See what exists and what is still a claim.
Separate a product fact from a named supplier, qualified volume, and deployed workload.
Static research endpoint · no JavaScript required · updated 2026-08-01
A chip announcement is not a complete supply chain. This page shows what the reviewed record says about each design, foundry process, lithography path, factory tool, material, memory system, package, server, runtime, and deployment. Missing evidence stays visible.
Separate a product fact from a named supplier, qualified volume, and deployed workload.
Read the exact process, memory, package, equipment, material, test, and source boundary.
Follow the runtime and workload back through bandwidth, interconnect, systems, power, and manufacturing.
Current indexed snapshot
Every cell keeps two questions separate: what is known about the product at this stage, and whether a reviewed source names a company or supplier for this exact product.
One shared path
Start with who designed it. End with proof that useful systems were qualified, shipped, installed, and operated.
The company named as responsible for defining the product.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
The factory and process that turn the chip design into patterned silicon wafers.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
The physical links, protocols, switches, and network systems that move data between chips and machines.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Source-linked product records
The first path is open as an example. Every other path uses the same native browser control and works without scripts.
dfsx-df1000Working research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Shanghai DFSX is the named company for DF1000 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Software-defined spatial/dataflow accelerator with DRAM vertically integrated over logic. Normalized compute record: 520 TFLOPS · BF16 · peak, dense-versus-sparse undisclosed
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 14 nm · mature-node-class · reported.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: 3d-near-memory · DRAM, exact generation unknown · 6.4 TB/s peak · company peak; raw/effective/internal/sustained scope unknown.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: Company describes wafer-level DRAM-logic 3D hybrid bonding and an OAM 2.0 card.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_family. Availability record: Launched July 13, 2026; cards and systems shown; company claims functional validation and mass-production readiness; no public volume-shipment receipt.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: 900 GB/s peak · company-stated scale-up bandwidth; direction, ports, topology and payload rate unknown.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: CAAP · driver · runtime · operator libraries · distributed tools. A peer-reviewed predecessor demonstrates the architectural direction, not DF1000 product specifications. No public DF1000 teardown or independent workload benchmark was found.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Launched July 13, 2026; cards and systems shown; company claims functional validation and mass-production readiness; no public volume-shipment receipt.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
huawei-ascend-910cWorking research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Huawei is the named company for Ascend 910C / Atlas 900 A3 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Tensor-centric Ascend architecture in a multi-die package. Normalized compute record: 780 TFLOPS · BF16 · derived per chip from Huawei's 0.30 BF16 EFLOPS for 384 chips
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 7 nm · advanced-constrained · independent.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm · HBM2E · 128 GB · 3.125 TB/s peak · derived from Huawei aggregate system figure; not a direct chip datasheet.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: Multi-die accelerator with HBM2E; sampled component provenance varies.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_and_system_family. Availability record: In production and deployed in Atlas 900 A3 systems; Huawei reported more than 300 systems at over 20 customers by September 2025.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: 270 GB/s peak · reported one-way internal dual-die link; Atlas 900 A3 scales through UnifiedBus/SuperPoD.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: CANN · AscendCL · MindSpore · PyTorch adapters · HCCL · MindIE. TechInsights teardowns establish physical silicon and HBM in sampled packages. Public neutral workload-efficiency data remain limited.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: In production and deployed in Atlas 900 A3 systems; Huawei reported more than 300 systems at over 20 customers by September 2025.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
huawei-ascend-950prWorking research · not fully verified
1 known6 partial8 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Huawei is the named company for Ascend 950PR in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Prefill-optimized Ascend accelerator with Huawei-defined HiBL memory. Normalized compute record: 1 PFLOPS · FP8 · roadmap target | 2 PFLOPS · FP4 · roadmap target
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm-class · HiBL 1.0 · 128 GB · 1.6 TB/s peak · official roadmap; reported launched configurations differ.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_family. Availability record: Officially announced; reported in Atlas 350 configurations in 2026; independent teardown and customer benchmark not found.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: 2000 GB/s peak · company-claimed LingQu scale-up bandwidth.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: CANN · MindIE · HCCL · LingQu · CUDA migration tools. None found for final silicon specifications or end-to-end workload performance.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Officially announced; reported in Atlas 350 configurations in 2026; independent teardown and customer benchmark not found.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
huawei-ascend-950dtWorking research · not fully verified
1 known6 partial8 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Huawei is the named company for Ascend 950DT in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Decode/training-optimized Ascend accelerator with higher-bandwidth HiZQ memory. Normalized compute record: 1 PFLOPS · FP8 · roadmap/system-derived | 2 PFLOPS · FP4 · roadmap/system-derived
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm-class · HiZQ 2.0 · 144 GB · 4 TB/s peak · official roadmap target.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_family. Availability record: Roadmap product planned for later 2026; schedule reports vary; no independent silicon measurement found.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: 2000 GB/s peak · company-claimed LingQu scale-up bandwidth.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: CANN · MindIE · HCCL · LingQu. None found for final silicon.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Roadmap product planned for later 2026; schedule reports vary; no independent silicon measurement found.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
cambricon-mlu370Working research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Cambricon is the named company for MLU370 family in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
MLUv03 clusters with compute cores, memory core, and shared SRAM. Normalized compute record: FP32/TF32/FP16/BF16/INT8 supported · authoritative rates vary by board and remain incomplete
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 7 nm · advanced-constrained · reported.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: lpddr · LPDDR5 · 48 GB · 0.3072 TB/s peak · MLU370-M8 manual.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: PCIe board; no HBM/interposer.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_family. Availability record: Long-standing production hardware with public manuals and academic workload use.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: 200 GB/s peak · aggregate bidirectional across four MLU-Link ports on M8.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: Neuware · CNRT · CNDrv · CNCL · MagicMind · BANG C/C++. An academic MLU370-X4 implementation measured a 27% TPS improvement from LPDDR-aware allocation. That is a memory-management result, not a cross-vendor benchmark.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Long-standing production hardware with public manuals and academic workload use.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
cambricon-mlu590-690Working research · not fully verified
1 known5 partial9 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Cambricon is the named company for MLU590 / MLU690 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Public microarchitecture detail incomplete. Normalized compute record: unknown
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_family. Availability record: MLU590 is recognized by current SDK documentation; this alone does not prove volume shipment. Reliable public MLU690 specifications were not found..
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: MLU590 appears in current CNCL/MLUDirect locality documentation; bandwidth unknown.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: Neuware · CNCL · MLUDirect. None found.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: MLU590 is recognized by current SDK documentation; this alone does not prove volume shipment. Reliable public MLU690 specifications were not found..
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
biren-br100Working research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Biren Technology is the named company for BR100 / BR104 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
General vector processor plus 2.5D GEMM engine, C-Warp mode, large SRAM, multicast, and near-memory features. Normalized compute record: 1 PFLOPS · BF16 · BR100 peak company claim | 256 TFLOPS · FP32 · BR100 peak company claim | 2 POPS · INT8 · BR100 peak company claim
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 7 nm · advanced-constrained · official.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm · HBM2E · 64 GB · 2.3 TB/s peak · reported BR100 peak.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: Two 537 mm² compute chiplets and four HBM2E stacks on TSMC CoWoS 2.5D.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_family. Availability record: Silicon and systems demonstrated; Q4 2022 sampling announced. Continuing volume status is unclear following the reported TSMC suspension and related trade restrictions..
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: 448 GB/s peak · per BR100 OAM chip in an eight-card all-to-all topology.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: BIRENSUPA · compiler · runtime · drivers · libraries · framework support. Independent architectural analysis exists; neutral current silicon benchmarks and shipment volumes remain missing.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Silicon and systems demonstrated; Q4 2022 sampling announced. Continuing volume status is unclear following the reported TSMC suspension and related trade restrictions..
