{ "schema_version": "touchdown.us-ai-chip-supply-chain.v2", "updated_at": "2026-08-01", "as_of": "2026-08-01", "title": "United States accelerator reference map: exact products and bounded relationships", "scope": "A source-bounded comparison of U.S.-designed accelerators, U.S. and source-recorded cross-border capability entities, and named foundry, memory, system, cloud, reference-design, and company-level relationships. It is not a complete bill of materials, supplier census, allocation record, or deployment inventory.", "coverage_kind": "bounded product and relationship reference, not an exhaustive supplier census", "evidence_boundary": "A cited capability anchor or product-family identity does not prove a product-specific supplier, customer, facility, qualification, capacity, yield, volume, or deployment edge.", "relationship_boundary": "Only explicitly sourced relationships from us-reference-expansion-v1.json appear here. Product-specific, product-family, reference-design, and company-level edges remain separate. Technical fit, capability, headquarters, deployment geography, or a published reference design never becomes an inferred product supplier or manufacturing-origin claim.", "summary": { "anchor_entity_count": 37, "us_owned_anchor_count": 26, "foreign_dependency_anchor_count": 11, "product_family_count": 17, "relationship_count": 31, "explicit_unknown_product_path_count": 17, "complete_product_path_count": 0, "source_count": 91, "entities_by_macro_stage": { "advanced_packaging_osat": 7, "chip_architecture": 8, "cloud_deployment_demand": 14, "deposition_etch_clean_cmp": 4, "design_ip_eda": 3, "front_end_fabrication": 4, "inspection_metrology_test": 10, "interconnect_networking": 3, "lithography": 2, "memory_storage": 3, "power_cooling_facilities": 3, "software_runtime": 12, "substrate_board": 11, "systems_integration": 8, "wafers_materials_chemicals": 2 }, "complete": false, "reviewed_static_anchor_count": 33, "reviewed_static_us_owned_anchor_count": 24, "reviewed_static_foreign_dependency_anchor_count": 9, "reference_expansion_entity_count": 4, "exact_product_or_platform_count": 17, "product_path_reference_count": 17, "parent_family_stage_baseline_reference_count": 0, "authoritative_product_path_stage_cell_count": 255, "authoritative_stage_status_counts": { "known": 17, "partial": 130, "unknown": 108, "not_applicable": 0 }, "relationship_counts_by_scope": { "company_level": 2, "product_family": 1, "product_specific": 26, "reference_design": 2 }, "relationship_counts_by_category": { "cloud": 7, "company_level": 2, "foundry": 8, "memory": 8, "reference_design": 2, "system": 4 }, "gap_count": 17 }, "taxonomy": { "macro_stages": [ { "id": "design_ip_eda", "label": "Design, IP & EDA", "plain_language": "The tools, reusable designs, and verification work used to define a chip.", "order": 1 }, { "id": "chip_architecture", "label": "Chip architecture", "plain_language": "The compute design: GPU, accelerator, CPU, controller, sensor, or system-on-chip.", "order": 2 }, { "id": "front_end_fabrication", "label": "Wafer fabrication & process", "plain_language": "The fab and process steps that turn a blank wafer into working devices.", "order": 3 }, { "id": "lithography", "label": "Lithography", "plain_language": "The scanners, tracks, optics, masks, and resist used to print circuit patterns.", "order": 4 }, { "id": "deposition_etch_clean_cmp", "label": "Deposition, etch, clean & CMP", "plain_language": "The equipment that adds, removes, cleans, plates, and flattens material on a wafer.", "order": 5 }, { "id": "inspection_metrology_test", "label": "Inspection, metrology & test", "plain_language": "The tools that find defects, measure process control, and test dies and packages.", "order": 6 }, { "id": "wafers_materials_chemicals", "label": "Wafers, materials & chemicals", "plain_language": "Silicon wafers, gases, resists, targets, slurries, solvents, and other consumables.", "order": 7 }, { "id": "memory_storage", "label": "Memory & storage", "plain_language": "DRAM, HBM, NAND, modules, controllers, and storage products.", "order": 8 }, { "id": "advanced_packaging_osat", "label": "Advanced packaging & OSAT", "plain_language": "Assembly, stacking, bonding, wafer-level packaging, and package test.", "order": 9 }, { "id": "substrate_board", "label": "Substrates, boards & cards", "plain_language": "The substrate, printed circuit board, and accelerator card that connect the package.", "order": 10 }, { "id": "systems_integration", "label": "Systems & integration", "plain_language": "Servers, vehicles, phones, PCs, racks, and the companies that assemble them.", "order": 11 }, { "id": "interconnect_networking", "label": "Interconnect & networking", "plain_language": "Links, modems, optical components, and network systems that move data between chips and machines.", "order": 12 }, { "id": "power_cooling_facilities", "label": "Power, cooling & facilities", "plain_language": "Cleanrooms, utilities, exhaust, gas delivery, construction, power, and cooling around production and compute.", "order": 13 }, { "id": "software_runtime", "label": "Software & runtime", "plain_language": "Firmware, simulation, system software, and the runtime layer used to operate hardware.", "order": 14 }, { "id": "cloud_deployment_demand", "label": "Cloud, deployment & demand", "plain_language": "Cloud services, compute centers, telecom operators, and downstream users that put hardware to work.", "order": 15 }, { "id": "production_qualification", "label": "Production & qualification", "plain_language": "Manufacturing, acceptance, validation, test, shipment, and repeatable production evidence.", "order": 16 }, { "id": "other_unknown", "label": "Other or unresolved", "plain_language": "A recorded role that does not yet fit one technical stage without making an inference.", "order": 17 } ], "required_product_path_stages": [ { "id": "design_company", "label": "Design company", "order": 1 }, { "id": "architecture_ip", "label": "Architecture and licensed IP", "order": 2 }, { "id": "eda", "label": "EDA and verification", "order": 3 }, { "id": "logic_foundry_process", "label": "Logic foundry and process", "order": 4 }, { "id": "lithography", "label": "Lithography", "order": 5 }, { "id": "wafer_equipment", "label": "Other wafer-fabrication equipment", "order": 6 }, { "id": "critical_materials", "label": "Critical wafers, gases, chemicals, masks, and materials", "order": 7 }, { "id": "memory_manufacturer", "label": "Memory manufacturer", "order": 8 }, { "id": "package_provider", "label": "Package and substrate provider", "order": 9 }, { "id": "assembly_test", "label": "Assembly and test", "order": 10 }, { "id": "board_system", "label": "Board and system", "order": 11 }, { "id": "networking", "label": "Interconnect and networking", "order": 12 }, { "id": "power_cooling", "label": "Power and cooling", "order": 13 }, { "id": "software_workload", "label": "Software and workload", "order": 14 }, { "id": "qualification_volume_deployment", "label": "Qualification, volume, and deployment", "order": 15 } ], "evidence_states": { "canonical": [ "CONFIRMED_INDEPENDENT", "CONFIRMED_PRIMARY", "CONTRADICTED", "CORROBORATED", "PLAUSIBLE_UNVERIFIED", "RESEARCH_MEASURED", "VENDOR_REPORTED" ], "public_display": [ "official", "independent", "corroborated", "reported", "derived", "unknown" ] }, "boundary": "Macro stages classify a cited capability. They do not create a supplier, customer, facility, product, production, or qualification relationship." }, "entities": [ { "id": "synopsys", "entity_id": "synopsys", "record_type": "entity", "name": "Synopsys, Inc.", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "United States", "country_of_ownership": "United States", "headquarters": "Sunnyvale, California, United States", "raw_supply_chain_layers": [ "EDA/IP" ], "supply_chain_layers": [ "EDA/IP" ], "macro_stages": [ "design_ip_eda" ], "why_it_matters": "Design, verification, and reusable silicon IP are required before a complex chip can become manufacturable geometry.", "capability_claim": "Synopsys offers electronic-design-automation, hardware-assisted verification, and silicon-IP products.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "commercially_offered", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-synopsys" ], "source_refs": [ { "source_id": "us-source-synopsys", "url": "https://www.synopsys.com/", "title": "Synopsys — EDA, verification, and semiconductor IP", "publisher": "Synopsys, Inc.", "primary_status": "primary" } ], "unknowns": [ "Use by a named accelerator, process qualification, capacity, or U.S.-origin supply completeness." ], "last_checked": "2026-08-01", "source": { "label": "Synopsys — EDA, verification, and semiconductor IP", "url": "https://www.synopsys.com/", "proves": "A current commercial EDA, verification, and IP portfolio.", "does_not_prove": "Use by a named accelerator, process qualification, capacity, or U.S.-origin supply completeness.", "last_checked": "2026-08-01", "id": "us-source-synopsys", "source_id": "us-source-synopsys", "primary_status": "primary" } }, { "id": "cadence", "entity_id": "cadence", "record_type": "entity", "name": "Cadence Design Systems, Inc.", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "United States", "country_of_ownership": "United States", "headquarters": "San Jose, California, United States", "raw_supply_chain_layers": [ "EDA/IP" ], "supply_chain_layers": [ "EDA/IP" ], "macro_stages": [ "design_ip_eda" ], "why_it_matters": "Chip-to-system design software connects silicon implementation to packages, boards, and complete systems.", "capability_claim": "Cadence provides computational software for the design and verification of chips, packages, boards, and systems.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "commercially_offered", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-cadence" ], "source_refs": [ { "source_id": "us-source-cadence", "url": "https://www.cadence.com/en_US/home.html", "title": "Cadence — Intelligent System Design", "publisher": "Cadence Design Systems, Inc.", "primary_status": "primary" } ], "unknowns": [ "Use in a named accelerator or qualification for a named process." ], "last_checked": "2026-08-01", "source": { "label": "Cadence — Intelligent System Design", "url": "https://www.cadence.com/en_US/home.html", "proves": "A current commercial computational-design portfolio.", "does_not_prove": "Use in a named accelerator or qualification for a named process.", "last_checked": "2026-08-01", "id": "us-source-cadence", "source_id": "us-source-cadence", "primary_status": "primary" } }, { "id": "arm", "entity_id": "arm", "record_type": "entity", "name": "Arm Holdings plc", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "Japan", "country_of_ownership": "Japan", "headquarters": "Cambridge, England, United Kingdom", "raw_supply_chain_layers": [ "EDA/IP" ], "supply_chain_layers": [ "EDA/IP" ], "macro_stages": [ "design_ip_eda" ], "why_it_matters": "Licensed processor architecture, physical IP, and system IP can sit inside hosts, controllers, and infrastructure silicon.", "capability_claim": "Arm develops and markets processor, physical, and system IP; its filing identifies SoftBank Group of Japan as ultimate controller.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_regulatory_primary", "readiness_state": "commercially_licensed", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-arm" ], "source_refs": [ { "source_id": "us-source-arm", "url": "https://www.sec.gov/Archives/edgar/data/1973239/000197323925000035/armholdingsplcukannualre.htm", "title": "Arm Holdings plc 2025 annual report", "publisher": "Arm Holdings plc", "primary_status": "primary" } ], "unknowns": [ "A current license or use by a named accelerator." ], "last_checked": "2026-08-01", "source": { "label": "Arm Holdings plc 2025 annual report", "url": "https://www.sec.gov/Archives/edgar/data/1973239/000197323925000035/armholdingsplcukannualre.htm", "proves": "United Kingdom headquarters, Japanese ultimate control, and commercial IP activity.", "does_not_prove": "A current license or use by a named accelerator.", "last_checked": "2026-08-01", "id": "us-source-arm", "source_id": "us-source-arm", "primary_status": "primary" } }, { "id": "nvidia", "entity_id": "nvidia", "record_type": "entity", "name": "NVIDIA Corporation", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "United States", "country_of_ownership": "United States", "headquarters": "Santa Clara, California, United States", "raw_supply_chain_layers": [ "accelerator design", "boards/systems", "networking/optics", "software/cloud/deployment" ], "supply_chain_layers": [ "accelerator design", "boards/systems", "networking/optics", "software/cloud/deployment" ], "macro_stages": [ "chip_architecture", "substrate_board", "systems_integration", "interconnect_networking", "software_runtime", "cloud_deployment_demand" ], "why_it_matters": "NVIDIA is the current reference point for GPU accelerators, scale-up systems, networking, and the software path used to deploy them.", "capability_claim": "NVIDIA offers data-center accelerators, systems, networking, and software for training, inference, and infrastructure management.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "commercially_offered", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-nvidia" ], "source_refs": [ { "source_id": "us-source-nvidia", "url": "https://www.nvidia.com/en-us/data-center/", "title": "NVIDIA — Data Center", "publisher": "NVIDIA Corporation", "primary_status": "primary" } ], "unknowns": [ "Who fabricates, packages, tests, or supplies memory for a particular product." ], "last_checked": "2026-08-01", "source": { "label": "NVIDIA — Data Center", "url": "https://www.nvidia.com/en-us/data-center/", "proves": "A current platform spanning accelerators, systems, networking, and software.", "does_not_prove": "Who fabricates, packages, tests, or supplies memory for a particular product.", "last_checked": "2026-08-01", "id": "us-source-nvidia", "source_id": "us-source-nvidia", "primary_status": "primary" } }, { "id": "amd", "entity_id": "amd", "record_type": "entity", "name": "Advanced Micro Devices, Inc.", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "United States", "country_of_ownership": "United States", "headquarters": "Santa Clara, California, United States", "raw_supply_chain_layers": [ "accelerator design", "software/cloud/deployment" ], "supply_chain_layers": [ "accelerator design", "software/cloud/deployment" ], "macro_stages": [ "chip_architecture", "software_runtime", "cloud_deployment_demand" ], "why_it_matters": "AMD provides the main U.S. merchant alternative to NVIDIA for data-center GPU accelerators and an associated software stack.", "capability_claim": "AMD develops data-center processors, AI accelerators, adaptive-computing products, and supporting software.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_regulatory_primary", "readiness_state": "commercially_offered", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-amd" ], "source_refs": [ { "source_id": "us-source-amd", "url": "https://ir.amd.com/financial-information/sec-filings/content/0000002488-26-000018/amd-20251227.htm", "title": "AMD 2025 Form 10-K", "publisher": "Advanced Micro Devices, Inc.", "primary_status": "primary" } ], "unknowns": [ "A product-specific foundry, HBM, package, substrate, or equipment supplier." ], "last_checked": "2026-08-01", "source": { "label": "AMD 2025 Form 10-K", "url": "https://ir.amd.com/financial-information/sec-filings/content/0000002488-26-000018/amd-20251227.htm", "proves": "Commercial data-center processors, accelerators, and related computing activity.", "does_not_prove": "A product-specific foundry, HBM, package, substrate, or equipment supplier.", "last_checked": "2026-08-01", "id": "us-source-amd", "source_id": "us-source-amd", "primary_status": "primary" } }, { "id": "intel", "entity_id": "intel", "record_type": "entity", "name": "Intel Corporation", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "United States", "country_of_ownership": "United States", "headquarters": "Santa Clara, California, United States", "raw_supply_chain_layers": [ "accelerator design", "foundry/fab", "advanced packaging/test/substrates", "boards/systems", "software/cloud/deployment" ], "supply_chain_layers": [ "accelerator design", "foundry/fab", "advanced packaging/test/substrates", "boards/systems", "software/cloud/deployment" ], "macro_stages": [ "chip_architecture", "front_end_fabrication", "advanced_packaging_osat", "inspection_metrology_test", "substrate_board", "systems_integration", "software_runtime", "cloud_deployment_demand" ], "why_it_matters": "Intel combines chip design with operating wafer fabs, advanced packaging, assembly, test, and systems software.", "capability_claim": "Intel Foundry offers wafer fabrication, process technologies, advanced packaging, assembly, test, IP, and software services.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "commercial_capability_with_expansion", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-intel" ], "source_refs": [ { "source_id": "us-source-intel", "url": "https://www.intel.com/content/www/us/en/foundry/manufacturing.html", "title": "Intel Foundry — Manufacturing", "publisher": "Intel Corporation", "primary_status": "primary" } ], "unknowns": [ "Qualification, yield, or production for an unnamed customer." ], "last_checked": "2026-08-01", "source": { "label": "Intel Foundry — Manufacturing", "url": "https://www.intel.com/content/www/us/en/foundry/manufacturing.html", "proves": "Operating fabrication and assembly/test capabilities, including U.S. manufacturing.", "does_not_prove": "Qualification, yield, or production for an unnamed customer.", "last_checked": "2026-08-01", "id": "us-source-intel", "source_id": "us-source-intel", "primary_status": "primary" } }, { "id": "globalfoundries", "entity_id": "globalfoundries", "record_type": "entity", "name": "GlobalFoundries Inc.", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "United States", "country_of_ownership": "United States", "headquarters": "Malta, New York, United States", "raw_supply_chain_layers": [ "foundry/fab" ], "supply_chain_layers": [ "foundry/fab" ], "macro_stages": [ "front_end_fabrication" ], "why_it_matters": "GlobalFoundries provides U.S.-headquartered contract manufacturing across differentiated and mature process technologies.", "capability_claim": "GlobalFoundries manufactures integrated circuits as a commercial semiconductor foundry.