "memory type, capacity, supplier, and bandwidth", "package, assembly, and test path", "independent customer qualification and safety validation", "delivered Li L9 count using M100", "chip shipment and production volume", "yield and field reliability", "country-of-origin share" ], "technical_profile": { "entity_level": "automotive_autonomous_driving_inference_chip", "accelerator_type": "Automotive autonomous-driving inference accelerator", "role": "In-vehicle inference hardware designed to operate with Li Auto's autonomous-driving algorithms", "architecture": "Li Auto describes M100 as its proprietary autonomous-driving inference chip designed for synergy with its full-stack autonomous-driving algorithms; the reviewed filings do not disclose a normalized CPU, GPU, NPU, or tensor architecture", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": null, "scope": "No precision-specific peak or sustained compute rate is stated in the reviewed Li Auto filings", "state": "unknown" } ], "memory": { "strategy": "unknown", "hbm_free": null, "type": null, "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "Memory technology, capacity, topology, supplier, and bandwidth are not stated in the reviewed Li Auto filings", "state": "unknown" }, "interconnect": { "peak_gb_s": null, "scope": "Vehicle, sensor, die-to-die, and chip-to-chip interconnect topology and rates are not stated in the reviewed Li Auto filings", "state": "unknown" }, "package": { "description": "Automotive autonomous-driving inference chip; die, package, assembly, and test construction are not stated", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "Li Auto full-stack autonomous-driving algorithms", "MindVLA large model and 3D ViT Encoder in the all-new Li L9 vehicle configuration" ], "software_evidence_state": "official", "availability": { "state": "official", "status": "Li Auto said it launched and began deliveries of the all-new Li L9 in May 2026: the Ultra uses one proprietary MAHE M100 and the Livis uses two. This establishes the stated vehicle configuration and delivery start, not delivered-unit count, chip shipment volume, or independent vehicle qualification" }, "independent_validation": "Li Auto's SEC-filed results release is a primary company receipt for the stated May 2026 Li L9 launch, delivery start, and M100 configurations. It is not an independent teardown, matched driving-workload benchmark, safety, field-reliability, unit-volume, supply-chain, or yield validation." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-0c85e440636bcc7e", "src-atlas-64ee46503634d134" ], "summary": "Li Auto is the named company for MAHE M100 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-0c85e440636bcc7e", "src-atlas-64ee46503634d134" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Li Auto describes M100 as its proprietary autonomous-driving inference chip designed for synergy with its full-stack autonomous-driving algorithms; the reviewed filings do not disclose a normalized CPU, GPU, NPU, or tensor architecture. Normalized compute record: No precision-specific peak or sustained compute rate is stated in the reviewed Li Auto filings", "evidence_state": "official", "source_ids": [ "src-atlas-0c85e440636bcc7e", "src-atlas-64ee46503634d134" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: automotive_autonomous_driving_inference_chip. Availability record: Li Auto said it launched and began deliveries of the all-new Li L9 in May 2026: the Ultra uses one proprietary MAHE M100 and the Livis uses two. This establishes the stated vehicle configuration and delivery start, not delivered-unit count, chip shipment volume, or independent vehicle qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-0c85e440636bcc7e", "src-atlas-64ee46503634d134" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Li Auto full-stack autonomous-driving algorithms · MindVLA large model and 3D ViT Encoder in the all-new Li L9 vehicle configuration. Li Auto's SEC-filed results release is a primary company receipt for the stated May 2026 Li L9 launch, delivery start, and M100 configurations. It is not an independent teardown, matched driving-workload benchmark, safety, field-reliability, unit-volume, supply-chain, or yield validation.", "evidence_state": "official", "source_ids": [ "src-atlas-0c85e440636bcc7e", "src-atlas-64ee46503634d134" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Li Auto said it launched and began deliveries of the all-new Li L9 in May 2026: the Ultra uses one proprietary MAHE M100 and the Livis uses two. This establishes the stated vehicle configuration and delivery start, not delivered-unit count, chip shipment volume, or independent vehicle qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-0c85e440636bcc7e", "src-atlas-64ee46503634d134" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "747270a3863d40b8042dd3425e3c0dc240e5dc2653f583b8d673af5c36973612" }, { "id": "nvidia-blackwell-b200", "entity_id": "nvidia-blackwell-b200", "name": "NVIDIA · Blackwell B200", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "NVIDIA", "product": "Blackwell B200", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "source_refs": [ { "source_id": "src-atlas-24203513100c1d6d", "url": "https://nvidianews.nvidia.com/news/nvidia-blackwell-platform-arrives-to-power-a-new-era-of-computing", "title": "NVIDIA Blackwell platform announcement", "publisher": "NVIDIA Blackwell platform announcement", "primary_status": "primary" }, { "source_id": "src-atlas-b8ff78c83d18e130", "url": "https://www.nvidia.com/en-us/data-center/dgx-b200/", "title": "NVIDIA DGX B200", "publisher": "NVIDIA DGX B200", "primary_status": "primary" }, { "source_id": "src-atlas-cc28745ad0f7c9e4", "url": "https://docs.nvidia.com/enterprise-reference-architectures/hgx-ai-factory/latest/components.html", "title": "NVIDIA HGX B200 specifications", "publisher": "NVIDIA HGX B200 specifications", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "HBM manufacturer by lot", "package and substrate supplier", "standalone B200 channel availability", "shipment volume", "sustained accepted-workload economics" ], "technical_profile": { "entity_level": "datacenter_accelerator_gpu", "accelerator_type": "GPU/GPGPU", "role": "Datacenter training and inference GPU", "architecture": "Blackwell dual-die Tensor Core GPU used in HGX and DGX B200 systems", "process": { "node_nm": 4, "node_class": "advanced", "scope": "NVIDIA states that Blackwell uses a custom TSMC 4NP process", "state": "official" }, "compute": [ { "value": null, "unit": null, "precision": "FP4 through FP64", "scope": "Peak rate depends on precision, sparsity, and HGX or DGX configuration", "state": "official" } ], "memory": { "strategy": "hbm", "hbm_free": false, "type": "HBM3e", "capacity_gb": 180, "peak_bandwidth_tb_s": 8, "bandwidth_scope": "B200 SXM GPU specification; do not read the value as rack aggregate bandwidth", "state": "official" }, "interconnect": { "peak_gb_s": 1800, "scope": "Fifth-generation NVLink per B200 GPU in HGX and DGX; topology and aggregate rate depend on the system", "state": "official" }, "package": { "description": "Two reticle-sized Blackwell dies connected by a company-stated 10 TB/s die-to-die link in one HBM-equipped accelerator package; packaging supplier is not named", "state": "official" }, "power": { "value": 1000, "unit": "W", "scope": "Configurable maximum per B200 GPU in the reviewed HGX reference; not server, rack, or wall power", "state": "official" }, "system_hierarchy": [ "B200 GPU", "GB200 Grace Blackwell Superchip", "GB200 NVL72 rack" ], "specification_maturity": null, "software": [ "CUDA", "TensorRT-LLM", "NCCL", "Triton" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "NVIDIA documents current HGX and DGX B200 systems; this does not establish unrestricted standalone-GPU availability or shipment volume" }, "independent_validation": "Specifications and availability are NVIDIA claims. Workload throughput, usable bandwidth, power, acceptance, and delivered configuration require system-specific receipts." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "summary": "NVIDIA is the named company for Blackwell B200 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Blackwell dual-die Tensor Core GPU used in HGX and DGX B200 systems. Normalized compute record: FP4 through FP64 · Peak rate depends on precision, sparsity, and HGX or DGX configuration", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-24203513100c1d6d" ], "summary": "Process claim: 4 nm · advanced · official. Named supplier record: NVIDIA states that Blackwell GPUs are manufactured on a custom TSMC 4NP process.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "This establishes the named foundry and process for the Blackwell GPU. It does not identify the facility, wafer lot, masks, equipment, materials, yield, package, assembly site, shipment volume, or every component in an HGX or DGX system." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM3e · 180 GB · 8 TB/s peak · B200 SXM GPU specification; do not read the value as rack aggregate bandwidth.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Two reticle-sized Blackwell dies connected by a company-stated 10 TB/s die-to-die link in one HBM-equipped accelerator package; packaging supplier is not named.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_gpu. Availability record: NVIDIA documents current HGX and DGX B200 systems; this does not establish unrestricted standalone-GPU availability or shipment volume.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 1800 GB/s peak · Fifth-generation NVLink per B200 GPU in HGX and DGX; topology and aggregate rate depend on the system.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Power record: 1000 W · Configurable maximum per B200 GPU in the reviewed HGX reference; not server, rack, or wall power.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CUDA · TensorRT-LLM · NCCL · Triton. Specifications and availability are NVIDIA claims. Workload throughput, usable bandwidth, power, acceptance, and delivered configuration require system-specific receipts.", "evidence_state": "derived", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: NVIDIA documents current HGX and DGX B200 systems; this does not establish unrestricted standalone-GPU availability or shipment volume.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "ff0615a260f45bbe83382cdb0017d06253ccc6adde72d786ece051a4b5e12a87" }, { "id": "nvidia-blackwell-b300", "entity_id": "nvidia-blackwell-b300", "name": "NVIDIA · Blackwell Ultra B300", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "NVIDIA", "product": "Blackwell Ultra B300", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "source_refs": [ { "source_id": "src-atlas-7f9540f347b9ce35", "url": "https://www.nvidia.com/en-us/data-center/dgx-b300/", "title": "NVIDIA DGX B300", "publisher": "NVIDIA DGX B300", "primary_status": "primary" }, { "source_id": "src-atlas-9f9d8f06c94b8ace", "url": "https://docs.nvidia.com/dgx/dgxb300-user-guide/dgxb300-user-guide.pdf", "title": "NVIDIA DGX B300 user guide", "publisher": "NVIDIA DGX B300 user guide", "primary_status": "primary" }, { "source_id": "src-atlas-cc28745ad0f7c9e4", "url": "https://docs.nvidia.com/enterprise-reference-architectures/hgx-ai-factory/latest/components.html", "title": "NVIDIA HGX B200 specifications", "publisher": "NVIDIA HGX B200 specifications", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "B300-specific process and foundry", "HBM manufacturer by lot", "package and substrate supplier", "standalone B300 channel availability", "shipment volume", "sustained accepted-workload economics" ], "technical_profile": { "entity_level": "datacenter_accelerator_gpu", "accelerator_type": "GPU/GPGPU", "role": "Datacenter training and inference GPU", "architecture": "Blackwell Ultra Tensor Core GPU used in HGX and DGX B300 systems", "process": { "node_nm": null, "node_class": "advanced", "scope": "The reviewed B300 sources do not state a B300-specific process or foundry", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": "FP4 through FP64", "scope": "Peak rate depends on precision, sparsity, and HGX or DGX configuration", "state": "official" } ], "memory": { "strategy": "hbm", "hbm_free": false, "type": "HBM3e", "capacity_gb": 288, "peak_bandwidth_tb_s": 8, "bandwidth_scope": "Per B300 GPU; do not read the value as eight-GPU or rack aggregate bandwidth", "state": "official" }, "interconnect": { "peak_gb_s": 1800, "scope": "Fifth-generation NVLink per B300 GPU in HGX and DGX; topology and aggregate rate depend on the system", "state": "official" }, "package": { "description": "SXM accelerator with HBM3e; the reviewed official sources do not establish the B300 package technology, substrate, foundry, or packaging supplier", "state": "official" }, "power": { "value": 1100, "unit": "W", "scope": "Configurable maximum per B300 GPU in the reviewed HGX reference; GB300 configurations differ and this is not server, rack, or wall power", "state": "official" }, "system_hierarchy": [ "B300 GPU", "GB300 module or Superchip scope", "GB300 NVL72 rack" ], "specification_maturity": null, "software": [ "CUDA", "TensorRT-LLM", "NCCL", "Triton" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "NVIDIA describes DGX B300 as available and documents first-customer support; this remains a vendor availability claim" }, "independent_validation": "Specifications and availability are NVIDIA claims. Production volume, customer acceptance, sustained collectives, and accepted-workload economics remain separate receipts." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "summary": "NVIDIA is the named company for Blackwell Ultra B300 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Blackwell Ultra Tensor Core GPU used in HGX and DGX B300 systems. Normalized compute record: FP4 through FP64 · Peak rate depends on precision, sparsity, and HGX or DGX configuration", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM3e · 288 GB · 8 TB/s peak · Per B300 GPU; do not read the value as eight-GPU or rack aggregate bandwidth.", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: SXM accelerator with HBM3e; the reviewed official sources do not establish the B300 package technology, substrate, foundry, or packaging supplier.", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_gpu. Availability record: NVIDIA describes DGX B300 as available and documents first-customer support; this remains a vendor availability claim.", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 1800 GB/s peak · Fifth-generation NVLink per B300 GPU in HGX and DGX; topology and aggregate rate depend on the system.", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Power record: 1100 W · Configurable maximum per B300 GPU in the reviewed HGX reference; GB300 configurations differ and this is not server, rack, or wall power.", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CUDA · TensorRT-LLM · NCCL · Triton. Specifications and availability are NVIDIA claims. Production volume, customer acceptance, sustained collectives, and accepted-workload economics remain separate receipts.", "evidence_state": "derived", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: NVIDIA describes DGX B300 as available and documents first-customer support; this remains a vendor availability claim.", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "5d513d9eae2d6ce43fe6c00d0e3528e40206b261ccfa23515dad2376eaf9bf5f" }, { "id": "nvidia-gb200-nvl72", "entity_id": "nvidia-gb200-nvl72", "name": "NVIDIA · GB200 NVL72", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "NVIDIA", "product": "GB200 NVL72", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "source_refs": [ { "source_id": "src-atlas-24203513100c1d6d", "url": "https://nvidianews.nvidia.com/news/nvidia-blackwell-platform-arrives-to-power-a-new-era-of-computing", "title": "NVIDIA Blackwell platform announcement", "publisher": "NVIDIA Blackwell platform announcement", "primary_status": "primary" }, { "source_id": "src-atlas-4524551d9aa90859", "url": "https://docs.nvidia.com/dgx/dgxgb200-user-guide/hardware.html", "title": "NVIDIA DGX GB200 hardware guide", "publisher": "NVIDIA DGX GB200 hardware guide", "primary_status": "primary" }, { "source_id": "src-atlas-6499ff99cb5c9ee3", "url": "https://www.nvidia.com/en-us/data-center/gb200-nvl72/", "title": "NVIDIA GB200 NVL72", "publisher": "NVIDIA GB200 NVL72", "primary_status": "primary" }, { "source_id": "src-atlas-fd28c3b1a54de001", "url": "https://docs.nvidia.com/multi-node-nvlink-systems/index.html", "title": "NVIDIA multi-node NVLink documentation", "publisher": "NVIDIA multi-node NVLink documentation", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "HBM and LPDDR manufacturers by rack", "package and substrate suppliers", "OEM supplier allocation", "shipment and installed-base totals", "delivered rack power", "sustained collective efficiency" ], "technical_profile": { "entity_level": "rack_scale_accelerator_system", "accelerator_type": "GPU/GPGPU", "role": "Liquid-cooled rack-scale training and inference system", "architecture": "Grace Blackwell rack with 72 Blackwell GPUs and 36 Grace CPUs in one NVLink domain", "process": { "node_nm": 4, "node_class": "advanced", "scope": "The rack contains Blackwell GPUs that NVIDIA states use custom TSMC 4NP; this is not a process claim for every component in the rack", "state": "official" }, "compute": [ { "value": null, "unit": null, "precision": "multiple", "scope": "Rack aggregate and workload result depend on precision, sparsity, software, cooling, and utilization", "state": "official" } ], "memory": { "strategy": "hbm-plus-lpddr", "hbm_free": false, "type": "HBM3e GPU memory plus LPDDR5X CPU memory", "capacity_gb": 13400, "peak_bandwidth_tb_s": 576, "bandwidth_scope": "Up-to rack aggregate HBM3e capacity and GPU-memory bandwidth; not per-GPU bandwidth", "state": "official" }, "interconnect": { "peak_gb_s": 130000, "scope": "Rack aggregate fifth-generation NVLink across 72 GPUs; direction, collectives, and delivered topology still matter", "state": "official" }, "package": { "description": "An NVL72 rack with 18 compute trays, nine NVLink switch trays, power shelves, bus bars, and liquid-cooling manifolds; it is not one chip package", "state": "official" }, "power": { "value": null, "unit": null, "scope": "Liquid-cooled rack; the reviewed record does not normalize delivered rack wall power, facility overhead, or cooling supplier", "state": "official" }, "system_hierarchy": [ "B200 GPU", "GB200 Grace Blackwell Superchip", "GB200 NVL72 rack" ], "specification_maturity": null, "software": [ "CUDA", "NCCL", "TensorRT-LLM", "NVIDIA AI Enterprise" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "NVIDIA documents deployed and supported GB200 rack systems; shipment and installed-base totals are not established here" }, "independent_validation": "Rack power, cooling, fabric utilization, model quality, and accepted workload throughput must be measured together." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "summary": "NVIDIA is the named company for GB200 NVL72 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Grace Blackwell rack with 72 Blackwell GPUs and 36 Grace CPUs in one NVLink domain. Normalized compute record: multiple · Rack aggregate and workload result depend on precision, sparsity, software, cooling, and utilization", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-6499ff99cb5c9ee3" ], "summary": "Process claim: 4 nm · advanced · official. Named supplier record: GB200 NVL72 contains Blackwell GPUs, and NVIDIA states that Blackwell GPUs are manufactured on custom TSMC 4NP.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "This is a component-level foundry relationship for the Blackwell GPUs inside GB200. It is not a foundry claim for Grace CPUs, switches, memory, power, cooling, or every component in the rack, and it does not establish facility, lot, yield, or volume." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm-plus-lpddr · HBM3e GPU memory plus LPDDR5X CPU memory · 13400 GB · 576 TB/s peak · Up-to rack aggregate HBM3e capacity and GPU-memory bandwidth; not per-GPU bandwidth.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: An NVL72 rack with 18 compute trays, nine NVLink switch trays, power shelves, bus bars, and liquid-cooling manifolds; it is not one chip package.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: rack_scale_accelerator_system. Availability record: NVIDIA documents deployed and supported GB200 rack systems; shipment and installed-base totals are not established here.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 130000 GB/s peak · Rack aggregate fifth-generation NVLink across 72 GPUs; direction, collectives, and delivered topology still matter.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Power record: Liquid-cooled rack; the reviewed record does not normalize delivered rack wall power, facility overhead, or cooling supplier.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CUDA · NCCL · TensorRT-LLM · NVIDIA AI Enterprise. Rack power, cooling, fabric utilization, model quality, and accepted workload throughput must be measured together.", "evidence_state": "derived", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: NVIDIA documents deployed and supported GB200 rack systems; shipment and installed-base totals are not established here.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "19dc1240ce96b3c21e432d0550f786dd74fb680faea0903fdf33e4c3d032e98d" }, { "id": "nvidia-gb300-nvl72", "entity_id": "nvidia-gb300-nvl72", "name": "NVIDIA · GB300 NVL72", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "NVIDIA", "product": "GB300 NVL72", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "source_refs": [ { "source_id": "src-atlas-127d4157899a1ec9", "url": "https://www.nvidia.com/en-us/data-center/gb300-nvl72/", "title": "NVIDIA GB300 NVL72", "publisher": "NVIDIA GB300 NVL72", "primary_status": "primary" }, { "source_id": "src-atlas-748d12a572b96feb", "url": "https://docs.nvidia.com/mission-control/docs/systems-quick-start-guide/2.1.0/nmc-release-notes.html", "title": "NVIDIA Mission Control release notes", "publisher": "NVIDIA Mission Control release notes", "primary_status": "primary" }, { "source_id": "src-atlas-818f53dfd97ac373", "url": "https://news.skhynix.com/en/gtc-2026-ai-partnership/", "title": "SK hynix GTC 2026 NVIDIA memory disclosure", "publisher": "SK hynix GTC 2026 NVIDIA memory disclosure", "primary_status": "primary" }, { "source_id": "src-atlas-b2168e082011867c", "url": "https://www.nvidia.com/en-us/data-center/dgx-gb300/", "title": "NVIDIA DGX GB300", "publisher": "NVIDIA DGX GB300", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "B300-specific process and foundry", "complete HBM and LPDDR supplier set and rack-level lot allocation", "package and substrate suppliers", "production and shipment volume", "delivered rack power", "sustained collective efficiency" ], "technical_profile": { "entity_level": "rack_scale_accelerator_system", "accelerator_type": "GPU/GPGPU", "role": "Liquid-cooled rack-scale training and inference system", "architecture": "Grace Blackwell Ultra rack with 72 B300 GPUs and 36 Grace CPUs in one NVLink domain", "process": { "node_nm": null, "node_class": "advanced", "scope": "The reviewed official sources do not state a B300-specific process or foundry for the rack's GPUs", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": "multiple", "scope": "Rack aggregate and workload result depend on precision, sparsity, software, cooling, and utilization", "state": "official" } ], "memory": { "strategy": "hbm-plus-lpddr", "hbm_free": false, "type": "HBM3e GPU memory plus LPDDR5X CPU memory", "capacity_gb": 20000, "peak_bandwidth_tb_s": 576, "bandwidth_scope": "Company-stated rack HBM3e capacity and aggregate GPU-memory bandwidth; NVIDIA separately states 37 TB of fast memory including CPU memory", "state": "official" }, "interconnect": { "peak_gb_s": 130000, "scope": "Rack aggregate fifth-generation NVLink across 72 GPUs; ConnectX-8 scale-out and delivered topology remain system-level questions", "state": "official" }, "package": { "description": "An NVL72 rack-scale system, not one chip package; the reviewed official sources do not establish component package, substrate, or supplier provenance", "state": "official" }, "power": { "value": null, "unit": null, "scope": "Liquid-cooled rack; the reviewed record does not normalize delivered rack wall power, facility overhead, or cooling supplier", "state": "official" }, "system_hierarchy": [ "B300 GPU", "GB300 module or Superchip scope", "GB300 NVL72 rack" ], "specification_maturity": null, "software": [ "CUDA", "NCCL", "TensorRT-LLM", "NVIDIA AI Enterprise" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "NVIDIA labels GB300 NVL72 available and documents first-customer support; this remains a vendor availability claim" }, "independent_validation": "Shipment volume, customer acceptance, delivered rack configuration, power, cooling, fabric utilization, and accepted workload throughput remain separate receipts." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "summary": "NVIDIA is the named company for GB300 NVL72 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Grace Blackwell Ultra rack with 72 B300 GPUs and 36 Grace CPUs in one NVLink domain. Normalized compute record: multiple · Rack aggregate and workload result depend on precision, sparsity, software, cooling, and utilization", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-818f53dfd97ac373" ], "summary": "Memory record: hbm-plus-lpddr · HBM3e GPU memory plus LPDDR5X CPU memory · 20000 GB · 576 TB/s peak · Company-stated rack HBM3e capacity and aggregate GPU-memory bandwidth; NVIDIA separately states 37 TB of fast memory including CPU memory. Named supplier record: SK hynix states that a live NVIDIA GB300 GPU module at GTC 2026 used its HBM3e.", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "This establishes at least one company-reported GB300 module integration. It does not prove exclusivity, the supplier mix or lot allocation for every rack, HBM capacity by lot, rack shipment volume, customer acceptance, or the LPDDR supplier." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: An NVL72 rack-scale system, not one chip package; the reviewed official sources do not establish component package, substrate, or supplier provenance.", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: rack_scale_accelerator_system. Availability record: NVIDIA labels GB300 NVL72 available and documents first-customer support; this remains a vendor availability claim.", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 130000 GB/s peak · Rack aggregate fifth-generation NVLink across 72 GPUs; ConnectX-8 scale-out and delivered topology remain system-level questions.", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Power record: Liquid-cooled rack; the reviewed record does not normalize delivered rack wall power, facility overhead, or cooling supplier.", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CUDA · NCCL · TensorRT-LLM · NVIDIA AI Enterprise. Shipment volume, customer acceptance, delivered rack configuration, power, cooling, fabric utilization, and accepted workload throughput remain separate receipts.", "evidence_state": "derived", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: NVIDIA labels GB300 NVL72 available and documents first-customer support; this remains a vendor availability claim.", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "dbb5373ae1b0e1585e17061256d530aea109efd74ac5e6a055da9a443391c276" }, { "id": "nvidia-vera-rubin-nvl72", "entity_id": "nvidia-vera-rubin-nvl72", "name": "NVIDIA · Vera Rubin NVL72", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "NVIDIA", "product": "Vera Rubin NVL72", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "source_refs": [ { "source_id": "src-atlas-169b39cc7f09274c", "url": "https://nvidianews.nvidia.com/news/rubin-platform-ai-supercomputer", "title": "NVIDIA Rubin platform announcement", "publisher": "NVIDIA Rubin platform announcement", "primary_status": "primary" }, { "source_id": "src-atlas-432bd9e208d49df7", "url": "https://nvidianews.nvidia.com/news/vera-rubin-full-production-agentic-ai-factory", "title": "NVIDIA Vera Rubin production release", "publisher": "NVIDIA Vera Rubin production release", "primary_status": "primary" }, { "source_id": "src-atlas-4c164468c1f3f0eb", "url": "https://www.nvidia.com/en-us/data-center/nvlink/", "title": "NVIDIA NVLink 6", "publisher": "NVIDIA NVLink 6", "primary_status": "primary" }, { "source_id": "src-atlas-5fed51a077e8474e", "url": "https://www.nvidia.com/en-us/data-center/vera-rubin-nvl72/", "title": "NVIDIA Vera Rubin NVL72", "publisher": "NVIDIA Vera Rubin NVL72", "primary_status": "primary" }, { "source_id": "src-atlas-818f53dfd97ac373", "url": "https://news.skhynix.com/en/gtc-2026-ai-partnership/", "title": "SK hynix GTC 2026 NVIDIA memory disclosure", "publisher": "SK hynix GTC 2026 NVIDIA memory disclosure", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "final non-preliminary specifications", "process and foundry", "complete HBM4 and LPDDR supplier set and lot allocation", "package and substrate suppliers", "independently verified customer shipments", "customer acceptance", "exact general-availability date" ], "technical_profile": { "entity_level": "rack_scale_ai_platform", "accelerator_type": "GPU/GPGPU", "role": "Rack-scale AI platform with preliminary published specifications", "architecture": "Vera Rubin rack with 72 Rubin GPUs, 36 Vera CPUs, NVLink 6, ConnectX-9, BlueField-4, and Quantum-X800 or Spectrum-X networking", "process": { "node_nm": null, "node_class": "roadmap", "scope": "The reviewed NVIDIA sources do not name the Rubin or Vera process node or foundry", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": "multiple", "scope": "NVIDIA labels the published rack specifications preliminary and up-to; no independent production-system result is claimed", "state": "official" } ], "memory": { "strategy": "hbm-plus-lpddr", "hbm_free": false, "type": "HBM4 GPU memory plus LPDDR5X CPU memory", "capacity_gb": 20700, "peak_bandwidth_tb_s": 1580, "bandwidth_scope": "Preliminary up-to rack HBM4 capacity and aggregate bandwidth; per Rubin GPU NVIDIA states 288 GB and 22 TB/s", "state": "official" }, "interconnect": { "peak_gb_s": 260000, "scope": "Preliminary rack NVLink 6 switch bandwidth; NVIDIA states 3.6 TB/s per GPU and ConnectX-9 scale-out at 1.6 Tb/s per GPU", "state": "official" }, "package": { "description": "Preliminary NVL72 rack platform; final component package, substrate, assembly, and supplier details are not established", "state": "unknown" }, "power": { "value": null, "unit": null, "scope": "NVIDIA states 100% liquid cooling and a preliminary 45°C warm-water inlet condition; delivered rack wall power, facility overhead, and cooling supplier are not normalized", "state": "official" }, "system_hierarchy": [ "Rubin GPU", "Vera Rubin Superchip", "Vera Rubin NVL72 rack", "Vera Rubin POD platform" ], "specification_maturity": "preliminary", "software": [ "CUDA", "NCCL", "TensorRT-LLM", "NVIDIA AI Enterprise" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "NVIDIA says Rubin is in full production and partner systems are planned for the second half of 2026; the product page still labels specifications preliminary, so broad customer availability is not claimed" }, "independent_validation": "No independently verified customer shipment, accepted rack, final specification, or production workload receipt is claimed." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "summary": "NVIDIA is the named company for Vera Rubin NVL72 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Vera Rubin rack with 72 Rubin GPUs, 36 Vera CPUs, NVLink 6, ConnectX-9, BlueField-4, and Quantum-X800 or Spectrum-X networking. Normalized compute record: multiple · NVIDIA labels the published rack specifications preliminary and up-to; no independent production-system result is claimed", "evidence_state": "official", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "partial", "supplier_relationship_source_ids": [ "src-atlas-818f53dfd97ac373" ], "summary": "Memory record: hbm-plus-lpddr · HBM4 GPU memory plus LPDDR5X CPU memory · 20700 GB · 1580 TB/s peak · Preliminary up-to rack HBM4 capacity and aggregate bandwidth; per Rubin GPU NVIDIA states 288 GB and 22 TB/s. Named supplier record: SK hynix states that its HBM4 is slated to be adopted in NVIDIA Rubin and displayed the product on a Vera Rubin module at GTC 2026.", "evidence_state": "official", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "This is a company-stated planned adoption and demonstration, not proof of exclusivity, final supplier allocation, shipped production lots, customer acceptance, yield, volume, or the complete HBM4 and LPDDR supplier set." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: rack_scale_ai_platform. Availability record: NVIDIA says Rubin is in full production and partner systems are planned for the second half of 2026; the product page still labels specifications preliminary, so broad customer availability is not claimed.", "evidence_state": "official", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 260000 GB/s peak · Preliminary rack NVLink 6 switch bandwidth; NVIDIA states 3.6 TB/s per GPU and ConnectX-9 scale-out at 1.6 Tb/s per GPU.", "evidence_state": "official", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Power record: NVIDIA states 100% liquid cooling and a preliminary 45°C warm-water inlet condition; delivered rack wall power, facility overhead, and cooling supplier are not normalized.", "evidence_state": "official", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CUDA · NCCL · TensorRT-LLM · NVIDIA AI Enterprise. No independently verified customer shipment, accepted rack, final specification, or production workload receipt is claimed.", "evidence_state": "derived", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: NVIDIA says Rubin is in full production and partner systems are planned for the second half of 2026; the product page still labels specifications preliminary, so broad customer availability is not claimed.", "evidence_state": "official", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "07848f483f8a93695c8082f415a9f8d51d272b0eab85c52755692b27756b2004" }, { "id": "amd-instinct-mi300x", "entity_id": "amd-instinct-mi300x", "name": "AMD · Instinct MI300X", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "AMD", "product": "Instinct MI300X", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "source_refs": [ { "source_id": "src-atlas-27a1b24d9b9d0525", "url": "https://www.amd.com/en/products/accelerators/instinct/mi300/mi300x.html", "title": "AMD Instinct MI300X", "publisher": "AMD Instinct MI300X", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "HBM supplier and lot allocation", "package and assembly suppliers", "shipment volume", "sustained workload bandwidth", "customer-specific economics" ], "technical_profile": { "entity_level": "datacenter_accelerator_gpu", "accelerator_type": "GPU/GPGPU", "role": "Datacenter training and inference GPU", "architecture": "CDNA 3 chiplet accelerator", "process": { "node_nm": 5, "node_class": "advanced", "scope": "AMD lists TSMC 5 nm and 6 nm process technology for MI300X; this does not identify facilities or lots", "state": "official" }, "compute": [ { "value": null, "unit": null, "precision": "FP8 through FP64", "scope": "Precision and matrix mode dependent", "state": "official" } ], "memory": { "strategy": "hbm", "hbm_free": false, "type": "HBM3", "capacity_gb": 192, "peak_bandwidth_tb_s": 5.3, "bandwidth_scope": "Per MI300X accelerator peak", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Infinity Fabric; topology and delivered rate depend on the system", "state": "official" }, "package": { "description": "OAM accelerator with chiplets and HBM3; package, substrate, and assembly suppliers are not identified here", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "ROCm", "HIP", "RCCL", "MIGraphX" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "AMD publishes MI300X as a current product; supplier allocation, shipment volume, and cloud availability remain separate records" }, "independent_validation": "Use model-, software-version-, system-, and workload-specific tests." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "summary": "AMD is the named company for Instinct MI300X in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "CDNA 3 chiplet accelerator. Normalized compute record: FP8 through FP64 · Precision and matrix mode dependent", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 5 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM3 · 192 GB · 5.3 TB/s peak · Per MI300X accelerator peak.", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: OAM accelerator with chiplets and HBM3; package, substrate, and assembly suppliers are not identified here.", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_gpu. Availability record: AMD publishes MI300X as a current product; supplier allocation, shipment volume, and cloud availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Infinity Fabric; topology and delivered rate depend on the system.", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: ROCm · HIP · RCCL · MIGraphX. Use model-, software-version-, system-, and workload-specific tests.", "evidence_state": "derived", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: AMD publishes MI300X as a current product; supplier allocation, shipment volume, and cloud availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "ca4333e0ca6367da46284d27e27fa9cd1548e4c8b8b9d79bfe91953f7734b986" }, { "id": "amd-instinct-mi325x", "entity_id": "amd-instinct-mi325x", "name": "AMD · Instinct MI325X", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "AMD", "product": "Instinct MI325X", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-4188c64ef166f594" ], "source_refs": [ { "source_id": "src-atlas-4188c64ef166f594", "url": "https://www.amd.com/en/products/accelerators/instinct/mi300/mi325x.html", "title": "AMD Instinct MI325X", "publisher": "AMD Instinct MI325X", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "HBM supplier and lot allocation", "package and assembly suppliers", "shipment volume", "sustained workload bandwidth", "customer-specific economics" ], "technical_profile": { "entity_level": "datacenter_accelerator_gpu", "accelerator_type": "GPU/GPGPU", "role": "Datacenter training and inference GPU", "architecture": "CDNA 3 chiplet accelerator", "process": { "node_nm": 5, "node_class": "advanced", "scope": "AMD lists TSMC 5 nm and 6 nm process technology for MI325X; this does not identify facilities or lots", "state": "official" }, "compute": [ { "value": null, "unit": null, "precision": "FP8 through FP64", "scope": "Precision and matrix mode dependent", "state": "official" } ], "memory": { "strategy": "hbm", "hbm_free": false, "type": "HBM3e", "capacity_gb": 256, "peak_bandwidth_tb_s": 6, "bandwidth_scope": "Per MI325X accelerator peak", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Infinity Fabric; topology and delivered rate depend on the system", "state": "official" }, "package": { "description": "OAM accelerator with chiplets and HBM3e; package, substrate, and assembly suppliers are not identified here", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "ROCm", "HIP", "RCCL", "MIGraphX" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "AMD publishes MI325X as a current product; supplier allocation, shipment volume, and system availability remain separate records" }, "independent_validation": "Use model-, software-version-, system-, and workload-specific tests." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-4188c64ef166f594" ], "summary": "AMD is the named company for Instinct MI325X in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "CDNA 3 chiplet accelerator. Normalized compute record: FP8 through FP64 · Precision and matrix mode dependent", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 5 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM3e · 256 GB · 6 TB/s peak · Per MI325X accelerator peak.", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: OAM accelerator with chiplets and HBM3e; package, substrate, and assembly suppliers are not identified here.", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_gpu. Availability record: AMD publishes MI325X as a current product; supplier allocation, shipment volume, and system availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Infinity Fabric; topology and delivered rate depend on the system.", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: ROCm · HIP · RCCL · MIGraphX. Use model-, software-version-, system-, and workload-specific tests.", "evidence_state": "derived", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: AMD publishes MI325X as a current product; supplier allocation, shipment volume, and system availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "ce0480359372991c4be5c4a1655997b3677a3f4294adfb87f054e22aa487ed9f" }, { "id": "amd-instinct-mi350x", "entity_id": "amd-instinct-mi350x", "name": "AMD · Instinct MI350X", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "AMD", "product": "Instinct MI350X", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-918e143f4ae59526" ], "source_refs": [ { "source_id": "src-atlas-918e143f4ae59526", "url": "https://www.amd.com/en/products/accelerators/instinct/mi350/mi350x.html", "title": "AMD Instinct MI350X", "publisher": "AMD Instinct MI350X", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "HBM supplier and lot allocation", "package and assembly suppliers", "volume shipments by partner", "sustained collectives", "accepted-task economics" ], "technical_profile": { "entity_level": "datacenter_accelerator_gpu", "accelerator_type": "GPU/GPGPU", "role": "Datacenter training and inference GPU", "architecture": "CDNA 4 chiplet accelerator", "process": { "node_nm": 3, "node_class": "advanced", "scope": "AMD lists TSMC 3 nm and 6 nm process technology for MI350X; this does not identify facilities or lots", "state": "official" }, "compute": [ { "value": null, "unit": null, "precision": "FP4 through FP64", "scope": "Precision and matrix mode dependent", "state": "official" } ], "memory": { "strategy": "hbm", "hbm_free": false, "type": "HBM3e", "capacity_gb": 288, "peak_bandwidth_tb_s": 8, "bandwidth_scope": "Per MI350X accelerator peak", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Infinity Fabric; topology and delivered rate depend on the system", "state": "official" }, "package": { "description": "OAM accelerator with chiplets and HBM3e; package, substrate, and assembly suppliers are not identified here", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "ROCm", "HIP", "RCCL", "MIGraphX" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "AMD publishes MI350X as a current product; supplier allocation, shipment volume, and system availability remain separate records" }, "independent_validation": "Production system and workload receipts remain separate from product-page specifications." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-918e143f4ae59526" ], "summary": "AMD is the named company for Instinct MI350X in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "CDNA 4 chiplet accelerator. Normalized compute record: FP4 through FP64 · Precision and matrix mode dependent", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 3 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM3e · 288 GB · 8 TB/s peak · Per MI350X accelerator peak.", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: OAM accelerator with chiplets and HBM3e; package, substrate, and assembly suppliers are not identified here.", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_gpu. Availability record: AMD publishes MI350X as a current product; supplier allocation, shipment volume, and system availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Infinity Fabric; topology and delivered rate depend on the system.", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: ROCm · HIP · RCCL · MIGraphX. Production system and workload receipts remain separate from product-page specifications.", "evidence_state": "derived", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: AMD publishes MI350X as a current product; supplier allocation, shipment volume, and system availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "a766dc7c5b39b634dbfdecc0b3d769e67c72f6671aa36469e8ea470192364ff7" }, { "id": "amd-instinct-mi355x", "entity_id": "amd-instinct-mi355x", "name": "AMD · Instinct MI355X", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "AMD", "product": "Instinct MI355X", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "source_refs": [ { "source_id": "src-atlas-780b66f499f7b7f7", "url": "https://www.amd.com/en/products/accelerators/instinct/mi350/mi355x.html", "title": "AMD Instinct MI355X", "publisher": "AMD Instinct MI355X", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "HBM supplier and lot allocation", "package and assembly suppliers", "volume shipments by partner", "sustained collectives", "accepted-task economics" ], "technical_profile": { "entity_level": "datacenter_accelerator_gpu", "accelerator_type": "GPU/GPGPU", "role": "Datacenter training and inference GPU", "architecture": "CDNA 4 chiplet accelerator", "process": { "node_nm": 3, "node_class": "advanced", "scope": "AMD lists TSMC 3 nm and 6 nm process technology for MI355X; this does not identify facilities or lots", "state": "official" }, "compute": [ { "value": null, "unit": null, "precision": "FP4 through FP64", "scope": "Precision and matrix mode dependent", "state": "official" } ], "memory": { "strategy": "hbm", "hbm_free": false, "type": "HBM3e", "capacity_gb": 288, "peak_bandwidth_tb_s": 8, "bandwidth_scope": "Per MI355X accelerator peak", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Infinity Fabric; topology and delivered rate depend on the system", "state": "official" }, "package": { "description": "OAM accelerator with chiplets and HBM3e; package, substrate, and assembly suppliers are not identified here", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "ROCm", "HIP", "RCCL", "MIGraphX" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "AMD publishes MI355X as a current product; supplier allocation, shipment volume, and partner availability remain separate records" }, "independent_validation": "Production system and workload receipts remain separate from product-page specifications." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-780b66f499f7b7f7" ], "summary": "AMD is the named company for Instinct MI355X in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "CDNA 4 chiplet accelerator. Normalized compute record: FP4 through FP64 · Precision and matrix mode dependent", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 3 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM3e · 288 GB · 8 TB/s peak · Per MI355X accelerator peak.", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: OAM accelerator with chiplets and HBM3e; package, substrate, and assembly suppliers are not identified here.", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_gpu. Availability record: AMD publishes MI355X as a current product; supplier allocation, shipment volume, and partner availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Infinity Fabric; topology and delivered rate depend on the system.", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: ROCm · HIP · RCCL · MIGraphX. Production system and workload receipts remain separate from product-page specifications.", "evidence_state": "derived", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: AMD publishes MI355X as a current product; supplier allocation, shipment volume, and partner availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "cc5ef94e8f1f04d7c0f400ea595aacaa5d471b8b3312a38b8b1338640886f3e6" }, { "id": "intel-gaudi-3", "entity_id": "intel-gaudi-3", "name": "Intel · Gaudi 3", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Intel", "product": "Gaudi 3", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-923ed39addeeb70e" ], "source_refs": [ { "source_id": "src-atlas-923ed39addeeb70e", "url": "https://www.intel.com/content/www/us/en/products/details/processors/ai-accelerators/gaudi.html", "title": "Intel Gaudi", "publisher": "Intel Gaudi", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "current volume", "system-specific network efficiency", "accepted-task cost" ], "technical_profile": { "entity_level": "datacenter_accelerator_family", "accelerator_type": "NPU/tensor ASIC", "role": "Datacenter training and inference accelerator", "architecture": "Matrix-math and tensor processor accelerator with integrated Ethernet", "process": { "node_nm": 5, "node_class": "advanced", "state": "official" }, "compute": [ { "value": null, "unit": null, "precision": "BF16/FP8", "scope": "official SKU table", "state": "official" } ], "memory": { "strategy": "hbm", "hbm_free": false, "type": "HBM2e", "capacity_gb": 128, "peak_bandwidth_tb_s": 3.7, "bandwidth_scope": "official peak", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Integrated Ethernet ports; topology depends on system", "state": "official" }, "package": { "description": "Accelerator package with HBM2e", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "SynapseAI", "PyTorch", "DeepSpeed" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "Production accelerator available through systems and cloud instances" }, "independent_validation": "Software coverage and end-to-end workload fit remain decisive." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-923ed39addeeb70e" ], "summary": "Intel is the named company for Gaudi 3 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Matrix-math and tensor processor accelerator with integrated Ethernet. Normalized compute record: BF16/FP8 · official SKU table", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 5 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM2e · 128 GB · 3.7 TB/s peak · official peak.", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Accelerator package with HBM2e.", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Production accelerator available through systems and cloud instances.", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Integrated Ethernet ports; topology depends on system.", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: SynapseAI · PyTorch · DeepSpeed. Software coverage and end-to-end workload fit remain decisive.", "evidence_state": "derived", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Production accelerator available through systems and cloud instances.", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "b98584186835d0e5650b344ea88bd0b744b0744c5447f07b10f339089e0075fa" }, { "id": "intel-arc-b-series", "entity_id": "intel-arc-b-series", "name": "Intel · Arc B-Series", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Intel", "product": "Arc B-Series", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-a931987589247b74" ], "source_refs": [ { "source_id": "src-atlas-a931987589247b74", "url": "https://www.intel.com/content/www/us/en/products/docs/discrete-gpus/arc/desktop/b-series/overview.html", "title": "Intel Arc graphics", "publisher": "Intel Arc graphics", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "family-wide memory capacity", "sustained local-AI performance by model" ], "technical_profile": { "entity_level": "client_accelerator_family", "accelerator_type": "GPU/GPGPU", "role": "Client graphics and local AI GPU", "architecture": "Xe2 graphics architecture with XMX AI engines", "process": { "node_nm": null, "node_class": "advanced", "state": "official" }, "compute": [ { "value": null, "unit": null, "precision": "mixed", "scope": "SKU dependent", "state": "official" } ], "memory": { "strategy": "gddr", "hbm_free": true, "type": "GDDR6", "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "SKU dependent", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "PCIe client GPU", "state": "official" }, "package": { "description": "Discrete client GPU board", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "oneAPI", "OpenVINO", "XeSS" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "Shipping client GPU family" }, "independent_validation": "Not a datacenter HBM accelerator; included to make the chip-type boundary visible." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-a931987589247b74" ], "summary": "Intel is the named company for Arc B-Series in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Xe2 graphics architecture with XMX AI engines. Normalized compute record: mixed · SKU dependent", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: gddr · GDDR6 · SKU dependent.", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Discrete client GPU board.", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: client_accelerator_family. Availability record: Shipping client GPU family.", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: PCIe client GPU.", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: oneAPI · OpenVINO · XeSS. Not a datacenter HBM accelerator; included to make the chip-type boundary visible.", "evidence_state": "derived", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Shipping client GPU family.", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "9db67be73742e3bd2aceafef0d87f461fef3b42224ccffeea73ee59ee9b82b70" }, { "id": "cerebras-wse-3", "entity_id": "cerebras-wse-3", "name": "Cerebras · WSE-3", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Cerebras", "product": "WSE-3", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "source_refs": [ { "source_id": "src-atlas-c44b9c2c5e7301ef", "url": "https://www.cerebras.ai/press-release/cerebras-announces-third-generation-wafer-scale-engine/", "title": "Cerebras WSE-3 announcement", "publisher": "Cerebras WSE-3 announcement", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "workload-specific off-wafer traffic", "customer system utilization", "accepted-task economics" ], "technical_profile": { "entity_level": "wafer_scale_accelerator_system_family", "accelerator_type": "Wafer-scale engine", "role": "Wafer-scale training and inference accelerator", "architecture": "Entire-wafer compute engine with distributed on-wafer SRAM", "process": { "node_nm": 5, "node_class": "advanced", "state": "official" }, "compute": [ { "value": 125, "unit": "PFLOPS", "precision": "AI", "scope": "company peak", "state": "official" } ], "memory": { "strategy": "on-wafer-sram", "hbm_free": true, "type": "On-wafer SRAM plus external memory systems", "capacity_gb": 44, "peak_bandwidth_tb_s": 21000, "bandwidth_scope": "company-stated on-wafer memory bandwidth, not off-package DRAM bandwidth", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "SwarmX and MemoryX system fabric", "state": "official" }, "package": { "description": "Wafer-scale engine in a CS-3 system", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "Cerebras Software Platform", "PyTorch integration" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "Production CS-3 systems and cloud service" }, "independent_validation": "On-wafer bandwidth is a different scope from HBM bandwidth and must not be compared without the data path." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "summary": "Cerebras is the named company for WSE-3 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Entire-wafer compute engine with distributed on-wafer SRAM. Normalized compute record: 125 PFLOPS · AI · company peak", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 5 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: on-wafer-sram · On-wafer SRAM plus external memory systems · 44 GB · 21000 TB/s peak · company-stated on-wafer memory bandwidth, not off-package DRAM bandwidth.", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Wafer-scale engine in a CS-3 system.", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: wafer_scale_accelerator_system_family. Availability record: Production CS-3 systems and cloud service.", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: SwarmX and MemoryX system fabric.", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Cerebras Software Platform · PyTorch integration. On-wafer bandwidth is a different scope from HBM bandwidth and must not be compared without the data path.", "evidence_state": "derived", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Production CS-3 systems and cloud service.", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "7c08a6eaf2249136878eb0f34cb2c9536f1bb04aac6457d3c8670c0e238a0ba2" }, { "id": "groq-lpu", "entity_id": "groq-lpu", "name": "Groq · LPU / GroqRack", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Groq", "product": "LPU / GroqRack", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "source_refs": [ { "source_id": "src-atlas-6ca459b5a00428d5", "url": "https://groq.com/lpu-architecture", "title": "Groq LPU architecture", "publisher": "Groq LPU architecture", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "current chip revision by service", "system memory capacity", "customer volume" ], "technical_profile": { "entity_level": "accelerator_and_rack_system_family", "accelerator_type": "LPU/SRAM inference ASIC", "role": "Deterministic low-latency inference accelerator", "architecture": "Compiler-scheduled streaming processor with on-chip SRAM", "process": { "node_nm": 14, "node_class": "mature-node-class", "state": "official" }, "compute": [ { "value": null, "unit": null, "precision": "mixed", "scope": "chip and system dependent", "state": "unknown" } ], "memory": { "strategy": "on-chip-sram", "hbm_free": true, "type": "On-chip SRAM with model distributed across chips", "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "internal memory and chip-to-chip path differ from HBM GPU systems", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Chip-to-chip streaming fabric", "state": "official" }, "package": { "description": "LPU cards and rack-scale systems", "state": "official" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "Groq compiler", "GroqCloud API" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "Production cloud inference and rack offerings" }, "independent_validation": "Model support, quality, batch behavior, and end-to-end serving are workload-specific." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-6ca459b5a00428d5" ], "summary": "Groq is the named company for LPU / GroqRack in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Compiler-scheduled streaming processor with on-chip SRAM. Normalized compute record: mixed · chip and system dependent", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 14 nm · mature-node-class · official.", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: on-chip-sram · On-chip SRAM with model distributed across chips · internal memory and chip-to-chip path differ from HBM GPU systems.", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: LPU cards and rack-scale systems.", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: accelerator_and_rack_system_family. Availability record: Production cloud inference and rack offerings.", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Chip-to-chip streaming fabric.", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Groq compiler · GroqCloud API. Model support, quality, batch behavior, and end-to-end serving are workload-specific.", "evidence_state": "derived", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Production cloud inference and rack offerings.", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "b37f53aad9b06abb9d2517222c5fde83616a0434b79078f20b65c557fac33f11" }, { "id": "google-tpu", "entity_id": "google-tpu", "name": "Google · TPU v5e / v5p / Trillium / Ironwood", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Google", "product": "TPU v5e / v5p / Trillium / Ironwood", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "source_refs": [ { "source_id": "src-atlas-bb0aaa5608b2679c", "url": "https://cloud.google.com/tpu/docs/system-architecture-tpu-vm", "title": "Google Cloud TPU documentation", "publisher": "Google Cloud TPU documentation", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "foundry and package by generation", "current regional capacity", "generation-specific fields not yet split" ], "technical_profile": { "entity_level": "cloud_accelerator_family", "accelerator_type": "NPU/tensor ASIC", "role": "Cloud training and inference accelerator family", "architecture": "Tensor Processing Unit family deployed through Google Cloud", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": "multiple", "scope": "generation dependent", "state": "official" } ], "memory": { "strategy": "hbm", "hbm_free": false, "type": "HBM, generation dependent", "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "generation dependent", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "ICI pod topology, generation dependent", "state": "official" }, "package": { "description": "Cloud accelerator and pod; manufacturing origin not inferred", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "XLA", "JAX", "TensorFlow", "PyTorch/XLA" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "Multiple production Google Cloud generations; newest generations have distinct preview/availability states" }, "independent_validation": "Keep each generation and cloud availability state separate in procurement decisions." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "summary": "Google is the named company for TPU v5e / v5p / Trillium / Ironwood in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Tensor Processing Unit family deployed through Google Cloud. Normalized compute record: multiple · generation dependent", "evidence_state": "official", "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM, generation dependent · generation dependent.", "evidence_state": "official", "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: cloud_accelerator_family. Availability record: Multiple production Google Cloud generations; newest generations have distinct preview/availability states.", "evidence_state": "official", "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: ICI pod topology, generation dependent.", "evidence_state": "official", "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: XLA · JAX · TensorFlow · PyTorch/XLA. Keep each generation and cloud availability state separate in procurement decisions.", "evidence_state": "derived", "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Multiple production Google Cloud generations; newest generations have distinct preview/availability states.", "evidence_state": "official", "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "88eb3bdef3b512a1d84b28bc7f5f4570d4395ed63ba20b8f360848a31c18cae5" }, { "id": "aws-trainium-inferentia", "entity_id": "aws-trainium-inferentia", "name": "Amazon Web Services · Trainium / Inferentia", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Amazon Web Services", "product": "Trainium / Inferentia", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "source_refs": [ { "source_id": "src-atlas-c2fda96ed6a6bacc", "url": "https://aws.amazon.com/machine-learning/inferentia/", "title": "AWS Inferentia", "publisher": "AWS Inferentia", "primary_status": "primary" }, { "source_id": "src-atlas-e65f50446f1d0405", "url": "https://aws.amazon.com/machine-learning/trainium/", "title": "AWS Trainium", "publisher": "AWS Trainium", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "manufacturing chain", "generation-normalized specs", "regional supply" ], "technical_profile": { "entity_level": "cloud_accelerator_family", "accelerator_type": "NPU/tensor ASIC", "role": "Cloud training and inference accelerator families", "architecture": "AWS NeuronCore accelerators exposed through EC2 instances", "process": { "node_nm": null, "node_class": "unknown", "state": "unknown" }, "compute": [ { "value": null, "unit": null, "precision": "multiple", "scope": "generation and instance dependent", "state": "official" } ], "memory": { "strategy": "hbm-or-external", "hbm_free": null, "type": "Generation dependent", "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "instance and generation dependent", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "NeuronLink/EFA, generation and instance dependent", "state": "official" }, "package": { "description": "Cloud-only accelerator systems; manufacturing origin not inferred", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "AWS Neuron SDK", "PyTorch", "JAX" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "Production EC2 accelerator instances; individual generations vary" }, "independent_validation": "Cloud availability, compiler coverage, and accepted-task cost are the relevant receipts." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "summary": "Amazon Web Services is the named company for Trainium / Inferentia in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "AWS NeuronCore accelerators exposed through EC2 instances. Normalized compute record: multiple · generation and instance dependent", "evidence_state": "official", "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm-or-external · Generation dependent · instance and generation dependent.", "evidence_state": "official", "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: cloud_accelerator_family. Availability record: Production EC2 accelerator instances; individual generations vary.", "evidence_state": "official", "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: NeuronLink/EFA, generation and instance dependent.", "evidence_state": "official", "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: AWS Neuron SDK · PyTorch · JAX. Cloud availability, compiler coverage, and accepted-task cost are the relevant receipts.", "evidence_state": "derived", "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Production EC2 accelerator instances; individual generations vary.", "evidence_state": "official", "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "1222b2a41f86c1d6259996c09dcfda7a07e2e89ebc0126a6d23d0f672aec5164" }, { "id": "microsoft-maia", "entity_id": "microsoft-maia", "name": "Microsoft · Maia 100 / Maia 200", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Microsoft", "product": "Maia 100 / Maia 200", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "source_refs": [ { "source_id": "src-atlas-bdcaeb3bfd099e47", "url": "https://news.microsoft.com/source/features/ai/in-house-chips-silicon-to-service-to-meet-ai-demand/", "title": "Microsoft Maia 100", "publisher": "Microsoft Maia 100", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "broad customer availability", "manufacturing chain", "generation-specific production volume" ], "technical_profile": { "entity_level": "cloud_accelerator_family", "accelerator_type": "NPU/tensor ASIC", "role": "Azure AI training and inference accelerator", "architecture": "Microsoft-designed datacenter AI accelerator integrated with Azure systems", "process": { "node_nm": null, "node_class": "advanced", "state": "official" }, "compute": [ { "value": null, "unit": null, "precision": "multiple", "scope": "generation dependent", "state": "unknown" } ], "memory": { "strategy": "hbm", "hbm_free": false, "type": "HBM-class", "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "generation dependent", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Azure system fabric", "state": "official" }, "package": { "description": "Custom Azure accelerator package; supply-chain origin not inferred", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "Azure AI stack", "Triton" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "Microsoft deployment/roadmap family; customer access varies by generation" }, "independent_validation": "Internal deployment does not equal broadly orderable customer capacity." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "summary": "Microsoft is the named company for Maia 100 / Maia 200 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Microsoft-designed datacenter AI accelerator integrated with Azure systems. Normalized compute record: multiple · generation dependent", "evidence_state": "official", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM-class · generation dependent.", "evidence_state": "official", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: cloud_accelerator_family. Availability record: Microsoft deployment/roadmap family; customer access varies by generation.", "evidence_state": "official", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Azure system fabric.", "evidence_state": "official", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Azure AI stack · Triton. Internal deployment does not equal broadly orderable customer capacity.", "evidence_state": "derived", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Microsoft deployment/roadmap family; customer access varies by generation.", "evidence_state": "official", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "07fafc06cfd1d517ff246b34e06e296c2f60fa28ced27a1ce76930aecc5a18e1" }, { "id": "meta-mtia", "entity_id": "meta-mtia", "name": "Meta · MTIA", "kind": "product_family", "entity_type": "product_family", "entity_origin": "atlas_product_family", "company": "Meta", "product": "MTIA", "design_company_headquarters_country": "United States", "country_of_ownership": "Unknown", "headquarters": "United States design-company lane; exact design and legal-entity geography remain product-record scoped", "completion_state": "atlas_family_preserved", "last_checked": "2026-08-01", "aliases": [], "source_ids": [ "src-atlas-45b4e630ca93241d" ], "source_refs": [ { "source_id": "src-atlas-45b4e630ca93241d", "url": "https://ai.meta.com/blog/next-generation-meta-training-inference-accelerator-AI-MTIA/", "title": "Meta next-generation MTIA", "publisher": "Meta next-generation MTIA", "primary_status": "primary" } ], "raw_supply_chain_layers": [ "accelerator_product_family" ], "supply_chain_layers": [ "accelerator_product_family" ], "macro_stages": [ "chip_architecture" ], "unknowns": [ "deployment volume", "current revision mix", "external availability not applicable" ], "technical_profile": { "entity_level": "internal_datacenter_accelerator_family", "accelerator_type": "NPU/tensor ASIC", "role": "Internal recommendation and inference accelerator", "architecture": "Meta Training and Inference Accelerator for internal workloads", "process": { "node_nm": null, "node_class": "advanced", "state": "official" }, "compute": [ { "value": null, "unit": null, "precision": "multiple", "scope": "revision dependent", "state": "official" } ], "memory": { "strategy": "lpddr", "hbm_free": true, "type": "LPDDR-class, revision dependent", "capacity_gb": null, "peak_bandwidth_tb_s": null, "bandwidth_scope": "revision dependent", "state": "official" }, "interconnect": { "peak_gb_s": null, "scope": "Internal system design", "state": "unknown" }, "package": { "description": "Internal datacenter accelerator; manufacturing origin not inferred", "state": "unknown" }, "power": null, "system_hierarchy": [], "specification_maturity": null, "software": [ "Meta internal compiler and runtime", "PyTorch integration" ], "software_evidence_state": "derived", "availability": { "state": "official", "status": "Deployed internally; not a merchant accelerator" }, "independent_validation": "Internal production is a different commercial state from an orderable product." }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-45b4e630ca93241d" ], "summary": "Meta is the named company for MTIA in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-45b4e630ca93241d" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Meta Training and Inference Accelerator for internal workloads. Normalized compute record: multiple · revision dependent", "evidence_state": "official", "source_ids": [ "src-atlas-45b4e630ca93241d" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-45b4e630ca93241d" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · LPDDR-class, revision dependent · revision dependent.", "evidence_state": "official", "source_ids": [ "src-atlas-45b4e630ca93241d" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: internal_datacenter_accelerator_family. Availability record: Deployed internally; not a merchant accelerator.", "evidence_state": "official", "source_ids": [ "src-atlas-45b4e630ca93241d" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Meta internal compiler and runtime · PyTorch integration. Internal production is a different commercial state from an orderable product.", "evidence_state": "derived", "source_ids": [ "src-atlas-45b4e630ca93241d" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Deployed internally; not a merchant accelerator.", "evidence_state": "official", "source_ids": [ "src-atlas-45b4e630ca93241d" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "atlas_product_record_sha256": "973e367a282daec18f6b14127510176da427caec44c873e9f358282b59e0cccb" }, { "id": "atlas-unresolved-dfsx-df1000", "entity_id": "atlas-unresolved-dfsx-df1000", "name": "Shanghai DFSX · DF1000 — product-specific supply path unresolved", "kind": "unresolved_boundary", "entity_type": "unresolved_boundary", "entity_origin": "atlas_boundary", "boundary_for_product_id": "dfsx-df1000", "design_company_headquarters_country": "China", "country_of_ownership": "Unknown", "headquarters": null, "completion_state": "explicit_unknown", "last_checked": "2026-08-01", "aliases": [], "source_ids": [], "source_refs": [], "raw_supply_chain_layers": [ "product_specific_supplier_path_unknown" ], "supply_chain_layers": [ "product_specific_supplier_path_unknown" ], "macro_stages": [ "production_qualification", "other_unknown" ], "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific 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No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "huawei-ascend-950pr" }, { "id": "atlas-path-huawei-ascend-950dt", "relationship_id": "atlas-path-huawei-ascend-950dt", "record_type": "relationship", "from_entity_id": "huawei-ascend-950dt", "to_entity_id": "atlas-unresolved-huawei-ascend-950dt", "from": "huawei-ascend-950dt", "to": "atlas-unresolved-huawei-ascend-950dt", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "huawei-ascend-950dt" }, { "id": "atlas-path-cambricon-mlu370", "relationship_id": "atlas-path-cambricon-mlu370", "record_type": "relationship", "from_entity_id": "cambricon-mlu370", "to_entity_id": "atlas-unresolved-cambricon-mlu370", "from": "cambricon-mlu370", "to": "atlas-unresolved-cambricon-mlu370", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "cambricon-mlu370" }, { "id": "atlas-path-cambricon-mlu590-690", "relationship_id": "atlas-path-cambricon-mlu590-690", "record_type": "relationship", "from_entity_id": "cambricon-mlu590-690", "to_entity_id": "atlas-unresolved-cambricon-mlu590-690", "from": "cambricon-mlu590-690", "to": "atlas-unresolved-cambricon-mlu590-690", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "cambricon-mlu590-690" }, { "id": "atlas-path-biren-br100", "relationship_id": "atlas-path-biren-br100", "record_type": "relationship", "from_entity_id": "biren-br100", "to_entity_id": "atlas-unresolved-biren-br100", "from": "biren-br100", "to": "atlas-unresolved-biren-br100", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "biren-br100" }, { "id": "atlas-path-metax-c500-c550", "relationship_id": "atlas-path-metax-c500-c550", "record_type": "relationship", "from_entity_id": "metax-c500-c550", "to_entity_id": "atlas-unresolved-metax-c500-c550", "from": "metax-c500-c550", "to": "atlas-unresolved-metax-c500-c550", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "metax-c500-c550" }, { "id": "atlas-path-metax-c600", "relationship_id": "atlas-path-metax-c600", "record_type": "relationship", "from_entity_id": "metax-c600", "to_entity_id": "atlas-unresolved-metax-c600", "from": "metax-c600", "to": "atlas-unresolved-metax-c600", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "metax-c600" }, { "id": "atlas-path-enflame-t20-t21", "relationship_id": "atlas-path-enflame-t20-t21", "record_type": "relationship", "from_entity_id": "enflame-t20-t21", "to_entity_id": "atlas-unresolved-enflame-t20-t21", "from": "enflame-t20-t21", "to": "atlas-unresolved-enflame-t20-t21", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "enflame-t20-t21" }, { "id": "atlas-path-enflame-s60", "relationship_id": "atlas-path-enflame-s60", "record_type": "relationship", "from_entity_id": "enflame-s60", "to_entity_id": "atlas-unresolved-enflame-s60", "from": "enflame-s60", "to": "atlas-unresolved-enflame-s60", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "enflame-s60" }, { "id": "atlas-path-moore-threads-s4000", "relationship_id": "atlas-path-moore-threads-s4000", "record_type": "relationship", "from_entity_id": "moore-threads-s4000", "to_entity_id": "atlas-unresolved-moore-threads-s4000", "from": "moore-threads-s4000", "to": "atlas-unresolved-moore-threads-s4000", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "moore-threads-s4000" }, { "id": "atlas-path-iluvatar-bi-v150", "relationship_id": "atlas-path-iluvatar-bi-v150", "record_type": "relationship", "from_entity_id": "iluvatar-bi-v150", "to_entity_id": "atlas-unresolved-iluvatar-bi-v150", "from": "iluvatar-bi-v150", "to": "atlas-unresolved-iluvatar-bi-v150", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "iluvatar-bi-v150" }, { "id": "atlas-path-kunlunxin-p800", "relationship_id": "atlas-path-kunlunxin-p800", "record_type": "relationship", "from_entity_id": "kunlunxin-p800", "to_entity_id": "atlas-unresolved-kunlunxin-p800", "from": "kunlunxin-p800", "to": "atlas-unresolved-kunlunxin-p800", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "kunlunxin-p800" }, { "id": "atlas-path-horizon-journey-6", "relationship_id": "atlas-path-horizon-journey-6", "record_type": "relationship", "from_entity_id": "horizon-journey-6", "to_entity_id": "atlas-unresolved-horizon-journey-6", "from": "horizon-journey-6", "to": "atlas-unresolved-horizon-journey-6", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "horizon-journey-6" }, { "id": "atlas-path-alibaba-t-head-hanguang-800", "relationship_id": "atlas-path-alibaba-t-head-hanguang-800", "record_type": "relationship", "from_entity_id": "alibaba-t-head-hanguang-800", "to_entity_id": "atlas-unresolved-alibaba-t-head-hanguang-800", "from": "alibaba-t-head-hanguang-800", "to": "atlas-unresolved-alibaba-t-head-hanguang-800", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "alibaba-t-head-hanguang-800" }, { "id": "atlas-path-tencent-zixiao-c100", "relationship_id": "atlas-path-tencent-zixiao-c100", "record_type": "relationship", "from_entity_id": "tencent-zixiao-c100", "to_entity_id": "atlas-unresolved-tencent-zixiao-c100", "from": "tencent-zixiao-c100", "to": "atlas-unresolved-tencent-zixiao-c100", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "tencent-zixiao-c100" }, { "id": "atlas-path-hygon-dcu-8000", "relationship_id": "atlas-path-hygon-dcu-8000", "record_type": "relationship", "from_entity_id": "hygon-dcu-8000", "to_entity_id": "atlas-unresolved-hygon-dcu-8000", "from": "hygon-dcu-8000", "to": "atlas-unresolved-hygon-dcu-8000", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "hygon-dcu-8000" }, { "id": "atlas-path-sophgo-bm1690", "relationship_id": "atlas-path-sophgo-bm1690", "record_type": "relationship", "from_entity_id": "sophgo-bm1690", "to_entity_id": "atlas-unresolved-sophgo-bm1690", "from": "sophgo-bm1690", "to": "atlas-unresolved-sophgo-bm1690", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "sophgo-bm1690" }, { "id": "atlas-path-denglin-goldwasser-l", "relationship_id": "atlas-path-denglin-goldwasser-l", "record_type": "relationship", "from_entity_id": "denglin-goldwasser-l", "to_entity_id": "atlas-unresolved-denglin-goldwasser-l", "from": "denglin-goldwasser-l", "to": "atlas-unresolved-denglin-goldwasser-l", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "denglin-goldwasser-l" }, { "id": "atlas-path-vastai-va10-family", "relationship_id": "atlas-path-vastai-va10-family", "record_type": "relationship", "from_entity_id": "vastai-va10-family", "to_entity_id": "atlas-unresolved-vastai-va10-family", "from": "vastai-va10-family", "to": "atlas-unresolved-vastai-va10-family", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "vastai-va10-family" }, { "id": "atlas-path-axera-ax650-family", "relationship_id": "atlas-path-axera-ax650-family", "record_type": "relationship", "from_entity_id": "axera-ax650-family", "to_entity_id": "atlas-unresolved-axera-ax650-family", "from": "axera-ax650-family", "to": "atlas-unresolved-axera-ax650-family", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "axera-ax650-family" }, { "id": "atlas-path-intellifusion-deepedge10-family", "relationship_id": "atlas-path-intellifusion-deepedge10-family", "record_type": "relationship", "from_entity_id": "intellifusion-deepedge10-family", "to_entity_id": "atlas-unresolved-intellifusion-deepedge10-family", "from": "intellifusion-deepedge10-family", "to": "atlas-unresolved-intellifusion-deepedge10-family", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "intellifusion-deepedge10-family" }, { "id": "atlas-path-corerain-caisa-430", "relationship_id": "atlas-path-corerain-caisa-430", "record_type": "relationship", "from_entity_id": "corerain-caisa-430", "to_entity_id": "atlas-unresolved-corerain-caisa-430", "from": "corerain-caisa-430", "to": "atlas-unresolved-corerain-caisa-430", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "corerain-caisa-430" }, { "id": "atlas-path-corerain-n460h", "relationship_id": "atlas-path-corerain-n460h", "record_type": "relationship", "from_entity_id": "corerain-n460h", "to_entity_id": "atlas-unresolved-corerain-n460h", "from": "corerain-n460h", "to": "atlas-unresolved-corerain-n460h", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "corerain-n460h" }, { "id": "atlas-path-tsingmicro-tx5-family", "relationship_id": "atlas-path-tsingmicro-tx5-family", "record_type": "relationship", "from_entity_id": "tsingmicro-tx5-family", "to_entity_id": "atlas-unresolved-tsingmicro-tx5-family", "from": "tsingmicro-tx5-family", "to": "atlas-unresolved-tsingmicro-tx5-family", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "tsingmicro-tx5-family" }, { "id": "atlas-path-black-sesame-huashan-a1000-family", "relationship_id": "atlas-path-black-sesame-huashan-a1000-family", "record_type": "relationship", "from_entity_id": "black-sesame-huashan-a1000-family", "to_entity_id": "atlas-unresolved-black-sesame-huashan-a1000-family", "from": "black-sesame-huashan-a1000-family", "to": "atlas-unresolved-black-sesame-huashan-a1000-family", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "black-sesame-huashan-a1000-family" }, { "id": "atlas-path-jingjia-micro-jm11-family", "relationship_id": "atlas-path-jingjia-micro-jm11-family", "record_type": "relationship", "from_entity_id": "jingjia-micro-jm11-family", "to_entity_id": "atlas-unresolved-jingjia-micro-jm11-family", "from": "jingjia-micro-jm11-family", "to": "atlas-unresolved-jingjia-micro-jm11-family", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "jingjia-micro-jm11-family" }, { "id": "atlas-path-jingjia-micro-ch37-family", "relationship_id": "atlas-path-jingjia-micro-ch37-family", "record_type": "relationship", "from_entity_id": "jingjia-micro-ch37-family", "to_entity_id": "atlas-unresolved-jingjia-micro-ch37-family", "from": "jingjia-micro-ch37-family", "to": "atlas-unresolved-jingjia-micro-ch37-family", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "jingjia-micro-ch37-family" }, { "id": "atlas-path-lisuan-lx-7g100", "relationship_id": "atlas-path-lisuan-lx-7g100", "record_type": "relationship", "from_entity_id": "lisuan-lx-7g100", "to_entity_id": "atlas-unresolved-lisuan-lx-7g100", "from": "lisuan-lx-7g100", "to": "atlas-unresolved-lisuan-lx-7g100", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "lisuan-lx-7g100" }, { "id": "atlas-path-innosilicon-fenghua-3", "relationship_id": "atlas-path-innosilicon-fenghua-3", "record_type": "relationship", "from_entity_id": "innosilicon-fenghua-3", "to_entity_id": "atlas-unresolved-innosilicon-fenghua-3", "from": "innosilicon-fenghua-3", "to": "atlas-unresolved-innosilicon-fenghua-3", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "innosilicon-fenghua-3" }, { "id": "atlas-path-unisoc-t9100", "relationship_id": "atlas-path-unisoc-t9100", "record_type": "relationship", "from_entity_id": "unisoc-t9100", "to_entity_id": "atlas-unresolved-unisoc-t9100", "from": "unisoc-t9100", "to": "atlas-unresolved-unisoc-t9100", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "unisoc-t9100" }, { "id": "atlas-path-unisoc-a7870", "relationship_id": "atlas-path-unisoc-a7870", "record_type": "relationship", "from_entity_id": "unisoc-a7870", "to_entity_id": "atlas-unresolved-unisoc-a7870", "from": "unisoc-a7870", "to": "atlas-unresolved-unisoc-a7870", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "unisoc-a7870" }, { "id": "atlas-path-rockchip-rk3588", "relationship_id": "atlas-path-rockchip-rk3588", "record_type": "relationship", "from_entity_id": "rockchip-rk3588", "to_entity_id": "atlas-unresolved-rockchip-rk3588", "from": "rockchip-rk3588", "to": "atlas-unresolved-rockchip-rk3588", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "rockchip-rk3588" }, { "id": "atlas-path-allwinner-v853", "relationship_id": "atlas-path-allwinner-v853", "record_type": "relationship", "from_entity_id": "allwinner-v853", "to_entity_id": "atlas-unresolved-allwinner-v853", "from": "allwinner-v853", "to": "atlas-unresolved-allwinner-v853", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "allwinner-v853" }, { "id": "atlas-path-nio-shenji-nx9031", "relationship_id": "atlas-path-nio-shenji-nx9031", "record_type": "relationship", "from_entity_id": "nio-shenji-nx9031", "to_entity_id": "atlas-unresolved-nio-shenji-nx9031", "from": "nio-shenji-nx9031", "to": "atlas-unresolved-nio-shenji-nx9031", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "nio-shenji-nx9031" }, { "id": "atlas-path-xpeng-turing-ai-chip", "relationship_id": "atlas-path-xpeng-turing-ai-chip", "record_type": "relationship", "from_entity_id": "xpeng-turing-ai-chip", "to_entity_id": "atlas-unresolved-xpeng-turing-ai-chip", "from": "xpeng-turing-ai-chip", "to": "atlas-unresolved-xpeng-turing-ai-chip", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "xpeng-turing-ai-chip" }, { "id": "atlas-path-li-auto-mahe-m100", "relationship_id": "atlas-path-li-auto-mahe-m100", "record_type": "relationship", "from_entity_id": "li-auto-mahe-m100", "to_entity_id": "atlas-unresolved-li-auto-mahe-m100", "from": "li-auto-mahe-m100", "to": "atlas-unresolved-li-auto-mahe-m100", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "li-auto-mahe-m100" }, { "id": "atlas-path-nvidia-blackwell-b200", "relationship_id": "atlas-path-nvidia-blackwell-b200", "record_type": "relationship", "from_entity_id": "nvidia-blackwell-b200", "to_entity_id": "atlas-unresolved-nvidia-blackwell-b200", "from": "nvidia-blackwell-b200", "to": "atlas-unresolved-nvidia-blackwell-b200", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "nvidia-blackwell-b200" }, { "id": "atlas-path-nvidia-blackwell-b300", "relationship_id": "atlas-path-nvidia-blackwell-b300", "record_type": "relationship", "from_entity_id": "nvidia-blackwell-b300", "to_entity_id": "atlas-unresolved-nvidia-blackwell-b300", "from": "nvidia-blackwell-b300", "to": "atlas-unresolved-nvidia-blackwell-b300", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "nvidia-blackwell-b300" }, { "id": "atlas-path-nvidia-gb200-nvl72", "relationship_id": "atlas-path-nvidia-gb200-nvl72", "record_type": "relationship", "from_entity_id": "nvidia-gb200-nvl72", "to_entity_id": "atlas-unresolved-nvidia-gb200-nvl72", "from": "nvidia-gb200-nvl72", "to": "atlas-unresolved-nvidia-gb200-nvl72", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "nvidia-gb200-nvl72" }, { "id": "atlas-path-nvidia-gb300-nvl72", "relationship_id": "atlas-path-nvidia-gb300-nvl72", "record_type": "relationship", "from_entity_id": "nvidia-gb300-nvl72", "to_entity_id": "atlas-unresolved-nvidia-gb300-nvl72", "from": "nvidia-gb300-nvl72", "to": "atlas-unresolved-nvidia-gb300-nvl72", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "nvidia-gb300-nvl72" }, { "id": "atlas-path-nvidia-vera-rubin-nvl72", "relationship_id": "atlas-path-nvidia-vera-rubin-nvl72", "record_type": "relationship", "from_entity_id": "nvidia-vera-rubin-nvl72", "to_entity_id": "atlas-unresolved-nvidia-vera-rubin-nvl72", "from": "nvidia-vera-rubin-nvl72", "to": "atlas-unresolved-nvidia-vera-rubin-nvl72", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "nvidia-vera-rubin-nvl72" }, { "id": "atlas-path-amd-instinct-mi300x", "relationship_id": "atlas-path-amd-instinct-mi300x", "record_type": "relationship", "from_entity_id": "amd-instinct-mi300x", "to_entity_id": "atlas-unresolved-amd-instinct-mi300x", "from": "amd-instinct-mi300x", "to": "atlas-unresolved-amd-instinct-mi300x", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "amd-instinct-mi300x" }, { "id": "atlas-path-amd-instinct-mi325x", "relationship_id": "atlas-path-amd-instinct-mi325x", "record_type": "relationship", "from_entity_id": "amd-instinct-mi325x", "to_entity_id": "atlas-unresolved-amd-instinct-mi325x", "from": "amd-instinct-mi325x", "to": "atlas-unresolved-amd-instinct-mi325x", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "amd-instinct-mi325x" }, { "id": "atlas-path-amd-instinct-mi350x", "relationship_id": "atlas-path-amd-instinct-mi350x", "record_type": "relationship", "from_entity_id": "amd-instinct-mi350x", "to_entity_id": "atlas-unresolved-amd-instinct-mi350x", "from": "amd-instinct-mi350x", "to": "atlas-unresolved-amd-instinct-mi350x", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "amd-instinct-mi350x" }, { "id": "atlas-path-amd-instinct-mi355x", "relationship_id": "atlas-path-amd-instinct-mi355x", "record_type": "relationship", "from_entity_id": "amd-instinct-mi355x", "to_entity_id": "atlas-unresolved-amd-instinct-mi355x", "from": "amd-instinct-mi355x", "to": "atlas-unresolved-amd-instinct-mi355x", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "amd-instinct-mi355x" }, { "id": "atlas-path-intel-gaudi-3", "relationship_id": "atlas-path-intel-gaudi-3", "record_type": "relationship", "from_entity_id": "intel-gaudi-3", "to_entity_id": "atlas-unresolved-intel-gaudi-3", "from": "intel-gaudi-3", "to": "atlas-unresolved-intel-gaudi-3", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "intel-gaudi-3" }, { "id": "atlas-path-intel-arc-b-series", "relationship_id": "atlas-path-intel-arc-b-series", "record_type": "relationship", "from_entity_id": "intel-arc-b-series", "to_entity_id": "atlas-unresolved-intel-arc-b-series", "from": "intel-arc-b-series", "to": "atlas-unresolved-intel-arc-b-series", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "intel-arc-b-series" }, { "id": "atlas-path-cerebras-wse-3", "relationship_id": "atlas-path-cerebras-wse-3", "record_type": "relationship", "from_entity_id": "cerebras-wse-3", "to_entity_id": "atlas-unresolved-cerebras-wse-3", "from": "cerebras-wse-3", "to": "atlas-unresolved-cerebras-wse-3", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "cerebras-wse-3" }, { "id": "atlas-path-groq-lpu", "relationship_id": "atlas-path-groq-lpu", "record_type": "relationship", "from_entity_id": "groq-lpu", "to_entity_id": "atlas-unresolved-groq-lpu", "from": "groq-lpu", "to": "atlas-unresolved-groq-lpu", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "groq-lpu" }, { "id": "atlas-path-google-tpu", "relationship_id": "atlas-path-google-tpu", "record_type": "relationship", "from_entity_id": "google-tpu", "to_entity_id": "atlas-unresolved-google-tpu", "from": "google-tpu", "to": "atlas-unresolved-google-tpu", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "google-tpu" }, { "id": "atlas-path-aws-trainium-inferentia", "relationship_id": "atlas-path-aws-trainium-inferentia", "record_type": "relationship", "from_entity_id": "aws-trainium-inferentia", "to_entity_id": "atlas-unresolved-aws-trainium-inferentia", "from": "aws-trainium-inferentia", "to": "atlas-unresolved-aws-trainium-inferentia", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "aws-trainium-inferentia" }, { "id": "atlas-path-microsoft-maia", "relationship_id": "atlas-path-microsoft-maia", "record_type": "relationship", "from_entity_id": "microsoft-maia", "to_entity_id": "atlas-unresolved-microsoft-maia", "from": "microsoft-maia", "to": "atlas-unresolved-microsoft-maia", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "microsoft-maia" }, { "id": "atlas-path-meta-mtia", "relationship_id": "atlas-path-meta-mtia", "record_type": "relationship", "from_entity_id": "meta-mtia", "to_entity_id": "atlas-unresolved-meta-mtia", "from": "meta-mtia", "to": "atlas-unresolved-meta-mtia", "type": "supply_chain_path_unresolved", "relationship_type": "supply_chain_path_unresolved", "stage": "production_qualification", "macro_stages": [ "production_qualification", "other_unknown" ], "from_macro_stages": [ "chip_architecture" ], "to_macro_stages": [ "production_qualification", "other_unknown" ], "evidence_state": "UNKNOWN", "public_evidence_state": "unknown", "completion_state": "explicit_unknown", "relationship_origin": "atlas_explicit_unknown", "source_ids": [], "source_refs": [], "claim_ids": [], "product_id": null, "facility_id": null, "process_step": "Full product-family supply-chain path", "qualification_state": "unknown", "commercial_state": "unknown", "last_checked": "2026-08-01", "boundary": "The product family is preserved in the atlas, but the public record does not establish one complete product-specific foundry, memory, package, substrate, system, qualification, and volume path. No supplier edge is inferred from technical fit.", "unknowns": [ "canonical design-company crosswalk", "product-specific supplier relationship for architecture_ip", "product-specific supplier relationship for eda", "product-specific supplier relationship for logic_foundry_process", "product-specific supplier relationship for lithography", "product-specific supplier relationship for wafer_equipment", "product-specific supplier relationship for critical_materials", "product-specific supplier relationship for memory_manufacturer", "product-specific supplier relationship for package_provider", "product-specific supplier relationship for assembly_test", "product-specific supplier relationship for board_system", "product-specific supplier relationship for networking", "product-specific supplier relationship for power_cooling", "product-specific supplier relationship for software_workload", "product-specific supplier relationship for qualification_volume_deployment", "facility, yield, volume, customer acceptance, and deployment receipts beyond any explicitly named edge" ], "boundary_for_product_id": "meta-mtia" } ], "product_paths": [ { "product_id": "dfsx-df1000", "relationship_ids": [ "atlas-design-record-dfsx-df1000", "atlas-path-dfsx-df1000" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "summary": "Shanghai DFSX is the named company for DF1000 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Software-defined spatial/dataflow accelerator with DRAM vertically integrated over logic. Normalized compute record: 520 TFLOPS · BF16 · peak, dense-versus-sparse undisclosed", "evidence_state": "official", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 14 nm · mature-node-class · reported.", "evidence_state": "reported", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: 3d-near-memory · DRAM, exact generation unknown · 6.4 TB/s peak · company peak; raw/effective/internal/sustained scope unknown.", "evidence_state": "reported", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Company describes wafer-level DRAM-logic 3D hybrid bonding and an OAM 2.0 card.", "evidence_state": "reported", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Launched July 13, 2026; cards and systems shown; company claims functional validation and mass-production readiness; no public volume-shipment receipt.", "evidence_state": "reported", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 900 GB/s peak · company-stated scale-up bandwidth; direction, ports, topology and payload rate unknown.", "evidence_state": "reported", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CAAP · driver · runtime · operator libraries · distributed tools. A peer-reviewed predecessor demonstrates the architectural direction, not DF1000 product specifications. No public DF1000 teardown or independent workload benchmark was found.", "evidence_state": "derived", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Launched July 13, 2026; cards and systems shown; company claims functional validation and mass-production readiness; no public volume-shipment receipt.", "evidence_state": "reported", "source_ids": [ "src-atlas-38ee4d2b017ca9ca", "src-atlas-3da7974ecc2cc7bd", "src-atlas-b5e05a371644d162", "src-atlas-f499ad50e806df9c" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "huawei-ascend-910c", "relationship_ids": [ "atlas-design-record-huawei-ascend-910c", "atlas-path-huawei-ascend-910c" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "summary": "Huawei is the named company for Ascend 910C / Atlas 900 A3 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Tensor-centric Ascend architecture in a multi-die package. Normalized compute record: 780 TFLOPS · BF16 · derived per chip from Huawei's 0.30 BF16 EFLOPS for 384 chips", "evidence_state": "official", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 7 nm · advanced-constrained · independent.", "evidence_state": "independent", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM2E · 128 GB · 3.125 TB/s peak · derived from Huawei aggregate system figure; not a direct chip datasheet.", "evidence_state": "derived", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Multi-die accelerator with HBM2E; sampled component provenance varies.", "evidence_state": "independent", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_and_system_family. Availability record: In production and deployed in Atlas 900 A3 systems; Huawei reported more than 300 systems at over 20 customers by September 2025.", "evidence_state": "official", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 270 GB/s peak · reported one-way internal dual-die link; Atlas 900 A3 scales through UnifiedBus/SuperPoD.", "evidence_state": "reported", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CANN · AscendCL · MindSpore · PyTorch adapters · HCCL · MindIE. TechInsights teardowns establish physical silicon and HBM in sampled packages. Public neutral workload-efficiency data remain limited.", "evidence_state": "derived", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: In production and deployed in Atlas 900 A3 systems; Huawei reported more than 300 systems at over 20 customers by September 2025.", "evidence_state": "official", "source_ids": [ "src-atlas-1fdfb869912d4d2c", "src-atlas-7f6ae98d8e676324", "src-atlas-ccf15b66682ce2ee" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "huawei-ascend-950pr", "relationship_ids": [ "atlas-design-record-huawei-ascend-950pr", "atlas-path-huawei-ascend-950pr" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "summary": "Huawei is the named company for Ascend 950PR in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Prefill-optimized Ascend accelerator with Huawei-defined HiBL memory. Normalized compute record: 1 PFLOPS · FP8 · roadmap target | 2 PFLOPS · FP4 · roadmap target", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm-class · HiBL 1.0 · 128 GB · 1.6 TB/s peak · official roadmap; reported launched configurations differ.