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
metax-c500-c550Working research · not fully verified
1 known7 partial7 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
MetaX is the named company for C500 / C550 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
XCORE GPGPU; C500 PCIe and C550 OAM. Normalized compute record: 30 TFLOPS · FP32 · reported/observed class; authoritative table unavailable
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 7 nm · advanced-constrained · reported.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm-reported · HBM2E reported by server vendors · 64 GB · capacity observed with mx-smi; bandwidth unknown.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_family. Availability record: C500 mass production and shipment since December 2023 according to MetaX; C550 is reported in deployed service.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: C500 PCIe 4.0; C550 OAM/PCIe 5.0 reported; optical and 3D-mesh systems exist but numeric link bandwidth is unknown.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: MXMACA · MACA · mxcc · cucc · operator libraries · PyTorch. A public developer report shows an eight-C500 system, 64 GB per card, and a 350 W cap; a tested async-copy path underperformed its synchronous path, showing that source compatibility is not equal execution behavior.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: C500 mass production and shipment since December 2023 according to MetaX; C550 is reported in deployed service.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
metax-c600Working research · not fully verified
1 known5 partial9 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
MetaX is the named company for C600 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
XCORE-class GPGPU; public final architecture incomplete. Normalized compute record: unknown
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_family. Availability record: Taped out October 2024 and brought up July 2025 according to MetaX; product listed, but public volume-shipment evidence not found.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: OAM and PCIe 5.0 reported; topology and bandwidth unknown.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: MXMACA. None found.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Taped out October 2024 and brought up July 2025 according to MetaX; product listed, but public volume-shipment evidence not found.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
enflame-t20-t21Working research · not fully verified
1 known6 partial8 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Enflame is the named company for T20 / T21 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
VLIW-style GCU cores with tensor/vector units, sparsity execution, and GCU-LARE interconnect. Normalized compute record: 134.4 TFLOPS · FP16/BF16/TF32 · T20 company-era peak; sparsity convention requires confirmation | 268.8 TOPS · INT8 · T20 company-era peak
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 12 nm · mature-node-class · independent.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_family. Availability record: Commercial hardware used in clusters; no current teardown found.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: 300 GB/s peak · company-claimed GCU-LARE; direction and payload scope require confirmation.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: TopsRider · TopsPlatform · PyTorch · TensorFlow · ONNX. Hot Chips architecture material and independent architectural reviews exist; current neutral workload data remain limited.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Commercial hardware used in clusters; no current teardown found.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
enflame-s60Working research · not fully verified
1 known5 partial9 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Enflame is the named company for S60 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
GCU accelerator with a public Candle backend. Normalized compute record: unknown
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: unknown · 48 GB · capacity shown by company examples; type and bandwidth unknown.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_family. Availability record: Company repository demonstrates working S60 hardware; public production volume and qualification remain unknown.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: TopsPlatform · Ubridge · UHHI · Candle-GCU. Company-generated LLM examples exist; independent reproduction was not found.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Company repository demonstrates working S60 hardware; public production volume and qualification remain unknown.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
moore-threads-s4000Working research · not fully verified
1 known7 partial7 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Moore Threads is the named company for MTT S4000 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Third-generation MUSA GPU with 8,192 vector cores and 128 tensor cores. Normalized compute record: 25 TFLOPS · FP32 · official dense peak | 100 TFLOPS · FP16 tensor · official peak | 200 TOPS · INT8 · official peak
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm-not-evidenced · undisclosed conventional graphics memory · 48 GB · 0.768 TB/s peak · official peak.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: PCIe dual-slot board; no public HBM packaging evidence.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_card. Availability record: Shipping product with public manuals and kernel-development work.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: 240 GB/s peak · MTLink I/O/interface bandwidth; aggregate/directional scope and topology unclear.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: MUSA · MUSIFY · driver · runtime · math libraries · operator libraries · communication libraries. No neutral full-system benchmark or teardown found.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Shipping product with public manuals and kernel-development work.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
iluvatar-bi-v150Working research · not fully verified
1 known7 partial7 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Iluvatar CoreX is the named company for Tiangai 150 / BI-V150 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Second-generation general-purpose GPU. Normalized compute record: 48 TFLOPS · FP32 · reported peak | 192 TFLOPS · FP16/BF16 · reported peak
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 7 nm · advanced-constrained · reported.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: 2.5D CoWoS stated in a public manual copy.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_card. Availability record: Commercial card supported by current HAMi device sharing and heterogeneous-cluster work.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: 64 GB/s peak · manual-copy shared bidirectional value; other reported values conflict.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: IXUCA · CoreX SDK · framework compatibility · virtualization · vGPU. No teardown or credible neutral accelerator benchmark found.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Commercial card supported by current HAMi device sharing and heterogeneous-cluster work.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
kunlunxin-p800Working research · not fully verified
1 known4 partial10 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Kunlunxin / Baidu is the named company for P800 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Third-generation XPU-P optimized for MoE, MLA, and 8-bit inference. Normalized compute record: public figures conflict; no authoritative datasheet found
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_family. Availability record: Eight-card system passed a named CAICT DeepSeek adaptation test; large deployments are company-reported.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: XPU stack · PaddlePaddle · PyTorch build · KLX3 Triton · vllm-kunlun · xtorch_ops. CAICT adaptation artifact and a TechInsights floorplan analysis exist; accessible detailed silicon measurements remain incomplete.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Eight-card system passed a named CAICT DeepSeek adaptation test; large deployments are company-reported.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
horizon-journey-6Working research · not fully verified
1 known7 partial7 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Horizon Robotics is the named company for Journey 6 family in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
BPU Nash with integrated CPU, GPU, MCU, ISP, and safety islands. Normalized compute record: 560 effective TOPS · family maximum · official with one-half sparsity and TPP under 4,800; not dense datacenter BF16
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 7 nm · advanced-constrained · reported.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: lpddr · LPDDR5X · 0.204 TB/s peak · reported J6P 192-bit LPDDR5X-8533; capacity chosen by module/OEM.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: Integrated automotive SoC/module; no HBM.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: automotive_ai_soc_family. Availability record: Family launched in 2024; Journey 6 products are in vehicle production programs.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: OpenExplorer · horizon_tc_ui · HMCT · HBDK4 · runtime · model zoo. A commercial J6E module teardown exists, but detailed results are paywalled. Production vehicle evidence exists.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Family launched in 2024; Journey 6 products are in vehicle production programs.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
alibaba-t-head-hanguang-800Working research · not fully verified
1 known4 partial10 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Alibaba / T-Head is the named company for Hanguang 800 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
T-Head neural processing unit for search, translation, recommendation, advertising, and customer-service inference. Normalized compute record: No normalized like-for-like compute rate in the reviewed primary record
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: internal_cloud_accelerator. Availability record: Alibaba said on September 25, 2019 that Hanguang 800 was used internally, and later said it was deployed in Alibaba Cloud data centers; current merchant availability and deployment scale are not established.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: HGAI model conversion and compilation path · integration path for mainstream deep-learning inference frameworks. No independent product teardown, workload reproduction, current shipment receipt, or production-volume record is normalized here.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Alibaba said on September 25, 2019 that Hanguang 800 was used internally, and later said it was deployed in Alibaba Cloud data centers; current merchant availability and deployment scale are not established.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
tencent-zixiao-c100Working research · not fully verified
1 known6 partial8 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Tencent is the named company for Zixiao C100 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Tencent Zixiao accelerator for computer vision, optical character recognition, natural-language processing, image, text, and speech inference. Normalized compute record: 120 TFLOPS · FP16 · Tencent Cloud PTX1 instance specification for one Zixiao C100 device; sustained application performance is not stated
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: unknown · 16 GB · Tencent lists 16 GB of device memory; memory technology, placement, supplier, and bandwidth are not stated.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: C100 accelerator card inside Tencent Cloud PTX1 instances; die and package construction unknown.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: cloud_accelerator_card. Availability record: Tencent Cloud records PTX1 as launched in December 2022; this proves a named cloud-instance offering, not standalone card shipments or current volume.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: Tencent Cloud AI inference environment. No independent chip benchmark, teardown, customer qualification record, or shipment-volume receipt is normalized here.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Tencent Cloud records PTX1 as launched in December 2022; this proves a named cloud-instance offering, not standalone card shipments or current volume.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