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "operating_commercial_fabs", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-globalfoundries" ], "source_refs": [ { "source_id": "us-source-globalfoundries", "url": "https://gf.com/", "title": "GlobalFoundries", "publisher": "GlobalFoundries Inc.", "primary_status": "primary" } ], "unknowns": [ "Leading-edge accelerator fabrication or a named customer relationship." ], "last_checked": "2026-08-01", "source": { "label": "GlobalFoundries", "url": "https://gf.com/", "proves": "An operating commercial foundry business.", "does_not_prove": "Leading-edge accelerator fabrication or a named customer relationship.", "last_checked": "2026-08-01", "id": "us-source-globalfoundries", "source_id": "us-source-globalfoundries", "primary_status": "primary" } }, { "id": "tsmc", "entity_id": "tsmc", "record_type": "entity", "name": "Taiwan Semiconductor Manufacturing Company Limited", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "Taiwan", "country_of_ownership": "Taiwan", "headquarters": "Hsinchu, Taiwan", "raw_supply_chain_layers": [ "foundry/fab", "advanced packaging/test/substrates" ], "supply_chain_layers": [ "foundry/fab", "advanced packaging/test/substrates" ], "macro_stages": [ "front_end_fabrication", "advanced_packaging_osat", "inspection_metrology_test", "substrate_board" ], "why_it_matters": "TSMC is a Taiwan-based pure-play foundry and advanced-packaging capability for fabless accelerator designers.", "capability_claim": "TSMC offers contract semiconductor manufacturing and advanced system-integration and packaging technologies.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "operating_commercial_fabs", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-tsmc" ], "source_refs": [ { "source_id": "us-source-tsmc", "url": "https://www.tsmc.com/english/aboutTSMC", "title": "TSMC — About TSMC", "publisher": "Taiwan Semiconductor Manufacturing Company Limited", "primary_status": "primary" } ], "unknowns": [ "Fabrication, packaging, allocation, or qualification for NVIDIA, AMD, or another named product." ], "last_checked": "2026-08-01", "source": { "label": "TSMC — About TSMC", "url": "https://www.tsmc.com/english/aboutTSMC", "proves": "A dedicated commercial semiconductor foundry and technology portfolio.", "does_not_prove": "Fabrication, packaging, allocation, or qualification for NVIDIA, AMD, or another named product.", "last_checked": "2026-08-01", "id": "us-source-tsmc", "source_id": "us-source-tsmc", "primary_status": "primary" } }, { "id": "samsung-electronics", "entity_id": "samsung-electronics", "record_type": "entity", "name": "Samsung Electronics Co., Ltd.", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "South Korea", "country_of_ownership": "South Korea", "headquarters": "Suwon, Gyeonggi-do, South Korea", "raw_supply_chain_layers": [ "foundry/fab", "memory" ], "supply_chain_layers": [ "foundry/fab", "memory" ], "macro_stages": [ "front_end_fabrication", "memory_storage" ], "why_it_matters": "Samsung combines logic-foundry services with large-scale DRAM, NAND, and HBM capability.", "capability_claim": "Samsung operates commercial semiconductor foundry and memory businesses.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "operating_commercial_fabs", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-samsung-electronics" ], "source_refs": [ { "source_id": "us-source-samsung-electronics", "url": "https://semiconductor.samsung.com/foundry/about-samsung-foundry/company-info/", "title": "Samsung Foundry — Company Info", "publisher": "Samsung Electronics Co., Ltd.", "primary_status": "primary" } ], "unknowns": [ "A named accelerator customer, HBM supply relationship, qualification, or allocated capacity." ], "last_checked": "2026-08-01", "source": { "label": "Samsung Foundry — Company Info", "url": "https://semiconductor.samsung.com/foundry/about-samsung-foundry/company-info/", "proves": "A commercial foundry network with advanced and legacy manufacturing capabilities.", "does_not_prove": "A named accelerator customer, HBM supply relationship, qualification, or allocated capacity.", "last_checked": "2026-08-01", "id": "us-source-samsung-electronics", "source_id": "us-source-samsung-electronics", "primary_status": "primary" } }, { "id": "asml", "entity_id": "asml", "record_type": "entity", "name": "ASML Holding N.V.", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "Netherlands", "country_of_ownership": "Netherlands", "headquarters": "Veldhoven, Netherlands", "raw_supply_chain_layers": [ "lithography" ], "supply_chain_layers": [ "lithography" ], "macro_stages": [ "lithography" ], "why_it_matters": "ASML supplies EUV and DUV lithography systems used to pattern advanced semiconductor layers.", "capability_claim": "ASML develops and manufactures EUV and DUV lithography and related metrology systems.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "commercially_shipped", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-asml" ], "source_refs": [ { "source_id": "us-source-asml", "url": "https://www.asml.com/en/investors/annual-report/2025/strategy-and-stories", "title": "ASML 2025 annual report", "publisher": "ASML Holding N.V.", "primary_status": "primary" } ], "unknowns": [ "Placement at a particular fab or use for a named accelerator." ], "last_checked": "2026-08-01", "source": { "label": "ASML 2025 annual report", "url": "https://www.asml.com/en/investors/annual-report/2025/strategy-and-stories", "proves": "Commercial EUV, DUV, and metrology system capability.", "does_not_prove": "Placement at a particular fab or use for a named accelerator.", "last_checked": "2026-08-01", "id": "us-source-asml", "source_id": "us-source-asml", "primary_status": "primary" } }, { "id": "canon", "entity_id": "canon", "record_type": "entity", "name": "Canon Inc.", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "Japan", "country_of_ownership": "Japan", "headquarters": "Tokyo, Japan", "raw_supply_chain_layers": [ "lithography", "deposition/etch/inspection equipment" ], "supply_chain_layers": [ "lithography", "deposition/etch/inspection equipment" ], "macro_stages": [ "lithography", "deposition_etch_clean_cmp", "inspection_metrology_test" ], "why_it_matters": "Canon provides optical, DUV, and nanoimprint lithography plus selected semiconductor process equipment.", "capability_claim": "Canon offers semiconductor lithography, deposition, etch, bonding, and wafer-measurement equipment.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "commercially_offered", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-canon" ], "source_refs": [ { "source_id": "us-source-canon", "url": "https://www.usa.canon.com/business/semiconductor", "title": "Canon — Semiconductor Manufacturing Equipment", "publisher": "Canon Inc.", "primary_status": "primary" } ], "unknowns": [ "Technical equivalence to EUV or qualification at a named fab." ], "last_checked": "2026-08-01", "source": { "label": "Canon — Semiconductor Manufacturing Equipment", "url": "https://www.usa.canon.com/business/semiconductor", "proves": "A current commercial semiconductor-equipment portfolio.", "does_not_prove": "Technical equivalence to EUV or qualification at a named fab.", "last_checked": "2026-08-01", "id": "us-source-canon", "source_id": "us-source-canon", "primary_status": "primary" } }, { "id": "applied-materials", "entity_id": "applied-materials", "record_type": "entity", "name": "Applied Materials, Inc.", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "United States", "country_of_ownership": "United States", 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"deposition/etch/inspection equipment" ], "supply_chain_layers": [ "deposition/etch/inspection equipment" ], "macro_stages": [ "deposition_etch_clean_cmp", "inspection_metrology_test" ], "why_it_matters": "Lam supplies etch, deposition, and wafer-cleaning equipment across complex semiconductor process flows.", "capability_claim": "Lam manufactures etch, CVD, PECVD, ALD, electrochemical-deposition, strip, and cleaning systems.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "commercially_manufactured", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-lam-research" ], "source_refs": [ { "source_id": "us-source-lam-research", "url": "https://newsroom.lamresearch.com/High-Tech-Manufacturing-Careers-Offer-Variety-and-Challenge?blog=true", "title": "Lam Research — Manufacturing", "publisher": "Lam Research Corporation", "primary_status": "primary" } ], "unknowns": [ "Installation or process qualification at a named fab." ], "last_checked": "2026-08-01", "source": { "label": "Lam Research — Manufacturing", "url": "https://newsroom.lamresearch.com/High-Tech-Manufacturing-Careers-Offer-Variety-and-Challenge?blog=true", "proves": "Commercial etch, deposition, strip, and cleaning equipment activity.", "does_not_prove": "Installation or process qualification at a named fab.", "last_checked": "2026-08-01", "id": "us-source-lam-research", "source_id": "us-source-lam-research", "primary_status": "primary" } }, { "id": "kla", "entity_id": "kla", "record_type": "entity", "name": "KLA Corporation", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "United States", "country_of_ownership": "United States", "headquarters": "Milpitas, California, United States", "raw_supply_chain_layers": [ "deposition/etch/inspection equipment" ], "supply_chain_layers": [ "deposition/etch/inspection equipment" ], "macro_stages": [ "deposition_etch_clean_cmp", "inspection_metrology_test" ], "why_it_matters": "Inspection and metrology detect defects and control semiconductor yield.", "capability_claim": "KLA designs, manufactures, sells, and services semiconductor inspection and metrology equipment.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_certification_primary", "readiness_state": "commercially_manufactured", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-kla" ], "source_refs": [ { "source_id": "us-source-kla", "url": "https://www.kla.com/wp-content/uploads/KLA-ISO-9001-2015-Registration.pdf", "title": "KLA ISO 9001 registration", "publisher": "KLA Corporation", "primary_status": "primary" } ], "unknowns": [ "Tool performance at a particular node or installation at a named fab." ], "last_checked": "2026-08-01", "source": { "label": "KLA ISO 9001 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"does_not_prove": "Supply or qualification for a named fab or accelerator.", "last_checked": "2026-08-01", "id": "us-source-entegris", "source_id": "us-source-entegris", "primary_status": "primary" } }, { "id": "shin-etsu", "entity_id": "shin-etsu", "record_type": "entity", "name": "Shin-Etsu Chemical Co., Ltd.", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "Japan", "country_of_ownership": "Japan", "headquarters": "Tokyo, Japan", "raw_supply_chain_layers": [ "wafers/materials" ], "supply_chain_layers": [ "wafers/materials" ], "macro_stages": [ "wafers_materials_chemicals" ], "why_it_matters": "Semiconductor-grade single-crystal silicon wafers are the starting substrate for logic and memory fabrication.", "capability_claim": "Shin-Etsu manufactures polished, epitaxial, SOI, annealed, and other semiconductor silicon wafers.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "commercially_manufactured", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-shin-etsu" ], "source_refs": [ { "source_id": "us-source-shin-etsu", "url": "https://www.shinetsu.co.jp/en/products/semiconductor-silicon-business/silicon-wafers/", "title": "Shin-Etsu — Silicon Wafers", "publisher": "Shin-Etsu Chemical Co., Ltd.", "primary_status": "primary" } ], "unknowns": [ "Supply or qualification for a named foundry or accelerator." ], "last_checked": "2026-08-01", "source": { "label": "Shin-Etsu — Silicon Wafers", "url": "https://www.shinetsu.co.jp/en/products/semiconductor-silicon-business/silicon-wafers/", "proves": "Commercial manufacture and product types of semiconductor silicon wafers.", "does_not_prove": "Supply or qualification for a named foundry or accelerator.", "last_checked": "2026-08-01", "id": "us-source-shin-etsu", "source_id": "us-source-shin-etsu", "primary_status": "primary" } }, 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"https://www.micron.com/about/company/corporate-profile", "title": "Micron — Corporate Profile", "publisher": "Micron Technology, Inc.", "primary_status": "primary" } ], "unknowns": [ "HBM supply or qualification for NVIDIA, AMD, or another named accelerator." ], "last_checked": "2026-08-01", "source": { "label": "Micron — Corporate Profile", "url": "https://www.micron.com/about/company/corporate-profile", "proves": "A commercial memory and storage portfolio and listed manufacturing footprint.", "does_not_prove": "HBM supply or qualification for NVIDIA, AMD, or another named accelerator.", "last_checked": "2026-08-01", "id": "us-source-micron", "source_id": "us-source-micron", "primary_status": "primary" } }, { "id": "sk-hynix", "entity_id": "sk-hynix", "record_type": "entity", "name": "SK hynix Inc.", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "South Korea", "country_of_ownership": "South Korea", "headquarters": "Icheon, Gyeonggi-do, South Korea", "raw_supply_chain_layers": [ "memory" ], "supply_chain_layers": [ "memory" ], "macro_stages": [ "memory_storage" ], "why_it_matters": "SK hynix is a South Korea-based DRAM, NAND, multi-chip-package, and HBM manufacturer.", "capability_claim": "SK hynix manufactures and sells DRAM, NAND flash, and multi-chip-package memory products.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "commercially_manufactured", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-sk-hynix" ], "source_refs": [ { "source_id": "us-source-sk-hynix", "url": "https://ssd.skhynix.com/about_us/", "title": "SK hynix — About Us", "publisher": "SK hynix Inc.", "primary_status": "primary" } ], "unknowns": [ "A product-specific HBM relationship or allocated capacity." ], "last_checked": "2026-08-01", "source": { "label": "SK hynix — About Us", "url": "https://ssd.skhynix.com/about_us/", "proves": "Commercial DRAM, NAND, and multi-chip-package memory activity.", "does_not_prove": "A product-specific HBM relationship or allocated capacity.", "last_checked": "2026-08-01", "id": "us-source-sk-hynix", "source_id": "us-source-sk-hynix", "primary_status": "primary" } }, { "id": "amkor", "entity_id": "amkor", "record_type": "entity", "name": "Amkor Technology, Inc.", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "United States", "country_of_ownership": "United States", "headquarters": "Tempe, Arizona, United States", "raw_supply_chain_layers": [ "advanced packaging/test/substrates" ], "supply_chain_layers": [ "advanced packaging/test/substrates" ], "macro_stages": [ "advanced_packaging_osat", "inspection_metrology_test", "substrate_board" ], "why_it_matters": "Amkor provides outsourced semiconductor assembly, advanced packaging, and test services and is 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"inspection_metrology_test", "substrate_board" ], "why_it_matters": "ASE provides outsourced assembly, packaging, substrate manufacturing, probing, test, and system-in-package services.", "capability_claim": "ASE provides semiconductor packaging, testing, substrate manufacturing, and system-assembly services.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "commercially_manufactured", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-ase" ], "source_refs": [ { "source_id": "us-source-ase", "url": "https://ase.aseglobal.com/about-ase/", "title": "ASE — Company capability overview", "publisher": "ASE Technology Holding Co., Ltd.", "primary_status": "primary" } ], "unknowns": [ "Packaging or testing of a named U.S. accelerator." ], "last_checked": "2026-08-01", "source": { "label": "ASE — Company capability overview", "url": "https://ase.aseglobal.com/about-ase/", "proves": "Commercial packaging, testing, substrate, and system-assembly capabilities.", "does_not_prove": "Packaging or testing of a named U.S. accelerator.", "last_checked": "2026-08-01", "id": "us-source-ase", "source_id": "us-source-ase", "primary_status": "primary" } }, { "id": "ibiden", "entity_id": "ibiden", "record_type": "entity", "name": "IBIDEN Co., Ltd.", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "Japan", "country_of_ownership": "Japan", "headquarters": "Ogaki, Gifu, Japan", "raw_supply_chain_layers": [ "advanced packaging/test/substrates" ], "supply_chain_layers": [ "advanced packaging/test/substrates" ], "macro_stages": [ "advanced_packaging_osat", "inspection_metrology_test", "substrate_board" ], "why_it_matters": "High-performance IC package substrates connect complex semiconductor packages to boards and systems.", "capability_claim": "Ibiden manufactures high-performance IC package substrates and has approved further investment for server-oriented substrates.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "commercial_with_expansion_approved", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-ibiden" ], "source_refs": [ { "source_id": "us-source-ibiden", "url": "https://www.ibiden.com/company/2026/02/notice-regarding-capital-investment-plan-for-high-performance-ic-package-substrates.html", "title": "IBIDEN — High-performance IC package substrate investment", "publisher": "IBIDEN Co., Ltd.", "primary_status": "primary" } ], "unknowns": [ "Supply or qualification for NVIDIA, AMD, or another named product." ], "last_checked": "2026-08-01", "source": { "label": "IBIDEN — High-performance IC package substrate investment", "url": "https://www.ibiden.com/company/2026/02/notice-regarding-capital-investment-plan-for-high-performance-ic-package-substrates.html", "proves": "An existing substrate business and approved expansion plan.", "does_not_prove": "Supply or qualification for NVIDIA, AMD, or another named product.", "last_checked": "2026-08-01", "id": "us-source-ibiden", "source_id": "us-source-ibiden", "primary_status": "primary" } }, { "id": "dell", "entity_id": "dell", "record_type": "entity", "name": "Dell Technologies Inc.", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "United States", "country_of_ownership": "United States", "headquarters": "Round Rock, Texas, United States", "raw_supply_chain_layers": [ "boards/systems", "software/cloud/deployment" ], "supply_chain_layers": [ "boards/systems", "software/cloud/deployment" ], "macro_stages": [ "substrate_board", "systems_integration", "software_runtime", "cloud_deployment_demand" ], "why_it_matters": "Dell integrates servers, storage, networking, software, and services into deployable enterprise AI infrastructure.", "capability_claim": "Dell offers an AI infrastructure portfolio spanning servers, storage, networking, software, and deployment services.