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Officially announced; reported in Atlas 350 configurations in 2026; independent teardown and customer benchmark not found.", "evidence_state": "reported", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 2000 GB/s peak · company-claimed LingQu scale-up bandwidth.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CANN · MindIE · HCCL · LingQu · CUDA migration tools. None found for final silicon specifications or end-to-end workload performance.", "evidence_state": "derived", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Officially announced; reported in Atlas 350 configurations in 2026; independent teardown and customer benchmark not found.", "evidence_state": "reported", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "huawei-ascend-950dt", "relationship_ids": [ "atlas-design-record-huawei-ascend-950dt", "atlas-path-huawei-ascend-950dt" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "summary": "Huawei is the named company for Ascend 950DT in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Decode/training-optimized Ascend accelerator with higher-bandwidth HiZQ memory. Normalized compute record: 1 PFLOPS · FP8 · roadmap/system-derived | 2 PFLOPS · FP4 · roadmap/system-derived", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm-class · HiZQ 2.0 · 144 GB · 4 TB/s peak · official roadmap target.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Roadmap product planned for later 2026; schedule reports vary; no independent silicon measurement found.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 2000 GB/s peak · company-claimed LingQu scale-up bandwidth.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CANN · MindIE · HCCL · LingQu. None found for final silicon.", "evidence_state": "derived", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Roadmap product planned for later 2026; schedule reports vary; no independent silicon measurement found.", "evidence_state": "official", "source_ids": [ "src-atlas-451d351a4ef3e1b4" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "cambricon-mlu370", "relationship_ids": [ "atlas-design-record-cambricon-mlu370", "atlas-path-cambricon-mlu370" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "summary": "Cambricon is the named company for MLU370 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "MLUv03 clusters with compute cores, memory core, and shared SRAM. Normalized compute record: FP32/TF32/FP16/BF16/INT8 supported · authoritative rates vary by board and remain incomplete", "evidence_state": "official", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 7 nm · advanced-constrained · reported.", "evidence_state": "reported", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · LPDDR5 · 48 GB · 0.3072 TB/s peak · MLU370-M8 manual.", "evidence_state": "independent", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: PCIe board; no HBM/interposer.", "evidence_state": "independent", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Long-standing production hardware with public manuals and academic workload use.", "evidence_state": "independent", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 200 GB/s peak · aggregate bidirectional across four MLU-Link ports on M8.", "evidence_state": "independent", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Neuware · CNRT · CNDrv · CNCL · MagicMind · BANG C/C++. An academic MLU370-X4 implementation measured a 27% TPS improvement from LPDDR-aware allocation. That is a memory-management result, not a cross-vendor benchmark.", "evidence_state": "derived", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Long-standing production hardware with public manuals and academic workload use.", "evidence_state": "independent", "source_ids": [ "src-atlas-701b99b2bea643a1", "src-atlas-a41fccc5d11de3eb", "src-atlas-d39f0fa317efd419" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "cambricon-mlu590-690", "relationship_ids": [ "atlas-design-record-cambricon-mlu590-690", "atlas-path-cambricon-mlu590-690" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-ffa76aceb153b772" ], "summary": "Cambricon is the named company for MLU590 / MLU690 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-ffa76aceb153b772" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Public microarchitecture detail incomplete. Normalized compute record: unknown", "evidence_state": "official", "source_ids": [ "src-atlas-ffa76aceb153b772" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: MLU590 is recognized by current SDK documentation; this alone does not prove volume shipment. Reliable public MLU690 specifications were not found..", "evidence_state": "official", "source_ids": [ "src-atlas-ffa76aceb153b772" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: MLU590 appears in current CNCL/MLUDirect locality documentation; bandwidth unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-ffa76aceb153b772" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Neuware · CNCL · MLUDirect. None found.", "evidence_state": "derived", "source_ids": [ "src-atlas-ffa76aceb153b772" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: MLU590 is recognized by current SDK documentation; this alone does not prove volume shipment. Reliable public MLU690 specifications were not found..", "evidence_state": "official", "source_ids": [ "src-atlas-ffa76aceb153b772" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "biren-br100", "relationship_ids": [ "atlas-design-record-biren-br100", "atlas-path-biren-br100" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "summary": "Biren Technology is the named company for BR100 / BR104 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "General vector processor plus 2.5D GEMM engine, C-Warp mode, large SRAM, multicast, and near-memory features. Normalized compute record: 1 PFLOPS · BF16 · BR100 peak company claim | 256 TFLOPS · FP32 · BR100 peak company claim | 2 POPS · INT8 · BR100 peak company claim", "evidence_state": "official", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 7 nm · advanced-constrained · official.", "evidence_state": "official", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM2E · 64 GB · 2.3 TB/s peak · reported BR100 peak.", "evidence_state": "reported", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Two 537 mm² compute chiplets and four HBM2E stacks on TSMC CoWoS 2.5D.", "evidence_state": "official", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Silicon and systems demonstrated; Q4 2022 sampling announced. Continuing volume status is unclear following the reported TSMC suspension and related trade restrictions..", "evidence_state": "reported", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 448 GB/s peak · per BR100 OAM chip in an eight-card all-to-all topology.", "evidence_state": "official", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: BIRENSUPA · compiler · runtime · drivers · libraries · framework support. Independent architectural analysis exists; neutral current silicon benchmarks and shipment volumes remain missing.", "evidence_state": "derived", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Silicon and systems demonstrated; Q4 2022 sampling announced. Continuing volume status is unclear following the reported TSMC suspension and related trade restrictions..", "evidence_state": "reported", "source_ids": [ "src-atlas-12fa162fea903cae", "src-atlas-c3b8ca53d537c686" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "metax-c500-c550", "relationship_ids": [ "atlas-design-record-metax-c500-c550", "atlas-path-metax-c500-c550" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "summary": "MetaX is the named company for C500 / C550 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "XCORE GPGPU; C500 PCIe and C550 OAM. Normalized compute record: 30 TFLOPS · FP32 · reported/observed class; authoritative table unavailable", "evidence_state": "official", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 7 nm · advanced-constrained · reported.", "evidence_state": "reported", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm-reported · HBM2E reported by server vendors · 64 GB · capacity observed with mx-smi; bandwidth unknown.", "evidence_state": "independent", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: C500 mass production and shipment since December 2023 according to MetaX; C550 is reported in deployed service.", "evidence_state": "official", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: C500 PCIe 4.0; C550 OAM/PCIe 5.0 reported; optical and 3D-mesh systems exist but numeric link bandwidth is unknown.", "evidence_state": "reported", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: MXMACA · MACA · mxcc · cucc · operator libraries · PyTorch. A public developer report shows an eight-C500 system, 64 GB per card, and a 350 W cap; a tested async-copy path underperformed its synchronous path, showing that source compatibility is not equal execution behavior.", "evidence_state": "derived", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: C500 mass production and shipment since December 2023 according to MetaX; C550 is reported in deployed service.", "evidence_state": "official", "source_ids": [ "src-atlas-5b18c8669d9bc4cb", "src-atlas-9194a22be0a5b57a" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "metax-c600", "relationship_ids": [ "atlas-design-record-metax-c600", "atlas-path-metax-c600" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "summary": "MetaX is the named company for C600 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "XCORE-class GPGPU; public final architecture incomplete. Normalized compute record: unknown", "evidence_state": "official", "source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Taped out October 2024 and brought up July 2025 according to MetaX; product listed, but public volume-shipment evidence not found.", "evidence_state": "official", "source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: OAM and PCIe 5.0 reported; topology and bandwidth unknown.", "evidence_state": "reported", "source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: MXMACA. None found.", "evidence_state": "derived", "source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Taped out October 2024 and brought up July 2025 according to MetaX; product listed, but public volume-shipment evidence not found.", "evidence_state": "official", "source_ids": [ "src-atlas-23bb623e8fb89470", "src-atlas-9194a22be0a5b57a" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "enflame-t20-t21", "relationship_ids": [ "atlas-design-record-enflame-t20-t21", "atlas-path-enflame-t20-t21" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "summary": "Enflame is the named company for T20 / T21 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "VLIW-style GCU cores with tensor/vector units, sparsity execution, and GCU-LARE interconnect. Normalized compute record: 134.4 TFLOPS · FP16/BF16/TF32 · T20 company-era peak; sparsity convention requires confirmation | 268.8 TOPS · INT8 · T20 company-era peak", "evidence_state": "official", "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 12 nm · mature-node-class · independent.", "evidence_state": "independent", "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Commercial hardware used in clusters; no current teardown found.", "evidence_state": "reported", "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 300 GB/s peak · company-claimed GCU-LARE; direction and payload scope require confirmation.", "evidence_state": "official", "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: TopsRider · TopsPlatform · PyTorch · TensorFlow · ONNX. Hot Chips architecture material and independent architectural reviews exist; current neutral workload data remain limited.", "evidence_state": "derived", "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Commercial hardware used in clusters; no current teardown found.", "evidence_state": "reported", "source_ids": [ "src-atlas-2aa6cb3e29858d4e", "src-atlas-dbf1c379241d20f7" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "enflame-s60", "relationship_ids": [ "atlas-design-record-enflame-s60", "atlas-path-enflame-s60" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-295ba1b0e91682e2" ], "summary": "Enflame is the named company for S60 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-295ba1b0e91682e2" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "GCU accelerator with a public Candle backend. Normalized compute record: unknown", "evidence_state": "official", "source_ids": [ "src-atlas-295ba1b0e91682e2" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: unknown · 48 GB · capacity shown by company examples; type and bandwidth unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-295ba1b0e91682e2" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Company repository demonstrates working S60 hardware; public production volume and qualification remain unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-295ba1b0e91682e2" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: TopsPlatform · Ubridge · UHHI · Candle-GCU. Company-generated LLM examples exist; independent reproduction was not found.", "evidence_state": "derived", "source_ids": [ "src-atlas-295ba1b0e91682e2" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Company repository demonstrates working S60 hardware; public production volume and qualification remain unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-295ba1b0e91682e2" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "moore-threads-s4000", "relationship_ids": [ "atlas-design-record-moore-threads-s4000", "atlas-path-moore-threads-s4000" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "summary": "Moore Threads is the named company for MTT S4000 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Third-generation MUSA GPU with 8,192 vector cores and 128 tensor cores. Normalized compute record: 25 TFLOPS · FP32 · official dense peak | 100 TFLOPS · FP16 tensor · official peak | 200 TOPS · INT8 · official peak", "evidence_state": "official", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm-not-evidenced · undisclosed conventional graphics memory · 48 GB · 0.768 TB/s peak · official peak.", "evidence_state": "official", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: PCIe dual-slot board; no public HBM packaging evidence.", "evidence_state": "official", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_card. Availability record: Shipping product with public manuals and kernel-development work.", "evidence_state": "official", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 240 GB/s peak · MTLink I/O/interface bandwidth; aggregate/directional scope and topology unclear.", "evidence_state": "official", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: MUSA · MUSIFY · driver · runtime · math libraries · operator libraries · communication libraries. No neutral full-system benchmark or teardown found.", "evidence_state": "derived", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Shipping product with public manuals and kernel-development work.", "evidence_state": "official", "source_ids": [ "src-atlas-413cf3d124dfa4c6", "src-atlas-45b711a51482ed71", "src-atlas-636b447eec00fe6e" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "iluvatar-bi-v150", "relationship_ids": [ "atlas-design-record-iluvatar-bi-v150", "atlas-path-iluvatar-bi-v150" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-49480cf28f17187d" ], "summary": "Iluvatar CoreX is the named company for Tiangai 150 / BI-V150 in the normalized product record.", "evidence_state": "independent", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Second-generation general-purpose GPU. Normalized compute record: 48 TFLOPS · FP32 · reported peak | 192 TFLOPS · FP16/BF16 · reported peak", "evidence_state": "independent", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 7 nm · advanced-constrained · reported.", "evidence_state": "reported", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: 2.5D CoWoS stated in a public manual copy.", "evidence_state": "reported", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_card. Availability record: Commercial card supported by current HAMi device sharing and heterogeneous-cluster work.", "evidence_state": "independent", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 64 GB/s peak · manual-copy shared bidirectional value; other reported values conflict.", "evidence_state": "reported", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: IXUCA · CoreX SDK · framework compatibility · virtualization · vGPU. No teardown or credible neutral accelerator benchmark found.", "evidence_state": "derived", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Commercial card supported by current HAMi device sharing and heterogeneous-cluster work.", "evidence_state": "independent", "source_ids": [ "src-atlas-49480cf28f17187d" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "kunlunxin-p800", "relationship_ids": [ "atlas-design-record-kunlunxin-p800", "atlas-path-kunlunxin-p800" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-09497d62f3e4abd2", "src-atlas-8d89c26d9a18ec84", "src-atlas-9ae9e04eb1ae03f7" ], "summary": "Kunlunxin / Baidu is the named company for P800 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-09497d62f3e4abd2", "src-atlas-8d89c26d9a18ec84", "src-atlas-9ae9e04eb1ae03f7" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Third-generation XPU-P optimized for MoE, MLA, and 8-bit inference. Normalized compute record: public figures conflict; no authoritative datasheet found", "evidence_state": "official", "source_ids": [ "src-atlas-09497d62f3e4abd2", "src-atlas-8d89c26d9a18ec84", "src-atlas-9ae9e04eb1ae03f7" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Eight-card system passed a named CAICT DeepSeek adaptation test; large deployments are company-reported.", "evidence_state": "independent", "source_ids": [ "src-atlas-09497d62f3e4abd2", "src-atlas-8d89c26d9a18ec84", "src-atlas-9ae9e04eb1ae03f7" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: XPU stack · PaddlePaddle · PyTorch build · KLX3 Triton · vllm-kunlun · xtorch_ops. CAICT adaptation artifact and a TechInsights floorplan analysis exist; accessible detailed silicon measurements remain incomplete.", "evidence_state": "derived", "source_ids": [ "src-atlas-09497d62f3e4abd2", "src-atlas-8d89c26d9a18ec84", "src-atlas-9ae9e04eb1ae03f7" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Eight-card system passed a named CAICT DeepSeek adaptation test; large deployments are company-reported.", "evidence_state": "independent", "source_ids": [ "src-atlas-09497d62f3e4abd2", "src-atlas-8d89c26d9a18ec84", "src-atlas-9ae9e04eb1ae03f7" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "horizon-journey-6", "relationship_ids": [ "atlas-design-record-horizon-journey-6", "atlas-path-horizon-journey-6" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "summary": "Horizon Robotics is the named company for Journey 6 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "BPU Nash with integrated CPU, GPU, MCU, ISP, and safety islands. Normalized compute record: 560 effective TOPS · family maximum · official with one-half sparsity and TPP under 4,800; not dense datacenter BF16", "evidence_state": "official", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 7 nm · advanced-constrained · reported.", "evidence_state": "reported", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · LPDDR5X · 0.204 TB/s peak · reported J6P 192-bit LPDDR5X-8533; capacity chosen by module/OEM.", "evidence_state": "reported", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Integrated automotive SoC/module; no HBM.", "evidence_state": "official", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: automotive_ai_soc_family. Availability record: Family launched in 2024; Journey 6 products are in vehicle production programs.", "evidence_state": "official", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: OpenExplorer · horizon_tc_ui · HMCT · HBDK4 · runtime · model zoo. A commercial J6E module teardown exists, but detailed results are paywalled. Production vehicle evidence exists.", "evidence_state": "derived", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Family launched in 2024; Journey 6 products are in vehicle production programs.", "evidence_state": "official", "source_ids": [ "src-atlas-5f169f8d23f5bc8b", "src-atlas-6286a572960cb96f", "src-atlas-f41e75a6d3a6a02c" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "alibaba-t-head-hanguang-800", "relationship_ids": [ "atlas-design-record-alibaba-t-head-hanguang-800", "atlas-path-alibaba-t-head-hanguang-800" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-2362ce7652927c41", "src-atlas-7ba385a60b7a4962", "src-atlas-d3da566ac27187d4" ], "summary": "Alibaba / T-Head is the named company for Hanguang 800 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-2362ce7652927c41", "src-atlas-7ba385a60b7a4962", "src-atlas-d3da566ac27187d4" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "T-Head neural processing unit for search, translation, recommendation, advertising, and customer-service inference. Normalized compute record: No normalized like-for-like compute rate in the reviewed primary record", "evidence_state": "official", "source_ids": [ "src-atlas-2362ce7652927c41", "src-atlas-7ba385a60b7a4962", "src-atlas-d3da566ac27187d4" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: internal_cloud_accelerator. Availability record: Alibaba said on September 25, 2019 that Hanguang 800 was used internally, and later said it was deployed in Alibaba Cloud data centers; current merchant availability and deployment scale are not established.", "evidence_state": "official", "source_ids": [ "src-atlas-2362ce7652927c41", "src-atlas-7ba385a60b7a4962", "src-atlas-d3da566ac27187d4" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: HGAI model conversion and compilation path · integration path for mainstream deep-learning inference frameworks. No independent product teardown, workload reproduction, current shipment receipt, or production-volume record is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-2362ce7652927c41", "src-atlas-7ba385a60b7a4962", "src-atlas-d3da566ac27187d4" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Alibaba said on September 25, 2019 that Hanguang 800 was used internally, and later said it was deployed in Alibaba Cloud data centers; current merchant availability and deployment scale are not established.", "evidence_state": "official", "source_ids": [ "src-atlas-2362ce7652927c41", "src-atlas-7ba385a60b7a4962", "src-atlas-d3da566ac27187d4" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "tencent-zixiao-c100", "relationship_ids": [ "atlas-design-record-tencent-zixiao-c100", "atlas-path-tencent-zixiao-c100" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "summary": "Tencent is the named company for Zixiao C100 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Tencent Zixiao accelerator for computer vision, optical character recognition, natural-language processing, image, text, and speech inference. Normalized compute record: 120 TFLOPS · FP16 · Tencent Cloud PTX1 instance specification for one Zixiao C100 device; sustained application performance is not stated", "evidence_state": "official", "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: unknown · 16 GB · Tencent lists 16 GB of device memory; memory technology, placement, supplier, and bandwidth are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: C100 accelerator card inside Tencent Cloud PTX1 instances; die and package construction unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: cloud_accelerator_card. Availability record: Tencent Cloud records PTX1 as launched in December 2022; this proves a named cloud-instance offering, not standalone card shipments or current volume.", "evidence_state": "official", "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Tencent Cloud AI inference environment. No independent chip benchmark, teardown, customer qualification record, or shipment-volume receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Tencent Cloud records PTX1 as launched in December 2022; this proves a named cloud-instance offering, not standalone card shipments or current volume.", "evidence_state": "official", "source_ids": [ "src-atlas-001c9b5d13605335", "src-atlas-bbcaab1123ddced2", "src-atlas-cf230d086080b8e8" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "hygon-dcu-8000", "relationship_ids": [ "atlas-design-record-hygon-dcu-8000", "atlas-path-hygon-dcu-8000" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-2c78c73fc084cb04", "src-atlas-2cf813ccb61b0cde", "src-atlas-7d34f38ba91064db", "src-atlas-9b3cee9443d11a56" ], "summary": "Hygon is the named company for DCU 8000 series in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-2c78c73fc084cb04", "src-atlas-2cf813ccb61b0cde", "src-atlas-7d34f38ba91064db", "src-atlas-9b3cee9443d11a56" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Hygon describes DCU as a GPGPU using a general parallel-computing architecture. Normalized compute record: double, single, half precision, and integer formats supported · The reviewed filing states supported format classes but does not provide a normalized generation-specific peak rate", "evidence_state": "official", "source_ids": [ "src-atlas-2c78c73fc084cb04", "src-atlas-2cf813ccb61b0cde", "src-atlas-7d34f38ba91064db", "src-atlas-9b3cee9443d11a56" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: accelerator_family. Availability record: Hygon filings say Deep Computing No. 1 completed product validation and entered commercial application in 2021, and had begun scaled sales by June 2022; the current 8000-series generation, volumes, and customer scope remain unnormalized.", "evidence_state": "official", "source_ids": [ "src-atlas-2c78c73fc084cb04", "src-atlas-2cf813ccb61b0cde", "src-atlas-7d34f38ba91064db", "src-atlas-9b3cee9443d11a56" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: DTK software stack · self-developed operators · third-party components. Exchange filings establish company statements and historical commercialization wording. They do not establish independent workload results, named customers, current shipment counts, or production yield.", "evidence_state": "official", "source_ids": [ "src-atlas-2c78c73fc084cb04", "src-atlas-2cf813ccb61b0cde", "src-atlas-7d34f38ba91064db", "src-atlas-9b3cee9443d11a56" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Hygon filings say Deep Computing No. 1 completed product validation and entered commercial application in 2021, and had begun scaled sales by June 2022; the current 8000-series generation, volumes, and customer scope remain unnormalized.", "evidence_state": "official", "source_ids": [ "src-atlas-2c78c73fc084cb04", "src-atlas-2cf813ccb61b0cde", "src-atlas-7d34f38ba91064db", "src-atlas-9b3cee9443d11a56" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "sophgo-bm1690", "relationship_ids": [ "atlas-design-record-sophgo-bm1690", "atlas-path-sophgo-bm1690" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-1a5664d9f6c17765", "src-atlas-761fa9eecb96d9ea", "src-atlas-8cd82c3305ac4156", "src-atlas-f3a5d7c78fc4caf5" ], "summary": "SOPHGO is the named company for BM1690 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-1a5664d9f6c17765", "src-atlas-761fa9eecb96d9ea", "src-atlas-8cd82c3305ac4156", "src-atlas-f3a5d7c78fc4caf5" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "SOPHGO tensor processor supported through SOPHONSDK and TPU-MLIR tooling. Normalized compute record: No normalized BM1690 peak rate in the reviewed primary pages", "evidence_state": "official", "source_ids": [ "src-atlas-1a5664d9f6c17765", "src-atlas-761fa9eecb96d9ea", "src-atlas-8cd82c3305ac4156", "src-atlas-f3a5d7c78fc4caf5" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: processor_family. Availability record: SOPHGO records BM1690 as released in 2024 and documents continuing software enablement; the public record normalized here does not establish volume production or customer qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-1a5664d9f6c17765", "src-atlas-761fa9eecb96d9ea", "src-atlas-8cd82c3305ac4156", "src-atlas-f3a5d7c78fc4caf5" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: SOPHONSDK · TPU-MLIR · multi-core MatMul support · model regression tests · operator-development path. Software changelogs establish tool activity and regression testing, not production scale, customer acceptance, or independent workload performance.", "evidence_state": "official", "source_ids": [ "src-atlas-1a5664d9f6c17765", "src-atlas-761fa9eecb96d9ea", "src-atlas-8cd82c3305ac4156", "src-atlas-f3a5d7c78fc4caf5" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: SOPHGO records BM1690 as released in 2024 and documents continuing software enablement; the public record normalized here does not establish volume production or customer qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-1a5664d9f6c17765", "src-atlas-761fa9eecb96d9ea", "src-atlas-8cd82c3305ac4156", "src-atlas-f3a5d7c78fc4caf5" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "denglin-goldwasser-l", "relationship_ids": [ "atlas-design-record-denglin-goldwasser-l", "atlas-path-denglin-goldwasser-l" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "partial", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "summary": "DenglinAI is the named company for Goldwasser I L series in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Denglin GPU+ accelerator supported by the Hamming software stack. Normalized compute record: No normalized like-for-like peak rate in the reviewed primary product pages", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: unknown · 64 GB · 0.239 TB/s peak · Company peak for L128/L256; memory technology and sustained bandwidth are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Enterprise accelerator-card family; die and package construction unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: accelerator_card_family. Availability record: Denglin currently lists Goldwasser I L, Goldwasser II GS, and third-generation KS lines; current shipment quantity, customer qualification, and readiness of later generations are not established.", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Power record: 25 W · Company typical-power specification for the L128/L256 product table.", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Hamming software stack · mainstream AI-model inference path. No independent product benchmark, teardown, production-volume record, or named customer acceptance receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Denglin currently lists Goldwasser I L, Goldwasser II GS, and third-generation KS lines; current shipment quantity, customer qualification, and readiness of later generations are not established.", "evidence_state": "official", "source_ids": [ "src-atlas-7d07ed76a4a49929", "src-atlas-c3e2306259635fb0", "src-atlas-d3cd8f187d385fed", "src-atlas-dd89e93294f43dd9" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "vastai-va10-family", "relationship_ids": [ "atlas-design-record-vastai-va10-family", "atlas-path-vastai-va10-family" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "summary": "Vastai Technologies is the named company for VA10 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Vastai Unified Compute Architecture full-function GPU family spanning accelerator cards and appliances. Normalized compute record: No normalized like-for-like card compute rate in the reviewed primary pages", "evidence_state": "official", "source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: VA10-family accelerator cards and VGX VA16 appliance boundary; die and package construction unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: accelerator_and_system_family. Availability record: Vastai says two chip generations reached mass production and commercialization, and called VA1L and VA10L mass-produced in September 2024; audited units, named recipients, current availability, and qualification remain unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: VUCA · Kylin · UnionTech OS · Anolis OS · openEuler · company-stated model adaptation for Llama, Qwen, Baichuan, ChatGLM, and Stable Diffusion. Company mass-production and model-adaptation wording is not independent testing and does not establish shipment volume or workload parity.", "evidence_state": "official", "source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Vastai says two chip generations reached mass production and commercialization, and called VA1L and VA10L mass-produced in September 2024; audited units, named recipients, current availability, and qualification remain unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-5a2ab9962ec8a505", "src-atlas-79bb2b46cec3ad70", "src-atlas-dc14099b302e74a8", "src-atlas-e23d1506d07d833b" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "axera-ax650-family", "relationship_ids": [ "atlas-design-record-axera-ax650-family", "atlas-path-axera-ax650-family" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "summary": "Axera is the named company for AX650 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Axera Neutron NPU integrated with Arm CPU, AI image-signal processing, and video engines. Normalized compute record: 10.8 TOPS · INT8 · AX650N vendor peak; the same source states 43.2 TOPS at INT4 | 43.2 TOPS · INT4 · AX650N vendor peak; not comparable with INT8, FP16, or application throughput without a matched workload", "evidence_state": "official", "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · 64-bit LPDDR4X interface · AX650N interface support; device capacity, memory supplier, and sustained bandwidth are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Integrated edge AI SoC; separate 1050-series DIMM system-on-module products use AX650-family silicon.", "evidence_state": "official", "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: edge_ai_soc_family. Availability record: Axera's 2026 prospectus defines AX650 as a commercialized endpoint-computing series; this means external-sale revenue was recognized, not that current volume, customers, or profitability are established.", "evidence_state": "official", "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Axera SDK · AX-LLM evaluation repository · mainstream deep-learning framework conversion path. PSA Certified Level 1 is a bounded security-certification receipt for named products. It does not establish automotive functional safety, workload performance, volume, or complete-system qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Axera's 2026 prospectus defines AX650 as a commercialized endpoint-computing series; this means external-sale revenue was recognized, not that current volume, customers, or profitability are established.", "evidence_state": "official", "source_ids": [ "src-atlas-3900c910fe419b0f", "src-atlas-625f0841670e9e08", "src-atlas-6b6d0a2ed63bf092", "src-atlas-ae9fe08bf7480a9b", "src-atlas-d187a0cd4aa5e239" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "intellifusion-deepedge10-family", "relationship_ids": [ "atlas-design-record-intellifusion-deepedge10-family", "atlas-path-intellifusion-deepedge10-family" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-159f320b1c93bd19" ], "summary": "Intellifusion is the named company for DeepEdge10 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-159f320b1c93bd19" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "DeepEdge10C, DeepEdge10, and DeepEdge10Max use Intellifusion's NNP400T neural processor; DeepEdge10Max adds a vendor-described D2D chiplet interconnect for scalable edge inference. Normalized compute record: 8 TOPS · INT8 · DeepEdge10C vendor peak; the same page lists 4 TOPS INT16 and 1.5 TFLOPS FP16 | 16 TOPS · INT8 · DeepEdge10 vendor peak; the same page lists 8 TOPS INT16 and 2 TFLOPS FP16 | 64 TOPS · INT8 · DeepEdge10Max vendor peak; the same page lists 32 TOPS INT16 and 8 TFLOPS FP16", "evidence_state": "official", "source_ids": [ "src-atlas-159f320b1c93bd19" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Integrated edge SoC family; DeepEdge10Max is described as a chiplet design, but die and package construction are not disclosed.", "evidence_state": "official", "source_ids": [ "src-atlas-159f320b1c93bd19" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: edge_ai_soc_family. Availability record: Intellifusion currently lists DeepEdge10C, DeepEdge10, and DeepEdge10Max as chip products and lists modules and cards built around its processors; this does not establish shipment volume, named recipients, or current production capacity.", "evidence_state": "official", "source_ids": [ "src-atlas-159f320b1c93bd19" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: DeepEdge10Max uses a vendor-described D2D chiplet interconnect; topology, die count, protocol, and rate are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-159f320b1c93bd19" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: model quantization, compilation, and deployment SDK · PyTorch · ONNX · TensorFlow · support for CNN, RNN, Transformer, and GNN networks. No independent teardown, matched-workload benchmark, customer qualification, shipment count, or production-yield receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-159f320b1c93bd19" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Intellifusion currently lists DeepEdge10C, DeepEdge10, and DeepEdge10Max as chip products and lists modules and cards built around its processors; this does not establish shipment volume, named recipients, or current production capacity.", "evidence_state": "official", "source_ids": [ "src-atlas-159f320b1c93bd19" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "corerain-caisa-430", "relationship_ids": [ "atlas-design-record-corerain-caisa-430", "atlas-path-corerain-caisa-430" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "summary": "Corerain is the named company for CAISA 430 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Fourth-generation CAISA 4.0 reconfigurable dataflow architecture with a 24-core Arm Cortex-A55 CPU complex and support for CNN, RNN, and Transformer networks. Normalized compute record: 16 TOPS · INT8 · Vendor peak for CAISA 430; the same page says INT16 and FP32 are supported without normalized peak rates", "evidence_state": "official", "source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · LPDDR4X · 48 GB · 0.0896 TB/s peak · Vendor peak of 89.6 GB/s for the stated three-channel LPDDR4X memory path; sustained application bandwidth is not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: edge_ai_accelerator_soc. Availability record: Corerain currently lists CAISA 430 as an orderable-inquiry product and shows systems based on the architecture; the page does not establish shipment volume, current production capacity, or customer qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: RainBuilder compiler toolchain · TensorFlow · PyTorch · Caffe · ONNX · MXNet. Vendor utilization and peak-throughput statements are not independent workload measurements and do not establish sustained model performance, power efficiency, or volume production.", "evidence_state": "official", "source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Corerain currently lists CAISA 430 as an orderable-inquiry product and shows systems based on the architecture; the page does not establish shipment volume, current production capacity, or customer qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-229e5b592b1e9d49", "src-atlas-f61a067a7a89d767" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "corerain-n460h", "relationship_ids": [ "atlas-design-record-corerain-n460h", "atlas-path-corerain-n460h" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "partial", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "summary": "Corerain is the named company for Stellar N460H in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Corerain high-performance AI inference card with a vendor-listed three-by-24-core Arm Cortex-A55 controller configuration; accelerator die count and package topology are not stated. Normalized compute record: 48 TOPS · INT8 · N460H vendor peak; not sustained application throughput | 12 TOPS · INT16 · N460H vendor peak; not directly comparable with INT8 or FP32 rates | 384 GFLOPS · FP32 · N460H vendor peak; sustained workload performance is not stated", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · LPDDR4X · 144 GB · Memory bandwidth, topology, and supplier are not stated on the N460H card page.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Passive, single-slot, half-height half-length card measuring 169.5 by 69.2 by 18.5 mm; accelerator die and package construction are unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: accelerator_card. Availability record: Corerain currently lists N460H as a product with ordering inquiry; this establishes a vendor-offered card specification, not stock, shipment volume, named customer qualification, or installed capacity.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Vendor lists a PCIe Gen3 x8 physical interface and a PCIe Gen3 x2 data-link interface; measured host-transfer throughput and multi-card fabric are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Power record: 75 W · Vendor maximum card power, stated as no more than 75 W.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: OpenEuler operating system by default · RainBuilder compiler toolchain. No independent card teardown, measured host-transfer result, sustained model benchmark, qualification record, or shipment count is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Corerain currently lists N460H as a product with ordering inquiry; this establishes a vendor-offered card specification, not stock, shipment volume, named customer qualification, or installed capacity.", "evidence_state": "official", "source_ids": [ "src-atlas-1c48a778197fdca2", "src-atlas-f61a067a7a89d767" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "tsingmicro-tx5-family", "relationship_ids": [ "atlas-design-record-tsingmicro-tx5-family", "atlas-path-tsingmicro-tx5-family" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "summary": "TsingMicro is the named company for TX5 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "TX5 family uses TsingMicro's reconfigurable neural-network engine; individual members add CGRA image processing, general-compute acceleration, GPU or 3D engines, video codecs, and vision-processing blocks. Normalized compute record: W4A8 mixed-precision quantization supported on TX5326 · The reviewed family page does not provide a normalized numeric peak for TX5326, TX5336, TX5368, or TX5215", "evidence_state": "official", "source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Integrated edge SoC family including TX5326, TX5336, TX5368, and TX5215; package construction is not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: edge_ai_soc_family. Availability record: TsingMicro says the TX5 family is in scaled mass production; this is a vendor readiness claim and does not establish audited units, named recipients, current capacity, or qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: vendor-described mature deployment toolchain · mainstream-framework compatibility · intelligent quantization · Transformer, LLM, and VLM edge-model support. No independent teardown, framework reproduction, matched-workload result, qualification receipt, or audited shipment count is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: TsingMicro says the TX5 family is in scaled mass production; this is a vendor readiness claim and does not establish audited units, named recipients, current capacity, or qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-a9e4a3eb66486d99" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "black-sesame-huashan-a1000-family", "relationship_ids": [ "atlas-design-record-black-sesame-huashan-a1000-family", "atlas-path-black-sesame-huashan-a1000-family" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-665cb201ca3cd619" ], "summary": "Black Sesame Technologies is the named company for Huashan A1000 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-665cb201ca3cd619" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Huashan automotive SoC family consisting of A1000, A1000L, and A1000 Pro; the reviewed filing describes proprietary IP cores and an integrated driving-compute platform without disclosing a normalized microarchitecture. Normalized compute record: The reviewed 2025 annual report does not provide generation-normalized peak compute rates for A1000, A1000L, and A1000 Pro", "evidence_state": "official", "source_ids": [ "src-atlas-665cb201ca3cd619" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: automotive_ai_soc_family. Availability record: Black Sesame's 2025 annual report says the A1000 family achieved mass production and deployment, remained in vehicle programs, and was the main contributor to company chip sales in 2025; audited unit volume and product-level customer qualification are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-665cb201ca3cd619" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Hanhai ADAS middleware platform · peripheral open interfaces and commonly used basic software components. The exchange filing is a primary company record. Its product, certification, integration, and readiness wording is not an independent workload, safety, shipment-volume, or supply-chain validation.", "evidence_state": "official", "source_ids": [ "src-atlas-665cb201ca3cd619" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Black Sesame's 2025 annual report says the A1000 family achieved mass production and deployment, remained in vehicle programs, and was the main contributor to company chip sales in 2025; audited unit volume and product-level customer qualification are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-665cb201ca3cd619" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "jingjia-micro-jm11-family", "relationship_ids": [ "atlas-design-record-jingjia-micro-jm11-family", "atlas-path-jingjia-micro-jm11-family" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-61588c19f7b763d5" ], "summary": "Jingjia Micro is the named company for JM11 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Jingjia Micro GPU family with hardware virtualization and passthrough virtualization support; the reviewed filing does not disclose a normalized microarchitecture. Normalized compute record: No normalized peak compute rate is stated for the JM11 family in the reviewed filing", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: gpu_chip_family. Availability record: Jingjia Micro's 2025 annual report lists JM11 as released in 2025 and at the small-batch delivery-and-use stage; it also describes a 32-session cloud-desktop deployment, but does not disclose recipient identity, product units, or current production capacity.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Windows · Linux · mainstream operating systems used in China · hardware virtualization · passthrough virtualization. Company-reported application and concurrency wording is not an independent benchmark, product teardown, customer acceptance record, or audited shipment count.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Jingjia Micro's 2025 annual report lists JM11 as released in 2025 and at the small-batch delivery-and-use stage; it also describes a 32-session cloud-desktop deployment, but does not disclose recipient identity, product units, or current production capacity.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "jingjia-micro-ch37-family", "relationship_ids": [ "atlas-design-record-jingjia-micro-ch37-family", "atlas-path-jingjia-micro-ch37-family" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-61588c19f7b763d5" ], "summary": "Jingjia Micro / Chengheng Micro is the named company for CH37 family in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Chengheng Micro high-integration single-chip SoC with CPU, GPU, NPU, GPGPU, ISP, DSP, and VPU processing blocks. Normalized compute record: 64 TOPS · INT8 · CH37 family vendor peak in Jingjia Micro's filing; sustained workload performance is not stated", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: High-integration single-chip edge AI SoC; die and package construction are not disclosed.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: edge_ai_soc_family. Availability record: Jingjia Micro's 2025 annual report places CH37 in the small-batch production stage and says customer introduction and software work are continuing; this does not establish audited units, named recipients, or qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: supporting software under continued development according to the filing · flexible compute-precision support. The filing establishes the company's stated product and readiness stage, not an independent workload result, customer acceptance receipt, or audited production count.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Jingjia Micro's 2025 annual report places CH37 in the small-batch production stage and says customer introduction and software work are continuing; this does not establish audited units, named recipients, or qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-61588c19f7b763d5" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "lisuan-lx-7g100", "relationship_ids": [ "atlas-design-record-lisuan-lx-7g100", "atlas-path-lisuan-lx-7g100" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-13dac09c006da88b" ], "summary": "Lisuan Technology is the named company for LX 7G100 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-13dac09c006da88b" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Lisuan TrueGPU graphics architecture with NRSS super-resolution support. Normalized compute record: The reviewed official product page does not provide a peak compute rate or a normalized AI-acceleration rate", "evidence_state": "official", "source_ids": [ "src-atlas-13dac09c006da88b" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: gddr · GDDR6 · 12 GB · The product page states 12 GB GDDR6; bus width, data rate, supplier, and bandwidth are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-13dac09c006da88b" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: 294 by 120 by 49 mm discrete graphics card with active axial-fan cooling; GPU die and package construction are unknown.", "evidence_state": "official", "source_ids": [ "src-atlas-13dac09c006da88b" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: discrete_graphics_card. Availability record: Lisuan currently lists LX 7G100 as a consumer product and links to online purchasing; this does not establish stock, shipments, sell-through, named customers, or production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-13dac09c006da88b" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: DirectX 12 · Vulkan 1.3 · OpenGL 4.6 · OpenCL 3.0 · Lisuan driver download center · NRSS super resolution. No independent board teardown, driver-compatibility audit, matched gaming or AI benchmark, qualification receipt, or audited shipment count is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-13dac09c006da88b" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Lisuan currently lists LX 7G100 as a consumer product and links to online purchasing; this does not establish stock, shipments, sell-through, named customers, or production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-13dac09c006da88b" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "innosilicon-fenghua-3", "relationship_ids": [ "atlas-design-record-innosilicon-fenghua-3", "atlas-path-innosilicon-fenghua-3" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-f0377f591ec0d868" ], "summary": "Innosilicon is the named company for Fenghua 3 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-f0377f591ec0d868" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Full-function GPU with a vendor-described CUDA-compatible programming path and an integrated Nanhu V3 open-source RISC-V CPU. Normalized compute record: single, double, and mixed precision supported · The launch article describes supported precision classes and workloads but does not provide a normalized peak compute rate", "evidence_state": "official", "source_ids": [ "src-atlas-f0377f591ec0d868" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: high_bandwidth_discrete · high-bandwidth video memory; technology not stated · 112 GB · The vendor calls the memory high bandwidth but does not state memory technology, supplier, interface width, data rate, or numeric bandwidth.", "evidence_state": "official", "source_ids": [ "src-atlas-f0377f591ec0d868" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Single-card product boundary is stated; physical form factor, die count, package construction, assembly, and test path are not disclosed.", "evidence_state": "official", "source_ids": [ "src-atlas-f0377f591ec0d868" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: accelerator_card_family. Availability record: Innosilicon says Fenghua 3 was launched on September 22, 2025, demonstrated at the event, and covered by ecosystem agreements for future systems and clusters; this does not establish working units outside the demonstration, current shipments, installed clusters, or production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-f0377f591ec0d868" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: PyTorch · Triton · HIP and CUDA-compatible frameworks · OpenCL · DirectX 12 · Vulkan 1.2 · OpenGL 4.6 · UOS · Kylin · Windows · Android · vGPU virtualization. Launch demonstrations and ecosystem agreements are vendor evidence, not an independent benchmark, teardown, customer acceptance record, shipment receipt, or production audit.", "evidence_state": "official", "source_ids": [ "src-atlas-f0377f591ec0d868" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Innosilicon says Fenghua 3 was launched on September 22, 2025, demonstrated at the event, and covered by ecosystem agreements for future systems and clusters; this does not establish working units outside the demonstration, current shipments, installed clusters, or production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-f0377f591ec0d868" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "unisoc-t9100", "relationship_ids": [ "atlas-design-record-unisoc-t9100", "atlas-path-unisoc-t9100" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "summary": "UNISOC is the named company for T9100 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Octa-core Arm CPU with one Cortex-A76 at 2.7 GHz, three Cortex-A76 cores at 2.3 GHz, four Cortex-A55 cores at 2.1 GHz, an Arm Mali-G57 MC4 GPU, and an integrated NPU. Normalized compute record: 8 TOPS · UNISOC peak NPU claim; precision, power envelope, utilization, and sustained application rate are not stated", "evidence_state": "official", "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 6 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · LPDDR4X · 32 GB · UNISOC states LPDDR4X at 2133 MHz and eMMC 5.1 or UFS 3.1 storage support; bus width and memory bandwidth are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: mobile_ai_soc. Availability record: UNISOC currently maintains a T9100 product page; the page does not establish a named device design win, customer qualification, shipment count, or current production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: access to mainstream AI training frameworks · advanced model-compression tooling · compatibility with more than 200 neural-network operators · on-device AI development and debugging environment. No independent teardown, device-level workload benchmark, named-customer qualification, shipment count, or production-yield receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: UNISOC currently maintains a T9100 product page; the page does not establish a named device design win, customer qualification, shipment count, or current production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-7b79dc972ba8d16f" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "unisoc-a7870", "relationship_ids": [ "atlas-design-record-unisoc-a7870", "atlas-path-unisoc-a7870" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "partial", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-841b4e6a06b99c11" ], "summary": "UNISOC is the named company for A7870 series in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Octa-core Arm CPU with one Cortex-A76 at 2.7 GHz, three Cortex-A76 cores at 2.3 GHz, four Cortex-A55 cores at 2.1 GHz, a four-core NATT GPU at 850 MHz, and an IMG AX3596 NPU. Normalized compute record: 8 TOPS · UNISOC peak IMG AX3596 NPU claim; precision, power envelope, utilization, and sustained application rate are not stated | 486.4 GFLOPS · UNISOC peak NATT GPU claim in the product overview; the parameter table rounds the same GPU claim to 486 GFLOPS", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 6 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Lithography claim: UNISOC product page labels the process TSMC 6nm EUV. not independent foundry, scanner, facility, volume, yield, or China-developed DUV/EUV capability proof", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · LPDDR4X · 32 GB · UNISOC states LPDDR4X at 2133 MHz and eMMC 5.1 or UFS 3.1 storage support; bus width and memory bandwidth are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: automotive_cockpit_soc_family. Availability record: UNISOC lists the A7870 series as an automotive-grade smart-cockpit processor and uses AEC-Q100 process-system and support wording; the reviewed page does not establish a named vehicle, customer qualification, mass-production start, or shipment volume.", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: UNISOC lists PCIe 3.0, MIPI DSI, DisplayPort 1.4, CSI, UFS 3.1, I2S, and other system interfaces; lane topology, chip-to-chip fabric, and sustained rate are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: QNX · Linux · Android Automotive · virtual-machine multi-baseline cockpit software · integrated cockpit, parking, and T-Box solution path. The UNISOC product page labels the process as 'TSMC 6nm EUV.' This packet records that exact label only as an official UNISOC claim, not as independent foundry, lithography-tool, wafer-production, facility, volume, or yield proof. No independent teardown, vehicle benchmark, or qualification receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: UNISOC lists the A7870 series as an automotive-grade smart-cockpit processor and uses AEC-Q100 process-system and support wording; the reviewed page does not establish a named vehicle, customer qualification, mass-production start, or shipment volume.", "evidence_state": "official", "source_ids": [ "src-atlas-841b4e6a06b99c11" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "rockchip-rk3588", "relationship_ids": [ "atlas-design-record-rockchip-rk3588", "atlas-path-rockchip-rk3588" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "summary": "Rockchip is the named company for RK3588 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Quad-core Arm Cortex-A76 plus quad-core Cortex-A55 CPU, Arm Mali-G610 MC4 GPU, and triple-core NPU. Normalized compute record: 6 TOPS · INT4 / INT8 / INT16 / FP16 / BF16 / TF32 support · Rockchip aggregate NPU peak claim; the page lists supported arithmetic formats but does not map 6 TOPS to a specific precision or sustained workload", "evidence_state": "official", "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 8 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: edge_compute_soc. Availability record: Rockchip currently maintains an RK3588 product page; that page does not establish named board or device availability, customer qualification, shipment count, or current production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Rockchip lists PCIe 3.0, PCIe 2.0, SATA 3.0, RGMII, USB Type-C, USB 3.1, and USB 2.0; lane topology and sustained rates are not stated and these are not a normalized accelerator fabric.", "evidence_state": "official", "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Android · Linux · OpenCL 1.1, 1.2, and 2.0 GPU support. No independent teardown, matched-workload benchmark, board-level acceptance record, shipment count, or production-yield receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Rockchip currently maintains an RK3588 product page; that page does not establish named board or device availability, customer qualification, shipment count, or current production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-84d8ab12b1d2bf18" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "allwinner-v853", "relationship_ids": [ "atlas-design-record-allwinner-v853", "atlas-path-allwinner-v853" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "summary": "Allwinner is the named company for V853 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Arm Cortex-A7 CPU up to 1.2 GHz, RISC-V XuanTie E907 MCU up to 600 MHz, integrated NPU, Allwinner codec engine, and image-signal processor. Normalized compute record: 1 TOPS · INT8 · Allwinner peak NPU claim; power envelope, utilization, and sustained application rate are not stated", "evidence_state": "official", "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: ddr · DDR3 / DDR3L · Allwinner lists DDR3 and DDR3L support plus SD 3.0, eMMC 5.0, SPI NOR, and SPI NAND storage; capacity, bus width, supplier, and bandwidth are not stated.", "evidence_state": "official", "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: edge_ai_vision_soc. Availability record: Allwinner currently maintains a V853 product page and lists target applications; the examples are product positioning, not named design wins, customer qualification, shipment counts, or production-volume receipts.", "evidence_state": "official", "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Allwinner lists USB, SMHC, GPIO, SPI, TWI, UART, GMAC, GPADC, PWM, and other peripheral interfaces; no accelerator-fabric rate is stated.", "evidence_state": "official", "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Tina Linux · FreeRTOS. No independent teardown, device-level workload benchmark, named-customer qualification, shipment count, or production-yield receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Allwinner currently maintains a V853 product page and lists target applications; the examples are product positioning, not named design wins, customer qualification, shipment counts, or production-volume receipts.", "evidence_state": "official", "source_ids": [ "src-atlas-93a0cdb1c7b5310c" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "nio-shenji-nx9031", "relationship_ids": [ "atlas-design-record-nio-shenji-nx9031", "atlas-path-nio-shenji-nx9031" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-b5f9ed8a0678a62b" ], "summary": "NIO is the named company for Shenji NX9031 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-b5f9ed8a0678a62b" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "NIO describes Shenji NX9031 as its proprietary automotive-grade smart-driving chip; the reviewed primary source does not disclose a normalized CPU, GPU, NPU, or tensor architecture. Normalized compute record: No precision-specific peak or sustained compute rate is stated in the reviewed NIO release", "evidence_state": "official", "source_ids": [ "src-atlas-b5f9ed8a0678a62b" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: automotive_smart_driving_chip. Availability record: NIO said ET9 deliveries began on March 29, 2025 and that two Shenji NX9031 chips were integrated into every ET9. This establishes vehicle integration at the stated launch, not delivered ET9 quantity, broader-model deployment, customer qualification, or chip production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-b5f9ed8a0678a62b" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: NIO assisted and intelligent-driving feature stack. The NIO release is a primary company receipt for the stated ET9 delivery start and two-chip configuration. It is not an independent teardown, workload, safety, field-reliability, unit-volume, supply-chain, or yield validation.", "evidence_state": "official", "source_ids": [ "src-atlas-b5f9ed8a0678a62b" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: NIO said ET9 deliveries began on March 29, 2025 and that two Shenji NX9031 chips were integrated into every ET9. This establishes vehicle integration at the stated launch, not delivered ET9 quantity, broader-model deployment, customer qualification, or chip production volume.", "evidence_state": "official", "source_ids": [ "src-atlas-b5f9ed8a0678a62b" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "xpeng-turing-ai-chip", "relationship_ids": [ "atlas-design-record-xpeng-turing-ai-chip", "atlas-path-xpeng-turing-ai-chip" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-7412383edddfacd7", "src-atlas-ca81e3660c91770b" ], "summary": "XPeng is the named company for XPENG Turing chip in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-7412383edddfacd7", "src-atlas-ca81e3660c91770b" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "XPeng unveiled the Turing chip as part of its AI architecture and said it is applicable to robots, AI-defined cars, and eVOTLs; the reviewed product-specific release does not disclose a normalized accelerator architecture. Normalized compute record: No product-specific peak or sustained compute rate is stated in the reviewed XPeng release and filing", "evidence_state": "official", "source_ids": [ "src-atlas-7412383edddfacd7", "src-atlas-ca81e3660c91770b" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: automotive_and_robotics_ai_chip_program. Availability record: XPeng unveiled the Turing chip on August 27, 2024. The reviewed sources do not establish a product-specific vehicle integration, customer qualification, completed production ramp, shipment, or current merchant-availability receipt.", "evidence_state": "official", "source_ids": [ "src-atlas-7412383edddfacd7", "src-atlas-ca81e3660c91770b" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: XPENG AI architecture. XPeng's separate 2024 annual filing says unnamed processing hardware taped out in August 2024 and warns that development, design wins, and production ramp may not succeed. This packet does not convert that generic filing language into Turing-specific production proof. No independent teardown or workload receipt is normalized here.", "evidence_state": "official", "source_ids": [ "src-atlas-7412383edddfacd7", "src-atlas-ca81e3660c91770b" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: XPeng unveiled the Turing chip on August 27, 2024. The reviewed sources do not establish a product-specific vehicle integration, customer qualification, completed production ramp, shipment, or current merchant-availability receipt.", "evidence_state": "official", "source_ids": [ "src-atlas-7412383edddfacd7", "src-atlas-ca81e3660c91770b" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "li-auto-mahe-m100", "relationship_ids": [ "atlas-design-record-li-auto-mahe-m100", "atlas-path-li-auto-mahe-m100" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-0c85e440636bcc7e", "src-atlas-64ee46503634d134" ], "summary": "Li Auto is the named company for MAHE M100 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-0c85e440636bcc7e", "src-atlas-64ee46503634d134" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Li Auto describes M100 as its proprietary autonomous-driving inference chip designed for synergy with its full-stack autonomous-driving algorithms; the reviewed filings do not disclose a normalized CPU, GPU, NPU, or tensor architecture. Normalized compute record: No precision-specific peak or sustained compute rate is stated in the reviewed Li Auto filings", "evidence_state": "official", "source_ids": [ "src-atlas-0c85e440636bcc7e", "src-atlas-64ee46503634d134" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized memory technology, capacity, bandwidth, or manufacturer record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: automotive_autonomous_driving_inference_chip. Availability record: Li Auto said it launched and began deliveries of the all-new Li L9 in May 2026: the Ultra uses one proprietary MAHE M100 and the Livis uses two. This establishes the stated vehicle configuration and delivery start, not delivered-unit count, chip shipment volume, or independent vehicle qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-0c85e440636bcc7e", "src-atlas-64ee46503634d134" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Li Auto full-stack autonomous-driving algorithms · MindVLA large model and 3D ViT Encoder in the all-new Li L9 vehicle configuration. Li Auto's SEC-filed results release is a primary company receipt for the stated May 2026 Li L9 launch, delivery start, and M100 configurations. It is not an independent teardown, matched driving-workload benchmark, safety, field-reliability, unit-volume, supply-chain, or yield validation.", "evidence_state": "official", "source_ids": [ "src-atlas-0c85e440636bcc7e", "src-atlas-64ee46503634d134" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Li Auto said it launched and began deliveries of the all-new Li L9 in May 2026: the Ultra uses one proprietary MAHE M100 and the Livis uses two. This establishes the stated vehicle configuration and delivery start, not delivered-unit count, chip shipment volume, or independent vehicle qualification.", "evidence_state": "official", "source_ids": [ "src-atlas-0c85e440636bcc7e", "src-atlas-64ee46503634d134" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "nvidia-blackwell-b200", "relationship_ids": [ "atlas-design-record-nvidia-blackwell-b200", "atlas-supplier-record-nvidia-blackwell-b200-logic_foundry_process-tsmc", "atlas-path-nvidia-blackwell-b200" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "partial", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "known", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "summary": "NVIDIA is the named company for Blackwell B200 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Blackwell dual-die Tensor Core GPU used in HGX and DGX B200 systems. Normalized compute record: FP4 through FP64 · Peak rate depends on precision, sparsity, and HGX or DGX configuration", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-24203513100c1d6d" ], "summary": "Process claim: 4 nm · advanced · official. Named supplier record: NVIDIA states that Blackwell GPUs are manufactured on a custom TSMC 4NP process.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "This establishes the named foundry and process for the Blackwell GPU. It does not identify the facility, wafer lot, masks, equipment, materials, yield, package, assembly site, shipment volume, or every component in an HGX or DGX system." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM3e · 180 GB · 8 TB/s peak · B200 SXM GPU specification; do not read the value as rack aggregate bandwidth.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Two reticle-sized Blackwell dies connected by a company-stated 10 TB/s die-to-die link in one HBM-equipped accelerator package; packaging supplier is not named.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_gpu. Availability record: NVIDIA documents current HGX and DGX B200 systems; this does not establish unrestricted standalone-GPU availability or shipment volume.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 1800 GB/s peak · Fifth-generation NVLink per B200 GPU in HGX and DGX; topology and aggregate rate depend on the system.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Power record: 1000 W · Configurable maximum per B200 GPU in the reviewed HGX reference; not server, rack, or wall power.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CUDA · TensorRT-LLM · NCCL · Triton. Specifications and availability are NVIDIA claims. Workload throughput, usable bandwidth, power, acceptance, and delivered configuration require system-specific receipts.", "evidence_state": "derived", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: NVIDIA documents current HGX and DGX B200 systems; this does not establish unrestricted standalone-GPU availability or shipment volume.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-b8ff78c83d18e130", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "nvidia-blackwell-b300", "relationship_ids": [ "atlas-design-record-nvidia-blackwell-b300", "atlas-path-nvidia-blackwell-b300" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "partial", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "summary": "NVIDIA is the named company for Blackwell Ultra B300 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Blackwell Ultra Tensor Core GPU used in HGX and DGX B300 systems. Normalized compute record: FP4 through FP64 · Peak rate depends on precision, sparsity, and HGX or DGX configuration", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM3e · 288 GB · 8 TB/s peak · Per B300 GPU; do not read the value as eight-GPU or rack aggregate bandwidth.", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: SXM accelerator with HBM3e; the reviewed official sources do not establish the B300 package technology, substrate, foundry, or packaging supplier.", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_gpu. Availability record: NVIDIA describes DGX B300 as available and documents first-customer support; this remains a vendor availability claim.", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 1800 GB/s peak · Fifth-generation NVLink per B300 GPU in HGX and DGX; topology and aggregate rate depend on the system.", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Power record: 1100 W · Configurable maximum per B300 GPU in the reviewed HGX reference; GB300 configurations differ and this is not server, rack, or wall power.", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CUDA · TensorRT-LLM · NCCL · Triton. Specifications and availability are NVIDIA claims. Production volume, customer acceptance, sustained collectives, and accepted-workload economics remain separate receipts.", "evidence_state": "derived", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: NVIDIA describes DGX B300 as available and documents first-customer support; this remains a vendor availability claim.", "evidence_state": "official", "source_ids": [ "src-atlas-7f9540f347b9ce35", "src-atlas-9f9d8f06c94b8ace", "src-atlas-cc28745ad0f7c9e4" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "nvidia-gb200-nvl72", "relationship_ids": [ "atlas-design-record-nvidia-gb200-nvl72", "atlas-supplier-record-nvidia-gb200-nvl72-logic_foundry_process-tsmc", "atlas-path-nvidia-gb200-nvl72" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "partial", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "known", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "summary": "NVIDIA is the named company for GB200 NVL72 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Grace Blackwell rack with 72 Blackwell GPUs and 36 Grace CPUs in one NVLink domain. Normalized compute record: multiple · Rack aggregate and workload result depend on precision, sparsity, software, cooling, and utilization", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-6499ff99cb5c9ee3" ], "summary": "Process claim: 4 nm · advanced · official. Named supplier record: GB200 NVL72 contains Blackwell GPUs, and NVIDIA states that Blackwell GPUs are manufactured on custom TSMC 4NP.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "This is a component-level foundry relationship for the Blackwell GPUs inside GB200. It is not a foundry claim for Grace CPUs, switches, memory, power, cooling, or every component in the rack, and it does not establish facility, lot, yield, or volume." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm-plus-lpddr · HBM3e GPU memory plus LPDDR5X CPU memory · 13400 GB · 576 TB/s peak · Up-to rack aggregate HBM3e capacity and GPU-memory bandwidth; not per-GPU bandwidth.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: An NVL72 rack with 18 compute trays, nine NVLink switch trays, power shelves, bus bars, and liquid-cooling manifolds; it is not one chip package.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: rack_scale_accelerator_system. Availability record: NVIDIA documents deployed and supported GB200 rack systems; shipment and installed-base totals are not established here.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 130000 GB/s peak · Rack aggregate fifth-generation NVLink across 72 GPUs; direction, collectives, and delivered topology still matter.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Power record: Liquid-cooled rack; the reviewed record does not normalize delivered rack wall power, facility overhead, or cooling supplier.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CUDA · NCCL · TensorRT-LLM · NVIDIA AI Enterprise. Rack power, cooling, fabric utilization, model quality, and accepted workload throughput must be measured together.", "evidence_state": "derived", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: NVIDIA documents deployed and supported GB200 rack systems; shipment and installed-base totals are not established here.", "evidence_state": "official", "source_ids": [ "src-atlas-24203513100c1d6d", "src-atlas-4524551d9aa90859", "src-atlas-6499ff99cb5c9ee3", "src-atlas-fd28c3b1a54de001" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "nvidia-gb300-nvl72", "relationship_ids": [ "atlas-design-record-nvidia-gb300-nvl72", "atlas-supplier-record-nvidia-gb300-nvl72-memory_manufacturer-sk-hynix", "atlas-path-nvidia-gb300-nvl72" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "partial", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "known", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "summary": "NVIDIA is the named company for GB300 NVL72 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Grace Blackwell Ultra rack with 72 B300 GPUs and 36 Grace CPUs in one NVLink domain. Normalized compute record: multiple · Rack aggregate and workload result depend on precision, sparsity, software, cooling, and utilization", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-818f53dfd97ac373" ], "summary": "Memory record: hbm-plus-lpddr · HBM3e GPU memory plus LPDDR5X CPU memory · 20000 GB · 576 TB/s peak · Company-stated rack HBM3e capacity and aggregate GPU-memory bandwidth; NVIDIA separately states 37 TB of fast memory including CPU memory. Named supplier record: SK hynix states that a live NVIDIA GB300 GPU module at GTC 2026 used its HBM3e.", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "This establishes at least one company-reported GB300 module integration. It does not prove exclusivity, the supplier mix or lot allocation for every rack, HBM capacity by lot, rack shipment volume, customer acceptance, or the LPDDR supplier." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: An NVL72 rack-scale system, not one chip package; the reviewed official sources do not establish component package, substrate, or supplier provenance.", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: rack_scale_accelerator_system. Availability record: NVIDIA labels GB300 NVL72 available and documents first-customer support; this remains a vendor availability claim.", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 130000 GB/s peak · Rack aggregate fifth-generation NVLink across 72 GPUs; ConnectX-8 scale-out and delivered topology remain system-level questions.", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Power record: Liquid-cooled rack; the reviewed record does not normalize delivered rack wall power, facility overhead, or cooling supplier.", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CUDA · NCCL · TensorRT-LLM · NVIDIA AI Enterprise. Shipment volume, customer acceptance, delivered rack configuration, power, cooling, fabric utilization, and accepted workload throughput remain separate receipts.", "evidence_state": "derived", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: NVIDIA labels GB300 NVL72 available and documents first-customer support; this remains a vendor availability claim.", "evidence_state": "official", "source_ids": [ "src-atlas-127d4157899a1ec9", "src-atlas-748d12a572b96feb", "src-atlas-818f53dfd97ac373", "src-atlas-b2168e082011867c" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "nvidia-vera-rubin-nvl72", "relationship_ids": [ "atlas-design-record-nvidia-vera-rubin-nvl72", "atlas-supplier-record-nvidia-vera-rubin-nvl72-memory_manufacturer-sk-hynix", "atlas-path-nvidia-vera-rubin-nvl72" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "partial", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "summary": "NVIDIA is the named company for Vera Rubin NVL72 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Vera Rubin rack with 72 Rubin GPUs, 36 Vera CPUs, NVLink 6, ConnectX-9, BlueField-4, and Quantum-X800 or Spectrum-X networking. Normalized compute record: multiple · NVIDIA labels the published rack specifications preliminary and up-to; no independent production-system result is claimed", "evidence_state": "official", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "partial", "supplier_relationship_source_ids": [ "src-atlas-818f53dfd97ac373" ], "summary": "Memory record: hbm-plus-lpddr · HBM4 GPU memory plus LPDDR5X CPU memory · 20700 GB · 1580 TB/s peak · Preliminary up-to rack HBM4 capacity and aggregate bandwidth; per Rubin GPU NVIDIA states 288 GB and 22 TB/s. Named supplier record: SK hynix states that its HBM4 is slated to be adopted in NVIDIA Rubin and displayed the product on a Vera Rubin module at GTC 2026.", "evidence_state": "official", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "This is a company-stated planned adoption and demonstration, not proof of exclusivity, final supplier allocation, shipped production lots, customer acceptance, yield, volume, or the complete HBM4 and LPDDR supplier set." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: rack_scale_ai_platform. Availability record: NVIDIA says Rubin is in full production and partner systems are planned for the second half of 2026; the product page still labels specifications preliminary, so broad customer availability is not claimed.", "evidence_state": "official", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: 260000 GB/s peak · Preliminary rack NVLink 6 switch bandwidth; NVIDIA states 3.6 TB/s per GPU and ConnectX-9 scale-out at 1.6 Tb/s per GPU.", "evidence_state": "official", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Power record: NVIDIA states 100% liquid cooling and a preliminary 45°C warm-water inlet condition; delivered rack wall power, facility overhead, and cooling supplier are not normalized.", "evidence_state": "official", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: CUDA · NCCL · TensorRT-LLM · NVIDIA AI Enterprise. No independently verified customer shipment, accepted rack, final specification, or production workload receipt is claimed.", "evidence_state": "derived", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: NVIDIA says Rubin is in full production and partner systems are planned for the second half of 2026; the product page still labels specifications preliminary, so broad customer availability is not claimed.", "evidence_state": "official", "source_ids": [ "src-atlas-169b39cc7f09274c", "src-atlas-432bd9e208d49df7", "src-atlas-4c164468c1f3f0eb", "src-atlas-5fed51a077e8474e", "src-atlas-818f53dfd97ac373" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "amd-instinct-mi300x", "relationship_ids": [ "atlas-design-record-amd-instinct-mi300x", "atlas-path-amd-instinct-mi300x" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "summary": "AMD is the named company for Instinct MI300X in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "CDNA 3 chiplet accelerator. Normalized compute record: FP8 through FP64 · Precision and matrix mode dependent", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 5 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM3 · 192 GB · 5.3 TB/s peak · Per MI300X accelerator peak.", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: OAM accelerator with chiplets and HBM3; package, substrate, and assembly suppliers are not identified here.", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_gpu. Availability record: AMD publishes MI300X as a current product; supplier allocation, shipment volume, and cloud availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Infinity Fabric; topology and delivered rate depend on the system.", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: ROCm · HIP · RCCL · MIGraphX. Use model-, software-version-, system-, and workload-specific tests.", "evidence_state": "derived", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: AMD publishes MI300X as a current product; supplier allocation, shipment volume, and cloud availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-27a1b24d9b9d0525" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "amd-instinct-mi325x", "relationship_ids": [ "atlas-design-record-amd-instinct-mi325x", "atlas-path-amd-instinct-mi325x" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-4188c64ef166f594" ], "summary": "AMD is the named company for Instinct MI325X in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "CDNA 3 chiplet accelerator. Normalized compute record: FP8 through FP64 · Precision and matrix mode dependent", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 5 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM3e · 256 GB · 6 TB/s peak · Per MI325X accelerator peak.", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: OAM accelerator with chiplets and HBM3e; package, substrate, and assembly suppliers are not identified here.", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_gpu. Availability record: AMD publishes MI325X as a current product; supplier allocation, shipment volume, and system availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Infinity Fabric; topology and delivered rate depend on the system.", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: ROCm · HIP · RCCL · MIGraphX. Use model-, software-version-, system-, and workload-specific tests.", "evidence_state": "derived", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: AMD publishes MI325X as a current product; supplier allocation, shipment volume, and system availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-4188c64ef166f594" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "amd-instinct-mi350x", "relationship_ids": [ "atlas-design-record-amd-instinct-mi350x", "atlas-path-amd-instinct-mi350x" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-918e143f4ae59526" ], "summary": "AMD is the named company for Instinct MI350X in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "CDNA 4 chiplet accelerator. Normalized compute record: FP4 through FP64 · Precision and matrix mode dependent", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 3 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM3e · 288 GB · 8 TB/s peak · Per MI350X accelerator peak.", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: OAM accelerator with chiplets and HBM3e; package, substrate, and assembly suppliers are not identified here.", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_gpu. Availability record: AMD publishes MI350X as a current product; supplier allocation, shipment volume, and system availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Infinity Fabric; topology and delivered rate depend on the system.", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: ROCm · HIP · RCCL · MIGraphX. Production system and workload receipts remain separate from product-page specifications.", "evidence_state": "derived", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: AMD publishes MI350X as a current product; supplier allocation, shipment volume, and system availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-918e143f4ae59526" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "amd-instinct-mi355x", "relationship_ids": [ "atlas-design-record-amd-instinct-mi355x", "atlas-path-amd-instinct-mi355x" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-780b66f499f7b7f7" ], "summary": "AMD is the named company for Instinct MI355X in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "CDNA 4 chiplet accelerator. Normalized compute record: FP4 through FP64 · Precision and matrix mode dependent", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 3 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM3e · 288 GB · 8 TB/s peak · Per MI355X accelerator peak.", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: OAM accelerator with chiplets and HBM3e; package, substrate, and assembly suppliers are not identified here.", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_gpu. Availability record: AMD publishes MI355X as a current product; supplier allocation, shipment volume, and partner availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Infinity Fabric; topology and delivered rate depend on the system.", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: ROCm · HIP · RCCL · MIGraphX. Production system and workload receipts remain separate from product-page specifications.", "evidence_state": "derived", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: AMD publishes MI355X as a current product; supplier allocation, shipment volume, and partner availability remain separate records.", "evidence_state": "official", "source_ids": [ "src-atlas-780b66f499f7b7f7" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "intel-gaudi-3", "relationship_ids": [ "atlas-design-record-intel-gaudi-3", "atlas-path-intel-gaudi-3" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-923ed39addeeb70e" ], "summary": "Intel is the named company for Gaudi 3 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Matrix-math and tensor processor accelerator with integrated Ethernet. Normalized compute record: BF16/FP8 · official SKU table", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 5 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM2e · 128 GB · 3.7 TB/s peak · official peak.", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Accelerator package with HBM2e.", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: datacenter_accelerator_family. Availability record: Production accelerator available through systems and cloud instances.", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Integrated Ethernet ports; topology depends on system.", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: SynapseAI · PyTorch · DeepSpeed. Software coverage and end-to-end workload fit remain decisive.", "evidence_state": "derived", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Production accelerator available through systems and cloud instances.", "evidence_state": "official", "source_ids": [ "src-atlas-923ed39addeeb70e" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "intel-arc-b-series", "relationship_ids": [ "atlas-design-record-intel-arc-b-series", "atlas-path-intel-arc-b-series" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-a931987589247b74" ], "summary": "Intel is the named company for Arc B-Series in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Xe2 graphics architecture with XMX AI engines. Normalized compute record: mixed · SKU dependent", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: gddr · GDDR6 · SKU dependent.", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Discrete client GPU board.", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: client_accelerator_family. Availability record: Shipping client GPU family.", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: PCIe client GPU.", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: oneAPI · OpenVINO · XeSS. Not a datacenter HBM accelerator; included to make the chip-type boundary visible.", "evidence_state": "derived", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Shipping client GPU family.", "evidence_state": "official", "source_ids": [ "src-atlas-a931987589247b74" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "cerebras-wse-3", "relationship_ids": [ "atlas-design-record-cerebras-wse-3", "atlas-path-cerebras-wse-3" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "summary": "Cerebras is the named company for WSE-3 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Entire-wafer compute engine with distributed on-wafer SRAM. Normalized compute record: 125 PFLOPS · AI · company peak", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 5 nm · advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: on-wafer-sram · On-wafer SRAM plus external memory systems · 44 GB · 21000 TB/s peak · company-stated on-wafer memory bandwidth, not off-package DRAM bandwidth.", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: Wafer-scale engine in a CS-3 system.", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: wafer_scale_accelerator_system_family. Availability record: Production CS-3 systems and cloud service.", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: SwarmX and MemoryX system fabric.", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Cerebras Software Platform · PyTorch integration. On-wafer bandwidth is a different scope from HBM bandwidth and must not be compared without the data path.", "evidence_state": "derived", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Production CS-3 systems and cloud service.", "evidence_state": "official", "source_ids": [ "src-atlas-c44b9c2c5e7301ef" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "groq-lpu", "relationship_ids": [ "atlas-design-record-groq-lpu", "atlas-path-groq-lpu" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "partial", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-6ca459b5a00428d5" ], "summary": "Groq is the named company for LPU / GroqRack in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Compiler-scheduled streaming processor with on-chip SRAM. Normalized compute record: mixed · chip and system dependent", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: 14 nm · mature-node-class · official.", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: on-chip-sram · On-chip SRAM with model distributed across chips · internal memory and chip-to-chip path differ from HBM GPU systems.", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Package record: LPU cards and rack-scale systems.", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: accelerator_and_rack_system_family. Availability record: Production cloud inference and rack offerings.", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Chip-to-chip streaming fabric.", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Groq compiler · GroqCloud API. Model support, quality, batch behavior, and end-to-end serving are workload-specific.", "evidence_state": "derived", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Production cloud inference and rack offerings.", "evidence_state": "official", "source_ids": [ "src-atlas-6ca459b5a00428d5" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "google-tpu", "relationship_ids": [ "atlas-design-record-google-tpu", "atlas-path-google-tpu" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "summary": "Google is the named company for TPU v5e / v5p / Trillium / Ironwood in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Tensor Processing Unit family deployed through Google Cloud. Normalized compute record: multiple · generation dependent", "evidence_state": "official", "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM, generation dependent · generation dependent.", "evidence_state": "official", "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: cloud_accelerator_family. Availability record: Multiple production Google Cloud generations; newest generations have distinct preview/availability states.", "evidence_state": "official", "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: ICI pod topology, generation dependent.", "evidence_state": "official", "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: XLA · JAX · TensorFlow · PyTorch/XLA. Keep each generation and cloud availability state separate in procurement decisions.", "evidence_state": "derived", "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Multiple production Google Cloud generations; newest generations have distinct preview/availability states.", "evidence_state": "official", "source_ids": [ "src-atlas-bb0aaa5608b2679c" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "aws-trainium-inferentia", "relationship_ids": [ "atlas-design-record-aws-trainium-inferentia", "atlas-path-aws-trainium-inferentia" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "summary": "Amazon Web Services is the named company for Trainium / Inferentia in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "AWS NeuronCore accelerators exposed through EC2 instances. Normalized compute record: multiple · generation and instance dependent", "evidence_state": "official", "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No source-bounded logic foundry and process record is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm-or-external · Generation dependent · instance and generation dependent.", "evidence_state": "official", "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: cloud_accelerator_family. Availability record: Production EC2 accelerator instances; individual generations vary.", "evidence_state": "official", "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: NeuronLink/EFA, generation and instance dependent.", "evidence_state": "official", "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: AWS Neuron SDK · PyTorch · JAX. Cloud availability, compiler coverage, and accepted-task cost are the relevant receipts.", "evidence_state": "derived", "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Production EC2 accelerator instances; individual generations vary.", "evidence_state": "official", "source_ids": [ "src-atlas-c2fda96ed6a6bacc", "src-atlas-e65f50446f1d0405" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "microsoft-maia", "relationship_ids": [ "atlas-design-record-microsoft-maia", "atlas-path-microsoft-maia" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "partial", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "summary": "Microsoft is the named company for Maia 100 / Maia 200 in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Microsoft-designed datacenter AI accelerator integrated with Azure systems. Normalized compute record: multiple · generation dependent", "evidence_state": "official", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: hbm · HBM-class · generation dependent.", "evidence_state": "official", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: cloud_accelerator_family. Availability record: Microsoft deployment/roadmap family; customer access varies by generation.", "evidence_state": "official", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Interconnect record: Azure system fabric.", "evidence_state": "official", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Azure AI stack · Triton. Internal deployment does not equal broadly orderable customer capacity.", "evidence_state": "derived", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Microsoft deployment/roadmap family; customer access varies by generation.", "evidence_state": "official", "source_ids": [ "src-atlas-bdcaeb3bfd099e47" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." }, { "product_id": "meta-mtia", "relationship_ids": [ "atlas-design-record-meta-mtia", "atlas-path-meta-mtia" ], "path_state": "source_bounded_known_and_unknown_stages", "required_stage_status": { "design_company": "known", "architecture_ip": "partial", "eda": "unknown", "logic_foundry_process": "partial", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "partial", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "partial", "networking": "unknown", "power_cooling": "unknown", "software_workload": "partial", "qualification_volume_deployment": "partial" }, "required_stage_status_semantics": "product_fact_coverage", "supplier_relationship_status": { "design_company": "known", "architecture_ip": "unknown", "eda": "unknown", "logic_foundry_process": "unknown", "lithography": "unknown", "wafer_equipment": "unknown", "critical_materials": "unknown", "memory_manufacturer": "unknown", "package_provider": "unknown", "assembly_test": "unknown", "board_system": "unknown", "networking": "unknown", "power_cooling": "unknown", "software_workload": "unknown", "qualification_volume_deployment": "unknown" }, "required_stage_evidence": { "design_company": { "state": "known", "product_fact_state": "known", "supplier_relationship_state": "known", "supplier_relationship_source_ids": [ "src-atlas-45b4e630ca93241d" ], "summary": "Meta is the named company for MTIA in the normalized product record.", "evidence_state": "official", "source_ids": [ "src-atlas-45b4e630ca93241d" ], "boundary": "This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record." }, "architecture_ip": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Meta Training and Inference Accelerator for internal workloads. Normalized compute record: multiple · revision dependent", "evidence_state": "official", "source_ids": [ "src-atlas-45b4e630ca93241d" ], "boundary": "The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "eda": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "logic_foundry_process": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Process claim: advanced · official.", "evidence_state": "official", "source_ids": [ "src-atlas-45b4e630ca93241d" ], "boundary": "A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "lithography": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "wafer_equipment": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "critical_materials": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "memory_manufacturer": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Memory record: lpddr · LPDDR-class, revision dependent · revision dependent.", "evidence_state": "official", "source_ids": [ "src-atlas-45b4e630ca93241d" ], "boundary": "A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "package_provider": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific package record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "assembly_test": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.", "evidence_state": "unknown", "source_ids": [], "boundary": "Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "board_system": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Product boundary: internal_datacenter_accelerator_family. Availability record: Deployed internally; not a merchant accelerator.", "evidence_state": "official", "source_ids": [ "src-atlas-45b4e630ca93241d" ], "boundary": "A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "networking": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific scale-up or scale-out interconnect path.", "evidence_state": "unknown", "source_ids": [], "boundary": "A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "power_cooling": { "state": "unknown", "product_fact_state": "unknown", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "No normalized product-specific power and cooling record.", "evidence_state": "unknown", "source_ids": [], "boundary": "A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "software_workload": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Named software: Meta internal compiler and runtime · PyTorch integration. Internal production is a different commercial state from an orderable product.", "evidence_state": "derived", "source_ids": [ "src-atlas-45b4e630ca93241d" ], "boundary": "Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." }, "qualification_volume_deployment": { "state": "partial", "product_fact_state": "partial", "supplier_relationship_state": "unknown", "supplier_relationship_source_ids": [], "summary": "Availability record: Deployed internally; not a merchant accelerator.", "evidence_state": "official", "source_ids": [ "src-atlas-45b4e630ca93241d" ], "boundary": "Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.", "supplier_relationship_boundary": "No product-specific supplier relationship is established by this stage record." } }, "boundary": "The product-to-named-company association and any explicitly listed supplier edges are source backed at their stated scope. Known and partial stage states describe bounded product facts, not a complete bill of materials. Every unproved supplier, facility, qualification, yield, shipment-volume, exclusivity, and country-of-origin step remains unknown." } ], "products": [ { "commercial_state": "commercial_catalogue_region_dependent", "completion_state": "source_backed", "entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-alibaba-ecs-c8y", "last_checked": "2026-07-29", "name": "Alibaba Cloud ECS c8y instance family", "product_class": "cloud_compute_instance_family", "product_id": "prod-alibaba-ecs-c8y", "record_type": "product", "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ], "unknowns": [ "region-specific legal operator", "actual availability", "facility", "installed CPU count", "server BOM", "utilization", "uptime", "customer/workload" ] }, { "commercial_state": "commercial_catalogue_region_dependent", "completion_state": "source_backed", "entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-alibaba-ecs-g8y", "last_checked": "2026-07-29", "name": "Alibaba Cloud ECS g8y instance family", "product_class": "cloud_compute_instance_family", "product_id": "prod-alibaba-ecs-g8y", "record_type": "product", "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ], "unknowns": [ "region-specific legal operator", "actual availability", "facility", "installed CPU count", "server BOM", "utilization", "uptime", "customer/workload" ] }, { "commercial_state": "commercial_catalogue_region_dependent", "completion_state": "source_backed", "entity_id": "ent-alibaba-cloud-ecs-brand-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-alibaba-ecs-r8y", "last_checked": "2026-07-29", "name": "Alibaba Cloud ECS r8y instance family", "product_class": "cloud_compute_instance_family", "product_id": "prod-alibaba-ecs-r8y", "record_type": "product", "source_ids": [ "src-alibaba-ecs-yitian-instance-families-20260625" ], "unknowns": [ "region-specific legal operator", "actual availability", "facility", "installed CPU count", "server BOM", "utilization", "uptime", "customer/workload" ] }, { "commercial_state": "launched_apply_for_trial", "completion_state": "source_backed", "entity_id": "ent-baidu-ai-cloud-brand-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-baidu-baige-deepseek-p800", "last_checked": "2026-07-29", "name": "Baidu Baige DeepSeek appliance — 8-card P800 configuration", "product_class": "enterprise_ai_appliance", "product_id": "prod-baidu-baige-deepseek-p800", "record_type": "product", "source_ids": [ "src-baidu-baige-deepseek-p800-20250217" ], "unknowns": [ "orders", "shipment", "customer acceptance", "server OEM/BOM", "sustained workload/latency/energy", "reliability" ] }, { "commercial_state": "firmware_supported_option", "completion_state": "source_backed", "entity_id": "ent-biren-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-biren-104p", "last_checked": "2026-07-29", "name": "Biren 104P", "product_class": "accelerator_option", "product_id": "prod-biren-104p", "record_type": "product", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "unknowns": [ "legal supplier", "configured server SKU", "order", "shipment", "installation", "customer" ] }, { "commercial_state": "volume_production_and_commercialization_issuer_reported", "completion_state": "volume_backed", "entity_id": "ent-biren-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-biren-br106-family", "last_checked": "2026-07-29", "name": "BR106 form-factor family", "product_class": "ai_accelerator_family", "product_id": "prod-biren-br106-family", "record_type": "product", 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"batch_supply_vendor_reported", "completion_state": "relationship_backed", "entity_id": "ent-gentech", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-gentech-gas-chemical-box", "last_checked": "2026-07-29", "name": "Gas Box / Chemical Box / Bubbler", "product_class": "gas_and_chemical_delivery_subassembly", "product_id": "prod-gentech-gas-chemical-box", "record_type": "product", "source_ids": [ "src-gentech-annual-2025" ], "unknowns": [ "SKU-to-equipment-maker mapping", "qualified tool model", "facility", "quantity", "foreign valves/MFC/controllers" ] }, { "commercial_state": "historical_product", "completion_state": "relationship_backed", "entity_id": "ent-gloway-brand", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-gloway-yi-pro-2020", "last_checked": "2026-07-29", "name": "Yi Pro memory module (2020)", "product_class": "dram_module", "product_id": "prod-gloway-yi-pro-2020", "record_type": "product", "source_ids": [ "src-gloway-cxmt-yipro" ], "unknowns": [ "exact SKU", "current status", "controller/PMIC/PCB BOM", "volume" ] }, { "commercial_state": "official_firmware_release", "completion_state": "source_backed", "entity_id": "ent-h3c-technologies", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-h3c-h65-bios-574", "last_checked": "2026-07-29", "name": "H65-BIOS-5.74", "product_class": "server_firmware", "product_id": "prod-h3c-h65-bios-574", "record_type": "product", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "unknowns": [ "configured SKU", "order", "shipment", "customer validation", "installed base", "volume" ] }, { "commercial_state": "official_product", "completion_state": "source_backed", "entity_id": "ent-h3c-technologies", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-h3c-uniserver-r4930-g3", "last_checked": "2026-07-29", "name": "H3C UniServer R4930 G3", "product_class": "dual_socket_rack_server", "product_id": "prod-h3c-uniserver-r4930-g3", "record_type": "product", "source_ids": [ "src-h3c-r4930g3-product" ], "unknowns": [ "factory", "CPU SKU", "shipments", "customer", "installed base", "capacity", "failure rate", "component origins" ] }, { "commercial_state": "stable_supply_vendor_reported", "completion_state": "relationship_backed", "entity_id": "ent-hanjing", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-hanjing-quartz-sic-components", "last_checked": "2026-07-29", "name": "High-purity quartz and silicon-carbide equipment components", "product_class": "equipment_consumables_and_chamber_components", "product_id": "prod-hanjing-quartz-sic-components", "record_type": "product", "source_ids": [ "src-gentech-annual-2025" ], "unknowns": [ "component SKU", "grade", "purity", "tool model", "fab", "layer", "quantity" ] }, { "commercial_state": "shipped_to_named_equipment_customers", "completion_state": "relationship_backed", "entity_id": "ent-hengyunchang", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-hengyunchang-rf-power", "last_checked": "2026-07-29", "name": "RF power supply systems", "product_class": "rf_power", "product_id": "prod-hengyunchang-rf-power", "record_type": "product", "source_ids": [ "src-hengyunchang-annual-2025" ], "unknowns": [ "SKU by customer", "fab", "tool model", "accepted layer", "stop-line spares" ] }, { "commercial_state": "installed_in_volume_shipped_2021_Li_ONE", "completion_state": "volume_backed", "entity_id": "ent-horizon-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-horizon-journey-3", "last_checked": "2026-07-29", "name": "Journey 3", "product_class": "automotive_ai_accelerator", "product_id": "prod-horizon-journey-3", "record_type": "product", "source_ids": [ "src-li-auto-2021q1-results-20210526" ], "unknowns": [ "contracting legal entity", "foundry", "package/OSAT", "procurement quantity", "yield", "field failure rate" ] }, { "commercial_state": "design_win_announced_for_unidentified_BYD_models", "completion_state": "source_backed", "entity_id": "ent-horizon-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-horizon-journey-5", "last_checked": "2026-07-29", "name": "Journey 5", "product_class": "automotive_ai_accelerator", "product_id": "prod-horizon-journey-5", "record_type": "product", "source_ids": [ "src-byd-horizon-journey5-designwin-20220421" ], "unknowns": [ "contracting legal entities", "vehicle model", "SOP", "installed units", "foundry", "package/OSAT", "yield" ] }, { "commercial_state": "strategic_co_development_vendor_reported", "completion_state": "source_backed", "entity_id": "ent-houmo", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-houmo-h30", "last_checked": "2026-07-29", "name": "鸿途 H30", "peak_compute": { "INT8": "256 TOPS reported" }, "product_class": "automotive_compute_in_memory_accelerator", "product_id": "prod-houmo-h30", "record_type": "product", "source_ids": [ "src-houmo-h30-youkong-20231229" ], "unknowns": [ "counterparty legal entity", "production vehicle", "foundry", "memory", "package/OSAT", "units", "qualification", "yield" ] }, { "architecture_classification": [ "H3" ], "board_power": "10 W reported", "commercial_state": "integrated_in_announced_great_wall_n90_pro_vendor_reported", "completion_state": "relationship_backed", "entity_id": "ent-houmo", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-houmo-m50", "last_checked": "2026-07-29", "memory_bandwidth": "153.6 GB/s", "memory_capacity": "up to 48 GB", "memory_type": "LPDDR5", "name": "M50", "peak_compute": { "INT8": "160 TOPS", "bFP16": "100 TFLOPS" }, "product_class": "pc_compute_in_memory_accelerator", "product_id": "prod-houmo-m50", "record_type": "product", "source_ids": [ "src-houmo-m50-product", "src-houmo-m50-greatwall-20260531" ], "unknowns": [ "LPDDR5 supplier", "foundry", "package/OSAT", "units", "retail shipments", "acceptance", "independent workload", "yield" ] }, { "commercial_state": "certified_vendor_reported", "completion_state": "source_backed", "entity_id": "ent-huate-gas", "foreign_dependencies": [ "foreign excimer-laser platform certification/use may remain necessary" ], "foreign_dependency_status": "identified_candidates", "id": "prod-huate-excimer-gases", "last_checked": "2026-07-29", "name": "Excimer-lithography gas mixtures", "product_class": "lithography_gases", "product_id": "prod-huate-excimer-gases", "record_type": "product", "source_ids": [ "src-huate-gas-annual-2025" ], "unknowns": [ "scanner/laser model", "fab", "batch purity", "consumption", "certification date/scope" ] }, { "commercial_state": "named_project_in_construction_ledger", "completion_state": "relationship_backed", "entity_id": "ent-huate-gas", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-huate-onsite-hydrogen-system", "last_checked": "2026-07-29", "name": "Onsite hydrogen generation and supply system", "product_class": "facility_bulk_gas_system", "product_id": "prod-huate-onsite-hydrogen-system", "record_type": "product", "source_ids": [ "src-huate-gas-annual-2025" ], "unknowns": [ "contracting Huate subsidiary", "site address", "contract value", "delivery", "commissioning", "acceptance", "actual flow", "uptime", "gas purity", "process insertion" ] }, { "commercial_state": "integrated_in_online_cloud_service", "completion_state": "facility_backed", "entity_id": "ent-huawei-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-huawei-ascend-910b2", "last_checked": "2026-07-29", "name": "Ascend 910B2", "product_class": "ai_accelerator", "product_id": "prod-huawei-ascend-910b2", "record_type": "product", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "unknowns": [ "legal designer/manufacturer", "foundry", "memory", "package/OSAT", "quantity", "power", "yield" ] }, { "commercial_state": "integrated_in_online_cloud_service_family", "completion_state": "relationship_backed", "entity_id": "ent-huawei-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-huawei-atlas-300i-duo", "last_checked": "2026-07-29", "name": "Atlas 300I Duo", "product_class": "ai_accelerator_card", "product_id": "prod-huawei-atlas-300i-duo", "record_type": "product", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "unknowns": [ "legal supplier", "generation scope", "foundry", "memory", "package/OSAT", "quantity", "yield" ] }, { "commercial_state": "integrated_in_online_cloud_service_family", "completion_state": "relationship_backed", "entity_id": "ent-huawei-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-huawei-atlas-300i-pro", "last_checked": "2026-07-29", "name": "Atlas 300I Pro", "product_class": "ai_accelerator_card", "product_id": "prod-huawei-atlas-300i-pro", "record_type": "product", "source_ids": [ "src-ctyun-ascend-cloud-20260508" ], "unknowns": [ "legal supplier", "foundry", "memory", "package/OSAT", "quantity", "yield" ] }, { "commercial_state": "production_line_use_reported", "completion_state": "relationship_backed", "entity_id": "ent-hwatsing", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-hwatsing-cmp-portfolio", "last_checked": "2026-07-29", "name": "Universal-series CMP equipment portfolio", "product_class": "cmp_equipment", "product_id": "prod-hwatsing-cmp-portfolio", "record_type": "product", "source_ids": [ "src-hwatsing-inquiry-2021" ], "unknowns": [ "exact model by customer", "facility", "qualified layer", "acceptance date", "throughput", "yield effect" ] }, { "commercial_state": "integrated_in_official_server_product", "completion_state": "source_backed", "entity_id": "ent-hygon-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-hygon-7000-series", "last_checked": "2026-07-29", "name": "Hygon 7000 series", "product_class": "server_cpu_family", "product_id": "prod-hygon-7000-series", "record_type": "product", "source_ids": [ "src-h3c-r4930g3-product" ], "unknowns": [ "legal supplier", "exact CPU SKU/configuration", "foundry", "package", "shipments", "customer" ] }, { "commercial_state": "integrated_in_online_cloud_service", "completion_state": "facility_backed", "entity_id": "ent-hygon-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-hygon-7285", "last_checked": "2026-07-29", "name": "Hygon 7285", "product_class": "server_cpu", "product_id": "prod-hygon-7285", "record_type": "product", "source_ids": [ "src-ctyun-cambricon-cloud-20260703" ], "unknowns": [ "legal supplier", "foundry", "package/OSAT", "quantity", "power", "yield" ] }, { "commercial_state": "H3C supported configuration and compatibility certification", "completion_state": "qualification_backed", "entity_id": "ent-iluvatar", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-iluvatar-bi-v100-alias-unresolved", "last_checked": "2026-07-29", "name": "BI-V100 / 天数V100 (exact alias relationship unresolved)", "product_class": "accelerator_card", "product_id": "prod-iluvatar-bi-v100-alias-unresolved", "record_type": "product", "source_ids": [ "src-iluvatar-compatibility", "src-h3c-iluvatar-r5300g6-202412", "src-h3c-iluvatar-server-202408" ], "unknowns": [ "authoritative alias equivalence", "architecture", "process/foundry", "memory supplier/type", "package/OSAT", "purchase", "quantity", "production customer", "shipment", "installation", "acceptance" ] }, { "commercial_state": "volume_production_stage_vendor_timeline_2021", "completion_state": "volume_backed", "entity_id": "ent-iluvatar", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-iluvatar-tg100", "last_checked": "2026-07-29", "name": "天垓100 / TG100", "product_class": "training_gpu", "product_id": "prod-iluvatar-tg100", "record_type": "product", "source_ids": [ "src-iluvatar-annual-2025", "src-iluvatar-about" ], "unknowns": [ "model units", "foundry", "memory supplier", "package/OSAT", "customer/project", "facility", "yield", "field reliability" ] }, { "commercial_state": "chip_brought_up_and_card_released_vendor_timeline_2022", "completion_state": "source_backed", "entity_id": "ent-iluvatar", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-iluvatar-zk100", "last_checked": "2026-07-29", "name": "智铠100 / ZK100", "product_class": "inference_gpu", "product_id": "prod-iluvatar-zk100", "record_type": "product", "source_ids": [ "src-iluvatar-annual-2025", "src-iluvatar-about" ], "unknowns": [ "shipment state and units", "foundry", "memory supplier", "package/OSAT", "customer/project", "facility", "yield" ] }, { "commercial_state": "catalogue", "completion_state": "source_backed", "entity_id": "ent-innosilicon-brand", "foreign_dependencies": [ "HBM JEDEC standard ecosystem" ], "foreign_dependency_status": "identified_candidates", "id": "prod-innosilicon-hbm3e-phy", "last_checked": "2026-07-29", "name": "HBM3E PHY/controller IP", "product_class": "memory_interface_ip", "product_id": "prod-innosilicon-hbm3e-phy", "record_type": "product", "source_ids": [ "src-innosilicon-ip-catalogue" ], "unknowns": [ "legal licensor entity", "licensee", "foundry/process", "tapeout", "qualified production chip" ] }, { "board_power": "150 W", "commercial_state": "official_product_page", "completion_state": "source_backed", "entity_id": "ent-kunlun-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-kunlun-k200", "last_checked": "2026-07-29", "memory_bandwidth": "512 GB/s", "memory_capacity": "16 GB", "memory_type": "HBM", "name": "K200", "package": "2.5D", "process": "14 nm (vendor specification; foundry undisclosed)", "product_class": "ai_accelerator_card", "product_id": "prod-kunlun-k200", "record_type": "product", "source_ids": [ "src-kunlun-k200-product" ], "unknowns": [ "foundry", "HBM generation/supplier/stack", "base die/PHY", "interposer/substrate", "package/OSAT", "units", "customer", "yield", "reliability", "independent workload result" ] }, { "commercial_state": "integrated_in_baidu_appliance_and_powered_on_cluster; CMB_award_and_application_test_vendor_reported", "completion_state": "source_backed", "entity_id": "ent-kunlun-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-kunlun-p800", "last_checked": "2026-07-29", "name": "Kunlun P800", "product_class": "ai_accelerator", "product_id": "prod-kunlun-p800", "record_type": "product", "source_ids": [ "src-baidu-baige-deepseek-p800-20250217", "src-baidu-p800-large-cluster-caict-claim-20250723", "src-kunlun-p800-cmb-20250327" ], "unknowns": [ "CMB customer acceptance", "CMB delivery", "CMB installation", "CMB quantity", "CMB tender/contract", "exact installed count", "facility", "field reliability", "foundry", "legal designer/supplier", "memory", "package/OSAT", "utilization", "yield" ] }, { "commercial_state": "official_product_page", "completion_state": "source_backed", "entity_id": "ent-kunlun-brand-endpoint-unresolved", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-kunlun-r200", "last_checked": "2026-07-29", "memory_bandwidth": "512 GB/s", "memory_capacity": "16 GB or 32 GB", "memory_type": "GDDR6", "name": "R200 / R200-8F", "peak_compute": { "FP16": "128 TFLOPS", "INT8": "256 TOPS" }, "process": "7 nm (vendor specification; foundry undisclosed)", "product_class": "ai_accelerator_card", "product_id": "prod-kunlun-r200", "record_type": "product", "source_ids": [ "src-kunlun-r200-product" ], "unknowns": [ "foundry", "GDDR6 supplier", "package/OSAT", "units", "customer", "independent workload result", "yield" ] }, { "commercial_state": "volume_shipments_2021", "completion_state": "volume_backed", "entity_id": "ent-li-auto-inc", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-li-auto-2021-li-one", "last_checked": "2026-07-29", "name": "2021 Li ONE", "product_class": "electric_vehicle", "product_id": "prod-li-auto-2021-li-one", "record_type": "product", "source_ids": [ "src-li-auto-2021q1-results-20210526", "src-li-auto-2021q3-results-20211129", "src-li-auto-dec-deliveries-20220101" ], "unknowns": [ "legal manufacturer/factory", "full semiconductor BOM", "chip procurement quantity", "field failure rate" ] }, { "commercial_state": "product_page", "completion_state": "relationship_backed", "entity_id": "ent-memblaze", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "id": "prod-memblaze-pblaze6-6541", "last_checked": "2026-07-29", "name": "PBlaze6 6541", "product_class": "enterprise_nvme_ssd", "product_id": "prod-memblaze-pblaze6-6541", "record_type": "product", "source_ids": [ "src-memblaze-ymtc-pblaze6" ], "unknowns": [ "controller origin", "PMIC origin", "current shipment volume", "customer qualifications" ] }, { "commercial_state": "formal_mass_production_reported_from_2024_02", "completion_state": "volume_backed", "entity_id": "ent-metax", "foreign_dependencies": [ "overseas HBM, EDA and interface-IP categories disclosed; exact allocation unknown" ], "foreign_dependency_status": "identified_candidates", "id": "prod-metax-c500", "last_checked": "2026-07-29", "name": "C500", "product_class": "general_purpose_gpu", "product_id": "prod-metax-c500", "record_type": "product", "source_ids": [ "src-metax-annual-2025" ], "unknowns": [ "foundry", "package/OSAT", "HBM supplier/generation", "units", "customer", "facility", "independent workload", "yield" ] }, { "commercial_state": "formal_mass_production_reported_from_2023_04", "completion_state": "volume_backed", "entity_id": "ent-metax", "foreign_dependencies": [ "overseas supply categories disclosed at company level; model allocation unknown" ], "foreign_dependency_status": "identified_candidates", "id": "prod-metax-n100", "last_checked": "2026-07-29", "name": "N100", "product_class": "ai_inference_gpu", "product_id": "prod-metax-n100", "record_type": "product", "source_ids": [ "src-metax-annual-2025" ], "unknowns": [ "foundry", "package/OSAT", "memory supplier", "units", "customer", "facility", "independent workload", "yield" ] }, { "architecture_classification": [ "H3" ], "commercial_state": "catalogue", "completion_state": "source_backed", "entity_id": "ent-montage", "foreign_dependencies": [ "CXL/PCIe standards and ecosystem dependencies not origin-audited" ], "foreign_dependency_status": "identified_candidates", "id": "prod-montage-m88mx6852", "last_checked": "2026-07-29", "name": "M88MX6852", "product_class": "cxl_memory_expansion_controller", "product_id": "prod-montage-m88mx6852", "record_type": "product", "source_ids": [ "src-montage-mxc-official" ], "unknowns": [ "named deployment", "memory supplier", "p50/p99 latency", "energy", "contention", "recovery" ] }, { "commercial_state": "over_2000_cards_deployed_at_named_center_government_reported", "completion_state": "facility_backed", "entity_id": "ent-moore-threads", "foreign_dependencies": [], "foreign_dependency_status": "unknown_not_proven_none", "generation": "Pinghu architecture", "id": "prod-moore-threads-s5000", "last_checked": "2026-07-29", "memory_bandwidth": "1.6 TB/s (peak vendor 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], "wafer_diameter": "not_applicable" }, { "capacity": { "actual_output": null, "designed": { "scope": "design target at full production", "unit": "exposure_optical_systems_per_year", "value": { "maximum": 20, "minimum": 15 } }, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-guowang-exposure-optics-base", "foreign_dependencies": [ "two awarded Hermle five-axis vertical machining centres; delivery/current-use state unknown" ], "id": "fac-guowang-exposure-optics-base", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-guowang-optics", "location": "Beijing Economic-Technological Development Area, Beijing, China", "name": "Guowang exposure-optics R&D and batch-production base", "operator_entity_id": "ent-guowang-optics", "process_families": [ "projection_lithography_exposure_optics" ], "production_state": "facility_reported_completed_and_put_into_production_2024", "record_type": "facility", 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"src-icmtia-kehua-248nm-award-2021" ], "unknowns": [ "permit capacity", "installed/qualified capacity", "current operation", "actual output", "utilization", "model-to-line mapping", "named customer", "qualification", "yield", "resin/PAG/solvent/additive origins", "filters", "packaging", "metrology equipment" ], "wafer_diameter": "not_applicable" }, { "capacity": { "actual_output": null, "designed": { "scope": "high-bandwidth-storage-chiplet product design capacity", "source_literal": "3.6万片/年（200万块/年）", "values": [ { "unit": "片_per_year", "value": 36000 }, { "unit": "块_per_year", "value": 2000000 } ] }, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-nantong-tongfu-hbs-chiplet-line", "foreign_dependencies": [], "id": "fac-nantong-tongfu-hbs-chiplet-line", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-nantong-tongfu", "location": "3A factory, first floor, Nantong, Jiangsu, China", "name": "Nantong Tongfu high-bandwidth-storage-chiplet advanced-packaging line", "operator_entity_id": "ent-nantong-tongfu", "process_families": [ "seed_sputter", "plating", "temporary_bond", "thinning", "CMP", "dry_etch", "CVD", "backside_bump", "dicing", "interposer_attach", "nine_layer_stack", "molding", "laser_debond", "inspection_and_test" ], "production_state": "trial_production_not_environmentally_accepted_at_report_state", "record_type": "facility", "source_ids": [ "src-tongfu-hbs-change-analysis-2025", "src-tongfu-annual-2025" ], "unknowns": [ "片/块 unit reconciliation", "installed/qualified capacity", "actual output", "DRAM die owner", "base die/PHY", "TSV", "KGD", "customer", "accelerator", "repair", "qualification", "yield", "shipment", "tool models/vendors" ], "wafer_diameter": "unknown" }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-rslaser-yizhuang-base", "foreign_dependencies": [], "id": "fac-rslaser-yizhuang-base", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-rslaser", "location": "Hexi X6-1M3, Beijing Economic-Technological Development Area, Beijing, China", "name": "RSLaser Yizhuang lithography-light-source manufacturing and refurbishment base", "operator_entity_id": "ent-rslaser", "process_families": [ "excimer_laser_light_source", "light_source_refurbishment" ], "production_state": "project_registered; completion and output unknown", "record_type": "facility", "source_ids": [ "src-rslaser-yizhuang-project-2021" ], "unknowns": [ "construction completion", "installed capacity", "actual output", "customer", "scanner integration", "qualified use" ], "wafer_diameter": "not_applicable" }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "volume_backed", "facility_id": "fac-samsung-xian-nand", "foreign_dependencies": [], "id": "fac-samsung-xian-nand", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-samsung-china-semiconductor", "location": "Xi'an, Shaanxi, China", "name": "Samsung Xi'an memory facility", "operator_entity_id": "ent-samsung-china-semiconductor", "process_families": [ "3d_nand" ], "production_state": "full_scale_manufacturing_announced_2014", "record_type": "facility", "source_ids": [ "src-samsung-xian-operation-2014" ], "unknowns": [ "current generation", "capacity", "utilization", "output", "yield", "local supplier share" ], "wafer_diameter": "unknown" }, { "capacity": { "actual_output": { "period": "2025-H1", "unit": "300mm_wafers", "value": 298400 }, "designed": { "scope": "two-line total project plan; phase I plan 40,000", "unit": "300mm_wafers_per_month", "value": 80000 }, "installed": null, "licensed": null, "qualified": null, "utilized": { "denominator": null, "period": "2025-H1", "value": "full_load_statement" } }, "completion_state": "volume_backed", "facility_id": "fac-silan-jike-12in", "foreign_dependencies": [], "id": "fac-silan-jike-12in", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-silan-jike", "location": "89 Lanying Road, Haicang District, Xiamen, Fujian, China", "name": "Xiamen Silan Jike 12-inch specialty-process fab", "operator_entity_id": "ent-silan-jike", "process_families": [ "90nm_stated_phase1", "specialty_process", "IGBT", "analog" ], "production_state": "volume_production; full-load statement for 2025-H1", "record_type": "facility", "source_ids": [ "src-silan-jike-company-profile", "src-silan-jike-production-start-2020", "src-silan-jike-h1-2025", "src-kingsemi-silan-jike-krf-2022" ], "unknowns": [ "installed capacity", "qualified capacity", "utilization percentage denominator", "good-wafer output", "electrical yield", "complete tool/material BOM" ], "wafer_diameter": "300 mm" }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "volume_backed", "facility_id": "fac-skhynix-dalian-nand", "foreign_dependencies": [ "U.S.-controlled chipmaking-tool export approvals for 2026" ], "id": "fac-skhynix-dalian-nand", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-skhynix-dalian", "location": "Dalian, Liaoning, China", "name": "Dalian NAND fab", "operator_entity_id": "ent-skhynix-dalian", "process_families": [ "nand" ], "production_state": "current_group_owned_and_operated_nand_fab_as_of_2026_03_31", "record_type": "facility", "source_ids": [ "src-skhynix-dalian-acquisition-2021", "src-skhynix-f1-facilities-2026", "src-skhynix-official-network-2026", "src-skhynix-sec-subsidiaries-2026", "src-liaoning-skhynix-dalian-2026" ], "unknowns": [ "immediate legal-title chain", "generation", "wafer capacity", "facility-specific utilization denominator", "actual output", "yield", "supplier BOM", "covered export-license tool models and service 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"ent-tongcheng-electronic-materials-changzhou", "location": "Huachuang Zhigu, Hualuogeng High-Tech Zone, Jintan District, Changzhou, Jiangsu, China; project area 4,421 m²", "name": "Tongcheng Electronic Materials (Changzhou) advanced CMP-pad project", "operator_entity_id": "ent-tongcheng-electronic-materials-changzhou", "process_families": [ "cmp_pads_for_200mm_and_300mm_wafer_fabs" ], "production_state": "construction_completed_and_put_into_production; batch production and stable delivery issuer-reported", "record_type": "facility", "source_ids": [ "src-red-avenue-annual-2025", "src-jintan-tongcheng-cmp-project-2024" ], "unknowns": [ "street address", "installed capacity", "qualified capacity", "actual output", "utilization", "pad SKUs", "slurry pairings", "named fabs", "qualification dates", "yield effect", "polyurethane/precursor and equipment origins" ], "wafer_diameter": "not_applicable" }, { "capacity": { "actual_output": null, "designed": [ { "scope": "photoresist upstream 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issuer-reported accepted in 2025; acceptance type and electronic-formaldehyde-line state unresolved", "record_type": "facility", "source_ids": [ "src-red-avenue-annual-2025", "src-scip-tongcheng-resin-energy-review-2025", "src-redavenue-subsidiaries-guarantee-2025" ], "unknowns": [ "capacity by resin type", "installed/qualified capacity", "electronic-formaldehyde line acceptance", "actual output", "utilization", "customer qualification", "yield", "monomer/catalyst origins", "purification equipment", "filters" ], "wafer_diameter": "not_applicable" }, { "capacity": { "actual_output": null, "designed": [ { "scope": "semiconductor photoresist", "state": "approved_capacity_explicitly_defined_as_design_capacity", "unit": "tonnes_per_year", "value": 1000 }, { "scope": "high-purity solvent", "state": "approved_capacity_explicitly_defined_as_design_capacity", "unit": "tonnes_per_year", "value": 18800 } ], "installed": null, "licensed": null, "qualified": null, "utilized": [ { "period": "2025", "scope": "semiconductor photoresist", "unit": "percent", "value": 21.5 }, { "period": "2025", "scope": "high-purity solvent", "unit": "percent", "value": 7.2 } ] }, "completion_state": "facility_backed", "facility_id": "fac-tongcheng-electronic-photoresist-solvent", "foreign_dependencies": [], "id": "fac-tongcheng-electronic-photoresist-solvent", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-tongcheng-electronic-materials-shanghai", "location": "Shanghai Chemical Industry Park, Shanghai, China; exact street/plot for this factory unresolved", "name": "Tongcheng Electronic semiconductor photoresist and high-purity-solvent factory", "operator_entity_id": "ent-tongcheng-electronic-materials-shanghai", "process_families": [ "semiconductor_photoresist", "high_purity_solvent_ebr" ], "production_state": "operating; approved capacity and utilization disclosed for 2025", "record_type": "facility", "source_ids": [ "src-red-avenue-annual-2025", 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"utilized and actual output", "supplier BOM" ], "wafer_diameter": "300 mm" }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-tsmc-shanghai-fab10", "foreign_dependencies": [ "U.S.-controlled equipment export approvals" ], "id": "fac-tsmc-shanghai-fab10", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-tsmc-china", "location": "Shanghai, China", "name": "TSMC Fab 10", "operator_entity_id": "ent-tsmc-china", "process_families": [ "foundry" ], "production_state": "listed_operating_facility", "record_type": "facility", "source_ids": [ "src-tsmc-annual-2025" ], "unknowns": [ "installed", "qualified", "utilized and actual output", "supplier BOM" ], "wafer_diameter": "200 mm" }, { "capacity": { "actual_output": null, "designed": { "scope": "when fully equipped", "unit": "300mm_wafers_per_month", "value": 50000 }, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "volume_backed", "facility_id": "fac-united-semi-xiamen", "foreign_dependencies": [], "id": "fac-united-semi-xiamen", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-united-semi-xiamen", "location": "Xiamen, Fujian, China", "name": "United Semiconductor Xiamen", "operator_entity_id": "ent-united-semi-xiamen", "process_families": [ "foundry", "28nm" ], "production_state": "volume_production_since_2016", "record_type": "facility", "source_ids": [ "src-umc-fab-information" ], "unknowns": [ "current installed capacity", "utilization", "actual output", "yield", "customer mix", "supplier BOM" ], "wafer_diameter": "300 mm" }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "claim_ceiling": "The construction entity, project, address, cleanroom award and award value are proven. Contract signature, installation, acceptance, fab capacity, product generation and production are not.", "completion_state": "facility_backed", "facility_id": "fac-util-cxmt-phase2", "foreign_dependencies": [ "unknown; no cleanroom-system component BOM or origin record disclosed" ], "id": "fac-util-cxmt-phase2", "last_checked": "2026-07-29", "latest_dated_source": "src-util-001", "legal_owner_entity_id": "ent-util-changxin-xinqiao", "location": "Hefei Airport Economic Demonstration Zone, Anhui, China", "name": "12-inch memory-wafer manufacturing base Phase II", "operator_entity_id": "ent-util-changxin-xinqiao", "ownership_class": "mainland_location_ownership_unresolved", "ownership_evidence_ceiling": "Named project/construction entity; real-property title and current operating state remain unresolved unless separately stated.", "process_families": [ "12-inch memory wafer fabrication" ], "production_state": "cleanroom-package award announced; formal contract pending at source date", "project_scale": null, "record_type": "facility", "source_ids": [ "src-util-001" ], "unknowns": [ "real-property title where not expressly disclosed", "current operator state", "installed capacity", "qualified capacity", "actual output", "utilization", "yield", "complete equipment/material/component BOM and origins" ], "wafer_diameter": "300 mm" }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "claim_ceiling": "Site, building area, 12-inch specialty-process line and signed EPC scopes are proven. No construction completion, acceptance, tool installation, production qualification, capacity, yield or output is proven.", "completion_state": "facility_backed", "facility_id": "fac-util-huahong-wuxi-project", "foreign_dependencies": [ "The contract disclosure says the technology platform would combine independent development with appropriate introduction, but does not identify imported equipment, materials, IP, software or service." ], "id": "fac-util-huahong-wuxi-project", "last_checked": "2026-07-29", "latest_dated_source": "src-util-002", "legal_owner_entity_id": "ent-util-huahong-wuxi", "location": "30-1 Xinzhou Road, Xinwu District, Wuxi, Jiangsu, China", "name": "Hua Hong Manufacturing (Wuxi) project", "operator_entity_id": "ent-util-huahong-wuxi", "ownership_class": "mainland_location_ownership_unresolved", "ownership_evidence_ceiling": "Named project/construction entity; real-property title and current operating state remain unresolved unless separately stated.", "process_families": [ "12-inch specialty-process wafer fabrication" ], "production_state": "EPC contract formally signed in 2023, subject to effectiveness conditions", "project_scale": null, "record_type": "facility", "source_ids": [ "src-util-002" ], "unknowns": [ "real-property title where not expressly disclosed", "current operator state", "installed capacity", "qualified capacity", "actual output", "utilization", "yield", "complete equipment/material/component BOM and origins" ], "wafer_diameter": "300 mm" }, { "capacity": { "actual_output": null, "designed": { "capacity_state": "vendor-reported_design_target", "period": "after both phases", "scope": "eventual two-phase project", "unit": "8-inch SiC wafers/year", "value": 720000 }, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "claim_ceiling": "Named Phase I exhaust/PGEX award is proven only by the supplier. The 720,000-wafer/year number applies to the eventual two-phase project, not installed or operating Phase I capacity.", "completion_state": "facility_backed", "facility_id": "fac-util-silan-sic-phase1", "foreign_dependencies": [ "unknown; no exhaust/PGEX component BOM, control software, pump, sensor, valve or service origin disclosed" ], "id": "fac-util-silan-sic-phase1", "last_checked": "2026-07-29", "latest_dated_source": "src-util-003", "legal_owner_entity_id": "ent-util-silan-jihong", "location": "Haicang District, Xiamen, Fujian, China", "name": "Xiamen Silan Jihong 8-inch SiC power-device line Phase I", "operator_entity_id": "ent-util-silan-jihong", "ownership_class": "mainland_location_ownership_unresolved", "ownership_evidence_ceiling": "Named project/construction entity; real-property title and current operating state remain unresolved unless separately stated.", "process_families": [ "8-inch SiC power-device wafer fabrication" ], "production_state": "project start reported 2024-06-18; exhaust/PGEX package awarded by 2025-01-23", "project_scale": null, "record_type": "facility", "source_ids": [ "src-util-003" ], "unknowns": [ "real-property title where not expressly disclosed", "current operator state", "installed capacity", "qualified capacity", "actual output", "utilization", "yield", "complete equipment/material/component BOM and origins" ], "wafer_diameter": "200 mm" }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "claim_ceiling": "A supplier-reported EPC award, rounded contract value, project type and detailed construction scope are proven. Contract signature, installed systems, acceptance, process qualification and production are not.", "completion_state": "facility_backed", "facility_id": "fac-util-yuerun-a1", "foreign_dependencies": [ "unknown; no component-level origin record for cleanroom, gas, liquid, vacuum, FFU, controls or abatement systems" ], "id": "fac-util-yuerun-a1", "last_checked": "2026-07-29", "latest_dated_source": "src-util-004", "legal_owner_entity_id": "ent-util-yuerun", "location": "Shaoxing, Zhejiang, China; exact street address not proven by the first-party source in this lane", "name": "YueRun A1 next-generation heterogeneous-integration advanced-packaging and DDIC project", "operator_entity_id": "ent-util-yuerun", "ownership_class": "mainland_location_ownership_unresolved", "ownership_evidence_ceiling": "Named project/construction entity; real-property title and current operating state remain unresolved unless separately stated.", "process_families": [ "wafer-level advanced packaging", "heterogeneous integration", "display-driver packaging" ], "production_state": "EPC award reported; project described as starting in 2026", "project_scale": { "capacity_state": "vendor-reported_project_description", "period": "2026 project", "scope": "cleanroom area", "unit": "square_metres", "value": "nearly 10000" }, "record_type": "facility", "source_ids": [ "src-util-004" ], "unknowns": [ "real-property title where not expressly disclosed", "current operator state", "installed capacity", "qualified capacity", "actual output", "utilization", "yield", "complete equipment/material/component BOM and origins" ], "wafer_diameter": "not_applicable_packaging_site" }, { "capacity": { "actual_output": null, "designed": { "period": "2026-07", "state": "reported_compute_class", "unit": "P_vendor_defined_compute", "value": ">1000" }, "installed": { "period": "2026-07", "state": "deployed_government_reported", "unit": "S5000_accelerator_cards", "value": ">2000" }, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-wuxi-huishan-ai-compute-center-phase1", "foreign_dependencies": [], "id": "fac-wuxi-huishan-ai-compute-center-phase1", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-wuxi-huishan-ai-center-owner-unresolved", "location": "Huishan District, Wuxi, Jiangsu, China; exact address undisclosed", "name": "Wuxi (Huishan) AI Compute Center Phase I", "operator_entity_id": "ent-wuxi-huishan-ai-center-owner-unresolved", "process_families": [ "ai_compute_service" ], "production_state": "powered_on_and_deployed_government_reported", "record_type": "facility", "source_ids": [ "src-huishan-mt-s5000-center-20260724" ], "unknowns": [ "legal owner/operator", "buyer", "contract", "acceptance certificate", "exact card count", "uptime", "utilization", "power/cooling", "customer workloads" ], "wafer_diameter": "not_applicable" }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": { "period": "2024", "scope": "issuer inquiry reply", "unit": "percent", "value": 88.11 } }, "completion_state": "facility_backed", "facility_id": "fac-xinsheng-jingke-300mm", "foreign_dependencies": [ "major equipment suppliers anonymized" ], "id": "fac-xinsheng-jingke-300mm", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-xinsheng-jingke", "location": "Shanghai, China", "name": "Xinsheng Jingke 300 mm wafer operation", "operator_entity_id": "ent-xinsheng-jingke", "process_families": [ "silicon_wafers" ], "production_state": "operating_2024_receipt", "record_type": "facility", "source_ids": [ "src-nsig-inquiry-2025" ], "unknowns": [ "licensed/design/installed/qualified capacity", "actual output", "yield", "equipment vendors" ], "wafer_diameter": "300 mm" }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-xinye-shidai-8in", "foreign_dependencies": [], "id": "fac-xinye-shidai-8in", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-xinye-shidai", "location": "Xi'an, Shaanxi, China; exact street address not in award receipt", "name": "8-inch high-performance specialty-process semiconductor line", "operator_entity_id": "ent-xinye-shidai", "process_families": [ "high_performance_specialty_process; exact device families unknown" ], "production_state": "project_award_stage; operating state unknown", "record_type": "facility", "source_ids": [ "src-xinye-shidai-chemical-system-award-2025" ], "unknowns": [ "ownership", "address", "process families", "installed capacity", "tool move-in", "first wafer", "qualification", "output", "yield" ], "wafer_diameter": "200 mm" }, { "capacity": { "actual_output": null, "designed": null, "installed": null, "licensed": null, "qualified": null, "utilized": null }, "completion_state": "facility_backed", "facility_id": "fac-ymtc-phase3", "foreign_dependencies": [], "id": "fac-ymtc-phase3", "last_checked": "2026-07-29", "legal_owner_entity_id": "ent-ymtc-phase3", "location": "Wuhan, Hubei, China", "name": "长存三期（武汉）项目", "operator_entity_id": "ent-ymtc-phase3", "process_families": [ "3d_nand" ], "production_state": "construction", "project_investment": { "state": "announced_project_investment", "unit": "CNY_billion", "value": 20.72 }, "record_type": "facility", "source_ids": [ "src-wuhan-ymtc-phase3", "src-hubei-ymtc-phase3" ], "unknowns": [ "designed WSPM", "installed tools", "tool move-in", "first wafer", "qualified capacity", "actual output" ], "wafer_diameter": "300 mm expected but not explicitly restated in cited project records" } ], "claims": [ { "claim_id": "clm-51world-legal-identity", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", 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does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-acm-equipment-portfolio", "last_checked": "2026-07-29", "missing_proof": [ "exact models", "customer/facility", "delivery", "installation", "qualified layer", "uptime", "yield" ], "next_validation_event": "Named-fab delivery, installation and layer-qualification receipt for an exact model.", "object_id_or_value": [ "cleaning", "electroplating", "furnace" ], "predicate": "offers_portfolio", "process_id": "proc-clean-strip", "product_id": null, "publication_date": "2026-02-27", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "issuer annual-report business scope", "source_ids": [ "src-acm-annual-2025" ], "subject_id": "eq-acm-clean-portfolio" }, { "claim_id": "clm-acm-ultra-c-tahoe-anonymous-production", "completion_state": "source_backed", "confidence": "medium", "contradiction_ids": [], "event_date": "2024-11-11", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-acm-ultra-c-tahoe-anonymous-production", "last_checked": "2026-07-29", "missing_proof": [ "legal customer", "facility", "installation/acceptance", "layer mapping", "independent throughput/defect/yield receipt" ], "next_validation_event": "Customer-origin tender, acceptance or qualification record naming Ultra C Tahoe and the fab.", "object_id_or_value": "multiple anonymous mainland logic and memory fabs", "predicate": "used_in_volume_production_at", "process_id": "proc-clean-strip", "product_id": null, "publication_date": "2024-11-11", "publication_date_unknown_reason": null, "readiness_state": "volume_production", "record_type": "claim", "scope": "vendor-reported model-level production use", "source_ids": [ "src-acm-ultra-c-tahoe-2024" ], "subject_id": "eq-acm-ultra-c-tahoe" }, { "claim_id": "clm-aishengna-future-recipients", "completion_state": "source_backed", "confidence": "low", "contradiction_ids": [ "con-duv-future-recipients-not-deliveries" ], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "PLAUSIBLE_UNVERIFIED", "facility_id": null, "id": "clm-aishengna-future-recipients", "last_checked": "2026-07-29", "missing_proof": [ "purchase order", "model", "serial", "shipment", "move-in", "installation", "site acceptance" ], "next_validation_event": "Named fab purchase or acceptance record.", "object_id_or_value": [ "SMIC", "Hua Hong", "CXMT" ], "predicate": "reported_future_recipient_candidates", "process_id": "proc-lithography-immersion-arf", "product_id": null, "publication_date": "2026-07-28", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "future expectation in anonymous-source reporting", "source_ids": [ "src-reuters-duv-aishengna-2026" ], "subject_id": "ent-aishengna" }, { "claim_id": "clm-aishengna-reported-manufacturing", "completion_state": "source_backed", "confidence": "low", "contradiction_ids": [ "con-duv-mass-production-vs-testing" ], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "PLAUSIBLE_UNVERIFIED", "facility_id": null, "id": "clm-aishengna-reported-manufacturing", "last_checked": "2026-07-29", "missing_proof": [ "official product/model", "completed tool count", "serials", "shipments", "installations", "acceptances", "qualified layers" ], "next_validation_event": "Official manufacturer release or named fab purchase/receiving/acceptance record.", "object_id_or_value": "home-grown immersion DUV tools", "predicate": "reported_as_manufacturing", "process_id": "proc-lithography-immersion-arf", "product_id": null, "publication_date": "2026-07-28", "publication_date_unknown_reason": null, "readiness_state": "manufactured", "record_type": "claim", "scope": "anonymous-source Reuters report", "source_ids": [ "src-reuters-duv-aishengna-2026" ], "subject_id": "ent-aishengna" }, { "claim_id": "clm-amec-equipment-portfolio", "completion_state": "source_backed", "confidence": "high_for_portfolio_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-amec-equipment-portfolio", "last_checked": "2026-07-29", "missing_proof": [ "exact models", "customer/facility", "delivery", "installation", "qualified layer", "uptime", "yield" ], "next_validation_event": "Named-fab delivery, installation and layer-qualification receipt for an exact model.", "object_id_or_value": [ "etch", "thin-film deposition" ], "predicate": "offers_portfolio", "process_id": "proc-etch", "product_id": null, "publication_date": "2025-08-29", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "issuer interim-report business scope", "source_ids": [ "src-amec-halfyear-2025" ], "subject_id": "eq-amec-etch-portfolio" }, { "claim_id": "clm-amkor-shanghai-current-factory-2026", "completion_state": "source_backed", "confidence": "high_for_factory_identity_and_current_operation", "contradiction_ids": [], "event_date": "2025-03-07", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-amkor-shanghai", "id": "clm-amkor-shanghai-current-factory-2026", "last_checked": "2026-07-29", "missing_proof": [ "immediate ownership chain", "current package platforms", "customers", "capacity", "utilization", "yield" ], "next_validation_event": "Current facility filing plus customer qualification/AVL at exact package scope.", "object_id_or_value": { "address": "111 Yinglun Road, Waigaoqiao, Shanghai", "factory_id": "C3", "legal_name_cn": "安靠封装测试（上海）有限公司", "legal_name_en": "Amkor Assembly and Test (Shanghai) Co., Ltd." }, "predicate": "operates_as_current_factory", "process_id": "proc-osat-assembly", "product_id": null, "publication_date": "2025-03-10", "publication_date_unknown_reason": null, "readiness_state": "volume_production", "record_type": "claim", "scope": "current corporate factory list corroborated by 2025 government production-line visit", "source_ids": [ "src-amkor-current-factory-2026", "src-shanghai-amkor-current-2025" ], "subject_id": "fac-amkor-shanghai" }, { "claim_id": "clm-amkor-shanghai-packaging-2015", "completion_state": "source_backed", "confidence": "high_for_historical_scope", "contradiction_ids": [], "event_date": "2015-07-21", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-amkor-shanghai", "id": "clm-amkor-shanghai-packaging-2015", "last_checked": "2026-07-29", "missing_proof": [ "immediate ownership chain", "package name", "customer", "capacity", "yield" ], "next_validation_event": "Customer qualification names the Shanghai package platform and current scope.", "object_id_or_value": [ "wafer-level packaging", "die stacking", "package stacking" ], "predicate": "offered_packaging_technologies", "process_id": "proc-osat-assembly", "product_id": null, "publication_date": "2015-07-21", "publication_date_unknown_reason": null, "readiness_state": "manufactured", "record_type": "claim", "scope": "Shanghai operation, 2015", "source_ids": [ "src-amkor-shanghai-expansion-2015" ], "subject_id": "fac-amkor-shanghai" }, { "claim_id": "clm-amkor-shanghai-qualification-2001", "completion_state": "source_backed", "confidence": "high_for_historical_scope", "contradiction_ids": [], "event_date": "2001-06-11", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-amkor-shanghai", "id": "clm-amkor-shanghai-qualification-2001", "last_checked": "2026-07-29", "missing_proof": [ "customer", "package platform", "qualification result", "current legal operator", "current operating state" ], "next_validation_event": "Current Amkor facility filing plus a named customer qualification or AVL.", "object_id_or_value": "Waigaoqiao packaging and test factory", "predicate": "entered_customer_qualification", "process_id": "proc-osat-assembly", "product_id": null, "publication_date": "2001-06-11", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "historical 2001 facility milestone", "source_ids": [ "src-amkor-shanghai-qualification-2001" ], "subject_id": "fac-amkor-shanghai" }, { "claim_id": "clm-amkor-smic-service-award-2012", "completion_state": "source_backed", "confidence": "moderate", "contradiction_ids": [], "event_date": "2012-12-31", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-amkor-smic-service-award-2012", "last_checked": "2026-07-29", "missing_proof": [ "SMIC legal affiliate", "facility", "package", "chip", "quantity", "current status" ], "next_validation_event": "SMIC-origin award or procurement record identifies the affiliate and service scope.", "object_id_or_value": "ent-smic", "predicate": "received_service_provider_award_from", "process_id": "proc-osat-assembly", "product_id": null, "publication_date": "2013-06-24", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "2012 Excellent Service Provider Award, second consecutive year", "source_ids": [ "src-amkor-smic-award-2013" ], "subject_id": "ent-amkor" }, { "claim_id": "clm-anji-2025-filing-capability-matrix", "completion_state": "source_backed", "confidence": "high_for_family_state_only", "contradiction_ids": [ "con-generic-hybrid-bonding-vs-hbm", "con-generic-plating-vs-hbm" ], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-anji-2025-filing-capability-matrix", "last_checked": "2026-07-29", "missing_proof": [ "models/formulations", "client names", "facilities", "nodes/layers", "purity", "defectivity", "shipment volume", "yield" ], "next_validation_event": "Customer-side AVL, tender or acceptance names Anji product family/SKU, facility and process layer.", "object_id_or_value": { "advanced_packaging_cmp": "volume sales at anonymous clients; HBM not established", "ceria_cmp": "client_validated_and_volume_sales; numerical yield delta undisclosed", "copper_barrier_cmp": "validated_products_progressing_to_volume_sales", "functional_wet_chemicals": "family-specific validation, batch and volume states", "metal_gate_cmp": "volume_production_at_anonymous_clients", "tsv_plating": "development_and_customer_validation", "tungsten_cmp": "stable_supply_and_ramping" }, "predicate": "reports_readiness_by_material_family", "process_id": "proc-material-cmp-consumables", "product_id": null, "publication_date": "2026-04-16", "publication_date_unknown_reason": null, "readiness_state": "volume_production", "record_type": "claim", "scope": "2025 annual-report capability and R&D tables", "source_ids": [ "src-anji-annual-2025" ], "subject_id": "ent-anji" }, { "claim_id": "clm-anji-imported-raw-material-exposure", "completion_state": "source_backed", "confidence": "high_for_exposure_only", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-anji-imported-raw-material-exposure", "last_checked": "2026-07-29", "missing_proof": [ "material names", "supplier entities", "countries", "spend share", "inventory days", "domestic substitute", "qualification state" ], "next_validation_event": "Issuer supplier/BOM disclosure or customs/procurement record identifies the imported input and substitute status.", "object_id_or_value": "unnamed imported raw materials with substantial USD settlement", "predicate": "depends_on", "process_id": "proc-material-cmp-consumables", "product_id": null, 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"predicate": "offers", "process_id": "proc-dram-fabrication", "product_id": null, "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "shipped", "record_type": "claim", "scope": "official product portfolio", "source_ids": [ "src-cxmt-official-products-2026" ], "subject_id": "ent-cxmt-corp" }, { "claim_id": "clm-cxmt-legal-identity", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-cxmt-legal-identity", "last_checked": "2026-07-29", "missing_proof": [], "next_validation_event": "Monitor exchange filings for legal-name or ownership changes.", "object_id_or_value": { "cn": "长鑫科技集团股份有限公司", "en": "CXMT Corporation" }, "predicate": "has_legal_identity", "process_id": null, "product_id": null, "publication_date": "2026-05-27", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "issuer identity", "source_ids": [ "src-cxmt-sse-prospectus-2026" ], "subject_id": "ent-cxmt-corp" }, { "claim_id": "clm-cxmt-lpddr5-brand-validation", "completion_state": "source_backed", "confidence": "high_for_brand_scope", "contradiction_ids": [], "event_date": "2023-11-28", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-cxmt-lpddr5-brand-validation", "last_checked": "2026-07-29", "missing_proof": [ "phone model", "contracting entity", "shipment quantity", "current program" ], "next_validation_event": "A phone model BOM, customer qualification record or shipment disclosure naming the exact CXMT part.", "object_id_or_value": [ "Xiaomi-brand phone products", "Transsion-brand phone products" ], "predicate": "completed_validation_in", "process_id": null, "product_id": "prod-cxmt-lpddr5-12gb", "publication_date": "2023-11-28", "publication_date_unknown_reason": null, "readiness_state": "customer_validated", "record_type": "claim", "scope": "12 GB LPDDR5", "source_ids": [ "src-cxmt-xiaomi-transsion-validation-2023" ], "subject_id": "prod-cxmt-lpddr5-12gb" }, { "claim_id": "clm-cxmt-lpddr5x-state", "completion_state": "source_backed", "confidence": "high_that_company_reports_state", "contradiction_ids": [], "event_date": "2025-05-01", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-cxmt-lpddr5x-state", "last_checked": "2026-07-29", "missing_proof": [ "customer qualification by speed bin", "shipment volume", "yield", "field reliability" ], "next_validation_event": "Named handset/module qualification and shipment record per speed bin.", "object_id_or_value": { "10667_Mbps": "sampled", "8533_Mbps": "volume_production", "9600_Mbps": "volume_production" }, "predicate": "readiness_by_rate", 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platform, product and capacity.", "object_id_or_value": "part of CXMT DRAM product testing", "predicate": "performs", "process_id": "proc-final-test-burnin", "product_id": null, "publication_date": "2026-05-27", "publication_date_unknown_reason": null, "readiness_state": "volume_production", "record_type": "claim", "scope": "wholly owned subsidiary operating function", "source_ids": [ "src-cxmt-sse-prospectus-2026" ], "subject_id": "ent-cxmt-product-hefei" }, { "claim_id": "clm-cxmt-product-range-gap-vs-hbm-peers", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [ "con-cxmt-hbm-narrative-vs-sse-corpus" ], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-cxmt-product-range-gap-vs-hbm-peers", "last_checked": "2026-07-29", "missing_proof": [ "future product roadmap", "private R&D state" ], "next_validation_event": "A later issuer filing adds an exact HBM product and readiness state.", "object_id_or_value": { "issuer": [ "DDR", "LPDDR" ], "peers": [ "DDR", "LPDDR", "GDDR", "HBM" ] }, "predicate": "reports_product_range", "process_id": "proc-dram-fabrication", "product_id": null, "publication_date": "2025-12-30", "publication_date_unknown_reason": null, "readiness_state": "volume_production", "record_type": "claim", "scope": "issuer peer-comparison table and stated product-range gap", "source_ids": [ "src-cxmt-sse-preview-q1-2025" ], "subject_id": "ent-cxmt-corp" }, { "claim_id": "clm-cxmt-public-corpus-no-hbm-product-receipt", "completion_state": "source_backed", "confidence": "high_for_bounded_public_corpus", "contradiction_ids": [ "con-cxmt-hbm-narrative-vs-sse-corpus" ], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "RESEARCH_MEASURED", "facility_id": null, "id": "clm-cxmt-public-corpus-no-hbm-product-receipt", "last_checked": "2026-07-29", "missing_proof": [ "private R&D disclosures", "HBM product", "stack/facility", "supplier/OSAT", "customer", "qualification", "yield", "shipment" ], "next_validation_event": "CXMT or a named counterparty files a dated HBM product, manufacturing, packaging or customer qualification receipt.", "object_id_or_value": { "CXMT_HBM_product_receipts": 0, "HBM_files": 2, "HBM_hits": 30, "KGD_hits": 0, "TSV_hits": 0, "files_enumerated": 22, "hybrid_bonding_hits": 0, "named_OSAT_packaging_edges": 0 }, "predicate": "public_project_corpus_term_receipt", "process_id": "proc-dram-fabrication", "product_id": null, "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "complete public SSE project corpus as enumerated on 2026-07-29", "source_ids": [ "src-cxmt-sse-project-corpus-api", "src-cxmt-sse-prospectus-2026", 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"completed_first_delivery_with", "process_id": "proc-chip-automotive-soc", "product_id": "prod-dd-antora-1000-pro", "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "shipped", "record_type": "claim", "scope": "named product/facility-event chain; no direct purchase, unit volume, acceptance or yield", "source_ids": [ "src-dd-auto-001", "src-dd-auto-002", "src-dd-auto-003", "src-dd-auto-004" ], "subject_id": "prod-dd-antora-1000-pro" }, { "claim_id": "clm-dd-byd-1500v-sic-chain", "completion_state": "source_backed", "confidence": "medium_for_vendor_chain_scope", "contradiction_ids": [ "con-dd-byd-volume-vs-manufacturing-closure" ], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-dd-byd-1500v-sic-chain", "last_checked": "2026-07-29", "missing_proof": [ "exact legal entity", "fab/module facilities", "substrate/epitaxy", "equipment/material suppliers", "capacity", "qualified output", "yield", "vehicle count", "independent reliability" ], "next_validation_event": "BYD Semiconductor filing/EIA and vehicle qualification identify facilities, capacity and yield.", "object_id_or_value": { "chip": "1500 V high-power SiC", "module": [ "double-sided silver sintering", "laser welding", "high-temperature plastic encapsulant", "nano-silver sintering" ], "steps": [ "design", "wafer manufacturing", "module packaging", "test", "batch vehicle installation" ] }, "predicate": "reports_integrated_sic_chain", "process_id": "proc-sic-gan", "product_id": "prod-dd-byd-1500v-sic-chip", "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "volume_production", "record_type": "claim", "scope": "BYD vendor report; exact legal semiconductor entity, facilities, suppliers, capacity and yield absent", "source_ids": [ "src-dd-byd-001", "src-dd-byd-002" ], "subject_id": "ent-dd-byd-semiconductor-unresolved" }, { "claim_id": "clm-dd-byd-ebus3-c11-launch", "completion_state": "source_backed", "confidence": "high_for_launch_scope", "contradiction_ids": [], "event_date": "2025-09-15", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-dd-byd-ebus3-c11-launch", "last_checked": "2026-07-29", "missing_proof": [ "deliveries", "fleet operator", "exact chip/legal manufacturer", "facility", "capacity", "yield" ], "next_validation_event": "Fleet procurement/homologation and delivery record names chip and quantities.", "object_id_or_value": { "feature": "1500 V SiC power chip", "platform": "1000 V e-Bus Platform 3.0", "vehicle": "C11 bus" }, "predicate": "launched_with", "process_id": "proc-market-automotive", "product_id": "prod-dd-byd-ebus-3", "publication_date": "2025-09-16", "publication_date_unknown_reason": null, "readiness_state": "manufactured", "record_type": "claim", "scope": "launch receipt; no delivery or exact semiconductor BOM", "source_ids": [ "src-dd-byd-003" ], "subject_id": "prod-dd-byd-ebus-3" }, { "claim_id": "clm-dd-cu-ai-pool-tender-scope-only", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [ "con-dd-cu-procurement-not-relationship" ], "event_date": "2026-07-24", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-dd-cu-ai-pool-tender-scope-only", "last_checked": "2026-07-29", "missing_proof": [ "bidder", "awardee", "contract", "server/accelerator models", "exact facility", "delivery", "installation", "acceptance" ], "next_validation_event": "Final award, equipment schedule and site acceptance identify legal endpoints and models.", "object_id_or_value": { "AI_servers": 123, "RoCE_switches": 63 }, "predicate": "tendered", "process_id": "proc-market-telecom", "product_id": null, "publication_date": "2026-07-24", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "2026 cloud-intelligence resource-pool tender scope; no supplier/model/facility relationship", "source_ids": [ "src-dd-cu-003" ], "subject_id": "ent-dd-cu-operating" }, { "claim_id": "clm-dd-cu-general-server-candidates-only", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [ "con-dd-cu-procurement-not-relationship" ], "event_date": "2025-09-26", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-dd-cu-general-server-candidates-only", "last_checked": "2026-07-29", "missing_proof": [ "final award", "framework", "orders", "server/CPU models", "shares", "delivery", "installation", "acceptance" ], "next_validation_event": "Final award and executed-order/acceptance records name legal supplier and model.", "object_id_or_value": "2025 China Unicom general-server centralized procurement", "predicate": "published_candidate_notice", "process_id": "proc-market-telecom", "product_id": null, "publication_date": "2025-09-26", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "candidate notice only; zero supplier relationship promoted", "source_ids": [ "src-dd-cu-001" ], "subject_id": "ent-dd-cu-operating" }, { "claim_id": "clm-dd-cu-guangdong-zte-candidate-only", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [ "con-dd-cu-procurement-not-relationship" ], "event_date": "2026-07-27", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-dd-cu-guangdong-zte-candidate-only", "last_checked": "2026-07-29", "missing_proof": [ "final transaction notice", "contract", "equipment schedule", "server/accelerator model", "delivery", "installation", "site acceptance" ], "next_validation_event": "Final 成交/中选 notice and site-acceptance record name ZTE server and accelerator.", "object_id_or_value": { "candidate": "ZTE Corporation", "project": "GD-Z-WZ-25-4116 / HBTZ-GDLT-25116" }, "predicate": "reports_transaction_candidate", "process_id": "proc-market-telecom", "product_id": null, "publication_date": "2026-07-28", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "candidate notice only; no relationship edge", "source_ids": [ "src-dd-cu-002" ], "subject_id": "ent-dd-cu-guangdong-branch" }, { "claim_id": "clm-dd-lynk08-refresh-foreign-chip-bom", "completion_state": "source_backed", "confidence": "high_for_named_bom", "contradiction_ids": [ "con-dd-lynk-family-volume-vs-se1000-generation" ], "event_date": "2025-09-24", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-dd-lynk08-refresh-foreign-chip-bom", "last_checked": "2026-07-29", "missing_proof": [ "SKU/package 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null, "id": "clm-dd-poco-c71-retail-and-software-dependencies", "last_checked": "2026-07-29", "missing_proof": [ "completed sales/units", "legal product owner", "software versions/licenses", "offline substitutes", "update/service route" ], "next_validation_event": "Shipment receipt and software manifest for a delivered POCO C71 SKU.", "object_id_or_value": { "retail": "4GB+128GB shipping offer in Singapore", "software": [ "Android Go 64-bit", "Google services", "Google Assistant" ] }, "predicate": "has_commercial_offer_and_foreign_software", "process_id": "proc-compiler-runtime-firmware", "product_id": "prod-dd-poco-c71", "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "offer/compatibility only; no completed-sale volume", "source_ids": [ "src-dd-mobile-003", "src-dd-mobile-004" ], "subject_id": "prod-dd-poco-c71" }, { "claim_id": "clm-dd-poco-c71-unisoc-t7250-bom", "completion_state": "source_backed", "confidence": "high_for_named_product_bom", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-dd-poco-c71-unisoc-t7250-bom", "last_checked": "2026-07-29", "missing_proof": [ "legal POCO operator", "direct procurement", "units", "foundry", "package/OSAT", "memory/eMMC suppliers", "yield" ], "next_validation_event": "Regulatory declaration or teardown closes legal operator and manufacturing BOM.", "object_id_or_value": { "CPU": "2× Arm Cortex-A75 + 6× Cortex-A55", "GPU": "Arm Mali-G57", "SoC": "UNISOC T7250", "memory": "LPDDR4X", "process": "12 nm", "storage": "eMMC 5.1" }, "predicate": "integrates", "process_id": "proc-market-smartphones", "product_id": "prod-dd-poco-c71", "publication_date": null, "publication_date_unknown_reason": "No single publication date 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"publication_date": "2026-04-10", "publication_date_unknown_reason": null, "readiness_state": "shipped", "record_type": "claim", "scope": "electronic specialty-gas product count", "source_ids": [ "src-huate-gas-annual-2025" ], "subject_id": "ent-huate-gas" }, { "claim_id": "clm-huate-hbm-tsv-gas-application-ceiling", "completion_state": "source_backed", "confidence": "low", "contradiction_ids": [ "con-huate-hbm-application-not-qualified-stack" ], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-huate-hbm-tsv-gas-application-ceiling", "last_checked": "2026-07-29", "missing_proof": [ "gas identity/grade", "memory maker", "HBM generation", "facility", "TSV flow", "qualification", "volume", "yield" ], "next_validation_event": "Named HBM customer qualification identifies gas, grade, facility, step and generation.", "object_id_or_value": "unspecified high-end specialty gas for HBM TSV etch", "predicate": 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"contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-huate-new-product-orders-2025", "last_checked": "2026-07-29", "missing_proof": [ "customer", "quantity", "delivery", "acceptance", "qualification", "repeat order" ], "next_validation_event": "Order execution identifies product, grade, customer, quantity and delivery state.", "object_id_or_value": [ "Si2H6", "HBr", "BCl3" ], "predicate": "received_sales_orders", "process_id": "proc-material-process-gases", "product_id": null, "publication_date": "2026-04-10", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "2025 sales orders; customer and execution undisclosed", "source_ids": [ "src-huate-gas-annual-2025" ], "subject_id": "ent-huate-gas" }, { "claim_id": "clm-huate-smic-ningbo-award", "completion_state": "source_backed", "confidence": "medium", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-huate-smic-ningbo-award", "last_checked": "2026-07-29", "missing_proof": [ "customer-origin award notice", "gas SKU", "fab/layer", "quantity", "current status" ], "next_validation_event": "SMIC Ningbo origin record or tender/AVL naming gas and scope.", "object_id_or_value": "SMIC Ningbo", "predicate": "received_supplier_award_from", "process_id": "proc-gases-chemicals-delivery", "product_id": null, "publication_date": "2026-04-10", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "issuer annual report", "source_ids": [ "src-huate-gas-annual-2025" ], "subject_id": "ent-huate-gas" }, { "claim_id": "clm-huatian-2p5d-rd-ceiling", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [ "con-huatian-hbm-context-vs-rd-roadmap" ], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-huatian-2p5d-rd-ceiling", "last_checked": "2026-07-29", "missing_proof": [ "exact product", "HBM stack", "customer", "qualification", "capacity", "yield", "shipment" ], "next_validation_event": "Named 2.5D/HBM product customer qualification and production receipt.", "object_id_or_value": "silicon-interposer 2.5D packaging R&D ongoing; volume acceleration is a 2026 plan", "predicate": "reports_readiness", "process_id": "proc-rdl-interposer", "product_id": null, "publication_date": "2026-03-31", "publication_date_unknown_reason": null, "readiness_state": "process_development", "record_type": "claim", "scope": "issuer annual-report project and roadmap", "source_ids": [ "src-huatian-annual-2025" ], "subject_id": "ent-huatian" }, { "claim_id": "clm-hubei-dinglong-portfolio-20260801", "completion_state": "source_backed", "confidence": "high_for_identity_and_listed_portfolio_only", 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"object_id_or_value": [ "electronic chemicals", "etching fluids", "semiconductor materials" ], "predicate": "has_source_bounded_portfolio", "process_id": null, "product_id": null, "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "official company-level identity and portfolio; no product-specific supplier relationship", "source_ids": [ "src-xingfa-profile-20260801" ], "subject_id": "ent-hubei-xingfa-chemicals" }, { "claim_id": "clm-hwatsing-cmp-business", "completion_state": "source_backed", "confidence": "high_for_portfolio_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-hwatsing-cmp-business", "last_checked": "2026-07-29", "missing_proof": [ "exact model", "facility", 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"received_industry_award_for", "process_id": "proc-lithography-iline-krf", "product_id": null, "publication_date": "2021-11-08", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "association award; exact SKU, customer, facility, layer, quantity and independent process data absent", "source_ids": [ "src-icmtia-kehua-248nm-award-2021" ], "subject_id": "ent-beijing-kehua" }, { "claim_id": "clm-kehua-dk1080-catalogue-volume-claim", "completion_state": "source_backed", "confidence": "medium_for_catalogue_scope", "contradiction_ids": [ "con-kehua-catalogue-volume-vs-customer-receipt" ], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-kehua-dk1080-catalogue-volume-claim", "last_checked": "2026-07-29", "missing_proof": [ "customer legal entity", "fab", "qualified layer", "qualification date", "batch 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"event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "VENDOR_REPORTED", "facility_id": "fac-kehua-shunyi-photoresist-base", "id": "clm-kehua-production-base-and-portfolio-vendor-description", "last_checked": "2026-07-29", "missing_proof": [ "permit capacity", "installed/qualified capacity", "current operation", "output/utilization", "model-to-line mapping", "customer qualification" ], "next_validation_event": "Government permit/EIA or company operating disclosure verifies current line capacity and production.", "object_id_or_value": { "capacity_scope": "vendor-described line/class capacities only", "location": "No. 4 Zhuyuan Road, Shunyi, Beijing", "portfolio": [ "KrF", "I-line", "G-line", "broad-spectrum UV", "photoresist ancillary reagents" ] }, "predicate": "company_describes_production_base_and_portfolio", "process_id": "proc-material-resist-stack", "product_id": null, "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "search-indexed official company page; direct open error and no permit/operating receipt", "source_ids": [ "src-kehua-company-home-20260729" ], "subject_id": "fac-kehua-shunyi-photoresist-base" }, { "claim_id": "clm-kfmi-legal-identity", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [ "con-kfmi-grikin-do-not-merge" ], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-kfmi-legal-identity", "last_checked": "2026-07-29", "missing_proof": [], "next_validation_event": "Monitor registry/exchange filings for name or ownership changes.", "object_id_or_value": { "cn": "宁波江丰电子材料股份有限公司", "en": "Konfoong Materials International Co., Ltd." }, "predicate": 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], "next_validation_event": "Named-customer delivery and process-qualification receipt for an exact model.", "object_id_or_value": "semiconductor equipment", "predicate": "operates_business", "process_id": "proc-track", "product_id": null, "publication_date": "2026-04-18", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "issuer annual-report company scope", "source_ids": [ "src-kingsemi-annual-2025" ], "subject_id": "ent-kingsemi" }, { "claim_id": "clm-kingsemi-krf-track-silan-jike-movein", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [], "event_date": "2022-06-10", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-silan-jike-12in", "id": "clm-kingsemi-krf-track-silan-jike-movein", "last_checked": "2026-07-29", "missing_proof": [ "model", "serial", "installation", "site acceptance", "named layer", "qualification", "uptime", "yield" ], "next_validation_event": "Silan Jike asset/tender/acceptance record names model, serial and SAT result.", "object_id_or_value": "fac-silan-jike-12in", "predicate": "shipped_and_moved_into", "process_id": "proc-track", "product_id": null, "publication_date": "2022-06-10", "publication_date_unknown_reason": null, "readiness_state": "shipped", "record_type": "claim", "scope": "unnamed-model 12-inch high-throughput KrF coat/develop tool", "source_ids": [ "src-kingsemi-silan-jike-krf-2022" ], "subject_id": "eq-kingsemi-unidentified-12in-krf-silan-jike" }, { "claim_id": "clm-kingsemi-ks-ft200-300-catalogue", "completion_state": "source_backed", "confidence": "high_for_catalogue_only", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-kingsemi-ks-ft200-300-catalogue", "last_checked": "2026-07-29", "missing_proof": [ "customer", "order", 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"next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-dd-ecarx-holdings", "predicate": "integrates", "process_id": null, "product_id": "prod-dd-lynk08-2023", "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-dd-lynk-sales to ent-dd-ecarx-holdings; commercial state first_delivery; qualification state vehicle_platform_integration", "source_ids": [ "src-dd-auto-001", "src-dd-auto-002", "src-dd-auto-003" ], "subject_id": "rel-dd-lynk08-integrates-ecarx-antora" }, { "claim_id": "clm-relationship-dd-poco-c71-integrates-unisoc-t7250", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, 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qualification state shipping_product", "source_ids": [ "src-dd-mobile-001", "src-dd-mobile-002", "src-dd-mobile-003", "src-dd-mobile-005", "src-dd-mobile-006" ], "subject_id": "rel-dd-poco-c71-integrates-unisoc-t7250" }, { "claim_id": "clm-relationship-empyrean-polas-willsemi", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2022-06-29", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-relationship-empyrean-polas-willsemi", "last_checked": "2026-07-29", "missing_proof": [ "contract", "seat count", "chip SKU", "foundry", "PDK", "volume" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-willsemi", "predicate": "supports", "process_id": null, "product_id": "prod-empyrean-polas", "publication_date": "2022-06-29", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-empyrean to ent-willsemi; commercial state adopted; qualification state integrated_into_design_process_vendor_reported", "source_ids": [ "src-empyrean-polas-willsemi-2022" ], "subject_id": "rel-empyrean-polas-willsemi" }, { "claim_id": "clm-relationship-gentech-owns-hanjing", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-gentech-owns-hanjing", "last_checked": "2026-07-29", "missing_proof": [], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-hanjing", "predicate": "owns", "process_id": null, "product_id": "prod-hanjing-quartz-sic-components", "publication_date": "2026-04-18", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-gentech to ent-hanjing; commercial state subsidiary; qualification state not_applicable", "source_ids": [ "src-gentech-annual-2025" ], "subject_id": "rel-gentech-owns-hanjing" }, { "claim_id": "clm-relationship-gentech-supplies-amec", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-relationship-gentech-supplies-amec", "last_checked": "2026-07-29", "missing_proof": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-amec", "predicate": "supplies", "process_id": null, "product_id": "prod-gentech-gas-chemical-box", "publication_date": "2026-04-18", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-gentech to ent-amec; commercial state batch_supply; qualification state validated_vendor_reported", "source_ids": [ "src-gentech-annual-2025" ], "subject_id": "rel-gentech-supplies-amec" }, { "claim_id": "clm-relationship-gentech-supplies-leadmicro", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-relationship-gentech-supplies-leadmicro", "last_checked": "2026-07-29", "missing_proof": [ "exact SKU", "tool model", "receiving facility", "quantity", 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"clm-relationship-gentech-supplies-naura", "last_checked": "2026-07-29", "missing_proof": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-naura", "predicate": "supplies", "process_id": null, "product_id": "prod-gentech-gas-chemical-box", "publication_date": "2026-04-18", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-gentech to ent-naura; commercial state batch_supply; qualification state validated_vendor_reported", "source_ids": [ "src-gentech-annual-2025" ], "subject_id": "rel-gentech-supplies-naura" }, { "claim_id": "clm-relationship-gentech-supplies-piotech", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-relationship-gentech-supplies-piotech", "last_checked": "2026-07-29", "missing_proof": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-piotech", "predicate": "supplies", "process_id": null, "product_id": "prod-gentech-gas-chemical-box", "publication_date": "2026-04-18", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-gentech to ent-piotech; commercial state batch_supply; qualification state validated_vendor_reported", "source_ids": [ "src-gentech-annual-2025" ], "subject_id": "rel-gentech-supplies-piotech" }, { "claim_id": "clm-relationship-gentech-supplies-sicarrier", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-relationship-gentech-supplies-sicarrier", "last_checked": "2026-07-29", "missing_proof": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-sicarrier", "predicate": "supplies", "process_id": null, "product_id": "prod-gentech-gas-chemical-box", "publication_date": "2026-04-18", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-gentech to ent-sicarrier; commercial state batch_supply; qualification state validated_vendor_reported", "source_ids": [ "src-gentech-annual-2025" ], "subject_id": "rel-gentech-supplies-sicarrier" }, { "claim_id": "clm-relationship-gentech-supplies-xinye-shidai-chemical-system-2025", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-03-25", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-xinye-shidai-8in", "id": "clm-relationship-gentech-supplies-xinye-shidai-chemical-system-2025", "last_checked": "2026-07-29", "missing_proof": [ "exact system BOM", "chemical species", "delivery", "installation", "site acceptance", "operating state", "recurring service" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-xinye-shidai", "predicate": "supplies", "process_id": null, "product_id": null, "publication_date": "2025-03-25", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-gentech to ent-xinye-shidai; commercial state procurement_award; qualification state unknown", "source_ids": [ "src-xinye-shidai-chemical-system-award-2025" ], "subject_id": "rel-gentech-supplies-xinye-shidai-chemical-system-2025" }, { "claim_id": "clm-relationship-gentech-supplies-yitang", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-relationship-gentech-supplies-yitang", "last_checked": "2026-07-29", "missing_proof": [ "exact SKU", "tool model", "receiving facility", "quantity", "foreign valve/MFC/controller dependencies" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-yitang", "predicate": "supplies", "process_id": null, "product_id": "prod-gentech-gas-chemical-box", "publication_date": "2026-04-18", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-gentech to ent-yitang; commercial state batch_supply; qualification state validated_vendor_reported", "source_ids": [ "src-gentech-annual-2025" ], "subject_id": "rel-gentech-supplies-yitang" }, { "claim_id": "clm-relationship-gigadevice-buys-cxmt-dram", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2021-01-01", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-gigadevice-buys-cxmt-dram", "last_checked": "2026-07-29", "missing_proof": [ "exact die", "process generation", "fab", "actual volume", "yield" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-cxmt-corp", "predicate": "buys", "process_id": null, "product_id": null, "publication_date": "2026-01-23", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-gigadevice to ent-cxmt-corp; commercial state recurring_related_party_transaction; qualification state volume_production", "source_ids": [ "src-gigadevice-cxmt-2026" ], "subject_id": "rel-gigadevice-buys-cxmt-dram" }, { "claim_id": "clm-relationship-gloway-integrates-cxmt-dram", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2020", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-gloway-integrates-cxmt-dram", "last_checked": "2026-07-29", "missing_proof": [ "exact SKU", "volume", "current status", "legal brand owner" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-cxmt-corp", "predicate": "integrates", "process_id": null, "product_id": "prod-gloway-yi-pro-2020", "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-gloway-brand to ent-cxmt-corp; commercial state historical_named_product_bom; qualification state product_page", "source_ids": [ "src-gloway-cxmt-yipro" ], "subject_id": "rel-gloway-integrates-cxmt-dram" }, { "claim_id": "clm-relationship-great-wall-n90pro-integrates-houmo-m50", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2026-05-31", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-relationship-great-wall-n90pro-integrates-houmo-m50", "last_checked": "2026-07-29", "missing_proof": [ "customer-origin product page", "contract", "units", "retail shipments", "acceptance", "field reliability" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-houmo", "predicate": "integrates", "process_id": null, "product_id": "prod-houmo-m50", "publication_date": "2026-05-31", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-china-great-wall to ent-houmo; commercial 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"process_id": null, "product_id": "prod-hygon-7000-series", "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-h3c-technologies to ent-hygon-brand-endpoint-unresolved; commercial state official_product; qualification state vendor_manufactured_product", "source_ids": [ "src-h3c-r4930g3-product" ], "subject_id": "rel-h3c-r4930g3-integrates-hygon7000" }, { "claim_id": "clm-relationship-h3c-supports-biren104p-bios574", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2023-08-04", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-h3c-supports-biren104p-bios574", "last_checked": "2026-07-29", "missing_proof": [ "configured server SKU", "order", "shipment", "validation", "installation", "customer", "volume" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-biren-brand-endpoint-unresolved", "predicate": "supports", "process_id": null, "product_id": "prod-h3c-h65-bios-574", "publication_date": "2023-08-04", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-h3c-technologies to ent-biren-brand-endpoint-unresolved; commercial state firmware_option_adaptation; qualification state unknown", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "subject_id": "rel-h3c-supports-biren104p-bios574" }, { "claim_id": "clm-relationship-h3c-supports-cambricon-options-bios574", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2023-08-04", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-h3c-supports-cambricon-options-bios574", "last_checked": "2026-07-29", "missing_proof": [ "configured server SKU", "order", "shipment", "validation", "installation", "customer", "volume" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-cambricon-brand-endpoint-unresolved", "predicate": "supports", "process_id": null, "product_id": "prod-h3c-h65-bios-574", "publication_date": "2023-08-04", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-h3c-technologies to ent-cambricon-brand-endpoint-unresolved; commercial state firmware_option_adaptation; qualification state unknown", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "subject_id": "rel-h3c-supports-cambricon-options-bios574" }, { "claim_id": "clm-relationship-h3c-supports-cxmt-memory-option-bios574", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2023-08-04", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-h3c-supports-cxmt-memory-option-bios574", "last_checked": "2026-07-29", "missing_proof": [ "module legal manufacturer", "DRAM die/BOM", "configured SKU", "order", "shipment", "installation", "customer", "volume" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-cxmt-corp", "predicate": "supports", "process_id": null, "product_id": "prod-h3c-h65-bios-574", "publication_date": "2023-08-04", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-h3c-technologies to ent-cxmt-corp; commercial state firmware_option_adaptation; qualification state unknown", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "subject_id": "rel-h3c-supports-cxmt-memory-option-bios574" }, { "claim_id": "clm-relationship-hanjing-supplies-huahong-group", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-relationship-hanjing-supplies-huahong-group", "last_checked": "2026-07-29", "missing_proof": [ "component SKU", "receiving facility", "tool", "grade", "quantity" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-huahong-group", "predicate": "supplies", "process_id": null, "product_id": "prod-hanjing-quartz-sic-components", "publication_date": "2026-04-18", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-hanjing to ent-huahong-group; commercial state stable_supply; qualification state validated_vendor_reported", "source_ids": [ "src-gentech-annual-2025" ], "subject_id": "rel-hanjing-supplies-huahong-group" }, { "claim_id": "clm-relationship-hengyunchang-supplies-amec", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-hengyunchang-supplies-amec", "last_checked": "2026-07-29", "missing_proof": [ "SKU", "tool model", "fab", "qualified