hygon-dcu-8000Working research · not fully verified
1 known4 partial10 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Hygon is the named company for DCU 8000 series in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Hygon describes DCU as a GPGPU using a general parallel-computing architecture. Normalized compute record: double, single, half precision, and integer formats supported · The reviewed filing states supported format classes but does not provide a normalized generation-specific peak rate
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: accelerator_family. Availability record: Hygon filings say Deep Computing No. 1 completed product validation and entered commercial application in 2021, and had begun scaled sales by June 2022; the current 8000-series generation, volumes, and customer scope remain unnormalized.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: DTK software stack · self-developed operators · third-party components. Exchange filings establish company statements and historical commercialization wording. They do not establish independent workload results, named customers, current shipment counts, or production yield.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Hygon filings say Deep Computing No. 1 completed product validation and entered commercial application in 2021, and had begun scaled sales by June 2022; the current 8000-series generation, volumes, and customer scope remain unnormalized.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
sophgo-bm1690Working research · not fully verified
1 known4 partial10 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
SOPHGO is the named company for BM1690 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
SOPHGO tensor processor supported through SOPHONSDK and TPU-MLIR tooling. Normalized compute record: No normalized BM1690 peak rate in the reviewed primary pages
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: processor_family. Availability record: SOPHGO records BM1690 as released in 2024 and documents continuing software enablement; the public record normalized here does not establish volume production or customer qualification.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: SOPHONSDK · TPU-MLIR · multi-core MatMul support · model regression tests · operator-development path. Software changelogs establish tool activity and regression testing, not production scale, customer acceptance, or independent workload performance.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: SOPHGO records BM1690 as released in 2024 and documents continuing software enablement; the public record normalized here does not establish volume production or customer qualification.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
denglin-goldwasser-lWorking research · not fully verified
1 known7 partial7 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
DenglinAI is the named company for Goldwasser I L series in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Denglin GPU+ accelerator supported by the Hamming software stack. Normalized compute record: No normalized like-for-like peak rate in the reviewed primary product pages
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: unknown · 64 GB · 0.239 TB/s peak · Company peak for L128/L256; memory technology and sustained bandwidth are not stated.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: Enterprise accelerator-card family; die and package construction unknown.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: accelerator_card_family. Availability record: Denglin currently lists Goldwasser I L, Goldwasser II GS, and third-generation KS lines; current shipment quantity, customer qualification, and readiness of later generations are not established.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
Power record: 25 W · Company typical-power specification for the L128/L256 product table.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: Hamming software stack · mainstream AI-model inference path. No independent product benchmark, teardown, production-volume record, or named customer acceptance receipt is normalized here.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Denglin currently lists Goldwasser I L, Goldwasser II GS, and third-generation KS lines; current shipment quantity, customer qualification, and readiness of later generations are not established.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
vastai-va10-familyWorking research · not fully verified
1 known5 partial9 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Vastai Technologies is the named company for VA10 family in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Vastai Unified Compute Architecture full-function GPU family spanning accelerator cards and appliances. Normalized compute record: No normalized like-for-like card compute rate in the reviewed primary pages
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: VA10-family accelerator cards and VGX VA16 appliance boundary; die and package construction unknown.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: accelerator_and_system_family. Availability record: Vastai says two chip generations reached mass production and commercialization, and called VA1L and VA10L mass-produced in September 2024; audited units, named recipients, current availability, and qualification remain unknown.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: VUCA · Kylin · UnionTech OS · Anolis OS · openEuler · company-stated model adaptation for Llama, Qwen, Baichuan, ChatGLM, and Stable Diffusion. Company mass-production and model-adaptation wording is not independent testing and does not establish shipment volume or workload parity.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Vastai says two chip generations reached mass production and commercialization, and called VA1L and VA10L mass-produced in September 2024; audited units, named recipients, current availability, and qualification remain unknown.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
axera-ax650-familyWorking research · not fully verified
1 known6 partial8 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Axera is the named company for AX650 family in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Axera Neutron NPU integrated with Arm CPU, AI image-signal processing, and video engines. Normalized compute record: 10.8 TOPS · INT8 · AX650N vendor peak; the same source states 43.2 TOPS at INT4 | 43.2 TOPS · INT4 · AX650N vendor peak; not comparable with INT8, FP16, or application throughput without a matched workload
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: lpddr · 64-bit LPDDR4X interface · AX650N interface support; device capacity, memory supplier, and sustained bandwidth are not stated.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: Integrated edge AI SoC; separate 1050-series DIMM system-on-module products use AX650-family silicon.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: edge_ai_soc_family. Availability record: Axera's 2026 prospectus defines AX650 as a commercialized endpoint-computing series; this means external-sale revenue was recognized, not that current volume, customers, or profitability are established.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: Axera SDK · AX-LLM evaluation repository · mainstream deep-learning framework conversion path. PSA Certified Level 1 is a bounded security-certification receipt for named products. It does not establish automotive functional safety, workload performance, volume, or complete-system qualification.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Axera's 2026 prospectus defines AX650 as a commercialized endpoint-computing series; this means external-sale revenue was recognized, not that current volume, customers, or profitability are established.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
intellifusion-deepedge10-familyWorking research · not fully verified
1 known6 partial8 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Intellifusion is the named company for DeepEdge10 family in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
DeepEdge10C, DeepEdge10, and DeepEdge10Max use Intellifusion's NNP400T neural processor; DeepEdge10Max adds a vendor-described D2D chiplet interconnect for scalable edge inference. Normalized compute record: 8 TOPS · INT8 · DeepEdge10C vendor peak; the same page lists 4 TOPS INT16 and 1.5 TFLOPS FP16 | 16 TOPS · INT8 · DeepEdge10 vendor peak; the same page lists 8 TOPS INT16 and 2 TFLOPS FP16 | 64 TOPS · INT8 · DeepEdge10Max vendor peak; the same page lists 32 TOPS INT16 and 8 TFLOPS FP16
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: Integrated edge SoC family; DeepEdge10Max is described as a chiplet design, but die and package construction are not disclosed.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: edge_ai_soc_family. Availability record: Intellifusion currently lists DeepEdge10C, DeepEdge10, and DeepEdge10Max as chip products and lists modules and cards built around its processors; this does not establish shipment volume, named recipients, or current production capacity.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: DeepEdge10Max uses a vendor-described D2D chiplet interconnect; topology, die count, protocol, and rate are not stated.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: model quantization, compilation, and deployment SDK · PyTorch · ONNX · TensorFlow · support for CNN, RNN, Transformer, and GNN networks. No independent teardown, matched-workload benchmark, customer qualification, shipment count, or production-yield receipt is normalized here.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Intellifusion currently lists DeepEdge10C, DeepEdge10, and DeepEdge10Max as chip products and lists modules and cards built around its processors; this does not establish shipment volume, named recipients, or current production capacity.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
corerain-caisa-430Working research · not fully verified
1 known5 partial9 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Corerain is the named company for CAISA 430 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Fourth-generation CAISA 4.0 reconfigurable dataflow architecture with a 24-core Arm Cortex-A55 CPU complex and support for CNN, RNN, and Transformer networks. Normalized compute record: 16 TOPS · INT8 · Vendor peak for CAISA 430; the same page says INT16 and FP32 are supported without normalized peak rates
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: lpddr · LPDDR4X · 48 GB · 0.0896 TB/s peak · Vendor peak of 89.6 GB/s for the stated three-channel LPDDR4X memory path; sustained application bandwidth is not stated.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: edge_ai_accelerator_soc. Availability record: Corerain currently lists CAISA 430 as an orderable-inquiry product and shows systems based on the architecture; the page does not establish shipment volume, current production capacity, or customer qualification.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: RainBuilder compiler toolchain · TensorFlow · PyTorch · Caffe · ONNX · MXNet. Vendor utilization and peak-throughput statements are not independent workload measurements and do not establish sustained model performance, power efficiency, or volume production.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Corerain currently lists CAISA 430 as an orderable-inquiry product and shows systems based on the architecture; the page does not establish shipment volume, current production capacity, or customer qualification.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
corerain-n460hWorking research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Corerain is the named company for Stellar N460H in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Corerain high-performance AI inference card with a vendor-listed three-by-24-core Arm Cortex-A55 controller configuration; accelerator die count and package topology are not stated. Normalized compute record: 48 TOPS · INT8 · N460H vendor peak; not sustained application throughput | 12 TOPS · INT16 · N460H vendor peak; not directly comparable with INT8 or FP32 rates | 384 GFLOPS · FP32 · N460H vendor peak; sustained workload performance is not stated