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "commercially_deployed", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-dell" ], "source_refs": [ { "source_id": "us-source-dell", "url": "https://www.dell.com/en-us/dt/corporate/newsroom/announcements/detailpage.press-releases~usa~2024~05~20240520-dell-technologies-fast-tracks-ai-driven-innovation-with-the-dell-ai-factory.htm", "title": "Dell AI Factory", "publisher": "Dell Technologies Inc.", "primary_status": "primary" } ], "unknowns": [ "Board-level sourcing, component qualification, or country-of-origin distribution." ], "last_checked": "2026-08-01", "source": { "label": "Dell AI Factory", "url": "https://www.dell.com/en-us/dt/corporate/newsroom/announcements/detailpage.press-releases~usa~2024~05~20240520-dell-technologies-fast-tracks-ai-driven-innovation-with-the-dell-ai-factory.htm", "proves": "A commercial system and deployment portfolio.", "does_not_prove": "Board-level sourcing, component qualification, or country-of-origin distribution.", "last_checked": "2026-08-01", "id": "us-source-dell", "source_id": "us-source-dell", "primary_status": "primary" } }, { "id": "hpe", "entity_id": "hpe", "record_type": "entity", "name": "Hewlett Packard Enterprise Company", "kind": "company", "entity_type": "company", "entity_origin": "us_capability_anchor", "external_anchor": true, "ownership_country": "United States", "country_of_ownership": "United States", "headquarters": "Spring, Texas, United States", "raw_supply_chain_layers": [ "boards/systems", "power/cooling", "software/cloud/deployment" ], "supply_chain_layers": [ "boards/systems", "power/cooling", "software/cloud/deployment" ], "macro_stages": [ "substrate_board", "systems_integration", "power_cooling_facilities", "software_runtime", "cloud_deployment_demand" ], "why_it_matters": "HPE integrates AI and supercomputing systems, networking, software, services, and direct liquid cooling.", "capability_claim": "HPE offers AI systems and direct-liquid-cooling architectures with integrated infrastructure and services.", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_evidence_state": "official_primary", "readiness_state": "commercially_offered", "completion_state": "capability_anchor_only", "source_ids": [ "us-source-hpe" ], "source_refs": [ { "source_id": "us-source-hpe", "url": "https://www.hpe.com/us/en/solutions/direct-liquid-cooling.html", "title": "HPE — Direct Liquid Cooling", "publisher": "Hewlett Packard Enterprise Company", "primary_status": "primary" } ], "unknowns": [ "Component 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The U.S. reference supplement adds only named, sourced relationships and still does not establish a complete bill of materials, facility path, allocation, volume, or accepted deployment." }, { "id": "intel-arc-b-series", "product_id": "intel-arc-b-series", "record_type": "product_coverage", "kind": "accelerator_product_or_platform", "entity_type": "client_accelerator_family", "entity_origin": "us_product_dataset", "name": "Intel · Arc B-Series", "company": "Intel", "product": "Arc B-Series", "design_company_anchor_id": "intel", "design_company_headquarters_country": "United States", "country_of_ownership": "United States", "accelerator_type": "GPU/GPGPU", "entity_level": "client_accelerator_family", "role": "Client graphics and local AI GPU", "completion_state": "product_identity_and_selected_relationships_source_backed_complete_path_unknown", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "raw_supply_chain_layers": [ "accelerator_product_or_platform" ], "supply_chain_layers": [ "accelerator_product_or_platform" ], "macro_stages": [ "chip_architecture" ], "source_ids": [ "us-source-product-intel-arc-b-series-1" ], "source_refs": [ { "source_id": "us-source-product-intel-arc-b-series-1", "url": "https://www.intel.com/content/www/us/en/products/docs/discrete-gpus/arc/desktop/b-series/overview.html", "title": "Intel Arc graphics", "publisher": "Intel", "primary_status": "primary" } ], "unknowns": [ "family-wide memory capacity", "sustained local-AI performance by model" ], "last_checked": "2026-08-01", "boundary": "The cited product record establishes product identity and selected company-stated characteristics. The U.S. reference supplement adds only named, sourced relationships and still does not establish a complete bill of materials, facility path, allocation, volume, or accepted deployment." }, { "id": "cerebras-wse-3", "product_id": "cerebras-wse-3", "record_type": "product_coverage", "kind": "accelerator_product_or_platform", "entity_type": "wafer_scale_accelerator_system_family", "entity_origin": "us_product_dataset", "name": "Cerebras · WSE-3", "company": "Cerebras", "product": "WSE-3", "design_company_anchor_id": "cerebras", "design_company_headquarters_country": "United States", "country_of_ownership": "United States", "accelerator_type": "Wafer-scale engine", "entity_level": "wafer_scale_accelerator_system_family", "role": "Wafer-scale training and inference accelerator", "completion_state": "product_identity_and_selected_relationships_source_backed_complete_path_unknown", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "raw_supply_chain_layers": [ "accelerator_product_or_platform" ], "supply_chain_layers": [ "accelerator_product_or_platform" ], "macro_stages": [ "chip_architecture" ], "source_ids": [ "us-source-product-cerebras-wse-3-1" ], "source_refs": [ { "source_id": "us-source-product-cerebras-wse-3-1", "url": "https://www.cerebras.ai/press-release/cerebras-announces-third-generation-wafer-scale-engine/", "title": "Cerebras WSE-3 announcement", "publisher": "Cerebras", "primary_status": "primary" } ], "unknowns": [ "workload-specific off-wafer traffic", "customer system utilization", "accepted-task economics" ], "last_checked": "2026-08-01", "boundary": "The cited product record establishes product identity and selected company-stated characteristics. The U.S. reference supplement adds only named, sourced relationships and still does not establish a complete bill of materials, facility path, allocation, volume, or accepted deployment." }, { "id": "groq-lpu", "product_id": "groq-lpu", "record_type": "product_coverage", "kind": "accelerator_product_or_platform", "entity_type": "accelerator_and_rack_system_family", "entity_origin": "us_product_dataset", "name": "Groq · LPU / GroqRack", "company": "Groq", "product": "LPU / GroqRack", "design_company_anchor_id": "groq", "design_company_headquarters_country": "United States", "country_of_ownership": "United States", "accelerator_type": "LPU/SRAM inference ASIC", "entity_level": "accelerator_and_rack_system_family", "role": "Deterministic low-latency inference accelerator", "completion_state": "product_identity_and_selected_relationships_source_backed_complete_path_unknown", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "raw_supply_chain_layers": [ "accelerator_product_or_platform" ], "supply_chain_layers": [ "accelerator_product_or_platform" ], "macro_stages": [ "chip_architecture" ], "source_ids": [ "us-source-product-groq-lpu-1" ], "source_refs": [ { "source_id": "us-source-product-groq-lpu-1", "url": "https://groq.com/lpu-architecture", "title": "Groq LPU architecture", "publisher": "Groq", "primary_status": "primary" } ], "unknowns": [ "current chip revision by service", "system memory capacity", "customer volume" ], "last_checked": "2026-08-01", "boundary": "The cited product record establishes product identity and selected company-stated characteristics. The U.S. reference supplement adds only named, sourced relationships and still does not establish a complete bill of materials, facility path, allocation, volume, or accepted deployment." }, { "id": "google-tpu", "product_id": "google-tpu", "record_type": "product_coverage", "kind": "accelerator_product_or_platform", "entity_type": "cloud_accelerator_family", "entity_origin": "us_product_dataset", "name": "Google · TPU v5e / v5p / Trillium / Ironwood", "company": "Google", "product": "TPU v5e / v5p / Trillium / Ironwood", "design_company_anchor_id": "google", "design_company_headquarters_country": "United States", "country_of_ownership": "United States", "accelerator_type": "NPU/tensor ASIC", "entity_level": "cloud_accelerator_family", "role": "Cloud training and inference accelerator family", "completion_state": "product_identity_and_selected_relationships_source_backed_complete_path_unknown", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "raw_supply_chain_layers": [ "accelerator_product_or_platform" ], "supply_chain_layers": [ "accelerator_product_or_platform" ], "macro_stages": [ "chip_architecture" ], "source_ids": [ "us-source-product-google-tpu-1" ], "source_refs": [ { "source_id": "us-source-product-google-tpu-1", "url": "https://cloud.google.com/tpu/docs/system-architecture-tpu-vm", "title": "Google Cloud TPU documentation", "publisher": "Google", "primary_status": "primary" } ], "unknowns": [ "foundry and package by generation", "current regional capacity", "generation-specific fields not yet split" ], "last_checked": "2026-08-01", "boundary": "The cited product record establishes product identity and selected company-stated characteristics. The U.S. reference supplement adds only named, sourced relationships and still does not establish a complete bill of materials, facility path, allocation, volume, or accepted deployment." }, { "id": "aws-trainium-inferentia", "product_id": "aws-trainium-inferentia", "record_type": "product_coverage", "kind": "accelerator_product_or_platform", "entity_type": "cloud_accelerator_family", "entity_origin": "us_product_dataset", "name": "Amazon Web Services · Trainium / Inferentia", "company": "Amazon Web Services", "product": "Trainium / Inferentia", "design_company_anchor_id": "aws", "design_company_headquarters_country": "United States", "country_of_ownership": "United States", "accelerator_type": "NPU/tensor ASIC", "entity_level": "cloud_accelerator_family", "role": "Cloud training and inference accelerator families", "completion_state": "product_identity_and_selected_relationships_source_backed_complete_path_unknown", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "raw_supply_chain_layers": [ "accelerator_product_or_platform" ], "supply_chain_layers": [ "accelerator_product_or_platform" ], "macro_stages": [ "chip_architecture" ], "source_ids": [ "us-source-product-aws-trainium-inferentia-1", "us-source-product-aws-trainium-inferentia-2" ], "source_refs": [ { "source_id": "us-source-product-aws-trainium-inferentia-1", "url": "https://aws.amazon.com/machine-learning/trainium/", "title": "AWS Trainium", "publisher": "Amazon Web Services", "primary_status": "primary" }, { "source_id": "us-source-product-aws-trainium-inferentia-2", "url": "https://aws.amazon.com/machine-learning/inferentia/", "title": "AWS Inferentia", "publisher": "Amazon Web Services", "primary_status": "primary" } ], "unknowns": [ "manufacturing chain", "generation-normalized specs", "regional supply" ], "last_checked": "2026-08-01", "boundary": "The cited product record establishes product identity and selected company-stated characteristics. The U.S. reference supplement adds only named, sourced relationships and still does not establish a complete bill of materials, facility path, allocation, volume, or accepted deployment." }, { "id": "microsoft-maia", "product_id": "microsoft-maia", "record_type": "product_coverage", "kind": "accelerator_product_or_platform", "entity_type": "cloud_accelerator_family", "entity_origin": "us_product_dataset", "name": "Microsoft · Maia 100 / Maia 200", "company": "Microsoft", "product": "Maia 100 / Maia 200", "design_company_anchor_id": "microsoft-azure", "design_company_headquarters_country": "United States", "country_of_ownership": "United States", "accelerator_type": "NPU/tensor ASIC", "entity_level": "cloud_accelerator_family", "role": "Azure AI training and inference accelerator", "completion_state": "product_identity_and_selected_relationships_source_backed_complete_path_unknown", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "raw_supply_chain_layers": [ "accelerator_product_or_platform" ], "supply_chain_layers": [ "accelerator_product_or_platform" ], "macro_stages": [ "chip_architecture" ], "source_ids": [ "us-source-product-microsoft-maia-1" ], "source_refs": [ { "source_id": "us-source-product-microsoft-maia-1", "url": "https://news.microsoft.com/source/features/ai/in-house-chips-silicon-to-service-to-meet-ai-demand/", "title": "Microsoft Maia 100", "publisher": "Microsoft", "primary_status": "primary" } ], "unknowns": [ "broad customer availability", "manufacturing chain", "generation-specific production volume" ], "last_checked": "2026-08-01", "boundary": "The cited product record establishes product identity and selected company-stated characteristics. The U.S. reference supplement adds only named, sourced relationships and still does not establish a complete bill of materials, facility path, allocation, volume, or accepted deployment." }, { "id": "meta-mtia", "product_id": "meta-mtia", "record_type": "product_coverage", "kind": "accelerator_product_or_platform", "entity_type": "internal_datacenter_accelerator_family", "entity_origin": "us_product_dataset", "name": "Meta · MTIA", "company": "Meta", "product": "MTIA", "design_company_anchor_id": "meta", "design_company_headquarters_country": "United States", "country_of_ownership": "United States", "accelerator_type": "NPU/tensor ASIC", "entity_level": "internal_datacenter_accelerator_family", "role": "Internal recommendation and inference accelerator", "completion_state": "product_identity_and_selected_relationships_source_backed_complete_path_unknown", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "raw_supply_chain_layers": [ "accelerator_product_or_platform" ], "supply_chain_layers": [ "accelerator_product_or_platform" ], "macro_stages": [ "chip_architecture" ], "source_ids": [ "us-source-product-meta-mtia-1" ], "source_refs": [ { "source_id": "us-source-product-meta-mtia-1", "url": "https://ai.meta.com/blog/next-generation-meta-training-inference-accelerator-AI-MTIA/", "title": "Meta next-generation MTIA", "publisher": "Meta", "primary_status": "primary" } ], "unknowns": [ "deployment volume", "current revision mix", "external availability not applicable" ], "last_checked": "2026-08-01", "boundary": "The cited product record establishes product identity and selected company-stated characteristics. The U.S. reference supplement adds only named, sourced relationships and still does not establish a complete bill of materials, facility path, allocation, volume, or accepted deployment." } ], "facilities": [], "claims": [], "relationships": [ { "id": "us-rel-b200-tsmc-4np", "from_entity_id": "nvidia-blackwell-b200", "to_entity_id": "tsmc", "relationship_scope": "product_specific", "product_id": "nvidia-blackwell-b200", "product_family_id": null, "affected_product_ids": [ "nvidia-blackwell-b200" ], "edge_category": "foundry", "relationship_type": "manufactured_on_process_by", "stage_id": "logic_foundry_process", "macro_stages": [ "front_end_fabrication" ], "supplier_relationship_state": "known", "commercial_state": "company_disclosed_product_process", "qualification_state": "not_disclosed", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-nvidia-blackwell-platform" ], "summary": "NVIDIA states that Blackwell GPUs are manufactured on custom TSMC 4NP.", "boundary": "This exact-product edge covers the B200 GPU process. It does not identify a fab, wafer lot, equipment, yield, package, volume, or system-wide origin.", "unknowns": [ "fabrication facility and lot", "yield and volume", "package and assembly path" ], "relationship_id": "us-rel-b200-tsmc-4np", "record_type": "relationship", "from": "nvidia-blackwell-b200", "to": "tsmc", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-nvidia-blackwell-platform", "url": "https://nvidianews.nvidia.com/news/nvidia-blackwell-platform-arrives-to-power-a-new-era-of-computing", "title": "NVIDIA Blackwell platform announcement", "publisher": "NVIDIA", "primary_status": "primary" } ] }, { "id": "us-rel-b300-tsmc-4np", "from_entity_id": "nvidia-blackwell-b300", "to_entity_id": "tsmc", "relationship_scope": "product_specific", "product_id": "nvidia-blackwell-b300", "product_family_id": null, "affected_product_ids": [ "nvidia-blackwell-b300" ], "edge_category": "foundry", "relationship_type": "manufactured_on_process_by", "stage_id": "logic_foundry_process", "macro_stages": [ "front_end_fabrication" ], "supplier_relationship_state": "known", "commercial_state": "company_disclosed_product_process", "qualification_state": "not_disclosed", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-nvidia-blackwell-ultra" ], "summary": "NVIDIA states that Blackwell Ultra is manufactured using TSMC 4NP.", "boundary": "This exact-product edge covers the B300 GPU process. It does not identify a fab, wafer lot, equipment, yield, package, volume, or system-wide origin.", "unknowns": [ "fabrication facility and lot", "yield and volume", "package and assembly path" ], "relationship_id": "us-rel-b300-tsmc-4np", "record_type": "relationship", "from": "nvidia-blackwell-b300", "to": "tsmc", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-nvidia-blackwell-ultra", "url": "https://developer.nvidia.com/blog/inside-nvidia-blackwell-ultra-the-chip-powering-the-ai-factory-era/", "title": "Inside NVIDIA Blackwell Ultra", "publisher": "NVIDIA", "primary_status": "primary" } ] }, { "id": "us-rel-gb200-tsmc-blackwell-component", "from_entity_id": "nvidia-gb200-nvl72", "to_entity_id": "tsmc", "relationship_scope": "product_specific", "product_id": "nvidia-gb200-nvl72", "product_family_id": null, "affected_product_ids": [ "nvidia-gb200-nvl72" ], "edge_category": "foundry", "relationship_type": "contains_gpu_manufactured_on_process_by", "stage_id": "logic_foundry_process", "macro_stages": [ "front_end_fabrication" ], "supplier_relationship_state": "known", "commercial_state": "component_process_disclosure", "qualification_state": "not_disclosed", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-nvidia-blackwell-platform", "us-ref-source-nvidia-gb200" ], "summary": "GB200 NVL72 contains Blackwell GPUs, which NVIDIA states use custom TSMC 4NP.", "boundary": "This is a component-level foundry edge for Blackwell GPUs inside the rack, not a foundry claim for Grace CPUs, switches, memory, power, cooling, or every rack component.", "unknowns": [ "other component foundries", "fabrication facilities and lots", "rack-level supplier allocation" ], "relationship_id": "us-rel-gb200-tsmc-blackwell-component", "record_type": "relationship", "from": "nvidia-gb200-nvl72", "to": "tsmc", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-nvidia-blackwell-platform", "url": "https://nvidianews.nvidia.com/news/nvidia-blackwell-platform-arrives-to-power-a-new-era-of-computing", "title": "NVIDIA Blackwell platform announcement", "publisher": "NVIDIA", "primary_status": "primary" }, { "source_id": "us-ref-source-nvidia-gb200", "url": "https://www.nvidia.com/en-us/data-center/gb200-nvl72/", "title": "NVIDIA GB200 NVL72 product page", "publisher": "NVIDIA", "primary_status": "primary" } ] }, { "id": "us-rel-gb300-tsmc-b300-component", "from_entity_id": "nvidia-gb300-nvl72", "to_entity_id": "tsmc", "relationship_scope": "product_specific", "product_id": "nvidia-gb300-nvl72", "product_family_id": null, "affected_product_ids": [ "nvidia-gb300-nvl72" ], "edge_category": "foundry", "relationship_type": "contains_gpu_manufactured_on_process_by", "stage_id": "logic_foundry_process", "macro_stages": [ "front_end_fabrication" ], "supplier_relationship_state": "known", "commercial_state": "component_process_disclosure", "qualification_state": "not_disclosed", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-nvidia-blackwell-ultra", "us-ref-source-nvidia-gb300" ], "summary": "GB300 NVL72 contains Blackwell Ultra GPUs, which NVIDIA states use TSMC 4NP.", "boundary": "This is a component-level foundry edge for B300 GPUs inside the rack, not a foundry claim for Grace CPUs, switches, memory, power, cooling, or every rack component.", "unknowns": [ "other component foundries", "fabrication facilities and lots", "rack-level supplier allocation" ], "relationship_id": "us-rel-gb300-tsmc-b300-component", "record_type": "relationship", "from": "nvidia-gb300-nvl72", "to": "tsmc", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-nvidia-blackwell-ultra", "url": "https://developer.nvidia.com/blog/inside-nvidia-blackwell-ultra-the-chip-powering-the-ai-factory-era/", "title": "Inside NVIDIA Blackwell Ultra", "publisher": "NVIDIA", "primary_status": "primary" }, { "source_id": "us-ref-source-nvidia-gb300", "url": "https://www.nvidia.com/en-us/data-center/gb300-nvl72/", "title": "NVIDIA GB300 NVL72 product page", "publisher": "NVIDIA", "primary_status": "primary" } ] }, { "id": "us-rel-mi300x-tsmc", "from_entity_id": "amd-instinct-mi300x", "to_entity_id": "tsmc", "relationship_scope": "product_specific", "product_id": "amd-instinct-mi300x", "product_family_id": null, "affected_product_ids": [ "amd-instinct-mi300x" ], "edge_category": "foundry", "relationship_type": "uses_process_technology_from", "stage_id": "logic_foundry_process", "macro_stages": [ "front_end_fabrication" ], "supplier_relationship_state": "known", "commercial_state": "company_product_specification", "qualification_state": "not_disclosed", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-amd-mi300x" ], "summary": "AMD lists TSMC 5 nm and 6 nm process technology for MI300X.", "boundary": "This exact-product edge does not assign chiplets to facilities or lots and does not establish yield, volume, package, or assembly provenance.", "unknowns": [ "chiplet-to-process mapping", "fabrication facilities and lots", "yield and volume" ], "relationship_id": "us-rel-mi300x-tsmc", "record_type": "relationship", "from": "amd-instinct-mi300x", "to": "tsmc", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-amd-mi300x", "url": "https://www.amd.com/en/products/accelerators/instinct/mi300/mi300x.html", "title": "AMD Instinct MI300X product page", "publisher": "AMD", "primary_status": "primary" } ] }, { "id": "us-rel-mi325x-tsmc", "from_entity_id": "amd-instinct-mi325x", "to_entity_id": "tsmc", "relationship_scope": "product_specific", "product_id": "amd-instinct-mi325x", "product_family_id": null, "affected_product_ids": [ "amd-instinct-mi325x" ], "edge_category": "foundry", "relationship_type": "uses_process_technology_from", "stage_id": "logic_foundry_process", "macro_stages": [ "front_end_fabrication" ], "supplier_relationship_state": "known", "commercial_state": "company_product_specification", "qualification_state": "not_disclosed", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-amd-mi325x" ], "summary": "AMD lists TSMC 5 nm and 6 nm process technology for MI325X.", "boundary": "This exact-product edge does not assign chiplets to facilities or lots and does not establish yield, volume, package, or assembly provenance.", "unknowns": [ "chiplet-to-process mapping", "fabrication facilities and lots", "yield and volume" ], "relationship_id": "us-rel-mi325x-tsmc", "record_type": "relationship", "from": "amd-instinct-mi325x", "to": "tsmc", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-amd-mi325x", "url": "https://www.amd.com/en/products/accelerators/instinct/mi300/mi325x.html", "title": "AMD Instinct MI325X product page", "publisher": "AMD", "primary_status": "primary" } ] }, { "id": "us-rel-mi350x-tsmc", "from_entity_id": "amd-instinct-mi350x", "to_entity_id": "tsmc", "relationship_scope": "product_specific", "product_id": "amd-instinct-mi350x", "product_family_id": null, "affected_product_ids": [ "amd-instinct-mi350x" ], "edge_category": "foundry", "relationship_type": "uses_process_technology_from", "stage_id": "logic_foundry_process", "macro_stages": [ "front_end_fabrication" ], "supplier_relationship_state": "known", "commercial_state": "company_product_specification", "qualification_state": "not_disclosed", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-amd-mi350x" ], "summary": "AMD lists TSMC 3 nm and 6 nm process technology for MI350X.", "boundary": "This exact-product edge does not assign chiplets to facilities or lots and does not establish yield, volume, package, or assembly provenance.", "unknowns": [ "chiplet-to-process mapping", "fabrication facilities and lots", "yield and volume" ], "relationship_id": "us-rel-mi350x-tsmc", "record_type": "relationship", "from": "amd-instinct-mi350x", "to": "tsmc", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-amd-mi350x", "url": "https://www.amd.com/en/products/accelerators/instinct/mi350/mi350x.html", "title": "AMD Instinct MI350X product page", "publisher": "AMD", "primary_status": "primary" } ] }, { "id": "us-rel-mi355x-tsmc", "from_entity_id": "amd-instinct-mi355x", "to_entity_id": "tsmc", "relationship_scope": "product_specific", "product_id": "amd-instinct-mi355x", "product_family_id": null, "affected_product_ids": [ "amd-instinct-mi355x" ], "edge_category": "foundry", "relationship_type": "uses_process_technology_from", "stage_id": "logic_foundry_process", "macro_stages": [ "front_end_fabrication" ], "supplier_relationship_state": "known", "commercial_state": "company_product_specification", "qualification_state": "not_disclosed", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-amd-mi355x" ], "summary": "AMD lists TSMC 3 nm and 6 nm process technology for MI355X.", "boundary": "This exact-product edge does not assign chiplets to facilities or lots and does not establish yield, volume, package, or assembly provenance.", "unknowns": [ "chiplet-to-process mapping", "fabrication facilities and lots", "yield and volume" ], "relationship_id": "us-rel-mi355x-tsmc", "record_type": "relationship", "from": "amd-instinct-mi355x", "to": "tsmc", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-amd-mi355x", "url": "https://www.amd.com/en/products/accelerators/instinct/mi350/mi355x.html", "title": "AMD Instinct MI355X product page", "publisher": "AMD", "primary_status": "primary" } ] }, { "id": "us-rel-b200-micron-hbm3e", "from_entity_id": "nvidia-blackwell-b200", "to_entity_id": "micron", "relationship_scope": "product_specific", "product_id": "nvidia-blackwell-b200", "product_family_id": null, "affected_product_ids": [ "nvidia-blackwell-b200" ], "edge_category": "memory", "relationship_type": "hbm3e_available_for", "stage_id": "memory_manufacturer", "macro_stages": [ "memory_storage" ], "supplier_relationship_state": "partial", "commercial_state": "supplier_available_for_platform", "qualification_state": "installation_not_established", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-micron-nvidia-gtc" ], "summary": "Micron states that its 8-high HBM3E is available for NVIDIA HGX B200.", "boundary": "Available for is not an assertion that every B200 uses Micron or that a named system, lot, or customer received it.", "unknowns": [ "installed supplier mix", "lot and capacity allocation", "system and customer allocation" ], "relationship_id": "us-rel-b200-micron-hbm3e", "record_type": "relationship", "from": "nvidia-blackwell-b200", "to": "micron", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-micron-nvidia-gtc", "url": "https://investors.micron.com/news-releases/news-release-details/micron-innovates-data-center-edge-nvidia", "title": "Micron memory designed for NVIDIA platforms", "publisher": "Micron Technology", "primary_status": "primary" } ] }, { "id": "us-rel-gb200-micron-hbm3e", "from_entity_id": "nvidia-gb200-nvl72", "to_entity_id": "micron", "relationship_scope": "product_specific", "product_id": "nvidia-gb200-nvl72", "product_family_id": null, "affected_product_ids": [ "nvidia-gb200-nvl72" ], "edge_category": "memory", "relationship_type": "hbm3e_available_for", "stage_id": "memory_manufacturer", "macro_stages": [ "memory_storage" ], "supplier_relationship_state": "partial", "commercial_state": "supplier_available_for_platform", "qualification_state": "installation_not_established", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-micron-nvidia-gtc" ], "summary": "Micron states that its 8-high HBM3E is available for NVIDIA GB200.", "boundary": "Available for is not an assertion that every GB200 rack uses Micron or that a named rack, lot, or customer received it.", "unknowns": [ "installed supplier mix", "rack-level lot allocation", "LPDDR supplier" ], "relationship_id": "us-rel-gb200-micron-hbm3e", "record_type": "relationship", "from": "nvidia-gb200-nvl72", "to": "micron", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-micron-nvidia-gtc", "url": "https://investors.micron.com/news-releases/news-release-details/micron-innovates-data-center-edge-nvidia", "title": "Micron memory designed for NVIDIA platforms", "publisher": "Micron Technology", "primary_status": "primary" } ] }, { "id": "us-rel-b300-micron-hbm3e", "from_entity_id": "nvidia-blackwell-b300", "to_entity_id": "micron", "relationship_scope": "product_specific", "product_id": "nvidia-blackwell-b300", "product_family_id": null, "affected_product_ids": [ "nvidia-blackwell-b300" ], "edge_category": "memory", "relationship_type": "hbm3e_designed_into", "stage_id": "memory_manufacturer", "macro_stages": [ "memory_storage" ], "supplier_relationship_state": "known", "commercial_state": "supplier_design_in", "qualification_state": "company_reported_designed_into", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-micron-nvidia-gtc" ], "summary": "Micron states that its 12-high HBM3E is designed into NVIDIA HGX B300.", "boundary": "A design-in establishes a named product relationship, not exclusive supply, every-system installation, lot allocation, volume, or customer acceptance.", "unknowns": [ "supplier mix and exclusivity", "lot and capacity allocation", "customer shipment volume" ], "relationship_id": "us-rel-b300-micron-hbm3e", "record_type": "relationship", "from": "nvidia-blackwell-b300", "to": "micron", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-micron-nvidia-gtc", "url": "https://investors.micron.com/news-releases/news-release-details/micron-innovates-data-center-edge-nvidia", "title": "Micron memory designed for NVIDIA platforms", "publisher": "Micron Technology", "primary_status": "primary" } ] }, { "id": "us-rel-gb300-micron-hbm3e", "from_entity_id": "nvidia-gb300-nvl72", "to_entity_id": "micron", "relationship_scope": "product_specific", "product_id": "nvidia-gb300-nvl72", "product_family_id": null, "affected_product_ids": [ "nvidia-gb300-nvl72" ], "edge_category": "memory", "relationship_type": "hbm3e_designed_into", "stage_id": "memory_manufacturer", "macro_stages": [ "memory_storage" ], "supplier_relationship_state": "known", "commercial_state": "supplier_design_in", "qualification_state": "company_reported_designed_into", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-micron-nvidia-gtc" ], "summary": "Micron states that its 12-high HBM3E is designed into NVIDIA GB300.", "boundary": "A design-in establishes a named platform relationship, not exclusive supply, every-rack installation, rack-level lot allocation, volume, or customer acceptance.", "unknowns": [ "supplier mix and exclusivity", "rack-level lot allocation", "LPDDR supplier" ], "relationship_id": "us-rel-gb300-micron-hbm3e", "record_type": "relationship", "from": "nvidia-gb300-nvl72", "to": "micron", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-micron-nvidia-gtc", "url": "https://investors.micron.com/news-releases/news-release-details/micron-innovates-data-center-edge-nvidia", "title": "Micron memory designed for NVIDIA platforms", "publisher": "Micron Technology", "primary_status": "primary" } ] }, { "id": "us-rel-gb300-sk-hynix-hbm3e", "from_entity_id": "nvidia-gb300-nvl72", "to_entity_id": "sk-hynix", "relationship_scope": "product_specific", "product_id": "nvidia-gb300-nvl72", "product_family_id": null, "affected_product_ids": [ "nvidia-gb300-nvl72" ], "edge_category": "memory", "relationship_type": "live_module_used_hbm3e_from", "stage_id": "memory_manufacturer", "macro_stages": [ "memory_storage" ], "supplier_relationship_state": "known", "commercial_state": "company_reported_live_module", "qualification_state": "demonstrated_module", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-sk-hynix-nvidia-gtc" ], "summary": "SK hynix reports that a live NVIDIA GB300 module at GTC 2026 used its HBM3E.", "boundary": "The demonstrated module does not prove exclusive supply, every-rack installation, lot allocation, volume, customer acceptance, or the LPDDR supplier.", "unknowns": [ "supplier mix and exclusivity", "rack-level lot allocation", "customer shipment volume" ], "relationship_id": "us-rel-gb300-sk-hynix-hbm3e", "record_type": "relationship", "from": "nvidia-gb300-nvl72", "to": "sk-hynix", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-sk-hynix-nvidia-gtc", "url": "https://news.skhynix.com/en/gtc-2026-ai-partnership/", "title": "SK hynix NVIDIA memory partnership at GTC 2026", "publisher": "SK hynix", "primary_status": "primary" } ] }, { "id": "us-rel-rubin-sk-hynix-hbm4", "from_entity_id": "nvidia-vera-rubin-nvl72", "to_entity_id": "sk-hynix", "relationship_scope": "product_specific", "product_id": "nvidia-vera-rubin-nvl72", "product_family_id": null, "affected_product_ids": [ "nvidia-vera-rubin-nvl72" ], "edge_category": "memory", "relationship_type": "planned_hbm4_adoption", "stage_id": "memory_manufacturer", "macro_stages": [ "memory_storage" ], "supplier_relationship_state": "partial", "commercial_state": "planned_adoption", "qualification_state": "displayed_on_module", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-sk-hynix-nvidia-gtc" ], "summary": "SK hynix states that its HBM4 is slated for Rubin and displayed the product on a Vera Rubin module.", "boundary": "Planned adoption and a display are not proof of final allocation, exclusive supply, shipped production lots, volume, or customer acceptance.", "unknowns": [ "final supplier allocation", "production lot shipment", "customer availability" ], "relationship_id": "us-rel-rubin-sk-hynix-hbm4", "record_type": "relationship", "from": "nvidia-vera-rubin-nvl72", "to": "sk-hynix", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-sk-hynix-nvidia-gtc", "url": "https://news.skhynix.com/en/gtc-2026-ai-partnership/", "title": "SK hynix NVIDIA memory partnership at GTC 2026", "publisher": "SK hynix", "primary_status": "primary" } ] }, { "id": "us-rel-rubin-micron-hbm4", "from_entity_id": "nvidia-vera-rubin-nvl72", "to_entity_id": "micron", "relationship_scope": "product_specific", "product_id": "nvidia-vera-rubin-nvl72", "product_family_id": null, "affected_product_ids": [ "nvidia-vera-rubin-nvl72" ], "edge_category": "memory", "relationship_type": "hbm4_designed_for_and_shipping", "stage_id": "memory_manufacturer", "macro_stages": [ "memory_storage" ], "supplier_relationship_state": "partial", "commercial_state": "supplier_high_volume_production", "qualification_state": "company_reported_designed_for", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-micron-rubin" ], "summary": "Micron reports high-volume production and shipment of HBM4 designed for Vera Rubin.", "boundary": "Supplier shipment does not establish final rack allocation, exclusive supply, installed customer systems, customer acceptance, or the LPDDR supplier.", "unknowns": [ "final rack allocation", "supplier mix and exclusivity", "customer installation and acceptance" ], "relationship_id": "us-rel-rubin-micron-hbm4", "record_type": "relationship", "from": "nvidia-vera-rubin-nvl72", "to": "micron", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-micron-rubin", "url": "https://investors.micron.com/news-releases/news-release-details/micron-high-volume-production-hbm4-designed-nvidia-vera-rubin", "title": "Micron HBM4 designed for NVIDIA Vera Rubin", "publisher": "Micron Technology", "primary_status": "primary" } ] }, { "id": "us-rel-mi350-series-micron-hbm3e", "from_entity_id": "amd", "to_entity_id": "micron", "relationship_scope": "product_family", "product_id": null, "product_family_id": "amd-instinct-mi350-series", "affected_product_ids": [ "amd-instinct-mi350x", "amd-instinct-mi355x" ], "edge_category": "memory", "relationship_type": "hbm3e_integrated_into_product_family", "stage_id": "memory_manufacturer", "macro_stages": [ "memory_storage" ], "supplier_relationship_state": "known", "commercial_state": "supplier_design_in", "qualification_state": "company_reported_integration", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-micron-amd-mi350" ], "summary": "Micron reports integration of its 12-high HBM3E into AMD Instinct MI350 Series solutions.", "boundary": "This is a family-level edge affecting MI350X and MI355X. It does not assert that every unit or every SKU uses Micron, or establish exclusivity, lot allocation, volume, or customer acceptance.", "unknowns": [ "per-SKU supplier allocation", "supplier mix and exclusivity", "lot and customer allocation" ], "relationship_id": "us-rel-mi350-series-micron-hbm3e", "record_type": "relationship", "from": "amd", "to": "micron", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-micron-amd-mi350", "url": "https://investors.micron.com/news-releases/news-release-details/micron-hbm-designed-leading-amd-ai-platform", "title": "Micron HBM designed into AMD Instinct MI350 Series", "publisher": "Micron Technology", "primary_status": "primary" } ] }, { "id": "us-rel-mi300x-dell-xe9680", "from_entity_id": "amd-instinct-mi300x", "to_entity_id": "dell", "relationship_scope": "product_specific", "product_id": "amd-instinct-mi300x", "product_family_id": null, "affected_product_ids": [ "amd-instinct-mi300x" ], "edge_category": "system", "relationship_type": "offered_in_system_configuration", "stage_id": "board_system", "macro_stages": [ "systems_integration" ], "supplier_relationship_state": "known", "commercial_state": "system_configuration_offered", "qualification_state": "vendor_listed_configuration", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-dell-xe9680" ], "summary": "Dell lists a PowerEdge XE9680 configuration with eight AMD Instinct MI300X accelerators.", "boundary": "A listed system configuration does not establish shipment volume, installed base, customer acceptance, upstream supplier allocation, or workload performance.", "unknowns": [ "shipment and installed-base volume", "customer configuration mix", "accepted-workload