Deposition, Metallization & Plating Engineer

Why this work matters

Touchdown is engineering modular manufacturing for the chips and memory systems future computing needs. This role helps turn a buyer's physical result into a qualified process or a defensible decision to use an existing supplier. Advanced packaging is our intended first fab class; no production fab is operating today.

Overview

You will define the material and conductor stack required by a specific device or package layer, then compare feasible deposition, seed, plating, and finish routes. A process choice has to survive both inline metrology and downstream electrical and reliability tests. Early work is a specification and controlled comparison with qualified suppliers; hands-on trials require approved equipment, chemistry, and facilities.

What you will own

• Specify films and conductors, adhesion, seed/plating or other selected routes, uniformity, contamination, and electrical effects.
• Specify film stack, conductor geometry, adhesion, sheet resistance, uniformity, and contamination limits.
• Compare deposition, seed, plating, anneal, and finish options for a named package layer.
• Coordinate chemical, electrical, thermal, and reliability measurements with qualified owners.
• Connect material specifications and tool settings to electrical resistance, interface integrity, and package reliability.
• Define control samples, measurement methods, and corrective actions for film variation or plating defects.

Technical territory

Thin films and surface preparation; physical or chemical deposition where appropriate; seed layers, electroplating, metallization, adhesion, sheet resistance, thickness uniformity, contamination, thermal exposure, corrosion, tool controls, and waste handling.

Representative outputs

• A layer-specific process and measurement plan with thickness, adhesion, resistance, defects, and safety limits.
• A layer-specific recipe and incoming-material specification with process window.
• A measurement and reliability matrix, including failure and stop criteria.
• A supplier and process comparison with material inputs, tool capability, measurement uncertainty, environmental controls, and accepted-good cost.

What success looks like

• Film or conductor variation stays inside the customer CTQ budget.
• A failed layer can be traced to material, tool, recipe, or measurement.
• The selected stack meets product electrical and reliability limits across the claimed workpiece range.
• Any process drift can be detected, held, and traced before affected material moves downstream.

What you bring

• Thin films, PVD/CVD, plating or related metallization, equipment controls, and reliability testing.
• Hands-on thin-film or plating process development and qualification.
• Can interpret thickness maps, electrical resistance, adhesion, and defect data.
• Understands equipment controls, chemistry hazards, and cross-process contamination.
• Experience with process qualification, film or plating metrology, and defect investigation.
• Understanding of chemical safety, equipment controls, and the effect of upstream preparation on film performance.

Helpful experience

• RDL copper and barrier/seed stacks
• PVD, CVD, ALD, electroplating, or CMP interfaces
• Redistribution layers and package interconnects
• Surface analysis and failure analysis
• Supplier-to-site process transfer

How the role works

• Applications are open; the exact work location, arrangement, compensation, and start date will be discussed during hiring.
• Early work can produce engineering plans and partner comparisons. Hands-on work begins only at qualified, authorized facilities.
• You will work with process, equipment, quality, test, customer, and supplier owners as the scope requires.