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: lpddr · LPDDR4X · 144 GB · Memory bandwidth, topology, and supplier are not stated on the N460H card page.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: Passive, single-slot, half-height half-length card measuring 169.5 by 69.2 by 18.5 mm; accelerator die and package construction are unknown.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: accelerator_card. Availability record: Corerain currently lists N460H as a product with ordering inquiry; this establishes a vendor-offered card specification, not stock, shipment volume, named customer qualification, or installed capacity.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: Vendor lists a PCIe Gen3 x8 physical interface and a PCIe Gen3 x2 data-link interface; measured host-transfer throughput and multi-card fabric are not stated.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
Power record: 75 W · Vendor maximum card power, stated as no more than 75 W.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: OpenEuler operating system by default · RainBuilder compiler toolchain. No independent card teardown, measured host-transfer result, sustained model benchmark, qualification record, or shipment count is normalized here.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Corerain currently lists N460H as a product with ordering inquiry; this establishes a vendor-offered card specification, not stock, shipment volume, named customer qualification, or installed capacity.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
tsingmicro-tx5-familyWorking research · not fully verified
1 known5 partial9 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
TsingMicro is the named company for TX5 family in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
TX5 family uses TsingMicro's reconfigurable neural-network engine; individual members add CGRA image processing, general-compute acceleration, GPU or 3D engines, video codecs, and vision-processing blocks. Normalized compute record: W4A8 mixed-precision quantization supported on TX5326 · The reviewed family page does not provide a normalized numeric peak for TX5326, TX5336, TX5368, or TX5215
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: Integrated edge SoC family including TX5326, TX5336, TX5368, and TX5215; package construction is not stated.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: edge_ai_soc_family. Availability record: TsingMicro says the TX5 family is in scaled mass production; this is a vendor readiness claim and does not establish audited units, named recipients, current capacity, or qualification.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: vendor-described mature deployment toolchain · mainstream-framework compatibility · intelligent quantization · Transformer, LLM, and VLM edge-model support. No independent teardown, framework reproduction, matched-workload result, qualification receipt, or audited shipment count is normalized here.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: TsingMicro says the TX5 family is in scaled mass production; this is a vendor readiness claim and does not establish audited units, named recipients, current capacity, or qualification.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
black-sesame-huashan-a1000-familyWorking research · not fully verified
1 known4 partial10 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Black Sesame Technologies is the named company for Huashan A1000 family in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Huashan automotive SoC family consisting of A1000, A1000L, and A1000 Pro; the reviewed filing describes proprietary IP cores and an integrated driving-compute platform without disclosing a normalized microarchitecture. Normalized compute record: The reviewed 2025 annual report does not provide generation-normalized peak compute rates for A1000, A1000L, and A1000 Pro
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: automotive_ai_soc_family. Availability record: Black Sesame's 2025 annual report says the A1000 family achieved mass production and deployment, remained in vehicle programs, and was the main contributor to company chip sales in 2025; audited unit volume and product-level customer qualification are not stated.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: Hanhai ADAS middleware platform · peripheral open interfaces and commonly used basic software components. The exchange filing is a primary company record. Its product, certification, integration, and readiness wording is not an independent workload, safety, shipment-volume, or supply-chain validation.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Black Sesame's 2025 annual report says the A1000 family achieved mass production and deployment, remained in vehicle programs, and was the main contributor to company chip sales in 2025; audited unit volume and product-level customer qualification are not stated.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
jingjia-micro-jm11-familyWorking research · not fully verified
1 known4 partial10 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Jingjia Micro is the named company for JM11 family in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Jingjia Micro GPU family with hardware virtualization and passthrough virtualization support; the reviewed filing does not disclose a normalized microarchitecture. Normalized compute record: No normalized peak compute rate is stated for the JM11 family in the reviewed filing
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: gpu_chip_family. Availability record: Jingjia Micro's 2025 annual report lists JM11 as released in 2025 and at the small-batch delivery-and-use stage; it also describes a 32-session cloud-desktop deployment, but does not disclose recipient identity, product units, or current production capacity.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: Windows · Linux · mainstream operating systems used in China · hardware virtualization · passthrough virtualization. Company-reported application and concurrency wording is not an independent benchmark, product teardown, customer acceptance record, or audited shipment count.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Jingjia Micro's 2025 annual report lists JM11 as released in 2025 and at the small-batch delivery-and-use stage; it also describes a 32-session cloud-desktop deployment, but does not disclose recipient identity, product units, or current production capacity.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
jingjia-micro-ch37-familyWorking research · not fully verified
1 known5 partial9 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Jingjia Micro / Chengheng Micro is the named company for CH37 family in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Chengheng Micro high-integration single-chip SoC with CPU, GPU, NPU, GPGPU, ISP, DSP, and VPU processing blocks. Normalized compute record: 64 TOPS · INT8 · CH37 family vendor peak in Jingjia Micro's filing; sustained workload performance is not stated
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: High-integration single-chip edge AI SoC; die and package construction are not disclosed.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: edge_ai_soc_family. Availability record: Jingjia Micro's 2025 annual report places CH37 in the small-batch production stage and says customer introduction and software work are continuing; this does not establish audited units, named recipients, or qualification.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: supporting software under continued development according to the filing · flexible compute-precision support. The filing establishes the company's stated product and readiness stage, not an independent workload result, customer acceptance receipt, or audited production count.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Jingjia Micro's 2025 annual report places CH37 in the small-batch production stage and says customer introduction and software work are continuing; this does not establish audited units, named recipients, or qualification.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
lisuan-lx-7g100Working research · not fully verified
1 known6 partial8 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Lisuan Technology is the named company for LX 7G100 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Lisuan TrueGPU graphics architecture with NRSS super-resolution support. Normalized compute record: The reviewed official product page does not provide a peak compute rate or a normalized AI-acceleration rate
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: gddr · GDDR6 · 12 GB · The product page states 12 GB GDDR6; bus width, data rate, supplier, and bandwidth are not stated.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: 294 by 120 by 49 mm discrete graphics card with active axial-fan cooling; GPU die and package construction are unknown.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: discrete_graphics_card. Availability record: Lisuan currently lists LX 7G100 as a consumer product and links to online purchasing; this does not establish stock, shipments, sell-through, named customers, or production volume.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: DirectX 12 · Vulkan 1.3 · OpenGL 4.6 · OpenCL 3.0 · Lisuan driver download center · NRSS super resolution. No independent board teardown, driver-compatibility audit, matched gaming or AI benchmark, qualification receipt, or audited shipment count is normalized here.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Lisuan currently lists LX 7G100 as a consumer product and links to online purchasing; this does not establish stock, shipments, sell-through, named customers, or production volume.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
innosilicon-fenghua-3Working research · not fully verified
1 known6 partial8 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Innosilicon is the named company for Fenghua 3 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Full-function GPU with a vendor-described CUDA-compatible programming path and an integrated Nanhu V3 open-source RISC-V CPU. Normalized compute record: single, double, and mixed precision supported · The launch article describes supported precision classes and workloads but does not provide a normalized peak compute rate
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: high_bandwidth_discrete · high-bandwidth video memory; technology not stated · 112 GB · The vendor calls the memory high bandwidth but does not state memory technology, supplier, interface width, data rate, or numeric bandwidth.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: Single-card product boundary is stated; physical form factor, die count, package construction, assembly, and test path are not disclosed.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: accelerator_card_family. Availability record: Innosilicon says Fenghua 3 was launched on September 22, 2025, demonstrated at the event, and covered by ecosystem agreements for future systems and clusters; this does not establish working units outside the demonstration, current shipments, installed clusters, or production volume.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: PyTorch · Triton · HIP and CUDA-compatible frameworks · OpenCL · DirectX 12 · Vulkan 1.2 · OpenGL 4.6 · UOS · Kylin · Windows · Android · vGPU virtualization. Launch demonstrations and ecosystem agreements are vendor evidence, not an independent benchmark, teardown, customer acceptance record, shipment receipt, or production audit.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Innosilicon says Fenghua 3 was launched on September 22, 2025, demonstrated at the event, and covered by ecosystem agreements for future systems and clusters; this does not establish working units outside the demonstration, current shipments, installed clusters, or production volume.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
unisoc-t9100Working research · not fully verified
1 known6 partial8 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
UNISOC is the named company for T9100 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Octa-core Arm CPU with one Cortex-A76 at 2.7 GHz, three Cortex-A76 cores at 2.3 GHz, four Cortex-A55 cores at 2.1 GHz, an Arm Mali-G57 MC4 GPU, and an integrated NPU. Normalized compute record: 8 TOPS · UNISOC peak NPU claim; precision, power envelope, utilization, and sustained application rate are not stated