performance" ], "relationship_id": "us-rel-mi300x-dell-xe9680", "record_type": "relationship", "from": "amd-instinct-mi300x", "to": "dell", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-dell-xe9680", "url": "https://www.dell.com/en-us/shop/ipovw/poweredge-xe9680", "title": "Dell PowerEdge XE9680 product page", "publisher": "Dell Technologies", "primary_status": "primary" } ] }, { "id": "us-rel-mi355x-dell-xe9785", "from_entity_id": "amd-instinct-mi355x", "to_entity_id": "dell", "relationship_scope": "product_specific", "product_id": "amd-instinct-mi355x", "product_family_id": null, "affected_product_ids": [ "amd-instinct-mi355x" ], "edge_category": "system", "relationship_type": "offered_in_system_configuration", "stage_id": "board_system", "macro_stages": [ "systems_integration" ], "supplier_relationship_state": "known", "commercial_state": "system_configuration_offered", "qualification_state": "vendor_listed_configuration", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-dell-xe9785" ], "summary": "Dell lists a PowerEdge XE9785 configuration with eight AMD Instinct MI355X accelerators.", "boundary": "A listed system configuration does not establish shipment volume, installed base, customer acceptance, upstream supplier allocation, or workload performance.", "unknowns": [ "shipment and installed-base volume", "customer configuration mix", "accepted-workload performance" ], "relationship_id": "us-rel-mi355x-dell-xe9785", "record_type": "relationship", "from": "amd-instinct-mi355x", "to": "dell", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-dell-xe9785", "url": "https://www.dell.com/en-us/shop/ipovw/poweredge-xe9785", "title": "Dell PowerEdge XE9785 product page", "publisher": "Dell Technologies", "primary_status": "primary" } ] }, { "id": "us-rel-b300-dell-xe9785", "from_entity_id": "nvidia-blackwell-b300", "to_entity_id": "dell", "relationship_scope": "product_specific", "product_id": "nvidia-blackwell-b300", "product_family_id": null, "affected_product_ids": [ "nvidia-blackwell-b300" ], "edge_category": "system", "relationship_type": "offered_in_system_configuration", "stage_id": "board_system", "macro_stages": [ "systems_integration" ], "supplier_relationship_state": "known", "commercial_state": "system_configuration_offered", "qualification_state": "vendor_listed_configuration", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-dell-xe9785" ], "summary": "Dell lists a PowerEdge XE9785 configuration with an NVIDIA HGX B300 platform.", "boundary": "A listed system configuration does not establish shipment volume, installed base, customer acceptance, upstream supplier allocation, or workload performance.", "unknowns": [ "shipment and installed-base volume", "customer configuration mix", "accepted-workload performance" ], "relationship_id": "us-rel-b300-dell-xe9785", "record_type": "relationship", "from": "nvidia-blackwell-b300", "to": "dell", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-dell-xe9785", "url": "https://www.dell.com/en-us/shop/ipovw/poweredge-xe9785", "title": "Dell PowerEdge XE9785 product page", "publisher": "Dell Technologies", "primary_status": "primary" } ] }, { "id": "us-rel-gb300-dell-coreweave-rack", "from_entity_id": "nvidia-gb300-nvl72", "to_entity_id": "dell", "relationship_scope": "product_specific", "product_id": "nvidia-gb300-nvl72", "product_family_id": null, "affected_product_ids": [ "nvidia-gb300-nvl72" ], "edge_category": "system", "relationship_type": "assembled_tested_and_deployed_rack_for", "stage_id": "board_system", "macro_stages": [ "systems_integration" ], "supplier_relationship_state": "known", "commercial_state": "reported_customer_delivery", "qualification_state": "assembled_and_tested", "deployment_geography": "United States", "manufacturing_geography": null, "source_ids": [ "us-ref-source-dell-gb300-coreweave" ], "summary": "Dell reports assembling and testing a GB300 NVL72 rack and deploying it for CoreWeave in the United States.", "boundary": "Deployment geography is not manufacturing geography. One delivery does not establish fleet-wide allocation, shipment volume, customer acceptance, or origin of every component.", "unknowns": [ "assembly facility", "fleet-wide supplier allocation", "accepted production workload" ], "relationship_id": "us-rel-gb300-dell-coreweave-rack", "record_type": "relationship", "from": "nvidia-gb300-nvl72", "to": "dell", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-dell-gb300-coreweave", "url": "https://www.dell.com/en-us/blog/dell-delivers-market-s-first-nvidia-gb300-nvl72-to-coreweave/", "title": "Dell delivers a GB300 NVL72 rack to CoreWeave", "publisher": "Dell Technologies", "primary_status": "primary" } ] }, { "id": "us-rel-b200-coreweave-ga", "from_entity_id": "nvidia-blackwell-b200", "to_entity_id": "coreweave", "relationship_scope": "product_specific", "product_id": "nvidia-blackwell-b200", "product_family_id": null, "affected_product_ids": [ "nvidia-blackwell-b200" ], "edge_category": "cloud", "relationship_type": "generally_available_cloud_instance", "stage_id": "qualification_volume_deployment", "macro_stages": [ "cloud_deployment_demand" ], "supplier_relationship_state": "known", "commercial_state": "provider_reported_general_availability", "qualification_state": "cloud_service_available", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-coreweave-b200" ], "summary": "CoreWeave states general availability of NVIDIA HGX B200 instances.", "boundary": "General availability does not establish fleet size, region-by-region capacity, customer allocation, manufacturing origin, or accepted-workload results.", "unknowns": [ "fleet size by region", "customer allocation", "accepted-workload economics" ], "relationship_id": "us-rel-b200-coreweave-ga", "record_type": "relationship", "from": "nvidia-blackwell-b200", "to": "coreweave", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-coreweave-b200", "url": "https://www.coreweave.com/blog/coreweave-expands-its-nvidia-blackwell-fleet-with-generally-available-nvidia-hgx-b200-instances", "title": "CoreWeave HGX B200 general availability", "publisher": "CoreWeave", "primary_status": "primary" } ] }, { "id": "us-rel-b300-coreweave-ga", "from_entity_id": "nvidia-blackwell-b300", "to_entity_id": "coreweave", "relationship_scope": "product_specific", "product_id": "nvidia-blackwell-b300", "product_family_id": null, "affected_product_ids": [ "nvidia-blackwell-b300" ], "edge_category": "cloud", "relationship_type": "generally_available_cloud_instance", "stage_id": "qualification_volume_deployment", "macro_stages": [ "cloud_deployment_demand" ], "supplier_relationship_state": "known", "commercial_state": "provider_reported_general_availability", "qualification_state": "cloud_service_available", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-coreweave-b300" ], "summary": "CoreWeave states general availability of NVIDIA HGX B300 instances.", "boundary": "General availability does not establish fleet size, region-by-region capacity, customer allocation, manufacturing origin, or accepted-workload results.", "unknowns": [ "fleet size by region", "customer allocation", "accepted-workload economics" ], "relationship_id": "us-rel-b300-coreweave-ga", "record_type": "relationship", "from": "nvidia-blackwell-b300", "to": "coreweave", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-coreweave-b300", "url": "https://www.coreweave.com/blog/engineered-for-agentic-ai-nvidia-hgx-b300-on-coreweave-cloud", "title": "CoreWeave HGX B300 general availability", "publisher": "CoreWeave", "primary_status": "primary" } ] }, { "id": "us-rel-gb200-coreweave-ga", "from_entity_id": "nvidia-gb200-nvl72", "to_entity_id": "coreweave", "relationship_scope": "product_specific", "product_id": "nvidia-gb200-nvl72", "product_family_id": null, "affected_product_ids": [ "nvidia-gb200-nvl72" ], "edge_category": "cloud", "relationship_type": "generally_available_cloud_instance", "stage_id": "qualification_volume_deployment", "macro_stages": [ "cloud_deployment_demand" ], "supplier_relationship_state": "known", "commercial_state": "provider_reported_general_availability", "qualification_state": "cloud_service_available", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-coreweave-gb200" ], "summary": "CoreWeave states general availability of NVIDIA GB200 NVL72 instances.", "boundary": "General availability does not establish fleet size, region-by-region capacity, customer allocation, manufacturing origin, or accepted-workload results.", "unknowns": [ "fleet size by region", "customer allocation", "accepted-workload economics" ], "relationship_id": "us-rel-gb200-coreweave-ga", "record_type": "relationship", "from": "nvidia-gb200-nvl72", "to": "coreweave", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-coreweave-gb200", "url": "https://investors.coreweave.com/news/news-details/2025/CoreWeave-First-Cloud-Provider-to-Announce-General-Availability-of-NVIDIA-GB200-NVL72-Instances/default.aspx", "title": "CoreWeave GB200 NVL72 general availability", "publisher": "CoreWeave", "primary_status": "primary" } ] }, { "id": "us-rel-gb300-coreweave-regional-ga", "from_entity_id": "nvidia-gb300-nvl72", "to_entity_id": "coreweave", "relationship_scope": "product_specific", "product_id": "nvidia-gb300-nvl72", "product_family_id": null, "affected_product_ids": [ "nvidia-gb300-nvl72" ], "edge_category": "cloud", "relationship_type": "available_in_selected_cloud_regions", "stage_id": "qualification_volume_deployment", "macro_stages": [ "cloud_deployment_demand" ], "supplier_relationship_state": "known", "commercial_state": "provider_reported_regional_availability", "qualification_state": "cloud_service_available", "deployment_geography": "Selected CoreWeave regions, including US-WEST-01A", "manufacturing_geography": null, "source_ids": [ "us-ref-source-coreweave-gb300" ], "summary": "CoreWeave documents GB300 NVL72 availability in selected regions including US-WEST-01A.", "boundary": "The named deployment region is not manufacturing geography and does not establish fleet size, availability everywhere, customer allocation, or accepted-workload results.", "unknowns": [ "fleet size by region", "capacity and customer allocation", "accepted-workload economics" ], "relationship_id": "us-rel-gb300-coreweave-regional-ga", "record_type": "relationship", "from": "nvidia-gb300-nvl72", "to": "coreweave", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-coreweave-gb300", "url": "https://docs.coreweave.com/changelog/release-notes/gb300-nvl72", "title": "CoreWeave GB300 NVL72 release note", "publisher": "CoreWeave", "primary_status": "primary" } ] }, { "id": "us-rel-rubin-coreweave-bringup", "from_entity_id": "nvidia-vera-rubin-nvl72", "to_entity_id": "coreweave", "relationship_scope": "product_specific", "product_id": "nvidia-vera-rubin-nvl72", "product_family_id": null, "affected_product_ids": [ "nvidia-vera-rubin-nvl72" ], "edge_category": "cloud", "relationship_type": "operational_system_bringup", "stage_id": "qualification_volume_deployment", "macro_stages": [ "cloud_deployment_demand" ], "supplier_relationship_state": "partial", "commercial_state": "provider_reported_bringup", "qualification_state": "operational_validation_not_general_availability", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-coreweave-rubin" ], "summary": "CoreWeave reports operational bring-up of a Vera Rubin NVL72 system.", "boundary": "Bring-up is an operational validation receipt, not broad general availability, fleet scale, customer acceptance, or production workload economics.", "unknowns": [ "general-availability date", "fleet and regional capacity", "customer acceptance" ], "relationship_id": "us-rel-rubin-coreweave-bringup", "record_type": "relationship", "from": "nvidia-vera-rubin-nvl72", "to": "coreweave", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-coreweave-rubin", "url": "https://www.coreweave.com/news/coreweave-completes-industry-first-bring-up-of-nvidia-vera-rubin-nvl72", "title": "CoreWeave Vera Rubin NVL72 bring-up", "publisher": "CoreWeave", "primary_status": "primary" } ] }, { "id": "us-rel-mi300x-azure-ga", "from_entity_id": "amd-instinct-mi300x", "to_entity_id": "microsoft-azure", "relationship_scope": "product_specific", "product_id": "amd-instinct-mi300x", "product_family_id": null, "affected_product_ids": [ "amd-instinct-mi300x" ], "edge_category": "cloud", "relationship_type": "generally_available_cloud_vm", "stage_id": "qualification_volume_deployment", "macro_stages": [ "cloud_deployment_demand" ], "supplier_relationship_state": "known", "commercial_state": "provider_reported_general_availability", "qualification_state": "cloud_service_available", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-azure-mi300x" ], "summary": "Microsoft states general availability of Azure ND MI300X v5 virtual machines using eight MI300X accelerators.", "boundary": "General availability does not establish capacity in every region, customer allocation, upstream supplier allocation, or accepted-workload results.", "unknowns": [ "capacity by region", "customer allocation", "accepted-workload economics" ], "relationship_id": "us-rel-mi300x-azure-ga", "record_type": "relationship", "from": "amd-instinct-mi300x", "to": "microsoft-azure", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-azure-mi300x", "url": "https://azure.microsoft.com/en-us/blog/unleashing-innovation-the-new-era-of-compute-powering-azure-ai-solutions/", "title": "Azure ND MI300X v5 general availability", "publisher": "Microsoft Azure", "primary_status": "primary" } ] }, { "id": "us-rel-mi355x-oracle-ga", "from_entity_id": "amd-instinct-mi355x", "to_entity_id": "oracle-cloud-infrastructure", "relationship_scope": "product_specific", "product_id": "amd-instinct-mi355x", "product_family_id": null, "affected_product_ids": [ "amd-instinct-mi355x" ], "edge_category": "cloud", "relationship_type": "generally_available_cloud_instance", "stage_id": "qualification_volume_deployment", "macro_stages": [ "cloud_deployment_demand" ], "supplier_relationship_state": "known", "commercial_state": "provider_reported_general_availability", "qualification_state": "cloud_service_available", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-oracle-mi355x" ], "summary": "Oracle states general availability of OCI Compute instances using AMD Instinct MI355X accelerators.", "boundary": "General availability does not establish capacity in every region, customer allocation, upstream supplier allocation, or accepted-workload results.", "unknowns": [ "capacity by region", "customer allocation", "accepted-workload economics" ], "relationship_id": "us-rel-mi355x-oracle-ga", "record_type": "relationship", "from": "amd-instinct-mi355x", "to": "oracle-cloud-infrastructure", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-oracle-mi355x", "url": "https://www.oracle.com/news/announcement/ai-world-oracle-and-amd-expand-partnership-to-help-customers-achieve-next-generation-ai-scale-2025-10-14/", "title": "OCI Compute with AMD Instinct MI355X", "publisher": "Oracle", "primary_status": "primary" } ] }, { "id": "us-rel-gb200-vertiv-reference", "from_entity_id": "nvidia-gb200-nvl72", "to_entity_id": "vertiv", "relationship_scope": "reference_design", "product_id": "nvidia-gb200-nvl72", "product_family_id": null, "affected_product_ids": [ "nvidia-gb200-nvl72" ], "edge_category": "reference_design", "relationship_type": "co_developed_power_cooling_blueprint", "stage_id": "power_cooling", "macro_stages": [ "power_cooling_facilities" ], "supplier_relationship_state": "not_applicable", "commercial_state": "published_reference_blueprint", "qualification_state": "reference_design_only", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-vertiv-gb200" ], "summary": "Vertiv reports co-development with NVIDIA of a power and cooling blueprint for GB200 NVL72.", "boundary": "A reference blueprint is not a product-specific purchase, installed supplier, exclusive selection, shipment, or customer-acceptance record.", "unknowns": [ "installed supplier by deployment", "purchase and shipment volume", "customer acceptance" ], "relationship_id": "us-rel-gb200-vertiv-reference", "record_type": "relationship", "from": "nvidia-gb200-nvl72", "to": "vertiv", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-vertiv-gb200", "url": "https://www.vertiv.com/en-emea/about/news-and-events/news-releases/vertiv-codevelops-with-nvidia-complete-power-and-cooling-blueprint-for--nvidia-gb200-nvl72-platform/", "title": "Vertiv GB200 NVL72 power and cooling blueprint", "publisher": "Vertiv", "primary_status": "primary" } ] }, { "id": "us-rel-gb300-vertiv-reference", "from_entity_id": "nvidia-gb300-nvl72", "to_entity_id": "vertiv", "relationship_scope": "reference_design", "product_id": "nvidia-gb300-nvl72", "product_family_id": null, "affected_product_ids": [ "nvidia-gb300-nvl72" ], "edge_category": "reference_design", "relationship_type": "published_power_cooling_reference_architecture", "stage_id": "power_cooling", "macro_stages": [ "power_cooling_facilities" ], "supplier_relationship_state": "not_applicable", "commercial_state": "published_reference_architecture", "qualification_state": "reference_design_only", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-vertiv-gb300" ], "summary": "Vertiv reports a power and cooling reference architecture for GB300 NVL72.", "boundary": "A reference architecture is not a product-specific purchase, installed supplier, exclusive selection, shipment, or customer-acceptance record.", "unknowns": [ "installed supplier by deployment", "purchase and shipment volume", "customer acceptance" ], "relationship_id": "us-rel-gb300-vertiv-reference", "record_type": "relationship", "from": "nvidia-gb300-nvl72", "to": "vertiv", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-vertiv-gb300", "url": "https://www.vertiv.com/en-in/about/news-and-events/news-releases/vertiv-develops-energy-efficient-cooling-and-power-reference-architecture-for-the-nvidia-gb300-nvl72/", "title": "Vertiv GB300 NVL72 power and cooling reference architecture", "publisher": "Vertiv", "primary_status": "primary" } ] }, { "id": "us-rel-amd-tongfu-company-atmp", "from_entity_id": "amd", "to_entity_id": "tongfu-microelectronics", "relationship_scope": "company_level", "product_id": null, "product_family_id": null, "affected_product_ids": [], "edge_category": "company_level", "relationship_type": "company_level_assembly_test_mark_pack_services", "stage_id": "assembly_test", "macro_stages": [ "advanced_packaging_osat", "inspection_metrology_test" ], "supplier_relationship_state": "known", "commercial_state": "company_supplier_disclosure", "qualification_state": "product_allocation_not_disclosed", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-amd-2025-10k" ], "summary": "AMD reports assembly, test, mark, and pack services from joint ventures majority-owned by Tongfu affiliates.", "boundary": "This company-level edge does not assign MI300X, MI325X, MI350X, MI355X, a facility, package technology, lot, volume, or customer shipment to Tongfu.", "unknowns": [ "named product allocation", "facility and package allocation", "volume by product" ], "relationship_id": "us-rel-amd-tongfu-company-atmp", "record_type": "relationship", "from": "amd", "to": "tongfu-microelectronics", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-amd-2025-10k", "url": "https://ir.amd.com/financial-information/sec-filings/content/0000002488-26-000018/amd-20251227.htm", "title": "AMD 2025 Form 10-K", "publisher": "Advanced Micro Devices, Inc.", "primary_status": "primary" } ] }, { "id": "us-rel-nvidia-hon-hai-company-services", "from_entity_id": "nvidia", "to_entity_id": "hon-hai", "relationship_scope": "company_level", "product_id": null, "product_family_id": null, "affected_product_ids": [], "edge_category": "company_level", "relationship_type": "company_level_assembly_test_packaging_system_services", "stage_id": "assembly_test", "macro_stages": [ "advanced_packaging_osat", "systems_integration" ], "supplier_relationship_state": "known", "commercial_state": "company_supplier_disclosure", "qualification_state": "product_allocation_not_disclosed", "deployment_geography": null, "manufacturing_geography": null, "source_ids": [ "us-ref-source-nvidia-2026-10k" ], "summary": "NVIDIA names Hon Hai among suppliers used for assembly, testing, packaging, and system-level work.", "boundary": "This company-level edge does not assign B200, B300, GB200, GB300, Rubin, a facility, work scope, lot, volume, or customer shipment to Hon Hai.", "unknowns": [ "named product allocation", "facility and work-scope allocation", "volume by product" ], "relationship_id": "us-rel-nvidia-hon-hai-company-services", "record_type": "relationship", "from": "nvidia", "to": "hon-hai", "evidence_state": "CONFIRMED_PRIMARY", "public_evidence_state": "official", "source_refs": [ { "source_id": "us-ref-source-nvidia-2026-10k", "url": "https://www.sec.gov/Archives/edgar/data/1045810/000104581026000021/nvda-20260125.htm", "title": "NVIDIA fiscal 2026 Form 10-K", "publisher": "NVIDIA Corporation", "primary_status": "primary" } ] } ], "sources": [ { "id": "us-source-synopsys", "source_id": "us-source-synopsys", "record_type": "source", "title": "Synopsys — EDA, verification, and semiconductor IP", "label": "Synopsys — EDA, verification, and semiconductor IP", "publisher": "Synopsys, Inc.", "url": "https://www.synopsys.com/", "source_type": "company_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "A current commercial EDA, verification, and IP portfolio.", "does_not_prove": "Use by a named accelerator, process qualification, capacity, or U.S.