Process Integration Engineer

Why this work matters

Touchdown is engineering modular manufacturing for the chips and memory systems future computing needs. This role helps turn a buyer's physical result into a qualified process or a defensible decision to use an existing supplier. Advanced packaging is our intended first fab class; no production fab is operating today.

Overview

A good individual process is not a good product flow. You will connect candidate modules into a versioned route for a named workpiece, define what each step receives and releases, and find where variation or defects cross boundaries. Early work may be done with qualified partners; any owned physical route must pass its own safety and release gates. The result is a flow another team can run and a reviewer can reject.

What you will own

• Join process modules into a controlled flow with travelers, handoffs, process windows, and change control.
• Define the workpiece, route steps, interfaces, rework limits, and critical-to-quality measurements.
• Connect module recipes to travelers, lot history, sampling, holds, and change control.
• Use controlled splits to isolate cross-module variation before proposing a new step.
• Set sampling and measurement-system checks so a process shift is distinguishable from tool drift or measurement noise.
• Investigate cross-step excursions with module, metrology, equipment, and test owners before changing the route.

Technical territory

Route design, travelers, split lots, design of experiments, critical-to-quality measurements, statistical process control, defect and yield analysis, rework rules, recipe control, supplier transfer, and integration with package and electrical test.

Representative outputs

• A versioned route and split plan with measured CTQs, hold points, uncertainty, and accepted-good economics.
• A process-flow map with inputs, outputs, owner, recipe version, and hold point for each step.
• A split-lot analysis that compares the proposed route with a qualified baseline.
• A change-control packet linking each proposed module change to baseline lots, downstream tests, risk, and rollback conditions.

What success looks like

• Another qualified team can repeat the route and explain a reject.
• Each proposed process change has an acceptance criterion and rollback path.
• Lot genealogy connects input material, recipe version, measurements, disposition, and final accepted output.
• A process change improves the defined product result without hiding a defect in a downstream step.

What you bring

• Semiconductor or packaging process integration, DOE, variation, yield, and cross-module troubleshooting.
• Integrated semiconductor or advanced-packaging process modules across more than one tool or vendor.
• Can design a DOE and distinguish measurement noise from process movement.
• Can read yield, defect, reliability, and cycle-time evidence together.
• Strong statistical and experimental judgment with clear treatment of uncertainty and small sample sizes.
• Experience coordinating lithography, films, etch, assembly, metrology, test, and quality across an integrated flow.

Helpful experience

• OSAT or high-mix pilot lines
• Statistical process control and process FMEA
• Package and wafer process interfaces
• Failure analysis and defect paretos
• Partner-to-owned-process transfer

How the role works

• Applications are open; the exact work location, arrangement, compensation, and start date will be discussed during hiring.
• Early work can produce engineering plans and partner comparisons. Hands-on work begins only at qualified, authorized facilities.
• You will work with process, equipment, quality, test, customer, and supplier owners as the scope requires.