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 6 nm · advanced · official.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: lpddr · LPDDR4X · 32 GB · UNISOC states LPDDR4X at 2133 MHz and eMMC 5.1 or UFS 3.1 storage support; bus width and memory bandwidth are not stated.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: mobile_ai_soc. Availability record: UNISOC currently maintains a T9100 product page; the page does not establish a named device design win, customer qualification, shipment count, or current production volume.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: access to mainstream AI training frameworks · advanced model-compression tooling · compatibility with more than 200 neural-network operators · on-device AI development and debugging environment. No independent teardown, device-level workload benchmark, named-customer qualification, shipment count, or production-yield receipt is normalized here.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: UNISOC currently maintains a T9100 product page; the page does not establish a named device design win, customer qualification, shipment count, or current production volume.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
unisoc-a7870Working research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
UNISOC is the named company for A7870 series in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Octa-core Arm CPU with one Cortex-A76 at 2.7 GHz, three Cortex-A76 cores at 2.3 GHz, four Cortex-A55 cores at 2.1 GHz, a four-core NATT GPU at 850 MHz, and an IMG AX3596 NPU. Normalized compute record: 8 TOPS · UNISOC peak IMG AX3596 NPU claim; precision, power envelope, utilization, and sustained application rate are not stated | 486.4 GFLOPS · UNISOC peak NATT GPU claim in the product overview; the parameter table rounds the same GPU claim to 486 GFLOPS
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 6 nm · advanced · official.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
Lithography claim: UNISOC product page labels the process TSMC 6nm EUV. not independent foundry, scanner, facility, volume, yield, or China-developed DUV/EUV capability proof
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: lpddr · LPDDR4X · 32 GB · UNISOC states LPDDR4X at 2133 MHz and eMMC 5.1 or UFS 3.1 storage support; bus width and memory bandwidth are not stated.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: automotive_cockpit_soc_family. Availability record: UNISOC lists the A7870 series as an automotive-grade smart-cockpit processor and uses AEC-Q100 process-system and support wording; the reviewed page does not establish a named vehicle, customer qualification, mass-production start, or shipment volume.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: UNISOC lists PCIe 3.0, MIPI DSI, DisplayPort 1.4, CSI, UFS 3.1, I2S, and other system interfaces; lane topology, chip-to-chip fabric, and sustained rate are not stated.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: QNX · Linux · Android Automotive · virtual-machine multi-baseline cockpit software · integrated cockpit, parking, and T-Box solution path. The UNISOC product page labels the process as 'TSMC 6nm EUV.' This packet records that exact label only as an official UNISOC claim, not as independent foundry, lithography-tool, wafer-production, facility, volume, or yield proof. No independent teardown, vehicle benchmark, or qualification receipt is normalized here.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: UNISOC lists the A7870 series as an automotive-grade smart-cockpit processor and uses AEC-Q100 process-system and support wording; the reviewed page does not establish a named vehicle, customer qualification, mass-production start, or shipment volume.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
rockchip-rk3588Working research · not fully verified
1 known6 partial8 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Rockchip is the named company for RK3588 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Quad-core Arm Cortex-A76 plus quad-core Cortex-A55 CPU, Arm Mali-G610 MC4 GPU, and triple-core NPU. Normalized compute record: 6 TOPS · INT4 / INT8 / INT16 / FP16 / BF16 / TF32 support · Rockchip aggregate NPU peak claim; the page lists supported arithmetic formats but does not map 6 TOPS to a specific precision or sustained workload
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 8 nm · advanced · official.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: edge_compute_soc. Availability record: Rockchip currently maintains an RK3588 product page; that page does not establish named board or device availability, customer qualification, shipment count, or current production volume.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: Rockchip lists PCIe 3.0, PCIe 2.0, SATA 3.0, RGMII, USB Type-C, USB 3.1, and USB 2.0; lane topology and sustained rates are not stated and these are not a normalized accelerator fabric.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: Android · Linux · OpenCL 1.1, 1.2, and 2.0 GPU support. No independent teardown, matched-workload benchmark, board-level acceptance record, shipment count, or production-yield receipt is normalized here.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Rockchip currently maintains an RK3588 product page; that page does not establish named board or device availability, customer qualification, shipment count, or current production volume.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
allwinner-v853Working research · not fully verified
1 known6 partial8 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Allwinner is the named company for V853 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Arm Cortex-A7 CPU up to 1.2 GHz, RISC-V XuanTie E907 MCU up to 600 MHz, integrated NPU, Allwinner codec engine, and image-signal processor. Normalized compute record: 1 TOPS · INT8 · Allwinner peak NPU claim; power envelope, utilization, and sustained application rate are not stated
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: ddr · DDR3 / DDR3L · Allwinner lists DDR3 and DDR3L support plus SD 3.0, eMMC 5.0, SPI NOR, and SPI NAND storage; capacity, bus width, supplier, and bandwidth are not stated.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: edge_ai_vision_soc. Availability record: Allwinner currently maintains a V853 product page and lists target applications; the examples are product positioning, not named design wins, customer qualification, shipment counts, or production-volume receipts.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: Allwinner lists USB, SMHC, GPIO, SPI, TWI, UART, GMAC, GPADC, PWM, and other peripheral interfaces; no accelerator-fabric rate is stated.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: Tina Linux · FreeRTOS. No independent teardown, device-level workload benchmark, named-customer qualification, shipment count, or production-yield receipt is normalized here.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Allwinner currently maintains a V853 product page and lists target applications; the examples are product positioning, not named design wins, customer qualification, shipment counts, or production-volume receipts.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
nio-shenji-nx9031Working research · not fully verified
1 known4 partial10 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
NIO is the named company for Shenji NX9031 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
NIO describes Shenji NX9031 as its proprietary automotive-grade smart-driving chip; the reviewed primary source does not disclose a normalized CPU, GPU, NPU, or tensor architecture. Normalized compute record: No precision-specific peak or sustained compute rate is stated in the reviewed NIO release
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: automotive_smart_driving_chip. Availability record: NIO said ET9 deliveries began on March 29, 2025 and that two Shenji NX9031 chips were integrated into every ET9. This establishes vehicle integration at the stated launch, not delivered ET9 quantity, broader-model deployment, customer qualification, or chip production volume.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: NIO assisted and intelligent-driving feature stack. The NIO release is a primary company receipt for the stated ET9 delivery start and two-chip configuration. It is not an independent teardown, workload, safety, field-reliability, unit-volume, supply-chain, or yield validation.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: NIO said ET9 deliveries began on March 29, 2025 and that two Shenji NX9031 chips were integrated into every ET9. This establishes vehicle integration at the stated launch, not delivered ET9 quantity, broader-model deployment, customer qualification, or chip production volume.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
xpeng-turing-ai-chipWorking research · not fully verified
1 known4 partial10 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
XPeng is the named company for XPENG Turing chip in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
XPeng unveiled the Turing chip as part of its AI architecture and said it is applicable to robots, AI-defined cars, and eVOTLs; the reviewed product-specific release does not disclose a normalized accelerator architecture. Normalized compute record: No product-specific peak or sustained compute rate is stated in the reviewed XPeng release and filing
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: automotive_and_robotics_ai_chip_program. Availability record: XPeng unveiled the Turing chip on August 27, 2024. The reviewed sources do not establish a product-specific vehicle integration, customer qualification, completed production ramp, shipment, or current merchant-availability receipt.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: XPENG AI architecture. XPeng's separate 2024 annual filing says unnamed processing hardware taped out in August 2024 and warns that development, design wins, and production ramp may not succeed. This packet does not convert that generic filing language into Turing-specific production proof. No independent teardown or workload receipt is normalized here.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: XPeng unveiled the Turing chip on August 27, 2024. The reviewed sources do not establish a product-specific vehicle integration, customer qualification, completed production ramp, shipment, or current merchant-availability receipt.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
li-auto-mahe-m100Working research · not fully verified
1 known4 partial10 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Li Auto is the named company for MAHE M100 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Li Auto describes M100 as its proprietary autonomous-driving inference chip designed for synergy with its full-stack autonomous-driving algorithms; the reviewed filings do not disclose a normalized CPU, GPU, NPU, or tensor architecture. Normalized compute record: No precision-specific peak or sustained compute rate is stated in the reviewed Li Auto filings
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
No normalized memory technology, capacity, bandwidth, or manufacturer record.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: automotive_autonomous_driving_inference_chip. Availability record: Li Auto said it launched and began deliveries of the all-new Li L9 in May 2026: the Ultra uses one proprietary MAHE M100 and the Livis uses two. This establishes the stated vehicle configuration and delivery start, not delivered-unit count, chip shipment volume, or independent vehicle qualification.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: Li Auto full-stack autonomous-driving algorithms · MindVLA large model and 3D ViT Encoder in the all-new Li L9 vehicle configuration. Li Auto's SEC-filed results release is a primary company receipt for the stated May 2026 Li L9 launch, delivery start, and M100 configurations. It is not an independent teardown, matched driving-workload benchmark, safety, field-reliability, unit-volume, supply-chain, or yield validation.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Li Auto said it launched and began deliveries of the all-new Li L9 in May 2026: the Ultra uses one proprietary MAHE M100 and the Livis uses two. This establishes the stated vehicle configuration and delivery start, not delivered-unit count, chip shipment volume, or independent vehicle qualification.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
nvidia-blackwell-b200Working research · not fully verified
1 known9 partial5 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