-origin supply completeness.", "limitations": [ "Use by a named accelerator, process qualification, capacity, or U.S.-origin supply completeness." ] }, { "id": "us-source-cadence", "source_id": "us-source-cadence", "record_type": "source", "title": "Cadence — Intelligent System Design", "label": "Cadence — Intelligent System Design", "publisher": "Cadence Design Systems, Inc.", "url": "https://www.cadence.com/en_US/home.html", "source_type": "company_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "A current commercial computational-design portfolio.", "does_not_prove": "Use in a named accelerator or qualification for a named process.", "limitations": [ "Use in a named accelerator or qualification for a named process." ] }, { "id": "us-source-arm", "source_id": "us-source-arm", "record_type": "source", "title": "Arm Holdings plc 2025 annual report", "label": "Arm Holdings plc 2025 annual report", "publisher": "Arm Holdings plc", "url": "https://www.sec.gov/Archives/edgar/data/1973239/000197323925000035/armholdingsplcukannualre.htm", "source_type": "regulatory_filing", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "United Kingdom headquarters, Japanese ultimate control, and commercial IP activity.", "does_not_prove": "A current license or use by a named accelerator.", "limitations": [ "A current license or use by a named accelerator." ] }, { "id": "us-source-nvidia", "source_id": "us-source-nvidia", "record_type": "source", "title": "NVIDIA — Data Center", "label": "NVIDIA — Data Center", "publisher": "NVIDIA Corporation", "url": "https://www.nvidia.com/en-us/data-center/", "source_type": "company_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "A current platform spanning accelerators, systems, networking, and software.", "does_not_prove": "Who fabricates, packages, tests, or supplies memory for a particular product.", "limitations": [ "Who fabricates, packages, tests, or supplies memory for a particular product." ] }, { "id": "us-source-amd", "source_id": "us-source-amd", "record_type": "source", "title": "AMD 2025 Form 10-K", "label": "AMD 2025 Form 10-K", "publisher": "Advanced Micro Devices, Inc.", "url": "https://ir.amd.com/financial-information/sec-filings/content/0000002488-26-000018/amd-20251227.htm", "source_type": "regulatory_filing", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "Commercial data-center processors, accelerators, and related computing activity.", "does_not_prove": "A product-specific foundry, HBM, package, substrate, or equipment supplier.", "limitations": [ "A product-specific foundry, HBM, package, substrate, or equipment supplier." ] }, { "id": "us-source-intel", "source_id": "us-source-intel", "record_type": "source", "title": "Intel Foundry — Manufacturing", "label": "Intel Foundry — Manufacturing", "publisher": "Intel Corporation", "url": "https://www.intel.com/content/www/us/en/foundry/manufacturing.html", "source_type": "company_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "Operating fabrication and assembly/test capabilities, including U.S. manufacturing.", "does_not_prove": "Qualification, yield, or production for an unnamed customer.", "limitations": [ "Qualification, yield, or production for an unnamed customer." ] }, { "id": "us-source-globalfoundries", "source_id": "us-source-globalfoundries", "record_type": "source", "title": "GlobalFoundries", "label": "GlobalFoundries", "publisher": "GlobalFoundries Inc.", "url": "https://gf.com/", "source_type": "company_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "An operating commercial foundry business.", "does_not_prove": "Leading-edge accelerator fabrication or a named customer relationship.", "limitations": [ "Leading-edge accelerator fabrication or a named customer relationship." ] }, { "id": "us-source-tsmc", "source_id": "us-source-tsmc", "record_type": "source", "title": "TSMC — About TSMC", "label": "TSMC — About TSMC", "publisher": "Taiwan Semiconductor Manufacturing Company Limited", "url": "https://www.tsmc.com/english/aboutTSMC", "source_type": "company_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "A dedicated commercial semiconductor foundry and technology portfolio.", "does_not_prove": "Fabrication, packaging, allocation, or qualification for NVIDIA, AMD, or another named product.", "limitations": [ "Fabrication, packaging, allocation, or qualification for NVIDIA, AMD, or another named product." ] }, { "id": "us-source-samsung-electronics", "source_id": "us-source-samsung-electronics", "record_type": "source", "title": "Samsung Foundry — Company Info", "label": "Samsung Foundry — Company Info", "publisher": "Samsung Electronics Co., Ltd.", "url": "https://semiconductor.samsung.com/foundry/about-samsung-foundry/company-info/", "source_type": "company_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "A commercial foundry network with advanced and legacy manufacturing capabilities.", "does_not_prove": "A named accelerator customer, HBM supply relationship, qualification, or allocated capacity.", "limitations": [ "A named accelerator customer, HBM supply relationship, qualification, or allocated capacity." ] }, { "id": "us-source-asml", "source_id": "us-source-asml", "record_type": "source", "title": "ASML 2025 annual report", "label": "ASML 2025 annual report", "publisher": "ASML Holding N.V.", "url": "https://www.asml.com/en/investors/annual-report/2025/strategy-and-stories", "source_type": "company_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "Commercial EUV, DUV, and metrology system capability.", "does_not_prove": "Placement at a particular fab or use for a named accelerator.", "limitations": [ "Placement at a particular fab or use for a named accelerator." ] }, { "id": "us-source-canon", "source_id": "us-source-canon", "record_type": "source", "title": "Canon — Semiconductor Manufacturing Equipment", "label": "Canon — Semiconductor Manufacturing Equipment", "publisher": "Canon Inc.", "url": "https://www.usa.canon.com/business/semiconductor", "source_type": "company_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "A current commercial semiconductor-equipment portfolio.", "does_not_prove": "Technical equivalence to EUV or qualification at a named fab.", "limitations": [ "Technical equivalence to EUV or qualification at a named fab." ] }, { "id": "us-source-applied-materials", "source_id": "us-source-applied-materials", "record_type": "source", "title": "Applied Materials — Company FAQ", "label": "Applied Materials — Company FAQ", "publisher": "Applied Materials, Inc.", "url": "https://www.appliedmaterials.com/in/en/frequently-asked-questions.html", "source_type": "company_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "A broad commercial wafer-fabrication-equipment portfolio.", "does_not_prove": "Installation or qualification at a particular fab.", "limitations": [ "Installation or qualification at a particular fab." ] }, { "id": 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"Supply or qualification for a named fab or accelerator.", "limitations": [ "Supply or qualification for a named fab or accelerator." ] }, { "id": "us-source-shin-etsu", "source_id": "us-source-shin-etsu", "record_type": "source", "title": "Shin-Etsu — Silicon Wafers", "label": "Shin-Etsu — Silicon Wafers", "publisher": "Shin-Etsu Chemical Co., Ltd.", "url": "https://www.shinetsu.co.jp/en/products/semiconductor-silicon-business/silicon-wafers/", "source_type": "company_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "Commercial manufacture and product types of semiconductor silicon wafers.", "does_not_prove": "Supply or qualification for a named foundry or accelerator.", "limitations": [ "Supply or qualification for a named foundry or accelerator." ] }, { "id": "us-source-micron", "source_id": "us-source-micron", "record_type": "source", "title": "Micron — Corporate Profile", "label": "Micron — 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"title": "NVIDIA Blackwell platform announcement", "label": "NVIDIA Blackwell platform announcement", "publisher": "NVIDIA", "url": "https://nvidianews.nvidia.com/news/nvidia-blackwell-platform-arrives-to-power-a-new-era-of-computing", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named GB200 NVL72 record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-nvidia-gb300-nvl72-1", "source_id": "us-source-product-nvidia-gb300-nvl72-1", "record_type": "source", "title": "NVIDIA GB300 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"https://www.nvidia.com/en-us/data-center/dgx-gb300/", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named GB300 NVL72 record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-nvidia-gb300-nvl72-3", "source_id": "us-source-product-nvidia-gb300-nvl72-3", "record_type": "source", "title": "NVIDIA Mission Control release notes", "label": "NVIDIA Mission Control release notes", "publisher": "NVIDIA", "url": "https://docs.nvidia.com/mission-control/docs/systems-quick-start-guide/2.1.0/nmc-release-notes.html", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named GB300 NVL72 record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-nvidia-gb300-nvl72-4", "source_id": "us-source-product-nvidia-gb300-nvl72-4", "record_type": "source", "title": "SK hynix GTC 2026 NVIDIA memory disclosure", "label": "SK hynix GTC 2026 NVIDIA memory disclosure", "publisher": "NVIDIA", "url": "https://news.skhynix.com/en/gtc-2026-ai-partnership/", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named GB300 NVL72 record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-nvidia-vera-rubin-nvl72-1", "source_id": "us-source-product-nvidia-vera-rubin-nvl72-1", "record_type": "source", "title": "NVIDIA Vera Rubin NVL72", "label": "NVIDIA Vera Rubin NVL72", "publisher": "NVIDIA", "url": "https://www.nvidia.com/en-us/data-center/vera-rubin-nvl72/", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named Vera Rubin NVL72 record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-nvidia-vera-rubin-nvl72-2", "source_id": "us-source-product-nvidia-vera-rubin-nvl72-2", "record_type": "source", "title": "NVIDIA Vera Rubin production release", "label": "NVIDIA Vera Rubin production release", "publisher": "NVIDIA", "url": "https://nvidianews.nvidia.com/news/vera-rubin-full-production-agentic-ai-factory", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named Vera Rubin NVL72 record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-nvidia-vera-rubin-nvl72-3", "source_id": "us-source-product-nvidia-vera-rubin-nvl72-3", "record_type": "source", "title": "NVIDIA Rubin platform announcement", "label": "NVIDIA Rubin platform announcement", "publisher": "NVIDIA", "url": "https://nvidianews.nvidia.com/news/rubin-platform-ai-supercomputer", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named Vera Rubin NVL72 record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-nvidia-vera-rubin-nvl72-4", "source_id": "us-source-product-nvidia-vera-rubin-nvl72-4", "record_type": "source", "title": "NVIDIA NVLink 6", "label": "NVIDIA NVLink 6", "publisher": "NVIDIA", "url": "https://www.nvidia.com/en-us/data-center/nvlink/", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named Vera Rubin NVL72 record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-nvidia-vera-rubin-nvl72-5", "source_id": "us-source-product-nvidia-vera-rubin-nvl72-5", "record_type": "source", "title": "SK hynix GTC 2026 NVIDIA memory disclosure", "label": "SK hynix GTC 2026 NVIDIA memory disclosure", "publisher": "NVIDIA", "url": "https://news.skhynix.com/en/gtc-2026-ai-partnership/", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named Vera Rubin NVL72 record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-amd-instinct-mi300x-1", "source_id": "us-source-product-amd-instinct-mi300x-1", "record_type": "source", "title": "AMD Instinct MI300X", "label": "AMD Instinct MI300X", "publisher": "AMD", "url": "https://www.amd.com/en/products/accelerators/instinct/mi300/mi300x.html", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named Instinct MI300X record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-amd-instinct-mi325x-1", "source_id": "us-source-product-amd-instinct-mi325x-1", "record_type": "source", "title": "AMD Instinct MI325X", "label": "AMD Instinct MI325X", "publisher": "AMD", "url": "https://www.amd.com/en/products/accelerators/instinct/mi300/mi325x.html", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named Instinct MI325X record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-amd-instinct-mi350x-1", "source_id": "us-source-product-amd-instinct-mi350x-1", "record_type": "source", "title": "AMD Instinct MI350X", "label": "AMD Instinct MI350X", "publisher": "AMD", "url": "https://www.amd.com/en/products/accelerators/instinct/mi350/mi350x.html", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named Instinct MI350X record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-amd-instinct-mi355x-1", "source_id": "us-source-product-amd-instinct-mi355x-1", "record_type": "source", "title": "AMD Instinct MI355X", "label": "AMD Instinct MI355X", "publisher": "AMD", "url": "https://www.amd.com/en/products/accelerators/instinct/mi350/mi355x.html", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named Instinct MI355X record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-intel-gaudi-3-1", "source_id": "us-source-product-intel-gaudi-3-1", "record_type": "source", "title": "Intel Gaudi", "label": "Intel Gaudi", "publisher": "Intel", "url": "https://www.intel.com/content/www/us/en/products/details/processors/ai-accelerators/gaudi.html", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named Gaudi 3 record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-intel-arc-b-series-1", "source_id": "us-source-product-intel-arc-b-series-1", "record_type": "source", "title": "Intel Arc graphics", "label": "Intel Arc graphics", "publisher": "Intel", "url": "https://www.intel.com/content/www/us/en/products/docs/discrete-gpus/arc/desktop/b-series/overview.html", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named Arc B-Series record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-cerebras-wse-3-1", "source_id": "us-source-product-cerebras-wse-3-1", "record_type": "source", "title": "Cerebras WSE-3 announcement", "label": "Cerebras WSE-3 announcement", "publisher": "Cerebras", "url": "https://www.cerebras.ai/press-release/cerebras-announces-third-generation-wafer-scale-engine/", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named WSE-3 record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-groq-lpu-1", "source_id": "us-source-product-groq-lpu-1", "record_type": "source", "title": "Groq LPU architecture", "label": "Groq LPU architecture", "publisher": "Groq", "url": "https://groq.com/lpu-architecture", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named LPU / GroqRack record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-google-tpu-1", "source_id": "us-source-product-google-tpu-1", "record_type": "source", "title": "Google Cloud TPU documentation", "label": "Google Cloud TPU documentation", "publisher": "Google", "url": "https://cloud.google.com/tpu/docs/system-architecture-tpu-vm", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named TPU v5e / v5p / Trillium / Ironwood record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-aws-trainium-inferentia-1", "source_id": "us-source-product-aws-trainium-inferentia-1", "record_type": "source", "title": "AWS Trainium", "label": "AWS Trainium", "publisher": "Amazon Web Services", "url": "https://aws.amazon.com/machine-learning/trainium/", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named Trainium / Inferentia record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-aws-trainium-inferentia-2", "source_id": "us-source-product-aws-trainium-inferentia-2", "record_type": "source", "title": "AWS Inferentia", "label": "AWS Inferentia", "publisher": "Amazon Web Services", "url": "https://aws.amazon.com/machine-learning/inferentia/", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named Trainium / Inferentia record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-microsoft-maia-1", "source_id": "us-source-product-microsoft-maia-1", "record_type": "source", "title": "Microsoft Maia 100", "label": "Microsoft Maia 100", "publisher": "Microsoft", "url": "https://news.microsoft.com/source/features/ai/in-house-chips-silicon-to-service-to-meet-ai-demand/", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named