layer" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-amec", "predicate": "supplies", "process_id": null, "product_id": "prod-hengyunchang-rf-power", "publication_date": "2026-04-28", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-hengyunchang to ent-amec; commercial state customer_revenue_reported; qualification state equipment_maker_validation_required", "source_ids": [ "src-hengyunchang-annual-2025" ], "subject_id": "rel-hengyunchang-supplies-amec" }, { "claim_id": "clm-relationship-hengyunchang-supplies-leadmicro", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-hengyunchang-supplies-leadmicro", "last_checked": "2026-07-29", "missing_proof": [ "SKU", "tool model", "fab", "qualified layer", "revenue scope" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-leadmicro", "predicate": "supplies", "process_id": null, "product_id": "prod-hengyunchang-rf-power", "publication_date": "2026-04-28", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-hengyunchang to ent-leadmicro; commercial state named_customer; qualification state equipment_maker_validation_required", "source_ids": [ "src-hengyunchang-annual-2025" ], "subject_id": "rel-hengyunchang-supplies-leadmicro" }, { "claim_id": "clm-relationship-hengyunchang-supplies-naura", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-hengyunchang-supplies-naura", "last_checked": "2026-07-29", "missing_proof": [ "SKU", "tool model", "fab", "qualified layer" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-naura", "predicate": "supplies", "process_id": null, "product_id": "prod-hengyunchang-rf-power", "publication_date": "2026-04-28", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-hengyunchang to ent-naura; commercial state customer_revenue_reported; qualification state equipment_maker_validation_required", "source_ids": [ "src-hengyunchang-annual-2025" ], "subject_id": "rel-hengyunchang-supplies-naura" }, { "claim_id": "clm-relationship-hengyunchang-supplies-piotech", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-hengyunchang-supplies-piotech", "last_checked": "2026-07-29", "missing_proof": [ "SKU", "tool model", "fab", "qualified layer" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-piotech", "predicate": "supplies", "process_id": null, "product_id": "prod-hengyunchang-rf-power", "publication_date": "2026-04-28", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-hengyunchang to ent-piotech; commercial state customer_revenue_reported; qualification state equipment_maker_validation_required", "source_ids": [ "src-hengyunchang-annual-2025" ], "subject_id": "rel-hengyunchang-supplies-piotech" }, { "claim_id": "clm-relationship-hermle-guowang-five-axis-award-2022", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2022-06-09", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-guowang-exposure-optics-base", "id": "clm-relationship-hermle-guowang-five-axis-award-2022", "last_checked": "2026-07-29", "missing_proof": [ "delivery", "installation", "acceptance", "current use", "exact optical part", "service", "spares", "domestic substitute" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-guowang-optics", "predicate": "supplies", "process_id": null, "product_id": null, "publication_date": "2022-06-09", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-hermle to ent-guowang-optics; commercial state procurement_award; qualification state unknown", "source_ids": [ "src-guowang-hermle-award-2022" ], "subject_id": "rel-hermle-guowang-five-axis-award-2022" }, { "claim_id": "clm-relationship-houmo-develops-h30-with-youkong", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2023-12-29", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-relationship-houmo-develops-h30-with-youkong", "last_checked": "2026-07-29", "missing_proof": [ "counterparty legal entity", "contract", "vehicle program", "qualification", "SOP", "units", "field reliability" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-youkong-zhixing-endpoint-unresolved", "predicate": "develops", "process_id": null, "product_id": "prod-houmo-h30", "publication_date": "2023-12-29", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-houmo to ent-youkong-zhixing-endpoint-unresolved; commercial state strategic_co_development_announcement; qualification state engineering_prototype", "source_ids": [ "src-houmo-h30-youkong-20231229" ], "subject_id": "rel-houmo-develops-h30-with-youkong" }, { "claim_id": "clm-relationship-huate-owns-jiangxi", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-huate-owns-jiangxi", "last_checked": "2026-07-29", "missing_proof": [ "current registry status", "which material projects are operated by the subsidiary" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-huate-jiangxi", "predicate": "owns", "process_id": null, "product_id": null, "publication_date": "2026-04-10", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-huate-gas to ent-huate-jiangxi; commercial state wholly_owned_subsidiary_at_2025_year_end; qualification state not_applicable", "source_ids": [ "src-huate-gas-annual-2025" ], "subject_id": "rel-huate-owns-jiangxi" }, { "claim_id": "clm-relationship-huate-supplies-smic-ningbo", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-relationship-huate-supplies-smic-ningbo", "last_checked": "2026-07-29", "missing_proof": [ "customer-origin notice", "gas SKU", "fab/layer", "quantity", "current share" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-smic-ningbo", "predicate": "supplies", "process_id": null, "product_id": null, "publication_date": "2026-04-10", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-huate-gas to ent-smic-ningbo; commercial state supplier_award; qualification state supplier_award_vendor_reported_not_technical_qualification", "source_ids": [ "src-huate-gas-annual-2025" ], "subject_id": "rel-huate-supplies-smic-ningbo" }, { "claim_id": "clm-relationship-huate-tianyu-onsite-hydrogen-2025", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-huate-tianyu-onsite-hydrogen-2025", "last_checked": "2026-07-29", "missing_proof": [ "contracting Huate subsidiary", "site address", "contract date/value", "delivery", "installation", "commissioning", "acceptance", "actual flow", "uptime", "purity", "specific process" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-guangdong-tianyu", "predicate": "supplies", "process_id": null, "product_id": "prod-huate-onsite-hydrogen-system", "publication_date": "2026-04-10", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-huate-gas to ent-guangdong-tianyu; commercial state named_project_in_construction_ledger; qualification state unknown", "source_ids": [ "src-huate-gas-annual-2025" ], "subject_id": "rel-huate-tianyu-onsite-hydrogen-2025" }, { "claim_id": "clm-relationship-huishan-center-integrates-mt-s5000", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2026-06-30", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_INDEPENDENT", "facility_id": "fac-wuxi-huishan-ai-compute-center-phase1", "id": "clm-relationship-huishan-center-integrates-mt-s5000", "last_checked": "2026-07-29", "missing_proof": [ "legal owner/operator", "buyer", "contract", "serials", "site acceptance", "uptime", "utilization", "customer workloads" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-moore-threads", "predicate": "integrates", "process_id": null, "product_id": "prod-moore-threads-s5000", "publication_date": "2026-07-24", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-wuxi-huishan-ai-center-owner-unresolved to ent-moore-threads; commercial state deployed_and_powered_on_government_reported; qualification state installed", "source_ids": [ "src-huishan-mt-s5000-center-20260724" ], "subject_id": "rel-huishan-center-integrates-mt-s5000" }, { "claim_id": "clm-relationship-hwatsing-supplies-cxmt", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2014-2020", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-hwatsing-supplies-cxmt", "last_checked": "2026-07-29", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-cxmt-corp", "predicate": "supplies", "process_id": null, "product_id": "prod-hwatsing-cmp-portfolio", "publication_date": "2021-02-08", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-hwatsing to ent-cxmt-corp; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "source_ids": [ "src-hwatsing-inquiry-2021" ], "subject_id": "rel-hwatsing-supplies-cxmt" }, { "claim_id": "clm-relationship-hwatsing-supplies-huahong", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2014-2020", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-hwatsing-supplies-huahong", "last_checked": "2026-07-29", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-huahong-group", "predicate": "supplies", "process_id": null, "product_id": "prod-hwatsing-cmp-portfolio", "publication_date": "2021-02-08", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-hwatsing to ent-huahong-group; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "source_ids": [ "src-hwatsing-inquiry-2021" ], "subject_id": "rel-hwatsing-supplies-huahong" }, { "claim_id": "clm-relationship-hwatsing-supplies-smic", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2014-2020", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-hwatsing-supplies-smic", "last_checked": "2026-07-29", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-smic", "predicate": "supplies", "process_id": null, "product_id": "prod-hwatsing-cmp-portfolio", "publication_date": "2021-02-08", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-hwatsing to ent-smic; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "source_ids": [ "src-hwatsing-inquiry-2021" ], "subject_id": "rel-hwatsing-supplies-smic" }, { "claim_id": "clm-relationship-hwatsing-supplies-ymtc", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2014-2020", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-hwatsing-supplies-ymtc", "last_checked": "2026-07-29", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-ymtc", "predicate": "supplies", "process_id": null, "product_id": "prod-hwatsing-cmp-portfolio", "publication_date": "2021-02-08", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-hwatsing to ent-ymtc; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "source_ids": [ "src-hwatsing-inquiry-2021" ], "subject_id": "rel-hwatsing-supplies-ymtc" }, { "claim_id": "clm-relationship-iluvatar-supports-h3c-bi-v100-configurations", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CORROBORATED", "facility_id": null, "id": "clm-relationship-iluvatar-supports-h3c-bi-v100-configurations", "last_checked": "2026-07-29", "missing_proof": [ "exact BI-V100/天数V100 alias equivalence", "purchase", "quantity", "production customer", "shipment", "installation", "acceptance", "exact start date" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-h3c-technologies", "predicate": "supports", "process_id": null, "product_id": "prod-iluvatar-bi-v100-alias-unresolved", "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-iluvatar to ent-h3c-technologies; commercial state supported_configuration; qualification state hardware_compatibility_certified", "source_ids": [ "src-iluvatar-compatibility", "src-h3c-iluvatar-r5300g6-202412", "src-h3c-iluvatar-server-202408" ], "subject_id": "rel-iluvatar-supports-h3c-bi-v100-configurations" }, { "claim_id": "clm-relationship-jcet-sells-unspecified-goods-cxmt-fy2025", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-jcet-sells-unspecified-goods-cxmt-fy2025", "last_checked": "2026-07-29", "missing_proof": [ "product", "facility", "process", "package/test scope", "qualification", "quantity in physical units", "HBM status" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-cxmt-corp", "predicate": "supplies", "process_id": null, "product_id": null, "publication_date": "2026-04-10", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-jcet to ent-cxmt-corp; commercial state related_party_sale_of_unspecified_goods_fy2025; qualification state unknown", "source_ids": [ "src-jcet-annual-2025" ], "subject_id": "rel-jcet-sells-unspecified-goods-cxmt-fy2025" }, { "claim_id": "clm-relationship-jinhong-supplies-xinye-shidai-bulk-gas-project-2025", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-xinye-shidai-8in", "id": "clm-relationship-jinhong-supplies-xinye-shidai-bulk-gas-project-2025", "last_checked": "2026-07-29", "missing_proof": [ "contracting Jinhong subsidiary", "exact gases/grades", "contract value", "delivery", "installation", "acceptance", "operating capacity" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-xinye-shidai", "predicate": "supplies", "process_id": null, "product_id": null, "publication_date": "2026-03-28", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-jinhong-gas to ent-xinye-shidai; commercial state electronic_bulk_carrier_gas_project_landed; qualification state unknown", "source_ids": [ "src-jinhong-annual-2025" ], "subject_id": "rel-jinhong-supplies-xinye-shidai-bulk-gas-project-2025" }, { "claim_id": "clm-relationship-kfmi-supplies-ssmc-targets-parts", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2008-01-01", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-kfmi-supplies-ssmc-targets-parts", "last_checked": "2026-07-29", "missing_proof": [ "exact target metal", "grade", "target model/drawing", "equipment-part SKU", "quantity", "facility line", "process layer" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-ssmc", "predicate": "supplies", "process_id": null, "product_id": null, "publication_date": "2024-08-29", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-kfmi to ent-ssmc; commercial state sustained_supply_vendor_reported_for_16_years; qualification state supplier_award", "source_ids": [ "src-kfmi-ssmc-award-2024" ], "subject_id": "rel-kfmi-supplies-ssmc-targets-parts" }, { "claim_id": "clm-relationship-kingsemi-supplies-silan-jike-krf-2022", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2022-06-10", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-silan-jike-12in", "id": "clm-relationship-kingsemi-supplies-silan-jike-krf-2022", "last_checked": "2026-07-29", "missing_proof": [ "model", "serial", "installation completion", "site acceptance", "named layer", "qualification", "recurring volume", "yield" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-silan-jike", "predicate": "supplies", "process_id": null, "product_id": null, "publication_date": "2022-06-10", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-kingsemi to ent-silan-jike; commercial state shipped_and_moved_in; qualification state unknown", "source_ids": [ "src-kingsemi-silan-jike-krf-2022" ], "subject_id": "rel-kingsemi-supplies-silan-jike-krf-2022" }, { "claim_id": "clm-relationship-li-auto-2021-li-one-integrates-journey3", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2021-05-25", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-li-auto-2021-li-one-integrates-journey3", "last_checked": "2026-07-29", "missing_proof": [ "Horizon contracting legal entity", "direct purchase/quantity", "vehicle factory/operator", "foundry/package/OSAT", "chip yield", "field failure rate" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-horizon-brand-endpoint-unresolved", "predicate": "integrates", "process_id": null, "product_id": "prod-horizon-journey-3", "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-li-auto-inc to ent-horizon-brand-endpoint-unresolved; commercial state shipping_2021_vehicle_model; qualification state installed_in_delivered_vehicle_model", "source_ids": [ "src-li-auto-2021q1-results-20210526", "src-li-auto-2021q3-results-20211129", "src-li-auto-dec-deliveries-20220101" ], "subject_id": "rel-li-auto-2021-li-one-integrates-journey3" }, { "claim_id": "clm-relationship-memblaze-integrates-ymtc-nand", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-memblaze-integrates-ymtc-nand", "last_checked": "2026-07-29", "missing_proof": [ "NAND generation", "current shipment volume", "controller/PMIC origin" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-ymtc", "predicate": "integrates", "process_id": null, "product_id": "prod-memblaze-pblaze6-6541", "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-memblaze to ent-ymtc; commercial state named_product_bom; qualification state product_page", "source_ids": [ "src-memblaze-ymtc-pblaze6" ], "subject_id": "rel-memblaze-integrates-ymtc-nand" }, { "claim_id": "clm-relationship-nsig-owns-xinsheng-jingke", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2024-12-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-xinsheng-jingke-300mm", "id": "clm-relationship-nsig-owns-xinsheng-jingke", "last_checked": "2026-07-29", "missing_proof": [ "current ownership percentage if less than wholly owned" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-xinsheng-jingke", "predicate": "owns", "process_id": null, "product_id": null, "publication_date": "2025-09-01", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-nsig to ent-xinsheng-jingke; commercial state subsidiary; qualification state operating", "source_ids": [ "src-nsig-inquiry-2025" ], "subject_id": "rel-nsig-owns-xinsheng-jingke" }, { "claim_id": "clm-relationship-piotech-supplies-cxmt", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2018-2021Q1", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-piotech-supplies-cxmt", "last_checked": "2026-07-29", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-cxmt-corp", "predicate": "supplies", "process_id": null, "product_id": "prod-piotech-deposition-portfolio", "publication_date": "2021-11-05", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-piotech to ent-cxmt-corp; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "source_ids": [ "src-piotech-prospectus-2021" ], "subject_id": "rel-piotech-supplies-cxmt" }, { "claim_id": "clm-relationship-piotech-supplies-huahong", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2018-2021Q1", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-piotech-supplies-huahong", "last_checked": "2026-07-29", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-huahong-group", "predicate": "supplies", "process_id": null, "product_id": "prod-piotech-deposition-portfolio", "publication_date": "2021-11-05", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-piotech to ent-huahong-group; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "source_ids": [ "src-piotech-prospectus-2021" ], "subject_id": "rel-piotech-supplies-huahong" }, { "claim_id": "clm-relationship-piotech-supplies-smic", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2018-2021Q1", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-piotech-supplies-smic", "last_checked": "2026-07-29", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-smic", "predicate": "supplies", "process_id": null, "product_id": "prod-piotech-deposition-portfolio", "publication_date": "2021-11-05", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-piotech to ent-smic; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "source_ids": [ "src-piotech-prospectus-2021" ], "subject_id": "rel-piotech-supplies-smic" }, { "claim_id": "clm-relationship-piotech-supplies-ymtc", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2018-2021Q1", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-piotech-supplies-ymtc", "last_checked": "2026-07-29", "missing_proof": [ "exact model", "receiving legal entity/facility", "installation and acceptance date", "qualified layer", "throughput/uptime/yield" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-ymtc", "predicate": "supplies", "process_id": null, "product_id": "prod-piotech-deposition-portfolio", "publication_date": "2021-11-05", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-piotech to ent-ymtc; commercial state production_line_use_reported_at_group_portfolio_scope; qualification state exact_model_facility_layer_unresolved", "source_ids": [ "src-piotech-prospectus-2021" ], "subject_id": "rel-piotech-supplies-ymtc" }, { "claim_id": "clm-relationship-primarius-nanospice-skhynix", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2022-01-27", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-relationship-primarius-nanospice-skhynix", "last_checked": "2026-07-29", "missing_proof": [ "customer-origin receipt", "fab", "node", "chip SKU", "seat count", "volume" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-skhynix", "predicate": "supplies", "process_id": null, "product_id": "prod-primarius-nanospice", "publication_date": "2022-01-27", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-primarius to ent-skhynix; commercial state adopted; qualification state customer_adoption_vendor_reported", "source_ids": [ "src-primarius-nanospice-skhynix-2022" ], "subject_id": "rel-primarius-nanospice-skhynix" }, { "claim_id": "clm-relationship-red-avenue-owns-tongcheng-chemical-china", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-tongcheng-chemical-shanghai-resin", "id": "clm-relationship-red-avenue-owns-tongcheng-chemical-china", "last_checked": "2026-07-29", "missing_proof": [ "incorporation/acquisition date", "registration ID" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-tongcheng-chemical-china", "predicate": "owns", "process_id": null, "product_id": null, "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-red-avenue to ent-tongcheng-chemical-china; commercial state wholly_owned_subsidiary_at_2025_year_end; qualification state not_applicable", "source_ids": [ "src-red-avenue-annual-2025", "src-redavenue-subsidiaries-guarantee-2025" ], "subject_id": "rel-red-avenue-owns-tongcheng-chemical-china" }, { "claim_id": "clm-relationship-red-avenue-owns-tongcheng-electronic-shanghai", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-red-avenue-owns-tongcheng-electronic-shanghai", "last_checked": "2026-07-29", "missing_proof": [ "acquisition/origination date", "registration ID" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-tongcheng-electronic-materials-shanghai", "predicate": "owns", "process_id": null, "product_id": null, "publication_date": "2026-04-18", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-red-avenue to ent-tongcheng-electronic-materials-shanghai; commercial state current_subsidiary; qualification state not_applicable", "source_ids": [ "src-red-avenue-annual-2025" ], "subject_id": "rel-red-avenue-owns-tongcheng-electronic-shanghai" }, { "claim_id": "clm-relationship-saic-develops-journey5-solution", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2022-11-04", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-saic-develops-journey5-solution", "last_checked": "2026-07-29", "missing_proof": [ "Horizon legal entity", "SAIC subsidiary/vehicle model", "controller/BOM", "order", "SOP", "qualification", "delivery", "volume" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-horizon-brand-endpoint-unresolved", "predicate": "develops", "process_id": null, "product_id": "prod-horizon-journey-5", "publication_date": "2022-11-04", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-saic-motor to ent-horizon-brand-endpoint-unresolved; commercial state jointly_released_solution; qualification state unknown", "source_ids": [ "src-saic-soa-conference-20221104" ], "subject_id": "rel-saic-develops-journey5-solution" }, { "claim_id": "clm-relationship-samsung-owns-xian-operation", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2014-05-09", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-samsung-xian-nand", "id": "clm-relationship-samsung-owns-xian-operation", "last_checked": "2026-07-29", "missing_proof": [], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-samsung-china-semiconductor", "predicate": "owns", "process_id": null, "product_id": null, "publication_date": "2014-05-09", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-samsung-electronics to ent-samsung-china-semiconductor; commercial state foreign_owned_mainland_operation; qualification state volume_production", "source_ids": [ "src-samsung-xian-operation-2014" ], "subject_id": "rel-samsung-owns-xian-operation" }, { "claim_id": "clm-relationship-shenzhou-kuntai-framework-china-mobile-ai-servers-2024", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2024-08-22", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-shenzhou-kuntai-framework-china-mobile-ai-servers-2024", "last_checked": "2026-07-29", "missing_proof": [ "purchase orders", "executed quantity", "server model", "semiconductor BOM", "delivery", "installation", "commissioning", "acceptance", "receiving affiliate/facility", "utilization" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-china-mobile-communications", "predicate": "supplies", "process_id": null, "product_id": "prod-shenzhou-kuntai-ai-server-framework", "publication_date": "2024-08-24", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-shenzhou-kuntai-xiamen to ent-china-mobile-communications; commercial state signed_framework_after_award; qualification state awarded_framework_supplier", "source_ids": [ "src-digital-china-cmcc-framework-20240824" ], "subject_id": "rel-shenzhou-kuntai-framework-china-mobile-ai-servers-2024" }, { "claim_id": "clm-relationship-shenzhou-rps-to-amec", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-relationship-shenzhou-rps-to-amec", "last_checked": "2026-07-29", "missing_proof": [ "model", "facility", "acceptance", "qualified layer", "uptime" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-amec", "predicate": "supplies", "process_id": null, "product_id": "prod-shenzhou-rps", "publication_date": "2026-06-30", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-jiangsu-shenzhou to ent-amec; commercial state issuer_reports_installed_in_customer_equipment; qualification state customer_endorsement_in_filing", "source_ids": [ "src-jiangsu-shenzhou-prospectus-2026" ], "subject_id": "rel-shenzhou-rps-to-amec" }, { "claim_id": "clm-relationship-shenzhou-rps-to-piotech", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-relationship-shenzhou-rps-to-piotech", "last_checked": "2026-07-29", "missing_proof": [ "model", "facility", "acceptance", "qualified layer", "uptime" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-piotech", "predicate": "supplies", "process_id": null, "product_id": "prod-shenzhou-rps", "publication_date": "2026-06-30", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-jiangsu-shenzhou to ent-piotech; commercial state issuer_reports_installed_in_customer_equipment; qualification state customer_endorsement_in_filing", "source_ids": [ "src-jiangsu-shenzhou-prospectus-2026" ], "subject_id": "rel-shenzhou-rps-to-piotech" }, { "claim_id": "clm-relationship-silan-jv-with-xiamen-semiconductor-investment", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-silan-jike-12in", "id": "clm-relationship-silan-jv-with-xiamen-semiconductor-investment", "last_checked": "2026-07-29", "missing_proof": [ "shareholding percentages", "current ownership changes" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-xiamen-semiconductor-investment", "predicate": "joint_venture_with", "process_id": null, "product_id": null, "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-silan to ent-xiamen-semiconductor-investment; commercial state joint_investment_in_silan_jike; qualification state not_applicable", "source_ids": [ "src-silan-jike-company-profile" ], "subject_id": "rel-silan-jv-with-xiamen-semiconductor-investment" }, { "claim_id": "clm-relationship-skhynix-acquires-dalian-nand", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2021-12-30", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-skhynix-dalian-nand", "id": "clm-relationship-skhynix-acquires-dalian-nand", "last_checked": "2026-07-29", "missing_proof": [], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-skhynix-dalian", "predicate": "owns", "process_id": null, "product_id": null, "publication_date": "2021-12-30", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-skhynix to ent-skhynix-dalian; commercial state acquisition; qualification state operating_state_unknown", "source_ids": [ "src-skhynix-dalian-acquisition-2021" ], "subject_id": "rel-skhynix-acquires-dalian-nand" }, { "claim_id": "clm-relationship-skhynix-controls-dalian-operation", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2026-03-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-skhynix-dalian-nand", "id": "clm-relationship-skhynix-controls-dalian-operation", "last_checked": "2026-07-29", "missing_proof": [ "immediate ownership chain", "share percentage", "fab land/tool title allocation" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-skhynix-dalian", "predicate": "owns", "process_id": null, "product_id": null, "publication_date": "2026-06-24", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-skhynix to ent-skhynix-dalian; commercial state consolidated_subsidiary_and_current_nand_fab; qualification state not_applicable", "source_ids": [ "src-skhynix-f1-facilities-2026", "src-skhynix-sec-subsidiaries-2026", "src-skhynix-official-network-2026" ], "subject_id": "rel-skhynix-controls-dalian-operation" }, { "claim_id": "clm-relationship-skhynix-controls-wuxi-operation", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2026-03-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-skhynix-controls-wuxi-operation", "last_checked": "2026-07-29", "missing_proof": [ "immediate ownership chain", "share percentage", "fab land/tool title allocation" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-skhynix-wuxi-operator-unresolved", "predicate": "owns", "process_id": null, "product_id": null, "publication_date": "2026-06-24", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-skhynix to ent-skhynix-wuxi-operator-unresolved; commercial state consolidated_subsidiary_and_current_production_site; qualification state not_applicable", "source_ids": [ "src-skhynix-f1-facilities-2026", "src-skhynix-sec-subsidiaries-2026", "src-skhynix-official-network-2026" ], "subject_id": "rel-skhynix-controls-wuxi-operation" }, { "claim_id": "clm-relationship-smee-zycgr22011903-ssc800-award-2025", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-24", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-smee-zycgr22011903-ssc800-award-2025", "last_checked": "2026-07-29", "missing_proof": [ "buyer legal identity", "signed contract", "manufacturing completion", "serial", "shipment", "delivery/receiving", "move-in", "installation", "site acceptance", "asset registration", "facility", "technical specification", "qualified layer", "production use" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-buyer-zycgr22011903-unresolved", "predicate": "selected_supplier_for", "process_id": null, "product_id": "prod-smee-ssc800-10", "publication_date": "2025-12-25", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-smee to ent-buyer-zycgr22011903-unresolved; commercial state procurement_award_contract_pending; qualification state unknown", "source_ids": [ "src-ccgp-smee-ssc800-award-2025", "src-ssc800-ccgp-award-letter-20251224" ], "subject_id": "rel-smee-zycgr22011903-ssc800-award-2025" }, { "claim_id": "clm-relationship-tongcheng-shanghai-owns-beijing-kehua", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-05-28", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-tongcheng-shanghai-owns-beijing-kehua", "last_checked": "2026-07-29", "missing_proof": [ "identity and country of remaining 3.6705 percent minority", "current registration extract", "registration ID" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-beijing-kehua", "predicate": "owns", "process_id": null, "product_id": null, "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-tongcheng-electronic-materials-shanghai to ent-beijing-kehua; commercial state 96.3295_percent_direct_holding_disclosed_2025_05; 96.3296_percent_annual_report_rounding; qualification state not_applicable", "source_ids": [ "src-red-avenue-annual-2025", "src-redavenue-kehua-investment-2025" ], "subject_id": "rel-tongcheng-shanghai-owns-beijing-kehua" }, { "claim_id": "clm-relationship-tongcheng-shanghai-owns-tongcheng-changzhou", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-tongcheng-changzhou-cmp-pad", "id": "clm-relationship-tongcheng-shanghai-owns-tongcheng-changzhou", "last_checked": "2026-07-29", "missing_proof": [ "incorporation date", "registration ID" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-tongcheng-electronic-materials-changzhou", "predicate": "owns", "process_id": null, "product_id": null, "publication_date": "2026-04-18", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-tongcheng-electronic-materials-shanghai to ent-tongcheng-electronic-materials-changzhou; commercial state wholly_owned_project_subsidiary_at_2025_year_end; qualification state not_applicable", "source_ids": [ "src-red-avenue-annual-2025" ], "subject_id": "rel-tongcheng-shanghai-owns-tongcheng-changzhou" }, { "claim_id": "clm-relationship-tongfu-owns-nantong-tongfu", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-tongfu-owns-nantong-tongfu", "last_checked": "2026-07-29", "missing_proof": [], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-nantong-tongfu", "predicate": "owns", "process_id": null, "product_id": null, "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-tongfu to ent-nantong-tongfu; commercial state subsidiary_project_owner; qualification state not_applicable", "source_ids": [ "src-tongfu-annual-2025", "src-tongfu-hbm-project-2025" ], "subject_id": "rel-tongfu-owns-nantong-tongfu" }, { "claim_id": "clm-relationship-transsion-brand-validates-cxmt-lpddr5", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2023-11-28", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-transsion-brand-validates-cxmt-lpddr5", "last_checked": "2026-07-29", "missing_proof": [ "contracting legal entity", "phone model", "shipment volume", "current status" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-cxmt-corp", "predicate": "validates", "process_id": null, "product_id": "prod-cxmt-lpddr5-12gb", "publication_date": "2023-11-28", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-transsion-brand to ent-cxmt-corp; commercial state brand_phone_product_validation; qualification state customer_validated", "source_ids": [ "src-cxmt-xiaomi-transsion-validation-2023" ], "subject_id": "rel-transsion-brand-validates-cxmt-lpddr5" }, { "claim_id": "clm-relationship-tsmc-owns-nanjing", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-tsmc-nanjing-fab16", "id": "clm-relationship-tsmc-owns-nanjing", "last_checked": "2026-07-29", "missing_proof": [], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-tsmc-nanjing", "predicate": "owns", "process_id": null, "product_id": null, "publication_date": "2026-04-17", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-tsmc to ent-tsmc-nanjing; commercial state foreign_owned_mainland_operation; qualification state operating", "source_ids": [ "src-tsmc-annual-2025" ], "subject_id": "rel-tsmc-owns-nanjing" }, { "claim_id": "clm-relationship-tsmc-owns-shanghai", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-tsmc-shanghai-fab10", "id": "clm-relationship-tsmc-owns-shanghai", "last_checked": "2026-07-29", "missing_proof": [], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-tsmc-china", "predicate": "owns", "process_id": null, "product_id": null, "publication_date": "2026-04-17", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-tsmc to ent-tsmc-china; commercial state foreign_owned_mainland_operation; qualification state operating", "source_ids": [ "src-tsmc-annual-2025" ], "subject_id": "rel-tsmc-owns-shanghai" }, { "claim_id": "clm-relationship-umc-owns-united-semi-xiamen", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-united-semi-xiamen", "id": "clm-relationship-umc-owns-united-semi-xiamen", "last_checked": "2026-07-29", "missing_proof": [], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-united-semi-xiamen", "predicate": "owns", "process_id": null, "product_id": null, "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-umc to ent-united-semi-xiamen; commercial state foreign_owned_mainland_operation; qualification state volume_production", "source_ids": [ "src-umc-fab-information" ], "subject_id": "rel-umc-owns-united-semi-xiamen" }, { "claim_id": "clm-relationship-uprecision-company-k-2024-acceptance", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2024-01-01", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-uprecision-company-k-2024-acceptance", "last_checked": "2026-07-29", "missing_proof": [ "Company K legal identity", "model", "quantity", "scanner/bonder integration", "fab", "layer", "volume use" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-uprecision-company-k-unresolved", "predicate": "reported_customer_acceptance_by", "process_id": null, "product_id": null, "publication_date": "2026-06-30", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-uprecision to ent-uprecision-company-k-unresolved; commercial state batch_customer_acceptance; qualification state customer_accepted_subsystem_scope", "source_ids": [ "src-uprecision-prospectus-2026" ], "subject_id": "rel-uprecision-company-k-2024-acceptance" }, { "claim_id": "clm-relationship-uprecision-supplies-smee-dual-stage-2020", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2020-04-01", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-uprecision-supplies-smee-dual-stage-2020", "last_checked": "2026-07-29", "missing_proof": [ "scanner model", "destination fab", "later acceptance", "qualified layer", "volume use" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-smee", "predicate": "supplies", "process_id": null, "product_id": null, "publication_date": "2023-12-29", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-uprecision to ent-smee; commercial state shipped; qualification state not_accepted_at_source_cutoff", "source_ids": [ "src-uprecision-round2-2023" ], "subject_id": "rel-uprecision-supplies-smee-dual-stage-2020" }, { "claim_id": "clm-relationship-util-001", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2024-02-05", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-util-cxmt-phase2", "id": "clm-relationship-util-001", "last_checked": "2026-07-29", "missing_proof": [ "formal contract signature", "final scope and settlement terms", "installation", "site acceptance", "production qualification" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-util-11th-tech", "predicate": "selected_supplier_for", "process_id": null, "product_id": "svc-util-cxmt-cleanroom", "publication_date": "2024-02-06", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-util-lk-suzhou to ent-util-11th-tech; commercial state award_notice_received_formal_contract_pending; qualification state unknown", "source_ids": [ "src-util-001" ], "subject_id": "rel-util-001" }, { "claim_id": "clm-relationship-util-002", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2023-06-03", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-util-huahong-wuxi-project", "id": "clm-relationship-util-002", "last_checked": "2026-07-29", "missing_proof": [ "effectiveness-condition satisfaction date", "actual start and completion", "acceptance", "installed systems", "production qualification" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-util-huahong-wuxi", "predicate": "contracted_for", "process_id": null, "product_id": "svc-util-huahong-epc", "publication_date": "2023-06-03", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-util-11th-tech to ent-util-huahong-wuxi; commercial state formal_contract_signed_subject_to_effectiveness_conditions; qualification state unknown", "source_ids": [ "src-util-002" ], "subject_id": "rel-util-002" }, { "claim_id": "clm-relationship-util-003", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2023-06-03", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-util-huahong-wuxi-project", "id": "clm-relationship-util-003", "last_checked": "2026-07-29", "missing_proof": [ "effectiveness-condition satisfaction date", "actual start and completion", "acceptance" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-util-huahong-wuxi", "predicate": "contracted_for", "process_id": null, "product_id": "svc-util-huahong-civil", "publication_date": "2023-06-03", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-util-shanghai-fourth to ent-util-huahong-wuxi; commercial state formal_contract_signed_subject_to_effectiveness_conditions; qualification state unknown", "source_ids": [ "src-util-002" ], "subject_id": "rel-util-003" }, { "claim_id": "clm-relationship-util-004", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-01-23", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": "fac-util-silan-sic-phase1", "id": "clm-relationship-util-004", "last_checked": "2026-07-29", "missing_proof": [ "award amount", "contract signature", "installation", "acceptance", "commissioning", "component origin" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-util-silan-jihong", "predicate": "reported_selected_supplier_for", "process_id": null, "product_id": "svc-util-silan-exhaust", "publication_date": "2025-01-23", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-util-shengjian to ent-util-silan-jihong; commercial state supplier_reported_award; qualification state unknown", "source_ids": [ "src-util-003" ], "subject_id": "rel-util-004" }, { "claim_id": "clm-relationship-util-005", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2026-05-11", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": "fac-util-yuerun-a1", "id": "clm-relationship-util-005", "last_checked": "2026-07-29", "missing_proof": [ "counterparty confirmation", "exact unrounded award value", "contract signature", "installation", "acceptance", "production qualification" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-util-yuerun", "predicate": "reported_selected_supplier_for", "process_id": null, "product_id": "svc-util-yuerun-cleanroom", "publication_date": "2026-05-11", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-util-huakang to ent-util-yuerun; commercial state supplier_reported_award; qualification state unknown", "source_ids": [ "src-util-004" ], "subject_id": "rel-util-005" }, { "claim_id": "clm-relationship-util-006", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2026-05-07", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-util-006", "last_checked": "2026-07-29", "missing_proof": [ "delivery site", "delivery", "installation", "acceptance", "production-fab use", "component origin" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-util-ihep", "predicate": "selected_supplier_for", "process_id": null, "product_id": "prod-util-kyky-vacuum-test", "publication_date": "2026-05-07", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-util-kyky to ent-util-ihep; commercial state government_procurement_awarded; qualification state unknown", "source_ids": [ "src-util-005" ], "subject_id": "rel-util-006" }, { "claim_id": "clm-relationship-verisilicon-depends-globalfoundries-22fdx", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2025-09-24", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-verisilicon-depends-globalfoundries-22fdx", "last_checked": "2026-07-29", "missing_proof": [ "foundry facility", "PDK revision", "named chips/customers" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-globalfoundries", "predicate": "depends_on", "process_id": null, "product_id": "prod-verisilicon-fdsoi-wireless-ip", "publication_date": "2025-09-24", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-verisilicon to ent-globalfoundries; commercial state platform_built_on_process; qualification state production_shipments_claimed_for_anonymous_customers", "source_ids": [ "src-verisilicon-gf-22fdx-2025" ], "subject_id": "rel-verisilicon-depends-globalfoundries-22fdx" }, { "claim_id": "clm-relationship-xiaomi-brand-validates-cxmt-lpddr5", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": "2023-11-28", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-xiaomi-brand-validates-cxmt-lpddr5", "last_checked": "2026-07-29", "missing_proof": [ "contracting legal entity", "phone model", "shipment volume", "current status" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-cxmt-corp", "predicate": "validates", "process_id": null, "product_id": "prod-cxmt-lpddr5-12gb", "publication_date": "2023-11-28", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-xiaomi-brand to ent-cxmt-corp; commercial state brand_phone_product_validation; qualification state customer_validated", "source_ids": [ "src-cxmt-xiaomi-transsion-validation-2023" ], "subject_id": "rel-xiaomi-brand-validates-cxmt-lpddr5" }, { "claim_id": "clm-relationship-xmc-espressif-strategic-cooperation", "completion_state": "source_backed", "confidence": "high_for_disclosed_edge_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-relationship-xmc-espressif-strategic-cooperation", "last_checked": "2026-07-29", "missing_proof": [ "wafer quantity", "yield", "current program", "end-product volume" ], "next_validation_event": "Obtain counterparty-origin procurement, qualification, acceptance, shipment or current-authorization evidence at the exact product/facility scope.", "object_id_or_value": "ent-espressif", "predicate": "strategic_cooperation_with", "process_id": null, "product_id": "prod-xmc-spi-nor", "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "edge from ent-xmc to ent-espressif; commercial state announced_strategic_cooperation; qualification state unknown", "source_ids": [ "src-xmc-espressif-cooperation" ], "subject_id": "rel-xmc-espressif-strategic-cooperation" }, { "claim_id": "clm-rslaser-yizhuang-project-registration", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-rslaser-yizhuang-base", "id": "clm-rslaser-yizhuang-project-registration", "last_checked": "2026-07-29", "missing_proof": [ "construction completion", "installed capacity", "actual output", "customer", "scanner integration", "qualification" ], "next_validation_event": "Completion acceptance or operating report gives installed capacity and shipped light-source models.", "object_id_or_value": { "investment": 1.2923768, "unit": "CNY_billion" }, "predicate": "project_registered", "process_id": "proc-component-lasers-light-sources", "product_id": null, "publication_date": "2021-09-10", "publication_date_unknown_reason": null, "readiness_state": "research_concept", "record_type": "claim", "scope": "light-source manufacturing and refurbishment base", "source_ids": [ "src-rslaser-yizhuang-project-2021" ], "subject_id": "fac-rslaser-yizhuang-base" }, { "claim_id": "clm-saic-journey5-joint-solution-release", "completion_state": 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"proc-logic-foundry", "product_id": null, "publication_date": "2026-04-08", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "issuer annual-report company scope", "source_ids": [ "src-smic-annual-2025" ], "subject_id": "ent-smic" }, { "claim_id": "clm-smic-generic-procurement-no-scanner-edge-2025", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-smic-generic-procurement-no-scanner-edge-2025", "last_checked": "2026-07-29", "missing_proof": [ "vendor legal entity", "scanner model", "facility", "delivery", "installation", "site acceptance", "qualified layer" ], "next_validation_event": "SMIC or supplier filing/tender/asset/acceptance record names both endpoints, scanner model, site and status.", "object_id_or_value": "materials, spares, equipment, software and technical services", "predicate": "procures", "process_id": "proc-logic-foundry", "product_id": null, "publication_date": "2026-03-27", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "generic foundry procurement; scanner/vendor/facility not disclosed", "source_ids": [ "src-smic-sse-annual-2025" ], "subject_id": "ent-smic" }, { "claim_id": "clm-smic-zhongxinbeifang-no-named-scanner-2026", "completion_state": "source_backed", "confidence": "high_for_bounded_filing", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "RESEARCH_MEASURED", "facility_id": null, "id": "clm-smic-zhongxinbeifang-no-named-scanner-2026", "last_checked": "2026-07-29", "missing_proof": [ "equipment supplier", "scanner model", "facility", "commercial/readiness state" ], "next_validation_event": "A non-exempt 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"last_checked": "2026-07-29", "missing_proof": [ "exact product owner", "foundry", "memory supplier", "package/OSAT", "units", "customer", "workload", "yield" ], "next_validation_event": "Contract, certificate or filing identifies the BM1684X legal manufacturer/seller.", "object_id_or_value": { "BM1684X": { "BF16_FP16": "16 TFLOPS", "FP32": "2 TFLOPS", "INT8": "32 TOPS", "memory": "6/12/16 GB LPDDR4/LPDDR4X" }, "group_legal_entity": "北京算能科技有限公司及下属公司" }, "predicate": "has_group_identity_and_product_specification", "process_id": "proc-chip-ai-accelerator", "product_id": "prod-sophgo-bm1684x", "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "group policy does not identify exact BM1684X legal product owner", "source_ids": [ "src-sophgo-privacy", "src-sophgo-bm1684x-product" ], "subject_id": "ent-sophgo-brand-endpoint-unresolved" }, { "claim_id": "clm-suzhou-kema-materials-portfolio-20260801", "completion_state": "source_backed", "confidence": "high_for_identity_and_listed_portfolio_only", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-suzhou-kema-materials-portfolio-20260801", "last_checked": "2026-08-01", "missing_proof": [ "named counterparty legal entity", "exact product, facility and process scope", "order or shipment quantity", "installation and acceptance", "qualification, yield and recurring production" ], "next_validation_event": "Obtain a counterparty-origin procurement, facility, qualification or shipment receipt before adding any product-specific supplier edge.", "object_id_or_value": [ "high purity ceramic materials", "semiconductor equipment components", "equipment consumables" ], "predicate": "has_source_bounded_portfolio", "process_id": null, "product_id": null, "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "unknown", "record_type": "claim", "scope": "official company-level identity and portfolio; no product-specific supplier relationship", "source_ids": [ "src-kema-profile-20260801" ], "subject_id": "ent-suzhou-kema-materials" }, { "claim_id": "clm-swaysure-scope", "completion_state": "source_backed", "confidence": "high_for_scope_only", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-swaysure-scope", "last_checked": "2026-07-29", "missing_proof": [ "operating fab", "product generation", "wafer output", "scanner fleet" ], "next_validation_event": "Official fab EIA, tool move-in or production disclosure.", "object_id_or_value": "general-purpose memory product 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[], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-tianjin-jiuri-new-materials-portfolio-20260801", "last_checked": "2026-08-01", "missing_proof": [ "named counterparty legal entity", "exact product, facility and process scope", "order or shipment quantity", "installation and acceptance", "qualification, yield and recurring production" ], "next_validation_event": "Obtain a counterparty-origin procurement, facility, qualification or shipment receipt before adding any product-specific supplier edge.", "object_id_or_value": [ "photoresist materials", "electronic chemicals" ], "predicate": "has_source_bounded_portfolio", "process_id": null, "product_id": null, "publication_date": "2026-04-25", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "official company-level identity and portfolio; no product-specific supplier relationship", "source_ids": [ "src-jiuri-annual-2025" ], "subject_id": "ent-tianjin-jiuri-new-materials" }, { "claim_id": "clm-tongcheng-arf-krf-validation-ramp-2025", "completion_state": "source_backed", "confidence": "medium_for_anonymous_customer_scope", "contradiction_ids": [ "con-tongcheng-anonymous-validation-vs-customer-edge" ], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "VENDOR_REPORTED", "facility_id": null, "id": "clm-tongcheng-arf-krf-validation-ramp-2025", "last_checked": "2026-07-29", "missing_proof": [ "customer legal entity", "facility", "SKU", "wavelength/mode", "layer", "qualification date", "batch quantity", "yield" ], "next_validation_event": "Customer-side qualification or purchase receipt names legal entity, fab, material SKU and layer.", "object_id_or_value": [ "ArF photoresist", "KrF photoresist", "antireflective coating", "EBR" ], "predicate": "reports_customer_validation_and_ramp", "process_id": 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"completion_state": "source_backed", "confidence": "high_for_approved_capacity_and_utilization_only", "contradiction_ids": [ "con-tongcheng-approved-capacity-vs-installed-output" ], "event_date": "2025-12-31", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-tongcheng-electronic-photoresist-solvent", "id": "clm-tongcheng-photoresist-solvent-approved-capacity-2025", "last_checked": "2026-07-29", "missing_proof": [ "installed capacity", "qualified capacity", "actual output by SKU", "yield", "street address", "customer/facility mapping" ], "next_validation_event": "Permit, asset or operating disclosure separates installed, qualified and actual output by product grade.", "object_id_or_value": { "high_purity_solvent": { "approved_capacity_tonnes_per_year": 18800, "utilization_percent": 7.2 }, "semiconductor_photoresist": { "approved_capacity_tonnes_per_year": 1000, "utilization_percent": 21.5 } }, "predicate": 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"received_energy_review_for", "process_id": "proc-material-resist-stack", "product_id": null, "publication_date": "2025-01-17", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "government-approved project design; not installed, qualified or actual output", "source_ids": [ "src-scip-tongcheng-resin-energy-review-2025" ], "subject_id": "fac-tongcheng-chemical-shanghai-resin" }, { "claim_id": "clm-tongfu-hbm-project", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [ "con-hbm-project-vs-qualified-product" ], "event_date": "2025-01-24", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-tongfu-hbm-project", "last_checked": "2026-07-29", "missing_proof": [ "stack generation", "DRAM owner", "customer", "qualified flow", "yield", "shipment", "volume" ], "next_validation_event": "EIA completion/tool move-in followed by customer qualification naming 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"fac-nantong-tongfu-hbs-chiplet-line", "id": "clm-tongfu-hbs-trial-production-ceiling", "last_checked": "2026-07-29", "missing_proof": [ "HBM generation", "DRAM die owner", "base die/PHY", "TSV", "KGD", "customer/accelerator", "site acceptance", "qualified stack", "yield", "shipment" ], "next_validation_event": "Dated customer or government acceptance names HBM generation, die owner, stack, line, yield and shipment state.", "object_id_or_value": "trial production; environmental acceptance not completed", "predicate": "reported_readiness", "process_id": "proc-osat-assembly", "product_id": null, "publication_date": "2025-06-09", "publication_date_unknown_reason": null, "readiness_state": "process_development", "record_type": "claim", "scope": "high-bandwidth-storage-chiplet packaging line", "source_ids": [ "src-tongfu-hbs-change-analysis-2025" ], "subject_id": "fac-nantong-tongfu-hbs-chiplet-line" }, { "claim_id": "clm-tsmc-china-tool-license-exposure", "completion_state": "source_backed", "confidence": "medium", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_INDEPENDENT", "facility_id": "fac-tsmc-nanjing-fab16", "id": "clm-tsmc-china-tool-license-exposure", "last_checked": "2026-07-29", "missing_proof": [ "complete tool/component/service list", "license duration and conditions" ], "next_validation_event": "Official license or company filing enumerating covered tools and service.", "object_id_or_value": "U.S. approval for controlled tool exports", "predicate": "depends_on", "process_id": "proc-logic-foundry", "product_id": null, "publication_date": "2025-12-31", "publication_date_unknown_reason": null, "readiness_state": "volume_production", "record_type": "claim", "scope": "secondary report on annual approval", "source_ids": [ "src-reuters-tsmc-tool-license-2025" ], "subject_id": "ent-tsmc-nanjing" }, { "claim_id": "clm-tsmc-mainland-fabs", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [ "con-foreign-mainland-vs-domestic-ownership" ], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-tsmc-mainland-fabs", "last_checked": "2026-07-29", "missing_proof": [ "current installed/qualified/utilized/actual output", "customers", "supplier BOM" ], "next_validation_event": "Facility-level capacity, utilization and equipment-supply disclosure.", "object_id_or_value": [ "Fab 10 Shanghai", "Fab 16 Nanjing" ], "predicate": "operates", "process_id": "proc-logic-foundry", "product_id": null, "publication_date": "2026-04-17", "publication_date_unknown_reason": null, "readiness_state": "volume_production", "record_type": "claim", "scope": "2025 annual report fab network", "source_ids": [ "src-tsmc-annual-2025" ], "subject_id": "ent-tsmc" }, { "claim_id": "clm-umc-xiamen-volume-and-design-capacity", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [ "con-designed-vs-installed-capacity", "con-foreign-mainland-vs-domestic-ownership" ], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-united-semi-xiamen", "id": "clm-umc-xiamen-volume-and-design-capacity", "last_checked": "2026-07-29", "missing_proof": [ "current installed/qualified/utilized/actual output", "yield", "customers", "supplier BOM" ], "next_validation_event": "Current annual-report facility capacity and utilization table.", "object_id_or_value": { "designed_capacity_when_fully_equipped": 50000, "process": "28 nm", "unit": "300mm wafers/month", "volume_since": 2016 }, "predicate": "reports", "process_id": "proc-logic-foundry", "product_id": null, "publication_date": null, "publication_date_unknown_reason": "No single publication date can be inherited from the linked source set.", "readiness_state": "volume_production", "record_type": "claim", "scope": "official fab information", "source_ids": [ "src-umc-fab-information" ], "subject_id": "fac-united-semi-xiamen" }, { "claim_id": "clm-uprecision-2023-small-batch-ceiling", "completion_state": "source_backed", "confidence": "high_for_filing_cutoff", "contradiction_ids": [ "con-uprecision-marketing-vs-filing-ceiling" ], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-uprecision-2023-small-batch-ceiling", "last_checked": "2026-07-29", "missing_proof": [ "customer", "model", "scanner integration", "fab", "acceptance", "volume" ], "next_validation_event": "Dated customer acceptance and recurring-production receipt for an exact subsystem.", "object_id_or_value": "small-batch production capability without industrialization at 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"object_id_or_value": "anonymous Company K", "predicate": "reports_customer_acceptance", "process_id": "proc-component-stages-encoders-bearings", "product_id": null, "publication_date": "2026-06-30", "publication_date_unknown_reason": null, "readiness_state": "customer_validated", "record_type": "claim", "scope": "nanometre motion/control product and technical-service scope", "source_ids": [ "src-uprecision-prospectus-2026" ], "subject_id": "ent-uprecision" }, { "claim_id": "clm-uprecision-motion-bonding-products", "completion_state": "source_backed", "confidence": "high_for_development_scope", "contradiction_ids": [], "event_date": null, "event_date_unknown_reason": "The linked evidence does not identify one exact event date.", "evidence_state": "CONFIRMED_PRIMARY", "facility_id": null, "id": "clm-uprecision-motion-bonding-products", "last_checked": "2026-07-29", "missing_proof": [ "exact model", "scanner or bonder integration", "customer/facility", "delivery", "acceptance", 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"volume use" ], "next_validation_event": "Later customer-origin acceptance or asset record for the exact stage and scanner.", "object_id_or_value": "ent-smee", "predicate": "shipped_to", "process_id": "proc-lithography-immersion-arf", "product_id": null, "publication_date": "2023-12-29", "publication_date_unknown_reason": null, "readiness_state": "shipped", "record_type": "claim", "scope": "one lithography dual-wafer stage shipped April 2020 and not accepted at filing cutoff", "source_ids": [ "src-uprecision-round2-2023" ], "subject_id": "comp-uprecision-dual-stage" }, { "claim_ceiling": "Award only.", "claim_id": "clm-util-001", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [ "con-util-001" ], "event_date": "2024-02-05", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-util-cxmt-phase2", "id": "clm-util-001", "last_checked": "2026-07-29", "missing_proof": [ "signed formal contract", "installation", "site acceptance" ], "next_validation_event": "Formal contract disclosure or owner-side tender/contract record", "object_id_or_value": "svc-util-cxmt-cleanroom", "predicate": "received_award_for", "process_id": "proc-cleanroom-epc", "product_id": "svc-util-cxmt-cleanroom", "publication_date": "2024-02-06", "publication_date_unknown_reason": null, "readiness_state": "unknown", "record_type": "claim", "scope": "project GN2023-06-8412", "source_ids": [ "src-util-001" ], "source_locator": "lines 251-268", "subject_id": "ent-util-lk-suzhou" }, { "claim_ceiling": "Construction entity, not real-property title.", "claim_id": "clm-util-002", "completion_state": "source_backed", "confidence": "high", "contradiction_ids": [], "event_date": "2024-02-05", "event_date_unknown_reason": null, "evidence_state": "CONFIRMED_PRIMARY", "facility_id": "fac-util-cxmt-phase2", "id": "clm-util-002", "last_checked": "2026-07-29", "missing_proof": [ "land-title ownership", "operating-state receipt" ], 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null, "date_checked": "2026-07-29", "excerpt_original": "g8y, c8y and r8y instances use Alibaba Cloud's in-house 2.75 GHz Yitian 710. 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the English name remains source-normalized." ], "locally_archived_path": null, "locator": "Company introduction and site legal footer", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "珠海全志科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-allwinner-profile", "source_type": "official_company_page", "title": "关于全志", "translation_en": "Allwinner Technology; stock code 300458.", "url": "https://www.allwinnertech.com/index.php?a=index&c=about&id=21", "label": "关于全志" }, { "access_state": "open", "claim_ids": [ "clm-amec-equipment-portfolio" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司产品包括刻蚀、薄膜沉积等半导体设备。", "id": "src-amec-halfyear-2025", "limitations": [ "Issuer portfolio and revenue recognition do not name the facility, qualified layer, throughput, uptime, or yield." ], "locally_archived_path": null, "locator": "释义；主营业务与产品", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-08-29", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-amec-halfyear-2025", "source_type": "exchange_filing", "title": "中微半导体设备（上海）股份有限公司2025年半年度报告", "translation_en": "The company's product portfolio includes semiconductor etch and thin-film deposition equipment.", "url": "https://star.sse.com.cn/disclosure/listedinfo/announcement/c/new/2025-08-29/688012_20250829_BW75.pdf", "label": "中微半导体设备（上海）股份有限公司2025年半年度报告" }, { "access_state": "open", "claim_ids": [ "clm-amkor-shanghai-current-factory-2026", "clm-relationship-amkor-operates-shanghai-current" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Amkor Assembly and Test (Shanghai) Co, Ltd. — C3.", "id": "src-amkor-current-factory-2026", "limitations": [ "The current factory list proves legal name, factory identifier and address, not package-specific qualification, customers, capacity, utilization, yield or immediate ownership chain." ], "locally_archived_path": null, "locator": "Factories | Greater China; Shanghai C3 entry", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Amkor Technology, Inc.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-amkor-current-factory-2026", "source_type": "company_facility_page", "title": "Contact Us — Factories", "translation_en": "Same as original.", "url": "https://amkor.com/contact-us/", "label": "Contact Us — Factories" }, { "access_state": "open", "claim_ids": [ "clm-amkor-shanghai-packaging-2015" ], "claimed_event_date": "2015-07-21", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Shanghai offered wafer-level, die-stacking and package-stacking technologies.", "id": "src-amkor-shanghai-expansion-2015", "limitations": [ "Historical portfolio description is not package-specific customer qualification, capacity, utilization, yield or current production proof." ], "locally_archived_path": null, "locator": "facility-description paragraphs", "original_language": "en", "primary_status": "primary", "publication_date": "2015-07-21", "publication_date_unknown_reason": null, "publisher": "Amkor Technology, Inc.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-amkor-shanghai-expansion-2015", "source_type": "company_facility_announcement", "title": "Amkor Technology Announces Expansion of China Operations", "translation_en": "Same as original.", "url": "https://ir.amkor.com/news-releases/news-release-details/amkor-technology-announces-expansion-china-operations", "label": "Amkor Technology Announces Expansion of China Operations" }, { "access_state": "open", "claim_ids": [ "clm-amkor-shanghai-qualification-2001" ], "claimed_event_date": "2001-06-11", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The Waigaoqiao packaging and test factory was ready to begin customer qualification.", "id": "src-amkor-shanghai-qualification-2001", "limitations": [ "Readiness for qualification is not qualification, production or current operating-state proof." ], "locally_archived_path": null, "locator": "opening paragraph", "original_language": "en", "primary_status": "primary", "publication_date": "2001-06-11", "publication_date_unknown_reason": null, "publisher": "Amkor Technology, Inc.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-amkor-shanghai-qualification-2001", "source_type": "company_facility_announcement", "title": "Amkor’s China Factory Ready for Customer Qualification", "translation_en": "Same as original.", "url": "https://ir.amkor.com/news-releases/news-release-details/amkors-china-factory-ready-customer-qualification", "label": "Amkor’s China Factory Ready for Customer Qualification" }, { "access_state": "open", "claim_ids": [ "clm-amkor-smic-service-award-2012", "clm-relationship-amkor-services-smic-historical" ], "claimed_event_date": "2012-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "SMIC awarded Amkor its 2012 Excellent Service Provider Award for a second consecutive year.", "id": "src-amkor-smic-award-2013", "limitations": [ "Supplier-origin award statement does not identify the exact SMIC legal affiliate, facility, package, chip, quantity, price, qualification or current status." ], "locally_archived_path": null, "locator": "opening and award-description paragraphs", "original_language": "en", "primary_status": "primary", "publication_date": "2013-06-24", "publication_date_unknown_reason": null, "publisher": "Amkor Technology, Inc.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-amkor-smic-award-2013", "source_type": "company_customer_announcement", "title": "Amkor Technology Receives Excellent Service Provider Award from SMIC", "translation_en": "Same as original.", "url": "https://ir.amkor.com/news-releases/news-release-details/amkor-technology-receives-excellent-service-provider-award-0", "label": "Amkor Technology Receives Excellent Service Provider Award from SMIC" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-amlogic-shanghai" ], "claimed_event_date": "2019-08-08", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "晶晨半导体（上海）股份有限公司；证券代码为688099", "id": "src-amlogic-sse-listing", "limitations": [], "locally_archived_path": null, "locator": "Notice body", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2019-08-07", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-amlogic-sse-listing", "source_type": "exchange_notice", "title": "关于晶晨半导体（上海）股份有限公司人民币普通股股票科创板上市交易的公告", "translation_en": "Amlogic (Shanghai) Co., Ltd.; security code 688099.", "url": "https://www.sse.com.cn/disclosure/announcement/listing/ipo/c/c_20190807_75889932.shtml", "label": "关于晶晨半导体（上海）股份有限公司人民币普通股股票科创板上市交易的公告" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-amlogic-shanghai" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Full name | Amlogic（Shanghai）Co., Ltd. | Code | 688099", "id": "src-amlogic-sse-snapshot", "limitations": [ "Amlogic is also used globally as a brand and should not be treated as a separate legal parent without proof." ], "locally_archived_path": null, "locator": "Company Overview table", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-amlogic-sse-snapshot", "source_type": "exchange_record", "title": "688099 Company Overview", "translation_en": "Same as original.", "url": "https://star.sse.com.cn/star/en/marketdata/snapshot/c/5546285.shtml", "label": "688099 Company Overview" }, { "access_state": "open", "claim_ids": [ "clm-anji-material-portfolio" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司产品包括化学机械抛光液和功能性湿电子化学品。", "id": "src-anji-annual-2024", "limitations": [ "Public disclosure does not expose full formulation, precursor origin, lot purity, named qualified layer, or fab-specific utilization." ], "locally_archived_path": null, "locator": "第三节，主营业务与产品", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-04-16", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-anji-annual-2024", "source_type": "exchange_filing", "title": "安集微电子科技（上海）股份有限公司2024年年度报告", "translation_en": "The company's products include CMP slurries and functional wet electronic chemicals.", "url": "https://star.sse.com.cn/disclosure/listedinfo/announcement/c/new/2025-04-16/688019_20250416_8014.pdf", "label": "安集微电子科技（上海）股份有限公司2024年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-anji-2025-filing-capability-matrix", "clm-anji-imported-raw-material-exposure", "clm-anji-plating-state-separation" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "铜及铜阻挡层、钨、氧化铈、金属栅等多类抛光液实现验证、量产或放量；TSV电镀液仍处开发和客户验证；公司同时提示进口原材料及美元结算风险。", "id": "src-anji-annual-2025", "limitations": [ "Customers, facilities and product models are anonymized.", "No formulation, grade, numerical yield delta, shipment quantity or exact imported-input BOM is disclosed.", "Generic TSV/hybrid-bonding materials capability does not establish HBM qualification." ], "locally_archived_path": null, "locator": "PDF pp. 29–30 and 32–34 (capability/R&D); p. 36 (imported raw-material and USD-settlement risk)", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-16", "publication_date_unknown_reason": null, "publisher": "安集微电子科技（上海）股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-anji-annual-2025", "source_type": "exchange_filing", "title": "安集微电子科技（上海）股份有限公司2025年年度报告", "translation_en": "The filing separates validation, volume production and ramp states across copper/barrier, tungsten, ceria and metal-gate slurries; TSV plating remains in development/customer validation and imported-raw-material exposure remains.", "url": "https://static.cninfo.com.cn/finalpage/2026-04-16/1225108553.PDF", "label": "安集微电子科技（上海）股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-anji-process-family-readiness" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司称氧化铈抛光液形成多个产品家族，钨抛光液有15种以上配方并服务20多家客户。", "id": "src-anji-launch-2026", "limitations": [ "Customers are anonymous; family and formulation counts do not disclose exact SKU, composition, grade, facility, layer or yield." ], "locally_archived_path": null, "locator": "氧化铈抛光液和钨抛光液章节", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-03-27", "publication_date_unknown_reason": null, "publisher": "安集微电子科技（上海）股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-anji-launch-2026", "source_type": "company_product_announcement", "title": "『创领』安集科技新品发布会，聚“芯”SEMICON CHINA 2026", "translation_en": "The company reports multiple ceria-slurry families and more than 15 tungsten-slurry formulations serving over 20 customers.", "url": "https://www.anjimicro.com/qiyexinwen/124.html", "label": "『创领』安集科技新品发布会，聚“芯”SEMICON CHINA 2026" }, { "access_state": "open", "claim_ids": [ "clm-anji-process-family-readiness" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "页面按铜、钨、介电材料、氧化铈、衬底及新工艺抛光液，以及清洗、剥离和电镀产品列示量产或验证状态。", "id": "src-anji-solutions-2026", "limitations": [ "Family/process-level vendor statements; no exact SKU, formulation, grade, named customer/fab, lot volume, defectivity or yield." ], "locally_archived_path": null, "locator": "化学机械抛光液、功能性湿电子化学品及电镀液章节", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "安集微电子科技（上海）股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-anji-solutions-2026", "source_type": "company_product_and_process_page", "title": "解决方案", "translation_en": "The page separates copper, tungsten, dielectric, ceria, substrate and new-process slurries plus cleaning, stripping and plating products by reported volume or validation state.", "url": "https://www.anjimicro.com/jiejuefangan.html", "label": "解决方案" }, { "access_state": "open", "claim_ids": [ "clm-ase-wuxi-assembly-test" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "ASE Wuxi — Assembly, Test.", "id": "src-ase-wuxi-facility", "limitations": [ "The page does not identify the exact Chinese legal operator, package platforms, customers, capacity, qualification, utilization or ownership chain." ], "locally_archived_path": null, "locator": "manufacturing facilities list, Wuxi entry", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Advanced Semiconductor Engineering, Inc.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-ase-wuxi-facility", "source_type": "company_facility_page", "title": "Global Manufacturing", "translation_en": "Same as original.", "url": "https://ase.aseglobal.com/about-ase/manufacturing-facilities/", "label": "Global Manufacturing" }, { "access_state": "open", "claim_ids": [ "clm-ase-wuxi-current-legal-operator", "clm-relationship-ase-operates-wuxi-current" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "作为日月光集团旗下核心封测企业，无锡通芝微电子有限公司植根中国半导体产业近三十年。", "id": "src-ase-wuxi-operator-2025", "limitations": [ "The page proves the operating legal name, address and generic assembly/test scope, not the immediate ownership chain, package platforms, named customers, capacity, utilization or yield." ], "locally_archived_path": null, "locator": "首页，关于我们；核心业务；地址", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "无锡通芝微电子有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-ase-wuxi-operator-2025", "source_type": "company_facility_page", "title": "ASE WuXi — 关于我们", "translation_en": "Wuxi Tongzhi Microelectronics Co., Ltd. is a core packaging-and-test enterprise under ASE Group.", "url": "https://www.asewx.com/", "label": "ASE WuXi — 关于我们" }, { "access_state": "open", "claim_ids": [ "clm-relationship-baidu-baige-appliance-integrates-p800" ], "claimed_event_date": "2025-02-17", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "百度百舸DeepSeek一体机支持昆仑芯P800单机8卡部署；公司同时称P800万卡集群成功点亮。", "id": "src-baidu-baige-deepseek-p800-20250217", "limitations": [ "Launch/apply-for-trial and vendor deployment statements; no order, shipment, customer acceptance or independent workload receipt.", "Server OEM, CPU/memory/network BOM, cluster facility, exact card count, uptime and utilization are undisclosed." ], "locally_archived_path": null, "locator": "body lines 15–33", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-02-17", "publication_date_unknown_reason": null, "publisher": "百度智能云", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-baidu-baige-deepseek-p800-20250217", "source_type": "official_operator_product_release", "title": "百度百舸 DeepSeek 一体机发布，支持昆仑芯 P800 单机 8 卡满血版开箱即用", "translation_en": "The Baige DeepSeek appliance supports eight P800 cards per server; the operator also says a P800 10,000-card-class cluster was powered on.", "url": "https://cloud.baidu.com/news/news_e0a478ab-bfa4-425c-b9b5-a6d296f6c698", "label": "百度百舸 DeepSeek 一体机发布，支持昆仑芯 P800 单机 8 卡满血版开箱即用" }, { "access_state": "open", "claim_ids": [ "clm-baidu-p800-cluster-caict-five-star-vendor-report", "clm-baidu-p800-effective-training-time-995" ], "claimed_event_date": "2025-07-23", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司称百度百舸GPU云平台加昆仑芯P800万卡集群通过信通院稳定运行能力五星测评，万卡任务有效训练时长占比99.5%，并称4月点亮3万卡集群。", "id": "src-baidu-p800-large-cluster-caict-claim-20250723", "limitations": [ "CAICT report/certificate, test version, duration, sample, pass criteria and raw results were not retrieved.", "10,000- and 30,000-card terms are rounded vendor classes, not exact installed/qualified/utilized counts." ], "locally_archived_path": null, "locator": "body lines 15–34", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-07-23", "publication_date_unknown_reason": null, "publisher": "百度智能云", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-baidu-p800-large-cluster-caict-claim-20250723", "source_type": "official_operator_news", "title": "首家！AI算力最高评级！", "translation_en": "The operator reports a CAICT five-star stability assessment, 99.5% effective training-time share for a 10,000-card-class task, and an April power-on of a 30,000-card-class cluster.", "url": "https://cloud.baidu.com/news/news_377f7acf-07e4-4787-a0f5-d70671dd6f34", "label": "首家！AI算力最高评级！" }, { "access_state": "open", "claim_ids": [ "clm-biren-br106-br166-production-ceiling" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "BR106 and BR166 form factors completed volume production and commercialization; the company does not directly manufacture products.", "id": "src-biren-annual-2025", "limitations": [ "Customers, project sites, foundry, OSAT, memory suppliers and variant-specific unit counts are withheld." ], "locally_archived_path": null, "locator": "PDF pp. 2–9, 66 and 136–138", "original_language": "en", "primary_status": "primary", "publication_date": "2026-04-22", "publication_date_unknown_reason": null, "publisher": "香港交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-biren-annual-2025", "source_type": "exchange_filing", "title": "Shanghai Biren Technology Co., Ltd. 2025 Annual Report", "translation_en": "Same as original.", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0422/2026042200045.pdf", "label": "Shanghai Biren Technology Co., Ltd. 2025 Annual Report" }, { "access_state": "open", "claim_ids": [ "clm-biren-lightsphere-x-commercial-and-deployment", "clm-relationship-biren-integrates-lightsphere-x-with-inesa", "clm-relationship-biren-integrates-lightsphere-x-with-lightelligence", "clm-relationship-biren-integrates-lightsphere-x-with-zte" ], "claimed_event_date": "2026-03-16", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "光跃超节点已实现数千卡的部署。", "id": "src-biren-lightspherex-commercial", "limitations": [ "Vendor-reported aggregate; no site, customer, exact card SKU, acceptance, uptime or utilization." ], "locally_archived_path": null, "locator": "article body; commercial-version joint release and aggregate several-thousand-card deployment statement", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-03-16", "publication_date_unknown_reason": null, "publisher": "上海壁仞科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-biren-lightspherex-commercial", "source_type": "company_product_announcement", "title": "光跃超节点商业版联合发布", "translation_en": "LightSphere supernodes have achieved deployments totaling several thousand cards.", "url": "https://sgc-prod.birentech.com/news/h5vjj6lsw4n5za2yw6ayyv1e/", "label": "光跃超节点商业版联合发布" }, { "access_state": "open", "claim_ids": [ "clm-biren-lightsphere-x-commercial-and-deployment", "clm-relationship-biren-integrates-lightsphere-x-with-inesa", "clm-relationship-biren-integrates-lightsphere-x-with-lightelligence", "clm-relationship-biren-integrates-lightsphere-x-with-zte" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "壁仞科技、上海仪电、曦智科技、中兴通讯共同打造光跃LightSphere X。", "id": "src-biren-lightspherex-initial", "limitations": [ "Planned deployment at source date; no purchase, named customer, facility acceptance or installed-card count." ], "locally_archived_path": null, "locator": "article body; partner roles and then-planned deployment at the INESA computing center", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "上海壁仞科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-biren-lightspherex-initial", "source_type": "company_product_announcement", "title": "光跃LightSphere X超节点", "translation_en": "Biren, INESA, Lightelligence and ZTE jointly created LightSphere X.", "url": "https://www.birentech.com/news/uk3x1bhhagcrtf5bqkurbnsa/", "label": "光跃LightSphere X超节点" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-biwin-storage" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "深圳佰维存储科技股份有限公司（科创板股票代码：688525）", "id": "src-biwin-company", "limitations": [], "locally_archived_path": null, "locator": "Opening paragraph", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "深圳佰维存储科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-biwin-company", "source_type": "official_company_page", "title": "公司简介", "translation_en": "BIWIN Storage Technology Co., Ltd. (STAR Market code 688525).", "url": "https://www.biwin.com.cn/about/company", "label": "公司简介" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-biwin-storage" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司全称(中/英) ... BIWIN STORAGE TECHNOLOGY CO., LTD.", "id": "src-biwin-stock", "limitations": [ "The official English legal name omits Shenzhen." ], "locally_archived_path": null, "locator": "Company information table", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "深圳佰维存储科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-biwin-stock", "source_type": "official_company_page", "title": "Investor relations company information", "translation_en": "Full company name in English: BIWIN STORAGE TECHNOLOGY CO., LTD.", "url": "https://www.biwin.com.cn/gushi.html", "label": "Investor relations company information" }, { "access_state": "open", "claim_ids": [ "clm-byd-horizon-journey5-designwin-20220421" ], "claimed_event_date": "2022-04-21", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "比亚迪与地平线正式宣布达成定点合作，计划最早于2023年中在部分车型搭载征程5。", "id": "src-byd-horizon-journey5-designwin-20220421", "limitations": [ "Exact contracting legal endpoints, vehicle models, SOP, delivery, installed units and volume are undisclosed.", "Rhetorical mass-production wording is not a model-specific shipment or production receipt." ], "locally_archived_path": null, "locator": "body lines 24–42; site-owner footer lines 74–88", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2022-04-21", "publication_date_unknown_reason": null, "publisher": "比亚迪汽车工业有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-byd-horizon-journey5-designwin-20220421", "source_type": "customer_site_industry_news", "title": "比亚迪与地平线官宣合作 2023年部分上市车型将搭载征程5", "translation_en": "BYD and Horizon announced a design-win cooperation, with Journey 5 planned for some models as early as mid-2023.", "url": "https://oip.byd.com/addons/cms/news/detail?category=1&news_id=72", "label": "比亚迪与地平线官宣合作 2023年部分上市车型将搭载征程5" }, { "access_state": "open", "claim_ids": [ "clm-cambricon-identity-fabless-and-siyuan220-volume" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司采用Fabless模式，晶圆制造、封装测试委托未具名供应商；思元220系列累计销量超过100万颗。", "id": "src-cambricon-annual-2025", "limitations": [ "Foundry, wafer facility, OSAT, package flow, memory supplier and named customers are undisclosed.", "The one-million figure is family cumulative volume, not a model/facility split." ], "locally_archived_path": null, "locator": "PDF pp. 13–14", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-03-13", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-cambricon-annual-2025", "source_type": "exchange_filing", "title": "中科寒武纪科技股份有限公司2025年年度报告", "translation_en": "Cambricon reports a fabless model with unnamed wafer and packaging/test contractors; cumulative Siyuan 220-series sales exceeded one million chips.", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-13/688256_20260313_GWH3.pdf", "label": "中科寒武纪科技股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-cambricon-mlu370x8-specification" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "MLU370-X8采用7nm工艺，配置48GB LPDDR5、614.4GB/s带宽，板卡功耗250W。", "id": "src-cambricon-mlu370x8-product", "limitations": [ "Foundry, LPDDR5 supplier, OSAT, package, units, named customer and independent workload receipt are undisclosed." ], "locally_archived_path": null, "locator": "product specification block, page lines 92–116", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "中科寒武纪科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-cambricon-mlu370x8-product", "source_type": "company_product_page", "title": "MLU370-X8 智能加速卡", "translation_en": "MLU370-X8 lists 7 nm, 48 GB LPDDR5, 614.4 GB/s bandwidth and 250 W board power.", "url": "https://www.cambricon.com/index.php?a=lists&c=index&catid=406&m=content", "label": "MLU370-X8 智能加速卡" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-cansemitech" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "CanSemi, WE CAN.", "id": "src-cansemitech-about", "limitations": [ "The page does not close the current controller." ], "locally_archived_path": null, "locator": "About page and site legal footer", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "CanSemi", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-cansemitech-about", "source_type": "official_company_page", "title": "About Us", "translation_en": "Same as original.", "url": "https://www.cansemitech.com/?lang=en&page_id=394", "label": "About Us" }, { "access_state": "open", "attachment_url": "https://download.ccgp.gov.cn/oss/download?uuid=29ED2DAF253269EC63A6675AED0E4F", "claim_ids": [ "clm-relationship-smee-zycgr22011903-ssc800-award-2025", "clm-smee-ssc800-award-2025", "clm-smee-ssc800-buyer-identity-correlation-2026" ], "claimed_event_date": "2025-12-24", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "采购人zycgr22011903确定上海微电子装备（集团）股份有限公司为一台SSC800/10步进扫描式光刻机成交供应商，总价109999850元。", "id": "src-ccgp-smee-ssc800-award-2025", "limitations": [ "Buyer legal identity remains unresolved; official address/contact correlation to 临港实验室 is strong but not a same-document legal-identity receipt.", "Award/vendor selection is not a signed contract, manufacturing completion, shipment, delivery, move-in, installation, site acceptance, asset registration or process qualification.", "Wavelength, NA, resolution, overlay, throughput, facility, layer, yield and production use are undisclosed." ], "locally_archived_path": null, "locator": "main award table; project MB20016721763953804060; contact block; attachment link", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-12-25", "publication_date_unknown_reason": null, "publisher": "中国政府采购网 / 财政部", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-ccgp-smee-ssc800-award-2025", "source_type": "government_procurement_award", "title": "zycgr22011903单一来源采购步进扫描式光刻机成交公告", "translation_en": "Buyer alias zycgr22011903 selected SMEE for one SSC800/10 step-and-scan lithography machine at CNY 109,999,850.", "url": "https://www.ccgp.gov.cn/cggg/zygg/cjgg/202512/t20251225_25989183.htm", "label": "zycgr22011903单一来源采购步进扫描式光刻机成交公告" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-changchuan" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Hangzhou Changchuan Technology Co., Ltd. ... stock code: 300604", "id": "src-cctech-profile", "limitations": [], "locally_archived_path": null, "locator": "Opening paragraph", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Hangzhou Changchuan Technology Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-cctech-profile", "source_type": "official_company_page", "title": "Company Profile", "translation_en": "Same as original.", "url": "https://www.hzcctech.com/eng/companyprofile/index.aspx", "label": "Company Profile" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-crmicro" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "China Resources Microelectronics Limited, a high-tech enterprise under China Resources Group", "id": "src-crmicro-profile", "limitations": [ "The profile names the group, not the exact current immediate legal shareholder." ], "locally_archived_path": null, "locator": "Company Profile, first paragraph and listing paragraph", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "China Resources Microelectronics Limited", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-crmicro-profile", "source_type": "official_company_page", "title": "Company Profile", "translation_en": "Same as original.", "url": "https://www.crmicro.com/Home/companyProfile/index.html", "label": "Company Profile" }, { "access_state": "open", "claim_ids": [ "clm-zhuzhou-crrc-times-semiconductor-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company describes a power-semiconductor IDM spanning device design, manufacturing and assembly.", "id": "src-crrc-times-semiconductor-profile-20260801", "limitations": [ "The holding-company relationship is described without an ownership percentage; no accelerator-product supplier edge is established." ], "locally_archived_path": null, "locator": "company profile; business scope", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Zhuzhou CRRC Times Semiconductor Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-crrc-times-semiconductor-profile-20260801", "source_type": "company_profile", "title": "Company Profile", "translation_en": "The company describes a power-semiconductor IDM spanning device design, manufacturing and assembly.", "url": "https://ctsc.csrzic.com/protalen/gywm/gsjj/gsjj_1.htm", "label": "Company Profile" }, { "access_state": "open", "claim_ids": [ "clm-ctyun-pak1-multicard-llm-not-supported", "clm-ctyun-pak3-online-config", "clm-relationship-ctyun-integrates-ascend910b2-pak3-huabei2", "clm-relationship-ctyun-integrates-ascend910b2-pak3-shanghai36", "clm-relationship-ctyun-integrates-atlas300iduo-pak2", "clm-relationship-ctyun-integrates-atlas300ipro-pak1" ], "claimed_event_date": "2026-05-08", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "目前在华北2、上海36资源池上线。PAK3型采用Kunpeng 920 5250与Huawei昇腾910B2 NPU；PAK2型采用Kunpeng 920 7260与Atlas 300I Duo；PAK1型采用Atlas 300I Pro。", "id": "src-ctyun-ascend-cloud-20260508", "limitations": [ "Proves named configurations and online cloud-service availability, not a direct Huawei purchase/supply contract.", "Hardware count, delivery and acceptance date, utilization, tenant, exact building and semiconductor BOM are undisclosed.", "The page says multi-card PAK1 is not supported for large-model inference and will error." ], "locally_archived_path": null, "locator": "PAK3 lines 281–320; PAK2 lines 321–356; PAK1 lines 358–392; legal footer lines 415–425", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-05-08", "publication_date_unknown_reason": null, "publisher": "天翼云科技有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-ctyun-ascend-cloud-20260508", "source_type": "official_product_documentation", "title": "昇腾计算加速型云主机", "translation_en": "The Ascend cloud-host family is online in the North China 2 and Shanghai 36 resource pools. PAK3 uses Kunpeng 920 5250 and Ascend 910B2; PAK2 uses Kunpeng 920 7260 and Atlas 300I Duo; PAK1 uses Atlas 300I Pro.", "url": "https://www.ctyun.cn/document/10029787/10349596", "label": "昇腾计算加速型云主机" }, { "access_state": "open", "claim_ids": [ "clm-ctyun-pch1-online-config", "clm-relationship-ctyun-integrates-hygon7285-pch1", "clm-relationship-ctyun-integrates-mlu370s4-pch1" ], "claimed_event_date": "2026-07-03", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "目前在广州6资源池上线。PCH1型采用海光7285与寒武纪MLU370-S4加速卡，支持1、2、3、4卡直通，公共镜像预装cnmon驱动及cntoolkit。", "id": "src-ctyun-cambricon-cloud-20260703", "limitations": [ "Proves exact deployed cloud configuration, not a direct purchase or supplier contract.", "Card/CPU counts, asset acceptance, utilization, tenants, site address and field reliability are undisclosed." ], "locally_archived_path": null, "locator": "PCH1 lines 281–319; legal footer lines 343–352", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-07-03", "publication_date_unknown_reason": null, "publisher": "天翼云科技有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-ctyun-cambricon-cloud-20260703", "source_type": "official_product_documentation", "title": "寒武纪计算加速型云主机", "translation_en": "The PCH1 service is online in the Guangzhou 6 resource pool and uses a Hygon 7285 with one to four Cambricon MLU370-S4 cards in passthrough mode; public images preinstall cnmon and cntoolkit.", "url": "https://www.ctyun.cn/document/10029787/10349603", "label": "寒武纪计算加速型云主机" }, { "access_state": "open", "claim_ids": [ "clm-cxmt-lpddr5x-state" ], "claimed_event_date": "2025-05-01", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "8533Mbps、9600Mbps量产；10667Mbps送样。", "id": "src-cxmt-lpddr5x-2025", "limitations": [ "Vendor-reported state; no customer acceptance, shipment volume, yield or field reliability." ], "locally_archived_path": null, "locator": "announcement body, product-state paragraph", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-10-28", "publication_date_unknown_reason": null, "publisher": "长鑫科技集团股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-cxmt-lpddr5x-2025", "source_type": "company_press_release", "title": "长鑫存储LPDDR5X产品实现量产", "translation_en": "8,533 and 9,600 Mbps in volume production; 10,667 Mbps sampled.", "url": "https://www.cxmt.com/news/info_94.html", "label": "长鑫存储LPDDR5X产品实现量产" }, { "access_state": "open", "claim_ids": [ "clm-cxmt-dram-portfolio" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "CXMT specializes in design, manufacturing, sales and R&D of DRAM products ... DDR5, LPDDR5/5X, DDR4 and LPDDR4X.", "id": "src-cxmt-official-products-2026", "limitations": [ "Portfolio statement does not prove a particular customer, wafer capacity, yield, or shipment volume." ], "locally_archived_path": null, "locator": "About CXMT; Products", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "CXMT Corporation", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-cxmt-official-products-2026", "source_type": "company_product_page", "title": "CXMT - Products", "translation_en": "Same as original.", "url": "https://www.cxmt.com/en/", "label": "CXMT - Products" }, { "access_state": "open", "claim_ids": [ "clm-cxmt-product-range-gap-vs-hbm-peers", "clm-cxmt-public-corpus-no-hbm-product-receipt" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "对比表将发行人产品布局列为DDR、LPDDR等，而三星、SK海力士、美光列为DDR、LPDDR、GDDR、HBM等；公司承认产品种类和丰富度存在差距。", "id": "src-cxmt-sse-preview-q1-2025", "limitations": [ "The 29 HBM hits are peer/industry/diligence context, not a CXMT HBM product or readiness receipt." ], "locally_archived_path": null, "locator": "PDF pp. 43–47 (internal 8-1-1-42 to 46); p. 51", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-12-30", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "retrieved_content_sha256": "985bfb09dc6baf873b18d8fadbb2c854b922bf77342d35cffce4fa6639cd011e", "rights_boundary": "link_only", "source_id": "src-cxmt-sse-preview-q1-2025", "source_type": "exchange_filing", "title": "关于长鑫科技集团股份有限公司首次公开发行股票并在科创板上市预先审阅申请文件的问询函的回复", "translation_en": "The comparison table lists the issuer's portfolio as DDR/LPDDR, while Samsung, SK hynix and Micron include GDDR/HBM; the issuer acknowledges a product-range gap.", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202512/002170_20251230_XS2U.pdf", "label": "关于长鑫科技集团股份有限公司首次公开发行股票并在科创板上市预先审阅申请文件的问询函的回复" }, { "access_state": "open", "claim_ids": [ "clm-cxmt-public-corpus-no-hbm-product-receipt" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "文件唯一HBM命中为引用TrendForce的HBM3E与DDR5价格及利润比较。", "id": "src-cxmt-sse-preview-q2-2025", "limitations": [ "Market comparison only; not a CXMT product, development, customer or production statement." ], "locally_archived_path": null, "locator": "PDF p. 31", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-12-30", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "retrieved_content_sha256": "9f1cd4cc887e9c2de22a1201cecd75a3f0e253a9027ad8f381f64fb3a2495e76", "rights_boundary": "link_only", "source_id": "src-cxmt-sse-preview-q2-2025", "source_type": "exchange_filing", "title": "关于长鑫科技集团股份有限公司首次公开发行股票并在科创板上市预先审阅申请文件的第二轮问询函的回复", "translation_en": "The only HBM hit is a TrendForce-derived HBM3E-versus-DDR5 price/profit comparison.", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202512/002170_20251230_H2T8.pdf", "label": "关于长鑫科技集团股份有限公司首次公开发行股票并在科创板上市预先审阅申请文件的第二轮问询函的回复" }, { "access_state": "open", "claim_ids": [ "clm-cxmt-public-corpus-no-hbm-product-receipt" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "接口枚举长鑫科技科创板项目22个公开附件。", "id": "src-cxmt-sse-project-corpus-api", "limitations": [ "Corpus enumeration and deterministic term search do not prove absence of private or undisclosed activity." ], "locally_archived_path": null, "locator": "auditId=2170; 22 files enumerated and text-extracted on 2026-07-29", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-cxmt-sse-project-corpus-api", "source_type": "regulatory_file_index", "title": "CXMT SSE project-file corpus enumerator", "translation_en": "The endpoint enumerates all 22 public attachments in the CXMT STAR Market project corpus.", "url": "https://query.sse.com.cn/commonSoaQuery.do?sqlId=GP_COMMON_FILE_SEARCH&auditId=2170", "label": "CXMT SSE project-file corpus enumerator" }, { "access_state": "open", "claim_ids": [ "clm-cxmt-legal-identity", "clm-cxmt-packaging-outsourced-anonymous", "clm-cxmt-product-hefei-test-function", "clm-cxmt-public-corpus-no-hbm-product-receipt", "clm-relationship-cxmt-owns-product-hefei", "clm-relationship-cxmt-product-hefei-tests-cxmt-dram" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司芯片封装环节全部委托第三方封测厂商完成，测试以自主测试为主、委外测试为辅；部分测试由全资子公司长鑫存储产品（合肥）有限公司实施。", "id": "src-cxmt-sse-prospectus-2026", "limitations": [ "The issuer names no packaging OSAT legal entity.", "The filing has no HBM literal hit and no HBM product, stack, facility, customer, qualification, yield or shipment receipt.", "Absence in this filing is not proof that no private R&D exists." ], "locally_archived_path": null, "locator": "PDF pp. 11, 27, 70 and 125", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-05-27", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "retrieved_content_sha256": "411b07a14606246483291abe374f964b5983eea0af8b9159a2cf405b74fa4308", "rights_boundary": "link_only", "source_id": "src-cxmt-sse-prospectus-2026", "source_type": "exchange_filing", "title": "长鑫科技集团股份有限公司首次公开发行股票并在科创板上市招股说明书", "translation_en": "All chip packaging is outsourced to third-party OSATs; testing is mainly internal with some outsourced, and part is performed by wholly owned ChangXin Storage Products (Hefei) Co., Ltd.", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202605/002170_20260527_23QQ.pdf", "label": "长鑫科技集团股份有限公司首次公开发行股票并在科创板上市招股说明书" }, { "access_state": "open", "claim_ids": [ "clm-cxmt-lpddr5-brand-validation", "clm-relationship-transsion-brand-validates-cxmt-lpddr5", "clm-relationship-xiaomi-brand-validates-cxmt-lpddr5" ], "claimed_event_date": "2023-11-28", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "12GB LPDDR5产品已完成小米、传音等品牌手机产品验证。", "id": "src-cxmt-xiaomi-transsion-validation-2023", "limitations": [ "Names brands, not contracting legal entities; does not state sustained shipment volume." ], "locally_archived_path": null, "locator": "正文，产品验证段落", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2023-11-28", "publication_date_unknown_reason": null, "publisher": "CXMT", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-cxmt-xiaomi-transsion-validation-2023", "source_type": "company_press_release", "title": "长鑫存储LPDDR5产品正式发布", "translation_en": "The 12 GB LPDDR5 product completed validation in Xiaomi- and Transsion-brand phone products.", "url": "https://www.cxmt.com/news/info_90.html", "label": "长鑫存储LPDDR5产品正式发布" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-dapustor" ], "claimed_event_date": "2026-04-16", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司名称：深圳大普微电子股份有限公司；股票代码：301666.SZ", "id": "src-dapustor-investor", "limitations": [ "No official English legal name is printed." ], "locally_archived_path": null, "locator": "Basic information table", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-16", "publication_date_unknown_reason": null, "publisher": "深圳大普微电子股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dapustor-investor", "source_type": "official_company_page", "title": "基本信息", "translation_en": "Company: Shenzhen Dapu Microelectronics Co., Ltd.; stock code 301666.SZ.", "url": "https://www.dapustor.com/investor.html", "label": "基本信息" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-dapustor" ], "claimed_event_date": "2023-09-15", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "深圳大普微电子科技有限公司 ... 