NVIDIA is the named company for Blackwell B200 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Blackwell dual-die Tensor Core GPU used in HGX and DGX B200 systems. Normalized compute record: FP4 through FP64 · Peak rate depends on precision, sparsity, and HGX or DGX configuration
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 4 nm · advanced · official. Named supplier record: NVIDIA states that Blackwell GPUs are manufactured on a custom TSMC 4NP process.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
This establishes the named foundry and process for the Blackwell GPU. It does not identify the facility, wafer lot, masks, equipment, materials, yield, package, assembly site, shipment volume, or every component in an HGX or DGX system.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm · HBM3e · 180 GB · 8 TB/s peak · B200 SXM GPU specification; do not read the value as rack aggregate bandwidth.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: Two reticle-sized Blackwell dies connected by a company-stated 10 TB/s die-to-die link in one HBM-equipped accelerator package; packaging supplier is not named.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_gpu. Availability record: NVIDIA documents current HGX and DGX B200 systems; this does not establish unrestricted standalone-GPU availability or shipment volume.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: 1800 GB/s peak · Fifth-generation NVLink per B200 GPU in HGX and DGX; topology and aggregate rate depend on the system.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
Power record: 1000 W · Configurable maximum per B200 GPU in the reviewed HGX reference; not server, rack, or wall power.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: CUDA · TensorRT-LLM · NCCL · Triton. Specifications and availability are NVIDIA claims. Workload throughput, usable bandwidth, power, acceptance, and delivered configuration require system-specific receipts.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: NVIDIA documents current HGX and DGX B200 systems; this does not establish unrestricted standalone-GPU availability or shipment volume.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
nvidia-blackwell-b300Working research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
NVIDIA is the named company for Blackwell Ultra B300 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Blackwell Ultra Tensor Core GPU used in HGX and DGX B300 systems. Normalized compute record: FP4 through FP64 · Peak rate depends on precision, sparsity, and HGX or DGX configuration
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm · HBM3e · 288 GB · 8 TB/s peak · Per B300 GPU; do not read the value as eight-GPU or rack aggregate bandwidth.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: SXM accelerator with HBM3e; the reviewed official sources do not establish the B300 package technology, substrate, foundry, or packaging supplier.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_gpu. Availability record: NVIDIA describes DGX B300 as available and documents first-customer support; this remains a vendor availability claim.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: 1800 GB/s peak · Fifth-generation NVLink per B300 GPU in HGX and DGX; topology and aggregate rate depend on the system.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
Power record: 1100 W · Configurable maximum per B300 GPU in the reviewed HGX reference; GB300 configurations differ and this is not server, rack, or wall power.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: CUDA · TensorRT-LLM · NCCL · Triton. Specifications and availability are NVIDIA claims. Production volume, customer acceptance, sustained collectives, and accepted-workload economics remain separate receipts.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: NVIDIA describes DGX B300 as available and documents first-customer support; this remains a vendor availability claim.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
nvidia-gb200-nvl72Working research · not fully verified
1 known9 partial5 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
NVIDIA is the named company for GB200 NVL72 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Grace Blackwell rack with 72 Blackwell GPUs and 36 Grace CPUs in one NVLink domain. Normalized compute record: multiple · Rack aggregate and workload result depend on precision, sparsity, software, cooling, and utilization
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 4 nm · advanced · official. Named supplier record: GB200 NVL72 contains Blackwell GPUs, and NVIDIA states that Blackwell GPUs are manufactured on custom TSMC 4NP.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
This is a component-level foundry relationship for the Blackwell GPUs inside GB200. It is not a foundry claim for Grace CPUs, switches, memory, power, cooling, or every component in the rack, and it does not establish facility, lot, yield, or volume.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm-plus-lpddr · HBM3e GPU memory plus LPDDR5X CPU memory · 13400 GB · 576 TB/s peak · Up-to rack aggregate HBM3e capacity and GPU-memory bandwidth; not per-GPU bandwidth.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: An NVL72 rack with 18 compute trays, nine NVLink switch trays, power shelves, bus bars, and liquid-cooling manifolds; it is not one chip package.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: rack_scale_accelerator_system. Availability record: NVIDIA documents deployed and supported GB200 rack systems; shipment and installed-base totals are not established here.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: 130000 GB/s peak · Rack aggregate fifth-generation NVLink across 72 GPUs; direction, collectives, and delivered topology still matter.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
Power record: Liquid-cooled rack; the reviewed record does not normalize delivered rack wall power, facility overhead, or cooling supplier.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: CUDA · NCCL · TensorRT-LLM · NVIDIA AI Enterprise. Rack power, cooling, fabric utilization, model quality, and accepted workload throughput must be measured together.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: NVIDIA documents deployed and supported GB200 rack systems; shipment and installed-base totals are not established here.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
nvidia-gb300-nvl72Working research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
NVIDIA is the named company for GB300 NVL72 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Grace Blackwell Ultra rack with 72 B300 GPUs and 36 Grace CPUs in one NVLink domain. Normalized compute record: multiple · Rack aggregate and workload result depend on precision, sparsity, software, cooling, and utilization
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm-plus-lpddr · HBM3e GPU memory plus LPDDR5X CPU memory · 20000 GB · 576 TB/s peak · Company-stated rack HBM3e capacity and aggregate GPU-memory bandwidth; NVIDIA separately states 37 TB of fast memory including CPU memory. Named supplier record: SK hynix states that a live NVIDIA GB300 GPU module at GTC 2026 used its HBM3e.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
This establishes at least one company-reported GB300 module integration. It does not prove exclusivity, the supplier mix or lot allocation for every rack, HBM capacity by lot, rack shipment volume, customer acceptance, or the LPDDR supplier.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: An NVL72 rack-scale system, not one chip package; the reviewed official sources do not establish component package, substrate, or supplier provenance.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: rack_scale_accelerator_system. Availability record: NVIDIA labels GB300 NVL72 available and documents first-customer support; this remains a vendor availability claim.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: 130000 GB/s peak · Rack aggregate fifth-generation NVLink across 72 GPUs; ConnectX-8 scale-out and delivered topology remain system-level questions.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
Power record: Liquid-cooled rack; the reviewed record does not normalize delivered rack wall power, facility overhead, or cooling supplier.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: CUDA · NCCL · TensorRT-LLM · NVIDIA AI Enterprise. Shipment volume, customer acceptance, delivered rack configuration, power, cooling, fabric utilization, and accepted workload throughput remain separate receipts.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: NVIDIA labels GB300 NVL72 available and documents first-customer support; this remains a vendor availability claim.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
nvidia-vera-rubin-nvl72Working research · not fully verified
1 known7 partial7 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
NVIDIA is the named company for Vera Rubin NVL72 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Vera Rubin rack with 72 Rubin GPUs, 36 Vera CPUs, NVLink 6, ConnectX-9, BlueField-4, and Quantum-X800 or Spectrum-X networking. Normalized compute record: multiple · NVIDIA labels the published rack specifications preliminary and up-to; no independent production-system result is claimed
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm-plus-lpddr · HBM4 GPU memory plus LPDDR5X CPU memory · 20700 GB · 1580 TB/s peak · Preliminary up-to rack HBM4 capacity and aggregate bandwidth; per Rubin GPU NVIDIA states 288 GB and 22 TB/s. Named supplier record: SK hynix states that its HBM4 is slated to be adopted in NVIDIA Rubin and displayed the product on a Vera Rubin module at GTC 2026.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
This is a company-stated planned adoption and demonstration, not proof of exclusivity, final supplier allocation, shipped production lots, customer acceptance, yield, volume, or the complete HBM4 and LPDDR supplier set.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: rack_scale_ai_platform. Availability record: NVIDIA says Rubin is in full production and partner systems are planned for the second half of 2026; the product page still labels specifications preliminary, so broad customer availability is not claimed.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: 260000 GB/s peak · Preliminary rack NVLink 6 switch bandwidth; NVIDIA states 3.6 TB/s per GPU and ConnectX-9 scale-out at 1.6 Tb/s per GPU.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
Power record: NVIDIA states 100% liquid cooling and a preliminary 45°C warm-water inlet condition; delivered rack wall power, facility overhead, and cooling supplier are not normalized.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: CUDA · NCCL · TensorRT-LLM · NVIDIA AI Enterprise. No independently verified customer shipment, accepted rack, final specification, or production workload receipt is claimed.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: NVIDIA says Rubin is in full production and partner systems are planned for the second half of 2026; the product page still labels specifications preliminary, so broad customer availability is not claimed.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
amd-instinct-mi300xWorking research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
AMD is the named company for Instinct MI300X in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
CDNA 3 chiplet accelerator. Normalized compute record: FP8 through FP64 · Precision and matrix mode dependent
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 5 nm · advanced · official.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm · HBM3 · 192 GB · 5.3 TB/s peak · Per MI300X accelerator peak.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: OAM accelerator with chiplets and HBM3; package, substrate, and assembly suppliers are not identified here.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_gpu. Availability record: AMD publishes MI300X as a current product; supplier allocation, shipment volume, and cloud availability remain separate records.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: Infinity Fabric; topology and delivered rate depend on the system.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: ROCm · HIP · RCCL · MIGraphX. Use model-, software-version-, system-, and workload-specific tests.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: AMD publishes MI300X as a current product; supplier allocation, shipment volume, and cloud availability remain separate records.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