Maia 100 / Maia 200 record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-source-product-meta-mtia-1", "source_id": "us-source-product-meta-mtia-1", "record_type": "source", "title": "Meta next-generation MTIA", "label": "Meta next-generation MTIA", "publisher": "Meta", "url": "https://ai.meta.com/blog/next-generation-meta-training-inference-accelerator-AI-MTIA/", "source_type": "company_product_page", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "proves": "The named MTIA record and the specifications explicitly stated on the cited company source.", "does_not_prove": "A complete product-specific foundry, equipment, material, memory, packaging, assembly, qualification, volume, or deployment path.", "limitations": [ "Company product evidence is not a complete bill of materials, supplier allocation, qualification receipt, shipment receipt, or independent workload measurement." ] }, { "id": "us-ref-source-nvidia-blackwell-platform", "title": "NVIDIA Blackwell platform announcement", "publisher": "NVIDIA", "url": "https://nvidianews.nvidia.com/news/nvidia-blackwell-platform-arrives-to-power-a-new-era-of-computing", "proves": "NVIDIA states that Blackwell GPUs use a custom TSMC 4NP process.", "does_not_prove": "Facility, lot, yield, volume, package supplier, or manufacturing origin of every rack component.", "source_id": "us-ref-source-nvidia-blackwell-platform", "record_type": "source", "label": "NVIDIA Blackwell platform announcement", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Facility, lot, yield, volume, package supplier, or manufacturing origin of every rack component." ] }, { "id": "us-ref-source-nvidia-blackwell-ultra", "title": "Inside NVIDIA Blackwell Ultra", "publisher": "NVIDIA", "url": "https://developer.nvidia.com/blog/inside-nvidia-blackwell-ultra-the-chip-powering-the-ai-factory-era/", "proves": "NVIDIA states that Blackwell Ultra is manufactured using TSMC 4NP.", "does_not_prove": "Facility, lot, yield, volume, package supplier, or manufacturing origin of every GB300 rack component.", "source_id": "us-ref-source-nvidia-blackwell-ultra", "record_type": "source", "label": "Inside NVIDIA Blackwell Ultra", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Facility, lot, yield, volume, package supplier, or manufacturing origin of every GB300 rack component." ] }, { "id": "us-ref-source-nvidia-gb200", "title": "NVIDIA GB200 NVL72 product page", "publisher": "NVIDIA", "url": "https://www.nvidia.com/en-us/data-center/gb200-nvl72/", "proves": "The named rack contains Blackwell GPUs and Grace CPUs.", "does_not_prove": "A complete rack bill of materials, supplier allocation, shipment volume, or customer acceptance.", "source_id": "us-ref-source-nvidia-gb200", "record_type": "source", "label": "NVIDIA GB200 NVL72 product page", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "A complete rack bill of materials, supplier allocation, shipment volume, or customer acceptance." ] }, { "id": "us-ref-source-nvidia-gb300", "title": "NVIDIA GB300 NVL72 product page", "publisher": "NVIDIA", "url": "https://www.nvidia.com/en-us/data-center/gb300-nvl72/", "proves": "The named rack contains Blackwell Ultra GPUs and Grace CPUs.", "does_not_prove": "A complete rack bill of materials, supplier allocation, shipment volume, or customer acceptance.", "source_id": "us-ref-source-nvidia-gb300", "record_type": "source", "label": "NVIDIA GB300 NVL72 product page", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "A complete rack bill of materials, supplier allocation, shipment volume, or customer acceptance." ] }, { "id": "us-ref-source-amd-mi300x", "title": "AMD Instinct MI300X product page", "publisher": "AMD", "url": "https://www.amd.com/en/products/accelerators/instinct/mi300/mi300x.html", "proves": "AMD lists MI300X as an exact product with TSMC 5 nm and 6 nm process technology, 192 GB HBM3, and 5.3 TB/s peak memory bandwidth.", "does_not_prove": "Facility, lot, memory supplier, package supplier, shipment volume, or customer acceptance.", "source_id": "us-ref-source-amd-mi300x", "record_type": "source", "label": "AMD Instinct MI300X product page", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Facility, lot, memory supplier, package supplier, shipment volume, or customer acceptance." ] }, { "id": "us-ref-source-amd-mi325x", "title": "AMD Instinct MI325X product page", "publisher": "AMD", "url": "https://www.amd.com/en/products/accelerators/instinct/mi300/mi325x.html", "proves": "AMD lists MI325X as an exact product with TSMC 5 nm and 6 nm process technology, 256 GB HBM3E, and 6 TB/s peak memory bandwidth.", "does_not_prove": "Facility, lot, memory supplier, package supplier, shipment volume, or customer acceptance.", "source_id": "us-ref-source-amd-mi325x", "record_type": "source", "label": "AMD Instinct MI325X product page", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Facility, lot, memory supplier, package supplier, shipment volume, or customer acceptance." ] }, { "id": "us-ref-source-amd-mi350x", "title": "AMD Instinct MI350X product page", "publisher": "AMD", "url": "https://www.amd.com/en/products/accelerators/instinct/mi350/mi350x.html", "proves": "AMD lists MI350X as an exact product with TSMC 3 nm and 6 nm process technology, 288 GB HBM3E, and 8 TB/s peak memory bandwidth.", "does_not_prove": "Facility, lot, memory supplier, package supplier, shipment volume, or customer acceptance.", "source_id": "us-ref-source-amd-mi350x", "record_type": "source", "label": "AMD Instinct MI350X product page", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Facility, lot, memory supplier, package supplier, shipment volume, or customer acceptance." ] }, { "id": "us-ref-source-amd-mi355x", "title": "AMD Instinct MI355X product page", "publisher": "AMD", "url": "https://www.amd.com/en/products/accelerators/instinct/mi350/mi355x.html", "proves": "AMD lists MI355X as an exact product with TSMC 3 nm and 6 nm process technology, 288 GB HBM3E, and 8 TB/s peak memory bandwidth.", "does_not_prove": "Facility, lot, memory supplier, package supplier, shipment volume, or customer acceptance.", "source_id": "us-ref-source-amd-mi355x", "record_type": "source", "label": "AMD Instinct MI355X product page", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Facility, lot, memory supplier, package supplier, shipment volume, or customer acceptance." ] }, { "id": "us-ref-source-micron-nvidia-gtc", "title": "Micron memory designed for NVIDIA platforms", "publisher": "Micron Technology", "url": "https://investors.micron.com/news-releases/news-release-details/micron-innovates-data-center-edge-nvidia", "proves": "Micron states its 12-high HBM3E is designed into HGX B300 and GB300, and its 8-high HBM3E is available for HGX B200 and GB200.", "does_not_prove": "Exclusivity, installation in every system, lot allocation, volume, or customer acceptance.", "source_id": "us-ref-source-micron-nvidia-gtc", "record_type": "source", "label": "Micron memory designed for NVIDIA platforms", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Exclusivity, installation in every system, lot allocation, volume, or customer acceptance." ] }, { "id": "us-ref-source-sk-hynix-nvidia-gtc", "title": "SK hynix NVIDIA memory partnership at GTC 2026", "publisher": "SK hynix", "url": "https://news.skhynix.com/en/gtc-2026-ai-partnership/", "proves": "SK hynix reports HBM3E on a live GB300 module and planned HBM4 adoption for Rubin.", "does_not_prove": "Exclusivity, full rack allocation, production volume, final Rubin supplier mix, or customer acceptance.", "source_id": "us-ref-source-sk-hynix-nvidia-gtc", "record_type": "source", "label": "SK hynix NVIDIA memory partnership at GTC 2026", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Exclusivity, full rack allocation, production volume, final Rubin supplier mix, or customer acceptance." ] }, { "id": "us-ref-source-micron-rubin", "title": "Micron HBM4 designed for NVIDIA Vera Rubin", "publisher": "Micron Technology", "url": "https://investors.micron.com/news-releases/news-release-details/micron-high-volume-production-hbm4-designed-nvidia-vera-rubin", "proves": "Micron reports high-volume production and shipment of 12-high HBM4 designed for NVIDIA Vera Rubin.", "does_not_prove": "Exclusive supply, final rack allocation, installed customer systems, or customer acceptance.", "source_id": "us-ref-source-micron-rubin", "record_type": "source", "label": "Micron HBM4 designed for NVIDIA Vera Rubin", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Exclusive supply, final rack allocation, installed customer systems, or customer acceptance." ] }, { "id": "us-ref-source-micron-amd-mi350", "title": "Micron HBM designed into AMD Instinct MI350 Series", "publisher": "Micron Technology", "url": "https://investors.micron.com/news-releases/news-release-details/micron-hbm-designed-leading-amd-ai-platform", "proves": "Micron reports integration of its 12-high HBM3E into AMD Instinct MI350 Series solutions.", "does_not_prove": "That every MI350X or MI355X uses Micron, exclusivity, lot allocation, volume, or customer acceptance.", "source_id": "us-ref-source-micron-amd-mi350", "record_type": "source", "label": "Micron HBM designed into AMD Instinct MI350 Series", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "That every MI350X or MI355X uses Micron, exclusivity, lot allocation, volume, or customer acceptance." ] }, { "id": "us-ref-source-dell-xe9680", "title": "Dell PowerEdge XE9680 product page", "publisher": "Dell Technologies", "url": "https://www.dell.com/en-us/shop/ipovw/poweredge-xe9680", "proves": "Dell lists an eight-accelerator PowerEdge XE9680 configuration using AMD Instinct MI300X.", "does_not_prove": "Shipment volume, customer acceptance, upstream supplier allocation, or workload performance.", "source_id": "us-ref-source-dell-xe9680", "record_type": "source", "label": "Dell PowerEdge XE9680 product page", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Shipment volume, customer acceptance, upstream supplier allocation, or workload performance." ] }, { "id": "us-ref-source-dell-xe9785", "title": "Dell PowerEdge XE9785 product page", "publisher": "Dell Technologies", "url": "https://www.dell.com/en-us/shop/ipovw/poweredge-xe9785", "proves": "Dell lists PowerEdge XE9785 configurations using eight AMD Instinct MI355X accelerators or an NVIDIA HGX B300 platform.", "does_not_prove": "Shipment volume, customer acceptance, upstream supplier allocation, or workload performance.", "source_id": "us-ref-source-dell-xe9785", "record_type": "source", "label": "Dell PowerEdge XE9785 product page", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Shipment volume, customer acceptance, upstream supplier allocation, or workload performance." ] }, { "id": "us-ref-source-dell-gb300-coreweave", "title": "Dell delivers a GB300 NVL72 rack to CoreWeave", "publisher": "Dell Technologies", "url": "https://www.dell.com/en-us/blog/dell-delivers-market-s-first-nvidia-gb300-nvl72-to-coreweave/", "proves": "Dell reports assembly, testing, and U.S. deployment of a GB300 NVL72 rack for CoreWeave.", "does_not_prove": "Fleet-wide supplier allocation, shipment volume, customer acceptance, or manufacturing origin of every component.", "source_id": "us-ref-source-dell-gb300-coreweave", "record_type": "source", "label": "Dell delivers a GB300 NVL72 rack to CoreWeave", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Fleet-wide supplier allocation, shipment volume, customer acceptance, or manufacturing origin of every component." ] }, { "id": "us-ref-source-coreweave-b200", "title": "CoreWeave HGX B200 general availability", "publisher": "CoreWeave", "url": "https://www.coreweave.com/blog/coreweave-expands-its-nvidia-blackwell-fleet-with-generally-available-nvidia-hgx-b200-instances", "proves": "CoreWeave states general availability of NVIDIA HGX B200 instances.", "does_not_prove": "Fleet size, availability in every region, customer allocation, or accepted-workload results.", "source_id": "us-ref-source-coreweave-b200", "record_type": "source", "label": "CoreWeave HGX B200 general availability", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Fleet size, availability in every region, customer allocation, or accepted-workload results." ] }, { "id": "us-ref-source-coreweave-b300", "title": "CoreWeave HGX B300 general availability", "publisher": "CoreWeave", "url": "https://www.coreweave.com/blog/engineered-for-agentic-ai-nvidia-hgx-b300-on-coreweave-cloud", "proves": "CoreWeave states general availability of NVIDIA HGX B300 instances.", "does_not_prove": "Fleet size, availability in every region, customer allocation, or accepted-workload results.", "source_id": "us-ref-source-coreweave-b300", "record_type": "source", "label": "CoreWeave HGX B300 general availability", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Fleet size, availability in every region, customer allocation, or accepted-workload results." ] }, { "id": "us-ref-source-coreweave-gb200", "title": "CoreWeave GB200 NVL72 general availability", "publisher": "CoreWeave", "url": "https://investors.coreweave.com/news/news-details/2025/CoreWeave-First-Cloud-Provider-to-Announce-General-Availability-of-NVIDIA-GB200-NVL72-Instances/default.aspx", "proves": "CoreWeave states general availability of NVIDIA GB200 NVL72 instances.", "does_not_prove": "Fleet size, availability in every region, customer allocation, or accepted-workload results.", "source_id": "us-ref-source-coreweave-gb200", "record_type": "source", "label": "CoreWeave GB200 NVL72 general availability", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Fleet size, availability in every region, customer allocation, or accepted-workload results." ] }, { "id": "us-ref-source-coreweave-gb300", "title": "CoreWeave GB300 NVL72 release note", "publisher": "CoreWeave", "url": "https://docs.coreweave.com/changelog/release-notes/gb300-nvl72", "proves": "CoreWeave documents GB300 NVL72 availability in selected regions including US-WEST-01A.", "does_not_prove": "Fleet size, availability in every region, customer allocation, or accepted-workload results.", "source_id": "us-ref-source-coreweave-gb300", "record_type": "source", "label": "CoreWeave GB300 NVL72 release note", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Fleet size, availability in every region, customer allocation, or accepted-workload results." ] }, { "id": "us-ref-source-coreweave-rubin", "title": "CoreWeave Vera Rubin NVL72 bring-up", "publisher": "CoreWeave", "url": "https://www.coreweave.com/news/coreweave-completes-industry-first-bring-up-of-nvidia-vera-rubin-nvl72", "proves": "CoreWeave reports operational bring-up of a Vera Rubin NVL72 system.", "does_not_prove": "Broad general availability, fleet scale, final customer acceptance, or production workload economics.", "source_id": "us-ref-source-coreweave-rubin", "record_type": "source", "label": "CoreWeave Vera Rubin NVL72 bring-up", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Broad general availability, fleet scale, final customer acceptance, or production workload economics." ] }, { "id": "us-ref-source-azure-mi300x", "title": "Azure ND MI300X v5 general availability", "publisher": "Microsoft Azure", "url": "https://azure.microsoft.com/en-us/blog/unleashing-innovation-the-new-era-of-compute-powering-azure-ai-solutions/", "proves": "Microsoft states general availability of Azure ND MI300X v5 virtual machines using eight MI300X accelerators.", "does_not_prove": "Capacity in every region, customer allocation, upstream supplier allocation, or accepted-workload results.", "source_id": "us-ref-source-azure-mi300x", "record_type": "source", "label": "Azure ND MI300X v5 general availability", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Capacity in every region, customer allocation, upstream supplier allocation, or accepted-workload results." ] }, { "id": "us-ref-source-oracle-mi355x", "title": "OCI Compute with AMD Instinct MI355X", "publisher": "Oracle", "url": "https://www.oracle.com/news/announcement/ai-world-oracle-and-amd-expand-partnership-to-help-customers-achieve-next-generation-ai-scale-2025-10-14/", "proves": "Oracle states general availability of OCI Compute instances using AMD Instinct MI355X accelerators.", "does_not_prove": "Capacity in every region, customer allocation, upstream supplier allocation, or accepted-workload results.", "source_id": "us-ref-source-oracle-mi355x", "record_type": "source", "label": "OCI Compute with AMD Instinct MI355X", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Capacity in every region, customer allocation, upstream supplier allocation, or accepted-workload results." ] }, { "id": "us-ref-source-vertiv-gb200", "title": "Vertiv GB200 NVL72 power and cooling blueprint", "publisher": "Vertiv", "url": "https://www.vertiv.com/en-emea/about/news-and-events/news-releases/vertiv-codevelops-with-nvidia-complete-power-and-cooling-blueprint-for--nvidia-gb200-nvl72-platform/", "proves": "Vertiv reports co-development with NVIDIA of a power and cooling reference blueprint for GB200 NVL72.", "does_not_prove": "Selection in every shipped rack, exclusive supply, purchase volume, installation, or customer acceptance.", "source_id": "us-ref-source-vertiv-gb200", "record_type": "source", "label": "Vertiv GB200 NVL72 power and cooling blueprint", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Selection in every shipped rack, exclusive supply, purchase volume, installation, or customer acceptance." ] }, { "id": "us-ref-source-vertiv-gb300", "title": "Vertiv GB300 NVL72 power and cooling reference architecture", "publisher": "Vertiv", "url": "https://www.vertiv.com/en-in/about/news-and-events/news-releases/vertiv-develops-energy-efficient-cooling-and-power-reference-architecture-for-the-nvidia-gb300-nvl72/", "proves": "Vertiv reports a power and cooling reference architecture for GB300 NVL72.", "does_not_prove": "Selection in every shipped rack, exclusive supply, purchase volume, installation, or customer acceptance.", "source_id": "us-ref-source-vertiv-gb300", "record_type": "source", "label": "Vertiv GB300 NVL72 power and cooling reference architecture", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Selection in every shipped rack, exclusive supply, purchase volume, installation, or customer acceptance." ] }, { "id": "us-ref-source-amd-2025-10k", "title": "AMD 2025 Form 10-K", "publisher": "Advanced Micro Devices, Inc.", "url": "https://ir.amd.com/financial-information/sec-filings/content/0000002488-26-000018/amd-20251227.htm", "proves": "AMD reports company-level assembly, test, mark, and pack services from joint ventures majority-owned by Tongfu affiliates.", "does_not_prove": "Named product, facility, process, lot, volume, or customer allocation.", "source_id": "us-ref-source-amd-2025-10k", "record_type": "source", "label": "AMD 2025 Form 10-K", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Named product, facility, process, lot, volume, or