Lithography & Patterning Engineer

Why this work matters

Touchdown is engineering modular manufacturing for the chips and memory systems future computing needs. This role helps turn a buyer's physical result into a qualified process or a defensible decision to use an existing supplier. Advanced packaging is our intended first fab class; no production fab is operating today.

Overview

You will select a patterning method from the layer and workpiece requirement, then prove that it can repeat within the customer's acceptance limits. That includes mask data, resist and coating behavior, alignment, exposure, develop, inspection, and downstream effects. Compare existing supplier capacity and available tools first. The role does not assume leading-edge wafer lithography, EUV, or an owned production line.

What you will own

• Select and control the patterning route for the actual package layer, including resist, exposure, develop, alignment, and defects.
• Select patterning methods for a named layer and feature requirement; compare available partner capacity first.
• Control resist, coating, exposure, develop, overlay, CD, defectivity, and rework.
• Tie mask design rules and alignment marks to metrology and downstream yield.
• Define measurement and sampling plans that distinguish local defects, field effects, and lot-to-lot drift.
• Trace pattern failures into downstream metallization, etch, bonding, or electrical acceptance rather than stopping at an image.

Technical territory

Package, wafer, panel, and substrate patterning as applicable; masks and alignment marks; coating, exposure, development, overlay, critical dimensions, defect inspection, process windows, tool matching, measurement uncertainty, and rework limits.

Representative outputs

• A same-layer comparison of available mask/aligner routes, measured overlay/CD/defects, cost, and reject limits. EUV is not assumed.
• A layer specification with design rules, mask data, inspection, and reject limits.
• A patterning DOE and cost comparison across available equipment routes.
• A controlled layer traveler with mask revision, alignment strategy, inspection recipe, hold limits, and disposition path.

What success looks like

• A qualified reviewer can reproduce the layer result and reject failures.
• The chosen route meets the actual package need without assuming leading-edge wafer lithography.
• The candidate route repeatedly meets the named layer's overlay, dimension, and defect limits with known measurement uncertainty.
• The selected supplier or tool path wins against alternatives on accepted output and full cost, not feature size alone.

What you bring

• Lithography or package-patterning experience with overlay, critical dimensions, process windows, and metrology.
• Qualified lithography or package-patterning processes on real wafers, panels, or substrates.
• Can calculate overlay and CD budgets with tool capability and measurement uncertainty.
• Can troubleshoot resist, alignment, contamination, and pattern defects.
• Experience defining lithography process windows and responding to overlay or critical-dimension excursions.
• Ability to work with mask, equipment, integration, metrology, and quality owners on one versioned layer specification.

Helpful experience

• RDL or substrate lithography
• Mask shop and stepper or aligner supplier qualification
• High-mix advanced packaging
• Optical inspection and defect review
• Cost and throughput comparison across aligner routes

How the role works

• Applications are open; the exact work location, arrangement, compensation, and start date will be discussed during hiring.
• Early work can produce engineering plans and partner comparisons. Hands-on work begins only at qualified, authorized facilities.
• You will work with process, equipment, quality, test, customer, and supplier owners as the scope requires.