amd-instinct-mi325xWorking research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
AMD is the named company for Instinct MI325X in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
CDNA 3 chiplet accelerator. Normalized compute record: FP8 through FP64 · Precision and matrix mode dependent
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 5 nm · advanced · official.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm · HBM3e · 256 GB · 6 TB/s peak · Per MI325X accelerator peak.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: OAM accelerator with chiplets and HBM3e; package, substrate, and assembly suppliers are not identified here.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_gpu. Availability record: AMD publishes MI325X as a current product; supplier allocation, shipment volume, and system availability remain separate records.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: Infinity Fabric; topology and delivered rate depend on the system.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: ROCm · HIP · RCCL · MIGraphX. Use model-, software-version-, system-, and workload-specific tests.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: AMD publishes MI325X as a current product; supplier allocation, shipment volume, and system availability remain separate records.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
amd-instinct-mi350xWorking research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
AMD is the named company for Instinct MI350X in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
CDNA 4 chiplet accelerator. Normalized compute record: FP4 through FP64 · Precision and matrix mode dependent
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 3 nm · advanced · official.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm · HBM3e · 288 GB · 8 TB/s peak · Per MI350X accelerator peak.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: OAM accelerator with chiplets and HBM3e; package, substrate, and assembly suppliers are not identified here.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_gpu. Availability record: AMD publishes MI350X as a current product; supplier allocation, shipment volume, and system availability remain separate records.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: Infinity Fabric; topology and delivered rate depend on the system.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: ROCm · HIP · RCCL · MIGraphX. Production system and workload receipts remain separate from product-page specifications.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: AMD publishes MI350X as a current product; supplier allocation, shipment volume, and system availability remain separate records.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
amd-instinct-mi355xWorking research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
AMD is the named company for Instinct MI355X in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
CDNA 4 chiplet accelerator. Normalized compute record: FP4 through FP64 · Precision and matrix mode dependent
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 3 nm · advanced · official.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm · HBM3e · 288 GB · 8 TB/s peak · Per MI355X accelerator peak.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: OAM accelerator with chiplets and HBM3e; package, substrate, and assembly suppliers are not identified here.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_gpu. Availability record: AMD publishes MI355X as a current product; supplier allocation, shipment volume, and partner availability remain separate records.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: Infinity Fabric; topology and delivered rate depend on the system.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: ROCm · HIP · RCCL · MIGraphX. Production system and workload receipts remain separate from product-page specifications.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: AMD publishes MI355X as a current product; supplier allocation, shipment volume, and partner availability remain separate records.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
intel-gaudi-3Working research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Intel is the named company for Gaudi 3 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Matrix-math and tensor processor accelerator with integrated Ethernet. Normalized compute record: BF16/FP8 · official SKU table
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 5 nm · advanced · official.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm · HBM2e · 128 GB · 3.7 TB/s peak · official peak.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: Accelerator package with HBM2e.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: datacenter_accelerator_family. Availability record: Production accelerator available through systems and cloud instances.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: Integrated Ethernet ports; topology depends on system.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: SynapseAI · PyTorch · DeepSpeed. Software coverage and end-to-end workload fit remain decisive.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Production accelerator available through systems and cloud instances.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
intel-arc-b-seriesWorking research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Intel is the named company for Arc B-Series in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Xe2 graphics architecture with XMX AI engines. Normalized compute record: mixed · SKU dependent
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: advanced · official.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: gddr · GDDR6 · SKU dependent.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: Discrete client GPU board.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: client_accelerator_family. Availability record: Shipping client GPU family.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: PCIe client GPU.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: oneAPI · OpenVINO · XeSS. Not a datacenter HBM accelerator; included to make the chip-type boundary visible.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Shipping client GPU family.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
cerebras-wse-3Working research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Cerebras is the named company for WSE-3 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Entire-wafer compute engine with distributed on-wafer SRAM. Normalized compute record: 125 PFLOPS · AI · company peak
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 5 nm · advanced · official.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: on-wafer-sram · On-wafer SRAM plus external memory systems · 44 GB · 21000 TB/s peak · company-stated on-wafer memory bandwidth, not off-package DRAM bandwidth.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: Wafer-scale engine in a CS-3 system.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: wafer_scale_accelerator_system_family. Availability record: Production CS-3 systems and cloud service.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: SwarmX and MemoryX system fabric.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: Cerebras Software Platform · PyTorch integration. On-wafer bandwidth is a different scope from HBM bandwidth and must not be compared without the data path.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Production CS-3 systems and cloud service.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
groq-lpuWorking research · not fully verified
1 known8 partial6 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Groq is the named company for LPU / GroqRack in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Compiler-scheduled streaming processor with on-chip SRAM. Normalized compute record: mixed · chip and system dependent
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: 14 nm · mature-node-class · official.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: on-chip-sram · On-chip SRAM with model distributed across chips · internal memory and chip-to-chip path differ from HBM GPU systems.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
Package record: LPU cards and rack-scale systems.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: accelerator_and_rack_system_family. Availability record: Production cloud inference and rack offerings.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: Chip-to-chip streaming fabric.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: Groq compiler · GroqCloud API. Model support, quality, batch behavior, and end-to-end serving are workload-specific.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Production cloud inference and rack offerings.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
google-tpuWorking research · not fully verified
1 known6 partial8 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Google is the named company for TPU v5e / v5p / Trillium / Ironwood in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Tensor Processing Unit family deployed through Google Cloud. Normalized compute record: multiple · generation dependent
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm · HBM, generation dependent · generation dependent.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: cloud_accelerator_family. Availability record: Multiple production Google Cloud generations; newest generations have distinct preview/availability states.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: ICI pod topology, generation dependent.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: XLA · JAX · TensorFlow · PyTorch/XLA. Keep each generation and cloud availability state separate in procurement decisions.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Multiple production Google Cloud generations; newest generations have distinct preview/availability states.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
aws-trainium-inferentiaWorking research · not fully verified
1 known6 partial8 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Amazon Web Services is the named company for Trainium / Inferentia in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
AWS NeuronCore accelerators exposed through EC2 instances. Normalized compute record: multiple · generation and instance dependent
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
No source-bounded logic foundry and process record is normalized.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm-or-external · Generation dependent · instance and generation dependent.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: cloud_accelerator_family. Availability record: Production EC2 accelerator instances; individual generations vary.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: NeuronLink/EFA, generation and instance dependent.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: AWS Neuron SDK · PyTorch · JAX. Cloud availability, compiler coverage, and accepted-task cost are the relevant receipts.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Production EC2 accelerator instances; individual generations vary.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
microsoft-maiaWorking research · not fully verified
1 known7 partial7 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Microsoft is the named company for Maia 100 / Maia 200 in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Microsoft-designed datacenter AI accelerator integrated with Azure systems. Normalized compute record: multiple · generation dependent
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: advanced · official.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: hbm · HBM-class · generation dependent.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: cloud_accelerator_family. Availability record: Microsoft deployment/roadmap family; customer access varies by generation.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
Interconnect record: Azure system fabric.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: Azure AI stack · Triton. Internal deployment does not equal broadly orderable customer capacity.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Microsoft deployment/roadmap family; customer access varies by generation.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
meta-mtiaWorking research · not fully verified
1 known6 partial8 unknown
Open 15-stage path
The company named as responsible for defining the product.
