Bonding, Assembly & Rework Engineer

Why this work matters

Touchdown is engineering modular manufacturing for the chips and memory systems future computing needs. This role helps turn a buyer's physical result into a qualified process or a defensible decision to use an existing supplier. Advanced packaging is our intended first fab class; no production fab is operating today.

Overview

You will connect incoming die and package parts into a measurable assembly flow. Compare joining methods and supplier capability against the product's alignment, thermal, mechanical, and electrical requirements. Define what can be inspected, repaired, or scrapped, and keep every disposition tied to the original workpiece. The role begins with a bounded route and qualification plan; it does not assume an operating Touchdown assembly line.

What you will own

• Define attach or bond alignment, voids, warpage, thermal cycle, inspection, repair, and traceability.
• Define die, interposer, and substrate handling, placement, attach, bond, and cure controls.
• Measure alignment, voids, warpage, thermal cycling, and interconnect integrity.
• Specify which failures can be reworked and when a unit must be scrapped.
• Define incoming part and surface criteria, alignment references, process controls, and post-bond inspection gates.
• Investigate opens, shorts, voids, delamination, and stress with test and failure-analysis owners before approving rework.

Technical territory

Die attach, hybrid or thermal bonding where appropriate, placement and alignment, surface preparation, underfill, cure, inspection, warpage, voids, interface integrity, rework, traceability, and package-level reliability.

Representative outputs

• An assembly traveler and acceptance plan with failure analysis and permitted rework boundaries.
• A controlled assembly traveler with tooling, settings, inspection, and genealogy.
• A rework and scrap decision table tied to reliability evidence.
• A rework and scrap decision matrix with measurable limits, genealogy requirements, and customer approval points.

What success looks like

• A qualified operator can repeat the assembly and document deviations.
• Rework does not hide latent reliability risk.
• Assembly defects are detected and assigned before final test or shipment rather than hidden in a yield average.
• The qualified route states which workpieces can be reworked, how often, and when the customer must reject them.

What you bring

• Die attach, bonding, package assembly, rework, and reliability evidence.
• Released die-attach, bonding, or package-assembly steps with documented yield.
• Can troubleshoot mechanical, thermal, and electrical assembly failures.
• Can create operator instructions and equipment acceptance criteria.
• Experience with assembly process windows, equipment capability, and package inspection.
• Ability to connect joining defects with downstream electrical and reliability failures.

Helpful experience

• Hybrid bonding, flip chip, or thermocompression bonding
• X-ray, acoustic microscopy, or cross-section analysis
• High-density die-to-die integration
• Thermomechanical modeling
• OSAT process transfer

How the role works

• Applications are open; the exact work location, arrangement, compensation, and start date will be discussed during hiring.
• Early work can produce engineering plans and partner comparisons. Hands-on work begins only at qualified, authorized facilities.
• You will work with process, equipment, quality, test, customer, and supplier owners as the scope requires.