更名为深圳大普微电子股份有限公司", "id": "src-dapustor-rename", "limitations": [], "locally_archived_path": null, "locator": "Release body", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2023-09-15", "publication_date_unknown_reason": null, "publisher": "深圳大普微电子股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dapustor-rename", "source_type": "official_company_release", "title": "动态丨更名“深圳大普微电子股份有限公司”", "translation_en": "Shenzhen Dapu Microelectronics Technology Co., Ltd. was renamed Shenzhen Dapu Microelectronics Co., Ltd.", "url": "https://www.dapustor.com/news/96.html", "label": "动态丨更名“深圳大普微电子股份有限公司”" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-darbond" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Yantai Darbond Technology Co., Ltd ... Stock No.:688035", "id": "src-darbond-profile", "limitations": [], "locally_archived_path": null, "locator": "Company Profile opening", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Yantai Darbond Technology Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-darbond-profile", "source_type": "official_company_page", "title": "Company Profile", "translation_en": "Same as original.", "url": "https://www.darbond.com/en/index.php/List/index/cid/9.html", "label": "Company Profile" }, { "access_state": "open", "claim_ids": [ "clm-dd-antora-se1000-first-delivery-chain", "clm-relationship-dd-ecarx-antora-integrates-siengine-se1000", "clm-relationship-dd-lynk08-integrates-ecarx-antora" ], "claimed_event_date": "2023-03-30", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "首次搭载安托拉1000Pro计算平台，集成2颗7nm“龍鷹一号”芯片。", "id": "src-dd-auto-001", "limitations": [ "No vehicle shipment count, direct chip purchase, foundry, package, OSAT or yield." ], "locally_archived_path": null, "locator": "HTML lines 206–214, 232, 264 and 302", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2023-03-30", "publication_date_unknown_reason": null, "publisher": "领克汽车销售有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-auto-001", "source_type": "official_customer_product_announcement", "title": "领克携手魅族探索移动出行智能化，全方位共创「无界」超级生态", "translation_en": "The Lynk 08 first used Antora 1000 Pro with two 7 nm DragonHawk chips.", "url": "https://www.lynkco.com.cn/brand/news/newslist/2023/1117", "label": "领克携手魅族探索移动出行智能化，全方位共创「无界」超级生态" }, { "access_state": "open", "claim_ids": [ "clm-dd-antora-se1000-first-delivery-chain", "clm-relationship-dd-ecarx-antora-integrates-siengine-se1000", "clm-relationship-dd-lynk08-integrates-ecarx-antora" ], "claimed_event_date": "2023-09-26", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "successful first delivery of the ECARX Antora 1000 Pro", "id": "src-dd-auto-002", "limitations": [ "No unit count, acceptance certificate, line capacity, yield, uptime or sustained-volume period." ], "locally_archived_path": null, "locator": "HTML lines 25–35 and following product paragraph", "original_language": "en", "primary_status": "primary", "publication_date": "2023-09-28", "publication_date_unknown_reason": null, "publisher": "ECARX Holdings Inc.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-auto-002", "source_type": "official_supplier_ir_announcement", "title": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV", "translation_en": "Same as original.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-together-siengine-and-xingji-meizu-group-create", "label": "ECARX, together with SiEngine and XINGJI MEIZU Group, to create extraordinary cockpit experience in the new Lynk & Co SUV" }, { "access_state": "open", "claim_ids": [ "clm-dd-antora-se1000-first-delivery-chain", "clm-relationship-dd-ecarx-antora-integrates-siengine-se1000", "clm-relationship-dd-lynk08-integrates-ecarx-antora" ], "claimed_event_date": "2023-09-26", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "领克余姚工厂和亿咖通武汉东峻工厂。", "id": "src-dd-auto-003", "limitations": [ "Company-attributed government record, not an independent production audit." ], "locally_archived_path": null, "locator": "body paragraphs naming both sites, two chips and Lynk 08", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2023-09-27", "publication_date_unknown_reason": null, "publisher": "武汉经济技术开发区", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-auto-003", "source_type": "government_company_event_record", "title": "安托拉1000 Pro量产交付相关政务记录", "translation_en": "The event involved the Lynk Yuyao plant and ECARX Wuhan Dongjun plant.", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202309/t20230927_2272685.html", "label": "安托拉1000 Pro量产交付相关政务记录" }, { "access_state": "open", "claim_ids": [ "clm-dd-antora-se1000-first-delivery-chain", "clm-relationship-dd-ecarx-antora-integrates-siengine-se1000" ], "claimed_event_date": "2023", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "湖北芯擎科技有限公司；两颗“龍鷹一号”。", "id": "src-dd-auto-004", "limitations": [ "No foundry, package, OSAT, delivered-chip quantity or vehicle volume." ], "locally_archived_path": null, "locator": "body paragraphs naming the company and two-chip configuration", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2023-04-23", "publication_date_unknown_reason": null, "publisher": "武汉经济技术开发区", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-auto-004", "source_type": "government_company_identity_and_product_record", "title": "芯擎科技与龙鹰一号相关政务记录", "translation_en": "The record names Hubei SiEngine Technology and two DragonHawk chips.", "url": "https://www.whkfq.gov.cn/xwzx/yw/kfqyw/qnxw/202304/t20230423_2190472.html", "label": "芯擎科技与龙鹰一号相关政务记录" }, { "access_state": "open", "claim_ids": [ "clm-dd-lynk08-refresh-foreign-chip-bom" ], "claimed_event_date": "2025-09-24", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "采用高通骁龙8295芯片；搭载Thor芯片。", "id": "src-dd-auto-005", "limitations": [ "Near-150,000 family users span generations and cannot be assigned to the earlier SE1000 configuration." ], "locally_archived_path": null, "locator": "HTML lines 206–214, 233, 240 and 287", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-09-24", "publication_date_unknown_reason": null, "publisher": "领克汽车销售有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-auto-005", "source_type": "official_customer_product_announcement", "title": "全新有为 进阶无界，全新领克08 EM-P 15.98万元起正式上市", "translation_en": "The refreshed Lynk 08 uses Snapdragon 8295 and NVIDIA Thor.", "url": "https://www.lynkco.com.cn/brand/news/newslist/2025news/0924", "label": "全新有为 进阶无界，全新领克08 EM-P 15.98万元起正式上市" }, { "access_state": "open", "claim_ids": [ "clm-dd-tiangong05-antora-integration", "clm-relationship-dd-faw-tiangong05-integrates-ecarx-antora" ], "claimed_event_date": "2025", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "两颗自主设计的7nm车规级芯片。", "id": "src-dd-auto-006", "limitations": [ "The customer does not name the chip/platform vendor or delivery count." ], "locally_archived_path": null, "locator": "section 芯动未来 声形并驭", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-02-28", "publication_date_unknown_reason": null, "publisher": "中国一汽", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-auto-006", "source_type": "official_customer_product_announcement", "title": "红旗研发新视界：天工05", "translation_en": "The vehicle uses two independently designed 7 nm automotive-grade chips.", "url": "https://www.faw.com.cn/fawcn/5133331/5642305/5833080/index.html", "label": "红旗研发新视界：天工05" }, { "access_state": "open", "claim_ids": [ "clm-dd-tiangong05-antora-integration", "clm-relationship-dd-faw-tiangong05-integrates-ecarx-antora" ], "claimed_event_date": "2025-01", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Tiangong 05’s intelligent cockpit will be powered by ECARX’s Antora 1000 Pro.", "id": "src-dd-auto-007", "limitations": [ "Supplier-origin release; no vehicle deliveries, contract, chip shipment, foundry or OSAT." ], "locally_archived_path": null, "locator": "HTML lines 25–33", "original_language": "en", "primary_status": "primary", "publication_date": "2025-02-11", "publication_date_unknown_reason": null, "publisher": "ECARX Holdings Inc.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-auto-007", "source_type": "official_supplier_ir_announcement", "title": "ECARX to Power Launch of First Hongqi Model Under Strategic Partnership with FAW, Debuting AutoGPT with DeepSeek-R1 Integration", "translation_en": "Same as original.", "url": "https://ir.ecarxgroup.com/news-releases/news-release-details/ecarx-power-launch-first-hongqi-model-under-strategic", "label": "ECARX to Power Launch of First Hongqi Model Under Strategic Partnership with FAW, Debuting AutoGPT with DeepSeek-R1 Integration" }, { "access_state": "open", "claim_ids": [ "clm-dd-tiangong05-antora-integration", "clm-relationship-dd-ecarx-antora-integrates-siengine-se1000", "clm-relationship-dd-faw-tiangong05-integrates-ecarx-antora" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Two SE1000 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"比亚迪半导体；1500V大功率SiC芯片；设计、晶圆制造、模块封装及测试。", "id": "src-dd-byd-001", "limitations": [ "No fab, substrate/epitaxy supplier, equipment/material supplier, capacity, output, yield, vehicle count or independent reliability." ], "locally_archived_path": null, "locator": "HTML lines 142–186, 221 and 237", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-03-26", "publication_date_unknown_reason": null, "publisher": "比亚迪股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-byd-001", "source_type": "official_corporate_technical_announcement", "title": "全球首款批量装车1500V高耐压大功率SiC芯片 助力全球最强超级e平台", "translation_en": "BYD Semiconductor developed a 1500 V high-power SiC chip and reports design, wafer manufacturing, module packaging and test.", "url": "https://www.byd.com/cn/news/2025/detail569", "label": "全球首款批量装车1500V高耐压大功率SiC芯片 助力全球最强超级e平台" }, { "access_state": "open", "claim_ids": [ "clm-dd-byd-1500v-sic-chain", 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[ "clm-dd-cu-general-server-candidates-only" ], "claimed_event_date": "2025-09-26", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "现将该项目中标候选人予以公示。", "id": "src-dd-cu-001", "limitations": [ "Candidate notice only; no final award, framework, order, model, share, delivery, installation or acceptance." ], "locally_archived_path": null, "locator": "public page/API fields annoName, projectNo, bidNo, createDate and annoText", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-09-26", "publication_date_unknown_reason": null, "publisher": "中国联通采购与招标网", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-cu-001", "source_type": "official_customer_tender_candidate_notice", "title": "2025年中国联通通用服务器集中采购项目中标候选人公示", "translation_en": "The project award candidates are being published.", "url": "https://www.chinaunicombidding.cn/bidInformation/detail?id=1971600438168158208", "label": "2025年中国联通通用服务器集中采购项目中标候选人公示" }, { "access_state": "open", "claim_ids": [ "clm-dd-cu-guangdong-zte-candidate-only" ], "claimed_event_date": "2026-07-27", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "成交候选人：中兴通讯股份有限公司。", "id": "src-dd-cu-002", "limitations": [ "Candidate is not final award, contract, order, delivery, installation, acceptance or named-chip qualification." ], "locally_archived_path": null, "locator": "public page/API fields annoName, projectNo GD-Z-WZ-25-4116, bidNo HBTZ-GDLT-25116 and annoText", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-07-28", "publication_date_unknown_reason": null, "publisher": "中国联通采购与招标网", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-cu-002", "source_type": "official_customer_direct_procurement_candidate_notice", "title": "2025年中国联通广东智算中心资源池工程采购项目（二期）（人工智能服务器）直接采购评审结果公示", "translation_en": "The transaction candidate is ZTE Corporation.", "url": "https://www.chinaunicombidding.cn/bidInformation/detail?id=2082004955862970368", "label": "2025年中国联通广东智算中心资源池工程采购项目（二期）（人工智能服务器）直接采购评审结果公示" }, { "access_state": "open", "claim_ids": [ "clm-dd-cu-ai-pool-tender-scope-only" ], "claimed_event_date": "2026-07-24", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "人工智能服务器123台；配套RoCE交换机63台。", "id": "src-dd-cu-003", "limitations": [ "Tender only; no bidder, awardee, contract, model, exact facility, delivery, installation or acceptance." ], "locally_archived_path": null, "locator": "public page/API sections 1.1, 1.2, budget and 2.6–2.7", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-07-24", "publication_date_unknown_reason": null, "publisher": "中国联通采购与招标网", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-cu-003", "source_type": "official_customer_tender_notice", "title": "2026年中国联通云智业务智算资源池设备及集成安装服务招标公告", "translation_en": "The scope includes 123 AI servers and 63 RoCE switches.", "url": "https://www.chinaunicombidding.cn/bidInformation/detail?id=2080612123361193984", "label": "2026年中国联通云智业务智算资源池设备及集成安装服务招标公告" }, { "access_state": "open", "claim_ids": [ "clm-dd-poco-c71-unisoc-t7250-bom", "clm-relationship-dd-poco-c71-integrates-unisoc-t7250" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Powered by UNISOC T7250.", "id": "src-dd-mobile-001", "limitations": [ "No direct purchase path, SoC quantity, foundry, package or OSAT." ], "locally_archived_path": null, "locator": "HTML lines 37–50 and 54–65", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Xiaomi Global", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-mobile-001", "source_type": "official_customer_product_page", "title": "POCO C71", "translation_en": "Same as original.", "url": "https://www.mi.com/global/product/poco-c71/", "label": "POCO C71" }, { "access_state": "open", "claim_ids": [ "clm-dd-poco-c71-unisoc-t7250-bom", "clm-relationship-dd-poco-c71-integrates-unisoc-t7250" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "UNISOC T7250; 12nm; LPDDR4X + eMMC.", "id": "src-dd-mobile-002", "limitations": [ "Memory type is stated but memory and eMMC suppliers are not." ], "locally_archived_path": null, "locator": "HTML lines 8–13 and 51–57", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Xiaomi Global", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-mobile-002", "source_type": "official_customer_specification_page", "title": "POCO C71 Specs", "translation_en": "Same as original.", "url": "https://www.mi.com/global/product/poco-c71/specs/", "label": "POCO C71 Specs" }, { "access_state": "open", "claim_ids": [ "clm-dd-poco-c71-retail-and-software-dependencies", "clm-dd-poco-c71-unisoc-t7250-bom", "clm-relationship-dd-poco-c71-integrates-unisoc-t7250" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "processor manufacturer: UNISOC; cell supplier: NVT/SUNWODA/COSMX.", "id": "src-dd-mobile-003", "limitations": [ "Supplier strings are brands/abbreviations; legal entities, lot shares and direct purchasing are unresolved." ], "locally_archived_path": null, "locator": "HTML lines 48–58, 162–170, 270–310, 550–558, 652–654, 993–1007, 1328–1330, 1369–1371 and 1595–1599", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Xiaomi Global Support", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-mobile-003", "source_type": "official_customer_support_bom_page", "title": "POCO C71 FAQ", "translation_en": "Same as original.", "url": "https://www.mi.com/global/support/faq/details/KA-559836/", "label": "POCO C71 FAQ" }, { "access_state": "open", "claim_ids": [ "clm-dd-poco-c71-retail-and-software-dependencies" ], "claimed_event_date": "2025-12-09/2025-12-19", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "POCO C71 4GB+128GB; shipping and GST terms.", "id": "src-dd-mobile-004", "limitations": [ "Commercial offer and shipping availability do not prove completed sales or volume." ], "locally_archived_path": null, "locator": "HTML lines 47–61, 313–321 and 844–850", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Xiaomi Singapore", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-mobile-004", "source_type": "official_retail_terms", "title": "Xiaomi 12.12 Mega Sale 2025", "translation_en": "Same as original.", "url": "https://www.mi.com/sg/support/terms/xiaomi-12-12-mega-sale-2025/", "label": "Xiaomi 12.12 Mega Sale 2025" }, { "access_state": "open", "claim_ids": [ "clm-dd-poco-c71-unisoc-t7250-bom", "clm-relationship-dd-poco-c71-integrates-unisoc-t7250" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "T7250；12nm。", "id": "src-dd-mobile-005", "limitations": [ "No foundry, package, Xiaomi-specific certification or volume." ], "locally_archived_path": null, "locator": "process, CPU, GPU and operator-certification specification sections", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "紫光展锐", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-mobile-005", "source_type": "official_supplier_product_page", "title": "T7250", "translation_en": "T7250 is a 12 nm smartphone platform.", "url": "https://www.unisoc.com/cn/product/SmartPhone/T7250", "label": "T7250" }, { "access_state": "open", "claim_ids": [ "clm-dd-poco-c71-unisoc-t7250-bom", "clm-relationship-dd-poco-c71-integrates-unisoc-t7250" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "T7250; 12nm.", "id": "src-dd-mobile-006", "limitations": [ "No foundry, package, Xiaomi-specific certification or volume." ], "locally_archived_path": null, "locator": "process, CPU, GPU and operator-certification specification sections", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "UNISOC", "record_type": "source", 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"official_company_identity_page", "title": "联系我们", "translation_en": "UNISOC (Shanghai) Technology Co., Ltd.", "url": "https://www.unisoc.com/cn/about/contact-us", "label": "联系我们" }, { "access_state": "open", "claim_ids": [ "clm-dd-unisoc-shanghai-legal-identity" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "UNISOC (Shanghai) Technology Co., Ltd.", "id": "src-dd-mobile-008", "limitations": [ "Identity only; not a direct Xiaomi purchase receipt." ], "locally_archived_path": null, "locator": "contact-page company name and Shanghai headquarters", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "UNISOC", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-dd-mobile-008", "source_type": "official_company_identity_page", "title": "Contact Us", "translation_en": "Same 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"company_technology_page", "title": "3D Near-Memory Computing", "translation_en": "Same as original.", "url": "https://www.dfsx.com/technology/3d-near-memory-computing", "label": "3D Near-Memory Computing" }, { "access_state": "open", "claim_ids": [ "clm-df1000-architecture" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "DF1000 combines 3D DRAM near-memory computing and a software-defined architecture for training and inference.", "id": "src-dfsx-df1000-product-2026", "limitations": [ "Vendor page exposes no independent workload receipt, memory supplier, foundry, package yield, power, customer, or shipment volume." ], "locally_archived_path": null, "locator": "product overview", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "上海东方算芯科技有限公司", "record_type": "source", "rights_boundary": 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"https://english.sse.com.cn/news/newsrelease/voice/c/c_20250815_10788645.shtml", "label": "Xi'an ESWIN Material Technology listing review notice" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-fastprint" ], "claimed_event_date": "2010-06-18", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "深圳市兴森快捷电路科技股份有限公司；股票代码：002436", "id": "src-fastprint-listing", "limitations": [], "locally_archived_path": null, "locator": "Release body", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2010-07-05", "publication_date_unknown_reason": null, "publisher": "深圳市兴森快捷电路科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-fastprint-listing", "source_type": "official_company_release", "title": "兴森快捷成功上市", "translation_en": "Shenzhen Fastprint Circuit Tech Co., Ltd.; stock code 002436.", "url": "https://www.chinafastprint.com/news/detail/4929", "label": "兴森快捷成功上市" }, { "access_state": "paywalled", "claim_ids": [ "clm-yuliangsheng-smic-p3" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The report says a Yuliangsheng immersion prototype is under trials at SMIC.", "id": "src-ft-yuliangsheng-smic-2026", "limitations": [ "Paywalled secondary report; prototype evaluation is not delivery/acceptance or qualified production." ], "locally_archived_path": null, "locator": "reported SMIC trial passage", "original_language": "en", "primary_status": "secondary", "publication_date": "2025-09-17", "publication_date_unknown_reason": null, "publisher": "Financial Times", "record_type": "source", "rights_boundary": "metadata_and_short_excerpt_only", "source_id": "src-ft-yuliangsheng-smic-2026", "source_type": "news_report", "title": "China trials its first advanced tools for AI chipmaking", "translation_en": "Same as original.", "url": "https://www.ft.com/content/8fd79522-e34f-4633-bc87-ef0aae2d9159", "label": "China trials its first advanced tools for AI chipmaking" }, { "access_state": "open", "claim_ids": [ "clm-shenyang-fortune-precision-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company describes semiconductor precision process and structural components, gas-delivery systems and modules.", "id": "src-fuchuang-profile-20260801", "limitations": [ "Company-reported portfolio and capability only; no named customer, exact tool, fab, order, acceptance, yield or independently verified output." ], "locally_archived_path": null, "locator": "company profile; products and capabilities", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Shenyang Fortune Precision Equipment Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-fuchuang-profile-20260801", "source_type": "company_profile", "title": "Company Profile", "translation_en": "The company describes semiconductor precision process and structural components, gas-delivery systems and modules.", "url": "https://en.fortune-semi.com/profile.html", "label": "Company Profile" }, { "access_state": "open", "claim_ids": [ "clm-shanghai-fudan-microelectronics-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company describes ASIC design and non-volatile-memory product lines.", "id": "src-fudan-micro-profile-20260801", "limitations": [ "No named foundry, wafer-fabrication claim, exact customer or product-level supply relationship is disclosed." ], "locally_archived_path": null, "locator": "company profile; product lines", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Shanghai Fudan Microelectronics Group Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-fudan-micro-profile-20260801", "source_type": "company_profile", "title": "About Fudan Microelectronics", "translation_en": "The company describes ASIC design and non-volatile-memory product lines.", "url": "https://eng.fmsh.com/about.shtml", "label": "About Fudan Microelectronics" }, { "access_state": "open", "claim_ids": [ "clm-gentech-equipment-customer-set", "clm-gentech-gases-commercial-state", "clm-hanjing-huahong-stable-supply", "clm-relationship-gentech-owns-hanjing", "clm-relationship-gentech-supplies-amec", "clm-relationship-gentech-supplies-leadmicro", "clm-relationship-gentech-supplies-naura", "clm-relationship-gentech-supplies-piotech", "clm-relationship-gentech-supplies-sicarrier", "clm-relationship-gentech-supplies-yitang", "clm-relationship-hanjing-supplies-huahong-group" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "砷烷、磷烷等特种气体实现稳定量产；HCDS、TMA样品处于客户测试阶段。", "id": "src-gentech-annual-2025", "limitations": [ "Exact SKU-to-customer, facility, layer, quantity, acceptance date and purity are not disclosed." ], "locally_archived_path": null, "locator": "PDF pp. 11-15; p. 94", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-18", "publication_date_unknown_reason": null, "publisher": "上海正帆科技股份有限公司 via 上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-gentech-annual-2025", "source_type": "exchange_filing", "title": "上海正帆科技股份有限公司2025年年度报告", "translation_en": "Arsine and phosphine reached stable volume production; HCDS and TMA samples remained in customer testing.", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688596_20260418_YQFF.pdf", "label": "上海正帆科技股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-guangzhou-g-gas-energy-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company portfolio includes electronic bulk gases, rare gases and industrial gases.", "id": "src-ggas-profile-20260801", "limitations": [ "Portfolio capability does not prove installation or qualified supply at a specific fab." ], "locally_archived_path": null, "locator": "company and product overview", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Guangzhou G-Gas Energy Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-ggas-profile-20260801", "source_type": "company_profile", "title": "G-Gas", "translation_en": "The company portfolio includes electronic bulk gases, rare gases and industrial gases.", "url": "https://en.ggas.com/", "label": "G-Gas" }, { "access_state": "open_mirror", "claim_ids": [ "clm-gigadevice-cxmt-purchase", "clm-relationship-gigadevice-buys-cxmt-dram" ], "claimed_event_date": "2026-01-23", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "采购代工生产的DRAM相关产品。", "id": "src-gigadevice-cxmt-2026", "limitations": [ "Primary listed-company announcement accessed through a mirror; exact die, fab, process, volume, price and qualification are undisclosed." ], "locally_archived_path": null, "locator": "Section 三, 关联交易主要内容", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-01-23", "publication_date_unknown_reason": null, "publisher": "兆易创新科技集团股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-gigadevice-cxmt-2026", "source_type": "exchange_filing_mirror", "title": "兆易创新关于2026年上半年度日常关联交易预计额度的公告", "translation_en": "Purchase foundry-produced DRAM-related products.", "url": "https://money.finance.sina.com.cn/corp/view/vCB_AllBulletinDetail.php?id=11930272&stockid=603986", "label": "兆易创新关于2026年上半年度日常关联交易预计额度的公告" }, { "access_state": "open", "claim_ids": [ "clm-gloway-cxmt-bom", "clm-relationship-gloway-integrates-cxmt-dram" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "2020年弈Pro系列内存采用长鑫存储颗粒。", "id": "src-gloway-cxmt-yipro", "limitations": [ "Brand history does not quantify SKU-level volumes, current authorization, or all BOM components." ], "locally_archived_path": null, "locator": "发展历程，2020年", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "嘉合劲威", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-gloway-cxmt-yipro", "source_type": "company_brand_page", "title": "光威品牌发展历程", "translation_en": "The 2020 Yi Pro memory line used CXMT memory dies.", "url": "https://www.gloway.com.cn/pages_29/", "label": "光威品牌发展历程" }, { "access_state": "open", "claim_ids": [ "clm-goke-microelectronics-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "公司从事集成电路设计业务，业务覆盖固态存储等领域的大规模芯片及解决方案。", "id": "src-goke-annual-2025", "limitations": [ "No memory-wafer fabrication, named foundry, exact customer or product-level supply relationship is disclosed." ], "locally_archived_path": null, "locator": "2025年年度报告；公司业务概要", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-29", "publication_date_unknown_reason": null, "publisher": "湖南国科微电子股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-goke-annual-2025", "source_type": "annual_report", "title": "湖南国科微电子股份有限公司2025年年度报告", "translation_en": "The company operates an integrated-circuit design business covering large-scale chips and solutions in areas including solid-state storage.", "url": "https://static.cninfo.com.cn/finalpage/2026-04-29/1225245415.PDF", "label": "湖南国科微电子股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-goodix" ], "claimed_event_date": "2020-12-30", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "深圳市汇顶科技股份有限公司（SH 603160）", "id": "src-goodix-statement", "limitations": [], "locally_archived_path": null, "locator": "Statement body and signature", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2020-12-30", "publication_date_unknown_reason": null, "publisher": "深圳市汇顶科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-goodix-statement", "source_type": "official_company_release", "title": "澄清声明", "translation_en": "Shenzhen Goodix Technology Co., Ltd. (SH 603160).", "url": "https://www.goodix.com/zh/about_goodix/newsroom/company_news/detail/14328", "label": "澄清声明" }, { "access_state": "open", "claim_ids": [ "clm-grikin-copper-purity-conflict" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The product title says 6N High Purity Copper while the body states chemical purity of 99.999%.", "id": "src-grikin-6n-copper", "limitations": [ "Issuer metadata is internally inconsistent: 6N title versus 5N numeric purity; no CoA or named customer." ], "locally_archived_path": null, "locator": "title; Introduction and Parameter", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "GRIKIN Advanced Material Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-grikin-6n-copper", "source_type": "company_product_page", "title": "6N High Purity Copper", "translation_en": "Same as original.", "url": "https://www.grikin.com/en/cms/product/9", "label": "6N High Purity Copper" }, { "access_state": "open", "claim_ids": [ "clm-grikin-evaporation-material-catalogue" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "产品表列示Au、Ag、Pt、Ti、Ni、V、Cr、Al、Cu及多种金合金，牌号范围3N5至6N。", "id": "src-grikin-evaporation-materials", "limitations": [ "Catalogue only; no named process, customer, qualification, capacity or lot CoA." ], "locally_archived_path": null, "locator": "产品表；材料、纯度和包装字段", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "有研亿金新材料有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-grikin-evaporation-materials", "source_type": "company_product_page", "title": "蒸发料", "translation_en": "The catalogue lists Au, Ag, Pt, Ti, Ni, V, Cr, Al, Cu and several gold alloys with grades from 3N5 to 6N.", "url": "https://www.grikin.com/article/27", "label": "蒸发料" }, { "access_state": "open", "claim_ids": [ "clm-grikin-legal-identity" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "网站运营主体为有研亿金新材料有限公司，并说明其隶属有研新材料股份有限公司。", "id": "src-grikin-home", "limitations": [ "Legal identity and affiliation only." ], "locally_archived_path": null, "locator": "关于我们；公司主体和隶属关系", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "有研亿金新材料有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-grikin-home", "source_type": "company_home_page", "title": "有研亿金新材料有限公司", "translation_en": "The site identifies GRIKIN Advanced Material Co., Ltd. and states its affiliation with GRINM Advanced Materials Co., Ltd.", "url": "https://www.grikin.com/", "label": "有研亿金新材料有限公司" }, { "access_state": "open", "claim_ids": [ "clm-grikin-300mm-cu-target-volume" ], "claimed_event_date": "2021-11-15", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "有研亿金300mm超高纯铜靶已实现批量生产并供应主流客户。", "id": "src-grinm-grikin-300mm-cu-target-2021", "limitations": [ "Customers are unnamed; exact purity basis, target drawing, capacity, process layer, shipment quantity and yield are absent." ], "locally_archived_path": null, "locator": "正文；量产和客户范围段落", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2021-11-15", "publication_date_unknown_reason": null, "publisher": "中国有研科技集团有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-grinm-grikin-300mm-cu-target-2021", "source_type": "state_parent_product_announcement", "title": "有研亿金300mm超高纯铜靶喜获第二届集成电路材料五星产品奖", "translation_en": "The state-parent announcement says GRIKIN's 300 mm ultra-high-purity copper target reached volume production and supplies mainstream customers.", "url": "https://www.grinm.com/s/2614-6794-121247.html", "label": "有研亿金300mm超高纯铜靶喜获第二届集成电路材料五星产品奖" }, { "access_state": "open", "claim_ids": [ "clm-guowang-optics-base-state" ], "claimed_event_date": "2024-02-19", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "投影光刻机曝光光学系统研发及批量生产基地竣工投产。", "id": "src-guowang-base-production-2024", "limitations": [ "Facility state only; actual output, model, customer, scanner integration, qualification and yield are not disclosed." ], "locally_archived_path": null, "locator": "正文；竣工投产段落", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2024-02-19", "publication_date_unknown_reason": null, "publisher": "国家科技创新中心", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-guowang-base-production-2024", "source_type": "government_industrial_update", "title": "国望光学曝光光学系统基地竣工投产", "translation_en": "The projection-lithography exposure-optics R&D and batch-production base was reported completed and put into production.", "url": "https://www.ncsti.gov.cn/kjdt/scyq/bjjjjskfq/jkdt/202402/t20240219_149260.html", "label": "国望光学曝光光学系统基地竣工投产" }, { "access_state": "open", "claim_ids": [ "clm-relationship-hermle-guowang-five-axis-award-2022" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "德国贝托特•哈默机械制造股份公司中标两台五轴立式加工中心。", "id": "src-guowang-hermle-award-2022", "limitations": [ "Award does not prove delivery, installation, acceptance, current use, the exact optical part processed, service route or spares." ], "locally_archived_path": null, "locator": "项目2928-224000000010；中标人、数量及设备名称", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2022-06-09", "publication_date_unknown_reason": null, "publisher": "商务部机电产品招标投标电子交易平台", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-guowang-hermle-award-2022", "source_type": "government_procurement_award", "title": "北京国望光学科技有限公司五轴立式加工中心项目评标结果公告", "translation_en": "Berthold Hermle AG won the award for two five-axis vertical machining centres.", "url": "https://chinabidding.mofcom.gov.cn/bidDetail/bidding/bulletin/202206/ff8080817d94c145018145fd60755ec2.html", "label": "北京国望光学科技有限公司五轴立式加工中心项目评标结果公告" }, { "access_state": "open", "claim_ids": [ "clm-guowang-optics-designed-capacity" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "项目单位北京国望光学科技有限公司，计划达产后年产15至20套曝光光学系统。", "id": "src-guowang-optics-base-2021", "limitations": [ "15–20 systems/year is a design target, not installed, qualified or actual output." ], "locally_archived_path": null, "locator": "项目登记；单位、投资、建筑面积和达产目标", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2021-01-14", "publication_date_unknown_reason": null, "publisher": "北京市公共资源交易服务平台", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-guowang-optics-base-2021", "source_type": "government_project_record", "title": "投影光刻机曝光光学系统研发及批量生产基地项目", "translation_en": "The project owner is Beijing Guowang Optics Technology Co., Ltd.; the design target is 15 to 20 exposure optical systems per year at full production.", "url": "https://ggzyfw.beijing.gov.cn/jylcgcjs/20210114/1340589.html", "label": "投影光刻机曝光光学系统研发及批量生产基地项目" }, { "access_state": "open", "claim_ids": [ "clm-h3c-bios574-option-matrix", "clm-relationship-h3c-supports-biren104p-bios574", "clm-relationship-h3c-supports-cambricon-options-bios574", "clm-relationship-h3c-supports-cxmt-memory-option-bios574" ], "claimed_event_date": "2023-08-04", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "H65-BIOS-5.74适配璧仞104P GPU、海光7380/7390与寒武纪MLU370-S4组合、海光7380与MLU370-X4组合，以及长鑫内存CXMQ3A4MA4GR7-CJ1-A_NEW。", "id": "src-h3c-h65-bios-574-20230804", "limitations": [ "Firmware adaptation/support is not a purchase, configured commercial SKU, order, shipment, installation or external qualification.", "The signed binary is named with MD5 eea6fa3e3dc6f629ee8fdaa78932627c; it was not locally archived." ], "locally_archived_path": null, "locator": "title/date lines 726–748; compatibility lines 915–930 and 981–1001; option adaptations lines 1068–1102", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2023-08-04", "publication_date_unknown_reason": null, "publisher": "新华三技术有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-h3c-h65-bios-574-20230804", "source_type": "official_firmware_release_notes", "title": "H3C H65-BIOS-5.74版本说明书", "translation_en": "H65-BIOS-5.74 lists adaptations for Biren 104P, Hygon 7380/7390 with Cambricon MLU370-S4, Hygon 7380 with MLU370-X4, and CXMT memory part CXMQ3A4MA4GR7-CJ1-A_NEW.", "url": "https://www.h3c.com/cn/d_202308/1903077_30005_0.htm", "label": "H3C H65-BIOS-5.74版本说明书" }, { "access_state": "open", "claim_ids": [ "clm-iluvatar-bi-v100-h3c-compatibility", "clm-relationship-iluvatar-supports-h3c-bi-v100-configurations" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "天数V100；至少配置2张。", "id": "src-h3c-iluvatar-r5300g6-202412", "limitations": [ "The page exposes month but no exact publication day.", "The document names 天数V100 rather than BI-V100 and does not prove purchase or deployment." ], "locally_archived_path": null, "locator": "December 2024 R5300 G6 setup requirements; supported-GPU list and minimum-card statement", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "新华三技术有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-h3c-iluvatar-r5300g6-202412", "source_type": "customer_product_documentation", "title": "H3C UniServer R5300 G6配置文档", "translation_en": "Iluvatar V100; configure at least two cards.", "url": "https://www.h3c.com/cn/d_202412/2328144_30005_0.htm", "label": "H3C UniServer R5300 G6配置文档" }, { "access_state": "open", "claim_ids": [ "clm-iluvatar-bi-v100-h3c-compatibility", "clm-relationship-iluvatar-supports-h3c-bi-v100-configurations" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "天数V100。", "id": "src-h3c-iluvatar-server-202408", "limitations": [ "The page exposes month but no exact publication day.", "Support documentation does not prove purchase, shipment or production use." ], "locally_archived_path": null, "locator": "August 2024 server supported-GPU/configuration section", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "新华三技术有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-h3c-iluvatar-server-202408", "source_type": "customer_product_documentation", "title": "H3C服务器配置文档", "translation_en": "Iluvatar V100.", "url": "https://www.h3c.com/cn/d_202408/2255813_30005_0.htm", "label": "H3C服务器配置文档" }, { "access_state": "open", "claim_ids": [ "clm-h3c-r4930g3-all-domestic-bom-unproven", "clm-relationship-h3c-r4930g3-integrates-hygon7000" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "H3C UniServer R4930 G3基于海光二号，支持两颗Hygon 7000系列处理器。", "id": "src-h3c-r4930g3-product", "limitations": [ "No exact factory/address, processor SKU by configuration, shipment, customer, installed base, capacity or reliability receipt.", "The all-domestic wording lacks a component-level BOM and origin record." ], "locally_archived_path": null, "locator": "product overview lines 732–760", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "新华三技术有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-h3c-r4930g3-product", "source_type": "company_product_page", "title": "搭载海光二号的双路服务器H3C UniServer R4930 G3", "translation_en": "H3C UniServer R4930 G3 is based on second-generation Hygon and supports two Hygon 7000-series processors.", "url": "https://www.h3c.com/cn/Products_And_Solution/Server/H3C/Products/RackServer/Products_Series/Dualway_Server/R4930_G3/", "label": "搭载海光二号的双路服务器H3C UniServer R4930 G3" }, { "access_state": "open", "claim_ids": [ "clm-shanghai-hanbell-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company profile and PX vacuum-pump portfolio identify semiconductor applications.", "id": "src-hanbell-profile-vacuum-20260801", "limitations": [ "Application fit does not prove a named fab installation, customer order or accepted production tool." ], "locally_archived_path": null, "locator": "company profile; vacuum-pump product family", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Shanghai Hanbell Precise Machinery Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-hanbell-profile-vacuum-20260801", "source_type": "company_profile", "title": "Company Profile and Vacuum Pumps", "translation_en": "The company profile and PX vacuum-pump portfolio identify semiconductor applications.", "url": "https://hanbell.com.cn/En/company-profile?tp/1", "label": "Company Profile and Vacuum Pumps" }, { "access_state": "open", "claim_ids": [ "clm-hengyunchang-foreign-rf-dominance", "clm-hengyunchang-named-customers", "clm-relationship-hengyunchang-supplies-amec", "clm-relationship-hengyunchang-supplies-leadmicro", "clm-relationship-hengyunchang-supplies-naura", "clm-relationship-hengyunchang-supplies-piotech" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "主要客户包括拓荆科技、中微公司、北方华创、微导纳米；射频电源需通过设备商及晶圆厂验证。", "id": "src-hengyunchang-annual-2025", "limitations": [ "Issuer-reported customer revenue does not identify the receiving fab, tool model, layer, or exact accepted component SKU." ], "locally_archived_path": null, "locator": "第三节；主要客户；核心部件验证说明", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-28", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-hengyunchang-annual-2025", "source_type": "exchange_filing", "title": "深圳市恒运昌真空技术股份有限公司2025年年度报告", "translation_en": "Named customers include Piotech, AMEC, NAURA and Leadmicro; RF power requires equipment-maker and wafer-fab validation.", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-28/688785_20260428_AVJI.pdf", "label": "深圳市恒运昌真空技术股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-jiangsu-hhck-advanced-materials-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "公司致力于半导体封装材料环氧塑封料和组装材料电子胶黏剂的研发、生产和销售。", "id": "src-hhck-annual-2025", "limitations": [ "This is a packaging-material capability, not evidence that the company is a package assembler or a supplier to a named product." ], "locally_archived_path": null, "locator": "2025年年度报告；主营业务与产品部分", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-03-18", "publication_date_unknown_reason": null, "publisher": "江苏华海诚科新材料股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-hhck-annual-2025", "source_type": "annual_report", "title": "江苏华海诚科新材料股份有限公司2025年年度报告", "translation_en": "The company researches, produces and sells epoxy molding compounds and electronic adhesives used as semiconductor packaging and assembly materials.", "url": "https://static.cninfo.com.cn/finalpage/2026-03-18/1225014871.PDF", "label": "江苏华海诚科新材料股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-houmo-h30-co-development", "clm-relationship-houmo-develops-h30-with-youkong" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "后摩鸿途H30算力256TOPS，与优控智行开展战略合作。", "id": "src-houmo-h30-youkong-20231229", "limitations": [ "Counterparty legal entity, production vehicle, contract, units, foundry, memory and OSAT are undisclosed." ], "locally_archived_path": null, "locator": "body lines 39–55", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2023-12-29", "publication_date_unknown_reason": null, "publisher": "后摩智能科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-houmo-h30-youkong-20231229", "source_type": "company_customer_announcement", "title": "后摩智能与优控智行战略合作", "translation_en": "H30 is reported at 256 TOPS with a strategic co-development relationship with Youkong Zhixing.", "url": "https://www.houmoai.com/3/28/NewsDetails.html", "label": "后摩智能与优控智行战略合作" }, { "access_state": "open", "claim_ids": [ "clm-houmo-identity-h30-and-m50" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "后摩智能科技股份有限公司 / PostMoore Technology Co., Ltd.", "id": "src-houmo-home", "limitations": [ "Legal identity only." ], "locally_archived_path": null, "locator": "site footer", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "后摩智能科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-houmo-home", "source_type": "company_home_page", "title": "后摩智能官网", "translation_en": "Same as original.", "url": "https://www.houmoai.com/", "label": "后摩智能官网" }, { "access_state": "open", "claim_ids": [ "clm-houmo-m50-specification-and-integration", "clm-relationship-great-wall-n90pro-integrates-houmo-m50" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司称长城N90 Pro AI笔记本搭载后摩M50。", "id": "src-houmo-m50-greatwall-20260531", "limitations": [ "Direct buying entity, contract, units, retail shipments, acceptance and field reliability are undisclosed." ], "locally_archived_path": null, "locator": "body lines 39–55", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-05-31", "publication_date_unknown_reason": null, "publisher": "后摩智能科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-houmo-m50-greatwall-20260531", "source_type": "company_customer_announcement", "title": "长城N90 Pro AI笔记本搭载后摩M50", "translation_en": "The vendor reports that the Great Wall N90 Pro AI notebook integrates M50.", "url": "https://www.houmoai.com/1/47/NewsDetails.html", "label": "长城N90 Pro AI笔记本搭载后摩M50" }, { "access_state": "open", "claim_ids": [ "clm-houmo-m50-specification-and-integration" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "M50宣称INT8 160TOPS、bFP16 100TFLOPS、10W，支持最高48GB LPDDR5和153.6GB/s。", "id": "src-houmo-m50-product", "limitations": [ "Foundry, OSAT, LPDDR supplier, units, customer acceptance and independent workload receipt are undisclosed." ], "locally_archived_path": null, "locator": "product page lines 41–116", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "后摩智能科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-houmo-m50-product", "source_type": "company_product_page", "title": "M50", "translation_en": "M50 lists INT8 160 TOPS, bFP16 100 TFLOPS, 10 W, up to 48 GB LPDDR5 and 153.6 GB/s.", "url": "https://www.houmoai.com/60/ProductType.html", "label": "M50" }, { "access_state": "open", "claim_ids": [ "clm-huahong-wafer-manufacturing-business" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The report identifies Hua Hong Semiconductor Limited and its semiconductor-wafer manufacturing business.", "id": "src-huahong-annual-2025", "limitations": [ "Group disclosure does not identify a product's foundry, scanner fleet, customer, yield or complete supplier BOM." ], "locally_archived_path": null, "locator": "definitions; business review", "original_language": "en", "primary_status": "primary", "publication_date": "2026-03-26", "publication_date_unknown_reason": null, "publisher": "Hong Kong Exchanges and Clearing Limited", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-huahong-annual-2025", "source_type": "annual_report", "title": "Hua Hong Semiconductor Limited 2025 Annual Report", "translation_en": "Same as original.", "url": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0326/2026032602731_c.pdf", "label": "Hua Hong Semiconductor Limited 2025 Annual Report" }, { "access_state": "open", "claim_ids": [ "clm-huali-nikon-patent-title-2018" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "固定资产、无形资产、服务等由用户部门检查验收；专利清单含监控尼康光刻机底部镜头雾化散光程度的掩膜板。", "id": "src-huahong-huali-acquisition-2026", "limitations": [ "Generic acceptance workflow does not prove acceptance of a particular scanner.", "A patent title is mechanism/IP evidence, not proof of Nikon tool ownership, supplier status, installation or current use.", "Equipment suppliers remain undisclosed." ], "locally_archived_path": null, "locator": "printed 1-1-137, 1-1-144 and 1-1-469", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-06-23", "publication_date_unknown_reason": null, "publisher": "上海证券交易所 / 华虹宏力", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-huahong-huali-acquisition-2026", "source_type": "acquisition_filing", "title": "华虹宏力半导体有限公司发行股份购买资产并募集配套资金暨关联交易报告书（注册稿）", "translation_en": "User departments inspect and accept fixed assets/services; the patent list includes a mask for monitoring lens haze/astigmatism in a Nikon lithography machine.", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-06-23/688347_20260623_FKJB.pdf", "label": "华虹宏力半导体有限公司发行股份购买资产并募集配套资金暨关联交易报告书（注册稿）" }, { "access_state": "open", "claim_ids": [ "clm-huahong-generic-lithography-assets-2023" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "机器设备主要包括光刻机、离子注入机等生产制造设备。", "id": "src-huahong-ipo-2023", "limitations": [ "Generic asset category only; vendor, model, serial, facility, installation, acceptance and qualified layer are undisclosed." ], "locally_archived_path": null, "locator": "固定资产章节；前五大原材料供应商章节", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2023-07-31", "publication_date_unknown_reason": null, "publisher": "上海证券交易所 / 华虹公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-huahong-ipo-2023", "source_type": "prospectus", "title": "华虹公司首次公开发行股票并在科创板上市招股说明书", "translation_en": "Production machinery includes lithography and ion-implantation machines.", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2023-07-31/688347_20230731_O0FE.pdf", "label": "华虹公司首次公开发行股票并在科创板上市招股说明书" }, { "access_state": "open", "claim_ids": [ "clm-huahong-generic-procurement-no-scanner-edge-2025" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司集中采购晶圆代工所需原物料、设备及技术服务；部分商业秘密信息获豁免披露，前五名供应商除关联方外均匿名。", "id": "src-huahong-sse-annual-2025", "limitations": [ "Exact-term audit found no Yuliangsheng, SMEE or ASML name.", "No scanner supplier, model or site is disclosed; non-disclosure is not evidence of absence." ], "locally_archived_path": null, "locator": "采购模式；商业秘密豁免说明；printed pp. 24–25", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-03-27", "publication_date_unknown_reason": null, "publisher": "上海证券交易所 / 华虹半导体", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-huahong-sse-annual-2025", "source_type": "annual_report", "title": "华虹半导体有限公司2025年年度报告", "translation_en": "Hua Hong centrally procures foundry materials, equipment and technical services; some commercial-secret information is exempted and top suppliers are otherwise anonymized.", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-27/688347_20260327_AFKI.pdf", "label": "华虹半导体有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-huate-bcl3-designed-capacity", "clm-huate-c4f6-designed-capacity-construction", "clm-huate-gas-import-substitution", "clm-huate-hbm-tsv-gas-application-ceiling", "clm-huate-hbr-designed-capacity", "clm-huate-lithography-mixture-certification-ceiling", "clm-huate-new-product-orders-2025", "clm-huate-smic-ningbo-award", "clm-relationship-huate-owns-jiangxi", "clm-relationship-huate-supplies-smic-ningbo", "clm-relationship-huate-tianyu-onsite-hydrogen-2025" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "年报列示Ar/F/Ne、Kr/Ne、Ar/Ne、Kr/F/Ne、Ar/Ne/Xe光刻气体组合，以及HBr、乙硅烷、六氟丁二烯、三氯化硼等项目的订单或建设状态；HBr项目设计产能300吨/年并转固，六氟丁二烯项目年末进度95.03%。", "id": "src-huate-gas-annual-2025", "limitations": [ "The filing does not identify the legal owner or physical address for each gas project.", "Sales orders, project completion and fixed-asset transfer are not delivery, customer acceptance or qualified output.", "ASML/Gigaphoton certification is stated at portfolio level; exact certified formulations, certificates and laser models are not identified.", "Named customer recognition is not molecule-, grade-, facility- or process-specific.", "Generic HBM/TSV application language does not prove a qualified HBM stack or a material-to-HBM customer edge." ], "locally_archived_path": null, "locator": "PDF pp. 12–13, 20–21, 27, 65–70 and 210–212; project-ledger, product and customer-recognition tables", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-10", "publication_date_unknown_reason": null, "publisher": "广东华特气体股份有限公司 via 巨潮资讯网", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-huate-gas-annual-2025", "source_type": "exchange_filing", "title": "广东华特气体股份有限公司2025年年度报告", "translation_en": "The filing lists Ar/F/Ne, Kr/Ne, Ar/Ne, Kr/F/Ne and Ar/Ne/Xe lithography-gas mixtures and reports order or project states for HBr, disilane, C4F6 and BCl3. The 300 t/y HBr project was transferred to fixed assets; the 300 t/y C4F6 project was 95.03% complete at year-end.", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225090204.PDF", "label": "广东华特气体股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-huatian-2p5d-rd-ceiling" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Si中介层2.5D封装技术研发项目处于研发进行中；2026年计划重点加快2.5D技术平台产品量产进程。", "id": "src-huatian-annual-2025", "limitations": [ "The single HBM reference is industry context; a roadmap is not current qualification or volume production." ], "locally_archived_path": null, "locator": "PDF pp. 12, 19 and 28", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-03-31", "publication_date_unknown_reason": null, "publisher": "天水华天科技股份有限公司", "record_type": "source", "retrieved_content_sha256": "f48ccf00cc32cdcae6203aa8b4ed228f77b680dd5a852a753f5eb83b0bbc7ff0", "rights_boundary": "link_only", "source_id": "src-huatian-annual-2025", "source_type": "exchange_filing", "title": "天水华天科技股份有限公司2025年年度报告", "translation_en": "The silicon-interposer 2.5D packaging project remained in R&D; the 2026 plan is to accelerate its path to volume production.", "url": "https://static.cninfo.com.cn/finalpage/2026-03-31/1225059982.PDF", "label": "天水华天科技股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-huawei" ], "claimed_event_date": "2025-09-18", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Copyright © 2026 Huawei Technologies Co., Ltd.", "id": "src-huawei-legal-footer-20250918", "limitations": [ "The page does not prove the exact legal owner, designer, foundry, supplier, customer, or contracting entity for every Huawei, Ascend, Atlas, HiBL, or HiZQ product." ], "locally_archived_path": null, "locator": "Official site footer and publisher identity", "original_language": "en", "primary_status": "primary", "publication_date": "2025-09-18", "publication_date_unknown_reason": null, "publisher": "Huawei Technologies Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-huawei-legal-footer-20250918", "source_type": "official_company_legal_page", "title": "Huawei Launches SuperPoD Products", "translation_en": "Same as original.", "url": "https://www.huawei.com/en/news/2025/9/hc-superpod-innovation", "label": "Huawei Launches SuperPoD Products" }, { "access_state": "open", "claim_ids": [ "clm-ymtc-phase3-investment" ], "claimed_event_date": "2026-05-20", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "长存三期（武汉）集成电路有限责任公司项目投资约207.2亿元。", "id": "src-hubei-ymtc-phase3", "limitations": [ "Investment is not deployed capital, equipment list, capacity, first wafer or qualified production." ], "locally_archived_path": null, "locator": "project/company and investment paragraphs", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-05-20", "publication_date_unknown_reason": null, "publisher": "湖北省人民政府", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-hubei-ymtc-phase3", "source_type": "government_project_record", "title": "长存三期项目加速推进", "translation_en": "The YMTC Phase III Wuhan project-company investment is about CNY 20.72 billion.", "url": "https://www.hubei.gov.cn/hbfb/rdgz/202605/t20260520_5939700.shtml", "label": "长存三期项目加速推进" }, { "access_state": "open", "claim_ids": [ "clm-moore-threads-s5000-pinghu-and-huishan-deployment", "clm-relationship-huishan-center-integrates-mt-s5000" ], "claimed_event_date": "2026-06-30", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "中心一期部署超2000张摩尔线程S5000卡，算力超1000P，并于2026年6月点亮。", "id": "src-huishan-mt-s5000-center-20260724", "limitations": [ "Facility legal owner/operator, direct buyer, contract, acceptance certificate, uptime and utilization are undisclosed.", "Powered-on/deployed does not by itself prove sustained production workload or service volume." ], "locally_archived_path": null, "locator": "body lines 26–44", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-07-24", "publication_date_unknown_reason": null, "publisher": "惠山区人民政府办公室", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-huishan-mt-s5000-center-20260724", "source_type": "government_project_record", "title": "无锡（惠山）人工智能算力中心一期点亮", "translation_en": "Phase I deployed more than 2,000 Moore Threads S5000 cards, exceeded 1,000P and was powered on in June 2026.", "url": "https://www.huishan.gov.cn/doc/2026/07/24/4809561.shtml", "label": "无锡（惠山）人工智能算力中心一期点亮" }, { "access_state": "open", "claim_ids": [ "clm-hwatsing-cmp-business" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司主营化学机械抛光设备及相关工艺服务。", "id": "src-hwatsing-annual-2025", "limitations": [ "No public facility/model/layer/yield attribution is inferred from portfolio disclosure." ], "locally_archived_path": null, "locator": "第三节，主营业务", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-23", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-hwatsing-annual-2025", "source_type": "exchange_filing", "title": "华海清科股份有限公司2025年年度报告", "translation_en": "The company reports CMP equipment and related process services as its core business.", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-23/688120_20260423_K9XR.pdf", "label": "华海清科股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-hwatsing-production-line-customers", "clm-relationship-hwatsing-supplies-cxmt", "clm-relationship-hwatsing-supplies-huahong", "clm-relationship-hwatsing-supplies-smic", "clm-relationship-hwatsing-supplies-ymtc" ], "claimed_event_date": "2014-2020", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "CMP设备已广泛应用于中芯国际、长江存储、华虹集团、长鑫存储等。", "id": "src-hwatsing-inquiry-2021", "limitations": [ "Aggregates models, customers and process capabilities; exact model/facility/layer qualification is not disclosed." ], "locally_archived_path": null, "locator": "PDF pages 29-31", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2021-02-08", "publication_date_unknown_reason": null, "publisher": "华海清科股份有限公司 via 上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-hwatsing-inquiry-2021", "source_type": "exchange_filing", "title": "华海清科股份有限公司第二轮审核问询函回复", "translation_en": "CMP equipment has been widely used at SMIC, YMTC, Hua Hong Group and CXMT.", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202102/000752_20210208_7AX3.pdf", "label": "华海清科股份有限公司第二轮审核问询函回复" }, { "access_state": "open", "claim_ids": [ "clm-kehua-248nm-12in-industry-award-2021" ], "claimed_event_date": "2021-11-03", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "12吋工艺线用248nm光刻胶产品开发与量产技术。", "id": "src-icmtia-kehua-248nm-award-2021", "limitations": [ "The award names Beijing Kehua and a 248 nm family, not an exact SKU, customer, fab, layer, lot, quantity, qualification date or independent process data." ], "locally_archived_path": null, "locator": "award list lines 112–130", "original_language": "zh-CN", "primary_status": "secondary", "publication_date": "2021-11-08", "publication_date_unknown_reason": null, "publisher": "中关村集成电路材料产业技术创新联盟", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-icmtia-kehua-248nm-award-2021", "source_type": "industry_association_award_record", "title": "“第二届集成电路材料奖”获奖名单颁布", "translation_en": "Development and mass-production technology for 248 nm photoresist on 12-inch process lines.", "url": "https://www.icmtia.com/news/647.html", "label": "“第二届集成电路材料奖”获奖名单颁布" }, { "access_state": "open", "claim_ids": [ "clm-iluvatar-tg100-production-stage", "clm-iluvatar-zk100-bringup-and-card-release" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "天垓100于2021年进入量产阶段；智铠100于2022年完成芯片点亮并发布板卡。", "id": "src-iluvatar-about", "limitations": [ "Vendor timeline; model-specific units, foundry, OSAT, memory supplier and named customers are undisclosed." ], "locally_archived_path": null, "locator": "company chronology", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "上海天数智芯半导体股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-iluvatar-about", "source_type": "company_timeline", "title": "发展历程", "translation_en": "TG100 entered a reported volume-production stage in 2021; ZK100 was brought up and its card released in 2022.", "url": "https://www.iluvatar.com/about/", "label": "发展历程" }, { "access_state": "open", "claim_ids": [ "clm-iluvatar-identity-fabless-products-and-deployment-ceiling" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The company reports a fabless model, more than 340 customers and over 1,000 deployed projects; third-party contract manufacturers are unnamed.", "id": "src-iluvatar-annual-2025", "limitations": [ "Customers/projects, foundry, OSAT, HBM/memory supplier and model-specific units are withheld." ], "locally_archived_path": null, "locator": "PDF pp. 2–14 and 29", "original_language": "en", "primary_status": "primary", "publication_date": "2026-04-27", "publication_date_unknown_reason": null, "publisher": "香港交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-iluvatar-annual-2025", "source_type": "exchange_filing", "title": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd. 2025 Annual Report", "translation_en": "Same as original.", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0427/2026042701284.pdf", "label": "Shanghai Iluvatar CoreX Semiconductor Co., Ltd. 2025 Annual Report" }, { "access_state": "open", "claim_ids": [ "clm-iluvatar-bi-v100-h3c-compatibility", "clm-relationship-iluvatar-supports-h3c-bi-v100-configurations" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "新华三R4900 G6四卡、R5300 G5八卡BI-V100兼容配置。", "id": "src-iluvatar-compatibility", "limitations": [ "Compatibility does not prove purchase, quantity, shipment, installation or production use." ], "locally_archived_path": null, "locator": "hardware compatibility-certification list", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "上海天数智芯半导体股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-iluvatar-compatibility", "source_type": "official_compatibility_page", "title": "生态合作与适配认证", "translation_en": "H3C R4900 G6 four-card and R5300 G5 eight-card BI-V100 compatible configurations.", "url": "https://www.iluvatar.com/cooperation/direct", "label": "生态合作与适配认证" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-innoscience-suzhou" ], "claimed_event_date": "2024-12-30", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "InnoScience (Suzhou) Technology Holding Co., Ltd.", "id": "src-innoscience-hkex", "limitations": [ "Current controlling-shareholder analysis was not extracted for this identity-only lane." ], "locally_archived_path": null, "locator": "Document cover and corporate information", "original_language": "en", "primary_status": "primary", "publication_date": "2024-12-30", "publication_date_unknown_reason": null, "publisher": "Hong Kong Exchanges and Clearing Limited", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-innoscience-hkex", "source_type": "exchange_filing", "title": "InnoScience (Suzhou) Technology Holding Co., Ltd. listing document", "translation_en": "Same as original.", "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2024/1230/2024121201395.htm", "label": "InnoScience (Suzhou) Technology Holding Co., Ltd. listing document" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-innoscience-suzhou" ], "claimed_event_date": "2024-12-30", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "英诺赛科（苏州）科技股份有限公司；股票代码02577.HK", "id": "src-innoscience-official-listing", "limitations": [], "locally_archived_path": null, "locator": "Opening paragraph", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2024-12-30", "publication_date_unknown_reason": null, "publisher": "英诺赛科（苏州）科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-innoscience-official-listing", "source_type": "official_company_release", "title": "英诺赛科成功上市，氮化镓功率半导体引领者全“芯”启航", "translation_en": "InnoScience (Suzhou) Technology Holding Co., Ltd.; stock code 02577.HK.", "url": "https://www.innoscience.com/cn/news/detail/85/1278", "label": "英诺赛科成功上市，氮化镓功率半导体引领者全“芯”启航" }, { "access_state": "open", "claim_ids": [ "clm-innosilicon-hbm3e-ip-catalogue" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The catalogue lists HBM4/HBM3E PHY/controller, UCIe and PCIe/CXL IP.", "id": "src-innosilicon-ip-catalogue", "limitations": [ "Catalogue compatibility is not a named license, tapeout, qualified production chip, or mainland HBM stack." ], "locally_archived_path": null, "locator": "IP product matrix", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Innosilicon", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-innosilicon-ip-catalogue", "source_type": "company_product_page", "title": "IP Solutions", "translation_en": "Same as original.", "url": "https://www.innosilicon.com/ip-solution", "label": "IP Solutions" }, { "access_state": "open", "claim_ids": [ "clm-relationship-jcet-sells-unspecified-goods-cxmt-fy2025" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "关联交易表列示向长鑫科技集团股份有限公司销售商品1609744.00元。", "id": "src-jcet-annual-2025", "limitations": [ "The row says only sale of goods; product, facility, process, package/test scope and HBM status are unknown.", "Do not convert this receipt into a packages, tests or HBM relationship." ], "locally_archived_path": null, "locator": "PDF p. 195 (viewer p. 194), related-party sales table", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-10", "publication_date_unknown_reason": null, "publisher": "江苏长电科技股份有限公司 via 巨潮资讯网", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-jcet-annual-2025", "source_type": "exchange_filing", "title": "江苏长电科技股份有限公司2025年年度报告", "translation_en": "The related-transaction table reports CNY 1,609,744 of goods sold to CXMT in FY2025.", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225091498.PDF", "label": "江苏长电科技股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-jcet" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "江苏长电科技股份有限公司", "id": "src-jcet-ar2025", "limitations": [ "Current parent/control fields were not extracted into this identity lane." ], "locally_archived_path": null, "locator": "Cover and company profile", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-10", "publication_date_unknown_reason": null, "publisher": "江苏长电科技股份有限公司 via 巨潮资讯网", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-jcet-ar2025", "source_type": "exchange_filing", "title": "江苏长电科技股份有限公司2025年年度报告", "translation_en": "Jiangsu Changjiang Electronics Technology Co., Ltd.", "url": "https://static.cninfo.com.cn/finalpage/2026-04-10/1225091498.PDF", "label": "江苏长电科技股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-jcet" ], "claimed_event_date": "2019-12-24", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "JCET Group Co., Ltd. ... listed on the Shanghai Stock Exchange.", "id": "src-jcet-profile", "limitations": [ "The release predates the current control structure." ], "locally_archived_path": null, "locator": "About JCET paragraph", "original_language": "en", "primary_status": "primary", "publication_date": "2019-12-24", "publication_date_unknown_reason": null, "publisher": "JCET Group Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-jcet-profile", "source_type": "official_company_release", "title": "JCET Enters Into Strategic Business Agreement with Analog Devices", "translation_en": "Same as original.", "url": "https://www.jcetglobal.com/en/site/detailscon/556", "label": "JCET Enters Into Strategic Business Agreement with Analog Devices" }, { "access_state": "open", "claim_ids": [ "clm-jhicc-scope" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "攻坚集成电路内存芯片自主技术。", "id": "src-jhicc-about", "limitations": [ "Does not disclose qualified product, production state, capacity, yield, output or scanner fleet." ], "locally_archived_path": null, "locator": "About JHICC page", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "福建省晋华集成电路有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-jhicc-about", "source_type": "company_legal_page", "title": "关于晋华", "translation_en": "Develop independent integrated-circuit memory-chip technology.", "url": "https://www.jhicc.cn/AboutUs.html?info=quality", "label": "关于晋华" }, { "access_state": "open", "claim_ids": [ "clm-jiangyin-jianghua-micro-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "公司从事超净高纯湿电子化学品以及光刻胶配套试剂的研发、生产和销售。", "id": "src-jianghua-micro-profile-20260801", "limitations": [ "Twelve-inch-process language is company-reported; no named fab, grade, qualified layer or supply volume is disclosed." ], "locally_archived_path": null, "locator": "公司简介；产品范围", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "江阴江化微电子材料股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-jianghua-micro-profile-20260801", "source_type": "company_profile", "title": "About Jianghua Micro", "translation_en": "The company researches, produces and sells ultra-clean high-purity wet electronic chemicals and supporting reagents used with photoresist.", "url": "https://www.jianghuamem.com/cn/about.html", "label": "About Jianghua Micro" }, { "access_state": "open", "claim_ids": [ "clm-relationship-shenzhou-rps-to-amec", "clm-relationship-shenzhou-rps-to-piotech", "clm-shenzhou-rps-installed" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "多款RPS产品已安装于中微刻蚀、拓荆PECVD/ALD等设备，并在客户端稳定批量生产。", "id": "src-jiangsu-shenzhou-prospectus-2026", "limitations": [ "Issuer filing reproduces customer endorsements; facility, serial number, fab acceptance and qualified layer are not public." ], "locally_archived_path": null, "locator": "客户认证与客户证明函相关章节", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-06-30", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-jiangsu-shenzhou-prospectus-2026", "source_type": "exchange_filing", "title": "江苏神州半导体科技股份有限公司招股说明书", "translation_en": "The issuer reports multiple remote-plasma-source products installed in AMEC etch and Piotech PECVD/ALD equipment and stable batch production at clients.", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202606/002191_20260630_F1GO.pdf", "label": "江苏神州半导体科技股份有限公司招股说明书" }, { "access_state": "open", "claim_ids": [ "clm-wuhan-jingce-electronic-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company describes semiconductor testing products and services.", "id": "src-jingce-profile-20260801", "limitations": [ "The source does not close an exact back-end assembly/test process, named customer or production deployment." ], "locally_archived_path": null, "locator": "company profile; semiconductor business scope", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Wuhan Jingce Electronic Group Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-jingce-profile-20260801", "source_type": "company_profile", "title": "Company Profile", "translation_en": "The company describes semiconductor testing products and services.", "url": "https://www.wuhanjingce.com/en/jbxx/index.aspx", "label": "Company Profile" }, { "access_state": "open", "claim_ids": [ "clm-jinhong-2025-product-state-matrix", "clm-jinhong-fluorine-capacity-construction-2025", "clm-jinhong-precursor-capacity-2025", "clm-jinhong-ultrapure-ammonia-capacity-2025", "clm-relationship-jinhong-supplies-xinye-shidai-bulk-gas-project-2025" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司列示超纯氨、高纯氧化亚氮、TEOS、高纯二氧化碳、氢气及含氟气体等产品和集团产能；CH3F、C4F6处于试生产阶段。", "id": "src-jinhong-annual-2025", "limitations": [ "Capacity is consolidated/group aggregate and cannot be assigned to a facility or subsidiary.", "Named customer portfolios are not molecule-specific edges.", "Except for 7N ammonia program wording, customer CoA purity/particle/moisture/metal limits are absent.", "Do not derive actual output by multiplying capacity and utilization without a separately labeled model." ], "locally_archived_path": null, "locator": "PDF pp. 18–19, 27–30, 35–38, 68–75 and 89", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-03-28", "publication_date_unknown_reason": null, "publisher": "金宏气体股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-jinhong-annual-2025", "source_type": "exchange_filing", "title": "金宏气体股份有限公司2025年年度报告", "translation_en": "The filing lists ultra-pure ammonia, high-purity nitrous oxide, TEOS, high-purity CO2, hydrogen and fluorinated gases with group capacity; CH3F and C4F6 were in trial production.", "url": "https://static.cninfo.com.cn/finalpage/2026-03-28/1225047235.PDF", "label": "金宏气体股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-tongcheng-changzhou-cmp-movein-2024" ], "claimed_event_date": "2024-11-18", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "厂房已完成装修，进入设备进场阶段，计划于2025年初投产。", "id": "src-jintan-tongcheng-cmp-project-2024", "limitations": [ "The 250,000 pads/year figure was a designed full-rate target at that date, not installed, qualified, utilized or actual output." ], "locally_archived_path": null, "locator": "body lines 41–48", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2024-11-18", "publication_date_unknown_reason": null, "publisher": "常州市金坛区人民政府 / 华罗庚高新区", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-jintan-tongcheng-cmp-project-2024", "source_type": "government_project_record", "title": "华罗庚高新区：从“0”到“1” 打造半导体产业“芯”高地", "translation_en": "Factory fit-out was complete, equipment move-in had begun, and production was planned for early 2025.", "url": "https://www.jintan.gov.cn/html/czjt/2024/IJMJQALL_1118/267619.html", "label": "华罗庚高新区：从“0”到“1” 打造半导体产业“芯”高地" }, { "access_state": "open", "claim_ids": [ "clm-tianjin-jiuri-new-materials-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "公司年度报告披露光引发剂业务，并称半导体化学材料领域的光刻胶和光敏剂项目持续推进。", "id": "src-jiuri-annual-2025", "limitations": [ "Issuer-reported project and portfolio state; no named semiconductor customer, exact grade, layer, batch qualification or recurring supply relationship is disclosed." ], "locally_archived_path": null, "locator": "2025年年度报告；管理层讨论与业务部分", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-25", "publication_date_unknown_reason": null, "publisher": "天津久日新材料股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-jiuri-annual-2025", "source_type": "annual_report", "title": "天津久日新材料股份有限公司2025年年度报告", "translation_en": "The annual report describes the photoinitiator business and says photoresist and photosensitizer projects for semiconductor chemical materials continue to advance.", "url": "https://static.cninfo.com.cn/finalpage/2026-04-25/1225188188.PDF", "label": "天津久日新材料股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-giantec-juchen-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "公司产品包括EEPROM、NOR Flash、NFC及混合信号芯片。", "id": "src-juchen-profile-20260801", "limitations": [ "Historical application mentions require product and date limits; no current named supplier/customer edge is created." ], "locally_archived_path": null, "locator": "企业介绍；产品范围", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "聚辰半导体股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-juchen-profile-20260801", "source_type": "company_profile", "title": "Company Profile", "translation_en": "The company portfolio includes EEPROM, NOR Flash, NFC and mixed-signal chips.", "url": "https://www.giantec-semi.com/qyjs", "label": "Company Profile" }, { "access_state": "indexed_direct_open_error", "claim_ids": [ "clm-kehua-production-base-and-portfolio-vendor-description" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "产品覆盖KrF、I-line、G-line、紫外宽谱的光刻胶及配套试剂。", "id": "src-kehua-company-home-20260729", "limitations": [ "Direct page fetch returned an internal error; only the public search-indexed company-page text was recorded and no access control was bypassed.", "Line descriptions and address do not establish permit capacity, installed tools, current utilization, output, model-to-line mapping, named customer or qualification." ], "locally_archived_path": null, "locator": "search-indexed home-page About Us, production-base, quality and contact sections", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "北京科华微电子材料有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-kehua-company-home-20260729", "source_type": "official_company_page", "title": "北京科华微电子材料有限公司 — 关于我们 / Kempur home page", "translation_en": "Products cover KrF, I-line, G-line and broad-spectrum UV photoresists and ancillary reagents.", "url": "https://www.kempur.com/", "label": "北京科华微电子材料有限公司 — 关于我们 / Kempur home page" }, { "access_state": "open", "claim_ids": [ "clm-kehua-dk1080-catalogue-volume-claim" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The catalogue lists BN301/303/308/310, KMP E3100/E3200, EP3100/EP3200, BP212/BP218, C6111/C7500/C7300/C8300/C5300, DK1080 and CP4800 photoresists with wavelength, film-thickness, resolution or process-positioning details.", "id": "src-kehua-icmtia-product-catalogue-2026", "limitations": [ "Alliance-hosted manufacturer catalogue content is vendor-reported product evidence, not customer-side qualification evidence.", "Anonymous leading-manufacturer and volume-supply language cannot identify a legal customer, facility, quantity, qualification date or yield.", "Catalogue availability does not establish current production volume for every listed series." ], "locally_archived_path": null, "locator": "Product Description table, product rows BN301 through KMP CP4800", "original_language": "en", "primary_status": "secondary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Zhongguancun Integrated Circuit Materials Industry Technology Innovation Alliance", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-kehua-icmtia-product-catalogue-2026", "source_type": "industry_alliance_product_catalogue", "title": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue", "translation_en": "Same as original.", "url": "https://en.icmtia.com/product/348.html", "label": "Beijing Kehua Microelectronics Materials Co., Ltd. product catalogue" }, { "access_state": "open", "claim_ids": [ "clm-suzhou-kema-materials-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company describes high-purity ceramic components, powder preparation, sintering, machining, cleaning and inspection for semiconductor applications.", "id": "src-kema-profile-20260801", "limitations": [ "No named product-to-customer or product-to-fab relationship is disclosed." ], "locally_archived_path": null, "locator": "about page; capability description", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Suzhou Kema Materials Technology Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-kema-profile-20260801", "source_type": "company_profile", "title": "About Kema", "translation_en": "The company describes high-purity ceramic components, powder preparation, sintering, machining, cleaning and inspection for semiconductor applications.", "url": "https://kematek-en.com/about/", "label": "About Kema" }, { "access_state": "open", "claim_ids": [ "clm-kfmi-legal-identity", "clm-kfmi-purity-capabilities" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司列示靶材用超高纯铜达到6N、高纯铝和钛达到5N、钽达到4N的提纯能力。", "id": "src-kfmi-home-purity", "limitations": [ "Purity capability is not a lot CoA, target drawing, named customer qualification or process-layer receipt." ], "locally_archived_path": null, "locator": "五大核心技术；高纯金属纯度控制及提纯技术", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "宁波江丰电子材料股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-kfmi-home-purity", "source_type": "company_technology_page", "title": "宁波江丰电子材料股份有限公司", "translation_en": "The company lists purification capability of 6N copper, 5N aluminium and titanium, and 4N tantalum for target materials.", "url": "https://www.kfmic.com/", "label": "宁波江丰电子材料股份有限公司" }, { "access_state": "open", "claim_ids": [ "clm-kfmi-ssmc-sustained-supply", "clm-relationship-kfmi-supplies-ssmc-targets-parts" ], "claimed_event_date": "2024-08-29", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司称已连续16年向SSMC供应溅射靶材及设备零部件，并获最佳供应商奖。", "id": "src-kfmi-ssmc-award-2024", "limitations": [ "Supplier-side statement; exact target metal/grade/model, equipment-part SKU, quantity and process layer are absent." ], "locally_archived_path": null, "locator": "正文；合作年限、产品范围和奖项段落", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2024-08-29", "publication_date_unknown_reason": null, "publisher": "宁波江丰电子材料股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-kfmi-ssmc-award-2024", "source_type": "company_customer_announcement", "title": "江丰电子荣获SSMC“最佳供应商奖”", "translation_en": "The vendor says it supplied sputtering targets and equipment parts to SSMC for 16 consecutive years and received a best-supplier award.", "url": "https://www.kfmic.com/?news_13%2F634.html=", "label": "江丰电子荣获SSMC“最佳供应商奖”" }, { "access_state": "open", "claim_ids": [ "clm-kingsemi-equipment-business" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司为半导体专用设备企业。", "id": "src-kingsemi-annual-2025", "limitations": [ "The summary does not establish scanner pairing, installed base, site acceptance, or qualified production layer." ], "locally_archived_path": null, "locator": "第二节，公司基本情况", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-18", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-kingsemi-annual-2025", "source_type": "exchange_filing", "title": "沈阳芯源微电子设备股份有限公司2025年年度报告摘要", "translation_en": "The issuer is a semiconductor-equipment company.", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-18/688037_20260418_OATI.pdf", "label": "沈阳芯源微电子设备股份有限公司2025年年度报告摘要" }, { "access_state": "open", "claim_ids": [ "clm-kingsemi-ks-ft200-300-catalogue" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "KS-FT200/300适用于8/12寸前道晶圆涂胶显影工艺，可配置ArF、KrF、I-Line及多种功能材料模块。", "id": "src-kingsemi-ks-ft200-300", "limitations": [ "Catalogue capability only; it must not be joined to the unnamed model delivered to Silan Jike." ], "locally_archived_path": null, "locator": "产品介绍、特点及参数", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "沈阳芯源微电子设备股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-kingsemi-ks-ft200-300", "source_type": "company_product_page", "title": "KS-FT200/300 前道8/12寸涂胶显影机", "translation_en": "The KS-FT200/300 catalogue entry covers 8/12-inch front-end coat/develop processing for ArF, KrF, i-line and several functional materials.", "url": "https://www.kingsemi.com/index.php/Product/detail?id=221", "label": "KS-FT200/300 前道8/12寸涂胶显影机" }, { "access_state": "open", "claim_ids": [ "clm-kingsemi-krf-track-silan-jike-movein", "clm-relationship-kingsemi-supplies-silan-jike-krf-2022" ], "claimed_event_date": "2022-06-10", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "沈阳芯源12寸KrF涂胶显影设备顺利入驻厦门士兰集科；作为士兰集科引入的首台国产高产能KrF涂胶显影机台。", "id": "src-kingsemi-silan-jike-krf-2022", "limitations": [ "No model, serial, purchase record, installation completion, site acceptance, named layer, throughput, uptime or yield is disclosed." ], "locally_archived_path": null, "locator": "正文；搬入和交付段落", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2022-06-10", "publication_date_unknown_reason": null, "publisher": "沈阳芯源微电子设备股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-kingsemi-silan-jike-krf-2022", "source_type": "company_customer_announcement", "title": "同“芯”聚力，共创辉煌——沈阳芯源KrF涂胶显影机台入驻士兰集科暨双方达成战略合作关系", "translation_en": "A Kingsemi 12-inch KrF coat/develop tool moved into Xiamen Silan Jike; the vendor called it that customer's first domestic high-throughput KrF track.", "url": "https://www.kingsemi.com/index.php/News/detail?id=160", "label": "同“芯”聚力，共创辉煌——沈阳芯源KrF涂胶显影机台入驻士兰集科暨双方达成战略合作关系" }, { "access_state": "open", "claim_ids": [ "clm-shanghai-kingstone-semiconductor-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company describes ion implanters for logic, memory, power, analog and image-sensor manufacturing.", "id": "src-kingstone-profile-20260801", "limitations": [ "System counts, manufacturer counts and wafer volumes are anonymous and company-reported; no named customer or accepted tool edge is created." ], "locally_archived_path": null, "locator": "about page; product and deployment statements", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Shanghai Kingstone Semiconductor Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-kingstone-profile-20260801", "source_type": "company_profile", "title": "About Kingstone Semiconductor", "translation_en": "The company describes ion implanters for logic, memory, power, analog and image-sensor manufacturing.", "url": "https://www.kingstonesemi.com/en/about", "label": "About Kingstone Semiconductor" }, { "access_state": "open", "claim_ids": [ "clm-kunlun-k200-specification" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "K200采用14nm和2.5D封装，配置16GB HBM、512GB/s带宽，功耗150W。", "id": "src-kunlun-k200-product", "limitations": [ "Foundry, OSAT/interposer, HBM generation/supplier/stack, yield, units and named customer are undisclosed." ], "locally_archived_path": null, "locator": "product specification table", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "昆仑芯（北京）科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-kunlun-k200-product", "source_type": "company_product_page", "title": "K200", "translation_en": "K200 lists 14 nm, 2.5D packaging, 16 GB HBM, 512 GB/s and 150 W.", "url": "https://www.kunlunxin.com/product/686.html", "label": "K200" }, { "access_state": "open", "claim_ids": [ "clm-kunlun-p800-cmb-award-and-test", "clm-relationship-cmb-validates-kunlun-p800-vendor-reported" ], "claimed_event_date": "2025-03-27", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司称昆仑芯服务器中标招商银行AI芯片资源项目，P800完成应用测试。", "id": "src-kunlun-p800-cmb-20250327", "limitations": [ "Vendor-origin award; tender number, contract, quantity, delivery, installation and customer acceptance are undisclosed." ], "locally_archived_path": null, "locator": "headline and body", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-03-27", "publication_date_unknown_reason": null, "publisher": "昆仑芯（北京）科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-kunlun-p800-cmb-20250327", "source_type": "company_customer_announcement", "title": "昆仑芯中标招商银行AI芯片资源项目", "translation_en": "The vendor reports a CMB AI-chip-resource project award and P800 application testing.", "url": "https://www.kunlunxin.com/news/4469.html", "label": "昆仑芯中标招商银行AI芯片资源项目" }, { "access_state": "open", "claim_ids": [ "clm-kunlun-r200-specification" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "R200/R200-8F采用7nm，16GB或32GB GDDR6，带宽512GB/s，INT8 256TOPS，FP16 128TFLOPS。", "id": "src-kunlun-r200-product", "limitations": [ "Foundry, GDDR6 supplier, OSAT, units, named customer and workload receipt are undisclosed." ], "locally_archived_path": null, "locator": "product specification table", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "昆仑芯（北京）科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-kunlun-r200-product", "source_type": "company_product_page", "title": "R200", "translation_en": "R200/R200-8F lists 7 nm, 16/32 GB GDDR6, 512 GB/s, INT8 256 TOPS and FP16 128 TFLOPS.", "url": "https://www.kunlunxin.com/product/274.html", "label": "R200" }, { "access_state": "open", "claim_ids": [ "clm-kunlunxin-identity-r200-k200-specifications" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "网站页脚主体为昆仑芯（北京）科技股份有限公司。", "id": "src-kunlunxin-home", "limitations": [ "Legal identity only." ], "locally_archived_path": null, "locator": "current site footer/legal identity", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "昆仑芯（北京）科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-kunlunxin-home", "source_type": "company_home_page", "title": "昆仑芯官网", "translation_en": "The site footer identifies Kunlunxin (Beijing) Technology Co., Ltd.", "url": "https://www.kunlunxin.com/", "label": "昆仑芯官网" }, { "access_state": "open", "claim_ids": [ "clm-relationship-li-auto-2021-li-one-integrates-journey3" ], "claimed_event_date": "2021-05-25", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The 2021 Li ONE comes equipped with two Horizon Robotics Journey 3 AI acceleration processors for autonomous driving.", "id": "src-li-auto-2021q1-results-20210526", "limitations": [ "Horizon's contracting legal entity, chip purchase quantity, supplier contract, manufacturing facility and accepted-system test are undisclosed." ], "locally_archived_path": null, "locator": "product section beginning 'The 2021 Li ONE comes equipped'", "original_language": "en", "primary_status": "primary", "publication_date": "2021-05-26", "publication_date_unknown_reason": null, "publisher": "Li Auto Inc.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-li-auto-2021q1-results-20210526", "source_type": "company_financial_results", "title": "Li Auto Inc. 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Announces Unaudited Third Quarter 2021 Financial Results", "translation_en": "Same as original.", "url": "https://ir.lixiang.com/news-releases/news-release-details/li-auto-inc-announces-unaudited-third-quarter-2021-financial/", "label": "Li Auto Inc. Announces Unaudited Third Quarter 2021 Financial Results" }, { "access_state": "open", "claim_ids": [ "clm-relationship-li-auto-2021-li-one-integrates-journey3" ], "claimed_event_date": "2021-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Li Auto delivered 14,087 Li ONEs in December and 35,221 in the fourth quarter of 2021.", "id": "src-li-auto-dec-deliveries-20220101", "limitations": [ "The page does not independently repeat the Journey 3 configuration; the integration join is limited to the explicitly named 2021 Li ONE generation." ], "locally_archived_path": null, "locator": "body lines 48–61", "original_language": "en", "primary_status": "primary", "publication_date": "2022-01-01", "publication_date_unknown_reason": null, "publisher": "Li Auto Inc.