Ask: Which company is actually named, and is the exact legal entity known?
Meta is the named company for MTIA in the normalized product record.
This association does not establish the exact legal design entity, design site, or any manufacturing supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
The cited record names this product-to-company association; its exact legal-entity and site boundary still follows the source record.
The compute design, reusable circuit blocks, interfaces, and licensed intellectual property inside the product.
Ask: Which design blocks are public, and which suppliers or licenses remain unnamed?
Meta Training and Inference Accelerator for internal workloads. Normalized compute record: multiple · revision dependent
The product description does not identify every licensed architecture block, reusable IP block, or its supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The software used to design, simulate, verify, and prepare the chip for manufacturing.
Ask: Which tools and verification path are named for this exact product?
No product-specific EDA, verification-tool, process-design-kit, or tape-out path is normalized.
Do not infer an EDA vendor from headquarters, process node, architecture, or technical compatibility. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The factory and process that turn the chip design into patterned silicon wafers.
Ask: Do we know the foundry, facility, process family, yield, and production state?
Process claim: advanced · official.
A node or node-class claim does not identify the foundry, facility, qualified line, yield, wafer origin, or shipment volume. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The scanners, masks, resists, optics, and patterning steps used to print each circuit layer.
Ask: Does a source name DUV, EUV, a scanner, a mask flow, or only a process node?
No product-specific DUV, EUV, multipatterning, scanner, mask, resist, or lithography-line path is normalized.
A process node does not by itself prove DUV or EUV use, scanner origin, country-of-origin distribution, overlay performance, cycle time, or yield. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The deposition, etch, clean, implant, polishing, inspection, and metrology tools used around lithography.
Ask: Which exact tool, process step, factory, and qualification state are public?
No product-specific deposition, etch, clean, implant, CMP, inspection, metrology, or other wafer-equipment path is normalized.
Capability elsewhere in the graph is not evidence that this product used a named tool or supplier. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The wafers, gases, chemicals, resists, targets, slurries, pads, and other inputs consumed during fabrication.
Ask: Which material grade, supplier, factory, and production lot are actually connected to the product?
No product-specific wafer, mask, resist, gas, target, slurry, chemical, or other critical-material path is normalized.
Material capability and technical fit do not prove a product purchase, lot, facility, or country-of-origin path. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The DRAM, HBM, NAND, memory interface, controller, or storage product that holds and moves data.
Ask: Which memory type, producer, capacity, bandwidth, and qualified manufacturing path are named?
Memory record: lpddr · LPDDR-class, revision dependent · revision dependent.
A memory type or bandwidth claim does not identify the DRAM maker, die revision, package supplier, usable capacity, sustained bandwidth, or qualified lot. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The substrate, interposer, thinning, bonding, stacking, molding, and package work around the dies.
Ask: Which package flow, provider, factory, yield, and acceptance state are public?
No normalized product-specific package record.
A package description does not identify the provider, assembly site, interposer or substrate supplier, bonding process, yield, warpage, or thermal qualification. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The work that assembles, probes, tests, burns in, and qualifies dies, memory, packages, and modules.
Ask: Which assembly or test step is named, and does it prove capability or accepted production?
No product-specific assembly, known-good-die, burn-in, final-test, yield, or qualification path is normalized.
Do not infer assembly or test providers from package type, product photos, process node, or general OSAT capability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The accelerator card, server, rack, vehicle, phone, PC, or other finished system around the chip.
Ask: Which system integrates the product, and is that compatibility, supply, shipment, or deployment?
Product boundary: internal_datacenter_accelerator_family. Availability record: Deployed internally; not a merchant accelerator.
A product announcement or entity-level label does not prove a named board partner, system integrator, customer acceptance, installed base, or current orderability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The physical links, protocols, switches, and network systems that move data between chips and machines.
Ask: Which link, topology, port count, direction, and sustained rate are actually known?
No normalized product-specific scale-up or scale-out interconnect path.
A link name or peak rate does not establish direction, port count, topology, payload efficiency, congestion behavior, switch supplier, or sustained collective performance. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The power delivery, cooling, utilities, and facility systems needed to operate the hardware.
Ask: Which operating conditions are measured instead of inferred from a chip or board power number?
No normalized product-specific power and cooling record.
A board or chip power number does not establish wall power, rack density, cooling method, facility overhead, throttling behavior, or sustained operating conditions. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No product-fact source is attached because this state is explicit unknown or not applicable.
No relationship source is attached because this state is explicit unknown or not applicable.
The firmware, drivers, runtime, libraries, models, and workloads that turn hardware into useful work.
Ask: What software ran on this exact product, for which workload, and with what independent receipt?
Named software: Meta internal compiler and runtime · PyTorch integration. Internal production is a different commercial state from an orderable product.
Named software support does not prove operator coverage, framework parity, reproducibility, application quality, sustained performance, or production reliability. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
The acceptance, repeatable production, shipment, installation, and workload receipts that separate a product from a plan.
Ask: What proves qualified volume, delivery, operation, reliability, and useful output?
Availability record: Deployed internally; not a merchant accelerator.
Announcement, sampling, internal use, certification, orderability, customer qualification, volume shipment, and installed deployment are separate gates. The general product source IDs are a reviewed source set; any supplier_relationship_source_ids are the narrower receipts for the named product-to-supplier edge.
No product-specific supplier relationship is established by this stage record.
No relationship source is attached because this state is explicit unknown or not applicable.
Method and source boundary
No supplier, customer, facility, qualification, capacity, yield, or volume edge is inferred from product fit.
59b2b3fed7563a77d57a32d22dea3899194ca7d04dab7b25b08c879ed2f5afc2Found a stronger primary receipt or a wrong boundary? Send the exact product, stage, claim, and source. For a scoped commercial analysis, start a project.