customer allocation." ] }, { "id": "us-ref-source-nvidia-2026-10k", "title": "NVIDIA fiscal 2026 Form 10-K", "publisher": "NVIDIA Corporation", "url": "https://www.sec.gov/Archives/edgar/data/1045810/000104581026000021/nvda-20260125.htm", "proves": "NVIDIA names Hon Hai among company-level suppliers used for assembly, testing, packaging, and systems work.", "does_not_prove": "Named product, facility, process, lot, volume, or customer allocation.", "source_id": "us-ref-source-nvidia-2026-10k", "record_type": "source", "label": "NVIDIA fiscal 2026 Form 10-K", "source_type": "company_or_regulatory_primary", "primary_status": "primary", "public_evidence_state": "official", "access_state": "open", "date_checked": "2026-08-01", "limitations": [ "Named product, facility, process, lot, volume, or customer allocation." ] } ], "product_paths": [ { "product_id": "nvidia-blackwell-b200", "design_company_anchor_id": "nvidia", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "nvidia-blackwell-b200", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [ "us-rel-b200-coreweave-ga", "us-rel-b200-micron-hbm3e", "us-rel-b200-tsmc-4np" ], "source_ids": [ "us-ref-source-coreweave-b200", "us-ref-source-micron-nvidia-gtc", "us-ref-source-nvidia-blackwell-platform", "us-source-product-nvidia-blackwell-b200-1", "us-source-product-nvidia-blackwell-b200-2", "us-source-product-nvidia-blackwell-b200-3" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "nvidia-blackwell-b300", "design_company_anchor_id": "nvidia", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "nvidia-blackwell-b300", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [ "us-rel-b300-coreweave-ga", "us-rel-b300-dell-xe9785", "us-rel-b300-micron-hbm3e", "us-rel-b300-tsmc-4np" ], "source_ids": [ "us-ref-source-coreweave-b300", "us-ref-source-dell-xe9785", "us-ref-source-micron-nvidia-gtc", "us-ref-source-nvidia-blackwell-ultra", "us-source-product-nvidia-blackwell-b300-1", "us-source-product-nvidia-blackwell-b300-2", "us-source-product-nvidia-blackwell-b300-3" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "nvidia-gb200-nvl72", "design_company_anchor_id": "nvidia", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "nvidia-gb200-nvl72", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [ "us-rel-gb200-coreweave-ga", "us-rel-gb200-micron-hbm3e", "us-rel-gb200-tsmc-blackwell-component", "us-rel-gb200-vertiv-reference" ], "source_ids": [ "us-ref-source-coreweave-gb200", "us-ref-source-micron-nvidia-gtc", "us-ref-source-nvidia-blackwell-platform", "us-ref-source-nvidia-gb200", "us-ref-source-vertiv-gb200", "us-source-product-nvidia-gb200-nvl72-1", "us-source-product-nvidia-gb200-nvl72-2", "us-source-product-nvidia-gb200-nvl72-3", "us-source-product-nvidia-gb200-nvl72-4" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "nvidia-gb300-nvl72", "design_company_anchor_id": "nvidia", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "nvidia-gb300-nvl72", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [ "us-rel-gb300-coreweave-regional-ga", "us-rel-gb300-dell-coreweave-rack", "us-rel-gb300-micron-hbm3e", "us-rel-gb300-sk-hynix-hbm3e", "us-rel-gb300-tsmc-b300-component", "us-rel-gb300-vertiv-reference" ], "source_ids": [ "us-ref-source-coreweave-gb300", "us-ref-source-dell-gb300-coreweave", "us-ref-source-micron-nvidia-gtc", "us-ref-source-nvidia-blackwell-ultra", "us-ref-source-nvidia-gb300", "us-ref-source-sk-hynix-nvidia-gtc", "us-ref-source-vertiv-gb300", "us-source-product-nvidia-gb300-nvl72-1", "us-source-product-nvidia-gb300-nvl72-2", "us-source-product-nvidia-gb300-nvl72-3", "us-source-product-nvidia-gb300-nvl72-4" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "nvidia-vera-rubin-nvl72", "design_company_anchor_id": "nvidia", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "nvidia-vera-rubin-nvl72", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [ "us-rel-rubin-coreweave-bringup", "us-rel-rubin-micron-hbm4", "us-rel-rubin-sk-hynix-hbm4" ], "source_ids": [ "us-ref-source-coreweave-rubin", "us-ref-source-micron-rubin", "us-ref-source-sk-hynix-nvidia-gtc", "us-source-product-nvidia-vera-rubin-nvl72-1", "us-source-product-nvidia-vera-rubin-nvl72-2", "us-source-product-nvidia-vera-rubin-nvl72-3", "us-source-product-nvidia-vera-rubin-nvl72-4", "us-source-product-nvidia-vera-rubin-nvl72-5" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "amd-instinct-mi300x", "design_company_anchor_id": "amd", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "amd-instinct-mi300x", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [ "us-rel-mi300x-azure-ga", "us-rel-mi300x-dell-xe9680", "us-rel-mi300x-tsmc" ], "source_ids": [ "us-ref-source-amd-mi300x", "us-ref-source-azure-mi300x", "us-ref-source-dell-xe9680", "us-source-product-amd-instinct-mi300x-1" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "amd-instinct-mi325x", "design_company_anchor_id": "amd", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "amd-instinct-mi325x", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [ "us-rel-mi325x-tsmc" ], "source_ids": [ "us-ref-source-amd-mi325x", "us-source-product-amd-instinct-mi325x-1" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "amd-instinct-mi350x", "design_company_anchor_id": "amd", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "amd-instinct-mi350x", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [ "us-rel-mi350-series-micron-hbm3e", "us-rel-mi350x-tsmc" ], "source_ids": [ "us-ref-source-amd-mi350x", "us-ref-source-micron-amd-mi350", "us-source-product-amd-instinct-mi350x-1" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "amd-instinct-mi355x", "design_company_anchor_id": "amd", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "amd-instinct-mi355x", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [ "us-rel-mi350-series-micron-hbm3e", "us-rel-mi355x-dell-xe9785", "us-rel-mi355x-oracle-ga", "us-rel-mi355x-tsmc" ], "source_ids": [ "us-ref-source-amd-mi355x", "us-ref-source-dell-xe9785", "us-ref-source-micron-amd-mi350", "us-ref-source-oracle-mi355x", "us-source-product-amd-instinct-mi355x-1" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "intel-gaudi-3", "design_company_anchor_id": "intel", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "intel-gaudi-3", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [], "source_ids": [ "us-source-product-intel-gaudi-3-1" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "intel-arc-b-series", "design_company_anchor_id": "intel", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "intel-arc-b-series", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [], "source_ids": [ "us-source-product-intel-arc-b-series-1" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "cerebras-wse-3", "design_company_anchor_id": "cerebras", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "cerebras-wse-3", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [], "source_ids": [ "us-source-product-cerebras-wse-3-1" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "groq-lpu", "design_company_anchor_id": "groq", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "groq-lpu", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [], "source_ids": [ "us-source-product-groq-lpu-1" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "google-tpu", "design_company_anchor_id": "google", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "google-tpu", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [], "source_ids": [ "us-source-product-google-tpu-1" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "aws-trainium-inferentia", "design_company_anchor_id": "aws", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "aws-trainium-inferentia", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [], "source_ids": [ "us-source-product-aws-trainium-inferentia-1", "us-source-product-aws-trainium-inferentia-2" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "microsoft-maia", "design_company_anchor_id": "microsoft-azure", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "microsoft-maia", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [], "source_ids": [ "us-source-product-microsoft-maia-1" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." }, { "product_id": "meta-mtia", "design_company_anchor_id": "meta", "authoritative_endpoint": "./supply-chain-v1.json", "authoritative_product_path_key": "meta-mtia", "authoritative_reference_scope": "exact_product", "path_state": "authoritative_reference_with_local_relationship_supplement", "completion_state": "external_authoritative_reference_with_bounded_local_edges", "relationship_ids": [], "source_ids": [ "us-source-product-meta-mtia-1" ], "boundary": "This endpoint does not duplicate authoritative 15-stage statuses. Follow authoritative_endpoint for the exact product path; local relationship_ids add only the explicitly sourced U.S. reference edges and do not overwrite that path or close its unknowns." } ], "gaps": [ { "id": "us-gap-product-path-nvidia-blackwell-b200", "gap_id": "us-gap-product-path-nvidia-blackwell-b200", "record_type": "gap", "product_id": "nvidia-blackwell-b200", "authoritative_product_path_key": "nvidia-blackwell-b200", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "lithography", "wafer_equipment", "critical_materials", "assembly_test" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-nvidia-blackwell-b300", "gap_id": "us-gap-product-path-nvidia-blackwell-b300", "record_type": "gap", "product_id": "nvidia-blackwell-b300", "authoritative_product_path_key": "nvidia-blackwell-b300", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "logic_foundry_process", "lithography", "wafer_equipment", "critical_materials", "assembly_test" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-nvidia-gb200-nvl72", "gap_id": "us-gap-product-path-nvidia-gb200-nvl72", "record_type": "gap", "product_id": "nvidia-gb200-nvl72", "authoritative_product_path_key": "nvidia-gb200-nvl72", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "lithography", "wafer_equipment", "critical_materials", "assembly_test" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-nvidia-gb300-nvl72", "gap_id": "us-gap-product-path-nvidia-gb300-nvl72", "record_type": "gap", "product_id": "nvidia-gb300-nvl72", "authoritative_product_path_key": "nvidia-gb300-nvl72", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "logic_foundry_process", "lithography", "wafer_equipment", "critical_materials", "assembly_test" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-nvidia-vera-rubin-nvl72", "gap_id": "us-gap-product-path-nvidia-vera-rubin-nvl72", "record_type": "gap", "product_id": "nvidia-vera-rubin-nvl72", "authoritative_product_path_key": "nvidia-vera-rubin-nvl72", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "logic_foundry_process", "lithography", "wafer_equipment", "critical_materials", "package_provider", "assembly_test" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-amd-instinct-mi300x", "gap_id": "us-gap-product-path-amd-instinct-mi300x", "record_type": "gap", "product_id": "amd-instinct-mi300x", "authoritative_product_path_key": "amd-instinct-mi300x", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "lithography", "wafer_equipment", "critical_materials", "assembly_test", "power_cooling" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-amd-instinct-mi325x", "gap_id": "us-gap-product-path-amd-instinct-mi325x", "record_type": "gap", "product_id": "amd-instinct-mi325x", "authoritative_product_path_key": "amd-instinct-mi325x", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "lithography", "wafer_equipment", "critical_materials", "assembly_test", "power_cooling" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-amd-instinct-mi350x", "gap_id": "us-gap-product-path-amd-instinct-mi350x", "record_type": "gap", "product_id": "amd-instinct-mi350x", "authoritative_product_path_key": "amd-instinct-mi350x", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "lithography", "wafer_equipment", "critical_materials", "assembly_test", "power_cooling" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-amd-instinct-mi355x", "gap_id": "us-gap-product-path-amd-instinct-mi355x", "record_type": "gap", "product_id": "amd-instinct-mi355x", "authoritative_product_path_key": "amd-instinct-mi355x", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "lithography", "wafer_equipment", "critical_materials", "assembly_test", "power_cooling" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-intel-gaudi-3", "gap_id": "us-gap-product-path-intel-gaudi-3", "record_type": "gap", "product_id": "intel-gaudi-3", "authoritative_product_path_key": "intel-gaudi-3", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "lithography", "wafer_equipment", "critical_materials", "assembly_test", "power_cooling" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-intel-arc-b-series", "gap_id": "us-gap-product-path-intel-arc-b-series", "record_type": "gap", "product_id": "intel-arc-b-series", "authoritative_product_path_key": "intel-arc-b-series", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "lithography", "wafer_equipment", "critical_materials", "assembly_test", "power_cooling" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-cerebras-wse-3", "gap_id": "us-gap-product-path-cerebras-wse-3", "record_type": "gap", "product_id": "cerebras-wse-3", "authoritative_product_path_key": "cerebras-wse-3", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "lithography", "wafer_equipment", "critical_materials", "assembly_test", "power_cooling" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-groq-lpu", "gap_id": "us-gap-product-path-groq-lpu", "record_type": "gap", "product_id": "groq-lpu", "authoritative_product_path_key": "groq-lpu", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "lithography", "wafer_equipment", "critical_materials", "assembly_test", "power_cooling" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-google-tpu", "gap_id": "us-gap-product-path-google-tpu", "record_type": "gap", "product_id": "google-tpu", "authoritative_product_path_key": "google-tpu", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "logic_foundry_process", "lithography", "wafer_equipment", "critical_materials", "package_provider", "assembly_test", "power_cooling" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-aws-trainium-inferentia", "gap_id": "us-gap-product-path-aws-trainium-inferentia", "record_type": "gap", "product_id": "aws-trainium-inferentia", "authoritative_product_path_key": "aws-trainium-inferentia", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "logic_foundry_process", "lithography", "wafer_equipment", "critical_materials", "package_provider", "assembly_test", "power_cooling" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-microsoft-maia", "gap_id": "us-gap-product-path-microsoft-maia", "record_type": "gap", "product_id": "microsoft-maia", "authoritative_product_path_key": "microsoft-maia", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "lithography", "wafer_equipment", "critical_materials", "package_provider", "assembly_test", "power_cooling" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." }, { "id": "us-gap-product-path-meta-mtia", "gap_id": "us-gap-product-path-meta-mtia", "record_type": "gap", "product_id": "meta-mtia", "authoritative_product_path_key": "meta-mtia", "gap_type": "product_specific_supply_chain", "status": "open", "unknown_stage_ids": [ "eda", "lithography", "wafer_equipment", "critical_materials", "package_provider", "assembly_test", "networking", "power_cooling" ], "boundary": "The exact product keeps its authoritative 15-stage status in supply-chain-v1.json. Local U.S. relationship records are a bounded supplement and do not close unproven stages." } ], "limits": [ "This is an anchor registry, not an exhaustive U.S. bill of materials, supplier map, facility list, or market-share table.", "Stage placement proves a cited capability. It does not establish that NVIDIA, AMD, or another named designer buys from, qualifies, or ships products containing that entity's technology.", "Headquarters and ownership country are not manufacturing origin.", "Commercial capability does not establish current availability, lead time, yield, utilization, process suitability, or United States-located capacity.", "No source in this endpoint proves complete United States semiconductor supply-chain coverage. Source-recorded cross-border dependencies remain visible by design." ], "provenance": { "source_product_dataset": "./us-data-v2.json", "source_product_dataset_schema": "touchdown.us-ai-chip-atlas.v2", "source_product_dataset_updated_at": "2026-08-01", "anchor_review_as_of": "2026-08-01", "construction": "The endpoint preserves the static capability anchors, adds exact U.S. product records and a bounded primary-source relationship supplement, and references rather than duplicates the 15-stage path truth in supply-chain-v1.json.", "anchor_registry_dataset": "./us-supply-chain-v1.json", "anchor_registry_dataset_sha256": "771001f9abb082a13e4536f6f97499bc8311851909f9c20a14f7ae7f5a68f04b", "source_product_dataset_sha256": "6772813d65ca0aeab2b953379615a94897fa46f77bcfbfea8d65137d23c9f57f", "relationship_supplement_dataset": "./us-reference-expansion-v1.json", "relationship_supplement_dataset_schema": "touchdown.us-ai-chip-reference-expansion.v1", "relationship_supplement_dataset_sha256": "81be529161d8bd8ebfb168140c42d4debc8b4acad24dc04bb50ecdea76e39c20", "authoritative_product_path_endpoint": "supply-chain-v1.json", "authoritative_product_path_endpoint_sha256": "59b2b3fed7563a77d57a32d22dea3899194ca7d04dab7b25b08c879ed2f5afc2" }, "validation": { "status": "pass", "checks": [ "all reviewed static capability anchors are retained", "MI300X, MI325X, MI350X, and MI355X remain separate exact-product records", "every anchor, product, entity, relationship, and product-path source reference resolves", "all stage labels map to the shared taxonomies", "every tracked U.S. product points to one authoritative exact-product 15-stage path", "the endpoint duplicates no authoritative product-stage status", "every local relationship carries explicit scope, source, boundary, unknowns, and separate deployment and manufacturing geography", "company-level and reference-design edges cannot become product-specific supplier selections" ], "anchor_entity_count": 37, "product_family_count": 17, "relationship_count": 31, "source_count": 91, "error_count": 0, "product_path_reference_count": 17, "authoritative_product_path_stage_cell_count": 255 }, "product_path_authority": { "endpoint": "./supply-chain-v1.json", "collection": "product_paths", "lookup_key": "product_id", "required_stage_count": 15, "alias_dataset": "./us-reference-expansion-v1.json#product_path_aliases", "boundary": "All China and U.S. 15-stage statuses and evidence records remain in one authority. Every current U.S. product resolves by its exact product ID; local relationships remain separately sourced and explicitly scoped." } }