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-li-auto-dec-deliveries-20220101", "source_type": "company_delivery_update", "title": "Li Auto Inc. December 2021 Delivery Update", "translation_en": "Same as original.", "url": "https://ir.lixiang.com/news-releases/news-release-details/li-auto-inc-december-2021-delivery-update", "label": "Li Auto Inc. December 2021 Delivery Update" }, { "access_state": "open", "claim_ids": [ "clm-skhynix-dalian-current-legal-entity" ], "claimed_event_date": "2026-06-12", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "爱思开海力士半导体存储技术（大连）有限公司", "id": "src-liaoning-skhynix-dalian-2026", "limitations": [ "The government record confirms the current Chinese legal name only; it does not identify fab title, capacity, product generation, utilization, output, yield or supplier BOM." ], "locally_archived_path": null, "locator": "招聘会参会企业名单", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-06-15", "publication_date_unknown_reason": null, "publisher": "辽宁省人民政府", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-liaoning-skhynix-dalian-2026", "source_type": "government_employment_record", "title": "3000余岗位助力大学生留辽来辽", "translation_en": "SK hynix semiconductor storage technology (Dalian) Co., Ltd.", "url": "https://www.ln.gov.cn/web/qmzx/yhyshjzt/dt/2026061509212657810/index.shtml", "label": "3000余岗位助力大学生留辽来辽" }, { "access_state": "open", "claim_ids": [ "clm-smee-ssc800-buyer-identity-correlation-2026" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "上海市闵行区合川路2380号37号楼；临港实验室版权所有。", "id": "src-lingang-laboratory-contact-20260729", "limitations": [ "The page does not mention the masked buyer alias or SSC800/10." ], "locally_archived_path": null, "locator": "site footer and page metadata", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "临港实验室", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-lingang-laboratory-contact-20260729", "source_type": "official_laboratory_contact_page", "title": "联系方式", "translation_en": "Building 37, No. 2380 Hechuan Road, Minhang District, Shanghai; copyright Lingang Laboratory.", "url": "https://www.lglab.ac.cn/xxgk/xxgklxfs/", "label": "联系方式" }, { "access_state": "open", "claim_ids": [ "clm-smee-ssc800-buyer-identity-correlation-2026" ], "claimed_event_date": "2025-01-09", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "合川路2380号37号楼；艾老师021-64220895；王老师021-64220901。", "id": "src-lingang-laboratory-procurement-contact-20250109", "limitations": [ "This page is not about SSC800/10 and supports only identity correlation, not the equipment relationship." ], "locally_archived_path": null, "locator": "section V, submission location and contacts 1–2", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-01-09", "publication_date_unknown_reason": null, "publisher": "临港实验室", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-lingang-laboratory-procurement-contact-20250109", "source_type": "official_laboratory_procurement_notice", "title": "临港实验室科研物资采购服务平台2025-2027年度供应商公开遴选项目公告", "translation_en": "No. 2380 Hechuan Road, Building 37; Teacher Ai 021-64220895; Teacher Wang 021-64220901.", "url": "https://www.lglab.ac.cn/xwdt/tzgg/202501/t20250109_308408.html", "label": "临港实验室科研物资采购服务平台2025-2027年度供应商公开遴选项目公告" }, { "access_state": "open", "claim_ids": [ "clm-hangzhou-lion-electronics-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company describes semiconductor materials and power-chip design, development, manufacturing and sales.", "id": "src-lion-micro-profile-20260801", "limitations": [ "No named accelerator product, exact facility, process, customer, order or qualified supply relationship is disclosed." ], "locally_archived_path": null, "locator": "company profile; business scope", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "杭州立昂微电子股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-lion-micro-profile-20260801", "source_type": "company_profile", "title": "About Lion Micro", "translation_en": "The company describes semiconductor materials and power-chip design, development, manufacturing and sales.", "url": "https://www.li-on.com/about/", "label": "About Lion Micro" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-longsys" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "FORESEE；Zilia（智忆巴西）；Lexar雷克沙", "id": "src-longsys-brands", "limitations": [ "A brand is not a separate legal entity unless independently registered and recorded." ], "locally_archived_path": null, "locator": "Brand introduction sections", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-06-01", "publication_date_unknown_reason": null, "publisher": "深圳市江波龙电子股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-longsys-brands", "source_type": "official_company_page", "title": "品牌介绍", "translation_en": "FORESEE; Zilia; Lexar.", "url": "https://cn.longsys.com/about/news/13956.html", "label": "品牌介绍" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-longsys" ], "claimed_event_date": "2022-08-05", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "深圳市江波龙电子股份有限公司；股票代码为301308", "id": "src-longsys-listing", "limitations": [], "locally_archived_path": null, "locator": "Opening paragraph", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2022-08-05", "publication_date_unknown_reason": null, "publisher": "深圳市江波龙电子股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-longsys-listing", "source_type": "official_company_release", "title": "江波龙首次公开发行股票，正式登陆深交所A股创业板", "translation_en": "Shenzhen Longsys Electronics Co., Ltd.; stock code 301308.", "url": "https://cn.longsys.com/about/news/1719.html", "label": "江波龙首次公开发行股票，正式登陆深交所A股创业板" }, { "access_state": "open", "claim_ids": [ "clm-maxio-technology-hangzhou-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "公司从事SATA、PCIe和UFS存储控制芯片以及数据管理SoC的研发。", "id": "src-maxio-profile-20260801", "limitations": [ "Controller design is not NAND or DRAM wafer fabrication; foundry, OSAT and named product/customer links remain undisclosed." ], "locally_archived_path": null, "locator": "公司简介；产品范围", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "联芸科技（杭州）股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-maxio-profile-20260801", "source_type": "company_profile", "title": "About Maxio", "translation_en": "The company develops SATA, PCIe and UFS storage-controller chips and data-management systems-on-chip.", "url": "https://www.maxio-tech.com/about/intro.html", "label": "About Maxio" }, { "access_state": "open", "claim_ids": [ "clm-memblaze-ymtc-bom", "clm-relationship-memblaze-integrates-ymtc-nand" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "PBlaze6 6541采用长江存储Xtacking架构3D NAND。", "id": "src-memblaze-ymtc-pblaze6", "limitations": [ "Direct product BOM join for NAND only; controller, PMIC, firmware component origins and shipment volume are not fully disclosed." ], "locally_archived_path": null, "locator": "产品规格与介质说明", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "北京忆恒创源科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-memblaze-ymtc-pblaze6", "source_type": "company_product_page", "title": "PBlaze6 6541 Enterprise SSD", "translation_en": "PBlaze6 6541 uses YMTC Xtacking-architecture 3D NAND.", "url": "https://www.memblaze.com/product/pblaze6/639.html", "label": "PBlaze6 6541 Enterprise SSD" }, { "access_state": "open", "claim_ids": [ "clm-metax-identity-products-and-production-dates" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "产品包括C500/C600、N100/N260/N300、G100；N100于2023年4月正式量产，C500于2024年2月正式量产。", "id": "src-metax-annual-2025", "limitations": [ "Fabless contractors are unnamed; 2025 board-sales totals are family-category totals, not model-specific.", "Overseas HBM, EDA and interface-IP suppliers are not named." ], "locally_archived_path": null, "locator": "PDF pp. 18–19, 35 and 39", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-03-27", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-metax-annual-2025", "source_type": "exchange_filing", "title": "沐曦集成电路（上海）股份有限公司2025年年度报告", "translation_en": "The portfolio includes C500/C600, N100/N260/N300 and G100; N100 entered formal mass production in April 2023 and C500 in February 2024.", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-27/688802_20260327_0HOB.pdf", "label": "沐曦集成电路（上海）股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-metax-identity-products-and-production-dates" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "MetaX Integrated Circuits (Shanghai) Co., Ltd.", "id": "src-metax-legal", "limitations": [ "English legal-name receipt only." ], "locally_archived_path": null, "locator": "legal statement body", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "MetaX Integrated Circuits (Shanghai) Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-metax-legal", "source_type": "company_legal_page", "title": "Legal Statement", "translation_en": "Same as original.", "url": "https://www.metax-tech.com/en/index/statement.html", "label": "Legal Statement" }, { "access_state": "open", "claim_ids": [ "clm-montage-mxc-specs" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "M88MX6852 supports CXL 1.1/2.0/3.2, x8 or 2x4, up to 64 GT/s and DDR5.", "id": "src-montage-mxc-official", "limitations": [ "Product availability does not prove deployment in a named accelerator, p50/p99 latency, energy, contention, or recovery." ], "locally_archived_path": null, "locator": "product table", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "澜起科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-montage-mxc-official", "source_type": "company_product_page", "title": "MXC Memory Expansion Controller", "translation_en": "Same as original.", "url": "https://www.montage-tech.com/index.php/MXC", "label": "MXC Memory Expansion Controller" }, { "access_state": "open", "claim_ids": [ "clm-moore-threads-identity-and-fabless-model" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "产品包括MTT S5000/S4000/S3000、D800及KUAE；公司采用Fabless模式，制造、封测及板卡加工委托未具名供应商。", "id": "src-moore-threads-annual-2025", "limitations": [ "Foundry, OSAT, board maker, memory supplier and customer names are undisclosed." ], "locally_archived_path": null, "locator": "PDF pp. 18–24", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-27", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-moore-threads-annual-2025", "source_type": "exchange_filing", "title": "摩尔线程智能科技（北京）股份有限公司2025年年度报告", "translation_en": "Products include MTT S5000/S4000/S3000, D800 and KUAE; wafer, packaging/test and board processing are outsourced to unnamed vendors.", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-04-27/688795_20260427_CUNP.pdf", "label": "摩尔线程智能科技（北京）股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-moore-threads-identity-and-fabless-model" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Moore Threads Technology Co., Ltd.", "id": "src-moore-threads-legal", "limitations": [ "English legal-name receipt only." ], "locally_archived_path": null, "locator": "legal page body/footer", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Moore Threads Technology Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-moore-threads-legal", "source_type": "company_legal_page", "title": "Compliance / Legal", "translation_en": "Same as original.", "url": "https://en.mthreads.com/legal/compliance", "label": "Compliance / Legal" }, { "access_state": "open", "claim_ids": [ "clm-moore-threads-identity-and-fabless-model" ], "claimed_event_date": "2025-12-05", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司中文名称为摩尔线程智能科技（北京）股份有限公司，股票代码688795。", "id": "src-moore-threads-listing-2025", "limitations": [ "Legal/listing identity only." ], "locally_archived_path": null, "locator": "listing notice body; legal identity and listing date", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-12-04", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-moore-threads-listing-2025", "source_type": "exchange_listing_notice", "title": "摩尔线程智能科技（北京）股份有限公司股票科创板上市公告书", "translation_en": "The issuer is Moore Threads Technology (Beijing) Co., Ltd., ticker 688795.", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/announcement/listing/ipo/c/c_20251204_10800678.shtml", "label": "摩尔线程智能科技（北京）股份有限公司股票科创板上市公告书" }, { "access_state": "open", "claim_ids": [ "clm-moore-threads-s5000-pinghu-and-huishan-deployment" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "MTT S5000基于平湖架构。", "id": "src-moore-threads-s5000-product", "limitations": [ "No foundry, memory supplier, OSAT, facility, deployment or independent workload receipt." ], "locally_archived_path": null, "locator": "product overview and S5000/PH100/Pinghu identification", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "摩尔线程", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-moore-threads-s5000-product", "source_type": "company_product_page", "title": "MTT S5000", "translation_en": "MTT S5000 is based on the Pinghu architecture.", "url": "https://www.mthreads.com/product/S5000", "label": "MTT S5000" }, { "access_state": "open", "claim_ids": [ "clm-nata-electronic-gas-grades" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "产品卡列示电子级SF6 5N、NF3 4.6N、PH3/AsH3吸附气源及高纯PH3、AsH3等牌号和包装规格。", "id": "src-nata-electronic-gases", "limitations": [ "No impurity-by-element, moisture/oxygen/particle limits, CoA, named fab, qualified layer or shipment quantity." ], "locally_archived_path": null, "locator": "七个产品卡；牌号、CAS和包装字段", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "江苏南大光电材料股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-nata-electronic-gases", "source_type": "company_product_page", "title": "电子特气", "translation_en": "Product cards list electronic-grade SF6 5N, NF3 4.6N, adsorbed PH3/AsH3 sources and high-purity PH3/AsH3 grades with delivery forms.", "url": "https://www.natachem.com/dianziteqi/", "label": "电子特气" }, { "access_state": "open", "claim_ids": [ "clm-nata-metalorganic-catalogue" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "产品卡列示TMGa、TMIn、TMAl和TEGa，牌号标注为Adduct或Semi。", "id": "src-nata-mo-sources", "limitations": [ "Adduct/Semi are not numeric purity specifications; no CoA, named customer, facility or qualification." ], "locally_archived_path": null, "locator": "TMGa、TMIn、TMAl、TEGa产品卡", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "江苏南大光电材料股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-nata-mo-sources", "source_type": "company_product_page", "title": "MO源", "translation_en": "Product cards list TMGa, TMIn, TMAl and TEGa with vendor labels Adduct or Semi.", "url": "https://www.natachem.com/moyuan", "label": "MO源" }, { "access_state": "open", "claim_ids": [ "clm-naura-packaging-catalogue-model-identifiers" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "先进封装目录列示PSE V300、ACE I300(V)、HSE D300、HSE P300、BMD P300、Ausip T830、SUMERIS AP302C等型号。", "id": "src-naura-advanced-packaging-catalogue", "limitations": [ "Catalogue/model identity only; 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page-level production/baseline language cannot be inherited by an individual model." ], "locally_archived_path": null, "locator": "产品分类和型号列表", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "北方华创科技集团股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-naura-ic-equipment-catalogue", "source_type": "company_product_page", "title": "集成电路装备", "translation_en": "The catalogue lists named equipment models across etch, PVD, CVD/ALD, wet clean, furnace, ion implant, RTP and epitaxy.", "url": "https://www.naura.com/product/details_83_1602.html", "label": "集成电路装备" }, { "access_state": "open", "claim_ids": [ "clm-relationship-51world-supports-mt-s5000-simone4" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "51WORLD SimOne 4.0与摩尔线程S5000完成系统适配和优化。", "id": "src-ncsti-s5000-simone-20260226", "limitations": [ "Compatibility/validation receipt only; purchase, quantity, installation site and production use are undisclosed." ], "locally_archived_path": null, "locator": "body lines 153–175", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-02-26", "publication_date_unknown_reason": null, "publisher": "中关村国家自主创新示范区展示中心", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-ncsti-s5000-simone-20260226", "source_type": "government_innovation_record", "title": "国产GPU与自动驾驶仿真平台完成系统适配", "translation_en": "51WORLD SimOne 4.0 completed systematic adaptation and optimization for Moore Threads S5000.", "url": "https://www.ncsti.gov.cn/kjdt/scyq/zgckxc/zgcdt/202602/t20260226_239035.html", "label": "国产GPU与自动驾驶仿真平台完成系统适配" }, { "access_state": "open", "claim_ids": [ "clm-netac-technology-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company portfolio includes memory modules, SSDs, external storage, USB drives and memory cards.", "id": "src-netac-profile-20260801", "limitations": [ "The portfolio supports a module and storage-product vendor, not a memory-wafer fab or a named upstream relationship." ], "locally_archived_path": null, "locator": "company and product overview", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Netac Technology Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-netac-profile-20260801", "source_type": "company_profile", "title": "Netac Technology", "translation_en": "The company portfolio includes memory modules, SSDs, external storage, USB drives and memory cards.", "url": "https://www.netac.com/", "label": "Netac Technology" }, { "access_state": "open", "claim_ids": [ "clm-shenzhen-newway-photomask-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company describes photomasks for integrated-circuit manufacturing, semiconductor devices and advanced packaging; its Suzhou project describes a 130 to 28 nanometer range.", "id": "src-newway-photomask-profile-20260801", "limitations": [ "The process range is company-reported and does not identify a named fab, mask set, qualified layer or production volume." ], "locally_archived_path": null, "locator": "company and project overview", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Shenzhen Newway Photomask Making Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-newway-photomask-profile-20260801", "source_type": "company_profile", "title": "Newway Photomask", "translation_en": "The company describes photomasks for integrated-circuit manufacturing, semiconductor devices and advanced packaging; its Suzhou project describes a 130 to 28 nanometer range.", "url": "https://www.newwaymask.com/en/", "label": "Newway Photomask" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-nexchip-hefei" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Nexchip Semiconductor Corporation", "id": "src-nexchip-profile-en", "limitations": [ "The founding joint-venture statement is not proof of the current controlling shareholder." ], "locally_archived_path": null, "locator": "Page heading and first paragraph", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Nexchip Semiconductor Corporation", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-nexchip-profile-en", "source_type": "official_company_page", "title": "Corporate Profile", "translation_en": "Same as original.", "url": "https://www.nexchip.com.cn/en-us/About/Introduce", "label": "Corporate Profile" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-nexchip-hefei" ], "claimed_event_date": "2023-05-05", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "合肥晶合集成电路股份有限公司；证券代码为688249", "id": "src-nexchip-sse-listing", "limitations": [ "The company's July 2026 Hong Kong listing is mentioned on its current profile, but its HKEX code was not closed in this lane." ], "locally_archived_path": null, "locator": "Notice body", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2023-05-04", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-nexchip-sse-listing", "source_type": "exchange_notice", "title": "关于合肥晶合集成电路股份有限公司人民币普通股股票科创板上市交易的公告", "translation_en": "Hefei Nexchip Integrated Circuit Co., Ltd.; security code 688249.", "url": "https://www.sse.com.cn/disclosure/announcement/listing/ipo/c/c_20230504_89473619.shtml", "label": "关于合肥晶合集成电路股份有限公司人民币普通股股票科创板上市交易的公告" }, { "access_state": "open", "claim_ids": [ "clm-nio-et9-integrates-two-nx9031" ], "claimed_event_date": "2025-03-29", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Since the delivery of the ET9 on March 29 ... proprietary smart driving chip Shenji NX9031 ... Two of the chips have been integrated into every ET9.", "id": "src-nio-auto-shanghai-20250423", "limitations": [ "No delivered ET9 count, manufacturing legal entity/facility, foundry, OSAT, package, yield or field-reliability receipt.", "NIO's mass-production wording is vendor language; the source proves delivery start and two-chip integration only." ], "locally_archived_path": null, "locator": "body lines 78–105; ET9/NX9031 paragraphs at lines 85–93 and 101–105", "original_language": "en", "primary_status": "primary", "publication_date": "2025-04-23", "publication_date_unknown_reason": null, "publisher": "NIO Inc.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-nio-auto-shanghai-20250423", "source_type": "company_customer_press_release", "title": "NIO Showcases Its Three EV Brands at Auto Shanghai 2025", "translation_en": "Same as original.", "url": "https://www.nio.com/news/20250423001", "label": "NIO Showcases Its Three EV Brands at Auto Shanghai 2025" }, { "access_state": "open", "claim_ids": [ "clm-genitech-2026-chip-business-control" ], "claimed_event_date": "2026-02-26", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "GeniTech Co., Ltd. (Shenji), a subsidiary of the Company, is primarily responsible for NIO’s intelligent-driving chip business; a NIO subsidiary would continue to hold 62.7%.", "id": "src-nio-genitech-investment-20260226", "limitations": [ "The disclosure post-dates ET9 launch and does not establish the historical assignee, designer or manufacturer of each NX9031 die.", "The immediate NIO legal shareholder is unnamed." ], "locally_archived_path": null, "locator": "body lines 65–78, especially 72–75", "original_language": "en", "primary_status": "primary", "publication_date": "2026-02-26", "publication_date_unknown_reason": null, "publisher": "NIO Inc.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-nio-genitech-investment-20260226", "source_type": "company_investor_release", "title": "NIO Inc.’s Subsidiary Enters into Definitive Agreements for RMB2.257 Billion Investment", "translation_en": "Same as original.", "url": "https://ir.nio.com/zh-hans/news-releases/news-release-details/nio-incs-subsidiary-enters-definitive-agreements-rmb2257-billion", "label": "NIO Inc.’s Subsidiary Enters into Definitive Agreements for RMB2.257 Billion Investment" }, { "access_state": "open", "claim_ids": [ "clm-jiangsu-novoray-lianrui-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The portfolio includes crystalline, fused and spherical silica, spherical alumina and other electronic materials.", "id": "src-novoray-profile-20260801", "limitations": [ "No named package, customer, exact material grade, qualification or production allocation is disclosed." ], "locally_archived_path": null, "locator": "company profile; product portfolio", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Jiangsu NOVORAY New Material Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-novoray-profile-20260801", "source_type": "company_profile", "title": "About NOVORAY", "translation_en": "The portfolio includes crystalline, fused and spherical silica, spherical alumina and other electronic materials.", "url": "https://www.novoray.com/en/index.php/about/index/id/7.html", "label": "About NOVORAY" }, { "access_state": "open", "claim_ids": [ "clm-nsig-group-300mm-capacity" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "上海、太原两地300mm硅片产能达到85万片/月。", "id": "src-nsig-capacity-2025", "limitations": [ "Group capacity is not installed-tool count, qualified output, actual output, utilization, yield or fab-specific capacity." ], "locally_archived_path": null, "locator": "2025 operating-results and capacity paragraph", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-17", "publication_date_unknown_reason": null, "publisher": "上海硅产业集团股份有限公司 via 巨潮资讯网", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-nsig-capacity-2025", "source_type": "exchange_filing", "title": "上海硅产业集团股份有限公司2026年度“提质增效重回报”行动方案", "translation_en": "The group says Shanghai and Taiyuan 300 mm silicon-wafer capacity reached 850,000 wafers per month.", "url": "https://static.cninfo.com.cn/finalpage/2026-04-17/1225114299.PDF", "label": "上海硅产业集团股份有限公司2026年度“提质增效重回报”行动方案" }, { "access_state": "open", "claim_ids": [ "clm-relationship-nsig-owns-xinsheng-jingke", "clm-xinsheng-jingke-utilization-2024" ], "claimed_event_date": "2024-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "新昇晶科2024年产能利用率88.11%；主要设备供应商因商业秘密匿名披露。", "id": "src-nsig-inquiry-2025", "limitations": [ "Equipment vendors and a domestic polysilicon supplier are anonymized; forecasts are not actual production." ], "locally_archived_path": null, "locator": "PDF pp. 11-12, 28-29, 65-68, 95-96", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-09-01", "publication_date_unknown_reason": null, "publisher": "上海证券交易所 / 立信会计师事务所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-nsig-inquiry-2025", "source_type": "exchange_filing", "title": "关于上海硅产业集团股份有限公司发行股份及支付现金购买资产并募集配套资金申请审核问询函的回复", "translation_en": "Xinsheng Jingke's 2024 utilization was 88.11%; major equipment suppliers were anonymized.", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202509/688126_20250901_U2SY.pdf", "label": "关于上海硅产业集团股份有限公司发行股份及支付现金购买资产并募集配套资金申请审核问询函的回复" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-willsemi" ], "claimed_event_date": "2025-11-12", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "OmniVision Integrated Circuits Group, Inc.", "id": "src-omnivision-current", "limitations": [ "The page does not explain all legal subsidiaries operating under the OMNIVISION brand." ], "locally_archived_path": null, "locator": "Release title and body", "original_language": "en", "primary_status": "primary", "publication_date": "2025-11-12", "publication_date_unknown_reason": null, "publisher": "OMNIVISION", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-omnivision-current", "source_type": "official_company_release", "title": "OmniVision Integrated Circuits Group, Inc. Appointment of a New General Manager and Legal Representative", "translation_en": "Same as original.", "url": "https://www.ovt.com/press-releases/omnivision-integrated-circuits-group-inc-appointment-of-a-new-general-manager-and-legal-representative/", "label": "OmniVision Integrated Circuits Group, Inc. 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Founded ... Acquired by Will Semiconductor", "id": "src-ovt-history", "limitations": [ "The page does not provide a current legal subsidiary register or prove the immediate ownership chain." ], "locally_archived_path": null, "locator": "Technology Milestones, 1995 and 2019", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "OMNIVISION", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-ovt-history", "source_type": "official_company_page", "title": "About Us", "translation_en": "Same as original.", "url": "https://www.ovt.com/company/about-us/", "label": "About Us" }, { "access_state": "open", "claim_ids": [ "clm-payton-technology-shenzhen-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company describes DRAM and NAND packaging and testing capabilities, including DDR and SSD products.", "id": "src-payton-profile-20260801", "limitations": [ "Production figures are company-reported; no named customer, exact device, package flow, facility allocation or accepted shipment edge is disclosed." ], "locally_archived_path": null, "locator": "company profile PDF; capability overview", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Payton Technology (Shenzhen) Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-payton-profile-20260801", "source_type": "company_profile", "title": "Payton Technology Company Profile", "translation_en": "The company describes DRAM and NAND packaging and testing capabilities, including DDR and SSD products.", "url": "https://en.kaifa.cn/uploadfiles/2020/09/20200921165222583.pdf", "label": "Payton Technology Company Profile" }, { "access_state": "open", "claim_ids": [ "clm-cssc-handan-peric-special-gases-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company lists electronic specialty gases including nitrogen trifluoride, tungsten hexafluoride and hydrogen chloride for logic, DRAM and 3D NAND processes.", "id": "src-peric-special-gases-profile-20260801", "limitations": [ "Process fit does not prove a named fab, exact grade, qualified layer, capacity allocation or recurring supply edge." ], "locally_archived_path": null, "locator": "product portfolio and application descriptions", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "中船（邯郸）派瑞特种气体股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-peric-special-gases-profile-20260801", "source_type": "company_profile", "title": "PERIC Special Gases", "translation_en": "The company lists electronic specialty gases including nitrogen trifluoride, tungsten hexafluoride and hydrogen chloride for logic, DRAM and 3D NAND processes.", "url": "https://www.pericsg.com/", "label": "PERIC Special Gases" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-phichem" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "PhiChem Corporation ... 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exact model, facility, process layer, installation, acceptance, uptime and yield are not disclosed." ], "locally_archived_path": null, "locator": "PDF pages 94, 130-132; customer/product and top-customer tables", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2021-11-05", "publication_date_unknown_reason": null, "publisher": "拓荆科技股份有限公司 via 上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-piotech-prospectus-2021", "source_type": "exchange_filing", "title": "拓荆科技股份有限公司招股说明书（注册稿）", "translation_en": "The company's products have been used on production lines of SMIC, Hua Hong Group, YMTC and CXMT.", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202111/000996_20211105_MYB4.pdf", "label": "拓荆科技股份有限公司招股说明书（注册稿）" }, { "access_state": "open", "claim_ids": [ "clm-piotech-timeline-model-milestones" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "时间轴分别记录混合键合设备订单、D2W设备出货、W2W设备客户验证及若干具名沉积设备里程碑。", "id": "src-piotech-timeline-2026", "limitations": [ "Anonymous events cannot be joined to a catalogue model unless the timeline names that model." ], "locally_archived_path": null, "locator": "2023-03、2023-06、2024-12、2025-04、2025-07时间轴条目", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "拓荆科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-piotech-timeline-2026", "source_type": "company_timeline", "title": "发展历程", "translation_en": "The timeline separately records hybrid-bonding orders, a D2W shipment, W2W customer validation and several named deposition-tool milestones.", "url": "https://www.piotech.cn/index.php/About/about3", "label": "发展历程" }, { "access_state": "open", "claim_ids": [ "clm-pnc-process-systems-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The group describes process equipment, high-purity processing systems and electronic materials for integrated-circuit manufacturing.", "id": "src-pncs-group-profile-20260801", "limitations": [ "Shipment counts are company-reported; exact customer, product, facility, order and acceptance records are not disclosed." ], "locally_archived_path": null, "locator": "group profile; brand and capability sections", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "PNC Process Systems Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-pncs-group-profile-20260801", "source_type": "company_profile", "title": "PNC Group Profile", "translation_en": "The group describes process equipment, high-purity processing systems and electronic materials for integrated-circuit manufacturing.", "url": "https://en.pncs.cn/brand/index.html", "label": "PNC Group Profile" }, { "access_state": "open", "claim_ids": [ "clm-powev-jiahe-jinwei-brand-unresolved-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "公司介绍DRAM和NAND器件与模组、封装测试能力以及Asgard、Gloway和SINKER品牌。", "id": "src-powev-jiahe-profile-20260801", "limitations": [ "The page does not prove DRAM wafer fabrication or close the exact Jiahe Jinwei legal alias or rename; no named customer edge is created." ], "locally_archived_path": null, "locator": "公司简介；产品、封装测试和品牌范围", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Powev", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-powev-jiahe-profile-20260801", "source_type": "company_profile", "title": "About Powev", "translation_en": "The company describes DRAM and NAND devices and modules, packaging and testing capability, and the Asgard, Gloway and SINKER brands.", "url": "https://www.powev.com/about-5/", "label": "About Powev" }, { "access_state": "open", "claim_ids": [ "clm-primarius-eda-portfolio" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司从事器件建模、仿真、验证及测试相关EDA产品。", "id": "src-primarius-annual-2025", "limitations": [ "Summary-level portfolio statement; customer, PDK, tapeout, process and production-chip evidence remain product-specific." ], "locally_archived_path": null, "locator": "主营业务与主要产品", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-16", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-primarius-annual-2025", "source_type": "exchange_filing", "title": "上海概伦电子股份有限公司2025年年度报告摘要", "translation_en": "The company develops EDA products for device modeling, simulation, verification and test.", "url": "https://static.cninfo.com.cn/finalpage/2026-04-16/1225108666.PDF", "label": "上海概伦电子股份有限公司2025年年度报告摘要" }, { "access_state": "open", "claim_ids": [ "clm-primarius-nanospice-skhynix-adoption", "clm-relationship-primarius-nanospice-skhynix" ], "claimed_event_date": "2022-01-27", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "NanoSpice was adopted by SK hynix to accelerate verification of CMOS image sensor chips.", "id": "src-primarius-nanospice-skhynix-2022", "limitations": [ "Supplier-side adoption claim; no SK hynix-origin receipt, fab, node, chip SKU, seats or volume." ], "locally_archived_path": null, "locator": "opening and product-performance paragraphs", "original_language": "en", "primary_status": "primary", "publication_date": "2022-01-27", "publication_date_unknown_reason": null, "publisher": "Primarius Technologies Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-primarius-nanospice-skhynix-2022", "source_type": "company_customer_announcement", "title": "Primarius NanoSpice™ Simulator ... is Adopted by SK hynix", "translation_en": "Same as original.", "url": "https://www.primarius-tech.com/en/aboutus/news/Primarius-NanoSpice-Simulator-to-Accelerate-the-verification-of-CMOS-Image-Sensor-is-adopted-by-Skhy.html", "label": "Primarius NanoSpice™ Simulator ... is Adopted by SK hynix" }, { "access_state": "open", "claim_ids": [ "clm-puya-semiconductor-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company describes NOR Flash, EEPROM, MCU and analog products.", "id": "src-puya-profile-20260801", "limitations": [ "Named downstream brands are general use statements without exact product, order, volume or current qualification evidence." ], "locally_archived_path": null, "locator": "about page; product portfolio", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Puya Semiconductor (Shanghai) Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-puya-profile-20260801", "source_type": "company_profile", "title": "About Puya Semiconductor", "translation_en": "The company describes NOR Flash, EEPROM, MCU and analog products.", "url": "https://www.puyasemi.com/en/about.html", "label": "About Puya Semiconductor" }, { "access_state": "open", "claim_ids": [ "clm-shenzhen-qingyi-photomask-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company describes the design and production of photomasks for semiconductor chips, displays and printed-circuit boards.", "id": "src-qingyi-photomask-profile-20260801", "limitations": [ "No named wafer fab, process layer, mask set, order or qualified-production relationship is disclosed." ], "locally_archived_path": null, "locator": "about page; product scope", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Shenzhen Qingyi Photomask Limited", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-qingyi-photomask-profile-20260801", "source_type": "company_profile", "title": "About Qingyi Photomask", "translation_en": "The company describes the design and production of photomasks for semiconductor chips, displays and printed-circuit boards.", "url": "https://en.supermask.com/Aboutus/1.html", "label": "About Qingyi Photomask" }, { "access_state": "open", "claim_ids": [ "clm-red-avenue-legal-identity-2025", "clm-relationship-red-avenue-owns-tongcheng-chemical-china", "clm-relationship-red-avenue-owns-tongcheng-electronic-shanghai", "clm-relationship-tongcheng-shanghai-owns-beijing-kehua", "clm-relationship-tongcheng-shanghai-owns-tongcheng-changzhou", "clm-tongcheng-arf-krf-validation-ramp-2025", "clm-tongcheng-changzhou-cmp-production-2025", "clm-tongcheng-g5-ebr-40-28nm-2025", "clm-tongcheng-g5-ebr-domestic-substitution-2025", "clm-tongcheng-photoresist-solvent-approved-capacity-2025", "clm-tongcheng-resin-lines-accepted-2025" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司披露上海彤程电子材料、北京科华微电子材料和彤程电子材料（常州）的主体关系；彤程电子工厂半导体光刻胶批复产能1000吨、利用率21.5%，高纯溶剂批复产能18800吨、利用率7.2%；常州25万片CMP抛光垫项目竣工投产并批量稳定交付。", "id": "src-red-avenue-annual-2025", "limitations": [ "The filing explicitly defines design capacity in the table as approved capacity; it is not installed, qualified or actual output.", "Photoresist, EBR and CMP customers are anonymous, so no named fab relationship is created.", "The Shanghai Chemical Industry Park resin-line paragraph does not identify the exact legal owner/operator or street address.", "Issuer production, validation and volume language does not disclose batch quantities, yield, purity distributions or customer acceptance dates." ], "locally_archived_path": null, "locator": "printed pp. 5–6, 16–18, 35 and 195–196; definitions; electronic-materials operations; capacity/utilization table; subsidiary table", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-18", "publication_date_unknown_reason": null, "publisher": "上海证券交易所 / 彤程新材料集团股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-red-avenue-annual-2025", "source_type": "annual_report", "title": "彤程新材料集团股份有限公司2025年年度报告", "translation_en": "The filing identifies Shanghai Tongcheng Electronic Materials, Beijing Kehua and Tongcheng Electronic Materials (Changzhou); it reports approved capacity and utilization for semiconductor photoresist and high-purity solvent, and says the 250,000-pad/year Changzhou CMP project was completed, put into production and making stable batch deliveries.", "url": "https://static.cninfo.com.cn/finalpage/2026-04-18/1225115153.PDF", "label": "彤程新材料集团股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-relationship-tongcheng-shanghai-owns-beijing-kehua" ], "claimed_event_date": "2025-05-28", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "彤程电子从直接持有科华微电子87.8597%股权变更为96.3295%。", "id": "src-redavenue-kehua-investment-2025", "limitations": [ "The disclosure said business-registration changes remained at publication; the later annual report gives 96.3296%, a one-ten-thousandth-point rounding difference." ], "locally_archived_path": null, "locator": "announcement 2025-041, body lines 177–265; ownership at lines 192 and 207", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-05-28", "publication_date_unknown_reason": null, "publisher": "彤程新材料集团股份有限公司 / 上海证券报", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-redavenue-kehua-investment-2025", "source_type": "listed_company_mandatory_disclosure", "title": "彤程新材料集团股份有限公司对外投资进展公告", "translation_en": "Shanghai Tongcheng Electronic's direct Kehua holding increased from 87.8597% to 96.3295%.", "url": "https://paper.cnstock.com/html/2025-05/28/content_2074043.htm", "label": "彤程新材料集团股份有限公司对外投资进展公告" }, { "access_state": "open", "claim_ids": [ "clm-relationship-red-avenue-owns-tongcheng-chemical-china" ], "claimed_event_date": "2025-03-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "彤程化学、上海彤程电子材料有限公司均为本公司全资子公司。", "id": "src-redavenue-subsidiaries-guarantee-2025", "limitations": [ "Registered residences are legal-entity addresses and are not automatically the same as every manufacturing site." ], "locally_archived_path": null, "locator": "announcement 2025-018, lines 252–318; entity details lines 274–307", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-04-03", "publication_date_unknown_reason": null, "publisher": "彤程新材料集团股份有限公司 / 上海证券报", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-redavenue-subsidiaries-guarantee-2025", "source_type": "listed_company_mandatory_disclosure", "title": "彤程新材料集团股份有限公司关于年度预计融资担保进展的公告", "translation_en": "Tongcheng Chemical and Shanghai Tongcheng Electronic Materials are wholly owned subsidiaries.", "url": "https://paper.cnstock.com/html/2025-04/03/content_2044624.htm", "label": "彤程新材料集团股份有限公司关于年度预计融资担保进展的公告" }, { "access_state": "open", "claim_ids": [ "clm-aishengna-future-recipients", "clm-aishengna-reported-manufacturing" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "An anonymous source said Aishengna started manufacturing and expected 2026 deliveries to SMIC, Hua Hong and CXMT, with further testing still required.", "id": "src-reuters-duv-aishengna-2026", "limitations": [ "Anonymous-source report; no model, serial, purchase order, shipment, installation, site acceptance, layer qualification, uptime, yield, or recurring volume." ], "locally_archived_path": null, "locator": "body; anonymous-source manufacturing and expected-recipient passages", "original_language": "en", "primary_status": "secondary", "publication_date": "2026-07-28", "publication_date_unknown_reason": null, "publisher": "Reuters", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-reuters-duv-aishengna-2026", "source_type": "news_report", "title": "China starts production of home-grown immersion DUV chipmaking tools, source says", "translation_en": "Same as original.", "url": "https://www.reuters.com/world/china/china-starts-production-home-grown-immersion-duv-chipmaking-tools-source-2026-07-28/", "label": "China starts production of home-grown immersion DUV chipmaking tools, source says" }, { "access_state": "open", "claim_ids": [ "clm-samsung-xian-tool-license-2026", "clm-skhynix-dalian-tool-license-2026", "clm-skhynix-wuxi-tool-license-2026" ], "claimed_event_date": "2025-12-30", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Annual U.S. approvals cover chipmaking-tool shipments to Samsung and SK hynix China facilities in 2026.", "id": "src-reuters-samsung-skhynix-tool-license-2025", "limitations": [ "Anonymous-source reporting; no official license text, covered model/component list, quantities, service scope, expiry conditions or facility-by-facility schedule is public in the source." ], "locally_archived_path": null, "locator": "opening paragraphs; annual-approval and VEU-transition discussion", "original_language": "en", "primary_status": "secondary", "publication_date": "2025-12-30", "publication_date_unknown_reason": null, "publisher": "Reuters", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-reuters-samsung-skhynix-tool-license-2025", "source_type": "news_report", "title": "US approves Samsung, SK Hynix chipmaking tool shipments to China for 2026, sources say", "translation_en": "Same as original.", "url": "https://www.reuters.com/world/china/samsung-wins-us-annual-approval-chipmaking-tool-shipments-china-source-says-2025-12-30/", "label": "US approves Samsung, SK Hynix chipmaking tool shipments to China for 2026, sources say" }, { "access_state": "open", "claim_ids": [ "clm-tsmc-china-tool-license-exposure" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The report describes annual U.S. approval for controlled tool exports to TSMC's China operations.", "id": "src-reuters-tsmc-tool-license-2025", "limitations": [ "License reporting does not enumerate the complete tool/component/service BOM." ], "locally_archived_path": null, "locator": "license and China-operation passages", "original_language": "en", "primary_status": "secondary", "publication_date": "2025-12-31", "publication_date_unknown_reason": null, "publisher": "Reuters", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-reuters-tsmc-tool-license-2025", "source_type": "news_report", "title": "US grants annual approval for TSMC chipmaking tool exports to China", "translation_en": "Same as original.", "url": "https://www.reuters.com/world/asia-pacific/us-grants-annual-approval-tsmc-chipmaking-tool-exports-china-2025-12-31/", "label": "US grants annual approval for TSMC chipmaking tool exports to China" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-rockchip" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Rockchip Electronics Co., Ltd. (Rockchip, stock code: 603893)", "id": "src-rockchip-profile", "limitations": [], "locally_archived_path": null, "locator": "Opening paragraph and site title", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Rockchip Electronics Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-rockchip-profile", "source_type": "official_company_page", "title": "About Rockchip", "translation_en": "Same as original.", "url": "https://www.rock-chips.com/a/en/About_Rockchip/About_Rockchip/index.html", "label": "About Rockchip" }, { "access_state": "open", "claim_ids": [ "clm-rslaser-yizhuang-project-registration" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "项目单位北京科益虹源光电技术有限公司，总投资129237.68万元，建设光刻光源制造及翻新基地。", "id": "src-rslaser-yizhuang-project-2021", "limitations": [ "Project registration is not construction completion, installed capacity, output, customer delivery or scanner integration." ], "locally_archived_path": null, "locator": "项目登记；单位、批复、地址、投资及建筑面积字段", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2021-09-10", "publication_date_unknown_reason": null, "publisher": "北京市公共资源交易服务平台", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-rslaser-yizhuang-project-2021", "source_type": "government_project_record", "title": "科益虹源集成电路光刻光源制造及翻新基地（北京亦庄研发基地）项目", "translation_en": "The project owner is Beijing RSLaser Opto-Electronics Technology Co., Ltd.; registered investment is CNY 1.2923768 billion for a lithography-light-source manufacturing and refurbishment base.", "url": "https://ggzyfw.beijing.gov.cn/jylcgcjs/20210910/2058109.html", "label": "科益虹源集成电路光刻光源制造及翻新基地（北京亦庄研发基地）项目" }, { "access_state": "open", "claim_ids": [ "clm-relationship-saic-develops-journey5-solution", "clm-saic-journey5-joint-solution-release" ], "claimed_event_date": "2022-11-04", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "上汽、地平线联合发布基于征程5芯片的智驾解决方案。", "id": "src-saic-soa-conference-20221104", "limitations": [ "No exact vehicle program, Horizon legal entity, board/controller, order, SOP, shipment or field receipt.", "Other delivered SOA vehicles in the page are not tied to Journey 5; the future 2025 production target is not achieved production evidence." ], "locally_archived_path": null, "locator": "headline/date and key announcement lines 0–19; platform sections lines 57–77", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2022-11-04", "publication_date_unknown_reason": null, "publisher": "上海汽车集团股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-saic-soa-conference-20221104", "source_type": "company_customer_press_release", "title": "第二届上汽零束SOA平台开发者大会揭幕", "translation_en": "SAIC and Horizon jointly released an intelligent-driving solution based on Journey 5.", "url": "https://www.saicmotor.com/m/xwzx/xwk/2022/58086.shtml", "label": "第二届上汽零束SOA平台开发者大会揭幕" }, { "access_state": "open", "claim_ids": [ "clm-relationship-samsung-owns-xian-operation", "clm-samsung-xian-volume-2014" ], "claimed_event_date": "2014-05-09", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Samsung announced full-scale manufacturing operations at its Xi'an memory facility for 3D V-NAND.", "id": "src-samsung-xian-operation-2014", "limitations": [ "Historical start receipt; current capacity, generation, utilization, supplier mix, and export-control exposure require later sources." ], "locally_archived_path": null, "locator": "announcement body", "original_language": "en", "primary_status": "primary", "publication_date": "2014-05-09", "publication_date_unknown_reason": null, "publisher": "Samsung Electronics", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-samsung-xian-operation-2014", "source_type": "company_press_release", "title": "Samsung Announces Operation of Its Memory Facility in Xi'an, China", "translation_en": "Same as original.", "url": "https://news.samsung.com/global/samsung-announces-operation-of-its-memory-facility-in-xian-china", "label": "Samsung Announces Operation of Its Memory Facility in Xi'an, China" }, { "access_state": "open", "claim_ids": [ "clm-sanan-ic-brand-unresolved-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The page describes Sanan Group's integrated-circuit division, its reorganization into an RF division, and Xiamen and Quanzhou compound-semiconductor foundry operations.", "id": "src-sanan-ic-profile-20260801", "limitations": [ "Business-unit branding does not resolve one contracting legal operator for every factory or product." ], "locally_archived_path": null, "locator": "about page; organization and factory description", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Sanan IC", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-sanan-ic-profile-20260801", "source_type": "company_profile", "title": "About Sanan IC", "translation_en": "The page describes Sanan Group's integrated-circuit division, its reorganization into an RF division, and Xiamen and Quanzhou compound-semiconductor foundry operations.", "url": "https://www.sanan-ic.com/en/about-us", "label": "About Sanan IC" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-shennan-circuits" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Shennan Circuits Co., Ltd. (hereinafter referred to as SCC)", "id": "src-scc-profile", "limitations": [ "Current controlling shareholder was not closed in this lane." ], "locally_archived_path": null, "locator": "Opening paragraph", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Shennan Circuits Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-scc-profile", "source_type": "official_company_page", "title": "Who is SCC?", "translation_en": "Same as original.", "url": "https://www.scc.com.cn/scc/en/gysn/index.html", "label": "Who is SCC?" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-shennan-circuits" ], "claimed_event_date": "2014-12-26", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Shennan Circuits Ltd. was officially renamed as Shennan Circuits Co., Ltd.", "id": "src-scc-rename", "limitations": [], "locally_archived_path": null, "locator": "Release body", "original_language": "en", "primary_status": "primary", "publication_date": "2015-01-28", "publication_date_unknown_reason": null, "publisher": "Shennan Circuits Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-scc-rename", "source_type": "official_company_release", "title": "Shennan Circuits Ltd. officially renamed as Shennan Circuits Co., Ltd.", "translation_en": "Same as original.", "url": "https://www.scc.com.cn/scc/en/xwdt/782287856969187328.html", "label": "Shennan Circuits Ltd. officially renamed as Shennan Circuits Co., Ltd." }, { "access_state": "open", "claim_ids": [ "clm-tongcheng-resin-lines-accepted-2025", "clm-tongcheng-resin-project-government-design-2025" ], "claimed_event_date": "2025-01-17", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "建设6条光刻胶树脂生产线和1条电子级甲醛线。", "id": "src-scip-tongcheng-resin-energy-review-2025", "limitations": [ "Energy-review approval proves applicant, site, planned line count and design output, not construction completion, production, customer qualification or shipment." ], "locally_archived_path": null, "locator": "沪化管〔2025〕4号, lines 22–47; project scope lines 30–33", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-01-17", "publication_date_unknown_reason": null, "publisher": "上海化学工业区管理委员会", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-scip-tongcheng-resin-energy-review-2025", "source_type": "government_energy_review", "title": "上海化学工业区管理委员会关于彤程化学（中国）有限公司光刻胶上游树脂及电子甲醛项目节能报告的审查意见", "translation_en": "Construct six photoresist-resin lines and one electronic-grade formaldehyde line.", "url": "https://www.scip.gov.cn/govxxgk/jjfzc/2025-01-17/3ca523a9-c4da-4e50-a029-cdb960d5101c.html", "label": "上海化学工业区管理委员会关于彤程化学（中国）有限公司光刻胶上游树脂及电子甲醛项目节能报告的审查意见" }, { "access_state": "open", "claim_ids": [ "clm-semitronix-portfolio" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司提供EDA软件、电性测试设备及数据分析解决方案。", "id": "src-semitronix-annual-2025", "limitations": [ "Does not identify a qualified process layer, fab installation, or attributable yield improvement." ], "locally_archived_path": null, "locator": "主营业务", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-23", "publication_date_unknown_reason": null, "publisher": "巨潮资讯网", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-semitronix-annual-2025", "source_type": "exchange_filing", "title": "杭州广立微电子股份有限公司2025年年度报告摘要", "translation_en": "The company provides EDA software, electrical-test equipment and data-analysis solutions.", "url": "https://static.cninfo.com.cn/finalpage/2026-04-23/1225153966.PDF", "label": "杭州广立微电子股份有限公司2025年年度报告摘要" }, { "access_state": "open", "claim_ids": [ "clm-amkor-shanghai-current-factory-2026", "clm-relationship-amkor-operates-shanghai-current" ], "claimed_event_date": "2025-03-07", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "前往安靠封装测试（上海）有限公司……察看企业产品和生产线。", "id": "src-shanghai-amkor-current-2025", "limitations": [ "Government visit confirms current legal name and production-line presence, not exact package platform, customer, capacity, utilization, yield or equipment/material BOM." ], "locally_archived_path": null, "locator": "正文，第1至2段", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-03-10", "publication_date_unknown_reason": null, "publisher": "浦东新区人民政府", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-shanghai-amkor-current-2025", "source_type": "government_company_record", "title": "浦东新区领导走访行业领军企业", "translation_en": "Officials visited Amkor Assembly and Test (Shanghai) Co., Ltd. and inspected products and production lines.", "url": "https://www.shanghai.gov.cn/nw15343/20250310/86a8dfa142ed4672ae78265adb29ecf0.html", "label": "浦东新区领导走访行业领军企业" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-sicc" ], "claimed_event_date": "2026-07-22", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Stock Code: 2631 | Name: SICC CO., LTD.", "id": "src-sicc-hkex-current", "limitations": [ "Shareholding values are outside this lane." ], "locally_archived_path": null, "locator": "Stock code 2631 row", "original_language": "en", "primary_status": "primary", "publication_date": "2026-07-22", "publication_date_unknown_reason": null, "publisher": "Hong Kong Exchanges and Clearing Limited", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-sicc-hkex-current", "source_type": "exchange_record", "title": "Stock Connect Southbound Shareholding Search By Date", "translation_en": "Same as original.", "url": "https://www3.hkexnews.hk/sdw/search/mutualmarket.aspx?force_isolation=true&t=hk", "label": "Stock Connect Southbound Shareholding Search By Date" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-sicc" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "山东天岳先进科技股份有限公司；SICC Co., Ltd.", "id": "src-sicc-profile", "limitations": [ "The page does not display both exchange codes." ], "locally_archived_path": null, "locator": "公司名称 field and company description", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "山东天岳先进科技股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-sicc-profile", "source_type": "official_company_page", "title": "关于天岳：概况", "translation_en": "Shandong Tianyue Advanced Technology Co., Ltd.; SICC Co., Ltd.", "url": "https://www.sicc.cc/about1.html", "label": "关于天岳：概况" }, { "access_state": "open", "claim_ids": [ "clm-relationship-silan-jv-with-xiamen-semiconductor-investment", "clm-silan-jike-planned-capacity" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "厦门士兰集科微电子有限公司由杭州士兰微电子股份有限公司和厦门半导体投资集团有限公司共同投资建设。", "id": "src-silan-jike-company-profile", "limitations": [ "The 40,000/80,000 wafers-per-month figures are project plans, not installed, qualified or actual-output capacity." ], "locally_archived_path": null, "locator": "公司简介；股东、地址及12英寸项目段落", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "杭州士兰微电子股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-silan-jike-company-profile", "source_type": "company_subsidiary_page", "title": "子公司-厦门士兰集科微电子有限公司", "translation_en": "Xiamen Silan Jike Microelectronics Co., Ltd. was jointly invested in and built by Hangzhou Silan Microelectronics and Xiamen Semiconductor Investment Group.", "url": "https://www.silan.com.cn/index.php/about/info/246.html", "label": "子公司-厦门士兰集科微电子有限公司" }, { "access_state": "open", "claim_ids": [ "clm-silan-jike-h1-2025-output" ], "claimed_event_date": "2025-06-30", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "士兰集科产能处于满载水平，总计产出12吋芯片29.84万片。", "id": "src-silan-jike-h1-2025", "limitations": [ "Full load is not a disclosed utilization percentage; output is total wafers, not good-die output or yield." ], "locally_archived_path": null, "locator": "三、主要制造工厂经营情况；1、士兰集科", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-08-01", "publication_date_unknown_reason": null, "publisher": "杭州士兰微电子股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-silan-jike-h1-2025", "source_type": "company_operating_update", "title": "士兰微电子2025年半年度报告精读", "translation_en": "Silan Jike operated at a stated full-load level and produced 298,400 12-inch wafers in the first half of 2025.", "url": "https://www.silan.com.cn/index.php/news/details/260.html", "label": "士兰微电子2025年半年度报告精读" }, { "access_state": "open", "claim_ids": [ "clm-silan-jike-planned-capacity" ], "claimed_event_date": "2020-12-21", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "一期项目计划形成月产4万片12英寸90纳米特色工艺芯片生产能力。", "id": "src-silan-jike-production-start-2020", "limitations": [ "The stated 40,000 wafers/month is planned phase capacity; no yield or actual-output receipt is supplied." ], "locally_archived_path": null, "locator": "公告正文；一期项目与投产段落", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2020-12-21", "publication_date_unknown_reason": null, "publisher": "杭州士兰微电子股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-silan-jike-production-start-2020", "source_type": "company_facility_announcement", "title": "士兰集科12英寸特色工艺芯片生产线正式投产", "translation_en": "Phase I planned monthly capacity of 40,000 12-inch wafers using a stated 90 nm specialty process.", "url": "https://www.silan.com.cn/index.php/news/details/78.html", "label": "士兰集科12英寸特色工艺芯片生产线正式投产" }, { "access_state": "open", "claim_ids": [ "clm-hubei-sinophorus-xingfu-electronic-materials-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The company describes ultra-high-purity acids, etchants, developers, cleaners and strippers for semiconductor manufacturing.", "id": "src-sinophorus-profile-20260801", "limitations": [ "The Xingfa group link is supported, but exact current ownership percentage and named fab/product supply remain unresolved." ], "locally_archived_path": null, "locator": "about page; product categories", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Hubei Sinophorus Electronic Materials Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-sinophorus-profile-20260801", "source_type": "company_profile", "title": "About Sinophorus", "translation_en": "The company describes ultra-high-purity acids, etchants, developers, cleaners and strippers for semiconductor manufacturing.", "url": "https://m.sinophorus.com/about-us", "label": "About Sinophorus" }, { "access_state": "open", "claim_ids": [ "clm-shanghai-sinyang-semiconductor-materials-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "年度报告披露公司从事半导体行业所需关键工艺材料和配套设备的研发、生产和销售。", "id": "src-sinyang-annual-2025", "limitations": [ "Issuer portfolio evidence only; no named fab, package flow, exact grade, qualification or recurring supply edge is disclosed." ], "locally_archived_path": null, "locator": "2025年年度报告；主营业务和产品部分", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-03-13", "publication_date_unknown_reason": null, "publisher": "上海新阳半导体材料股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-sinyang-annual-2025", "source_type": "annual_report", "title": "上海新阳半导体材料股份有限公司2025年年度报告", "translation_en": "The annual report says the company researches, produces and sells critical process materials and supporting equipment required by the semiconductor industry.", "url": "https://static.cninfo.com.cn/finalpage/2026-03-13/1225006867.PDF", "label": "上海新阳半导体材料股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-sjsemi-jiangyin" ], "claimed_event_date": "2025-08-18", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "盛合晶微半导体（江阴）有限公司（以下简称“盛合晶微”或“公司”）", "id": "src-sjsemi-jiangyin", "limitations": [ "Do not collapse this entity into the listed issuer." ], "locally_archived_path": null, "locator": "Opening paragraph", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-08-19", "publication_date_unknown_reason": null, "publisher": "盛合晶微半导体（江阴）有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-sjsemi-jiangyin", "source_type": "official_company_release", "title": "盛合晶微厂房建设告捷 先进封装发展再添新引擎", "translation_en": "SJ Semiconductor (Jiangyin) Co., Ltd., referred to as the company.", "url": "https://www.sjsemi.com/about/22699/147191.html", "label": "盛合晶微厂房建设告捷 先进封装发展再添新引擎" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-sjsemi-issuer" ], "claimed_event_date": "2025-08-08", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "盛合晶微半导体有限公司（SJ Semiconductor Corporation，以下简称SJ Semi）", "id": "src-sjsemi-parent-profile", "limitations": [ "The page does not establish the legal ownership relation to the Jiangyin operating entity." ], "locally_archived_path": null, "locator": "Opening paragraph", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-08-08", "publication_date_unknown_reason": null, "publisher": "盛合晶微半导体有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-sjsemi-parent-profile", "source_type": "official_company_release", "title": "盛合晶微营收规模持续增长，进入全球OSAT前十榜单", "translation_en": "SJ Semiconductor Corporation, referred to as SJ Semi.", "url": "https://www.sjsemi.com/about/22699/147095.html", "label": "盛合晶微营收规模持续增长，进入全球OSAT前十榜单" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-sjsemi-issuer" ], "claimed_event_date": "2026-04-21", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "盛合晶微半导体有限公司；证券代码为688820", "id": "src-sjsemi-sse-listing", "limitations": [], "locally_archived_path": null, "locator": "Notice body", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-20", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-sjsemi-sse-listing", "source_type": "exchange_notice", "title": "关于盛合晶微半导体有限公司人民币普通股股票科创板上市交易的公告", "translation_en": "SJ Semiconductor Corporation; security code 688820.", "url": "https://www.sse.com.cn/disclosure/announcement/listing/ipo/c/c_20260420_10815741.shtml", "label": "关于盛合晶微半导体有限公司人民币普通股股票科创板上市交易的公告" }, { "access_state": "open", "claim_ids": [ "clm-relationship-skhynix-acquires-dalian-nand", "clm-skhynix-dalian-acquisition" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The first-phase acquisition included Intel's SSD business and the Dalian NAND flash manufacturing facility.", "id": "src-skhynix-dalian-acquisition-2021", "limitations": [ "Acquisition receipt does not provide current capacity, product generation, yield, utilization, or local supplier share." ], "locally_archived_path": null, "locator": "transaction scope", "original_language": "en", "primary_status": "primary", "publication_date": "2021-12-30", "publication_date_unknown_reason": null, "publisher": "SK hynix", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-skhynix-dalian-acquisition-2021", "source_type": "company_press_release", "title": "SK hynix Completes the First Phase of Intel NAND and SSD Business Acquisition", "translation_en": "Same as original.", "url": "https://news.skhynix.com/sk-hynix-completes-the-first-phase-of-intel-nand-and-ssd-business-acquisition/", "label": "SK hynix Completes the First Phase of Intel NAND and SSD Business Acquisition" }, { "access_state": "open", "claim_ids": [ "clm-relationship-skhynix-controls-dalian-operation", "clm-relationship-skhynix-controls-wuxi-operation", "clm-skhynix-dalian-current-2026", "clm-skhynix-mainland-fabs-current-2026", "clm-skhynix-wuxi-c2-current-2026", "clm-skhynix-wuxi-c2f-current-2026" ], "claimed_event_date": "2026-03-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "We own and operate fabs ... in Wuxi and Dalian, China.", "id": "src-skhynix-f1-facilities-2026", "limitations": [ "The filing identifies C2/C2F DRAM and Dalian NAND and states group-wide full utilization, but does not disclose facility wafer capacity, node, output, yield, tool fleet or supplier BOM.", "Parent-level owns/operates language does not by itself resolve immediate local legal-title chains." ], "locally_archived_path": null, "locator": "Business — Manufacturing Facilities; fab table as of 2026-03-31", "original_language": "en", "primary_status": "primary", "publication_date": "2026-06-24", "publication_date_unknown_reason": null, "publisher": "U.S. Securities and Exchange Commission", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-skhynix-f1-facilities-2026", "source_type": "regulatory_filing", "title": "SK hynix Inc. Form F-1 Registration Statement", "translation_en": "Same as original.", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785df1.htm", "label": "SK hynix Inc. Form F-1 Registration Statement" }, { "access_state": "open", "claim_ids": [ "clm-relationship-skhynix-controls-dalian-operation", "clm-relationship-skhynix-controls-wuxi-operation", "clm-skhynix-dalian-current-legal-entity", "clm-skhynix-wuxi-current-legal-entity" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "SK hynix Semiconductor (China) Ltd. — Wuxi Headquarters (Production site).", "id": "src-skhynix-official-network-2026", "limitations": [ "The page identifies the Wuxi production-site legal entity and a Dalian legal entity/address; it does not disclose capacity, process generation, output, yield, tools or materials." ], "locally_archived_path": null, "locator": "Global Network; Wuxi and Dalian company/address entries", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "SK hynix Inc.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-skhynix-official-network-2026", "source_type": "company_facility_page", "title": "Global Network", "translation_en": "Same as original.", "url": "https://www.skhynix.com/company/UI-FR-CP06/", "label": "Global Network" }, { "access_state": "open", "claim_ids": [ "clm-relationship-skhynix-controls-dalian-operation", "clm-relationship-skhynix-controls-wuxi-operation" ], "claimed_event_date": "2026-03-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "SK hynix Semiconductor (China) Ltd.; SK hynix semiconductor storage technology (Dalian) Co., Ltd.", "id": "src-skhynix-sec-subsidiaries-2026", "limitations": [ "Subsidiary list proves consolidated legal-entity inclusion, not immediate ownership percentage or the legal title holder for each fab parcel and tool set." ], "locally_archived_path": null, "locator": "Exhibit 21.1, China subsidiary rows; list as of 2026-03-31", "original_language": "en", "primary_status": "primary", "publication_date": "2026-06-24", "publication_date_unknown_reason": null, "publisher": "U.S. Securities and Exchange Commission", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-skhynix-sec-subsidiaries-2026", "source_type": "regulatory_filing", "title": "List of Subsidiaries of SK hynix Inc.", "translation_en": "Same as original.", "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526280172/d32785dex211.htm", "label": "List of Subsidiaries of SK hynix Inc." }, { "access_state": "open", "claim_ids": [ "clm-skhynix-wuxi-c2-production-historical", "clm-skhynix-wuxi-c2f-completed" ], "claimed_event_date": "2019-04-18", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The original C2 began DRAM production; C2F expansion was completed after equipment move-in.", "id": "src-skhynix-wuxi-c2f-2019", "limitations": [ "Historical announcement does not prove 2026 legal operator, capacity, technology, utilization, yield, product mix or ownership-chain changes." ], "locally_archived_path": null, "locator": "announcement body, project history and completion paragraphs", "original_language": "en", "primary_status": "primary", "publication_date": "2019-04-18", "publication_date_unknown_reason": null, "publisher": "SK hynix Inc.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-skhynix-wuxi-c2f-2019", "source_type": "company_facility_announcement", "title": "SK hynix Completes Expanded Fab (C2F) in Wuxi, China", "translation_en": "Same as original.", "url": "https://news.skhynix.com/en/sk-hynix-completes-expanded-fab-c2f-in-wuxi-china/", "label": "SK hynix Completes Expanded Fab (C2F) in Wuxi, China" }, { "access_state": "open", "claim_ids": [ "clm-skyverse-ginkgoifm-family-catalogue" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The GINKGOIFM family measures wafer geometry and nanotopography for patterned, unpatterned and bonded wafers.", "id": "src-skyverse-ginkgoifm-catalogue", "limitations": [ "Family-level catalogue; it does not establish P300 throughput or qualification at a named facility." ], "locally_archived_path": null, "locator": "Product Introduction and Product Features", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Skyverse Technology Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-skyverse-ginkgoifm-catalogue", "source_type": "company_product_page", "title": "Wafer Flatness Metrology Equipment Series - GINKGOIFM", "translation_en": "Same as original.", "url": "https://www.skyverse.cn/en/article/28/27.html", "label": "Wafer Flatness Metrology Equipment Series - GINKGOIFM" }, { "access_state": "open", "claim_ids": [ "clm-skyverse-ginkgoifm-p300-hbm-shipment" ], "claimed_event_date": "2025-11-24", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Skyverse reports that the first GINKGOIFM-P300 was shipped to an unnamed HBM client.", "id": "src-skyverse-ginkgoifm-p300-2025", "limitations": [ "Customer and facility are anonymous; shipment is not installation, acceptance, process qualification or HBM-stack qualification." ], "locally_archived_path": null, "locator": "article body; first-tool shipment passage", "original_language": "en", "primary_status": "primary", "publication_date": "2025-11-24", "publication_date_unknown_reason": null, "publisher": "Skyverse Technology Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-skyverse-ginkgoifm-p300-2025", "source_type": "company_customer_announcement", "title": "Skyverse Releases GINKGOIFM-P300 and Ships First Tool to HBM Client", "translation_en": "Same as original.", "url": "https://www.skyverse.cn/en/article/38/30.html", "label": "Skyverse Releases GINKGOIFM-P300 and Ships First Tool to HBM Client" }, { "access_state": "open", "claim_ids": [ "clm-skyverse-current-legal-identity" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "深圳中科飞测科技股份有限公司，证券代码688361。", "id": "src-skyverse-sse-identity-2023", "limitations": [ "Legal-identity receipt only; the index is not a product-readiness receipt." ], "locally_archived_path": null, "locator": "上市公告书索引；发行人名称和证券代码", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2023-05-18", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-skyverse-sse-identity-2023", "source_type": "exchange_filing_index", "title": "深圳中科飞测科技股份有限公司首次公开发行股票科创板上市公告书", "translation_en": "Shenzhen Skyverse Technology Co., Ltd.; security code 688361.", "url": "https://www.sse.com.cn/disclosure/announcement/listing/ipo/c/c_20230518_89633026.shtml", "label": "深圳中科飞测科技股份有限公司首次公开发行股票科创板上市公告书" }, { "access_state": "open", "claim_ids": [ "clm-smee-history-development-milestones" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "2016年首台前道扫描光刻机交付匿名用户；2017年90nm样机通过现场测试；2018年项目通过正式验收。", "id": "src-smee-history-official", "limitations": [ "Program or expert acceptance is not fab site acceptance; model, facility, layer and operating metrics are absent." ], "locally_archived_path": null, "locator": "发展历程；2016-06、2017-10、2018-03条目", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "上海微电子装备（集团）股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-smee-history-official", "source_type": "company_history_page", "title": "SMEE发展历程", "translation_en": "The company timeline reports an anonymous front-end scanner delivery in 2016, on-site prototype testing in 2017 and formal program acceptance in 2018.", "url": "https://www.smee.com.cn/eis.pub?method=indexinfo&onclicknodeno=1_2_2&service=homepageService", "label": "SMEE发展历程" }, { "access_state": "open", "claim_ids": [ "clm-smee-ssc800-public-index-negative-receipt-2026" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "SSX600、SSB500、SSB300、SSB200系列。", "id": "src-smee-lithography-product-index-20260729", "limitations": [ "SSC800/10 was absent from the reviewed index.", "Page absence does not prove that SSC800/10 does not exist, was not manufactured or is not offered under controlled disclosure." ], "locally_archived_path": null, "locator": "current lithography-equipment index reviewed 2026-07-29", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "上海微电子装备（集团）股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-smee-lithography-product-index-20260729", "source_type": "official_product_index", "title": "光刻设备", "translation_en": "SSX600, SSB500, SSB300 and SSB200 series.", "url": "https://www.smee.com.cn/eis.pub?method=indexinfo&onclicknodeno=1_4_1&service=homepageService", "label": "光刻设备" }, { "access_state": "open", "claim_ids": [ "clm-smee-ssa600-catalogue" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "SSX600/SSA600系列，4倍缩小投影物镜，满足90nm、110nm、280nm等前道光刻工艺需求。", "id": "src-smee-ssa600-official", "limitations": [ "Catalogue capability only; no named facility, serial number, installation, site acceptance, qualified layer, uptime, or yield." ], "locally_archived_path": null, "locator": "产品中心，600系列", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "上海微电子装备（集团）股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-smee-ssa600-official", "source_type": "company_product_page", "title": "600 Series Step-and-Scan Lithography System", "translation_en": "The SSX600/SSA600 series uses 4x reduction projection and is positioned for 90 nm, 110 nm and 280 nm front-end lithography.", "url": "https://www.smee.com.cn/eis.pub?method=indexinfo&onclicknodeno=1_4_1_1&service=homepageService", "label": "600 Series Step-and-Scan Lithography System" }, { "access_state": "open", "claim_ids": [ "clm-smic-foundry-business" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The report identifies Semiconductor Manufacturing International Corporation and describes its 8-inch and 12-inch foundry services.", "id": "src-smic-annual-2025", "limitations": [ "Group-level foundry capability does not identify a product's foundry, scanner fleet, customer, yield or tool/material BOM." ], "locally_archived_path": null, "locator": "corporate profile; principal business", "original_language": "en", "primary_status": "primary", "publication_date": "2026-04-08", "publication_date_unknown_reason": null, "publisher": "Hong Kong Exchanges and Clearing Limited", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-smic-annual-2025", "source_type": "annual_report", "title": "SMIC 2025 Annual Report", "translation_en": "Same as original.", "url": "https://www.hkexnews.hk/listedco/listconews/sehk/2026/0408/2026040801181.pdf", "label": "SMIC 2025 Annual Report" }, { "access_state": "open", "claim_ids": [ "clm-smic-generic-procurement-no-scanner-edge-2025" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司采购晶圆代工所需物料、零备件、设备、软件及技术服务；部分涉及商业秘密的信息已申请豁免披露。", "id": "src-smic-sse-annual-2025", "limitations": [ "Exact-term audit found no Yuliangsheng, SMEE or ASML name.", "Supplier disclosure is partially exempted; the top-five table concerns raw materials and does not disclose equipment vendors.", "Zero hits do not prove absence." ], "locally_archived_path": null, "locator": "printed pp. 12–13 and 27", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-03-27", "publication_date_unknown_reason": null, "publisher": "上海证券交易所 / 中芯国际", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-smic-sse-annual-2025", "source_type": "annual_report", "title": "中芯国际集成电路制造有限公司2025年年度报告", "translation_en": "SMIC procures materials, spares, equipment, software and technical services for foundry operations; some commercial-secret information is exempted from disclosure.", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-03-27/688981_20260327_AQDC.pdf", "label": "中芯国际集成电路制造有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-smic-zhongxinbeifang-no-named-scanner-2026" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "标的公司采购晶圆代工所需物料、设备及技术服务；前五名材料供应商均匿名。", "id": "src-smic-zhongxinbeifang-acquisition-2026", "limitations": [ "Exact-term audit found no named scanner vendor/model; equipment suppliers are not disclosed." ], "locally_archived_path": null, "locator": "printed 1-1-141–142；采购模式和前五名供应商章节", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-05-22", "publication_date_unknown_reason": null, "publisher": "上海证券交易所 / 中芯国际", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-smic-zhongxinbeifang-acquisition-2026", "source_type": "acquisition_filing", "title": "中芯国际集成电路制造有限公司发行股份购买资产暨关联交易报告书", "translation_en": "The target company procures foundry materials, equipment and technical services; its top material suppliers are anonymized.", "url": "https://static.sse.com.cn/disclosure/listedinfo/announcement/c/new/2026-05-22/688981_20260522_FD29.pdf", "label": "中芯国际集成电路制造有限公司发行股份购买资产暨关联交易报告书" }, { "access_state": "open", "claim_ids": [ "clm-sophgo-group-identity-and-bm1684x-specification" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "BM1684X lists INT8 32 TOPS, BF16/FP16 16 TFLOPS, FP32 2 TFLOPS and 6/12/16 GB LPDDR4/LPDDR4X.", "id": "src-sophgo-bm1684x-product", "limitations": [ "Exact legal product owner, foundry, OSAT, LPDDR supplier, units and named customer are undisclosed." ], "locally_archived_path": null, "locator": "mainboard specification block", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "SOPHGO", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-sophgo-bm1684x-product", "source_type": "company_product_page", "title": "BM1684X Mainboard", "translation_en": "Same as original.", "url": "https://en.sophgo.com/ecology/detail.html?id=41", "label": "BM1684X Mainboard" }, { "access_state": "open", "claim_ids": [ "clm-sophgo-group-identity-and-bm1684x-specification" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "北京算能科技有限公司及其下属公司在政策中统称算能。", "id": "src-sophgo-privacy", "limitations": [ "Does not identify the exact legal owner/manufacturer of each group-branded product." ], "locally_archived_path": null, "locator": "opening paragraph", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "北京算能科技有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-sophgo-privacy", "source_type": "company_legal_page", "title": "隐私政策", "translation_en": "The policy collectively calls Beijing SOPHGO Technology Co., Ltd. and its subsidiaries SOPHGO.", "url": "https://www.sophgo.com/site/provacy-policy.html", "label": "隐私政策" }, { "access_state": "open", "claim_ids": [ "clm-relationship-smee-zycgr22011903-ssc800-award-2025", "clm-smee-ssc800-award-2025" ], "claimed_event_date": "2025-12-24", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "请贵方在近期与采购人商签成交合同。", "id": "src-ssc800-ccgp-award-letter-20251224", "limitations": [ "The award letter does not prove that the contract was later executed or performed." ], "locally_archived_path": null, "locator": "DOCX body, paragraph following the selected-supplier notice", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-12-25", "publication_date_unknown_reason": null, "publisher": "zycgr22011903 / 中国政府采购网", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-ssc800-ccgp-award-letter-20251224", "source_type": "procurement_award_letter", "title": "zycgr22011903单一来源采购步进扫描式光刻成交通知书", "translation_en": "Please negotiate and sign the transaction contract with the purchaser in the near term.", "url": "https://download.ccgp.gov.cn/oss/download?uuid=29ED2DAF253269EC63A6675AED0E4F", "label": "zycgr22011903单一来源采购步进扫描式光刻成交通知书" }, { "access_state": "open", "claim_ids": [ "clm-smee-ssc800-buyer-identity-correlation-2026", "clm-smee-ssc800-neural-electrode-intended-use-2025", "clm-smee-ssc800-procurement-specification-2025", "clm-smee-ssc800-single-source-budget-and-unit-2025" ], "claimed_event_date": "2025-11-06", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "使用单位：LGGJ实验室；项目名称：步进扫描式光刻机；项目金额：11300万元；分辨率≤110nm、套刻精度≤15nm。", "id": "src-ssc800-ccgp-expert-opinion-20251106", "limitations": [ "The performance statements are procurement-justification assertions, not FAT, SAT or independent metrology.", "The attachment names no model, wavelength, NA, serial, facility, delivery date, qualified layer, throughput, uptime, defectivity or yield." ], "locally_archived_path": null, "locator": "scanned PDF p1 header/table; p1–p2 expert-opinion text", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-11-07", "publication_date_unknown_reason": null, "publisher": "科学技术部 / 中国政府采购网", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-ssc800-ccgp-expert-opinion-20251106", "source_type": "single_source_expert_opinion", "title": "附件3-专家论证意见", "translation_en": "Using unit: LGGJ Laboratory; project: step-and-scan lithography machine; amount: CNY 113 million; stated resolution no more than 110 nm and overlay no more than 15 nm.", "url": "https://download.ccgp.gov.cn/oss/download?uuid=ECF994F0FBE86A6F1C7EB79270DA03", "label": "附件3-专家论证意见" }, { "access_state": "open", "claim_ids": [ "clm-smee-ssc800-buyer-identity-correlation-2026", "clm-smee-ssc800-single-source-budget-and-unit-2025" ], "claimed_event_date": "2025-11-06", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "项目预算金额11300.000000万元；拟由上海微电子装备（集团）股份有限公司提供。", "id": "src-ssc800-ccgp-single-source-notice-20251107", "limitations": [ "The buyer remains masked.", "The notice does not provide the eventual model, signed contract, delivery date, installation facility, acceptance, qualified layer, wavelength, NA, throughput, uptime or yield." ], "locally_archived_path": null, "locator": "notice body; first paragraph; attachment block", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-11-07", "publication_date_unknown_reason": null, "publisher": "中国政府采购网 / 中华人民共和国财政部国库司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-ssc800-ccgp-single-source-notice-20251107", "source_type": "central_government_single_source_notice", "title": "科学技术部zycgr22011903单一来源采购步进扫描式光刻机征求意见公示", "translation_en": "The project budget was CNY 113 million, with SMEE proposed as the single-source provider.", "url": "https://www.ccgp.gov.cn/eadylynotice/202511/t20251107_25653325.htm", "label": "科学技术部zycgr22011903单一来源采购步进扫描式光刻机征求意见公示" }, { "access_state": "open", "claim_ids": [ "clm-beijing-starblaze-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "公司从事PCIe SSD主控芯片和SSD产品研发。", "id": "src-starblaze-profile-20260801", "limitations": [ "Tapeout and million-unit validation language is anonymous and company-reported; no foundry, OSAT or named customer edge is established." ], "locally_archived_path": null, "locator": "公司简介；产品与验证陈述", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "北京忆芯科技有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-starblaze-profile-20260801", "source_type": "company_profile", "title": "About Starblaze", "translation_en": "The company develops PCIe SSD controller chips and SSD products.", "url": "https://www.starblaze.com/content/index/cid/5.html", "label": "About Starblaze" }, { "access_state": "open", "claim_ids": [ "clm-swaysure-scope" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司致力于研发通用存储产品。", "id": "src-swaysure-home", "limitations": [ "Does not prove an operating fab, product generation, volume production or scanner fleet." ], "locally_archived_path": null, "locator": "homepage company introduction", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "深圳市昇维旭技术有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-swaysure-home", "source_type": "company_legal_page", "title": "深圳市昇维旭技术有限公司官网", "translation_en": "The company is committed to developing general-purpose memory products.", "url": "https://www.swaysure.com/", "label": "深圳市昇维旭技术有限公司官网" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-tankeblue" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "Beijing TanKeBlue Semiconductor Co., Ltd.", "id": "src-tankeblue-about", "limitations": [ "No current parent or listing was stated." ], "locally_archived_path": null, "locator": "About TanKeBlue, opening paragraph and site footer", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "Beijing TanKeBlue Semiconductor Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-tankeblue-about", "source_type": "official_company_page", "title": "About TanKeBlue", "translation_en": "Same as original.", "url": "https://en.tankeblue.com/introduce/index.html", "label": "About TanKeBlue" }, { "access_state": "open", "claim_ids": [ "clm-thinkon-semiconductor-jinzhou-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The portfolio includes silicon components, large-diameter silicon materials and wafers, and silicon-carbide components.", "id": "src-thinkon-profile-20260801", "limitations": [ "Classifies the portfolio as silicon materials and etch consumables; it is not evidence of a generic wafer-equipment product or named customer." ], "locally_archived_path": null, "locator": "company and product overview", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "锦州神工半导体股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-thinkon-profile-20260801", "source_type": "company_profile", "title": "Thinkon Semiconductor", "translation_en": "The portfolio includes silicon components, large-diameter silicon materials and wafers, and silicon-carbide components.", "url": "https://www.thinkon-cn.com/", "label": "Thinkon Semiconductor" }, { "access_state": "open", "claim_ids": [ "clm-relationship-tongfu-owns-nantong-tongfu" ], "claimed_event_date": "2025-12-31", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "南通通富微电子有限公司为全资子公司；基于芯粒的高性能计算芯片高密度封装技术研发及产业化项目仍为研发进行中。", "id": "src-tongfu-annual-2025", "limitations": [ "Two high-bandwidth-memory references are industry context; no named HBM product, customer, qualification, yield or shipment." ], "locally_archived_path": null, "locator": "PDF pp. 5, 12, 22 and 33", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-17", "publication_date_unknown_reason": null, "publisher": "通富微电子股份有限公司", "record_type": "source", "retrieved_content_sha256": "b8225569b0838cc9806982204cbafbcf81fab5386af636f25cb0c59b735b7b65", "rights_boundary": "link_only", "source_id": "src-tongfu-annual-2025", "source_type": "exchange_filing", "title": "通富微电子股份有限公司2025年年度报告", "translation_en": "Nantong Tongfu is wholly owned; the chiplet-based high-density HPC packaging industrialization project remained in R&D.", "url": "https://static.cninfo.com.cn/finalpage/2026-04-17/1225112762.PDF", "label": "通富微电子股份有限公司2025年年度报告" }, { "access_state": "open", "claim_ids": [ "clm-relationship-tongfu-owns-nantong-tongfu", "clm-tongfu-hbm-project" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "南通通富微电子有限公司拟建设HBM芯粒先进封装研发及产线建设项目。", "id": "src-tongfu-hbm-project-2025", "limitations": [ "Project/EIA receipt is not HBM customer qualification, qualified stack generation, yield, shipment, or volume production." ], "locally_archived_path": null, "locator": "公告正文及附件", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-01-24", "publication_date_unknown_reason": null, "publisher": "通富微电子股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-tongfu-hbm-project-2025", "source_type": "company_project_eia", "title": "HBM芯粒先进封装研发及产线建设项目环境影响报告表公示", "translation_en": "Nantong Tongfu Microelectronics proposes an HBM-chiplet advanced-packaging R&D and production-line construction project.", "url": "https://www.tfme.com/news/1380.html", "label": "HBM芯粒先进封装研发及产线建设项目环境影响报告表公示" }, { "access_state": "open", "claim_ids": [ "clm-tongfu-hbs-designed-capacity-units", "clm-tongfu-hbs-trial-production-ceiling" ], "claimed_event_date": "2024-11-30", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "项目处于试生产阶段，暂未验收；设计规模为3.6万片/年（200万块/年）高带宽存储芯粒产品。", "id": "src-tongfu-hbs-change-analysis-2025", "landing_page_url": "https://www.tfme.com/news_detail/3.html", "limitations": [ "The source never uses HBM and names no DRAM die owner, base die/PHY, customer or accelerator.", "The 片/块 capacity-unit mapping requires reconciliation; both are design capacity, not qualified or actual output.", "Tool counts are disclosed but models and vendors are not." ], "locally_archived_path": null, "locator": "PDF pp. 5, 8, 11–14 and 20–25", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-06-09", "publication_date_unknown_reason": null, "publisher": "南通通富微电子有限公司", "record_type": "source", "retrieved_content_sha256": "146c97ebae22b4da2d7d8b961c816003bee1e178dad3de817341dfe345c538e5", "rights_boundary": "link_only", "source_id": "src-tongfu-hbs-change-analysis-2025", "source_type": "environmental_impact_analysis", "title": "南通通富微电子有限公司高带宽存储芯粒先进封装技术研发和产线建设项目一般变动环境影响分析", "translation_en": "The project was in trial production and not yet accepted; design scale is stated as 36,000 片/year (2 million 块/year) of high-bandwidth-storage-chiplet products.", "url": "https://omo-oss-file110.thefastfile.com/portal-saas/pg2025022515115656448/cms/file/南通通富微电子一般变动环境影响分析报告.pdf", "label": "南通通富微电子有限公司高带宽存储芯粒先进封装技术研发和产线建设项目一般变动环境影响分析" }, { "access_state": "open", "claim_ids": [ "clm-relationship-tsmc-owns-nanjing", "clm-relationship-tsmc-owns-shanghai", "clm-tsmc-mainland-fabs" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The fab network lists Fab 10 in Shanghai and Fab 16 in Nanjing.", "id": "src-tsmc-annual-2025", "limitations": [ "Facility listing does not by itself establish current tool BOM, local-supplier share, customers, utilization, or output." ], "locally_archived_path": null, "locator": "Manufacturing facilities / fab network", "original_language": "en", "primary_status": "primary", "publication_date": "2026-04-17", "publication_date_unknown_reason": null, "publisher": "Taiwan Semiconductor Manufacturing Company Limited", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-tsmc-annual-2025", "source_type": "annual_report", "title": "TSMC 2025 Annual Report", "translation_en": "Same as original.", "url": "https://investor.tsmc.com/sites/ir/annual-report/2025/2025%20Annual%20Report_E.pdf", "label": "TSMC 2025 Annual Report" }, { "access_state": "open", "claim_ids": [ "clm-relationship-umc-owns-united-semi-xiamen", "clm-umc-xiamen-volume-and-design-capacity" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "United Semiconductor (Xiamen) began volume production in 2016 and has a design capacity of 50,000 12-inch wafers per month when fully equipped.", "id": "src-umc-fab-information", "limitations": [ "Designed capacity is not current installed, utilized, actual output, yield, or customer mix." ], "locally_archived_path": null, "locator": "United Semiconductor (Xiamen) row", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "United Microelectronics Corporation", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-umc-fab-information", "source_type": "company_facility_page", "title": "Fab Information", "translation_en": "Same as original.", "url": "https://www.umc.com/en/Html/fab_information", "label": "Fab Information" }, { "access_state": "open", "claim_ids": [ "clm-uprecision-2023-small-batch-ceiling" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "纳米级运动及控制系统在该截止时点尚未实现产业化，公司称具备小批量生产能力。", "id": "src-uprecision-listing-response-2023", "limitations": [ "Capability statement is not a scanner/fab delivery or site-acceptance receipt." ], "locally_archived_path": null, "locator": "printed 8-1-4-3", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2023-12-29", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-uprecision-listing-response-2023", "source_type": "exchange_filing", "title": "关于北京华卓精科科技股份有限公司首次公开发行股票并在科创板上市的上市委会议意见落实函的回复", "translation_en": "At the filing cutoff, the nanometre motion/control system had not been industrialized; the company reported small-batch production capability.", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202312/000571_20231229_4ZM1.pdf", "label": "关于北京华卓精科科技股份有限公司首次公开发行股票并在科创板上市的上市委会议意见落实函的回复" }, { "access_state": "open", "claim_ids": [ "clm-relationship-uprecision-company-k-2024-acceptance", "clm-uprecision-company-k-acceptance-2024", "clm-uprecision-motion-bonding-products" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "12英寸双工作台超精密系统平均运动偏差优于4.5nm；2024年K公司集中验收带来收入增长。", "id": "src-uprecision-prospectus-2026", "limitations": [ "Company K remains anonymous and must not be resolved to SMEE.", "Subsystem commercialization and customer acceptance do not establish scanner delivery, fab insertion, qualified layer or high-volume use." ], "locally_archived_path": null, "locator": "printed 1-1-103–104, 1-1-165, 1-1-230 and 1-1-389", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-06-30", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-uprecision-prospectus-2026", "source_type": "exchange_filing", "title": "北京华卓精科科技股份有限公司招股说明书", "translation_en": "The 12-inch dual-work-position ultra-precision subsystem is reported below 4.5 nm mean motion deviation; anonymous Company K accepted batches in 2024.", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202606/002213_20260630_2DQN.pdf", "label": "北京华卓精科科技股份有限公司招股说明书" }, { "access_state": "open", "claim_ids": [ "clm-relationship-uprecision-supplies-smee-dual-stage-2020", "clm-uprecision-smee-stage-unaccepted" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "公司2020年4月向上海微电子发货一台光刻机双工件台，尚未通过验收。", "id": "src-uprecision-round2-2023", "limitations": [ "Subsystem shipment only; no scanner model, fab, later acceptance, qualified layer or volume use." ], "locally_archived_path": null, "locator": "printed 8-1-2-4；另见8-1-2-12、8-1-2-69及后续页", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2023-12-29", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-uprecision-round2-2023", "source_type": "exchange_filing", "title": "关于北京华卓精科科技股份有限公司首次公开发行股票并在科创板上市申请文件第二轮审核问询函的回复", "translation_en": "In April 2020 the company shipped one lithography dual-wafer stage to SMEE; it had not passed acceptance.", "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202312/000571_20231229_25V2.pdf", "label": "关于北京华卓精科科技股份有限公司首次公开发行股票并在科创板上市申请文件第二轮审核问询函的回复" }, { "access_state": "open", "claim_ids": [ "clm-relationship-util-001", "clm-util-001", "clm-util-002", "clm-util-003" ], "claimed_event_date": "2024-02-05", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "确认亚翔集成成为12英寸存储器晶圆制造基地二期项目无尘室系统包的承包单位", "id": "src-util-001", "limitations": [ "The issuer expressly says a formal project contract still had to be signed and construction, settlement and payment details remained subject to that contract." ], "locally_archived_path": null, "locator": "Announcement 2024-003; web lines 243-281, especially 251-275", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2024-02-06", "publication_date_unknown_reason": null, "publisher": "亚翔系统集成科技（苏州）股份有限公司 / 上海证券报", "record_type": "source", "rights_boundary": "Public statutory disclosure; only short excerpts and locators recorded; no local source archive created.", "source_claim_posture": "primary", "source_id": "src-util-001", "source_type": "issuer_statutory_disclosure", "title": "亚翔系统集成科技（苏州）股份有限公司关于公司重大项目中标的公告", "translation_en": "The award notice confirmed L&K as contractor for the cleanroom-system package of the Phase II 12-inch memory-wafer manufacturing base.", "url": "https://paper.cnstock.com/html/2024-02/06/content_1875556.htm", "label": "亚翔系统集成科技（苏州）股份有限公司关于公司重大项目中标的公告" }, { "access_state": "open", "claim_ids": [ "clm-relationship-util-002", "clm-relationship-util-003", "clm-util-004", "clm-util-005", "clm-util-006", "clm-util-007", "clm-util-008", "clm-util-009" ], "claimed_event_date": "2023-06-03", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "十一科技、上海四建与华虹半导体制造（无锡）有限公司完成了《建设项目工程总承包合同》的正式签署", "id": "src-util-002", "limitations": [ "Formal signature is proven, but effectiveness was conditional on specified internal, shareholder and government approvals. Completion, site acceptance, production qualification, uptime and output are not proven." ], "locally_archived_path": null, "locator": "Announcement 临2023-029; web lines 194-303, especially 204-226, 238-247, 265-280", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2023-06-03", "publication_date_unknown_reason": null, "publisher": "无锡市太极实业股份有限公司 / 上海证券报", "record_type": "source", "rights_boundary": "Public statutory disclosure; only short excerpts and locators recorded; no local source archive created.", "source_claim_posture": "primary", "source_id": "src-util-002", "source_type": "issuer_statutory_disclosure", "title": "无锡市太极实业股份有限公司关于子公司十一科技中标重大项目工程的进展公告", "translation_en": "11th Technology, Shanghai Construction No. 4 and Hua Hong Semiconductor Manufacturing (Wuxi) formally signed the construction EPC contract.", "url": "https://paper.cnstock.com/html/2023-06/03/content_1776018.htm", "label": "无锡市太极实业股份有限公司关于子公司十一科技中标重大项目工程的进展公告" }, { "access_state": "open", "claim_ids": [ "clm-relationship-util-004", "clm-util-010", "clm-util-011" ], "claimed_event_date": "2025-01-23", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "成功中标厦门士兰集宏半导体有限公司组织的“8英寸SIC功率器件芯片制造生产新项目（一期）酸碱废气&PGEX系统”项目", "id": "src-util-003", "limitations": [ "No award amount, signed contract, installation, acceptance or commissioning receipt is published. The 720,000 wafers/year figure is a two-phase eventual design target and not Phase I installed capacity or output." ], "locally_archived_path": null, "locator": "Web lines 39-50; award at line 43 and two-phase project description at line 47", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-01-23", "publication_date_unknown_reason": null, "publisher": "上海盛剑科技股份有限公司", "record_type": "source", "rights_boundary": "Public supplier webpage; only short excerpts and locators recorded; no local source archive created.", "source_claim_posture": "primary_vendor_report", "source_id": "src-util-003", "source_type": "official_supplier_project_notice", "title": "喜讯 | 盛剑科技中标厦门士兰集宏半导体有限公司项目", "translation_en": "Shengjian reported winning Xiamen Silan Jihong Semiconductor's Phase I acid/alkali exhaust and PGEX system project for a new 8-inch SiC power-device wafer line.", "url": "https://www.sheng-jian.com/news_details/386.html", "label": "喜讯 | 盛剑科技中标厦门士兰集宏半导体有限公司项目" }, { "access_state": "indexed_direct_open_error", "claim_ids": [ "clm-relationship-util-005", "clm-util-012", "clm-util-013", "clm-util-014" ], "claimed_event_date": "2026-05-11", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "华康洁净中标越润集成电路（绍兴）有限公司“下一代异构集成先进封装技术及DDIC项目”工程总承包，中标金额1.059亿元", "id": "src-util-004", "limitations": [ "Supplier-authored award notice. No counterparty confirmation, signed contract, installation, acceptance, production qualification or output receipt was located." ], "locally_archived_path": null, "locator": "Search-indexed full official article; title, publication timestamp, award paragraph, project-detail block and construction-scope block", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-05-11", "publication_date_unknown_reason": null, "publisher": "武汉华康世纪洁净科技股份有限公司", "record_type": "source", "rights_boundary": "Public supplier webpage; direct fetch returned an internal error and was not bypassed. Only the indexed excerpt and fields are recorded.", "source_claim_posture": "primary_vendor_report", "source_id": "src-util-004", "source_type": "official_supplier_project_notice", "title": "华康洁净中标越润高端封测基地项目 强链国产半导体", "translation_en": "Huakang reported winning YueRun Integrated Circuit (Shaoxing)'s EPC project for next-generation heterogeneous-integration advanced packaging and DDIC, for CNY 105.9 million.", "url": "https://www.whhksj.com/details/217.html", "label": "华康洁净中标越润高端封测基地项目 强链国产半导体" }, { "access_state": "open", "claim_ids": [ "clm-relationship-util-006", "clm-util-015", "clm-util-016" ], "claimed_event_date": "2026-05-07", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "供应商名称：北京中科科仪股份有限公司……超净半导体真空测试系统……KYKY等……定制……1套……￥1,168,000.00", "id": "src-util-005", "limitations": [ "The award proves vendor, purchaser, system, model class, quantity and price. It does not prove delivery, installation, acceptance, semiconductor-fab production use or component origin." ], "locally_archived_path": null, "locator": "Project OITC-G260360319; web lines 13-23 and 37-52", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-05-07", "publication_date_unknown_reason": null, "publisher": "中国政府采购网 / 中华人民共和国财政部国库司", "record_type": "source", "rights_boundary": "Public government procurement result; only short excerpts and locators recorded; no local source archive created.", "source_claim_posture": "primary", "source_id": "src-util-005", "source_type": "government_procurement_award", "title": "中国科学院高能物理研究所超净半导体真空测试系统采购项目中标公告", "translation_en": "Supplier: Beijing KYKY; ultraclean semiconductor vacuum test system; KYKY et al.; custom; one set; CNY 1,168,000.", "url": "https://www.ccgp.gov.cn/cggg/zygg/zbgg/202605/t20260507_26518210.htm", "label": "中国科学院高能物理研究所超净半导体真空测试系统采购项目中标公告" }, { "access_state": "open", "claim_ids": [ "clm-relationship-verisilicon-depends-globalfoundries-22fdx", "clm-verisilicon-gf-22fdx-dependency" ], "claimed_event_date": "2025-09-24", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "The wireless IP platform is built on GlobalFoundries' 22FDX 22nm FD-SOI process.", "id": "src-verisilicon-gf-22fdx-2025", "limitations": [ "Customers and chips are anonymous; facility and shipment split are undisclosed." ], "locally_archived_path": null, "locator": "opening and customer-shipment paragraphs", "original_language": "en", "primary_status": "primary", "publication_date": "2025-09-24", "publication_date_unknown_reason": null, "publisher": "VeriSilicon Microelectronics (Shanghai) Co., Ltd.", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-verisilicon-gf-22fdx-2025", "source_type": "company_product_announcement", "title": "VeriSilicon Introduces FD-SOI Wireless IP Platform", "translation_en": "Same as original.", "url": "https://www.verisilicon.com/en/PressRelease/WirelessIP", "label": "VeriSilicon Introduces FD-SOI Wireless IP Platform" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-wazam" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "浙江华正新材料股份有限公司（以下简称“华正新材”）", "id": "src-wazam-about", "limitations": [ "The page states group affiliation but not the exact immediate legal shareholder." ], "locally_archived_path": null, "locator": "Opening paragraph and site footer", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "浙江华正新材料股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-wazam-about", "source_type": "official_company_page", "title": "了解我们", "translation_en": "Zhejiang Huazheng New Materials Co., Ltd., referred to as Huazheng New Materials.", "url": "https://www.wazam.com.cn/article/list/28.html", "label": "了解我们" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-wazam" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "浙江华正新材料股份有限公司；股票代码：603186", "id": "src-wazam-company-info", "limitations": [ "The official English field contains the spelling 'Zhengjiang'; the current site brand is WAZAM." ], "locally_archived_path": null, "locator": "Company information table", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2017-09-27", "publication_date_unknown_reason": null, "publisher": "浙江华正新材料股份有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-wazam-company-info", "source_type": "official_company_page", "title": "公司信息", "translation_en": "Zhejiang Huazheng New Material Co., Ltd.; stock code 603186.", "url": "https://en.wazam.com.cn/article/detail-56.html", "label": "公司信息" }, { "access_state": "open", "claim_ids": [ "clm-hubei-tongge-microelectronics-portfolio-20260801", "clm-wg-tech-jiangxi-group-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "The group identifies WG Tech and affiliated Hubei Tongge Microelectronics and describes glass circuit plates, through-glass vias, PVD copper and multilayer glass circuits.", "id": "src-wgtech-tongge-profile-20260801", "limitations": [ "The compound seed covers two entities. Affiliate status is supported, but exact equity and product-to-customer relationships are not." ], "locally_archived_path": null, "locator": "group and affiliate overview; product descriptions", "original_language": "en", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "WG Tech", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-wgtech-tongge-profile-20260801", "source_type": "company_profile", "title": "WG Tech Group", "translation_en": "The group identifies WG Tech and affiliated Hubei Tongge Microelectronics and describes glass circuit plates, through-glass vias, PVD copper and multilayer glass circuits.", "url": "https://www.wgtechjx.com/", "label": "WG Tech Group" }, { "access_state": "open", "claim_ids": [ "clm-seed-identity-willsemi" ], "claimed_event_date": "2017-05-04", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "上海韦尔半导体股份有限公司；证券代码为603501", "id": "src-will-sse-listing", "limitations": [ "This historical notice must not be used as the current legal name." ], "locally_archived_path": null, "locator": "Notice body", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2017-05-03", "publication_date_unknown_reason": null, "publisher": "上海证券交易所", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-will-sse-listing", "source_type": "exchange_notice", "title": "关于上海韦尔半导体股份有限公司人民币普通股股票上市交易的公告", "translation_en": "Will Semiconductor Co., Ltd. Shanghai; security code 603501.", "url": "https://big5.sse.com.cn/site/cht/www.sse.com.cn/disclosure/announcement/listing/c/c_20170502_4304662.shtml", "label": "关于上海韦尔半导体股份有限公司人民币普通股股票上市交易的公告" }, { "access_state": "open", "claim_ids": [ "clm-witmem-identity-wtm2101-and-wtm8-states" ], "claimed_event_date": "2024-11-05", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "企业名称杭州知存算力科技有限公司，统一社会信用代码91110108MA0188UJXA。", "id": "src-witmem-government-equity-20241105", "limitations": [ "Identity/equity record only." ], "locally_archived_path": null, "locator": "lines 2–27; shareholder table lines 39–44", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2024-11-05", "publication_date_unknown_reason": null, "publisher": "北京市公共资源交易服务平台", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-witmem-government-equity-20241105", "source_type": "government_equity_record", "title": "杭州知存算力科技有限公司企业国有产权交易披露", "translation_en": "The record identifies Hangzhou Zhicun Computing Technology Co., Ltd. and registration code 91110108MA0188UJXA.", "url": "https://ggzyfw.beijing.gov.cn/jyxxgqgpplxx/20241105/4719635.html", "label": "杭州知存算力科技有限公司企业国有产权交易披露" }, { "access_state": "open", "claim_ids": [ "clm-witmem-identity-wtm2101-and-wtm8-states" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "杭州知存算力科技有限公司 / Hangzhou Zhicun (Witmem) Technology Co., Ltd.", "id": "src-witmem-home", "limitations": [ "Legal identity and portfolio statement only." ], "locally_archived_path": null, "locator": "company description lines 60–82; footer lines 172–198", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "杭州知存算力科技有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-witmem-home", "source_type": "company_home_page", "title": "知存科技官网", "translation_en": "Same as original.", "url": "https://www.witmem.com/", "label": "知存科技官网" }, { "access_state": "open", "claim_ids": [ "clm-witmem-wtm2101-specification-and-shipments" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "WTM2101宣称超过50GOPS、1.8M模型参数、2.6mm×3.2mm，并称达到KK级出货。", "id": "src-witmem-wtm2101-product", "limitations": [ "Audited units, foundry, OSAT, legal customer, yield and field reliability are undisclosed." ], "locally_archived_path": null, "locator": "product specifications and shipment statement", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "杭州知存算力科技有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-witmem-wtm2101-product", "source_type": "company_product_page", "title": "WTM2101", "translation_en": "WTM2101 lists over 50 GOPS, 1.8M model parameters, a 2.6 mm by 3.2 mm die and a vendor KK-level shipment claim.", "url": "https://www.witmem.com/WTM2101.php", "label": "WTM2101" }, { "access_state": "open", "claim_ids": [ "clm-witmem-wtm8-trial-state" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "WTM-8实现成功试产。", "id": "src-witmem-wtm8-about", "limitations": [ "Trial production is not commercial release, customer qualification or volume shipment." ], "locally_archived_path": null, "locator": "about-page lines 57–63", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "杭州知存算力科技有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-witmem-wtm8-about", "source_type": "company_timeline", "title": "关于知存", "translation_en": "WTM-8 achieved successful trial production.", "url": "https://www.witmem.com/about.php", "label": "关于知存" }, { "access_state": "open", "claim_ids": [ "clm-witmem-wtm8-trial-state" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "WTM-8产品页标注Coming Soon，并宣称超过24TOPS、低于3W和3D异质键合。", "id": "src-witmem-wtm8-product", "limitations": [ "Foundry, bonding facility/tool/pitch/yield, OSAT, die suppliers, customer and shipment are undisclosed." ], "locally_archived_path": null, "locator": "product page", "original_language": "zh-CN", "primary_status": "primary", "publication_date": null, "publication_date_unknown_reason": "No visible publication date was captured on the official page.", "publisher": "杭州知存算力科技有限公司", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-witmem-wtm8-product", "source_type": "company_product_page", "title": "WTM-8", "translation_en": "The WTM-8 page is marked Coming Soon and claims over 24 TOPS, below 3 W and 3D heterogeneous bonding.", "url": "https://www.witmem.com/WTM-8.php", "label": "WTM-8" }, { "access_state": "open", "claim_ids": [ "clm-ymtc-phase3-construction" ], "claimed_event_date": "2025-09-01", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "长江存储三期项目于2025年9月开工。", "id": "src-wuhan-ymtc-phase3", "limitations": [ "Construction start is not tool move-in, installed capacity, first wafer, qualification or production." ], "locally_archived_path": null, "locator": "project summary", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-01-08", "publication_date_unknown_reason": null, "publisher": "武汉市人民政府", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-wuhan-ymtc-phase3", "source_type": "government_project_record", "title": "长江存储三期项目建设进展", "translation_en": "YMTC Phase III began construction in September 2025.", "url": "https://www.wuhan.gov.cn/sy/whyw/202601/t20260108_2708121.shtml", "label": "长江存储三期项目建设进展" }, { "access_state": "open", "claim_ids": [ "clm-skhynix-wuxi-current-legal-entity" ], "claimed_event_date": "2025-12-25", "content_hash": null, "date_checked": "2026-07-29", "excerpt_original": "建设单位：SK海力士半导体（中国）有限公司；建设地点：中国江苏省无锡高新区综合保税区K7地块。", "id": "src-wuxi-skhynix-environment-2025", "limitations": [ "Waste-transfer approval proves current entity/site identity, not DRAM generation, fab capacity, utilization, output, yield or production-tool qualification." ], "locally_archived_path": null, "locator": "正文，一、建设单位；二、建设地点", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2025-12-25", "publication_date_unknown_reason": null, "publisher": "无锡市新吴生态环境局", "record_type": "source", "rights_boundary": "link_only", "source_id": "src-wuxi-skhynix-environment-2025", "source_type": "government_environmental_record", "title": "SK海力士半导体（中国）有限公司固体（危险）废物跨省转移审核意见的公告", "translation_en": "Project entity: SK hynix Semiconductor (China) Ltd.; site: K7, Wuxi 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"link_only", "source_id": "src-xingfa-profile-20260801", "source_type": "company_profile", "title": "About Xingfa Group", "translation_en": "The company describes electronic-grade chemicals, etching fluids, and integrated-circuit-grade phosphoric and sulfuric acids.", "url": "https://www.xingfagroup.com/en/index.php/About", "label": "About Xingfa Group" }, { "access_state": "open", "claim_ids": [ "clm-kunshan-kinglai-xinlai-portfolio-20260801" ], "claimed_event_date": null, "content_hash": null, "date_checked": "2026-08-01", "excerpt_original": "公司主营业务之一为洁净应用材料和高纯及超高纯应用材料的研发、生产与销售，并定义真空、腔体和流体输送等业务术语。", "id": "src-xinlai-annual-2025", "limitations": [ "Issuer portfolio evidence only; it does not identify an exact semiconductor part, fab, order, installation or qualification state." ], "locally_archived_path": null, "locator": "2025年年度报告；释义和主营业务部分", "original_language": "zh-CN", "primary_status": "primary", "publication_date": "2026-04-28", "publication_date_unknown_reason": null, 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"src-atlas-ccf15b66682ce2ee", "source_id": "src-atlas-ccf15b66682ce2ee", "record_type": "source", "label": "TechInsights findings reported by DigiTimes", "title": "TechInsights findings reported by DigiTimes", "publisher": "TechInsights findings reported by DigiTimes", "url": "https://www.digitimes.com/news/a20251005PD200/huawei-ascend-tsmc-techinsights-samsung.html", "primary_status": "secondary", "public_evidence_state": "independent", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-cf230d086080b8e8", "source_id": "src-atlas-cf230d086080b8e8", "record_type": "source", "label": "Tencent Cloud PTX1 instance overview", "title": "Tencent Cloud PTX1 instance overview", "publisher": "Tencent Cloud PTX1 instance overview", "url": "https://cloud.tencent.com/document/product/560/19700", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-d187a0cd4aa5e239", "source_id": "src-atlas-d187a0cd4aa5e239", "record_type": "source", "label": "Axera AX650N product announcement", "title": "Axera AX650N product announcement", "publisher": "Axera AX650N product announcement", "url": "https://axera-tech.com/en/news/2819.html", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-d39f0fa317efd419", "source_id": "src-atlas-d39f0fa317efd419", "record_type": "source", "label": "FCC-hosted MLU370-M8 manual", "title": "FCC-hosted MLU370-M8 manual", "publisher": "FCC-hosted MLU370-M8 manual", "url": "https://fcc.report/FCC-ID/2ARVF-MLU370-M8/5528126.pdf", "primary_status": "secondary", "public_evidence_state": "independent", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-d3cd8f187d385fed", "source_id": "src-atlas-d3cd8f187d385fed", "record_type": "source", "label": "DenglinAI Goldwasser L-series page", "title": "DenglinAI Goldwasser L-series page", "publisher": "DenglinAI Goldwasser L-series page", "url": "https://denglinai.com/h-col-251.html", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-d3da566ac27187d4", "source_id": "src-atlas-d3da566ac27187d4", "record_type": "source", "label": "Alibaba announcement of Hanguang 800", "title": "Alibaba announcement of Hanguang 800", "publisher": "Alibaba announcement of Hanguang 800", "url": "https://www.alibabagroup.com/en-US/document-1491206538574954496", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-dbf1c379241d20f7", "source_id": "src-atlas-dbf1c379241d20f7", "record_type": "source", "label": "Enflame Hot Chips presentation", "title": "Enflame Hot Chips presentation", "publisher": "Enflame Hot Chips presentation", "url": "https://hc33.hotchips.org/assets/program/conference/day2/Enflame_Final%20Deck.pdf", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-dc14099b302e74a8", "source_id": "src-atlas-dc14099b302e74a8", "record_type": "source", "label": "Vastai VGX VA16 announcement", "title": "Vastai VGX VA16 announcement", "publisher": "Vastai VGX VA16 announcement", "url": "https://www.vastaitech.com/newsroom/company-news/56", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-dd89e93294f43dd9", "source_id": "src-atlas-dd89e93294f43dd9", "record_type": "source", "label": "DenglinAI corporate and product site", "title": "DenglinAI corporate and product site", "publisher": "DenglinAI corporate and product site", "url": "https://denglinai.com/", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-e23d1506d07d833b", "source_id": "src-atlas-e23d1506d07d833b", "record_type": "source", "label": "Vastai product overview", "title": "Vastai product overview", "publisher": "Vastai product overview", "url": "https://www.vastaitech.com/", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-e65f50446f1d0405", "source_id": "src-atlas-e65f50446f1d0405", "record_type": "source", "label": "AWS Trainium", "title": "AWS Trainium", "publisher": "AWS Trainium", "url": "https://aws.amazon.com/machine-learning/trainium/", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-f0377f591ec0d868", "source_id": "src-atlas-f0377f591ec0d868", "record_type": "source", "label": "Innosilicon Fenghua 3 launch article", "title": "Innosilicon Fenghua 3 launch article", "publisher": "Innosilicon Fenghua 3 launch article", "url": "https://www.innosilicon.cn/news/37", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-f3a5d7c78fc4caf5", "source_id": "src-atlas-f3a5d7c78fc4caf5", "record_type": "source", "label": "SOPHGO English company and product history", "title": "SOPHGO English company and product history", "publisher": "SOPHGO English company and product history", "url": "https://en.sophgo.com/about-us/index.html", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-f41e75a6d3a6a02c", "source_id": "src-atlas-f41e75a6d3a6a02c", "record_type": "source", "label": "Horizon Journey 6", "title": "Horizon Journey 6", "publisher": "Horizon Journey 6", "url": "https://en.horizon.auto/solutions/horizon-journey", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-f499ad50e806df9c", "source_id": "src-atlas-f499ad50e806df9c", "record_type": "source", "label": "TrendForce China launch report", "title": "TrendForce China launch report", "publisher": "TrendForce China launch report", "url": "https://www.trendforce.cn/industry-news/semiconductors/20260714-6437.html", "primary_status": "secondary", "public_evidence_state": "reported", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-f61a067a7a89d767", "source_id": "src-atlas-f61a067a7a89d767", "record_type": "source", "label": "Corerain CAISA 4.0 architecture and RainBuilder page", "title": "Corerain CAISA 4.0 architecture and RainBuilder page", "publisher": "Corerain CAISA 4.0 architecture and RainBuilder page", "url": "https://www.corerain.com/caisa.html", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-fd28c3b1a54de001", "source_id": "src-atlas-fd28c3b1a54de001", "record_type": "source", "label": "NVIDIA multi-node NVLink documentation", "title": "NVIDIA multi-node NVLink documentation", "publisher": "NVIDIA multi-node NVLink documentation", "url": "https://docs.nvidia.com/multi-node-nvlink-systems/index.html", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" }, { "id": "src-atlas-ffa76aceb153b772", "source_id": "src-atlas-ffa76aceb153b772", "record_type": "source", "label": "Cambricon developer documentation", "title": "Cambricon developer documentation", "publisher": "Cambricon developer documentation", "url": "https://developer.cambricon.com/", "primary_status": "primary", "public_evidence_state": "official", "source_type": "atlas_product_family_source", "date_checked": "2026-08-01", "limitations": [ "Supports only the scoped product-family statements in the atlas record; it does not prove a complete supplier path." ], "atlas_source_origin": "product_family_dataset" } ], "gaps": [ { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-ai-accelerator-manufacturing-and-customer-receipts-20260729", "id": "gap-ai-accelerator-manufacturing-and-customer-receipts-20260729", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "model-specific foundry and facility", "memory supplier and exact device", "OSAT/package/substrate/interposer", "customer procurement and acceptance", "model shipment volume", "yield and independent workload receipt" ], "next_action": "Retrieve customer-origin procurement/acceptance records and supplier filings that name the same accelerator model and legal endpoints.", "priority": 1, "question": "Which named foundry, wafer facility, OSAT, memory supplier and customer closes each mainland accelerator model's manufacturing and shipment chain?", "record_type": "gap", "source_ids": [], "why_it_matters": "None of the ten accelerator lanes exposes a complete model-level foundry-memory-package-customer-yield chain." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-anji-named-customer-sku", "id": "gap-anji-named-customer-sku", "last_checked": "2026-07-29", "layer": "materials_grades_and_qualification", "missing_proof": [ "SKU/formulation", "composition/grade", "named facility", "qualification date", "lot volume", "defectivity/yield" ], "next_action": "Retrieve customer-side qualification or procurement evidence naming Anji SKU and layer.", "priority": 6, "question": "Which exact Anji SKU/formulation is qualified at which fab and layer?", "record_type": "gap", "source_ids": [], "why_it_matters": "Catalogue grade or family-level volume language does not establish fab qualification, lot quality or process yield." }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-baidu-p800-cluster-primary-test-asset", "id": "gap-baidu-p800-cluster-primary-test-asset", "last_checked": "2026-07-29", "layer": "downstream_validation", "missing_proof": [ "legal owner/operator", "site", "asset/BOM count", "SAT", "CAICT report/certificate", "test window/method", "uptime/failures", "utilization" ], "next_action": "Retrieve the CAICT report and Baidu facility/asset record identifying site and exact P800 count.", "priority": 3, "question": "Where are Baidu's P800 clusters, how many exact active cards do they contain, and what did CAICT test?", "record_type": "gap", "source_ids": [ "src-baidu-p800-large-cluster-caict-claim-20250723" ], "why_it_matters": "Framework, firmware, catalogue and powered-on states are below delivery, acceptance, qualification and sustained operation." }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-chinatelecom-framework-execution-bom", "id": "gap-chinatelecom-framework-execution-bom", "last_checked": "2026-07-29", "layer": "missing_supplier_or_customer_receipt", "missing_proof": [ "ZJZB-2024-18920 technical annex", "PO", "server model", "CPU/accelerator part", "quantity", "arrival/test acceptance", "facility" ], "next_action": "Retrieve a ZJZB-2024-18920 PO plus arrival/test acceptance and technical annex.", "priority": 3, "question": "Which China Telecom ARM-A/GPU server models and chip parts were ordered and accepted?", "record_type": "gap", "source_ids": [ "src-digital-china-chinatelecom-framework-20250423" ], "why_it_matters": "Framework, firmware, catalogue and powered-on states are below delivery, acceptance, qualification and sustained operation." }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-cmcc-framework-execution-bom", "id": "gap-cmcc-framework-execution-bom", "last_checked": "2026-07-29", "layer": "missing_supplier_or_customer_receipt", "missing_proof": [ "technical annex", "executed PO", "server model", "chip BOM", "quantity", "delivery", "SAT/asset receipt", "resource pool" ], "next_action": "Retrieve CMCC20240500088 technical specifications or an executed PO/SAT record.", "priority": 3, "question": "How many of the 842 China Mobile framework servers were ordered and accepted, with what chip BOM?", "record_type": "gap", "source_ids": [ "src-digital-china-cmcc-framework-20240824" ], "why_it_matters": "Framework, firmware, catalogue and powered-on states are below delivery, acceptance, qualification and sustained operation." }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-ctyun-hardware-procurement-acceptance", "id": "gap-ctyun-hardware-procurement-acceptance", "last_checked": "2026-07-29", "layer": "downstream_validation", "missing_proof": [ "procurement/PO", "supplier legal entity", "model/configuration", "quantity", "delivery/acceptance", "resource-pool owner/address", "utilization", "field reliability" ], "next_action": "Retrieve Tianyi Cloud/China Telecom procurement award or asset/SAT record naming PAK/PCH hardware and resource pool.", "priority": 3, "question": "Who legally supplied the Tianyi Cloud PAK/PCH hardware, in what quantity, and where was it accepted?", "record_type": "gap", "source_ids": [ "src-ctyun-ascend-cloud-20260508", "src-ctyun-cambricon-cloud-20260703" ], "why_it_matters": "The current receipt establishes a bounded state but does not close qualification, capacity, supplier identity or manufacturing scope." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-cxmt-public-hbm-product-receipt", "id": "gap-cxmt-public-hbm-product-receipt", "last_checked": "2026-07-29", "layer": "conventional_hbm", "missing_proof": [ "generation", "DRAM die", "TSV/KGD", "base die/PHY", "OSAT/facility", "customer", "yield", "shipment" ], "next_action": "Monitor CXMT and named counterparty filings for an exact HBM product/facility/qualification receipt.", "priority": 1, "question": "Does CXMT have a publicly receipted conventional-HBM product or qualified stack?", "record_type": "gap", "source_ids": [], "why_it_matters": "Process adjacency, trial production and industry context cannot close a qualified commercial HBM proof chain." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-cxmt-unnamed-osat-packaging", "id": "gap-cxmt-unnamed-osat-packaging", "last_checked": "2026-07-29", "layer": "conventional_hbm", "missing_proof": [ "OSAT legal entity", "facility", "package platform", "CXMT product", "qualification", "volume" ], "next_action": "Retrieve CXMT supplier filings or OSAT/customer disclosures naming both endpoints and package/product.", "priority": 1, "question": "Which legal OSATs package which CXMT DRAM products at which facilities?", "record_type": "gap", "source_ids": [], "why_it_matters": "Process adjacency, trial production and industry context cannot close a qualified commercial HBM proof chain." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-foreign-amkor-shanghai-current", "id": "gap-foreign-amkor-shanghai-current", "last_checked": "2026-07-29", "layer": "foreign_owned_mainland_operations", "missing_proof": [ "immediate ownership chain", "customer qualification/AVL", "capacity, utilization and yield" ], "next_action": "Retrieve a current customer qualification or AVL naming Amkor Shanghai C3 and the exact package platform.", "priority": 7, "question": "Which current package/test platforms and customers are qualified at Amkor Shanghai C3?", "record_type": "gap", "source_ids": [], "why_it_matters": "Foreign-owned mainland capacity must be separated from mainland ownership and still requires facility-specific process, capacity, qualification, output and dependency proof." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-foreign-ase-wuxi-operator", "id": "gap-foreign-ase-wuxi-operator", "last_checked": "2026-07-29", "layer": "foreign_owned_mainland_operations", "missing_proof": [ "immediate ownership chain", "package-platform qualification", "customer and capacity receipt" ], "next_action": "Retrieve a customer qualification/AVL naming Wuxi Tongzhi and the exact package platform.", "priority": 7, "question": "Which exact package/test flows are qualified at the resolved Wuxi Tongzhi operation?", "record_type": "gap", "source_ids": [], "why_it_matters": "Foreign-owned mainland capacity must be separated from mainland ownership and still requires facility-specific process, capacity, qualification, output and dependency proof." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-foreign-skhynix-wuxi-current", "id": "gap-foreign-skhynix-wuxi-current", "last_checked": "2026-07-29", "layer": "foreign_owned_mainland_operations", "missing_proof": [ "facility permit/EIA", "node and WSPM allocation by C2/C2F", "actual output and yield receipt" ], "next_action": "Retrieve C2/C2F permits or filings with node, WSPM, actual output and yield.", "priority": 7, "question": "What are the current node, wafer-capacity denominator, output, yield and supplier BOM for the resolved SK hynix Wuxi operation?", "record_type": "gap", "source_ids": [], "why_it_matters": "Foreign-owned mainland capacity must be separated from mainland ownership and still requires facility-specific process, capacity, qualification, output and dependency proof." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-grikin-named-customer", "id": "gap-grikin-named-customer", "last_checked": "2026-07-29", "layer": "materials_grades_and_qualification", "missing_proof": [ "named fab", "purity basis", "target drawing/model", "qualified layer", "shipment/consumption volume" ], "next_action": "Retrieve customer qualification, tender or acceptance naming GRIKIN target and layer.", "priority": 6, "question": "Which named fab qualifies GRIKIN's 300 mm copper target and on what layer?", "record_type": "gap", "source_ids": [], "why_it_matters": "Catalogue grade or family-level volume language does not establish fab qualification, lot quality or process yield." }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-h3c-supported-options-commercial-receipt", "id": "gap-h3c-supported-options-commercial-receipt", "last_checked": "2026-07-29", "layer": "downstream_validation", "missing_proof": [ "configured SKU/option code", "supplier legal entity", "order", "delivery", "acceptance", "customer/facility", "volume" ], "next_action": "Find an H3C order, tender, delivery/SAT or warranty asset record naming the option code.", "priority": 3, "question": "Which H3C supported Biren/Cambricon/CXMT/Hygon options were ordered, shipped and accepted?", "record_type": "gap", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "why_it_matters": "Framework, firmware, catalogue and powered-on states are below delivery, acceptance, qualification and sustained operation." }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-huate-project-capacity-qualification", "id": "gap-huate-project-capacity-qualification", "last_checked": "2026-07-29", "layer": "materials_grades_and_qualification", "missing_proof": [ "legal owner/operator", "facility/address", "commissioning/SAT", "installed and qualified capacity", "utilization/output", "grade/CoA", "customer qualification", "upstream BOM" ], "next_action": "Retrieve project EIA/acceptance and customer AVL for HBr, Si2H6, C4F6 and BCl3.", "priority": 4, "question": "Which Huate gas project has installed, qualified and utilized capacity at which legal facility?", "record_type": "gap", "source_ids": [ "src-huate-gas-annual-2025" ], "why_it_matters": "The current receipt establishes a bounded state but does not close qualification, capacity, supplier identity or manufacturing scope." }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-jcet-cxmt-unspecified-goods", "id": "gap-jcet-cxmt-unspecified-goods", "last_checked": "2026-07-29", "layer": "missing_supplier_or_customer_receipt", "missing_proof": [ "product/SKU", "facility", "process", "physical quantity", "qualification", "package/test scope", "HBM status" ], "next_action": "Retrieve the transaction contract or counterparty disclosure identifying the goods and process.", "priority": 3, "question": "What goods did JCET sell to CXMT in FY2025, and did they involve package/test services?", "record_type": "gap", "source_ids": [ "src-jcet-annual-2025" ], "why_it_matters": "The current receipt establishes a bounded state but does not close qualification, capacity, supplier identity or manufacturing scope." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-kfmi-mainland-fab-target", "id": "gap-kfmi-mainland-fab-target", "last_checked": "2026-07-29", "layer": "materials_grades_and_qualification", "missing_proof": [ "mainland legal fab", "target metal/grade/drawing", "tool and layer", "quantity", "qualification" ], "next_action": "Retrieve mainland customer AVL, tender, award or acceptance naming KFMI and the exact target.", "priority": 6, "question": "Which exact KFMI target metal/grade/model is qualified at a mainland fab?", "record_type": "gap", "source_ids": [], "why_it_matters": "Catalogue grade or family-level volume language does not establish fab qualification, lot quality or process yield." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-nata-customer-qualification", "id": "gap-nata-customer-qualification", "last_checked": "2026-07-29", "layer": "materials_grades_and_qualification", "missing_proof": [ "named customer/facility", "molecule and grade", "CoA impurity limits", "delivery acceptance", "qualified layer" ], "next_action": "Retrieve customer AVL, tender, acceptance or issuer filing naming Nata molecule, grade and endpoint.", "priority": 6, "question": "Which Nata gas/precursor grade is qualified at which legal fab and process?", "record_type": "gap", "source_ids": [], "why_it_matters": "Catalogue grade or family-level volume language does not establish fab qualification, lot quality or process yield." }, { "completion_state": "source_backed", "evidence_state": "UNRESOLVED", "gap_id": "gap-nio-nx9031-manufacturing-chain", "id": "gap-nio-nx9031-manufacturing-chain", "last_checked": "2026-07-29", "layer": "fabless_product_and_foundry_dependency", "missing_proof": [ "historical legal designer/assignee", "foundry/facility", "process", "package/OSAT", "yield", "delivered vehicle count", "field reliability" ], "next_action": "Retrieve NIO/GeniTech manufacturing evidence or physical analysis plus ET9 delivery records.", "priority": 4, "question": "Who fabricated, packaged and tested NX9031, and how many ET9 vehicles carry it?", "record_type": "gap", "source_ids": [ "src-nio-auto-shanghai-20250423", "src-nio-genitech-investment-20260226" ], "why_it_matters": "The current receipt establishes a bounded state but does not close qualification, capacity, supplier identity or manufacturing scope." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-nsig-shanghai-taiyuan-capacity-split", "id": "gap-nsig-shanghai-taiyuan-capacity-split", "last_checked": "2026-07-29", "layer": "silicon_wafers", "missing_proof": [ "named facility and operator", "installed/qualified/output state", "grade mix", "yield" ], "next_action": "Retrieve facility-level NSIG subsidiary filings, permits or inquiry replies with the capacity denominator.", "priority": 8, "question": "How is NSIG's 850,000-wafer monthly group capacity split among named Shanghai and Taiyuan facilities?", "record_type": "gap", "source_ids": [], "why_it_matters": "An aggregate company statement cannot be promoted into a synthetic facility record." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-accepted-result-economics", "id": "gap-process-accepted-result-economics", "last_checked": "2026-07-29", "layer": "workload", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Accepted output, cost, energy, reliability and margin.", "priority": 30, "question": "No matched cost-per-accepted-task or joules-per-task receipt", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, accepted output, cost, energy, reliability and margin cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-analog-design", "id": "gap-process-analog-design", "last_checked": "2026-07-29", "layer": "eda", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Analog and custom design.", "priority": 7, "question": "Named PDK and production-chip receipts are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, analog and custom design cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-analog-rf-power-sensor", "id": "gap-process-analog-rf-power-sensor", "last_checked": "2026-07-29", "layer": "fabrication", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Analog, RF, power, MEMS and sensor fabrication.", "priority": 30, "question": "Facility/product/customer and qualification joins are incomplete", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, analog, rf, power, mems and sensor fabrication cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-boards-optics-network", "id": "gap-process-boards-optics-network", "last_checked": "2026-07-29", "layer": "systems", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Boards, optics and networking.", "priority": 30, "question": "Component-level origin, topology and acceptance are unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, boards, optics and networking cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-channel-authorized-distribution", "id": "gap-process-channel-authorized-distribution", "last_checked": "2026-07-29", "layer": "distribution", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Authorized semiconductor distribution.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for authorized semiconductor distribution", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, authorized semiconductor distribution cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-channel-equipment-material-agents", "id": "gap-process-channel-equipment-material-agents", "last_checked": "2026-07-29", "layer": "distribution", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Equipment and material agents and service organizations.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for equipment and material agents and service organizations", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, equipment and material agents and service organizations cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-channel-inventory-spot-resale", "id": "gap-process-channel-inventory-spot-resale", "last_checked": "2026-07-29", "layer": "distribution", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Inventory ownership and spot-market resale.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for inventory ownership and spot-market resale", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, inventory ownership and spot-market resale cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-channel-module-distribution-assembly", "id": "gap-process-channel-module-distribution-assembly", "last_checked": "2026-07-29", "layer": "distribution", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Module distribution and assembly boundaries.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for module distribution and assembly boundaries", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, module distribution and assembly boundaries cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-ai-accelerator", "id": "gap-process-chip-ai-accelerator", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: AI accelerator products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for ai accelerator products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, ai accelerator products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-architecture", "id": "gap-process-chip-architecture", "last_checked": "2026-07-29", "layer": "design", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Chip architecture.", "priority": 4, "question": "DF1000 architecture remains vendor-reported and physically under-specified", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, chip architecture cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-automotive-soc", "id": "gap-process-chip-automotive-soc", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Automotive SoC products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for automotive soc products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, automotive soc products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-cpu", "id": "gap-process-chip-cpu", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: CPU products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for cpu products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, cpu products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-display-driver", "id": "gap-process-chip-display-driver", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Display-driver products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for display-driver products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, display-driver products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-dsp", "id": "gap-process-chip-dsp", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: DSP products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for dsp products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, dsp products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-fpga", "id": "gap-process-chip-fpga", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: FPGA products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for fpga products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, fpga products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-gpu", "id": "gap-process-chip-gpu", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: GPU products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for gpu products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, gpu products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-industrial-security", "id": "gap-process-chip-industrial-security", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Industrial-control and security-chip products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for industrial-control and security-chip products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, industrial-control and security-chip products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-isp-vision", "id": "gap-process-chip-isp-vision", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: ISP and vision-processing products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for isp and vision-processing products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, isp and vision-processing products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-mcu", "id": "gap-process-chip-mcu", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: MCU products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for mcu products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, mcu products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-modem-connectivity", "id": "gap-process-chip-modem-connectivity", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Modem and connectivity products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for modem and connectivity products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, modem and connectivity products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-network-switch-optical-dsp", "id": "gap-process-chip-network-switch-optical-dsp", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Network-switch and optical-DSP products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for network-switch and optical-dsp products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, network-switch and optical-dsp products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-pmic-analog", "id": "gap-process-chip-pmic-analog", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: PMIC and analog products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for pmic and analog products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, pmic and analog products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-power-device", "id": "gap-process-chip-power-device", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power-semiconductor products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for power-semiconductor products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, power-semiconductor products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-rf", "id": "gap-process-chip-rf", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: RF semiconductor products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for rf semiconductor products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, rf semiconductor products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-sensors", "id": "gap-process-chip-sensors", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Sensor products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for sensor products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, sensor products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-chip-storage-controller-interface", "id": "gap-process-chip-storage-controller-interface", "last_checked": "2026-07-29", "layer": "chip_product", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Storage controllers and memory-interface products.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for storage controllers and memory-interface products", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, storage controllers and memory-interface products cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-clean-strip", "id": "gap-process-clean-strip", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Wet clean, dry clean and strip.", "priority": 30, "question": "Model/facility/layer/defectivity receipts remain sparse", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, wet clean, dry clean and strip cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-cleanroom-epc", "id": "gap-process-cleanroom-epc", "last_checked": "2026-07-29", "layer": "facilities", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Cleanroom EPC, vibration and contamination control.", "priority": 17, "question": "Facility-specific EPC contract ledger is unbuilt", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, cleanroom epc, vibration and contamination control cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-cmp", "id": "gap-process-cmp", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Chemical mechanical planarization.", "priority": 30, "question": "Named layer, consumable pair, throughput and yield effect are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, chemical mechanical planarization cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-compiler-runtime-firmware", "id": "gap-process-compiler-runtime-firmware", "last_checked": "2026-07-29", "layer": "software", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Compiler, runtime, firmware and kernels.", "priority": 30, "question": "Independent framework/kernel/workload compatibility receipt is absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, compiler, runtime, firmware and kernels cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-chillers-abatement", "id": "gap-process-component-chillers-abatement", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Tool chillers and point-of-use abatement.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for tool chillers and point-of-use abatement", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, tool chillers and point-of-use abatement cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-esc-ceramics", "id": "gap-process-component-esc-ceramics", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Electrostatic chucks and technical ceramics.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for electrostatic chucks and technical ceramics", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, electrostatic chucks and technical ceramics cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-field-service", "id": "gap-process-component-field-service", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Equipment field service.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for equipment field service", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, equipment field service cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-gas-panels-piping", "id": "gap-process-component-gas-panels-piping", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Gas panels and high-purity piping.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for gas panels and high-purity piping", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, gas panels and high-purity piping cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-lasers-light-sources", "id": "gap-process-component-lasers-light-sources", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Lasers and lithography light sources.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for lasers and lithography light sources", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, lasers and lithography light sources cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-mfc", "id": "gap-process-component-mfc", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Mass-flow controllers.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for mass-flow controllers", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, mass-flow controllers cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-power-control-electronics", "id": "gap-process-component-power-control-electronics", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power supplies and control electronics.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for power supplies and control electronics", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, power supplies and control electronics cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-projection-optics", "id": "gap-process-component-projection-optics", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Projection and inspection optics.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for projection and inspection optics", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, projection and inspection optics cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-quartz-silicon-electrodes", "id": "gap-process-component-quartz-silicon-electrodes", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Quartz parts and silicon electrodes.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for quartz parts and silicon electrodes", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, quartz parts and silicon electrodes cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-rf-matching", "id": "gap-process-component-rf-matching", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: RF power and matching networks.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for rf power and matching networks", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, rf power and matching networks cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-robots-wafer-handling", "id": "gap-process-component-robots-wafer-handling", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Robots and wafer-handling systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for robots and wafer-handling systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, robots and wafer-handling systems cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-seals", "id": "gap-process-component-seals", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: High-purity and vacuum seals.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for high-purity and vacuum seals", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, high-purity and vacuum seals cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-sensors-software", "id": "gap-process-component-sensors-software", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Equipment sensors and control software.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for equipment sensors and control software", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, equipment sensors and control software cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-spares", "id": "gap-process-component-spares", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Equipment spare-parts supply.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for equipment spare-parts supply", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, equipment spare-parts supply cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-stages-encoders-bearings", "id": "gap-process-component-stages-encoders-bearings", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Stages, encoders and bearings.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for stages, encoders and bearings", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, stages, encoders and bearings cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-targets-filters", "id": "gap-process-component-targets-filters", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Targets and filters for equipment systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for targets and filters for equipment systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, targets and filters for equipment systems cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-vacuum-pumps", "id": "gap-process-component-vacuum-pumps", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Vacuum pumps.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for vacuum pumps", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, vacuum pumps cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-component-vacuum-valves", "id": "gap-process-component-vacuum-valves", "last_checked": "2026-07-29", "layer": "equipment_component", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Vacuum valves.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for vacuum valves", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, vacuum valves cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-compound-substrates", "id": "gap-process-compound-substrates", "last_checked": "2026-07-29", "layer": "materials", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: SiC, GaN, sapphire and epitaxial substrates.", "priority": 15, "question": "Grade, defect limit and device-line qualification are unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, sic, gan, sapphire and epitaxial substrates cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-computational-lithography", "id": "gap-process-computational-lithography", "last_checked": "2026-07-29", "layer": "patterning", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: OPC, source-mask optimization and DTCO.", "priority": 12, "question": "No source-closed mainland OPC production deployment found", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, opc, source-mask optimization and dtco cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-controller-module", "id": "gap-process-controller-module", "last_checked": "2026-07-29", "layer": "systems", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Controllers and memory/storage modules.", "priority": 30, "question": "SKU BOM closure and customer qualifications remain incomplete", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, controllers and memory/storage modules cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-deposition-cvd-ald", "id": "gap-process-deposition-cvd-ald", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: CVD, PECVD and ALD deposition.", "priority": 26, "question": "Model/facility/layer/uptime/yield receipts remain sparse", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, cvd, pecvd and ald deposition cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-design-verification", "id": "gap-process-design-verification", "last_checked": "2026-07-29", "layer": "eda", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Functional verification, simulation, emulation and formal.", "priority": 6, "question": "Named production-chip tapeout receipts are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, functional verification, simulation, emulation and formal cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-dft-yield-analysis", "id": "gap-process-dft-yield-analysis", "last_checked": "2026-07-29", "layer": "eda", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: DFT and yield analysis.", "priority": 10, "question": "Attributable production-yield effect is absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, dft and yield analysis cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-dram-fabrication", "id": "gap-process-dram-fabrication", "last_checked": "2026-07-29", "layer": "fabrication", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: DRAM wafer fabrication.", "priority": 30, "question": "Capacity, yield, tool/material BOM and customer volume remain unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, dram wafer fabrication cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-end-user-workload", "id": "gap-process-end-user-workload", "last_checked": "2026-07-29", "layer": "demand", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Real end-user workload and accepted result.", "priority": 2, "question": "No matched workload-to-accepted-result receipt for the mapped accelerators", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, real end-user workload and accepted result cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-epitaxy", "id": "gap-process-epitaxy", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Epitaxy.", "priority": 27, "question": "Model/facility/device qualification is unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, epitaxy cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-etch", "id": "gap-process-etch", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Plasma and high-aspect-ratio etch.", "priority": 28, "question": "Model/facility/qualified-layer/throughput/yield receipts remain sparse", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, plasma and high-aspect-ratio etch cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-abatement", "id": "gap-process-facility-abatement", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Point-of-use and central abatement.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for point-of-use and central abatement", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, point-of-use and central abatement cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-automation", "id": "gap-process-facility-automation", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Facility automation and monitoring.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for facility automation and monitoring", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, facility automation and monitoring cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-backup-power", "id": "gap-process-facility-backup-power", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Backup-power systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for backup-power systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, backup-power systems cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-bulk-gases", "id": "gap-process-facility-bulk-gases", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Bulk-gas generation and supply.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for bulk-gas generation and supply", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, bulk-gas generation and supply cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-chemical-delivery", "id": "gap-process-facility-chemical-delivery", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: High-purity chemical delivery systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for high-purity chemical delivery systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, high-purity chemical delivery systems cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-chillers-heat-rejection", "id": "gap-process-facility-chillers-heat-rejection", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Chillers and heat-rejection systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for chillers and heat-rejection systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, chillers and heat-rejection systems cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-contamination-control", "id": "gap-process-facility-contamination-control", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Contamination-control systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for contamination-control systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, contamination-control systems cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-fire-life-safety", "id": "gap-process-facility-fire-life-safety", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Fire and life-safety systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for fire and life-safety systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, fire and life-safety systems cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-power-quality", "id": "gap-process-facility-power-quality", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power-quality systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for power-quality systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, power-quality systems cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-solvent-recovery", "id": "gap-process-facility-solvent-recovery", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Solvent-recovery systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for solvent-recovery systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, solvent-recovery systems cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-specialty-gas-delivery", "id": "gap-process-facility-specialty-gas-delivery", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Specialty-gas delivery systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for specialty-gas delivery systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, specialty-gas delivery systems cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-ultrapure-water", "id": "gap-process-facility-ultrapure-water", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Ultrapure-water generation and distribution.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for ultrapure-water generation and distribution", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, ultrapure-water generation and distribution cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-vacuum", "id": "gap-process-facility-vacuum", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Fab vacuum systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for fab vacuum systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, fab vacuum systems cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-vibration-control", "id": "gap-process-facility-vibration-control", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Vibration-control systems.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for vibration-control systems", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, vibration-control systems cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-facility-wastewater", "id": "gap-process-facility-wastewater", "last_checked": "2026-07-29", "layer": "facilities_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Fab wastewater treatment.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for fab wastewater treatment", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, fab wastewater treatment cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-final-test-burnin", "id": "gap-process-final-test-burnin", "last_checked": "2026-07-29", "layer": "packaging_test", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Final test, burn-in and repair.", "priority": 30, "question": "HBM/accelerator test coverage and qualified flow are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, final test, burn-in and repair cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-gases-chemicals-delivery", "id": "gap-process-gases-chemicals-delivery", "last_checked": "2026-07-29", "layer": "facilities", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Bulk/specialty gases and chemical delivery.", "priority": 19, "question": "Facility-specific supply and qualification receipts are unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, bulk/specialty gases and chemical delivery cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-hybrid-bonding", "id": "gap-process-hybrid-bonding", "last_checked": "2026-07-29", "layer": "advanced_packaging", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Hybrid and fusion bonding.", "priority": 30, "question": "Generic equipment capability is not HBM qualification", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, hybrid and fusion bonding cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-implant", "id": "gap-process-implant", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Ion implantation.", "priority": 29, "question": "Named fab, model and qualified layer are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, ion implantation cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-inspection-defect-review", "id": "gap-process-inspection-defect-review", "last_checked": "2026-07-29", "layer": "process_control", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Inspection and defect review.", "priority": 30, "question": "Advanced optical/e-beam production capability remains a critical gap", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, inspection and defect review cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-isa-rtl", "id": "gap-process-isa-rtl", "last_checked": "2026-07-29", "layer": "design", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: ISA and RTL.", "priority": 5, "question": "ISA/RTL provenance and licensed dependencies are not closed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, isa and rtl cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-lithography-dry-arf", "id": "gap-process-lithography-dry-arf", "last_checked": "2026-07-29", "layer": "lithography", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Dry ArF lithography.", "priority": 22, "question": "Wavelength/model-to-layer and customer qualification are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, dry arf lithography cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-lithography-euv", "id": "gap-process-lithography-euv", "last_checked": "2026-07-29", "layer": "lithography", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: EUV lithography.", "priority": 24, "question": "No verified mainland-owned commercial EUV scanner", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, euv lithography cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-lithography-iline-krf", "id": "gap-process-lithography-iline-krf", "last_checked": "2026-07-29", "layer": "lithography", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: i-line and KrF lithography.", "priority": 21, "question": "Named installation, site acceptance and qualified layer are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, i-line and krf lithography cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-lithography-immersion-arf", "id": "gap-process-lithography-immersion-arf", "last_checked": "2026-07-29", "layer": "lithography", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Immersion ArF lithography.", "priority": 23, "question": "No public P4-P6 domestic system exists in the seven-fab matrix", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, immersion arf lithography cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-logic-foundry", "id": "gap-process-logic-foundry", "last_checked": "2026-07-29", "layer": "fabrication", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Logic wafer fabrication.", "priority": 30, "question": "Node/facility/product/tool joins remain source-bounded and incomplete", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, logic wafer fabrication cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-aerospace-defense", "id": "gap-process-market-aerospace-defense", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Publicly documented aerospace and defense demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for publicly documented aerospace and defense demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, publicly documented aerospace and defense demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-ai-inference", "id": 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readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: AI training demand and accepted workloads.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for ai training demand and accepted workloads", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, ai training demand and accepted workloads cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-automotive", "id": "gap-process-market-automotive", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Automotive semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for automotive semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, automotive semiconductor demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-cloud-services", "id": "gap-process-market-cloud-services", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Cloud-service semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for cloud-service semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, cloud-service semiconductor demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-consumer-electronics", "id": "gap-process-market-consumer-electronics", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Consumer-electronics semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for consumer-electronics semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, consumer-electronics semiconductor demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-energy", "id": "gap-process-market-energy", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Energy-system semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for energy-system semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, energy-system semiconductor demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-grid", "id": "gap-process-market-grid", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact 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Image-sensor and power-electronics demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for image-sensor and power-electronics demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, image-sensor and power-electronics demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-industrial-automation", "id": "gap-process-market-industrial-automation", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Industrial-automation semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for industrial-automation semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, industrial-automation semiconductor demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-medical", "id": "gap-process-market-medical", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Medical-device semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for medical-device semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, medical-device semiconductor demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-networking", "id": "gap-process-market-networking", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Networking-system semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for networking-system semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, networking-system semiconductor demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-pcs", "id": "gap-process-market-pcs", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: PC semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for pc semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, pc semiconductor demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-robotics", "id": "gap-process-market-robotics", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Robotics semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for robotics semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, robotics semiconductor demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-scientific-computing", "id": "gap-process-market-scientific-computing", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Scientific-computing semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for scientific-computing semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, scientific-computing semiconductor demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-smartphones", "id": "gap-process-market-smartphones", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Smartphone semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for smartphone semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, smartphone semiconductor demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-storage", "id": "gap-process-market-storage", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Storage-system semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for storage-system semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, storage-system semiconductor demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-market-telecom", "id": "gap-process-market-telecom", "last_checked": "2026-07-29", "layer": "end_market", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Telecom-system semiconductor demand.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for telecom-system semiconductor demand", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, telecom-system semiconductor demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-mask-reticle", "id": "gap-process-mask-reticle", "last_checked": "2026-07-29", "layer": "patterning", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Mask, reticle, pellicle, inspection and repair.", "priority": 13, "question": "Advanced mask blank, inspection and repair qualification is unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, mask, reticle, pellicle, inspection and repair cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-200mm-silicon", "id": "gap-process-material-200mm-silicon", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: 200 mm silicon wafers.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for 200 mm silicon wafers", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, 200 mm silicon wafers cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-300mm-silicon", "id": "gap-process-material-300mm-silicon", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: 300 mm silicon wafers.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for 300 mm silicon wafers", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, 300 mm silicon wafers cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-abf-bt-ceramic", "id": "gap-process-material-abf-bt-ceramic", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: ABF, BT resin and packaging ceramics.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for abf, bt resin and packaging ceramics", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, abf, bt resin and packaging ceramics cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-adhesive-molding-thermal", "id": "gap-process-material-adhesive-molding-thermal", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Adhesives, underfill, NCF, EMC, TIM and fillers.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for adhesives, underfill, ncf, emc, tim and fillers", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, adhesives, underfill, ncf, emc, tim and fillers cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-cmp-consumables", "id": "gap-process-material-cmp-consumables", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: CMP slurry and pads.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for cmp slurry and pads", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, cmp slurry and pads cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-compound-substrate", "id": "gap-process-material-compound-substrate", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: SiC, GaN and sapphire substrates and epitaxy.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for sic, gan and sapphire substrates and epitaxy", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, sic, gan and sapphire substrates and epitaxy cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-epi-heavy-doped", "id": "gap-process-material-epi-heavy-doped", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Epitaxial and heavily doped silicon wafers.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for epitaxial and heavily doped silicon wafers", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, epitaxial and heavily doped silicon wafers cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-leadframe-bondwire", "id": "gap-process-material-leadframe-bondwire", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Leadframes and bonding wire.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for leadframes and bonding wire", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, leadframes and bonding wire cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-mask-blank-quartz", "id": "gap-process-material-mask-blank-quartz", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Mask blanks and high-purity quartz.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for mask blanks and high-purity quartz", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, mask blanks and high-purity quartz cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-metal-highk-precursors", "id": "gap-process-material-metal-highk-precursors", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Barrier, seed, high-k and metal precursors.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for barrier, seed, high-k and metal precursors", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, barrier, seed, high-k and metal precursors cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-process-gases", "id": "gap-process-material-process-gases", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Etch, deposition, implant and bulk process gases.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for etch, deposition, implant and bulk process gases", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, etch, deposition, implant and bulk process gases cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-resist-stack", "id": "gap-process-material-resist-stack", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Photoresist, PAG, resin, developer, rinse and topcoat.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for photoresist, pag, resin, developer, rinse and topcoat", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, photoresist, pag, resin, developer, rinse and topcoat cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-soi", "id": "gap-process-material-soi", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Silicon-on-insulator wafers.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for silicon-on-insulator wafers", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, silicon-on-insulator wafers cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-sputter-targets", "id": "gap-process-material-sputter-targets", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Sputtering targets.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for sputtering targets", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, sputtering targets cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-substrate-interposer-rdl", "id": "gap-process-material-substrate-interposer-rdl", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Package substrates, interposers and RDL materials.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for package substrates, interposers and rdl materials", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, package substrates, interposers and rdl materials cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-material-wet-plating-chemistry", "id": "gap-process-material-wet-plating-chemistry", "last_checked": "2026-07-29", "layer": "materials_leaf", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Wet chemicals and electroplating chemistry.", "priority": 30, "question": "No source-closed legal-entity, product/facility and readiness chain yet for wet chemicals and electroplating chemistry", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, wet chemicals and electroplating chemistry cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-metrology", "id": "gap-process-metrology", "last_checked": "2026-07-29", "layer": "process_control", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: CD, overlay, film and materials metrology.", "priority": 30, "question": "Advanced production metrology qualification remains unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, cd, overlay, film and materials metrology cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-nand-fabrication", "id": "gap-process-nand-fabrication", "last_checked": "2026-07-29", "layer": "fabrication", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: 3D NAND wafer fabrication.", "priority": 30, "question": "Generation/facility/capacity/yield and supplier BOM remain incomplete", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, 3d nand wafer fabrication cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-national-commercial-demand", "id": "gap-process-national-commercial-demand", "last_checked": "2026-07-29", "layer": "demand", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: National and commercial semiconductor demand.", "priority": 1, "question": "No source-closed demand-to-chip procurement ledger yet", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, national and commercial semiconductor demand cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-organic-substrate", "id": "gap-process-organic-substrate", "last_checked": "2026-07-29", "layer": "advanced_packaging", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Organic substrate manufacturing.", "priority": 30, "question": "HBM-class ABF substrate qualification remains unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, organic substrate manufacturing cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-os-collectives-serving", "id": "gap-process-os-collectives-serving", "last_checked": "2026-07-29", "layer": "software", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: OS, collectives, serving engine and scheduling.", "priority": 30, "question": "Versioned scale-out software and independent distributed-workload receipt are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, os, collectives, serving engine and scheduling cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-osat-assembly", "id": "gap-process-osat-assembly", "last_checked": "2026-07-29", "layer": "packaging_test", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Assembly and advanced packaging.", "priority": 30, "question": "Named HBM die owner, stack, customer, yield and volume are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, assembly and advanced packaging cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-packaging-substrates", "id": "gap-process-packaging-substrates", "last_checked": "2026-07-29", "layer": "materials", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Organic, ceramic, glass and silicon substrates/interposers.", "priority": 16, "question": "HBM-class substrate/interposer qualification is unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, organic, ceramic, glass and silicon substrates/interposers cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-pdk-libraries-ip", "id": "gap-process-pdk-libraries-ip", "last_checked": "2026-07-29", "layer": "eda_ip", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: PDK, standard cells, memory compilers and interface IP.", "priority": 11, "question": "Named foundry PDK, licensee, tapeout and production-chip receipts are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, pdk, standard cells, memory compilers and interface ip cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-physical-design-signoff", "id": "gap-process-physical-design-signoff", "last_checked": "2026-07-29", "layer": "eda", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Place and route, timing, power and signoff.", "priority": 8, "question": "Advanced-node full-flow signoff evidence is absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, place and route, timing, power and signoff cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-plating", "id": "gap-process-plating", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Electroplating.", "priority": 30, "question": "Named fab and qualified TSV/interconnect layer are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, electroplating cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-power-cooling", "id": "gap-process-power-cooling", "last_checked": "2026-07-29", "layer": "systems", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power delivery and cooling.", "priority": 30, "question": "DF1000 card/rack power and thermal BOM are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, power delivery and cooling cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-power-water", "id": "gap-process-power-water", "last_checked": "2026-07-29", "layer": "facilities", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Power, ultrapure water and backup power.", "priority": 18, "question": "Fab-specific demand, redundancy and utility supplier evidence is unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, power, ultrapure water and backup power cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-rdl-interposer", "id": "gap-process-rdl-interposer", "last_checked": "2026-07-29", "layer": "advanced_packaging", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: RDL and interposer integration.", "priority": 30, "question": "HBM-specific interposer and yield receipts are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, rdl and interposer integration cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-reliability-failure-analysis", "id": "gap-process-reliability-failure-analysis", "last_checked": "2026-07-29", "layer": "packaging_test", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Reliability and failure analysis.", "priority": 30, "question": "Field-reliability and qualification receipts are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, reliability and failure analysis cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-sic-gan", "id": "gap-process-sic-gan", "last_checked": "2026-07-29", "layer": "fabrication", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: SiC and GaN device fabrication.", "priority": 30, "question": "Substrate-to-device-to-module source chain is not yet closed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, sic and gan device fabrication cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-signal-power-integrity", "id": "gap-process-signal-power-integrity", "last_checked": "2026-07-29", "layer": "eda", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Signal and power integrity.", "priority": 9, "question": "Named chip and production qualification receipts are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, signal and power integrity cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-silicon-photonics", "id": "gap-process-silicon-photonics", "last_checked": "2026-07-29", "layer": "fabrication", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Silicon photonics and optical integration.", "priority": 30, "question": "Foundry/package/customer qualification chain is not closed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, silicon photonics and optical integration cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-silicon-wafers", "id": "gap-process-silicon-wafers", "last_checked": "2026-07-29", "layer": "materials", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Silicon and SOI wafers.", "priority": 14, "question": "Grade, defect limit and named-fab qualification are unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, silicon and soi wafers cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-specialty-memory", "id": "gap-process-specialty-memory", "last_checked": "2026-07-29", "layer": "fabrication", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: NOR and specialty memory fabrication.", "priority": 30, "question": "SKU-level customer, yield and volume are incomplete", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, nor and specialty memory fabrication cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-stack-assembly-repair", "id": "gap-process-stack-assembly-repair", "last_checked": "2026-07-29", "layer": "advanced_packaging", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Stack assembly, repair and redundancy.", "priority": 30, "question": "Qualified mainland commercial HBM stack assembly is absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, stack assembly, repair and redundancy cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-storage-tier", "id": "gap-process-storage-tier", "last_checked": "2026-07-29", "layer": "systems", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Local, CXL, PCIe, NVMe and remote storage tiers.", "priority": 30, "question": "Matched latency, energy, contention and recovery receipts are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, local, cxl, pcie, nvme and remote storage tiers cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-system-architecture", "id": "gap-process-system-architecture", "last_checked": "2026-07-29", "layer": "systems", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: System architecture and integration.", "priority": 3, "question": "Vendor system pages lack installed-customer and BOM receipts", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, system architecture and integration cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-thermal", "id": "gap-process-thermal", "last_checked": "2026-07-29", "layer": "wafer_equipment", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Furnace, oxidation, diffusion and RTP.", "priority": 30, "question": "Model/facility/layer receipts are incomplete", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, furnace, oxidation, diffusion and rtp cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-track", "id": "gap-process-track", "last_checked": "2026-07-29", "layer": "lithography", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Coat/develop track.", "priority": 25, "question": "Named scanner pairing and qualified production layer are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, coat/develop track cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-tsv", "id": "gap-process-tsv", "last_checked": "2026-07-29", "layer": "advanced_packaging", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: TSV formation, dielectric, barrier, seed and fill.", "priority": 30, "question": "Qualified mainland commercial HBM TSV chain is absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, tsv formation, dielectric, barrier, seed and fill cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-vacuum-abatement-wastewater", "id": "gap-process-vacuum-abatement-wastewater", "last_checked": "2026-07-29", "layer": "facilities", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Vacuum, abatement, solvent recovery and wastewater.", "priority": 20, "question": "Facility-specific equipment and service receipts are unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, vacuum, abatement, solvent recovery and wastewater cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-wafer-probe", "id": "gap-process-wafer-probe", "last_checked": "2026-07-29", "layer": "test", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Wafer probe and known-good-die selection.", "priority": 30, "question": "HBM-grade KGD selection and probe coverage are unclosed", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, wafer probe and known-good-die selection cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-wafer-thinning", "id": "gap-process-wafer-thinning", "last_checked": "2026-07-29", "layer": "advanced_packaging", "missing_proof": [ "named legal endpoints", "exact product/process/facility scope", "dated readiness or qualification receipt" ], "next_action": "Search official filings, EIAs, tenders, acceptance records and customer disclosures for: Wafer thinning and backgrind.", "priority": 30, "question": "HBM-specific qualified process and yield are absent", "record_type": "gap", "source_ids": [], "why_it_matters": "Without this receipt, wafer thinning and backgrind cannot be promoted to qualified or volume-backed coverage." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-cxmt-duv", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-cxmt-duv", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "purchase", "model/serial", "move-in", "installation", "site acceptance" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for CXMT domestic DUV receipt.", "priority": 10, "question": "CXMT domestic DUV receipt", "record_type": "gap", "source_ids": [], "why_it_matters": "Future-recipient language is below P4." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-cxmt-fab-bom", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-cxmt-fab-bom", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "facility", "supplier legal entity", "model/material grade", "acceptance" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for CXMT fab equipment and material suppliers.", "priority": 8, "question": "CXMT fab equipment and material suppliers", "record_type": "gap", "source_ids": [], "why_it_matters": "DRAM products do not reveal facility BOM." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-cxmt-phone-program", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-cxmt-phone-program", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "legal buyer", "phone model", "AVL/qualification", "shipments" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for CXMT LPDDR5 legal customer/program.", "priority": 7, "question": "CXMT LPDDR5 legal customer/program", "record_type": "gap", "source_ids": [], "why_it_matters": "Brand validation does not resolve contracting legal entity or shipping program." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-df1000-bond-tool", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-df1000-bond-tool", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "tool vendor/model", "facility", "bond flow/pitch/yield" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 bonding equipment and process owner.", "priority": 4, "question": "DF1000 bonding equipment and process owner", "record_type": "gap", "source_ids": [], "why_it_matters": "A generic domestic bonding portfolio is not a DF1000 edge." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-df1000-customer", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-df1000-customer", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "customer legal entity", "purchase/acceptance", "units and dates" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 named customer and shipment.", "priority": 5, "question": "DF1000 named customer and shipment", "record_type": "gap", "source_ids": [], "why_it_matters": "Product launch is not commercial delivery or volume." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-df1000-foundry", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-df1000-foundry", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "foundry legal entity", "facility", "wafer lot/tapeout receipt" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 foundry and fabrication facility.", "priority": 1, "question": "DF1000 foundry and fabrication facility", "record_type": "gap", "source_ids": [], "why_it_matters": "A foundry is not inferred from the reported 14 nm process." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-df1000-memory", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-df1000-memory", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "memory legal entity", "die generation", "wafer/die supply receipt" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 memory die supplier.", "priority": 2, "question": "DF1000 memory die supplier", "record_type": "gap", "source_ids": [], "why_it_matters": "3D DRAM does not identify the DRAM maker." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-df1000-osat", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-df1000-osat", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "OSAT legal entity", "facility", "package/flow acceptance" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for DF1000 OSAT and packaging facility.", "priority": 3, "question": "DF1000 OSAT and packaging facility", "record_type": "gap", "source_ids": [], "why_it_matters": "Hybrid bonding/3D packaging does not identify the assembler." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-df1000-server-oem", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-df1000-server-oem", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "OEM/legal operator", "facility", "component BOM", "shipment" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for QY100/TY64/HS512 manufacturing and server OEM path.", "priority": 6, "question": "QY100/TY64/HS512 manufacturing and server OEM path", "record_type": "gap", "source_ids": [], "why_it_matters": "A vendor product page does not close system BOM/assembly." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-gentech-part-tool-fab", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-gentech-part-tool-fab", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "part number", "equipment model", "fab", "quantity/acceptance" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Gentech delivery subsystem part-to-tool-to-fab join.", "priority": 17, "question": "Gentech delivery subsystem part-to-tool-to-fab join", "record_type": "gap", "source_ids": [], "why_it_matters": "Batch supply to equipment makers lacks exact insertion." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-hbm-accelerator", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-hbm-accelerator", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "stack product/generation", "accelerator", "customer qualification", "sustained yield/shipments" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Qualified mainland HBM stack-to-accelerator relationship.", "priority": 20, "question": "Qualified mainland HBM stack-to-accelerator relationship", "record_type": "gap", "source_ids": [], "why_it_matters": "Generic TSV/bonding/package capability is not HBM completion." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-hengyunchang-fab-validation", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-hengyunchang-fab-validation", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "component SKU", "tool model", "fab", "dual validation and spares" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Hengyunchang RF power fab validation.", "priority": 16, "question": "Hengyunchang RF power fab validation", "record_type": "gap", "source_ids": [], "why_it_matters": "Equipment-maker sales do not identify fab-level validation." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-huahong-duv", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-huahong-duv", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "subsidiary/fab", "purchase", "installation", "acceptance" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Hua Hong domestic DUV receipt.", "priority": 12, "question": "Hua Hong domestic DUV receipt", "record_type": "gap", "source_ids": [], "why_it_matters": "Future-recipient language is below P4 and the fab is unresolved." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-huate-gas-fab", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-huate-gas-fab", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "gas SKU/grade", "fab/process layer", "qualification date", "quantity" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Huate exact gas-to-SMIC Ningbo process join.", "priority": 18, "question": "Huate exact gas-to-SMIC Ningbo process join", "record_type": "gap", "source_ids": [], "why_it_matters": "Supplier award does not identify the gas, layer or quantity." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-hwatsing-model-facility", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-hwatsing-model-facility", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "exact model", "receiving facility", "slurry/pad", "yield effect" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Hwatsing CMP model-to-fab acceptance.", "priority": 15, "question": "Hwatsing CMP model-to-fab acceptance", "record_type": "gap", "source_ids": [], "why_it_matters": "Aggregate customer evidence does not identify model/fab/layer." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-nsig-customer-grade", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-nsig-customer-grade", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "wafer grade/spec", "facility", "customer/fab/process", "qualified output" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for NSIG wafer grade-to-customer qualification.", "priority": 19, "question": "NSIG wafer grade-to-customer qualification", "record_type": "gap", "source_ids": [], "why_it_matters": "Group capacity does not prove grade, customer or qualified output." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-piotech-model-facility", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-piotech-model-facility", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "exact model", "receiving facility", "acceptance", "qualified layer" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Piotech deposition model-to-fab acceptance.", "priority": 14, "question": "Piotech deposition model-to-fab acceptance", "record_type": "gap", "source_ids": [], "why_it_matters": "Group-level production-line use does not identify model/fab/layer." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-smic-duv", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-smic-duv", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "subsidiary/fab", "model/serial", "acceptance", "qualified layer" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for SMIC domestic DUV receipt.", "priority": 11, "question": "SMIC domestic DUV receipt", "record_type": "gap", "source_ids": [], "why_it_matters": "Anonymous prototype evaluation is only a P3 lead." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-tongfu-hbm-customer", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-tongfu-hbm-customer", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "stack generation", "DRAM owner", "accelerator/customer", "yield/shipments" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for Tongfu HBM project customer and qualified stack.", "priority": 13, "question": "Tongfu HBM project customer and qualified stack", "record_type": "gap", "source_ids": [], "why_it_matters": "Project construction is not HBM customer qualification." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-receipt-ymtc-scanner", "gap_type": "missing_supplier_or_customer_receipt", "id": "gap-receipt-ymtc-scanner", "last_checked": "2026-07-29", "layer": "supplier_customer_receipt", "missing_proof": [ "scanner model", "fab phase", "layer", "acceptance and yield" ], "next_action": "Search customer-origin AVL, tender, purchase, acceptance, EIA or filing evidence for YMTC scanner vendor/model by 3D NAND layer.", "priority": 9, "question": "YMTC scanner vendor/model by 3D NAND layer", "record_type": "gap", "source_ids": [], "why_it_matters": "Production with an unidentified fleet cannot prove domestic DUV." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-smee-ssc800-award-buyer-and-acceptance", "id": "gap-smee-ssc800-award-buyer-and-acceptance", "last_checked": "2026-07-29", "layer": "domestic_duv", "missing_proof": [ "buyer legal identity/registration ID", "signed contract/equipment schedule", "manufacturing completion/serial", "shipment", "delivery/receiving", "move-in", "installation", "site acceptance", "asset registration", "wavelength/NA", "facility owner/operator", "qualified layer", "yield" ], "next_action": "Retrieve CCGP contract and 履约验收 records for project MB20016721763953804060, especially the signed equipment schedule and delivery/SAT attachment naming serial, purchaser and installation facility; if absent, inspect 2026 public fixed-asset/audit records for the same project ID and amount.", "priority": 1, "question": "What exact legal entity is zycgr22011903/LGGJ实验室, and did SSC800/10 progress beyond award?", "record_type": "gap", "source_ids": [], "why_it_matters": "An award is not a signed contract, shipment, installation, site acceptance or production qualification." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-tongcheng-cmp-named-fab-layer", "id": "gap-tongcheng-cmp-named-fab-layer", "last_checked": "2026-07-29", "layer": "cmp_consumables", "missing_proof": [ "customer legal entity", "facility", "pad SKU", "slurry", "layer", "qualification date", "quantity", "yield effect" ], "next_action": "Retrieve customer AVL/qualification, tender, purchase or recurring-delivery records at exact pad-SKU scope.", "priority": 1, "question": "Which named 200 mm and 300 mm fabs qualify which Changzhou CMP-pad SKUs for which layers and slurries?", "record_type": "gap", "source_ids": [], "why_it_matters": "Anonymous issuer or catalogue language cannot close a legal supplier/customer, facility, capacity, qualification or yield edge." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-tongcheng-material-output-yield", "id": "gap-tongcheng-material-output-yield", "last_checked": "2026-07-29", "layer": "lithography_materials", "missing_proof": [ "installed capacity", "qualified capacity", "actual output by SKU/grade", "utilization denominator", "yield" ], "next_action": "Retrieve facility permits, asset schedules and operating disclosures separating all capacity states.", "priority": 1, "question": "What installed, qualified and actual output supports Tongcheng's approved photoresist and high-purity-solvent capacity?", "record_type": "gap", "source_ids": [], "why_it_matters": "Anonymous issuer or catalogue language cannot close a legal supplier/customer, facility, capacity, qualification or yield edge." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-tongcheng-photoresist-named-fab-layer", "id": "gap-tongcheng-photoresist-named-fab-layer", "last_checked": "2026-07-29", "layer": "lithography_materials", "missing_proof": [ "customer legal entity", "facility", "material SKU", "wavelength/mode", "layer", "qualification date", "batch quantity", "yield" ], "next_action": "Retrieve customer-side AVL, tender, purchase, qualification or recurring-delivery records naming both endpoints and the exact SKU/layer.", "priority": 1, "question": "Which named fabs qualify which Tongcheng/Kehua ArF, KrF and i-line photoresist SKUs at which layers?", "record_type": "gap", "source_ids": [], "why_it_matters": "Anonymous issuer or catalogue language cannot close a legal supplier/customer, facility, capacity, qualification or yield edge." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-tongcheng-shanghai-resin-lines-operator", "id": "gap-tongcheng-shanghai-resin-lines-operator", "last_checked": "2026-07-29", "layer": "photoresist_precursors", "missing_proof": [ "acceptance certificate/type", "capacity by resin type", "electronic-formaldehyde line state", "installed/qualified capacity", "actual output/utilization", "equipment/precursor BOM", "customer qualification" ], "next_action": "Retrieve the Shanghai Chemical Industry Park EIA/竣工环保验收 attachments and operating records for the resin/formaldehyde project.", "priority": 1, "question": "What acceptance, installed capacity and output support the six Tongcheng Chemical photoresist-resin lines at 66 North Yinhe Road?", "record_type": "gap", "source_ids": [], "why_it_matters": "Anonymous issuer or catalogue language cannot close a legal supplier/customer, facility, capacity, qualification or yield edge." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-tongfu-hbs-line-hbm-closure", "id": "gap-tongfu-hbs-line-hbm-closure", "last_checked": "2026-07-29", "layer": "conventional_hbm", "missing_proof": [ "HBM generation", "DRAM owner", "base die/PHY", "TSV/KGD", "customer/accelerator", "SAT", "yield", "shipments" ], "next_action": "Obtain dated customer or government acceptance naming the stack, line, yield and shipment state.", "priority": 1, "question": "Can the Nantong Tongfu trial line be joined to one qualified HBM stack?", "record_type": "gap", "source_ids": [], "why_it_matters": "Process adjacency, trial production and industry context cannot close a qualified commercial HBM proof chain." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-util-001", "id": "gap-util-001", "last_checked": "2026-07-29", "layer": "cleanroom_and_epc", "missing_proof": [ "Issuer statutory disclosure or owner/tender-platform signed contract naming both endpoints, exact package, facility, date and state." ], "next_action": "Issuer statutory disclosure or owner/tender-platform signed contract naming both endpoints, exact package, facility, date and state.", "priority": 1, "question": "Bocheng exact named semiconductor facility receipt", "record_type": "gap", "severity": "high", "source_ids": [], "why_it_matters": "Media leads report Changxin Xinqiao process-piping work, but no directly inspectable primary contract or tender record was closed within this lane deadline." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-util-002", "id": "gap-util-002", "last_checked": "2026-07-29", "layer": "cleanroom_and_epc", "missing_proof": [ "Original contract, award or acceptance record naming CESE legal entity, facility owner/operator and exact semiconductor scope." ], "next_action": "Original contract, award or acceptance record naming CESE legal entity, facility owner/operator and exact semiconductor scope.", "priority": 2, "question": "CESE exact named semiconductor facility receipt", "record_type": "gap", "severity": "high", "source_ids": [], "why_it_matters": "A government bid-evaluation page listed CESE prior semiconductor project performance, but it did not close the original customer legal endpoint and contract scope for a new relationship edge." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-util-003", "id": "gap-util-003", "last_checked": "2026-07-29", "layer": "facility_equipment", "missing_proof": [ "Customer tender, purchase, delivery, installation or acceptance record with exact model and facility." ], "next_action": "Customer tender, purchase, delivery, installation or acceptance record with exact model and facility.", "priority": 3, "question": "MayAir, PNCS, Jingyi Equipment and Hanbell named-facility receipts", "record_type": "gap", "severity": "high", "source_ids": [], "why_it_matters": "Company/filing leads name customer classes or company-level customers, but no model-plus-facility-plus-date delivery, installation or acceptance receipt was promoted." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-util-004", "id": "gap-util-004", "last_checked": "2026-07-29", "layer": "cleanroom_and_epc", "missing_proof": [ "Owner-side completion/acceptance and FMCS/utility performance test records." ], "next_action": "Owner-side completion/acceptance and FMCS/utility performance test records.", "priority": 4, "question": "Shenghui and Huakang completion receipts", "record_type": "gap", "severity": "medium", "source_ids": [], "why_it_matters": "Huakang has a named supplier-reported award; Shenghui had media leads. Neither has an as-built semiconductor-facility acceptance receipt in this lane." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-util-005", "id": "gap-util-005", "last_checked": "2026-07-29", "layer": "foreign_dependencies", "missing_proof": [ "Approved equipment/material schedules, component BOMs, origin certificates, service contracts and critical-spares lists." ], "next_action": "Approved equipment/material schedules, component BOMs, origin certificates, service contracts and critical-spares lists.", "priority": 5, "question": "Component-level origin and stop-risk", "record_type": "gap", "severity": "critical", "source_ids": [], "why_it_matters": "None of the six edges discloses a component-level origin record for filters, valves, pumps, MFCs, sensors, controls, software, chillers, scrubbers, piping, seals, spares or field service." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-util-006", "id": "gap-util-006", "last_checked": "2026-07-29", "layer": "qualification", "missing_proof": [ "Site-acceptance protocols, utility qualification reports and recurring production/yield records." ], "next_action": "Site-acceptance protocols, utility qualification reports and recurring production/yield records.", "priority": 6, "question": "System performance and production qualification", "record_type": "gap", "severity": "critical", "source_ids": [], "why_it_matters": "No edge includes verified uptime, flow, pressure stability, particulate performance, abatement efficiency, tool availability, MTBF/MTTR, site acceptance, wafer yield effect or sustained production receipt." }, { "completion_state": "lead_only", "evidence_state": "UNRESOLVED", "gap_id": "gap-xmc-separate-facility-identities", "id": "gap-xmc-separate-facility-identities", "last_checked": "2026-07-29", "layer": "foundry_facilities", "missing_proof": [ "facility names and addresses", "legal owner/operator per fab", "phase/process/capacity allocation" ], "next_action": "Retrieve XMC fab-phase EIAs, permits or land records and create separate facility rows only after identity closure.", "priority": 8, "question": "Which two separate XMC 12-inch facilities are covered by the prospectus aggregate?", "record_type": "gap", "source_ids": [], "why_it_matters": "An aggregate company statement cannot be promoted into a synthetic facility record." } ], "supporting": { "seed_universe": { "as_of": "2026-07-29", "dataset": "seed_universe", "groups": { "cleanrooms_utilities_environment": [ "Bocheng", "L&K Engineering", "Taiji Industry / 11th Tech", "Shenghui", "Huakang", "MayAir", "PNCS", "Jingyi Equipment", "Shengjian Environment", "CESE", "Hanbell", "KYKY" ], "compound_power_rf_photonics_sensors": [ "SICC", "TankeBlue", "Sanan IC", "Innoscience", "CR Micro", "Silan", "BYD Semiconductor", "CRRC Times Electric", "StarPower", "Basic Semiconductor", "Will Semiconductor", "OmniVision", "CETC institutes", "Accelink", "Hisense Broadband", "Innolight", "Eoptolink", "Source Photonics China operations" ], "controlled_global_comparators": [ "Qualcomm HBC / AI250", "d-Matrix 3DIMC", "Tenstorrent Wormhole / Galaxy", "GroqChip", "Cerebras WSE-3 and MemoryX", "UPMEM", "SK hynix AiMX", "Samsung HBM-PIM", "Phison aiDAPTIV" ], "distribution_channels": [ "Shannon Semiconductor", "Shenzhen Huaqiang", "Yitoa", "Shangluo Electronics", "CECport", "authorized distributors" ], "downstream_demand": [ "Alibaba Cloud", "Tencent", "ByteDance", "Huawei", "Baidu", "China Mobile", "China Telecom", "China Unicom", "Inspur", "Sugon", "H3C", "Lenovo", "xFusion", "Xiaomi", "OPPO", "vivo", "Honor", "Transsion", "BYD", "NIO", "Li Auto", "Geely", "SAIC", "Desay SV", "Jingwei HiRain", "Midea", "Gree", "Haier", "Sungrow", "CATL", "State Grid suppliers", "industrial-control OEMs" ], "eda_ip_design_services": [ "Empyrean Technology", "Primarius Technologies", "Semitronix", "Xpeedic", "UniVista", "VeriSilicon", "Brite Semiconductor", "Innosilicon", "MooreElite", "SiCarrier", "Huawei HiSilicon", "Chinese Academy of Sciences institutes", "CETC institutes", "relevant university spinouts" ], "equipment_components_subsystems": [ "Fuchuang Precision", "Coma / Kema", "Hengyunchang", "Thinkon", "Xinlai", "KFMI", "KYKY", "Hanbell", "PNCS", "U-Precision", "RSLaser", "Guowang Optics" ], "fabless_and_system_silicon": [ "Huawei HiSilicon", "UNISOC", "Loongson", "Phytium", "Zhaoxin", "Hygon", "Cambricon", "Biren", "Enflame", "Moore Threads", "MetaX", "Iluvatar CoreX", "Kunlunxin", "Alibaba T-Head", "SOPHGO", "Horizon Robotics", "Black Sesame Technologies", "Houmo", "Witmem", "上海东方算芯科技有限公司", "GigaDevice", "Fudan Micro", "Puya", "Dosilicon", "Juchen", "Montage", "Maxio", "YEESTOR", "Goke Micro", "Rockchip", "Allwinner", "Amlogic", "Ingenic", "Espressif", "Goodix", "Will Semiconductor", "OmniVision", "SG Micro", "StarPower", "BYD Semiconductor", "CRRC Times Electric", "Basic Semiconductor", "Innoscience" ], "foreign_owned_mainland_operations": [ "SK hynix Dalian NAND", "SK hynix Wuxi DRAM", "Samsung Xi’an NAND", "TSMC Nanjing", "UMC-related mainland operations", "foreign OSAT facilities", "foreign material facilities", "foreign equipment-service operations" ], "foundries_idms_wafer_fabs": [ "SMIC", "Hua Hong Semiconductor", "HLMC", "Nexchip", "CanSemi", "CR Micro", "Silan", "CXMT", "YMTC", "Wuhan Xinxin / XMC", "Fujian Jinhua / JHICC", "Swaysure", "GigaDevice manufacturing relationships", "Sanan IC", "Innoscience", "BYD Semiconductor", "CRRC Times", "CETC fabs", "foreign-owned mainland fabs" ], "hbm_reduced_architectures": [ "Huawei", "Cambricon", "Hygon", "Enflame", "Biren", "Moore Threads", "MetaX", "Iluvatar CoreX", "Kunlunxin", "Alibaba T-Head", "SOPHGO", "Houmo", "Witmem", "Reexen / 亿铸科技", "Jiutian Ruixin / 九天睿芯", "Pingxin Technology / 苹芯科技", "Qianxin Technology / 千芯科技", "Shanyi Semiconductor / 闪易半导体", "Hengshuo / 恒烁股份" ], "lithography_masks_patterning": [ "SMEE", "上海爱晟纳电子科技集团有限公司", "上海宇量昇科技有限公司", "北京科益虹源 / Beijing RSLaser", "华卓精科 / U-Precision", "国望光学 / Guowang Optics", "清溢光电 / Qingyi Photomask", "路维光电 / Newway Photomask", "九日新材 / Jiuri New Materials", "SiCarrier", "Kingsemi", "Nata", "Red Avenue", "Kehua", "Jingrui", "OPC suppliers", "mask-inspection suppliers", "mask-repair suppliers" ], "memory_controllers_modules_storage": [ "CXMT", "YMTC", "Wuhan Xinxin / XMC", "Fujian Jinhua / JHICC", "Swaysure", "GigaDevice", "Dosilicon", "Puya", "Fudan Micro", "XTX", "Montage", "Maxio", "YEESTOR", "Starblaze", "Innosilicon", "Goke Micro", "Juchen", "Longsys", "BIWIN", "Netac", "Techwinsemi", "Ramaxel", "Memblaze", "DapuStor", "Jiahe Jinwei" ], "packaging_osat_test_substrates": [ "Tongfu", "JCET", "Huatian", "SJ Semiconductor", "Payton", "Wanrun", "HYC", "SEIC", "MaxOne", "Sidea", "AccoTEST", "Changchuan", "Shennan", "Fastprint", "Huazheng", "WG Tech / TGV Tech", "Darbond", "HHCK", "Phichem" ], "wafer_fabrication_equipment": [ "AMEC", "NAURA", "Yitang", "Piotech", "Leadmicro", "Hwatsing", "ACM Research Shanghai", "Zhichun", "Kingsemi", "Skyverse", "Jingce", "SEIC", "AccoTEST", "Kingstone", "CETC", "Changchuan", "MaxOne", "Sidea" ], "wafers_materials_gases_chemicals": [ "NSIG", "Xi’an Eswin Material", "Lion Micro", "GRINM", "TCL Zhonghuan", "SICC", "TankeBlue", "Red Avenue", "Kehua", "Nata", "Jingrui", "Guangzhou Gas", "CSSC Special Gas", "Huate Gas", "Jinhong Gas", "Xingfu", "Xingfa", "Jianghua Micro", "Shanghai Sinyang", "Anji Micro", "Dinglong", "Yoke", "UP Chemical", "KFMI", "HHCK", "Lianrui", "Shennan Circuits", "Fastprint", "Huazheng", "WG Tech / TGV Tech", "Darbond", "Phichem" ] }, "note": "Names are research seeds, not proof of legal identity, capability, or a commercial relationship. Generic categories are retained as discovery queues.", "resolution_note": "Only exact research-seed strings resolved in the canonical entity registry appear here; all others remain explicit unresolved seeds.", "resolved": { "ACM Research Shanghai": "ent-acm-shanghai", "AMEC": "ent-amec", "AccoTEST": "ent-huafeng-test-control", "Allwinner": "ent-allwinner", "Amlogic": "ent-amlogic-shanghai", "Anji Micro": "ent-anji", "BIWIN": "ent-biwin-storage", "BYD": "ent-byd-contracting-endpoint-unresolved", "Biren": "ent-biren-brand-endpoint-unresolved", "CR Micro": "ent-crmicro", "CRRC Times": "ent-zhuzhou-crrc-times-semiconductor", "CSSC Special Gas": "ent-cssc-handan-peric-special-gases", "CXMT": "ent-cxmt-corp", "Cambricon": "ent-cambricon-brand-endpoint-unresolved", "CanSemi": "ent-cansemitech", "Changchuan": "ent-changchuan", "China Unicom": "ent-dd-cu-operating", "Coma / Kema": "ent-suzhou-kema-materials", "DapuStor": "ent-dapustor", "Darbond": "ent-darbond", "Dinglong": "ent-hubei-dinglong", "Dosilicon": "ent-dosilicon", "Empyrean Technology": "ent-empyrean", "Enflame": "ent-enflame", "Espressif": "ent-espressif", "Fastprint": "ent-fastprint", "Fuchuang Precision": "ent-shenyang-fortune-precision", "Fudan Micro": "ent-shanghai-fudan-microelectronics", "Fujian Jinhua / JHICC": "ent-jhicc", "GRINM": "ent-grinm-advanced-materials", "GigaDevice": "ent-gigadevice", "GigaDevice manufacturing relationships": "ent-gigadevice", "Goke Micro": "ent-goke-microelectronics", "Goodix": "ent-goodix", "Guangzhou Gas": "ent-guangzhou-g-gas-energy", "Guowang Optics": "ent-guowang-optics", "H3C": "ent-h3c-technologies", "HHCK": "ent-jiangsu-hhck-advanced-materials", "HLMC": "ent-huahong-huali", "Hanbell": "ent-shanghai-hanbell", "Hengyunchang": "ent-hengyunchang", "Houmo": "ent-houmo", "Hua Hong Semiconductor": "ent-huahong-semiconductor", "Huakang": "ent-util-huakang", "Huate Gas": "ent-huate-gas", "Huatian": "ent-huatian", "Huawei": "ent-huawei", "Huazheng": "ent-wazam", "Hwatsing": "ent-hwatsing", "Iluvatar CoreX": "ent-iluvatar", "Innoscience": "ent-innoscience-suzhou", "JCET": "ent-jcet", "Jianghua Micro": "ent-jiangyin-jianghua-micro", "Jingce": "ent-wuhan-jingce-electronic", "Jinhong Gas": "ent-jinhong-gas", "Juchen": "ent-giantec-juchen", "KFMI": "ent-kfmi", "KYKY": "ent-util-kyky", "Kehua": "ent-beijing-kehua", "Kingsemi": "ent-kingsemi", "Kingstone": "ent-shanghai-kingstone-semiconductor", "Kunlunxin": "ent-kunlun-brand-endpoint-unresolved", "L&K Engineering": "ent-util-lk-suzhou", "Leadmicro": "ent-leadmicro", "Li Auto": "ent-li-auto-inc", "Lianrui": "ent-jiangsu-novoray-lianrui", "Lion Micro": "ent-hangzhou-lion-electronics", "Longsys": "ent-longsys", "Maxio": "ent-maxio-technology-hangzhou", "Memblaze": "ent-memblaze", "MetaX": "ent-metax", "Montage": "ent-montage", "Moore Threads": "ent-moore-threads", "NAURA": "ent-naura", "NIO": "ent-nio-inc", "NSIG": "ent-nsig", "Nata": "ent-nata", "Netac": "ent-netac-technology", "Nexchip": "ent-nexchip-hefei", "PNCS": "ent-pnc-process-systems", "Payton": "ent-payton-technology-shenzhen", "Phichem": "ent-phichem", "Piotech": "ent-piotech", "Primarius Technologies": "ent-primarius", "Puya": "ent-puya-semiconductor", "RSLaser": "ent-rslaser", "Red Avenue": "ent-red-avenue", "Rockchip": "ent-rockchip", "SAIC": "ent-saic-motor", "SICC": "ent-sicc", "SJ Semiconductor": "ent-sjsemi-issuer", "SK hynix Dalian NAND": "ent-skhynix-dalian", "SK hynix Wuxi DRAM": "ent-skhynix-wuxi-operator-unresolved", "SMEE": "ent-smee", "SMIC": "ent-smic", "SOPHGO": "ent-sophgo-beijing", "Samsung Xi’an NAND": "ent-samsung-china-semiconductor", "Semitronix": "ent-semitronix", "Shanghai Sinyang": "ent-shanghai-sinyang-semiconductor-materials", "Shennan": "ent-shennan-circuits", "Shennan Circuits": "ent-shennan-circuits", "SiCarrier": "ent-sicarrier", "Silan": "ent-silan", "Skyverse": "ent-skyverse", "Starblaze": "ent-beijing-starblaze", "Swaysure": "ent-swaysure", "TSMC Nanjing": "ent-tsmc-nanjing", "TankeBlue": "ent-tankeblue", "Thinkon": "ent-thinkon-semiconductor-jinzhou", "Tongfu": "ent-tongfu", "U-Precision": "ent-uprecision", "UMC-related mainland operations": "ent-united-semi-xiamen", "UNISOC": "ent-dd-unisoc-shanghai", "VeriSilicon": "ent-verisilicon", "Will Semiconductor": "ent-willsemi", "Witmem": "ent-witmem", "Wuhan Xinxin / XMC": "ent-xmc", "XTX": "ent-xtx-technology", "Xingfa": "ent-hubei-xingfa-chemicals", "Xingfu": "ent-hubei-sinophorus-xingfu-electronic-materials", "Xinlai": "ent-kunshan-kinglai-xinlai", "Xi’an Eswin Material": "ent-xian-eswin-material", "Xpeedic": "ent-xpeedic", "YMTC": "ent-ymtc", "Yitang": "ent-yitang", "Zhichun": "ent-pnc-process-systems", "上海东方算芯科技有限公司": "ent-dfsx", "上海宇量昇科技有限公司": "ent-yuliangsheng", "上海爱晟纳电子科技集团有限公司": "ent-aishengna", "九日新材 / Jiuri New Materials": "ent-tianjin-jiuri-new-materials", "北京科益虹源 / Beijing RSLaser": "ent-rslaser", "华卓精科 / U-Precision": "ent-uprecision", "国望光学 / Guowang Optics": "ent-guowang-optics", "清溢光电 / Qingyi Photomask": "ent-shenzhen-qingyi-photomask", "路维光电 / Newway Photomask": "ent-shenzhen-newway-photomask" }, "schema_version": "touchdown.china-semiconductor.seed-universe.v1", "sourced_exclusions": [] }, "processes": [ { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-accepted-result-economics" ], "id": "proc-accepted-result-economics", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "workload", "name": "Accepted output, cost, energy, reliability and margin", "process_id": "proc-accepted-result-economics", "record_type": "process", "source_ids": [], "verified_entity_ids": [] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-analog-design" ], "id": "proc-analog-design", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "eda", "name": "Analog and custom design", "process_id": "proc-analog-design", "record_type": "process", "source_ids": [ "src-empyrean-annual-2025", "src-primarius-annual-2025" ], "verified_entity_ids": [ "ent-empyrean", "ent-primarius" ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-analog-rf-power-sensor" ], "id": "proc-analog-rf-power-sensor", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "fabrication", "name": "Analog, RF, power, MEMS and sensor fabrication", "process_id": "proc-analog-rf-power-sensor", "record_type": "process", "source_ids": [ "src-huahong-annual-2025", "src-reuters-duv-aishengna-2026" ], "verified_entity_ids": [ "ent-huahong-semiconductor" ] }, { "completion_state": "source_backed", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-boards-optics-network" ], "id": "proc-boards-optics-network", "inventory_class": "major_process", "last_checked": "2026-07-29", "layer": "systems", "name": "Boards, optics and networking", "process_id": "proc-boards-optics-network", "record_type": "process", "source_ids": [ "src-dfsx-3d-near-memory-2026", "src-dfsx-df1000-product-2026" ], "verified_entity_ids": [ "ent-dfsx" ] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-channel-authorized-distribution" ], "id": "proc-channel-authorized-distribution", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "distribution", "name": "Authorized semiconductor distribution", "process_id": "proc-channel-authorized-distribution", "record_type": "process", "source_ids": [], "verified_entity_ids": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-channel-equipment-material-agents" ], "id": "proc-channel-equipment-material-agents", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "distribution", "name": "Equipment and material agents and service organizations", "process_id": "proc-channel-equipment-material-agents", "record_type": "process", "source_ids": [], "verified_entity_ids": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-channel-inventory-spot-resale" ], "id": "proc-channel-inventory-spot-resale", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "distribution", "name": "Inventory ownership and spot-market resale", "process_id": "proc-channel-inventory-spot-resale", "record_type": "process", "source_ids": [], "verified_entity_ids": [] }, { "completion_state": "lead_only", "coverage_note": "Verified entity means only that a source supports relevant portfolio or operation; see gap for qualification ceiling.", "explicit_gap_ids": [ "gap-process-channel-module-distribution-assembly" ], "id": "proc-channel-module-distribution-assembly", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "distribution", "name": "Module distribution and assembly boundaries", "process_id": "proc-channel-module-distribution-assembly", "record_type": "process", "source_ids": [], "verified_entity_ids": [] }, { "completion_state": "source_backed", "coverage_note": "Ten legal/company or preserved group endpoints have exact product receipts; no model has a complete foundry-memory-OSAT-customer-yield chain.", "explicit_gap_ids": [ "gap-process-chip-ai-accelerator" ], "id": "proc-chip-ai-accelerator", "inventory_class": "required_leaf", "last_checked": "2026-07-29", "layer": "chip_product", "name": "AI accelerator products", "process_id": "proc-chip-ai-accelerator", "record_type": "process", "source_ids": [ "src-baidu-baige-deepseek-p800-20250217", "src-baidu-p800-large-cluster-caict-claim-20250723", "src-biren-annual-2025", "src-cambricon-annual-2025", "src-cambricon-mlu370x8-product", "src-ctyun-cambricon-cloud-20260703", "src-enflame-csrc-approval-20260709", "src-enflame-t20-t21-20210709", "src-h3c-h65-bios-574-20230804", "src-houmo-h30-youkong-20231229", "src-houmo-home", "src-houmo-m50-greatwall-20260531", "src-houmo-m50-product", "src-iluvatar-about", "src-iluvatar-annual-2025", "src-kunlun-k200-product", "src-kunlun-p800-cmb-20250327", "src-kunlun-r200-product", "src-kunlunxin-home", 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"src-huate-gas-annual-2025" ], "unknowns": [ "CoA impurity limits", "delivery form", "customer/facility", "process layer", "capacity", "shipment volume" ] }, { "batch_supply_state": "construction_ledger_entry; progress_and_output_unknown", "capacity": { "scope": "legal owner and facility not resolved", "state": "designed_project_capacity", "unit": "tonnes_per_year", "value": 300 }, "chemical_identity": "BCl3", "completion_state": "facility_backed", "entity_id": "ent-huate-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "numeric specification undisclosed", "id": "mat-huate-bcl3-300t-project", "last_checked": "2026-07-29", "material_class": "etch_or_doping_gas", "material_id": "mat-huate-bcl3-300t-project", "name": "Boron trichloride purification project", "purity": null, "qualified_process": "clean/etch or doping application claimed; exact qualified process undisclosed", "record_type": "material", "source_ids": [ 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"material", "source_ids": [ "src-huate-gas-annual-2025" ], "unknowns": [ "designed capacity", "legal project owner", "facility/address", "installed/qualified capacity", "utilization", "actual output", "CoA", "customer", "delivery/acceptance", "upstream precursor" ] }, { "batch_supply_state": "volume_production_vendor_reported", "chemical_identity": "Includes CF4, C2F6, CO2, CO, C4F8, CHF3 and C4F6", "completion_state": "source_backed", "entity_id": "ent-huate-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "electronic grade; SKU grades undisclosed", "id": "mat-huate-electronic-gases", "last_checked": "2026-07-29", "material_class": "etch_and_process_gases", "material_id": "mat-huate-electronic-gases", "name": "Electronic specialty-gas portfolio", "purity": null, "qualified_process": "issuer reports multiple node uses; exact layers undisclosed", "record_type": "material", "source_ids": [ "src-huate-gas-annual-2025" ], "unknowns": [ "gas 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"unknowns": [ "named legal customer and facility", "qualified process/layer", "lot CoA and impurity-by-element limits", "shipment volume" ], "upstream_precursor": null, "utilization": null }, { "batch_supply_state": "volume_production_vendor_reported", "capacity": null, "chemical_identity": "TEOS", "completion_state": "source_backed", "contradiction_ids": [], "entity_id": "ent-jinhong-gas", "foreign_dependency": null, "foreign_dependency_status": "unknown_not_proven_none", "grade": "electronic precursor; numeric grade undisclosed", "id": "mat-jinhong-teos", "last_checked": "2026-07-29", "material_class": "deposition_precursor", "material_id": "mat-jinhong-teos", "metal_limit": null, "name": "Tetraethyl orthosilicate", "named_fab_or_osat": null, "packaging_delivery_form": [ "cylinder" ], "particle_limit": null, "purity": null, "qualified_process": "LPCVD SiO2 insulating layer; exact qualified customer process unknown", "record_type": "material", "source_ids": [ "src-jinhong-annual-2025" 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"family-level vendor readiness; no exact SKU, named fab, grade, qualification date or yield", "claim_ids": [ "clm-anji-process-family-readiness" ], "completion_state": "source_backed", "entity_id": "ent-anji", "evidence_state": "VENDOR_REPORTED", "families": [ "copper_and_barrier", "tungsten", "dielectric", "ceria", "silicon_substrate", "TSV", "hybrid_bonding", "polymer", "carbon" ], "id": "cap-anji-cmp-family-matrix", "last_checked": "2026-07-29", "name": "CMP slurry family readiness matrix", "process_id": "proc-material-cmp-consumables", "readiness_state": "volume_production", "record_type": "capability", "source_ids": [ "src-anji-solutions-2026", "src-anji-launch-2026" ], "taxonomy": "materials_product_family" }, { "capability_id": "cap-anji-functional-wet-chemicals", "claim_ceiling": "family/process-level vendor readiness; no exact SKU, named fab, grade, lot or yield", "claim_ids": [ "clm-anji-process-family-readiness" ], "completion_state": "source_backed", "entity_id": "ent-anji", "evidence_state": "VENDOR_REPORTED", "families": [ "aluminum_post_etch_clean", "copper_post_etch_clean", "TiN_hardmask_clean", "copper_post_CMP_clean", "thick_resist_strip", "cured_PI_clean", "flux_remove", "copper_plating", "nickel_plating", "nickel_iron_plating", "tin_silver_plating" ], "id": "cap-anji-functional-wet-chemicals", "last_checked": "2026-07-29", "name": "Functional wet-chemical process matrix", "process_id": "proc-material-wet-plating-chemistry", "readiness_state": "volume_production", "record_type": "capability", "source_ids": [ "src-anji-solutions-2026" ], "taxonomy": "materials_product_family" }, { "architecture_classification": [ "H2" ], "bandwidth": { "evidence_state": "PLAUSIBLE_UNVERIFIED", "label": "secondary report relaying a vendor launch peak; direction, scope and sustained result undisclosed", "unit": "TB/s", "value": 6.4 }, "capability_id": "cap-df1000-h2", "capacity": null, "claim_ids": [ "clm-df1000-architecture", "clm-df1000-launch-numeric-claims" ], "completion_state": "source_backed", "energy_per_bit": null, "entity_id": "ent-dfsx", "evidence_state": "VENDOR_REPORTED", "foreign_dependencies": [], "id": "cap-df1000-h2", "last_checked": "2026-07-29", "latency_distribution": null, "memory_medium": "3D DRAM; generation and supplier unknown", "name": "DF1000 vendor-described 3D DRAM near-memory architecture", "package": "wafer-level hybrid-bonded structure claimed; flow unknown", "physical_byte_path": "DRAM-to-logic vertical path; interface width, layers and protocol unknown", "physical_location": "vertically integrated near logic per vendor", "process_id": "proc-chip-architecture", "readiness_state": "manufactured", "record_type": "capability", "software_requirements": [ "vendor software-defined architecture; versions and kernels unknown" ], "source_ids": [ "src-dfsx-df1000-product-2026", "src-dfsx-3d-near-memory-2026", "src-dfsx-launch-shanghai-securities-2026" ], "taxonomy": "hbm_reduced_architecture", "unknowns": [ "foundry", "memory supplier", "memory capacity", "interface width", "layer count", "bond flow", "bond pitch", "yield", "package", "OSAT", "TDP", "customers", "installed units", "shipment volume", "independent workload" ], "workload_fit": [ "training and inference claimed; no independent receipt" ] }, { "capability_id": "cap-duv-dram-patterning-trace", "claim_ids": [], "completion_state": "lead_only", "device_family": "DRAM", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "id": "cap-duv-dram-patterning-trace", "last_checked": "2026-07-29", "name": "DRAM domestic-DUV patterning proof trace", "process_id": "proc-dram-fabrication", "readiness_state": "unknown", "record_type": "capability", "required_layers": { "block_masks": null, "cell_patterning": null, "contacts": null, "cost_per_good_wafer": null, "cut_masks": null, "cycle_time": null, "edge_placement_error": null, "hard_masks": null, "inspection": null, "lele": null, "metal": null, "overlay": null, "peripheral_logic": null, "sadp": null, "saqp": null, "yield": null }, "source_ids": [], "taxonomy": "duv_patterning_trace", "unknowns": [ "fab", "scanner model", "named layer", "process window", "electrical yield" ] }, { "availability": null, "capability_id": "cap-duv-fab-cxmt", "cd_window": null, "claim_ids": [], "completion_state": "source_backed", "conclusion": "No purchase, delivery, move-in, installation or acceptance record.", "defectivity": null, "electrical_yield": null, "entity_id": "ent-cxmt-corp", "evidence_state": "PLAUSIBLE_UNVERIFIED", "focus_control": null, "good_die_output": null, "highest_source_bounded_context_state": "future-recipient lead below P4", "id": "cap-duv-fab-cxmt", "installation": null, "last_checked": "2026-07-29", "model": null, "move_in": null, "mtbf": null, "mttr": null, "name": "CXMT domestic-DUV insertion matrix", "named_layer": null, "next_evidence_needed": "Named legal fab and model plus purchase/receiving, move-in, installation, site acceptance, qualified layer, process window, electrical yield and two-quarter production receipt.", "numerical_aperture": null, "overlay": null, "overlay_distribution": null, "p0": "lead/catalogue context only or not linked", "p1": "not sufficient for domestic scanner attribution", "p2": "production context does not identify scanner vendor", "p3": "only SMIC has a reported prototype-evaluation lead", "p4": "not proven", "p5": "not proven", "p6": "not proven", "process_id": "proc-lithography-immersion-arf", "readiness_state": "unknown", "record_type": "capability", "recurring_two_quarter_volume": null, "resist": null, "serial_or_purchase_evidence": null, "site_acceptance": null, "source_ids": [ "src-reuters-duv-aishengna-2026" ], "taxonomy": "domestic_duv_fab_matrix", "track": null, "verified_domestic_duv_state": "UNRESOLVED", "wafers_per_hour": null, "wavelength": null }, { "availability": null, "capability_id": "cap-duv-fab-huahong", "cd_window": null, "claim_ids": [], "completion_state": "source_backed", "conclusion": "Future-recipient reporting is not delivery or installation; exact subsidiary/fab unresolved.", "defectivity": null, "electrical_yield": null, "entity_id": "ent-huahong-semiconductor", "evidence_state": "PLAUSIBLE_UNVERIFIED", "focus_control": null, "good_die_output": null, "highest_source_bounded_context_state": "future-recipient lead below P4", "id": "cap-duv-fab-huahong", "installation": null, "last_checked": "2026-07-29", "model": null, "move_in": null, "mtbf": null, "mttr": null, "name": "Hua Hong domestic-DUV insertion matrix", "named_layer": null, "next_evidence_needed": "Named legal fab and model plus purchase/receiving, move-in, installation, site acceptance, qualified layer, process window, electrical yield and two-quarter production receipt.", "numerical_aperture": null, "overlay": null, "overlay_distribution": null, "p0": "lead/catalogue context only or not linked", "p1": "not sufficient for domestic scanner attribution", "p2": "production context does not identify scanner vendor", "p3": "only SMIC has a reported prototype-evaluation lead", "p4": "not proven", "p5": "not proven", "p6": "not proven", "process_id": "proc-lithography-immersion-arf", "readiness_state": "unknown", "record_type": "capability", "recurring_two_quarter_volume": null, "resist": null, "serial_or_purchase_evidence": null, "site_acceptance": null, "source_ids": [ "src-reuters-duv-aishengna-2026" ], "taxonomy": "domestic_duv_fab_matrix", "track": null, "verified_domestic_duv_state": "UNRESOLVED", "wafers_per_hour": null, "wavelength": null }, { "availability": null, "capability_id": "cap-duv-fab-jhicc", "cd_window": null, "claim_ids": [], "completion_state": "source_backed", "conclusion": "Official page proves memory scope only; operating/production/scanner milestones remain open.", "defectivity": null, "electrical_yield": null, "entity_id": "ent-jhicc", "evidence_state": "UNRESOLVED", "focus_control": null, "good_die_output": null, "highest_source_bounded_context_state": "unresolved", "id": "cap-duv-fab-jhicc", "installation": null, "last_checked": "2026-07-29", "model": null, "move_in": null, "mtbf": null, "mttr": null, "name": "Fujian Jinhua / JHICC domestic-DUV insertion matrix", "named_layer": null, "next_evidence_needed": "Named legal fab and model plus purchase/receiving, move-in, installation, site acceptance, qualified layer, process window, electrical yield and two-quarter production receipt.", "numerical_aperture": null, "overlay": null, "overlay_distribution": null, "p0": "lead/catalogue context only or not linked", "p1": "not sufficient for domestic scanner attribution", "p2": "production context does not identify scanner vendor", "p3": "only SMIC has a reported prototype-evaluation lead", "p4": "not proven", "p5": "not proven", "p6": "not proven", "process_id": "proc-lithography-immersion-arf", "readiness_state": "unknown", "record_type": "capability", "recurring_two_quarter_volume": null, "resist": null, "serial_or_purchase_evidence": null, "site_acceptance": null, "source_ids": [ "src-jhicc-about" ], "taxonomy": "domestic_duv_fab_matrix", "track": null, "verified_domestic_duv_state": "UNRESOLVED", "wafers_per_hour": null, "wavelength": null }, { "availability": null, "capability_id": "cap-duv-fab-smic", "cd_window": null, "claim_ids": [], "completion_state": "source_backed", "conclusion": "Paywalled secondary report of prototype evaluation; no primary receipt.", "defectivity": null, "electrical_yield": null, "entity_id": "ent-smic", "evidence_state": "PLAUSIBLE_UNVERIFIED", "focus_control": null, "good_die_output": null, "highest_source_bounded_context_state": "P3 reported only", "id": "cap-duv-fab-smic", "installation": null, "last_checked": "2026-07-29", "model": null, "move_in": null, "mtbf": null, "mttr": null, "name": "SMIC domestic-DUV insertion matrix", "named_layer": null, "next_evidence_needed": "Named legal fab and model plus purchase/receiving, move-in, installation, site acceptance, qualified layer, process window, electrical yield and two-quarter production receipt.", "numerical_aperture": null, "overlay": null, "overlay_distribution": null, "p0": "lead/catalogue context only or not linked", "p1": "not sufficient for domestic scanner attribution", "p2": "production context does not identify scanner vendor", "p3": "only SMIC has a reported prototype-evaluation lead", "p4": "not proven", "p5": "not proven", "p6": "not proven", "process_id": "proc-lithography-immersion-arf", "readiness_state": "unknown", "record_type": "capability", "recurring_two_quarter_volume": null, "resist": null, "serial_or_purchase_evidence": null, "site_acceptance": null, "source_ids": [ "src-ft-yuliangsheng-smic-2026" ], "taxonomy": "domestic_duv_fab_matrix", "track": null, "verified_domestic_duv_state": "UNRESOLVED", "wafers_per_hour": null, "wavelength": null }, { "availability": null, "capability_id": "cap-duv-fab-swaysure", "cd_window": null, "claim_ids": [], "completion_state": "source_backed", "conclusion": "Official page proves an R&D scope only; an operating fab is not proven.", "defectivity": null, "electrical_yield": null, "entity_id": "ent-swaysure", "evidence_state": "UNRESOLVED", "focus_control": null, "good_die_output": null, "highest_source_bounded_context_state": "unresolved", "id": "cap-duv-fab-swaysure", "installation": null, "last_checked": "2026-07-29", "model": null, "move_in": null, "mtbf": null, "mttr": null, "name": "Swaysure domestic-DUV insertion matrix", "named_layer": null, "next_evidence_needed": "Named legal fab and model plus purchase/receiving, move-in, installation, site acceptance, qualified layer, process window, electrical yield and two-quarter production receipt.", "numerical_aperture": null, "overlay": null, "overlay_distribution": null, "p0": "lead/catalogue context only or not linked", "p1": "not sufficient for domestic scanner attribution", "p2": "production context does not identify scanner vendor", "p3": "only SMIC has a reported prototype-evaluation lead", "p4": "not proven", "p5": "not proven", "p6": "not proven", "process_id": "proc-lithography-immersion-arf", "readiness_state": "unknown", "record_type": "capability", "recurring_two_quarter_volume": null, "resist": null, "serial_or_purchase_evidence": null, "site_acceptance": null, "source_ids": [ "src-swaysure-home" ], "taxonomy": "domestic_duv_fab_matrix", "track": null, "verified_domestic_duv_state": "UNRESOLVED", "wafers_per_hour": null, "wavelength": null }, { "availability": null, "capability_id": "cap-duv-fab-xmc", "cd_window": null, "claim_ids": [], "completion_state": "source_backed", "conclusion": "Two fabs and output are proven; domestic scanner identity is not.", "defectivity": null, "electrical_yield": null, "entity_id": "ent-xmc", "evidence_state": "CONFIRMED_PRIMARY", "focus_control": null, "good_die_output": null, "highest_source_bounded_context_state": "P2 production context; scanner unidentified", "id": "cap-duv-fab-xmc", "installation": null, "last_checked": "2026-07-29", "model": null, "move_in": null, "mtbf": null, "mttr": null, "name": "Wuhan Xinxin / XMC domestic-DUV insertion matrix", "named_layer": null, "next_evidence_needed": "Named legal fab and model plus purchase/receiving, move-in, installation, site acceptance, qualified layer, process window, electrical yield and two-quarter production receipt.", "numerical_aperture": null, "overlay": null, "overlay_distribution": null, "p0": "lead/catalogue context only or not linked", "p1": "not sufficient for domestic scanner attribution", "p2": "production context does not identify scanner vendor", "p3": "only SMIC has a reported prototype-evaluation lead", "p4": "not proven", "p5": "not proven", "p6": "not proven", "process_id": "proc-lithography-immersion-arf", "readiness_state": "unknown", "record_type": "capability", "recurring_two_quarter_volume": null, "resist": null, "serial_or_purchase_evidence": null, "site_acceptance": null, "source_ids": [ "src-xmc-prospectus-2025" ], "taxonomy": "domestic_duv_fab_matrix", "track": null, "verified_domestic_duv_state": "UNRESOLVED", "wafers_per_hour": null, "wavelength": null }, { "availability": null, "capability_id": "cap-duv-fab-ymtc", "cd_window": null, "claim_ids": [], "completion_state": "source_backed", "conclusion": "Product production is proven; domestic scanner identity is not.", "defectivity": null, "electrical_yield": null, "entity_id": "ent-ymtc", "evidence_state": "CONFIRMED_PRIMARY", "focus_control": null, "good_die_output": null, "highest_source_bounded_context_state": "P2 production context; scanner unidentified", "id": "cap-duv-fab-ymtc", "installation": null, "last_checked": "2026-07-29", "model": null, "move_in": null, "mtbf": null, "mttr": null, "name": "YMTC domestic-DUV insertion matrix", "named_layer": null, "next_evidence_needed": "Named legal fab and model plus purchase/receiving, move-in, installation, site acceptance, qualified layer, process window, electrical yield and two-quarter production receipt.", "numerical_aperture": null, "overlay": null, "overlay_distribution": null, "p0": "lead/catalogue context only or not linked", "p1": "not sufficient for domestic scanner attribution", "p2": "production context does not identify scanner vendor", "p3": "only SMIC has a reported prototype-evaluation lead", "p4": "not proven", "p5": "not proven", "p6": "not proven", "process_id": "proc-lithography-immersion-arf", "readiness_state": "unknown", "record_type": "capability", "recurring_two_quarter_volume": null, "resist": null, "serial_or_purchase_evidence": null, "site_acceptance": null, "source_ids": [ "src-ymtc-about", "src-ymtc-64layer-2019" ], "taxonomy": "domestic_duv_fab_matrix", "track": null, "verified_domestic_duv_state": "UNRESOLVED", "wafers_per_hour": null, "wavelength": null }, { "capability_id": "cap-duv-nand-patterning-trace", "claim_ids": [], "completion_state": "lead_only", "device_family": "3D NAND", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "id": "cap-duv-nand-patterning-trace", "last_checked": "2026-07-29", "name": "3D-NAND domestic-DUV patterning proof trace", "process_id": "proc-nand-fabrication", "readiness_state": "unknown", "record_type": "capability", "required_layers": { "alignment": null, "channel_patterning": null, "cost_per_good_wafer": null, "cycle_time": null, "hard_masks": null, "high_aspect_ratio_etch_interaction": null, "inspection": null, "periphery": null, "slit_patterning": null, "staircase_patterning": null, "string_stacking": null, "yield": null }, "source_ids": [], "taxonomy": "duv_patterning_trace", "unknowns": [ "fab", "scanner model", "named layer", "process window", "electrical yield" ] }, { "capability_id": "cap-hbm-step-accelerator-integration", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-system-architecture", "id": "cap-hbm-step-accelerator-integration", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Accelerator integration", "process_id": "proc-system-architecture", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step" }, { "capability_id": "cap-hbm-step-base-die-phy", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-pdk-libraries-ip", "id": "cap-hbm-step-base-die-phy", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Base die and PHY", "process_id": "proc-pdk-libraries-ip", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step" }, { "capability_id": "cap-hbm-step-burn-in", "claim_ids": [], "completion_state": "lead_only", "entity_id": "ent-mainland-qualified-hbm-analysis", "evidence_state": "UNRESOLVED", "gap_id": "gap-process-final-test-burnin", "id": "cap-hbm-step-burn-in", "last_checked": "2026-07-29", "missing_proof": [ "named stack generation/product", "named legal endpoints and facility", "customer qualification", "yield and sustained shipment" ], "name": "Burn-in", "process_id": "proc-final-test-burnin", "qualification_state": "not_proven_for_a_qualified_mainland_commercial_hbm_stack", "readiness_state": "unknown", "record_type": "capability", "required_stack_fields": { "accelerator": null, "bandwidth": null, "base_die": null, "bond_pitch": null, "bond_type": null, "customer": null, "die_capacity": null, "field_reliability": null, "generation": null, "interface_width": null, "known_good_die_method": null, "phy": null, "power_integrity": null, "probe_coverage": null, "qualification_date": null, "redundancy": null, "repair": null, "shipment_volume": null, "signal_integrity": null, "stack_height": null, "stack_yield": null, "test_coverage": null, "thermal_cycling": null, "total_capacity": null, "tsv_geometry": null, "warpage": null }, "source_ids": [], "taxonomy": "conventional_hbm_step" }, { "capability_id": "cap-hbm-step-customer-qualification", "claim_ids": [], "completion_state": "lead_only", "entity_id": 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"dep-gap-material-advanced-metal-precursors", "dependency_name": "Co/Ru/Mo advanced metal precursors", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-deposition-cvd-ald", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-advanced-metal-precursors", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 13, "record_type": "dependency", "source_ids": [], "substitute_id": null }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-arf-photoresist", "dependency_name": "Immersion-ArF photoresist", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-lithography-immersion-arf", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-arf-photoresist", "last_checked": "2026-07-29", "proof_needed": [ "named 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"dep-gap-material-high-k-precursors", "dependency_name": "High-k Hf/Zr precursors", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-deposition-cvd-ald", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-high-k-precursors", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 12, "record_type": "dependency", "source_ids": [], "substitute_id": null }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-high-performance-tim", "dependency_name": "High-performance thermal interface materials", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-power-cooling", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-high-performance-tim", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", 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"dep-gap-material-ncf-underfill", "dependency_name": "NCF and capillary underfill", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-stack-assembly-repair", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-ncf-underfill", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 18, "record_type": "dependency", "source_ids": [], "substitute_id": null }, { "category": "material_precursor", "claim_ids": [], "completion_state": "lead_only", "country_or_region": "unknown", "dependency_id": "dep-gap-material-pag", "dependency_name": "Photoacid generators", "dependency_type": "unresolved_dependency_candidate", "dependent_id": "proc-lithography-immersion-arf", "evidence_state": "UNRESOLVED", "id": "dep-gap-material-pag", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process 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"dep-metax-overseas-hbm-category", "last_checked": "2026-07-29", "proof_needed": [ "exact HBM generation/SKU", "supplier", "product allocation", "package flow", "qualification", "second source" ], "rank": 3, "record_type": "dependency", "source_ids": [ "src-metax-annual-2025" ], "substitute_id": null }, { "category": "eda_software_ip_service", "claim_ids": [ "clm-metax-identity-products-and-production-dates" ], "completion_state": "source_backed", "country_or_region": "overseas supplier undisclosed", "dependency_id": "dep-metax-overseas-interface-ip-category", "dependency_name": "Overseas high-speed interface IP category", "dependency_type": "confirmed_foreign_ip_category", "dependent_id": "ent-metax", "evidence_state": "CONFIRMED_PRIMARY", "id": "dep-metax-overseas-interface-ip-category", "last_checked": "2026-07-29", "proof_needed": [ "IP block/vendor/version", "product allocation", "foundry/node", "license/service route", "domestic replacement qualification" ], "rank": 4, "record_type": "dependency", "source_ids": [ "src-metax-annual-2025" ], "substitute_id": null }, { "category": "equipment", "claim_ids": [ "clm-samsung-xian-tool-license-2026" ], "completion_state": "source_backed", "country_or_region": "United States", "dependency_id": "dep-samsung-xian-controlled-tool-exports", "dependency_name": "U.S.-controlled chipmaking tools and service route", "dependency_type": "confirmed_export_license_exposure", "dependent_id": "fac-samsung-xian-nand", "evidence_state": "CONFIRMED_INDEPENDENT", "id": "dep-samsung-xian-controlled-tool-exports", "last_checked": "2026-07-29", "proof_needed": [ "official license", "covered tool/component list", "license term", "qualified substitutes" ], "rank": 1, "record_type": "dependency", "source_ids": [ "src-reuters-samsung-skhynix-tool-license-2025" ], "substitute_id": null }, { "category": "equipment", "claim_ids": [ "clm-skhynix-dalian-tool-license-2026" ], "completion_state": "source_backed", "country_or_region": "United States", "dependency_id": "dep-skhynix-dalian-controlled-tool-exports", "dependency_name": "U.S.-controlled chipmaking tools and service route", "dependency_type": "confirmed_export_license_exposure", "dependent_id": "fac-skhynix-dalian-nand", "evidence_state": "CONFIRMED_INDEPENDENT", "id": "dep-skhynix-dalian-controlled-tool-exports", "last_checked": "2026-07-29", "proof_needed": [ "official license", "covered tool/component list", "license term", "qualified substitutes" ], "rank": 1, "record_type": "dependency", "source_ids": [ "src-reuters-samsung-skhynix-tool-license-2025" ], "substitute_id": null }, { "category": "equipment", "claim_ids": [ "clm-skhynix-wuxi-tool-license-2026" ], "completion_state": "source_backed", "country_or_region": "United States", "dependency_id": "dep-skhynix-wuxi-controlled-tool-exports", "dependency_name": "U.S.-controlled chipmaking tools and service route", "dependency_type": "confirmed_export_license_exposure", "dependent_id": "ent-skhynix-wuxi-operator-unresolved", "evidence_state": "CONFIRMED_INDEPENDENT", "id": "dep-skhynix-wuxi-controlled-tool-exports", "last_checked": "2026-07-29", "proof_needed": [ "official license", "covered tool/component list", "license term", "qualified substitutes" ], "rank": 1, "record_type": "dependency", "source_ids": [ "src-reuters-samsung-skhynix-tool-license-2025" ], "substitute_id": null }, { "category": "equipment", "claim_ids": [ "clm-tsmc-china-tool-license-exposure" ], "completion_state": "source_backed", "country_or_region": "United States", "dependency_id": "dep-tsmc-nanjing-controlled-tool-exports", "dependency_name": "U.S.-controlled chipmaking tools and service route", "dependency_type": "confirmed_export_license_exposure", "dependent_id": "fac-tsmc-nanjing-fab16", "evidence_state": "CONFIRMED_INDEPENDENT", "id": "dep-tsmc-nanjing-controlled-tool-exports", "last_checked": "2026-07-29", "proof_needed": [ "official license", "covered tool/component list", "license term", "domestic substitute and qualification" ], "rank": 1, "record_type": "dependency", "source_ids": [ "src-reuters-tsmc-tool-license-2025" ], "substitute_id": null }, { "category": "eda_software_ip_service", "claim_ids": [], "completion_state": "relationship_backed", "country_or_region": "United States", "dependency_id": "dep-verisilicon-globalfoundries-22fdx", "dependency_name": "GlobalFoundries 22FDX 22 nm FD-SOI process/PDK", "dependency_type": "confirmed_foreign_foundry_and_pdk", "dependent_id": "prod-verisilicon-fdsoi-wireless-ip", "evidence_state": "CONFIRMED_PRIMARY", "id": "dep-verisilicon-globalfoundries-22fdx", "last_checked": "2026-07-29", "proof_needed": [ "named importer/user", "exact part/material/software", "facility/process insertion", "domestic substitute qualification" ], "rank": 1, "record_type": "dependency", "source_ids": [ "src-verisilicon-gf-22fdx-2025" ], "substitute_id": null } ], "contradictions": [ { "claim_ids": [ "clm-piotech-production-line-customers", "clm-hwatsing-production-line-customers" ], "completion_state": "source_backed", "contradiction_id": "con-aggregate-customer-vs-model-facility", "current_conclusion": "Direct group-level supplier relationships are preserved, but exact model, receiving legal entity/facility, layer and acceptance remain unknown.", "disagreement_type": "scope_and_facility", "id": "con-aggregate-customer-vs-model-facility", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Customer-side purchase/acceptance record naming model, legal operator, fab and layer.", "source_ids": [ "src-piotech-prospectus-2021", "src-hwatsing-inquiry-2021" ], "topic": "Group-level equipment customer disclosure versus model/facility/layer" }, { "claim_ids": [ "clm-baidu-p800-cluster-caict-five-star-vendor-report" ], "completion_state": "source_backed", "contradiction_id": "con-baidu-caict-vendor-report-not-independent", "current_conclusion": "Keep as vendor-reported until the CAICT certificate/report and test annex are retrieved.", "disagreement_type": "evidence_state", "id": "con-baidu-caict-vendor-report-not-independent", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "CAICT publishes a cluster-identified certificate/report with methodology and results.", "source_ids": [ "src-baidu-p800-large-cluster-caict-claim-20250723" ], "topic": "Baidu report of CAICT assessment versus independent confirmation" }, { "claim_ids": [ "clm-byd-horizon-journey5-designwin-20220421" ], "completion_state": "source_backed", "contradiction_id": "con-byd-journey5-designwin-not-production", "current_conclusion": "The source proves a design win and future plan only; rhetorical mass-production language is not model/SOP/shipment evidence.", "disagreement_type": "commercial_state", "id": "con-byd-journey5-designwin-not-production", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Customer-origin homologation, BOM, SOP or delivery record names model, legal manufacturer and installed Journey 5.", "source_ids": [ "src-byd-horizon-journey5-designwin-20220421" ], "topic": "BYD Journey 5 design-win announcement versus production" }, { "claim_ids": [ "clm-nsig-group-300mm-capacity", "clm-xinsheng-jingke-utilization-2024" ], "completion_state": "source_backed", "contradiction_id": "con-capacity-target-installed-utilized-output", "current_conclusion": "The 850,000 wafers/month group figure and 88.11% Xinsheng Jingke utilization have different entity/facility scopes and cannot be multiplied or merged.", "disagreement_type": "capacity_scope_and_state", "id": "con-capacity-target-installed-utilized-output", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Facility-level capacity denominator, installed/qualified capacity, actual output and yield.", "source_ids": [ "src-nsig-capacity-2025", "src-nsig-inquiry-2025" ], "topic": "NSIG group capacity versus facility utilization and actual output" }, { "claim_ids": [ "clm-china-telecom-server-framework-values" ], "completion_state": "source_backed", "contradiction_id": "con-chinatelecom-chip-identities-unproven", "current_conclusion": "ARM-A does not identify Kunpeng and GPU G-series does not identify Ascend, Cambricon, Biren, MetaX or another vendor.", "disagreement_type": "product_identity", "id": "con-chinatelecom-chip-identities-unproven", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Technical specification annex names legal manufacturer and exact part numbers.", "source_ids": [ "src-digital-china-chinatelecom-framework-20250423" ], "topic": "China Telecom ARM-A/GPU categories versus CPU or accelerator identity" }, { "claim_ids": [ "clm-china-telecom-server-framework-values" ], "completion_state": "source_backed", "contradiction_id": "con-chinatelecom-framework-not-delivery", "current_conclusion": "The filing proves framework shares; later POs, arrival acceptance and test acceptance are unproven.", "disagreement_type": "commercial_state", "id": "con-chinatelecom-framework-not-delivery", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "PO plus arrival/test acceptance and payment milestone record identifies executed scope.", "source_ids": [ "src-digital-china-chinatelecom-framework-20250423" ], "topic": "China Telecom framework values versus order/delivery/test acceptance" }, { "claim_ids": [ "clm-cmcc-ai-server-framework-ceiling" ], "completion_state": "source_backed", "contradiction_id": "con-cmcc-accelerator-identity-unproven", "current_conclusion": "The filing names AI servers only; no Huawei/Ascend or other accelerator attribution is created.", "disagreement_type": "product_identity", "id": "con-cmcc-accelerator-identity-unproven", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Technical annex or PO names server and accelerator/CPU/memory part numbers.", "source_ids": [ "src-digital-china-cmcc-framework-20240824" ], "topic": "China Mobile AI-server framework versus semiconductor supplier identity" }, { "claim_ids": [ "clm-cmcc-ai-server-framework-ceiling" ], "completion_state": "source_backed", "contradiction_id": "con-cmcc-framework-not-delivery", "current_conclusion": "842 is an award ceiling subject to actual orders; delivery, installation and acceptance remain unknown.", "disagreement_type": "commercial_state", "id": "con-cmcc-framework-not-delivery", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Executed PO, delivery list and SAT/asset receipt identify quantity and facility.", "source_ids": [ "src-digital-china-cmcc-framework-20240824" ], "topic": "China Mobile signed framework quantity versus delivered/accepted servers" }, { "claim_ids": [ "clm-ctyun-pak3-online-config", "clm-ctyun-pch1-online-config" ], "completion_state": "source_backed", "contradiction_id": "con-ctyun-integration-not-direct-purchase", "current_conclusion": "The documentation proves integration and online availability only; no semiconductor supplies or Tianyi buys edge is created.", "disagreement_type": "relationship_scope", "id": "con-ctyun-integration-not-direct-purchase", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Procurement award, PO, delivery or asset acceptance names legal supplier, model, quantity and facility.", "source_ids": [ "src-ctyun-ascend-cloud-20260508", "src-ctyun-cambricon-cloud-20260703" ], "topic": "Tianyi Cloud online configurations versus direct semiconductor purchase/supplier edges" }, { "claim_ids": [ "clm-cxmt-public-corpus-no-hbm-product-receipt", "clm-cxmt-product-range-gap-vs-hbm-peers" ], "completion_state": "source_backed", "contradiction_id": "con-cxmt-hbm-narrative-vs-sse-corpus", "current_conclusion": "The 22-file corpus contains HBM only in peer/industry comparisons and explicitly shows CXMT's DDR/LPDDR product-range gap. No CXMT HBM product receipt is promoted; private R&D remains unknown.", "disagreement_type": "product_scope_and_evidence_ceiling", "id": "con-cxmt-hbm-narrative-vs-sse-corpus", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "CXMT or a named counterparty publishes an exact HBM product, facility, stack and readiness receipt.", "source_ids": [ "src-cxmt-sse-project-corpus-api", "src-cxmt-sse-prospectus-2026", "src-cxmt-sse-preview-q1-2025", "src-cxmt-sse-preview-q2-2025" ], "topic": "CXMT HBM narrative versus complete public SSE project corpus" }, { "claim_ids": [ "clm-dd-byd-1500v-sic-chain" ], "completion_state": "source_backed", "contradiction_id": "con-dd-byd-volume-vs-manufacturing-closure", "current_conclusion": "Vendor volume/batch-installation language does not disclose legal semiconductor entity, fab, capacity, output, yield or upstream BOM.", "disagreement_type": "commercial_state_capacity_and_yield", "id": "con-dd-byd-volume-vs-manufacturing-closure", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "BYD Semiconductor filing/EIA plus vehicle qualification and output/yield records.", "source_ids": [ "src-dd-byd-001", "src-dd-byd-002" ], "topic": "BYD large-scale SiC application language versus facility/capacity/yield closure" }, { "claim_ids": [ "clm-dd-cu-general-server-candidates-only", "clm-dd-cu-guangdong-zte-candidate-only", "clm-dd-cu-ai-pool-tender-scope-only" ], "completion_state": "source_backed", "contradiction_id": "con-dd-cu-procurement-not-relationship", "current_conclusion": "Tender and candidate notices create zero supplies/buys/installed/accepted edges until final award and execution receipts appear.", "disagreement_type": "procurement_state", "id": "con-dd-cu-procurement-not-relationship", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Final award, contract/order, equipment schedule, delivery and site acceptance.", "source_ids": [ "src-dd-cu-001", "src-dd-cu-002", "src-dd-cu-003" ], "topic": "China Unicom tender/candidate records versus supplier/customer relationship" }, { "claim_ids": [ "clm-dd-lynk08-refresh-foreign-chip-bom" ], "completion_state": "source_backed", "contradiction_id": "con-dd-lynk-family-volume-vs-se1000-generation", "current_conclusion": "The 2025 family aggregate spans configurations and cannot quantify the 2023 Antora/SE1000 installed base.", "disagreement_type": "product_generation_and_quantity_scope", "id": "con-dd-lynk-family-volume-vs-se1000-generation", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Generation-specific deliveries and homologation BOM by production period.", "source_ids": [ "src-dd-auto-001", "src-dd-auto-005" ], "topic": "Lynk 08 family user aggregate versus 2023 SE1000-configured volume" }, { "claim_ids": [ "clm-umc-xiamen-volume-and-design-capacity" ], "completion_state": "source_backed", "contradiction_id": "con-designed-vs-installed-capacity", "current_conclusion": "50,000 wafers/month is recorded only as design capacity when fully equipped.", "disagreement_type": "capacity_state", "id": "con-designed-vs-installed-capacity", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Current facility table separating installed, qualified, utilized and actual output.", "source_ids": [ "src-umc-fab-information" ], "topic": "UMC Xiamen designed capacity versus installed/qualified/utilized/output" }, { "claim_ids": [ "clm-df1000-all-domestic-claim" ], "completion_state": "source_backed", "contradiction_id": "con-df1000-all-domestic-no-bom", "current_conclusion": "The all-domestic claim fails the requested BOM gate; foundry, memory, OSAT, bonding equipment, EDA/IP and service remain unknown.", "disagreement_type": "origin_and_dependency_scope", "id": "con-df1000-all-domestic-no-bom", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Auditable component-level BOM and origin record with critical spares/service dependencies.", "source_ids": [ "src-dfsx-launch-shanghai-securities-2026" ], "topic": "DF1000 all-domestic claim versus missing component-level BOM" }, { "claim_ids": [ "clm-dfsx-hs512-name", "clm-dfsx-hs128-secondary-name" ], "completion_state": "source_backed", "contradiction_id": "con-df1000-hs128-vs-hs512", "current_conclusion": "Current official product page supports HS512; secondary narrative also uses HS128. Relationship/versioning remains unresolved.", "disagreement_type": "product_naming_and_topology", "id": "con-df1000-hs128-vs-hs512", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Versioned official product matrix defining HS128/HS512 and card/node topology.", "source_ids": [ "src-dfsx-qy100-hs512-2026", "src-dfsx-hs128-secondary-2026" ], "topic": "DF1000 cluster naming: HS128 versus HS512" }, { "claim_ids": [ "clm-df1000-launch-numeric-claims" ], "completion_state": "source_backed", "contradiction_id": "con-df1000-peak-vs-workload", "current_conclusion": "Peak BF16 and bandwidth claims are not workload results and have no independent matched test.", "disagreement_type": "metric_scope_and_performance", "id": "con-df1000-peak-vs-workload", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Independent benchmark at matched model, precision, context, batch, power, software and quality target.", "source_ids": [ "src-dfsx-launch-shanghai-securities-2026" ], "topic": "DF1000 peak numeric claims versus competitive workload evidence" }, { "claim_ids": [ "clm-dfsx-legal-identity" ], "completion_state": "source_backed", "contradiction_id": "con-dfsx-english-name-and-df100-alias", "current_conclusion": "上海东方算芯科技有限公司 is the authoritative Chinese legal name from the official site. No English legal name is promoted; three reported English variants remain source-specific. DF100 is quarantined; the official product identifier is DF1000.", "disagreement_type": "legal_identity_and_product_alias", "id": "con-dfsx-english-name-and-df100-alias", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Official registry extract with English name plus a versioned company product/alias table.", "source_ids": [ "src-dfsx-df1000-product-2026", "src-dfsx-3d-near-memory-2026" ], "topic": "DFSX English legal-name variants and DF100/DF1000 identifier" }, { "claim_ids": [ "clm-smee-ssa600-catalogue" ], "completion_state": "source_backed", "contradiction_id": "con-duv-catalogue-vs-insertion", "current_conclusion": "Catalogue evidence is P0 only; customer, facility, serial, acceptance and qualified layer are unknown.", "disagreement_type": "product_fit_vs_installed_base", "id": "con-duv-catalogue-vs-insertion", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Customer/fab receipt naming model, serial, acceptance and production layer.", "source_ids": [ "src-smee-ssa600-official" ], "topic": "SMEE catalogue product versus fab insertion" }, { "claim_ids": [ "clm-aishengna-future-recipients" ], "completion_state": "source_backed", "contradiction_id": "con-duv-future-recipients-not-deliveries", "current_conclusion": "Expected recipients are leads below P4; no supplies/buys/installed edge is created.", "disagreement_type": "timing_and_commercial_state", "id": "con-duv-future-recipients-not-deliveries", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Purchase order plus delivery, move-in, installation and site acceptance.", "source_ids": [ "src-reuters-duv-aishengna-2026" ], "topic": "Reported future DUV recipients versus delivered or installed tools" }, { "claim_ids": [ "clm-aishengna-reported-manufacturing", "clm-yuliangsheng-smic-p3" ], "completion_state": "source_backed", "contradiction_id": "con-duv-mass-production-vs-testing", "current_conclusion": "Unresolved. Anonymous-source manufacturing language does not prove a completed, delivered, installed or accepted scanner. The strongest reported fab context is P3 at SMIC.", "disagreement_type": "commercial_state_and_terminology", "id": "con-duv-mass-production-vs-testing", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Named model/serial and fab purchase, receiving, move-in, installation and site-acceptance record.", "source_ids": [ "src-reuters-duv-aishengna-2026", "src-ft-yuliangsheng-smic-2026" ], "topic": "Domestic immersion DUV mass-production language versus prototype/testing evidence" }, { "claim_ids": [ "clm-enflame-t20-t21-historical-plan" ], "completion_state": "source_backed", "contradiction_id": "con-enflame-plan-vs-production-closure", "current_conclusion": "The historical end-2021 production plan remains a plan; current production, qualification and shipment are unresolved.", "disagreement_type": "timing_and_commercial_state", "id": "con-enflame-plan-vs-production-closure", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Later primary filing or named-customer acceptance identifies model, units and production state.", "source_ids": [ "src-enflame-csrc-approval-20260709", "src-enflame-t20-t21-20210709" ], "topic": "Enflame T20/T21 2021 volume-production plan versus missing closing receipt" }, { "claim_ids": [ "clm-umc-xiamen-volume-and-design-capacity", "clm-samsung-xian-volume-2014", "clm-tsmc-mainland-fabs", "clm-skhynix-dalian-acquisition" ], "completion_state": "source_backed", "contradiction_id": "con-foreign-mainland-vs-domestic-ownership", "current_conclusion": "UMC, Samsung, TSMC and SK hynix mainland operations remain foreign-owned/controlled and are not counted as mainland-owned capacity.", "disagreement_type": "ownership", "id": "con-foreign-mainland-vs-domestic-ownership", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Current legal ownership/operation filings if control changes.", "source_ids": [ "src-umc-fab-information", "src-samsung-xian-operation-2014", "src-tsmc-annual-2025", "src-skhynix-dalian-acquisition-2021" ], "topic": "Foreign-owned mainland capacity versus mainland-owned capacity" }, { "claim_ids": [ "clm-piotech-bonding-portfolio", "clm-tongfu-hbm-project" ], "completion_state": "source_backed", "contradiction_id": "con-generic-hybrid-bonding-vs-hbm", "current_conclusion": "Neither a bonding equipment portfolio nor an HBM project proves a qualified mainland commercial HBM stack.", "disagreement_type": "capability_vs_qualification", "id": "con-generic-hybrid-bonding-vs-hbm", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Named stack generation, DRAM owner, flow, pitch, yield, accelerator, customer qualification and sustained shipments.", "source_ids": [ "src-piotech-annual-2025", "src-tongfu-hbm-project-2025" ], "topic": "Generic hybrid-bonding capability versus qualified HBM" }, { "claim_ids": [ "clm-anji-plating-state-separation" ], "completion_state": "source_backed", "contradiction_id": "con-generic-plating-vs-hbm", "current_conclusion": "Damascene chemistry is in volume, while TSV chemistry is only in development/validation; neither is promoted to HBM.", "disagreement_type": "process_fit_vs_qualification", "id": "con-generic-plating-vs-hbm", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Named HBM stack/facility qualification with TSV geometry, fill, defects and yield.", "source_ids": [ "src-anji-annual-2025" ], "topic": "Damascene/TSV plating portfolio versus HBM TSV qualification" }, { "claim_ids": [ "clm-grikin-copper-purity-conflict" ], "completion_state": "source_backed", "contradiction_id": "con-grikin-copper-6n-vs-5n", "current_conclusion": "Unresolved: the product title says 6N while the body says 99.999% (5N).", "disagreement_type": "grade_or_purity", "id": "con-grikin-copper-6n-vs-5n", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Corrected official specification or lot CoA defining total-metal and gas-element bases.", "source_ids": [ "src-grikin-6n-copper" ], "topic": "GRIKIN high-purity copper title versus numeric body purity" }, { "claim_ids": [ "clm-h3c-r4930g3-all-domestic-bom-unproven" ], "completion_state": "source_backed", "contradiction_id": "con-h3c-all-domestic-bom-unproven", "current_conclusion": "Do not promote to a confirmed all-domestic system without a part-level BOM, origins, IP/software and service dependencies.", "disagreement_type": "domestic_content", "id": "con-h3c-all-domestic-bom-unproven", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Configuration-specific BOM/AVL and origin record for a shipped server.", "source_ids": [ "src-h3c-r4930g3-product" ], "topic": "H3C all-domestic wording versus component-origin proof" }, { "claim_ids": [ "clm-h3c-bios574-option-matrix" ], "completion_state": "source_backed", "contradiction_id": "con-h3c-firmware-support-not-commercial-deployment", "current_conclusion": "Firmware adaptation proves support only; no supplier, purchase, shipment, installation, qualification or volume edge is created.", "disagreement_type": "readiness_scope", "id": "con-h3c-firmware-support-not-commercial-deployment", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Order/configuration, delivery or customer acceptance names the option part and system.", "source_ids": [ "src-h3c-h65-bios-574-20230804" ], "topic": "H3C firmware option support versus configured/shipped system" }, { "claim_ids": [ "clm-tongfu-hbm-project" ], "completion_state": "source_backed", "contradiction_id": "con-hbm-project-vs-qualified-product", "current_conclusion": "EIA/project evidence remains research/line-construction evidence; customer qualification and volume are not proven.", "disagreement_type": "project_state_vs_production_state", "id": "con-hbm-project-vs-qualified-product", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Customer-qualified stack and dated shipment/yield records.", "source_ids": [ "src-tongfu-hbm-project-2025" ], "topic": "HBM project/line construction versus qualified product" }, { "claim_ids": [ "clm-huali-nikon-patent-title-2018" ], "completion_state": "source_backed", "contradiction_id": "con-huali-nikon-patent-not-installed-tool", "current_conclusion": "Patent ownership/title is mechanism evidence only. No Nikon supplies/owns/operates/installed relationship is created.", "disagreement_type": "patent_scope_vs_installed_base", "id": "con-huali-nikon-patent-not-installed-tool", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Asset, procurement, maintenance or acceptance record names Nikon model and Huali facility.", "source_ids": [ "src-huahong-huali-acquisition-2026" ], "topic": "Huali Nikon-named patent versus installed scanner or supplier edge" }, { "claim_ids": [ "clm-huate-hbm-tsv-gas-application-ceiling" ], "completion_state": "source_backed", "contradiction_id": "con-huate-hbm-application-not-qualified-stack", "current_conclusion": "No exact gas, HBM generation, customer, facility, qualification, yield or shipment is disclosed; all conventional-HBM steps remain open.", "disagreement_type": "application_fit_vs_qualification", "id": "con-huate-hbm-application-not-qualified-stack", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Named HBM customer qualification identifies gas/grade, facility, TSV layer, generation, yield and shipment.", "source_ids": [ "src-huate-gas-annual-2025" ], "topic": "Huate HBM/TSV gas application language versus qualified HBM material edge" }, { "claim_ids": [ "clm-huate-lithography-mixture-certification-ceiling" ], "completion_state": "source_backed", "contradiction_id": "con-huate-portfolio-certification-not-five-model-qualification", "current_conclusion": "The filing lists five mixtures but does not identify which two trace-fluorine formulations passed both certifications; do not assign certification to all five.", "disagreement_type": "scope_and_qualification", "id": "con-huate-portfolio-certification-not-five-model-qualification", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Certificate/AVL names formulation, concentration tolerance, laser model, date and status.", "source_ids": [ "src-huate-gas-annual-2025" ], "topic": "Huate portfolio certification versus per-formulation qualification" }, { "claim_ids": [ "clm-huatian-2p5d-rd-ceiling" ], "completion_state": "source_backed", "contradiction_id": "con-huatian-hbm-context-vs-rd-roadmap", "current_conclusion": "The annual report's HBM mention is industry context. Huatian's own silicon-interposer 2.5D project is R&D ongoing and volume is a future acceleration plan.", "disagreement_type": "industry_context_vs_company_readiness", "id": "con-huatian-hbm-context-vs-rd-roadmap", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Named product/customer qualification and dated production/shipment record.", "source_ids": [ "src-huatian-annual-2025" ], "topic": "Huatian HBM industry context versus its own 2.5D project state" }, { "claim_ids": [ "clm-iluvatar-bi-v100-h3c-compatibility" ], "completion_state": "source_backed", "contradiction_id": "con-iluvatar-bi-v100-alias", "current_conclusion": "Iluvatar's compatibility page names BI-V100 while H3C configuration documents name 天数V100; no reviewed authoritative source explicitly equates the two identifiers.", "disagreement_type": "product_alias", "id": "con-iluvatar-bi-v100-alias", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Versioned joint compatibility matrix or product datasheet explicitly maps BI-V100 to 天数V100.", "source_ids": [ "src-iluvatar-compatibility", "src-h3c-iluvatar-r5300g6-202412", "src-h3c-iluvatar-server-202408" ], "topic": "Iluvatar BI-V100 versus H3C 天数V100 naming" }, { "claim_ids": [ "clm-jinhong-2025-product-state-matrix" ], "completion_state": "source_backed", "contradiction_id": "con-jinhong-c4f6-terminology", "current_conclusion": "The annual report uses 六氟丁二烯 (C4F6) in product/R&D sections and 全氟丁二烯 in another trial-production passage. Preserve both wordings; do not silently equate them.", "disagreement_type": "chemical_identity_terminology", "id": "con-jinhong-c4f6-terminology", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Official product catalogue, SDS, CoA or EIA table supplies formula and CAS.", "source_ids": [ "src-jinhong-annual-2025" ], "topic": "Jinhong C4F6 chemical terminology" }, { "claim_ids": [ "clm-kehua-dk1080-catalogue-volume-claim" ], "completion_state": "source_backed", "contradiction_id": "con-kehua-catalogue-volume-vs-customer-receipt", "current_conclusion": "An alliance-hosted manufacturer catalogue is vendor-reported product evidence; anonymous leading-manufacturer language is not a customer, facility, qualification-date or volume receipt.", "disagreement_type": "source_type_customer_and_quantity", "id": "con-kehua-catalogue-volume-vs-customer-receipt", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Named customer AVL, tender, purchase or qualification record for DK1080.", "source_ids": [ "src-kehua-icmtia-product-catalogue-2026" ], "topic": "Kehua DK1080 catalogue volume language versus named customer receipt" }, { "claim_ids": [ "clm-kfmi-legal-identity", "clm-grikin-legal-identity" ], "completion_state": "source_backed", "contradiction_id": "con-kfmi-grikin-do-not-merge", "current_conclusion": "Do not merge. KFMI is 宁波江丰电子材料股份有限公司; GRIKIN is 有研亿金新材料有限公司 under a different ownership group.", "disagreement_type": "alias_and_legal_entity_resolution", "id": "con-kfmi-grikin-do-not-merge", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "A legal merger, acquisition or registry change naming both entities.", "source_ids": [ "src-kfmi-home-purity", "src-grikin-home" ], "topic": "KFMI versus GRIKIN legal-entity identity" }, { "claim_ids": [ "clm-nata-electronic-gas-grades" ], "completion_state": "source_backed", "contradiction_id": "con-nata-bf3-cas-metadata", "current_conclusion": "The issuer's BF3 AGS card displays CAS 07784-42-1, the same CAS used for arsine. Preserve the literal metadata and do not silently correct it.", "disagreement_type": "material_identity", "id": "con-nata-bf3-cas-metadata", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Official corrected SDS or product CoA for BF3 adsorbed gas source.", "source_ids": [ "src-nata-electronic-gases" ], "topic": "Nata BF3 adsorbed-gas identity versus displayed CAS" }, { "claim_ids": [ "clm-smic-generic-procurement-no-scanner-edge-2025", "clm-huahong-generic-procurement-no-scanner-edge-2025" ], "completion_state": "source_backed", "contradiction_id": "con-primary-nondisclosure-not-absence", "current_conclusion": "Audited SMIC/Hua Hong filings disclose no Yuliangsheng/SMEE/ASML scanner edge, but explicitly allow commercial-secret exemptions. Do not convert not disclosed into not present.", "disagreement_type": "source_scope_and_negative_evidence", "id": "con-primary-nondisclosure-not-absence", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Official procurement, asset, shipment, service or acceptance record names vendor, model and facility.", "source_ids": [ "src-smic-sse-annual-2025", "src-smic-zhongxinbeifang-acquisition-2026", "src-huahong-sse-annual-2025", "src-huahong-huali-acquisition-2026" ], "topic": "Zero scanner-name hits versus commercial-secret exemptions" }, { "claim_ids": [ "clm-innosilicon-hbm3e-ip-catalogue" ], "completion_state": "source_backed", "contradiction_id": "con-product-fit-vs-supplier-relationship", "current_conclusion": "Catalogue compatibility does not create a licenses/supplies relationship or prove a tapeout.", "disagreement_type": "product_fit_vs_relationship", "id": "con-product-fit-vs-supplier-relationship", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Licensee/foundry disclosure naming IP version, process, tapeout and production chip.", "source_ids": [ "src-innosilicon-ip-catalogue" ], "topic": "HBM IP catalogue fit versus disclosed licensee or production relationship" }, { "claim_ids": [ "clm-saic-journey5-joint-solution-release" ], "completion_state": "source_backed", "contradiction_id": "con-saic-journey5-solution-not-production", "current_conclusion": "The source proves solution development/release only; other delivered SAIC vehicles and a future 2025 target cannot be joined to Journey 5.", "disagreement_type": "commercial_state_and_scope", "id": "con-saic-journey5-solution-not-production", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Vehicle homologation/configuration or production/delivery release names Journey 5.", "source_ids": [ "src-saic-soa-conference-20221104" ], "topic": "SAIC Journey 5 joint solution versus production vehicle" }, { "claim_ids": [ "clm-smee-ssa600-catalogue", "clm-uprecision-smee-stage-unaccepted" ], "completion_state": "source_backed", "contradiction_id": "con-smee-program-acceptance-vs-fab-p4", "current_conclusion": "SMEE's history establishes development/delivery milestones only. Anonymous user delivery and program acceptance do not satisfy the model/facility/SAT evidence required for P4.", "disagreement_type": "acceptance_scope", "id": "con-smee-program-acceptance-vs-fab-p4", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Named customer/fab receipt supplies model, receiving record, installation completion and site-acceptance result.", "source_ids": [ "src-smee-history-official", "src-smee-ssa600-official", "src-uprecision-round2-2023" ], "topic": "SMEE project/expert acceptance versus fab site acceptance" }, { "claim_ids": [ "clm-smee-ssc800-award-2025" ], "completion_state": "source_backed", "contradiction_id": "con-smee-ssc800-award-vs-p4", "current_conclusion": "The award proves model, selected supplier, quantity and price for an unresolved buyer alias; the award letter says the parties should next negotiate/sign the contract. It remains below supply/shipment and cannot satisfy P4 without move-in, installation and site acceptance.", "disagreement_type": "commercial_state_and_acceptance", "id": "con-smee-ssc800-award-vs-p4", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Signed contract/equipment schedule plus buyer identity, serial, receiving/move-in, installation completion and SAT record.", "source_ids": [ "src-ccgp-smee-ssc800-award-2025", "src-ssc800-ccgp-award-letter-20251224" ], "topic": "SSC800/10 procurement award versus domestic-DUV P4" }, { "claim_ids": [ "clm-smee-ssc800-buyer-identity-correlation-2026" ], "completion_state": "source_backed", "contradiction_id": "con-smee-ssc800-buyer-correlation-vs-legal-identity", "current_conclusion": "Official sources match LGGJ-related address, contacts and research remit to 临港实验室, but no reviewed same-document unmasking, registration ID or signed contract closes the legal identity.", "disagreement_type": "legal_identity", "id": "con-smee-ssc800-buyer-correlation-vs-legal-identity", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Executed contract or asset record prints the purchaser legal name and registration identifier.", "source_ids": [ "src-ssc800-ccgp-single-source-notice-20251107", "src-ssc800-ccgp-expert-opinion-20251106", "src-lingang-laboratory-procurement-contact-20250109", "src-lingang-laboratory-contact-20260729" ], "topic": "SSC800/10 masked buyer versus 临港实验室 identity correlation" }, { "claim_ids": [ "clm-smee-ssc800-procurement-specification-2025" ], "completion_state": "source_backed", "contradiction_id": "con-smee-ssc800-node-wavelength-secondary-claims", "current_conclusion": "Secondary reports variously label the system 28 nm, KrF or ArF, while reviewed primary procurement records disclose no wavelength, NA, node or qualified layer.", "disagreement_type": "terminology_process_node_and_wavelength", "id": "con-smee-ssc800-node-wavelength-secondary-claims", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Official SSC800/10 product sheet, contract technical annex or SAT specification names wavelength, NA and qualified scope.", "source_ids": [ "src-ssc800-ccgp-single-source-notice-20251107", "src-ssc800-ccgp-expert-opinion-20251106", "src-ccgp-smee-ssc800-award-2025", "src-ssc800-ccgp-award-letter-20251224" ], "topic": "SSC800/10 secondary node/wavelength labels versus primary-source silence" }, { "claim_ids": [ "clm-smee-ssc800-procurement-specification-2025" ], "completion_state": "source_backed", "contradiction_id": "con-smee-ssc800-specification-vs-acceptance", "current_conclusion": "The expert opinion states resolution no more than 110 nm and overlay no more than 15 nm, but no FAT/SAT metrology report, method, distribution or pass receipt is public.", "disagreement_type": "performance_measurement_and_acceptance", "id": "con-smee-ssc800-specification-vs-acceptance", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Dated FAT/SAT report names model/serial, methods, distributions and pass criteria.", "source_ids": [ "src-ssc800-ccgp-expert-opinion-20251106" ], "topic": "SSC800/10 procurement specification versus measured acceptance" }, { "claim_ids": [ "clm-sophgo-group-identity-and-bm1684x-specification" ], "completion_state": "source_backed", "contradiction_id": "con-sophgo-group-vs-product-owner", "current_conclusion": "Beijing SOPHGO and its subsidiaries are grouped under one brand; no source closes which legal entity owns or sells BM1684X.", "disagreement_type": "legal_entity_and_product_scope", "id": "con-sophgo-group-vs-product-owner", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Product certificate, contract, invoice form or filing names the exact legal manufacturer/seller.", "source_ids": [ "src-sophgo-privacy", "src-sophgo-bm1684x-product" ], "topic": "SOPHGO group identity versus exact BM1684X legal product owner" }, { "claim_ids": [ "clm-tongcheng-arf-krf-validation-ramp-2025", "clm-tongcheng-g5-ebr-40-28nm-2025" ], "completion_state": "source_backed", "contradiction_id": "con-tongcheng-anonymous-validation-vs-customer-edge", "current_conclusion": "Multiple-customer validation and ramp language supports product state only; it cannot create a supplies/buys edge or identify a fab/layer.", "disagreement_type": "customer_and_qualification_scope", "id": "con-tongcheng-anonymous-validation-vs-customer-edge", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Customer-side AVL, tender, purchase, qualification or recurring-delivery record naming both legal endpoints, material SKU, fab and layer.", "source_ids": [ "src-red-avenue-annual-2025" ], "topic": "Tongcheng anonymous validation/ramp language versus named customer relationship" }, { "claim_ids": [ "clm-tongcheng-photoresist-solvent-approved-capacity-2025" ], "completion_state": "source_backed", "contradiction_id": "con-tongcheng-approved-capacity-vs-installed-output", "current_conclusion": "The filing calls 1,000 t and 18,800 t approved capacity and gives utilization; it does not disclose installed, qualified or actual output by product grade.", "disagreement_type": "capacity_state", "id": "con-tongcheng-approved-capacity-vs-installed-output", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Facility permit/asset and operating records with installed equipment, qualified capacity and actual SKU output.", "source_ids": [ "src-red-avenue-annual-2025" ], "topic": "Tongcheng approved/design capacity versus installed, qualified and actual output" }, { "claim_ids": [ "clm-tongcheng-changzhou-cmp-production-2025" ], "completion_state": "source_backed", "contradiction_id": "con-tongcheng-cmp-volume-vs-output-customer", "current_conclusion": "The issuer reports batch production and stable delivery but no actual output, utilization, pad SKU, named fab, layer, yield effect or customer acceptance date.", "disagreement_type": "commercial_state_capacity_customer_and_yield", "id": "con-tongcheng-cmp-volume-vs-output-customer", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Customer qualification/purchase record and facility output report at pad-SKU and fab/layer scope.", "source_ids": [ "src-red-avenue-annual-2025" ], "topic": "Tongcheng Changzhou CMP stable-delivery language versus output and customer closure" }, { "claim_ids": [ "clm-tongfu-hbs-trial-production-ceiling", "clm-tongfu-hbs-designed-capacity-units" ], "completion_state": "source_backed", "contradiction_id": "con-tongfu-high-bandwidth-storage-vs-qualified-hbm", "current_conclusion": "The primary report says trial production and not yet accepted, never uses HBM, and omits the DRAM owner, TSV, KGD, base die/PHY, customer, yield and shipment chain.", "disagreement_type": "terminology_and_readiness", "id": "con-tongfu-high-bandwidth-storage-vs-qualified-hbm", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Customer/government acceptance names HBM generation, die owner, stack, line, qualification, yield and shipment.", "source_ids": [ "src-tongfu-hbs-change-analysis-2025", "src-tongfu-annual-2025" ], "topic": "Tongfu high-bandwidth-storage-chiplet project versus qualified conventional HBM" }, { "claim_ids": [ "clm-uprecision-smee-stage-unaccepted", "clm-uprecision-company-k-acceptance-2024" ], "completion_state": "source_backed", "contradiction_id": "con-uprecision-marketing-vs-filing-ceiling", "current_conclusion": "The 2020 SMEE stage was shipped but unaccepted at the source cutoff. Anonymous 2024 Company K acceptance is later progress but cannot be assigned to SMEE or retroactively close the 2020 receipt.", "disagreement_type": "commercial_state_and_timing", "id": "con-uprecision-marketing-vs-filing-ceiling", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Customer-origin acceptance identifies the legal customer, model, serial, tool integration and date.", "source_ids": [ "src-uprecision-round2-2023", "src-uprecision-listing-response-2023", "src-uprecision-prospectus-2026" ], "topic": "U-Precision industrialization language versus dated filing ceilings" }, { "claim_ids": [ "clm-util-001" ], "completion_state": "source_backed", "contradiction_id": "con-util-001", "current_conclusion": "The issuer uses award/contractor language but explicitly says a formal contract still must be signed. Any contract-signed, installed, accepted or operating classification would exceed the source. Evidence ranking: Issuer statutory disclosure controls. Status: UNRESOLVED.", "disagreement_type": "commercial_state", "id": "con-util-001", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Formal contract and later acceptance disclosure.", "source_ids": [ "src-util-001" ], "topic": "L&K CXMT Phase II award versus contract/completion" }, { "claim_ids": [ "clm-util-004", "clm-util-005" ], "completion_state": "source_backed", "contradiction_id": "con-util-002", "current_conclusion": "Formal signature is proven, but effectiveness depended on internal approvals, Hua Hong Semiconductor shareholder approval and government filing. No completion or acceptance receipt is present. Evidence ranking: The conditions in the same statutory disclosure govern the state ceiling. Status: UNRESOLVED.", "disagreement_type": "commercial_state", "id": "con-util-002", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Effectiveness confirmation and project completion/acceptance record.", "source_ids": [ "src-util-002" ], "topic": "Hua Hong Wuxi formal signature versus contract effectiveness and completion" }, { "claim_ids": [ "clm-util-011" ], "completion_state": "source_backed", "contradiction_id": "con-util-003", "current_conclusion": "The 720,000 wafers/year number is explicitly the eventual result after both phases; it cannot be assigned to Phase I designed, installed, qualified or operating capacity. Evidence ranking: Supplier page is only a project-description lead for capacity. Status: UNRESOLVED.", "disagreement_type": "capacity_scope", "id": "con-util-003", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Phase-separated EIA, permit and operating output records.", "source_ids": [ "src-util-003" ], "topic": "Silan Jihong two-phase capacity target versus Phase I facility state" }, { "claim_ids": [ "clm-util-012" ], "completion_state": "source_backed", "contradiction_id": "con-util-004", "current_conclusion": "The official supplier page reports a rounded CNY 105.9 million award and nearly 10,000 m2 of cleanroom. A directly inspectable issuer/customer tender record with exact allocation, measured area and contract state was not located in this lane. Evidence ranking: Supplier notice remains VENDOR_REPORTED pending statutory/customer confirmation. Status: UNRESOLVED.", "disagreement_type": "quantity_and_commercial_state", "id": "con-util-004", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Public tender result, signed contract and acceptance record.", "source_ids": [ "src-util-004" ], "topic": "YueRun award and cleanroom-area wording" }, { "claim_ids": [ "clm-witmem-wtm8-trial-state" ], "completion_state": "source_backed", "contradiction_id": "con-witmem-wtm8-trial-vs-coming-soon", "current_conclusion": "Trial production proves manufactured samples only; commercial release, qualification and shipments remain unresolved.", "disagreement_type": "commercial_state_and_terminology", "id": "con-witmem-wtm8-trial-vs-coming-soon", "last_checked": "2026-07-29", "record_type": "contradiction", "resolution_event": "Dated customer qualification, commercial shipment and sustained-volume record.", "source_ids": [ "src-witmem-wtm8-about", "src-witmem-wtm8-product" ], "topic": "WTM-8 successful trial-production statement versus Coming Soon product page" } ] }, "validation": { "status": "pass", "checks": [ "all 217 canonical entity records preserved", "all 101 canonical relationship records preserved", "entity, product, facility, claim, and source references resolve", "confirmed relationships have sources", "raw supply-chain layers are retained beside additive macro-stage mappings", "all 55 atlas product families link to a source-bounded named design company and an isolated explicit-unknown remainder path", "no two atlas product families share an unresolved boundary node", "4 product-specific supplier relationships are preserved only where the atlas product records provide explicit scoped receipts", "product-to-company associations do not create any supplier, customer, qualification, volume, or country-of-origin edge that is not explicitly recorded", "product-fact coverage is separate from product-specific supplier-relationship coverage for all 15 stages", "canonical census, product-overlay, and output dates are preserved separately", "every named atlas supplier edge retains its exact source IDs, relationship state, and non-exclusivity boundary" ], "canonical_entity_count": 217, "canonical_relationship_count": 101, "total_entity_count": 369, "total_relationship_count": 215, "error_count": 0 } }